Product Specification

( ) Preliminary Specification
( √ ) Approval Specification

Any modification of Spec is not allowed without SDC‟s permission.

CUSTOMER TCL MODEL NO. LSC400HM06

DATE OF ISSUE 2013/3/18 EXTENSION CODE -8/-T

Customer Approval & Feedback

整机TR已完成，限量认可100,000
pcs
数字签名人 林健源
DN：
cn=林健源，
c=<无>，
o=TCL多媒
体研发中心， ou=设计5所，
email=linjianyuan@tcl.com
日期：
2013.03.22 16:58:57 +08'00'

Approved by
2013/3/18

Prepared by
2013/3/18
LCD Sales & Marketing Team
Samsung Display Co., Ltd
————————————————————————————————————————————————–

Table of Contents

REVISION HISTORY .......................................................................................................................................................... 3

1. GENERAL DESCRIPTION ............................................................................................................................................. 4
2. ABSOLUTE MAXIMUM RATINGS.............................................................................................................................. 5

ly
3. OPTICAL CHARACTERISTICS ..................................................................................................................................... 6
4. ELECTRICAL CHARACTERISTICS ............................................................................................................................... 9

on
4.1 TFT LCD MODULE ..................................................................................................................................................... 9
5. INPUT TERMINAL PIN ASSIGNMENT .................................................................................................................... 10
5.1 INPUT SIGNAL & POWER ....................................................................................................................................... 10
5.2 LVDS INTERFACE..................................................................................................................................................... 12

L
5.3 INPUT COLOR DATA MAPPING............................................................................................................................. 13
TC
6. INTERFACE TIMING ................................................................................................................................................... 14
6.1 TIMING PARAMETERS OF TIMING (ONLY DE MODE) ............................................................................................ 14
6.2 TIMING DIAGRAMS OF INTERFACE SIGNAL ........................................................................................................ 14
6.3 CHARACTREISTICS OF INPUT DATA OF LVDS ..................................................................................................... 15
6.4 POWER ON/OFF SEQUENCE ................................................................................................................................. 16
of

7. OUTLINE DIMENSION ............................................................................................................................................... 17

8. RELIABILITY TEST ....................................................................................................................................................... 18
9. PACKING ...................................................................................................................................................................... 19
s

9.1 CARTON................................................................................................................................................................... 19
ye

9.2 MARKING ................................................................................................................................................................ 20

10. GENERAL PRECAUTIONS ....................................................................................................................................... 22
10.1 HANDLING ............................................................................................................................................................ 22
re

10.2 STORAGE ............................................................................................................................................................... 24

10.3 OPERATION ........................................................................................................................................................... 24
10.4 OPERATION CONDITION GUIDE ........................................................................................................................ 25
10.5 PROCESS EXECUTING GUIDE .............................................................................................................................. 25
10.6 OTHERS .................................................................................................................................................................. 26
Fo

11. SPECIAL PRECAUSTIONS........................................................................................................................................ 27

APPENDIX – RECOMMENDATION FOR THE BLU DESIGN .................................................................................... 28

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 2 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

REVISION HISTORY

Date. Rev.No. Page Revision Description

2013/3/18 000 Initial Release

ly
on
L
TC
of
s
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 3 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

1. GENERAL DESCRIPTION

DESCRIPTION

This model uses a liquid crystal display (LCD) of amorphous silicon TFT as switching components. This model is
composed of a TFT LCD panel, a driver circuit, and an ass‟y KIT of source PBA. This 40.0” model has a
resolution of a 1920 x 1080 and can display up to 1.07 Billion colors with the wide viewing angle of 89° or a

ly
higher degree in all directions. This panel is designed to support applications by providing a excellent
performance function of the flat panel display such as home-alone multimedia TFT-LCD TV and a high
definition TV.

on
FEATURES
RoHS compliance (Pb-free)
High contrast ratio & aperture ratio with the wide color gamut

L
S-PVA (Super Patterned vertical align) mode
Wide viewing angle (± 178°) TC
High speed response
FHD resolution (1920 x 1080, 16:9)
DE (Data enable) mode
The interface (2Pixel/clock) of 2ch LVDS (Low voltage differential signaling)
of

GENERAL INFORMATION
Item Specification Unit Note
Active Display Area 885.60 (H) x 498.15 (V) mm
s

Switching Components a-Si TFT Active matrix

TFT :906.40H) x 518.00(V)
ye

Glass size CF : 906.40(H) x 515.26(V) mm ±0.5mm

906.40(H) x 518.00(V) mm ±0.5mm
Panel Size
1.80(D) mm ±0.1mm
2090 (Max)
re

Weight g
Display Colors 1.07B (Dithered 10bit )
Number of Pixels 1920 × 1080 16:9
Pixel Arrangement RGB Horizontal Stripe mm
Display Mode Normally Black
Fo

Surface Treatment Anti Glare

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 4 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

2. ABSOLUTE MAXIMUM RATINGS

If the figures on measuring instruments exceed maximum ratings, it can cause the malfunction or the
unrecoverable damage on the device.

