THERMAL RESISTANCE TABLE

PIN COMMON PIN COMMON PIN COMMON

THETA THETA TO SUBSTRATE THETA THETA TO SUBSTRATE THETA THETA TO SUBSTRATE
PACKAGE STYLE JC JA — PACKAGE STYLE JC JA — PACKAGE STYLE JC JA —
TYPE CODE LEAD COUNT °C/W °C/W BOARD TYPE TYPE CODE LEAD COUNT °C/W °C/W BOARD TYPE TYPE CODE LEAD COUNT °C/W °C/W BOARD TYPE
Metal Can K TO-3 2L 3 35 Case MS MS12 21 135 Cu, 4 layer UFD20,UFD24 3.4 43 4 Layer
TO-3 4L 3 35 Case MS16 21 120 Cu, 4 layer 4×5 UFD ,UFD28
Metal Can H TO-5 40 150 — MS16(12) 21 135 Cu, 4 layer
TO-39 15 150 Pin 3* MSE MSE10 5-10 35-40 Cu, 4 layer 4×6 UFE UFE26, UFE38 4 38 4 Layer
TO-46 80 440 Pin 3* MSE12 5-10 35-40 Cu, 4 layer
MSE16 5-10 35-40 Cu, 4 layer 4×7 UFF UFF34, 2.6 36.4 4 Layer
TO-52 N/A 360 Pin 3*
CERDIP J J8 30 110 — MSE16(12) 5-10 35-40 Cu, 4 layer UFF36, UFF44
J14 25 95 — Plastic SSOP G G16 40 110 Cu, 4 layer 4×9 UFH UFH44 3 34 4 Layer
J16 25 85 — 5.3mm G20 30 90 Cu, 4 layer
J18 20 75 — G24 25 88 Cu, 4 layer 5×5 UH UH20, UH24, 7.3 44 4 Layer
J20 15 70 — G28 25 80 Cu, 4 layer UH32, UH40
J24 10 65 — G36 25 70 Cu, 4 layer 5×6 UHE UHE28, 5.0 43 4 Layer
J28 7 55 G44 25 70 Cu, 4 layer UHE36,
Side Brazed D D8 30 100 — SSOP, GN GN16 40 110 Cu, 4 layer
Narrow GN16/ 4 pin fused 37 90 Cu, 4 layer UHE42
D14 25 85 —
D16 25 80 — 150mil GN20 30 90 Cu, 4 layer 5×7 UHF UHF38 2 34 4 Layer
D18 20 75 — GN24 30 85 Cu, 4 layer 5×8 UHG UHG39/UHG52 3.8 36 4 Layer
D20 15 70 GN28 25 80 Cu, 4 layer 5×9 UHH UHH48, UHH56 2 31 4 Layer
LCC LS LS8 4 125 — SSOP, Wide GW GW36 20 65 Cu, 4 layer 6×6 UJ UJ40 2 33 4 Layer
L LCC 20L 40 100 — 300mil GW44 17 60 Cu, 4 layer 7×7 UK UK44, UK48 3 34 4 Layer
Flat Pack W W10 40 170 — Plastic F F14 17 100 Cu, 4 Layer 7×8 UKG WKG UKG52, WKG52 2 31 4 Layer
Glass Sealed W14 40 160 — TSSOP 4.mm F20 20 90 Cu, 4 Layer
7×9 UKH WKH UKH64, WKH56 2 29 4 Layer
Flat Pack Bot- WB WB10 40 160 — F20, fused 18 80 Cu, 4 Layer
9×9 UP WP UP64, WP64 1 29 4 Layer
tom Brazed WB14 40 150 — FE FE16 10 38 Cu, 4 Layer
Plastic TO P TO-3P 3L 1.5 45 Pin 2 FE20 10 38 Cu, 4 Layer Plastic LX LX48 - 53 4 Layer
(TO-247) FE24 10 33 Cu, 4 Layer LQFP/
18.5 45 Split pad, 4 Layer
Plastic TO Z TO-226 3L — 160 Pin 1 or 2 FE28 5-10 30 Cu, 4 Layer eLQFP
(TO-92) (By Device) FE38 5-10 28 Cu, 4 Layer - 57 DAF, 4 Layer
Plastic TO T TO-220 3L 11 34 Pin 2 FE38(31) 5-10 28 Cu, 4 Layer
Plastic FW FW48 — 82 Cu, 4 Layer LXE LXE48 3 20 4 Layer
T TO-220 5L 11 34 Pin 3
T7 TO-220 7L 11 34 Pin 4 TSSOP LW LW64 - 34 4 Layer
Plastic DD M DD Pak 3L 11 34 Pin 2 6.1mm
Q DD Pak 5L 11 34 Pin 3 Plastic DFN (Exposed Pad) LWE LWE64 2.5 17 4 Layer
R DD Pak 7L 11 34 Pin 4 2×2 DC DC3, DC4, 16.7 80.6 4 Layer
