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Icrs Project Report

This report is a detailed summary of the processes that we have learnt at the KAYNES TECHNOLOGY during our internship. Mainly the processes here include Printed Circuit Board assembly and full box build. Also, this report gives detailed information about our learning, understanding and conceptualization of various processes carried out at each department in the facility. We also carried out shop floor visits and contributed towards process improvement activities.

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Sanjith Hm
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100% found this document useful (1 vote)
835 views33 pages

Icrs Project Report

This report is a detailed summary of the processes that we have learnt at the KAYNES TECHNOLOGY during our internship. Mainly the processes here include Printed Circuit Board assembly and full box build. Also, this report gives detailed information about our learning, understanding and conceptualization of various processes carried out at each department in the facility. We also carried out shop floor visits and contributed towards process improvement activities.

Uploaded by

Sanjith Hm
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
You are on page 1/ 33

The National Institute of Engineering

(An Autonomous Institute under Visvesvaraya Technological University, Belagavi)

REPORT ON
ISO 9001:2015 AND ECRS

Submitted in partial fulfilment for the award of credits for


Project work preliminary (IP0113)

By
Roshan
4NI14IP031
VII SEM

Guide: Dr. M. S. Sham Prasad


Head of the Department

DEPARTMENT OF
INDUSTRIAL AND PRODUCTION ENGINEERING
NIE, MYSURU- 08

1
13.09.19

ACKNOWLEDGEMENT

It is with a sense of gratitude; we acknowledge the efforts of entire hosts of well-wishers


who have in some way or other contributed in their own special ways to the success and
completion of this internship project.

First of all, we express our deep sense of gratitude to Mrs. Savitha Ramesh, Director
Operations, Systems and ITfor her immense support and faith in us.

We would also like to thank our project guideMr. PONNAPPA U GBusiness Development
Executive, Mr. NANJAN BIDDAPPA C, Sr. Executive Training &Developmentand Mr.
DARSHAN,NPI Sr. Engineer who have been very helpful in the completion of this project.

We express our thankfulness to all the Department Heads and all the operators on the
shop floor for their constant help in lot many ways during the training process.

We sincerely express our gratitude to our lecturers for their valuable guidance and
intellectual suggestions.

2
ABSTRACT

This report is a detailed summary of the processes that we have learnt at the KAYNES
TECHNOLOGY during our internship. Mainly the processes here include Printed Circuit
Board assembly and full box build. Also, this report gives detailed information about our
learning, understanding and conceptualization of various processes carried out at each
department in the facility.

We also carried out shop floor visits and contributed towards process improvement
activities.

3
TABLE OF CONTENT

Sl No. Contents Page No.

1. About the Company 5


2. Orientation Program 11
3. Shop floor visit 16
4. Gemba Walk 17
5. Overall Process Flow 22
6. Process Improvement 23
7. Suggestions 28
8. Daily Routine 29
9. Experience 30
10. Gratitude 31

4
1. ABOUT THE COMPANY

Fig 1.1 Picture of shop floor at Kaynes Technology

Kaynes Technology India Private Ltd, Mysore, India is a leading domestic player in the
Electronics System & Design Manufacturing Services Space with Global foot print. Apart from
its mother plant and additional manufacturing facility at Mysore it has five manufacturing plants
at Bangalore, Chennai, Manesar, Parwanoo, and Selaqui.

Apart from products required for various industry segments Kaynes undertakes conceptual
design, manufacture and testing of high reliability PCBAs, Box Build, Products and Systems
Integration Services, Military Wire/Cable Harness for Defense and Aerospace Electronics and all
other segments of Industry.

The Services offered by Kaynes mainly include Systems Design & Engineering, Equipment
Installation and Commissioning including Support for On Board Systems, Overhauling and
Maintenance of Electronic and Electrical Equipment’s, Component level Electronic Card Repair
and Re-Engineering/ Obsolescence Management, PLC Programming and System
Commissioning and Systems Integration Activities.