Item Symbol Min. Max. Unit Note

Power supply voltage VDD 10.8 13.2 V (1)
Temperature for storage

ly
TSTG -20 65 C
(Temperature of glass surface) (2), (4)
Humidity for storage HSTG 5 90 %RH

on
Operating temperature TOPR 0 50 C
(2), (5)
Operating humidity HSTG 20 90 %RH
Endurance on static electricity 150 V (3)

Note (1) The power supply voltage at Ta= 25 ± 2 °C

L
(2) Temperature and the range of relative humidity are shown in the figure below.
a. 90 % RH Max. (Ta ≤ 39 °C) TC
b. The relative humidity is 90% or less. (Ta ＞39 °C)
c. No condensation
(3) Keep the static electricity under 150V in process the polarizer is attached on glass.
(4) Storage condition with glass.
(5) Operating condition with assembly
of
(6) Condition without packing.(Unpacking condition)
s
ye
re
Fo

Fig. Range for temperature and relative humidity (unpacking condition)

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 5 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

3. OPTICAL CHARACTERISTICS

The optical characteristics should be measured in the dark room or the space surrounded by the similar
setting. Measuring equipment : TOPCON RD-80S, TOPCON SR-3 ,ELDIM EZ-Contrast

Ta = 25 ± 2°C, VDD=12.0V, fv=60Hz, fDCLK=148.5MHz, Light source: D65 Standard Light

Item Symbol Condition Min. Typ. Max. Unit Note
(1)
Contrast Ratio CR 3000 5000 - - SR-3

ly
(2)
Response time G-to-G Tg - 8 16 msec RD-80S
Transmissivity ` (3)
4.41 4.9

on
T %
(At the center of screen) SR-3
RX 0.660
Red
RY Normal 0.330
GX qL,R=0 0.265
Color Green
GY qU,D=0 TYP 0.590 TYP (4),(5)
Chromaticity

L
BX -0.03 0.135 +0.03 SR-3
(CIE) Blue
BY Viewing TC 0.120
WX Angle 0.295
White
WY 0.365
qL 75 89 -
Hor. (5)
Viewing qR CR  10 75 89 - SR-3
Degrees
Angle qU At center 75 89 - EZ-Contrast
Ver.
of
qD 75 89 -
Color Gamut 67 69 - %
Color - 7000 - K

Notice
s

(a) Setup for test equipment

ye

The measurement should be executed in a stable, windless, and dark room for 40min and 60min after
operating the panel at the given temperature for stabilization of the standard light. (SDC uses the standard
luminance of the D65media).
This measurement should be measured at the center of screen.
re

The environment condition: Ta = 25 ± 2 °C

(b) D65media has the general light source.

The temperature of color is 6487K. The coordinate of color is Wx 0.313, Wy 0.329
The luminance of this product is 7217cd/㎡.
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 6 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

Photo detector Field

SR-3 2°

RD-80S 1°

ly
on
(c) The CIE positions D65 as the standard daylight illuminant:
[D65] is intended to represent average daylight and has a correlated color temperature of approximately 6500
K. CIE standard illuminant D65 should be used in all colorimetric calculations requiring representative daylight,

L
unless there are specific reasons for using a different illuminant.

- Definition of the test point

TC
of
s
ye

Note (1) Definition of contrast ratio (C/R)

: The ratio of gray max (Gmax) & gray min (Gmin) at the center point ⑤ of the panel
The measurement goes in ELABO-LS Standard light source
re

G max
C/R
G min

Gmax : The luminance with all white pixels

Fo

Gmin : The luminance with all black pixels

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 7 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–
Note (2) Definition of response time

Display data

The response of
optical instruments

ly
※ G-to-G : Average response time between the whole gray scale to the whole gray scale.

on
The response time is the value that was measured after it was operated in Samsung's standard BLU for one
hour.( at room temperature)

Note (3) Definition of transmissivity.

L
The measurement shall be executed with the standard light source of D65 .

TC
Note (4) The definition of chromaticity (CIE 1931)
The color coordinate of red, green, blue and white at the center point ⑤
The measurement shall be executed with the standard light source of D65

Note (5) Definition of viewing angle

: The range of viewing angle (C/R ≥10)
of

The measurement shall be executed with the standard light source of D65
s
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 8 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

4. ELECTRICAL CHARACTERISTICS

4.1 TFT LCD MODULE

* Ta = 25 ± 2 °C
Item Symbol Min. Typ. Max. Unit Note
Voltage of power supply VDD 10.8 12.0 13.2 V (1)
(a) Black - 500 600 mA
Currnet of
(b) White - 470 550 mA
power IDD (2),(3)

ly
(c) Sub V-Stripe - 750 850 mA
supply
(d) Sub H-Stripe 800 1000 mA
Vsync frequency fV 45 60 65 Hz

on
Hsync frequency fH 50 67.5 73 kHz
Main frequency Fdclk 130 148.5 160 MHz
Rush current IRUSH - - 3 A (4)

Note (1) The ripple voltage should be controlled fewer than 10% of V DD (Typ.) voltage.

