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Optoelectronic Detectors: Outline

The document outlines key concepts in optoelectronic detectors including: 1) Optical absorption and how the absorption coefficient determines how light interacts with materials based on their band gap. 2) Photoconductors which use light to increase conductivity without a junction, and their performance parameters, fabrication, and applications. 3) Diodes and their basic operation as photo detectors and solar cells. 4) Additional detector types like solar cells, photodiodes, photo transistors, and infrared detectors are also outlined.

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Shivam Tiwari
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0% found this document useful (0 votes)
208 views54 pages

Optoelectronic Detectors: Outline

The document outlines key concepts in optoelectronic detectors including: 1) Optical absorption and how the absorption coefficient determines how light interacts with materials based on their band gap. 2) Photoconductors which use light to increase conductivity without a junction, and their performance parameters, fabrication, and applications. 3) Diodes and their basic operation as photo detectors and solar cells. 4) Additional detector types like solar cells, photodiodes, photo transistors, and infrared detectors are also outlined.

Uploaded by

Shivam Tiwari
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 54

Outline

¾ Optical absorption
¾ Absorption coefficient
¾ Band gaps of semiconductor relative to optical spectrum

¾ Photoconductors
¾ Operation
¾ Performance parameters
¾ Fabrication
¾ Applications

¾ Diodes
¾ Basic ideas
¾ Behaviour as photo detector and solar cell

OPTOELECTRONIC DETECTORS 2
Outline … continued

¾ Solar cells
¾ Basic operation
¾ Efficiency parameters and ways to improve efficiency
¾ Calibration
¾ Fabrication
¾ Designs used
¾ Other factors

¾ Photo detectors
¾ General consideration
¾ P-N junction photodiode
¾ P-i-n photodiode
¾ Metal-semiconductor photodiode
¾ Hetero junction photodiode
¾ Avalanche photodiode

OPTOELECTRONIC DETECTORS 3
Outline … continued

¾ Photoconductors and photo detectors


¾ noise and bandwidth

¾ Infrared detectors
¾ Classification
¾ Application

¾ Photo transistors
¾ Basic working
¾ Structure

¾ Photo FETs
¾ Charge coupled devices
¾ Summary

OPTOELECTRONIC DETECTORS 4
Optical Absorption

Monochromator
„ Photons of a particular λ incident on a semi- I0
conductor
„ 2 cases : l It
„ hν ≥ Eg – electrons excited to CB - lose
energy to lattice – velocity reaches equilibrium It = I0 exp (-αl)
thermal velocity – all electrons near CB Assuming reflection is negligible
„ hν < Eg – unable to excite electron from VB to
CB
Typical plot of α vs λ
„ Hence the notion of cutoff wavelength (λc)

Beam of photons (hν > Eg) – some amount hν=Eg

α (cm-1)
„
absorbed …some amount transmitted
„ Assuming none of light is reflected
„ I(x) = I0 exp(-αx)
„ α : Absorption coefficient – cm-1
„ Hence α is a function of wavelength as well
as material used

OPTOELECTRONIC DETECTORS 5
Optical Absorption Absorption coefficient

„ 1/ α : effective absorption length


„ 1/ α : distance within which 63.2%of
incident light is absorbed
„ For e.g. 104 cm-1 corresponds to an
effective absorption length of 1μm

„ Indirect band gap semiconductors -


α at a given energy is generally low
for higher Eg materials (Ge, Si)
„ Direct band gap semiconductors
(GaAs) - α is higher even though
they have larger Eg compared to
indirect band gap semiconductor
„ For a given photon energy – a
thinner layer of GaAs is required –
compared to Si.

