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THE TECHNICAL UNIVERSITY OF KENYA
BOND
GOVERNING STUDENTS ADMISSION, RE-ADMISSION INTO, AND STUDENTSHIP
UNDER THE MODULE I AND II PROGRAMMES
1) THIS BOND is made by the University Council and Senate (hereinafter referred to as 'The
Enacting Authority') and forms part of the binding terms and conditions upon which anyone
may be admitted, re-admitted into, or permitted to remain in studentship in the University
Programmes.
2) THIS BOND once executed shall remain in force in its present form for all students
governing their admission, re-admission and studentship throughout their tenure of
studentship, subject to such special decision as the Enacting Authority may its sole
discretion take in relation to particular cases, until such time as the Enacting Authority
may vary the bond's content, in such manner as the Enacting Authority may deem fit.
3) THIS BOND shall bind jointly and severally all persons being admitted or re-admitted
into, or allowed to remain in studentship in the University, and their
Parents/Guardians/Sponsors and the Enacting Authority and an appropriate
undertaking in the form prescribed in THIS BOND shall be made by both the person
admitted into, or allowed to remain in studentship in the University, and the
Parent/Guardian/Sponsor of the person in the presence of a Judge, a Magistrate or a
Commissioner of Oaths.
4) THIS BOND shall bind the Parents/Guardians/Sponsors of all students being admitted
or re-admitted into or allowed to remain in studentship in the University to pay to the
University at the beginning of each Semester/Term, or at such other time as the
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University Senate may prescribe and communicate to the persons in question, a fees of -
----------- per course unit/semester/term and other charges as indicated in the fees
schedule, or such other fees as the University Senate may determine from time to time.
5) By THIS BOND the Parents/Guardians/Sponsors undertakes to pay the required fee, and
the applicant undertakes to ensure the fee is duly paid and delivered timeously as
required in the terms of Paragraph 4 hereof.
THIS BOND IS EXECUTED at --------------------------------------------------------------------------------------
This ----------------------------------------------- day of ---------------------------------------- 20---------------------
I. SIGNATURE OF PARENT/GUARDIAN/SPONSORED)
)
) -----------------------------------------------
)
BEFORE ME:
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- (Judge, Magistrate or Commissioner for Oaths)
II. NAME OF APPLICANT IN FULL ____________________________________________
SIGNATURE OF APPLICANT_____________________________________________
SCHOOL________________________________________________________________
COURSE________________________________________________________________
REGISTRATION NUMBER_______________________________________________
BEFORE ME:
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(Judge, Magistrate or Commissioner of Oaths)
(Signature and Stamp)
III. -------------------------------------------------------------------
ACADEMIC REGISTRAR
(On behalf of the Enacting Authority)