L
(2) fV=60Hz, fDCLK = 148.5MHz, VDD = 12.0V, DC Current.
(3) Power dissipation check pattern (LCD Module only)
TC
of

(4) Conditions for measurement

s
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 9 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

5. INPUT TERMINAL PIN ASSIGNMENT

5.1 INPUT SIGNAL & POWER

Connector : FI-RXE51S-HF (JAE)
Pin Symbol Description Pin Symbol Description

1 NC NOTE2 26 NC NOTE1

ly
2 NC NOTE2 27 NC NOTE1

3 NC NOTE2 28 Rx2[A]N Even LVDS Signal -

on
4 NC NOTE1 29 Rx2[A]P Even LVDS Signal +

5 NC NOTE1 30 Rx2[B]N Even LVDS Signal -

6 NC NOTE1 31 Rx2[B]P Even LVDS Signal +

L
7 NC NOTE1 32 Rx2[C]N Even LVDS Signal -

9
NC

NC
NOTE1

NOTE1
TC 33

34
Rx2[C]P

GND
Even LVDS Signal +

Ground

10 NC NOTE1 35 Rx2CLK- LVDS Clock -

11 GND Ground 36 Rx2CLK+ LVDS Clock +

of

12 Rx1[A]N Odd LVDS Signal - 37 GND Ground

13 Rx1[A]P Odd LVDS Signal + 38 Rx2[D]N Even LVDS Signal -

s

14 Rx1[B]N Odd LVDS Signal - 39 Rx2[D]P Even LVDS Signal +

ye

15 Rx1[B]P Odd LVDS Signal + 40 Rx2[E]N (Note 3) Even LVDS Signal -

16 Rx1[C]N Odd LVDS Signal - 41 Rx2[E]P (Note 3) Even LVDS Signal +

17 Rx1[C]P Odd LVDS Signal + 42 NC NOTE1

re

18 GND Ground 43 NC NOTE1

19 Rx1CLK- LVDS Clock - 44 GND Ground

20 Rx1CLK+ LVDS Clock + 45 GND Ground

Fo

21 GND Ground 46 GND Ground

22 Rx1[D]N Odd LVDS Signal - 47 NC NOTE1

23 Rx1[D]P Odd LVDS Signal + 48 12V DC power supply

24 Rx1[E]N (Note 3) Odd LVDS Signal - 49 12V DC power supply

25 Rx1[E]P (Note 3) Odd LVDS Signal + 50 12V DC power supply

51 12V DC power supply

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 10 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

Note (1) No connection: These PINS are used only for the product of SAMSUNG.
(DO NOT CONNECT the input device to these pins.)

Note (2) Pin No. 1, 2, 3 are used only for I2C communication in flicker tuning.
(Refer to 9.5 Process Executing Guide)

Note (3) If set input is 8bit LVDS signal, Keep Echannel level „0‟

Pin No.24 / Pin No.40 : Pull up(3.3V)

Pin No.25 / Pin No.41 : Pull down(GND)

ly
Note (4) Pin number which starts from the left side.

on
L
TC
of
s
ye

Fig . The diagram of connector

re

a. Power GND pins should be connected to the LCD‟s metal chassis.

b. All power input pins should be connected together.
c. All NC pins should be separated from other signal or power.
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 11 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

5.2 LVDS INTERFACE

- LVDS receiver : T-con(merged)
- Data format
LVDS pin JEIDA -DATA

TxIN/RxOUT0 R4

TxIN/RxOUT1 R5

TxIN/RxOUT2 R6

TxOUT/RxIN0 TxIN/RxOUT3 R7

TxIN/RxOUT4 R8

ly
TxIN/RxOUT6 R9

TxIN/RxOUT7 G4

on
TxIN/RxOUT8 G5

TxIN/RxOUT9 G6

TxIN/RxOUT12 G7

TxOUT/RxIN1 TxIN/RxOUT13 G8

L
TxIN/RxOUT14 G9

TxIN/RxOUT15 B4
TC
TxIN/RxOUT18

TxIN/RxOUT19
B5

B6

TxIN/RxOUT20 B7

TxIN/RxOUT21 B8
of
TxOUT/RxIN2 TxIN/RxOUT22 B9

TxIN/RxOUT24 HSYNC

TxIN/RxOUT25 VSYNC

TxIN/RxOUT26 DEN
s

TxIN/RxOUT27 R2
ye

TxIN/RxOUT5 R3

TxIN/RxOUT10 G2

TxOUT/RxIN3 TxIN/RxOUT11 G3
re

TxIN/RxOUT16 B2

TxIN/RxOUT17 B3

TxIN/RxOUT23 RESERVED

TxIN/RxOUT28 R0
Fo

TxIN/RxOUT29 R1

TxIN/RxOUT30 G0
TxOUT/RxIN4
TxIN/RxOUT31 G1

TxIN/RxOUT32 B0

TxIN/RxOUT33 B1

TxIN/RxOUT34 RESERVED

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 12 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

