Outline
¾   Optical absorption
      ¾  Absorption coefficient
      ¾  Band gaps of semiconductor relative to optical spectrum
  ¾   Photoconductors
      ¾  Operation
      ¾  Performance parameters
      ¾  Fabrication
      ¾  Applications
  ¾   Diodes
      ¾  Basic ideas
      ¾  Behaviour as photo detector and solar cell
           OPTOELECTRONIC DETECTORS                                2
Outline … continued
  ¾   Solar cells
      ¾  Basic operation
      ¾  Efficiency parameters and ways to improve efficiency
      ¾  Calibration
      ¾  Fabrication
      ¾  Designs used
      ¾  Other factors
  ¾   Photo detectors
      ¾  General consideration
      ¾  P-N junction photodiode
      ¾  P-i-n photodiode
      ¾  Metal-semiconductor photodiode
      ¾  Hetero junction photodiode
      ¾  Avalanche photodiode
           OPTOELECTRONIC DETECTORS                             3
Outline … continued
  ¾   Photoconductors and photo detectors
      ¾  noise and bandwidth
  ¾   Infrared detectors
      ¾   Classification
      ¾   Application
  ¾   Photo transistors
      ¾  Basic working
      ¾  Structure
  ¾   Photo FETs
  ¾   Charge coupled devices
  ¾   Summary
           OPTOELECTRONIC DETECTORS         4
Optical Absorption
                                                                 Monochromator
     Photons of a particular λ incident on a semi-                         I0
      conductor
     2 cases :                                                                         l              It
         hν ≥ Eg – electrons excited to CB - lose
          energy to lattice – velocity reaches equilibrium                       It = I0 exp (-αl)
          thermal velocity – all electrons near CB                      Assuming reflection is negligible
         hν < Eg – unable to excite electron from VB to
          CB
                                                                        Typical plot of α vs λ
         Hence the notion of cutoff wavelength (λc)
      Beam of photons (hν > Eg) – some amount                               hν=Eg
                                                             α (cm-1)
  
      absorbed …some amount transmitted
     Assuming none of light is reflected
     I(x) = I0 exp(-αx)
     α : Absorption coefficient – cm-1
     Hence α is a function of wavelength as well
      as material used
                                                                                            hν
            OPTOELECTRONIC DETECTORS                                                                    5
Optical Absorption                          Absorption coefficient
    1/ α : effective absorption length
    1/ α : distance within which 63.2%of
     incident light is absorbed
    For e.g. 104 cm-1 corresponds to an
     effective absorption length of 1μm
    Indirect band gap semiconductors -
     α at a given energy is generally low
     for higher Eg materials (Ge, Si)
    Direct band gap semiconductors
     (GaAs) - α is higher even though
     they have larger Eg compared to
     indirect band gap semiconductor
    For a given photon energy – a
     thinner layer of GaAs is required –
     compared to Si.
