Document Number: AN4402

Freescale Semiconductor Rev. 0, 04/2014

Design Checklist

P2041/P2040 QorIQ Integrated

Processor Design Checklist
Contents
1. Simplifying the first phase of design . . . . . . . . . . . . . 2
2. Power design recommendations . . . . . . . . . . . . . . . . . 6

About this document 3.

4.
Power-on reset recommendations . . . . . . . . . . . . . . . 11
DDR recommendations . . . . . . . . . . . . . . . . . . . . . . 13
5. SerDes recommendations . . . . . . . . . . . . . . . . . . . . . 15
This document provides recommendations for new designs based on the P2041. It may also be useful 6. eLBC recommendations . . . . . . . . . . . . . . . . . . . . . . 16
in debugging newly-designed systems by highlighting those aspects of a design that merit special 7. DMA recommendations . . . . . . . . . . . . . . . . . . . . . . 18
attention during initial system start-up. 8. PIC recommendations . . . . . . . . . . . . . . . . . . . . . . . . 19
9. IEEE 1588 recommendations . . . . . . . . . . . . . . . . . . 20
Each section has a pin termination checklist or a system-level checklist, or sometimes both. 10. Ethernet management recommendations . . . . . . . . . 21
11. TSEC recommendations . . . . . . . . . . . . . . . . . . . . . . 22
12. UART recommendations . . . . . . . . . . . . . . . . . . . . . 24
Before you begin 13. I2C recommendations . . . . . . . . . . . . . . . . . . . . . . . . 25
14. eSDHC recommendations . . . . . . . . . . . . . . . . . . . . 26
Ensure you are familiar with the following Freescale documents before proceeding: 15. eSPI recommendations . . . . . . . . . . . . . . . . . . . . . . . 27
16. USB recommendations . . . . . . . . . . . . . . . . . . . . . . . 28
• P2041 QorIQ Integrated Processor Hardware Specifications (P2041EC) 17. GPIO recommendations . . . . . . . . . . . . . . . . . . . . . . 30
• P2041 QorIQ Integrated Processor Reference Manual (P2041RM) 18. DFT recommendations . . . . . . . . . . . . . . . . . . . . . . . 32
19. Power management recommendations . . . . . . . . . . . 32
• P2041 Chip Errata (P2041CE) 20. Trust recommendations . . . . . . . . . . . . . . . . . . . . . . . 33
21. Clock recommendations . . . . . . . . . . . . . . . . . . . . . . 34
• QorIQ Data Path Acceleration Architecture (DPAA) Reference Manual (DPAARM)
22. System control recommendations . . . . . . . . . . . . . . . 34
23. Debug recommendations . . . . . . . . . . . . . . . . . . . . . 35
24. JTAG recommendations . . . . . . . . . . . . . . . . . . . . . . 37
25. No connect recommendations . . . . . . . . . . . . . . . . . . 42
26. Thermal recommendations . . . . . . . . . . . . . . . . . . . . 42
27. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

© 2014 Freescale Semiconductor, Inc. All rights reserved.

Simplifying the first phase of design

1 Simplifying the first phase of design

This section outlines recommendations to simplify the first phase of design. Before designing a system with the chip, it is recommended that
the designer be familiar with the available documentation, software, models, and tools.
This figure shows the major functional units within the chip.

P2041
Power Architecture®
128 KB e500mc Core
Backside 1024 KB 64-bit
L2 Cache 32 KB 32 KB Frontside DDR3/3L
D-Cache I-Cache CoreNet Platform Memory Controller
Cache
eOpenPIC
PreBoot
Loader CoreNet
Coherency Fabric
Security
Monitor Peripheral PAMU
PAMU PAMU PAMU PAMU Access Mgmt Unit
Internal
BootROM
Power Mgmt Frame Manager Real Time Debug
SD/MMC Parse, Classify,
Security Queue 2x DMA Watchpoint
eLBC 4.2 Mgr Distribute Cross
SPI
Trigger

SATA 2.0

SATA 2.0
2x DUART Buffer

4x I2C Pattern Perf Trace

RapidIO 1GE

PCIe 2.0
PCIe 2.0

PCIe 2.0
Match Buffer 1GE Monitor

PCIe
2x RMan

sRIO 1.3/2.1

sRIO 1.3/2.1
USB 2.0 PHY Engine Mgr 10GE
2.1 1GE
1GE Aurora
Clocks/Reset 1GE
GPIO
CCSR 10-Lane 5-GHz SerDes

Figure 1. Chip block diagram

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 Simplifying the first phase of design

1.1 Recommended resources

This table lists helpful tools, training resources, and documentation, some of which may be available only under a non-disclosure agreement
(NDA). Contact your local field applications engineer or sales representative to obtain a copy.
Table 1. Helpful tools and references

ID Name Location

Related documentation

P2041CE P2041 Chip Errata Contact your Freescale representative

Note: This document describes the latest fixes and work-arounds for the chip. It is strongly recommended that this
document be thoroughly researched prior to starting a design with the chip.

P2041EC P2041 QorIQ Integrated Processor Hardware Specifications Contact your Freescale representative

P2041FS P2041 Fact Sheet www.freescale.com

P2041RM P2041 QorIQ Integrated Processor Reference Manual www.freescale.com

P2041RMAD Errata to P2041 QorIQ Integrated Processor Reference Manual Contact your Freescale representative

DPAARM QorIQ Data Path Acceleration Architecture (DPAA) Reference Manual Contact your Freescale representative

P2041SECRM P2041 Security (SEC 4.2) Reference Manual Contact your Freescale representative

E500CORERM PowerPC e500 Core Complex Reference Manual www.freescale.com

AN4326 Verification of the IEEE 1588 Interface www.freescale.com

AN4311 SerDes Reference Clock Interfacing and HSSI measurements Recommendations www.freescale.com

AN4309 PowerQUICC DDR3 SDRAM Controller Register Setting Considerations www.freescale.com

AN4290 Configuring the Data Path Acceleration Architecture (DPAA) www.freescale.com

AN3939 DDR Interleaving for PowerQUICC and QorIQ Processors www.freescale.com

AN3940 Hardware and Layout Design Considerations for DDR3 SDRAM Memory Interfaces www.freescale.com

AN3645 SEC 2/3x Descriptor Programmer’s Guide www.freescale.com

AN2919 Determining the I2C Frequency Divider Ratio for SCL www.freescale.com

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Simplifying the first phase of design

Table 1. Helpful tools and references (continued)

ID Name Location

Software tools

I2CBOOTSEQ Boot sequencer generator tool allows configuration of any memory-mapped register before the completion of Contact your Freescale representative
power-on reset (POR). The register data to be changed is stored in an I2C EEPROM. The chip requires a particular
data format for register changes as outlined in the P2041RM. The boot sequencer tool (I2CBOOTSEQ) is a C-code
file. When compiled and given a sample data file, it will generate the appropriate raw data format as outlined in the
P2041RM. The file that is generated is an s-record file that can be used to program the EEPROM.

LBCUPMIBCG UPM Programming tool features a GUI for a user-friendly programming interface. It allows programming of all three Contact your Freescale representative
of the chip’s user-programmable machines. The GUI consists of a wave editor, a table editor, and a report generator.
The user can edit the waveform directly or the RAM array directly. At the end of programming, the report generator
will print out the UPM RAM array that can be used in a C-program.