5.3 INPUT COLOR DATA MAPPING

ly
on
L
TC
of
s
ye
re
Fo

Note (1) Definition of gray : Rn: Red gray, Gn: Green gray, Bn: Blue gray (n=gray level)
Note (2) Input signal: 0 =Low level voltage, 1=High level voltage

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 13 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

6. INTERFACE TIMING
6.1 TIMING PARAMETERS OF TIMING (Only DE Mode)
Signal Item Symbol Min. Typ. Max. Unit Note
Clock 1/TC 130 148.5 152.5 MHz -
Hsync Frequency FH 50 67.5 70 KHz -
Vsync FV 45 60 62.5 Hz -
Term for the Active display
TVD 1080 Lines -
Vertical period
Display Total vertical TV 1092 1125 1500 Lines -

ly
Active display
Term for the THD 1920 Clocks -
Period
Horizontal

on
Total
Display TH 2080 2200 2450 clocks -
Horizontal
Note) These products don‟t have to receive the signal of Hsync & Vsync from the input device.
(1)Key points when testing: TTL controls the signal and the CLK at the input terminal of LVDS Tx of the system.
(2) Internal VDD = 3.3V
(3) Spread spectrum

L
* The limit of spread spectrum's range of SET in which the LCD module is assembled should be within ± 1.5%.

6.2 TIMING DIAGRAMS OF INTERFACE SIGNAL

TC
of
s
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 14 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

6.3 CHARACTREISTICS OF INPUT DATA OF LVDS

ITEM SYMBOL Min. Typ. Max. UNIT NOTE

Differential input high VTH - - 100 mV VCM=1.2V

threshold voltage

Differential input low VTL -100 - - mV

threshold voltage
Input common mode voltage VCM 0.2 1.2 2.0 V
Differential Input Voltage |VID| 100 - 600 mV

ly
tRSRM - - 450 ps
Input data position FIN=80MHz
tRSLM -450 - - ps

on
Notice The spread spectrum should be 0% when the skew is measured.
Position of a measurement is T-CON LVDS input pin

L
TC
of
s
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 15 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

6.4 POWER ON/OFF SEQUENCE

To prevent the product from being latched up or the DC in the LCD module from starting an operation, the
order to turn the power on and off should be changed to the order as shown in the diagram below.

ly
on
L
TC
of

T1 : The VDD rising time from 10% to 90%

T2 : The time from the point which V DD reach to 90% of voltage to the point which the valid data is out when
the power is on.
s

T3: The time from the point which the valid data is out to the point which VDD reach to the 90% of voltage
when the power is off.
ye

T4: the time from the point which the Vdd decrease to the point which the Vdd increase again for windows to
restart.
re

※ The recommended operating condition of the back light system

T5: The time which takes for B/L to be turned on after the signal is entered when the time is on.
T6 : The time which takes until the signal is out after BL is turned off
 The condition of supply voltage to enter in the module from the external system should have the
Fo

same condition as the definition of VDD.

 Apply the voltage for the lamp within the range which the LCD operates. when the back light is turned on
before the LCD is operated or when the LCD is turned off before the back light is turned off, the display
may show the abnormal screen momentarily.
 While the VDD is off level, please keep the level of input signals low or keep a high impedance condition.
 The figure of T4 should be measured after the module has been fully discharged between the periods
when the power is on and off.
 The interface signal must not keep the high impedance condition when the power is on.

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 16 of 37 Rev.No. 06-000-G-20130318
 ACTIVE CENTER

Fo
re
ye
s
of
TC
L
on
ly
————————————————————————————————————————————————–

8. RELIABILITY TEST
Item Test Condition Quantity Note
HTOL 60 ℃ 8
LTOL -5 ℃ 4
THB 50 ℃ / 90 %RH 10
25 ℃ / Mosaic pattern(9*10) 12hrs
Image sticking 8
Rolling pattern 12hrs / 3cycles

ly
Decompression -40~50℃, 0m(0ft) ~ 13,700m(45,000ft), 72.5Hr 4
HTS 70 ℃, Storage 4

on
LTS -25 ℃, Storage 4
drop(20cm) → temperature/humidity(-30~60/40℃ 90%RH)
Transportation
→ pressure → vibration(5~200Hz 1.05Grms, 2hr) → 1pallet
condition
drop(20cm)
WHTS 60 ℃ / 75 %RH , Storage 4

L
Noise Electromagnetic noise: Overall 23dB 이하 2
Complex stress
ESD
TC
-20℃~60℃, 0~90%RH, 2cycle
S-IC Input ± 7KV, Output ± 4KV
4
3

[ Criteria on evaluation]
There should be no change of the product, which may affect to the practical display functions, when the
of
display quality test is executed under the normal operation setting.

