dsPIC30F Data Sheet

General Purpose and Sensor Families

High-Performance
Digital Signal Controllers

 2004 Microchip Technology Inc. Preliminary DS70083G

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device Trademarks

applications and the like is intended through suggestion only The Microchip name and logo, the Microchip logo, Accuron,
and may be superseded by updates. It is your responsibility to dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
ensure that your application meets with your specifications. PRO MATE, PowerSmart, rfPIC, and SmartShunt are
No representation or warranty is given and no liability is registered trademarks of Microchip Technology Incorporated
assumed by Microchip Technology Incorporated with respect in the U.S.A. and other countries.
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
use or otherwise. Use of Microchip’s products as critical SmartSensor and The Embedded Control Solutions Company
components in life support systems is not authorized except are registered trademarks of Microchip Technology
with express written approval by Microchip. No licenses are Incorporated in the U.S.A.
conveyed, implicitly or otherwise, under any intellectual Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
property rights. dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

DS70083G-page ii Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
dsPIC30F Enhanced Flash 16-bit Digital Signal Controllers
General Purpose and Sensor Families

Note: This data sheet summarizes features of this group

Peripheral Features:
of dsPIC30F devices and is not intended to be a complete • High current sink/source I/O pins: 25 mA/25 mA
reference source. For more information on the CPU,
peripherals, register descriptions and general device • Up to 5 external interrupt sources
functionality, refer to the dsPIC30F Family Reference • Timer module with programmable prescaler:
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F - Up to five 16-bit timers/counters; optionally
Programmer’s Reference Manual (DS70030). pair up 16-bit timers into 32-bit timer modules
• 16-bit Capture input functions
High Performance Modified RISC CPU: • 16-bit Compare/PWM output functions:
• Modified Harvard architecture - Dual Compare mode available
• C compiler optimized instruction set architecture • Data Converter Interface (DCI) supports common
audio Codec protocols, including I2S and AC’97
• 84 base instructions
• 3-wire SPI™ modules (supports 4 Frame modes)
• 24-bit wide instructions, 16-bit wide data path
• I2C™ module supports Multi-Master/Slave mode
• Linear program memory addressing up to 4M
and 7-bit/10-bit addressing
instruction words
• Addressable UART modules supporting:
• Linear data memory addressing up to 64 Kbytes
- Interrupt on address bit
• Up to 144 Kbytes on-chip Flash program space
- Wake-up on Start bit
• Up to 48K instruction words
- 4 characters deep TX and RX FIFO buffers
• Up to 8 Kbytes of on-chip data RAM
• CAN bus modules
• Up to 4 Kbytes of non-volatile data EEPROM
• 16 x 16-bit working register array
Analog Features:
• Three Address Generation Units that enable:
- Dual data fetch • 12-bit Analog-to-Digital Converter (A/D) with:
- Accumulator write back for DSP operations - 100 Ksps conversion rate
• Flexible Addressing modes supporting: - Up to 16 input channels
- Indirect, Modulo and Bit-Reversed modes - Conversion available during Sleep and Idle
• Two 40-bit wide accumulators with optional • Programmable Low Voltage Detection (PLVD)
saturation logic • Programmable Brown-out Detection and Reset
• 17-bit x 17-bit single cycle hardware fractional/ generation
integer multiplier
• Single cycle Multiply-Accumulate (MAC)
operation
• 40-stage Barrel Shifter
• Up to 30 MIPs operation:
- DC to 40 MHz external clock input
- 4 MHz-10 MHz oscillator input with
PLL active (4x, 8x, 16x)
• Up to 41 interrupt sources:
- 8 user selectable priority levels
• Vector table with up to 62 vectors:
- 54 interrupt vectors
- 8 processor exceptions and software traps

 2004 Microchip Technology Inc. Preliminary DS70083G-page 1

dsPIC30F
Special Microcontroller Features: CMOS Technology:
• Enhanced Flash program memory: • Low power, high speed Flash technology
- 10,000 erase/write cycle (min.) for • Wide operating voltage range (2.5V to 5.5V)
industrial temperature range, 100K (typical) • Industrial and Extended temperature ranges
• Data EEPROM memory: • Low power consumption
- 100,000 erase/write cycle (min.) for
industrial temperature range, 1M (typical)
• Self-reprogrammable under software control
• Power-on Reset (POR), Power-up Timer (PWRT)
and Oscillator Start-up Timer (OST)
• Flexible Watchdog Timer (WDT) with on-chip low
power RC oscillator for reliable operation
• Fail-Safe Clock Monitor operation:
- Detects clock failure and switches to on-chip
low power RC oscillator
• Programmable code protection
• In-Circuit Serial Programming™ (ICSP™) via
3 pins and power/ground
• Selectable Power Management modes:
- Sleep, Idle and Alternate Clock modes

DS70083G-page 2 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
dsPIC30F Sensor Processor Family
Program Memory

UART

SPI™

I2C™
SRAM EEPROM Timer Input Output Comp/ A/D 12-bit
Device Pins
Bytes Instructions Bytes Bytes 16-bit Cap Std PWM 100 Ksps

dsPIC30F2011 18 12K 4K 1024 0 3 2 2 8 ch 1 1 1

dsPIC30F3012 18 24K 8K 2048 1024 3 2 2 8 ch 1 1 1
dsPIC30F2012 28 12K 4K 1024 0 3 2 2 10 ch 1 1 1
dsPIC30F3013 28 24K 8K 2048 1024 3 2 2 10 ch 2 1 1

Pin Diagrams
18-Pin SOIC and PDIP

MCLR 1 18 AVDD
AN0/VREF+/CN2/RB0 2 17 AVSS

dsPIC30F3012
dsPIC30F2011
AN1/VREF-/CN3/RB1 3 16 AN6/SCK1/INT0/OCFA/RB6
AN2/SS1/LVDIN/CN4/RB2 4 15 EMUD2/AN7/OC2/IC2/INT2/RB7
AN3/CN5/RB3 5 14 VDD
OSC1/CLKI 6 13 VSS
OSC2/CLKO/RC15 7 12 PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 8 11 PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 9 10 EMUC2/OC1/IC1/INT1/RD0

28-Pin PDIP and SOIC

MCLR 1 28 AVDD
EMUD3/AN0/VREF+/CN2/RB0 2 27 AVSS
EMUC3/AN1/VREF-/CN3/RB1 3 26 AN6/OCFA/RB6
AN2/SS1/LVDIN/CN4/RB2 4 25 EMUD2/AN7/RB7
dsPIC30F2012

AN3/CN5/RB3 5 24 AN8/OC1/RB8
AN4/CN6/RB4 6 23 AN9/OC2/RB9
AN5/CN7/RB5 7 22 CN17/RF4
VSS 8 21 CN18/RF5
OSC1/CLKI 9 20 VDD
OSC2/CLKO/RC15 10 19 VSS
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 11 18 PGC/EMUC/U1RX/SDI1/SDA/RF2
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 12 17 PGD/EMUD/U1TX/SDO1/SCL/RF3
VDD 13 16 SCK1/INT0/RF6
IC2/INT2/RD9 14 15 EMUC2/IC1/INT1/RD8

28-Pin PDIP and SOIC

MCLR 1 28 AVDD
EMUD3/AN0/VREF+/CN2/RB0 2 27 AVSS
EMUC3/AN1/VREF-/CN3/RB1 3 26 AN6/OCFA/RB6
AN2/SS1/LVDIN/CN4/RB2 4 25 EMUD2/AN7/RB7
dsPIC30F3013

AN3/CN5/RB3 5 24 AN8/OC1/RB8
AN4/CN6/RB4 6 23 AN9/OC2/RB9
AN5/CN7/RB5 7 22 U2RX/CN17/RF4
VSS 8 21 U2TX/CN18/RF5
OSC1/CLKI 9 20 VDD
OSC2/CLKO/RC15 10 19 VSS
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 11 18 PGC/EMUC/U1RX/SDI1/SDA/RF2
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 12 17 PGD/EMUD/U1TX/SDO1/SCL/RF3
VDD 13 16 SCK1/INT0/RF6
IC2/INT2/RD9 14 15 EMUC2/IC1/INT1/RD8

Note: For descriptions of individual pins, see Section 1.0.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 3

dsPIC30F
Pin Diagrams (Continued)

44-Pin QFN

EMUC1/SOSCO/T1CK / U1ARX / CN0 / RC14

EMUD1/SOSCI/T2CK / U1ATX / CN1 / RC13
PGD/EMUD/U1TX/SDO1/SCL/RF3

EMUC2/IC1/INT1/RD8
SCK1/INT0/RF6

IC2/INT2/RD9
VDD
NC
NC
NC
NC
44
43
42
41
40
39
38
37
36
35
34
PGC/EMUC/U1RX/SDI1/SDA/RF2 1 33 OSC2/CLKO/RC15
VSS 2 32 OSC1/CLKI
NC 3 31 VSS
VDD 4 30 VSS
NC 5 29 NC
NC 6 dsPIC30F3013 28 NC
U2TX/CN18/RF5 7 27 AN5/CN7/RB5
NC 8 26 AN4/CN6/RB4
U2RX/CN17/RF4 9 25 AN3/CN5/RB3
AN9/OC2/RB9 10 24 NC
AN8/OC1/RB8 11 23 AN2/SS1/LVDIN/CN4/RB2
22
12
13
14
15
16
17
18
19
20
21
MCLR
NC

NC
AVSS
AVDD

NC
NC
EMUD2/AN7/RB7

AN6/OCFA/RB6

EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1

Note: For descriptions of individual pins, see Section 1.0.

DS70083G-page 4 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
dsPIC30F General Purpose Controller Family
Program Memory Output

UART

SPI™

I2C™
CAN
SRAM EEPROM Timer Input Codec A/D 12-bit
Device Pins Comp/Std
Bytes Instructions Bytes Bytes 16-bit Cap
PWM
Interface 100 Ksps

dsPIC30F3014 40/44 24K 8K 2048 1024 3 2 2 — 13 ch 2 1 1 -

dsPIC30F4013 40/44 48K 16K 2048 1024 5 4 4 AC’97, I2S 13 ch 2 1 1 1
dsPIC30F5011 64 66K 22K 4096 1024 5 8 8 AC’97, I2S 16 ch 2 2 1 2
dsPIC30F6011 64 132K 44K 6144 2048 5 8 8 — 16 ch 2 2 1 2
dsPIC30F6012 64 144K 48K 8192 4096 5 8 8 AC’97, I2S 16 ch 2 2 1 2
dsPIC30F5013 80 66K 22K 4096 1024 5 8 8 AC’97, I2S 16 ch 2 2 1 2
dsPIC30F6013 80 132K 44K 6144 2048 5 8 8 — 16 ch 2 2 1 2
dsPIC30F6014 80 144K 48K 8192 4096 5 8 8 AC’97, I2S 16 ch 2 2 1 2

Pin Diagrams

40-Pin PDIP

MCLR 1 40 AVDD
AN0/VREF+/CN2/RB0 2 39 AVSS
AN1/VREF-/CN3/RB1 3 38 AN9/RB9
AN2/SS1/LVDIN/CN4/RB2 4 37 AN10/RB10
AN3/CN5/RB3 5 36 AN11/RB11
AN4/CN6/RB4 6 35 AN12/RB12
AN5/CN7/RB5 7 34 EMUC2/OC1/RD0
dsPIC30F3014
PGC/EMUC/AN6/OCFA/RB6 8 33 EMUD2/OC2/RD1
PGD/EMUD/AN7/RB7 9 32 VDD
AN8/RB8 10 31 VSS
VDD 11 30 RF0
VSS 12 29 RF1
OSC1/CLKI 13 28 U2RX/CN17/RF4
OSC2/CLKO/RC15 14 27 U2TX/CN18/RF5
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 15 26 U1RX/SDI1/SDA/RF2
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 16 25 EMUD3/U1TX/SDO1/SCL/RF3
INT0/RA11 17 24 EMUC3/SCK1/RF6
IC2/INT2/RD9 18 23 IC1/INT1/RD8
RD3 19 22 RD2
VSS 20 21 VDD

40-Pin PDIP

MCLR 1 40 AVDD
AN0/VREF+/CN2/RB0 2 39 AVSS
AN1/VREF-/CN3/RB1 3 38 AN9/CSCK/RB9
AN2/SS1/LVDIN/CN4/RB2 4 37 AN10/CSDI/RB10
AN3/CN5/RB3 5 36 AN11/CSDO/RB11
AN4/IC7/CN6/RB4 6 35 AN12/COFS/RB12
AN5/IC8/CN7/RB5 7 34 EMUC2/OC1/RD0
dsPIC30F4013

PGC/EMUC/AN6/OCFA/RB6 8 33 EMUD2/OC2/RD1
PGD/EMUD/AN7/RB7 9 32 VDD
AN8/RB8 10 31 VSS
VDD 11 30 C1RX/RF0
VSS 12 29 C1TX/RF1
OSC1/CLKI 13 28 U2RX/CN17/RF4
OSC2/CLKO/RC15 14 27 U2TX/CN18/RF5
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 15 26 U1RX/SDI1/SDA/RF2
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 16 25 EMUD3/U1TX/SDO1/SCL/RF3
INT0/RA11 17 24 EMUC3/SCK1/RF6
IC2/INT2/RD9 18 23 IC1/INT1/RD8
OC4/RD3 19 22 OC3/RD2
VSS 20 21 VDD

Note: For descriptions of individual pins, see Section 1.0.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 5

dsPIC30F
Pin Diagrams (Continued)

44-Pin TQFP

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
EMUD3/U1TX/SDO1/SCL/RF3
EMUC3/SCK1/RF6

IC2/INT2/RD1
INT0/RA11
INT1/RD8
RD2

RD3
VDD
VSS

NC
44
43
42
41
40
39
38
37
36
35
34
U1RX/SDI1/SDA/RF2 1 33 NC
U2TX/CN18/RF5 2 32 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
U2RX/CN17/RF4 3 31 OSC2/CLKO/RC15
C1TX/RF1 4 30 OSC1/CLKI
C1RX/RF0 5 29 VSS
VSS 6 dsPIC30F3014 28 VDD
VDD 7 27 AN8/RB8
EMUD2/OC2/RD1 8 26 PGD/EMUD/AN7/RB7
EMUC2/OC1/RD0 9 25 PGC/EMUC/AN6/OCFA/RB6
AN12/RB12 10 24 AN5/CN7/RB5
AN11/RB11 11 23 AN4/CN6/RB4
12
13
14
15
16
17
18
19
20
21
22
NC
NC

MCLR
AN10/RB10
AN9/RB9

AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1

AN3/CN5/RB3
AN2/SS1/LVDIN/CN4/RB2
AVSS
AVDD

Note: For descriptions of individual pins, see Section 1.0.

DS70083G-page 6 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
Pin Diagrams (Continued)

44-Pin TQFP

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
EMUD3/U1TX/SDO1/SCL/RF3
EMUC3/SCK1/RF6
IC1/INT1/RD8

IC2/INT2/RD1
INT0/RA11
OC3/RD2

OC4/RD3
VDD
VSS

NC
44
43
42
41
40
39
38
37
36
35
34
U1RX/SDI1/SDA/RF2 1 33 NC
U2TX/CN18/RF5 2 32 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
U2RX/CN17/RF4 3 31 OSC2/CLKO/RC15
CTX1/RF1 4 30 OSC1/CLKI
CRX1/RF0 5 29 VSS
VSS 6 dsPIC30F4013 28 VDD
VDD 7 27 AN8/RB8
EMUD2/OC2/RD1 8 26 PGD/EMUD/TB7/AN7/RB7
EMUC2/OC1/RD0 9 25 PGC/EMUC/TB6/AN6/OCFA/RB6
AN12/COFS/RB12 10 24 AN5/IC8/CN7/RB5
AN11/CSDO/RB11 11 23 AN4/IC7/CN6/RB4
12
13
14
15
16
17
18
19
20
21
22
NC
NC
AN10/CSDI/RB10
AN9/CSCK/RB9

MCLR
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
AVSS
AVDD

Note: For descriptions of individual pins, see Section 1.0.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 7

dsPIC30F
Pin Diagrams (Continued)

44-Pin QFN

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUD3/U1TX/SDO1/SCL/RF3
EMUC3/SCK1/RF6
IC1/INT1/RD8

IC2/INT2/RD9
INT0/RA11
RD2

RD3
VDD
VSS
44
43
42
41
40
39
38
37
36
35
34
U1RX/SDI1/SDA/RF2 1 33 OSC2/CLKO/RC15
U2TX/CN18/RF5 2 32 OSC1/CLKI
U2RX/CN17/RF4 3 31 VSS
C1TX/RF1 4 30 VSS
C1RX/RF0 5 29 VDD
VSS 6 dsPIC30F3014 28 VDD
VDD 7 27 AN8/RB8
VDD 8 26 PGD/EMUD/AN7/RB7
EMUD2/OC2/RD1 9 25 PGC/EMUC/AN6/OCFA/RB6
EMUC2/OC1/RD0 10 24 AN5/CN7/RB5
AN12/RB12 11 23 AN4/CN6/RB4
12
13
14
15
16
17
18
19
20
21
22
AN11/RB11
NC
AN10/RB10
AN9/RB9

MCLR
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1

AN3/CN5/RB3
AN2/SS1/LVDIN/CN4/RB2
AVSS
AVDD

Note: For descriptions of individual pins, see Section 1.0.

DS70083G-page 8 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
Pin Diagrams (Continued)

44-Pin QFN

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUD3/U1TX/SDO1/SCL/RF3
EMUC3/SCK1/RF6

IC2/INT2/RD1
TOC3/RD2

INT0/RA11
INT1/RD8

OC4/RD3
VDD
VSS
44
43
42
41
40
39
38
37
36
35
34
U1RX/SDI1/SDA/RF2 1 33 OSC2/CLKO/RC15
U2TX/CN18/RF5 2 32 OSC1/CLKI
U2RX/CN17/RF4 3 31 VSS
CTX1/RF1 4 30 VSS
CRX1/RF0 5 29 VDD
VSS 6 dsPIC30F4013 28 VDD
VDD 7 27 AN8/RB8
VDD 8 26 PGD/EMUD/TB7/AN7/RB7
EMUD2/OC2/RD1 9 25 PGC/EMUC/TB6/AN6/OCFA/RB6
EMUC2/OC1/RD0 10 24 AN5/IC8/CN7/RB5
AN12/COFS/RB12 11 23 AN4/IC7/CN6/RB4
12
13
14
15
16
17
18
19
20
21
22
AN10/CSDI/RB10
AN11/CSDO/RB11
NC

MCLR
AN9/CSCK/RB9

AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1

AN3/CN5/RB3
AN2/SS1/LVDIN/CN4/RB2
AVSS
AVDD

Note: For descriptions of individual pins, see Section 1.0.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 9

dsPIC30F
Pin Diagrams (Continued)

64-Pin TQFP

OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4

EMUD2/OC2/RD1
OC8/CN16/RD7
OC7/CN15/RD6
CSDO/RG13

CSCK/RG14
CSDI/RG12

C2RX/RG0
C2TX/RG1

C1RX/RF0
C1TX/RF1

OC4/RD3
OC3/RD2
VDD
VSS
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
COFS/RG15 1 48 EMUC1/SOSCO/T1CK/CN0/RC14
T2CK/RC1 2 47 EMUD1/SOSCI/T4CK/CN1/RC13
T3CK/RC2 3 46 EMUC2/OC1/RD0
SCK2/CN8/RG6 4 45 IC4/INT4/RD11
SDI2/CN9/RG7 5 44 IC3/INT3/RD10
SDO2/CN10/RG8 6 43 IC2/INT2/RD9
MCLR 7 42 IC1/INT1/RD8
SS2/CN11/RG9 8 41 VSS
VSS 9
dsPIC30F5011 40 OSC2/CLKO/RC15
VDD 10 39 OSC1/CLKI
AN5/IC8/CN7/RB5 11 38 VDD
AN4/IC7/CN6/RB4 12 37 SCL/RG2
AN3/CN5/RB3 13 36 SDA/RG3
AN2/SS1/LVDIN/CN4/RB2 14 35 EMUC3/SCK1/INT0/RF6
AN1/VREF-/CN3/RB1 15 34 U1RX/SDI1/RF2
AN0/VREF+/CN2/RB0 16 33 EMUD3/U1TX/SDO1/RF3
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
AN15/OCFB/CN12/RB15
PGD/EMUD/AN7/RB7
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14

U2RX/CN17/RF4
U2TX/CN18/RF5
PGC/EMUC/AN6/OCFA/RB6

Note: For descriptions of individual pins, see Section 1.0.

DS70083G-page 10 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
Pin Diagrams (Continued)

64-Pin TQFP

OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4

EMUD2/OC2/RD1
OC8/CN16/RD7
OC7/CN15/RD6
C2RX/RG0
C2TX/RG1

C1RX/RF0
C1TX/RF1

OC4/RD3
OC3/RD2
RG13
RG12
RG14

VDD
VSS
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
RG15 1 48 EMUC1/SOSCO/T1CK/CN0/RC14
T2CK/RC1 2 47 EMUD1/SOSCI/T4CK/CN1/RC13
T3CK/RC2 3 46 EMUC2/OC1/RD0
SCK2/CN8/RG6 4 45 IC4/INT4/RD11
SDI2/CN9/RG7 5 44 IC3/INT3/RD10
SDO2/CN10/RG8 6 43 IC2/INT2/RD9
MCLR 7 42 IC1/INT1/RD8
SS2/CN11/RG9 8 41 VSS
VSS 9
dsPIC30F6011 40 OSC2/CLKO/RC15
VDD 10 39 OSC1/CLKI
AN5/IC8/CN7/RB5 11 38 VDD
AN4/IC7/CN6/RB4 12 37 SCL/RG2
AN3/CN5/RB3 13 36 SDA/RG3
AN2/SS1/LVDIN/CN4/RB2 14 35 EMUC3/SCK1/INT0/RF6
PGC/EMUC/AN1/VREF-/CN3/RB1 15 34 U1RX/SDI1/RF2
PGD/EMUD/AN0/VREF+/CN2/RB0 16 33 EMUD3/U1TX/SDO1/RF3
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
AN10/RB10

AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
AN7/RB7
AVDD
AVSS
AN8/RB8
AN9/RB9

AN11/RB11
VSS
VDD

U2RX/CN17/RF4
U2TX/CN18/RF5
AN6/OCFA/RB6

Note: For descriptions of individual pins, see Section 1.0.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 11

dsPIC30F
Pin Diagrams (Continued)

64-Pin TQFP

OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4

EMUD2/OC2/RD1
OC8/CN16/RD7
OC7/CN15/RD6
CSDO/RG13

CSCK/RG14
CSDI/RG12

C2RX/RG0
C2TX/RG1

C1RX/RF0
C1TX/RF1

OC4/RD3
OC3/RD2
VDD
VSS
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
COFS/RG15 1 48 EMUC1/SOSCO/T1CK/CN0/RC14
T2CK/RC1 2 47 EMUD1/SOSCI/T4CK/CN1/RC13
T3CK/RC2 3 46 EMUC2/OC1/RD0
SCK2/CN8/RG6 4 45 IC4/INT4/RD11
SDI2/CN9/RG7 5 44 IC3/INT3/RD10
SDO2/CN10/RG8 6 43 IC2/INT2/RD9
MCLR 7 42 IC1/INT1/RD8
SS2/CN11/RG9 8 41 VSS
VSS 9 dsPIC30F6012 40 OSC2/CLKO/RC15
VDD 10 39 OSC1/CLKI
AN5/IC8/CN7/RB5 11 38 VDD
AN4/IC7/CN6/RB4 12 37 SCL/RG2
AN3/CN5/RB3 13 36 SDA/RG3
AN2/SS1/LVDIN/CN4/RB2 14 35 EMUC3/SCK1/INT0/RF6
PGC/EMUC/AN1/VREF-/CN3/RB1 15 34 U1RX/SDI1/RF2
PGD/EMUD/AN0/VREF+/CN2/RB0 16 33 EMUD3/U1TX/SDO1/RF3
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
AN15/OCFB/CN12/RB15
AN7/RB7
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14

U2RX/CN17/RF4
U2TX/CN18/RF5
AN6/OCFA/RB6

Note: For descriptions of individual pins, see Section 1.0.

DS70083G-page 12 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
Pin Diagrams (Continued)

80-Pin TQFP

EMUD2/OC2/RD1
IC6/CN19/RD13
OC8/CN16/RD7
OC7/CN15/RD6
OC6/CN14/RD5
OC5/CN13/RD4
CSDO/RG13

CSCK/RG14
CSDI/RG12

C2RX/RG0
C2TX/RG1

C1RX/RF0
RA7/CN23
RA6/CN22

C1TX/RF1

IC5/RD12
OC4/RD3
OC3/RD2
VDD
VSS
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60 EMUC1/SOSCO/T1CK/CN0/RC14
COFS/RG15 1
59 EMUD1/SOSCI/CN1/RC13
T2CK/RC1 2
58 EMUC2/OC1/RD0
T3CK/RC2 3
57 IC4/RD11
T4CK/RC3 4
56 IC3/RD10
T5CK/RC4 5
55 IC2/RD9
SCK2/CN8/RG6 6
54 IC1/RD8
SDI2/CN9/RG7 7
SDO2/CN10/RG8 53 INT4/RA15
8
MCLR 9 52 INT3/RA14
51 VSS
SS2/CN11/RG9 10 dsPIC30F5013
VSS 11 50 OSC2/CLKO/RC15
49 OSC1/CLKI
VDD 12
INT1/RA12 48 VDD
13
INT2/RA13 47 SCL/RG2
14
AN5/CN7/RB5 46 SDA/RG3
15
AN4/CN6/RB4 16 45 EMUC3/SCK1/INT0/RF6
AN3/CN5/RB3 17 44 SDI1/RF7
AN2/SS1/LVDIN/CN4/RB2 18 43 EMUD3/SDO1/RF8
PGC/EMUC/AN1/CN3/RB1 19 42 U1RX/RF2
PGD/EMUD/AN0/CN2/RB0 20 41 U1TX/RF3
21
22

34
35
36
37
38
39
40
23
24
25
26
27
28
29
30
31
32
33
AN10/RB10

AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
AN7/RB7
VREF-/RA9
VREF+/RA10
AVDD

IC7/CN20/RD14
IC8/CN21/RD15
AVSS
AN8/RB8
AN9/RB9

AN11/RB11
VSS
VDD

U2RX/CN17/RF4
U2TX/CN18/RF5
AN6/OCFA/RB6

Note: For descriptions of individual pins, see Section 1.0.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 13

dsPIC30F
Pin Diagrams (Continued)

80-Pin TQFP

EMUD2/OC2/RD1
IC6/CN19/RD13
OC8/CN16/RD7
OC7/CN15/RD6
OC6/CN14/RD5
OC5/CN13/RD4
C2RX/RG0
C2TX/RG1

C1RX/RF0
RA7/CN23
RA6/CN22

C1TX/RF1

IC5/RD12
OC4/RD3
OC3/RD2
RG13
RG12
RG14

VDD
VSS
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60 EMUC1/SOSCO/T1CK/CN0/RC14
RG15 1
59 EMUD1/SOSCI/CN1/RC13
T2CK/RC1 2
58 EMUC2/OC1/RD0
T3CK/RC2 3
57 IC4/RD11
T4CK/RC3 4
56 IC3/RD10
T5CK/RC4 5
55 IC2/RD9
SCK2/CN8/RG6 6
54 IC1/RD8
SDI2/CN9/RG7 7
SDO2/CN10/RG8 53 INT4/RA15
8
MCLR 9 52 INT3/RA14
51 VSS
SS2/CN11/RG9 10
VSS
dsPIC30F6013 50 OSC2/CLKO/RC15
11
VDD 49 OSC1/CLKI
12
INT1/RA12 48 VDD
13
INT2/RA13 47 SCL/RG2
14
AN5/CN7/RB5 46 SDA/RG3
15
AN4/CN6/RB4 16 45 EMUC3/SCK1/INT0/RF6
AN3/CN5/RB3 17 44 SDI1/RF7
AN2/SS1/LVDIN/CN4/RB2 18 43 EMUD3/SDO1/RF8
PGC/EMUC/AN1/CN3/RB1 19 42 U1RX/RF2
PGD/EMUD/AN0/CN2/RB0 20 41 U1TX/RF3
21
22

34
35
36
37
38
39
40
23
24
25
26
27
28
29
30
31
32
33
AN6/OCFA/RB6

VREF-/RA9
AN7/RB7

VREF+/RA10

AN8/RB8

AN10/RB10
AN11/RB11
AN9/RB9

AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
IC7/CN20/RD14
IC8/CN21/RD15
U2RX/CN17/RF4
U2TX/CN18/RF5
AVDD
AVSS

VSS
VDD

Note: For descriptions of individual pins, see Section 1.0.

DS70083G-page 14 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
Pin Diagrams (Continued)

80-Pin TQFP

EMUD2/OC2/RD1
IC6/CN19/RD13
OC8/CN16/RD7
OC7/CN15/RD6
OC6/CN14/RD5
OC5/CN13/RD4
CSDO/RG13

CSCK/RG14
CSDI/RG12

C2RX/RG0
C2TX/RG1

C1RX/RF0
RA7/CN23
RA6/CN22

C1TX/RF1

IC5/RD12
OC4/RD3
OC3/RD2
VDD
VSS
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60 EMUC1/SOSCO/T1CK/CN0/RC14
COFS/RG15 1
59 EMUD1/SOSCI/CN1/RC13
T2CK/RC1 2
58 EMUC2/OC1/RD0
T3CK/RC2 3
57 IC4/RD11
T4CK/RC3 4
56 IC3/RD10
T5CK/RC4 5
55 IC2/RD9
SCK2/CN8/RG6 6
54 IC1/RD8
SDI2/CN9/RG7 7
SDO2/CN10/RG8 53 INT4/RA15
8
MCLR 9 52 INT3/RA14
51 VSS
SS2/CN11/RG9 10 dsPIC30F6014
VSS 11 50 OSC2/CLKO/RC15
49 OSC1/CLKI
VDD 12
INT1/RA12 48 VDD
13
INT2/RA13 47 SCL/RG2
14
AN5/CN7/RB5 46 SDA/RG3
15
AN4/CN6/RB4 16 45 EMUC3/SCK1/INT0/RF6
AN3/CN5/RB3 17 44 SDI1/RF7
AN2/SS1/LVDIN/CN4/RB2 18 43 EMUD3/SDO1/RF8
PGC/EMUC/AN1/CN3/RB1 19 42 U1RX/RF2
PGD/EMUD/AN0/CN2/RB0 20 41 U1TX/RF3
21
22

34
35
36
37
38
39
40
23
24
25
26
27
28
29
30
31
32
33
AN10/RB10

AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
AN7/RB7
VREF-/RA9
VREF+/RA10
AVDD

IC7/CN20/RD14
IC8/CN21/RD15
AVSS
AN8/RB8
AN9/RB9

AN11/RB11
VSS
VDD

U2RX/CN17/RF4
U2TX/CN18/RF5
AN6/OCFA/RB6

Note: For descriptions of individual pins, see Section 1.0.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 15

dsPIC30F
Table of Contents
1.0 Device Overview ........................................................................................................................................................................ 17
2.0 CPU Architecture Overview........................................................................................................................................................ 21
3.0 Memory Organization ................................................................................................................................................................. 35
4.0 Address Generator Units ............................................................................................................................................................ 47
5.0 Interrupts .................................................................................................................................................................................... 55
6.0 Flash Program Memory .............................................................................................................................................................. 63
7.0 Data EEPROM Memory ............................................................................................................................................................. 69
8.0 I/O Ports ..................................................................................................................................................................................... 75
9.0 Timer1 Module ........................................................................................................................................................................... 81
10.0 Timer2/3 Module ........................................................................................................................................................................ 85
11.0 Timer4/5 Module ....................................................................................................................................................................... 91
12.0 Input Capture Module................................................................................................................................................................. 95
13.0 Output Compare Module ............................................................................................................................................................ 99
14.0 SPI Module............................................................................................................................................................................... 103
15.0 I2C Module ............................................................................................................................................................................... 107
16.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 115
17.0 CAN Module ............................................................................................................................................................................. 123
18.0 Data Converter Interface (DCI) Module.................................................................................................................................... 135
19.0 12-bit Analog-to-Digital Converter (A/D) Module ...................................................................................................................... 145
20.0 System Integration ................................................................................................................................................................... 153
21.0 Instruction Set Summary .......................................................................................................................................................... 169
22.0 Development Support............................................................................................................................................................... 177
23.0 Electrical Characteristics .......................................................................................................................................................... 183
24.0 Packaging Information.............................................................................................................................................................. 223
Index .................................................................................................................................................................................................. 237
On-Line Support................................................................................................................................................................................. 243
Systems Information and Upgrade Hot Line ...................................................................................................................................... 243
Reader Response .............................................................................................................................................................................. 244
Product Identification System............................................................................................................................................................. 245

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DS70083G-page 16 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
1.0 DEVICE OVERVIEW Figure 1-1 shows a sample device block diagram.

Note: This data sheet summarizes features of this group

Note: The device(s) depicted in this block
of dsPIC30F devices and is not intended to be a complete diagram are representative of the
reference source. For more information on the CPU, corresponding device family. Other
peripherals, register descriptions and general device devices of the same family may vary in
functionality, refer to the dsPIC30F Family Reference terms of number of pins and multiplexing
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F of pin functions. Typically, smaller devices
Programmer’s Reference Manual (DS70030). in the family contain a subset of the
peripherals present in the device(s) shown
This document contains device family specific in this diagram.
information for the dsPIC30F family of Digital Signal
Controller (DSC) devices. The dsPIC30F devices
contain extensive Digital Signal Processor (DSP)
functionality within a high performance 16-bit
microcontroller (MCU) architecture.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 17

dsPIC30F
FIGURE 1-1: dsPIC30F5013/6013/6014 BLOCK DIAGRAM

CN22/RA6
Y Data Bus CN23/RA7
X Data Bus
VREF-/RA9
16 16 16 VREF+/RA10
16
INT1/RA12
Interrupt Data Latch Data Latch INT2/RA13
Controller PSV & Table
Data Access Y Data X Data INT3/RA14
24 Control Block 8 16 RAM RAM INT4/RA15
(4 Kbytes) (4 Kbytes)
16 PORTA
Address Address
24 Latch Latch PGD/EMUD/AN0/CN2/RB0
16 16 16 PGC/EMUC/AN1/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
24 X RAGU
Y AGU AN3/CN5/RB3
PCU PCH PCL X WAGU
AN4/CN6/RB4
Program Counter
AN5/CN7/RB5
Address Latch Stack Loop
Control Control AN6/OCFA/RB6
Program Memory Logic Logic AN7/RB7
(144 Kbytes) AN8/RB8
AN9/RB9
Data EEPROM
(4 Kbytes) AN10/RB10
Effective Address AN11/RB11
Data Latch 16 AN12/RB12
AN13/RB13
AN14/RB14
ROM Latch 16 AN15/OCFB/CN12/RB15
24 PORTB
T2CK/RC1
IR T3CK/RC2
16 T4CK/RC3
16
T5CK/RC4
16 x 16 EMUD1/SOSCI/CN1/RC13
W Reg Array EMUC1/SOSCO/T1CK/CN0/RC14
Decode
OSC2/CLKO/RC15
Instruction PORTC
Decode & 16 16
Control EMUC2/OC1/RD0
EMUD2/OC2/RD1
OC3/RD2
Control Signals DSP Divide OC4/RD3
to Various Blocks Power-up Engine OC5/CN13/RD4
Unit
Timer OC6/CN14/RD5
Timing Oscillator OC7/CN15/RD6
OSC1/CLKI OC8/CN16/RD7
Generation Start-up Timer
IC1/RD8
POR/BOR ALU<16> IC2/RD9
Reset IC3/RD10
Watchdog 16 16 IC4/RD11
MCLR IC5/RD12
Timer
IC6/CN19/RD13
Low Voltage
IC7/CN20/RD14
VDD, VSS Detect IC8/CN21/RD15
AVDD, AVSS PORTD

Input Output C1RX/RF0

CAN1,
CAN2 12-bit ADC Capture Compare I2C C1TX/RF1
Module Module U1RX/RF2
U1TX/RF3
U2RX/CN17/RF4
U2TX/CN18/RF5
EMUC3/SCK1/INT0/RF6
SDI1/RF7
SPI1, UART1,
Timers DCI SPI2 UART2 EMUD3/SDO1/RF8
PORTF
C2RX/RG0
C2TX/RG1
SCL/RG2
SDA/RG3
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
SS2/CN11/RG9
CSDI/RG12
CSDO/RG13
CSCK/RG14
COFS/RG15
PORTG

DS70083G-page 18 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
Table 1-1 provides a brief description of device I/O
pinouts and the functions that may be multiplexed to a
port pin. Multiple functions may exist on one port pin.
When multiplexing occurs, the peripheral module’s
functional requirements may force an override of the
data direction of the port pin.
TABLE 1-1: PINOUT I/O DESCRIPTIONS
Pin Buffer
Pin Name Description
Type Type
AN0-AN15 I Analog Analog input channels.
AN0 and AN1 are also used for device programming data and
clock inputs, respectively.
AVDD P P Positive supply for analog module.
AVSS P P Ground reference for analog module.
CLKI I ST/CMOS External clock source input. Always associated with OSC1 pin
function.
CLKO O — Oscillator crystal output. Connects to crystal or resonator in
Crystal Oscillator mode. Optionally functions as CLKO in RC
and EC modes. Always associated with OSC2 pin
function.
CN0-CN23 I ST Input change notification inputs.
Can be software programmed for internal weak pull-ups on all
inputs.
COFS I/O ST Data Converter Interface frame synchronization pin.
CSCK I/O ST Data Converter Interface serial clock input/output pin.
CSDI I ST Data Converter Interface serial data input pin.
CSDO O — Data Converter Interface serial data output pin.
C1RX I ST CAN1 bus receive pin.
C1TX O — CAN1 bus transmit pin.
C2RX I ST CAN2 bus receive pin.
C2TX O — CAN2 bus transmit pin
EMUD I/O ST ICD Primary Communication Channel data input/output pin.
EMUC I/O ST ICD Primary Communication Channel clock input/output pin.
EMUD1 I/O ST ICD Secondary Communication Channel data
input/output pin.
EMUC1 I/O ST ICD Secondary Communication Channel clock input/output pin.
EMUD2 I/O ST ICD Tertiary Communication Channel data input/output pin.
EMUC2 I/O ST ICD Tertiary Communication Channel clock input/output pin.
EMUD3 I/O ST ICD Quaternary Communication Channel data
input/output pin.
EMUC3 I/O ST ICD Quaternary Communication Channel clock input/output pin.
IC1-IC8 I ST Capture inputs 1 through 8.
INT0 I ST External interrupt 0.
INT1 I ST External interrupt 1.
INT2 I ST External interrupt 2.
INT3 I ST External interrupt 3.
INT4 I ST External interrupt 4.
LVDIN I Analog Low Voltage Detect Reference Voltage input pin.
MCLR I/P ST Master Clear (Reset) input or programming voltage input. This
pin is an active low Reset to the device.
OCFA I ST Compare Fault A input (for Compare channels 1, 2, 3 and 4).
OCFB I ST Compare Fault B input (for Compare channels 5, 6, 7 and 8).
OC1-OC8 O — Compare outputs 1 through 8.
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power

 2004 Microchip Technology Inc. Preliminary DS70083G-page 19

dsPIC30F
TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Buffer
Pin Name Description
Type Type
OSC1 I ST/CMOS Oscillator crystal input. ST buffer when configured in RC mode;
CMOS otherwise.
OSC2 I/O — Oscillator crystal output. Connects to crystal or resonator in
Crystal Oscillator mode. Optionally functions as CLKO in RC
and EC modes.
PGD I/O ST In-Circuit Serial Programming data input/output pin.
PGC I ST In-Circuit Serial Programming clock input pin.
RA6-RA7 I/O ST PORTA is a bidirectional I/O port.
RA9-RA10 I/O ST
RA12-RA15 I/O ST
RB0-RB15 I/O ST PORTB is a bidirectional I/O port.
RC1-RC4 I/O ST PORTC is a bidirectional I/O port.
RC13-RC15 I/O ST
RD0-RD15 I/O ST PORTD is a bidirectional I/O port.
RF0-RF8 I/O ST PORTF is a bidirectional I/O port.
RG0-RG3 I/O ST PORTG is a bidirectional I/O port.
RG6-RG9 I/O ST
RG12-RG15 I/O ST
SCK1 I/O ST Synchronous serial clock input/output for SPI1.
SDI1 I ST SPI1 Data In.
SDO1 O — SPI1 Data Out.
SS1 I ST SPI1 Slave Synchronization.
SCK2 I/O ST Synchronous serial clock input/output for SPI2.
SDI2 I ST SPI2 Data In.
SDO2 O — SPI2 Data Out.
SS2 I ST SPI2 Slave Synchronization.
SCL I/O ST Synchronous serial clock input/output for I2C.
SDA I/O ST Synchronous serial data input/output for I2C.
SOSCO O — 32 kHz low power oscillator crystal output.
SOSCI I ST/CMOS 32 kHz low power oscillator crystal input. ST buffer when config-
ured in RC mode; CMOS otherwise.
T1CK I ST Timer1 external clock input.
T2CK I ST Timer2 external clock input.
T3CK I ST Timer3 external clock input.
T4CK I ST Timer4 external clock input.
T5CK I ST Timer5 external clock input.
U1RX I ST UART1 Receive.
U1TX O — UART1 Transmit.
U1ARX I ST UART1 Alternate Receive.
U1ATX O — UART1 Alternate Transmit.
U2RX I ST UART2 Receive.
U2TX O — UART2 Transmit.
VDD P — Positive supply for logic and I/O pins.
VSS P — Ground reference for logic and I/O pins.
VREF+ I Analog Analog Voltage Reference (High) input.
VREF- I Analog Analog Voltage Reference (Low) input.
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power

DS70083G-page 20 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
2.0 CPU ARCHITECTURE Overhead-free circular buffers (modulo addressing) are
OVERVIEW supported in both X and Y address spaces. This is pri-
marily intended to remove the loop overhead for DSP
Note: This data sheet summarizes features of this group algorithms.
of dsPIC30F devices and is not intended to be a complete The X AGU also supports bit-reversed addressing on
reference source. For more information on the CPU,
peripherals, register descriptions and general device destination effective addresses to greatly simplify input
functionality, refer to the dsPIC30F Family Reference or output data reordering for radix-2 FFT algorithms.
Manual (DS70046). For more information on the device Refer to Section 4.0 for details on modulo and
instruction set and programming, refer to the dsPIC30F bit-reversed addressing.
Programmer’s Reference Manual (DS70030).
The core supports Inherent (no operand), Relative,
2.1 Core Overview Literal, Memory Direct, Register Direct, Register
Indirect, Register Offset and Literal Offset Addressing
The core has a 24-bit instruction word. The Program modes. Instructions are associated with predefined
Counter (PC) is 23-bits wide with the Least Significant Addressing modes, depending upon their functional
(LS) bit always clear (refer to Section 3.1), and the requirements.
Most Significant (MS) bit is ignored during normal pro- For most instructions, the core is capable of executing
gram execution, except for certain specialized instruc- a data (or program data) memory read, a working reg-
tions. Thus, the PC can address up to 4M instruction ister (data) read, a data memory write and a program
words of user program space. An instruction pre-fetch (instruction) memory read per instruction cycle. As a
mechanism is used to help maintain throughput. Pro- result, 3-operand instructions are supported, allowing
gram loop constructs, free from loop count manage- C = A+B operations to be executed in a single cycle.
ment overhead, are supported using the DO and
REPEAT instructions, both of which are interruptible at A DSP engine has been included to significantly
any point. enhance the core arithmetic capability and throughput.
It features a high speed 17-bit by 17-bit multiplier, a
The working register array consists of 16 x 16-bit regis- 40-bit ALU, two 40-bit saturating accumulators and a
ters, each of which can act as data, address or offset 40-bit bidirectional barrel shifter. Data in the accumula-
registers. One working register (W15) operates as a tor or any working register can be shifted up to 15 bits
software stack pointer for interrupts and calls. right, or 16 bits left in a single cycle. The DSP instruc-
The data space is 64 Kbytes (32K words) and is split tions operate seamlessly with all other instructions and
into two blocks, referred to as X and Y data memory. have been designed for optimal real-time performance.
Each block has its own independent Address Genera- The MAC class of instructions can concurrently fetch
tion Unit (AGU). Most instructions operate solely two data operands from memory while multiplying two
through the X memory, AGU, which provides the W registers. To enable this concurrent fetching of data
appearance of a single unified data space. The operands, the data space has been split for these
Multiply-Accumulate (MAC) class of dual source DSP instructions and linear for all others. This has been
instructions operate through both the X and Y AGUs, achieved in a transparent and flexible manner, by ded-
splitting the data address space into two parts (see icating certain working registers to each address space
Section 3.2). The X and Y data space boundary is for the MAC class of instructions.
device specific and cannot be altered by the user. Each The core does not support a multi-stage instruction
data word consists of 2 bytes, and most instructions pipeline. However, a single stage instruction pre-fetch
can address data either as words or bytes. mechanism is used, which accesses and partially
There are two methods of accessing data stored in decodes instructions a cycle ahead of execution, in
program memory: order to maximize available execution time. Most
• The upper 32 Kbytes of data space memory can instructions execute in a single cycle with certain
be mapped into the lower half (user space) of pro- exceptions, as outlined in Section 2.3.
gram space at any 16K program word boundary, The core features a vectored exception processing
defined by the 8-bit Program Space Visibility Page structure for traps and interrupts, with 62 independent
(PSVPAG) register. This lets any instruction vectors. The exceptions consist of up to 8 traps (of
access program space as if it were data space, which 4 are reserved) and 54 interrupts. Each interrupt
with a limitation that the access requires an addi- is prioritized based on a user assigned priority between
tional cycle. Moreover, only the lower 16 bits of 1 and 7 (1 being the lowest priority and 7 being the
each instruction word can be accessed using this highest), in conjunction with a predetermined ‘natural
method. order’. Traps have fixed priorities ranging from 8 to 15.
• Linear indirect access of 32K word pages within
program space is also possible using any working
register, via table read and write instructions.
Table read and write instructions can be used to
access all 24 bits of an instruction word.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 21

dsPIC30F
2.2 Programmer’s Model 2.2.2 STATUS REGISTER
The programmer’s model is shown in Figure 2-1 and The dsPIC core has a 16-bit STATUS register (SR), the
consists of 16 x 16-bit working registers (W0 through LS Byte of which is referred to as the SR Low byte
W15), 2 x 40-bit accumulators (AccA and AccB), (SRL) and the MS Byte as the SR High byte (SRH).
STATUS register (SR), Data Table Page register See Figure 2-1 for SR layout.
(TBLPAG), Program Space Visibility Page register SRL contains all the MCU ALU operation status flags
(PSVPAG), DO and REPEAT registers (DOSTART, (including the Z bit), as well as the CPU Interrupt Prior-
DOEND, DCOUNT and RCOUNT) and Program ity Level status bits, IPL<2:0> and the Repeat Active
Counter (PC). The working registers can act as data, status bit, RA. During exception processing, SRL is
address or offset registers. All registers are memory concatenated with the MS Byte of the PC to form a
mapped. W0 acts as the W register for file register complete word value which is then stacked.
addressing.
The upper byte of the STATUS register contains the
Some of these registers have a shadow register asso- DSP Adder/Subtracter status bits, the DO Loop Active
ciated with each of them, as shown in Figure 2-1. The bit (DA) and the Digit Carry (DC) status bit.
shadow register is used as a temporary holding register
Most SR bits are read/write. Exceptions are:
and can transfer its contents to or from its host register
upon the occurrence of an event. None of the shadow 1. The DA bit: DA is read and clear only because
registers are accessible directly. The following rules accidentally setting it could cause erroneous
apply for transfer of registers into and out of shadows. operation.
• PUSH.S and POP.S 2. The RA bit: RA is a read only bit because acci-
W0, W1, W2, W3, SR (DC, N, OV, Z and C bits dentally setting it could cause erroneous opera-
only) are transferred. tion. RA is only set on entry into a REPEAT loop,
and cannot be directly cleared by software.
• DO instruction
DOSTART, DOEND, DCOUNT shadows are 3. The OV, OA, OB and OAB bits: These bits are
pushed on loop start, and popped on loop end. read only and can only be set by the DSP engine
overflow logic.
When a byte operation is performed on a working reg-
4. The SA, SB and SAB bits: These are read and
ister, only the Least Significant Byte of the target regis-
clear only and can only be set by the DSP
ter is affected. However, a benefit of memory mapped
engine saturation logic. Once set, these flags
working registers is that both the Least and Most Sig-
remain set until cleared by the user, irrespective
nificant Bytes can be manipulated through byte wide
of the results from any subsequent DSP
data memory space accesses.
operations.
2.2.1 SOFTWARE STACK POINTER/ Note 1: Clearing the SAB bit will also clear both
FRAME POINTER the SA and SB bits.
The dsPIC® devices contain a software stack. W15 is 2: When the memory mapped STATUS reg-
the dedicated software Stack Pointer (SP), and will be ister (SR) is the destination address for
automatically modified by exception processing and an operation which affects any of the SR
subroutine calls and returns. However, W15 can be ref- bits, data writes are disabled to all bits.
erenced by any instruction in the same manner as all
other W registers. This simplifies the reading, writing 2.2.2.1 Z Status Bit
and manipulation of the stack pointer (e.g., creating Instructions that use a carry/borrow input (ADDC,
stack frames). CPB, SUBB and SUBBR) will only be able to clear Z (for
a non-zero result) and can never set it. A multi-
Note: In order to protect against misaligned
precision sequence of instructions, starting with an
stack accesses, W15<0> is always clear.
instruction with no carry/borrow input, will thus auto-
W15 is initialized to 0x0800 during a Reset. The user matically logically AND the successive results of the
may reprogram the SP during initialization to any zero test. All results must be zero for the Z flag to
location within data space. remain set by the end of the sequence.
W14 has been dedicated as a stack frame pointer as All other instructions can set as well as clear the Z bit.
defined by the LNK and ULNK instructions. However,
W14 can be referenced by any instruction in the same 2.2.3 PROGRAM COUNTER
manner as all other W registers.
The program counter is 23-bits wide; bit 0 is always
clear. Therefore, the PC can address up to 4M
instruction words.

DS70083G-page 22 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 2-1: PROGRAMMER’S MODEL

D15 D0
W0/WREG
PUSH.S Shadow
W1
DO Shadow
W2
W3 Legend
W4
DSP Operand W5
Registers
W6
W7
Working Registers
W8
W9
DSP Address
Registers W10
W11
W12/DSP Offset
W13/DSP Write Back
W14/Frame Pointer
W15/Stack Pointer

SPLIM Stack Pointer Limit Register

AD39 AD31 AD15 AD0

DSP AccA
Accumulators AccB

PC22 PC0
0 Program Counter

7 0
TABPAG
TBLPAG Data Table Page Address

7 0
PSVPAG Program Space Visibility Page Address

15 0
RCOUNT REPEAT Loop Counter

15 0
DCOUNT DO Loop Counter

22 0
DOSTART DO Loop Start Address

22
DOEND DO Loop End Address

15 0
CORCON Core Configuration Register

OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C Status Register

SRH SRL

 2004 Microchip Technology Inc. Preliminary DS70083G-page 23

dsPIC30F
2.3 Instruction Flow
There are 8 types of instruction flows:
1. Normal one-word, one-cycle instructions: these
instructions take one effective cycle to execute
as shown in Figure 2-2.

FIGURE 2-2: INSTRUCTION PIPELINE FLOW: 1-WORD, 1-CYCLE

TCY0 TCY1 TCY2 TCY3 TCY4 TCY5

1. MOV.b #0x55,W0 Fetch 1 Execute 1
2. MOV.b #0x35,W1 Fetch 2 Execute 2
3. ADD.b W0,W1,W2 Fetch 3 Execute 3

2. One-word, two-cycle (or three-cycle) instruc-

tions that are flow control instructions: these
instructions include the relative branches, rela-
tive call, skips and returns. When an instruction
changes the PC (other than to increment it), the
pipelined fetch is discarded. This causes the
instruction to take two effective cycles to exe-
cute as shown in Figure 2-3. Some instructions
that change program flow require 3 cycles, such
as the RETURN, RETFIE and RETLW instruc-
tions, and instructions that skip over 2-word
instructions.

FIGURE 2-3: INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE

TCY0 TCY1 TCY2 TCY3 TCY4 TCY5

1. MOV #0x55,W0 Fetch 1 Execute 1
2. BTSC W1,#3 Fetch 2 Execute 2
Skip Taken
3. ADD W0,W1,W2 Fetch 3 Flush
4. BRA SUB_1 Fetch 4 Execute 4
5. SUB W0,W1,W3 Fetch 5 Flush
6. Instruction @ address SUB_1 Fetch SUB_1

DS70083G-page 24 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
3. One-word, two-cycle instructions that are not
flow control instructions: the only instructions of
this type are the MOV.D (load and store double-
word) instructions, as shown in Figure 2-4.

FIGURE 2-4: INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE MOV.D OPERATIONS

TCY0 TCY1 TCY2 TCY3 TCY4 TCY5
1. MOV W0,0x1234 Fetch 1 Execute 1
2. MOV.D [W0++],W1 Fetch 2 Execute 2
R/W Cycle 1
3. MOV W1,0x00AA Fetch 3 Execute 2
R/W Cycle2
3a. Stall Stall Execute 3
4. MOV 0x0CC, W0 Fetch 4 Execute 4

4. Table read/write instructions: these instructions

will suspend the fetching to insert a read or write
cycle to the program memory. The instruction
fetched while executing the table operation is
saved for 1 cycle and executed in the cycle
immediately after the table operation as shown
in Figure 2-5.

FIGURE 2-5: INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE TABLE OPERATIONS

TCY0 TCY1 TCY2 TCY3 TCY4 TCY5

1. MOV #0x1234,W0 Fetch 1 Execute 1
2. TBLRDL [W0++],W1 Fetch 2 Execute 2
3. MOV #0x00AA,W1 Fetch 3 Execute 2
Read Cycle
3a. Table Operation Bus Read Execute 3
4. MOV #0x0CC,W0 Fetch 4 Execute 4

5. Two-word instructions for CALL and GOTO: in

these instructions, the fetch after the instruction
provides the remainder of the jump or call desti-
nation address. These instructions require 2
cycles to execute, 1 cycle to fetch the 2 instruc-
tion words (enabled by a high speed path on the
second fetch), and 1 cycle to flush the pipeline
as shown in Figure 2-6.

FIGURE 2-6: INSTRUCTION PIPELINE FLOW: 2-WORD, 2-CYCLE GOTO, CALL

TCY0 TCY1 TCY2 TCY3 TCY4 TCY5

1. MOV #0x1234,W0 Fetch 1 Execute 1
2. GOTO LABEL Fetch 2L Update PC
2a. Second Word Fetch 2H NOP
3. Instruction @ address LABEL Fetch Execute
LABEL LABEL
4. BSET W1, #BIT3 Fetch 4 Execute 4

 2004 Microchip Technology Inc. Preliminary DS70083G-page 25

dsPIC30F
6. Two-word instructions for DO: in these instruc-
tions, the fetch after the instruction contains an
address offset. This address offset is added to
the first instruction address to generate the last
loop instruction address. Therefore, these
instructions require 2 cycles as shown in
Figure 2-7.

FIGURE 2-7: INSTRUCTION PIPELINE FLOW: 2-WORD, 2-CYCLE DO, DOW

TCY0 TCY1 TCY2 TCY3 TCY4

1. PUSH DOEND Fetch 1 Execute 1
2. DO LABEL,#COUNT Fetch 2L NOP
2a. Second Word Fetch 2H Execute 2
3. 1st Instruction of Loop Fetch 3 Execute 3

7. Instructions that are subjected to a stall due to a

data dependency between the X RAGU and
X WAGU: an additional cycle is inserted to
resolve the resource conflict as shown in
Figure 2-7. Instruction stalls caused by data
dependencies are further discussed in
Section 4.0.

FIGURE 2-8: INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE WITH INSTRUCTION STALL

TCY0 TCY1 TCY2 TCY3 TCY4 TCY5

1. MOV.b W0,[W1] Fetch 1 Execute 1
2. MOV.b [W1],PORTB Fetch 2 NOP
2a. Stall (NOP) Stall Execute 2
3. MOV.b W0,PORTB Fetch 3 Execute 3

8. Interrupt recognition execution: refer to

Section 6.0 for details on interrupts.

DS70083G-page 26 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
2.4 Divide Support The non-restoring divide algorithm requires one cycle
for an initial dividend shift (for integer divides only), one
The dsPIC devices feature a 16/16-bit signed fractional cycle per divisor bit, and a remainder/quotient correc-
divide operation, as well as 32/16-bit and 16/16-bit tion cycle. The correction cycle is the last cycle of the
signed and unsigned integer divide operations, in the iteration loop but must be performed (even if the
form of single instruction iterative divides. The following remainder is not required) because it may also adjust
instructions and data sizes are supported: the quotient. A consequence of this is that DIVF will
1. DIVF - 16/16 signed fractional divide also produce a valid remainder (though it is of little use
2. DIV.sd - 32/16 signed divide in fractional arithmetic).
3. DIV.ud - 32/16 unsigned divide The divide instructions must be executed within a
4. DIV.sw - 16/16 signed divide REPEAT loop. Any other form of execution (e.g., a
series of discrete divide instructions) will not function
5. DIV.uw - 16/16 unsigned divide
correctly because the instruction flow depends on
The 16/16 divides are similar to the 32/16 (same number RCOUNT. The divide instruction does not automatically
of iterations), but the dividend is either zero-extended or set up the RCOUNT value and it must, therefore, be
sign-extended during the first iteration. explicitly and correctly specified in the REPEAT instruc-
The quotient for all divide instructions is stored in W0, tion as shown in Table 2-1 (REPEAT will execute the tar-
and the remainder in W1. DIV and DIVF can specify get instruction {operand value+1} times). The REPEAT
any W register for both the 16-bit dividend and divisor. loop count must be setup for 18 iterations of the DIV/
All other divides can specify any W register for the DIVF instruction. Thus, a complete divide operation
16-bit divisor, but the 32-bit dividend must be in an requires 19 cycles.
aligned W register pair, such as W1:W0, W3:W2, etc. Note: The divide flow is interruptible. However,
the user needs to save the context as
appropriate.

TABLE 2-1: DIVIDE INSTRUCTIONS

Instruction Function
DIVF Signed fractional divide: Wm/Wn → W0; Rem → W1
DIV.sd Signed divide: (Wm+1:Wm)/Wn → W0; Rem → W1
DIV.sw or Signed divide: Wm/Wn → W0; Rem → W1
DIV.s
DIV.ud Unsigned divide: (Wm+1:Wm)/Wn → W0; Rem → W1
DIV.uw or Unsigned divide: Wm/Wn → W0; Rem → W1
DIV.u

 2004 Microchip Technology Inc. Preliminary DS70083G-page 27

dsPIC30F
2.5 DSP Engine The DSP engine also has the capability to perform
inherent accumulator-to-accumulator operations,
Concurrent operation of the DSP engine with MCU which require no additional data. These instructions are
instruction flow is not possible, though both the MCU ADD, SUB and NEG.
ALU and DSP engine resources may be used concur-
rently by the same instruction (e.g., ED and EDAC The DSP engine has various options selected through
instructions). various bits in the CPU Core Configuration register
(CORCON), as listed below:
The DSP engine consists of a high speed 17-bit x
17-bit multiplier, a barrel shifter and a 40-bit adder/ 1. Fractional or integer DSP multiply (IF).
subtracter (with two target accumulators, round and 2. Signed or unsigned DSP multiply (US).
saturation logic). 3. Conventional or convergent rounding (RND).
Data input to the DSP engine is derived from one of the 4. Automatic saturation on/off for AccA (SATA).
following: 5. Automatic saturation on/off for AccB (SATB).
1. Directly from the W array (registers W4, W5, W6 6. Automatic saturation on/off for writes to data
or W7) via the X and Y data buses for the MAC memory (SATDW).
class of instructions (MAC, MSC, MPY, 7. Accumulator Saturation mode selection
MPY.N, ED, EDAC, CLR and MOVSAC). (ACCSAT).
2. From the X bus for all other DSP instructions.
Note: For CORCON layout, see Table 4-3.
3. From the X bus for all MCU instructions which
use the barrel shifter. A block diagram of the DSP engine is shown in
Figure 2-9.
Data output from the DSP engine is written to one of the
following:
1. The target accumulator, as defined by the DSP
instruction being executed.
2. The X bus for MAC, MSC, CLR and MOVSAC
accumulator writes, where the EA is derived
from W13 only. (MPY, MPY.N, ED and EDAC
do not offer an accumulator write option.)
3. The X bus for all MCU instructions which use the
barrel shifter.