             OPTOELECTRONIC DETECTORS                                6
Optical Absorption                          Band gaps relative to optical spectrum
                                            YELLOW
                                                                      VIOLET
                                                     GREEN
                                   RED
                                                             BLUE
       INFRARED                                                                ULTRAVIOLET
                          GaAs          GaP
InSb       Ge        Si          CdSe                CdS            SiC        ZnS
0                1                      2                                 3          4   Eg(eV)
   GaAs, Si, Ge, InSb – outside visible region – in infrared – hence absorbs band gap
    light (1μm) and also in the visible spectrum
   GaP, CdS – have band gaps wide enough to pass photons in visible range
             OPTOELECTRONIC DETECTORS                                                             7
Photo Conductors                                   Basic operation
   A slab of semiconductor – intrinsic or
    extrinsic – no junction necessary
   Shine with light hν > Eg
   Transition of electrons - VB to CB
   Increase in conductivity
   Generation rate = G
     Δp = Gτp
     Δn = G τn
     Δσ = qG(τpμp+ τnμn)
   Spectral response
      Photon energy < Eg – no absorption
      Photon energy >> Eg – creation of e- hole
       pairs at surface – high probability of                  I
       recombination
   Cutoff wavelength λc (μm) = 1.24 / Eg(eV)
              OPTOELECTRONIC DETECTORS                               8
Photo Conductors                                     Performance
   Performance parameters                                                                             SENSITIVITY
                                                          Log (Resistance)
      Sensitivity - how resistance varies with light
      Photoconductivity gain - number of charge
       carriers passing b/w contact electrodes per
       sec for each photon absorbed per sec
          Gain = (ΔI)/(qGpair) = τ / ttr , τ : carrier
           life time ; ttr : carrier transit time
      Response time of detector                                                                         Log (Illumination)
          Bulk photoconductor resistance –
                                                                                                 SPEED OF RESPONSE
                                                          Bulk Photoconductor resistance
           decrease with light
                                                                                             Fall time
          Fall times longer – traps due to
           imperfections                                                                                           Rise time
                                                                                           Light off           Light on Time
              OPTOELECTRONIC DETECTORS                                                                                   9
Photo Conductors                                   Other parameters
   Spectral response - each photoconductive
    material has spectral response …
    depends on band gap of semi conductor
   Temperature coefficient of resistance -
    variation with temperature
   Dark resistance - resistance under zero
    illumination - gives idea of leakage current
    - range 500k to 15M
   Resistance tolerance – like normal
    resistor … a particular resistance value +               SPECTRAL RESPONSE
    a tolerance
              OPTOELECTRONIC DETECTORS                                           10
Photo Conductors                               Fabrication
   Given photoconductive material – at
    certain illumination – has certain
    resistivity
   RH=ρH(w/l) , w , l : width and length of
    electrode gap , w/l – can be varied,
    RH : resistance per sheet thickness
   Start with an insulating substrate –
    ceramic
   Deposition of semi-conductor layer
      Vapour deposition
      Sintering photoconductive material
      Metal-contacts evaporated on
       surface
              OPTOELECTRONIC DETECTORS                       11
Photo Conductors                           Fabrication
   Thin films – high resistance
   Space b/w contacts is narrow
   Inter digitated pattern - more photo
    conductivity gain
       Low resistance – under light
        conditions
       Greater area exposed
   Contact resistance must be minimized
   Made as an ohmic contact
   Materials used :
      Cadmium Sulphide, Lead Sulphide
      Germanium, Silicon and Gallium
       Arsenide
              OPTOELECTRONIC DETECTORS                   12
Photo Conductors                      Advantages & disadvantages, applications
   Advantages
       High sensitivity
                                                    LIGHT SENSOR CIRCUIT
       Low cost
       No junction potential
   Disadvantages
       Narrow spectral response
       Light-history effects
       Slower response times
   Applications
      Light meters
      Street light automatic switch on-off
      Burglar alarms
      Obstacle detection