* HTOL/ LTOL : The operating cycle on the high and low temperature
* THB : Temperature humidity slant
* HTS/LTS : The storage at the high and low temperature
s

* WHTS : The storage in the high temperature with the high humidity
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 18 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

9. PACKING
9.1 CARTON
(1) Packing Form
Corrugated Card board box as shock absorber.

(2) Packing Method

ly
on
7EA

L
TC
of

20EA
s
ye

(3) Packing Material

re

ITEM Specification Remark

Total Pallet Size 1485 X 1150 X 1200 W x V x Height [mm]

Fo

-. Panel : 13.3kg(1.9kg/Panel, 7ea/Tray)

Tray 7 [Panel/Tray]
-. Panel Tray : 1.6kg(EPS)

-. Pallet 28.0kg(Wood Pallet)

Pallet 20 [Tray/Pallet]
-. 20ea(10tray x 2array) + 2ea(Top tray)

Total Weight 339.0 [kg] -. Packing Box : 3kg(Paper)

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 19 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

9.2 MARKING
A nameplate is affixed to the specified location on each product.

ly
XXX

on
L
(1)Parts number : LSC400HM06
(2)Revision code : 3 letters TC
(3)Lot number :X X X X XXX XX X

Panel number
Cell ID
Lot ID
of
Month
Year
Product Code
Line
th
(4) Weekcode : 1205( ex. 2012 year, 5 week)
s
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 20 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–
(4) Nameplate Indication

LSC400HM06-xxx

ly
on
Parts name : LSC400HM06
Lot number : XXXXXXXXXX
Product Revision Code : XXX

(5) Packing box attach

L
TC
LSC400HM06

140
of
s
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 21 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

10. GENERAL PRECAUTIONS

10.1 HANDLING

(a) When the panel kit and BLU kit are assembled, the panel kit and BLU kit should be attached to the set
system firmly by combining each mounted holes. Be careful not to give the mechanical stress.

ly
(b) Be careful not to give any extra mechanical stress to the panel when designing the set, and BLU kit.

(c) Be cautious not to give any strong mechanical shock and / or any forces to the panel kit.

on
Applying the any forces to the panel may cause the abnormal operation or the damage to the panel kit and
the back light unit kit.

(d) Refrain from applying any forces to the source PBA and the drive IC in the process of the handling or
installing to the set. If any forces are applied to the products, it may cause damage or a malfunction in the
panel kit.

L
(e) Refrain from applying any forces which cause a constant shock to the back side of panel kit, the set
TC
Design and BLU kit. If any forces are applied to the products, it may cause an abnormal display, a functional
failure and etc.

(f) Note that polarizer could be damaged easily.

Do not press or scratch the bare surface with the material which is harder than a HB pencil lead.
of

(g) Wipe off water droplets or oil immediately. If you leave the droplets for a long time on the product, a
staining or the discoloration may occur.

(h) If the surface of the polarizer is dirty, clean it using the absorbent cotton or the soft cloth.
s

(i) Desirable cleaners are water or IPA (Isopropyl Alcohol).

ye

Do not use Kenton type materials (ex. Acetone), Ethyl alcohol, Toluene, Ethyl acid or Methyl chloride. These
might cause the permanent damage to the polarizer due to chemical reaction.
re

(j) If the liquid crystal material leaks from the panel, this should be kept away from the eyes or mouth.
If this contacts to hands, legs, or clothes, you must washed it away with soap thoroughly and see a doctor
for the medical examination.

(k) Protect the panel kit and BLU Kit out of the static electricity. Otherwise the circuit IC could be damaged.
Fo

- Reference : Process control standard of SDC

No. Item Control standard

1 Ionizer All Equipment should be controlled under 150V.(Typ. 100V)

2 Carrying Roller Carrying Roller should be controlled under 200V.

3 Equipment Ground Resistance All Equipment Ground Should be less than 1ohm.

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 22 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–
(l) Remove the stains with finger-stalls wearing soft gloves in order to keep the display clean in the process of
the incoming inspection and the assembly process.

(m) Do not pull or fold the source drive IC which connects to the source PBA and the panel or the gate drive
IC.

(n) Do not pull, fold or bend the source drive IC and the gate drive IC in any processes.
If not, the source drive IC could be bent one time in the process of assembling the panel Kit and the BLU
Kit.

(o) Do not adjust the variable resistor located on the panel kit and BLU kit except when adjusting the flicker.

ly
(p) Do not touch the pins of the interface connector directly with bare hands.

on
(q) Be cautious not to be peeled off the protection film.

- Make sure to peel off slowly

(It is recommended to peel it off at the speed of more than
8sec. constantly.)