NetComm The NetComm device driver software package is available for download. It includes the following: www.freescale.com/netcommsw
Software • Device drivers for DPAA and other commonly used modules
• Use cases to test the functionality of DPAA and other commonly used modules

QorIQ DPAA Mentor Embedded Linux Essentials for QorIQ Processors with Data Path Acceleration www.freescale.com
SDK

Hardware tools

P2041DS1 Development system, including schematics, bill of materials, board errata list, user’s Guide, and configuration guide Contact your Freescale representative

Models

IBIS To ensure first path success, Freescale strongly recommends using the IBIS models for board level simulations, www.freescale.com
especially for SerDes and DDR characteristics.

BSDL Use the BSDL files in board verification. www.freescale.com

Flotherm Use the Flotherm model for thermal simulation. Especially without forced cooling or constant airflow, a thermal www.freescale.com
simulation should not be skipped.

Available training

Our third-party partners are part of an extensive alliance network. More information can be found at www.freescale.com/alliances
—
www.freescale.com/alliances.
Training materials from past Smart Network Developer’s Forums and Freescale Technology Forums (FTF) are also www.freescale.com/alliances
—
available at our website. These training modules are a valuable resource for understanding the chip.

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 Simplifying the first phase of design

1
Design requirements in the device hardware specification and design checklist supersede the design/implementation of the DS system.

1.2 Product revisions

This table lists the processor version register (PVR) and system version register (SVR) values for the various chip silicon derivatives.
Table 2. Chip product revisions

Device Device Core Processor version System version

With...
number revision revision register value register value

P2041E 1.0 V2.2 0x8023_0121 0x8218_0110 DPAA SEC 4.2

P2041 0x8210_0110 DPAA only

P2041E 1.1 0x8218_0111 DPAA SEC 4.2

P2041 0x8210_0111 DPAA only

P2040E 1.0 V2.2 0x8023_0121 0x8218_0010 DPAA SEC 4.2

P2040 0x8210_0010 DPAA only

P2040E 1.1 0x8218_0011 DPAA SEC 4.2

P2040 0x8210_0011 DPAA only

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 Power design recommendations

2 Power design recommendations

2.1 Power pin recommendations
Table 3. Power and ground pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

AVDD_CC1 — Power supply for Core cluster PLL1 (1.0 V through a filter). Tie to GND

AVDD_CC2 — Power supply for Core cluster PLL2 (1.0 V through a filter). Tie to GND

AVDD_DDR — Power supply for the DDR PLL (1.0 V through a filter). Tie to GND

AVDD_PLAT — Power supply for the Platform PLL (1.0 V through a filter). Tie to GND

AVDD_SRDS1 — Power supply for the SerDes PLL1 (1.0 V through a filter). Tie to GND
AVDD_SRDS2 — Power supply for the SerDes PLL2 (1.0 V through a filter). Tie to GND

AVDD_SRDS3 — Power supply for the SerDes PLL3 (1.0 V through a filter). Tie to GND

SVDD — Power supply for the SerDes core logic (1.0 V). Tie to GND

BVDD — Power supply for the local bus and GPIO (1.8 V/2.5 V/3.3 V). Tie to GND

CVDD — Power supply for eSPI and& eSDHC (1.8 V/2.5 V/3.3 V). Tie to GND

GVDD — Power supply for the DDR (1.5 V/1.35V). Tie to GND

LVDD — Power supply for the TSEC (2.5 V/3.3 V). Tie to GND

OVDD — Power supply for the general I/O (3.3 V). Tie to GND

VDD_CA_CB_PL — Power supply for core 0-3 (1.0 V) and platform. Tie to GND

VDD_LP — Low power security monitor supply (1.0V) Tie to 1.0V

SENSEVDD_CA_PL — For Rev 1.1 and Rev 2.0, the better solution is to use the Leave unconnected
SENSEVDD_CB and SENSEGND_CB pair. The
SENSEVDD_CB — SENSEVDD_CA_PL and SENSEGND_CA_PL pair can be
left as unconnected.

XVDD — Power supply for the SerDes transceiver (1.5 V/1.8 V). Tie to GND

POVDD — Fuse programming override supply (1.5V). Tie to GND

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 Power design recommendations

Table 3. Power and ground pin termination checklist (continued)

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

USB1_VDD_3P3 — USB1 PHY PLL 3.3 V Supply. Tie to GND or leave

unconnected

USB2_VDD_3P3 — USB2 PHY Transceiver 3.3V Supply. Tie to GND or leave

unconnected

USB1_VDD_1P0 — USB1 PHY PLL 1.0 V Supply. Tie to 1.0 V

USB2_VDD_1P0 — USB2 PHY PLL 1.0 V Supply. Tie to 1.0 V

SGND — SerDes core logic GND. —

XGND — SerDes transceiver GND. —

GND — Ground

AGND_SRDS1 — SerDes PLL 1 GND —

AGND_SRDS2 — SerDes PLL 2 GND —

SENSEGND_CA_PL — Core group A and Platform GND sense —

SENSEGND_CB — Core group B GND sense —

USB1_AGND — USB1 PHY Transceiver GND —

USB2_AGND — USB2 PHY Transceiver GND —

2.2 Power system-level recommendations

Table 4. Power design system-level checklist

Item Remarks (for customer use) Completed

General

1. Ensure that all power supplies have a voltage tolerance no greater than 5% from the nominal value.1
2. Ensure the power supply is selected based on MAXIMUM power dissipation.1

3. Ensure the thermal design is based on THERMAL power dissipation.1

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Power design recommendations

Table 4. Power design system-level checklist (continued)

Item Remarks (for customer use) Completed

4. Ensure the power-up sequence is within 75 ms.1

5. Use large power planes to the extent possible.

6. Ensure the PLL filter circuit is applied to AVDD_PLAT, AVDD_CB, AVDD_DDR.

7. If SerDes is enabled, ensure the PLL filter circuit is applied to the respective AVDD_SRDS. Otherwise, a filter
is not required.

8. Ensure the PLL filter circuits are placed as close to the respective AVDD pin as possible.

9. Ensure the decoupling capacitors of 0.1 µF are placed at each VDD, AVDD, B/C/G/L/X/S/OVDD pin.

Power supply decoupling

10.Provide large power planes, because immediate charge requirements by the device are always serviced from
the power planes first.

11.Place at least one decoupling capacitor at each VDD, AVDD, BVDD, CVDD, OVDD, GVDD, and LVDD pins of the
device.

12.Ensure these decoupling capacitors receive their power from separate VDD, AVDD, BVDD, CVDD, OVDD,GVDD,
and LVDD, and GND planes in the PCB, utilizing short traces to minimize inductance.
13.Capacitors maybe placed directly under the device using a standard escape pattern, and others may surround
the part.

14.Ensure these capacitors have a value of 0.01 or 0.1 µF.

15.Only use ceramic surface mount technology (SMT) capacitors to minimize lead inductance, preferably 0402
or 0603.

16.Distribute several bulk storage capacitors around the PCB, feeding the VDD, AVDD, BVDD, CVDD, OVDD, GVDD,
and LVDD planes to enable quick recharging of the smaller chip capacitors.

17.Ensure the bulk capacitors have a low ESR (equivalent series resistance) rating to ensure the quick response
time necessary.

18.Ensure the bulk capacitors are connected to the power and ground planes through two vias to minimize
inductance.