              OPTOELECTRONIC DETECTORS                                      13
Diodes                                 p-n junction diode - basics
   p-type semiconductor and n-type
    semiconductor
   Allows current readily in FB but not in RB
   p-n junction is formed
       Electrons diffusion from n to p
       Leaves behind +ve charge on n-side and
        –ve on p-side
   Formation of depletion region
   Presence of in built electric field
             OPTOELECTRONIC DETECTORS                                14
Diodes                                p-n junction diode – band diagram
   Band diagram of p-n junction diode
    under zero bias
   Alignment of Fermi-levels – absence of
    current
   Results in bending of bands at junction
   Presence of barrier potential ... electric
    field at the junction
   Illumination under light – energy > Eg
                                                 hν
   Electron hole pairs – both p and n
   Contribution to current – generation in
    depletion region
                                                                      hν
   Current opposite to normal FB diode                                              hν
                                                 Electron diffusion    Drift space        Hole diffusion
              OPTOELECTRONIC DETECTORS                                                            15
Diodes                            p-n junction diode – I-V characteristics
                                                             I
                                                                 Dark
   Modification of diode equation and
    diode characteristics
   I = I0 [exp(V/VT)-1] – IL
   VOC ~ VT ln (IL / Io)
   Characteristics – 1st , 3rd and 4th
    quadrant
   Third quadrant – photo detector                                                   V
   Fourth quadrant – solar cell
                                            Photo detector       Solar cell
                                                                  With illumination
              OPTOELECTRONIC DETECTORS                                          16
Solar Cells                                    Basic operation
   Conversion of solar energy to electrical
    energy
   Operated in the 4th quadrant I-V
    characteristics
   Operated in unbiased mode
   Characteristics
      Spectral response – correspond to
       solar spectrum – 500nm peak
      High conversion efficiency                 Solar cell – monocrystalline Si
                                                  wafer
              OPTOELECTRONIC DETECTORS                                              17
Solar Cells                                    Efficiency factors
   Maximum power point
     Shown by the maximum power
      rectangle
                                                  I                 Maximum power
                                                                    rectangle
   Energy conversion efficiency                  ISC
      % of power converted when solar            Im
       cell is connected to electric circuit
      η = Pm / (E X Ac) , E : irradiance ,
       Ac : area of the solar cell
   Fill factor
        Ratio of maximum power point to                              Vm VOC
         VOCISC
                                                                               V
        FF = Pmax / (VOC X ISC)
              OPTOELECTRONIC DETECTORS                                              18
Solar Cells                  Efficiency – factors and improvement techniques
   Large device – greater amount of optical energy is absorbed
   Top layer is kept thin – so most light reaches base – surface absorption causes
    recombination – no useful current produced
   Requirement is diffusion lengths must be large
   Base is made larger – n+p structures are preferred – p region – Dn is larger than for
    holes
   η = FF VOCIL / Pin - Hence we require high VOC, ISC and FF
   Need to increase IL – heavy doping of back of cell – n+pp+ structure – potential barrier
    at back pp+ junction - reduction of recombination at back surface
   Dependence of material – as Eg increases – IO decreases – VOC increases – but with
    Eg increase - hν maybe < Eg - therefore optimum efficiency depending on the
    material
   GaAs is used for space applications – Si used for terrestrial applications
              OPTOELECTRONIC DETECTORS                                                    19
Solar Cells                  Efficiency – factors and improvement techniques
   Use of anti-reflective coatings – SiO2 , TiO2 , Ta2O5
   Use of surface texturing - chemical etch ants - advantages
      Multiple reflections reduce light reflected back
      The light gets refracted as it enters and travels obliquely through the cell causing
       its absorption closer to the junction
   Use of finger contacts to reduce series resistance
   Use of solar concentrators – using mirrors
   Use of tracking systems to track position of the sun
              OPTOELECTRONIC DETECTORS                                                    20
Solar Cells                                        Calibration
   AIR MASS : measure of how far light travels through the Earth's atmosphere
   Outer edge of Earth’s atmosphere receives around 135 mW /cm2
   Light reaching Earth’s surface – depends on the thickness of the atmosphere