L
- The peeling direction is shown at the Fig
- Instruct the ground worker to work with the adequate
TC
methods such as the antistatic wrist band.
- Maker sure to be grounded the source PBA while peeling of
the protection film.
- Ionized air should be blown over during the peeling
- The protection film should not t be contacted to the source
drive IC.
of

- If the adhesive stains remain on the polarizer after the

protection film is peeled off, please move stains with
isopropyl-alcohol liquid.
s
ye

(r) The protection film for the polarizer on the panel kit should be slowly peeled off just before using so that
the electrostatic charge can be minimized.
re

(s) The panel kit and BLU kit have high frequency circuits. The sufficient suppression to the EMI should be
done by the set manufacturers.
(t) The set of which the panel is assembled shall not be twisted. If the product is twisted, it may cause the
Fo

damage on the product.

(u) Surface Temp. of IC should be controlled less than 100℃, operating over the Temp. can cause the damage
or decrease of lifetime.

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 23 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

10.2 STORAGE
The storage condition for packing
ITEM Unit Min. Max.
Storage
(℃) 5 40
Temperature
Storage
(%rH) 35 75
Humidity

ly
Storage life 6 months
(1) The storage room should provide good ventilation and temperature control.
(2) Products should not be placed on the floor, but on the Pallet away from a wall.

on
(3) Prevent products from direct sunlight, moisture nor water; Be cautious of a buildup of
condensation.
(4) Avoid other hazardous environment while storing goods.
Storage
(5) If products delivered or kept in conditions of the recommended temperature or humidity,
Condition
we recommend you leave them at a circumstance which is shown in the following table.

L
period 1 month 2 months 3 months 4 months 5 months 6 months

Baking
Condition
No Baking
TC 50℃, 10%
24Hr
50℃, 10%, 48Hr

10.3 OPERATION
of

(a) Do not connect or disconnect the FFC cable during the "Power On" condition.

(b) Power supply should be always turned on and off by the "Power on/off sequence"
s

(c) The module has high frequency circuits. The sufficient suppression to the electromagnetic interference
should be done by the system manufacturers. The grounding and shielding methods is important to minimize
ye

the interference.

(d) The cables between TV SET connector and Control PBA interface cable should be connected directly to
have a minimized length. A longer cable between TV SET connector and Control PBA interface cable maybe
re

operate abnormal display

(e) Recommend to age for over 1 hour at least in the state, which the product is driving initially to stabilize the
characteristic of the initial TFT.
Fo

(f) Response time depends on the temperature.( In Lower temperature, it becomes longer)

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 24 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

10.4 OPERATION CONDITION GUIDE

(a) The LCD product shall be operated under normal conditions.
The normal condition is defined as below;
- Temperature : 20± 15℃
- Humidity : 55± 20%
- Display pattern : continually changing pattern (Not stationary)

(b) If the product will be used under extreme conditions such as under the high temperature, humidity,
display patterns or the operation time etc.., it is strongly recommended to contact SDC for the advice about

ly
the application of engineering . Otherwise, its reliability and the function may not be guaranteed. Extreme
conditions are commonly found at airports, transit stations, banks, stock markets, and controlling systems.

on
10.5 PROCESS EXECUTING GUIDE
(a) Aging
Be sure to age for over 1 hour at least, which the product is driving initially to stabilize TFT Characteristic.
(b) Flicker Adjustment

L
(1) Flicker should be adjusted by optimizing the Vcom value in customer LCM Line through the I2C Interface.
(Master & Slave = I2C communication ) TC
Pin. No. Symbol Function Remark
Default : 0V
Vcom tunning : 3.3V
1 TCON_WP EN
(Shouldn‟t be communicated with I2C device as output level
of

“5V”)

2 SCL_I I2C Interface

I2C Bus Interface
s

3 SDA_I I2C Interface

ye

(2) Flicker should be tuned by correct method according to gamma IC type of each model and
(LSC400HM06 – “Genie Type”)
re

Type Flicker data saving position Slave Address

Genie Type Gamma IC memory

Write B0 = “0”/Read B0 =”1”
Fo

Genie-lite Type T-con EEPROM 1110101 (EEPROM data Address : 8161)

(3) Flicker should be adjusted the pattern, where are displayed alternately at green sub-pixel. (Green 1*1 Dot
Pattern)

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 25 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

ly
on
L
< Flicker Adjust Circuit Block Diagram >
TC
10.6 OTHERS
(a) The ultra-violet ray filter is necessary for the outdoor operation.
of

(b) Avoid the condensation of water which may result in the improper operation of product or the
disconnection of
electrode.
s

(c) Do not exceed the limit on the absolute maximum rating. (For example, the supply voltage variation, the
input voltage variation, the variation in content of parts and environmental temperature, and so on) If not,
ye

panel may be damaged.

(d) If the module keeps displaying the same pattern for a long period of time, the image may be remained to
the screen. To avoid the image sticking, it is recommended to use a screen saver.
re

(e) This Panel has its circuitry of PCB's on the rear side, so it should be handled carefully in order for a force
not to be applied.

(f) Please contact the SDC in advance when the same pattern is displayed for a long time
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 26 of 37 Rev.No. 06-000-G-20130318
 ————————————————————————————————————————————————–

11. SPECIAL PRECAUSTIONS

No Component Expected cause
.