Kaynes Technology is an ISO 9001/14001/18001 BVCI Certified Company making it one of the
unique and leading EMS players in the niche business of Professional Electronics with an

5
integrated Management System in place. One of the rare companies in India to have undertaken
this initiative and certified successfully.

1.1. Location

Fig 1.2.Locationof Kaynes Technology

1.2. Vision

6
Fig 1.3.Visionof Kaynes Technology

1.3. Mission

Kaynes is committed to provide best-in-class Electronics Manufacturing Services, to Customers


globally, in the areas of Mobility, Industrial, Healthcare, Defense and Communication through
highly skilled and innovative people by adapting contemporary technologies and processes; thus,
creating a healthy environment and performance culture to delight all Interested Parties.

1.4. Value Systems

 To maintain basic discipline and integrity, at all levels at all times.


 To respect individual skills and expertise independent of positions.
 To value customers’ and suppliers’ feedback positively to leverage for all improvements

1.5. Capabilities

 Kaynes Technical team has the understanding of various Hardware and Software
platforms available across the industry along with Application specific requirements
 Kaynes has carried out more than 40 Technology Transfers globally into India

7
 Kaynes has separate Technical Teams for Electronics, Mechanical, Manufacturing
Infrastructure and Manufacturing Process at all Stages
 Kaynes has the Technical competence to Design and develop,Jigs,Fixtures, Test benches
and Simulators for Manufacturing and Testing Processes
 Kaynes has the competence for Building Custom Functional Simulators and Testers to
meet the needs of Product Qualification and Validation.

1.6. Exclusive RoHS/ GREEN Manufacturing

KAYNES has set up an exclusive “Lead free” manufacturing line for PCB assemblies, with the
expertise on RoHS compliant products manufacturing for over a year, have established the skill
sets/trained manpower and infrastructure to produce highly effective RoHS compliant products.
They have built up expertise beyond, to supply mechanical parts, finishes, transformers, cable
sets, bare boards, heat sink parts, consumables, “Green dot” packaging and even labelling of
products which are RoHs compliant.

1.7. Sector Served

1.7.1. Defence & Aerospace


Kaynes Technology has been in the Defence & Aerospace segment since last 8 years. It is the
“Most Preferred Supplier” to Bharath Electronics Ltd (BEL) one of the “NAVARATHNA
COMPANIES” of India. Kaynes Technology is an approved supplier of SMT process for ISRO.

1.7.2. Railways and other Transportation


Kaynes has been manufacturing for most of the OEMs in the Railway & Metro Signalling since
2002. It first started its association with Union Switch & Signal inc a USA company for whom it
started manufacturing all interlocking systems for the Global market.

1.7.3. Health Care


Kaynes has been in the medical segment since 1995 thru manufacturing of Patient Monitoring
systems for a marquee OEM. Kaynes is manufacturing complex diagnostic & lab testing
equipment’s for both domestic and exports market.

1.7.4. Automotive

8
Kaynes being an EMS company is a tier 2 supplier to the well-known OEMs like Honda,
Maruthi, Yamaha etc. It is having a Strategic partnership with a leading Cluster Manufacturer
based overseas and thru this company is supplying to most of the OEMs in India as well as for
exports.

1.7.5. IT & Telecom


Kaynes has been manufacturing PCBAs for Printer companies since last 12 years. It is an
approved Independent Hardware Vendor for a fortune 500 company in the Information
Technology segment.

1.7.6. Power & Energy & Industrial Automation & Controls


Kaynes has been in this segment since its inception. It was certified for ISO 9000 way back in
1995 itself. All facilities of Kaynes Technology are certified for ISO 9001.

1.8. Certification and Credits


 ISO 9001, ISO 14001, OHSAS 18001, IATF 16949, EN/AS 9100, ISO/TS 22163, ISO
13485, ANSI S20.20, IEC 61340-5-1 – certified
 C-DOT approved for SMD manufacturing
 Self-certified by two leading Indian companies
 Audited and approved by experts from the USA

1.9. Departments

1.9.1. Customer Related Process


These requirements apply at all stages of the sales process e.g. enquiry and quotation,
order receipt, order processing and order amendment.