   Air Mass 1 (AM1) : the radiation reaching sea level at high noon in a clear sky is 92.5
    mW/cm2
   Air Mass 0 (AM0) : the radiation in outer space = 135mW/cm2 (outside earth’s
    atmosphere)
   Solar cells are calibrated as AM0 or AM1 illumination
   AM0 : Solar cells in outer space
   AM1 : Solar cells used for terrestrial applications
              OPTOELECTRONIC DETECTORS                                                   21
Solar Cells                             Fabrication – simple structure
   Start with a p-substrate
   p-n junction formed by diffusion or ion
    implantation – small n-region
   Metal contact “fingers” on the surface
   Metal base contact at the other end
   Large area
   Match of Ln , p region thickness and
    mean optical penetration depth
   Must have low series resistance
   Compromise b/w large contact
    potential and longer lifetimes
              OPTOELECTRONIC DETECTORS                                   22
Solar Cells                                 General designs used
   Homo junction device - e.g crystalline Si
       Single material is used
       Depth of p-n junction, dopants and purity
        of material used can be varied
   Hetero junction device – e.g CdS , CuInSe2
       Top window layer – high Eg
       Bottom layer with low Eg
   p-i-n and n-i-p devices – e.g. am Si and CdTe
       3-layer sandwich – middle i-layer
       Electric field stretching across intrinsic
        region
   Multi-junction devices
       Cascade or tandem cell – individual cells
        with different Band Gaps stacked together
             OPTOELECTRONIC DETECTORS                              23
Solar Cells                                      General designs used
   Multi-junction cell – 2 ways
       Mechanical stack approach
           Independent solar cells
           Different band gaps
           Mechanical stacking one on top
            of other
       Monolithic approach
           Fabrication of one full solar cell
           Growing other cell on these
              OPTOELECTRONIC DETECTORS                                  24
Solar Cells          How power is produced
          OPTOELECTRONIC DETECTORS           25
Solar Cells                                               Other factors
   Modification of diode equation
     I = I0 [exp(V/VT)-1] – IL
                                                      Relative response
       VOC=Vmax=VT * ln(IL/IS + 1)
       ISC = IL
       η = (ILkV2mp)/((1+kVmp)APin) * (1 + IL/ IS)
        ; k=1/VT
   Spectral response
      Variation of short circuit current with
       wavelength of incident light
      Short wavelength response – junction
       close to surface ( 1/α small)
      Long wavelength response – junction
       must be deep comparatively                                         Wavelength of incident light
              OPTOELECTRONIC DETECTORS                                                             26
Solar Cells                                           Other factors
   Recombination current and series
    resistance
       Recombination within depletion region
       Defects in solar cell
       Modification of diode equation
                                                     Current
       I = I0 [exp(V/nVT)-1] – IL
       Modification of diode characteristics –
        series resistance (mainly) , shunt                                        Rs=5ohm
        resistance
                                                                                  Rsh=inf
           RS – jn depth, impurity concentration,
            arrangement of ohmic contacts                      Rs=0
                                                               Rsh=100ohm
   Radiation effect
       High energy particle radiation                                                Rs=0
       Production of defects in semi-                                                Rsh=inf
        conductors
       Reduction in solar power output
                                                                            Voltage
              OPTOELECTRONIC DETECTORS                                                 27
Photo Detectors                                    General consideration
   Reverse biased semiconductor diodes
   Includes p-i-n diode, the p-n junction diode, metal-semiconductor diode,
    hetero junction, avalanche photodiode
   Wavelength response, modulation-frequency response, available power, SNR
   Wavelength response – absorption coefficient = function of Wavelength … small
    for longer wavelength and vice versa
   Modulation frequency response
       Diffusion of carriers – for carriers generated outside depletion region
       Drift time in depletion region
       Capacitance of depletion region          compromise b/w the two
   Available power – depends on quantum efficiency, area, incident photon flux
   SNR – signal to noise ratio
               OPTOELECTRONIC DETECTORS                                             28
Photo Detectors                             General consideration
   Quantum efficiency η = number of useful electron hole pairs generated per incident
    photon – useful EHPs – which do not recombine and contribute to current
   η = (IL/q)/(Poptical / hν) ~ exp(-αWP) – exp {-α(W+LP)}
