DIGITIMES Asia

🔋 Taiwan's Battery Industry at a Crossroads: Compete Smart, Not Big As the global lithium battery market becomes increasingly dominated by China, Taiwan's path forward must be strategic, focused, and differentiated. A new analysis highlights how Taiwan can carve out a sustainable and profitable niche—not by chasing scale, but by leveraging high-value, low-volume markets such as defense drones, eVTOL aircraft, electric buses, and AI servers. 💬 Full article linked in the comments! #BatteryIndustry #Taiwan #CleanEnergy #Electrification #AIEconomy

🚨 Global Memory Chip Shortage Reaches Crisis Levels The memory market is entering one of its tightest cycles in recent years. As major global manufacturers finalize Q4 2025 contract prices, competition for supply has intensified — pushing order fulfillment for major U.S. and Chinese customers down to around 70%. 📈 Server DRAM contract prices have surged 40–50%, while lower-priority customers may see fulfillment rates fall below 40% in the coming quarters. The shortage worsened in Q3 2025, driven by explosive demand from AI workloads. Supply chain sources warn that inventory is already sold out for key products like DDR5 DRAM, with some South Korean suppliers declining to quote new prices until at least November 2025. 💡 Spot DDR5 prices have soared from US$7–8 in September to around US$13 today, making it the fastest-rising product line in the market — and shortages are expected to deepen further into the year’s end. The message is clear: ➡️ AI growth is redefining semiconductor supply dynamics. ➡️ Strategic inventory planning and diversification have never been more critical. #Semiconductors #MemoryChips #AI #DRAM #SupplyChain #Technology #DataCenters

China's EMS comeback in India: A quiet shift reshaping Asia's electronics map 🌏📱 After years of geopolitical tension, Chinese electronics manufacturers are quietly regaining ground in India's booming smartphone supply chain. Firms like DBG and BYD are ramping up local production, rehiring staff, and expanding partnerships with Chinese ODMs Longcheer and Huaqin—even as Indian giants like Dixon Technologies continue to dominate under the PLI scheme. Recent trade data shows DBG's share of India's contract manufacturing market has surged from 13% to 21% in just two quarters, while India and China are cautiously reopening economic links—including new direct flights that cut logistics time between the two nations. 💬 Full article linked in the comments! #ElectronicsManufacturing #IndiaChina #SupplyChain #Smartphones #Geopolitics

🚀 China’s Yangtze Memory Technologies Pushes for 100% Domestic Chipmaking — A Milestone in Tech Self-Reliance China’s leading memory chipmaker, YMTC (Yangtze Memory Technologies Co.), has announced plans for its Phase III fab, backed by CNY 20.72 billion (US$2.9 billion) in registered capital. What’s truly groundbreaking? The new facility is reportedly aiming for full adoption of domestically built semiconductor equipment — a 100% localisation target that would mark an unprecedented achievement in China’s chip industry. Amid escalating US–China tech tensions and widening export curbs on global toolmakers like ASML and Applied Materials, YMTC’s move signals a bold push to secure supply chain sovereignty and industrial self-reliance. The strategy not only reflects YMTC’s survival mindset but could also accelerate growth for key Chinese equipment makers such as Naura Technology, AMEC, and Piotech. With Phase III targeting 100,000 wafers per month and production slated for 2026, YMTC could soon expand total capacity to 300,000 wafers monthly — reshaping the balance in the NAND flash market. 👉 Whether this “all-local” pilot succeeds technically will determine much more than YMTC’s future — it could redefine how far China’s semiconductor ecosystem has come in closing the gap with global leaders. #Semiconductors #ChinaTech #YMTC #Chips #NANDFlash #Manufacturing #Technology #USChina #Innovation #SupplyChain #Localization

Standardization or Differentiation? The Dilemma at the Heart of Advanced Packaging What started as an innovation for smartphones has become the battleground for the future of AI computing. Advanced packaging—from 2.5D to 3D integration—now sits at the center of the semiconductor race. But as the industry pushes forward, one crucial question remains unanswered: 👉 Can we standardize something that's evolving faster than we can define it? DIGITIMES Analyst Albert Lin's latest piece dives deep into why setting technical standards for advanced packaging is proving so difficult—and what lessons the industry can learn from decades of DRAM evolution and HBM's complex path toward commoditization. 💬 Full article linked in the comments! #Semiconductors #AdvancedPackaging #AIChips #UCIe #HBM

📈 TSMC's Record Quarter Reveals a Global Tech Power Shift Fueled by massive AI orders from Apple and NVIDIA, TSMC just reported record-breaking third-quarter results—and raised its full-year revenue growth forecast to 35%, or about US$122 billion. But behind the numbers lies a deeper story: 🔹 China's chip presence is fading as US sanctions bite harder 🔹 Nvidia's rise is reshaping TSMC's client mix, now contributing around 20% of total revenue 🔹 Meanwhile, companies like SOPHGO Technologies 算能科技 and BITMAIN—once significant Chinese customers—have seen their wafer orders collapse to near zero 🔗 Full article linked in the comments! #TSMC #Semiconductors #AI #China #Geopolitics