1.9.2. New Product Development


It is the process of bringing a new product to the marketplace.Business may need to
engage in this process due to changes in consumer preferences, increasing competition
and advances in technology or to capitalize on a new opportunity.

1.9.3. Supplier Management Process


The supplier management process is the set of activities used by an organization to
qualify, segment, monitor, and manage its third-party suppliers.

9
1.9.4. Inventory Management Process
Inventory Management refers to the process of supervising and controlling the stock
items for a company. The inventory management ensures that the company always has
the needed materials and products on hand while keeping the cost as low as possible.

1.9.5. Product Realization Process


Product realization process combines market requirements, technological capabilities,
and resources to define new product designs and the requisite manufacturing and field
support processes.

1.9.6. Quality Related Process


Collection of business processes focused on consistently meeting customer
requirements and enhancing their satisfaction. 

1.9.7. Resource Management Process


Resource management is the efficient and effective development of an organization's
resources when they are needed. Such resources may include financial resources,
inventory, human skills, production resources, or information technology (IT) and
natural resources.

1.9.8. Management Process


Management process is a process of setting goals, planning and/or controlling the
organizing and leading the execution of any type of activity.

1.9.9. Environment and Health Safety


Environment (E), health (H) and safety (S) (together EHS) is a discipline that studies
and implements practical aspects of environmental protection and safety at work. In
simple terms it is what organizations must do to make sure that their activities do not
cause harm to anyone.

1.9.10. Accounts Process


The accounting process is a series of activities that begins with transaction.

10
2. ORIENTATION PROGRAM

Under orientation program we had an exposure about the following processes which KAYNES
TECHNOLOGY follows,

2.1.Process distribution in the shop floor:


1) Production of PCBs-SMT
2) Production of PCBs-Through hole
3) Clearance
4) Full assembly
5) Packaging and delivery

2.2.Process design:
1) Study customer drawings and specifications
2) CRP receipt
3) Project tracker updation

11
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4) Inward of customer documents
5) Review Customer Input Risk Analysis
6) Conduct Customer Focus Team meeting
7) BOM Analysis
8) Identification of re-finishing items
9) Prepare materials lists
10) Prepare IQC inspection plan
11) Process approval
12) Production planning

2.3.ROHS & NON-ROHS:RoHS compliant means that the component does not contain six


hazardous substances: lead, mercury, cadmium, hexavalent chromium, PBB, &
PBDE.NON-ROHS is the one which contains these hazardous substances.

2.4.Surface Mount Technology (SMT):

Fig.3.1. Flow diagram of SMT


12
1) Stencil inspection: Stencil is used to provide fixed position for solder paste printing.
It’s produced according to the designed positions of solder pads on PCB.

2) Paste management:Solder paste (or solder cream) is a material used in the


manufacture of printed circuit boards to connect surface mount components to pads on
the board. It is also possible to solder through hole pin in paste components by printing
solder paste in/over the holes. Storage and protection of paste: checking of the tags i.e.,
limited shelf life tag, moisture sensitive device tag.

3) PCB bare board cleaning

4) Laser marking

5) Screen printing: The art of screen-printing has long been a mainstay in PCB production,
used in many processes from applying etch and plating resists over the copper surface,
through to the application of solder and peelable resists.

6) 3D Solder Paste Inspection: The height and thickness of PCB’S are checked.

7) Pick and place machine: Pick-and-place machines or P&Ps, are robotic machines which


are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB). They
are used for high speed, high precision placing of broad range of electronic components,
like capacitors, resistors, integrated circuits onto the PCBs which are in turn used
in computers, consumer electronics as well as industrial, medical, automotive, military
and telecommunications equipment.

