Data Sheet: SAA5244A
Data Sheet: SAA5244A
DATA SHEET
SAA5244A
Integrated VIP and teletext decoder
(IVT1.1)
Product specification March 1992
File under Integrated Circuits, IC02
Philips Semiconductors Product specification
FEATURES
• Complete teletext decoder including page memory in a
single 40-pin DIL package
• Single +5 V power supply
• Digital data slicer and display clock phase-locked loop
reduces peripheral components to a minimum
• Both video and scan related synchronization modes are DESCRIPTION
supported
The Integrated VIP and Teletext (IVT1.1) is a teletext
• On board single page memory including extension
decoder (contained within a single-chip package) for
packets for FASTEXT
decoding 625-line based World System Teletext
• Single page acquisition system transmissions. The teletext decoder hardware is based on
• RGB interface to standard colour decoder ICs, push-pull a reduced function version of the device SAA5246
output drive (IVT1.0).
• Data capture performance similar to SAA5231 (VIP2) The Video Input Processor (VIP) section of the device
uses mixed analog and digital designs for the data slicer
• Simple software control via I2C-bus
and the display clock phase-locked loop functions. As a
• Option for five national languages result the number of external components is greatly
• 32 supplementary characters for on-screen displays reduced and no critical or adjustable components are
required. A single page static RAM is incorporated in the
• Optional storage of packet 24 in the display memory
device thereby giving a genuine single-chip teletext
• Page links in packets 27 and 8/30 are Hamming decoder device.
decoded
• Separate text and video signal quality detectors,
625/525 video status and language version all readable
via I2C-bus
• Automatic ODD/EVEN output control with manual
override
• Control of display PLL free-run and rolling header via
I2C-bus
• VCS to SCS mode for stable 525 line status display
ORDERING INFORMATION
March 1992 2
Philips Semiconductors Product specification
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Philips Semiconductors Product specification
DISPLAY
PAGE
MEMORY
DATA
TELETEXT
SLICER
ACQUISITION
AND
AND
CLOCK
DECODING
REGENERATOR
25
2 SDA
I C-BUS
INTERFACE 24
SCL
DCVBS
1 VDD
5 10
V SS VDD
SAA5244A
ANALOG 14
VSS
TO TIMING 20
DIGITAL CHAIN
CONVERTER
6
REF
2 INPUT DISPLAY
OSCOUT CLOCK
CRYSTAL CLAMP
3 AND SYNC PHASE
OSCILLATOR
OSCIN SEPARATOR LOCKED
LOOP
4 7 9 8 11 13 12
MLA228 - 1
March 1992 4
Philips Semiconductors Product specification
PINNING
March 1992 5
Philips Semiconductors Product specification
handbook, halfpage
VDD 1 40
OSCOUT 2 39
OSCIN 3 38
OSCGND 4 37
VSS 5 36
REF 6 35
BLACK 7 34
CVBS 8 33 i.c.
IREF 9 32
VDD 10 31
SAA5244A
POL 11 30
STTV / LFB 12 29
VCR / FFB 13 28
VSS 14 27
R 15 26
G 16 25 SDA
B 17 24 SCL
RGBREF 18 23 Y
VSS 20 21 COR
MLA035 - 3
March 1992 6
Philips Semiconductors Product specification
41 ODD / EVEN
37 RGBREF
38 BLAN
SDA
39 V SS
40 COR
43 SCL
35 G
34 R
42 Y
36 B
handbook, full pagewidth
index
44
corner
1 33 VSS
7 27 VDD
8 26 IREF
9 25 CVBS
i.c.
10 24 BLACK
11 23 REF
OSCIN 20
OSCGND 21
V SS 22
12
13
14
15
16
17
V DD 18
OSCOUT 19
i.c.
MLA227 - 2
March 1992 7
Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER MIN. MAX. UNIT
VDD supply voltage (all supplies) −0.3 6.5 V
VI input voltage (any input) −0.3 VDD+0.5 V
VO output voltage (any output) −0.3 VDD+0.5 V
IO output current (each output) − ±10 mA
IIOK DC input or output diode current − ±20 mA
Tamb operating ambient temperature range −20 70 °C
Tstg storage temperature range −55 125 °C
Vstat electrostatic handling
human body model (note 1) −2000 2000 V
Note
1. The human body model ESD simulation is equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor;
this produces a single discharge transient. Reference Philips Semiconductors test method UZW-B0/FQ-A302
(compatible with MIL-STD method 3015.7).
Failure Rate
The failure rate at Tamb = 55 °C will be a maximum of 1000 FITS (1 FIT = 1 x 10−9 failures per hour).