OPTOELECTRONIC DETECTORS 6
Optical Absorption Band gaps relative to optical spectrum

YELLOW

VIOLET
GREEN
RED

BLUE
INFRARED ULTRAVIOLET

GaAs GaP

InSb Ge Si CdSe CdS SiC ZnS

0 1 2 3 4 Eg(eV)

„ GaAs, Si, Ge, InSb – outside visible region – in infrared – hence absorbs band gap
light (1μm) and also in the visible spectrum
„ GaP, CdS – have band gaps wide enough to pass photons in visible range

OPTOELECTRONIC DETECTORS 7
Photo Conductors Basic operation

„ A slab of semiconductor – intrinsic or


extrinsic – no junction necessary
„ Shine with light hν > Eg
„ Transition of electrons - VB to CB
„ Increase in conductivity

„ Generation rate = G
‰ Δp = Gτp
‰ Δn = G τn
‰ Δσ = qG(τpμp+ τnμn)

„ Spectral response
‰ Photon energy < Eg – no absorption
‰ Photon energy >> Eg – creation of e- hole
pairs at surface – high probability of I
recombination
„ Cutoff wavelength λc (μm) = 1.24 / Eg(eV)

OPTOELECTRONIC DETECTORS 8
Photo Conductors Performance

„ Performance parameters SENSITIVITY

Log (Resistance)
‰ Sensitivity - how resistance varies with light
‰ Photoconductivity gain - number of charge
carriers passing b/w contact electrodes per
sec for each photon absorbed per sec
„ Gain = (ΔI)/(qGpair) = τ / ttr , τ : carrier
life time ; ttr : carrier transit time
‰ Response time of detector Log (Illumination)
„ Bulk photoconductor resistance –
SPEED OF RESPONSE

Bulk Photoconductor resistance


decrease with light
Fall time
„ Fall times longer – traps due to
imperfections Rise time

Light off Light on Time

OPTOELECTRONIC DETECTORS 9
Photo Conductors Other parameters

„ Spectral response - each photoconductive


material has spectral response …
depends on band gap of semi conductor
„ Temperature coefficient of resistance -
variation with temperature
„ Dark resistance - resistance under zero
illumination - gives idea of leakage current
- range 500k to 15M
„ Resistance tolerance – like normal
resistor … a particular resistance value + SPECTRAL RESPONSE
a tolerance

OPTOELECTRONIC DETECTORS 10
Photo Conductors Fabrication

„ Given photoconductive material – at


certain illumination – has certain
resistivity
„ RH=ρH(w/l) , w , l : width and length of
electrode gap , w/l – can be varied,
RH : resistance per sheet thickness

„ Start with an insulating substrate –


ceramic
„ Deposition of semi-conductor layer
‰ Vapour deposition
‰ Sintering photoconductive material
‰ Metal-contacts evaporated on
surface

OPTOELECTRONIC DETECTORS 11
Photo Conductors Fabrication

„ Thin films – high resistance


„ Space b/w contacts is narrow
„ Inter digitated pattern - more photo
conductivity gain
‰ Low resistance – under light
conditions
‰ Greater area exposed

„ Contact resistance must be minimized


„ Made as an ohmic contact

„ Materials used :
‰ Cadmium Sulphide, Lead Sulphide
‰ Germanium, Silicon and Gallium
Arsenide

OPTOELECTRONIC DETECTORS 12
Photo Conductors Advantages & disadvantages, applications

„ Advantages
‰ High sensitivity
LIGHT SENSOR CIRCUIT
‰ Low cost
‰ No junction potential

„ Disadvantages
‰ Narrow spectral response
‰ Light-history effects
‰ Slower response times

„ Applications
‰ Light meters
‰ Street light automatic switch on-off
‰ Burglar alarms
‰ Obstacle detection

OPTOELECTRONIC DETECTORS 13
Diodes p-n junction diode - basics

„ p-type semiconductor and n-type


semiconductor
„ Allows current readily in FB but not in RB
„ p-n junction is formed
‰ Electrons diffusion from n to p
‰ Leaves behind +ve charge on n-side and
–ve on p-side
„ Formation of depletion region
„ Presence of in built electric field

OPTOELECTRONIC DETECTORS 14
Diodes p-n junction diode – band diagram

„ Band diagram of p-n junction diode


under zero bias
„ Alignment of Fermi-levels – absence of
current
„ Results in bending of bands at junction
„ Presence of barrier potential ... electric
field at the junction

„ Illumination under light – energy > Eg



„ Electron hole pairs – both p and n
„ Contribution to current – generation in
depletion region