Prevent the panel from breaking by assigning gaps between the panel and the upholding part for panel on the drawing
1 Upholding part for for the upholding part for panel.
panel Refer to the (a), (b), (c) of 3-1 for the design of BLU.

The shape of the Design the upholding part for panel to fit to the panel appropriately when designing the BLU since the shape of the
2 upholding part for upholding part for panel may damage the panel.
panel Refer to the (a), (b), (c) of 3-1 for the design of BLU.

ly
The edge of Design the edge of panel to have a sufficient space with the upholding part for panel when designing the BLU since the
3 upholding part for edge of the upholding part for panel may damage the panel when assembling the panel and BLU.
panel Refer to the (a), (b), (c) of 3-1 for the design of BLU.

on
Place the upholding part for the panel in order for the shape of mold, which contacts with the panel not to interfere
4 Upholding part for with the area of panel.
panel Refer to the (a), (b), (c) of 3-1 for the design of BLU.

Design the BLU in order for the COF not to contain the lead crack resulted from the tensioned COF created when the
5 Drive IC product is twisted if the space between the D-IC COF and the middle mold isn't sufficient.
Refer to the (a), (b), (c),(d),(e),(f), and (g)of 3-2 for the design of BLU.

L
Design the BLU in order for the product not to contain the lead crack resulted from the tensioned COF caused under the
TC
6 Drive IC condition, which the product is twisted by fixing the source PCB.
Refer to the (a), (b), (c),(d),(e),(f), and (g)of 3-2 for the design of BLU.

1) The temperature of each part of product suggested by our company and the second vendor shall meet the standard
IC of temperature, which is recommended not to be exceeded by our company when the product is affected under the
7 component various temperature ranges.
Apply over 1mm long separation distance stated in the safety standard between the electric part and each conductor.
(Apply the rated separation distance when insulating.)
of

8 Thermal pad Apply the thermal pad in a designated size to the product as a measure to lower the temperature of heat in order for
each part to use the rated temperature.
The surrounding area of the POL shall be treated with an electrification treatment since the external ESD may cause a
9 POL phenomenon, which the POL is coming off.
s

In addition, the GND portion of source PBA shall be grounded.

The GND portion of each PBA shall be contacted with the GND portion of BLU.
ye

10 PBA Refer to the (a) and (b) of 3-3 for the design of BLU.

The standardized approval from the client is required since the EMI is executed by a client.
11 Circuit Our company can only measure the reference since the client measures the BLU.

12 The height of Design the BLU with considering the maximum height of parts, which our company suggests.
re

component

13 Between the FFC and Design the instrument with considering the length between the FFC and the control PBA.
the C-PBA (The marginal minimum length of 5mm or 8mm is required.)
The surface temperature of panel shall be maintained within 0℃ and 45℃ when the external ambient temperature is at
14 Panel
25℃. (Design the BLU with considering the increase of the temperature in the panel by the LED, CCFL, and etc.)
Recommend to age for over 1 hour at least in the state, which the product is driving initially to stabilize the
Fo

15 Aging
characteristic of the initial TFT.
16 The attachment of The additional confirmation by our company is required If the attachment of gasket to the S-PBA of our company is
gasket required.(To fix the S-PBA or the EMI)
Design the top chassis and the driver IC to be contacted by placing the shape of emboss inside the top chassis as a
17 Drive IC measure to prevent the driver IC from heating. The size of emboss shall be designed in larger size than the size of IC
inside the film of the driver IC.
Refer to the (a), (b), (c),(d),(e),(f), and (g)of 3-2 for the design of BLU.
The prohibited Design the BLU in order for the BLU not to interfere with the area, where the control PBA and the source PBA are
18 bandwidth located densely according to the drawing for the BLU from our company.
The material, which contacts with the bottom side of S-PBA which has a pattern shall be non-conducting material or
19 S-PBA shall be insulated.

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 27 of 37 Rev.No. 06-000-G-20130318
 ————————————————————————————————————————————————–

APPENDIX – RECOMMENDATION FOR THE BLU DESIGN

1. The schematic of panel

ly
on
L
TC
of
s
ye

Item Symbol Remark

Protector Film ① Removable

re

Polaroid Film ②

Color Filter Glass ③

Fo

TFT Glass ④

Source IC ⑤

Gate IC ⑥

Source PBA ⑦

FFC ⑧

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 28 of 37 Rev.No. 06-000-G-20130318
 ————————————————————————————————————————————————–

2. The tolerance of panel assembly

ly
on
L
TC
of

Item Symbol Min. Note

X1 ± 0.3
s

Glass Cutting
ye

Y1 ± 0.3
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 29 of 37 Rev.No. 06-000-G-20130318
 ————————————————————————————————————————————————–

3. The guide for the mechanical design

3.1 The panel guide

(a) It is recommended to avoid the following cases since the light leakage can be caused by the
pressure of the guiding structure.