March 1992 8
Philips Semiconductors Product specification
CHARACTERISTICS
VDD = 5 V ± 10%; Tamb = −20 to +70 °C, unless otherwise specified
March 1992 9
Philips Semiconductors Product specification
March 1992 10
Philips Semiconductors Product specification
March 1992 11
Philips Semiconductors Product specification
March 1992 12
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March 1992
Philips Semiconductors
(IVT1.1)
Integrated VIP and teletext decoder
0 4.66 64 µs
LSP
(Line Sync Pulse)
0 2.33 32 34.33 64 µs
EP
(Equalizing Pulse)
0 27.33 32 59.33 64 µs
BP
(Broad Pulse)
[1]
13
TCS interlaced
309 310 311 312 313 314 (1) 315 (2) 316 (3) 317 (4) 318 (5) 319 (6) 320 (7)
TCS interlaced
TCS non-interlaced
MLA037 - 2
[2]
handbook, full pagewidth
Product specification
SAA5244A
[1] LSP, EP and BP are combined to give TCS as shown below. All timings measured from falling edge of LSP.
[2] Line numbers placed in the middle of the line. Equivalent count numbers in brackets.
LSP
handbook, full pagewidth
(TCS)
0 4.66 64 µs
40 µs
R, G, B, Y
display period
(1)
R, G, B, Y
(1) display period
Fig.5 Display output timing (a) line rate (b) field rate.
SDA
t BUF t LOW tf
SCL
t HD;STA t HIGH
tr
t HD;DAT
t SU;DAT
SDA
MBC764
t SU;STA
t SU;STO
March 1992 14
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March 1992
Philips Semiconductors
(IVT1.1)
Integrated VIP and teletext decoder
FIRST FIELD START (EVEN)
TCS interlaced
ODD/EVEN output
(normal sync mode) 2 µs
ODD/EVEN output
(normal sync mode 48 µs
when VCS to SCS
mode active)
ODD/EVEN output
(slave sync mode) 31 µs
15
309 310 311 312 313 314 (1) 315 (2) 316 (3) 317 (4) 318 (5) 319 (6) 320 (7)
TCS interlaced
ODD/EVEN output 2 µs
(normal sync mode)
ODD/EVEN output
(normal sync mode 16 µs
when VCS to SCS
mode active)
Product specification
SAA5244A
ODD/EVEN output 31 µs
(slave sync mode)
MBA073 - 4
Line numbers placed in the middle of the line. Equivalent count numbers in brackets.
APPLICATION INFORMATION
39
OSCOUT
2 38
C3 C2 C1
C4 L1
37
1 nF 4.7 µH 15 p 10 p 100 nF OSCIN
3
36
R1
3.3
kΩ OSCGND 35
4
X1
27 MHz, 3rd Overtone VSS 34
5
100 nF REF+
VDD 6 33 i.c.
C7 100 nF
VSS VSS 7 32
BLACK
CVBS 8
C8 VSS 31
100 100 nF
nF 9 SAA5244A
R17 27 kΩ IREF 30
V DD 10
POL 29
11
STTV / LFB 12 28
V DDD
VCR / FFB 13 27
LK2 LK1
VSS 14 25
R 15
(1) R9 25 SDA
G 16
R10 24 SCL
B 17
(1) 23 Y
RGBREF
VSS 18
(1)
BLAN 19 22 ODD / EVEN
VSS 20 21 COR
2.7 k Ω
2.7 kΩ
MLA054 - 5
VDD
VDD
March 1992 16
Philips Semiconductors Product specification
fixed character
written by IVT hardware
alphanumerics white for normal 8 characters
7 characters alphanumerics green when looking always rolling
for status for display page (time)
ROW
7 1 24 8 0
1
24 characters from page header 2
rolling when display page looked for 3
4
21
PACKET X / 22 22
PACKET X / 23 23
PACKET X / 24 STORED HERE IF R0D7 = 1 24
10 14 25
10 bytes for 14 bytes
received free for use
page information by microcontroller MBA274
Row 0:
Row 0 is for the page header. The first seven columns (0
to 6) are free for status messages. The eighth is an
alphanumeric white or green control character, written ROW
automatically by SAA5244A to give a green rolling header
PACKET X / 24 if R0D7 = 0 0
when a page is being looked for. The last eight characters
are for rolling time. PACKET X / 27 / 0 1
PACKETS 8 / 30 / 0 to 15 2
Row 25:
MBA275 - 2
The first 10 bytes of row 25 contain control data relating to
the received page as shown in Table 1. The remaining 14
bytes are free for use by the microcomputer.
Fig.10 Organization of the extension memory.
March 1992 17
Philips Semiconductors Product specification
Column 0 1 2 3 4 5 6 7 8 9
Where:
Page number
MAG magazine
PU page units
PT page tens
PBLF page being looked for
FOUND LOW for page has been found
HAM.ER Hamming error in corresponding byte
Page sub-code
MU minutes units
MT minutes tens
HU hours units
HT hours tens
C4-C14 transmitted control bits.