DS70083G-page 28 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 2-9: DSP ENGINE BLOCK DIAGRAM

S
a
40 40-bit Accumulator A 40 Round t 16
40-bit Accumulator B u
Logic r
a
Carry/Borrow Out t
Saturate e
Carry/Borrow In Adder

Negate

40 40 40

Barrel
16
Shifter

X Data Bus
40

Sign-Extend
Y Data Bus

32 16
Zero Backfill
32
33

17-bit
Multiplier/Scaler

16 16

To/From W Array

 2004 Microchip Technology Inc. Preliminary DS70083G-page 29

dsPIC30F
2.5.1 MULTIPLIER When the multiplier is configured for fractional multipli-
cation, the data is represented as a two’s complement
The 17 x 17-bit multiplier is capable of signed or
fraction, where the MSB is defined as a sign bit and the
unsigned operation and can multiplex its output using a
radix point is implied to lie just after the sign bit (QX
scaler to support either 1.31 fractional (Q31) or 32-bit
format). The range of an N-bit two’s complement frac-
integer results. The respective number representation
tion with this implied radix point is -1.0 to (1 – 21-N). For
formats are shown in Figure 2-10. Unsigned operands
a 16-bit fraction, the Q15 data range is -1.0 (0x8000)
are zero-extended into the 17th bit of the multiplier
to 0.999969482 (0x7FFF) including ‘0’ and has a
input value. Signed operands are sign-extended into
precision of 3.01518x10-5. In Fractional mode, the
the 17th bit of the multiplier input value. The output of
16x16 multiply operation generates a 1.31 product
the 17 x 17-bit multiplier/scaler is a 33-bit value which
which has a precision of 4.65661 x 10-10.
is sign-extended to 40 bits. Integer data is inherently
represented as a signed two’s complement value,
where the MSB is defined as a sign bit. Generally
speaking, the range of an N-bit two’s complement inte-
ger is -2N-1 to 2N-1 – 1. For a 16-bit integer, the data
range is -32768 (0x8000) to 32767 (0x7FFF) including
‘0’ (see Figure 2-10). For a 32-bit integer, the data
range is -2,147,483,648 (0x8000 0000) to
2,147,483,645 (0x7FFF FFFF).

FIGURE 2-10: 16-BIT INTEGER AND FRACTIONAL MODES

Different Representations of 0x4001
Integer:

0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 1

20
2 14
2 13
2 12
2 11
.... 20

0x4001 = 214 + 20 = 16385

1.15 Fractional:

0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 1

-20 . -1
2 2 -2 -3
2 ... 2-15

0x4001 = 2-1 + 2-15 = 0.500030518

Certain multiply operations always operate on signed different. In these instructions, data format selection is
data. These include the MAC/MSC, MPY[.N] and made with the IF bit (CORCON<0>) and US bits
ED[AC] instructions. The 40-bit adder/subtracter may (CORCON<12>), and it must be set accordingly (‘0’ for
also optionally negate one of its operand inputs to Fractional mode, ‘1’ for Integer mode in the case of the
change the result sign (without changing the oper- IF bit, and ‘0’ for Signed mode, ‘1’ for Unsigned mode
ands). This is used to create a multiply and subtract in the case of the US bit). This is required because of
(MSC), or multiply and negate (MPY.N) operation. the implied radix point used by dsPIC30F fractions. In
In the special case when both input operands are 1.15 Integer mode, multiplying two 16-bit integers produces
fractions and equal to 0x8000 (-110), the result of the a 32-bit integer result. However, multiplying two 1.15
multiplication is corrected to 0x7FFFFFFF (as the values generates a 2.30 result. Since the dsPIC30F
closest approximation to +1) by hardware before it is uses 1.31 format for the accumulators, a DSP multiply
used. in Fractional mode also includes a left shift by one bit to
keep the radix point properly aligned. This feature
It should be noted that with the exception of DSP mul- reduces the resolution of the DSP multiplier to 2-30, but
tiplies, the dsPIC30F ALU operates identically on inte- has no other effect on the computation.
ger and fractional data. Namely, an addition of two
integers will yield the same result (binary number) as
the addition of two fractional numbers. The only differ-
ence is how the result is interpreted by the user. How-
ever, multiplies performed by DSP operations are

DS70083G-page 30 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
The same multiplier is used to support the MCU multi- Six STATUS register bits have been provided to
ply instructions which include integer 16-bit signed, support saturation and overflow; they are:
unsigned and mixed sign multiplies. Additional data 1. OA:
paths are provided to allow these instructions to write AccA overflowed into guard bits
the result back into the W array and X data bus (via the
2. OB:
W array). These paths are placed prior to the data
AccB overflowed into guard bits
scaler. The IF bit in the CORCON register, therefore,
only affects the result of the MAC class of DSP instruc- 3. SA:
tions. All other multiply operations are assumed to be AccA saturated (bit 31 overflow and saturation)
integer operations. If the user executes a MAC instruc- or
tion on fractional data without clearing the IF bit, the AccA overflowed into guard bits and saturated
result must be explicitly shifted left by the user program (bit 39 overflow and saturation)
after multiplication in order to obtain the correct result. 4. SB:
AccB saturated (bit 31 overflow and saturation)
The MUL instruction may be directed to use byte or
or
word sized operands. Byte operands will direct a 16-bit
AccB overflowed into guard bits and saturated
result, and word operands will direct a 32-bit result to
(bit 39 overflow and saturation)
the specified register(s) in the W array.
5. OAB:
2.5.2 DATA ACCUMULATORS AND Logical OR of OA and OB
ADDER/SUBTRACTER 6. SAB:
Logical OR of SA and SB
The data accumulator consists of a 40-bit adder/
subtracter with automatic sign extension logic. It can The OA and OB bits are modified each time data
select one of two accumulators (A or B) as its pre- passes through the adder/subtracter. When set, they
accumulation source and post-accumulation destina- indicate that the most recent operation has overflowed
tion. For the ADD and LAC instructions, the data to be into the accumulator guard bits (bits 32 through 39).
accumulated or loaded can be optionally scaled via the The OA and OB bits can also optionally generate an
barrel shifter, prior to accumulation. arithmetic warning trap when set and the correspond-
ing overflow trap flag enable bit (OVATEN, OVBTEN) in
2.5.2.1 Adder/Subtracter, Overflow and the INTCON1 register (refer to Section 5.0) is set. This
Saturation allows the user to take immediate action, for example,
to correct system gain.
The adder/subtracter is a 40-bit adder with an optional
zero input into one side and either true, or complement The SA and SB bits are modified each time data
data into the other input. In the case of addition, the passes through the adder/subtracter but can only be
carry/borrow input is active high and the other input is cleared by the user. When set, they indicate that the
true data (not complemented), whereas in the case of accumulator has overflowed its maximum range (bit 31
subtraction, the carry/borrow input is active low and the for 32-bit saturation, or bit 39 for 40-bit saturation) and
other input is complemented. The adder/subtracter will be saturated (if saturation is enabled). When satu-
generates overflow status bits SA/SB and OA/OB, ration is not enabled, SA and SB default to bit 39 over-
which are latched and reflected in the STATUS register: flow and thus indicate that a catastrophic overflow has
occurred. If the COVTE bit in the INTCON1 register is
• Overflow from bit 39: this is a catastrophic
set, SA and SB bits will generate an arithmetic warning
overflow in which the sign of the accumulator is
trap when saturation is disabled.
destroyed.
• Overflow into guard bits 32 through 39: this is a The overflow and saturation status bits can optionally
recoverable overflow. This bit is set whenever all be viewed in the STATUS register (SR) as the logical
the guard bits bits are not identical to each other. OR of OA and OB (in bit OAB) and the logical OR of SA
and SB (in bit SAB). This allows programmers to check
The adder has an additional saturation block which one bit in the STATUS register to determine if either
controls accumulator data saturation, if selected. It accumulator has overflowed, or one bit to determine if
uses the result of the adder, the overflow status bits either accumulator has saturated. This would be useful
described above, and the SATA/B (CORCON<7:6>) for complex number arithmetic which typically uses
and ACCSAT (CORCON<4>) mode control bits to both the accumulators.
determine when and to what value to saturate.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 31

dsPIC30F
The device supports three saturation and overflow 2.5.2.3 Round Logic
modes:
The round logic is a combinational block which per-
1. Bit 39 Overflow and Saturation: forms a conventional (biased) or convergent (unbi-
When bit 39 overflow and saturation occurs, the ased) round function during an accumulator write
saturation logic loads the maximally positive 9.31 (store). The Round mode is determined by the state of
(0x7FFFFFFFFF), or maximally negative 9.31 the RND bit in the CORCON register. It generates a 16-
value (0x8000000000) into the target accumula- bit, 1.15 data value which is passed to the data space
tor. The SA or SB bit is set and remains set until write saturation logic. If rounding is not indicated by the
cleared by the user. This is referred to as ‘super instruction, a truncated 1.15 data value is stored and
saturation’ and provides protection against erro- the LS Word is simply discarded.
neous data, or unexpected algorithm problems
The two Rounding modes are shown in Figure 2-10.
(e.g., gain calculations).
Conventional rounding takes bit 15 of the accumulator,
2. Bit 31 Overflow and Saturation: zero-extends it and adds it to the ACCxH word (bits 16
When bit 31 overflow and saturation occurs, the through 31 of the accumulator). If the ACCxL word
saturation logic then loads the maximally posi- (bits 0 through 15 of the accumulator) is between
tive 1.31 value (0x007FFFFFFF), or maximally 0x8000 and 0xFFFF (0x8000 included), ACCxH is
negative 1.31 value (0x0080000000) into the incremented. If ACCxL is between 0x0000 and
target accumulator. The SA or SB bit is set and 0x7FFF, ACCxH is left unchanged. A consequence of
remains set until cleared by the user. When this this algorithm is that over a succession of random
Saturation mode is in effect, the guard bits are rounding operations, the value will tend to be biased
not used (so the OA, OB or OAB bits are never slightly positive.
set).
Convergent (or unbiased) rounding operates in the
3. Bit 39 Catastrophic Overflow:
same manner as conventional rounding, except when
The bit 39 overflow status bit from the adder is
ACCxL equals 0x8000. If this is the case, the LS bit
used to set the SA or SB bit which remain set
(bit 16 of the accumulator) of ACCxH is examined. If it
until cleared by the user. No saturation operation
is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not
is performed and the accumulator is allowed to
modified. Assuming that bit 16 is effectively random in
overflow (destroying its sign). If the COVTE bit in
nature, this scheme will remove any rounding bias that
the INTCON1 register is set, a catastrophic
may accumulate.
overflow can initiate a trap exception.
The SAC and SAC.R instructions store either a trun-
2.5.2.2 Accumulator ‘Write Back’ cated (SAC) or rounded (SAC.R) version of the contents
of the target accumulator to data memory via the X bus
The MAC class of instructions (with the exception of
(subject to data saturation, see Section 2.5.2.4). Note
MPY, MPY.N, ED and EDAC) can optionally write a
that for the MAC class of instructions, the accumulator
rounded version of the high word (bits 31 through 16)
write back operation will function in the same manner,
of the accumulator that is not targeted by the instruction
addressing combined MCU (X and Y) data space
into data space memory. The write is performed across
though the X bus. For this class of instructions, the data
the X bus into combined X and Y address space. The
is always subject to rounding.
following Addressing modes are supported:
1. W13, Register Direct:
The rounded contents of the non-target
accumulator are written into W13 as a 1.15
fraction.
2. [W13]+=2, Register Indirect with Post-Increment:
The rounded contents of the non-target accumu-
lator are written into the address pointed to by
W13 as a 1.15 fraction. W13 is then
incremented by 2 (for a word write).

DS70083G-page 32 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
2.5.2.4 Data Space Write Saturation 2.5.3 BARREL SHIFTER
In addition to adder/subtracter saturation, writes to data The barrel shifter is capable of performing up to 15-bit
space may also be saturated but without affecting the arithmetic or logic right shifts, or up to 16-bit left shifts
contents of the source accumulator. The data space in a single cycle. The source can be either of the two
write saturation logic block accepts a 16-bit, 1.15 frac- DSP accumulators, or the X bus (to support multi-bit
tional value from the round logic block as its input, shifts of register or memory data).
together with overflow status from the original source The shifter requires a signed binary value to determine
(accumulator) and the 16-bit round adder. These are both the magnitude (number of bits) and direction of the
combined and used to select the appropriate 1.15 shift operation. A positive value will shift the operand
fractional value as output to write to data space right. A negative value will shift the operand left. A
memory. value of ‘0’ will not modify the operand.
If the SATDW bit in the CORCON register is set, data The barrel shifter is 40-bits wide, thereby obtaining a
(after rounding or truncation) is tested for overflow and 40-bit result for DSP shift operations and a 16-bit result
adjusted accordingly, For input data greater than for MCU shift operations. Data from the X bus is pre-
0x007FFF, data written to memory is forced to the sented to the barrel shifter between bit positions 16 to
maximum positive 1.15 value, 0x7FFF. For input data 31 for right shifts, and bit positions 0 to 15 for left shifts.
less than 0xFF8000, data written to memory is forced
to the maximum negative 1.15 value, 0x8000. The MS
bit of the source (bit 39) is used to determine the sign
of the operand being tested.
If the SATDW bit in the CORCON register is not set, the
input data is always passed through unmodified under
all conditions.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 33

dsPIC30F
NOTES:

DS70083G-page 34 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
3.0 MEMORY ORGANIZATION User program space access is restricted to the lower
4M instruction word address range (0x000000 to
Note: This data sheet summarizes features of this group 0x7FFFFE) for all accesses other than TBLRD/TBLWT,
of dsPIC30F devices and is not intended to be a complete which use TBLPAG<7> to determine user or configura-
reference source. For more information on the CPU,
peripherals, register descriptions and general device
tion space access. In Table 3-1, Program Space
functionality, refer to the dsPIC30F Family Reference Address Construction, bit 23 allows access to the
Manual (DS70046). For more information on the device Device ID, the User ID and the configuration bits.
instruction set and programming, refer to the dsPIC30F Otherwise, bit 23 is always clear.
Programmer’s Reference Manual (DS70030).
Note: The address map shown in Figure 3-5 is
3.1 Program Address Space conceptual, and the actual memory con-
figuration may vary across individual
The program address space is 4M instruction words. It devices depending on available memory.
is addressable by a 24-bit value from either the 23-bit
PC, table instruction EA, or data space EA, when pro-
gram space is mapped into data space as defined by
Table 3-1. Note that the program space address is
incremented by two between successive program
words in order to provide compatibility with data space
addressing.

TABLE 3-1: PROGRAM SPACE ADDRESS CONSTRUCTION

Access Program Space Address
Access Type
Space <23> <22:16> <15> <14:1> <0>
Instruction Access User 0 PC<22:1> 0
TBLRD/TBLWT User TBLPAG<7:0> Data EA<15:0>
(TBLPAG<7> = 0)
TBLRD/TBLWT Configuration TBLPAG<7:0> Data EA<15:0>
(TBLPAG<7> = 1)
Program Space Visibility User 0 PSVPAG<7:0> Data EA<14:0>

FIGURE 3-1: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION

23 bits
Using
Program 0 Program Counter 0
Counter

Select
1 EA
Using
Program 0 PSVPAG Reg
Space
Visibility 8 bits 15 bits

EA

Using 1/0 TBLPAG Reg

Table
Instruction
8 bits 16 bits

User/
Configuration Byte
Space 24-bit EA
Select
Select

Note: Program space visibility cannot be used to access bits <23:16> of a word in program memory.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 35

dsPIC30F
3.1.1 PROGRAM SPACE ALIGNMENT A set of table instructions are provided to move byte or
AND DATA ACCESS USING TABLE word sized data to and from program space.
INSTRUCTIONS 1. TBLRDL: Table Read Low
This architecture fetches 24-bit wide program memory. Word: Read the LS Word of the program address;
Consequently, instructions are always aligned. P<15:0> maps to D<15:0>.
However, as the architecture is modified Harvard, data Byte: Read one of the LS Bytes of the program
can also be present in program space. address;
P<7:0> maps to the destination byte when byte
There are two methods by which program space can select = 0;
be accessed: via special table instructions, or through P<15:8> maps to the destination byte when byte
the remapping of a 16K word program space page into select = 1.
the upper half of data space (see Section 3.1.2). The
2. TBLWTL: Table Write Low (refer to Section 6.0
TBLRDL and TBLWTL instructions offer a direct method
for details on Flash Programming)
of reading or writing the LS Word of any address within
program space, without going through data space. The 3. TBLRDH: Table Read High
TBLRDH and TBLWTH instructions are the only method Word: Read the MS Word of the program address;
whereby the upper 8 bits of a program space word can P<23:16> maps to D<7:0>; D<15:8> will always
be accessed as data. be = 0.
Byte: Read one of the MS Bytes of the program
The PC is incremented by two for each successive address;
24-bit program word. This allows program memory P<23:16> maps to the destination byte when
addresses to directly map to data space addresses. byte select = 0;
Program memory can thus be regarded as two 16-bit The destination byte will always be = 0 when
word wide address spaces, residing side by side, each byte select = 1.
with the same address range. TBLRDL and TBLWTL
4. TBLWTH: Table Write High (refer to Section 6.0
access the space which contains the LS Data Word,
for details on Flash Programming)
and TBLRDH and TBLWTH access the space which
contains the MS Data Byte.
Figure 3-1 shows how the EA is created for table oper-
ations and data space accesses (PSV = 1). Here,
P<23:0> refers to a program space word, whereas
D<15:0> refers to a data space word.

FIGURE 3-2: PROGRAM DATA TABLE ACCESS (LS WORD)

PC Address 23 16 8 0
0x000000 00000000
0x000002 00000000
0x000004 00000000
0x000006 00000000

TBLRDL.B (Wn<0> = 0)
TBLRDL.W
Program Memory
‘Phantom’ Byte
TBLRDL.B (Wn<0> = 1)
(read as ‘0’)

DS70083G-page 36 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 3-3: PROGRAM DATA TABLE ACCESS (MS BYTE)

TBLRDH.W

PC Address 23 16 8 0
0x000000 00000000
0x000002 00000000
0x000004 00000000
0x000006 00000000

TBLRDH.B (Wn<0> = 0)

Program Memory
‘Phantom’ Byte
(read as ‘0’) TBLRDH.B (Wn<0> = 1)

3.1.2 PROGRAM SPACE VISIBILITY Note that by incrementing the PC by 2 for each
FROM DATA SPACE program memory word, the LS 15 bits of data space
addresses directly map to the LS 15 bits in the corre-
The upper 32 Kbytes of data space may optionally be
sponding program space addresses. The remaining
mapped into any 16K word program space page. This
bits are provided by the Program Space Visibility Page
provides transparent access of stored constant data
register, PSVPAG<7:0>, as shown in Figure 3-4.
from X data space without the need to use special
instructions (i.e., TBLRDL/H, TBLWTL/H instructions). Note: PSV access is temporarily disabled during
Program space access through the data space occurs table reads/writes.
if the MS bit of the data space EA is set and program For instructions that use PSV which are executed
space visibility is enabled by setting the PSV bit in the outside a REPEAT loop:
Core Control register (CORCON). The functions of
• The following instructions will require one
CORCON are discussed in Section 2.5, DSP Engine.
instruction cycle in addition to the specified
Data accesses to this area add an additional cycle to execution time:
the instruction being executed, since two program - MAC class of instructions with data operand
memory fetches are required. pre-fetch
Note that the upper half of addressable data space is - MOV instructions
always part of the X data space. Therefore, when a - MOV.D instructions
DSP operation uses program space mapping to access
• All other instructions will require two instruction
this memory region, Y data space should typically con-
cycles in addition to the specified execution time
tain state (variable) data for DSP operations, whereas
of the instruction.
X data space should typically contain coefficient
(constant) data. For instructions that use PSV which are executed
inside a REPEAT loop:
Although each data space address, 0x8000 and
higher, maps directly into a corresponding program • The following instances will require two instruction
memory address (see Figure 3-4), only the lower cycles in addition to the specified execution time
16 bits of the 24-bit program word are used to contain of the instruction:
the data. The upper 8 bits should be programmed to - Execution in the first iteration
force an illegal instruction to maintain machine robust- - Execution in the last iteration
ness. Refer to the Programmer’s Reference Manual - Execution prior to exiting the loop due to an
(DS70030) for details on instruction encoding. interrupt
- Execution upon re-entering the loop after an
interrupt is serviced
• Any other iteration of the REPEAT loop will allow
the instruction accessing data, using PSV, to
execute in a single cycle.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 37

dsPIC30F
FIGURE 3-4: DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION

Program Space

Data Space
0x0000

15 PSVPAG(1)
EA<15> = 0 0x21
8

Data 16
Space 0x8000 0x108000
15 23 15 0
EA Address
EA<15> = 1 Concatenation 23 0x108200
15

Upper Half of Data

Space is Mapped
into Program Space
0xFFFF 0x10FFFF

BSET CORCON,#2 ; PSV bit set

MOV #0x21, W0 ; Set PSVPAG register
MOV W0, PSVPAG
MOV 0x8200, W0 ; Access program memory location
; using a data space access
Data Read

Note: PSVPAG is an 8-bit register, containing bits <22:15> of the program space address (i.e., it defines
the page in program space to which the upper half of data space is being mapped).

DS70083G-page 38 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 3-5: SAMPLE PROGRAM 3.2 Data Address Space
SPACE MEMORY MAP
The core has two data spaces. The data spaces can be
Reset - GOTO Instruction 000000 considered either separate (for some DSP instruc-
Reset - Target Address 000002 tions), or as one unified linear address range (for MCU
000004
instructions). The data spaces are accessed using two
Address Generation Units (AGUs) and separate data
paths.
Vector Tables
Interrupt Vector Table
3.2.1 DATA SPACES
The X data space is used by all instructions and sup-
ports all Addressing modes. There are separate read
and write data buses. The X read data bus is the return
data path for all instructions that view data space as
00007E
Reserved 000080 combined X and Y address space. It is also the X
User Memory

Alternate Vector Table 000084 address space data path for the dual operand read
Space

0000FE
000100 instructions (MAC class). The X write data bus is the
User Flash
Program Memory only write path to data space for all instructions.
(48K instructions)
017FFE
The X data space also supports modulo addressing for
018000 all instructions, subject to Addressing mode restric-
Reserved tions. Bit-reversed addressing is only supported for
(Read ‘0’s)
7FEFFE writes to X data space.
7FF000
Data EEPROM The Y data space is used in concert with the X data
(4 Kbytes) space by the MAC class of instructions (CLR, ED,
7FFFFE EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to
800000 provide two concurrent data read paths. No writes
occur across the Y bus. This class of instructions dedi-
cates two W register pointers, W10 and W11, to always
address Y data space, independent of X data space,
whereas W8 and W9 always address X data space.
Note that during accumulator write back, the data
Reserved address space is considered a combination of X and Y
data spaces, so the write occurs across the X bus.
Consequently, the write can be to any address in the
entire data space.
The Y data space can only be used for the data pre-
fetch operation associated with the MAC class of
Configuration Memory

instructions. It also supports modulo addressing for

8005BE automated circular buffers. Of course, all other instruc-
Space

8005C0 tions can access the Y data address space through the
UNITID (32 instr.)
8005FE X data path as part of the composite linear space.
800600
Reserved The boundary between the X and Y data spaces is
F7FFFE defined as shown in Figure 3-8 and is not user pro-
Device Configuration F80000
Registers F8000E
grammable. Should an EA point to data outside its own
F80010 assigned address space, or to a location outside phys-
ical memory, an all zero word/byte will be returned. For
example, although Y address space is visible by all
non-MAC instructions using any Addressing mode, an
attempt by a MAC instruction to fetch data from that
Reserved
space using W8 or W9 (X space pointers) will return
0x0000.

FEFFFE
DEVID (2) FF0000
FFFFFE

Note: These address boundaries may vary from one

device to another.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 39

dsPIC30F
TABLE 3-2: EFFECT OF INVALID FIGURE 3-6: DATA ALIGNMENT
MEMORY ACCESSES MS Byte LS Byte
15 87 0
Attempted Operation Data Returned
0001 Byte1 Byte 0 0000
EA = an unimplemented address 0x0000
0003 Byte3 Byte 2 0002
W8 or W9 used to access Y data 0x0000
space in a MAC instruction Byte5 Byte 4
0005 0004
W10 or W11 used to access X 0x0000
data space in a MAC instruction
All byte loads into any W register are loaded into the LS
All effective addresses are 16 bits wide and point to Byte. The MSB is not modified.
bytes within the data space. Therefore, the data space
address range is 64 Kbytes or 32K words. A sign-extend (SE) instruction is provided to allow
users to translate 8-bit signed data to 16-bit signed
3.2.2 DATA SPACE WIDTH values. Alternatively, for 16-bit unsigned data, users
can clear the MSB of any W register by executing a
The core data width is 16 bits. All internal registers are zero-extend (ZE) instruction on the appropriate
organized as 16-bit wide words. Data space memory is address.
organized in byte addressable, 16-bit wide blocks.
Although most instructions are capable of operating on
3.2.3 DATA ALIGNMENT word or byte data sizes, it should be noted that some
instructions, including the DSP instructions, operate
To help maintain backward compatibility with
only on words.
PICmicro® devices and improve data space memory
usage efficiency, the dsPIC30F instruction set supports 3.2.4 DATA SPACE MEMORY MAP
both word and byte operations. Data is aligned in data
memory and registers as words, but all data space EAs The data space memory is split into two blocks, X and
resolve to bytes. Data byte reads will read the complete Y data space. A key element of this architecture is that
word which contains the byte, using the LS bit of any Y space is a subset of X space, and is fully contained
EA to determine which byte to select. The selected byte within X space. In order to provide an apparent linear
is placed onto the LS Byte of the X data path (no byte addressing space, X and Y spaces have contiguous
accesses are possible from the Y data path as the MAC addresses.
class of instruction can only fetch words). That is, data When executing any instruction other than one of the
memory and registers are organized as two parallel MAC class of instructions, the X block consists of the 64-
byte wide entities with shared (word) address decode Kbyte data address space (including all Y addresses).
but separate write lines. Data byte writes only write to When executing one of the MAC class of instructions,
the corresponding side of the array or register which the X block consists of the 64-Kbyte data address
matches the byte address. space excluding the Y address block (for data reads
As a consequence of this byte accessibility, all effective only). In other words, all other instructions regard the
address calculations (including those generated by the entire data memory as one composite address space.
DSP operations which are restricted to word sized The MAC class instructions extract the Y address space
data) are internally scaled to step through word aligned from data space and address it using EAs sourced from
memory. For example, the core would recognize that W10 and W11. The remaining X data space is
Post-Modified Register Indirect Addressing mode addressed using W8 and W9. Both address spaces are
[Ws++] will result in a value of Ws+1 for byte operations concurrently accessed only with the MAC class
and Ws+2 for word operations. instructions.
All word accesses must be aligned to an even address. An example data space memory map is shown in
Misaligned word data fetches are not supported so Figure 3-8.
care must be taken when mixing byte and word opera-
tions, or translating from 8-bit MCU code. Should a mis-
aligned read or write be attempted, an address error
trap will be generated. If the error occurred on a read,
the instruction underway is completed, whereas if it
occurred on a write, the instruction will be executed but
the write will not occur. In either case, a trap will then
be executed, allowing the system and/or user to exam-
ine the machine state prior to execution of the address
fault.

DS70083G-page 40 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
3.2.5 NEAR DATA SPACE 3.2.6 SOFTWARE STACK
An 8-Kbyte ‘near’ data space is reserved in X address The dsPIC devices contain a software stack. W15 is
memory space between 0x0000 and 0x1FFF, which is used as the stack pointer.
directly addressable via a 13-bit absolute address field
There is a Stack Pointer Limit register (SPLIM) associ-
within all memory direct instructions. The remaining X
ated with the stack pointer. SPLIM is uninitialized at
address space and all of the Y address space is
Reset. As is the case for the stack pointer, SPLIM<0>
addressable indirectly. Additionally, the whole of X data
is forced to ‘0’ because all stack operations must be
space is addressable using MOV instructions, which
word aligned. Whenever an effective address (EA) is
support memory direct addressing with a 16-bit
generated using W15 as a source or destination
address field.
pointer, the address thus generated is compared with
The stack pointer always points to the first available the value in SPLIM. If the contents of the Stack Pointer
free word and grows from lower addresses towards (W15) and the SPLIM register are equal and a push
higher addresses. It pre-decrements for stack pops and operation is performed, a Stack Error Trap will not
post-increments for stack pushes as shown in Figure 3- occur. The Stack Error Trap will occur on a subsequent
7. Note that for a PC push during any CALL instruction, push operation. Thus, for example, if it is desirable to
the MSB of the PC is zero-extended before the push, cause a Stack Error Trap when the stack grows beyond
ensuring that the MSB is always clear. address 0x2000 in RAM, initialize the SPLIM with the
Note: A PC push during exception processing value, 0x1FFE.
will concatenate the SRL register to the Similarly, a stack pointer underflow (stack error) trap is
MSB of the PC prior to the push. generated when the stack pointer address is found to
be less than 0x0800, thus preventing the stack from
interfering with the Special Function Register (SFR)
space.
A write to the SPLIM register should not be immediately
followed by an indirect read operation using W15.

FIGURE 3-7: CALL STACK FRAME

0x0000 15 0
Stack Grows Towards
Higher Address

PC<15:0> W15 (before CALL)

000000000 PC<22:16>
<Free Word> W15 (after CALL)

POP : [--W15]
PUSH : [W15++]

 2004 Microchip Technology Inc. Preliminary DS70083G-page 41

dsPIC30F
FIGURE 3-8: SAMPLE DATA SPACE MEMORY MAP

MS Byte LS Byte
Address 16 bits Address
MSB LSB
0x0001 0x0000
2-Kbyte
SFR Space
SFR Space 0x07FE
0x07FF
0x0801 0x0800
8-Kbyte
Near
X Data RAM (X) Data
Space

8-Kbyte 0x17FF 0x17FE

SRAM Space 0x1801 0x1800
0x1FFF 0x1FFE
Y Data RAM (Y)

0x27FF 0x27FE
0x2801 0x2800

0x8001 0x8000

X Data
Unimplemented (X)

Optionally
Mapped
into Program
Memory

0xFFFF 0xFFFE

Note: The address map shown in Figure 3-8 is conceptual, and may vary across individual devices
depending on available memory.

DS70083G-page 42 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 3-9: DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE

SFR SPACE SFR SPACE

X SPACE
UNUSED

(Y SPACE) Y SPACE UNUSED

X SPACE

X SPACE
UNUSED

Non-MAC Class Ops (Read/Write) MAC Class Ops (Read)

MAC Class Ops (Write)

Indirect EA from any W Indirect EA from W8, W9 Indirect EA from W10, W11

 2004 Microchip Technology Inc. Preliminary DS70083G-page 43

 TABLE 3-3: CORE REGISTER MAP
Address
SFR Name Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
(Home)
W0 0000 W0 / WREG 0000 0000 0000 0000
W1 0002 W1 0000 0000 0000 0000
W2 0004 W2 0000 0000 0000 0000

DS70083G-page 44
W3 0006 W3 0000 0000 0000 0000
W4 0008 W4 0000 0000 0000 0000
dsPIC30F

W5 000A W5 0000 0000 0000 0000

W6 000C W6 0000 0000 0000 0000
W7 000E W7 0000 0000 0000 0000
W8 0010 W8 0000 0000 0000 0000
W9 0012 W9 0000 0000 0000 0000
W10 0014 W10 0000 0000 0000 0000
W11 0016 W11 0000 0000 0000 0000
W12 0018 W12 0000 0000 0000 0000
W13 001A W13 0000 0000 0000 0000
W14 001C W14 0000 0000 0000 0000
W15 001E W15 0000 1000 0000 0000
SPLIM 0020 SPLIM 0000 0000 0000 0000
ACCAL 0022 ACCAL 0000 0000 0000 0000
ACCAH 0024 ACCAH 0000 0000 0000 0000

Preliminary
ACCAU 0026 Sign-Extension (ACCA<39>) ACCAU 0000 0000 0000 0000
ACCBL 0028 ACCBL 0000 0000 0000 0000
ACCBH 002A ACCBH 0000 0000 0000 0000
ACCBU 002C Sign-Extension (ACCB<39>) ACCBU 0000 0000 0000 0000
PCL 002E PCL 0000 0000 0000 0000
PCH 0030 — — — — — — — — — PCH 0000 0000 0000 0000
TBLPAG 0032 — — — — — — — — TBLPAG 0000 0000 0000 0000
PSVPAG 0034 — — — — — — — — PSVPAG 0000 0000 0000 0000
RCOUNT 0036 RCOUNT uuuu uuuu uuuu uuuu
DCOUNT 0038 DCOUNT uuuu uuuu uuuu uuuu
DOSTARTL 003A DOSTARTL 0 uuuu uuuu uuuu uuu0
DOSTARTH 003C — — — — — — — — — DOSTARTH 0000 0000 0uuu uuuu
DOENDL 003E DOENDL 0 uuuu uuuu uuuu uuu0
DOENDH 0040 — — — — — — — — — DOENDH 0000 0000 0uuu uuuu
SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C 0000 0000 0000 0000
Legend: u = uninitialized bit

 2004 Microchip Technology Inc.

 TABLE 3-3: CORE REGISTER MAP (CONTINUED)
Address
SFR Name Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
(Home)
CORCON 0044 — — — US EDT DL2 DL1 DL0 SATA SATB SATDW ACCSAT IPL3 PSV RND IF 0000 0000 0010 0000
MODCON 0046 XMODEN YMODEN — — BWM<3:0> YWM<3:0> XWM<3:0> 0000 0000 0000 0000
XMODSRT 0048 XS<15:1> 0 uuuu uuuu uuuu uuu0
XMODEND 004A XE<15:1> 1 uuuu uuuu uuuu uuu1
YMODSRT 004C YS<15:1> 0 uuuu uuuu uuuu uuu0
YMODEND 004E YE<15:1> 1 uuuu uuuu uuuu uuu1
XBREV 0050 BREN XB<14:0> uuuu uuuu uuuu uuuu

 2004 Microchip Technology Inc.

DISICNT 0052 — — DISICNT<13:0> 0000 0000 0000 0000
Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

Preliminary
dsPIC30F

DS70083G-page 45
dsPIC30F
NOTES:

DS70083G-page 46 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
4.0 ADDRESS GENERATOR UNITS When executing instructions which require just one
source operand to be fetched from data space, the X
Note: This data sheet summarizes features of this group RAGU and X WAGU are used to calculate the effective
of dsPIC30F devices and is not intended to be a complete address. The X RAGU and X WAGU can generate any
reference source. For more information on the CPU,
peripherals, register descriptions and general device
address in the 64-Kbyte data space. They support all
functionality, refer to the dsPIC30F Family Reference MCU Addressing modes and modulo addressing for
Manual (DS70046). For more information on the device low overhead circular buffers. The X WAGU also sup-
instruction set and programming, refer to the dsPIC30F ports bit-reversed addressing to facilitate FFT data
Programmer’s Reference Manual (DS70030). reorganization.
The dsPIC core contains two independent address When executing instructions which require two source
generator units: the X AGU and Y AGU. Further, the X operands to be concurrently fetched (i.e., the MAC class
AGU has two parts: X RAGU (Read AGU) and X of DSP instructions), both the X RAGU and Y AGU are
WAGU (Write AGU). The X RAGU and X WAGU sup- used simultaneously and the data space is split into two
port byte and word sized data space reads and writes independent address spaces, X and Y. The Y AGU sup-
for both MCU and DSP instructions. The Y AGU sup- ports register indirect post-modified and modulo
ports word sized data reads for the DSP MAC class of addressing only.
instructions only. They are each capable of supporting
two types of data addressing: Note: The data write phase of the MAC class of
instructions does not split X and Y address
• Linear Addressing space. The write EA is calculated using
• Modulo (Circular) Addressing the X WAGU and the data space is
In addition, the X WAGU can support: configured for full 64-Kbyte access.
• Bit-Reversed Addressing In the Split Data Space mode, some W register address
pointers are dedicated to X RAGU, and others to Y
Linear and Modulo Data Addressing modes can be
AGU. The EAs of each operand must, therefore, be
applied to data space or program space. Bit-reversed
restricted within different address spaces. If they are
addressing is only applicable to data space addresses.
not, one of the EAs will be outside the address space
of the corresponding data space (and will fetch the bus
4.1 Data Space Organization default value, 0x0000).
Although the data space memory is organized as 16-bit
words, all effective addresses (EAs) are byte 4.2 Instruction Addressing Modes
addresses. Instructions can thus access individual
The Addressing modes in Table 4-1 form the basis of
bytes as well as properly aligned words. Word
the Addressing modes optimized to support the specific
addresses must be aligned at even boundaries. Mis-
features of individual instructions. The Addressing
aligned word accesses are not supported, and if
modes provided in the MAC class of instructions are
attempted, will initiate an address error trap.
somewhat different from those in the other instruction
types.
Some Addressing mode combinations may lead to a
one-cycle stall during instruction execution, or are not
allowed, as discussed in Section 4.3.

TABLE 4-1: FUNDAMENTAL ADDRESSING MODES SUPPORTED

Addressing Mode Description
File Register Direct The address of the File register is specified explicitly.
Register Direct The contents of a register are accessed directly.
Register Indirect The contents of Wn forms the EA.
Register Indirect Post-modified The contents of Wn forms the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-modified Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset The sum of Wn and Wb forms the EA.
Register Indirect with Literal Offset The sum of Wn and a literal forms the EA.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 47

dsPIC30F
4.2.1 FILE REGISTER INSTRUCTIONS In summary, the following Addressing modes are
supported by move and accumulator instructions:
Most File register instructions use a 13-bit address field
(f) to directly address data present in the first 8192 • Register Direct
bytes of data memory. These memory locations are • Register Indirect
known as File registers. Most File register instructions • Register Indirect Post-modified
employ a working register, W0, which is denoted as
• Register Indirect Pre-modified
WREG in these instructions. The destination is typically
either the same File register or WREG (with the excep- • Register Indirect with Register Offset (Indexed)
tion of the MUL instruction), which writes the result to a • Register Indirect with Literal Offset
register or register pair. The MOV instruction can use a • 8-bit Literal
16-bit address field. • 16-bit Literal

4.2.2 MCU INSTRUCTIONS Note: Not all instructions support all the
Addressing modes given above. Individual
The three-operand MCU instructions are of the form: instructions may support different subsets
Operand 3 = Operand 1 <function> Operand 2 of these Addressing modes.
where Operand 1 is always a working register (i.e., the
4.2.4 MAC INSTRUCTIONS
Addressing mode can only be register direct) which is
referred to as Wb. Operand 2 can be the W register The dual source operand DSP instructions (CLR, ED,
fetched from data memory or 5-bit literal. In two- EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also
operand instructions, the result location is the same as referred to as MAC instructions, utilize a simplified set of
that of one of the operands. Certain MCU instructions Addressing modes to allow the user to effectively
are one-operand operations. The following addressing manipulate the data pointers through register indirect
modes are supported by MCU instructions: tables.
• Register Direct The 2 source operand pre-fetch registers must be a
• Register Indirect member of the set {W8, W9, W10, W11}. For data
reads, W8 and W9 will always be directed to the X
• Register Indirect Post-modified
RAGU and W10 and W11 will always be directed to the
• Register Indirect Pre-modified Y AGU. The effective addresses generated (before and
• 5-bit or 10-bit Literal after modification) must, therefore, be valid addresses
Note: Not all instructions support all the within X data space for W8 and W9 and Y data space
Addressing modes given above. Individual for W10 and W11.
instructions may support different subsets Note: Register indirect with register offset
of these Addressing modes. addressing is only available for W9 (in X
space) and W11 (in Y space).
4.2.3 MOVE AND ACCUMULATOR
In summary, the following Addressing modes are
INSTRUCTIONS
supported by the MAC class of instructions:
Move instructions and the DSP accumulator class of
• Register Indirect
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the • Register Indirect Post-modified by 2
Addressing modes supported by most MCU instruc- • Register Indirect Post-modified by 4
tions, move and accumulator instructions also support • Register Indirect Post-modified by 6
Register Indirect with Register Offset Addressing • Register Indirect with Register Offset (Indexed)
mode, also referred to as Register Indexed mode.
4.2.5 OTHER INSTRUCTIONS
Note: For the MOV instructions, the Addressing
mode specified in the instruction can differ Besides the various Addressing modes outlined above,
for the source and destination EA. some instructions use literal constants of various sizes.
However, the 4-bit Wb (register offset) For example, BRA (branch) instructions use 16-bit
field is shared between both source and signed literals to specify the branch destination directly,
destination (but typically only used by whereas the DISI instruction uses a 14-bit unsigned
one). literal field. In some instructions, such as ADD Acc, the
source of an operand or result is implied by the opcode
itself. Certain operations, such as NOP, do not have any
operands.

DS70083G-page 48 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
4.3 Instruction Stalls 4.3.2 RAW DEPENDENCY DETECTION
During the instruction pre-decode, the core determines
4.3.1 INTRODUCTION if any address register dependency is imminent across
In order to maximize data space, EA calculation and an instruction boundary. The stall detection logic com-
operand fetch time, the X data space read and write pares the W register (if any) used for the destination EA
accesses are partially pipelined. The latter half of the of the instruction currently being executed, with the W
read phase overlaps the first half of the write phase of register to be used by the source EA (if any) of the pre-
an instruction, as shown in Section 2.0. fetched instruction. As the W registers are also memory
Address register data dependencies, also known as mapped, the stall detection logic also derives an SFR
‘Read After Write’ (RAW) dependencies may, there- address from the W register being used by the destina-
fore, arise between successive read and write opera- tion EA, and determines whether this address is being
tions using common registers. They occur across issued during the write phase of the instruction
instruction boundaries and are detected by the currently being executed.
hardware. When it observes a match between the destination and
An example of a RAW dependency is a write operation source registers, a set of rules is applied to decide
(in the current instruction) that modifies W5, followed whether or not to stall the instruction by one cycle.
by a read operation (in the next instruction) that uses Table 4-2 lists out the various RAW conditions which
W5 as a source address pointer. W5 will not be valid for cause an instruction execution stall.
the read operation until the earlier write completes.
This problem is resolved by stalling the instruction exe-
cution for one instruction cycle, thereby allowing the
write to complete before the next read is started.

TABLE 4-2: RAW DEPENDENCY RULES (DETECTION BY HARDWARE)

Destination
Source Addressing Examples
Addressing Mode Status
Mode Using Wn (Wn = W2)
Using Wn
Direct Direct No Stall ADD.w W0, W1, W2
MOV.w W2, W3
Direct Indirect Stall ADD.w W0, W1, W2
MOV.w [W2], W3
Direct Indirect with Pre- or Stall ADD.w W0, W1, W2
Post-Modification MOV.w [W2++], W3
Indirect Direct No Stall ADD.w W0, W1, [W2]
MOV.w W2, W3
Indirect Indirect No Stall ADD.w W0, W1, [W2]
MOV.w [W2], W3
Indirect Indirect Stall ADD.w W0, W1, [W2] ; W2=0x0004 (mapped W2)
MOV.w [W2], W3 ; (i.e. if W2 = addr. of
W2)
Indirect Indirect with Pre- or No Stall ADD.w W0, W1, [W2]
Post-Modification MOV.w [W2++], W3
Indirect Indirect with Pre- or Stall ADD.w W0, W1, [W2] ; W2=0x0004 (mapped W2)
Post-Modification MOV.w [W2++], W3 ; (i.e. if W2 = addr. of
W2)
Indirect with Pre- or Direct No Stall ADD.w W0, W1, [W2++]
Post-Modification MOV.w W2, W3
Indirect with Pre- or Indirect Stall ADD.w W0, W1, [W2++]
Post-Modification MOV.w [W2], W3
Indirect with Pre- or Indirect with Pre- or Stall ADD.w W0, W1, [W2++]
Post-Modification Post-Modification MOV.w [W2++], W3

 2004 Microchip Technology Inc. Preliminary DS70083G-page 49

dsPIC30F
4.4 Modulo Addressing For example, if the start address was chosen to be
0x2000, then the X/YMODEND would be set to
Modulo addressing is a method of providing an auto- (0x2000 + 0x0064 – 1) = 0x2063.
mated means to support circular data buffers using
hardware. The objective is to remove the need for soft- Note: ‘Start address’ refers to the smallest
ware to perform data address boundary checks when address boundary of the circular buffer.
executing tightly looped code, as is typical in many The first access of the buffer may be at
DSP algorithms. any address within the modulus range
(see Section 4.4.4).
Modulo addressing can operate in either data or pro-
gram space (since the data pointer mechanism is In the case of a decrementing buffer, the last ‘N’ bits of
essentially the same for both). One circular buffer can the data buffer end address must be ones. There are
be supported in each of the X (which also provides the no such restrictions on the start address of a decre-
pointers into program space) and Y data spaces. Mod- menting buffer. For example, if the buffer size (modulus
ulo addressing can operate on any W register pointer. value) is chosen to be 100 bytes (0x64), then the buffer
However, it is not advisable to use W14 or W15 for mod- end address for a decrementing buffer must contain
ulo addressing since these two registers are used as 7 Least Significant ones. Valid end addresses may,
the stack frame pointer and stack pointer, respectively. therefore, be 0xXXFF and 0xXX7F, where ‘X’ is any
hexadecimal value. Subtracting the buffer length from
In general, any particular circular buffer can only be
this value and adding 1 will give the start address to be
configured to operate in one direction, as there are cer-
written into X/YMODSRT. For example, if the end
tain restrictions on the buffer start address (for incre-
address was chosen to be 0x207F, then the start
menting buffers), or end address (for decrementing
address would be (0x207F – 0x0064 + 1) = 0x201C,
buffers) based upon the direction of the buffer.
which is the first physical address of the buffer.
The only exception to the usage restrictions is for buff-
ers which have a power-of-2 length. As these buffers Note: Y space modulo addressing EA calcula-
satisfy the start and end address criteria, they may tions assume word sized data (LS bit of
operate in a Bidirectional mode (i.e., address boundary every EA is always clear).
checks will be performed on both the lower and upper The length of a circular buffer is not directly specified. It
address boundaries). is determined by the difference between the corre-
sponding start and end addresses. The maximum pos-
4.4.1 START AND END ADDRESS sible length of the circular buffer is 32K words
The modulo addressing scheme requires that a starting (64 Kbytes).
and an ending address be specified and loaded into the A write operation to the MODCON register should not
16-bit Modulo Buffer Address registers: XMODSRT, be immediately followed by an indirect read operation
XMODEND, YMODSRT, YMODEND (see Table 3-3). using any W register.
Note: The start and end addresses are the first Note 1: Using a POP instruction to pop the con-
and last byte addresses of the buffer (irre- tents of the top-of-stack (TOS) location
spective of whether it is a word or byte into MODCON also constitutes a write to
buffer, or an increasing or decreasing MODCON. Therefore, the instruction
buffer). Moreover, the start address must immediately following such a POP cannot
be even and the end address must be odd be any instruction performing an indirect
(for both word and byte buffers). read operation.
If the length of an incrementing buffer is greater than 2: It should be noted that some instructions
M = 2N-1, but not greater than M = 2N bytes, then the perform an indirect read operation
last ‘N’ bits of the data buffer start address must be implicitly. These are: POP, RETURN,
zeros. There are no such restrictions on the end RETFIE, RETLW and ULNK.
address of an incrementing buffer. For example, if the
buffer size (modulus value) is chosen to be 100 bytes
(0x64), then the buffer start address for an increment-
ing buffer must contain 7 Least Significant zeros. Valid
start addresses may, therefore, be 0xXX00 and
0xXX80, where ‘X’ is any hexadecimal value. Adding
the buffer length to this value and subtracting ‘1’ will
give the end address to be written into X/YMODEND.

DS70083G-page 50 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
4.4.2 W ADDRESS REGISTER The X Address Space Pointer W register (XWM), to
SELECTION which modulo addressing is to be applied, is stored in
MODCON<3:0> (see Table 3-3). Modulo addressing is
The Modulo and Bit-Reversed Addressing Control reg-
enabled for X data space when XWM is set to any value
ister MODCON<15:0> contains enable flags as well as
other than ‘15’ and the XMODEN bit is set at
a W register field to specify the W address registers.
MODCON<15>.
The XWM and YWM fields select which registers will
operate with modulo addressing. If XWM = 15, X The Y Address Space Pointer W register (YWM), to
RAGU and X WAGU modulo addressing is disabled. which modulo addressing is to be applied, is stored in
Similarly, if YWM = 15, Y AGU modulo addressing is MODCON<7:4>. Modulo addressing is enabled for Y
disabled. data space when YWM is set to any value other than
‘15’ and the YMODEN bit is set at MODCON<14>.
Note: The XMODSRT and XMODEND registers
and the XWM register selection are
shared between X RAGU and X WAGU.

FIGURE 4-1: INCREMENTING BUFFER MODULO ADDRESSING OPERATION EXAMPLE

Byte
Address MOV #0x1100,W0
MOV W0,XMODSRT ;set modulo start address
MOV #0x1163,W0
MOV W0,MODEND ;set modulo end address
0x1100 MOV #0x8001,W0
MOV W0,MODCON ;enable W1, X AGU for modulo

MOV #0x0000,W0 ;W0 holds buffer fill value

MOV #0x1110,W1 ;point W1 to buffer

DO AGAIN,#0x31 ;fill the 50 buffer locations

MOV W0,[W1++] ;fill the next location
AGAIN: INC W0,W0 ;increment the fill value
0x1163

Start Addr = 0x1100

End Addr = 0x1163
Length = 0x0032 words

 2004 Microchip Technology Inc. Preliminary DS70083G-page 51

dsPIC30F
FIGURE 4-2: DECREMENTING BUFFER MODULO ADDRESSING OPERATION EXAMPLE

Byte
Address
MOV #0x11D0,W0
MOV #0,XMODSRT ;set modulo start address
MOV 0x11FF,W0
MOV W0,XMODEND ;set modulo end address
MOV #0x8001,W0
MOV W0,MODCON ;enable W1, X AGU for modulo

MOV #0x000F,W0 ;W0 holds buffer fill value

0x11D0
MOV #0x11E0,W1 ;point W1 to buffer

DO AGAIN,#0x17 ;fill the 24 buffer locations

MOV W0,[W1--] ;fill the next location
AGAIN: DEC W0,W0 ; decrement the fill value

0x11FF

Start Addr = 0x11D0

End Addr = 0x11FF
Length = 0x0018 words

DS70083G-page 52 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
4.4.3 MODULO ADDRESSING 4.5 Bit-Reversed Addressing
APPLICABILITY
Bit-reversed addressing is intended to simplify data re-
Modulo addressing can be applied to the effective ordering for radix-2 FFT algorithms. It is supported by
address (EA) calculation associated with any W regis- the X WAGU only (i.e., for data writes only).
ter. It is important to realize that the address bound-
The modifier, which may be a constant value or register
aries check for addresses less than, or greater than the
contents, is regarded as having its bit order reversed. The
upper (for incrementing buffers), and lower (for decre-
address source and destination are kept in normal order.
menting buffers) boundary addresses (not just equal
Thus, the only operand requiring reversal is the modifier.
to). Address changes may, therefore, jump over bound-
aries and still be adjusted correctly (see Section 4.4.4
4.5.1 BIT-REVERSED ADDRESSING
for restrictions).
IMPLEMENTATION
Note: The modulo corrected effective address is Bit-reversed addressing is enabled when:
written back to the register only when Pre-
Modify or Post-Modify Addressing mode is 1. BWM (W register selection) in the MODCON
used to compute the effective address. register is any value other than ‘15’ (the stack
When an address offset (e.g., [W7+W2]) is cannot be accessed using bit-reversed
used, modulo address correction is per- addressing) and
formed but the contents of the register 2. the BREN bit is set in the XBREV register and
remain unchanged. 3. the Addressing mode used is Register Indirect
with Pre-Increment or Post-Increment.
4.4.4 MODULO ADDRESSING
If the length of a bit-reversed buffer is M = 2N bytes,
RESTRICTIONS
then the last ‘N’ bits of the data buffer start address
For an incrementing buffer, the circular buffer start must be zeros.
address (lower boundary) is arbitrary but must be at a
XB<14:0> is the bit-reversed address modifier or ‘pivot
‘zero’ power-of-two boundary (see Section 4.4.1). For
point’ which is typically a constant. In the case of an
a decrementing buffer, the circular buffer end address
FFT computation, its value is equal to half of the FFT
is arbitrary but must be at a ‘ones’ boundary.
data buffer size.
There are no restrictions regarding how much an EA
calculation can exceed the address boundary being Note: All bit-reversed EA calculations assume
checked and still be successfully corrected. word sized data (LS bit of every EA is
always clear). The XB value is scaled
Once configured, the direction of successive accordingly to generate compatible (byte)
addresses into a buffer should not be changed. addresses.
Although all EAs will continue to be generated cor-
rectly, irrespective of offset sign, only one address When enabled, bit-reversed addressing will only be
boundary is checked for each type of buffer. Thus, if a executed for register indirect with pre-increment or
buffer is set up to be an incrementing buffer by choos- post-increment addressing and word sized data writes.
ing an appropriate starting address, then correction of It will not function for any other Addressing mode or for
the effective address will be performed by the AGU at byte sized data, and normal addresses will be gener-
the upper address boundary, but no address correction ated instead. When bit-reversed addressing is active,
will occur if the EA crosses the lower address bound- the W address pointer will always be added to the
ary. Similarly, for a decrementing boundary, address address modifier (XB) and the offset associated with
correction will be performed by the AGU at the lower the Register Indirect Addressing mode will be ignored.
address boundary, but no address correction will take In addition, as word sized data is a requirement, the LS
place if the EA crosses the upper address boundary. bit of the EA is ignored (and always clear).
The circular buffer pointer may be freely modified in Note: Modulo addressing and bit-reversed
both directions without a possibility of out-of-range addressing should not be enabled together.
address access only when the start address satisfies In the event that the user attempts to do
the condition for an incrementing buffer (last ‘N’ bits are this, bit-reversed addressing will assume
zeroes) and the end address satisfies the condition for priority when active for the X WAGU, and X
a decrementing buffer (last ‘N’ bits are ones). Thus, the WAGU modulo addressing will be disabled.
modulo addressing capability is truly bidirectional only However, modulo addressing will continue
for modulo-2 length buffers. to function in the X RAGU.
If bit-reversed addressing has already been enabled by
setting the BREN (XBREV<15>) bit, then a write to the
XBREV register should not be immediately followed by
an indirect read operation using the W register that has
been designated as the bit-reversed pointer.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 53

dsPIC30F
FIGURE 4-3: BIT-REVERSED ADDRESS EXAMPLE
Sequential Address
b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 0

Bit Locations Swapped Left-to-Right

Around Center of Binary Value

b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4 0

Bit-Reversed Address

Pivot Point
XB = 0x0008 for a 16-word Bit-Reversed Buffer

TABLE 4-3: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)

Normal Address Bit-Reversed Address
A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal
0 0 0 0 0 0 0 0 0 0
0 0 0 1 1 1 0 0 0 8
0 0 1 0 2 0 1 0 0 4
0 0 1 1 3 1 1 0 0 12
0 1 0 0 4 0 0 1 0 2
0 1 0 1 5 1 0 1 0 10
0 1 1 0 6 0 1 1 0 6
0 1 1 1 7 1 1 1 0 14
1 0 0 0 8 0 0 0 1 1
1 0 0 1 9 1 0 0 1 9
1 0 1 0 10 0 1 0 1 5
1 0 1 1 11 1 1 0 1 13
1 1 0 0 12 0 0 1 1 3
1 1 0 1 13 1 0 1 1 11
1 1 1 0 14 0 1 1 1 7
1 1 1 1 15 1 1 1 1 15

TABLE 4-4: BIT-REVERSED ADDRESS MODIFIER VALUES

Buffer Size (Words) XB<14:0> Bit-Reversed Address Modifier Value
32768 0x4000
16384 0x2000
8192 0x1000
4096 0x0800
2048 0x0400
1024 0x0200
512 0x0100
256 0x0080
128 0x0040
64 0x0020
32 0x0010
16 0x0008
8 0x0004
4 0x0002
2 0x0001

DS70083G-page 54 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
5.0 INTERRUPTS • INTCON1<15:0>, INTCON2<15:0>
Global interrupt control functions are derived from
Note: This data sheet summarizes features of this group these two registers. INTCON1 contains the con-
of dsPIC30F devices and is not intended to be a complete trol and status flags for the processor exceptions.
reference source. For more information on the CPU,
peripherals, register descriptions and general device
The INTCON2 register controls the external
functionality, refer to the dsPIC30F Family Reference interrupt request signal behavior and the use of
Manual (DS70046). For more information on the device the alternate vector table.
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030). Note: Interrupt flag bits get set when an interrupt
condition occurs, regardless of the state of
The dsPIC30F Sensor and General Purpose Family its corresponding enable bit. User soft-
has up to 41 interrupt sources and 4 processor excep- ware should ensure the appropriate inter-
tions (traps) which must be arbitrated based on a rupt flag bits are clear prior to enabling an
priority scheme. interrupt.
The CPU is responsible for reading the Interrupt Vector All interrupt sources can be user assigned to one of 7
Table (IVT) and transferring the address contained in priority levels, 1 through 7, via the IPCx registers. Each
the interrupt vector to the program counter. The inter- interrupt source is associated with an interrupt vector,
rupt vector is transferred from the program data bus as shown in Table 5-2. Levels 7 and 1 represent the
into the program counter via a 24-bit wide multiplexer highest and lowest maskable priorities, respectively.
on the input of the program counter.
Note: Assigning a priority level of ‘0’ to an inter-
The Interrupt Vector Table (IVT) and Alternate Interrupt rupt source is equivalent to disabling that
Vector Table (AIVT) are placed near the beginning of interrupt.
program memory (0x000004). The IVT and AIVT are
shown in Table 5-2. If the NSTDIS bit (INTCON1<15>) is set, nesting of
interrupts is prevented. Thus, if an interrupt is currently
The interrupt controller is responsible for pre- being serviced, processing of a new interrupt is pre-
processing the interrupts and processor exceptions vented even if the new interrupt is of higher priority than
prior to them being presented to the processor core. the one currently being serviced.
The peripheral interrupts and traps are enabled, priori-
tized and controlled using centralized Special Function Note: The IPL bits become read only whenever
Registers: the NSTDIS bit has been set to ‘1’.
• IFS0<15:0>, IFS1<15:0>, IFS2<15:0> Certain interrupts have specialized control bits for fea-
All interrupt request flags are maintained in these tures like edge or level triggered interrupts, interrupt-
three registers. The flags are set by their respec- on-change, etc. Control of these features remains
tive peripherals or external signals, and they are within the peripheral module which generates the
cleared via software. interrupt.
• IEC0<15:0>, IEC1<15:0>, IEC2<15:0> The DISI instruction can be used to disable the pro-
All interrupt enable control bits are maintained in cessing of interrupts of priorities 6 and lower for a cer-
these three registers. These control bits are used tain number of instructions, during which the DISI bit
to individually enable interrupts from the (INTCON2<14>) remains set.
peripherals or external signals.
When an interrupt is serviced, the PC is loaded with the
• IPC0<15:0>... IPC10<7:0> address stored in the vector location in program mem-
The user assignable priority level associated with ory that corresponds to the interrupt. There are 63 dif-
each of these 41 interrupts is held centrally in ferent vectors within the IVT (refer to Table 5-2). These
these twelve registers. vectors are contained in locations 0x000004 through
• IPL<3:0> 0x0000FE of program memory (refer to Table 5-2).
The current CPU priority level is explicitly stored These locations contain 24-bit addresses and in order
in the IPL bits. IPL<3> is present in the CORCON to preserve robustness, an address error trap will take
register, whereas IPL<2:0> are present in the place should the PC attempt to fetch any of these
STATUS register (SR) in the processor core. words during normal execution. This prevents execu-
tion of random data as a result of accidentally decre-
menting a PC into vector space, accidentally mapping
a data space address into vector space, or the PC roll-
ing over to 0x000000 after reaching the end of imple-
mented program memory space. Execution of a GOTO
instruction to this vector space will also generate an
address error trap.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 55

dsPIC30F
5.1 Interrupt Priority TABLE 5-1: NATURAL ORDER PRIORITY
The user assignable interrupt priority (IP<2:0>) bits for INT Vector
Interrupt Source
each individual interrupt source are located in the LS Number Number
3 bits of each nibble within the IPCx register(s). Bit 3 of Highest Natural Order Priority
each nibble is not used and is read as a ‘0’. These bits 0 8 INT0 - External Interrupt 0
define the priority level assigned to a particular interrupt 1 9 IC1 - Input Capture 1
by the user.
2 10 OC1 - Output Compare 1
Note: The user selectable priority levels start at 3 11 T1 - Timer 1
0 as the lowest priority and level 7 as the 4 12 IC2 - Input Capture 2
highest priority. 5 13 OC2 - Output Compare 2
Since more than one interrupt request source may be 6 14 T2 - Timer 2
assigned to a specific user specified priority level, a 7 15 T3 - Timer 3
means is provided to assign priority within a given level. 8 16 SPI1
This method is called “Natural Order Priority”.
9 17 U1RX - UART1 Receiver
Table 5-1 lists the interrupt numbers and interrupt 10 18 U1TX - UART1 Transmitter
sources for the dsPIC device and their associated 11 19 ADC - ADC Convert Done
vector numbers.
12 20 NVM - NVM Write Complete
Note 1: The natural order priority scheme has 0 13 21 SI2C - I2C Slave Interrupt
as the highest priority and 53 as the 14 22 MI2C - I2C Master Interrupt
lowest priority. 15 23 Input Change Interrupt
2: The natural order priority number is the 16 24 INT1 - External Interrupt 1
same as the INT number. 17 25 IC7 - Input Capture 7
The ability for the user to assign every interrupt to one 18 26 IC8 - Input Capture 8
of seven priority levels implies that the user can assign 19 27 OC3 - Output Compare 3
a very high overall priority level to an interrupt with a 20 28 OC4 - Output Compare 4
low natural order priority. For example, the PLVD (Low
21 29 T4 - Timer 4
Voltage Detect) can be given a priority of 7. The INT0
22 30 T5 - Timer 5
(External Interrupt 0) may be assigned to priority level
1, thus giving it a very low effective priority. 23 31 INT2 - External Interrupt 2
24 32 U2RX - UART2 Receiver
25 33 U2TX - UART2 Transmitter
26 34 SPI2
27 35 C1 - Combined IRQ for CAN1
28 36 IC3 - Input Capture 3
29 37 IC4 - Input Capture 4
30 38 IC5 - Input Capture 5
31 39 IC6 - Input Capture 6
32 40 OC5 - Output Compare 5
33 41 OC6 - Output Compare 6
34 42 OC7 - Output Compare 7
35 43 OC8 - Output Compare 8
36 44 INT3 - External Interrupt 3
37 45 INT4 - External Interrupt 4
38 46 C2 - Combined IRQ for CAN2
39-40 47-48 Reserved
41 49 DCI - Codec Transfer Done
42 50 LVD - Low Voltage Detect
43-53 51-61 Reserved
Lowest Natural Order Priority

DS70083G-page 56 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
5.2 Reset Sequence 5.3 Traps
A Reset is not a true exception, because the interrupt Traps can be considered as non-maskable, non-stable
controller is not involved in the Reset process. The pro- interrupts, which adhere to a predefined priority, as
cessor initializes its registers in response to a Reset shown in Table 5-2. They are intended to provide the
which forces the PC to zero. The processor then begins user a means to correct erroneous operation during
program execution at location 0x000000. A GOTO debug and when operating within the application.
instruction is stored in the first program memory loca-
Note: If the user does not intend to take correc-
tion immediately followed by the address target for the
tive action in the event of a trap error con-
GOTO instruction. The processor executes the GOTO to
dition, these vectors must be loaded with
the specified address and then begins operation at the
the address of a default handler that sim-
specified target (start) address.
ply contains the RESET instruction. If, on
5.2.1 RESET SOURCES the other hand, one of the vectors contain-
ing an invalid address is called, an
In addition to external Reset and Power-on Reset address error trap is generated.
(POR), there are 6 sources of error conditions which
‘trap’ to the Reset vector. Note that many of these trap conditions can only be
detected when they occur. Consequently, the question-
• Watchdog Time-out: able instruction is allowed to complete prior to trap
The watchdog has timed out, indicating that the exception processing. If the user chooses to recover
processor is no longer executing the correct flow from the error, the result of the erroneous action that
of code. caused the trap may have to be corrected.
• Uninitialized W Register Trap:
There are 8 fixed priority levels for traps: level 8 through
An attempt to use an uninitialized W register as
level 15, which implies that the IPL3 is always set
an address pointer will cause a Reset.
during processing of a trap.
• Illegal Instruction Trap:
Attempted execution of any unused opcodes will If the user is not currently executing a trap, and he sets
result in an illegal instruction trap. Note that a the IPL<3:0> bits to a value of ‘0111’ (level 7), then all
fetch of an illegal instruction does not result in an interrupts are disabled but traps can still be processed.
illegal instruction trap if that instruction is flushed
prior to execution due to a flow change. 5.3.1 TRAP SOURCES
• Brown-out Reset (BOR): The following traps are provided with increasing prior-
A momentary dip in the power supply to the ity. However, since all traps can be nested, priority has
device has been detected which may result in little effect.
malfunction. • Math Error Trap:
• Trap Lockout: The math error trap executes under the following
Occurrence of multiple trap conditions four circumstances:
simultaneously will cause a Reset. 1. Should an attempt be made to divide by
zero, the divide operation will be aborted on
a cycle boundary and the trap taken.
2. If enabled, a math error trap will be taken
when an arithmetic operation on either
accumulator A or B causes an overflow
from bit 31 and the accumulator guard bits
are not utilized.
3. If enabled, a math error trap will be taken
when an arithmetic operation on either
accumulator A or B causes a catastrophic
overflow from bit 39 and all saturation is
disabled.
4. If the shift amount specified in a shift
instruction is greater than the maximum
allowed shift amount, a trap will occur.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 57

dsPIC30F
• Address Error Trap: 5.3.2 HARD AND SOFT TRAPS
This trap is initiated when any of the following
It is possible that multiple traps can become active
circumstances occurs:
within the same cycle (e.g., a misaligned word stack
1. A misaligned data word access is write to an overflowed address). In such a case, the
attempted. fixed priority shown in Figure 5-2 is implemented,
2. A data fetch from and unimplemented data which may require the user to check if other traps are
memory location is attempted. pending in order to completely correct the fault.
3. A data fetch from an unimplemented pro- ‘Soft’ traps include exceptions of priority level 8 through
gram memory location is attempted. level 11, inclusive. The arithmetic error trap (level 11)
4. An instruction fetch from vector space is falls into this category of traps. Soft traps can be treated
attempted. like non-maskable sources of interrupt that adhere to
Note: In the MAC class of instructions, wherein the priority assigned by their position in the IVT. Soft
the data space is split into X and Y data traps are processed like interrupts and require 2 cycles
space, unimplemented X space includes to be sampled and Acknowledged prior to exception
all of Y space, and unimplemented Y processing. Therefore, additional instructions may be
space includes all of X space. executed before a soft trap is Acknowledged.