19.Ensure you work directly with your power regulator vendor for best values and types of bulk capacitors. The
capacitors need to be selected to work well with the power supply so as to be able to handle the chip dynamic
load requirements.2

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 Power design recommendations

Table 4. Power design system-level checklist (continued)

Item Remarks (for customer use) Completed

SerDes power supply decoupling

20.Use only SMT capacitors to minimize inductance.

21.Ensure connections from all capacitors to power and ground are done with multiple vias to further reduce
inductance.

22.Ensure the board has at least one 10 x 0.1 µF SMT ceramic chip capacitor as close as possible for each
supply ball of the chip.
• Where the board has blind vias, ensure these capacitors are placed directly below the chip supply and ground
connections.
• Where the board does not have blind vias, ensure these capacitors are placed in a ring around the chip as
close to the supply and ground connections as possible.

23.For all SerDes supplies: Ensure there is a 1-µF ceramic chip capacitor on each side of the device.

24.For all SerDes supplies: Ensure there is a 10-µF, low equivalent series resistance (ESR) SMT tantalum chip
capacitor and a 100-µF, low ESR SMT tantalum chip capacitor between the device and any SerDes voltage
regular.

PLL power supply filtering3

25.Provide independent filter circuits per PLL power supply, as illustrated in this figure4.
5Ω
VDD_CA_CB_PL AVDD
10 µF 1.0 µF

Low-ESL surface-mount capacitors

GND

26.Ensure it is built with surface mount capacitors with minimum effective series inductance (ESL). 5

27.Place each circuit as close as possible to the specific AVDD pin being supplied to minimize noise coupled from
nearby circuits.
Note: If done properly, it is possible to route directly from the capacitors to the AVDD pin.
28.Ensure each of the PLLs is provided with power through independent power supply pins (AVPLAT, AVDD_DDR,
AVDD_SRDS).

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Power design recommendations

Table 4. Power design system-level checklist (continued)

Item Remarks (for customer use) Completed

29.Ensure the AVDD level is always equivalent to VDD, and preferably these voltages are derived directly from
VDD through a low frequency filter scheme.

30.For maximum effectiveness, ensure the filter circuit is placed as close as possible to the AVDD_SRDS ball to
ensure it filters out as much noise as possible.

31.Ensure the ground connection is near the AVDD_SRDS ball. The 0.003-µF capacitor is closest to the ball,
followed by the two 2.2-µF capacitors, and finally the 1.0-Ω resistor to the board supply plane.
32.To ensure stability of the internal clock, ensure the power supplied to the PLL is filtered using a circuit similar
to the one shown in this figure.

1.0 Ω
SVDD AVDD_SRDS
2.2 µF 1 2.2 µF1 0.003 µF

GND

Caution: These filters are a necessary extension of the PLL circuitry and are compliant with the device
specifications. Any deviation from the recommended filters is done at the user’s risk.

33.Ensure the capacitors are connected from AVDD_SRDS to the ground plane.

34.Use ceramic chip capacitors with the highest possible self-resonant frequency. All traces should be kept short,
wide, and direct.

35.Ensure AVDD_SRDS is a filtered version of SVDD.

36.Ensure that signals on the SerDes interface are fed from the XVDD power plane.
1 See the P2041 hardware specification (P2041EC) for more details.
2 Suggested bulk capacitors are 100–330 µF (AVX TPS tantalum or Sanyo OSCON).
3 The PLL power supply filter circuit filters noise in the PLLs’ resonant frequency range from 500 kHz–10 MHz.
4 A higher capacitance value for C2 can be used to improve the filter as long as the other C2 parameters do not change (0402 body, X5R, ESL <= 0.5 nH).
5 Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic (Prentice Hall, 1993), multiple small capacitors of

equal value are recommended over a single large value capacitor.

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 Power-on reset recommendations

3 Power-on reset recommendations

Various device functions are initialized by sampling certain signals during the assertion of PORESET. These power-on reset (POR) inputs are
pulled either high or low during this period. While these pins are generally output pins during normal operation, they are treated as inputs while
PORESET is asserted. When PORESET de-asserts, the configuration pins are sampled and latched into registers, and the pins then take on their
normal output circuit characteristics.
Table 5. Power-on reset system-level checklist

Item Remarks (for customer use) Completed

Timing

1. Ensure PORESET is asserted for a minimum of 1ms. Ensure HRESET is asserted for a minimum of 32
SYSCLK cycles.

2. Use a 4.7 kΩ pull-down resistor to pull the configuration pin to a valid logic-low level.

3. Optional: An alternative to using pull-up and pull-down resistors to configure the POR pins is to use a PLD or
similar device that drives the configuration signals to the chip when PORESET is asserted. The PLD must
begin to drive these signals at least four SYSCLK cycles prior to the de-assertion of PORESET, hold their
values for at least 2 SYSCLK cycles after the de-assertion of PORESET, and then release the pins to high
impedance afterward for normal device operation.
Note: See the P2041EC for details about reset initialization timing specifications.

I/O supply voltage encodings

4. Ensure IO_VSEL[0:4] encodings are selected properly for each I/O supply. This pin has an internal 2 kΩ
pull-down resistor, to pull it high, a pull-up resistor of less than 1 kΩ to OVDD should be used.
Warning: Incorrect voltage-select settings can lead to irreversible device damage.
Note: See the P2041EC for details about I/O voltage selection.

This table lists all the reset configuration pins. See the chip reference manual, Section 4.6.3, “Reset Configuration Word (RCW),” for more
information.

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Power-on reset recommendations

Table 6. Reset configuration pins

Reset configuration name Function Signal Name Configuration default value Remarks (for customer use) Completed

cfg_gpinput[0:15] LAD[0:15] This is for an application-specific 1111 1111 1111 1111

purpose.

cfg_xvdd_sel LA[26] 0: XVDD 1.8V 1

1: XVDD 1.5V

cfg_elbc_ecc LA[23] 0: NAND flash ECM disable 1

1: NAND flash ECC enable

cfg_dram_type LA[24] 0: DDR3 technology(1.5V) 1

1: DDR3L technology(1.35V)
cfg_rcw_src[0] LGPL0/LFCLE Source of the reset configuration 1
word
cfg_rcw_src[1] LGPL1/LFALE 1

cfg_rcw_src[2] LGPL2/LOE/LFRE 1

cfg_rcw_src[3] LGPL3/LFWP 1

cfg_rcw_src[4] LGPL5 1

cfg_svr[0:1] LA[16:17] LA[16:17] = 2’b11; P2040 11

LA[16:17] = 2’b10; P2041

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 DDR recommendations

4 DDR recommendations
Table 7. DDR pin termination checklist

Signal name I/O Type Used Not used Remarks (for customer use) Completed

MA[0:15] O Must be properly terminated to VTT. May be left unconnected.

MBA[0:2] O Must be properly terminated to VTT. May be left unconnected.

MCK[0:3]/ O Must be properly terminated. May be left unconnected. However, the MCK
MCK[0:3] pin should be disabled via DDRCLKDR
register.

MCKE[0:3] O Must be properly terminated to VTT. May be left unconnected.

MCS[0:3] O Must be properly terminated to VTT. May be left unconnected.

MDIC[0:1] I/O This pin is used for automatic calibration of May be left unconnected.
the DDR IOs. The calibration resistor value
for DDR3 should be 20-Ω (full-strength
mode) or 40.2-Ω (half-strength mode).