When the guiding part is made of plastic resin, the gap between the panel and the guiding structure
should be considered when you design. The shrinkage under the situation which the temperatures
change causes the light leakage. For your reference, it is recommended to have a total gap between
the panel and the guide structure as below (When the resin is composed of the PC and the 15% of

ly
G/F.)

on
਀tꀀሄ 32” 40” 46” 55”

Right & Left 0.9 0.9 1.0 1.1

Total Gap
Top & Bottom 0.6 0.7 0.8 0.9

L
It is recommended to follow the dimension and the shape of the guiding structure stated as below
TC
since the distortion of guiding parts can cause the light leakage
of
s
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 30 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–
(b) When the panel guide point is designed at the edge of the panel, the points in the corner
shall not be designed to be contacted with the other parts in order to avoid the crack on the
panel caused by the burr of the panel.

ly
on
(c) It is recommended to avoid placing the ribs as shown below since the panel damage with
the unstable design can be easily happened under the external force.
-. The sharp or the round shape near the panel shall be changed to a flat shape, such as the
shape of screw point, the gate point, and etc.

L
TC
of

-. It is recommended to keep the gap between the panel guides and ribs over 1mm in the
worst conditions.
(※ The suggested dimension does not guarantee the quality of the products.)
s
ye
re

-. The gap between the panel guide and the front cover (or the front chassis) should be a
zero in Z-direction to avoid the being broken in the panel caused by being stuck between
Fo

the gap.

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 31 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

3.2 The COF and the Drive IC

(a) The pattern of COF is easily damaged by the sharp edge of the press and the burr of
mold under the condition which the products are shaking while delivering. Therefore, it

ly
is recommended to avoid designing not to locate the gate of mold or the parting line in
the position of COF when designing the product.

on
L
TC
(b) It is recommended to secure the sufficient gap between the COF and the other parts when
designing the product since the lack of gap between the COF and the other parts can cause
of
the damage in the COF such as the lead crack under the condition which the product is
twisted.
(※ The space over 3.0mm for moving is recommended, but the quality of products is not
guaranteed.)
s
ye
re
Fo

(c) The temperature of the surface of Drive-IC should be less than 100℃

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 32 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–
(d) The sufficient space for the COF and the Drive IC should be prepared including the worst
condition to prevent the damage on Drive-IC from the external force.
-. If the panel is placed to the upper part of the mold, it is recommended to keep the gap
between the mold and the front cover or the mold and the top chassis by adding the rib
between the COF and COF.

ly
on
L
-. Design the gap between the rib and the cover to maintain the space for the protection of COF
TC
as small as possible
of
s
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 33 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–
(e) When metal parts are assembled next to the Drive-IC, the metal part should be insulated to
avoid the damage on IC from the static electricity.

ly
on
(f) If the length of COF is designed to be short, the lead crack can be occurred by applying the
tension on the COF due to the being shaking of the product.

L
TC
of
s
ye

(g) It is recommended to design source PCB can be easily moved to the direction of each axis in
order for the tension not to be applied to the edge of COF under vibrating condition, such as
transportation of the product.
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 34 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

3.3 The control PBA and the Source PBA

(a) The gaps between the source PBA and the other parts and the control PBA and other parts
should be considered to avoid the damage on electrical parts by the static electricity and the
external forces. If the material of shielding part is metal, the insulation method is
recommended.

ly
on
L
TC
(b) Confirm the status of insulation tape since the inappropriately attached insulation tape can
cause the damage on the parts of product if the insulation tape for the insulation of part of
of

PBA is attached inconsecutively due to the inappropriate design or the error occurred during
the process.
s
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 35 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

3. 4 The 4-Corner and the cloudy light leakage

(a) It is recommended to follow the method delineated in the picture below for designing
since the distortion on panel and the sharp increase of the temperature gradient in the
surface of panel can cause the light leakage.
-. Place the strong beads at the corner point to control the flatness of the panel.

ly
on
-. The heat sinking plane in the lower parts shall contact with the bottom chassis.

L
TC
of
s
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 36 of 37 Rev.No. 06-000-G-20130318
————————————————————————————————————————————————–

3.5 Others
(a) The corrosion of the source PBA
Be cautious when selecting the specification of tape or designing the product since the
corrosion of the parts of circuit caused by the overuse of the glass cleaner of the end user
may cause the occurrence of the abnormalities in the screen, if the model is the reversed
product which has the source PBA designed at the 90˚.

ly
on
L
TC
(b) The deterioration of crystal liquid
It is recommended to design the products to make the temperature of the active area of the
of

product operated below the 50℃ for the protection from containing the abnormalities in the
screen due to the deterioration of the liquid crystal. In addition, it is recommended to design the
product not to cause the occurrence of the deterioration of liquid crystal under the ambient
temperature of 50 ℃.
s
ye
re
Fo

——————————————————————————————————————————————––—
Doc.No. LSC400HM06 Page 37 of 37 Rev.No. 06-000-G-20130318