5. Execution of a “BRA #literal” instruction or a ‘Hard’ traps include exceptions of priority level 12
“GOTO #literal” instruction, where literal through level 15, inclusive. The address error (level
is an unimplemented program memory address. 12), stack error (level 13) and oscillator error (level 14)
traps fall into this category.
6. Executing instructions after modifying the PC to
point to unimplemented program memory Like soft traps, hard traps can also be viewed as non-
addresses. The PC may be modified by loading maskable sources of interrupt. The difference between
a value into the stack and executing a RETURN hard traps and soft traps is that hard traps force the
instruction. CPU to stop code execution after the instruction caus-
• Stack Error Trap: ing the trap has completed. Normal program execution
This trap is initiated under the following flow will not resume until after the trap has been
conditions: Acknowledged and processed.
1. The stack pointer is loaded with a value If a higher priority trap occurs while any lower priority
which is greater than the (user program- trap is in progress, processing of the lower priority trap
mable) limit value written into the SPLIM will be suspended and the higher priority trap will be
register (stack overflow). Acknowledged and processed. The lower priority trap
2. The stack pointer is loaded with a value will remain pending until processing of the higher
which is less than 0x0800 (simple stack priority trap completes.
underflow). Each hard trap that occurs must be Acknowledged
• Oscillator Fail Trap: before code execution of any type may continue. If a
This trap is initiated if the external oscillator fails lower priority hard trap occurs while a higher priority
and operation becomes reliant on an internal RC trap is pending, Acknowledged, or is being processed,
backup. a hard trap conflict will occur. The conflict occurs
because the lower priority trap cannot be Acknowl-
edged until processing for the higher priority trap
completes.
The device is automatically reset in a hard trap conflict
condition. The TRAPR status bit (RCON<15>) is set
when the Reset occurs so that the condition may be
detected in software.
In the case of a math error trap or oscillator failure trap,
the condition that causes the trap to occur must be
removed before the respective trap flag bit in the
INTCON1 register may be cleared.

DS70083G-page 58 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
5.4 Interrupt Sequence FIGURE 5-2: EXCEPTION VECTORS
All interrupt event flags are sampled in the beginning of Reset - GOTO Instruction 0x000000
Reset - GOTO Address 0x000002
each instruction cycle by the IFSx registers. A pending Reserved 0x000004
interrupt request (IRQ) is indicated by the flag bit being Oscillator Fail Trap Vector
Address Error Trap Vector
equal to a ‘1’ in an IFSx register. The IRQ will cause an Stack Error Trap Vector

Decreasing
Math Error Trap Vector

Priority
interrupt to occur if the corresponding bit in the Interrupt
IVT Reserved Vector
Enable (IECx) register is set. For the remainder of the Reserved Vector
instruction cycle, the priorities of all pending interrupt Reserved Vector
Interrupt 0 Vector 0x000014
requests are evaluated. Interrupt 1 Vector
~
If there is a pending IRQ with a priority level greater ~
than the current processor priority level in the IPL bits, ~
Interrupt 52 Vector
the processor will be interrupted. Interrupt 53 Vector 0x00007E
Reserved 0x000080
The processor then stacks the current program counter Reserved 0x000082
Reserved 0x000084
and the low byte of the processor STATUS register Oscillator Fail Trap Vector
(SRL), as shown in Figure 5-1. The low byte of the Stack Error Trap Vector
Address Error Trap Vector
STATUS register contains the processor priority level at Math Error Trap Vector
the time prior to the beginning of the interrupt cycle. AIVT Reserved Vector
Reserved Vector
The processor then loads the priority level for this inter- Reserved Vector
rupt into the STATUS register. This action will disable Interrupt 0 Vector 0x000094
Interrupt 1 Vector
all lower priority interrupts until the completion of the ~
Interrupt Service Routine. ~
~
Interrupt 52 Vector
0x0000FE
FIGURE 5-1: INTERRUPT STACK Interrupt 53 Vector

FRAME
0x0000 15 0 5.5 Alternate Vector Table
In program memory, the Interrupt Vector Table (IVT) is
followed by the Alternate Interrupt Vector Table (AIVT),
Stack Grows Towards

as shown in Table 5-2. Access to the alternate vector

Higher Address

table is provided by the ALTIVT bit in the INTCON2 reg-

ister. If the ALTIVT bit is set, all interrupt and exception
PC<15:0> W15 (before CALL)
processes will use the alternate vectors instead of the
SRL IPL3 PC<22:16> default vectors. The alternate vectors are organized in
<Free Word> W15 (after CALL) the same manner as the default vectors. The AIVT sup-
ports emulation and debugging efforts by providing a
POP : [--W15] means to switch between an application and a support
PUSH: [W15++] environment without requiring the interrupt vectors to
be reprogrammed. This feature also enables switching
between applications for evaluation of different
software algorithms at run time.
Note 1: The user can always lower the priority If the AIVT is not required, the program memory allo-
level by writing a new value into SR. The cated to the AIVT may be used for other purposes.
Interrupt Service Routine must clear the AIVT is not a protected section and may be freely
interrupt flag bits in the IFSx register programmed by the user.
before lowering the processor interrupt
priority, in order to avoid recursive
interrupts.
2: The IPL3 bit (CORCON<3>) is always
clear when interrupts are being pro-
cessed. It is set only during execution of
traps.
The RETFIE (return from interrupt) instruction will
unstack the program counter and STATUS registers to
return the processor to its state prior to the interrupt
sequence.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 59

dsPIC30F
5.6 Fast Context Saving 5.7 External Interrupt Requests
A context saving option is available using shadow reg- The interrupt controller supports up to five external
isters. Shadow registers are provided for the DC, N, interrupt request signals, INT0-INT4. These inputs are
OV, Z and C bits in SR, and the registers W0 through edge sensitive; they require a low-to-high or a high-to-
W3. The shadows are only one level deep. The shadow low transition to generate an interrupt request. The
registers are accessible using the PUSH.S and POP.S INTCON2 register has five bits, INT0EP-INT4EP, that
instructions only. select the polarity of the edge detection circuitry.
When the processor vectors to an interrupt, the
PUSH.S instruction can be used to store the current 5.8 Wake-up from Sleep and Idle
value of the aforementioned registers into their
respective shadow registers. The interrupt controller may be used to wake-up the
processor from either Sleep or Idle modes, if Sleep or
If an ISR of a certain priority uses the PUSH.S and Idle mode is active when the interrupt is generated.
POP.S instructions for fast context saving, then a
higher priority ISR should not include the same instruc- If an enabled interrupt request of sufficient priority is
tions. Users must save the key registers in software received by the interrupt controller, then the standard
during a lower priority interrupt if the higher priority ISR interrupt request is presented to the processor. At the
uses fast context saving. same time, the processor will wake-up from Sleep or
Idle and begin execution of the Interrupt Service
Routine (ISR) needed to process the interrupt request.

DS70083G-page 60 Preliminary  2004 Microchip Technology Inc.

 TABLE 5-2: INTERRUPT CONTROLLER REGISTER MAP
SFR
ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Name

INTCON1 0080 NSTDIS — — — — OVATE OVBTE COVTE — — — MATHERR ADDRERR STKERR OSCFAIL — 0000 0000 0000 0000
INTCON2 0082 ALTIVT — — — — — — — — — — INT4EP INT3EP INT2EP INT1EP INT0EP 0000 0000 0000 0000
IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000 0000 0000 0000
IFS1 0086 IC6IF IC5IF IC4IF IC3IF C1IF SPI2IF U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF IC8IF IC7IF INT1IF 0000 0000 0000 0000
IFS2 0088 — — — — — LVDIF DCIIF — — C2IF INT4IF INT3IF OC8IF OC7IF OC6IF OC5IF 0000 0000 0000 0000
IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000

 2004 Microchip Technology Inc.

IEC1 008E IC6IE IC5IE IC4IE IC3IE C1IE SPI2IE U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE IC8IE IC7IE INT1IE 0000 0000 0000 0000
IEC2 0090 — — — — — LVDIE DCIIE — — C2IE INT4IE INT3IE OC8IE OC7IE OC6IE OC5IE 0000 0000 0000 0000
IPC0 0094 — T1IP<2:0> — OC1IP<2:0> — IC1IP<2:0> — INT0IP<2:0> 0100 0100 0100 0100
IPC1 0096 — T31P<2:0> — T2IP<2:0> — OC2IP<2:0> — IC2IP<2:0> 0100 0100 0100 0100
IPC2 0098 — ADIP<2:0> — U1TXIP<2:0> — U1RXIP<2:0> — SPI1IP<2:0> 0100 0100 0100 0100
IPC3 009A — CNIP<2:0> — MI2CIP<2:0> — SI2CIP<2:0> — NVMIP<2:0> 0100 0100 0100 0100
IPC4 009C — OC3IP<2:0> — IC8IP<2:0> — IC7IP<2:0> — INT1IP<2:0> 0100 0100 0100 0100
IPC5 009E — INT2IP<2:0> — T5IP<2:0> — T4IP<2:0> — OC4IP<2:0> 0100 0100 0100 0100
IPC6 00A0 — C1IP<2:0> — SPI2IP<2:0> — U2TXIP<2:0> — U2RXIP<2:0> 0100 0100 0100 0100
IPC7 00A2 — IC6IP<2:0> — IC5IP<2:0> — IC4IP<2:0> — IC3IP<2:0> 0100 0100 0100 0100
IPC8 00A4 — OC8IP<2:0> — OC7IP<2:0> — OC6IP<2:0> — OC5IP<2:0> 0100 0100 0100 0100
IPC9 00A6 — — — — — C2IP<2:0> — INT41IP<2:0> — INT3IP<2:0> 0000 0100 0100 0100

Preliminary
IPC10 00A8 — — — — — LVDIP<2:0> — DCIIP<2:0> — — — — 0000 0100 0100 0000
Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
dsPIC30F

DS70083G-page 61
dsPIC30F
NOTES:

DS70083G-page 62 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
6.0 FLASH PROGRAM MEMORY 6.2 Run-Time Self-Programming
(RTSP)
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete RTSP is accomplished using TBLRD (table read) and
reference source. For more information on the CPU, TBLWT (table write) instructions. With RTSP, the user
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference may erase and program 32 instructions (96 bytes) at a
Manual (DS70046). For more information on the device time.
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030).
6.3 Table Instruction Operation
The dsPIC30F family of devices contains internal pro- Summary
gram Flash memory for executing user code. There are
two methods by which the user can program this The TBLRDL and the TBLWTL instructions are used to
memory: read or write to bits<15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
1. Run-Time Self-Programming (RTSP) Word or Byte mode.
2. In-Circuit Serial Programming™ (ICSP™)
The TBLRDH and TBLWTH instructions are used to read
or write to bits<23:16> of program memory. TBLRDH
6.1 In-Circuit Serial Programming and TBLWTH can access program memory in Word or
(ICSP) Byte mode.
dsPIC30F devices can be serially programmed while in A 24-bit program memory address is formed using
the end application circuit. This is simply done with two bits<7:0> of the TBLPAG register and the effective
lines for Programming Clock and Programming Data address (EA) from a W register specified in the table
(which are named PGC and PGD respectively), and instruction, as shown in Figure 6-1.
three other lines for Power (VDD), Ground (VSS) and
Master Clear (MCLR). this allows customers to manu-
facture boards with unprogrammed devices, and then
program the microcontroller just before shipping the
product. This also allows the most recent firmware or a
custom firmware to be programmed.

FIGURE 6-1: ADDRESSING FOR TABLE AND NVM REGISTERS

24 bits
Using
Program 0 Program Counter 0
Counter

NVMADR Reg EA
Using
NVMADR 1/0 NVMADRU Reg
Addressing
8 bits 16 bits

Working Reg EA

Using 1/0 TBLPAG Reg

Table
Instruction 8 bits 16 bits

Byte
User/Configuration Select
Space Select 24-bit EA

 2004 Microchip Technology Inc. Preliminary DS70083G-page 63

dsPIC30F
6.4 RTSP Operation 6.5 Control Registers
The dsPIC30F Flash program memory is organized The four SFRs used to read and write the program
into rows and panels. Each row consists of 32 instruc- Flash memory are:
tions or 96 bytes. Each panel consists of 128 rows or • NVMCON
4K x 24 instructions. RTSP allows the user to erase and
• NVMADR
program one row (32 instructions) at a time. RTSP may
be used to program multiple program memory panels, • NVMADRU
but the table pointer must be changed at each panel • NVMKEY
boundary.
6.5.1 NVMCON REGISTER
Each panel of program memory contains write latches
that hold 32 instructions of programming data. Prior to The NVMCON register controls which blocks are to be
the actual programming operation, the write data must erased, which memory type is to be programmed and
be loaded into the panel write latches. The data to be start of the programming cycle.
programmed into the panel is loaded in sequential
order into the write latches: instruction 0, instruction 1, 6.5.2 NVMADR REGISTER
etc. The instruction words loaded must always be from The NVMADR register is used to hold the lower two
a group of 32 boundary. bytes of the effective address. The NVMADR register
The basic sequence for RTSP programming is to set up captures the EA<15:0> of the last table instruction that
a table pointer, then do a series of TBLWT instructions has been executed and selects the row to write.
to load the write latches. Programming is performed by
setting the special bits in the NVMCON register. Four 6.5.3 NVMADRU REGISTER
TBLWTL and four TBLWTH instructions are required to The NVMADRU register is used to hold the upper byte
load the four instructions. To fully program a row of of the effective address. The NVMADRU register cap-
program memory, eight cycles of four TBLWTL and four tures the EA<23:16> of the last table instruction that
TBLWTH are required. If multiple panel programming has been executed.
is required, the table pointer needs to be changed and
the next set of multiple write latches written. 6.5.4 NVMKEY REGISTER
All of the table write operations are single word writes NVMKEY is a write only register that is used for write
(2 instruction cycles) because only the table latches are protection. To start a programming or an erase
written. A total of 32 programming passes, each writing sequence, the user must consecutively write 0x55 and
4 instruction words, are required per row. 0xAA to the NVMKEY register. Refer to Section 6.6 for
further details.
The Flash program memory is readable, writable, and
erasable during normal operation over the entire VDD
range.

DS70083G-page 64 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
6.6 Programming Operations 4. Write 32 instruction words of data from data
RAM into the program Flash write latches.
A complete programming sequence is necessary for
5. Program 32 instruction words into program
programming or erasing the internal Flash in RTSP
Flash.
mode. A programming operation is nominally 2 msec in
duration and the processor stalls (waits) until the oper- a) Setup NVMCON register for multi-word,
ation is finished. Setting the WR bit (NVMCON<15>) program Flash, program, and set WREN
starts the operation, and the WR bit is automatically bit.
cleared when the operation is finished. b) Write ‘55’ to NVMKEY.
c) Write ‘AA’ to NVMKEY.
6.6.1 PROGRAMMING ALGORITHM FOR d) Set the WR bit. This will begin program
PROGRAM FLASH cycle.
The user can erase one row of program Flash memory e) CPU will stall for duration of the program
at a time. The user can program one block cycle.
(4 instruction words) of Flash memory at a time. The f) The WR bit is cleared by the hardware
general process is: when program cycle ends.
1. Read one row of program Flash (32 instruction 6. Repeat steps 1 through 5 as needed to program
words) and store into data RAM as a data desired amount of program Flash memory.
“image”.
2. Update the data image with the desired new 6.6.2 ERASING A ROW OF PROGRAM
data. MEMORY
3. Erase program Flash row. Example 6-1 shows a code sequence that can be used
a) Setup NVMCON register for multi-word, to erase a row (32 instructions) of program memory.
program Flash, erase, and set WREN bit.
b) Write address of row to be erased into
NVMADRU/NVMADR.
c) Write ‘55’ to NVMKEY.
d) Write ‘AA’ to NVMKEY.
e) Set the WR bit. This will begin erase cycle.
f) CPU will stall for the duration of the erase
cycle.
g) The WR bit is cleared when erase cycle
ends.

EXAMPLE 6-1: ERASING A ROW OF PROGRAM MEMORY

; Setup NVMCON for erase operation, multi word write
; program memory selected, and writes enabled
MOV #0x4041,W0 ;
MOV W0,NVMCON ; Init NVMCON SFR
; Init pointer to row to be ERASED
MOV #tblpage(PROG_ADDR),W0 ;
MOV W0,NVMADRU ; Initialize PM Page Boundary SFR
MOV #tbloffset(PROG_ADDR),W0 ; Intialize in-page EA[15:0] pointer
MOV W0, NVMADR ; Initialize NVMADR SFR
DISI #5 ; Block all interrupts with priority <7 for
; next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Start the erase sequence
NOP ; Insert two NOPs after the erase
NOP ; command is asserted

 2004 Microchip Technology Inc. Preliminary DS70083G-page 65

dsPIC30F
6.6.3 LOADING WRITE LATCHES
Example 6-2 shows a sequence of instructions that can
be used to load the 96 bytes of write latches. Four
TBLWTL and four TBLWTH instructions are needed to
load the write latches selected by the table pointer.

EXAMPLE 6-2: LOADING WRITE LATCHES

; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
MOV #0x0000,W0 ;
MOV W0,TBLPAG ; Initialize PM Page Boundary SFR
MOV #0x6000,W0 ; An example program memory address
; Perform the TBLWT instructions to write the latches
; 0th_program_word
MOV #LOW_WORD_0,W2 ;
MOV #HIGH_BYTE_0,W3 ;
TBLWTL W2,[W0] ; Write PM low word into program latch
TBLWTH W3,[W0++] ; Write PM high byte into program latch
; 1st_program_word
MOV #LOW_WORD_1,W2 ;
MOV #HIGH_BYTE_1,W3 ;
TBLWTL W2,[W0] ; Write PM low word into program latch
TBLWTH W3,[W0++] ; Write PM high byte into program latch
; 2nd_program_word
MOV #LOW_WORD_2,W2 ;
MOV #HIGH_BYTE_2,W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
•
•
•
; 31st_program_word
MOV #LOW_WORD_3,W2 ;
MOV #HIGH_BYTE_3,W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch

Note: In Example 6-2, the contents of the upper byte of W3 has no effect.

6.6.4 INITIATING THE PROGRAMMING

SEQUENCE
For protection, the write initiate sequence for NVMKEY
must be used to allow any erase or program operation
to proceed. After the programming command has been
executed, the user must wait for the programming time
until programming is complete. The two instructions fol-
lowing the start of the programming sequence should
be NOPs.

EXAMPLE 6-3: INITIATING A PROGRAMMING SEQUENCE

DISI #5 ; Block all interrupts with priority <7 for
; next 5 instructions
MOV #0x55,W0 ;
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Start the erase sequence
NOP ; Insert two NOPs after the erase
NOP ; command is asserted

DS70083G-page 66 Preliminary  2004 Microchip Technology Inc.

 TABLE 6-1: NVM REGISTER MAP
File Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All RESETS

NVMCON 0760 WR WREN WRERR — — — — TWRI — PROGOP<6:0> 0000 0000 0000 0000
NVMADR 0762 NVMADR<15:0> uuuu uuuu uuuu uuuu
NVMADRU 0764 — — — — — — — — NVMADR<23:16> 0000 0000 uuuu uuuu
NVMKEY 0766 — — — — — — — — KEY<7:0> 0000 0000 0000 0000
Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

 2004 Microchip Technology Inc.

Preliminary
dsPIC30F

DS70083G-page 67
dsPIC30F
NOTES:

DS70083G-page 68 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
7.0 DATA EEPROM MEMORY Control bit WR initiates write operations similar to pro-
gram Flash writes. This bit cannot be cleared, only set,
Note: This data sheet summarizes features of this group in software. They are cleared in hardware at the com-
of dsPIC30F devices and is not intended to be a complete pletion of the write operation. The inability to clear the
reference source. For more information on the CPU,
peripherals, register descriptions and general device
WR bit in software prevents the accidental or
functionality, refer to the dsPIC30F Family Reference premature termination of a write operation.
Manual (DS70046). For more information on the device The WREN bit, when set, will allow a write operation.
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030). On power-up, the WREN bit is clear. The WRERR bit is
set when a write operation is interrupted by a MCLR
The Data EEPROM Memory is readable and writable Reset or a WDT Time-out Reset during normal opera-
during normal operation over the entire VDD range. The tion. In these situations, following Reset, the user can
data EEPROM memory is directly mapped in the check the WRERR bit and rewrite the location. The
program memory address space. address register NVMADR remains unchanged.
The four SFRs used to read and write the program Note: Interrupt flag bit NVMIF in the IFS0 regis-
Flash memory are used to access data EEPROM ter is set when write is complete. It must be
memory, as well. As described in Section 6.5, these cleared in software.
registers are:
• NVMCON 7.1 Reading the Data EEPROM
• NVMADR
A TBLRD instruction reads a word at the current pro-
• NVMADRU
gram word address. This example uses W0 as a
• NVMKEY pointer to data EEPROM. The result is placed in
The EEPROM data memory allows read and write of register W4 as shown in Example 7-1.
single words and 16-word blocks. When interfacing to
data memory, NVMADR in conjunction with the EXAMPLE 7-1: DATA EEPROM READ
NVMADRU register are used to address the EEPROM MOV #LOW_ADDR_WORD,W0 ; Init Pointer
location being accessed. TBLRDL and TBLWTL MOV #HIGH_ADDR_WORD,W1
instructions are used to read and write data EEPROM. MOV W1,TBLPAG
The dsPIC30F devices have up to 8 Kbytes (4K TBLRDL [ W0 ], W4 ; read data EEPROM
words) of data EEPROM with an address range from
0x7FF000 to 0x7FFFFE.
A word write operation should be preceded by an erase
of the corresponding memory location(s). The write typ-
ically requires 2 ms to complete but the write time will
vary with voltage and temperature.
A program or erase operation on the data EEPROM
does not stop the instruction flow. The user is respon-
sible for waiting for the appropriate duration of time
before initiating another data EEPROM write/erase
operation. Attempting to read the data EEPROM while
a programming or erase operation is in progress results
in unspecified data.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 69

dsPIC30F
7.2 Erasing Data EEPROM
7.2.1 ERASING A BLOCK OF DATA
EEPROM
In order to erase a block of data EEPROM, the
NVMADRU and NVMADR registers must initially point
to the block of memory to be erased. Configure
NVMCON for erasing a block of data EEPROM, and
set the ERASE and WREN bits in the NVMCON
register. Setting the WR bit initiates the erase as
shown in Example 7-2.

EXAMPLE 7-2: DATA EEPROM BLOCK ERASE

; Select data EEPROM block, ERASE, WREN bits
MOV #4045,W0
MOV W0,NVMCON ; Initialize NVMCON SFR

; Start erase cycle by setting WR after writing key sequence

DISI #5 ; Block all interrupts with priority <7 for
; next 5 instructions
MOV #0x55,W0 ;
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete

7.2.2 ERASING A WORD OF DATA

EEPROM
The TBLPAG and NVMADR registers must point to the
block. Select erase a block of data Flash, and set the
ERASE and WREN bits in the NVMCON register. Set-
ting the WR bit initiates the erase as shown in
Example 7-3.

EXAMPLE 7-3: DATA EEPROM WORD ERASE

; Select data EEPROM word, ERASE, WREN bits
MOV #4044,W0
MOV W0,NVMCON

; Start erase cycle by setting WR after writing key sequence

DISI #5 ; Block all interrupts with priority <7 for
; next 5 instructions
MOV #0x55,W0 ;
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete

DS70083G-page 70 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
7.3 Writing to the Data EEPROM The write will not initiate if the above sequence is not
exactly followed (write 0x55 to NVMKEY, write 0xAA to
To write an EEPROM data location, the following NVMCON, then set WR bit) for each word. It is strongly
sequence must be followed: recommended that interrupts be disabled during this
1. Erase data EEPROM word. code segment.
a) Select word, data EEPROM erase, and set Additionally, the WREN bit in NVMCON must be set to
WREN bit in NVMCON register. enable writes. This mechanism prevents accidental
b) Write address of word to be erased into writes to data EEPROM due to unexpected code exe-
NVMADR. cution. The WREN bit should be kept clear at all times
c) Enable NVM interrupt (optional). except when updating the EEPROM. The WREN bit is
not cleared by hardware.
d) Write ‘55’ to NVMKEY.
e) Write ‘AA’ to NVMKEY. After a write sequence has been initiated, clearing the
WREN bit will not affect the current write cycle. The WR
f) Set the WR bit. This will begin erase cycle.
bit will be inhibited from being set unless the WREN bit
g) Either poll NVMIF bit or wait for NVMIF is set. The WREN bit must be set on a previous instruc-
interrupt. tion. Both WR and WREN cannot be set with the same
h) The WR bit is cleared when the erase cycle instruction.
ends.
At the completion of the write cycle, the WR bit is
2. Write data word into data EEPROM write cleared in hardware and the Non-Volatile Memory
latches. Write Complete Interrupt Flag bit (NVMIF) is set. The
3. Program 1 data word into data EEPROM. user may either enable this interrupt or poll this bit.
a) Select word, data EEPROM program, and NVMIF must be cleared by software.
set WREN bit in NVMCON register.
b) Enable NVM write done interrupt (optional). 7.3.1 WRITING A WORD OF DATA
c) Write ‘55’ to NVMKEY. EEPROM
d) Write ‘AA’ to NVMKEY. Once the user has erased the word to be programmed,
e) Set the WR bit. This will begin program then a table write instruction is used to write one write
cycle. latch, as shown in Example 7-4.
f) Either poll NVMIF bit or wait for NVM
interrupt.
g) The WR bit is cleared when the write cycle
ends.

EXAMPLE 7-4: DATA EEPROM WORD WRITE

; Point to data memory
MOV #LOW_ADDR_WORD,W0 ; Init pointer
MOV #HIGH_ADDR_WORD,W1
MOV W1,TBLPAG
MOV #LOW(WORD),W2 ; Get data
TBLWTL W2,[ W0] ; Write data
; The NVMADR captures last table access address
; Select data EEPROM for 1 word op
MOV #0x4004,W0
MOV W0,NVMCON

; Operate key to allow write operation

DISI #5 ; Block all interrupts with priority <7 for
; next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Initiate program sequence
NOP
NOP
; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete

 2004 Microchip Technology Inc. Preliminary DS70083G-page 71

dsPIC30F
7.3.2 WRITING A BLOCK OF DATA
EEPROM
To write a block of data EEPROM, write to all sixteen
latches first, then set the NVMCON register and
program the block.

EXAMPLE 7-5: DATA EEPROM BLOCK WRITE

MOV #LOW_ADDR_WORD,W0 ; Init pointer
MOV #HIGH_ADDR_WORD,W1
MOV W1,TBLPAG
MOV #data1,W2 ; Get 1st data
TBLWTL W2,[ W0]++ ; write data
MOV #data2,W2 ; Get 2nd data
TBLWTL W2,[ W0]++ ; write data
MOV #data3,W2 ; Get 3rd data
TBLWTL W2,[ W0]++ ; write data
MOV #data4,W2 ; Get 4th data
TBLWTL W2,[ W0]++ ; write data
MOV #data5,W2 ; Get 5th data
TBLWTL W2,[ W0]++ ; write data
MOV #data6,W2 ; Get 6th data
TBLWTL W2,[ W0]++ ; write data
MOV #data7,W2 ; Get 7th data
TBLWTL W2,[ W0]++ ; write data
MOV #data8,W2 ; Get 8th data
TBLWTL W2,[ W0]++ ; write data
MOV #data9,W2 ; Get 9th data
TBLWTL W2,[ W0]++ ; write data
MOV #data10,W2 ; Get 10th data
TBLWTL W2,[ W0]++ ; write data
MOV #data11,W2 ; Get 11th data
TBLWTL W2,[ W0]++ ; write data
MOV #data12,W2 ; Get 12th data
TBLWTL W2,[ W0]++ ; write data
MOV #data13,W2 ; Get 13th data
TBLWTL W2,[ W0]++ ; write data
MOV #data14,W2 ; Get 14th data
TBLWTL W2,[ W0]++ ; write data
MOV #data15,W2 ; Get 15th data
TBLWTL W2,[ W0]++ ; write data
MOV #data16,W2 ; Get 16th data
TBLWTL W2,[ W0]++ ; write data. The NVMADR captures last table access address.
MOV #0x400A,W0 ; Select data EEPROM for multi word op
MOV W0,NVMCON ; Operate Key to allow program operation
DISI #5 ; Block all interrupts with priority <7 for
; next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Start write cycle
NOP
NOP

DS70083G-page 72 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
7.4 Write Verify 7.5 Protection Against Spurious Write
Depending on the application, good programming There are conditions when the device may not want to
practice may dictate that the value written to the mem- write to the data EEPROM memory. To protect against
ory should be verified against the original value. This spurious EEPROM writes, various mechanisms have
should be used in applications where excessive writes been built-in. On power-up, the WREN bit is cleared;
can stress bits near the specification limit. also, the Power-up Timer prevents EEPROM write.
The write initiate sequence and the WREN bit together
help prevent an accidental write during brown-out,
power glitch, or software malfunction.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 73

dsPIC30F
NOTES:

DS70083G-page 74 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
8.0 I/O PORTS Any bit and its associated data and control registers
that are not valid for a particular device will be dis-
Note: This data sheet summarizes features of this group abled. That means the corresponding LATx and TRISx
of dsPIC30F devices and is not intended to be a complete registers and the port pin will read as zeros.
reference source. For more information on the CPU,
peripherals, register descriptions and general device When a pin is shared with another peripheral or func-
functionality, refer to the dsPIC30F Family Reference tion that is defined as an input only, it is nevertheless
Manual (DS70046). regarded as a dedicated port because there is no
All of the device pins (except VDD, VSS, MCLR, and other competing source of outputs. An example is the
OSC1/CLKI) are shared between the peripherals and INT4 pin.
the parallel I/O ports. The format of the registers for PORTA are shown in
All I/O input ports feature Schmitt Trigger inputs for Table 8-1.
improved noise immunity. The TRISA (Data Direction Control) register controls
the direction of the RA<7:0> pins, as well as the INTx
8.1 Parallel I/O (PIO) Ports pins and the VREF pins. The LATA register supplies
data to the outputs and is readable/writable. Reading
When a peripheral is enabled and the peripheral is the PORTA register yields the state of the input pins,
actively driving an associated pin, the use of the pin as while writing the PORTA register modifies the contents
a general purpose output pin is disabled. The I/O pin of the LATA register.
may be read but the output driver for the parallel port bit
will be disabled. If a peripheral is enabled but the A parallel I/O (PIO) port that shares a pin with a periph-
peripheral is not actively driving a pin, that pin may be eral is, in general, subservient to the peripheral. The
driven by a port. peripheral’s output buffer data and control signals are
provided to a pair of multiplexers. The multiplexers
All port pins have three registers directly associated select whether the peripheral or the associated port
with the operation of the port pin. The Data Direction has ownership of the output data and control signals of
register (TRISx) determines whether the pin is an input the I/O pad cell. Figure 8-2 shows how ports are shared
or an output. If the data direction bit is a ‘1’, then the pin with other peripherals and the associated I/O cell (pad)
is an input. All port pins are defined as inputs after a to which they are connected. Table 8-2 through
Reset. Reads from the latch (LATx), read the latch. Table 8-6 show the formats of the registers for the
Writes to the latch, write the latch (LATx). Reads from shared ports, PORTB through PORTG.
the port (PORTx), read the port pins and writes to the
port pins, write the latch (LATx). Note: The actual bits in use vary between
devices.

FIGURE 8-1: BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE

Dedicated Port Module

Read TRIS
I/O Cell

TRIS Latch
Data Bus D Q

WR TRIS CK

Data Latch
D Q I/O Pad

WR LAT +
WR Port CK

Read LAT

Read Port

 2004 Microchip Technology Inc. Preliminary DS70083G-page 75

dsPIC30F
FIGURE 8-2: BLOCK DIAGRAM OF A SHARED PORT STRUCTURE

Peripheral Module Output Multiplexers

Peripheral Input Data

Peripheral Module Enable

I/O Cell
Peripheral Output Enable 1 Output Enable
Peripheral Output Data 0

PIO Module 1
Output Data
0

Read TRIS

I/O Pad
Data Bus D Q

WR TRIS CK
TRIS Latch

D Q
WR LAT +
WR Port CK
Data Latch

Read LAT
Input Data

Read Port

8.2 Configuring Analog Port Pins 8.2.1 I/O PORT WRITE/READ TIMING
The use of the ADPCFG and TRIS registers control the One instruction cycle is required between a port
operation of the A/D port pins. The port pins that are direction change or port write operation and a read
desired as analog inputs must have their correspond- operation of the same port. Typically this instruction
ing TRIS bit set (input). If the TRIS bit is cleared would be a NOP.
(output), the digital output level (VOH or VOL) will be
converted. EXAMPLE 8-1: PORT WRITE/READ
When reading the Port register, all pins configured as EXAMPLE
analog input channels will read as cleared (a low level). MOV 0xFF00, W0 ; Configure PORTB<15:8>
Pins configured as digital inputs will not convert an ; as inputs
MOV W0, TRISB ; and PORTB<7:0> as outputs
analog input. Analog levels on any pin that is defined as
NOP ; additional instruction
a digital input (including the ANx pins) may cause the
cylcle
input buffer to consume current that exceeds the btss PORTB, #13 ; bit test RB13 and skip if
device specifications. set

DS70083G-page 76 Preliminary  2004 Microchip Technology Inc.

 TABLE 8-1: PORTA REGISTER MAP
SFR Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Name
TRISA 02C0 TRISA15 TRISA14 TRISA13 TRISA12 — TRISA10 TRISA9 — TRISA7 TRISA6 — — — — — — 1111 0110 1100 0000
PORTA 02C2 RA15 RA14 RA13 RA12 — RA10 RA9 — RA7 RA6 — — — — — — 0000 0000 0000 0000
LATA 02C4 LATA15 LATA14 LATA13 LATA12 — LATA10 LATA9 — LATA7 LATA6 — — — — — — 0000 0000 0000 0000
Legend: u = uninitialized bit

TABLE 8-2: PORTB REGISTER MAP

SFR

 2004 Microchip Technology Inc.

Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Name
TRISB 02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111
PORTB 02C8 RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000
LATB 02CB LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000
Legend: u = uninitialized bit

TABLE 8-3: PORTC REGISTER MAP

SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Name
TRISC 02CC TRISC15 TRISC14 TRISC13 — — — — — — — — TRISC4 TRISC3 TRISC2 TRISC1 — 1110 0000 0001 1110
PORTC 02CE RC15 RC14 RC13 — — — — — — — — RC4 RC3 RC2 RC1 — 0000 0000 0000 0000
LATC 02D0 LATC15 LATC14 LATC13 — — — — — — — — LATC4 LATC3 LATC2 LATC1 — 0000 0000 0000 0000

Preliminary
Legend: u = uninitialized bit

TABLE 8-4: PORTD REGISTER MAP

SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Name

TRISD 02D2 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 1111 1111
PORTD 02D4 RD15 RD14 RD13 RD12 RD11 RD10 RD9 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 0000 0000 0000 0000
LATD 02D6 LATD15 LATD14 LATD13 LATD12 LATD11 LATD10 LATD9 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 0000 0000 0000 0000
Legend: u = uninitialized bit
dsPIC30F

DS70083G-page 77
 TABLE 8-5: PORTF REGISTER MAP
SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Name
TRISF 02DE — — — — — — — TRISF8 TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 0000 0001 1111 1111
PORTF 02E0 — — — — — — — RF8 RF7 RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000
LATF 02E2 — — — — — — — LATF8 LATF7 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 0000 0000 0000 0000

DS70083G-page 78
Legend: u = uninitialized bit
dsPIC30F

TABLE 8-6: PORTG REGISTER MAP

SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Name

TRISG 02E4 TRISG15 TRISG14 TRISG13 TRISG12 — — TRISG9 TRISG8 TRISG7 TRISG6 — — TRISG3 TRISG2 TRISG1 TRISG0 1111 0011 1100 1111
PORTG 02E6 RG15 RG14 RG13 RG12 — — RG9 RG8 RG7 RG6 — — RG3 RG2 RG1 RG0 0000 0000 0000 0000
LATG 02E8 LATG15 LATG14 LATG13 LATG12 — — LATG9 LATG8 LATG7 LATG6 — — LATG3 LATG2 LATG1 LATG0 0000 0000 0000 0000
Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

Preliminary
 2004 Microchip Technology Inc.
 dsPIC30F
8.3 Input Change Notification Module
The input change notification module provides the
dsPIC30F devices the ability to generate interrupt
requests to the processor, in response to a change of
state on selected input pins. This module is capable of
detecting input change of states even in Sleep mode,
when the clocks are disabled. There are up to 24 exter-
nal signals (CN0 through CN23) that may be selected
(enabled) for generating an interrupt request on a
change of state.

TABLE 8-7: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 15-8)

SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Reset State
Name

CNEN1 00C0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE 0000 0000 0000 0000
CNEN2 00C2 — — — — — — — — 0000 0000 0000 0000
CNPU1 00C4 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE 0000 0000 0000 0000
CNPU2 00C6 — — — — — — — — 0000 0000 0000 0000
Legend: u = uninitialized bit

TABLE 8-8: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0)

SFR
Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Name
CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000
CNEN2 00C2 CN23IE CN22IE CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE 0000 0000 0000 0000
CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000
CNPU2 00C6 CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000 0000 0000 0000
Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 79

dsPIC30F
NOTES:

DS70083G-page 80 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
9.0 TIMER1 MODULE These Operating modes are determined by setting the
appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1
Note: This data sheet summarizes features of this group presents a block diagram of the 16-bit timer module.
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU, 16-bit Timer Mode: In the 16-bit Timer mode, the timer
peripherals, register descriptions and general device increments on every instruction cycle up to a match
functionality, refer to the dsPIC30F Family Reference value preloaded into the Period register PR1, then
Manual (DS70046). resets to ‘0’ and continues to count.
This section describes the 16-bit General Purpose When the CPU goes into the Idle mode, the timer will
(GP) Timer1 module and associated Operational stop incrementing unless the TSIDL (T1CON<13>)
modes. Figure 9-1 depicts the simplified block diagram bit = 0. If TSIDL = 1, the timer module logic will resume
of the 16-bit Timer1 module. the incrementing sequence upon termination of the
The following sections provide a detailed description CPU Idle mode.
including setup and control registers, along with asso- 16-bit Synchronous Counter Mode: In the 16-bit
ciated block diagrams for the Operational modes of the Synchronous Counter mode, the timer increments on
timers. the rising edge of the applied external clock signal
The Timer1 module is a 16-bit timer which can serve as which is synchronized with the internal phase clocks.
the time counter for the real-time clock, or operate as a The timer counts up to a match value preloaded in PR1,
free-running interval timer/counter. The 16-bit timer has then resets to ‘0’ and continues.
the following modes: When the CPU goes into the Idle mode, the timer will
• 16-bit Timer stop incrementing unless the respective TSIDL bit = 0.
• 16-bit Synchronous Counter If TSIDL = 1, the timer module logic will resume the
incrementing sequence upon termination of the CPU
• 16-bit Asynchronous Counter
Idle mode.
Further, the following operational characteristics are
16-bit Asynchronous Counter Mode: In the 16-bit
supported:
Asynchronous Counter mode, the timer increments on
• Timer gate operation every rising edge of the applied external clock signal.
• Selectable prescaler settings The timer counts up to a match value preloaded in PR1,
• Timer operation during CPU Idle and Sleep then resets to ‘0’ and continues.
modes When the timer is configured for the Asynchronous
• Interrupt on 16-bit Period register match or falling mode of operation and the CPU goes into the Idle
edge of external gate signal mode, the timer will stop incrementing if TSIDL = 1.

FIGURE 9-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM

PR1

Equal
Comparator x 16 TSYNC

1 Sync
TMR1
Reset
0
0
T1IF
Event Flag 1 Q D TGATE
Q CK
TGATE
TGATE
TCS

TCKPS<1:0>
SOSCO/ TON 2
T1CK 1x

Gate Prescaler
LPOSCEN 1, 8, 64, 256
Sync 01

SOSCI
TCY 00

 2004 Microchip Technology Inc. Preliminary DS70083G-page 81

dsPIC30F
9.1 Timer Gate Operation 9.4 Timer Interrupt
The 16-bit timer can be placed in the Gated Time Accu- The 16-bit timer has the ability to generate an interrupt on
mulation mode. This mode allows the internal TCY to period match. When the timer count matches the Period
increment the respective timer when the gate input sig- register, the T1IF bit is asserted and an interrupt will be
nal (T1CK pin) is asserted high. Control bit TGATE generated if enabled. The T1IF bit must be cleared in
(T1CON<6>) must be set to enable this mode. The software. The timer interrupt flag, T1IF, is located in the
timer must be enabled (TON = 1) and the timer clock IFS0 Control register in the interrupt controller.
source set to internal (TCS = 0). When the Gated Time Accumulation mode is enabled,
When the CPU goes into the Idle mode, the timer will an interrupt will also be generated on the falling edge of
stop incrementing unless TSIDL = 0. If TSIDL = 1, the the gate signal (at the end of the accumulation cycle).
timer will resume the incrementing sequence upon Enabling an interrupt is accomplished via the respec-
termination of the CPU Idle mode. tive timer interrupt enable bit, T1IE. The timer interrupt
enable bit is located in the IEC0 Control register in the
9.2 Timer Prescaler interrupt controller.
The input clock (FOSC/4 or external clock) to the 16-bit
Timer has a prescale option of 1:1, 1:8, 1:64 and 1:256, 9.5 Real-Time Clock
selected by control bits TCKPS<1:0> (T1CON<5:4>). Timer1, when operating in Real-Time Clock (RTC)
The prescaler counter is cleared when any of the mode, provides time of day and event time-stamping
following occurs: capabilities. Key operational features of the RTC are:
• a write to the TMR1 register • Operation from 32 kHz LP oscillator
• clearing of the TON bit (T1CON<15>) • 8-bit prescaler
• device Reset, such as POR and BOR • Low power
However, if the timer is disabled (TON = 0), then the • Real-Time Clock interrupts
timer prescaler cannot be reset since the prescaler
These Operating modes are determined by setting the
clock is halted.
appropriate bit(s) in the T1CON Control register.
TMR1 is not cleared when T1CON is written. It is
cleared by writing to the TMR1 register. FIGURE 9-2: RECOMMENDED
COMPONENTS FOR
9.3 Timer Operation During Sleep TIMER1 LP OSCILLATOR
Mode RTC
During CPU Sleep mode, the timer will operate if:
C1
• The timer module is enabled (TON = 1) and
SOSCI
• The timer clock source is selected as external
(TCS = 1) and 32.768 kHz dsPIC30FXXXX
• The TSYNC bit (T1CON<2>) is asserted to a logic XTAL
‘0’ which defines the external clock source as SOSCO
asynchronous.
C2 R
When all three conditions are true, the timer will con-
tinue to count up to the Period register and be reset to
0x0000.
C1 = C2 = 18 pF; R = 100K
When a match between the timer and the Period regis-
ter occurs, an interrupt can be generated if the
respective timer interrupt enable bit is asserted.

DS70083G-page 82 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
9.5.1 RTC OSCILLATOR OPERATION 9.5.2 RTC INTERRUPTS
When the TON = 1, TCS = 1 and TGATE = 0, the timer When an interrupt event occurs, the respective interrupt
increments on the rising edge of the 32 kHz LP oscilla- flag, T1IF, is asserted and an interrupt will be generated
tor output signal, up to the value specified in the Period if enabled. The T1IF bit must be cleared in software. The
register and is then reset to ‘0’. respective Timer interrupt flag, T1IF, is located in the
The TSYNC bit must be asserted to a logic ‘0’ IFS0 Status register in the interrupt controller.
(Asynchronous mode) for correct operation. Enabling an interrupt is accomplished via the respec-
Enabling LPOSCEN (OSCCON<1>) will disable the tive timer interrupt enable bit, T1IE. The timer interrupt
normal Timer and Counter modes and enable a timer enable bit is located in the IEC0 Control register in the
carry-out wake-up event. interrupt controller.

When the CPU enters Sleep mode, the RTC will con-
tinue to operate provided the 32 kHz external crystal
oscillator is active and the control bits have not been
changed. The TSIDL bit should be cleared to ‘0’ in
order for RTC to continue operation in Idle mode.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 83

 TABLE 9-1: TIMER1 REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR1 0100 Timer1 Register uuuu uuuu uuuu uuuu

PR1 0102 Period Register 1 1111 1111 1111 1111
T1CON 0104 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — TSYNC TCS — 0000 0000 0000 0000

DS70083G-page 84
Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
dsPIC30F

Preliminary
 2004 Microchip Technology Inc.
 dsPIC30F
10.0 TIMER2/3 MODULE 16-bit Timer Mode: In the 16-bit mode, Timer2 and
Timer3 can be configured as two independent 16-bit
Note: This data sheet summarizes features of this group timers. Each timer can be set up in either 16-bit Timer
of dsPIC30F devices and is not intended to be a complete mode or 16-bit Synchronous Counter mode. See
reference source. For more information on the CPU,
peripherals, register descriptions and general device
Section 9.0, Timer1 Module for details on these two
functionality, refer to the dsPIC30F Family Reference Operating modes.
Manual (DS70046). The only functional difference between Timer2 and
This section describes the 32-bit General Purpose Timer3 is that Timer2 provides synchronization of the
(GP) Timer module (Timer2/3) and associated Opera- clock prescaler output. This is useful for high frequency
tional modes. Figure 10-1 depicts the simplified block external clock inputs.
diagram of the 32-bit Timer2/3 module. Figure 10-2 32-bit Timer Mode: In the 32-bit Timer mode, the timer
and Figure 10-3 show Timer2/3 configured as two increments on every instruction cycle, up to a match
independent 16-bit timers, Timer2 and Timer3, value preloaded into the combined 32-bit Period
respectively. register PR3/PR2, then resets to ‘0’ and continues to
The Timer2/3 module is a 32-bit timer (which can be count.
configured as two 16-bit timers) with selectable For synchronous 32-bit reads of the Timer2/Timer3
Operating modes. These timers are utilized by other pair, reading the LS Word (TMR2 register) will cause
peripheral modules, such as: the MS word to be read and latched into a 16-bit
• Input Capture holding register, termed TMR3HLD.
• Output Compare/Simple PWM For synchronous 32-bit writes, the holding register
The following sections provide a detailed description, (TMR3HLD) must first be written to. When followed by
including setup and control registers, along with asso- a write to the TMR2 register, the contents of TMR3HLD
ciated block diagrams for the Operational modes of the will be transferred and latched into the MSB of the
timers. 32-bit timer (TMR3).

The 32-bit timer has the following modes: 32-bit Synchronous Counter Mode: In the 32-bit
Synchronous Counter mode, the timer increments on
• Two independent 16-bit timers (Timer2 and the rising edge of the applied external clock signal
Timer3) with all 16-bit Operating modes (except which is synchronized with the internal phase clocks.
Asynchronous Counter mode) The timer counts up to a match value preloaded in the
• Single 32-bit timer operation combined 32-bit period register PR3/PR2, then resets
• Single 32-bit synchronous counter to ‘0’ and continues.
Further, the following operational characteristics are When the timer is configured for the Synchronous
supported: Counter mode of operation and the CPU goes into the
Idle mode, the timer will stop incrementing unless the
• ADC event trigger
TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer
• Timer gate operation module logic will resume the incrementing sequence
• Selectable prescaler settings upon termination of the CPU Idle mode.
• Timer operation during Idle and Sleep modes
Note: In some devices, one or more of the TxCK
• Interrupt on a 32-bit period register match pins may be absent. Therefore, for such
These Operating modes are determined by setting the timers, the following modes should not be
appropriate bit(s) in the 16-bit T2CON and T3CON used:
SFRs. 1. TCS = 1 (16-bit counter)
For 32-bit timer/counter operation, Timer2 is the LS 2. TCS = 0, TGATE = 1 (gated time
Word and Timer3 is the MS Word of the 32-bit timer. accumulation.

Note: For 32-bit timer operation, T3CON control

bits are ignored. Only T2CON control bits
are used for setup and control. Timer2
clock and gate inputs are utilized for the
32-bit timer module but an interrupt is gen-
erated with the Timer3 interrupt flag (T3IF)
and the interrupt is enabled with the
Timer3 interrupt enable bit (T3IE).

 2004 Microchip Technology Inc. Preliminary DS70083G-page 85

dsPIC30F
FIGURE 10-1: 32-BIT TIMER2/3 BLOCK DIAGRAM

Data Bus<15:0>

TMR3HLD
16
16
Write TMR2
Read TMR2

16

Reset
TMR3 TMR2 Sync

MSB LSB
ADC Event Trigger
Comparator x 32
Equal

PR3 PR2

0
T3IF
Event Flag
1 Q D TGATE (T2CON<6>)
Q CK
TGATE
(T2CON<6>)

TGATE
TCS

TCKPS<1:0>
TON 2
T2CK 1x

Gate Prescaler
Sync 01 1, 8, 64, 256

TCY 00

Note: Timer configuration bit T32 (T2CON<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control
bits are respective to the T2CON register.

DS70083G-page 86 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 10-2: 16-BIT TIMER2 BLOCK DIAGRAM

PR2

Equal
Comparator x 16

TMR2 Sync
Reset

0
T2IF
Event Flag 1 Q D TGATE
Q CK
TGATE

TGATE
TCS
TCKPS<1:0>
TON 2
T2CK 1x

Gate Prescaler
Sync 01 1, 8, 64, 256

TCY 00

FIGURE 10-3: 16-BIT TIMER3 BLOCK DIAGRAM

PR3

ADC Event Trigger Equal

Comparator x 16

TMR3
Reset

0
T3IF
Event Flag 1 Q D TGATE
Q CK
TGATE

TGATE
TCS

TCKPS<1:0>
TON 2
T3CK Sync 1x

Prescaler
01 1, 8, 64, 256

TCY 00

 2004 Microchip Technology Inc. Preliminary DS70083G-page 87

dsPIC30F
10.1 Timer Gate Operation 10.4 Timer Operation During Sleep
The 32-bit timer can be placed in the Gated Time Accu-
Mode
mulation mode. This mode allows the internal TCY to During CPU Sleep mode, the timer will not operate
increment the respective timer when the gate input sig- because the internal clocks are disabled.
nal (T2CK pin) is asserted high. Control bit TGATE
(T2CON<6>) must be set to enable this mode. When in 10.5 Timer Interrupt
this mode, Timer2 is the originating clock source. The
TGATE setting is ignored for Timer3. The timer must be The 32-bit timer module can generate an interrupt on
enabled (TON = 1) and the timer clock source set to period match or on the falling edge of the external gate
internal (TCS = 0). signal. When the 32-bit timer count matches the
The falling edge of the external signal terminates the respective 32-bit period register, or the falling edge of
count operation but does not reset the timer. The user the external “gate” signal is detected, the T3IF bit
must reset the timer in order to start counting from zero. (IFS0<7>) is asserted and an interrupt will be gener-
ated if enabled. In this mode, the T3IF interrupt flag is
used as the source of the interrupt. The T3IF bit must
10.2 ADC Event Trigger be cleared in software.
When a match occurs between the 32-bit timer (TMR3/ Enabling an interrupt is accomplished via the
TMR2) and the 32-bit combined period register (PR3/ respective timer interrupt enable bit, T3IE (IEC0<7>).
PR2), or between the 16-bit timer (TMR3) and the 16-
bit period register (PR3), a special ADC trigger event
signal is generated by Timer3.

10.3 Timer Prescaler

The input clock (FOSC/4 or external clock) to the timer
has a prescale option of 1:1, 1:8, 1:64, and 1:256,
selected by control bits TCKPS<1:0> (T2CON<5:4>
and T3CON<5:4>). For the 32-bit timer operation, the
originating clock source is Timer2. The prescaler oper-
ation for Timer3 is not applicable in this mode. The
prescaler counter is cleared when any of the following
occurs:
• a write to the TMR2/TMR3 register
• clearing either of the TON (T2CON<15> or
T3CON<15>) bits to ‘0’
• device Reset, such as POR and BOR
However, if the timer is disabled (TON = 0), then the
Timer 2 prescaler cannot be reset since the prescaler
clock is halted.
TMR2/TMR3 is not cleared when T2CON/T3CON is
written.

DS70083G-page 88 Preliminary  2004 Microchip Technology Inc.

 TABLE 10-1: TIMER2/3 REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR2 0106 Timer2 Register uuuu uuuu uuuu uuuu

TMR3HLD 0108 Timer3 Holding Register (for 32-bit timer operations only) uuuu uuuu uuuu uuuu
TMR3 010A Timer3 Register uuuu uuuu uuuu uuuu
PR2 010C Period Register 2 1111 1111 1111 1111
PR3 010E Period Register 3 1111 1111 1111 1111
T2CON 0110 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 — TCS — 0000 0000 0000 0000
T3CON 0112 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — — TCS — 0000 0000 0000 0000
Legend: u = uninitialized bit

 2004 Microchip Technology Inc.

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

Preliminary
dsPIC30F

DS70083G-page 89
dsPIC30F
NOTES:

DS70083G-page 90 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
11.0 TIMER4/5 MODULE The Operating modes of the Timer4/5 module are
determined by setting the appropriate bit(s) in the
Note: This data sheet summarizes features of this group 16-bit T4CON and T5CON SFRs.
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU, For 32-bit timer/counter operation, Timer4 is the LS
peripherals, register descriptions and general device Word and Timer5 is the MS Word of the 32-bit timer.
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). Note: For 32-bit timer operation, T5CON control
bits are ignored. Only T4CON control bits
This section describes the second 32-bit General Pur- are used for setup and control. Timer4
pose (GP) Timer module (Timer4/5) and associated clock and gate inputs are utilized for the
Operational modes. Figure 11-1 depicts the simplified 32-bit timer module but an interrupt is gen-
block diagram of the 32-bit Timer4/5 module. erated with the Timer5 interrupt flag (T5IF)
Figure 11-2 and Figure 11-3 show Timer4/5 configured and the interrupt is enabled with the
as two independent 16-bit timers, Timer4 and Timer5, Timer5 interrupt enable bit (T5IE).
respectively.
The Timer4/5 module is similar in operation to the Note: In some devices, one or more of the TxCK
Timer2/3 module. However, there are some differences pins may be absent. Therefore, for such
which are listed below: timers, the following modes should not be
used:
• The Timer4/5 module does not support the ADC
1. TCS = 1 (16-bit counter)
event trigger feature
2. TCS = 0, TGATE = 1 (gated time
• Timer4/5 can not be utilized by other peripheral accumulation)
modules, such as input capture and
output compare

FIGURE 11-1: 32-BIT TIMER4/5 BLOCK DIAGRAM

Data Bus<15:0>

TMR5HLD
16
16
Write TMR4
Read TMR4

16

Reset
TMR5 TMR4 Sync

MSB LSB

Comparator x 32
Equal

PR5 PR4

0
T5IF
Event Flag 1 Q D TGATE (T4CON<6>)
Q CK
TGATE
(T4CON<6>)
TGATE
TCS

TCKPS<1:0>
TON 2
T4CK 1x

Prescaler
Gate 1, 8, 64, 256
Sync 01

TCY 00

Note: Timer configuration bit T32 (T4CON<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All
control bits are respective to the T4CON register.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 91

dsPIC30F
FIGURE 11-2: 16-BIT TIMER4 BLOCK DIAGRAM

PR4

Equal
Comparator x 16

TMR4 Sync
Reset

0
T4IF
Event Flag 1 Q D TGATE
Q CK

TGATE
TGATE

TCS
TCKPS<1:0>
TON 2
T4CK 1x

Gate Prescaler
Sync 01 1, 8, 64, 256

TCY 00

FIGURE 11-3: 16-BIT TIMER5 BLOCK DIAGRAM

PR5

ADC Event Trigger Equal

Comparator x 16

TMR5
Reset

0
T5IF
Event Flag 1 Q D TGATE
Q CK
TGATE

TGATE
TCS

TCKPS<1:0>
TON 2
T5CK Sync 1x

Prescaler
01 1, 8, 64, 256

TCY 00

DS70083G-page 92 Preliminary  2004 Microchip Technology Inc.