   Hence WP must be small and W large – but large W ⇒ large transit time
   Responsivity – ratio of photocurrent to the incident optical power (A/W)
   R = IL/Poptical = ηq/(hν)
   Dark Current – photocurrent with no optical signal – current due to background
    radiation and saturation current – contributes to noise
   Noise equivalent power (NEP) - minimum input optical power to generate
    photocurrent equal to the rms noise current in a 1 Hz bandwidth
   Detectivity D = 1/NEP
              OPTOELECTRONIC DETECTORS                                                   29
Photo Detectors                            p-n junction photodiode
                                               hν
   Absorption takes place – n/p region or           P
    depletion region
   Production of electron hole pairs
   Separation of the electron hole pairs by
                                                                     N
    electric field
   Depletion region width increased –
    reverse bias
                                                hν
   Alternative approach – using graded p-n
                                                         P
    junction
   Presence of in-built electric field
              OPTOELECTRONIC DETECTORS                                   30
Photo Detectors                       p-n junction photodiode - structure
   Similar to a p-n junction diode
   Generally thin p+ layer – unlike solar
    cells – formed by Boron diffusion –
    1um
   Response must be fast – compromise
    b/w sensitivity and speed of response
    – vary p, n and n+ layer
   Materials used
      Silicon
      Germanium
              OPTOELECTRONIC DETECTORS                                      31
Photo Detectors                                p-i-n photodiode
   Most common depletion layer photo
    detector
   Principle of operation – same as p-n
    junction photodiode
   Depletion layer thickness – tailored for
    sensitivity and response
   Intrinsic region – low doping , high
    carrier lifetime… most of carriers
    collected
   Large width depletion region – low
    capacitance
   High bandwidths
   Modes of operation
     Current mode – constant RB
     Voltage mode – no external bias
              OPTOELECTRONIC DETECTORS                            32
Photo Detectors                          p-i-n photodiode structure
   Two ways – planar and mesa structure
   Planar
      n substrate
      Epitaxial growth of intrinsic region
       ever the n-type substrate – 10 to
       200 microns
      P+ diffusion or ion implantation
   Mesa
      Layers grown on substrate –
       dopants incorporated
                                                             hν       P+
                                                               N+
             OPTOELECTRONIC DETECTORS                                      33
Photo Detectors                       Metal semiconductor photodiode
     Metal semiconductor junction                     Metal        Semi conductor
       Operation in various modes                     qφBn
     A.   Eg > hν > qφBn ; V << VB – photo                                           EC
          excited electrons in metal …                                               EF
          cross barrier to semi-conductor
     B.   Eg < hν ; V << VB – hole-electron
          pairs in semi-conductor…similar
          to p-i-n photodiode                                                        Ev
     C.   Eg < hν ; V ~ VB – can be
          operated as avalanche
          photodiode – when guard bands
          are used
     Can be used as UV detector also
                                                               hν
hν
                                    hν
        CASE A                                CASE B                       CASE C
               OPTOELECTRONIC DETECTORS                                                   34
Photo Detectors             Metal semiconductor photodiode structure
                                        Thin metal film    Incident wave
   n-layer substrate                   Anti-reflection                Contact dot
   Deposition of thin metal film       coating
   Absorption losses must be minimum
   Usage of anti-reflective coatings
   Inter digitated design minimizes
    parasitic resistances.
                                                            n layer
                                           As for p-i-n diode, the MSM speed is
                                            determined by the transit time, and
                                            depletion region width
                                           MSMs have bandwidths up to 350
                                            GHz
            OPTOELECTRONIC DETECTORS                                               35
Photo Detectors                         Heterojunction photo diode
   Multi layers of compound                hν
    semiconductors                                n-GaAs     p-Ge
   Band gap – varied to match incident
    wavelength
   Quantum efficiency is higher
   Usage of window (high band gap
    material)
   Frequency response depends on
    relative absorption
   Barrier can be penetrated – tunneling
    or by high energy
                                                                     V