MDM[0:8] O — May be left unconnected.

MDQ[0:63] I/O — May be left unconnected.

MDQS[0:8]/ I/O — May be left unconnected.

MDQS[0:8]
MECC[0:7] I/O — May be left unconnected.

MAPAR_ERR I This pin is an open drain output from

This pin is should be pulled up whether
registered DIMMs. Ensure that a 4.7K pull-up
used or not.
to GVDD is present on this pin.

MAPAR_OUT O If the controller supports the optional May be left unconnected.

MAPAR_OUT and MAPAR_ERR signals,
ensure that they are hooked up as follows:
• MAPAR_OUT (from the controller) =>
PAR_IN (at the RDIMM)
• ERR_OUT (from the RDIMM) =>
MAPAR_ERR (at the controller)

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DDR recommendations

Table 7. DDR pin termination checklist (continued)

Signal name I/O Type Used Not used Remarks (for customer use) Completed

MODT[0:3] O Are the MODT signals connected correctly? May be left unconnected.
In general, for Dual-Ranked DIMMS, the
following should all go to the same physical
memory bank:
• MODT(0), MCS(0), MCKE(0)
• MODT(1), MCS(1), MCKE(1)
• MODT(2), MCS(2), MCKE(2)
• MODT(3), MCS(3), MCKE(3)
For Quad-Ranked DIMMS, it is
recommended to obtain a data sheet from
the memory supplier to confirm required
signals. But, in general, each controller
needs MCS(0:3), MODT(0:1), and
MCKE(0:1) connected to the one
Quad-Ranked DIMM. If DIMM (modules) is
used then the termination is on the DIMM. If
discrete design is used, MODT[0:3] must be
terminated to VTT when used.

MRAS O Must be properly terminated to VTT. May be left unconnected.

MCAS O Must be properly terminated to VTT. May be left unconnected.

MWE O Must be properly terminated to VTT. May be left unconnected.

MVREF I DDR Reference Voltage: 0.49 × GVDD to Must be connected to GND.

0.51 × GVDD.
MVREF can be generated using a divider
from GVDD as MVREF. Another option is to
use supplies that generate GVDD, VTT, and
MVREF voltage. These methods help reduce
differences between GVDD and MVREF.
Generating MVREF from a separate
regulator is not recommended as MVREF will
not track GVDD as closely.

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 SerDes recommendations

5 SerDes recommendations
Table 8. SerDes pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

SD_TX[2:7] O — Must be left unconnected.

SD_TX[10:13]

SD_TX[2:7] O — Must be left unconnected.

SD_TX[10:13]

SD_RX[2:7] I — Must be connected to GND.

SD_RX[10:13]

SD_RX[2:7] I — Must be connected to GND.

SD_RX[10:13]
SD_REF_CLK1 I — Must be connected to GND.

SD_REF_CLK2 I — Must be connected to GND.

SD_REF_CLK1 I — Must be connected to GND.

SD_REF_CLK2 I — Must be connected to GND.

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eLBC recommendations

6 eLBC recommendations
Table 9. eLBC pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

LAD[0:15] I/O This pin is a reset configuration pin. It has a Tie high or low through a 2–10 kΩ resistor
weak internal pull-up P-FET that is enabled to BVDD or GND, if the general purpose
only when the processor is in the reset state. POR configuration is not used.
Note that the LSB for the address is Still need to pull up if the POR default is
LAD[8:15]; however, the MSB for the data is acceptable.
on LAD[0:7].
Note: The value of LAD[0:15] during reset
sets the upper 16 bits of the GPPORCR.
cfg_gpinput[0:15]

LA[16:31] I/O This pin is a reset configuration pin. It has a If the POR default is acceptable, these pins
weak internal pull-up P-FET that is enabled may be left unconnected.
only when the processor is in the reset state.
• LA[16:17] cfg_svr[0:1]
• LA[23] cfg_elbc_ecc
• LA[24] cfg_dram_type
• LA[26] cfg_xvdd
Note: The following pins must NOT be
pulled down during power-on reset:
LA[16], LA[18:22], LA[25].

LCS[0:3] O Recommend a weak pull-up resistor May be left unconnected.

(2–10KΩ) be placed on this pin to BVDD to
ensure no random chip select assertion due
to possible noise and so on.

LDP[0:1] I/O — Tie high or low through a 2–10 kΩ resistor

to BVDD or GND.
LWE[0:1] O — May be left unconnected.

LBCTL O — May be left unconnected.

LALE O — May be left unconnected.

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16 Freescale Semiconductor
 eLBC recommendations

Table 9. eLBC pin termination checklist (continued)

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

LGPL0/LFCLE O This pin is a reset configuration pin. It has a If the POR default is acceptable, may be left
weak internal pull-up P-FET that is enabled unconnected.
LGPL1/LFALE O only when the processor is in the reset state.
LGPL2/LOE/LFRE O

LGPL3/LFWP O

LGPL4/LGTA/ I/O For systems that boot from Local Bus For systems that boot from Local Bus
LUPWAIT/LPBSE (GPCM)-controlled NOR flash or (GPCM)-controlled NOR flash or
(FCM)-controlled NAND flash, a pull up on (FCM)-controlled NAND flash, a pull up on
LGPL4 is required. LGPL4 is required.

LGPL[5] O This pin is a reset configuration pin. It has a If the POR default is acceptable, may be left
weak internal pull-up P-FET that is enabled unconnected.
only when the processor is in the reset state.

LCLK[0:1] O — May be left unconnected.

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Freescale Semiconductor 17
DMA recommendations

7 DMA recommendations
Ensure pin is driven in the non asserted state, or use pull up.
Table 10. DMA Pin Termination Checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

DMA1_DREQ0/IIC4_SCL/EVT5/ I RCW[354:357] bit to select Tie high through a 2–10 kΩ

M1SRCID1/LB_SRCID1/GPIO18 between DMA1 or other resistor to OVDD.
functions.
DMA1_DACK0/IIC3_SCL/GPIO16/ O If not used, configure it to be DMA
SDHC_CD/M1DVAL/LB_DVAL function and leave it floating.
DMA1_DDONE0/IIC3_SDA/GPIO17/ O
M1SRCID0/LB_SRCID0/SDHC_WP

DMA2_DREQ0/IRQ03/GPIO21 I RCW[371:374] bit to select Tie high through a 2–10 kΩ

between DMA2 or other resistor to OVDD.
functions.
DMA2_DACK0/IRQ04/GPIO22 O If not used, configure it to be DMA
function and leave it floating.
DMA2_DDONE0/IRQ05/GPIO23 O

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18 Freescale Semiconductor
 PIC recommendations

8 PIC recommendations
Ensure pin is driven in the non asserted state, or use pull up.
Table 11. PIC pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

IRQ[0:2} I Ensure pin is driven in the non- Tie low through a 2–10 kΩ resistor to
asserted state, or use pull up. GND.

IRQ03/GPIO21/ I RCW[IRQ1] bit to select between Tie low through a 2–10 kΩ resistor to
DMA2_DREQ0 IRQ or other functions. GND.