 TABLE 11-1: TIMER4/5 REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR4 0114 Timer 4 Register uuuu uuuu uuuu uuuu

TMR5HLD 0116 Timer 5 Holding Register (for 32-bit operations only) uuuu uuuu uuuu uuuu
TMR5 0118 Timer 5 Register uuuu uuuu uuuu uuuu
PR4 011A Period Register 4 1111 1111 1111 1111
PR5 011C Period Register 5 1111 1111 1111 1111
T4CON 011E TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T45 — TCS — 0000 0000 0000 0000
T5CON 0120 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — — TCS — 0000 0000 0000 0000
Legend: u = uninitialized

 2004 Microchip Technology Inc.

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

Preliminary
dsPIC30F

DS70083G-page 93
dsPIC30F
NOTES:

DS70083G-page 94 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
12.0 INPUT CAPTURE MODULE The key operational features of the input capture
module are:
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
• Simple Capture Event mode
reference source. For more information on the CPU, • Timer2 and Timer3 mode selection
peripherals, register descriptions and general device • Interrupt on input capture event
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). These Operating modes are determined by setting the
appropriate bits in the ICxCON register (where
This section describes the input capture module and
x = 1,2,...,N). The dsPIC devices contain up to 8
associated Operational modes. The features provided
capture channels (i.e., the maximum value of N is 8).
by this module are useful in applications requiring fre-
quency (period) and pulse measurement. Figure 12-1
depicts a block diagram of the input capture module.
Input capture is useful for such modes as:
• Frequency/Period/Pulse Measurements
• Additional Sources of External Interrupts

FIGURE 12-1: INPUT CAPTURE MODE BLOCK DIAGRAM

From GP Timer Module T2_CNT T3_CNT

16 16

ICTMR
ICx pin 1 0
Prescaler Clock Edge FIFO
1, 4, 16 Synchronizer Detection R/W
Logic Logic

3 ICM<2:0>
Mode Select ICxBUF

ICBNE, ICOV

ICI<1:0>
Interrupt
ICxCON Logic

Data Bus Set Flag

ICxIF

Note: Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input capture
channels 1 through N.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 95

dsPIC30F
12.1 Simple Capture Event Mode 12.1.3 TIMER2 AND TIMER3 SELECTION
MODE
The simple capture events in the dsPIC30F product
family are: The input capture module consists of up to 8 input cap-
ture channels. Each channel can select between one of
• Capture every falling edge
two timers for the time base, Timer2 or Timer3.
• Capture every rising edge
Selection of the timer resource is accomplished
• Capture every 4th rising edge
through SFR bit, ICTMR (ICxCON<7>). Timer3 is the
• Capture every 16th rising edge default timer resource available for the input capture
• Capture every rising and falling edge module.
These simple Input Capture modes are configured by
setting the appropriate bits ICM<2:0> (ICxCON<2:0>). 12.1.4 HALL SENSOR MODE
When the input capture module is set for capture on
12.1.1 CAPTURE PRESCALER every edge, rising and falling, ICM<2:0> = 001, the fol-
There are four input capture prescaler settings speci- lowing operations are performed by the input capture
fied by bits ICM<2:0> (ICxCON<2:0>). Whenever the logic:
capture channel is turned off, the prescaler counter will • The input capture interrupt flag is set on every
be cleared. In addition, any Reset will clear the edge, rising and falling.
prescaler counter. • The interrupt on Capture mode setting bits,
ICI<1:0>, is ignored since every capture
12.1.2 CAPTURE BUFFER OPERATION generates an interrupt.
Each capture channel has an associated FIFO buffer • A capture overflow condition is not generated in
which is four 16-bit words deep. There are two status this mode.
flags which provide status on the FIFO buffer:
• ICBFNE - Input Capture Buffer Not Empty
• ICOV - Input Capture Overflow
The ICBFNE will be set on the first input capture event
and remain set until all capture events have been read
from the FIFO. As each word is read from the FIFO, the
remaining words are advanced by one position within
the buffer.
In the event that the FIFO is full with four capture
events and a fifth capture event occurs prior to a read
of the FIFO, an overflow condition will occur and the
ICOV bit will be set to a logic ‘1’. The fifth capture event
is lost and is not stored in the FIFO. No additional
events will be captured until all four events have been
read from the buffer.
If a FIFO read is performed after the last read and no
new capture event has been received, the read will
yield indeterminate results.

DS70083G-page 96 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
12.2 Input Capture Operation During 12.2.2 INPUT CAPTURE IN CPU IDLE
Sleep and Idle Modes MODE
An input capture event will generate a device wake-up CPU Idle mode allows input capture module operation
or interrupt, if enabled, if the device is in CPU Idle or with full functionality. In the CPU Idle mode, the Inter-
Sleep mode. rupt mode selected by the ICI<1:0> bits is applicable,
as well as the 4:1 and 16:1 capture prescale settings
Independent of the timer being enabled, the input cap- which are defined by control bits ICM<2:0>. This mode
ture module will wake-up from the CPU Sleep or Idle requires the selected timer to be enabled. Moreover,
mode when a capture event occurs if ICM<2:0> = 111 the ICSIDL bit must be asserted to a logic ‘0’.
and the interrupt enable bit is asserted. The same wake-
up can generate an interrupt if the conditions for pro- If the input capture module is defined as
cessing the interrupt have been satisfied. The wake-up ICM<2:0> = 111 in CPU Idle mode, the input capture
feature is useful as a method of adding extra external pin pin will serve only as an external interrupt pin.
interrupts.
12.3 Input Capture Interrupts
12.2.1 INPUT CAPTURE IN CPU SLEEP
The input capture channels have the ability to generate
MODE
an interrupt based upon the selected number of cap-
CPU Sleep mode allows input capture module opera- ture events. The selection number is set by control bits
tion with reduced functionality. In the CPU Sleep mode, ICI<1:0> (ICxCON<6:5>).
the ICI<1:0> bits are not applicable and the input cap-
Each channel provides an interrupt flag (ICxIF) bit. The
ture module can only function as an external interrupt
respective capture channel interrupt flag is located in
source.
the corresponding IFSx Status register.
The capture module must be configured for interrupt
Enabling an interrupt is accomplished via the respec-
only on rising edge (ICM<2:0> = 111) in order for the
tive capture channel interrupt enable (ICxIE) bit. The
input capture module to be used while the device is in
capture interrupt enable bit is located in the
Sleep mode. The prescale settings of 4:1 or 16:1 are
corresponding IEC Control register.
not applicable in this mode.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 97

 TABLE 12-1: INPUT CAPTURE REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

IC1BUF 0140 Input 1 Capture Register uuuu uuuu uuuu uuuu

IC1CON 0142 — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
IC2BUF 0144 Input 2 Capture Register uuuu uuuu uuuu uuuu

DS70083G-page 98
IC2CON 0146 — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
IC3BUF 0148 Input 3 Capture Register uuuu uuuu uuuu uuuu
IC3CON 014A — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
dsPIC30F

IC4BUF 014C Input 4 Capture Register uuuu uuuu uuuu uuuu

IC4CON 014E — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
IC5BUF 0150 Input 5 Capture Register uuuu uuuu uuuu uuuu
IC5CON 0152 — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
IC6BUF 0154 Input 6 Capture Register uuuu uuuu uuuu uuuu
IC6CON 0156 — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
IC7BUF 0158 Input 7 Capture Register uuuu uuuu uuuu uuuu
IC7CON 015A — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
IC8BUF 015C Input 8 Capture Register uuuu uuuu uuuu uuuu
IC8CON 015E — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

Preliminary
 2004 Microchip Technology Inc.
 dsPIC30F
13.0 OUTPUT COMPARE MODULE The key operational features of the output compare
module include:
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
• Timer2 and Timer3 Selection mode
reference source. For more information on the CPU, • Simple Output Compare Match mode
peripherals, register descriptions and general device • Dual Output Compare Match mode
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). • Simple PWM mode
• Output Compare During Sleep and Idle modes
This section describes the output compare module and
associated Operational modes. The features provided • Interrupt on Output Compare/PWM Event
by this module are useful in applications requiring These Operating modes are determined by setting the
Operational modes, such as: appropriate bits in the 16-bit OCxCON SFR (where
• Generation of Variable Width Output Pulses x = 1,2,3,...,N). The dsPIC devices contain up to 8
compare channels (i.e., the maximum value of N is 8).
• Power Factor Correction
OCxRS and OCxR in Figure 13-1 represent the Dual
Figure 13-1 depicts a block diagram of the output
Compare registers. In the Dual Compare mode, the
compare module.
OCxR register is used for the first compare and OCxRS
is used for the second compare.

FIGURE 13-1: OUTPUT COMPARE MODE BLOCK DIAGRAM

Set Flag bit

OCxIF

OCxRS

OCxR Output S Q
Logic R
OCx
Output
3
Enable
OCM<2:0>
Comparator Mode Select

OCTSEL OCFA
0 1 0 1 (for x = 1, 2, 3 or 4)
or OCFB
From GP (for x = 5, 6, 7 or 8)
Timer Module

TMR2<15:0 TMR3<15:0> T2P2_MATCH T3P3_MATCH

Note: Where ‘x’ is shown, reference is made to the registers associated with the respective output compare
channels 1 through N.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 99

dsPIC30F
13.1 Timer2 and Timer3 Selection Mode 13.3.2 CONTINUOUS PULSE MODE
Each output compare channel can select between one For the user to configure the module for the generation
of two 16-bit timers, Timer2 or Timer3. of a continuous stream of output pulses, the following
steps are required:
The selection of the timers is controlled by the OCTSEL
bit (OCxCON<3>). Timer2 is the default timer resource • Determine instruction cycle time TCY.
for the output compare module. • Calculate desired pulse value based on TCY.
• Calculate timer to start pulse width from timer start
13.2 Simple Output Compare Match value of 0x0000.
Mode • Write pulse width start and stop times into OCxR
and OCxRS (x denotes channel 1, 2, ...,N)
When control bits OCM<2:0> (OCxCON<2:0>) = 001, Compare registers, respectively.
010 or 011, the selected output compare channel is
• Set Timer Period register to value equal to, or
configured for one of three simple Output Compare
greater than value in OCxRS Compare register.
Match modes:
• Set OCM<2:0> = 101.
• Compare forces I/O pin low
• Enable timer, TON (TxCON<15>) = 1.
• Compare forces I/O pin high
• Compare toggles I/O pin 13.4 Simple PWM Mode
The OCxR register is used in these modes. The OCxR
When control bits OCM<2:0> (OCxCON<2:0>) = 110
register is loaded with a value and is compared to the
or 111, the selected output compare channel is config-
selected incrementing timer count. When a compare
ured for the PWM mode of operation. When configured
occurs, one of these Compare Match modes occurs. If
for the PWM mode of operation, OCxR is the main latch
the counter resets to zero before reaching the value in
(read only) and OCxRS is the secondary latch. This
OCxR, the state of the OCx pin remains unchanged.
enables glitchless PWM transitions.

13.3 Dual Output Compare Match Mode The user must perform the following steps in order to
configure the output compare module for PWM
When control bits OCM<2:0> (OCxCON<2:0>) = 100 operation:
or 101, the selected output compare channel is config-
1. Set the PWM period by writing to the appropriate
ured for one of two Dual Output Compare modes,
period register.
which are:
2. Set the PWM duty cycle by writing to the OCxRS
• Single Output Pulse mode register.
• Continuous Output Pulse mode 3. Configure the output compare module for PWM
operation.
13.3.1 SINGLE PULSE MODE
4. Set the TMRx prescale value and enable the
For the user to configure the module for the generation Timer, TON (TxCON<15>) = 1.
of a single output pulse, the following steps are
required (assuming timer is off): 13.4.1 INPUT PIN FAULT PROTECTION
• Determine instruction cycle time TCY. FOR PWM
• Calculate desired pulse width value based on TCY. When control bits OCM<2:0> (OCxCON<2:0>) = 111,
• Calculate time to start pulse from timer start value the selected output compare channel is again config-
of 0x0000. ured for the PWM mode of operation with the additional
• Write pulse width start and stop times into OCxR feature of input FAULT protection. While in this mode,
and OCxRS Compare registers (x denotes if a logic ‘0’ is detected on the OCFA/B pin, the respec-
channel 1, 2, ...,N). tive PWM output pin is placed in the high impedance
input state. The OCFLT bit (OCxCON<4>) indicates
• Set Timer Period register to value equal to, or
whether a FAULT condition has occurred. This state will
greater than value in OCxRS Compare register.
be maintained until both of the following events have
• Set OCM<2:0> = 100. occurred:
• Enable timer, TON (TxCON<15>) = 1.
• The external FAULT condition has been removed.
To initiate another single pulse, issue another write to • The PWM mode has been re-enabled by writing
set OCM<2:0> = 100. to the appropriate control bits.

DS70083G-page 100 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
13.4.2 PWM PERIOD When the selected TMRx is equal to its respective
period register, PRx, the following four events occur on
The PWM period is specified by writing to the PRx
the next increment cycle:
register. The PWM period can be calculated using
Equation 13-1. • TMRx is cleared.
• The OCx pin is set.
EQUATION 13-1: - Exception 1: If PWM duty cycle is 0x0000,
the OCx pin will remain low.
PWM period = [(PRx) + 1] • 4 • TOSC •
(TMRx prescale value) - Exception 2: If duty cycle is greater than PRx,
the pin will remain high.
• The PWM duty cycle is latched from OCxRS into
PWM frequency is defined as 1 / [PWM period]. OCxR.
• The corresponding timer interrupt flag is set.
See Figure 13-2 for key PWM period comparisons.
Timer3 is referred to in Figure 13-2 for clarity.

FIGURE 13-2: PWM OUTPUT TIMING

Period

Duty Cycle

TMR3 = PR3
TMR3 = PR3 T3IF = 1
T3IF = 1 (Interrupt Flag)
(Interrupt Flag) OCxR = OCxRS
OCxR = OCxRS
TMR3 = Duty Cycle TMR3 = Duty Cycle
(OCxR) (OCxR)

13.5 Output Compare Operation During 13.7 Output Compare Interrupts

CPU Sleep Mode The output compare channels have the ability to gener-
When the CPU enters Sleep mode, all internal clocks ate an interrupt on a compare match, for whichever
are stopped. Therefore, when the CPU enters the Match mode has been selected.
Sleep state, the output compare channel will drive the For all modes except the PWM mode, when a compare
pin to the active state that was observed prior to event occurs, the respective interrupt flag (OCxIF) is
entering the CPU Sleep state. asserted and an interrupt will be generated if enabled.
For example, if the pin was high when the CPU entered The OCxIF bit is located in the corresponding IFS
the Sleep state, the pin will remain high. Likewise, if the Status register and must be cleared in software. The
pin was low when the CPU entered the Sleep state, the interrupt is enabled via the respective compare inter-
pin will remain low. In either case, the output compare rupt enable (OCxIE) bit located in the corresponding
module will resume operation when the device wakes IEC Control register.
up. For the PWM mode, when an event occurs, the respec-
tive timer interrupt flag (T2IF or T3IF) is asserted and
13.6 Output Compare Operation During an interrupt will be generated if enabled. The IF bit is
CPU Idle Mode located in the IFS0 Status register and must be cleared
in software. The interrupt is enabled via the respective
When the CPU enters the Idle mode, the output timer interrupt enable bit (T2IE or T3IE) located in the
compare module can operate with full functionality. IEC0 Control register. The output compare interrupt
The output compare channel will operate during the flag is never set during the PWM mode of operation.
CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at
logic ‘0’ and the selected time base (Timer2 or Timer3)
is enabled and the TSIDL bit of the selected timer is set
to logic ‘0’.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 101

 TABLE 13-1: OUTPUT COMPARE REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

OC1RS 0180 Output Compare 1 Secondary Register 0000 0000 0000 0000
OC1R 0182 Output Compare 1 Main Register 0000 0000 0000 0000
OC1CON 0184 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
OC2RS 0186 Output Compare 2 Secondary Register 0000 0000 0000 0000

DS70083G-page 102
OC2R 0188 Output Compare 2 Main Register 0000 0000 0000 0000
OC2CON 018A — — OCSIDL — — — — — — — — OCFLT OCTSE OCM<2:0> 0000 0000 0000 0000
dsPIC30F

OC3RS 018C Output Compare 3 Secondary Register 0000 0000 0000 0000
OC3R 018E Output Compare 3 Main Register 0000 0000 0000 0000
OC3CON 0190 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
OC4RS 0192 Output Compare 4 Secondary Register 0000 0000 0000 0000
OC4R 0194 Output Compare 4 Main Register 0000 0000 0000 0000
OC4CON 0196 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
OC5RS 0198 Output Compare 5 Secondary Register 0000 0000 0000 0000
OC5R 019A Output Compare 5 Main Register 0000 0000 0000 0000
OC5CON 019C — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
OC6RS 019E Output Compare 6 Secondary Register 0000 0000 0000 0000
OC6R 01A0 Output Compare 6 Main Register 0000 0000 0000 0000
OC6CON 01A2 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
OC7RS 01A4 Output Compare 7 Secondary Register 0000 0000 0000 0000
OC7R 01A6 Output Compare 7 Main Register 0000 0000 0000 0000

Preliminary
OC7CON 01A8 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
OC8RS 01AA Output Compare 8 Secondary Register 0000 0000 0000 0000
OC8R 01AC Output Compare 8 Main Register 0000 0000 0000 0000
OC8CON 01AE — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

 2004 Microchip Technology Inc.

 dsPIC30F
14.0 SPI MODULE In Master mode, the clock is generated by prescaling
the system clock. Data is transmitted as soon as a
Note: This data sheet summarizes features of this group value is written to SPIxBUF. The interrupt is generated
of dsPIC30F devices and is not intended to be a complete at the middle of the transfer of the last bit.
reference source. For more information on the CPU,
peripherals, register descriptions and general device In Slave mode, data is transmitted and received as
functionality, refer to the dsPIC30F Family Reference external clock pulses appear on SCK. Again, the inter-
Manual (DS70046). rupt is generated when the last bit is latched. If SSx
The Serial Peripheral Interface (SPI) module is a syn- control is enabled, then transmission and reception are
chronous serial interface. It is useful for communicating enabled only when SSx = low. The SDOx output will be
with other peripheral devices, such as EEPROMs, shift disabled in SSx mode with SSx high.
registers, display drivers and A/D converters, or other The clock provided to the module is (FOSC/4). This
microcontrollers. It is compatible with Motorola's SPI™ clock is then prescaled by the primary (PPRE<1:0>)
and SIOP interfaces. and the secondary (SPRE<2:0>) prescale factors. The
CKE bit determines whether transmit occurs on transi-
14.1 Operating Function Description tion from active clock state to Idle clock state, or vice
versa. The CKP bit selects the Idle state (high or low)
Each SPI module consists of a 16-bit shift register, for the clock.
SPIxSR (where x = 1 or 2), used for shifting data in and
out, and a buffer register, SPIxBUF. A control register, 14.1.1 WORD AND BYTE
SPIxCON, configures the module. Additionally, a status COMMUNICATION
register, SPIxSTAT, indicates various status conditions.
A control bit, MODE16 (SPIxCON<10>), allows the
The serial interface consists of 4 pins: SDIx (serial data module to communicate in either 16-bit or 8-bit mode.
input), SDOx (serial data output), SCKx (shift clock 16-bit operation is identical to 8-bit operation except
input or output), and SSx (active low slave select). that the number of bits transmitted is 16 instead of 8.
In Master mode operation, SCK is a clock output but in The user software must disable the module prior to
Slave mode, it is a clock input. changing the MODE16 bit. The SPI module is reset
A series of eight (8) or sixteen (16) clock pulses shift when the MODE16 bit is changed by the user.
out bits from the SPIxSR to SDOx pin and simulta- A basic difference between 8-bit and 16-bit operation is
neously shift in data from SDIx pin. An interrupt is gen- that the data is transmitted out of bit 7 of the SPIxSR for
erated when the transfer is complete and the 8-bit operation, and data is transmitted out of bit15 of
corresponding interrupt flag bit (SPI1IF or SPI2IF) is the SPIxSR for 16-bit operation. In both modes, data is
set. This interrupt can be disabled through an interrupt shifted into bit 0 of the SPIxSR.
enable bit (SPI1IE or SPI2IE).
The receive operation is double-buffered. When a com- 14.1.2 SDOx DISABLE
plete byte is received, it is transferred from SPIxSR to A control bit, DISSDO, is provided to the SPIxCON reg-
SPIxBUF. ister to allow the SDOx output to be disabled. This will
If the receive buffer is full when new data is being trans- allow the SPI module to be connected in an input only
ferred from SPIxSR to SPIxBUF, the module will set the configuration. SDO can also be used for general
SPIROV bit indicating an overflow condition. The trans- purpose I/O.
fer of the data from SPIxSR to SPIxBUF will not be
completed and the new data will be lost. The module 14.2 Framed SPI Support
will not respond to SCL transitions while SPIROV is ‘1’,
effectively disabling the module until SPIxBUF is read The module supports a basic framed SPI protocol in
by user software. Master or Slave mode. The control bit FRMEN enables
framed SPI support and causes the SSx pin to perform
Transmit writes are also double-buffered. The user the frame synchronization pulse (FSYNC) function.
writes to SPIxBUF. When the master or slave transfer The control bit SPIFSD determines whether the SSx
is completed, the contents of the shift register (SPIxSR) pin is an input or an output (i.e., whether the module
are moved to the receive buffer. If any transmit data has receives or generates the frame synchronization
been written to the buffer register, the contents of the pulse). The frame pulse is an active high pulse for a
transmit buffer are moved to SPIxSR. The received single SPI clock cycle. When frame synchronization is
data is thus placed in SPIxBUF and the transmit data in enabled, the data transmission starts only on the
SPIxSR is ready for the next transfer. subsequent transmit edge of the SPI clock.
Note: Both the transmit buffer (SPIxTXB) and
the receive buffer (SPIxRXB) are mapped
to the same register address, SPIxBUF.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 103

dsPIC30F
FIGURE 14-1: SPI BLOCK DIAGRAM

Internal
Data Bus
Read Write

SPIxBUF SPIxBUF

Receive Transmit

SPIxSR
SDIx bit 0

SDOx Shift
Clock
SS and FSYNC Clock Edge
Control Control Select
SSx
Secondary Primary
Prescaler Prescaler FCY
1,2,4,6,8 1, 4, 16, 64
SCKx

Enable Master Clock

Note: x = 1 or 2.

FIGURE 14-2: SPI MASTER/SLAVE CONNECTION

SPI Master SPI Slave

SDOx SDIy

Serial Input Buffer Serial Input Buffer

(SPIxBUF) (SPIyBUF)

Shift Register SDIx SDOy Shift Register

(SPIxSR) (SPIySR)

MSb LSb MSb LSb

Serial Clock
SCKx SCKy
PROCESSOR 1 PROCESSOR 2

Note: x = 1 or 2, y = 1 or 2.

DS70083G-page 104 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
14.3 Slave Select Synchronization 14.5 SPI Operation During CPU Idle
The SSx pin allows a Synchronous Slave mode. The
Mode
SPI must be configured in SPI Slave mode with SSx pin When the device enters Idle mode, all clock sources
control enabled (SSEN = 1). When the SSx pin is low, remain functional. The SPISIDL bit (SPIxSTAT<13>)
transmission and reception are enabled and the SDOx selects if the SPI module will stop or continue on Idle. If
pin is driven. When SSx pin goes high, the SDOx pin is SPISIDL = 0, the module will continue to operate when
no longer driven. Also, the SPI module is re- the CPU enters Idle mode. If SPISIDL = 1, the module
synchronized, and all counters/control circuitry are will stop when the CPU enters Idle mode.
reset. Therefore, when the SSx pin is asserted low
again, transmission/reception will begin at the MS bit
even if SSx had been de-asserted in the middle of a
transmit/receive.

14.4 SPI Operation During CPU Sleep

Mode
During Sleep mode, the SPI module is shutdown. If the
CPU enters Sleep mode while an SPI transaction is in
progress, then the transmission and reception is
aborted.
The transmitter and receiver will stop in Sleep mode.
However, register contents are not affected by entering
or exiting Sleep mode.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 105

 TABLE 14-1: SPI1 REGISTER MAP
SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Name
SPI1STAT 0220 SPIEN — SPISIDL — — — — — — SPIROV — — — — SPITBF SPIRBF 0000 0000 0000 0000
SPI1CON 0222 — FRMEN SPIFSD — DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000
SPI1BUF 0224 Transmit and Receive Buffer 0000 0000 0000 0000

DS70083G-page 106
Legend: u = uninitialized bit
dsPIC30F

TABLE 14-2: SPI2 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

SPI2STAT 0226 SPIEN — SPISIDL — — — — — — SPIROV — — — — SPITBF SPIRBF 0000 0000 0000 0000
SPI2CON 0228 — FRMEN SPIFSD — DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000
SPI2BUF 022A Transmit and Receive Buffer 0000 0000 0000 0000
Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

Preliminary
 2004 Microchip Technology Inc.
 dsPIC30F
15.0 I2C MODULE • Serial clock synchronization for I2C port can be
used as a handshake mechanism to suspend and
Note: This data sheet summarizes features of this group resume serial transfer (SCLREL control).
• I2C supports multi-master operation; detects bus
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device collision and will arbitrate accordingly.
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
15.1 Operating Function Description
The Inter-Integrated Circuit (I2CTM) module provides
The hardware fully implements all the master and slave
complete hardware support for both Slave and Multi-
functions of the I2C Standard and Fast mode
Master modes of the I2C serial communication
specifications, as well as 7 and 10-bit addressing.
standard, with a 16-bit interface.
Thus, the I2C module can operate either as a slave or
This module offers the following key features:
a master on an I2C bus.
• I2C interface supporting both master and slave
operation. 15.1.1 VARIOUS I2C MODES
• I2C Slave mode supports 7 and 10-bit address. The following types of I2C operation are supported:
• I2C Master mode supports 7 and 10-bit address. • I2C slave operation with 7-bit address
• I2C port allows bidirectional transfers between • I2C slave operation with 10-bit address
master and slaves.
• I2C master operation with 7 or 10-bit address
See the I2C programmer’s model in Figure 15-1.

FIGURE 15-1: PROGRAMMER’S MODEL

I2CRCV (8 bits)
Bit 7 Bit 0

I2CTRN (8 bits)
Bit 7 Bit 0
I2CBRG (9 bits)
Bit 8 Bit 0
I2CCON (16 bits)
Bit 15 Bit 0
I2CSTAT (16 bits)
Bit 15 Bit 0
I2CADD (10 bits)
Bit 9 Bit 0

15.1.2 PIN CONFIGURATION IN I2C MODE The I2CADD register holds the slave address. A status
bit, ADD10, indicates 10-bit Address mode. The
I 2C
has a 2-pin interface: the SCL pin is clock and the
I2CBRG acts as the baud rate generator reload value.
SDA pin is data.
In receive operations, I2CRSR and I2CRCV together
15.1.3 I2C REGISTERS form a double-buffered receiver. When I2CRSR
I2CCON and I2CSTAT are control and status registers, receives a complete byte, it is transferred to I2CRCV
respectively. The I2CCON register is readable and writ- and an interrupt pulse is generated. During
able. The lower 6 bits of I2CSTAT are read only. The transmission, the I2CTRN is not double-buffered.
remaining bits of the I2CSTAT are read/write. Note: Following a RESTART condition in 10-bit
I2CRSR is the shift register used for shifting data, mode, the user only needs to match the
whereas I2CRCV is the buffer register to which data first 7-bit address.
bytes are written, or from which data bytes are read.
I2CRCV is the receive buffer as shown in Figure 15-1.
I2CTRN is the transmit register to which bytes are
written during a transmit operation, as shown in
Figure 15-2.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 107

dsPIC30F
FIGURE 15-2: I2C BLOCK DIAGRAM

Internal
Data Bus

I2CRCV
Read
Shift
SCL Clock
I2CRSR
LSB

SDA Addr_Match
Match Detect

Write

I2CADD

Read

Start and
Stop bit Detect
Write

I2CSTAT
Start, RESTART,
Stop bit Generate
Read
Control Logic

Collision
Detect
Write
I2CCON

Acknowledge
Read
Generation

Clock
Stretching Write

I2CTRN
LSB
Shift Read
Clock

Reload
Control Write

BRG Down I2CBRG

Counter Read
FOSC

DS70083G-page 108 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
15.2 I2C Module Addresses received, if I2CRCV is not full or I2COV is not set,
I2CRSR is transferred to I2CRCV. ACK is sent on the
The I2CADD register contains the Slave mode ninth clock.
addresses. The register is a 10-bit register.
If the RBF flag is set, indicating that I2CRCV is still
If the A10M bit (I2CCON<10>) is ‘0’, the address is holding data from a previous operation (RBF = 1), then
interpreted by the module as a 7-bit address. When an ACK is not sent; however, the interrupt pulse is gener-
address is received, it is compared to the 7 LS bits of ated. In the case of an overflow, the contents of the
the I2CADD register. I2CRSR are not loaded into the I2CRCV.
If the A10M bit is ‘1’, the address is assumed to be a
10-bit address. When an address is received, it will be Note: The I2CRCV will be loaded if the I2COV
compared with the binary value ‘11110 A9 A8’ (where bit = 1 and the RBF flag = 0. In this case,
A9 and A8 are two Most Significant bits of I2CADD). If a read of the I2CRCV was performed but
that value matches, the next address will be compared the user did not clear the state of the
with the Least Significant 8 bits of I2CADD, as specified I2COV bit before the next receive
in the 10-bit addressing protocol. occurred. The Acknowledgement is not
7-bit I2C Slave Addresses supported by dsPIC30F: sent (ACK = 1) and the I2CRCV is
updated.
0x00 General call address or start byte
0x01-0x03 Reserved 15.4 I2C 10-bit Slave Mode Operation
0x04-0x77 Valid 7-bit addresses
In 10-bit mode, the basic receive and transmit opera-
0x78-0x7b Valid 10-bit addresses (lower 7
tions are the same as in the 7-bit mode. However, the
bits)
criteria for address match is more complex.
0x7c-0x7f Reserved
The I2C specification dictates that a slave must be
addressed for a write operation with two address bytes
15.3 I2C 7-bit Slave Mode Operation following a Start bit.
Once enabled (I2CEN = 1), the slave module will wait The A10M bit is a control bit that signifies that the
for a Start bit to occur (i.e., the I2C module is ‘Idle’). Fol- address in I2CADD is a 10-bit address rather than a 7-bit
lowing the detection of a Start bit, 8 bits are shifted into address. The address detection protocol for the first byte
I2CRSR and the address is compared against of a message address is identical for 7-bit and 10-bit
I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0> messages, but the bits being compared are different.
are compared against I2CRSR<7:1> and I2CRSR<0> I2CADD holds the entire 10-bit address. Upon receiv-
is the R_W bit. All incoming bits are sampled on the ris- ing an address following a Start bit, I2CRSR <7:3> is
ing edge of SCL. compared against a literal ‘11110’ (the default 10-bit
If an address match occurs, an Acknowledgement will address) and I2CRSR<2:1> are compared against
be sent, and the slave event interrupt flag (SI2CIF) is I2CADD<9:8>. If a match occurs and if R_W = 0, the
set on the falling edge of the ninth (ACK) bit. The interrupt pulse is sent. The ADD10 bit will be cleared to
address match does not affect the contents of the indicate a partial address match. If a match fails or
I2CRCV buffer or the RBF bit. R_W = 1, the ADD10 bit is cleared and the module
returns to the Idle state.
15.3.1 SLAVE TRANSMISSION
The low byte of the address is then received and com-
If the R_W bit received is a ‘1’, then the serial port will pared with I2CADD<7:0>. If an address match occurs,
go into Transmit mode. It will send ACK on the ninth bit the interrupt pulse is generated and the ADD10 bit is
and then hold SCL to ‘0’ until the CPU responds by writ- set, indicating a complete 10-bit address match. If an
ing to I2CTRN. SCL is released by setting the SCLREL address match did not occur, the ADD10 bit is cleared
bit, and 8 bits of data are shifted out. Data bits are and the module returns to the Idle state.
shifted out on the falling edge of SCL, such that SDA is
valid during SCL high. The interrupt pulse is sent on the 15.4.1 10-BIT MODE SLAVE
falling edge of the ninth clock pulse, regardless of the TRANSMISSION
status of the ACK received from the master.
Once a slave is addressed in this fashion with the full
10-bit address (we will refer to this state as
15.3.2 SLAVE RECEPTION
“PRIOR_ADDR_MATCH”), the master can begin
If the R_W bit received is a ‘0’ during an address sending data bytes for a slave reception operation.
match, then Receive mode is initiated. Incoming bits
are sampled on the rising edge of SCL. After 8 bits are

 2004 Microchip Technology Inc. Preliminary DS70083G-page 109

dsPIC30F
15.4.2 10-BIT MODE SLAVE RECEPTION vice the ISR and read the contents of the I2CRCV
before the master device can initiate another receive
Once addressed, the master can generate a Repeated
sequence. This will prevent buffer overruns from
Start, reset the high byte of the address and set the
occurring.
R_W bit without generating a Stop bit, thus initiating a
slave transmit operation.
Note 1: If the user reads the contents of the
I2CRCV, clearing the RBF bit before the
15.5 Automatic Clock Stretch
falling edge of the ninth clock, the
In the Slave modes, the module can synchronize buffer SCLREL bit will not be cleared and clock
reads and write to the master device by clock stretching. stretching will not occur.
2: The SCLREL bit can be set in software
15.5.1 TRANSMIT CLOCK STRETCHING regardless of the state of the RBF bit. The
Both 10-bit and 7-bit Transmit modes implement clock user should be careful to clear the RBF bit
stretching by asserting the SCLREL bit after the falling in the ISR before the next receive
edge of the ninth clock, if the TBF bit is cleared, indicat- sequence in order to prevent an overflow
ing the buffer is empty. condition.
In Slave Transmit modes, clock stretching is always
15.5.4 CLOCK STRETCHING DURING
performed irrespective of the STREN bit.
10-BIT ADDRESSING (STREN = 1)
Clock synchronization takes place following the ninth
Clock stretching takes place automatically during the
clock of the transmit sequence. If the device samples
addressing sequence. Because this module has a
an ACK on the falling edge of the ninth clock and if the
register for the entire address, it is not necessary for
TBF bit is still clear, then the SCLREL bit is automati-
the protocol to wait for the address to be updated.
cally cleared. The SCLREL being cleared to ‘0’ will
assert the SCL line low. The user’s ISR must set the After the address phase is complete, clock stretching
SCLREL bit before transmission is allowed to continue. will occur on each data receive or transmit sequence as
By holding the SCL line low, the user has time to ser- was described earlier.
vice the ISR and load the contents of the I2CTRN
before the master device can initiate another transmit 15.6 Software Controlled Clock
sequence. Stretching (STREN = 1)
Note 1: If the user loads the contents of I2CTRN, When the STREN bit is ‘1’, the SCLREL bit may be
setting the TBF bit before the falling edge cleared by software to allow software to control the
of the ninth clock, the SCLREL bit will not clock stretching. The logic will synchronize writes to the
be cleared and clock stretching will not SCLREL bit with the SCL clock. Clearing the SCLREL
occur. bit will not assert the SCL output until the module
2: The SCLREL bit can be set in software, detects a falling edge on the SCL output and SCL is
regardless of the state of the TBF bit. sampled low. If the SCLREL bit is cleared by the user
while the SCL line has been sampled low, the SCL out-
15.5.2 RECEIVE CLOCK STRETCHING put will be asserted (held low). The SCL output will
The STREN bit in the I2CCON register can be used to remain low until the SCLREL bit is set, and all other
enable clock stretching in Slave Receive mode. When devices on the I2C bus have de-asserted SCL. This
the STREN bit is set, the SCL pin will be held low at the ensures that a write to the SCLREL bit will not violate
end of each data receive sequence. the minimum high time requirement for SCL.
If the STREN bit is ‘0’, a software write to the SCLREL
15.5.3 CLOCK STRETCHING DURING bit will be disregarded and have no effect on the
7-BIT ADDRESSING (STREN = 1) SCLREL bit.
When the STREN bit is set in Slave Receive mode, the
SCL line is held low when the buffer register is full. The 15.7 Interrupts
method for stretching the SCL output is the same for
The I2C module generates two interrupt flags, MI2CIF
both 7 and 10-bit Addressing modes.
(I2C Master Interrupt Flag) and SI2CIF (I2C Slave Inter-
Clock stretching takes place following the ninth clock of rupt Flag). The MI2CIF interrupt flag is activated on
the receive sequence. On the falling edge of the ninth completion of a master message event. The SI2CIF
clock at the end of the ACK sequence, if the RBF bit is interrupt flag is activated on detection of a message
set, the SCLREL bit is automatically cleared, forcing directed to the slave.
the SCL output to be held low. The user’s ISR must set
the SCLREL bit before reception is allowed to continue.
By holding the SCL line low, the user has time to ser-

DS70083G-page 110 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
15.8 Slope Control 15.12 I2C Master Operation
The I2C standard requires slope control on the SDA The master device generates all of the serial clock
and SCL signals for Fast mode (400 kHz). The control pulses and the Start and Stop conditions. A transfer is
bit, DISSLW, enables the user to disable slew rate con- ended with a Stop condition or with a Repeated Start
trol if desired. It is necessary to disable the slew rate condition. Since the Repeated Start condition is also
control for 1 MHz mode. the beginning of the next serial transfer, the I2C bus will
not be released.
15.9 IPMI Support In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
The control bit, IPMIEN, enables the module to support
first byte transmitted contains the slave address of the
Intelligent Peripheral Management Interface (IPMI).
receiving device (7 bits) and the data direction bit. In
When this bit is set, the module accepts and acts upon
this case, the data direction bit (R_W) is logic ‘0’. Serial
all addresses.
data is transmitted 8 bits at a time. After each byte is
transmitted, an ACK bit is received. Start and Stop con-
15.10 General Call Address Support ditions are output to indicate the beginning and the end
The general call address can address all devices. of a serial transfer.
When this address is used, all devices should, in In Master Receive mode, the first byte transmitted con-
theory, respond with an Acknowledgement. tains the slave address of the transmitting device
The general call address is one of eight addresses (7 bits) and the data direction bit. In this case, the data
reserved for specific purposes by the I2C protocol. It direction bit (R_W) is logic ‘1’. Thus, the first byte trans-
consists of all ‘0’s with R_W = 0. mitted is a 7-bit slave address, followed by a ‘1’ to indi-
cate receive bit. Serial data is received via SDA while
The general call address is recognized when the Gen- SCL outputs the serial clock. Serial data is received
eral Call Enable (GCEN) bit is set (I2CCON<15> = 1). 8 bits at a time. After each byte is received, an ACK bit
Following a Start bit detection, 8 bits are shifted into is transmitted. Start and Stop conditions indicate the
I2CRSR and the address is compared with I2CADD, beginning and end of transmission.
and is also compared with the general call address
which is fixed in hardware. 15.12.1 I2C MASTER TRANSMISSION
If a general call address match occurs, the I2CRSR is Transmission of a data byte, a 7-bit address, or the sec-
transferred to the I2CRCV after the eighth clock, the ond half of a 10-bit address is accomplished by simply
RBF flag is set and on the falling edge of the ninth bit writing a value to I2CTRN register. The user should
(ACK bit), the master event interrupt flag (MI2CIF) is only write to I2CTRN when the module is in a WAIT
set. state. This action will set the Buffer Full Flag (TBF) and
When the interrupt is serviced, the source for the inter- allow the baud rate generator to begin counting and
rupt can be checked by reading the contents of the start the next transmission. Each bit of address/data
I2CRCV to determine if the address was device will be shifted out onto the SDA pin after the falling
specific or a general call address. edge of SCL is asserted. The Transmit Status Flag,
TRSTAT (I2CSTAT<14>), indicates that a master
15.11 I2C Master Support transmit is in progress.

As a master device, six operations are supported: 15.12.2 I2C MASTER RECEPTION
• Assert a Start condition on SDA and SCL. Master mode reception is enabled by programming the
• Assert a RESTART condition on SDA and SCL. Receive Enable bit, RCEN (I2CCON<11>). The I2C
• Write to the I2CTRN register initiating module must be Idle before the RCEN bit is set, other-
transmission of data/address. wise the RCEN bit will be disregarded. The baud rate
generator begins counting and on each rollover, the
• Generate a Stop condition on SDA and SCL.
state of the SCL pin ACK and data are shifted into the
• Configure the I2C port to receive data. I2CRSR on the rising edge of each clock.
• Generate an ACK condition at the end of a
received byte of data.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 111

dsPIC30F
15.12.3 BAUD RATE GENERATOR If a Start, RESTART, Stop or Acknowledge condition
2 was in progress when the bus collision occurred, the
In I C Master mode, the reload value for the BRG is
condition is aborted, the SDA and SCL lines are de-
located in the I2CBRG register. When the BRG is
asserted, and the respective control bits in the I2CCON
loaded with this value, the BRG counts down to ‘0’ and
register are cleared to ‘0’. When the user services the
stops until another reload has taken place. If clock arbi-
bus collision Interrupt Service Routine, and if the I2C
tration is taking place, for instance, the BRG is reloaded
bus is free, the user can resume communication by
when the SCL pin is sampled high.
asserting a Start condition.
As per the I2C standard, FSCL may be 100 kHz or
The master will continue to monitor the SDA and SCL
400 kHz. However, the user can specify any baud rate
pins, and if a Stop condition occurs, the MI2CIF bit will
up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal.
be set.
EQUATION 15-1: SERIAL CLOCK RATE A write to the I2CTRN will start the transmission of data
at the first data bit regardless of where the transmitter
left off when bus collision occurred.
I2CBRG = ( FFSCL
CY – FCY
1,111,111
) –1
In a multi-master environment, the interrupt generation
on the detection of Start and Stop conditions allows the
determination of when the bus is free. Control of the I2C
15.12.4 CLOCK ARBITRATION bus can be taken when the P bit is set in the I2CSTAT
Clock arbitration occurs when the master de-asserts register, or the bus is Idle and the S and P bits are
the SCL pin (SCL allowed to float high) during any cleared.
receive, transmit, or RESTART/Stop condition. When
the SCL pin is allowed to float high, the baud rate gen- 15.13 I2C Module Operation During CPU
erator (BRG) is suspended from counting until the SCL Sleep and Idle Modes
pin is actually sampled high. When the SCL pin is sam-
pled high, the baud rate generator is reloaded with the 15.13.1 I2C OPERATION DURING CPU
contents of I2CBRG and begins counting. This ensures SLEEP MODE
that the SCL high time will always be at least one BRG
When the device enters Sleep mode, all clock sources
rollover count in the event that the clock is held low by
to the module are shutdown and stay at logic ‘0’. If
an external device.
Sleep occurs in the middle of a transmission and the
15.12.5 MULTI-MASTER COMMUNICATION, state machine is partially into a transmission as the
clocks stop, then the transmission is aborted. Similarly,
BUS COLLISION, AND BUS
if Sleep occurs in the middle of a reception, then the
ARBITRATION
reception is aborted.
Multi-master operation support is achieved by bus arbi-
tration. When the master outputs address/data bits 15.13.2 I2C OPERATION DURING CPU IDLE
onto the SDA pin, arbitration takes place when the MODE
master outputs a ‘1’ on SDA by letting SDA float high
For the I2C, the I2CSIDL bit selects if the module will
while another master asserts a ‘0’. When the SCL pin
stop on Idle or continue on Idle. If I2CSIDL = 0, the
floats high, data should be stable. If the expected data
module will continue operation on assertion of the Idle
on SDA is a ‘1’ and the data sampled on the SDA
mode. If I2CSIDL = 1, the module will stop on Idle.
pin = 0, then a bus collision has taken place. The
master will set the MI2CIF pulse and reset the master
portion of the I2C port to its Idle state.
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the TBF flag is
cleared, the SDA and SCL lines are de-asserted and a
value can now be written to I2CTRN. When the user
services the I2C master event Interrupt Service Rou-
tine, if the I2C bus is free (i.e., the P bit is set), the user
can resume communication by asserting a Start
condition.

DS70083G-page 112 Preliminary  2004 Microchip Technology Inc.

 TABLE 15-1: I2C REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

I2CRCV 0200 — — — — — — — — Receive Register 0000 0000 0000 0000

I2CTRN 0202 — — — — — — — — Transmit Register 0000 0000 1111 1111
I2CBRG 0204 — — — — — — — Baud Rate Generator 0000 0000 0000 0000
I2CCON 0206 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 0001 0000 0000 0000
I2CSTAT 0208 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 0000 0000 0000
I2CADD 020A — — — — — — Address Register 0000 0000 0000 0000
Legend: u = uninitialized bit

 2004 Microchip Technology Inc.

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

Preliminary
dsPIC30F

DS70083G-page 113
dsPIC30F
NOTES:

DS70083G-page 114 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
16.0 UNIVERSAL ASYNCHRONOUS 16.1 UART Module Overview
RECEIVER TRANSMITTER The key features of the UART module are:
(UART) MODULE • Full-duplex, 8 or 9-bit data communication
Note: This data sheet summarizes features of this group • Even, odd or no parity options (for 8-bit data)
of dsPIC30F devices and is not intended to be a complete • One or two Stop bits
reference source. For more information on the CPU,
peripherals, register descriptions and general device • Fully integrated baud rate generator with 16-bit
functionality, refer to the dsPIC30F Family Reference prescaler
Manual (DS70046). • Baud rates range from 38 bps to 1.875 Mbps at a
This section describes the Universal Asynchronous 30 MHz instruction rate
Receiver/Transmitter Communications module. • 4-word deep transmit data buffer
• 4-word deep receive data buffer
• Parity, framing and buffer overrun error detection
• Support for interrupt only on address detect
(9th bit = 1)
• Separate transmit and receive interrupts
• Loopback mode for diagnostic support

FIGURE 16-1: UART TRANSMITTER BLOCK DIAGRAM

Internal Data Bus

Control and Status bits

Write Write

UTX8 UxTXREG Low Byte Transmit Control

– Control TSR
– Control Buffer
– Generate Flags
– Generate Interrupt

Load TSR
UxTXIF
UTXBRK

Data
Transmit Shift Register (UxTSR)
‘0’ (Start)
UxTX
‘1’ (Stop)

Parity 16x Baud Clock

Parity 16 Divider
Generator from Baud Rate
Generator

Control
Signals

Note: x = 1 or 2.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 115

dsPIC30F
FIGURE 16-2: UART RECEIVER BLOCK DIAGRAM

Internal Data Bus 16

Read Write Read Read Write

UxMODE UxSTA

URX8 UxRXREG Low Byte

Receive Buffer Control
– Generate Flags
– Generate Interrupt
– Shift Data Characters

LPBACK 8-9
From UxTX
1 Load RSR

FERR
to Buffer

PERR
Control
Receive Shift Register Signals
UxRX 0 (UxRSR)

· Start bit Detect

· Parity Check
· Stop bit Detect 16 Divider
· Shift Clock Generation
· Wake Logic

16x Baud Clock from

Baud Rate Generator
UxRXIF

DS70083G-page 116 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
16.2 Enabling and Setting Up UART 16.3 Transmitting Data
16.2.1 ENABLING THE UART 16.3.1 TRANSMITTING IN 8-BIT DATA
The UART module is enabled by setting the UARTEN MODE
bit in the UxMODE register (where x = 1 or 2). Once The following steps must be performed in order to
enabled, the UxTX and UxRX pins are configured as an transmit 8-bit data:
output and an input respectively, overriding the TRIS
1. Set up the UART:
and LATCH register bit settings for the corresponding
First, the data length, parity and number of Stop
I/O port pins. The UxTX pin is at logic ‘1’ when no
bits must be selected. Then, the transmit and
transmission is taking place.
receive interrupt enable and priority bits are
setup in the UxMODE and UxSTA registers.
16.2.2 DISABLING THE UART
Also, the appropriate baud rate value must be
The UART module is disabled by clearing the UARTEN written to the UxBRG register.
bit in the UxMODE register. This is the default state 2. Enable the UART by setting the UARTEN bit
after any Reset. If the UART is disabled, all I/O pins (UxMODE<15>).
operate as port pins under the control of the latch and
3. Set the UTXEN bit (UxSTA<10>), thereby
TRIS bits of the corresponding port pins.
enabling a transmission.
Disabling the UART module resets the buffers to empty 4. Write the byte to be transmitted to the lower byte
states. Any data characters in the buffers are lost and of UxTXREG. The value will be transferred to the
the baud rate counter is reset. Transmit Shift register (UxTSR) immediately
All error and status flags associated with the UART and the serial bit stream will start shifting out
module are reset when the module is disabled. The during the next rising edge of the baud clock.
URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and Alternatively, the data byte may be written while
UTXBF bits are cleared, whereas RIDLE and TRMT UTXEN = 0, following which, the user may set
are set. Other control bits, including ADDEN, UTXEN. This will cause the serial bit stream to
URXISEL<1:0>, UTXISEL, as well as the UxMODE begin immediately because the baud clock will
and UxBRG registers, are not affected. start from a cleared state.
Clearing the UARTEN bit while the UART is active will 5. A transmit interrupt will be generated, depend-
abort all pending transmissions and receptions and ing on the value of the interrupt control bit
reset the module as defined above. Re-enabling the UTXISEL (UxSTA<15>).
UART will restart the UART in the same configuration.
16.3.2 TRANSMITTING IN 9-BIT DATA
16.2.3 ALTERNATE I/O MODE
The alternate I/O function is enabled by setting the The sequence of steps involved in the transmission of
ALTIO bit (UxMODE<10>). If ALTIO = 1, the UxATX 9-bit data is similar to 8-bit transmission, except that a
and UxARX pins (alternate transmit and alternate 16-bit data word (of which the upper 7 bits are always
receive pins, respectively) are used by the UART mod- clear) must be written to the UxTXREG register.
ule instead of the UxTX and UxRX pins. If ALTIO = 0,
the UxTX and UxRX pins are used by the UART 16.3.3 TRANSMIT BUFFER (UXTXB)
module. The transmit buffer is 9 bits wide and 4 characters
deep. Including the Transmit Shift register (UxTSR),
16.2.4 SETTING UP DATA, PARITY AND the user effectively has a 5-deep FIFO (First-In, First-
STOP BIT SELECTIONS Out) buffer. The UTXBF status bit (UxSTA<9>)
Control bits PDSEL<1:0> in the UxMODE register are indicates whether the transmit buffer is full.
used to select the data length and parity used in the If a user attempts to write to a full buffer, the new data
transmission. The data length may either be 8 bits with will not be accepted into the FIFO, and no data shift will
even, odd or no parity, or 9 bits with no parity. occur within the buffer. This enables recovery from a
The STSEL bit determines whether one or two Stop bits buffer overrun condition.
will be used during data transmission. The FIFO is reset during any device Reset but is not
The default (power-on) setting of the UART is 8 bits, no affected when the device enters or wakes up from a
parity and 1 Stop bit (typically represented as 8, N, 1). Power Saving mode.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 117

dsPIC30F
16.3.4 TRANSMIT INTERRUPT 16.4.2 RECEIVE BUFFER (UXRXB)
The transmit interrupt flag (U1TXIF or U2TXIF) is The receive buffer is 4 words deep. Including the
located in the corresponding interrupt flag register. Receive Shift register (UxRSR), the user effectively
The transmitter generates an edge to set the UxTXIF has a 5-word deep FIFO buffer.
bit. The condition for generating the interrupt depends URXDA (UxSTA<0>) = 1 indicates that the receive
on the UTXISEL control bit: buffer has data available. URXDA = 0 implies that the
a) If UTXISEL = 0, an interrupt is generated when buffer is empty. If a user attempts to read an empty
a word is transferred from the transmit buffer to buffer, the old values in the buffer will be read and no
the Transmit Shift register (UxTSR). This implies data shift will occur within the FIFO.
that the transmit buffer has at least one empty The FIFO is reset during any device Reset. It is not
word. affected when the device enters or wakes up from a
b) If UTXISEL = 1, an interrupt is generated when Power Saving mode.
a word is transferred from the transmit buffer to
the Transmit Shift register (UxTSR) and the 16.4.3 RECEIVE INTERRUPT
transmit buffer is empty. The receive interrupt flag (U1RXIF or U2RXIF) can be
Switching between the two Interrupt modes during read from the corresponding interrupt flag register. The
operation is possible and sometimes offers more interrupt flag is set by an edge generated by the
flexibility. receiver. The condition for setting the receive interrupt
flag depends on the settings specified by the
16.3.5 TRANSMIT BREAK URXISEL<1:0> (UxSTA<7:6>) control bits.
Setting the UTXBRK bit (UxSTA<11>) will cause the a) If URXISEL<1:0> = 00 or 01, an interrupt is gen-
UxTX line to be driven to logic ‘0’. The UTXBRK bit erated every time a data word is transferred
overrides all transmission activity. Therefore, the user from the Receive Shift register (UxRSR) to the
should generally wait for the transmitter to be Idle receive buffer. There may be one or more
before setting UTXBRK. characters in the receive buffer.
To send a break character, the UTXBRK bit must be set b) If URXISEL<1:0> = 10, an interrupt is generated
by software and must remain set for a minimum of 13 when a word is transferred from the Receive Shift
baud clock cycles. The UTXBRK bit is then cleared by register (UxRSR) to the receive buffer, which as a
software to generate Stop bits. The user must wait for result of the transfer, contains 3 characters.
a duration of at least one or two baud clock cycles in c) If URXISEL<1:0> = 11, an interrupt is set when
order to ensure a valid Stop bit(s) before reloading the a word is transferred from the Receive Shift reg-
UxTXB, or starting other transmitter activity. Transmis- ister (UxRSR) to the receive buffer, which as a
sion of a break character does not generate a transmit result of the transfer, contains 4 characters (i.e.,
interrupt. becomes full).
Switching between the Interrupt modes during opera-
16.4 Receiving Data tion is possible, though generally not advisable during
normal operation.
16.4.1 RECEIVING IN 8-BIT OR 9-BIT
DATA MODE 16.5 Reception Error Handling
The following steps must be performed while receiving
8-bit or 9-bit data: 16.5.1 RECEIVE BUFFER OVERRUN
ERROR (OERR BIT)
1. Set up the UART (see Section 16.3.1).
2. Enable the UART (see Section 16.3.1). The OERR bit (UxSTA<1>) is set if all of the following
conditions occur:
3. A receive interrupt will be generated when one
or more data words have been received, a) The receive buffer is full.
depending on the receive interrupt settings b) The Receive Shift register is full, but unable to
specified by the URXISEL bits (UxSTA<7:6>). transfer the character to the receive buffer.
4. Read the OERR bit to determine if an overrun c) The Stop bit of the character in the UxRSR is
error has occurred. The OERR bit must be reset detected, indicating that the UxRSR needs to
in software. transfer the character to the buffer.
5. Read the received data from UxRXREG. The act Once OERR is set, no further data is shifted in UxRSR
of reading UxRXREG will move the next word to (until the OERR bit is cleared in software or a Reset
the top of the receive FIFO, and the PERR and occurs). The data held in UxRSR and UxRXREG
FERR values will be updated. remains valid.

DS70083G-page 118 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
16.5.2 FRAMING ERROR (FERR) 16.6 Address Detect Mode
The FERR bit (UxSTA<2>) is set if a ‘0’ is detected Setting the ADDEN bit (UxSTA<5>) enables this spe-
instead of a Stop bit. If two Stop bits are selected, both cial mode in which a 9th bit (URX8) value of ‘1’ identi-
Stop bits must be ‘1’, otherwise FERR will be set. The fies the received word as an address, rather than data.
read only FERR bit is buffered along with the received This mode is only applicable for 9-bit data communica-
data. It is cleared on any Reset. tion. The URXISEL control bit does not have any
impact on interrupt generation in this mode since an
16.5.3 PARITY ERROR (PERR) interrupt (if enabled) will be generated every time the
The PERR bit (UxSTA<3>) is set if the parity of the received word has the 9th bit set.
received word is incorrect. This error bit is applicable
only if a Parity mode (odd or even) is selected. The 16.7 Loopback Mode
read only PERR bit is buffered along with the received
data bytes. It is cleared on any Reset. Setting the LPBACK bit enables this special mode in
which the UxTX pin is internally connected to the UxRX
16.5.4 IDLE STATUS pin. When configured for the Loopback mode, the
UxRX pin is disconnected from the internal UART
When the receiver is active (i.e., between the initial
receive logic. However, the UxTX pin still functions as
detection of the Start bit and the completion of the Stop
in a normal operation.
bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between the com-
pletion of the Stop bit and detection of the next Start bit, To select this mode:
the RIDLE bit is ‘1’, indicating that the UART is Idle. a) Configure UART for desired mode of operation.
b) Set LPBACK = 1 to enable Loopback mode.
16.5.5 RECEIVE BREAK
c) Enable transmission as defined in Section 16.3.
The receiver will count and expect a certain number of
bit times based on the values programmed in the
PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>)
16.8 Baud Rate Generator
bits. The UART has a 16-bit baud rate generator to allow
If the break is longer than 13 bit times, the reception is maximum flexibility in baud rate generation. The baud
considered complete after the number of bit times rate generator register (UxBRG) is readable and
specified by PDSEL and STSEL. The URXDA bit is set, writable. The baud rate is computed as follows:
FERR is set, zeros are loaded into the receive FIFO, BRG = 16-bit value held in UxBRG register
interrupts are generated if appropriate and the RIDLE (0 through 65535)
bit is set.
FCY = Instruction Clock Rate (1/TCY)
When the module receives a long break signal and the
The Baud Rate is given by Equation 16-1.
receiver has detected the Start bit, the data bits and the
invalid Stop bit (which sets the FERR), the receiver
must wait for a valid Stop bit before looking for the next EQUATION 16-1: BAUD RATE
Start bit. It cannot assume that the break condition on
Baud Rate = FCY / (16*(BRG+1))
the line is the next Start bit.
Break is regarded as a character containing all ‘0’s with
the FERR bit set. The break character is loaded into the Therefore, the maximum baud rate possible is
buffer. No further reception can occur until a Stop bit is FCY /16 (if BRG = 0),
received. Note that RIDLE goes high when the Stop bit
has not yet been received. and the minimum baud rate possible is
FCY / (16* 65536).
With a full 16-bit baud rate generator at 30 MIPs
operation, the minimum baud rate achievable is
28.5 bps.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 119

dsPIC30F
16.9 Auto Baud Support 16.10.2 UART OPERATION DURING CPU
IDLE MODE
To allow the system to determine baud rates of
received characters, the input can be optionally linked For the UART, the USIDL bit selects if the module will
to a capture input (IC1 for UART1, IC2 for UART2). To stop operation when the device enters Idle mode or
enable this mode, the user must program the input cap- whether the module will continue on Idle. If USIDL = 0,
ture module to detect the falling and rising edges of the the module will continue operation during Idle mode. If
Start bit. USIDL = 1, the module will stop on Idle.

16.10 UART Operation During CPU

Sleep and Idle Modes
16.10.1 UART OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’. If entry
into Sleep mode occurs while a transmission is in
progress, then the transmission is aborted. The UxTX
pin is driven to logic ‘1’. Similarly, if entry into Sleep
mode occurs while a reception is in progress, then the
reception is aborted. The UxSTA, UxMODE, transmit
and receive registers and buffers, and the UxBRG
register are not affected by Sleep mode.
If the WAKE bit (UxSTA<7>) is set before the device
enters Sleep mode, then a falling edge on the UxRX pin
will generate a receive interrupt. The Receive Interrupt
Select mode bit (URXISEL) has no effect for this func-
tion. If the receive interrupt is enabled, then this will
wake-up the device from Sleep. The UARTEN bit must
be set in order to generate a wake-up interrupt.

DS70083G-page 120 Preliminary  2004 Microchip Technology Inc.

