The new chip wiring products, along with other materials engineering innovations for making future AI chips, will be discussed at Applied’s SEMICON West 2024 Technology Breakfast.

A new material claims to increase the performance-per-watt of chips by enabling copper wiring to scale to the 2-nm node and beyond while reducing resistance by as much as 25%. This new material with ...

Broadcom Inc on Tuesday released a new chip for wiring together supercomputers for artificial intelligence (AI) work using networking technology that is already in wide use.

"Laser chips" could help the technologies that carry data between components in PCs and servers keep pace with the rapid advances in power of processors, according to researchers at Intel and the ...

That makes the speed at which the individual chips can communicate important. Broadcom on Tuesday announced a new chip, Jericho3-AI, which can connect up to 32,000 GPU chips together.