             OPTOELECTRONIC DETECTORS                                    36
Photo Detectors                 Heterojunction photo diode structure
   Contains semiconductor – semi
    conductor junction
   In0.53Ga0.47As/InP – widely used
    hetero structure
   Lattice matched
   InP used as window
   In0.53Ga0.47As – absorbing layer
   Eg of In0.53Ga0.47As is 0.73eV
   Can be used up to 1.7μm – can be
    used from 1.3-1.55 μm
             OPTOELECTRONIC DETECTORS                                  37
Photo Detectors              P-i-n Heterojunction diode structure
      n contact   InGaAs                              Air bridge
                  active layer
                                                   Polyimide passivation
                                                       Semi-insulating InP
                                  Optical fibre
          OPTOELECTRONIC DETECTORS                                         38
Photo Detectors                             Avalanche photodiode
   Operated at high reverse bias – under
    breakdown conditions
   Internal current gain – avalanche
    effect
   Photo multiplication factor
       Mph = Iph/Ipho =1/(1-(V/VB)n)
   Increase in photocurrent and
    responsivity of detector
   Low level optical signals detection –
    photodiode operated in avalanche
    mode – current gain – Si APD can
    have high sensitivity and response
    time of 1ns – used mainly in Optical
    communication
              OPTOELECTRONIC DETECTORS                             39
Photo Detectors                      Avalanche photodiode structure
                                                                          Aluminium
                                                SiO2
                                                                     n+
   Useful current gain – elimination of
    micro plasmas (small areas in which
    breakdown voltage is less than that of
    junction)
   Usage of guard ring – lower impurity                     P - type
    gradient , large radius of curvature
   Must have uniform doping                                Planar Type
    concentration
                                             SiO2
                                                                n+        Au contact ring
                                                    n(Sb)                  n(Sb)
                                                            P - type
                                                             Mesa Type
             OPTOELECTRONIC DETECTORS                                              40
Photo Conductors & Detectors                Noise and bandwidth
   Main two parameters – Sensitivity and response time – compromise b/w the two is
    required
   Gain-bandwidth product is also important
   Signal to noise ratio
   Photoconductor
      Source of noise – random fluctuations in dark current – noise current increases
       with current and conductivity
      Photoconductor noise - reduced by increasing dark resistance
      Dark resistance inversely proportional to bandwidth
   Pin-diode
      There is no gain mechanism – one photon gives at most one electron-hole pair
      Gain-bandwidth product – determined by bandwidth or frequency response
      Response time depends – width of depletion region
      Noise – thermal generation of EHPs – shot noise – lower than in photoconductor
             OPTOELECTRONIC DETECTORS                                                    41
Photo Conductors & Detectors               Noise and bandwidth
   Avalanche photo diodes
      Provide gain – avalanche multiplication effect
      Increased noise relative to p-i-n – due to random fluctuations
      Noise – can be reduced – impact ionization is due to only due to one type of
       carrier – more carriers more fluctuations
      Si – ability for electrons – impact ionization is higher than for holes
      Si photodiodes – high gain and low noise
      Si APDs – cannot be used for optical fiber communication – Si transparent at low
       loss wavelength
      In0.53Ga0.47As – longer wavelengths – but has more noise
      Use of Si-InGaAs APD – fusion of InGaAs (absorbing layer) – photo generated
       electrons injected into Si – causing impact ionization at low noise
      Another approach is APD structure in resonant cavity
             OPTOELECTRONIC DETECTORS                                                 42
Infrared Detectors                           Introduction
   Electromagnetic waves in region
    0.75μm (1.65eV) to 1000 μm(1.2meV).
   All objects with temperature > 0K emit
    infrared radiation.
   At room temperature 300K – all
    radiation is in infrared region
   Shifts towards UV – as temperature
    increases
   Difference from other photo detectors
       Use of cooling equipment
       Atmospheric absorption and
        background problems
             OPTOELECTRONIC DETECTORS                       43
Infrared Detectors                                  Classification
   Infrared detectors can be divided into two types
       Thermal detectors – thermistors and thermocouples – respond to heating
        produced by absorption of radiation
       Quantum detectors – similar to photodiodes discussed previously
   Quantum type detectors feature high detectivity and fast response speed.