8) Reflow: Soldering oven

1. Pre-heat zone

2. Soak zone

3. Reflow zone

4. Cooling zone
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9) 3D Automatic Optical Instrument: Here we check for solder ability through image
comparison.

10) x- Ray: This machine is used to check if there is any short or contact between the solder
for bottom termination lead.

11)Cleaning of Stencil: Clean the boards after soldering, and check if there’s any flaws.
Rework or repair the defects and store the products.

2.5.Through hole Process

Fig.3.2. Flow diagram of Through hole process

1) Forming: cutting, trimming and bending of electronics components.

2) Hardware Fixing: Heat sink assembly and the adhesive used is anabond.

3) Masking: giving protective layer by Kapton tape.

4) Stuffing: By referring CAD placing the components on the board.

 Mass assembly

 Line assembly
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a 5) Line Quality Control: Supervisor checks for the quality.

6) Wave Soldering

7) Conformal Coating: Is done to enhance the life and to reduce corrosion.

2.6.Clearance Line

Fig.3.3. Flow diagram of Clearance Line

15
3. SHOP FLOOR VISIT

In order to understand the process flow at Kaynes, we started with the gate entry process.
The succeeding process being GRN (Goods Received Note).

We learnt the types of Material Purchase namely – DTA (Domestic Tariff Area) and EHTP
(Electro Hardware Techno Park) and types of Material Received namely – RMI (Raw
Material Import) and RML (Raw Material Local) which was followed by IQC (Inward
Quality Control).

The General Inspection Plan was being followed for the Standard Parts and Specific
Inspection Plan for the customary parts. The parts are checked for RoHS (Restriction of
Hazardous Substances), MSD (Moisture Sensitive device), LSL (Limited Shelf Life), COC
(Certificate of conformance), batch code, date code and criticality.

Non-Conforming parts are sent to Quarantine Area where one of Six Disposal action are
carried out.

Learning the process at stores we visited SMT-2 (Surface Mount Technology), a fully
automated shop floor.

Followed by a visit to Through Hole assembly line where we had hands on experience on
forming, stuffing and masking processes and the next process being Non-RoHS Wave
Soldering based on customer demand.

In the same shop floor we have the Clearance lines named Sabarmati, Brahmaputra and
Sutlej, where process like coating, lead cutting, depanelizationof boards followed by touch up,

16
soldering and inspection.

The next shop floor being the Yamuna assembly line where in there is a completely
dedicated RoHS Wave Soldering and related clearance and Outward Quality Control.

The next shop floor being Mahanadi, completely dedicated for Railways. The processes
consisting of Clearance, touch-up, coating, mechanicalassembly, testing and outgoing quality
control lastly packing.

4. GEMBA WALK
4.1. Purchasing department
We conducted a Gemba at the purchasing department to know about supplier quality
management where we learnt about the selection, evaluation and revaluation of
suppliers.

Different procedures were followed for standard and custom-builtparts. The metrics
considered for standard part were lead time, cost,MOQ (Minimum Order Quantity), SPQ
(Standard Packing Quantity), payment terms etc whereas for custom built part quality
was an additional metric.

We also learnt how they deal with defectives,NC report and SCAR.

4.2. Customer related process


We learnt about lead generation, enquiry handling and order handling. The different
Sources of lead are exhibition, cold calling, supplier reference, customer reference, etc.
Details related to company, contact person, contact details, scope, etc. are entered into
ERP- lead register. A Study on risk and costing details are entered into ERP-enquiry
register. Under order handling, orders are validated with respect to quotation. We also
studied the various methods of handling customer complaints.

17
4.3.Quality department- CAPA
We conducted a Gemba at the quality department to understand about corrective action
and preventive action (CAPA). A methodology called 8D is being followed-

[1] Create a team

[2] Description of problem

[3] Implement containment action

[4] Root cause analysis

[5] Corrective action

[6] Implementation

[7] Preventive action

[8] Approval and closure

The different containment actions are as follows:

[1] Change the existing production review no.