 TABLE 16-1: UART1 REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

U1MODE 020C UARTEN — USIDL — — ALTIO — — WAKE LPBACK ABAUD — — PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000
U1STA 020E UTXISEL — — — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000
U1TXREG 0210 — — — — — — — UTX8 Transmit Register 0000 000u uuuu uuuu
U1RXREG 0212 — — — — — — — URX8 Receive Register 0000 0000 0000 0000
U1BRG 0214 Baud Rate Generator Prescaler 0000 0000 0000 0000
Legend: u = uninitialized bit

 2004 Microchip Technology Inc.

TABLE 16-2: UART2 REGISTER MAP
SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Name

U2MODE 0216 UARTEN — USIDL — — — — — WAKE LPBACK ABAUD — — PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000
U2STA 0218 UTXISEL — — — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000
U2TXREG 021A — — — — — — — UTX8 Transmit Register 0000 000u uuuu uuuu
U2RXREG 021C — — — — — — — URX8 Receive Register 0000 0000 0000 0000
U2BRG 021E Baud Rate Generator Prescaler 0000 0000 0000 0000
Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

Preliminary
dsPIC30F

DS70083G-page 121
dsPIC30F
NOTES:

DS70083G-page 122 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
17.0 CAN MODULE The CAN bus module consists of a protocol engine and
message buffering/control. The CAN protocol engine
Note: This data sheet summarizes features of this group handles all functions for receiving and transmitting
of dsPIC30F devices and is not intended to be a complete messages on the CAN bus. Messages are transmitted
reference source. For more information on the CPU,
peripherals, register descriptions and general device
by first loading the appropriate data registers. Status
functionality, refer to the dsPIC30F Family Reference and errors can be checked by reading the appropriate
Manual (DS70046). registers. Any message detected on the CAN bus is
checked for errors and then matched against filters to
17.1 Overview see if it should be received and stored in one of the
receive registers.
The Controller Area Network (CAN) module is a serial
interface, useful for communicating with other CAN 17.2 Frame Types
modules or microcontroller devices. This interface/
protocol was designed to allow communications within The CAN module transmits various types of frames
noisy environments. which include data messages or remote transmission
The CAN module is a communication controller imple- requests initiated by the user, as other frames that are
menting the CAN 2.0 A/B protocol, as defined in the automatically generated for control purposes. The
BOSCH specification. The module will support following frame types are supported:
CAN 1.2, CAN 2.0A, CAN 2.0B Passive, and CAN 2.0B • Standard Data Frame:
Active versions of the protocol. The module implemen- A standard data frame is generated by a node
tation is a full CAN system. The CAN specification is when the node wishes to transmit data. It includes
not covered within this data sheet. The reader may an 11-bit standard identifier (SID) but not an 18-bit
refer to the BOSCH CAN specification for further extended identifier (EID).
details.
• Extended Data Frame:
The module features are as follows:
An extended data frame is similar to a standard
• Implementation of the CAN protocol CAN 1.2, data frame but includes an extended identifier as
CAN 2.0A and CAN 2.0B well.
• Standard and extended data frames
• Remote Frame:
• 0-8 bytes data length
It is possible for a destination node to request the
• Programmable bit rate up to 1 Mbit/sec data from the source. For this purpose, the desti-
• Support for remote frames nation node sends a remote frame with an identi-
• Double-buffered receiver with two prioritized fier that matches the identifier of the required data
received message storage buffers (each buffer frame. The appropriate data source node will then
may contain up to 8 bytes of data) send a data frame as a response to this remote
• 6 full (standard/extended identifier) acceptance request.
filters, 2 associated with the high priority receive • Error Frame:
buffer and 4 associated with the low priority
An error frame is generated by any node that
receive buffer
detects a bus error. An error frame consists of 2
• 2 full acceptance filter masks, one each fields: an error flag field and an error delimiter
associated with the high and low priority receive field.
buffers
• Three transmit buffers with application specified • Overload Frame:
prioritization and abort capability (each buffer may An overload frame can be generated by a node as
contain up to 8 bytes of data) a result of 2 conditions. First, the node detects a
• Programmable wake-up functionality with dominant bit during interframe space which is an
integrated low-pass filter illegal condition. Second, due to internal condi-
tions, the node is not yet able to start reception of
• Programmable Loopback mode supports self-test
the next message. A node may generate a maxi-
operation
mum of 2 sequential overload frames to delay the
• Signaling via interrupt capabilities for all CAN start of the next message.
receiver and transmitter error states
• Programmable clock source • Interframe Space:
• Programmable link to Input Capture module (IC2, Interframe space separates a proceeding frame
for both CAN1 and CAN2) for time-stamping and (of whatever type) from a following data or remote
network synchronization frame.
• Low power Sleep and Idle mode

 2004 Microchip Technology Inc. Preliminary DS70083G-page 123

dsPIC30F
FIGURE 17-1: CAN BUFFERS AND PROTOCOL ENGINE BLOCK DIAGRAM

Acceptance Mask
BUFFERS RXM1

Acceptance Filter
RXF2

Acceptance Mask Acceptance Filter A

TXB0 TXB1 TXB2 c
RXM0 RXF3
A c
c Acceptance Filter Acceptance Filter e
MESSAGE

MESSAGE

MESSAGE
MTXBUFF

MTXBUFF

MTXBUFF
MSGREQ

MSGREQ

MSGREQ
TXLARB

TXLARB

TXLARB
c RXF0 RXF4 p
TXERR

TXERR

TXERR
TXABT

TXABT

TXABT
e t
Acceptance Filter Acceptance Filter
p
RXF1 RXF5
t

R R
X Identifier M Identifier X
Message B A B
Queue 0 B 1
Control
Transmit Byte Sequencer Data Field Data Field

Receive RERRCNT
Error

PROTOCOL Counter
TERRCNT

ENGINE Transmit Err Pas

Error Bus Off
Counter

Transmit Shift Receive Shift

Protocol
Finite
CRC Generator CRC Check
State
Machine

Bit
Transmit
Timing Bit Timing
Logic
Logic Generator

CiTX(1) CiRX(1)

Note 1: i = 1 or 2 refers to a particular CAN module (CAN1 or CAN2).

DS70083G-page 124 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
17.3 Modes of Operation The module can be programmed to apply a low-pass
filter function to the CiRX input line while the module or
The CAN module can operate in one of several Operation the CPU is in Sleep mode. The WAKFIL bit
modes selected by the user. These modes include: (CiCFG2<14>) enables or disables the filter.
• Initialization Mode
• Disable Mode Note: Typically, if the CAN module is allowed to
transmit in a particular mode of operation
• Normal Operation Mode
and a transmission is requested immedi-
• Listen Only Mode
ately after the CAN module has been
• Loopback Mode placed in that mode of operation, the mod-
• Error Recognition Mode ule waits for 11 consecutive recessive bits
Modes are requested by setting the REQOP<2:0> bits on the bus before starting transmission. If
(CiCTRL<10:8>), except the Error Recognition mode the user switches to Disable Mode within
which is requested through the RXM<1:0> bits this 11-bit period, then this transmission is
(CiRXnCON<6:5>, where n = 0 or 1 represents a par- aborted and the corresponding TXABT bit
ticular receive buffer). Entry into a mode is Acknowl- is set and TXREQ bit is cleared.
edged by monitoring the OPMODE<2:0> bits
(CiCTRL<7:5>). The module will not change the mode 17.3.3 NORMAL OPERATION MODE
and the OPMODE bits until a change in mode is Normal Operating mode is selected when
acceptable, generally during bus Idle time which is REQOP<2:0> = 000. In this mode, the module is acti-
defined as at least 11 consecutive recessive bits. vated and the I/O pins will assume the CAN bus func-
tions. The module will transmit and receive CAN bus
17.3.1 INITIALIZATION MODE
messages via the CxTX and CxRX pins.
In the Initialization mode, the module will not transmit or
receive. The error counters are cleared and the inter- 17.3.4 LISTEN ONLY MODE
rupt flags remain unchanged. The programmer will If the Listen Only mode is activated, the module on the
have access to configuration registers that are access CAN bus is passive. The transmitter buffers revert to
restricted in other modes. The module will protect the the port I/O function. The receive pins remain inputs.
user from accidentally violating the CAN protocol For the receiver, no error flags or Acknowledge signals
through programming errors. All registers which control are sent. The error counters are deactivated in this
the configuration of the module can not be modified state. The Listen Only mode can be used for detecting
while the module is on-line. The CAN module will not the baud rate on the CAN bus. To use this, it is neces-
be allowed to enter the Configuration mode while a sary that there are at least two further nodes that
transmission is taking place. The Configuration mode communicate with each other.
serves as a lock to protect the following registers.
• All Module Control Registers 17.3.5 LISTEN ALL MESSAGES MODE
• Baud Rate and Interrupt Configuration Registers The module can be set to ignore all errors and receive
• Bus Timing Registers any message. The Error Recognition mode is activated
• Identifier Acceptance Filter Registers by setting REQOP<2:0> = 111. In this mode, the data
• Identifier Acceptance Mask Registers which is in the message assembly buffer until the time
an error occurred, is copied in the receive buffer and
17.3.2 DISABLE MODE can be read via the CPU interface.
In Disable mode, the module will not transmit or
17.3.6 LOOPBACK MODE
receive. The module has the ability to set the WAKIF bit
due to bus activity, however, any pending interrupts will If the Loopback mode is activated, the module will con-
remain and the error counters will retain their value. nect the internal transmit signal to the internal receive
signal at the module boundary. The transmit and
If the REQOP<2:0> bits (CiCTRL<10:8>) = 001, the
receive pins revert to their port I/O function.
module will enter the Module Disable mode. If the module
is active, the module will wait for 11 recessive bits on the
CAN bus, detect that condition as an Idle bus, then
accept the module disable command. When the
OPMODE<2:0> bits (CiCTRL<7:5>) = 001, that indi-
cates whether the module successfully went into Module
Disable mode. The I/O pins will revert to normal I/O
function when the module is in the Module Disable mode.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 125

dsPIC30F
17.4 Message Reception 17.4.4 RECEIVE OVERRUN
An overrun condition occurs when the Message
17.4.1 RECEIVE BUFFERS
Assembly Buffer (MAB) has assembled a valid
The CAN bus module has 3 receive buffers. However, received message, the message is accepted through
one of the receive buffers is always committed to mon- the acceptance filters, and when the receive buffer
itoring the bus for incoming messages. This buffer is associated with the filter has not been designated as
called the Message Assembly Buffer (MAB). So there clear of the previous message.
are 2 receive buffers visible, RXB0 and RXB1, that can
The overrun error flag, RXnOVR (CiINTF<15> or
essentially instantaneously receive a complete
CiINTF<14>), and the ERRIF bit (CiINTF<5>) will be
message from the protocol engine.
set and the message in the MAB will be discarded.
All messages are assembled by the MAB and are trans-
If the DBEN bit is clear, RXB1 and RXB0 operate inde-
ferred to the RXBn buffers only if the acceptance filter
pendently. When this is the case, a message intended
criterion are met. When a message is received, the
for RXB0 will not be diverted into RXB1 if RXB0 con-
RXnIF flag (CiINTF<0> or CiINRF<1>) will be set. This
tains an unread message and the RX0OVR bit will be
bit can only be set by the module when a message is
set.
received. The bit is cleared by the CPU when it has com-
pleted processing the message in the buffer. If the If the DBEN bit is set, the overrun for RXB0 is handled
RXnIE bit (CiINTE<0> or CiINTE<1>) is set, an interrupt differently. If a valid message is received for RXB0 and
will be generated when a message is received. RXFUL = 1 indicates that RXB0 is full and RXFUL = 0
indicates that RXB1 is empty, the message for RXB0
RXF0 and RXF1 filters with RXM0 mask are associated
will be loaded into RXB1. An overrun error will not be
with RXB0. The filters RXF2, RXF3, RXF4, and RXF5
generated for RXB0. If a valid message is received for
and the mask RXM1 are associated with RXB1.
RXB0 and RXFUL = 1, indicating that both RXB0 and
RXB1 are full, the message will be lost and an overrun
17.4.2 MESSAGE ACCEPTANCE FILTERS
will be indicated for RXB1.
The message acceptance filters and masks are used to
determine if a message in the message assembly 17.4.5 RECEIVE ERRORS
buffer should be loaded into either of the receive buff-
The CAN module will detect the following receive
ers. Once a valid message has been received into the
errors:
Message Assembly Buffer (MAB), the identifier fields of
the message are compared to the filter values. If there • Cyclic Redundancy Check (CRC) Error
is a match, that message will be loaded into the • Bit Stuffing Error
appropriate receive buffer. • Invalid Message Receive Error
The acceptance filter looks at incoming messages for These receive errors do not generate an interrupt.
the RXIDE bit (CiRXnSID<0>) to determine how to However, the receive error counter is incremented by
compare the identifiers. If the RXIDE bit is clear, the one in case one of these errors occur. The RXWAR bit
message is a standard frame and only filters with the (CiINTF<9>) indicates that the receive error counter
EXIDE bit (CiRXFnSID<0>) clear are compared. If the has reached the CPU warning limit of 96 and an
RXIDE bit is set, the message is an extended frame, interrupt is generated.
and only filters with the EXIDE bit set are compared.
Configuring the RXM<1:0> bits to ‘01’ or ‘10’ can 17.4.6 RECEIVE INTERRUPTS
override the EXIDE bit.
Receive interrupts can be divided into 3 major groups,
each including various conditions that generate
17.4.3 MESSAGE ACCEPTANCE FILTER
interrupts:
MASKS
• Receive Interrupt:
The mask bits essentially determine which bits to apply
the filter to. If any mask bit is set to a zero, then that bit A message has been successfully received and
will automatically be accepted regardless of the filter loaded into one of the receive buffers. This inter-
bit. There are 2 programmable acceptance filter masks rupt is activated immediately after receiving the
associated with the receive buffers, one for each buffer. End of Frame (EOF) field. Reading the RXnIF flag
will indicate which receive buffer caused the
interrupt.
• Wake-up Interrupt:
The CAN module has woken up from Disable
mode or the device has woken up from Sleep
mode.

DS70083G-page 126 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
• Receive Error Interrupts: Setting TXREQ bit simply flags a message buffer as
A receive error interrupt will be indicated by the enqueued for transmission. When the module detects
ERRIF bit. This bit shows that an error condition an available bus, it begins transmitting the message
occurred. The source of the error can be deter- which has been determined to have the highest priority.
mined by checking the bits in the CAN Interrupt If the transmission completes successfully on the first
Status register, CiINTF. attempt, the TXREQ bit is cleared automatically, and an
- Invalid Message Received: interrupt is generated if TXIE was set.
If any type of error occurred during reception of If the message transmission fails, one of the error con-
the last message, an error will be indicated by dition flags will be set, and the TXREQ bit will remain
the IVRIF bit. set indicating that the message is still pending for trans-
mission. If the message encountered an error condition
- Receiver Overrun: during the transmission attempt, the TXERR bit will be
The RXnOVR bit indicates that an overrun set, and the error condition may cause an interrupt. If
condition occurred. the message loses arbitration during the transmission
attempt, the TXLARB bit is set. No interrupt is
- Receiver Warning:
generated to signal the loss of arbitration.
The RXWAR bit indicates that the receive error
counter (RERRCNT<7:0>) has reached the 17.5.4 ABORTING MESSAGE
warning limit of 96. TRANSMISSION
- Receiver Error Passive: The system can also abort a message by clearing the
The RXEP bit indicates that the receive error TXREQ bit associated with each message buffer. Set-
counter has exceeded the error passive limit of ting the ABAT bit (CiCTRL<12>) will request an abort of
127 and the module has gone into error passive all pending messages. If the message has not yet
state. started transmission, or if the message started but is
interrupted by loss of arbitration or an error, the abort
17.5 Message Transmission will be processed. The abort is indicated when the
module sets the TXABT bit and the TXnIF flag is not
17.5.1 TRANSMIT BUFFERS automatically set.
The CAN module has three transmit buffers. Each of 17.5.5 TRANSMISSION ERRORS
the three buffers occupies 14 bytes of data. Eight of the
bytes are the maximum 8 bytes of the transmitted mes- The CAN module will detect the following transmission
sage. Five bytes hold the standard and extended errors:
identifiers and other message arbitration information. • Acknowledge Error
• Form Error
17.5.2 TRANSMIT MESSAGE PRIORITY
• Bit Error
Transmit priority is a prioritization within each node of
the pending transmittable messages. There are These transmission errors will not necessarily generate
4 levels of transmit priority. If TXPRI<1:0> an interrupt but are indicated by the transmission error
(CiTXnCON<1:0>, where n = 0, 1 or 2 represents a par- counter. However, each of these errors will cause the
ticular transmit buffer) for a particular message buffer is transmission error counter to be incremented by one.
set to ‘11’, that buffer has the highest priority. If Once the value of the error counter exceeds the value
TXPRI<1:0> for a particular message buffer is set to of 96, the ERRIF (CiINTF<5>) and the TXWAR bit
‘10’ or ‘01’, that buffer has an intermediate priority. If (CiINTF<10>) are set. Once the value of the error
TXPRI<1:0> for a particular message buffer is ‘00’, that counter exceeds the value of 96, an interrupt is
buffer has the lowest priority. generated and the TXWAR bit in the Error Flag register
is set.
17.5.3 TRANSMISSION SEQUENCE
To initiate transmission of the message, the TXREQ bit
(CiTXnCON<3>) must be set. The CAN bus module
resolves any timing conflicts between setting of the
TXREQ bit and the Start of Frame (SOF), ensuring that if
the priority was changed, it is resolved correctly before the
SOF occurs. When TXREQ is set, the TXABT
(CiTXnCON<6>), TXLARB (CiTXnCON<5>) and TXERR
(CiTXnCON<4>) flag bits are automatically cleared.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 127

dsPIC30F
17.5.6 TRANSMIT INTERRUPTS 17.6 Baud Rate Setting
Transmit interrupts can be divided into 2 major groups, All nodes on any particular CAN bus must have the
each including various conditions that generate same nominal bit rate. In order to set the baud rate, the
interrupts: following parameters have to be initialized:
• Transmit Interrupt: • Synchronization Jump Width
At least one of the three transmit buffers is empty • Baud Rate Prescaler
(not scheduled) and can be loaded to schedule a
• Phase Segments
message for transmission. Reading the TXnIF
flags will indicate which transmit buffer is available • Length determination of Phase Segment 2
and caused the interrupt. • Sample Point
• Propagation Segment bits
• Transmit Error Interrupts:
A transmission error interrupt will be indicated by 17.6.1 BIT TIMING
the ERRIF flag. This flag shows that an error con-
All controllers on the CAN bus must have the same
dition occurred. The source of the error can be
baud rate and bit length. However, different controllers
determined by checking the error flags in the CAN
are not required to have the same master oscillator
Interrupt Status register, CiINTF. The flags in this
clock. At different clock frequencies of the individual
register are related to receive and transmit errors.
controllers, the baud rate has to be adjusted by
- Transmitter Warning Interrupt: adjusting the number of time quanta in each segment.
The TXWAR bit indicates that the transmit error The nominal bit time can be thought of as being divided
counter has reached the CPU warning limit of into separate non-overlapping time segments. These
96. segments are shown in Figure 17-2.
- Transmitter Error Passive: • Synchronization Segment (Sync Seg)
The TXEP bit (CiINTF<12>) indicates that the • Propagation Time Segment (Prop Seg)
transmit error counter has exceeded the error • Phase Segment 1 (Phase1 Seg)
passive limit of 127 and the module has gone to • Phase Segment 2 (Phase2 Seg)
error passive state.
The time segments and also the nominal bit time are
- Bus Off: made up of integer units of time called time quanta or
The TXBO bit (CiINTF<13>) indicates that the TQ. By definition, the nominal bit time has a minimum
transmit error counter has exceeded 255 and of 8 TQ and a maximum of 25 TQ. Also, by definition,
the module has gone to the bus off state. the minimum nominal bit time is 1 µsec corresponding
to a maximum bit rate of 1 MHz.

FIGURE 17-2: CAN BIT TIMING

Input Signal

Prop Phase Phase

Sync Segment Segment 1 Segment 2 Sync

Sample Point

TQ

DS70083G-page 128 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
17.6.2 PRESCALER SETTING 17.6.5 SAMPLE POINT
There is a programmable prescaler with integral values The sample point is the point of time at which the bus
ranging from 1 to 64, in addition to a fixed divide-by-2 level is read and interpreted as the value of that respec-
for clock generation. The time quantum (TQ) is a fixed tive bit. The location is at the end of Phase1 Seg. If the
unit of time derived from the oscillator period, and is bit timing is slow and contains many TQ, it is possible to
given by Equation 17-1, where FCAN is FCY (if the CAN- specify multiple sampling of the bus line at the sample
CKS bit is set) or 4FCY (if CANCKS is clear). point. The level determined by the CAN bus then corre-
sponds to the result from the majority decision of three
Note: FCAN must not exceed 30 MHz. If
values. The majority samples are taken at the sample
CANCKS = 0, then FCY must not exceed
point and twice before with a distance of TQ/2. The
7.5 MHz.
CAN module allows the user to choose between sam-
pling three times at the same point or once at the same
EQUATION 17-1: TIME QUANTUM FOR point, by setting or clearing the SAM bit (CiCFG2<6>).
CLOCK GENERATION
Typically, the sampling of the bit should take place at
about 60 - 70% through the bit time, depending on the
TQ = 2 (BRP<5:0> + 1) / FCAN
system parameters.

17.6.6 SYNCHRONIZATION
17.6.3 PROPAGATION SEGMENT
To compensate for phase shifts between the oscillator
This part of the bit time is used to compensate physical
frequencies of the different bus stations, each CAN
delay times within the network. These delay times con-
controller must be able to synchronize to the relevant
sist of the signal propagation time on the bus line and
signal edge of the incoming signal. When an edge in
the internal delay time of the nodes. The Prop Seg can
the transmitted data is detected, the logic will compare
be programmed from 1 TQ to 8 TQ by setting the
the location of the edge to the expected time (Synchro-
PRSEG<2:0> bits (CiCFG2<2:0>).
nous Segment). The circuit will then adjust the values
of Phase1 Seg and Phase2 Seg. There are 2
17.6.4 PHASE SEGMENTS
mechanisms used to synchronize.
The phase segments are used to optimally locate the
sampling of the received bit within the transmitted bit 17.6.6.1 Hard Synchronization
time. The sampling point is between Phase1 Seg and
Hard synchronization is only done whenever there is a
Phase2 Seg. These segments are lengthened or short-
‘recessive’ to ‘dominant’ edge during bus Idle indicating
ened by resynchronization. The end of the Phase1 Seg
the start of a message. After hard synchronization, the
determines the sampling point within a bit period. The
bit time counters are restarted with the Sync Seg. Hard
segment is programmable from 1 TQ to 8 TQ. Phase2
synchronization forces the edge which has caused the
Seg provides delay to the next transmitted data transi-
hard synchronization to lie within the synchronization
tion. The segment is programmable from 1 TQ to 8 TQ,
segment of the restarted bit time. If a hard synchroniza-
or it may be defined to be equal to the greater of
tion is done, there will not be a resynchronization within
Phase1 Seg or the information processing time (2 TQ).
that bit time.
The Phase1 Seg is initialized by setting bits
SEG1PH<2:0> (CiCFG2<5:3>), and Phase2 Seg is 17.6.6.2 Resynchronization
initialized by setting SEG2PH<2:0> (CiCFG2<10:8>).
As a result of resynchronization, Phase1 Seg may be
The following requirement must be fulfilled while setting lengthened or Phase2 Seg may be shortened. The
the lengths of the phase segments: amount of lengthening or shortening of the phase
Prop Seg + Phase1 Seg > = Phase2 Seg buffer segment has an upper bound known as the syn-
chronization jump width, and is specified by the
SJW<1:0> bits (CiCFG1<7:6>). The value of the syn-
chronization jump width will be added to Phase1 Seg or
subtracted from Phase2 Seg. The resynchronization
jump width is programmable between 1 TQ and 4 TQ.
The following requirement must be fulfilled while setting
the SJW<1:0> bits:
Phase2 Seg > Synchronization Jump Width

 2004 Microchip Technology Inc. Preliminary DS70083G-page 129

 TABLE 17-1: CAN1 REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

C1RXF0SID 0300 — — — Receive Acceptance Filter 0 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u
C1RXF0EIDH 0302 — — — — Receive Acceptance Filter 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C1RXF0EIDL 0304 Receive Acceptance Filter 0 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C1RXF1SID 0308 — — — Receive Acceptance Filter 1 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u
C1RXF1EIDH 030A — — — — Receive Acceptance Filter 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

DS70083G-page 130
C1RXF1EIDL 030C Receive Acceptance Filter 1 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C1RXF2SID 0310 — — — Receive Acceptance Filter 2 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u
dsPIC30F

C1RXF2EIDH 0312 — — — — Receive Acceptance Filter 2 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C1RXF2EIDL 0314 Receive Acceptance Filter 2 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C1RXF3SID 0318 — — — Receive Acceptance Filter 3 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u
C1RXF3EIDH 031A — — — — Receive Acceptance Filter 3 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C1RXF3EIDL 031C Receive Acceptance Filter 3 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C1RXF4SID 0320 — — — Receive Acceptance Filter 4 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u
C1RXF4EIDH 0322 — — — — Receive Acceptance Filter 4 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C1RXF4EIDL 0324 Receive Acceptance Filter 4 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C1RXF5SID 0328 — — — Receive Acceptance Filter 5 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u
C1RXF5EIDH 032A — — — — Receive Acceptance Filter 5 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C1RXF5EIDL 032C Receive Acceptance Filter 5 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C1RXM0SID 0330 — — — Receive Acceptance Mask 0 Standard Identifier <10:0> — MIDE 000u uuuu uuuu uu0u
C1RXM0EIDH 0332 — — — — Receive Acceptance Mask 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

Preliminary
C1RXM0EIDL 0334 Receive Acceptance Mask 0 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C1RXM1SID 0338 — — — Receive Acceptance Mask 1 Standard Identifier <10:0> — MIDE 000u uuuu uuuu uu0u
C1RXM1EIDH 033A — — — — Receive Acceptance Mask 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C1RXM1EIDL 033C Receive Acceptance Mask 1 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C1TX2SID 0340 Transmit Buffer 2 Standard Identifier <10:6> — — — Transmit Buffer 2 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu
C1TX2EID 0342 Transmit Buffer 2 Extended Identifier — — — — Transmit Buffer 2 Extended Identifier <13:6> uuuu 0000 uuuu uuuu
<17:14>
C1TX2DLC 0344 Transmit Buffer 2 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000
C1TX2B1 0346 Transmit Buffer 2 Byte 1 Transmit Buffer 2 Byte 0 uuuu uuuu uuuu uuuu
C1TX2B2 0348 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 2 uuuu uuuu uuuu uuuu
C1TX2B3 034A Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 4 uuuu uuuu uuuu uuuu
C1TX2B4 034C Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 6 uuuu uuuu uuuu uuuu
C1TX2CON 034E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000
C1TX1SID 0350 Transmit Buffer 1 Standard Identifier <10:6> — — — Transmit Buffer 1 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu
C1TX1EID 0352 Transmit Buffer 1 Extended Identifier — — — — Transmit Buffer 1 Extended Identifier <13:6> uuuu 0000 uuuu uuuu
<17:14>
C1TX1DLC 0354 Transmit Buffer 1 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000
Legend: u = uninitialized bit

 2004 Microchip Technology Inc.

 TABLE 17-1: CAN1 REGISTER MAP (CONTINUED)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
C1TX1B1 0356 Transmit Buffer 1 Byte 1 Transmit Buffer 1 Byte 0 uuuu uuuu uuuu uuuu
C1TX1B2 0358 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 2 uuuu uuuu uuuu uuuu
C1TX1B3 035A Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 4 uuuu uuuu uuuu uuuu
C1TX1B4 035C Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 6 uuuu uuuu uuuu uuuu
C1TX1CON 035E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000
C1TX0SID 0360 Transmit Buffer 0 Standard Identifier <10:6> — — — Transmit Buffer 0 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu
C1TX0EID 0362 Transmit Buffer 0 Extended Identifier — — — — Transmit Buffer 0 Extended Identifier <13:6> uuuu 0000 uuuu uuuu
<17:14>

 2004 Microchip Technology Inc.

C1TX0DLC 0364 Transmit Buffer 0 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000
C1TX0B1 0366 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 uuuu uuuu uuuu uuuu
C1TX0B2 0368 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 uuuu uuuu uuuu uuuu
C1TX0B3 036A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 uuuu uuuu uuuu uuuu
C1TX0B4 036C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 uuuu uuuu uuuu uuuu
C1TX0CON 036E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000
C1RX1SID 0370 — — — Receive Buffer 1 Standard Identifier <10:0> SRR RXIDE 000u uuuu uuuu uuuu
C1RX1EID 0372 — — — — Receive Buffer 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C1RX1DLC 0374 Receive Buffer 1 Extended Identifier <5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu
C1RX1B1 0376 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 uuuu uuuu uuuu uuuu
C1RX1B2 0378 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 uuuu uuuu uuuu uuuu
C1RX1B3 037A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

Preliminary
C1RX1B4 037C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 uuuu uuuu uuuu uuuu
C1RX1CON 037E — — — — — — — — RXFUL — — — RXRTRRO FILHIT<2:0> 0000 0000 0000 0000
C1RX0SID 0380 — — — Receive Buffer 0 Standard Identifier <10:0> SRR RXIDE 000u uuuu uuuu uuuu
C1RX0EID 0382 — — — — Receive Buffer 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C1RX0DLC 0384 Receive Buffer 0 Extended Identifier <5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu
C1RX0B1 0386 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 uuuu uuuu uuuu uuuu
C1RX0B2 0388 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 uuuu uuuu uuuu uuuu
C1RX0B3 038A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 uuuu uuuu uuuu uuuu
C1RX0B4 038C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 uuuu uuuu uuuu uuuu
C1RX0CON 038E — — — — — — — — RXFUL — — — RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000
C1CTRL 0390 CANCAP — CSIDLE ABAT CANCKS REQOP<2:0> OPMODE<2:0> — ICODE<2:0> — 0000 0100 1000 0000
C1CFG1 0392 — — — — — — — — SJW<1:0> BRP<5:0> 0000 0000 0000 0000
C1CFG2 0394 — WAKFIL — — — SEG2PH<2:0> SEG2PHTS SAM SEG1PH<2:0> PRSEG<2:0> 0u00 0uuu uuuu uuuu
C1INTF 0396 RX0OVR RX1OVR TXBO TXEP RXEP TXWAR RXWAR EWARN IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF 0000 0000 0000 0000
C1INTE 0398 — — — — — — — — IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1E RX0IE 0000 0000 0000 0000
C1EC 039A Transmit Error Count Register Receive Error Count Register 0000 0000 0000 0000
Legend: u = uninitialized bit
dsPIC30F

DS70083G-page 131
 TABLE 17-2: CAN2 REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

C2RXF0SID 03C0 — — — Receive Acceptance Filter 0 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u
C2RXF0EIDH 03C2 — — — — Receive Acceptance Filter 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C2RXF0EIDL 03C4 Receive Acceptance Filter 0 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C2RXF1SID 03C8 — — — Receive Acceptance Filter 1 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

DS70083G-page 132
C2RXF1EIDH 03CA — — — — Receive Acceptance Filter 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C2RXF1EIDL 03CC Receive Acceptance Filter 1 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
dsPIC30F

C2RXF2SID 03D0 — — — Receive Acceptance Filter 2 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u
C2RXF2EIDH 03D2 — — — — Receive Acceptance Filter 2 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C2RXF2EIDL 03D4 Receive Acceptance Filter 2 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C2RXF3SID 03D8 — — — Receive Acceptance Filter 3 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u
C2RXF3EIDH 03DA — — — — Receive Acceptance Filter 3 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C2RXF3EIDL 03DC Receive Acceptance Filter 3 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C2RXF4SID 03E0 — — — Receive Acceptance Filter 4 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u
C2RXF4EIDH 03E2 — — — — Receive Acceptance Filter 4 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C2RXF4EIDL 03E4 Receive Acceptance Filter 4 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C2RXF5SID 03E8 — — — Receive Acceptance Filter 5 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u
C2RXF5EIDH 03EA — — — — Receive Acceptance Filter 5 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C2RXF5EIDL 03EC Receive Acceptance Filter 5 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C2RXM0SID 03F0 — — — Receive Acceptance Mask 0 Standard Identifier <10:0> — MIDE 000u uuuu uuuu uu0u
C2RXM0EIDH 03F2 — — — — Receive Acceptance Mask 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

Preliminary
C2RXM0EIDL 03F4 Receive Acceptance Mask 0 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C2RXM1SID 03F8 — — — Receive Acceptance Mask 1 Standard Identifier <10:0> — MIDE 000u uuuu uuuu uu0u
C2RXM1EIDH 03FA — — — — Receive Acceptance Mask 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C2RXM1EIDL 03FC Receive Acceptance Mask 1 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000
C2TX2SID 0400 Transmit Buffer 2 Standard Identifier <10:6> — — — Transmit Buffer 2 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu
C2TX2EID 0402 Transmit Buffer 2 Extended Identifier — — — — Transmit Buffer 2 Extended Identifier <13:6> uuuu 0000 uuuu uuuu
<17:14>
C2TX2DLC 0404 Transmit Buffer 2 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000
C2TX2B1 0406 Transmit Buffer 2 Byte 1 Transmit Buffer 2 Byte 0 uuuu uuuu uuuu uuuu
C2TX2B2 0408 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 2 uuuu uuuu uuuu uuuu
C2TX2B3 040A Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 4 uuuu uuuu uuuu uuuu
C2TX2B4 040C Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 6 uuuu uuuu uuuu uuuu
C2TX2CON 040E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000
C2TX1SID 0410 Transmit Buffer 1 Standard Identifier <10:6> — — — Transmit Buffer 1 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu
C2TX1EID 0412 Transmit Buffer 1 Extended Identifier — — — — Transmit Buffer 1 Extended Identifier <13:6> uuuu 0000 uuuu uuuu
<17:14>
C2TX1DLC 0414 Transmit Buffer 1 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000
Legend: u = uninitialized bit

 2004 Microchip Technology Inc.

 TABLE 17-2: CAN2 REGISTER MAP (CONTINUED)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

C2TX1B1 0416 Transmit Buffer 1 Byte 1 Transmit Buffer 1 Byte 0 uuuu uuuu uuuu uuuu
C2TX1B2 0418 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 2 uuuu uuuu uuuu uuuu
C2TX1B3 041A Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 4 uuuu uuuu uuuu uuuu
C2TX1B4 041C Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 6 uuuu uuuu uuuu uuuu
C2TX1CON 041E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000
C2TX0SID 0420 Transmit Buffer 0 Standard Identifier <10:6> — — — Transmit Buffer 0 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu
C2TX0EID 0422 Transmit Buffer 0 Extended Identifier — — — — Transmit Buffer 0 Extended Identifier <13:6> uuuu 0000 uuuu uuuu
<17:14>

 2004 Microchip Technology Inc.

C2TX0DLC 0424 Transmit Buffer 0 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000
C2TX0B1 0426 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 uuuu uuuu uuuu uuuu
C2TX0B2 0428 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 uuuu uuuu uuuu uuuu
C2TX0B3 042A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 uuuu uuuu uuuu uuuu
C2TX0B4 042C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 uuuu uuuu uuuu uuuu
C2TX0CON 042E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000
C2RX1SID 0430 — — — Receive Buffer 1 Standard Identifier <10:0> SRR RXIDE 000u uuuu uuuu uuuu
C2RX1EID 0432 — — — — Receive Buffer 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C2RX1DLC 0434 Receive Buffer 1 Extended Identifier <5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu
C2RX1B1 0436 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 uuuu uuuu uuuu uuuu
C2RX1B2 0438 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 uuuu uuuu uuuu uuuu
C2RX1B3 043A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 uuuu uuuu uuuu uuuu
C2RX1B4 043C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

Preliminary
C2RX1CON 043E — — — — — — — — RXFUL — — — RXRTRRO FILHIT<2:0> 0000 0000 0000 0000
C2RX0SID 0440 — — — Receive Buffer 0 Standard Identifier <10:0> SRR RXIDE 000u uuuu uuuu uuuu
C2RX0EID 0442 — — — — Receive Buffer 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu
C2RX0DLC 0444 Receive Buffer 0 Extended Identifier <5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu
C2RX0B1 0446 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 uuuu uuuu uuuu uuuu
C2RX0B2 0448 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 uuuu uuuu uuuu uuuu
C2RX0B3 044A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 uuuu uuuu uuuu uuuu
C2RX0B4 044C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 uuuu uuuu uuuu uuuu
C2RX0CON 044E — — — — — — — — RXFUL — — — RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000
C2CTRL 0450 CANCAP — CSIDLE ABAT CANCKS REQOP<2:0> OPMODE<2:0> — ICODE<2:0> — 0000 0100 1000 0000
C2CFG1 0452 — — — — — — — — SJW<1:0> BRP<5:0> 0000 0000 0000 0000
C2CFG2 0454 — WAKFIL — — — SEG2PH<2:0> SEG2PHTS SAM SEG1PH<2:0> PRSEG<2:0> 0u00 0uuu uuuu uuuu
C2INTF 0456 RX0OVR RX1OVR TXBO TXEP RXEP TXWAR RXWAR EWARN IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF 0000 0000 0000 0000
C2INTE 0458 — — — — — — — — IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1E RX0IE 0000 0000 0000 0000
C2EC 045A Transmit Error Count Register Receive Error Count Register 0000 0000 0000 0000
Legend: u = uninitialized bit
dsPIC30F

DS70083G-page 133
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
dsPIC30F
NOTES:

DS70083G-page 134 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
18.0 DATA CONVERTER 18.2.3 CSDI PIN
INTERFACE (DCI) MODULE The serial data input (CSDI) pin is configured as an
input only pin when the module is enabled.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete 18.2.3.1 COFS PIN
reference source. For more information on the CPU,
peripherals, register descriptions and general device The Codec frame synchronization (COFS) pin is used
functionality, refer to the dsPIC30F Family Reference to synchronize data transfers that occur on the CSDO
Manual (DS70046).
and CSDI pins. The COFS pin may be configured as an
input or an output. The data direction for the COFS pin
18.1 Module Introduction is determined by the COFSD control bit in the
The dsPIC30F Data Converter Interface (DCI) module DCICON1 register.
allows simple interfacing of devices, such as audio The DCI module accesses the shadow registers while
coder/decoders (Codecs), A/D converters and D/A the CPU is in the process of accessing the memory
converters. The following interfaces are supported: mapped buffer registers.
• Framed Synchronous Serial Transfer (Single or
18.2.4 BUFFER DATA ALIGNMENT
Multi-Channel)
• Inter-IC Sound (I2S) Interface Data values are always stored left justified in the buff-
ers since most Codec data is represented as a signed
• AC-Link Compliant mode
2’s complement fractional number. If the received word
The DCI module provides the following general length is less than 16 bits, the unused LS bits in the
features: receive buffer registers are set to ‘0’ by the module. If
• Programmable word size up to 16 bits the transmitted word length is less than 16 bits, the
• Support for up to 16 time slots, for a maximum unused LS bits in the transmit buffer register are
frame size of 256 bits ignored by the module. The word length setup is
described in subsequent sections of this document.
• Data buffering for up to 4 samples without CPU
overhead 18.2.5 TRANSMIT/RECEIVE SHIFT
REGISTER
18.2 Module I/O Pins
The DCI module has a 16-bit shift register for shifting
There are four I/O pins associated with the module. serial data in and out of the module. Data is shifted in/
When enabled, the module controls the data direction out of the shift register MS bit first, since audio PCM
of each of the four pins. data is transmitted in signed 2’s complement format.

18.2.1 CSCK PIN 18.2.6 DCI BUFFER CONTROL

The CSCK pin provides the serial clock for the DCI The DCI module contains a buffer control unit for trans-
module. The CSCK pin may be configured as an input ferring data between the shadow buffer memory and
or output using the CSCKD control bit in the DCICON2 the serial shift register. The buffer control unit is a sim-
SFR. When configured as an output, the serial clock is ple 2-bit address counter that points to word locations
provided by the dsPIC30F. When configured as an in the shadow buffer memory. For the receive memory
input, the serial clock must be provided by an external space (high address portion of DCI buffer memory), the
device. address counter is concatenated with a ‘0’ in the MSb
location to form a 3-bit address. For the transmit mem-
18.2.2 CSDO PIN ory space (high portion of DCI buffer memory), the
The serial data output (CSDO) pin is configured as an address counter is concatenated with a ‘1’ in the MSb
output only pin when the module is enabled. The location.
CSDO pin drives the serial bus whenever data is to be Note: The DCI buffer control unit always
transmitted. The CSDO pin is tri-stated or driven to ‘0’ accesses the same relative location in the
during CSCK periods when data is not transmitted, transmit and receive buffers, so only one
depending on the state of the CSDOM control bit. This address counter is provided.
allows other devices to place data on the serial bus
during transmission periods not used by the DCI
module.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 135

dsPIC30F
FIGURE 18-1: DCI MODULE BLOCK DIAGRAM

BCG Control bits

SCKD

Sample Rate
FOSC/4 CSCK
Generator

FSD
Word Size Selection bits Frame
Frame Length Selection bits Synchronization COFS
DCI Mode Selection bits Generator
16-bit Data Bus

Receive Buffer
Registers w/Shadow
DCI Buffer
Control Unit

15 0
Transmit Buffer
DCI Shift Register CSDI
Registers w/Shadow

CSDO

DS70083G-page 136 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
18.3 DCI Module Operation 18.3.4 FRAME SYNC MODE
CONTROL BITS
18.3.1 MODULE ENABLE
The type of frame sync signal is selected using the
The DCI module is enabled or disabled by setting/ Frame Synchronization mode control bits
clearing the DCIEN control bit in the DCICON1 SFR. (COFSM<1:0>) in the DCICON1 SFR. The following
Clearing the DCIEN control bit has the effect of reset- operating modes can be selected:
ting the module. In particular, all counters associated
• Multi-Channel mode
with CSCK generation, frame sync, and the DCI buffer
control unit are reset. • I2S mode
• AC-Link mode (16-bit)
The DCI clocks are shutdown when the DCIEN bit is
cleared. • AC-Link mode (20-bit)

When enabled, the DCI controls the data direction for The operation of the COFSM control bits depends on
the four I/O pins associated with the module. The Port, whether the DCI module generates the frame sync
LAT and TRIS register values for these I/O pins are signal as a master device, or receives the frame sync
overridden by the DCI module when the DCIEN bit is set. signal as a slave device.

It is also possible to override the CSCK pin separately The master device in a DSP/Codec pair is the device
when the bit clock generator is enabled. This permits that generates the frame sync signal. The frame sync
the bit clock generator to operate without enabling the signal initiates data transfers on the CSDI and CSDO
rest of the DCI module. pins and usually has the same frequency as the data
sample rate (COFS).
18.3.2 WORD SIZE SELECTION BITS The DCI module is a frame sync master if the COFSD
The WS<3:0> word size selection bits in the DCICON2 control bit is cleared and is a frame sync slave if the
SFR determine the number of bits in each DCI data COFSD control bit is set.
word. Essentially, the WS<3:0> bits determine the
counting period for a 4-bit counter clocked from the 18.3.5 MASTER FRAME SYNC
CSCK signal. OPERATION
Any data length, up to 16-bits, may be selected. The When the DCI module is operating as a frame sync
value loaded into the WS<3:0> bits is one less the master device (COFSD = 0), the COFSM mode bits
desired word length. For example, a 16-bit data word determine the type of frame sync pulse that is
size is selected when WS<3:0> = 1111. generated by the frame sync generator logic.
A new COFS signal is generated when the frame sync
Note: These WS<3:0> control bits are used only
generator resets to ‘0’.
in the Multi-Channel and I2S modes. These
bits have no effect in AC-Link mode since In the Multi-Channel mode, the frame sync pulse is
the data slot sizes are fixed by the protocol. driven high for the CSCK period to initiate a data trans-
fer. The number of CSCK cycles between successive
18.3.3 FRAME SYNC GENERATOR frame sync pulses will depend on the word size and
The frame sync generator (COFSG) is a 4-bit counter frame sync generator control bits. A timing diagram for
that sets the frame length in data words. The frame the frame sync signal in Multi-Channel mode is shown
sync generator is incremented each time the word size in Figure 18-2.
counter is reset (refer to Section 18.3.2). The period for In the AC-Link mode of operation, the frame sync sig-
the frame synchronization generator is set by writing nal has a fixed period and duty cycle. The AC-Link
the COFSG<3:0> control bits in the DCICON2 SFR. frame sync signal is high for 16 CSCK cycles and is low
The COFSG period in clock cycles is determined by the for 240 CSCK cycles. A timing diagram with the timing
following formula: details at the start of an AC-Link frame is shown in
Figure 18-3.
EQUATION 18-1: COFSG PERIOD In the I2S mode, a frame sync signal having a 50% duty
cycle is generated. The period of the I2S frame sync
Frame Length = Word Length • (FSG Value + 1)
signal in CSCK cycles is determined by the word size
and frame sync generator control bits. A new I2S data
Frame lengths, up to 16 data words, may be selected. transfer boundary is marked by a high-to-low or a
The frame length in CSCK periods can vary up to a low-to-high transition edge on the COFS pin.
maximum of 256 depending on the word size that is
selected.
Note: The COFSG control bits will have no effect
in AC-Link mode since the frame length is
set to 256 CSCK periods by the protocol.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 137

dsPIC30F
18.3.6 SLAVE FRAME SYNC OPERATION In the I2S mode, a new data word will be transferred
one CSCK cycle after a low-to-high or a high-to-low
When the DCI module is operating as a frame sync
transition is sampled on the COFS pin. A rising or fall-
slave (COFSD = 1), data transfers are controlled by the
ing edge on the COFS pin resets the frame sync
Codec device attached to the DCI module. The
generator logic.
COFSM control bits control how the DCI module
responds to incoming COFS signals. In the AC-Link mode, the tag slot and subsequent data
slots for the next frame will be transferred one CSCK
In the Multi-Channel mode, a new data frame transfer
cycle after the COFS pin is sampled high.
will begin one CSCK cycle after the COFS pin is sam-
pled high (see Figure 18-2). The pulse on the COFS The COFSG and WS bits must be configured to pro-
pin resets the frame sync generator logic. vide the proper frame length when the module is oper-
ating in the Slave mode. Once a valid frame sync pulse
has been sampled by the module on the COFS pin, an
entire data frame transfer will take place. The module
will not respond to further frame sync pulses until the
data frame transfer has completed.

FIGURE 18-2: FRAME SYNC TIMING, MULTI-CHANNEL MODE

CSCK

COFS

CSDI/CSDO MSB LSB

FIGURE 18-3: FRAME SYNC TIMING, AC-LINK START OF FRAME

BIT_CLK

CSDO or CSDI S12 S12 S12 Tag Tag Tag

bit 2 bit 1 LSb MSb bit 14 bit 13

SYNC

FIGURE 18-4: I2S INTERFACE FRAME SYNC TIMING

CSCK

CSDI or CSDO MSB LSB MSB LSB

WS

Note: A 5-bit transfer is shown here for illustration purposes. The I2S protocol does not specify word length - this will
be system dependent.

DS70083G-page 138 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
18.3.7 BIT CLOCK GENERATOR 18.3.8 SAMPLE CLOCK EDGE
The DCI module has a dedicated 12-bit time base that CONTROL BIT
produces the bit clock. The bit clock rate (period) is set The sample clock edge (CSCKE) control bit determines
by writing a non-zero 12-bit value to the BCG<11:0> the sampling edge for the CSCK signal. If the CSCK bit
control bits in the DCICON1 SFR. is cleared (default), data will be sampled on the falling
When the BCG<11:0> bits are set to zero, the bit clock edge of the CSCK signal. The AC-Link protocols and
will be disabled. If the BCG<11:0> bits are set to a non- most Multi-Channel formats require that data be sam-
zero value, the bit clock generator is enabled. These pled on the falling edge of the CSCK signal. If the
bits should be set to ‘0’ and the CSCKD bit set to ‘1’ if CSCK bit is set, data will be sampled on the rising edge
the serial clock for the DCI is received from an external of CSCK. The I2S protocol requires that data be
device. sampled on the rising edge of the CSCK signal.

The formula for the bit clock frequency is given in 18.3.9 DATA JUSTIFICATION
Equation 18-2. CONTROL BIT
In most applications, the data transfer begins one
EQUATION 18-2: BIT CLOCK FREQUENCY
CSCK cycle after the COFS signal is sampled active.
This is the default configuration of the DCI module. An
FCY
FBCK = alternate data alignment can be selected by setting the
2 • (BCG + 1) DJST control bit in the DCICON2 SFR. When DJST = 1,
data transfers will begin during the same CSCK cycle
The required bit clock frequency will be determined by when the COFS signal is sampled active.
the system sampling rate and frame size. Typical bit
18.3.10 TRANSMIT SLOT ENABLE BITS
clock frequencies range from 16x to 512x the converter
sample rate depending on the data converter and the The TSCON SFR has control bits that are used to
communication protocol that is used. enable up to 16 time slots for transmission. These con-
trol bits are the TSE<15:0> bits. The size of each time
To achieve bit clock frequencies associated with com-
slot is determined by the WS<3:0> word size selection
mon audio sampling rates, the user will need to select
bits and can vary up to 16 bits.
a crystal frequency that has an ‘even’ binary value.
Examples of such crystal frequencies are listed in If a transmit time slot is enabled via one of the TSE bits
Table 18-1. (TSEx = 1), the contents of the current transmit shadow
buffer location will be loaded into the CSDO Shift regis-
TABLE 18-1: DEVICE FREQUENCIES FOR ter and the DCI buffer control unit is incremented to
COMMON CODEC CSCK point to the next location.
FREQUENCIES During an unused transmit time slot, the CSDO pin will
drive ‘0’s or will be tri-stated during all disabled time
FOSC PLL FCYC
slots depending on the state of the CSDOM bit in the
2.048 MHz 16x 32.768 MIPs DCICON1 SFR.
4.096 MHz 8x 32.768 MIPs The data frame size in bits is determined by the chosen
4.800 MHz 8x 38.4 MIPs data word size and the number of data word elements
in the frame. If the chosen frame size has less than 16
9.600 MHz 4x 38.4 MIPs
elements, the additional slot enable bits will have no
effect.
Note 1: When the CSCK signal is applied exter- Each transmit data word is written to the 16-bit transmit
nally (CSCKD = 1), the BCG<11:0> bits buffer as left justified data. If the selected word size is
have no effect on the operation of the DCI less than 16 bits, then the LS bits of the transmit buffer
module. memory will have no effect on the transmitted data. The
user should write ‘0’s to the unused LS bits of each
2: When the CSCK signal is applied exter-
transmit buffer location.
nally (CSCKD = 1), the external clock
high and low times must meet the device
timing requirements.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 139

dsPIC30F
18.3.11 RECEIVE SLOT ENABLE BITS 18.3.14 BUFFER LENGTH CONTROL
The RSCON SFR contains control bits that are used to The amount of data that is buffered between interrupts
enable up to 16 time slots for reception. These control is determined by the buffer length (BLEN<1:0>) control
bits are the RSE<15:0> bits. The size of each receive bits in the DCISTAT SFR. The size of the transmit and
time slot is determined by the WS<3:0> word size receive buffers may be varied from 1 to 4 data words
selection bits and can vary from 1 to 16 bits. using the BLEN control bits. The BLEN control bits are
If a receive time slot is enabled via one of the RSE bits compared to the current value of the DCI buffer control
(RSEx = 1), the shift register contents will be written to unit address counter. When the 2 LS bits of the DCI
the current DCI receive shadow buffer location and the address counter match the BLEN<1:0> value, the
buffer control unit will be incremented to point to the buffer control unit will be reset to ‘0’. In addition, the
next buffer location. contents of the receive shadow registers are trans-
ferred to the receive buffer registers and the contents
Data is not packed in the receive memory buffer loca- of the transmit buffer registers are transferred to the
tions if the selected word size is less than 16 bits. Each transmit shadow registers.
received slot data word is stored in a separate 16-bit
buffer location. Data is always stored in a left justified 18.3.15 BUFFER ALIGNMENT WITH DATA
format in the receive memory buffer. FRAMES
18.3.12 SLOT ENABLE BITS OPERATION There is no direct coupling between the position of the
WITH FRAME SYNC AGU address pointer and the data frame boundaries.
This means that there will be an implied assignment of
The TSE and RSE control bits operate in concert with each transmit and receive buffer that is a function of the
the DCI frame sync generator. In the Master mode, a BLEN control bits and the number of enabled data slots
COFS signal is generated whenever the frame sync via the TSE and RSE control bits.
generator is reset. In the Slave mode, the frame sync
generator is reset whenever a COFS pulse is received. As an example, assume that a 4-word data frame is
chosen and that we want to transmit on all four time
The TSE and RSE control bits allow up to 16 consecu- slots in the frame. This configuration would be estab-
tive time slots to be enabled for transmit or receive. lished by setting the TSE0, TSE1, TSE2, and TSE3
After the last enabled time slot has been transmitted/ control bits in the TSCON SFR. With this module setup,
received, the DCI will stop buffering data until the next the TXBUF0 register would be naturally assigned to
occurring COFS pulse. slot #0, the TXBUF1 register would be naturally
assigned to slot #1, and so on.
18.3.13 SYNCHRONOUS DATA
TRANSFERS Note: When more than four time slots are active
within a data frame, the user code must
The DCI buffer control unit will be incremented by one
keep track of which time slots are to be
word location whenever a given time slot has been
read/written at each interrupt. In some
enabled for transmission or reception. In most cases,
cases, the alignment between transmit/
data input and output transfers will be synchronized,
receive buffers and their respective slot
which means that a data sample is received for a given
assignments could be lost. Examples of
channel at the same time a data sample is transmitted.
such cases include an emulation break-
Therefore, the transmit and receive buffers will be filled
point or a hardware trap. In these situa-
with equal amounts of data when a DCI interrupt is
tions, the user should poll the SLOT status
generated.
bits to determine what data should be
In some cases, the amount of data transmitted and loaded into the buffer registers to
received during a data frame may not be equal. As an resynchronize the software with the DCI
example, assume a two-word data frame is used. Fur- module.
thermore, assume that data is only received during
slot #0 but is transmitted during slot #0 and slot #1. In
this case, the buffer control unit counter would be incre-
mented twice during a data frame but only one receive
register location would be filled with data.

DS70083G-page 140 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
18.3.16 TRANSMIT STATUS BITS 18.3.19 CSDO MODE BIT
There are two transmit status bits in the DCISTAT SFR. The CSDOM control bit controls the behavior of the
The TMPTY bit is set when the contents of the transmit CSDO pin during unused transmit slots. A given trans-
buffer registers are transferred to the transmit shadow mit time slot is unused if it’s corresponding TSEx bit in
registers. The TMPTY bit may be polled in software to the TSCON SFR is cleared.
determine when the transmit buffer registers may be If the CSDOM bit is cleared (default), the CSDO pin will
written. The TMPTY bit is cleared automatically by the be low during unused time slot periods. This mode will
hardware when a write to one of the four transmit be used when there are only two devices attached to
buffers occurs. the serial bus.
The TUNF bit is read only and indicates that a transmit If the CSDOM bit is set, the CSDO pin will be tri-stated
underflow has occurred for at least one of the transmit during unused time slot periods. This mode allows mul-
buffer registers that is in use. The TUNF bit is set at the tiple devices to share the same CSDO line in a multi-
time the transmit buffer registers are transferred to the channel application. Each device on the CSDO line is
transmit shadow registers. The TUNF status bit is configured so that it will only transmit data during
cleared automatically when the buffer register that specific time slots. No two devices will transmit data
underflowed is written by the CPU. during the same time slot.
Note: The transmit status bits only indicate sta- 18.3.20 DIGITAL LOOPBACK MODE
tus for buffer locations that are used by the
module. If the buffer length is set to less Digital Loopback mode is enabled by setting the
than four words, for example, the unused DLOOP control bit in the DCISTAT SFR. When the
buffer locations will not affect the transmit DLOOP bit is set, the module internally connects the
status bits. CSDO signal to CSDI. The actual data input on the
CSDI I/O pin will be ignored in Digital Loopback mode.
18.3.17 RECEIVE STATUS BITS
18.3.21 UNDERFLOW MODE CONTROL BIT
There are two receive status bits in the DCISTAT SFR.
When an underflow occurs, one of two actions may
The RFUL status bit is read only and indicates that new occur depending on the state of the Underflow mode
data is available in the receive buffers. The RFUL bit is (UNFM) control bit in the DCICON2 SFR. If the UNFM
cleared automatically when all receive buffers in use bit is cleared (default), the module will transmit ‘0’s on
have been read by the CPU. the CSDO pin during the active time slot for the buffer
The ROV status bit is read only and indicates that a location. In this Operating mode, the Codec device
receive overflow has occurred for at least one of the attached to the DCI module will simply be fed digital
receive buffer locations. A receive overflow occurs ‘silence’. If the UNFM control bit is set, the module will
when the buffer location is not read by the CPU before transmit the last data written to the buffer location. This
new data is transferred from the shadow registers. The Operating mode permits the user to send continuous
ROV status bit is cleared automatically when the buffer data to the Codec device without consuming CPU
register that caused the overflow is read by the CPU. overhead.
When a receive overflow occurs for a specific buffer
location, the old contents of the buffer are overwritten. 18.4 DCI Module Interrupts
Note: The receive status bits only indicate status The frequency of DCI module interrupts is dependent
for buffer locations that are used by the on the BLEN<1:0> control bits in the DCICON2 SFR.
module. If the buffer length is set to less An interrupt to the CPU is generated each time the set
than four words, for example, the unused buffer length has been reached and a shadow register
buffer locations will not affect the transmit transfer takes place. A shadow register transfer is
status bits. defined as the time when the previously written TXBUF
values are transferred to the transmit shadow registers
18.3.18 SLOT STATUS BITS and new received values in the receive shadow
The SLOT<3:0> status bits in the DCISTAT SFR indi- registers are transferred into the RXBUF registers.
cate the current active time slot. These bits will corre-
spond to the value of the frame sync generator counter.
The user may poll these status bits in software when a
DCI interrupt occurs to determine what time slot data
was last received and which time slot data should be
loaded into the TXBUF registers.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 141

dsPIC30F
18.5 DCI Module Operation During CPU The 20-bit mode treats each 256-bit AC-Link frame as
Sleep and Idle Modes sixteen, 16-bit time slots. In the 20-bit AC-Link mode,
the module operates as if COFSG<3:0> = 1111 and
18.5.1 DCI MODULE OPERATION DURING WS<3:0> = 1111. The data alignment for 20-bit data
CPU SLEEP MODE slots is ignored. For example, an entire AC-Link data
frame can be transmitted and received in a packed
The DCI module has the ability to operate while in fashion by setting all bits in the TSCON and RSCON
Sleep mode and wake the CPU when the CSCK signal SFRs. Since the total available buffer length is 64 bits,
is supplied by an external device (CSCKD = 1). The it would take 4 consecutive interrupts to transfer the
DCI module will generate an asynchronous interrupt AC-Link frame. The application software must keep
when a DCI buffer transfer has completed and the CPU track of the current AC-Link frame segment.
is in Sleep mode.

18.5.2 DCI MODULE OPERATION DURING 18.7 I2S Mode Operation

CPU IDLE MODE The DCI module is configured for I2S mode by writing
If the DCISIDL control bit is cleared (default), the mod- a value of ‘01’ to the COFSM<1:0> control bits in the
ule will continue to operate normally even in Idle mode. DCICON1 SFR. When operating in the I2S mode, the
If the DCISIDL bit is set, the module will halt when Idle DCI module will generate frame synchronization sig-
mode is asserted. nals with a 50% duty cycle. Each edge of the frame
synchronization signal marks the boundary of a new
data word transfer.
18.6 AC-Link Mode Operation
The user must also select the frame length and data
The AC-Link protocol is a 256-bit frame with one 16-bit word size using the COFSG and WS control bits in the
data slot, followed by twelve 20-bit data slots. The DCI DCICON2 SFR.
module has two Operating modes for the AC-Link pro-
tocol. These Operating modes are selected by the 18.7.1 I2S FRAME AND DATA WORD
COFSM<1:0> control bits in the DCICON1 SFR. The LENGTH SELECTION
first AC-Link mode is called ‘16-bit AC-Link mode’ and
is selected by setting COFSM<1:0> = 10. The second The WS and COFSG control bits are set to produce the
AC-Link mode is called ‘20-bit AC-Link mode’ and is period for one half of an I2S data frame. That is, the
selected by setting COFSM<1:0> = 11. frame length is the total number of CSCK cycles
required for a left or a right data word transfer.
18.6.1 16-BIT AC-LINK MODE The BLEN bits must be set for the desired buffer length.
In the 16-bit AC-Link mode, data word lengths are Setting BLEN<1:0> = 01 will produce a CPU interrupt,
restricted to 16 bits. Note that this restriction only once per I2S frame.
affects the 20-bit data time slots of the AC-Link proto-
col. For received time slots, the incoming data is simply 18.7.2 I2S DATA JUSTIFICATION
truncated to 16 bits. For outgoing time slots, the 4 LS As per the I2S specification, a data word transfer will, by
bits of the data word are set to ‘0’ by the module. This default, begin one CSCK cycle after a transition of the
truncation of the time slots limits the A/D and DAC data WS signal. A ‘MS bit left justified’ option can be
to 16 bits but permits proper data alignment in the selected using the DJST control bit in the DCICON2
TXBUF and RXBUF registers. Each RXBUF and SFR.
TXBUF register will contain one data time slot value. If DJST = 1, the I2S data transfers will be MS bit left jus-
tified. The MS bit of the data word will be presented on
18.6.2 20-BIT AC-LINK MODE
the CSDO pin during the same CSCK cycle as the ris-
The 20-bit AC-Link mode allows all bits in the data time ing or falling edge of the COFS signal. The CSDO pin
slots to be transmitted and received but does not main- is tri-stated after the data word has been sent.
tain data alignment in the TXBUF and RXBUF
registers.
The 20-bit AC-Link mode functions similar to the Multi-
Channel mode of the DCI module, except for the duty
cycle of the frame synchronization signal. The AC-Link
frame synchronization signal should remain high for 16
CSCK cycles and should be low for the following
240 cycles.

DS70083G-page 142 Preliminary  2004 Microchip Technology Inc.