🚀 Big Leap Forward in AI Infrastructure from Broadcom at OCP Global Summit At this year's OCP Global Summit, Broadcom made a bold statement: Co-Packaged Optics (CPO) is ready for prime time—and it's set to redefine how next-generation AI compute clusters are built. 🔍 What’s the breakthrough? Broadcom unveiled a new CPO architecture that delivers up to 90% higher AI training efficiency, signaling a turning point for large-scale, high-bandwidth systems. According to Rajiv Pancholy, Director of Marketing for Broadcom’s Optical Systems Group, CPO now enables massively scaled single-node “scale-up” domains that traditional electrical interconnects simply can’t support. 📉 The problem with copper: Copper links are hitting physical limits in terms of bandwidth, reach, and power. Scaling something like a 1,024-GPU node with copper? Practically impossible. Enter optics. 📈 The optical future: Broadcom outlined a 200-terabit switch architecture, connecting 16 GPU racks and 4 switch racks—entirely over optics. From fiber shuffling and blind-mate connectors to power and cooling, Broadcom is working with partners across the ecosystem to make this vision a reality. 🔄 From intra-rack to inter-row: While electrical backplanes (like Nvidia’s NDL72) are extending scale-up within racks, the next frontier is optical backplanes interconnecting entire rows. That’s the scale needed for the AI workloads of tomorrow. 📡 Beyond copper. Beyond limits. The future of AI infrastructure is looking a lot more optical. #OCPGlobalSummit #Broadcom #AIInfrastructure #CoPackagedOptics #CPO #DataCenterInnovation #OpticalNetworking #AIClusters #HPC #TechInnovation #NextGenAI

💡 Intel Corporation just made one of its boldest AI moves yet. At the 2025 OCP Global Summit, Intel unveiled a new AI strategy centered on openness, modularity, and flexibility—a sharp contrast to the closed ecosystems dominating today's AI infrastructure. Chief Technology and AI Officer Sachin Katti introduced the company’s new "Crescent Island" GPU, built for real-world, continuous "agentic AI" applications that reason, plan, and act across data centers and the edge. Instead of chasing peak compute, Intel is betting that system-level efficiency and interoperability will define the next era of AI. 💬 Full story linked in the comments! #Intel #AI #AgenticAI #OCP2025 #Semiconductors

Discover how AI is reshaping industries at World AI Show Malaysia 2025. Connect with global innovators, business leaders, and policymakers to explore real-world use cases driving progress in finance, healthcare, manufacturing, and smart cities. Gain actionable insights, build partnerships, and stay ahead in the era of intelligent transformation. DIGITIMES is proud to be an official media partner and excited to witness the future of AI unfold in Malaysia. The event is less than 15 days away; secure your spot today! https://lnkd.in/gUMbJ4Cj   #DIGITIMES #WorldAIShow #WASMalaysia2025 #AI #ArtificialIntelligence #AIInnovation #DigitalTransformation #MalaysiaTech #TechLeadership #FutureOfAI

🚀 "AI has changed everything." That was the message from Mohamed Awad, SVP & GM of Infrastructure at Arm, during his keynote at the OCP Global Summit 2025. In his talk — “What AI Wants: New Silicon, New Systems, and a New Era for the Data Center” — Awad challenged the industry to rethink how systems are built in the age of AI. 💡 Key takeaways: 🔹 On October 14 alone, there were over 4 billion AI queries — enough to stack paper to the International Space Station. 🔹 Global compute demand is surging toward 16 zettaflops, with an expected 160 GW of additional power needed by 2030. 🔹 The new priority? Performance per watt — not just performance. 🔧 Since 2018, Arm has shifted its strategy from general-purpose CPUs to purpose-built, energy-efficient systems. Every major hyperscaler — Meta, Microsoft, Amazon Web Services (AWS), Google — is now deploying Arm Neoverse-based systems. 🧩 To accelerate custom silicon innovation, Arm launched the Arm Total Design ecosystem, which has tripled in size since 2023. It brings together foundries, EDA tools, design houses, and firmware providers to streamline chiplet-based SoC development and reduce time-to-market. In a world where compute and power are under pressure, Arm is betting on collaborative design, custom silicon, and ecosystem scale to fuel the AI infrastructure of tomorrow. #OCP2025 #Arm #AIInfrastructure #CustomSilicon #DataCenters #Neoverse #PerformancePerWatt #Chiplets #HyperscaleComputing #TechLeadership