„ Current opposite to normal FB diode hν

Electron diffusion Drift space Hole diffusion

OPTOELECTRONIC DETECTORS 15
Diodes p-n junction diode – I-V characteristics

I
Dark
„ Modification of diode equation and
diode characteristics
„ I = I0 [exp(V/VT)-1] – IL
„ VOC ~ VT ln (IL / Io)
„ Characteristics – 1st , 3rd and 4th
quadrant
„ Third quadrant – photo detector V
„ Fourth quadrant – solar cell
Photo detector Solar cell

With illumination

OPTOELECTRONIC DETECTORS 16
Solar Cells Basic operation

„ Conversion of solar energy to electrical


energy
„ Operated in the 4th quadrant I-V
characteristics
„ Operated in unbiased mode

„ Characteristics
‰ Spectral response – correspond to
solar spectrum – 500nm peak
‰ High conversion efficiency Solar cell – monocrystalline Si
wafer

OPTOELECTRONIC DETECTORS 17
Solar Cells Efficiency factors

„ Maximum power point


‰ Shown by the maximum power
rectangle
I Maximum power
rectangle
„ Energy conversion efficiency ISC
‰ % of power converted when solar Im
cell is connected to electric circuit
‰ η = Pm / (E X Ac) , E : irradiance ,
Ac : area of the solar cell

„ Fill factor
‰ Ratio of maximum power point to Vm VOC
VOCISC
V
‰ FF = Pmax / (VOC X ISC)

OPTOELECTRONIC DETECTORS 18
Solar Cells Efficiency – factors and improvement techniques

„ Large device – greater amount of optical energy is absorbed


„ Top layer is kept thin – so most light reaches base – surface absorption causes
recombination – no useful current produced
„ Requirement is diffusion lengths must be large
„ Base is made larger – n+p structures are preferred – p region – Dn is larger than for
holes
„ η = FF VOCIL / Pin - Hence we require high VOC, ISC and FF
„ Need to increase IL – heavy doping of back of cell – n+pp+ structure – potential barrier
at back pp+ junction - reduction of recombination at back surface
„ Dependence of material – as Eg increases – IO decreases – VOC increases – but with
Eg increase - hν maybe < Eg - therefore optimum efficiency depending on the
material
„ GaAs is used for space applications – Si used for terrestrial applications

OPTOELECTRONIC DETECTORS 19
Solar Cells Efficiency – factors and improvement techniques

„ Use of anti-reflective coatings – SiO2 , TiO2 , Ta2O5


„ Use of surface texturing - chemical etch ants - advantages
‰ Multiple reflections reduce light reflected back
‰ The light gets refracted as it enters and travels obliquely through the cell causing
its absorption closer to the junction
„ Use of finger contacts to reduce series resistance
„ Use of solar concentrators – using mirrors
„ Use of tracking systems to track position of the sun

OPTOELECTRONIC DETECTORS 20
Solar Cells Calibration

„ AIR MASS : measure of how far light travels through the Earth's atmosphere
„ Outer edge of Earth’s atmosphere receives around 135 mW /cm2
„ Light reaching Earth’s surface – depends on the thickness of the atmosphere
„ Air Mass 1 (AM1) : the radiation reaching sea level at high noon in a clear sky is 92.5
mW/cm2
„ Air Mass 0 (AM0) : the radiation in outer space = 135mW/cm2 (outside earth’s
atmosphere)

„ Solar cells are calibrated as AM0 or AM1 illumination


„ AM0 : Solar cells in outer space
„ AM1 : Solar cells used for terrestrial applications

OPTOELECTRONIC DETECTORS 21
Solar Cells Fabrication – simple structure

„ Start with a p-substrate


„ p-n junction formed by diffusion or ion
implantation – small n-region
„ Metal contact “fingers” on the surface
„ Metal base contact at the other end

„ Large area
„ Match of Ln , p region thickness and
mean optical penetration depth
„ Must have low series resistance
„ Compromise b/w large contact
potential and longer lifetimes