 TABLE 18-2: DCI REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

DCICON1 0240 DCIEN — DCISIDL — DLOOP CSCKD CSCKE COFSD UNFM CSDOM DJST — — — COFSM1 COFSM0 0000 0000 0000 0000
DCICON2 0242 — — — — BLEN1 BLEN0 — COFSG<3:0> — WS<3:0> 0000 0000 0000 0000
DCICON3 0244 — — — — BCG<11:0> 0000 0000 0000 0000
DCISTAT 0246 — — — — SLOT3 SLOT2 SLOT1 SLOT0 — — — — ROV RFUL TUNF TMPTY 0000 0000 0000 0000
TSCON 0248 TSE15 TSE14 TSE13 TSE12 TSE11 TSE10 TSE9 TSE8 TSE7 TSE6 TSE5 TSE4 TSE3 TSE2 TSE1 TSE0 0000 0000 0000 0000
RSCON 024C RSE15 RSE14 RSE13 RSE12 RSE11 RSE10 RSE9 RSE8 RSE7 RSE6 RSE5 RSE4 RSE3 RSE2 RSE1 RSE0 0000 0000 0000 0000
RXBUF0 0250 Receive Buffer #0 Data Register 0000 0000 0000 0000
RXBUF1 0252 Receive Buffer #1 Data Register 0000 0000 0000 0000

 2004 Microchip Technology Inc.

RXBUF2 0254 Receive Buffer #2 Data Register 0000 0000 0000 0000
RXBUF3 0256 Receive Buffer #3 Data Register 0000 0000 0000 0000
TXBUF0 0258 Transmit Buffer #0 Data Register 0000 0000 0000 0000
TXBUF1 025A Transmit Buffer #1 Data Register 0000 0000 0000 0000
TXBUF2 025C Transmit Buffer #2 Data Register 0000 0000 0000 0000
TXBUF3 025E Transmit Buffer #3 Data Register 0000 0000 0000 0000
Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

Preliminary
dsPIC30F

DS70083G-page 143
dsPIC30F
NOTES:

DS70083G-page 144 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
19.0 12-BIT ANALOG-TO-DIGITAL The A/D module has six 16-bit registers:
CONVERTER (A/D) MODULE • A/D Control Register 1 (ADCON1)
• A/D Control Register 2 (ADCON2)
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete • A/D Control Register 3 (ADCON3)
reference source. For more information on the CPU, • A/D Input Select Register (ADCHS)
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
• A/D Port Configuration Register (ADPCFG)
Manual (DS70046). • A/D Input Scan Selection Register (ADCSSL)
The 12-bit Analog-to-Digital converter (A/D) allows The ADCON1, ADCON2 and ADCON3 registers con-
conversion of an analog input signal to a 12-bit digital trol the operation of the A/D module. The ADCHS reg-
number. This module is based on a Successive ister selects the input channels to be converted. The
Approximation Register (SAR) architecture and pro- ADPCFG register configures the port pins as analog
vides a maximum sampling rate of 100 ksps. The A/D inputs or as digital I/O. The ADCSSL register selects
module has up to 16 analog inputs which are multi- inputs for scanning.
plexed into a sample and hold amplifier. The output of Note: The SSRC<2:0>, ASAM, SMPI<3:0>,
the sample and hold is the input into the converter BUFM and ALTS bits, as well as the
which generates the result. The analog reference volt- ADCON3 and ADCSSL registers, must
age is software selectable to either the device supply not be written to while ADON = 1. This
voltage (AVDD/AVSS) or the voltage level on the would lead to indeterminate results.
(VREF+/VREF-) pin. The A/D converter has a unique
feature of being able to operate while the device is in The block diagram of the 12-bit A/D module is shown in
Sleep mode with RC oscillator selection. Figure 19-1.

FIGURE 19-1: 12-BIT A/D FUNCTIONAL BLOCK DIAGRAM

VREF+
AVDD AVSS
VREF-

0000 Comparator
AN0
DAC
0001
AN1

AN2 0010

0011 12-bit SAR Conversion Logic

AN3

AN4 0100

Data Format
0101 16-word, 12-bit
AN5 Dual Port
Buffer

Bus Interface
0110
AN6

0111
AN7

1000 Sample/Sequence
AN8 Sample Control
1001
AN9

1010 Input
AN10 Switches Input Mux
1011 Control
AN11

AN12 1100

AN13 1101

AN14 1110

AN15 1111
CH0G S/H CH0
CH0R

 2004 Microchip Technology Inc. Preliminary DS70083G-page 145

dsPIC30F
19.1 A/D Result Buffer 19.3 Selecting the Conversion
The module contains a 16-word dual port read only
Sequence
buffer, called ADCBUF0...ADCBUFF, to buffer the A/D Several groups of control bits select the sequence in
results. The RAM is 12 bits wide but the data obtained which the A/D connects inputs to the sample/hold
is represented in one of four different 16-bit data for- channel, converts a channel, writes the buffer memory
mats. The contents of the sixteen A/D Conversion and generates interrupts.
Result Buffer registers, ADCBUF0 through ADCBUFF,
The sequence is controlled by the sampling clocks.
cannot be written by user software.
The SMPI bits select the number of acquisition/
19.2 Conversion Operation conversion sequences that would be performed before
an interrupt occurs. This can vary from 1 sample per
After the A/D module has been configured, the sample interrupt to 16 samples per interrupt.
acquisition is started by setting the SAMP bit. Various
The BUFM bit will split the 16-word results buffer into
sources, such as a programmable bit, timer time-outs
two 8-word groups. Writing to the 8-word buffers will be
and external events, will terminate acquisition and start
alternated on each interrupt event.
a conversion. When the A/D conversion is complete,
the result is loaded into ADCBUF0...ADCBUFF, and Use of the BUFM bit will depend on how much time is
the DONE bit and the A/D interrupt flag ADIF are set after available for the moving of the buffers after the
the number of samples specified by the SMPI bit. The interrupt.
ADC module can be configured for different interrupt If the processor can quickly unload a full buffer within
rates as described in Section 19.3. the time it takes to acquire and convert one channel,
The following steps should be followed for doing an the BUFM bit can be ‘0’ and up to 16 conversions (cor-
A/D conversion: responding to the 16 input channels) may be done per
interrupt. The processor will have one acquisition and
1. Configure the A/D module:
conversion time to move the sixteen conversions.
• Configure analog pins, voltage reference and
digital I/O If the processor cannot unload the buffer within the
acquisition and conversion time, the BUFM bit should be
• Select A/D input channels
‘1’. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111,
• Select A/D conversion clock then eight conversions will be loaded into 1/2 of the
• Select A/D conversion trigger buffer, following which an interrupt occurs. The next
• Turn on A/D module eight conversions will be loaded into the other 1/2 of the
2. Configure A/D interrupt (if required): buffer. The processor will have the entire time between
interrupts to move the eight conversions.
• Clear ADIF bit
• Select A/D interrupt priority The ALTS bit can be used to alternate the inputs
selected during the sampling sequence. The input
3. Start sampling.
multiplexer has two sets of sample inputs: MUX A and
4. Wait the required acquisition time. MUX B. If the ALTS bit is ‘0’, only the MUX A inputs are
5. Trigger acquisition end, start conversion: selected for sampling. If the ALTS bit is ‘1’ and
6. Wait for A/D conversion to complete, by either: SMPI<3:0> = 0000 on the first sample/convert
• Waiting for the A/D interrupt, or sequence, the MUX A inputs are selected and on the
• Waiting for the DONE bit to get set. next acquire/convert sequence, the MUX B inputs are
selected.
7. Read A/D result buffer, clear ADIF if required.
The CSCNA bit (ADCON2<10>) will allow the multi-
plexer input to be alternately scanned across a
selected number of analog inputs for the MUX A group.
The inputs are selected by the ADCSSL register. If a
particular bit in the ADCSSL register is ‘1’, the corre-
sponding input is selected. The inputs are always
scanned from lower to higher numbered inputs, starting
after each interrupt. If the number of inputs selected is
greater than the number of samples taken per interrupt,
the higher numbered inputs are unused.

DS70083G-page 146 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
19.4 Programming the Start of Example 19-1 shows a sample calculation for the
Conversion Trigger ADCS<5:0> bits, assuming a device operating speed
of 30 MIPS.
The conversion trigger will terminate acquisition and
start the requested conversions. EXAMPLE 19-1: A/D CONVERSION CLOCK
The SSRC<2:0> bits select the source of the conver- CALCULATION
sion trigger. The SSRC bits provide for up to 4 alternate
sources of conversion trigger. Minimum TAD = 667 nsec
When SSRC<2:0> = 000, the conversion trigger is TCY = 33 nsec (30 MIPS)
under software control. Clearing the SAMP bit will
TAD
cause the conversion trigger. ADCS<5:0> = 2 –1
TCY
When SSRC<2:0> = 111 (Auto-Start mode), the con- 667 nsec
=2• –1
version trigger is under A/D clock control. The SAMC 33 nsec
bits select the number of A/D clocks between the start = 39.4
of acquisition and the start of conversion. This provides
the fastest conversion rates on multiple channels. Therefore,
SAMC must always be at least 1 clock cycle. Set ADCS<5:0> = 40

Other trigger sources can come from timer modules or TCY

external interrupts. Actual TAD = (ADCS<5:0> + 1)
2
33 nsec
19.5 Aborting a Conversion = (40 + 1)
2
Clearing the ADON bit during a conversion will abort = 677 nsec
the current conversion and stop the sampling sequenc-
ing until the next sampling trigger. The ADCBUF will not
be updated with the partially completed A/D conversion
sample. That is, the ADCBUF will continue to contain
the value of the last completed conversion (or the last
value written to the ADCBUF register).
If the clearing of the ADON bit coincides with an auto-
start, the clearing has a higher priority and a new
conversion will not start.
After the A/D conversion is aborted, a 2 TAD wait is
required before the next sampling may be started by
setting the SAMP bit.

19.6 Selecting the A/D Conversion

Clock
The A/D conversion requires 15 TAD. The source of the
A/D conversion clock is software selected, using a
six-bit counter. There are 64 possible options for TAD.

EQUATION 19-1: A/D CONVERSION CLOCK

TAD = TCY * (0.5*(ADCS<5:0> + 1))

The internal RC oscillator is selected by setting the

ADRC bit.
For correct A/D conversions, the A/D conversion clock
(TAD) must be selected to ensure a minimum TAD time
of 667 nsec (for VDD = 5V). Refer to the Electrical
Specifications section for minimum TAD under other
operating conditions.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 147

dsPIC30F
19.7 A/D Acquisition Requirements required to charge the capacitor CHOLD. The combined
impedance of the analog sources must therefore be
The analog input model of the 12-bit A/D converter small enough to fully charge the holding capacitor
is shown in Figure 19-2. The total sampling time for the within the chosen sample time. To minimize the effects
A/D is a function of the internal amplifier settling time of pin leakage currents on the accuracy of the A/D con-
and the holding capacitor charge time. verter, the maximum recommended source imped-
For the A/D converter to meet its specified accuracy, ance, RS, is 2.5 kΩ. After the analog input channel is
the charge holding capacitor (CHOLD) must be allowed selected (changed), this sampling function must be
to fully charge to the voltage level on the analog input completed prior to starting the conversion. The internal
pin. The source impedance (RS), the interconnect holding capacitor will be in a discharged state prior to
impedance (RIC), and the internal sampling switch each sample operation.
(RSS) impedance combine to directly affect the time

FIGURE 19-2: 12-BIT A/D CONVERTER ANALOG INPUT MODEL

VDD RIC ≤ 250Ω RSS ≤ 3 kΩ

Sampling
Switch
VT = 0.6V
Rs ANx RSS

CHOLD
VA CPIN I leakage = DAC capacitance
VT = 0.6V ± 500 nA = 18 pF

VSS

Legend: CPIN = input capacitance

VT = threshold voltage
I leakage = leakage current at the pin due to
various junctions
RIC = interconnect resistance
RSS = sampling switch resistance
CHOLD = sample/hold capacitance (from DAC)

Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 2.5 kΩ.

DS70083G-page 148 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
19.8 Module Power-down Modes If the A/D interrupt is enabled, the device will wake-up
from Sleep. If the A/D interrupt is not enabled, the A/
The module has 2 internal Power modes. D module will then be turned off, although the ADON bit
When the ADON bit is ‘1’, the module is in Active mode; will remain set.
it is fully powered and functional.
19.9.2 A/D OPERATION DURING CPU IDLE
When ADON is ‘0’, the module is in Off mode. The dig-
MODE
ital and analog portions of the circuit are disabled for
maximum current savings. The ADSIDL bit selects if the module will stop on Idle or
continue on Idle. If ADSIDL = 0, the module will con-
In order to return to the Active mode from Off mode, the
tinue operation on assertion of Idle mode. If ADSIDL =
user must wait for the ADC circuitry to stabilize.
1, the module will stop on Idle.

19.9 A/D Operation During CPU Sleep

19.10 Effects of a Reset
and Idle Modes
A device Reset forces all registers to their Reset state.
19.9.1 A/D OPERATION DURING CPU This forces the A/D module to be turned off, and any
SLEEP MODE conversion and sampling sequence is aborted. The val-
ues that are in the ADCBUF registers are not modified.
When the device enters Sleep mode, all clock sources
The A/D Result register will contain unknown data after
to the module are shutdown and stay at logic ‘0’.
a Power-on Reset.
If Sleep occurs in the middle of a conversion, the con-
version is aborted. The converter will not continue with 19.11 Output Formats
a partially completed conversion on exit from Sleep
mode. The A/D result is 12 bits wide. The data buffer RAM is
Register contents are not affected by the device also 12 bits wide. The 12-bit data can be read in one of
entering or leaving Sleep mode. four different formats. The FORM<1:0> bits select the
format. Each of the output formats translates to a 16-bit
The A/D module can operate during Sleep mode if the result on the data bus. Write data will always be in right
A/D clock source is set to RC (ADRC = 1). When the RC justified (integer) format.
clock source is selected, the A/D module waits one
instruction cycle before starting the conversion. This
allows the SLEEP instruction to be executed which elim-
inates all digital switching noise from the conversion.
When the conversion is complete, the CONV bit will be
cleared and the result loaded into the ADCBUF register.

FIGURE 19-3: A/D OUTPUT DATA FORMATS

RAM Contents: d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

Read to Bus:

Signed Fractional d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0

Fractional d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0

Signed Integer d11 d11 d11 d11 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

Integer 0 0 0 0 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

 2004 Microchip Technology Inc. Preliminary DS70083G-page 149

dsPIC30F
19.12 Configuring Analog Port Pins 19.13 Connection Considerations
The use of the ADPCFG and TRIS registers control the The analog inputs have diodes to VDD and VSS as ESD
operation of the A/D port pins. The port pins that are protection. This requires that the analog input be
desired as analog inputs must have their correspond- between VDD and VSS. If the input voltage exceeds this
ing TRIS bit set (input). If the TRIS bit is cleared (out- range by greater than 0.3V (either direction), one of the
put), the digital output level (VOH or VOL) will be diodes becomes forward biased and it may damage the
converted. device if the input current specification is exceeded.
The A/D operation is independent of the state of the An external RC filter is sometimes added for anti-
CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits. aliasing of the input signal. The R component should be
When reading the Port register, all pins configured as selected to ensure that the sampling time requirements
analog input channels will read as cleared. are satisfied. Any external components connected (via
high impedance) to an analog input pin (capacitor,
Pins configured as digital inputs will not convert an ana- zener diode, etc.) should have very little leakage
log input. Analog levels on any pin that is defined as a current at the pin.
digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.

DS70083G-page 150 Preliminary  2004 Microchip Technology Inc.

 TABLE 19-1: A/D CONVERTER REGISTER MAP
SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Name

ADCBUF0 0280 — — — — ADC Data Buffer 0 0000 uuuu uuuu uuuu

ADCBUF1 0282 — — — — ADC Data Buffer 1 0000 uuuu uuuu uuuu
ADCBUF2 0284 — — — — ADC Data Buffer 2 0000 uuuu uuuu uuuu
ADCBUF3 0286 — — — — ADC Data Buffer 3 0000 uuuu uuuu uuuu
ADCBUF4 0288 — — — — ADC Data Buffer 4 0000 uuuu uuuu uuuu
ADCBUF5 028A — — — — ADC Data Buffer 5 0000 uuuu uuuu uuuu
ADCBUF6 028C — — — — ADC Data Buffer 6 0000 uuuu uuuu uuuu

 2004 Microchip Technology Inc.

ADCBUF7 028E — — — — ADC Data Buffer 7 0000 uuuu uuuu uuuu
ADCBUF8 0290 — — — — ADC Data Buffer 8 0000 uuuu uuuu uuuu
ADCBUF9 0292 — — — — ADC Data Buffer 9 0000 uuuu uuuu uuuu
ADCBUFA 0294 — — — — ADC Data Buffer 10 0000 uuuu uuuu uuuu
ADCBUFB 0296 — — — — ADC Data Buffer 11 0000 uuuu uuuu uuuu
ADCBUFC 0298 — — — — ADC Data Buffer 12 0000 uuuu uuuu uuuu
ADCBUFD 029A — — — — ADC Data Buffer 13 0000 uuuu uuuu uuuu
ADCBUFE 029C — — — — ADC Data Buffer 14 0000 uuuu uuuu uuuu
ADCBUFF 029E — — — — ADC Data Buffer 15 0000 uuuu uuuu uuuu
ADCON1 02A0 ADON — ADSIDL — — — FORM<1:0> SSRC<2:0> — — ASAM SAMP DONE 0000 0000 0000 0000
ADCON2 02A2 VCFG<2:0> — — CSCNA — — BUFS — SMPI<3:0> BUFM ALTS 0000 0000 0000 0000
ADCON3 02A4 — — — SAMC<4:0> ADRC — ADCS<5:0> 0000 0000 0000 0000

Preliminary
ADCHS 02A6 — — — CH0NB CH0SB<3:0> — — — CH0NA CH0SA<3:0> 0000 0000 0000 0000
ADPCFG 02A8 PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000
ADCSSL 02AA CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8 CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 0000 0000 0000 0000
Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
dsPIC30F

DS70083G-page 151
dsPIC30F
NOTES:

DS70083G-page 152 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
20.0 SYSTEM INTEGRATION Sleep mode is designed to offer a very low current
Power-down mode. The user can wake-up from Sleep
Note: This data sheet summarizes features of this group through external Reset, Watchdog Timer Wake-up, or
of dsPIC30F devices and is not intended to be a complete through an interrupt. Several oscillator options are also
reference source. For more information on the CPU,
peripherals, register descriptions and general device
made available to allow the part to fit a wide variety of
functionality, refer to the dsPIC30F Family Reference applications. In the Idle mode, the clock sources are
Manual (DS70046). For more information on the device still active but the CPU is shut-off. The RC oscillator
instruction set and programming, refer to the dsPIC30F option saves system cost while the LP crystal option
Programmer’s Reference Manual (DS70030). saves power.
There are several features intended to maximize sys-
tem reliability, minimize cost through elimination of 20.1 Oscillator System Overview
external components, provide Power Saving Operating
modes and offer code protection: The dsPIC30F oscillator system has the following
modules and features:
• Oscillator Selection
• Various external and internal oscillator options as
• Reset
clock sources
- Power-on Reset (POR)
• An on-chip PLL to boost internal operating
- Power-up Timer (PWRT) frequency
- Oscillator Start-up Timer (OST) • A clock switching mechanism between various
- Programmable Brown-out Reset (BOR) clock sources
• Watchdog Timer (WDT) • Programmable clock postscaler for system power
• Power Saving Modes (Sleep and Idle) savings
• Code Protection • A Fail-Safe Clock Monitor (FSCM) that detects
• Unit ID Locations clock failure and takes fail-safe measures
• In-Circuit Serial Programming (ICSP) • Clock Control register (OSCCON)
• Configuration bits for main oscillator selection
dsPIC30F devices have a Watchdog Timer which is
permanently enabled via the configuration bits or can Configuration bits determine the clock source upon
be software controlled. It runs off its own RC oscillator Power-on Reset (POR) and Brown-out Reset (BOR).
for added reliability. There are two timers that offer Thereafter, the clock source can be changed between
necessary delays on power-up. One is the Oscillator permissible clock sources. The OSCCON register
Start-up Timer (OST), intended to keep the chip in controls the clock switching and reflects system clock
Reset until the crystal oscillator is stable. The other is related status bits.
the Power-up Timer (PWRT) which provides a delay on Table 20-1 provides a summary of the dsPIC30F
power-up only, designed to keep the part in Reset while Oscillator Operating modes. A simplified diagram of the
the power supply stabilizes. With these two timers on- oscillator system is shown in Figure 20-1.
chip, most applications need no external Reset
circuitry.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 153

dsPIC30F
TABLE 20-1: OSCILLATOR OPERATING MODES
Oscillator Mode Description

XTL 200 kHz-4 MHz crystal on OSC1:OSC2.

XT 4 MHz-10 MHz crystal on OSC1:OSC2.
XT w/ PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled.
XT w/ PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled.
XT w/ PLL 16x 4 MHz-10 MHz crystal on OSC1:OSC2, 16x PLL enabled(1).
LP 32 kHz crystal on SOSCO:SOSCI(2).
HS 10 MHz-25 MHz crystal.
HS/2 w/ PLL 4x 10 MHz-25 MHz crystal, divide by 2, 4x PLL enabled.
HS/2 w/ PLL 8x 10 MHz-25 MHz crystal, divide by 2, 8x PLL enabled.
HS/2 w/ PLL 16x 10 MHz-25 MHz crystal, divide by 2, 16x PLL enabled.
HS/3 w/ PLL 4x 10 MHz-25 MHz crystal, divide by 3, 4x PLL enabled.
HS/3 w/ PLL 8x 10 MHz-25 MHz crystal, divide by 3, 8x PLL enabled.
HS/3 w/ PLL 16x 10 MHz-25 MHz crystal, divide by 3, 16x PLL enabled.
EC External clock input (0-40 MHz).
ECIO External clock input (0-40 MHz), OSC2 pin is I/O.
EC w/ PLL 4x External clock input (0-40 MHz), OSC2 pin is I/O, 4x PLL enabled(1).
EC w/ PLL 8x External clock input (0-40 MHz), OSC2 pin is I/O, 8x PLL enabled(1).
EC w/ PLL 16x External clock input (0-40 MHz), OSC2 pin is I/O, 16x PLL enabled(1).
ERC External RC oscillator, OSC2 pin is FOSC/4 output(3).
ERCIO External RC oscillator, OSC2 pin is I/O(3).
FRC 8 MHz internal RC oscillator.
FRC w/ PLL 4x 8 MHz Internal RC oscillator, 4x PLL enabled.
FRC w/ PLL 8x 8 MHz Internal RC oscillator, 8x PLL enabled.
FRC w/ PLL 16x 7.5 MHz Internal RC oscillator, 16x PLL enabled.
LPRC 512 kHz internal RC oscillator.
Note 1: dsPIC30F maximum operating frequency of 120 MHz must be met.
2: LP oscillator can be conveniently shared as system clock, as well as real-time clock for Timer1.
3: Requires external R and C. Frequency operation up to 4 MHz.
4: Some devices support a subset of the above modes. Refer to individual device data sheets for details.

DS70083G-page 154 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 20-1: OSCILLATOR SYSTEM BLOCK DIAGRAM
Oscillator Configuration bits
PWRSAV Instruction

Wake-up Request

FPLL
OSC1
Primary PLL
Oscillator x4, x8, x16 PLL
OSC2
Lock COSC<2:0>
Primary Osc
NOSC<2:0>

Primary
Oscillator OSWEN
Stability Detector

Oscillator
POR Done Start-up
Timer Clock
Programmable
Secondary Osc Switching
Clock Divider System
and Control
Clock
Block
SOSCO
32 kHz LP Secondary 2
Oscillator
Oscillator
SOSCI Stability Detector
POST<1:0>

Internal Fast RC
Oscillator (FRC)

Internal Low LPRC

Power RC
Oscillator (LPRC)

CF
Fail-Safe Clock
FCKSM<1:0> Monitor (FSCM)
2 Oscillator Trap

To Timer1

 2004 Microchip Technology Inc. Preliminary DS70083G-page 155

dsPIC30F
20.2 Oscillator Configurations The selection is as shown in Table 20-2.
Note: Some devices may have different FOS
20.2.1 INITIAL CLOCK SOURCE and FPR values from Table 20-2, depend-
SELECTION ing on the oscillator modes supported.
While coming out of Power-on Reset or Brown-out Refer to individual device data sheets for
Reset, the device selects its clock source based on: details.
a) FOS<2:0> configuration bits that select one of
four oscillator groups,
b) and FPR<4:0> configuration bits that select one
of 13 oscillator choices within the primary group.

TABLE 20-2: CONFIGURATION BIT VALUES FOR CLOCK SELECTION

Oscillator OSC2
Oscillator Mode FOS<2:0> FPR<4:0>
Source Function
ECIO w/ PLL 4x PLL 1 1 1 0 1 1 0 1 I/O
ECIO w/ PLL 8x PLL 1 1 1 0 1 1 1 0 I/O
ECIO w/ PLL 16x PLL 1 1 1 0 1 1 1 1 I/O
FRC w/ PLL 4x PLL 1 1 1 0 0 0 0 1 I/O
FRC w/ PLL 8x PLL 1 1 1 0 1 0 1 0 I/O
FRC w/ PLL 16x PLL 1 1 1 0 0 0 1 1 I/O
XT w/ PLL 4x PLL 1 1 1 0 0 1 0 1 OSC2
XT w/ PLL 8x PLL 1 1 1 0 0 1 1 0 OSC2
XT w/ PLL 16x PLL 1 1 1 0 0 1 1 1 OSC2
HS2 w/ PLL 4x PLL 1 1 1 1 0 0 0 1 OSC2
HS2 w/ PLL 8x PLL 1 1 1 1 0 0 1 0 OSC2
HS2 w/ PLL 16x PLL 1 1 1 1 0 0 1 1 OSC2
HS3 w/ PLL 4x PLL 1 1 1 1 0 1 0 1 OSC2
HS3 w/ PLL 8x PLL 1 1 1 1 0 1 1 0 OSC2
HS3 w/ PLL 16x PLL 1 1 1 1 0 1 1 1 OSC2
ECIO External 0 1 1 0 1 1 0 0 I/O
XT External 0 1 1 0 0 1 0 0 OSC2
HS External 0 1 1 0 0 0 1 0 OSC2
EC External 0 1 1 0 1 0 1 1 CLKOUT
ERC External 0 1 1 0 1 0 0 1 CLKOUT
ERCIO External 0 1 1 0 1 0 0 0 I/O
XTL External 0 1 1 0 0 0 0 0 OSC2
LP Secondary 0 0 0 X X X X X (Notes 1, 2)
FRC Internal FRC 0 0 1 X X X X X (Notes 1, 2)
LPRC Internal LPRC 0 1 0 X X X X X (Notes 1, 2)
Note 1: OSC2 pin function is determined by (FPR<4:0>).
2: Note that OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock
source is selected at all times.

DS70083G-page 156 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
20.2.2 OSCILLATOR START-UP TIMER 20.2.5 FAST RC OSCILLATOR (FRC)
(OST) The FRC oscillator is a fast (8 MHz nominal) internal
In order to ensure that a crystal oscillator (or ceramic RC oscillator. This oscillator is intended to provide
resonator) has started and stabilized, an Oscillator reasonable device operating speeds without the use of
Start-up Timer is included. It is a simple 10-bit counter an external crystal, ceramic resonator, or RC network.
that counts 1024 TOSC cycles before releasing the The FRC oscillator can be used with the PLL to obtain
oscillator clock to the rest of the system. The time-out higher clock frequencies.
period is designated as TOST. The TOST time is involved The dsPIC30F operates from the FRC oscillator when-
every time the oscillator has to restart (i.e., on POR, ever the current oscillator selection control bits in the
BOR and wake-up from Sleep). The Oscillator Start-up OSCCON register (OSCCON<14:12>) are set to ‘001’.
Timer is applied to the LP oscillator, XT, XTL, and HS
modes (upon wake-up from Sleep, POR and BOR) for The four bit field specified by TUN<3:0> (OSCON
the primary oscillator. <15:14> and OSCON<11:10>) allows the user to tune
the internal fast RC oscillator (nominal 8.0 MHz). The
20.2.3 LP OSCILLATOR CONTROL user can tune the FRC oscillator within a range of
+10.5% (840 kHz) and -12% (960 kHz) in steps of
Enabling the LP oscillator is controlled with two 1.50% around the factory-calibrated setting, see
elements: Table 20-4.
1. The current oscillator group bits COSC<2:0>. If OSCCON<14:12> are set to ‘111’ and FPR<4:0> are
2. The LPOSCEN bit (OSCON register). set to ‘00101’, ‘00110’ or ‘00111’, then a PLL multiplier
The LP oscillator is on (even during Sleep mode) if of 4, 8 or 16 (respectively) is applied.
LPOSCEN = 1. The LP oscillator is the device clock if:
Note: When a 16x PLL is used, the FRC fre-
• COSC<2:0> = 00 (LP selected as main oscillator) quency must not be tuned to a frequency
and greater than 7.5 MHz.
• LPOSCEN = 1
Keeping the LP oscillator on at all times allows for a fast TABLE 20-4: FRC TUNING
switch to the 32 kHz system clock for lower power oper- TUN<3:0>
ation. Returning to the faster main oscillator will still FRC Frequency
Bits
require a start-up time
0111 + 10.5%
20.2.4 PHASE LOCKED LOOP (PLL) 0110 + 9.0%
The PLL multiplies the clock which is generated by the 0101 + 7.5%
primary oscillator. The PLL is selectable to have either 0100 + 6.0%
gains of x4, x8, and x16. Input and output frequency 0011 + 4.5%
ranges are summarized in Table 20-3. 0010 + 3.0%
TABLE 20-3: PLL FREQUENCY RANGE 0001 + 1.5%
0000 Center Frequency (oscillator is
PLL
FIN FOUT running at calibrated frequency)
Multiplier
1111 - 1.5%
4 MHz-10 MHz x4 16 MHz-40 MHz 1110 - 3.0%
4 MHz-10 MHz x8 32 MHz-80 MHz 1101 - 4.5%
4 MHz-7.5 MHz x16 64 MHz-160 MHz 1100 - 6.0%
The PLL features a lock output which is asserted when 1011 - 7.5%
the PLL enters a phase locked state. Should the loop 1010 - 9.0%
fall out of lock (e.g., due to noise), the lock signal will be 1001 - 10.5%
rescinded. The state of this signal is reflected in the
1000 - 12.0%
read only LOCK bit in the OSCCON register.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 157

dsPIC30F
20.2.6 LOW POWER RC OSCILLATOR If the oscillator has a very slow start-up time coming out
(LPRC) of POR, BOR or Sleep, it is possible that the PWRT
timer will expire before the oscillator has started. In
The LPRC oscillator is a component of the Watchdog
such cases, the FSCM will be activated and the FSCM
Timer (WDT) and oscillates at a nominal frequency of
will initiate a clock failure trap, and the COSC<2:0> bits
512 kHz. The LPRC oscillator is the clock source for
are loaded with FRC oscillator selection. This will effec-
the Power-up Timer (PWRT) circuit, WDT, and clock
tively shut-off the original oscillator that was trying to
monitor circuits. It may also be used to provide a low
start.
frequency clock source option for applications where
power consumption is critical and timing accuracy is The user may detect this situation and restart the
not required oscillator in the clock fail trap ISR.
The LPRC oscillator is always enabled at a Power-on Upon a clock failure detection, the FSCM module will
Reset because it is the clock source for the PWRT. initiate a clock switch to the FRC oscillator as follows:
After the PWRT expires, the LPRC oscillator will 1. The COSC bits (OSCCON<14:12>) are loaded
remain on if one of the following is TRUE: with the FRC oscillator selection value.
• The Fail-Safe Clock Monitor is enabled 2. CF bit is set (OSCCON<3>).
• The WDT is enabled 3. OSWEN control bit (OSCCON<0>) is cleared.
• The LPRC oscillator is selected as the system For the purpose of clock switching, the clock sources
clock via the COSC<2:0> control bits in the are sectioned into four groups:
OSCCON register
1. Primary
If one of the above conditions is not true, the LPRC will 2. Secondary
shut-off after the PWRT expires.
3. Internal FRC
Note 1: OSC2 pin function is determined by the 4. Internal LPRC
Primary Oscillator mode selection
(FPR<4:0>). The user can switch between these functional groups
but cannot switch between options within a group. If the
2: OSC1 pin cannot be used as an I/O pin primary group is selected, then the choice within the
even if the secondary oscillator or an group is always determined by the FPR<4:0>
internal clock source is selected at all configuration bits.
times.
The OSCCON register holds the control and status bits
20.2.7 FAIL-SAFE CLOCK MONITOR related to clock switching.

The Fail-Safe Clock Monitor (FSCM) allows the device • COSC<1:0>: Read only status bits always reflect
to continue to operate even in the event of an oscillator the current oscillator group in effect.
failure. The FSCM function is enabled by appropriately • NOSC<2:0>: Control bits which are written to
programming the FCKSM configuration bits (clock indicate the new oscillator group of choice.
switch and monitor selection bits) in the FOSC Device - On POR and BOR, COSC<2:0> and
Configuration register. If the FSCM function is enabled, NOSC<1:0> are both loaded with the
the LPRC internal oscillator will run at all times (except configuration bit values FOS<2:0>.
during Sleep mode) and will not be subject to control by • LOCK: The LOCK status bit indicates a PLL lock.
the SWDTEN bit. • CF: Read only status bit indicating if a clock fail
In the event of an oscillator failure, the FSCM will gen- detect has occurred.
erate a clock failure trap event and will switch the sys- • OSWEN: Control bit changes from a ‘0’ to a ‘1’
tem clock over to the FRC oscillator. The user will then when a clock transition sequence is initiated.
have the option to either attempt to restart the oscillator Clearing the OSWEN control bit will abort a clock
or execute a controlled shutdown. The user may decide transition in progress (used for hang-up
to treat the trap as a warm Reset by simply loading the situations).
Reset address into the oscillator fail trap vector. In this
If configuration bits FCKSM<2:0> = 1x, then the clock
event, the CF (Clock Fail) status bit (OSCCON<3>) is
switching and Fail-Safe Clock monitoring functions are
also set whenever a clock failure is recognized.
disabled. This is the default configuration bit setting.
In the event of a clock failure, the WDT is unaffected
and continues to run on the LPRC clock.

DS70083G-page 158 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
If clock switching is disabled, then the FOS<2:0> and Byte write is allowed for one instruction cycle. Write the
FPR<4:0> bits directly control the oscillator selection desired value or use bit manipulation instruction.
and the COSC<2:0> bits do not control the clock selec-
tion. However, these bits will reflect the clock source 20.3 Reset
selection.
The dsPIC30F differentiates between various kinds of
Note: The application should not attempt to Reset:
switch to a clock of frequency lower than
a) Power-on Reset (POR)
100 KHz when the fail-safe clock monitor is
enabled. If such clock switching is b) MCLR Reset during normal operation
performed, the device may generate an c) MCLR Reset during Sleep
oscillator fail trap and switch to the Fast RC d) Watchdog Timer (WDT) Reset (during normal
oscillator. operation)
e) Programmable Brown-out Reset (BOR)
20.2.8 PROTECTION AGAINST f) RESET Instruction
ACCIDENTAL WRITES TO OSCCON g) Reset caused by trap lockup (TRAPR)
A write to the OSCCON register is intentionally made h) Reset caused by illegal opcode or by using an
difficult because it controls clock switching and clock uninitialized W register as an address pointer
scaling. (IOPUWR)
To write to the OSCCON low byte, the following code Different registers are affected in different ways by var-
sequence must be executed without any other ious Reset conditions. Most registers are not affected
instructions in between: by a WDT wake-up since this is viewed as the resump-
Byte Write “0x46” to OSCCON low tion of normal operation. Status bits from the RCON
Byte Write “0x57” to OSCCON low register are set or cleared differently in different Reset
situations, as indicated in Table 20-5. These bits are
Byte write is allowed for one instruction cycle. Write the used in software to determine the nature of the Reset.
desired value or use bit manipulation instruction. A block diagram of the On-Chip Reset Circuit is shown
To write to the OSCCON high byte, the following in Figure 20-2.
instructions must be executed without any other A MCLR noise filter is provided in the MCLR Reset
instructions in between: path. The filter detects and ignores small pulses.
Byte Write “0x78” to OSCCON high Internally generated Resets do not drive MCLR pin low.
Byte Write “0x9A” to OSCCON high

FIGURE 20-2: RESET SYSTEM BLOCK DIAGRAM

RESET
Instruction

Digital
Glitch Filter
MCLR
Sleep or Idle
WDT
Module

VDD Rise POR

Detect S
VDD
Brown-out BOR
Reset
BOREN
R Q
SYSRST
Trap Conflict

Illegal Opcode/
Uninitialized W Register

 2004 Microchip Technology Inc. Preliminary DS70083G-page 159

dsPIC30F
20.3.1 POR: POWER-ON RESET The POR circuit inserts a small delay, TPOR, which is
nominally 10 µs and ensures that the device bias cir-
A power-on event will generate an internal POR pulse
cuits are stable. Furthermore, a user selected power-
when a VDD rise is detected. The Reset pulse will occur
up time-out (TPWRT) is applied. The TPWRT parameter
at the POR circuit threshold voltage (VPOR) which is
is based on device configuration bits and can be 0 ms
nominally 1.85V. The device supply voltage character-
(no delay), 4 ms, 16 ms, or 64 ms. The total delay is at
istics must meet specified starting voltage and rise rate
device power-up, TPOR + TPWRT. When these delays
requirements. The POR pulse will reset a POR timer
have expired, SYSRST will be negated on the next
and place the device in the Reset state. The POR also
leading edge of the Q1 clock and the PC will jump to the
selects the device clock source identified by the oscil-
Reset vector.
lator configuration fuses.
The timing for the SYSRST signal is shown in
Figure 20-3 through Figure 20-5.

FIGURE 20-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)

VDD

MCLR

INTERNAL POR

TOST
OST TIME-OUT
TPWRT

PWRT TIME-OUT

INTERNAL Reset

FIGURE 20-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1

VDD

MCLR

INTERNAL POR

TOST
OST TIME-OUT
TPWRT

PWRT TIME-OUT

INTERNAL Reset

DS70083G-page 160 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 20-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2

VDD

MCLR

INTERNAL POR

TOST
OST TIME-OUT
TPWRT

PWRT TIME-OUT

INTERNAL Reset

 2004 Microchip Technology Inc. Preliminary DS70083G-page 161

dsPIC30F
20.3.1.1 POR with Long Crystal Start-up Time A BOR will generate a Reset pulse which will reset the
(with FSCM Enabled) device. The BOR will select the clock source based on
the device configuration bit values (FOS<1:0> and
The oscillator start-up circuitry is not linked to the POR
FPR<3:0>). Furthermore, if an Oscillator mode is
circuitry. Some crystal circuits (especially low fre-
selected, the BOR will activate the Oscillator Start-up
quency crystals) will have a relatively long start-up
Timer (OST). The system clock is held until OST
time. Therefore, one or more of the following conditions
expires. If the PLL is used, then the clock will be held
is possible after the POR timer and the PWRT have
until the LOCK bit (OSCCON<5>) is ‘1’.
expired:
Concurrently, the POR time-out (TPOR) and the PWRT
• The oscillator circuit has not begun to oscillate.
time-out (TPWRT) will be applied before the internal Reset
• The Oscillator Start-up Timer has not expired (if a is released. If TPWRT = 0 and a crystal oscillator is being
crystal oscillator is used). used, then a nominal delay of TFSCM = 100 µs is applied.
• The PLL has not achieved a LOCK (if PLL is The total delay in this case is (TPOR + TFSCM).
used).
The BOR status bit (RCON<1>) will be set to indicate
If the FSCM is enabled and one of the above conditions that a BOR has occurred. The BOR circuit, if enabled,
is true, then a clock failure trap will occur. The device will continue to operate while in Sleep or Idle modes
will automatically switch to the FRC oscillator and the and will reset the device should VDD fall below the BOR
user can switch to the desired crystal oscillator in the threshold voltage.
trap ISR.
FIGURE 20-6: EXTERNAL POWER-ON
20.3.1.2 Operating without FSCM and PWRT
RESET CIRCUIT (FOR
If the FSCM is disabled and the Power-up Timer SLOW VDD POWER-UP)
(PWRT) is also disabled, then the device will exit rap-
idly from Reset on power-up. If the clock source is VDD
FRC, LPRC, EXTRC or EC, it will be active
immediately. D R
R1
If the FSCM is disabled and the system clock has not MCLR
started, the device will be in a frozen state at the Reset
vector until the system clock starts. From the user’s C dsPIC30F
perspective, the device will appear to be in Reset until
a system clock is available.
Note 1: External Power-on Reset circuit is required
20.3.2 BOR: PROGRAMMABLE only if the VDD power-up slope is too slow.
The diode D helps discharge the capacitor
BROWN-OUT RESET quickly when VDD powers down.
The BOR (Brown-out Reset) module is based on an 2: R should be suitably chosen so as to make
internal voltage reference circuit. The main purpose of sure that the voltage drop across R does not
the BOR module is to generate a device Reset when a violate the device’s electrical specifications.
brown-out condition occurs. Brown-out conditions are 3: R1 should be suitably chosen so as to limit
generally caused by glitches on the AC mains (i.e., any current flowing into MCLR from external
missing portions of the AC cycle waveform due to bad capacitor C, in the event of MCLR/VPP pin
breakdown due to Electrostatic Discharge
power transmission lines, or voltage sags due to exces-
(ESD), or Electrical Overstress (EOS).
sive current draw when a large inductive load is turned
on).
The BOR module allows selection of one of the
following voltage trip points: Note: Dedicated supervisory devices, such as
the MCP1XX and MCP8XX, may also be
• 2.0V
used as an external Power-on Reset
• 2.7V circuit.
• 4.2V
• 4.5V

Note: The BOR voltage trip points indicated here

are nominal values provided for design
guidance only. Refer to the Electrical
Specifications in the specific device data
sheet for BOR voltage limit specifications.

DS70083G-page 162 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
Table 20-5 shows the Reset conditions for the RCON
register. Since the control bits within the RCON register
are R/W, the information in the table implies that all the
bits are negated prior to the action specified in the
condition column.

TABLE 20-5: INITIALIZATION CONDITION FOR RCON REGISTER: CASE 1

Program
Condition TRAPR IOPUWR EXTR SWR WDTO Idle Sleep POR BOR
Counter
Power-on Reset 0x000000 0 0 0 0 0 0 0 1 1
Brown-out Reset 0x000000 0 0 0 0 0 0 0 0 1
MCLR Reset during normal 0x000000 0 0 1 0 0 0 0 0 0
operation
Software Reset during 0x000000 0 0 0 1 0 0 0 0 0
normal operation
MCLR Reset during Sleep 0x000000 0 0 1 0 0 0 1 0 0
MCLR Reset during Idle 0x000000 0 0 1 0 0 1 0 0 0
WDT Time-out Reset 0x000000 0 0 0 0 1 0 0 0 0
WDT Wake-up PC + 2 0 0 0 0 1 0 1 0 0
Interrupt Wake-up from (1)
PC + 2 0 0 0 0 0 0 1 0 0
Sleep
Clock Failure Trap 0x000004 0 0 0 0 0 0 0 0 0
Trap Reset 0x000000 1 0 0 0 0 0 0 0 0
Illegal Operation Trap 0x000000 0 1 0 0 0 0 0 0 0
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’
Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 163

dsPIC30F
Table 20-6 shows a second example of the bit
conditions for the RCON register. In this case, it is not
assumed the user has set/cleared specific bits prior to
action specified in the condition column.

TABLE 20-6: INITIALIZATION CONDITION FOR RCON REGISTER: CASE 2

Program
Condition TRAPR IOPUWR EXTR SWR WDTO Idle Sleep POR BOR
Counter
Power-on Reset 0x000000 0 0 0 0 0 0 0 1 1
Brown-out Reset 0x000000 u u u u u u u 0 1
MCLR Reset during normal 0x000000 u u 1 0 0 0 0 u u
operation
Software Reset during 0x000000 u u 0 1 0 0 0 u u
normal operation
MCLR Reset during Sleep 0x000000 u u 1 u 0 0 1 u u
MCLR Reset during Idle 0x000000 u u 1 u 0 1 0 u u
WDT Time-out Reset 0x000000 u u 0 0 1 0 0 u u
WDT Wake-up PC + 2 u u u u 1 u 1 u u
Interrupt Wake-up from (1)
PC + 2 u u u u u u 1 u u
Sleep
Clock Failure Trap 0x000004 u u u u u u u u u
Trap Reset 0x000000 1 u u u u u u u u
Illegal Operation Reset 0x000000 u 1 u u u u u u u
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’
Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.

DS70083G-page 164 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
20.4 Watchdog Timer (WDT) 20.6 Power Saving Modes
20.4.1 WATCHDOG TIMER OPERATION There are two power saving states that can be entered
through the execution of a special instruction, PWRSAV;
The primary function of the Watchdog Timer (WDT) is these are Sleep and Idle.
to reset the processor in the event of a software mal-
function. The WDT is a free-running timer which runs The format of the PWRSAV instruction is as follows:
off an on-chip RC oscillator, requiring no external com- PWRSAV <parameter>, where ‘parameter’ defines
ponent. Therefore, the WDT timer will continue to oper- Idle or Sleep mode.
ate even if the main processor clock (e.g., the crystal
oscillator) fails. 20.6.1 SLEEP MODE
In Sleep mode, the clock to the CPU and peripherals is
20.4.2 ENABLING AND DISABLING shutdown. If an on-chip oscillator is being used, it is
THE WDT shutdown.
The Watchdog Timer can be “Enabled” or “Disabled” The Fail-Safe Clock Monitor is not functional during
only through a configuration bit (FWDTEN) in the Sleep since there is no clock to monitor. However,
Configuration register, FWDT. LPRC clock remains active if WDT is operational during
Setting FWDTEN = 1 enables the Watchdog Timer. The Sleep.
enabling is done when programming the device. By The brown-out protection circuit and the Low Voltage
default, after chip erase, FWDTEN bit = 1. Any device Detect circuit, if enabled, will remain functional during
programmer capable of programming dsPIC30F Sleep.
devices allows programming of this and other
configuration bits. The processor wakes up from Sleep if at least one of
the following conditions has occurred:
If enabled, the WDT will increment until it overflows or
“times out”. A WDT time-out will force a device Reset • any interrupt that is individually enabled and
(except during Sleep). To prevent a WDT time-out, the meets the required priority level
user must clear the Watchdog Timer using a CLRWDT • any Reset (POR, BOR and MCLR)
instruction. • WDT time-out
If a WDT times out during Sleep, the device will wake- On waking up from Sleep mode, the processor will
up. The WDTO bit in the RCON register will be cleared restart the same clock that was active prior to entry into
to indicate a wake-up resulting from a WDT time-out. Sleep mode. When clock switching is enabled, bits
Setting FWDTEN = 0 allows user software to enable/ COSC<1:0> will determine the oscillator source that
disable the Watchdog Timer via the SWDTEN will be used on wake-up. If clock switch is disabled,
(RCON<5>) control bit. then there is only one system clock.
Note: If a POR or BOR occurred, the selection of
20.5 Low Voltage Detect the oscillator is based on the FOS<1:0>
and FPR<3:0> configuration bits.
The Low Voltage Detect (LVD) module is used to detect
when the VDD of the device drops below a threshold If the clock source is an oscillator, the clock to the
value, VLVD, which is determined by the LVDL<3:0> device will be held off until OST times out (indicating a
bits (RCON<11:8>) and is thus user programmable. stable oscillator). If PLL is used, the system clock is
The internal voltage reference circuitry requires a nom- held off until LOCK = 1 (indicating that the PLL is
inal amount of time to stabilize, and the BGST bit stable). In either case, TPOR, TLOCK and TPWRT delays
(RCON<13>) indicates when the voltage reference has are applied.
stabilized. If EC, FRC, LPRC or EXTRC oscillators are used, then
In some devices, the LVD threshold voltage may be a delay of TPOR (~ 10 µs) is applied. This is the smallest
applied externally on the LVDIN pin. delay possible on wake-up from Sleep.

The LVD module is enabled by setting the LVDEN bit Moreover, if LP oscillator was active during Sleep and
(RCON<12>). LP is the oscillator used on wake-up, then the start-up
delay will be equal to TPOR. PWRT delay and OST
timer delay are not applied. In order to have -the small-
est possible start-up delay when waking up from Sleep,
one of these faster wake-up options should be selected
before entering Sleep.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 165

dsPIC30F
Any interrupt that is individually enabled (using the cor- Any interrupt that is individually enabled (using IE bit)
responding IE bit) and meets the prevailing priority level and meets the prevailing priority level will be able to
will be able to wake-up the processor. The processor will wake-up the processor. The processor will process the
process the interrupt and branch to the ISR. The Sleep interrupt and branch to the ISR. The Idle status bit in
status bit in the RCON register is set upon wake-up. the RCON register is set upon wake-up.
Note: In spite of various delays applied (TPOR, Any Reset other than POR will set the Idle status bit.
TLOCK and TPWRT), the crystal oscillator On a POR, the Idle bit is cleared.
(and PLL) may not be active at the end of If Watchdog Timer is enabled, then the processor will
the time-out (e.g., for low frequency crys- wake-up from Idle mode upon WDT time-out. The Idle
tals). In such cases, if FSCM is enabled, and WDTO status bits are both set.
then the device will detect this as a clock
Unlike wake-up from Sleep, there are no time delays
failure and process the clock failure trap, the
involved in wake-up from Idle.
FRC oscillator will be enabled and the user
will have to re-enable the crystal oscillator. If
FSCM is not enabled, then the device will 20.7 Device Configuration Registers
simply suspend execution of code until the The configuration bits in each device configuration reg-
clock is stable and will remain in Sleep until ister specify some of the Device modes and are
the oscillator clock has started. programmed by a device programmer, or by using the
All Resets will wake-up the processor from Sleep In-Circuit Serial Programming™ (ICSP™) feature of
mode. Any Reset, other than POR, will set the Sleep the device. Each device configuration register is a
status bit. In a POR, the Sleep bit is cleared. 24-bit register, but only the lower 16 bits of each regis-
If the Watchdog Timer is enabled, then the processor ter are used to hold configuration data. There are four
will wake-up from Sleep mode upon WDT time-out. The device configuration registers available to the user:
Sleep and WDTO status bits are both set. 1. FOSC (0xF80000): Oscillator Configuration
Register
20.6.2 IDLE MODE 2. FWDT (0xF80002): Watchdog Timer
In Idle mode, the clock to the CPU is shutdown while Configuration Register
peripherals keep running. Unlike Sleep mode, the clock 3. FBORPOR (0xF80004): BOR and POR
source remains active. Configuration Register
Several peripherals have a control bit in each module 4. FGS (0xF8000A): General Code Segment
that allows them to operate during Idle. Configuration Register
LPRC Fail-Safe Clock remains active if clock failure The placement of the configuration bits is automatically
detect is enabled. handled when you select the device in your device pro-
grammer. The desired state of the configuration bits
The processor wakes up from Idle if at least one of the
may be specified in the source code (dependent on the
following conditions has occurred:
language tool used), or through the programming inter-
• any interrupt that is individually enabled (IE bit is face. After the device has been programmed, the appli-
‘1’) and meets the required priority level cation software may read the configuration bit values
• any Reset (POR, BOR, MCLR) through the table read instructions. For additional infor-
• WDT time-out mation, please refer to the Programming Specifications
of the device.
Upon wake-up from Idle mode, the clock is re-applied
to the CPU and instruction execution begins immedi- Note: If the code protection configuration fuse
ately, starting with the instruction following the PWRSAV bits (FGS<GCP> and FGS<GWRP>)
instruction. have been programmed, an erase of the
entire code-protected device is only
possible at voltages VDD ≥ 4.5V.

DS70083G-page 166 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
20.8 Peripheral Module Disable (PMD) 20.9 In-Circuit Debugger
Registers When MPLAB ICD2 is selected as a Debugger, the In-
The Peripheral Module Disable (PMD) registers pro- Circuit Debugging functionality is enabled. This func-
vide a method to disable a peripheral module by stop- tion allows simple debugging functions when used with
ping all clock sources supplied to that module. When a MPLAB IDE. When the device has this feature enabled,
peripheral is disabled via the appropriate PMD control some of the resources are not available for general
bit, the peripheral is in a minimum power consumption use. These resources include the first 80 bytes of Data
state. The control and status registers associated with RAM and two I/O pins.
the peripheral will also be disabled so writes to those One of four pairs of Debug I/O pins may be selected by
registers will have no effect and read values will be the user using configuration options in MPLAB IDE.
invalid. These pin pairs are named EMUD/EMUC, EMUD1/
A peripheral module will only be enabled if both the EMUC1, EMUD2/EMUC2 and MUD3/EMUC3.
associated bit in the the PMD register is cleared and In each case, the selected EMUD pin is the Emulation/
the peripheral is supported by the specific dsPIC vari- Debug Data line, and the EMUC pin is the Emulation/
ant. If the peripheral is present in the device, it is Debug Clock line. These pins will interface to the
enabled in the PMD register by default. MPLAB ICD 2 module available from Microchip. The
Note: If a PMD bit is set, the corresponding mod- selected pair of Debug I/O pins is used by MPLAB
ule is disabled after a delay of 1 instruction ICD 2 to send commands and receive responses, as
cycle. Similarly, if a PMD bit is cleared, the well as to send and receive data. To use the In-Circuit
corresponding module is enabled after a Debugger function of the device, the design must
delay of 1 instruction cycle (assuming the implement ICSP connections to MCLR, VDD, VSS,
module control registers are already PGC, PGD, and the selected EMUDx/EMUCx pin pair.
configured to enable module operation). This gives rise to two possibilities:
1. If EMUD/EMUC is selected as the Debug I/O pin
pair, then only a 5-pin interface is required, as
Note 1: In the dsPIC30F6011 and dsPIC30F6013
the EMUD and EMUC pin functions are multi-
devices, the DCIMD bit is readable and
plexed with the PGD and PGC pin functions in
writeable, and will be read as “1” when
all dsPIC30F devices.
set.
2. If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/
2: In the dsPIC30F3014 device, the T4MD, EMUC3 is selected as the Debug I/O pin pair,
T5MD, IC7MD, IC8MD, OC3MD, OC4MD then a 7-pin interface is required, as the
DCIMD and C1MD bits are readable and EMUDx/EMUCx pin functions (x = 1, 2 or 3) are
writeable, and will be reas as “1” when not multiplexed with the PGD and PGC pin
set. functions.
3: In the dsPIC30F2011, dsPIC30F3012
and dsPIC30F2012 devices, the U2MD
bit is readable and writeable, and will be
read as “1” when set.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 167

 TABLE 20-7: SYSTEM INTEGRATION REGISTER MAP
SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Name
RCON 0740 TRAPR IOPUWR BGST LVDEN LVDL<3:0> EXTR SWR SWDTEN WDTO Sleep Idle BOR POR (Note 1)
OSCCON 0742 — COSC<2:0> — NOSC<2:0> POST<1:0> LOCK — CF — LPOSCEN OSWEN (Note 2)
OSCTUN 0774 — — TUN3 TUN2 TUN1 TUN0 0000 0000 0000 0000

DS70083G-page 168
PMD1 0770 T5MD T4MD T3MD T2MD T1MD — — DCIMD I2CMD U2MD U1MD SPI2MD SPI1MD C2MD C1MD ADCMD 0000 0000 0000 0000
PMD2 0772 IC8MD IC7MD IC6MD IC5MD IC4MD IC3MD IC2MD IC1MD OC8MD OC7MD OC6MD OC5MD OC4MD OC3MD OC2MD OC1MD 0000 0000 0000 0000
dsPIC30F

Note 1: Reset state depends on type of Reset.

2: Reset state depends on configuration bits.

