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Die To Die Connectivity: Walter Katz

This document discusses how to automatically generate post-layout die-to-die interconnect models using existing vendor and EDA tool models. Vendor models include IBIS files for dies and EMD files for packages and connectors. EDA tools provide PCB board models and define connectivity between boards, packages, and cables. With IBIS, EMD, and connection data defining mappings between pin numbers, EDA tools can now determine both intra-board and inter-board connectivity to fully define die-to-die models without additional manual work.

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80 views11 pages

Die To Die Connectivity: Walter Katz

This document discusses how to automatically generate post-layout die-to-die interconnect models using existing vendor and EDA tool models. Vendor models include IBIS files for dies and EMD files for packages and connectors. EDA tools provide PCB board models and define connectivity between boards, packages, and cables. With IBIS, EMD, and connection data defining mappings between pin numbers, EDA tools can now determine both intra-board and inter-board connectivity to fully define die-to-die models without additional manual work.

Uploaded by

Jou
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 11

Die to Die Connectivity

Walter Katz
IBIS Interconnect
12/12/12
Overview
• A real Die 2 Die problem
• Vendor supplied models
• EDA tool supplies PCB models
• EDA tool supplies connectivity between PCB
models and Vendor supplied models
• All of the pieces are now in place to
automatically define full post layout Die 2 Die
models.
• Conclusion

2
A Real Die 2 Die Problem
• System consists of
– Backplane
– A Number of Line Cards
– A Number of Switch Cards
– Twinax cables from Line Card on this system to a Line
Card on another similar system
– Optical cables from Line Card on this system to a Line
Card on another similar system
• Die 2 Die Connections (Die Pad to Die Pad)
– Within a DIMM
– Within a Line Card or Switch Card
– Between Line Card and Switch Card in a System
– Between Line Cards on two Systems

3
Example Switch Card

4
Modules Not Shown
• Line Card Module
• Backplane Module
• Connectors between Backplane Module and
– Line Card Module
– Switch Card Module
• Cables between Line Card Modules
– Twinax
– Optical

5
Vendor Supplied Models
• IC Vendors
– IBIS file of BGA PKG/Die
– EMD file of Socket/Interposer/Silicon
– Connector/Dimm PCB/3D Stacked SDRAMS
• Connector Vendors
– EMD file of Line Card Connector
– EMD file of Switch Card Connector
• Cable Vendors
– EMD file of Twinax Cable
– EMD file of Optical Cable

6
EDA Tool Supplies PCB Models
• PCB Board Models
– Back Plane
– Line Card
– Switch Card
• Boards can be from multiple EDA Vendors
• Models can be supplied as EMD files

7
Intra PCB Module Connectivity is
Determined by EDA Tool
• Between PCB and IC Vendor Models
– Footprints in PCB Data Base have
• Reference Designator
• Corporate Part Number
• Pin Numbers (IBIS Pin_names)
– EDA tool uses mapping of Corporate Part Numbers to
IBIS files (.ibs, .ebd. .emd) and Pin Numbers to define
electrical connectivity between PCB and IBIS file.

8
Inter PCB Connectivity is
Determined by EDA Tool
• Between PCB and PCB
– Each Board instance has a Board Reference
Designator
– Footprints in PCB Data Base have
• Reference Designator
• Pin Numbers (IBIS Pin_names)
– EDA tool has “Connection Data” that has a number of
“connections” with the following data:
• Connector (or Cable) EMD Model
• For both A and B Side of the Connector
– Board Reference Designator
– Footprint Reference Designator
– Footprint Pin

9
All of the Pieces are now in Place
• Intra IBIS (EMD) Die to Die
– EMD supplies this Die to Die model
• Inter IBIS (.ibs, EMD, EBD) Die to Die
– IBIS supplies Die to IBIS Pin model
– EDA tool makes connection of IBIS to PCB
– Inter PCB
• EDA tool uses PCB connections to finish the job

10
Conclusion
• Demonstrated that EMD is all that is required to
solve the problem of automatically generating
post layout interconnect models from Die to Die.
• Assumptions
– IC Vendors generate EMD files for board level
components
– Connector Vendors generate EMD files for connectors
– Cable Vendors generate EMD files for cables
– Connections between PCB and Connectors, Cables
and Board Level Components are done by Pin Number
(Pin_name). Connection within EMD (e.g. between
silicon and interposer, or interposer and package) may
use XY coordinates or other techniques.

11

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