   Responsivity is wavelength dependent
   Quantum type detectors classified - intrinsic types and extrinsic types
   Intrinsic type detectors
       Have detection wavelength limits determined by their inherent energy gap
       Responsivity drops drastically when the wavelength limit is exceeded
       HgCdTe or PbSnTe - wavelength of peak responsivity - changed by controlling
        the composition of the ternary mixture
       HgCdTe detectors - 3 to 5 µm and 7 to 13 µm ranges
       Si, Ge can also be used
   Extrinsic type detectors
      Wavelength limits determined by the level of impurities doped in high
       concentrations to the Ge or Si semiconductors
      Operating temperatures - must be cooled liquid helium temperature
             OPTOELECTRONIC DETECTORS                                                 44
Infrared Detectors                                 Applications
   Others photodiodes - InGaAs, Ge , PbS, PbSe,
    InAs, PtSi, InSb InSb, MCT- HgCdTe, MZT-
    HgZnTe
   Applications
      Infrared spectroscopy
      Weather observation
      Automatic shutdown of industrial boiler
      Even as sensors in robotics
             OPTOELECTRONIC DETECTORS                             45
Photo Transistors                                Basic operation
   Detect light and provide gain
    (amplification)
   Incident photon generates electron
    hole pairs in reverse bias CB junction
   Induced holes drawn to base and
    electrons to collector
   Normal transistor operation takes
    place
   Ic = βIbdark + Iceodark + ILe(1+β) ,
    ILe : current of photo generated
    electrons
   Collector to emitter radiation sensitivity
    (SRCEO) = o/p collector current per unit
    of incident irradiance with base open
   Ic = SRCEP Heff
              OPTOELECTRONIC DETECTORS                             46
Photo Transistors                          Structure
   Similar to a normal transistor
   But larger base and collector areas
   Top surface exposed
   Use of window or lens
   Fabrication using epitaxial growth –
    matching lattices
   Optical switches
   Light sensors
                                            Fabrication of normal transistor
              OPTOELECTRONIC DETECTORS                                         47
Photo FETs                                  Operation
   Provides combination of
    photosensitive p-n junction with high
    impedance
                                                           ID
                                                  hν
   Photon enter gate area – electrons
    from VB to CB                                 IG            D
   Small signal analysis – gives small
                                                       G
    signal gain                                             S
   ΔVDS = ΔIGRGgfsRD
              OPTOELECTRONIC DETECTORS                              48
Charge Coupled Devices                        Basic operation
   IC chip – array of MOS capacitors
   Accumulation of charge
   Read value after fixed time
   Sensitive to low light levels
   Similar to bucket brigade device
   The depletion layer – potential well
   When light strikes – electron hole pair
   Electron remains in the potential well
   Array read - transferring the charge
    from one MOS capacitor to its
    neighbor on one side – like shift
    register
              OPTOELECTRONIC DETECTORS                          49
Charge Coupled Devices                        Fabrication
   Photoactive region - epitaxial layer of
    silicon
   Doping of p+ (Boron) – diffusion
   Buried channels by phosphorous ion
    implantation
   Growth of silicon dioxide, followed by
    poly gate – use of photolithography
   Two poly-silicon MOS transistors
   Silicon dioxide grown, followed by
    polygate
   Photolithography and formation of 3
    poly gates
   Similarly an array is formed
              OPTOELECTRONIC DETECTORS                      50
Charge Coupled Devices                    Applications
   Digital still and video cameras
   Astronomical telescopes, scanners,
    and bar code readers
   Vision for robots
   Optical character recognition (OCR)
                                             CCD for UV imaging
   Processing of satellite photographs
   Color Cameras – 3CCD
                                             CCD from a fax machine
             OPTOELECTRONIC DETECTORS                                 51
Summary
   Optical absorption
      α : Coefficient of absorption – 1/α mean absorption length
   Photoconductors
      Conductivity increased by shining light
      Sensitivity and speed of response – main parameters
   Diodes
      Generation of electron-hole pairs in depletion region
      Presence of electric field helps detect light
      Can be operated in photo detector or photovoltaic mode
   Solar cells
      Photovoltaic mode of operation
      Generation of current – solar to electrical energy
      Operation in maximum power rectangle
      Designs – to trap maximum light
              OPTOELECTRONIC DETECTORS                              52
Summary
   Photo detectors
      Used in optical fibre communication
      p-n junction diode, p-i-n diode
      Avalanche photo diode with internal current gain
   Infrared detectors
       Cooling problems and background radiations
       Quantum type detectors – intrinsic and extrinsic
   Phototransistors
      Detection of light and provide current gain
   Charge coupled devices
     Potential well in MOS – stores charge
     Like bucket brigade device
     Light sensor in digital cameras
     3CCD used as RGB
             OPTOELECTRONIC DETECTORS                      53
Books referred
   Semiconductor Devices – Nandita Dasgupta and Amitava Dasgupta
   Integrated Circuits and Semiconductor Devices – Deboo/Burrous
   Solid State Electronic Devices – B.G. Streetman
   Physics of Semiconductor Devices – Sze
   The World of Information - INTERNET
            OPTOELECTRONIC DETECTORS                                54
OPTOELECTRONIC DETECTORS   55