DDEController
DDEController
NOTE
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless
otherwise specified, dimensions have a tolerance of ±0.13 and angles have a tolerance of ±2°. Figures and illustrations are
for identification only and are not drawn to scale.
1. INTRODUCTION
This specification covers the requirements for application of the Stacked MicroQSFP Connector and Cage
Assemblies utilized to interconnect MicroQSFP fiber optic or copper transceiver modules to host printed circuit
boards. The MicroQSFP Connector and Cage assembly is a pre-assembled unit available in a 2X1 thru 2X4
configurations. Product styles include iterations that contain bezel EMI springs or gaskets. In addition, light pipe
kits for each configuration are available.
Both the connector and cage assembly feature compliant pin contacts for mechanical retention to the pc board
and to provide EMI suppression, thermal vent holes, and panel ground springs. In addition, the cage assembly
ports contain latch plate slots used to retain the transceiver modules during operation. A dust cover for each
port may be used when a module is not mated to the cage assembly to prevent contaminants from entering the
chassis. The connector and cage assembly is designed to be inserted thru a bezel after being seated on the pc
board.
The connector consists of a housing with dual 38-position receptacle ports and compliant pin contacts on a
.6mm centerline spacing. The housings contain alignment posts that provide stability for placement on the pc
board. Each receptacle port has a card entry slot that accepts a 1.0 +/-.1 mm thick integrated circuit card
housed in the mating transceiver module.
When corresponding with TE Connectivity Personnel, use the terminology provided in this specification to
facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1.
EMI Springs
Optional Light
Optional EMI Pipe Assembly
Gasket
Figure 1 (cont’d)
© 2016 TE Connectivity family of companies PRODUCT INFORMATION 1-800-522-6752 This controlled document is subject to change.
All Rights Reserved For latest revision and Regional Customer Service,
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*Trademark visit our website at www.te.com.
TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product, and/or company names may be trademarks of their respective owners.
114-32161
Connector
Housing Compliant Pin
Contacts Latch Plate
Retention
Slots
Port
Card Entry
Slots
Figure 1 (end)
2. REFERENCE MATERIAL
2.3. Drawings
Customer drawings for product part numbers are available from www.te.com. Information contained in the
customer drawing takes priority.
2.4. Specifications
Product Specification 108-32126 provides product performance and test results.
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3. REQUIREMENTS
3.1. Safety
Do not stack product shipping containers so high that the containers buckle or deform.
3.2. Storage
A. Ultraviolet Light
Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the product
material.
B. Shelf Life
The product should remain in the shipping containers until ready for use to prevent deformation to
components. The product should be used on a first in, first out basis to avoid storage contamination that
could adversely affect performance.
C. Chemical Exposure
Do not store product near any chemical listed below as they may cause stress corrosion cracking in the
material.
Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds
Amines Carbonates Nitrites Sulfur Nitrites Tartrates
3.3. Limitations
The connectors are designed to operate in a temperature range of -55 to 85°C [-67 to 185°F].
The bezel requirements given in this document are specifically configured for products used in the
communications industry, and peripheral component interconnect (PCI) applications.
3.4. Material
The connector housing and chicklets (parts that hold the compliant pins) are made of molded thermoplastic, UL
94-V-O rated. All compliant pin contacts in the connector are made of a copper based alloy under-plated with
Nickel, plated with tin at the compliant pin area and gold at the interface. The cage components are made from
a stainless steel alloy and the light pipe kits are made from molded polycarbonate material.
3.5. PC Board
A. Material and Thickness
The pc board material shall be glassed epoxy (FR-4 or G10). The minimum pc board thickness shall be
1.45mm for single sided applications and 2.2mm for dual sided. These minimum thickness values
include the board thicknesses tolerance.
B. Tolerance
Maximum allowable bow of the pc board shall be 0.08 mm over the length of the connector and cage
assembly.
C. Hole Dimensions
The holes for the connector signal contacts and cage assembly must be drilled and plated through to
dimensions specified in Figure 2.