IRQ04/GPIO22/ I
DMA2_DACK0

IRQ05/GPIO23/ I
DMA2_DDONE0

IRQ06/GPIO24/ I
USB1_DRVVBUS

IRQ07/GPIO25/ I
USB1_PWRFAULT

IRQ08/GPIO26/ I
USB2_DRVVBUS

IRQ09/GPIO27/ I
USB2_PWRFAULT

IRQ10/GPIO28/EVT7 I

IRQ11/GPIO29/EVT8 I

IRQ_OUT/EVT9 O Tie high through a 2–10 kΩ resistor to May be left unconnected.

OVDD.

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Freescale Semiconductor 19
IEEE 1588 recommendations

9 IEEE 1588 recommendations

Table 12. IEEE 1588 pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

TSEC_1588_CLK_IN/ I RCW[EC1] bit to select between Tie low to the inactive state
EC1_RXD2 1588 or other functions. through a 2–10 kΩ resistor to
GND.
TSEC_1588_TRIG_IN1/ I
EC1_RXD0

TSEC_1588_TRIG_IN2/ I
EC1_RXD1

TSEC_1588_ALARM_OUT1/ O If not used, configure it to be 1588

EC1_TXD0 function and leave it floating.
TSEC_1588_ALARM_OUT2/ O
EC1_TXD1/GPIO30

TSEC_1588_CLK_OUT/ O
EC1_RXD3

TSEC_1588_PULSE_OUT1/ O
EC1_TXD2

TSEC_1588_PULSE_OUT2/ O
EC1_TXD3/GPIO31

EC_XTRNL_TX_STMP1/ I Tie low to the inactive state

EC1_TX_EN through a 2–10 kΩ resistor to
GND.
EC_XTRNL_RX_STMP1/ I
EC1_RX_DV

EC_XTRNL_TX_STMP2/ I
EC1_GTX_CLK125

EC_XTRNL_RX_STMP2/ I
EC1_RX_CLK

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20 Freescale Semiconductor
 Ethernet management recommendations

10 Ethernet management recommendations

Table 13. Ethernet management pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

EMI1_MDC O — May be left unconnected.

EMI1_MDIO I/O Pull up through a 2–10 kΩ resistor to LVDD. Tie low through a 2–10 kΩ resistor to GND.

EMI2_MDC O The pin should be pulled up to 1.2 V through a May be left unconnected.
180 Ω ± 1% resistor for EMI2_MDC and a 330 Ω
± 1% resistor for EMI2_MDIO.

EMI2_MDIO I/O This pin should be pulled up to 1.2 V through a Tie low through a 2–10 kΩ resistor to GND.
180 Ω ± 1% resistor for EMI2_MDC and a 330 Ω
± 1% resistor for EMI2_MDIO.

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Freescale Semiconductor 21
 TSEC recommendations

11 TSEC recommendations
Table 14. TSEC pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

EC1_GTX_CLK125/EC_X I RCW[EC1] bit to select Tie low to the inactive state through a
TRNL_TX_STMP2 EC1_GTX_CLK125 for RGMII mode or 2–10 kΩ resistor to GND.
other functions.
EC1_TXD3/TSEC_1588_ O If not used, configure it to be RGMII
PULSE_OUT2/GPIO31 mode and leave it floating.

EC1_TXD2/TSEC_1588_ O May be left unconnected.

PULSE_OUT1

EC1_TXD1/TSEC_1588_ O If not used, configure it to be RGMII

ALARM_OUT2/GPIO30 mode and leave it floating.

EC1_TX_EN/EC_XTRNL_ O This pin requires an external 4.7 kΩ If not used, configure it to be RGMII
TX_STMP1 pull-down resistor to prevent the PHY mode and leave it floating.
from seeing a valid Transmit Enable
before it is actively driven (during reset).

TSEC1_GTX_CLK O — May be left unconnected.

EC1_RXD3/TSEC_1588_ I RCW[EC1] bit to select RGMII mode or Tie low to the inactive state through a
CLK_OUT other functions. 2–10 kΩ resistor to GND.

EC1_RXD2/TSEC_1588_ I
CLK_IN

EC1_RXD1/TSEC_1588_ I
TRIG_IN2

EC1_RXD0/TSEC_1588_ I
TRIG_IN1

EC1_RX_DV/EC_XTRNL_ I
RX_STMP1

EC1_RX_CLK/EC_XTRNL I
_RX_STMP2

EC2_GTX_CLK125 I This pin functions as EC2_GTX_CLK125 Tie low to the inactive state through a
for RGMII mode. 2–10 kΩ resistor to GND.

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22 Freescale Semiconductor
 TSEC recommendations

Table 14. TSEC pin termination checklist (continued)

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

TSEC2_TXD[0:3] O — May be left unconnected.

TSEC2_TX_EN O This pin requires an external 4.7 kΩ May be left unconnected.

pull-down resistor to prevent the PHY
from seeing a valid Transmit Enable
before it is actively driven (during reset).

TSEC2_GTX_CLK O — May be left unconnected.

TSEC2_RXD[0:3] I — Tie low to the inactive state through a

2–10 kΩ resistor to GND.
TSEC2_RX_DV I —

TSEC2_RX_CLK I —

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Freescale Semiconductor 23
 UART recommendations

12 UART recommendations
Table 15. UART pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

UART1_SOUT/GPIO8 O Functionally, this pin is an I/O, but may act May be left unconnected.
as an output only or an input only
UART2_SOUT/GPIO9 O depending on the pin mux configuration
defined by the RCW (Reset Configuration
Word).

UART1_SIN/GPIO10 I Functionally, this pin is an I/O, but may act Tie low through a 2–10 kΩ resistor to
as an output only or an input only GND.
UART2_SIN/GPIO11 I depending on the pin mux configuration
defined by the RCW (Reset Configuration
Word).

UART1_RTS/UART3_S O Functionally, this pin is an I/O, but may act May be left unconnected.
OUT/GPIO12 as an output only or an input only
depending on the pin mux configuration
UART2_RTS/UART4_S O defined by the RCW (Reset Configuration
OUT/GPIO13 Word).
UART1_CTS/UART3_S I Functionally, this pin is an I/O, but may act Tie high through a 2–10 kΩ resistor to
IN/GPIO14 as an output only or an input only OVDD.
depending on the pin mux configuration
UART2_CTS/UART4_S I defined by the RCW (Reset Configuration
IN/GPIO15 Word).

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24 Freescale Semiconductor
 I2C recommendations

13 I2C recommendations
Table 16. I2C pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

IIC1_SDA I/O Tie these open-drain signals high through a Tie high through a 2–10 kΩ
nominal 1 kΩ resistor to OVDD. Optimum pull-up resistor to OVDD.
IIC1_SCL I/O value depends on the capacitive loading of
IIC2_SDA I/O external devices and required operating speed.

IIC2_SCL I/O

IIC3_SCL/GPIO16/ I/O These are multiplexed with other functionalities. Tie high through a 2–10 kΩ
M1DVAL/LB_DVAL/ If configured for I2C function, tie these open-drain resistor to OVDD.
DMA1_DACK0/ signals high through a nominal 1 kΩ resistor to
SDHC_CD OVDD. Optimum pull-up value depends on the
capacitive loading of external devices and
IIC3_SDA/GPIO17/ I/O required operating speed.
M1SRCID0/
LB_SRCID0/
DMA1_DDONE0/
SDHC_WP

IIC4_SCL/EVT5/ I/O
M1SRCID1/
LB_SRCID1/GPIO18/
DMA1_DREQ0

IIC4_SDA/EVT6/ I/O
M1SRCID2/
LB_SRCID2/
GPIO19

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Freescale Semiconductor 25
 eSDHC recommendations

14 eSDHC recommendations
Table 17. eSDHC pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

SDHC_CMD I/O Tie high through a 2–10 kΩ resistor to Tie high through a 2–10 kΩ resistor to
OVDD. OVDD.

