Latest News for: 1 mm

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Egypt, Qatar's Al Mana Holding sign $200-MM SAF deal

Hydrocarbon Processing 23 Dec 2025
The project will be developed in three phases and will span 100,000 m2 in the Integrated Sokhna Zone on Egypt's Red Sea coast ....
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Indonesia allocates 15.65 MM kiloliters of biodiesel for 2026

Hydrocarbon Processing 23 Dec 2025
Of the total allocation, 7.45 MMkl have been earmarked for the public service obligation (PSO), which covers sectors such as public transportation and whose sales will be subsidized by the country's palm oil fund ....
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Ethanol producer Inpasa to invest $630 MM in Brazil biorefinery projects

Hydrocarbon Processing 22 Dec 2025
The new facility in Rondonopolis will receive 2.77 B reais in investments, with operations starting in early 2027 ....
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JFE Steel develops 130 mm steel plate for offshore wind power structures

SteelOrbis 19 Dec 2025
Japanese steelmaker JFE Steel has announced that it has developed a steel plate with a maximum thickness of 130 mm for use in offshore wind power generation support structures, including monopiles, jackets and wind turbine towers.
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Monday scores | RAL, MM boys basketball pick up wins

TDN 17 Dec 2025
Drew Ibarreta scored 29 points for the Monarchs ....
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MM Group Named Top Performer in PwC Austria’s 2025 ESG Report (Mayr-Melnhof Karton AG)

Public Technologies 17 Dec 2025
MM Group's exceptional ranking reflects the breadth and quality of its ESG disclosures across environmental, social and governance criteria ... MM's performance further demonstrates strengths in social ...
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CoreFlow Unveils NEW 310 mm × 310 mm Vacuum Stage to Solve Major Warpage Challenges in CoPoS Panel-Level Packaging

PR Newswire 16 Dec 2025
Derived from CoreFlow's fab-proven vacuum chucks currently used in 300mm wafers CoPoW process flows, the new 310 mm × 310 mm stage is designed to support next-generation CoPoS panel-level packaging requirements.
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Development of DFD6080: A Dicing Saw for Package Dicing (Max. 400 x 400 mm) (Disco Corporation)

Public Technologies 15 Dec 2025
400 x 400 mm packages ... To improve productivity, fan-out wafer-level packaging (FOWLP), which uses a 300 mm wafer as a carrier, has become widespread ... Supports dicing of packages with a maximum size of 400 x 400 mm.
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Tokyo Electron Releases EVAROS™, a Batch Thermal Processing System for 300 mm Wafers (TEL - Tokyo Electron Ltd)

Public Technologies 15 Dec 2025
). Tokyo Electron (TEL; Head Office ... Toshiki Kawai) has announced the release of EVAROS™, a batch thermal processing system for 300 mm wafers ... EVAROS™ can process up to 200 wafers at a time, surpassing the capacity of our previous 300 mm wafer models.
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