March 1992 18
Philips Semiconductors Product specification
Register maps
SAA5244A mode registers R0 to R11 are shown in Table 2. R0 to R10 are WRITE only; R11 is READ/WRITE.
Register map (R3), for page requests, is shown in detail in Table 3.
Notes to Table 2
1. ‘− ‘ indicates these bits are inactive and must be written to logic 0 for future compatibility.
2. All bits in registers R0 to R10 are cleared to logic 0 on power-up except bits D0 to D1 of registers R1, R5 and R6
which are set to logic 1.
3. All memory is cleared to ‘space’ (00100000) on power-up, except row 0 column 7 chapter 0, which is ‘alpha’ white
(00000111) as the acquisition circuit is enabled but the page is on hold.
4. TB must be set to logic 0 for normal operation.
5. The I2C slave address is 0010001
March 1992 19
Philips Semiconductors Product specification
REGISTER DESCRIPTION
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
START
PRD4 PRD3 PRD2 PRD1 PRD0
COLUMN
0 Do care
Magazine HOLD MAG2 MAG1 MAG0
1 Do care
Page tens PT3 PT2 PT1 PT0
2 Do care
Page units PU3 PU2 PU1 PU0
3 Do care
Hours tens X X HT1 HT0
4 Do care
Hours units HU3 HU2 HU1 HU0
5 Do care
Minutes tens X MT2 MT1 MT0
6 Do care
Minutes units MU3 MU2 MU1 MU0
Notes to Table 3
1. Abbreviations are as for Table 1 except for DO CARE bits.
2. When the DO CARE bit is set to logic 1 this means the corresponding digit is to be taken into account for page
requests. If the DO CARE bit is set to logic 0 the digit is ignored. This allows, for example, ‘normal’ or ‘timed page’
selection.
3. If HOLD is set LOW, the page is held and not updated.
4. Columns auto-increment on successive I2C-bus transmission bytes.
Table 4 Interlace/non-interlace 312/313 line control (T0 and T1)
T1 T0 RESULT
0 0 interlaced 312.5/312.5 lines
0 1 non-interlaced 312/313 lines (note 1)
1 0 non-interlaced 312/312 lines (note 1)
1 1 scan-locked
Note to Table 4
1. Reverts to interlaced mode if a newsflash or subtitle is being displayed.
March 1992 22
Philips Semiconductors Product specification
1 SAA5244A
CRYSTAL
OSCILLATOR
1 nF 4.7 µH 15 p 10 p 100 nF
3
3.3 kΩ 27 MHz
MLA036 - 5
CLOCK SYSTEMS
Crystal oscillator
The crystal is a conventional 2-pin design operating at
27 MHz. It is capable of oscillating with both fundamental
and third overtone mode crystals. External components
should be used to suppress the fundamental output of
the third overtone, as shown in Fig.11. The crystal
characteristics are given in Table 5.
March 1992 23
Philips Semiconductors Product specification
MLA663
handbook, full pagewidth
March 1992 24
Philips Semiconductors Product specification
B b7
0 0 0 0 0 0 1 1 1 1
I
b6
T 0 0 1 1 1 1 0 0 1 1 AVAILABLE AS
S b5 NATIONAL OPTIONS
0 1 0 0 1 1 0 1 0 1
ONLY
b4 b3 b2 b1
column
r 0 1 2 2a 3 3a 4 4b 5 5b 6 6a 7 7a
o
w alpha -
graphics
0 0 0 0 0 numerics
black
black
alpha -
graphics
0 0 0 1 1 numerics
red
red
alpha - graphics
0 0 1 0 2 numerics green
green
alpha - graphics
0 0 1 1 3 numerics yellow
yellow
alpha -
numerics graphics
0 1 0 0 4
blue blue
alpha -
graphics
0 1 0 1 5 numerics
magenta
magenta
alpha -
graphics
0 1 1 0 6 numerics
cyan
cyan
alpha - graphics
0 1 1 1 7 numerics white
white
conceal
1 0 0 0 8 flash display
1 0 0 1 9 steady contiguous
graphics
separated
1 0 1 0 10 end box
graphics
normal black
1 1 0 0 12 back -
hight
ground
new
1 1 0 1 double back -
13
height ground
hold
1 1 1 0 14 SO
graphics
book, full pagewidth
release
1 1 1 1 15 SI
graphics
MBA266 - 1
Notes to Table 6 - For character version number (01000) see Register 11B
1. * These control characters are reserved for compatibility with other data codes.
2. ** These control characters are presumed before each row begins.
3. + Columns 4b and 5b can only be accessed when supplementary character bits are set (see Registers 9 and 10).