OPTOELECTRONIC DETECTORS 22
Solar Cells General designs used

„ Homo junction device - e.g crystalline Si


‰ Single material is used
‰ Depth of p-n junction, dopants and purity
of material used can be varied
„ Hetero junction device – e.g CdS , CuInSe2
‰ Top window layer – high Eg
‰ Bottom layer with low Eg
„ p-i-n and n-i-p devices – e.g. am Si and CdTe
‰ 3-layer sandwich – middle i-layer
‰ Electric field stretching across intrinsic
region
„ Multi-junction devices
‰ Cascade or tandem cell – individual cells
with different Band Gaps stacked together

OPTOELECTRONIC DETECTORS 23
Solar Cells General designs used

„ Multi-junction cell – 2 ways

‰ Mechanical stack approach


„ Independent solar cells
„ Different band gaps
„ Mechanical stacking one on top
of other

‰ Monolithic approach
„ Fabrication of one full solar cell
„ Growing other cell on these

OPTOELECTRONIC DETECTORS 24
Solar Cells How power is produced

OPTOELECTRONIC DETECTORS 25
Solar Cells Other factors

„ Modification of diode equation


‰ I = I0 [exp(V/VT)-1] – IL

Relative response
‰ VOC=Vmax=VT * ln(IL/IS + 1)
‰ ISC = IL
‰ η = (ILkV2mp)/((1+kVmp)APin) * (1 + IL/ IS)
; k=1/VT

„ Spectral response
‰ Variation of short circuit current with
wavelength of incident light
‰ Short wavelength response – junction
close to surface ( 1/α small)
‰ Long wavelength response – junction
must be deep comparatively Wavelength of incident light

OPTOELECTRONIC DETECTORS 26
Solar Cells Other factors

„ Recombination current and series


resistance
‰ Recombination within depletion region
‰ Defects in solar cell
‰ Modification of diode equation

Current
‰ I = I0 [exp(V/nVT)-1] – IL
‰ Modification of diode characteristics –
series resistance (mainly) , shunt Rs=5ohm
resistance
Rsh=inf
„ RS – jn depth, impurity concentration,
arrangement of ohmic contacts Rs=0
Rsh=100ohm
„ Radiation effect
‰ High energy particle radiation Rs=0
‰ Production of defects in semi- Rsh=inf
conductors
‰ Reduction in solar power output
Voltage

OPTOELECTRONIC DETECTORS 27
Photo Detectors General consideration

„ Reverse biased semiconductor diodes


„ Includes p-i-n diode, the p-n junction diode, metal-semiconductor diode,
hetero junction, avalanche photodiode

„ Wavelength response, modulation-frequency response, available power, SNR


„ Wavelength response – absorption coefficient = function of Wavelength … small
for longer wavelength and vice versa
„ Modulation frequency response
‰ Diffusion of carriers – for carriers generated outside depletion region
‰ Drift time in depletion region
‰ Capacitance of depletion region compromise b/w the two
„ Available power – depends on quantum efficiency, area, incident photon flux
„ SNR – signal to noise ratio

OPTOELECTRONIC DETECTORS 28
Photo Detectors General consideration

„ Quantum efficiency η = number of useful electron hole pairs generated per incident
photon – useful EHPs – which do not recombine and contribute to current
„ η = (IL/q)/(Poptical / hν) ~ exp(-αWP) – exp {-α(W+LP)}
„ Hence WP must be small and W large – but large W ⇒ large transit time

„ Responsivity – ratio of photocurrent to the incident optical power (A/W)


„ R = IL/Poptical = ηq/(hν)

„ Dark Current – photocurrent with no optical signal – current due to background


radiation and saturation current – contributes to noise

„ Noise equivalent power (NEP) - minimum input optical power to generate


photocurrent equal to the rms noise current in a 1 Hz bandwidth
„ Detectivity D = 1/NEP

OPTOELECTRONIC DETECTORS 29
Photo Detectors p-n junction photodiode


„ Absorption takes place – n/p region or P
depletion region
„ Production of electron hole pairs
„ Separation of the electron hole pairs by
N
electric field
„ Depletion region width increased –
reverse bias