SDHC_DAT[0:3] I/O Tie high through a 2–10 kΩ resistor to OVDD. Tie high through a 2–10 kΩ resistor to
OVDD.
SDHC_DAT4/ O Tie high through a 2–10 kΩ resistor to OVDD. Tie high through a 2–10 kΩ resistor to
SPI_CS0/GPIO00 SDHC_DAT[4:7] require CVDD = 3.3 V when OVDD.
muxed extended SDHC data signals are
SDHC_DAT5/ O enabled via the RCW[SPI] field.
SPI_CS1/GPIO01
SDHC_DAT6/ O
SPI_CS2/GPIO02

SDHC_DAT7/ O
SPI_CS3/GPIO01

SDHC_WP/IIC3_SDA/ I If RCW field I2C = 0b0100 or 0b0101 (RCW It can be configured as GPIO output pin
GPIO17/M1SRCID0/ bits 354–357), the SDHC_WP and and leave no connect.
LB_SRCID0/ SDHC_CD input signals are enabled
DMA1_DDONE0 for external use. If SDHC_WP and SDHC_CD
are selected and not used, they must be
SDHC_CD/IIC3_SCL/ I externally pulled low such that
GPIO16/M1DVAL/ SDHC_WP = 0 (write enabled) and
LB_DVAL/ SDHC_CD = 0 (card detected). If RCW field
DMA1_DACK0 I2C != 0b100 or 0b101, thereby
selecting either I2C3 or GPIO functionality,
SDHC_WP and SDHC_CD are internally
driven such that SDHC_WP =
write enabled and SDHC_CD = card detected
and the selected I2C3 or GPIO external pin
functionality may be used.

SDHC_CLK O 33 Ω serial resistor must be provided for May be left unconnected.

SDHC_CLK and placed close to
P2041/P2040 device.

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26 Freescale Semiconductor
 eSPI recommendations

15 eSPI recommendations
Table 18. eSPI pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

SPI_MISO I/O — Tie high through a 2–10 kΩ resistor to

CVDD.

SPI_MOSI O — Tie high through a 2–10 kΩ resistor to

CVDD.

SPI_CS0/SDHC_DAT4/ O Functionally, this pin is an I/O, but may Tie high through a 2–10 kΩ resistor to
GPIO00 act as an output only or an input only CVDD.
depending on the pin mux
SPI_CS1/SDHC_DAT5/ O configuration defined
GPIO01 by the RCW.
SPI_CS2/SDHC_DAT6/ O
GPIO02

SPI_CS3/SDHC_DAT7/ O
GPIO03

SPI_CLK O — May be left unconnected.

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Freescale Semiconductor 27
USB recommendations

16 USB recommendations
Table 19. USB pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

USB1_UDP I/O — May be left unconnected.

USB1_UDM I/O — May be left unconnected.

USB1_VBUS_CLMP I A divider network is required on this Tie low through a 1 kΩ resistor to GND.
signal.
See Section 3.6.4.1, “USB Divider
Network,” in the chip hardware
specifications.

USB1_UID I — Tie low through a 1 kΩ resistor to GND.

USB1_DRVVBUS/ O — Tie low through a 1 kΩ resistor to GND.

GPIO24/IRQ6

USB1_PWRFAULT/ I/O — Tie low through a 1 kΩ resistor to GND.

GPIO25/IRQ7

USB1_IBIAS_REXT — This pin should be pulled low through May be left unconnected.
a 10 kΩ+/- 1% precision resistor to GND.

USB1_VDD_1P8_DE — A 1uF to 1.5 uF capacitor connected to May be left unconnected.

CAP GND is required on this signal. A list of
recommended capacitors are shown in
the hardware specification: Section
3.6.4.2, “USBn_VDD_1P8_DECAP
Capacitor Options."

USB2_UDP I/O — May be left unconnected.

USB2_UDM I/O — May be left unconnected.

USB2_VBUS_CLMP I A divider network is required on this Tie low through a 1 kΩ resistor to GND.
signal.
See Section 3.6.4.1, “USB Divider
Network,” in the chip hardware
specifications.
USB2_UID I — Tie low through a 1 kΩ resistor to GND.

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28 Freescale Semiconductor
 USB recommendations

Table 19. USB pin termination checklist (continued)

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

USB2_DRVVBUS/ O — Tie low through a 1 kΩ resistor to GND.

GPIO26/IRQ8

USB2_PWRFAULT/ I/O — Tie low through a 1 kΩ resistor to GND.

GPIO27/IRQ9

USB_CLKIN I — Tie low through a 1 kΩ resistor to GND.

USB2_IBIAS_REXT — This pin should be pulled low through May be left unconnected.
a 10 kΩ+/- 1% precision resistor to GND.

USB2_VDD_1P8_DE — A 1uF to 1.5 uF capacitor connected to May be left unconnected.

CAP GND is required on this signal. A list of
recommended capacitors are shown in
the hardware specification: Section
3.6.4.2, “USBn_VDD_1P8_DECAP
Capacitor Options."

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Freescale Semiconductor 29
GPIO recommendations

17 GPIO recommendations
Table 20. GPIO pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

GPIO00/SPI_CS0/ I/O General purpose I/O. Each signal can Pull high through a 2–10kΩ to OVDD or
SDHC_DATA4 be set individually to act as input or leave floating and configured as outputs
output, according to application. via the GPIO direction register (GPDIR).
GPIO01/SPI_CS1/ I/O Configure RCW to select GPIO
SDHC_DATA5 function.
GPIO02/SPI_CS2/ I/O
SDHC_DATA6

GPIO03/SPI_CS3/ I/O
SDHC_DATA7

GPIO08/UART1_SOUT I/O

GPIO09/UART2_SOUT I/O

GPIO10/UART1_SIN I/O

GPIO11/UART2_SIN I/O

GPIO12/UART1_RTS/ I/O
UART3_SOUT

GPIO13/UART2_RTS/ I/O
UART4_SOUT

GPIO14/UART1_CTS/ I/O
UART3_SIN

GPIO15/UART2_CTS/ I/O
UART4_SIN

GPIO16/IIC3_SCL/ I/O
M1DVAL/LB_DVAL/
DMA1_DACK0/SDHC_CD

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30 Freescale Semiconductor
 GPIO recommendations

Table 20. GPIO pin termination checklist (continued)

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

GPIO17/IIC3_SDA/ I/O General purpose I/O. Each signal can Pull high through a 2–10kΩ to OVDD or
M1SRCID0/LB_SRCID0/ be set individually to act as input or leave floating and configured as outputs
DMA1_DDONE0/ output, according to application. via the GPIO direction register (GPDIR).
SDHC_WP Configure RCW to select GPIO
function.
GPIO18/IIC4_SCL/EVT5/ I/O
M1SRCID1/LB_SRCID1/
DMA1_DREQ0
GPIO19/IIC4_SDA/EVT6/ I/O
M1SRCID2/LB_SRCID2