[2] Correct product revision in invoice.

[3] Correct the product revision in certification of conformity (COC) and send
updated COC to customer.

4.4.Maintenance department
A Gemba on maintenance department was conducted with a view to understand the
various maintenance that is being carried out.

4.4.1.Types of maintenance:
 Preventive maintenance

This also called as timely maintenance is carried on a daily, weekly, monthly basis.
The daily and weekly maintenance is done by the workers following a methodology
called CLIT- Cleaning, Lubrication, Inspection and Tightening. The monthly
maintenance is taken care by the maintenance department.

18
 Breakdown maintenance
This maintenance is carried out when machine breaks down. The maintenance
department takes immediate action to fix the problem and simultaneously route
cause analysis using 7QC tools is being done.

 Predictive maintenance
This is also called as condition-based maintenance. Here, the condition of the
machine is studied over time and the breakdown is predicted so that maintenance
can be done much in advance and extends the machine life.

 Spare part management


Spare parts management is the main component of a complete strategic service
management process that companies use to ensure that right spare part and
resources are at the right place (where the broken part is) at the right time.

We learnt about different measures of reliability such as Mean Time


BetweenFailures (MTBF) and Mean Time to Failure (MTTF) and the measure of
maintenance being Mean Time toRepair (MTTR). The maintenance department
plays a vital role in asset management where they provide valuable suggestions
regarding purchasing decisions.

4.5. Quality department- Auditing


We learnt about the different types of internal audit namely:

[1] Patrol inspection

[2] Electrostatic discharge (ESD) audit

[3] Limited shelf life (LSL) audit

[4] Moisture sensitive device (MSD) audit

[5] Luminous audit

[6] Process audit

4.5.1. Two types of certification audit are as follows:


19
[1] Recertification audit.

[2] Surveillance audit

We learnt about the audit procedure and the implication when a non conformity is
found.

4.6.Shop floor
A careful study at the shop floor revealed the inefficiencies that reduce process
yield. There were a number of delays both major and minor ones. The major delay
was a result of material shortage and testing delays whereas minor delay was due to
interruptions. While the major delays impacted the process significantly, the minor
ones which looked insignificant became a matter of concern when the resulting
incremental sum was calculated.

Due to material shortage, the process had to be temporarily stopped. Also, few
workers in the line were involved in the pending assembly operations which
affected the ongoing line.

14 120

12
100

10
80

8
60 duration(days)
6 Cumulative percentage

40
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2

0 0

Fig.4.1. Pareto Chart

(Graph represents the likely causes of inefficiencies in the shop floor)

20
4.7.NPD department
Planning Phase of a Project

1. Customer Requirement Plan (commercial Dept)

2. Engineering Team (Gets the Customer Document)

3. Advanced Product Quality Planning (APQP)

 Product name

 Product type

 Old or new

 Activities needed to produce

 Process Scheduling

4. Risk an Opportunity Analysis

5. Input Finalization (Determining means of gathering raw materials, local


market,suppliers, authorized subcontractors)

6. Drawing Preparation (size parameters – panel and cards)

7. Process design

 Process Flow Diagram

 Process Flow Chart

8. Part Development with Suppliers

9. First Article Preparation

10. Escorting Pilot Lots (design errors are rectified)

11. Quality Sign Office

21
5. OVERALL PROCESS FLOW

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Fig.5.1. Flow diagram of overall process

PROCESS IMPROVEMENT
23
Study 1
Problem statement:
A study on Brahmaputra clearance line on Kone oscillator switch was conducted on 26 th
July to eliminate the inefficiencies that affect productivity.

Observation:

Observation Cause

About 20s lost in Interruption in work (touch up on


the first operation defective pieces)

No continuous flow Fourth workerinvolved in other work

Lot of WIP Due to delays in preceding process

Analysis:

24
Fig.6.1. Value stream map of Brahmaputra clearance line

Conclusion:
 Touch up on defective components to be done later so that the ongoing process is
free from interruptions.