TABLE 20-8: DEVICE CONFIGURATION REGISTER MAP

File Name Addr. Bits 23-16 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

FOSC F80000 — FCKSM<1:0> — — — FOS<2:0> — — — FPR<4:0>

FWDT F80002 — FWDTEN — — — — — — — — — FWPSA<1:0> FWPSB<3:0>
FBORPOR F80004 — MCLREN — — — — — — — BOREN — BORV<1:0> — — FPWRT<1:0>
FGS F8000A — — — — — — — — — — — — — — — GCP GWRP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

Preliminary
 2004 Microchip Technology Inc.
 dsPIC30F
21.0 INSTRUCTION SET SUMMARY Most bit-oriented instructions (including simple rotate/
shift instructions) have two operands:
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
• The W register (with or without an address
reference source. For more information on the CPU, modifier) or file register (specified by the value of
peripherals, register descriptions and general device ‘Ws’ or ‘f’)
functionality, refer to the dsPIC30F Family Reference • The bit in the W register or file register
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F (specified by a literal value or indirectly by the
Programmer’s Reference Manual (DS70030). contents of register ‘Wb’)

The dsPIC30F instruction set adds many The literal instructions that involve data movement may
enhancements to the previous PICmicro® instruction use some of the following operands:
sets, while maintaining an easy migration from • A literal value to be loaded into a W register or file
PICmicro instruction sets. register (specified by the value of ‘k’)
Most instructions are a single program memory word • The W register or file register where the literal
(24 bits). Only three instructions require two program value is to be loaded (specified by ‘Wb’ or ‘f’)
memory locations. However, literal instructions that involve arithmetic or
Each single word instruction is a 24-bit word divided logical operations use some of the following operands:
into an 8-bit opcode which specifies the instruction • The first source operand which is a register ‘Wb’
type, and one or more operands which further specify without any address modifier
the operation of the instruction.
• The second source operand which is a literal
The instruction set is highly orthogonal and is grouped value
into five basic categories: • The destination of the result (only if not the same
• Word or byte-oriented operations as the first source operand) which is typically a
• Bit-oriented operations register ‘Wd’ with or without an address modifier
• Literal operations The MAC class of DSP instructions may use some of the
• DSP operations following operands:
• Control operations • The accumulator (A or B) to be used (required
operand)
Table 21-1 shows the general symbols used in
describing the instructions. • The W registers to be used as the two operands
• The X and Y address space pre-fetch operations
The dsPIC30F instruction set summary in Table 21-2
lists all the instructions, along with the status flags • The X and Y address space pre-fetch destinations
affected by each instruction. • The accumulator write back destination
Most word or byte-oriented W register instructions The other DSP instructions do not involve any
(including barrel shift instructions) have three multiplication, and may include:
operands: • The accumulator to be used (required)
• The first source operand which is typically a • The source or destination operand (designated as
register ‘Wb’ without any address modifier Wso or Wdo, respectively) with or without an
• The second source operand which is typically a address modifier
register ‘Ws’ with or without an address modifier • The amount of shift specified by a W register ‘Wn’
• The destination of the result which is typically a or a literal value
register ‘Wd’ with or without an address modifier The control instructions may use some of the following
However, word or byte-oriented file register instructions operands:
have two operands: • A program memory address
• The file register specified by the value ‘f’ • The mode of the table read and table write
• The destination, which could either be the file instructions
register ‘f’ or the W0 register, which is denoted as
‘WREG’

 2004 Microchip Technology Inc. Preliminary DS70083G-page 169

dsPIC30F
All instructions are a single word, except for certain which are single word instructions but take two or three
double-word instructions, which were made double- cycles. Certain instructions that involve skipping over
word instructions so that all the required information is the subsequent instruction require either two or three
available in these 48 bits. In the second word, the cycles if the skip is performed, depending on whether
8 MSbs are ‘0’s. If this second word is executed as an the instruction being skipped is a single word or two-
instruction (by itself), it will execute as a NOP. word instruction. Moreover, double-word moves
Most single word instructions are executed in a single require two cycles. The double-word instructions
instruction cycle, unless a conditional test is true or the execute in two instruction cycles.
program counter is changed as a result of the instruc- Note: For more details on the instruction set,
tion. In these cases, the execution takes two instruction refer to the Programmer’s Reference
cycles with the additional instruction cycle(s) executed Manual.
as a NOP. Notable exceptions are the BRA (uncondi-
tional/computed branch), indirect CALL/GOTO, all table
reads and writes, and RETURN/RETFIE instructions,

TABLE 21-1: SYMBOLS USED IN OPCODE DESCRIPTIONS

Field Description
#text Means literal defined by “text”
(text) Means “content of text”
[text] Means “the location addressed by text”
{ } Optional field or operation
<n:m> Register bit field
.b Byte mode selection
.d Double-Word mode selection
.S Shadow register select
.w Word mode selection (default)
Acc One of two accumulators {A, B}
AWB Accumulator write back destination address register ∈ {W13, [W13]+=2}
bit4 4-bit bit selection field (used in word addressed instructions) ∈ {0...15}
C, DC, N, OV, Z MCU status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero
Expr Absolute address, label or expression (resolved by the linker)
f File register address ∈ {0x0000...0x1FFF}
lit1 1-bit unsigned literal ∈ {0,1}
lit4 4-bit unsigned literal ∈ {0...15}
lit5 5-bit unsigned literal ∈ {0...31}
lit8 8-bit unsigned literal ∈ {0...255}
lit10 10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode
lit14 14-bit unsigned literal ∈ {0...16384}
lit16 16-bit unsigned literal ∈ {0...65535}
lit23 23-bit unsigned literal ∈ {0...8388608}; LSB must be 0
None Field does not require an entry, may be blank
OA, OB, SA, SB DSP status bits: AccA Overflow, AccB Overflow, AccA Saturate, AccB Saturate
PC Program Counter
Slit10 10-bit signed literal ∈ {-512...511}
Slit16 16-bit signed literal ∈ {-32768...32767}
Slit6 6-bit signed literal ∈ {-16...16}

DS70083G-page 170 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
TABLE 21-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field Description
Wb Base W register ∈ {W0..W15}
Wd Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Wdo Destination W register ∈
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Wm,Wn Dividend, Divisor working register pair (direct addressing)
Wm*Wm Multiplicand and Multiplier working register pair for Square instructions ∈
{W4*W4,W5*W5,W6*W6,W7*W7}
Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions ∈
{W4*W5,W4*W6,W4*W7,W5*W6,W5*W7,W6*W7}
Wn One of 16 working registers ∈ {W0..W15}
Wnd One of 16 destination working registers ∈ {W0..W15}
Wns One of 16 source working registers ∈ {W0..W15}
WREG W0 (working register used in file register instructions)
Ws Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Wso Source W register ∈
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
Wx X data space pre-fetch address register for DSP instructions
∈ {[W8]+=6, [W8]+=4, [W8]+=2, [W8], [W8]-=6, [W8]-=4, [W8]-=2,
[W9]+=6, [W9]+=4, [W9]+=2, [W9], [W9]-=6, [W9]-=4, [W9]-=2,
[W9+W12],none}
Wxd X data space pre-fetch destination register for DSP instructions ∈ {W4..W7}
Wy Y data space pre-fetch address register for DSP instructions
∈ {[W10]+=6, [W10]+=4, [W10]+=2, [W10], [W10]-=6, [W10]-=4, [W10]-=2,
[W11]+=6, [W11]+=4, [W11]+=2, [W11], [W11]-=6, [W11]-=4, [W11]-=2,
[W11+W12], none}
Wyd Y data space pre-fetch destination register for DSP instructions ∈ {W4..W7}

 2004 Microchip Technology Inc. Preliminary DS70083G-page 171

dsPIC30F
TABLE 21-2: INSTRUCTION SET OVERVIEW
Base
Assembly # of # of Status Flags
Instr Assembly Syntax Description
Mnemonic Words Cycles Affected
#
1 ADD ADD Acc Add Accumulators 1 1 OA,OB,SA,SB
ADD f f = f + WREG 1 1 C,DC,N,OV,Z
ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z
ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z
ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z
ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z
ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB
2 ADDC ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z
ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z
ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z
ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z
ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z
3 AND AND f f = f .AND. WREG 1 1 N,Z
AND f,WREG WREG = f .AND. WREG 1 1 N,Z
AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z
AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z
AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z
4 ASR ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z
ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z
ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z
ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z
ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z
5 BCLR BCLR f,#bit4 Bit Clear f 1 1 None
BCLR Ws,#bit4 Bit Clear Ws 1 1 None
6 BRA BRA C,Expr Branch if Carry 1 1 (2) None
BRA GE,Expr Branch if greater than or equal 1 1 (2) None
BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None
BRA GT,Expr Branch if greater than 1 1 (2) None
BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None
BRA LE,Expr Branch if less than or equal 1 1 (2) None
BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None
BRA LT,Expr Branch if less than 1 1 (2) None
BRA LTU,Expr Branch if unsigned less than 1 1 (2) None
BRA N,Expr Branch if Negative 1 1 (2) None
BRA NC,Expr Branch if Not Carry 1 1 (2) None
BRA NN,Expr Branch if Not Negative 1 1 (2) None
BRA NOV,Expr Branch if Not Overflow 1 1 (2) None
BRA NZ,Expr Branch if Not Zero 1 1 (2) None
BRA OA,Expr Branch if Accumulator A overflow 1 1 (2) None
BRA OB,Expr Branch if Accumulator B overflow 1 1 (2) None
BRA OV,Expr Branch if Overflow 1 1 (2) None
BRA SA,Expr Branch if Accumulator A saturated 1 1 (2) None
BRA SB,Expr Branch if Accumulator B saturated 1 1 (2) None
BRA Expr Branch Unconditionally 1 2 None
BRA Z,Expr Branch if Zero 1 1 (2) None
BRA Wn Computed Branch 1 2 None
7 BSET BSET f,#bit4 Bit Set f 1 1 None
BSET Ws,#bit4 Bit Set Ws 1 1 None
8 BSW BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None
BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None

DS70083G-page 172 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Assembly # of # of Status Flags
Instr Assembly Syntax Description
Mnemonic Words Cycles Affected
#
9 BTG BTG f,#bit4 Bit Toggle f 1 1 None
BTG Ws,#bit4 Bit Toggle Ws 1 1 None
10 BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1 None
(2 or 3)
BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1 None
(2 or 3)
11 BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1 None
(2 or 3)
BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1 None
(2 or 3)
12 BTST BTST f,#bit4 Bit Test f 1 1 Z
BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C
BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z
BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C
BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z
13 BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z
BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C
BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z
14 CALL CALL lit23 Call subroutine 2 2 None
CALL Wn Call indirect subroutine 1 2 None
15 CLR CLR f f = 0x0000 1 1 None
CLR WREG WREG = 0x0000 1 1 None
CLR Ws Ws = 0x0000 1 1 None
CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB
16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO,Sleep
17 COM COM f f=f 1 1 N,Z
COM f,WREG WREG = f 1 1 N,Z
COM Ws,Wd Wd = Ws 1 1 N,Z
18 CP CP f Compare f with WREG 1 1 C,DC,N,OV,Z
CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z
CP Wb,Ws Compare Wb with Ws (Wb - Ws) 1 1 C,DC,N,OV,Z
19 CP0 CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z
CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z
20 CP1 CP1 f Compare f with 0xFFFF 1 1 C,DC,N,OV,Z
CP1 Ws Compare Ws with 0xFFFF 1 1 C,DC,N,OV,Z
21 CPB CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z
CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z
CPB Wb,Ws Compare Wb with Ws, with Borrow 1 1 C,DC,N,OV,Z
(Wb - Ws - C)
22 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1 None
(2 or 3)
23 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1 None
(2 or 3)
24 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1 None
(2 or 3)
25 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if ≠ 1 1 None
(2 or 3)
26 DAW DAW Wn Wn = decimal adjust Wn 1 1 C
27 DEC DEC f f = f -1 1 1 C,DC,N,OV,Z
DEC f,WREG WREG = f -1 1 1 C,DC,N,OV,Z
DEC Ws,Wd Wd = Ws - 1 1 1 C,DC,N,OV,Z
28 DEC2 DEC2 f f = f -2 1 1 C,DC,N,OV,Z
DEC2 f,WREG WREG = f -2 1 1 C,DC,N,OV,Z
DEC2 Ws,Wd Wd = Ws - 2 1 1 C,DC,N,OV,Z

 2004 Microchip Technology Inc. Preliminary DS70083G-page 173

dsPIC30F
TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Assembly # of # of Status Flags
Instr Assembly Syntax Description
Mnemonic Words Cycles Affected
#
29 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None
30 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C,OV
DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV
DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C,OV
DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV
31 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N,Z,C,OV
32 DO DO #lit14,Expr Do code to PC+Expr, lit14+1 times 2 2 None
DO Wn,Expr Do code to PC+Expr, (Wn)+1 times 2 2 None
33 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB,
SA,SB,SAB
34 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB,
SA,SB,SAB
35 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None
36 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C
37 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C
38 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C
39 GOTO GOTO Expr Go to address 2 2 None
GOTO Wn Go to indirect 1 2 None
40 INC INC f f=f+1 1 1 C,DC,N,OV,Z
INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z
INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z
41 INC2 INC2 f f=f+2 1 1 C,DC,N,OV,Z
INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z
INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z
42 IOR IOR f f = f .IOR. WREG 1 1 N,Z
IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z
IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z
IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z
IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z
43 LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
44 LNK LNK #lit14 Link frame pointer 1 1 None
45 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z
LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z
LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z
LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z
LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z
46 MAC MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd, Multiply and Accumulate 1 1 OA,OB,OAB,
AWB SA,SB,SAB
MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB,
SA,SB,SAB
47 MOV MOV f,Wn Move f to Wn 1 1 None
MOV f Move f to f 1 1 N,Z
MOV f,WREG Move f to WREG 1 1 N,Z
MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None
MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None
MOV Wn,f Move Wn to f 1 1 None
MOV Wso,Wdo Move Ws to Wd 1 1 None
MOV WREG,f Move WREG to f 1 1 N,Z
MOV.D Wns,Wd Move Double from W(ns):W(ns+1) to Wd 1 2 None
MOV.D Ws,Wnd Move Double from Ws to W(nd+1):W(nd) 1 2 None
48 MOVSAC MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB Pre-fetch and store accumulator 1 1 None

DS70083G-page 174 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Assembly # of # of Status Flags
Instr Assembly Syntax Description
Mnemonic Words Cycles Affected
#
49 MPY MPY Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
50 MPY.N MPY.N Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multiply Wm by Wn) to Accumulator 1 1 None
51 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd, Multiply and Subtract from Accumulator 1 1 OA,OB,OAB,
AWB SA,SB,SAB
52 MUL MUL.SS Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * signed(Ws) 1 1 None
MUL.SU Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None
MUL.US Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None
MUL.UU Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) * 1 1 None
unsigned(Ws)
MUL.SU Wb,#lit5,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None
MUL.UU Wb,#lit5,Wnd {Wnd+1, Wnd} = unsigned(Wb) * 1 1 None
unsigned(lit5)
MUL f W3:W2 = f * WREG 1 1 None
53 NEG NEG Acc Negate Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
NEG f f=f+1 1 1 C,DC,N,OV,Z
NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z
NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z
54 NOP NOP No Operation 1 1 None
NOPR No Operation 1 1 None
55 POP POP f Pop f from top-of-stack (TOS) 1 1 None
POP Wdo Pop from top-of-stack (TOS) to Wdo 1 1 None
POP.D Wnd Pop from top-of-stack (TOS) to 1 2 None
W(nd):W(nd+1)
POP.S Pop Shadow Registers 1 1 All
56 PUSH PUSH f Push f to top-of-stack (TOS) 1 1 None
PUSH Wso Push Wso to top-of-stack (TOS) 1 1 None
PUSH.D Wns Push W(ns):W(ns+1) to top-of-stack (TOS) 1 2 None
PUSH.S Push Shadow Registers 1 1 None
57 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO,Sleep
58 RCALL RCALL Expr Relative Call 1 2 None
RCALL Wn Computed Call 1 2 None
59 REPEAT REPEAT #lit14 Repeat Next Instruction lit14+1 times 1 1 None
REPEAT Wn Repeat Next Instruction (Wn)+1 times 1 1 None
60 RESET RESET Software device Reset 1 1 None
61 RETFIE RETFIE Return from interrupt 1 3 (2) None
62 RETLW RETLW #lit10,Wn Return with literal in Wn 1 3 (2) None
63 RETURN RETURN Return from Subroutine 1 3 (2) None
64 RLC RLC f f = Rotate Left through Carry f 1 1 C,N,Z
RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z
RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z
65 RLNC RLNC f f = Rotate Left (No Carry) f 1 1 N,Z
RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z
RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z
66 RRC RRC f f = Rotate Right through Carry f 1 1 C,N,Z
RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z
RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z
67 RRNC RRNC f f = Rotate Right (No Carry) f 1 1 N,Z
RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z
RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z

 2004 Microchip Technology Inc. Preliminary DS70083G-page 175

dsPIC30F
TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Assembly # of # of Status Flags
Instr Assembly Syntax Description
Mnemonic Words Cycles Affected
#
68 SAC SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None
SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None
69 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z
70 SETM SETM f f = 0xFFFF 1 1 None
SETM WREG WREG = 0xFFFF 1 1 None
SETM Ws Ws = 0xFFFF 1 1 None
71 SFTAC SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB,
SA,SB,SAB
SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB,
SA,SB,SAB
72 SL SL f f = Left Shift f 1 1 C,N,OV,Z
SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z
SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z
SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z
SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z
73 SUB SUB Acc Subtract Accumulators 1 1 OA,OB,OAB,
SA,SB,SAB
SUB f f = f - WREG 1 1 C,DC,N,OV,Z
SUB f,WREG WREG = f - WREG 1 1 C,DC,N,OV,Z
SUB #lit10,Wn Wn = Wn - lit10 1 1 C,DC,N,OV,Z
SUB Wb,Ws,Wd Wd = Wb - Ws 1 1 C,DC,N,OV,Z
SUB Wb,#lit5,Wd Wd = Wb - lit5 1 1 C,DC,N,OV,Z
74 SUBB SUBB f f = f - WREG - (C) 1 1 C,DC,N,OV,Z
SUBB f,WREG WREG = f - WREG - (C) 1 1 C,DC,N,OV,Z
SUBB #lit10,Wn Wn = Wn - lit10 - (C) 1 1 C,DC,N,OV,Z
SUBB Wb,Ws,Wd Wd = Wb - Ws - (C) 1 1 C,DC,N,OV,Z
SUBB Wb,#lit5,Wd Wd = Wb - lit5 - (C) 1 1 C,DC,N,OV,Z
75 SUBR SUBR f f = WREG - f 1 1 C,DC,N,OV,Z
SUBR f,WREG WREG = WREG - f 1 1 C,DC,N,OV,Z
SUBR Wb,Ws,Wd Wd = Ws - Wb 1 1 C,DC,N,OV,Z
SUBR Wb,#lit5,Wd Wd = lit5 - Wb 1 1 C,DC,N,OV,Z
76 SUBBR SUBBR f f = WREG - f - (C) 1 1 C,DC,N,OV,Z
SUBBR f,WREG WREG = WREG -f - (C) 1 1 C,DC,N,OV,Z
SUBBR Wb,Ws,Wd Wd = Ws - Wb - (C) 1 1 C,DC,N,OV,Z
SUBBR Wb,#lit5,Wd Wd = lit5 - Wb - (C) 1 1 C,DC,N,OV,Z
77 SWAP SWAP.b Wn Wn = nibble swap Wn 1 1 None
SWAP Wn Wn = byte swap Wn 1 1 None
78 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None
79 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None
80 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None
81 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None
82 ULNK ULNK Unlink frame pointer 1 1 None
83 XOR XOR f f = f .XOR. WREG 1 1 N,Z
XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z
XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z
XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z
XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z
84 ZE ZE Ws,Wnd Wnd = Zero-extend Ws 1 1 C,Z,N

DS70083G-page 176 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
22.0 DEVELOPMENT SUPPORT 22.1 MPLAB Integrated Development
Environment Software
The PICmicro® microcontrollers are supported with a
full range of hardware and software development tools: The MPLAB IDE software brings an ease of software
• Integrated Development Environment development previously unseen in the 8/16-bit micro-
controller market. The MPLAB IDE is a Windows®
- MPLAB® IDE Software
based application that contains:
• Assemblers/Compilers/Linkers
• An interface to debugging tools
- MPASM™ Assembler
- simulator
- MPLAB C17 and MPLAB C18 C Compilers
- programmer (sold separately)
- MPLINK™ Object Linker/
MPLIB™ Object Librarian - emulator (sold separately)
- MPLAB C30 C Compiler - in-circuit debugger (sold separately)
- MPLAB ASM30 Assembler/Linker/Library • A full-featured editor with color coded context
• Simulators • A multiple project manager
- MPLAB SIM Software Simulator • Customizable data windows with direct edit of
contents
- MPLAB dsPIC30 Software Simulator
• High level source code debugging
• Emulators
• Mouse over variable inspection
- MPLAB ICE 2000 In-Circuit Emulator
• Extensive on-line help
- MPLAB ICE 4000 In-Circuit Emulator
• In-Circuit Debugger The MPLAB IDE allows you to:
- MPLAB ICD 2 • Edit your source files (either assembly or C)
• Device Programmers • One touch assemble (or compile) and download
- PRO MATE® II Universal Device Programmer to PICmicro emulator and simulator tools
(automatically updates all project information)
- PICSTART® Plus Development Programmer
• Debug using:
• Low Cost Demonstration Boards
- source files (assembly or C)
- PICDEM™ 1 Demonstration Board
- absolute listing file (mixed assembly and C)
- PICDEM.net™ Demonstration Board
- machine code
- PICDEM 2 Plus Demonstration Board
- PICDEM 3 Demonstration Board MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost effective
- PICDEM 4 Demonstration Board
simulators, through low cost in-circuit debuggers, to
- PICDEM 17 Demonstration Board full-featured emulators. This eliminates the learning
- PICDEM 18R Demonstration Board curve when upgrading to tools with increasing flexibility
- PICDEM LIN Demonstration Board and power.
- PICDEM USB Demonstration Board
• Evaluation Kits 22.2 MPASM Assembler
- KEELOQ® The MPASM assembler is a full-featured, universal
- PICDEM MSC macro assembler for all PICmicro MCUs.
- microID® The MPASM assembler generates relocatable object
- CAN files for the MPLINK object linker, Intel® standard HEX
- PowerSmart® files, MAP files to detail memory usage and symbol ref-
- Analog erence, absolute LST files that contain source lines and
generated machine code and COFF files for
debugging.
The MPASM assembler features include:
• Integration into MPLAB IDE projects
• User defined macros to streamline assembly code
• Conditional assembly for multi-purpose source
files
• Directives that allow complete control over the
assembly process

 2004 Microchip Technology Inc. Preliminary DS70083G-page 177

dsPIC30F
22.3 MPLAB C17 and MPLAB C18 22.6 MPLAB ASM30 Assembler, Linker,
C Compilers and Librarian
The MPLAB C17 and MPLAB C18 Code Development MPLAB ASM30 assembler produces relocatable
Systems are complete ANSI C compilers for machine code from symbolic assembly language for
Microchip’s PIC17CXXX and PIC18CXXX family of dsPIC30F devices. MPLAB C30 compiler uses the
microcontrollers. These compilers provide powerful assembler to produce it’s object file. The assembler
integration capabilities, superior code optimization and generates relocatable object files that can then be
ease of use not found with other compilers. archived or linked with other relocatable object files and
For easy source level debugging, the compilers provide archives to create an executable file. Notable features
symbol information that is optimized to the MPLAB IDE of the assembler include:
debugger. • Support for the entire dsPIC30F instruction set
• Support for fixed-point and floating-point data
22.4 MPLINK Object Linker/ • Command line interface
MPLIB Object Librarian • Rich directive set
The MPLINK object linker combines relocatable • Flexible macro language
objects created by the MPASM assembler and the • MPLAB IDE compatibility
MPLAB C17 and MPLAB C18 C compilers. It can link
relocatable objects from pre-compiled libraries, using 22.7 MPLAB SIM Software Simulator
directives from a linker script.
The MPLAB SIM software simulator allows code devel-
The MPLIB object librarian manages the creation and opment in a PC hosted environment by simulating the
modification of library files of pre-compiled code. When PICmicro series microcontrollers on an instruction
a routine from a library is called from a source file, only level. On any given instruction, the data areas can be
the modules that contain that routine will be linked in examined or modified and stimuli can be applied from
with the application. This allows large libraries to be a file, or user defined key press, to any pin. The execu-
used efficiently in many different applications. tion can be performed in Single-Step, Execute Until
The object linker/library features include: Break, or Trace mode.
• Efficient linking of single libraries instead of many The MPLAB SIM simulator fully supports symbolic
smaller files debugging using the MPLAB C17 and MPLAB C18
• Enhanced code maintainability by grouping C Compilers, as well as the MPASM assembler. The
related modules together software simulator offers the flexibility to develop and
• Flexible creation of libraries with easy module debug code outside of the laboratory environment,
listing, replacement, deletion and extraction making it an excellent, economical software
development tool.
22.5 MPLAB C30 C Compiler
22.8 MPLAB SIM30 Software Simulator
The MPLAB C30 C compiler is a full-featured, ANSI
compliant, optimizing compiler that translates standard The MPLAB SIM30 software simulator allows code
ANSI C programs into dsPIC30F assembly language development in a PC hosted environment by simulating
source. The compiler also supports many command- the dsPIC30F series microcontrollers on an instruction
line options and language extensions to take full level. On any given instruction, the data areas can be
advantage of the dsPIC30F device hardware capabili- examined or modified and stimuli can be applied from
ties, and afford fine control of the compiler code a file, or user defined key press, to any of the pins.
generator. The MPLAB SIM30 simulator fully supports symbolic
MPLAB C30 is distributed with a complete ANSI C debugging using the MPLAB C30 C Compiler and
standard library. All library functions have been vali- MPLAB ASM30 assembler. The simulator runs in either
dated and conform to the ANSI C library standard. The a Command Line mode for automated tasks, or from
library includes functions for string manipulation, MPLAB IDE. This high speed simulator is designed to
dynamic memory allocation, data conversion, time- debug, analyze and optimize time intensive DSP
keeping, and math functions (trigonometric, exponen- routines.
tial and hyperbolic). The compiler provides symbolic
information for high level source debugging with the
MPLAB IDE.

DS70083G-page 178 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
22.9 MPLAB ICE 2000 22.11 MPLAB ICD 2 In-Circuit Debugger
High Performance Universal Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
In-Circuit Emulator powerful, low cost, run-time development tool,
The MPLAB ICE 2000 universal in-circuit emulator is connecting to the host PC via an RS-232 or high speed
intended to provide the product development engineer USB interface. This tool is based on the Flash
with a complete microcontroller design tool set for PICmicro MCUs and can be used to develop for these
PICmicro microcontrollers. Software control of the and other PICmicro microcontrollers. The MPLAB
MPLAB ICE 2000 in-circuit emulator is advanced by ICD 2 utilizes the in-circuit debugging capability built
the MPLAB Integrated Development Environment, into the Flash devices. This feature, along with
which allows editing, building, downloading and source Microchip’s In-Circuit Serial Programming™ (ICSPTM)
debugging from a single environment. protocol, offers cost effective in-circuit Flash debugging
from the graphical user interface of the MPLAB Inte-
The MPLAB ICE 2000 is a full-featured emulator sys- grated Development Environment. This enables a
tem with enhanced trace, trigger and data monitoring designer to develop and debug source code by setting
features. Interchangeable processor modules allow the breakpoints, single-stepping and watching variables,
system to be easily reconfigured for emulation of differ- CPU status and peripheral registers. Running at full
ent processors. The universal architecture of the speed enables testing hardware and applications in
MPLAB ICE in-circuit emulator allows expansion to real-time. MPLAB ICD 2 also serves as a development
support new PICmicro microcontrollers. programmer for selected PICmicro devices.
The MPLAB ICE 2000 in-circuit emulator system has
been designed as a real-time emulation system with 22.12 PRO MATE II Universal Device
advanced features that are typically found on more Programmer
expensive development tools. The PC platform and
Microsoft® Windows 32-bit operating system were The PRO MATE II is a universal, CE compliant device
chosen to best make these features available in a programmer with programmable voltage verification at
simple, unified application. VDDMIN and VDDMAX for maximum reliability. It features
an LCD display for instructions and error messages
22.10 MPLAB ICE 4000 and a modular detachable socket assembly to support
various package types. In Stand-Alone mode, the
High Performance Universal
PRO MATE II device programmer can read, verify, and
In-Circuit Emulator program PICmicro devices without a PC connection. It
The MPLAB ICE 4000 universal in-circuit emulator is can also set code protection in this mode.
intended to provide the product development engineer
with a complete microcontroller design tool set for high- 22.13 PICSTART Plus Development
end PICmicro microcontrollers. Software control of the Programmer
MPLAB ICE in-circuit emulator is provided by the
MPLAB Integrated Development Environment, which The PICSTART Plus development programmer is an
allows editing, building, downloading and source easy-to-use, low cost, prototype programmer. It con-
debugging from a single environment. nects to the PC via a COM (RS-232) port. MPLAB
Integrated Development Environment software makes
The MPLAB ICD 4000 is a premium emulator system, using the programmer simple and efficient. The
providing the features of MPLAB ICE 2000, but with PICSTART Plus development programmer supports
increased emulation memory and high speed perfor- most PICmicro devices up to 40 pins. Larger pin count
mance for dsPIC30F and PIC18XXXX devices. Its devices, such as the PIC16C92X and PIC17C76X,
advanced emulator features include complex triggering may be supported with an adapter socket. The
and timing, up to 2 Mb of emulation memory, and the PICSTART Plus development programmer is CE
ability to view variables in real-time. compliant.
The MPLAB ICE 4000 in-circuit emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft Windows 32-bit operating system were cho-
sen to best make these features available in a simple,
unified application.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 179

dsPIC30F
22.14 PICDEM 1 PICmicro 22.17 PICDEM 3 PIC16C92X
Demonstration Board Demonstration Board
The PICDEM 1 demonstration board demonstrates the The PICDEM 3 demonstration board supports the
capabilities of the PIC16C5X (PIC16C54 to PIC16C923 and PIC16C924 in the PLCC package. All
PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, the necessary hardware and software is included to run
PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All the demonstration programs.
necessary hardware and software is included to run
basic demo programs. The sample microcontrollers 22.18 PICDEM 4 8/14/18-Pin
provided with the PICDEM 1 demonstration board can Demonstration Board
be programmed with a PRO MATE II device program-
mer, or a PICSTART Plus development programmer. The PICDEM 4 can be used to demonstrate the capa-
The PICDEM 1 demonstration board can be connected bilities of the 8-, 14-, and 18-pin PIC16XXXX and
to the MPLAB ICE in-circuit emulator for testing. A pro- PIC18XXXX MCUs, including the PIC16F818/819,
totype area extends the circuitry for additional applica- PIC16F87/88, PIC16F62XA and the PIC18F1320 fam-
tion components. Features include an RS-232 ily of microcontrollers. PICDEM 4 is intended to show-
interface, a potentiometer for simulated analog input, case the many features of these low pin count parts,
push button switches and eight LEDs. including LIN and Motor Control using ECCP. Special
provisions are made for low power operation with the
22.15 PICDEM.net Internet/Ethernet super capacitor circuit, and jumpers allow on-board
Demonstration Board hardware to be disabled to eliminate current draw in
this mode. Included on the demo board are provisions
The PICDEM.net demonstration board is an Internet/ for Crystal, RC or Canned Oscillator modes, a five volt
Ethernet demonstration board using the PIC18F452 regulator for use with a nine volt wall adapter or battery,
microcontroller and TCP/IP firmware. The board DB-9 RS-232 interface, ICD connector for program-
supports any 40-pin DIP device that conforms to the ming via ICSP and development with MPLAB ICD 2,
standard pinout used by the PIC16F877 or 2x16 liquid crystal display, PCB footprints for H-Bridge
PIC18C452. This kit features a user friendly TCP/IP motor driver, LIN transceiver and EEPROM. Also
stack, web server with HTML, a 24L256 Serial included are: header for expansion, eight LEDs, four
EEPROM for Xmodem download to web pages into potentiometers, three push buttons and a prototyping
Serial EEPROM, ICSP/MPLAB ICD 2 interface con- area. Included with the kit is a PIC16F627A and a
nector, an Ethernet interface, RS-232 interface, and a PIC18F1320. Tutorial firmware is included along with
16 x 2 LCD display. Also included is the book and the User’s Guide.
CD-ROM “TCP/IP Lean, Web Servers for Embedded
Systems,” by Jeremy Bentham 22.19 PICDEM 17 Demonstration Board

22.16 PICDEM 2 Plus The PICDEM 17 demonstration board is an evaluation

board that demonstrates the capabilities of several
Demonstration Board Microchip microcontrollers, including PIC17C752,
The PICDEM 2 Plus demonstration board supports PIC17C756A, PIC17C762 and PIC17C766. A pro-
many 18-, 28-, and 40-pin microcontrollers, including grammed sample is included. The PRO MATE II device
PIC16F87X and PIC18FXX2 devices. All the neces- programmer, or the PICSTART Plus development pro-
sary hardware and software is included to run the dem- grammer, can be used to reprogram the device for user
onstration programs. The sample microcontrollers tailored application development. The PICDEM 17
provided with the PICDEM 2 demonstration board can demonstration board supports program download and
be programmed with a PRO MATE II device program- execution from external on-board Flash memory. A
mer, PICSTART Plus development programmer, or generous prototype area is available for user hardware
MPLAB ICD 2 with a Universal Programmer Adapter. expansion.
The MPLAB ICD 2 and MPLAB ICE in-circuit emulators
may also be used with the PICDEM 2 demonstration
board to test firmware. A prototype area extends the
circuitry for additional application components. Some
of the features include an RS-232 interface, a 2 x 16
LCD display, a piezo speaker, an on-board temperature
sensor, four LEDs, and sample PIC18F452 and
PIC16F877 Flash microcontrollers.

DS70083G-page 180 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
22.20 PICDEM 18R PIC18C601/801 22.23 PICDEM USB PIC16C7X5
Demonstration Board Demonstration Board
The PICDEM 18R demonstration board serves to assist The PICDEM USB Demonstration Board shows off the
development of the PIC18C601/801 family of Microchip capabilities of the PIC16C745 and PIC16C765 USB
microcontrollers. It provides hardware implementation microcontrollers. This board provides the basis for
of both 8-bit Multiplexed/De-multiplexed and 16-bit future USB products.
Memory modes. The board includes 2 Mb external
Flash memory and 128 Kb SRAM memory, as well as 22.24 Evaluation and
serial EEPROM, allowing access to the wide range of Programming Tools
memory types supported by the PIC18C601/801.
In addition to the PICDEM series of circuits, Microchip
22.21 PICDEM LIN PIC16C43X has a line of evaluation kits and demonstration software
Demonstration Board for these products.
• KEELOQ evaluation and programming tools for
The powerful LIN hardware and software kit includes a Microchip’s HCS Secure Data Products
series of boards and three PICmicro microcontrollers.
• CAN developers kit for automotive network
The small footprint PIC16C432 and PIC16C433 are
applications
used as slaves in the LIN communication and feature
on-board LIN transceivers. A PIC16F874 Flash micro- • Analog design boards and filter design software
controller serves as the master. All three microcontrol- • PowerSmart battery charging evaluation/
lers are programmed with firmware to provide LIN bus calibration kits
communication. • IrDA® development kit
• microID development and rfLab™ development
22.22 PICkit™ 1 Flash Starter Kit software
A complete "development system in a box", the PICkit • SEEVAL® designer kit for memory evaluation and
Flash Starter Kit includes a convenient multi-section endurance calculations
board for programming, evaluation, and development • PICDEM MSC demo boards for Switching mode
of 8/14-pin Flash PIC® microcontrollers. Powered via power supply, high power IR driver, delta sigma
USB, the board operates under a simple Windows GUI. ADC, and flow rate sensor
The PICkit 1 Starter Kit includes the user's guide (on Check the Microchip web page and the latest Product
CD ROM), PICkit 1 tutorial software and code for vari- Line Card for the complete list of demonstration and
ous applications. Also included are MPLAB® IDE (Inte- evaluation kits.
grated Development Environment) software, software
and hardware "Tips 'n Tricks for 8-pin Flash PIC®
Microcontrollers" Handbook and a USB Interface
Cable. Supports all current 8/14-pin Flash PIC
microcontrollers, as well as many future planned
devices.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 181

dsPIC30F
NOTES:

DS70083G-page 182 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
23.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future
revisions of this document as it becomes available.
For detailed information about the dsPIC30F architecture and core, refer to dsPIC30F Family Reference Manual
(DS70046).
Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions above
the parameters indicated in the operation listings of this specification is not implied.
Note: The specifications listed in this section are provided for design guidance only. Please refer to the individual
device data sheets for electrical characteristics specific to each device.

Absolute Maximum Ratings(†)

Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD and MCLR) ................................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V
Voltage on MCLR with respect to VSS (Note 1) ......................................................................................... 0V to +13.25V
Total power dissipation (Note 2) ...............................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD) ..........................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ................................................................................................... ±20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports ..................................................................................................................200 mA
Note 1: Power dissipation is calculated as follows:
Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOl x IOL)
2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latchup.
Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather
than pulling this pin directly to VSS.

†NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.

Note: All peripheral electrical characteristics are specified. For exact peripherals available on specific
devices, please refer the the Family Cross Reference Table.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 183

dsPIC30F
23.1 DC Characteristics

TABLE 23-1: OPERATING MIPS VS. VOLTAGE

Max MIPS
VDD Range Temp Range
dsPIC30FXXX-30I dsPIC30FXXX-20I dsPIC30FXXX-20E
4.5-5.5V -40°C to 85°C 30 20 —
4.5-5.5V -40°C to 125°C — — 20
3.0-3.6V -40°C to 85°C 15 10 —
3.0-3.6V -40°C to 125°C — — 10
2.5-3.0V -40°C to 85°C 10 7.5 —

TABLE 23-2: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min Typ(1) Max Units Conditions
No.
Operating Voltage(2)
DC10 VDD Supply Voltage 2.5 — 5.5 V Industrial temperature
DC11 VDD Supply Voltage 3.0 — 5.5 V Extended temperature
DC12 VDR RAM Data Retention Voltage(3) — 1.5 — V
DC16 VPOR VDD Start Voltage — VSS — V
to ensure internal
Power-on Reset signal
DC17 SVDD VDD Rise Rate 0.05 V/ms 0-5V in 0.1 sec
to ensure internal 0-3V in 60 ms
Power-on Reset signal
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
3: This is the limit to which VDD can be lowered without losing RAM data.

DS70083G-page 184 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
TABLE 23-3: DC CHARACTERISTICS: OPERATING CURRENT (IDD)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Parameter
Typical(1) Max Units Conditions
No.
Operating Current (IDD)(2)
DC20 — — mA -40°C
DC20a 4 — mA 25°C
3.3V
DC20b — — mA 85°C
DC20c — — mA 125°C
1 MIPS EC mode
DC20d — — mA -40°C
DC20e 7 — mA 25°C
5V
DC20f — — mA 85°C
DC20g — — mA 125°C
DC23 — — mA -40°C
DC23a 13 — mA 25°C
3.3V
DC23b — — mA 85°C
DC23c — — mA 125°C
4 MIPS EC mode, 4X PLL
DC23d — — mA -40°C
DC23e 22 — mA 25°C
5V
DC23f — — mA 85°C
DC23g — — mA 125°C
DC24 — — mA -40°C
DC24a 29 — mA 25°C
3.3V
DC24b — — mA 85°C
DC24c — — mA 125°C
10 MIPS EC mode, 4X PLL
DC24d — — mA -40°C
DC24e 50 — mA 25°C
5V
DC24f — — mA 85°C
DC24g — — mA 125°C
DC25 — — mA -40°C
DC25a 23 — mA 25°C
3.3V
DC25b — — mA 85°C
DC25c — — mA 125°C
8 MIPS EC mode, 8X PLL
DC25d — — mA -40°C
DC25e 41 — mA 25°C
5V
DC25f — — mA 85°C
DC25g — — mA 125°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1
driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD.
MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data
Memory are operational. No peripheral modules are operating.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 185

dsPIC30F
TABLE 23-3: DC CHARACTERISTICS: OPERATING CURRENT (IDD) (CONTINUED)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Parameter
Typical(1) Max Units Conditions
No.
Operating Current (IDD)(2)
DC27 — — mA -40°C
DC27a 50 — mA 25°C 3.3V
DC27b — — mA 85°C
DC27c — — mA -40°C 20 MIPS EC mode, 8X PLL
DC27d 90 — mA 25°C
5V
DC27e — — mA 85°C
DC27f — — mA 125°C
DC28 — — mA -40°C
DC28a 42 — mA 25°C 3.3V
DC28b — — mA 85°C
DC28c — — mA -40°C 16 MIPS EC mode, 16X PLL
DC28d 76 — mA 25°C
5V
DC28e — — mA 85°C
DC28f — — mA 125°C
DC29 — — mA -40°C
DC29a 146 — mA 25°C
5V 30 MIPS EC mode, 16X PLL
DC29b — — mA 85°C
DC29c — — mA 125°C
DC30 — — mA -40°C
DC30a 7.0 — mA 25°C
3.3V
DC30b — — mA 85°C
DC30c — — mA 125°C
FRC (~ 2 MIPS)
DC30d — — mA -40°C
DC30e 12 — mA 25°C
5V
DC30f — — mA 85°C
DC30g — — mA 125°C
DC31 — — mA -40°C
DC31a 1.5 — mA 25°C
3.3V
DC31b — — mA 85°C
DC31c — — mA 125°C
LPRC (~ 512 kHz)
DC31d — — mA -40°C
DC31e 2.5 — mA 25°C
5V
DC31f — — mA 85°C
DC31g — — mA 125°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1
driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD.
MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data
Memory are operational. No peripheral modules are operating.

DS70083G-page 186 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
TABLE 23-4: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Parameter
Typical(1) Max Units Conditions
No.
Idle Current (IIDLE): Core OFF Clock ON Base Current(2)
DC40 — — mA -40°C
DC40a 3 — mA 25°C
3.3V
DC40b — — mA 85°C
DC40c — — mA 125°C
1 MIPS EC mode
DC40d — — mA -40°C
DC40e 5 — mA 25°C
5V
DC40f — — mA 85°C
DC40g — — mA 125°C
DC43 — — mA -40°C
DC43a 7.7 — mA 25°C
3.3V
DC43b — — mA 85°C
DC43c — — mA 125°C
4 MIPS EC mode, 4X PLL
DC43d — — mA -40°C
DC43e 13 — mA 25°C
5V
DC43f — — mA 85°C
DC43g — — mA 125°C
DC44 — — mA -40°C
DC44a 15 — mA 25°C
3.3V
DC44b — — mA 85°C
DC44c — — mA 125°C
10 MIPS EC mode, 4X PLL
DC44d — — mA -40°C
DC44e 29 — mA 25°C
5V
DC44f — — mA 85°C
DC44g — — mA 125°C
DC45 — — mA -40°C
DC45a 13 — mA 25°C
3.3V
DC45b — — mA 85°C
DC45c — — mA 125°C
8 MIPS EC mode, 8X PLL
DC45d — — mA -40°C
DC45e 24 — mA 25°C
5V
DC45f — — mA 85°C
DC45g — — mA 125°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: Base IIDLE current is measured with Core off, Clock on and all modules turned off.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 187

dsPIC30F
TABLE 23-4: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) (CONTINUED)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Parameter
Typical(1) Max Units Conditions
No.
Idle Current (IIDLE): Core OFF Clock ON Base Current(2)
DC47 — — mA -40°C
DC47a 29 — mA 25°C 3.3V
DC47b — — mA 85°C
DC47c — — mA -40°C 20 MIPS EC mode, 8X PLL
DC47d 52 — mA 25°C
5V
DC47e — — mA 85°C
DC47f — — mA 125°C
DC48 — — mA -40°C
DC48a 24 — mA 25°C 3.3V
DC48b — — mA 85°C
DC48c — — mA -40°C 16 MIPS EC mode, 16X PLL
DC48d 43 — mA 25°C
5V
DC48e — — mA 85°C
DC48f — — mA 125°C
DC49 — — mA -40°C
DC49a 73 — mA 25°C
5V 30 MIPS EC mode, 16X PLL
DC49b — — mA 85°C
DC49c — — mA 125°C
DC50 — — mA -40°C
DC50a 4.0 — mA 25°C
3.3V
DC50b — — mA 85°C
DC50c — — mA 125°C
FRC (~ 2 MIPS)
DC50d — — mA -40°C
DC50e 7.0 — mA 25°C
5V
DC50f — — mA 85°C
DC50g — — mA 125°C
DC51 — — mA -40°C
DC51a 1.0 — mA 25°C
3.3V
DC51b — — mA 85°C
DC51c — — mA 125°C
LPRC (~ 512 kHz)
DC51d — — mA -40°C
DC51e 1.5 — mA 25°C
5V
DC51f — — mA 85°C
DC51g — — mA 125°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: Base IIDLE current is measured with Core off, Clock on and all modules turned off.

DS70083G-page 188 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
TABLE 23-5: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Parameter
Typical(1) Max Units Conditions
No.
Power Down Current (IPD)(2)
DC60 — — µA -40°C
DC60a 0.1 — µA 25°C
3.3V
DC60b — — µA 85°C
DC60c — — µA 125°C
Base Power Down Current(3)
DC60d — — µA -40°C
DC60e 0.2 — µA 25°C
5V
DC60f — — µA 85°C
DC60g — — µA 125°C
DC61 — — µA -40°C
DC61a 6.8 — µA 25°C
3.3V
DC61b — — µA 85°C
DC61c — — µA 125°C
Watchdog Timer Current: ∆IWDT(3)
DC61d — — µA -40°C
DC61e 16 — µA 25°C
5V
DC61f — — µA 85°C
DC61g — — µA 125°C
DC62 — — µA -40°C
DC62a 5.5 — µA 25°C
3.3V
DC62b — — µA 85°C
DC62c — — µA 125°C
Timer 1 w/32 kHz Crystal: ∆ITI32(3)
DC62d — — µA -40°C
DC62e 7.5 — µA 25°C
5V
DC62f — — µA 85°C
DC62g — — µA 125°C
DC63 — — µA -40°C
DC63a 32 — µA 25°C
3.3V
DC63b — — µA 85°C
DC63c — — µA 125°C
BOR On: ∆IBOR(3)
DC63d — — µA -40°C
DC63e 38 — µA 25°C
5V
DC63f — — µA 85°C
DC63g — — µA 125°C
Note 1: Data in the Typical column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled high. LVD, BOR, WDT, etc. are all switched off.
3: The ∆ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 189

dsPIC30F
TABLE 23-5: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) (CONTINUED)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Parameter
Typical(1) Max Units Conditions
No.
Power Down Current (IPD)(2)
DC66 — — µA -40°C
DC66a 25 — µA 25°C
3.3V
DC66b — — µA 85°C
DC66c — — µA 125°C
Low Voltage Detect: ∆ILVD(3)
DC66d — — µA -40°C
DC66e 30 — µA 25°C
5V
DC66f — — µA 85°C
DC66g — — µA 125°C
Note 1: Data in the Typical column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled high. LVD, BOR, WDT, etc. are all switched off.
3: The ∆ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.

DS70083G-page 190 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
TABLE 23-6: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min Typ(1) Max Units Conditions
No.
VIL Input Low Voltage(2)
DI10 I/O pins:
with Schmitt Trigger buffer VSS — 0.2 VDD V
DI15 MCLR VSS — 0.2 VDD V
DI16 OSC1 (in XT, HS and LP modes) VSS — 0.2 VDD V
(3)
DI17 OSC1 (in RC mode) VSS — 0.3 VDD V
DI18 SDA, SCL TBD — TBD V SM bus disabled
DI19 SDA, SCL TBD — TBD V SM bus enabled
VIH Input High Voltage(2)
DI20 I/O pins:
with Schmitt Trigger buffer 0.8 VDD — VDD V
DI25 MCLR 0.8 VDD — VDD V
DI26 OSC1 (in XT, HS and LP modes) 0.7 VDD — VDD V
(3)
DI27 OSC1 (in RC mode) 0.9 VDD — VDD V
DI28 SDA, SCL TBD — TBD V SM bus disabled
DI29 SDA, SCL TBD — TBD V SM bus enabled
ICNPU CNXX Pull-up Current(2)
DI30 50 250 400 µA VDD = 5V, VPIN = VSS
DI31 TBD TBD TBD µA VDD = 3V, VPIN = VSS
IIL Input Leakage Current(2)(4)(5)
DI50 I/O ports — 0.01 ±1 µA VSS ≤ VPIN ≤ VDD,
Pin at hi-impedance
DI51 Analog input pins — 0.50 — µA VSS ≤ VPIN ≤ VDD,
Pin at hi-impedance
DI55 MCLR — 0.05 ±5 µA VSS ≤ VPIN ≤ VDD
DI56 OSC1 — 0.05 ±5 µA VSS ≤ VPIN ≤ VDD, XT, HS
and LP Osc mode
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
3: In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that
the dsPIC30F device be driven with an external clock while in RC mode.
4: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
5: Negative current is defined as current sourced by the pin.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 191

dsPIC30F
TABLE 23-7: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min Typ(1) Max Units Conditions
No.
VOL Output Low Voltage(2)
DO10 I/O ports — — 0.6 V IOL = 8.5 mA, VDD = 5V
— — TBD V IOL = 2.0 mA, VDD = 3V
DO16 OSC2/CLKOUT — — 0.6 V IOL = 1.6 mA, VDD = 5V
(RC or EC Osc mode) — — TBD V IOL = 2.0 mA, VDD = 3V
VOH Output High Voltage(2)
DO20 I/O ports VDD – 0.7 — — V IOH = -3.0 mA, VDD = 5V
TBD — — V IOH = -2.0 mA, VDD = 3V
DO26 OSC2/CLKOUT VDD – 0.7 — — V IOH = -1.3 mA, VDD = 5V
(RC or EC Osc mode) TBD — — V IOH = -2.0 mA, VDD = 3V
Capacitive Loading Specs
on Output Pins(2)
DO50 COSCO OSC2/SOSCO pin — — 15 pF In XTL, XT, HS and LP modes
when external clock is used to
drive OSC1.
DO56 CIO All I/O pins and OSC2 — — 50 pF RC or EC Osc mode
DO58 CB SCL, SDA — — 400 pF In I2C mode
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.

FIGURE 23-1: LOW-VOLTAGE DETECT CHARACTERISTICS

VDD

LV10

LVDIF
(LVDIF set by hardware)

DS70083G-page 192 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
TABLE 23-8: ELECTRICAL CHARACTERISTICS: LVDL
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Typ Max Units Conditions
No.
LV10 VPLVD LVDL Voltage on VDD transition LVDL = 0000(2) — — — V
high to low
LVDL = 0001(2) — — — V
LVDL = 0010(2) — — — V
(2)
LVDL = 0011 — — — V
LVDL = 0100 2.50 — 2.65 V
LVDL = 0101 2.70 — 2.86 V
LVDL = 0110 2.80 — 2.97 V
LVDL = 0111 3.00 — 3.18 V
LVDL = 1000 3.30 — 3.50 V
LVDL = 1001 3.50 — 3.71 V
LVDL = 1010 3.60 — 3.82 V
LVDL = 1011 3.80 — 4.03 V
LVDL = 1100 4.00 — 4.24 V
LVDL = 1101 4.20 — 4.45 V
LVDL = 1110 4.50 — 4.77 V
LV15 VLVDIN External LVD input pin LVDL = 1111 — — — V
threshold voltage
Note 1: These parameters are characterized but not tested in manufacturing.
2: These values not in usable operating range.

FIGURE 23-2: BROWN-OUT RESET CHARACTERISTICS

VDD

(Device not in Brown-out Reset)

BO15
BO10
(Device in Brown-out Reset)

RESET (due to BOR)

Power Up Time-out

 2004 Microchip Technology Inc. Preliminary DS70083G-page 193

dsPIC30F
TABLE 23-9: ELECTRICAL CHARACTERISTICS: BOR
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min Typ(1) Max Units Conditions
No.

BO10 VBOR BOR Voltage(2) on BORV = 00(3) — — — V Not in operating

VDD transition high to range
low BORV = 01 2.7 — 2.86 V
BORV = 10 4.2 — 4.46 V
BORV = 11 4.5 — 4.78 V
BO15 VBHYS — 5 — mV
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
3: 00 values not in usable operating range.

TABLE 23-10: DC CHARACTERISTICS: PROGRAM AND EEPROM

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min Typ(1) Max Units Conditions
No.
Data EEPROM Memory(2)
D120 ED Byte Endurance 100K 1M — E/W -40°C ≤ TA ≤ +85°C
D121 VDRW VDD for Read/Write VMIN — 5.5 V Using NVMCON to read/write
VMIN = Minimum operating
voltage
D122 TDEW Erase/Write Cycle Time — 2 — ms
D123 TRETD Characteristic Retention 40 100 — Year Provided no other specifications
are violated
D124 IDEW IDD during Programming — 10 30 mA Row erase
(2)
Program FLASH Memory
D130 EP Cell Endurance 10K 100K — E/W -40°C ≤ TA ≤ +85°C
D131 VPR VDD for Read VMIN — 5.5 V VMIN = Minimum operating
voltage
D132 VEB VDD for Bulk Erase 3.0 — 5.5 V
D133 VPEW VDD for Erase/Write 3.0 — 5.5 V
D134 TPEW Erase/Write Cycle Time — 2 — ms
D135 TRETD Characteristic Retention 40 100 — Year Provided no other specifications
are violated
D136 TEB ICSP Block Erase Time — 4 — ms
D137 IPEW IDD during Programming — 10 30 mA Row erase
D138 IEB IDD during Programming — 10 30 mA Bulk erase
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated.
2: These parameters are characterized but not tested in manufacturing.

DS70083G-page 194 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
23.2 AC Characteristics and Timing Parameters
The information contained in this section defines dsPIC30F AC characteristics and timing parameters.

TABLE 23-11: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Operating voltage VDD range as described in DC Spec Section 23.0.

FIGURE 23-3: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

Load Condition 1 - for all pins except OSC2 Load Condition 2 - for OSC2

VDD/2

RL Pin CL

VSS
CL
Pin RL = 464 Ω
CL = 50 pF for all pins except OSC2
VSS 5 pF for OSC2 output

FIGURE 23-4: EXTERNAL CLOCK TIMING

Q4 Q1 Q2 Q3 Q4 Q1

OSC1
OS20
OS30 OS30 OS31 OS31
OS25
CLKOUT

OS40 OS41

 2004 Microchip Technology Inc. Preliminary DS70083G-page 195

dsPIC30F
TABLE 23-12: EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min Typ(1) Max Units Conditions
No.

OS10 FOSC External CLKIN Frequency(2) DC — 40 MHz EC

(External clocks allowed only 4 — 10 MHz EC with 4x PLL
in EC mode) 4 — 10 MHz EC with 8x PLL
4 — 7.5 MHz EC with 16x PLL
Oscillator Frequency(2) DC — 4 MHz RC
0.4 — 4 MHz XTL
4 — 10 MHz XT
4 — 10 MHz XT with 4x PLL
4 — 10 MHz XT with 8x PLL
4 — 7.5 MHz XT with 16x PLL
10 — 25 MHz HS
31 — 33 kHz LP
— 8 — MHz FRC internal
— 512 — kHz LPRC internal
OS20 TOSC TOSC = 1/FOSC — — — — See parameter OS10
for FOSC value
OS25 TCY Instruction Cycle Time(2)(3) 33 — DC ns See Table 23-14
OS30 TosL, External Clock(2) in (OSC1) .45 x TOSC — — ns EC
TosH High or Low Time
OS31 TosR, External Clock(2) in (OSC1) — — 20 ns EC
TosF Rise or Fall Time
OS40 TckR CLKOUT Rise Time(2)(4) — 6 10 ns
OS41 TckF CLKOUT Fall Time(2)(4) — 6 10 ns
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
3: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the
“Max.” cycle time limit is “DC” (no clock) for all devices.
4: Measurements are taken in EC or ERC modes. The CLKOUT signal is measured on the OSC2 pin.
CLKOUT is low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).

DS70083G-page 196 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
TABLE 23-13: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Typ(2) Max Units Conditions
No.
OS50 FPLLI PLL Input Frequency Range(2) 4 — 10 MHz EC, XT modes with PLL
OS51 FSYS On-chip PLL Output(2) 16 — 120 MHz EC, XT modes with PLL
OS52 TLOC PLL Start-up Time (Lock Time) — 20 50 µs
OS53 DCLK CLKOUT Stability (Jitter) TBD 1 TBD % Measured over 100 ms
period
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.

TABLE 23-14: INTERNAL CLOCK TIMING EXAMPLES

Clock
FOSC MIPS(3) MIPS(3) MIPS(3) MIPS(3)
Oscillator TCY (µsec)(2)
(MHz)(1) w/o PLL w PLL x4 w PLL x8 w PLL x16
Mode
EC 0.200 20.0 0.05 — — —
4 1.0 1.0 4.0 8.0 16.0
10 0.4 2.5 10.0 20.0 —
25 0.16 25.0 — — —
XT 4 1.0 1.0 4.0 8.0 16.0
10 0.4 2.5 10.0 20.0 —
Note 1: Assumption: Oscillator Postscaler is divide by 1.
2: Instruction Execution Cycle Time: TCY = 1 / MIPS.
3: Instruction Execution Frequency: MIPS = (FOSC * PLLx) / 4 [since there are 4 Q clocks per instruction
cycle].

TABLE 23-15: INTERNAL RC ACCURACY

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Characteristic Min Typ Max Units Conditions
No.
FRC @ Freq = 8 MHz(1)
F16 TBD — TBD % -40°C to +85°C VDD = 3.3V
F19 TBD — TBD % -40°C to +85°C VDD = 5V
LPRC @ Freq = 512 kHz(2)
F20 TBD — TBD % -40°C to +85°C VDD = 3V
F21 TBD — TBD % -40°C to +85°C VDD = 5V
Note 1: Frequency calibrated at 25°C and 5V. TUN bits can be used to compensate for temperature drift.
2: LPRC frequency after calibration.
3: Change of LPRC frequency as VDD changes.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 197

dsPIC30F
FIGURE 23-5: CLKOUT AND I/O TIMING CHARACTERISTICS

I/O Pin
(Input)

DI35
DI40

I/O Pin Old Value New Value

(Output)
DO31
DO32

Note: Refer to Figure 23-3 for load conditions.

TABLE 23-16: CLKOUT AND I/O TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1)(2)(3) Min Typ(4) Max Units Conditions
No.
DO31 TIOR Port output rise time — 10 25 ns —
DO32 TIOF Port output fall time — 10 25 ns —
DI35 TINP INTx pin high or low time (output) 20 — — ns —
DI40 TRBP CNx high or low time (input) 2 TCY — — ns —
Note 1: These parameters are asynchronous events not related to any internal clock edges
2: Measurements are taken in RC mode and EC mode where CLKOUT output is 4 x TOSC.
3: These parameters are characterized but not tested in manufacturing.
4: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

DS70083G-page 198 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 23-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING CHARACTERISTICS

VDD SY12

MCLR

Internal SY10
POR

SY11
PWRT
Time-out
SY30
OSC
Time-out

Internal
RESET

Watchdog
Timer
RESET
SY20
SY13
SY13

I/O Pins

SY35
FSCM
Delay

Note: Refer to Figure 23-3 for load conditions.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 199

dsPIC30F
TABLE 23-17: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Typ(2) Max Units Conditions
No.
SY10 TmcL MCLR Pulse Width (low) 2 — — µs -40°C to +85°C
SY11 TPWRT Power-up Timer Period TBD 0 TBD ms -40°C to +85°C
TBD 4 TBD User programmable
TBD 16 TBD
TBD 64 TBD
SY12 TPOR Power On Reset Delay 3 10 30 µs -40°C to +85°C
SY13 TIOZ I/O Hi-impedance from MCLR — — 100 ns
Low or Watchdog Timer Reset
SY20 TWDT1 Watchdog Timer Time-out Period 1.8 2.0 2.2 ms VDD = 5V, -40°C to +85°C
(No Prescaler)
TWDT2 1.9 2.1 2.3 ms VDD = 3V, -40°C to +85°C
SY25 TBOR Brown-out Reset Pulse Width(3) 100 — — µs VDD ≤ VBOR (D034)
SY30 TOST Oscillation Start-up Timer Period — 1024 TOSC — — TOSC = OSC1 period
SY35 TFSCM Fail-Safe Clock Monitor Delay — 100 — µs -40°C to +85°C
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.
3: Refer to Figure 23-2 and Table 23-9 for BOR.

FIGURE 23-7: BAND GAP START-UP TIME CHARACTERISTICS

VBGAP
0V

Enable Band Gap

(see Note)
Band Gap
SY40 Stable

Note: Set LVDEN bit (RCON<12>) or FBORPOR<7>set.

TABLE 23-18: BAND GAP START-UP TIME REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Typ(2) Max Units Conditions
No.
SY40 TBGAP Band Gap Start-up Time — 20 50 µs Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable.
RCON<13>Status bit
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

DS70083G-page 200 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 23-8: TYPE A, B AND C TIMER EXTERNAL CLOCK TIMING CHARACTERISTICS

TxCK
Tx10 Tx11

Tx15 Tx20
OS60
TMRX

Note: Refer to Figure 23-3 for load conditions.

TABLE 23-19: TYPE A TIMER (TIMER1) EXTERNAL CLOCK TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min Typ Max Units Conditions
No.
TA10 TTXH TxCK High Time Synchronous, 0.5 TCY + 20 — — ns Must also meet
no prescaler parameter TA15
Synchronous, 10 — — ns
with prescaler
Asynchronous 10 — — ns
TA11 TTXL TxCK Low Time Synchronous, 0.5 TCY + 20 — — ns Must also meet
no prescaler parameter TA15
Synchronous, 10 — — ns
with prescaler
Asynchronous 10 — — ns
TA15 TTXP TxCK Input Period Synchronous, TCY + 10 — — ns
no prescaler
Synchronous, Greater of: — — — N = prescale
with prescaler 20 ns or value
(TCY + 40)/N (1, 8, 64, 256)
Asynchronous 20 — — ns
OS60 Ft1 SOSCI/T1CK oscillator input DC — 50 kHz
frequency range (oscillator enabled
by setting bit TCS (T1CON, bit 1))
TA20 TCKEXTMRL Delay from External TQCK Clock 2 TOSC 6 TOSC —
Edge to Timer Increment
Note: Timer1 is a Type A.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 201

dsPIC30F
TABLE 23-20: TYPE B TIMER (TIMER2 AND TIMER4) EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min Typ Max Units Conditions
No.
TB10 TtxH TxCK High Time Synchronous, 0.5 TCY + 20 — — ns Must also meet
no prescaler parameter TB15
Synchronous, 10 — — ns
with prescaler
TB11 TtxL TxCK Low Time Synchronous, 0.5 TCY + 20 — — ns Must also meet
no prescaler parameter TB15
Synchronous, 10 — — ns
with prescaler
TB15 TtxP TxCK Input Period Synchronous, TCY + 10 — — ns N = prescale
no prescaler value
Synchronous, Greater of: (1, 8, 64, 256)
with prescaler 20 ns or
(TCY + 40)/N
TB20 TCKEXTMRL Delay from External TQCK Clock 2 TOSC — 6 TOSC —
Edge to Timer Increment
Note: Timer2 and Timer4 are Type B.

TABLE 23-21: TYPE C TIMER (TIMER3 AND TIMER5) EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min Typ Max Units Conditions
No.
TC10 TtxH TxCK High Time Synchronous 0.5 TCY + 20 — — ns Must also meet
parameter TC15
TC11 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 — — ns Must also meet
parameter TC15
TC15 TtxP TxCK Input Period Synchronous, TCY + 10 — — ns N = prescale
no prescaler value
Synchronous, Greater of: (1, 8, 64, 256)
with prescaler 20 ns or
(TCY + 40)/N
TC20 TCKEXTMRL Delay from External TQCK Clock 2 TOSC — 6 TOSC —
Edge to Timer Increment
Note: Timer3 and Timer5 are Type C.

DS70083G-page 202 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 23-9: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS

ICX

IC10 IC11
IC15

Note: Refer to Figure 23-3 for load conditions.

TABLE 23-22: INPUT CAPTURE TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Max Units Conditions
No.
IC10 TccL ICx Input Low Time No Prescaler 0.5 TCY + 20 — ns
With Prescaler 10 — ns
IC11 TccH ICx Input High Time No Prescaler 0.5 TCY + 20 — ns
With Prescaler 10 — ns
IC15 TccP ICx Input Period (2 TCY + 40)/N — ns N = prescale
value (1, 4, 16)
Note 1: These parameters are characterized but not tested in manufacturing.

FIGURE 23-10: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS

OCx
(Output Compare
or PWM Mode) OC11 OC10

Note: Refer to Figure 23-3 for load conditions.

TABLE 23-23: OUTPUT COMPARE MODULE TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Typ(2) Max Units Conditions
No.
OC10 TccF OCx Output Fall Time — 10 25 ns —
OC11 TccR OCx Output Rise Time — 10 25 ns —
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 203

dsPIC30F
FIGURE 23-11: OC/PWM MODULE TIMING CHARACTERISTICS

OC20

OCFA/OCFB

OC15

OCx

TABLE 23-24: SIMPLE OC/PWM MODE TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Typ(2) Max Units Conditions
No.
OC15 TFD Fault Input to PWM I/O — — 25 ns VDD = 3V -40°C to +85°C
Change TBD ns VDD = 5V
OC20 TFLT Fault Input Pulse Width — — 50 ns VDD = 3V -40°C to +85°C
TBD ns VDD = 5V
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.

DS70083G-page 204 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 23-12: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING CHARACTERISTICS

CSCK
(SCKE = 1)

CS11 CS10 CS21 CS20

CSCK
(SCKE = 0)

CS20 CS21

COFS
CS55 CS56
CS35
CS51 CS50 70

HIGH-Z MSb LSb HIGH-Z

CSDO

CS30 CS31

CSDI MSb IN LSb IN

CS40 CS41

Note: Refer to Figure 23-3 for load conditions.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 205

dsPIC30F
TABLE 23-25: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Typ(2) Max Units Conditions
No.
CS10 TcSCKL CSCK Input Low Time TCY / 2 + 20 — — ns —
(CSCK pin is an input)
CSCK Output Low Time(3) 30 — — ns —
(CSCK pin is an output)
CS11 TcSCKH CSCK Input High Time TCY / 2 + 20 — — ns —
(CSCK pin is an input)
CSCK Output High Time(3) 30 — — ns —
(CSCK pin is an output)
CS20 TcSCKF CSCK Output Fall Time(4) — 10 25 ns —
(CSCK pin is an output)
CS21 TcSCKR CSCK Output Rise Time(4) — 10 25 ns —
(CSCK pin is an output)
CS30 TcSDOF CSDO Data Output Fall Time(4) — 10 25 ns —
CS31 TcSDOR CSDO Data Output Rise Time(4) — 10 25 ns —
CS35 TDV Clock edge to CSDO data valid — — 10 ns —
CS36 TDIV Clock edge to CSDO tri-stated 10 — 20 ns —
CS40 TCSDI Setup time of CSDI data input to 20 — — ns —
CSCK edge (CSCK pin is input
or output)
CS41 THCSDI Hold time of CSDI data input to 20 — — ns —
CSCK edge (CSCK pin is input
or output)
CS50 TcoFSF COFS Fall Time — 10 25 ns Note 1
(COFS pin is output)
CS51 TcoFSR COFS Rise Time — 10 25 ns Note 1
(COFS pin is output)
CS55 TscoFS Setup time of COFS data input to 20 — — ns —
CSCK edge (COFS pin is input)
CS56 THCOFS Hold time of COFS data input to 20 — — ns —
CSCK edge (COFS pin is input)
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
3: The minimum clock period for CSCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all DCI pins.