GPIO21/IRQ3/ I/O
DMA2_DREQ0
GPIO22/IRQ4/ I/O
DMA2_DACK0
GPIO23/IRQ5/ I/O
DMA2_DDONE0
GPIO24/IRQ6/ I/O
USB1_DRVVBUS

GPIO25/IRQ7/ I/O
USB1_PWRFAULT

GPIO26/IRQ8/ I/O
USB2_DRVVBUS

GPIO27/IRQ9/ I/O
USB2_PWRFAULT

GPIO28/IRQ10/EVT7 I/O

GPIO29/IRQ11/EVT8 I/O

GPIO30/EC1_TXD1/TSEC I/O This GPIO pin is on LVDD power plane, Pull high through a 2–10kΩ to OVDD or
_1588_ALARM_OUT2 not OVDD. leave floating and configured as outputs
via the GPIO direction register (GPDIR).
GPIO31/EC1_TXD3/TSEC I/O
_1588_PULSE_OUT2

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Freescale Semiconductor 31
DFT recommendations

18 DFT recommendations
Table 21. DFT pin termination checklist

Signal name Signal type Used Not used Remarks (for customer use) Completed

SCAN_MODE I For factory use only, this test pin requires a pull up with 100 Ω −1 kΩ το OVDD for
normal machine operation. See the chip hardware specification.

TEST_SEL I For factory use only, this test pin requires a pull down with 1 kΩ − 2 kΩ to GND for
normal machine operation. See the chip hardware specification.

19 Power management recommendations

Table 22. Power management termination checklist

Signal name Signal type Used Not used Remarks (for customer use) Completed

ASLEEP O System Ready.

Must NOT be pulled down during power-on reset.

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32 Freescale Semiconductor
 Trust recommendations

20 Trust recommendations
Table 23. Trust termination checklist

Signal name Signal type Used Not used Remarks (for customer use) Completed

TMP_DETECT I If a tamper sensor is used, it must maintain • Tie high to OVDD (high-power Trust
the signal at the specified voltage until a Architecture is not used).
tamper is detected. 1kΩ pull-down resistor • If no aspect of Trust Architecture is
strongly recommended. used, the following Trust Architecture
pins can be tied to GND:
– PO_VDD
– TMP_DETECT
– LP_TMP_DETECT

LP_TMP_DETECT I If a tamper sensor is used, it must maintain • Tie high to VDD_LP (low-power Trust
the signal at the specified voltage until a Architecture is not used).
tamper is detected. 1kΩ pull-down resistor • If no aspect of Trust Arch is used, the
strongly recommended. following Trust Architecture pins can
be tied to GND:
– PO_VDD
– TMP_DETECT
– LP_TMP_DETECT

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Freescale Semiconductor 33
Clock recommendations

21 Clock recommendations
Table 24. Clock pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

EC1_GTX_CLK125 I If any of the eTSECs are used in gigabit Pull low through a 2–10 kΩ resistor to
mode, connect it to a 125 MHz clock. GND.

EC2_GTX_CLK125 I If any of the eTSECs are used in gigabit Pull low through a 2–10 kΩ resistor to
mode, connect it to a 125 MHz clock. GND.

CLK_OUT O CLK_OUT is for monitoring purposes only, May be left unconnected. This output is
not for clocking other devices. actively driven during reset rather than
being three-stated during reset.

RTC I The default source of the time base is the Pull low through a 2–10 kΩ resistor to
CCB clock divided by eight. For more GND.
details, see the E500CORERM.

SYSCLK I Must always be connected to an input Must always be connected to an input

clock of 67–133 MHz. clock of 67–133 MHz.

22 System control recommendations

Table 25. System control pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

PORESET I It is required to be asserted per specification in relation to minimum assertion time

and during power-up/power-down. It is an input only pin and must be asserted to
sample power on configuration pins.

HRESET I/O Pull up high through a 2–10 kΩ resistor to OVDD. This pin is an open drain signal.

RESET_REQ O Must not be pulled down during power-on reset. If used, connect as needed plus pull
high to OVDD via 10kΩ pull-up.

CKSTP_OUT O Pull up high through a 2–10 kΩ resistor to OVDD. This pin is an open drain signal.

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34 Freescale Semiconductor
 Debug recommendations

23 Debug recommendations
Table 26. Debug pin termination checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

EVT0 I/O Debug Event. EVT[0:1] and EVT[4] are —

used as part of the Aurora Debug Interface.
EVT1 I/O Recommend a pull-up to OVDD be used.
EVT2 I/O

EVT3 I/O

EVT4 I/O

EVT5/IIC4_SCL/ I/O Debug Event. Configure RCW to select Leave floating and configured as outputs
M1SRCID1/ debug function. via the GPIO direction register (GPDIR).
LB_SRCID1/GPIO18/
DMA1_DREQ0

EVT6/IIC4_SDA/ I/O
M1SRCID2/
LB_SRCID2/
GPIO19

EVT7GPIO28/IRQ10 I/O Debug Event. Configure RCW to select —

debug function.
EVT8/GPIO29/IRQ11 I/O

EVT9/IRQ_OUT I/O Tie high through a 2–10 kΩ resistor to

OVDD.

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Freescale Semiconductor 35
 Debug recommendations

Table 26. Debug pin termination checklist (continued)

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

M1DVAL/LB_DVAL/ O — Leave floating and configured as outputs

IIC3_SCL/GPIO16/ via the GPIO direction register (GPDIR).
SDHC_CD/
DMA1_DACK0

MSRCID0/ O Functionally, this pin is an output, but

LB_SRCID0/ structurally it is an I/O because it either
IIC3_SDA/GPIO17/ samples configuration input during reset or
DMA_DDONE0/ it has other manufacturing test functions.
SDHC_WP This pin is therefore described as an I/O for
boundary scan.

MSRCID1/ O Configure RCW to select debug function.

LB_MSRCID1/ Pin must NOT be pulled down during
EVT5/IIC4_SCL/ power-on reset.
LB_SRCID1/GPIO18/
DMA1_DREQ0

MSRCID2/ O
LB_SRCID2/EVT6/
IIC4_SDA/
LB_SRCID2/GPIO19

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36 Freescale Semiconductor
 JTAG recommendations

24 JTAG recommendations
24.1 JTAG pin termination recommendations
Table 27. JTAG Pin Termination Checklist

Signal
Signal name Used Not used Remarks (for customer use) Completed
type

TCK I If COP is used, connect as needed and strap If COP is unused, tie TCK to OVDD through
to OVDD via a 10 kΩ pull up. a 10 kΩ resistor. This prevents TCK from
changing state and reading incorrect data
into the device.

TDI I This pin has a weak internal pull-up P-FET May be left unconnected.
that is always enabled. Connect to Pin3 of
the COP connector.

TDO O Connect to Pin1 of the COP connector. May be left unconnected.

TMS I This pin has a weak internal pull-up P-FET May be left unconnected.
that is always enabled. Connect to Pin9 of
the COP connector.

TRST I Connect as shown in Figure 2. TRST should be tied to HRESET through a

0-Ω resistor.

24.2 JTAG system-level recommendations

Table 28. JTAG system-level checklist

Item Remarks (for customer use) Completed

General

1. Configure the group of system control pins as shown in Figure 2.

Note: These pins must be maintained at a valid deasserted state under normal operating conditions, because most
have asynchronous behavior and spurious assertion gives unpredictable results.