4. Control characters shown in columns 0 and 1 are normally displayed as spaces.
5. Characters may be referred to by column and row, For example 2/5 refers to %.
March 1992 25
Philips Semiconductors Product specification
March 1992 26
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March 1992
Table 7
Philips Semiconductors
(IVT1.1)
Integrated VIP and teletext decoder
SAA5244A Basic character matrix
2/0 2/8 3/0 3/8 4/0 4/8 5/0 5/8 6/0 6/8 7/0 7/8
NC NC
2/1 2/9 3/1 3/9 4/1 4/9 5/1 5/9 6/1 6/9 7/1 7/9
2/2 2/10 3/2 3/10 4/2 4/10 5/2 5/10 6/2 6/10 7/2 7/10
2/3 2/11 3/3 3/11 4/3 4/11 5/3 5/11 6/3 6/11 7/3 7/11
NC NC NC
27
2/4 2/12 3/4 3/12 4/4 4/12 5/4 5/12 6/4 6/12 7/4 7/12
NC NC NC
2/5 2/13 3/5 3/13 4/5 4/13 5/5 5/13 6/5 6/13 7/5 7/13
NC NC
2/6 2/14 3/6 3/14 4/6 4/14 5/6 5/14 6/6 7/6 7/14
NC NC
2/7 2/15 3/7 3/15 4/7 4/15 5/7 5/15 6/7 6/15 7/7 7/15
Product specification
NC
SAA5244A
handbook, full pagewidth
MLA630
ENGLISH 0 0 0
GERMAN 0 0 1
SWEDISH 0 1 0
ITALIAN 0 1 1
FRENCH 1 0 0
MLA664
(1) PHCB are the Page Header Control Bits. Other combinations default to English.
March 1992 28
Philips Semiconductors Product specification
PACKAGE OUTLINES
D ME
A2 A
L A1
c
Z e w M
b1
(e 1)
b
40 21 MH
pin 1 index
1 20
0 5 10 mm
scale
UNIT
A A1 A2
b b1 c D
(1)
E
(1)
e e1 L ME MH w Z (1)
max. min. max. max.
1.70 0.53 0.36 52.50 14.1 3.60 15.80 17.42
mm 4.7 0.51 4.0 2.54 15.24 0.254 2.25
1.14 0.38 0.23 51.50 13.7 3.05 15.24 15.90
0.067 0.021 0.014 2.067 0.56 0.14 0.62 0.69
inches 0.19 0.020 0.16 0.10 0.60 0.01 0.089
0.045 0.015 0.009 2.028 0.54 0.12 0.60 0.63
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
92-11-17
SOT129-1 051G08 MO-015AJ
95-01-14
March 1992 29
Philips Semiconductors Product specification
QFP44: plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm SOT205-1
33 23 A
34 22 ZE
e
E HE A2
A (A 3)
A1
wM
θ
bp Lp
pin 1 index L
44 12
detail X
1 11
ZD v M A
e wM
bp
D B
HD v M B
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
95-02-04
SOT205-1 133E01A
97-08-01
March 1992 30
Philips Semiconductors Product specification
Apply a low voltage soldering iron (less than 24 V) to the During placement and before soldering, the package must
lead(s) of the package, below the seating plane or not be fixed with a droplet of adhesive. The adhesive can be
more than 2 mm above it. If the temperature of the applied by screen printing, pin transfer or syringe
soldering iron bit is less than 300 °C it may remain in dispensing. The package can be soldered after the
contact for up to 10 seconds. If the bit temperature is adhesive is cured. Maximum permissible solder
between 300 and 400 °C, contact may be up to 5 seconds. temperature is 260 °C, and maximum duration of package
immersion in solder is 10 seconds, if cooled to less than
QFP 150 °C within 6 seconds. Typical dwell time is 4 seconds
at 250 °C.
REFLOW SOLDERING
A mildly-activated flux will eliminate the need for removal
Reflow soldering techniques are suitable for all QFP of corrosive residues in most applications.
packages.
The choice of heating method may be influenced by larger REPAIRING SOLDERED JOINTS
plastic QFP packages (44 leads, or more). If infrared or Fix the component by first soldering two diagonally-
vapour phase heating is used and the large packages are opposite end leads. Use only a low voltage soldering iron
not absolutely dry (less than 0.1% moisture content by (less than 24 V) applied to the flat part of the lead. Contact
weight), vaporization of the small amount of moisture in time must be limited to 10 seconds at up to 300 °C. When
them can cause cracking of the plastic body. For more using a dedicated tool, all other leads can be soldered in
information, refer to the Drypack chapter in our “Quality one operation within 2 to 5 seconds between
Reference Handbook” (order code 9397 750 00192). 270 and 320 °C.
March 1992 31
Philips Semiconductors Product specification
DEFINITIONS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
March 1992 32