„ Alternative approach – using graded p-n
P
junction
„ Presence of in-built electric field

OPTOELECTRONIC DETECTORS 30
Photo Detectors p-n junction photodiode - structure

„ Similar to a p-n junction diode

„ Generally thin p+ layer – unlike solar


cells – formed by Boron diffusion –
1um

„ Response must be fast – compromise


b/w sensitivity and speed of response
– vary p, n and n+ layer

„ Materials used
‰ Silicon
‰ Germanium

OPTOELECTRONIC DETECTORS 31
Photo Detectors p-i-n photodiode

„ Most common depletion layer photo


detector
„ Principle of operation – same as p-n
junction photodiode
„ Depletion layer thickness – tailored for
sensitivity and response
„ Intrinsic region – low doping , high
carrier lifetime… most of carriers
collected
„ Large width depletion region – low
capacitance
„ High bandwidths

„ Modes of operation
‰ Current mode – constant RB
‰ Voltage mode – no external bias

OPTOELECTRONIC DETECTORS 32
Photo Detectors p-i-n photodiode structure

„ Two ways – planar and mesa structure


„ Planar
‰ n substrate
‰ Epitaxial growth of intrinsic region
ever the n-type substrate – 10 to
200 microns
‰ P+ diffusion or ion implantation
„ Mesa
‰ Layers grown on substrate –
dopants incorporated
hν P+

N+

OPTOELECTRONIC DETECTORS 33
Photo Detectors Metal semiconductor photodiode

„ Metal semiconductor junction Metal Semi conductor

„ Operation in various modes qφBn


A. Eg > hν > qφBn ; V << VB – photo EC
excited electrons in metal … EF
cross barrier to semi-conductor
B. Eg < hν ; V << VB – hole-electron
pairs in semi-conductor…similar
to p-i-n photodiode Ev
C. Eg < hν ; V ~ VB – can be
operated as avalanche
photodiode – when guard bands
are used

„ Can be used as UV detector also



CASE A CASE B CASE C

OPTOELECTRONIC DETECTORS 34
Photo Detectors Metal semiconductor photodiode structure

Thin metal film Incident wave

„ n-layer substrate Anti-reflection Contact dot


„ Deposition of thin metal film coating
„ Absorption losses must be minimum
„ Usage of anti-reflective coatings
„ Inter digitated design minimizes
parasitic resistances.
n layer

„ As for p-i-n diode, the MSM speed is


determined by the transit time, and
depletion region width
„ MSMs have bandwidths up to 350
GHz

OPTOELECTRONIC DETECTORS 35
Photo Detectors Heterojunction photo diode

„ Multi layers of compound hν


semiconductors n-GaAs p-Ge
„ Band gap – varied to match incident
wavelength
„ Quantum efficiency is higher
„ Usage of window (high band gap
material)
„ Frequency response depends on
relative absorption
„ Barrier can be penetrated – tunneling
or by high energy
V

OPTOELECTRONIC DETECTORS 36
Photo Detectors Heterojunction photo diode structure

„ Contains semiconductor – semi


conductor junction
„ In0.53Ga0.47As/InP – widely used
hetero structure
„ Lattice matched
„ InP used as window
„ In0.53Ga0.47As – absorbing layer
„ Eg of In0.53Ga0.47As is 0.73eV
„ Can be used up to 1.7μm – can be
used from 1.3-1.55 μm

OPTOELECTRONIC DETECTORS 37
Photo Detectors P-i-n Heterojunction diode structure

n contact InGaAs Air bridge


active layer

Polyimide passivation

Semi-insulating InP

Optical fibre

OPTOELECTRONIC DETECTORS 38
Photo Detectors Avalanche photodiode

„ Operated at high reverse bias – under


breakdown conditions
„ Internal current gain – avalanche
effect
„ Photo multiplication factor
‰ Mph = Iph/Ipho =1/(1-(V/VB)n)

„ Increase in photocurrent and


responsivity of detector

„ Low level optical signals detection –


photodiode operated in avalanche
mode – current gain – Si APD can
have high sensitivity and response
time of 1ns – used mainly in Optical
communication