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JTAG recommendations

Table 28. JTAG system-level checklist (continued)

Item Remarks (for customer use) Completed

2. The common on-chip processor (COP) function of these processors allows a remote computer system, typically a
PC with dedicated hardware and debugging software, to access and control the internal operations of the
processor. The COP interfaces primarily through the JTAG port of the processor, with some additional status
monitoring signals. The COP port requires the ability to independently assert HRESET or TRST to fully control the
processor. If the target system has independent reset sources, such as voltage monitors, watchdog timers, power
supply failures, or push-button switches, the COP reset signals must be merged into these signals with logic.

Boundary-scan testing

3. Ensure that TRST is asserted during power-on reset flow to ensure that the JTAG boundary logic does not interfere
with normal chip operation.
Note: While the JTAG state machine can be forced into the Test Logic Reset state using only the TCK and TMS signals,
systems generally assert TRST during the power-on reset flow. Simply tying TRST to HRESET is not practical because
the JTAG interface is also used for accessing the common on-chip processor (COP), which implements the debug
interface to the chip.

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38 Freescale Semiconductor
 JTAG recommendations

Table 28. JTAG system-level checklist (continued)

Item Remarks (for customer use) Completed

4. Follow the arrangement shown in Figure 2 to allow the COP port to assert HRESET or TRST independently while
ensuring that the target can drive HRESET as well.

5. The COP interface has a standard header, shown in the following figure, for connection to the target system, and is
based on the 0.025" square-post, 0.100" centered header assembly (often called a Berg header). The connector
typically has pin 14 removed as a connector key.
There is no standardized way to number the COP header, so emulator vendors have issued many different pin
numbering schemes. Some COP headers are numbered top-to-bottom then left-to-right, while others use
left-to-right then top-to-bottom. Still others number the pins counter-clockwise from pin 1 (as with an IC).
Regardless of the numbering scheme, the signal placement recommended in this figure is common to all known
emulators.

COP_TDO 1 2 NC

COP_TDI 3 4 COP_TRST

NC 5 6 COP_VDD_SENSE

COP_TCK 7 8 COP_CHKSTP_IN

COP_TMS 9 10 NC

COP_SRESET 11 12 NC

KEY
COP_HRESET 13 No pin

COP_CHKSTP_OUT 15 16 GND
Note: The COP header adds many benefits such as breakpoints, watchpoints, register and memory
examination/modification, and other standard debugger features. An inexpensive option can be to leave the COP
header unpopulated until needed.

Correct operation of the JTAG interface requires configuration of a group of system control pins as demonstrated in Figure 2. Care must be taken
to ensure that these pins are maintained at a valid deasserted state under normal operating conditions, as most have asynchronous behavior and
spurious assertion will give unpredictable results.

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JTAG recommendations

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40 Freescale Semiconductor
 JTAG recommendations

OVDD

7 10 kΩ HRESET 6
From Target HRESET
Board Sources
(if any) PORESET 10 kΩ PORESET1

COP_HRESET
13
COP_SRESET 10 kΩ
11
B A 10 kΩ

5 10 kΩ

10 kΩ
COP_TRST TRST1
1 2 4
COP_VDD_SENSE2 10 Ω
3 4 6
5 NC
5 6

COP_CHKSTP_OUT
COP Header

7 8 15 CKSTP_OUT
9 10
14 3 10 kΩ 10 kΩ
11 12

KEY
13 No pin COP_CHKSTP_IN
8 System logic
15 16 COP_TMS
9 TMS
COP Connector COP_TDO
1 TDO
Physical Pinout
COP_TDI
3 TDI
COP_TCK
7 TCK
2 NC
10 NC

12 4

16

Notes:
1. The COP port and target board must be able to independently assert PORESET and TRST to the processor
in order to fully control the processor as shown here.
2. Populate this with a 10 Ω resistor for short-circuit/current-limiting protection.
3. The KEY location (pin 14) is not physically present on the COP header.
4. Although pin 12 is defined as a No-Connect, some debug tools may use pin 12 as an additional GND pin for improved
signal integrity.
5.This switch is included as a precaution for BSDL testing. The switch must be closed to position A during BSDL testing
to avoid accidentally asserting the TRST line. If BSDL testing is not being performed, this switch must be closed
to position B.
6. Asserting HRESET causes a hard reset on the device.
7. This is an open-drain gate.

Figure 2. JTAG interface connection

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Freescale Semiconductor 41
 No connect recommendations

25 No connect recommendations
Table 29. No Connect Pin Termination Checklist

Signal name Signal type Used Not used Remarks (for customer use) Completed

RSVD — All RSVD pins must left unconnected (floating).

26 Thermal recommendations
26.1 Recommended thermal model
Information about Flotherm models of the package or thermal data not available in this document can be obtained from your local Freescale
sales office.

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 Thermal recommendations

26.2 Thermal system-level recommendations

Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow, and thermal interface material.
Table 30. Thermal system-level checklist

Item Remarks (for customer use) Completed

1. Use the recommended thermal model. Information about Flotherm models of the package or thermal data not
available in this document can be obtained from your local Freescale sales office.

2. Use this recommended board attachment method to the heat sink:

FC-PBGA Package (Small Lid)
Heat Sink

Heat Sink
Clip

Adhesive or
Thermal Interface Material Die Lid
Die

Printed-Circuit Board

3. Ensure the heat sink is attached to the printed-circuit board with the spring force centered over the package.

4. Ensure the spring force does not exceed 10 pounds force (45 Newtons).

5. A thermal interface material is required at the package-to-heat sink interface to minimize the thermal contact
resistance.

6. Ensure the method of mounting heat sinks on the package is by means of a spring clip attachment to the
printed-circuit board.

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Thermal recommendations

Table 30. Thermal system-level checklist (continued)

Item Remarks (for customer use) Completed

7. A thermal simulation is required to determine the performance in the application.4

Note:
1. The performance of thermal interface materials improves with increased contact pressure; the thermal interface vendor generally provides a performance characteristic
chart to guide improved performance.
2. The system board designer can choose among several types of commercially-available heat sinks to determine the appropriate one to place on the device. Ultimately, the
final selection of an appropriate heat sink depends on factors such as thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly,
and cost.
3. The system board designer can choose among several types of commercially-available thermal interface materials.
4. A Flotherm thermal model of the part is available.

26.3 Internal package conduction resistance

For the package, the intrinsic internal conduction thermal resistance paths are as follows:
• The die junction-to-case thermal resistance
• The die junction-to-lid-top thermal resistance
• The die junction-to-board thermal resistance

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44 Freescale Semiconductor
 Thermal recommendations

This figure depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
External Resistance Radiation Convection

Heat Sink Junction to case top

Junction to lid top Thermal Interface Material

Internal Resistance Die/Package

Die Junction
Package/Solder balls
Printed-Circuit Board

External Resistance Radiation Convection

(Note the internal versus external package resistance)

Figure 3. Package with heat sink mounted to a printed-circuit board

With this package, heat flow is both to the board and to the heat sink. A thermal simulation is required to
determine the performance in the application. A Flotherm thermal model of the part is available.

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Freescale Semiconductor 45
Revision history

27 Revision history
This table summarizes changes to this document.
Table 31. Document revision history

Rev.
Date Change
Number

0 04/2014 • Initial public release

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46 Freescale Semiconductor
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Document Number: AN4402

Rev. 0
04/2014