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0.025-0.050
Copper Plating (Max Hardness 150 Knoop)
0.27 ±0.05 Finished Hole
Diameter After Plating
0.004-0.010 Hot Air Solder Leveling (HASL) Tin-lead (SnPb)
0.0005 (Min) Immersion Tin (Sn)
0.0002-0.0005 Organic Solderability Preservative (OSP)
0.004-0.0076 Nickel (Ni), 0.0001-0.0005 Immersion Gold (Au)
0.0001-0.0005 Immersion Silver (Ag)
Recommended Hole Dimensions for Cage Assembly
0.025-0.050
Copper Plating (Max Hardness 150 Knoop)
Finished Hole Diameter After Plating
1.05 ±0.05 (For 1.05 Dia Holes)
0.56 ±0.05 (For 0.56 Dia Holes) 0.004-0.010 Hot Air Solder Leveling (HASL) Tin-lead (SnPb)
0.0005 (Min) Immersion Tin (Sn)
0.0002-0.0005 Organic Solderability Preservative (OSP)
0.004-0.0076 Nickel (Ni), 0.0001-0.0005 Immersion Gold (Au)
0.0001-0.0005 Immersion Silver (Ag)
Figure 2
D. Layout
The holes for the connector and cage assembly must be precisely located to ensure proper placement
and optimum performance of the connector and cage assembly. Recommended hole pattern, dimensions,
and tolerances are provided on the customer prints. Sample layouts are provided in Figure 3.
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3 Max
Rev A 5 of 13
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(Connector)
Detail A Detail B
0.79
1.135 1.925
0.79
1.1
0.705
0.9
1.8 1.8
Figure 3 (cont’d)
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Figure 3 (end)
Rev A 7 of 13
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3.7. Bezel
A. Thickness
The bezel thickness range shall be 0.8 through 2.6 mm.
B. Cutout
The bezel must provide a cutout that allows proper mounting of the connector and cage assembly. The
cage assembly panel ground springs or gasket must be compressed by the bezel in order to provide an
electrical ground between the connector and cage assembly and bezel for EMI suppression. Care must
be used to avoid interference between adjacent connector and cage assemblies and other components.
The minimum allowable distance between connector and cage assemblies must be considered to ensure
proper assembly. Dimensions for bezel cutout and minimum allowable distance between cutouts are
shown in Figure 4.
(Ø 2.5)
(28.61)
24.7 ±0.1
(TYP)
R 0.3 Max
B Min
CONNECTOR AND CAGE DIMENSION “A” DIMENSION “B”
ASSEMBLY CONFIGURATION
2X1 15.45 20.0
2X2 29.7 34.25
2X3 43.95 48.5
2X4 58.2 62.75
Figure 4
Rev A 8 of 13
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48
0.25 ±0.1
Bottom of Cutout
in Bezel to Top of
PC Board
CL of Connector
1.7 ±0.9 52 ±0.3
Guide Post
48
0.25 ±0.1
Bottom of Cutout
in Bezel to Top of
PC Board
Figure 5
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3.9. Placement
The following requirements also apply to connectors and cage assemblies used for rework purposes.
Connectors should only be handled by the housing to avoid deformation, contamination, or damage to the
compliant pin contacts.
A. Registration
The compliant pin contacts and mounting posts must be aligned with the matching holes in the pc board,
then inserted into the pc board simultaneously to prevent twisting or bending of the compliant pin
contacts.
B. Seating
Using proper seating force and seating height is essential to interconnection performance. The force used
to seat the connector and cage assembly must be applied evenly to prevent deformation or other damage
to the compliant pin contacts. The force required to seat the connector and cage assembly onto the pc
board can be calculated by:
Amount of Compliant Pin Contacts X 44.5N (10 lbs) Force per Compliant Pin =
Over-driving the connector and cage assembly will deform parts critical to the quality of the connection.
Maximum force occurs prior to the connector and cage assembly bottoming on the pc board.
The shut height of the application tool must be specifically set for proper seating of the connector and
cage assembly. The shut height can be calculated by:
Seating Height (Connector and Cage Seated) + Height of Seating Tool + Combined Thickness of PC
Board and PC Board Support Fixture = Shut Height (Ram Down)
The seating height, measured from the top of the cage assembly (not including the panel ground springs)
to the top of the PC board is shown in Figure 6.
23.95 Ref
Seating
Height
Figure 6
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7A 7B
Snap Light Pipe
Bracket onto
Cage Body
Snap the
Organizer Latches
into the Cage Slots
Figure 7
4. QUALIFICATION
No qualifying support for MicroQSFP Stacked Connectors and Cage Assemblies was defined at the time of
publication of this document.
5. TOOLING
Tooling Part Numbers and instructional material packaged with the tooling are given in Figure 8.
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6. VISUAL AID
The illustration below shows a typical application of this product. This illustration should be used by production
personnel to ensure a correctly applied product. Applications which do not appear correct should be inspected
using the information in the preceding pages of this specification and in the instructional material shipped with
the product or tooling.
Rev A 13 of 13