DS70083G-page 206 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 23-13: DCI MODULE (AC-LINK MODE) TIMING CHARACTERISTICS

BIT_CLK
(CSCK)

CS61 CS60 CS62 CS21 CS20

CS71 CS70

CS72

SYNC
(COFS)
CS76 CS75
CS80

LSb MSb LSb

SDO
(CSDO)
CS76 CS75

SDI MSb IN
(CSDI)
CS65 CS66

TABLE 23-26: DCI MODULE (AC-LINK MODE) TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1)(2) Min Typ(3) Max Units Conditions
No.
CS60 TBCLKL BIT_CLK Low Time 36 40.7 45 ns —
CS61 TBCLKH BIT_CLK High Time 36 40.7 45 ns —
CS62 TBCLK BIT_CLK Period — 81.4 — ns Bit clock is input
CS65 TSACL Input Setup Time to — — 10 ns —
Falling Edge of BIT_CLK
CS66 THACL Input Hold Time from — — 10 ns —
Falling Edge of BIT_CLK
CS70 TSYNCLO SYNC Data Output Low Time — 19.5 — µs Note 1
CS71 TSYNCHI SYNC Data Output High Time — 1.3 — µs Note 1
CS72 TSYNC SYNC Data Output Period — 20.8 — µs Note 1
CS75 TRACL Rise Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 5V
CS76 TFACL Fall Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 5V
CS77 TRACL Rise Time, SYNC, SDATA_OUT — TBD TBD ns CLOAD = 50 pF, VDD = 3V
CS78 TFACL Fall Time, SYNC, SDATA_OUT — TBD TBD ns CLOAD = 50 pF, VDD = 3V
CS80 TOVDACL Output valid delay from rising — — 15 ns —
edge of BIT_CLK
Note 1: These parameters are characterized but not tested in manufacturing.
2: These values assume BIT_CLK frequency is 12.288 MHz.
3: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 207

dsPIC30F
FIGURE 23-14: SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS

SCKx
(CKP = 0)

SP11 SP10 SP21 SP20

SCKx
(CKP = 1)

SP35 SP20 SP21

SDOx MSb BIT14 - - - - - -1 LSb

SP31 SP30

SDIx MSb IN BIT14 - - - -1 LSb IN

SP40 SP41

Note: Refer to Figure 23-3 for load conditions.

TABLE 23-27: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Typ(2) Max Units Conditions
No.
SP10 TscL SCKX Output Low Time(3) TCY / 2 — — ns —
SP11 TscH SCKX Output High Time(3) TCY / 2 — — ns —
SP20 TscF SCKX Output Fall Time(4 — 10 25 ns —
SP21 TscR SCKX Output Rise Time(4) — 10 25 ns —
SP30 TdoF SDOX Data Output Fall Time(4) — 10 25 ns —
(4)
SP31 TdoR SDOX Data Output Rise Time — 10 25 ns —
SP35 TscH2doV, SDOX Data Output Valid after — — 30 ns —
TscL2doV SCKX Edge
SP40 TdiV2scH, Setup Time of SDIX Data Input 20 — — ns —
TdiV2scL to SCKX Edge
SP41 TscH2diL, Hold Time of SDIX Data Input 20 — — ns —
TscL2diL to SCKX Edge
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all SPI pins.

DS70083G-page 208 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 23-15: SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS

SP36
SCKX
(CKP = 0)

SP11 SP10 SP21 SP20

SCKX
(CKP = 1)
SP35
SP20 SP21

SDOX MSb BIT14 - - - - - -1 LSb

SP40 SP30,SP31

SDIX MSb IN BIT14 - - - -1 LSb IN

SP41

Note: Refer to Figure 23-3 for load conditions.

TABLE 23-28: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Typ(2) Max Units Conditions
No.
SP10 TscL SCKX output low time(3) TCY / 2 — — ns —
SP11 TscH SCKX output high time(3) TCY / 2 — — ns —
SP20 TscF SCKX output fall time(4) — 10 25 ns —
SP21 TscR SCKX output rise time(4) — 10 25 ns —
SP30 TdoF SDOX data output fall time(4) — 10 25 ns —
SP31 TdoR SDOX data output rise time(4) — 10 25 ns —
SP35 TscH2doV, SDOX data output valid after — — 30 ns —
TscL2doV SCKX edge
SP36 TdoV2sc, SDOX data output setup to 30 — — ns —
TdoV2scL first SCKX edge
SP40 TdiV2scH, Setup time of SDIX data input 20 — — ns —
TdiV2scL to SCKX edge
SP41 TscH2diL, Hold time of SDIX data input 20 — — ns —
TscL2diL to SCKX edge
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in master mode must not
violate this specification.
4: Assumes 50 pF load on all SPI pins.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 209

dsPIC30F
FIGURE 23-16: SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS

SSX

SP50 SP52
SCKX
(CKP = 0)

SP71 SP70 SP20 SP21

SCKX
(CKP = 1)

SP20 SP21
SP35

SDOX MSb BIT14 - - - - - -1 LSb

SP30,SP31 SP51

SDIX MSb IN BIT14 - - - -1 LSb IN

SP41
SP40

Note: Refer to Figure 23-3 for load conditions.

TABLE 23-29: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Typ(2) Max Units Conditions
No.
SP70 TscL SCKX Input Low Time 30 — — ns —
SP71 TscH SCKX Input High Time 30 — — ns —
SP20 TscF SCKX Output Fall Time(3) — 10 25 ns —
SP21 TscR SCKX Output Rise Time(3) — 10 25 ns —
SP30 TdoF SDOX Data Output Fall Time(3) — 10 25 ns —
SP31 TdoR SDOX Data Output Rise Time(3) — 10 25 ns —
SP35 TscH2doV, SDOX Data Output Valid after — — 30 ns —
TscL2doV SCKX Edge
SP40 TdiV2scH, Setup Time of SDIX Data Input 20 — — ns —
TdiV2scL to SCKX Edge
SP41 TscH2diL, Hold Time of SDIX Data Input 20 — — ns —
TscL2diL to SCKX Edge
SP50 TssL2scH, SSX↓ to SCKX↑ or SCKX↓ Input 120 — — ns —
TssL2scL
SP51 TssH2doZ SSX↑ to SDOX Output 10 — 50 ns —
Hi-Impedance(3)
SP52 TscH2ssH SSX after SCK Edge 1.5 TCY +40 — — ns —
TscL2ssH
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
3: Assumes 50 pF load on all SPI pins.

DS70083G-page 210 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 23-17: SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SP60
SSX

SP50 SP52
SCKX
(CKP = 0)

SP71 SP70 SP20 SP21

SCKX
(CKP = 1)
SP35
SP20 SP21
SP52

SDOX MSb BIT14 - - - - - -1 LSb

SP30,SP31 SP51

SDIX
MSb IN BIT14 - - - -1 LSb IN
SP41
SP40

Note: Refer to Figure 23-3 for load conditions.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 211

dsPIC30F
TABLE 23-30: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Typ(2) Max Units Conditions
No.
SP70 TscL SCKX Input Low Time 30 — — ns —
SP71 TscH SCKX Input High Time 30 — — ns —
(3)
SP20 TscF SCKX Output Fall Time — 10 25 ns —
SP21 TscR SCKX Output Rise Time(3) — 10 25 ns —
(3)
SP30 TdoF SDOX Data Output Fall Time — 10 25 ns —
SP31 TdoR SDOX Data Output Rise Time(3) — 10 25 ns —
SP35 TscH2doV, SDOX Data Output Valid after — — 30 ns —
TscL2doV SCKX Edge
SP40 TdiV2scH, Setup Time of SDIX Data Input 20 — — ns —
TdiV2scL to SCKX Edge
SP41 TscH2diL, Hold Time of SDIX Data Input 20 — — ns —
TscL2diL to SCKX Edge
SP50 TssL2scH, SSX↓ to SCKX↓ or SCKX↑ input 120 — — ns —
TssL2scL
SP51 TssH2doZ SS↑ to SDOX Output 10 — 50 ns —
Hi-Impedance(4)
SP52 TscH2ssH SSX↑ after SCKX Edge 1.5 TCY + 40 — — ns —
TscL2ssH
SP60 TssL2doV SDOX Data Output Valid after — — 50 ns —
SSX Edge
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in master mode must not
violate this specification.
4: Assumes 50 pF load on all SPI pins.

DS70083G-page 212 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 23-18: I2C BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)

SCL
IM31 IM34
IM30 IM33

SDA

Start Stop
Condition Condition

Note: Refer to Figure 23-3 for load conditions.

FIGURE 23-19: I2C BUS DATA TIMING CHARACTERISTICS (MASTER MODE)

IM20 IM11 IM21

IM10
SCL
IM11 IM26
IM10 IM25 IM33
SDA
In
IM40 IM40 IM45

SDA
Out

Note: Refer to Figure 23-3 for load conditions.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 213

dsPIC30F
TABLE 23-31: I2C BUS DATA TIMING REQUIREMENTS (MASTER MODE)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min(1) Max Units Conditions
No.
IM10 TLO:SCL Clock Low Time 100 kHz mode TCY / 2 (BRG + 1) — ms —
400 kHz mode TCY / 2 (BRG + 1) — ms —
1 MHz mode(2) TCY / 2 (BRG + 1) — ms —
IM11 THI:SCL Clock High Time 100 kHz mode TCY / 2 (BRG + 1) — ms —
400 kHz mode TCY / 2 (BRG + 1) — ms —
(2)
1 MHz mode TCY / 2 (BRG + 1) — ms —
IM20 TF:SCL SDA and SCL 100 kHz mode — 300 ns CB is specified to be
Fall Time 400 kHz mode 20 + 0.1 CB 300 ns from 10 to 400 pF
1 MHz mode(2) — 100 ns
IM21 TR:SCL SDA and SCL 100 kHz mode — 1000 ns CB is specified to be
Rise Time 400 kHz mode 20 + 0.1 CB 300 ns from 10 to 400 pF
1 MHz mode(2) — 300 ns
IM25 TSU:DAT Data Input 100 kHz mode 250 — ns —
Setup Time 400 kHz mode 100 — ns
1 MHz mode(2) TBD — ns
IM26 THD:DAT Data Input 100 kHz mode 0 — ns —
Hold Time 400 kHz mode 0 0.9 ms
1 MHz mode(2) TBD — ns
IM30 TSU:STA Start Condition 100 kHz mode TCY / 2 (BRG + 1) — ms Only relevant for
Setup Time 400 kHz mode TCY / 2 (BRG + 1) — ms repeated Start
condition
1 MHz mode(2) TCY / 2 (BRG + 1) — ms
IM31 THD:STA Start Condition 100 kHz mode TCY / 2 (BRG + 1) — ms After this period the
Hold Time 400 kHz mode TCY / 2 (BRG + 1) — ms first clock pulse is
generated
1 MHz mode(2) TCY / 2 (BRG + 1) — ms
IM33 TSU:STO Stop Condition 100 kHz mode TCY / 2 (BRG + 1) — ms —
Setup Time 400 kHz mode TCY / 2 (BRG + 1) — ms
1 MHz mode(2) TCY / 2 (BRG + 1) — ms
IM34 THD:STO Stop Condition 100 kHz mode TCY / 2 (BRG + 1) — ns —
Hold Time 400 kHz mode TCY / 2 (BRG + 1) — ns
1 MHz mode(2) TCY / 2 (BRG + 1) — ns
IM40 TAA:SCL Output Valid 100 kHz mode — 3500 ns —
From Clock 400 kHz mode — 1000 ns —
(2)
1 MHz mode — — ns —
IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — ms Time the bus must be
400 kHz mode 1.3 — ms free before a new
transmission can start
1 MHz mode(2) TBD — ms
IM50 CB Bus Capacitive Loading — 400 pF
Note 1: BRG is the value of the I2C Baud Rate Generator. Refer to Section 21 “Inter-Integrated Circuit™ (I2C)”
in the dsPIC30F Family Reference Manual.
2: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).

DS70083G-page 214 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 23-20: I2C BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)

SCL
IS31 IS34
IS30 IS33

SDA

Start Stop
Condition Condition

FIGURE 23-21: I2C BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)

IS20 IS11 IS21

IS10
SCL
IS30 IS26
IS31 IS25 IS33
SDA
In
IS40 IS40 IS45

SDA
Out

 2004 Microchip Technology Inc. Preliminary DS70083G-page 215

dsPIC30F
TABLE 23-32: I2C BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min Max Units Conditions
No.
IS10 TLO:SCL Clock Low Time 100 kHz mode 4.7 — µs Device must operate at a
minimum of 1.5 MHz
400 kHz mode 1.3 — µs Device must operate at a
minimum of 10 MHz.
1 MHz mode(1) 0.5 — µs —
IS11 THI:SCL Clock High Time 100 kHz mode 4.0 — µs Device must operate at a
minimum of 1.5 MHz
400 kHz mode 0.6 — µs Device must operate at a
minimum of 10 MHz
1 MHz mode(1) 0.5 — µs —
IS20 TF:SCL SDA and SCL 100 kHz mode — 300 ns CB is specified to be from
Fall Time 400 kHz mode 20 + 0.1 CB 300 ns 10 to 400 pF
1 MHz mode(1) — 100 ns
IS21 TR:SCL SDA and SCL 100 kHz mode — 1000 ns CB is specified to be from
Rise Time 400 kHz mode 20 + 0.1 CB 300 ns 10 to 400 pF
1 MHz mode(1) — 300 ns
IS25 TSU:DAT Data Input 100 kHz mode 250 — ns —
Setup Time 400 kHz mode 100 — ns
1 MHz mode(1) 100 — ns
IS26 THD:DAT Data Input 100 kHz mode 0 — ns —
Hold Time 400 kHz mode 0 0.9 µs
1 MHz mode(1) 0 0.3 µs
IS30 TSU:STA Start Condition 100 kHz mode 4.7 — µs Only relevant for repeated
Setup Time 400 kHz mode 0.6 — µs Start condition
1 MHz mode(1) 0.25 — µs
IS31 THD:STA Start Condition 100 kHz mode 4.0 — µs After this period the first
Hold Time 400 kHz mode 0.6 — µs clock pulse is generated
1 MHz mode(1) 0.25 — µs
IS33 TSU:STO Stop Condition 100 kHz mode 4.7 — µs —
Setup Time 400 kHz mode 0.6 — µs
1 MHz mode(1) 0.6 — µs
IS34 THD:STO Stop Condition 100 kHz mode 4000 — ns —
Hold Time 400 kHz mode 600 — ns
1 MHz mode(1) 250 ns
IS40 TAA:SCL Output Valid From 100 kHz mode 0 3500 ns —
Clock 400 kHz mode 0 1000 ns
1 MHz mode(1) 0 350 ns
IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — µs Time the bus must be free
400 kHz mode 1.3 — µs before a new transmission
can start
1 MHz mode(1) 0.5 — µs
IS50 CB Bus Capacitive — 400 pF —
Loading
Note 1: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).

DS70083G-page 216 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
FIGURE 23-22: CAN MODULE I/O TIMING CHARACTERISTICS

CXTX Pin Old Value New Value

(output)

CA10 CA11
CXRX Pin
(input)
CA20

TABLE 23-33: CAN MODULE I/O TIMING REQUIREMENTS

Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic(1) Min Typ(2) Max Units Conditions
No.
CA10 TioF Port Output Fall Time — 10 25 ns —
CA11 TioR Port Output Rise Time — 10 25 ns —
CA20 Tcwf Pulse Width to Trigger 500 ns —
CAN Wakeup Filter
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 217

dsPIC30F
TABLE 23-34: 12-BIT A/D MODULE SPECIFICATIONS
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min. Typ Max. Units Conditions
No.
Device Supply
AD01 AVDD Module VDD Supply Greater of — Lesser of V —
VDD - 0.3 VDD + 0.3
or 2.7 or 5.5
AD02 AVSS Module VSS Supply VSS - 0.3 — VSS + 0.3 V —
Reference Inputs
AD05 VREFH Reference Voltage High AVSS + 2.7 — AVDD V —
AD06 VREFL Reference Voltage Low AVSS — AVDD - 2.7 V —
AD07 VREF Absolute Reference AVSS - 0.3 — AVDD + 0.3 V —
Voltage
AD08 IREF Current Drain — 200 300 µA A/D operating
.001 3 µA A/D off
Analog Input
AD10 VINH-VINL Full-Scale Input Span VREFL VREFH V See Note
AD11 VIN Absolute Input Voltage AVSS - 0.3 AVDD + 0.3 V —
AD12 — Leakage Current — ±0.001 ±0.610 µA VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
Source Impedance =
2.5 kΩ
AD13 — Leakage Current — ±0.001 ±0.610 µA VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
Source Impedance =
2.5 kΩ
AD15 RSS Switch Resistance — 3.2K — Ω —
AD16 CSAMPLE Sample Capacitor — 18 pF —
AD17 RIN Recommended Impedance — — 2.5K Ω —
of Analog Voltage Source
DC Accuracy
AD20 Nr Resolution 12 data bits bits
AD21 INL Integral Nonlinearity — ±0.75 TBD LSb VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
AD21A INL Integral Nonlinearity — ±0.75 TBD LSb VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
AD22 DNL Differential Nonlinearity — ±0.5 < ±1 LSb VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
AD22A DNL Differential Nonlinearity — ±0.5 < ±1 LSb VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
AD23 GERR Gain Error — ±1.25 TBD LSb VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
AD23A GERR Gain Error — ±1.25 TBD LSb VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
Note 1: The A/D conversion result never decreases with an increase in the input voltage, and has no missing
codes.

DS70083G-page 218 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
TABLE 23-34: 12-BIT A/D MODULE SPECIFICATIONS (CONTINUED)
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min. Typ Max. Units Conditions
No.
AD24 EOFF Offset Error — ±1.25 TBD LSb VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
AD24A EOFF Offset Error — ±1.25 TBD LSb VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
AD25 — Monotonicity(1) — — — — Guaranteed
AD26 CMRR Common-Mode Rejection — TBD — dB —
AD27 PSRR Power Supply Rejection — TBD — dB —
Ratio
AD28 CTLK Channel to Channel — TBD — dB —
Crosstalk
Dynamic Performance
AD30 THD Total Harmonic Distortion — — — dB —
AD31 SINAD Signal to Noise and — TBD — dB —
Distortion
AD32 SFDR Spurious Free Dynamic — TBD — dB —
Range
AD33 FNYQ Input Signal Bandwidth — — 50 kHz —
AD34 ENOB Effective Number of Bits — TBD TBD bits —
Note 1: The A/D conversion result never decreases with an increase in the input voltage, and has no missing
codes.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 219

dsPIC30F
FIGURE 23-23: 12-BIT A/D CONVERSION TIMING CHARACTERISTICS
(ASAM = 0, SSRC = 000)

AD50

ADCLK
Instruction
Execution BSF SAMP BCF SAMP

SAMP

ch0_dischrg

ch0_samp

eoc

AD61
AD60

TSAMP AD55

DONE

ADIF

ADRES(0)

1 2 3 4 5 6 7 8 9

1 - Software sets ADCON. SAMP to start sampling.

2 - Sampling starts after discharge period.
TSAMP is described in the dsPIC30F Family Reference Manual, Section 18.
3 - Software clears ADCON. SAMP to start conversion.
4 - Sampling ends, conversion sequence starts.
5 - Convert bit 11.
6 - Convert bit 10.
7 - Convert bit 1.
8 - Convert bit 0.
9 - One TAD for end of conversion.

DS70083G-page 220 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
TABLE 23-35: 12-BIT A/D CONVERSION TIMING REQUIREMENTS
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Param
Symbol Characteristic Min. Typ Max. Units Conditions
No.
Clock Parameters
AD50 TAD A/D Clock Period — 667 — ns VDD = 3-5.5V (Note 1)
AD51 tRC A/D Internal RC Oscillator Period 1.2 1.5 1.8 µs —
Conversion Rate
AD55 tCONV Conversion Time — 14 TAD ns —
AD56 FCNV Throughput Rate — — 100 ksps VDD = VREF = 5V
AD57 TSAMP Sample Time — 1 TAD — ns VDD = 3-5.5V source
resistance
RS = 0-2.5 kΩ
Timing Parameters
AD60 tPCS Conversion Start from Sample — — TAD ns —
Trigger
AD61 tPSS Sample Start from Setting 0.5 TAD — 1.5 TAD ns —
Sample (SAMP) Bit
AD62 tCSS Conversion Completion to — — TBD ns —
Sample Start (ASAM = 1)
AD63 tDPU Time to Stabilize Analog Stage — — TBD µs —
from A/D Off to A/D On
Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
2: These parameters are characterized but not tested in manufacturing.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 221

dsPIC30F
NOTES:

DS70083G-page 222 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
24.0 PACKAGING INFORMATION

24.1 Package Marking Information

18-Lead PDIP Example

XXXXXXXXXXXXXXXXX dsPIC30F3012-30I/P
XXXXXXXXXXXXXXXXX
YYWWNNN 0348017

28-Lead PDIP Example

XXXXXXXXXXXXXXXXX dsPIC30F2012-30I/SP
XXXXXXXXXXXXXXXXX
YYWWNNN 0348017

18-Lead SOIC Example

XXXXXXXXXXXX dsPIC30F2011
XXXXXXXXXXXX -30I/SO
XXXXXXXXXXXX
YYWWNNN 0348017

28-Lead SOIC (.300”) Example

XXXXXXXXXXXXXXXXXXXX PIC30F2012-30I/SO
XXXXXXXXXXXXXXXXXXXX 0310017
XXXXXXXXXXXXXXXXXXXX
YYWWNNN

Legend: XX...X Customer specific information*

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.

* Standard device marking consists of Microchip part number, year code, week code, and traceability code.
For device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 223

dsPIC30F
24.1 Package Marking Information (Continued)

40-Lead PDIP Example

XXXXXXXXXXXXXXXXXX dsPIC30F3014-30I/P
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
YYWWNNN 0348017

44-Lead TQFP Example

XXXXXXXXXX dsPIC30F
XXXXXXXXXX 3014-30I/PT
XXXXXXXXXX
YYWWNNN 0348017

44-Lead QFN Example

XXXXXXXXXX
XXXXXXXXXX dsPIC30F4013-30I/ML
XXXXXXXXXX 0310017
YYWWNNN

64-Lead TQFP (10x10x1mm) Example

XXXXXXXXXX dsPIC30F
XXXXXXXXXX 5011-30I/PT
XXXXXXXXXX
YYWWNNN 0348017

64-Lead TQFP (14x14x1mm) Example

XXXXXXXXXXXX dsPIC30F6011
XXXXXXXXXXXX -30I/PF
YYWWNNN 0348017

DS70083G-page 224 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
24.1 Package Marking Information (Continued)

80-Lead TQFP (12x12x1mm) Example

XXXXXXXXXXXX dsPIC30F5013
XXXXXXXXXXXX -30I/PT
YYWWNNN 0348017

80-Lead TQFP (14x14x1mm) Example

XXXXXXXXXXXX dsPIC30F6013
XXXXXXXXXXXX -30I/PF
YYWWNNN 0348017

 2004 Microchip Technology Inc. Preliminary DS70083G-page 225

dsPIC30F
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

E1

n 1 α

E A2

c L

A1
B1
β
B p
eB

Units INCHES* MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 18 18
Pitch p .100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .890 .898 .905 22.61 22.80 22.99
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top α 5 10 15 5 10 15
Mold Draft Angle Bottom β 5 10 15 5 10 15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007

DS70083G-page 226 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
28-Lead Plastic Dual In-line (SP) – 300 mil (PDIP)
E1

2
n 1 α

E A2

L
c

β A1 B1

eB B p

Units INCHES* MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 28 28
Pitch p .100 2.54
Top to Seating Plane A .140 .150 .160 3.56 3.81 4.06
Molded Package Thickness A2 .125 .130 .135 3.18 3.30 3.43
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .310 .325 7.62 7.87 8.26
Molded Package Width E1 .275 .285 .295 6.99 7.24 7.49
Overall Length D 1.345 1.365 1.385 34.16 34.67 35.18
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .040 .053 .065 1.02 1.33 1.65
Lower Lead Width B .016 .019 .022 0.41 0.48 0.56
Overall Row Spacing § eB .320 .350 .430 8.13 8.89 10.92
Mold Draft Angle Top α 5 10 15 5 10 15
Mold Draft Angle Bottom β 5 10 15 5 10 15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070

 2004 Microchip Technology Inc. Preliminary DS70083G-page 227

dsPIC30F
18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)

E
p
E1

2
B n 1

h
α

45°

c
A A2

φ
β L A1

Units INCHES* MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 18 18
Pitch p .050 1.27
Overall Height A .093 .099 .104 2.36 2.50 2.64
Molded Package Thickness A2 .088 .091 .094 2.24 2.31 2.39
Standoff § A1 .004 .008 .012 0.10 0.20 0.30
Overall Width E .394 .407 .420 10.01 10.34 10.67
Molded Package Width E1 .291 .295 .299 7.39 7.49 7.59
Overall Length D .446 .454 .462 11.33 11.53 11.73
Chamfer Distance h .010 .020 .029 0.25 0.50 0.74
Foot Length L .016 .033 .050 0.41 0.84 1.27
Foot Angle φ 0 4 8 0 4 8
Lead Thickness c .009 .011 .012 0.23 0.27 0.30
Lead Width B .014 .017 .020 0.36 0.42 0.51
Mold Draft Angle Top α 0 12 15 0 12 15
Mold Draft Angle Bottom β 0 12 15 0 12 15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051

DS70083G-page 228 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)

E
E1
p

B
2
n 1

h
α

45°

c
A A2

φ
β L A1

Units INCHES* MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 28 28
Pitch p .050 1.27
Overall Height A .093 .099 .104 2.36 2.50 2.64
Molded Package Thickness A2 .088 .091 .094 2.24 2.31 2.39
Standoff § A1 .004 .008 .012 0.10 0.20 0.30
Overall Width E .394 .407 .420 10.01 10.34 10.67
Molded Package Width E1 .288 .295 .299 7.32 7.49 7.59
Overall Length D .695 .704 .712 17.65 17.87 18.08
Chamfer Distance h .010 .020 .029 0.25 0.50 0.74
Foot Length L .016 .033 .050 0.41 0.84 1.27
Foot Angle Top φ 0 4 8 0 4 8
Lead Thickness c .009 .011 .013 0.23 0.28 0.33
Lead Width B .014 .017 .020 0.36 0.42 0.51
Mold Draft Angle Top α 0 12 15 0 12 15
Mold Draft Angle Bottom β 0 12 15 0 12 15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052

 2004 Microchip Technology Inc. Preliminary DS70083G-page 229

dsPIC30F
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)

E1

2 α
n 1

A A2

L
c

β B1
A1
eB B p

Units INCHES* MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 40 40
Pitch p .100 2.54
Top to Seating Plane A .160 .175 .190 4.06 4.45 4.83
Molded Package Thickness A2 .140 .150 .160 3.56 3.81 4.06
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .595 .600 .625 15.11 15.24 15.88
Molded Package Width E1 .530 .545 .560 13.46 13.84 14.22
Overall Length D 2.045 2.058 2.065 51.94 52.26 52.45
Tip to Seating Plane L .120 .130 .135 3.05 3.30 3.43
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .030 .050 .070 0.76 1.27 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing § eB .620 .650 .680 15.75 16.51 17.27
Mold Draft Angle Top α 5 10 15 5 10 15
Mold Draft Angle Bottom β 5 10 15 5 10 15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016

DS70083G-page 230 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

E
E1
#leads=n1

D1 D

2
1
B

n
CH x 45 °
α
A

φ
β A1 A2
L
(F)

Units INCHES MILLIMETERS*

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 44 44
Pitch p .031 0.80
Pins per Side n1 11 11
Overall Height A .039 .043 .047 1.00 1.10 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff § A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Footprint (Reference) (F) .039 1.00
Foot Angle φ 0 3.5 7 0 3.5 7
Overall Width E .463 .472 .482 11.75 12.00 12.25
Overall Length D .463 .472 .482 11.75 12.00 12.25
Molded Package Width E1 .390 .394 .398 9.90 10.00 10.10
Molded Package Length D1 .390 .394 .398 9.90 10.00 10.10
Lead Thickness c .004 .006 .008 0.09 0.15 0.20
Lead Width B .012 .015 .017 0.30 0.38 0.44
Pin 1 Corner Chamfer CH .025 .035 .045 0.64 0.89 1.14
Mold Draft Angle Top α 5 10 15 5 10 15
Mold Draft Angle Bottom β 5 10 15 5 10 15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076

 2004 Microchip Technology Inc. Preliminary DS70083G-page 231

dsPIC30F
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)

DS70083G-page 232 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

E
E1
#leads=n1

D1 D

2
1
B
n
CH x 45 °
α
A
c
A2

L φ
β A1
(F)

Units INCHES MILLIMETERS*

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 64 64
Pitch p .020 0.50
Pins per Side n1 16 16
Overall Height A .039 .043 .047 1.00 1.10 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff § A1 .002 .006 .010 0.05 0.15 0.25
Foot Length L .018 .024 .030 0.45 0.60 0.75
Footprint (Reference) (F) .039 1.00
Foot Angle φ 0 3.5 7 0 3.5 7
Overall Width E .463 .472 .482 11.75 12.00 12.25
Overall Length D .463 .472 .482 11.75 12.00 12.25
Molded Package Width E1 .390 .394 .398 9.90 10.00 10.10
Molded Package Length D1 .390 .394 .398 9.90 10.00 10.10
Lead Thickness c .005 .007 .009 0.13 0.18 0.23
Lead Width B .007 .009 .011 0.17 0.22 0.27
Pin 1 Corner Chamfer CH .025 .035 .045 0.64 0.89 1.14
Mold Draft Angle Top α 5 10 15 5 10 15
Mold Draft Angle Bottom β 5 10 15 5 10 15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085

 2004 Microchip Technology Inc. Preliminary DS70083G-page 233

dsPIC30F
64-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

E
E1
#leads=n1

D1 D

2
1
B
n
CH x 45 °
α
A
c
A2

L φ
β A1
(F)

Units INCHES MILLIMETERS*

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 64 64
Pitch p .032 0.80
Pins per Side n1 16 16
Overall Height A .047 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff § A1 .002 .006 0.05 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Footprint (Reference) (F) .039 1.00
Foot Angle φ 0 7 0 7
Overall Width E .630 16.00
Overall Length D .630 16.00
Molded Package Width E1 .551 14.00
Molded Package Length D1 .551 14.00
Lead Thickness c .004 .008 0.09 0.20
Lead Width B .019 .013 .018 0.30 0.32 0.45
Pin 1 Corner Chamfer CH
Mold Draft Angle Top α 11 13 11 13
Mold Draft Angle Bottom β 11 13 11 13
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085

DS70083G-page 234 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

E
E1
#leads=n1

D1 D

2
B 1

n
CH x 45 °
A α
c

β φ A2
L A1
(F)

Units INCHES MILLIMETERS*

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 80 80
Pitch p .020 0.50
Pins per Side n1 20 20
Overall Height A .039 .043 .047 1.00 1.10 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff § A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Footprint (Reference) (F) .039 1.00
Foot Angle φ 0 3.5 7 0 3.5 7
Overall Width E .541 .551 .561 13.75 14.00 14.25
Overall Length D .541 .551 .561 13.75 14.00 14.25
Molded Package Width E1 .463 .472 .482 11.75 12.00 12.25
Molded Package Length D1 .463 .472 .482 11.75 12.00 12.25
Lead Thickness c .004 .006 .008 0.09 0.15 0.20
Lead Width B .007 .009 .011 0.17 0.22 0.27
Pin 1 Corner Chamfer CH .025 .035 .045 0.64 0.89 1.14
Mold Draft Angle Top α 5 10 15 5 10 15
Mold Draft Angle Bottom β 5 10 15 5 10 15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-092

 2004 Microchip Technology Inc. Preliminary DS70083G-page 235

dsPIC30F
80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

E
E1
#leads=n1

D1 D

2
B 1

n
CH x 45 °
A α
c

β φ A2
L A1
(F)

Units INCHES MILLIMETERS*

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 80 80
Pitch p .026 0.65
Pins per Side n1 20 20
Overall Height A .047 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff § A1 .002 .006 0.05 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Footprint (Reference) (F) .039 1.00
Foot Angle φ 0 7 0 7
Overall Width E .630 16.00
Overall Length D .630 16.00
Molded Package Width E1 .551 14.00
Molded Package Length D1 . .551 14.00
Lead Thickness c .004 .008 0.09 0.20
Lead Width B .009 .013 .015 0.22 0.32 0.38
Pin 1 Corner Chamfer CH
Mold Draft Angle Top α 11 13 11 13
Mold Draft Angle Bottom β 11 13 11 13
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-092

DS70083G-page 236 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
INDEX CAN Buffers and Protocol Engine ............................ 124
DCI Module............................................................... 136
Numerics Dedicated Port Structure ............................................ 75
12-bit Analog-to-Digital Converter (A/D) Module .............. 145 DSP Engine ................................................................ 29
dsPIC30F5013/6013/6014.......................................... 18
A External Power-on Reset Circuit .............................. 162
A/D .................................................................................... 145 I2C ............................................................................ 108
Aborting a Conversion .............................................. 147 Input Capture Mode.................................................... 95
ADCHS Register ....................................................... 145 Oscillator System...................................................... 155
ADCON1 Register..................................................... 145 Output Compare Mode ............................................... 99
ADCON2 Register..................................................... 145 Reset System ........................................................... 159
ADCON3 Register..................................................... 145 Shared Port Structure................................................. 76
ADCSSL Register ..................................................... 145 SPI............................................................................ 104
ADPCFG Register..................................................... 145 SPI Master/Slave Connection................................... 104
Configuring Analog Port Pins.............................. 76, 150 UART Receiver......................................................... 116
Connection Considerations....................................... 150 UART Transmitter..................................................... 115
Conversion Operation ............................................... 146 BOR Characteristics ......................................................... 194
Effects of a Reset...................................................... 149 BOR. See Brown-out Reset.
Operation During CPU Idle Mode ............................. 149 Brown-out Reset
Operation During CPU Sleep Mode.......................... 149 Characteristics.......................................................... 193
Output Formats ......................................................... 149 Timing Requirements ............................................... 200
Power-down Modes .................................................. 149 C
Programming the Sample Trigger............................. 147
C Compilers
Register Map............................................................. 151
MPLAB C17.............................................................. 178
Result Buffer ............................................................. 146
MPLAB C18.............................................................. 178
Sampling Requirements............................................ 148
MPLAB C30.............................................................. 178
Selecting the Conversion Clock ................................ 147
CAN Module ..................................................................... 123
Selecting the Conversion Sequence......................... 146
Baud Rate Setting .................................................... 128
AC Characteristics ............................................................ 195
CAN1 Register Map.................................................. 130
Load Conditions ........................................................ 195
CAN2 Register Map.................................................. 132
AC Temperature and Voltage Specifications .................... 195
Frame Types ............................................................ 123
AC-Link Mode Operation .................................................. 142
I/O Timing Characteristics ........................................ 217
16-bit Mode ............................................................... 142
Message Reception.................................................. 126
20-bit Mode ............................................................... 142
Message Transmission............................................. 127
Address Generator Units .................................................... 47
Modes of Operation .................................................. 125
Alternate Vector Table ........................................................ 59
Overview................................................................... 123
Analog-to-Digital Converter. See A/D.
CLKOUT and I/O Timing
Assembler
Characteristics.......................................................... 198
MPASM Assembler................................................... 177
Requirements ........................................................... 198
Automatic Clock Stretch.................................................... 110
Code Examples
During 10-bit Addressing (STREN = 1)..................... 110
Data EEPROM Block Erase ....................................... 70
During 7-bit Addressing (STREN = 1)....................... 110
Data EEPROM Block Write ........................................ 72
Receive Mode ........................................................... 110
Data EEPROM Read.................................................. 69
Transmit Mode .......................................................... 110
Data EEPROM Word Erase ....................................... 70
B Data EEPROM Word Write ........................................ 71
Bandgap Start-up Time Erasing a Row of Program Memory ........................... 65
Requirements............................................................ 200 Initiating a Programming Sequence ........................... 66
Timing Characteristics .............................................. 200 Loading Write Latches................................................ 66
Barrel Shifter ....................................................................... 33 Code Protection ................................................................ 153
Bit Reversed Addressing Core Architecture................................................................ 21
Example ...................................................................... 54 Overview..................................................................... 21
Implementation ........................................................... 53 D
Bit-Reversed Addressing .................................................... 53
Data Accumulators and Adder/Subtractor .......................... 31
Modifier Values Table ................................................. 54
Data Space Write Saturation ...................................... 33
Sequence Table (16-Entry)......................................... 54
Overflow and Saturation ............................................. 31
Block Diagrams
Round Logic ............................................................... 32
12-bit A/D Functional ................................................ 145
Write Back .................................................................. 32
16-bit Timer1 Module .................................................. 81
Data Address Space........................................................... 39
16-bit Timer2............................................................... 87
Alignment.................................................................... 40
16-bit Timer3............................................................... 87
Alignment (Figure) ...................................................... 40
16-bit Timer4............................................................... 92
Effect of Invalid Memory Accesses (Table) ................ 40
16-bit Timer5............................................................... 92
MCU and DSP (MAC Class) Instructions Example .... 43
32-bit Timer2/3............................................................ 86
Memory Map............................................................... 40
32-bit Timer4/5............................................................ 91
Near Data Space ........................................................ 41

 2004 Microchip Technology Inc. Preliminary DS70083G-page 237

dsPIC30F
Sample Memory Map .................................................. 42 Timing Requirements
Software Stack ............................................................ 41 AC-Link Mode................................................... 207
Spaces ........................................................................ 39 Multichannel, I2S Modes................................... 206
Width........................................................................... 40 Transmit Slot Enable Bits ......................................... 139
Data Converter Interface (DCI) Module ............................ 135 Transmit Status Bits.................................................. 141
Data EEPROM Memory ...................................................... 69 Transmit/Receive Shift Register ............................... 135
Erasing ........................................................................ 70 Underflow Mode Control Bit...................................... 141
Erasing, Block ............................................................. 70 Word Size Selection Bits .......................................... 137
Erasing, Word ............................................................. 70 Demonstration Boards
Protection Against Spurious Write .............................. 73 PICDEM 1................................................................. 180
Reading....................................................................... 69 PICDEM 17............................................................... 180
Write Verify ................................................................. 73 PICDEM 18R PIC18C601/801.................................. 181
Writing ......................................................................... 71 PICDEM 2 Plus......................................................... 180
Writing, Block .............................................................. 72 PICDEM 3 PIC16C92X............................................. 180
Writing, Word .............................................................. 71 PICDEM 4................................................................. 180
Data Space Organization .................................................... 47 PICDEM LIN PIC16C43X ......................................... 181
DC Characteristics ............................................................ 184 PICDEM USB PIC16C7X5 ....................................... 181
BOR .......................................................................... 194 PICDEM.net Internet/Ethernet .................................. 180
Brown-out Reset ....................................................... 193 Development Support ....................................................... 177
I/O Pin Input Specifications ....................................... 191 Device Configuration
I/O Pin Output Specifications .................................... 192 Register Map ............................................................ 168
Idle Current (IIDLE) .................................................... 187 Device Configuration Registers
Low-Voltage Detect................................................... 192 FBORPOR ................................................................ 166
LVDL ......................................................................... 193 FGS .......................................................................... 166
Operating Current (IDD)............................................. 185 FOSC........................................................................ 166
Power-Down Current (IPD) ........................................ 189 FWDT ....................................................................... 166
Program and EEPROM............................................. 194 Device Overview................................................................ 17
Temperature and Voltage Specifications .................. 184 Disabling the UART .......................................................... 117
DCI Module Divide Support .................................................................... 27
Bit Clock Generator................................................... 139 Instructions (Table) ..................................................... 27
Buffer Alignment with Data Frames .......................... 140 DSP Engine ........................................................................ 28
Buffer Control ............................................................ 135 Multiplier ..................................................................... 30
Buffer Data Alignment ............................................... 135 Dual Output Compare Match Mode .................................. 100
Buffer Length Control................................................ 140 Continuous Pulse Mode............................................ 100
COFS Pin.................................................................. 135 Single Pulse Mode.................................................... 100
CSCK Pin.................................................................. 135
CSDI Pin ................................................................... 135 E
CSDO Mode Bit ........................................................ 141 Electrical Characteristics .................................................. 183
CSDO Pin ................................................................. 135 AC............................................................................. 195
Data Justification Control Bit ..................................... 139 DC ............................................................................ 184
Device Frequencies for Common Codec CSCK Frequen- Enabling and Setting Up UART
cies (Table) ....................................................... 139 Alternate I/O ............................................................. 117
Digital Loopback Mode ............................................. 141 Setting Up Data, Parity and Stop Bit Selections ....... 117
Enable....................................................................... 137 Enabling the UART ........................................................... 117
Frame Sync Generator ............................................. 137 Equations
Frame Sync Mode Control Bits ................................. 137 A/D Conversion Clock............................................... 147
I/O Pins ..................................................................... 135 Baud Rate................................................................. 119
Interrupts ................................................................... 141 Bit Clock Frequency.................................................. 139
Introduction ............................................................... 135 COFSG Period.......................................................... 137
Master Frame Sync Operation .................................. 137 Serial Clock Rate ...................................................... 112
Operation .................................................................. 137 Time Quantum for Clock Generation ........................ 129
Operation During CPU Idle Mode ............................. 142 Errata .................................................................................. 16
Operation During CPU Sleep Mode .......................... 142 Evaluation and Programming Tools.................................. 181
Receive Slot Enable Bits........................................... 140 Exception Processing ......................................................... 55
Receive Status Bits ................................................... 141 External Clock Timing Characteristics
Register Map............................................................. 143 Type A, B and C Timer ............................................. 201
Sample Clock Edge Control Bit................................. 139 External Clock Timing Requirements ............................... 196
Slave Frame Sync Operation .................................... 138 Type A Timer ............................................................ 201
Slot Enable Bits Operation with Frame Sync ............ 140 Type B Timer ............................................................ 202
Slot Status Bits.......................................................... 141 Type C Timer ............................................................ 202
Synchronous Data Transfers .................................... 140 External Interrupt Requests ................................................ 60
Timing Characteristics
AC-Link Mode ................................................... 207
Multichannel, I2S Modes ................................... 205

DS70083G-page 238 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
F Input Capture Timing Requirements................................. 203
Fast Context Saving............................................................ 60 Input Change Notification Module....................................... 79
Flash Program Memory ...................................................... 63 Register Map (Bits 15-8)............................................. 79
Control Registers ........................................................ 64 Register Map (Bits 7-0)............................................... 79
Instruction Addressing Modes ............................................ 47
NVMADR ............................................................ 64
File Register Instructions ............................................ 48
NVMADRU.......................................................... 64
NVMCON ............................................................ 64 Fundamental Modes Supported ................................. 47
NVMKEY............................................................. 64 MAC Instructions ........................................................ 48
MCU Instructions ........................................................ 48
I Move and Accumulator Instructions ........................... 48
I/O Pin Specifications Other Instructions ....................................................... 48
Input .......................................................................... 191 Instruction Flow................................................................... 24
Output ....................................................................... 192 Pipeline
I/O Ports .............................................................................. 75 1-Word, 1-Cycle (Figure) .................................... 24
Parallel (PIO) .............................................................. 75 1-Word, 2-Cycle (Figure) .................................... 24
I2C ..................................................................................... 107 1-Word, 2-Cycle MOV.D Operations (Figure)..... 25
I2C 10-bit Slave Mode Operation ...................................... 109 1-Word, 2-Cycle Table Operations (Figure) ....... 25
Reception.................................................................. 110 1-Word, 2-Cycle with Instruction Stall (Figure) ... 26
Transmission............................................................. 109 2-Word, 2-Cycle DO, DOW (Figure)................... 26
I2C 7-bit Slave Mode Operation ........................................ 109 2-Word, 2-Cycle GOTO, CALL (Figure) ............. 25
Reception.................................................................. 109 Instruction Set
Transmission............................................................. 109 Overview................................................................... 172
I2C Master Mode Operation .............................................. 111 Summary .................................................................. 169
Baud Rate Generator................................................ 112 Instruction Stalls ................................................................. 49
Clock Arbitration........................................................ 112 Introduction................................................................. 49
Multi-Master Communication, Bus Collision Raw Dependency Detection ....................................... 49
and Bus Arbitration ........................................... 112 Inter-Integrated Circuit. See I2C.
Reception.................................................................. 111 Internal Clock Timing Examples ....................................... 197
Transmission............................................................. 111 Interrupt Controller
I2C Master Mode Support ................................................. 111 Register Map .............................................................. 61
I2C Module ........................................................................ 107 Interrupt Priority .................................................................. 56
Addresses ................................................................. 109 Interrupt Sequence ............................................................. 59
Bus Data Timing Characteristics Interrupt Stack Frame................................................. 59
Master Mode ..................................................... 213 Interrupts ............................................................................ 55
Slave Mode ....................................................... 215 L
Bus Data Timing Requirements
Load Conditions................................................................ 195
Master Mode ..................................................... 214
Low Voltage Detect (LVD) ................................................ 165
Slave Mode ....................................................... 216
Low-Voltage Detect Characteristics.................................. 192
Bus Start/Stop Bits Timing Characteristics
LVDL Characteristics ........................................................ 193
Master Mode ..................................................... 213
Slave Mode ....................................................... 215 M
General Call Address Support .................................. 111
Memory Organization ......................................................... 17
Interrupts................................................................... 110
Core Register Map ..................................................... 43
IPMI Support ............................................................. 111
Modes of Operation
Operating Function Description ................................ 107
Disable...................................................................... 125
Operation During CPU Sleep and Idle Modes .......... 112
Initialization............................................................... 125
Pin Configuration ...................................................... 107
Listen All Messages.................................................. 125
Programmer’s Model................................................. 107
Listen Only................................................................ 125
Register Map............................................................. 113
Loopback .................................................................. 125
Registers................................................................... 107
Normal Operation ..................................................... 125
Slope Control ............................................................ 111
Modulo Addressing ............................................................. 50
Software Controlled Clock Stretching (STREN = 1).. 110
Applicability................................................................. 53
Various Modes .......................................................... 107
Decrementing Buffer Operation Example................... 52
I2S Mode Operation .......................................................... 142
Incrementing Buffer Operation Example .................... 51
Data Justification....................................................... 142
Restrictions................................................................. 53
Frame and Data Word Length Selection................... 142
Start and End Address ............................................... 50
Idle Current (IIDLE) ............................................................ 187
W Address Register Selection.................................... 51
In-Circuit Serial Programming (ICSP) ......................... 63, 153
MPLAB ASM30 Assembler, Linker, Librarian ................... 178
Input Capture (CAPX) Timing Characteristics .................. 203
MPLAB ICD 2 In-Circuit Debugger ................................... 179
Input Capture Module ......................................................... 95
MPLAB ICE 2000 High Performance Universal
Interrupts..................................................................... 97
In-Circuit Emulator.................................................... 179
Register Map............................................................... 98
MPLAB ICE 4000 High Performance Universal
Input Capture Operation During Sleep and Idle Modes ...... 97
In-Circuit Emulator.................................................... 179
CPU Idle Mode............................................................ 97
CPU Sleep Mode ........................................................ 97

 2004 Microchip Technology Inc. Preliminary DS70083G-page 239

dsPIC30F
MPLAB Integrated Development Environment Software .. 177 Data Access from, Address Generation ..................... 35
MPLINK Object Linker/MPLIB Object Librarian ................ 178 Data Space Window into Operation............................ 38
Multiplier Data Table Access (LS Word) .................................... 36
16-bit Integer and Fractional Modes Example ............ 30 Data Table Access (MS Byte)..................................... 37
Memory Map............................................................... 39
N Table Instructions
NVM TBLRDH ............................................................. 36
Register Map............................................................... 67 TBLRDL.............................................................. 36
TBLWTH............................................................. 36
O TBLWTL ............................................................. 36
OC/PWM Module Timing Characteristics.......................... 204 Visibility from Data Space........................................... 37
Operating Current (IDD)..................................................... 185 Program and EEPROM Characteristics............................ 194
Operating Frequency vs Voltage Program Counter ................................................................ 22
dsPIC30FXXXX-20 (Extended)................................. 184 Programmable .................................................................. 153
Oscillator Programmer’s Model .......................................................... 22
Configurations ........................................................... 156 Diagram ...................................................................... 23
Fail-Safe Clock Monitor..................................... 158 Programming Operations.................................................... 65
Fast RC (FRC) .................................................. 157 Algorithm for Program Flash....................................... 65
Initial Clock Source Selection ........................... 156 Erasing a Row of Program Memory............................ 65
Low Power RC (LPRC) ..................................... 158 Initiating the Programming Sequence......................... 66
LP Oscillator Control ......................................... 157 Loading Write Latches ................................................ 66
Phase Locked Loop (PLL) ................................ 157 Protection Against Accidental Writes to OSCCON ........... 159
Start-up Timer (OST) ........................................ 157
Operating Modes (Table) .......................................... 154 R
System Overview ...................................................... 153 Reset ........................................................................ 153, 159
Oscillator Selection ........................................................... 153 BOR, Programmable ................................................ 162
Oscillator Start-up Timer Brown-out Reset (BOR)............................................ 153
Timing Characteristics .............................................. 199 Oscillator Start-up Timer (OST) ................................ 153
Timing Requirements ................................................ 200 POR
Output Compare Interrupts ............................................... 101 Operating without FSCM and PWRT................ 162
Output Compare Module..................................................... 99 With Long Crystal Start-up Time ...................... 162
Register Map............................................................. 102 POR (Power-on Reset)............................................. 160
Timing Characteristics .............................................. 203 Power-on Reset (POR)............................................. 153
Timing Requirements ................................................ 203 Power-up Timer (PWRT) .......................................... 153
Output Compare Operation During CPU Idle Mode.......... 101 Reset Sequence ................................................................. 57
Output Compare Sleep Mode Operation........................... 101 Reset Sources ............................................................ 57
Reset Sources
P Brown-out Reset (BOR).............................................. 57
Packaging Information ...................................................... 223 Illegal Instruction Trap ................................................ 57
Marking ..................................................................... 223 Trap Lockout............................................................... 57
Peripheral Module Disable (PMD) Registers .................... 167 Uninitialized W Register Trap ..................................... 57
PICkit 1 Flash Starter Kit................................................... 181 Watchdog Time-out .................................................... 57
PICSTART Plus Development Programmer ..................... 179 Reset Timing Characteristics............................................ 199
Pinout Descriptions ............................................................. 19 Reset Timing Requirements ............................................. 200
PLL Clock Timing Specifications....................................... 197 RTSP Operation ................................................................. 64
POR. See Power-on Reset. Run-Time Self-Programming (RTSP) ................................. 63
Port Write/Read Example.................................................... 76
PORTA Register Map ......................................................... 77 S
PORTB Register Map ......................................................... 77 Serial Peripheral Interface. See SPI.
PORTC Register Map ......................................................... 77 Simple Capture Event Mode............................................... 96
PORTD Register Map ......................................................... 77 Buffer Operation ......................................................... 96
PORTF Register Map.......................................................... 78 Hall Sensor Mode ....................................................... 96
PORTG Register Map ......................................................... 78 Prescaler .................................................................... 96
Power Saving Modes ........................................................ 165 Timer2 and Timer3 Selection Mode............................ 96
Idle ............................................................................ 166 Simple OC/PWM Mode Timing Requirements ................. 204
Sleep......................................................................... 165 Simple Output Compare Match Mode .............................. 100
Sleep and Idle ........................................................... 153 Simple PWM Mode ........................................................... 100
Power-Down Current (IPD) ................................................ 189 Input Pin Fault Protection ......................................... 100
Power-up Timer Period ....................................................................... 101
Timing Characteristics .............................................. 199 Software Simulator (MPLAB SIM) .................................... 178
Timing Requirements ................................................ 200 Software Simulator (MPLAB SIM30) ................................ 178
PRO MATE II Universal Device Programmer ................... 179 Software Stack Pointer, Frame Pointer .............................. 22
Program Address Space ..................................................... 35 CALL Stack Frame ..................................................... 41
Alignment and Data Access Using Table SPI .................................................................................... 103
Instructions.......................................................... 36 SPI Module ....................................................................... 103
Construction ................................................................ 35 Framed SPI Support ................................................. 103

DS70083G-page 240 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
Operating Function Description ................................ 103 External Clock .......................................................... 195
Operation During CPU Idle Mode ............................. 105 I2C Bus Data
Operation During CPU Sleep Mode.......................... 105 Master Mode..................................................... 213
SDOx Disable ........................................................... 103 Slave Mode ...................................................... 215
Slave Select Synchronization ................................... 105 I2C Bus Start/Stop Bits
SPI1 Register Map.................................................... 106 Master Mode..................................................... 213
SPI2 Register Map.................................................... 106 Slave Mode ...................................................... 215
Timing Characteristics Input Capture (CAPX)............................................... 203
Master Mode (CKE = 0) .................................... 208 OC/PWM Module...................................................... 204
Master Mode (CKE = 1) .................................... 209 Oscillator Start-up Timer........................................... 199
Slave Mode (CKE = 1) .............................. 210, 211 Output Compare Module .......................................... 203
Timing Requirements Power-up Timer ........................................................ 199
Master Mode (CKE = 0) .................................... 208 Reset ........................................................................ 199
Master Mode (CKE = 1) .................................... 209 SPI Module
Slave Mode (CKE = 0) ...................................... 210 Master Mode (CKE = 0).................................... 208
Slave Mode (CKE = 1) ...................................... 212 Master Mode (CKE = 1).................................... 209
Word and Byte Communication ................................ 103 Slave Mode (CKE = 0)...................................... 210
Status Bits, Their Significance and the Initialization Slave Mode (CKE = 1)...................................... 211
Condition for RCON Register, Case 1 ...................... 163 Type A, B and C Timer External Clock..................... 201
Status Bits, Their Significance and the Initialization Watchdog Timer ....................................................... 199
Condition for RCON Register, Case 2 ...................... 164 Timing Diagrams
Status Register ................................................................... 22 CAN Bit..................................................................... 128
Z Status Bit ................................................................. 22 Frame Sync, AC-Link Start of Frame ....................... 138
Symbols Used in Opcode Descriptions............................. 170 Frame Sync, Multi-Channel Mode ............................ 138
System Integration ............................................................ 153 I2S Interface Frame Sync ......................................... 138
Register Map............................................................. 168 PWM Output ............................................................. 101
Time-out Sequence on Power-up
T (MCLR Not Tied to VDD), Case 1 ..................... 160
Table Instruction Operation Summary ................................ 63 Time-out Sequence on Power-up
Temperature and Voltage Specifications (MCLR Not Tied to VDD), Case 2 ..................... 161
AC ............................................................................. 195 Time-out Sequence on Power-up
DC............................................................................. 184 (MCLR Tied to VDD) ......................................... 160
Timer1 Module .................................................................... 81 Timing Diagrams and Specifications
16-bit Asynchronous Counter Mode ........................... 81 DC Characteristics - Internal RC Accuracy .............. 197
16-bit Synchronous Counter Mode ............................. 81 Timing Diagrams.See Timing Characteristics
16-bit Timer Mode....................................................... 81 Timing Requirements
Gate Operation ........................................................... 82 A/D Conversion
Interrupt....................................................................... 82 10-Bit ................................................................ 221
Operation During Sleep Mode .................................... 82 Bandgap Start-up Time ............................................ 200
Prescaler..................................................................... 82 Brown-out Reset....................................................... 200
Real-Time Clock ......................................................... 82 CLKOUT and I/O ...................................................... 198
Interrupts............................................................. 83 DCI Module
Oscillator Operation ............................................ 83 AC-Link Mode................................................... 207
Register Map............................................................... 84 Multichannel, I2S Modes................................... 206
Timer2 and Timer3 Selection Mode .................................. 100 External Clock .......................................................... 196
Timer2/3 Module ................................................................. 85 I2C Bus Data (Master Mode) .................................... 214
16-bit Timer Mode....................................................... 85 I2C Bus Data (Slave Mode) ...................................... 216
32-bit Synchronous Counter Mode ............................. 85 Input Capture............................................................ 203
32-bit Timer Mode....................................................... 85 Oscillator Start-up Timer........................................... 200
ADC Event Trigger...................................................... 88 Output Compare Module .......................................... 203
Gate Operation ........................................................... 88 Power-up Timer ........................................................ 200
Interrupt....................................................................... 88 Reset ........................................................................ 200
Operation During Sleep Mode .................................... 88 Simple OC/PWM Mode ............................................ 204
Register Map............................................................... 89 SPI Module
Timer Prescaler........................................................... 88 Master Mode (CKE = 0).................................... 208
Timer4/5 Module ................................................................. 91 Master Mode (CKE = 1).................................... 209
Register Map............................................................... 93 Slave Mode (CKE = 0)...................................... 210
Timing Characteristics Slave Mode (CKE = 1)...................................... 212
A/D Conversion Type A Timer External Clock.................................... 201
10-Bit (ASAM = 0, SSRC = 000)....................... 220 Type B Timer External Clock.................................... 202
Bandgap Start-up Time............................................. 200 Type C Timer External Clock.................................... 202
CAN Module I/O........................................................ 217 Watchdog Timer ....................................................... 200
CLKOUT and I/O....................................................... 198 Timing Specifications
DCI Module PLL Clock ................................................................. 197
AC-Link Mode ................................................... 207
Multichannel, I2S Modes ................................... 205

 2004 Microchip Technology Inc. Preliminary DS70083G-page 241

dsPIC30F
Traps ................................................................................... 57 Transmit Break ......................................................... 118
Hard and Soft .............................................................. 58 Transmit Buffer (UxTXB) .......................................... 117
Sources ....................................................................... 57 Transmit Interrupt ..................................................... 118
Address Error Trap ............................................. 58 Transmitting Data ..................................................... 117
Math Error Trap................................................... 57 Transmitting in 8-bit Data Mode................................ 117
Oscillator Fail Trap.............................................. 58 Transmitting in 9-bit Data Mode................................ 117
Stack Error Trap.................................................. 58 UART1 Register Map................................................ 121
UART2 Register Map................................................ 121
U UART Operation
UART Module Idle Mode .................................................................. 120
Address Detect Mode ............................................... 119 Sleep Mode .............................................................. 120
Auto Baud Support.................................................... 120 Unit ID Locations .............................................................. 153
Baud Rate Generator ................................................ 119 Universal Asynchronous Receiver Transmitter. See UART.
Enabling and Setting Up ........................................... 117
Framing Error (FERR)............................................... 119 W
Idle Status ................................................................. 119 Wake-up from Sleep ......................................................... 153
Loopback Mode ........................................................ 119 Wake-up from Sleep and Idle ............................................. 60
Operation During CPU Sleep and Idle Modes .......... 120 Watchdog Timer
Overview ................................................................... 115 Timing Characteristics .............................................. 199
Parity Error (PERR) .................................................. 119 Timing Requirements................................................ 200
Receive Break........................................................... 119 Watchdog Timer (WDT)............................................ 153, 165
Receive Buffer (UxRXB) ........................................... 118 Enabling and Disabling ............................................. 165
Receive Buffer Overrun Error (OERR Bit) ................ 118 Operation .................................................................. 165
Receive Interrupt....................................................... 118 WWW, On-Line Support ..................................................... 16
Receiving Data.......................................................... 118
Receiving in 8-bit or 9-bit Data Mode........................ 118
Reception Error Handling.......................................... 118

DS70083G-page 242 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
ON-LINE SUPPORT SYSTEMS INFORMATION AND
Microchip provides on-line support on the Microchip UPGRADE HOT LINE
World Wide Web site. The Systems Information and Upgrade Line provides
The web site is used by Microchip as a means to make system users a listing of the latest versions of all of
files and information easily available to customers. To Microchip's development systems software products.
view the site, the user must have access to the Internet Plus, this line provides information on how customers
and a web browser, such as Netscape® or Microsoft® can receive the most current upgrade kits.The Hot Line
Internet Explorer. Files are also available for FTP Numbers are:
download from our FTP site. 1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
Connecting to the Microchip Internet
Web Site 042003
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP ser-
vice to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
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available for consideration is:
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• Links to other useful web sites related to
Microchip Products
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technical information and more
• Listing of seminars and events

 2004 Microchip Technology Inc. Preliminary DS70083G-page 243

dsPIC30F
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
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Device: dsPIC30F Literature Number: DS70083G

Questions:

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DS70083G-page 244 Preliminary  2004 Microchip Technology Inc.

 dsPIC30F
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

d s P I C 3 0 F 4 0 1 3 AT- 3 0 I / P - E S
Custom ID (3 digits) or
Trademark Engineering Sample (ES)

Architecture Package
PT = TQFP 10x10
PT = TQFP 12x12
PF = TQFP 14x14
Flash P = DIP
SO = SOIC
SP = SPDIP
Memory Size in Bytes
ML = QFN 6x6 or 8x8
0 = ROMless S = Die (Waffle Pack)
1 = 1K to 6K
2 = 7K to 12K W = Die (Wafers)
3 = 13K to 24K
4 = 25K to 48K Temperature
5 = 49K to 96K I = Industrial -40°C to +85°C
6 = 97K to 192K E = Extended High Temp -40°C to +125°C
7 = 193K to 384K
8 = 385K to 768K
Speed
9 = 769K and Up
20 = 20 MIPS
30 = 30 MIPS
Device ID T = Tape and Reel

A,B,C… = Revision Level

Examples:
a) dsPIC30F2011AT-E/SO = Extended temp., SOIC package, Rev. A.
b) dsPIC30F5011AT-I/PT = Industrial temp., TQFP package, Rev. A.
c) dsPIC30F3012AT-I/P = Industrial temp., DIP package, Rev. A.

 2004 Microchip Technology Inc. Preliminary DS70083G-page 245

 WORLDWIDE SALES AND SERVICE
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08/24/04

DS70083G-page 246 Preliminary  2004 Microchip Technology Inc.