OPTOELECTRONIC DETECTORS 39
Photo Detectors Avalanche photodiode structure

Aluminium
SiO2
n+
„ Useful current gain – elimination of
micro plasmas (small areas in which
breakdown voltage is less than that of
junction)
„ Usage of guard ring – lower impurity P - type
gradient , large radius of curvature
„ Must have uniform doping Planar Type
concentration
SiO2
n+ Au contact ring

n(Sb) n(Sb)

P - type

Mesa Type

OPTOELECTRONIC DETECTORS 40
Photo Conductors & Detectors Noise and bandwidth

„ Main two parameters – Sensitivity and response time – compromise b/w the two is
required
„ Gain-bandwidth product is also important
„ Signal to noise ratio

„ Photoconductor
‰ Source of noise – random fluctuations in dark current – noise current increases
with current and conductivity
‰ Photoconductor noise - reduced by increasing dark resistance
‰ Dark resistance inversely proportional to bandwidth

„ Pin-diode
‰ There is no gain mechanism – one photon gives at most one electron-hole pair
‰ Gain-bandwidth product – determined by bandwidth or frequency response
‰ Response time depends – width of depletion region
‰ Noise – thermal generation of EHPs – shot noise – lower than in photoconductor

OPTOELECTRONIC DETECTORS 41
Photo Conductors & Detectors Noise and bandwidth

„ Avalanche photo diodes


‰ Provide gain – avalanche multiplication effect
‰ Increased noise relative to p-i-n – due to random fluctuations
‰ Noise – can be reduced – impact ionization is due to only due to one type of
carrier – more carriers more fluctuations
‰ Si – ability for electrons – impact ionization is higher than for holes
‰ Si photodiodes – high gain and low noise
‰ Si APDs – cannot be used for optical fiber communication – Si transparent at low
loss wavelength
‰ In0.53Ga0.47As – longer wavelengths – but has more noise
‰ Use of Si-InGaAs APD – fusion of InGaAs (absorbing layer) – photo generated
electrons injected into Si – causing impact ionization at low noise
‰ Another approach is APD structure in resonant cavity

OPTOELECTRONIC DETECTORS 42
Infrared Detectors Introduction

„ Electromagnetic waves in region


0.75μm (1.65eV) to 1000 μm(1.2meV).
„ All objects with temperature > 0K emit
infrared radiation.
„ At room temperature 300K – all
radiation is in infrared region
„ Shifts towards UV – as temperature
increases

„ Difference from other photo detectors


‰ Use of cooling equipment
‰ Atmospheric absorption and
background problems

OPTOELECTRONIC DETECTORS 43
Infrared Detectors Classification

„ Infrared detectors can be divided into two types


‰ Thermal detectors – thermistors and thermocouples – respond to heating
produced by absorption of radiation
‰ Quantum detectors – similar to photodiodes discussed previously

„ Quantum type detectors feature high detectivity and fast response speed.
„ Responsivity is wavelength dependent
„ Quantum type detectors classified - intrinsic types and extrinsic types

„ Intrinsic type detectors


‰ Have detection wavelength limits determined by their inherent energy gap
‰ Responsivity drops drastically when the wavelength limit is exceeded
‰ HgCdTe or PbSnTe - wavelength of peak responsivity - changed by controlling
the composition of the ternary mixture
‰ HgCdTe detectors - 3 to 5 µm and 7 to 13 µm ranges
‰ Si, Ge can also be used

„ Extrinsic type detectors


‰ Wavelength limits determined by the level of impurities doped in high
concentrations to the Ge or Si semiconductors
‰ Operating temperatures - must be cooled liquid helium temperature

OPTOELECTRONIC DETECTORS 44
Infrared Detectors Applications

„ Others photodiodes - InGaAs, Ge , PbS, PbSe,


InAs, PtSi, InSb InSb, MCT- HgCdTe, MZT-
HgZnTe

„ Applications
‰ Infrared spectroscopy
‰ Weather observation
‰ Automatic shutdown of industrial boiler
‰ Even as sensors in robotics