 All workers to be present when the process is going on so that there is continuous
flow.

Study 2
25
Problem statement:
A study on through hole process was conducted on 18thJune to balance the lines.

Observation:

Fig.6.2. Observation of shop floor visit

Conclusion:
The cards which were to be RoHS wave soldered were kept in waiting for 4hrs because
more cards were stuffed and being accumulated.

We infer that a total of non value added time of 4hrs was added to the process.

Study 3
26
Problem statement:
A study on clearance process was conducted on 22nd June to balance the lines.

Fig.6.3. Identification of bottleneck

Conclusion:
We observe that a level 2 worker was given a task to read the card number which was
six digits long and to note it done. This task should be replaced by the use of bar-coded
sticker in the 1st stage making the accounting task more efficient.

Also, a level 1 worker was given a task to attach stickers which was a not so easier job
and hence the trainer should have been given the task to depanelizing the cards which is
comparatively easier.

Combined Conclusion

27
 The above slides depict the time study of workers in each assembly line and their
various processes carried out

 From the study we conclude that the worker taking the longest duration is a bottleneck
resulting in imbalanced flow.

 This can be simplified by combining operations among workers

 During the planning phase a point should be noted that the operations performed is such
that their same time taken by each worker.

Worker 1 Worker 2 Worker 3 Worker 4

(1 min) (1 min) (1 min) (1 min)


Fig.6.3. Proposed template for production levelling

Study 4
Problem statement:
28
Preparing a template for bottle neck analysis in the assembly line

Fig.6.5. Template on Production Levelling

Conclusion:
By the use of the above template, the work study man is able to identify the worker with the
least output in a fixed time and hence identify the bottleneck

7. SUGGESTIONS
 Waste Disposal – consisting of mainly carton boxes,paper, plastic sticks and reels.

29
 We suggest for Better Implementation of 5S and more space allocation for carton boxes
and stacking them

 Ergonomically designed chairs and work table in through hole assembly line.

 Soldering wire can be placed overhead for easy handling

Fig.6.5. Template on Production Levelling


 Prior job assignment of workers for the next day, so that they are prepared.

 Job rotation needs to be implemented between through hole and clearance assembly
line with proper guidelines.

 Better inventory management

 Operations needs to be strictly time bound.

 Installation of effective fume collectors near Non-RoHS Wave Soldering machine.

 Upgradation of the lift.

 Use of trolleys for material handling between different shop floor.

 Training the employees with Two Hand process

8. DAILY ROUTINE

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Fig.8.1. Flow diagram of daily routine

EXPERIENCE

31
Our two months internship at Kaynes Technology was a period of rich learning. We were
exposed to a wide range of topics which enhanced our knowledge to a great extent. We got an
opportunity to have an exposure to some of latest technologies in industry and could bridge the
gap between classroom teaching and industrial requirements.

The work culture at Kaynes was a very good experience which taught us punctuality,time
management,professionalism etc.The employees were amicable and guided us in all possible
ways.

Every Saturday there was a special assembly which had an invocation song,pledge,story
telling.Onspot quiz etc.A report on kaizen of the week was presented which initiated increase
in productivity.The best report was rewarded which boosted employee morale.

Most of the lean concepts were implemented and 5S was strictly followed in all the shop
floors.

We were served with healthy food and were not allowed to waste.They had a board
mentioning the amount of food wastage which could feed certain number of people.This taught
us the value of food.

Working as a team,we learnt the importance of teamwork and time management.It was an
opportunity to sharpen our skills and discover the best in us.

10. GRATITUDE

32
We express our sincere gratitude towards Kaynes Technology.

Special thanks to Savitha Ma’am, PonnappaSir, Biddappa Sir and Darshan Sir for their

constant support and guidance.

A big thank you to all the shop floor workers and everyone at Kaynes Technology.

33

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