Plastic PDIP N8 N8 45 100 Cu, 4 layer DC6,DC8
300mil N8 50 150 A42, 4 layer KC
Plastic PDIP N N14, Cu 33 70 4 Layer KC8 17.2 88.5 4 Layer
300mil N16, Cu 34 70 4 Layer 2×3 DCB DCB6, DCB8 9.6 64 4 Layer
N18, Cu 29 65 4 Layer 3×2 DDB DDB8, DDB10, 16.8 55 4 Layer
N20, Cu 28 62 4 Layer DDB12
N24, Cu 27 60 4 Layer 3×3 DD DD8,DD8 5.5 43 4 Layer
N28, Cu 30 59 4 Layer KD DD10,DD12
Plastic SC70 SC6 SC6, 2 pin fused 270 Cu, Multilayer DD12MA
- KD10
SC8 SC8, 3 pin fused 270 Cu, Multilayer
4×3 DE,UE DE12, UE12 5.5 43 4 Layer
Plastic S3 S3 100 202 A42, 4 layer, pin 2
SOT/TSOT S5 S5 50 215 Cu, 4 layer, Pin 2 4×3 DE,KE DE14, DE16, 5.5 43 4 Layer
S6 S6 51 192 Cu, 4 layer, Pin 2 KE14
TS8 TS8 47 195 Cu, 4 layer, Pin 2 Consult individual data sheets for product-specific values or requirements.
Plastic ST SOT-223 15 60 (est.) Pin 2 4×4 DF DF12 3.7 42.6 4 Layer
SOT-223 5×3 DHC DHC16 3.2 41.7 4 Layer 1. These values are offered for general reference use.
Plastic SO S8 S8 39 120 Cu, 4 layer 5×4 DHD DHD16 4.3 41.7 4 Layer 2. High effective thermal conductivity board (JEDEC 4 layer) was used for the calculations.
150mil S8 42 190 A42, 4 layer 5×5 DH DH16 3.0 34 4 Layer 3. DFN and QFN package type dimensions are in millimeter.
S8, 1 pin fused 38 95 Cu, 4 layer 6×3 DJC DJC22 4.3 31.8 4 Layer 4. All QFN/QFN are Cu lead frames.
S8, 2 pin fused 37 90 Cu, 4 layer 6x4 DJD DJD24 4.3 37 4 Layer 5. The values for Plastic Packages are for copper material and non-fused type unless otherwise
S8, 3 pin fused 35 85 Cu, 4 layer 7×4 DKD DKD32 7.5 34 4 Layer shown in STYLE LEAD COUNT column.
S S14 37 88 Cu, 4 layer DKD24 6. Construction variations, such as die size, material, leads fused internally to Die Attach Pad,
S S14 - 160 A42, 4 layer and PCB copper layout, significantly influence thermal performance.
Plastic QFN (Exposed Pad)
S S16, 4 pin fused 22 65 Cu, 4 layer 7. For θ jc (Theta JC) calculation on e-pad packages, the heat sink applies to package bottom
S S16 30 80 Cu, 4 layer 3×3 UD UD16, UD20, 7.5 68 4 Layer exposed pad only.
S S16 - 150 A42, 4 layer PD PD16, PD20 8. Cu = Copper; A42 = Alloy 42.
S8E S8E 5 33 Cu, 4 layer 3x2 UDB UDB10 5.0 137 4 layer * 3-Lead Versions, metal can.
SW SW16 30 80 4 layer 3×4 UDC UDC20, 6.8 52 4 Layer
SW18 27 70 4 layer PDC UDC20MA,
Plastic SO SW20 25 60 4 layer UDC24,PDC20
300mil SW24 23 60 4 layer 3×5 UDD UDD24 5.0 46 4 Layer
SW28 20 55 4 layer 4×4 UF UF16,UF20 4.5 47 4 Layer
Plastic MSOP MS8 MS8 40 163 Cu, 4 layer PF UF24,UF28
& Exposed MS8 45 273 A42, 4 layer PF24,PF28
MSOP MS8E MS8E 5-10 35-40 Cu, 4-layer
MS MS10 45 160 Cu, 4-layer