OPTOELECTRONIC DETECTORS 45
Photo Transistors Basic operation

„ Detect light and provide gain


(amplification)
„ Incident photon generates electron
hole pairs in reverse bias CB junction
„ Induced holes drawn to base and
electrons to collector
„ Normal transistor operation takes
place
„ Ic = βIbdark + Iceodark + ILe(1+β) ,
ILe : current of photo generated
electrons

„ Collector to emitter radiation sensitivity


(SRCEO) = o/p collector current per unit
of incident irradiance with base open
„ Ic = SRCEP Heff

OPTOELECTRONIC DETECTORS 46
Photo Transistors Structure

„ Similar to a normal transistor


„ But larger base and collector areas
„ Top surface exposed
„ Use of window or lens
„ Fabrication using epitaxial growth –
matching lattices

„ Optical switches
„ Light sensors

Fabrication of normal transistor

OPTOELECTRONIC DETECTORS 47
Photo FETs Operation

„ Provides combination of
photosensitive p-n junction with high
impedance
ID

„ Photon enter gate area – electrons
from VB to CB IG D
„ Small signal analysis – gives small
G
signal gain S
„ ΔVDS = ΔIGRGgfsRD

OPTOELECTRONIC DETECTORS 48
Charge Coupled Devices Basic operation

„ IC chip – array of MOS capacitors


„ Accumulation of charge
„ Read value after fixed time
„ Sensitive to low light levels
„ Similar to bucket brigade device
„ The depletion layer – potential well

„ When light strikes – electron hole pair


„ Electron remains in the potential well
„ Array read - transferring the charge
from one MOS capacitor to its
neighbor on one side – like shift
register

OPTOELECTRONIC DETECTORS 49
Charge Coupled Devices Fabrication

„ Photoactive region - epitaxial layer of


silicon
„ Doping of p+ (Boron) – diffusion
„ Buried channels by phosphorous ion
implantation
„ Growth of silicon dioxide, followed by
poly gate – use of photolithography
„ Two poly-silicon MOS transistors

„ Silicon dioxide grown, followed by


polygate
„ Photolithography and formation of 3
poly gates
„ Similarly an array is formed

OPTOELECTRONIC DETECTORS 50
Charge Coupled Devices Applications

„ Digital still and video cameras


„ Astronomical telescopes, scanners,
and bar code readers
„ Vision for robots
„ Optical character recognition (OCR)
CCD for UV imaging
„ Processing of satellite photographs

„ Color Cameras – 3CCD

CCD from a fax machine

OPTOELECTRONIC DETECTORS 51
Summary

„ Optical absorption
‰ α : Coefficient of absorption – 1/α mean absorption length

„ Photoconductors
‰ Conductivity increased by shining light
‰ Sensitivity and speed of response – main parameters

„ Diodes
‰ Generation of electron-hole pairs in depletion region
‰ Presence of electric field helps detect light
‰ Can be operated in photo detector or photovoltaic mode

„ Solar cells
‰ Photovoltaic mode of operation
‰ Generation of current – solar to electrical energy
‰ Operation in maximum power rectangle
‰ Designs – to trap maximum light

OPTOELECTRONIC DETECTORS 52
Summary

„ Photo detectors
‰ Used in optical fibre communication
‰ p-n junction diode, p-i-n diode
‰ Avalanche photo diode with internal current gain

„ Infrared detectors
‰ Cooling problems and background radiations
‰ Quantum type detectors – intrinsic and extrinsic

„ Phototransistors
‰ Detection of light and provide current gain

„ Charge coupled devices


‰ Potential well in MOS – stores charge
‰ Like bucket brigade device
‰ Light sensor in digital cameras
‰ 3CCD used as RGB

OPTOELECTRONIC DETECTORS 53
Books referred

„ Semiconductor Devices – Nandita Dasgupta and Amitava Dasgupta


„ Integrated Circuits and Semiconductor Devices – Deboo/Burrous
„ Solid State Electronic Devices – B.G. Streetman
„ Physics of Semiconductor Devices – Sze
„ The World of Information - INTERNET

OPTOELECTRONIC DETECTORS 54
OPTOELECTRONIC DETECTORS 55

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