Ultra Low Dropout 1.5A Linear Regulator: General Description Features
Ultra Low Dropout 1.5A Linear Regulator: General Description Features
Ordering Information
RT9183 - 1 2 3 1 2 3
Package Type
G : SOT-223 VIN GND VOUT GND VOUT VIN
GF : SOT-223 (F-Type) (TAB) (TAB)
COUT
Enable EN GND ADJ
C CIN 10uF
0.1uF 10uF
VIN
Current Limit
Sensor
+
Error
-
Amplifier
0.8V
-
Reference
+
VOUT
Shutdown Thermal
EN
Logic Shutdown
ADJ
-
+
100mV
Output Mode
GND
Comparator
Electrical Characteristics
(VIN = VOUT + 0.7V, CIN =COUT = 10μF (Ceramic), TA = 25°C unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Units
To be continued
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These
are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated
in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions
for extended periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.
Note 5. Regulation is measured at constant junction temperature by using a 20ms current pulse. Devices are tested for
load regulation in the load range from 10mA to 1.5A.
Note 6. Quiescent, or ground current, is the difference between input and output currents. It is defined by IQ = IIN - IOUT
under no load condition (IOUT = 0mA). The total current drawn from the supply is the sum of the load current plus
the ground pin current.
Note 7. Standby current is the input current drawn by a regulator when the output voltage is disabled by a shutdown
signal (VEN >1.8V ). It is measured with VIN = 5.5V.
Note 8. θJA is measured in natural convection (still air) at TA = 25°C with the component mounted on a low effective
thermal conductivity test board of JEDEC 51-3 thermal measurement standard. And the cooper area of PCB
layout is 4mm x 2.5mm on SOT-223, 14mm x 14mm on TO-263 for thermal measurement.
1.85 2.55
Output Voltage (V)
1.75 2.45
RT9183H-18CS RT9183-25CG
1.7 2.4
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)
380 380
360 360
340 340
3.8 3.8
Current Limit (A)
3.6 3.6
3.4 3.4
3.2 3.2
RT9183-25CG RT9183L-33CM5
3 3
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)
Dropout vs.
Dropout Voltage Voltage
Load Current Dropout Voltage
Dropoutvs. Load Current
Voltage
500 500
TJ = 125°C
TJ = 125°C
Dropout Voltage (mV) 1
400 400
200 200
TJ = -40°C TJ = -40°C
100 100
RT9183-25CG RT9183L-33CM5
0 0
0 0.3 0.6 0.9 1.2 1.5 0 0.3 0.6 0.9 1.2 1.5
Load Current (A) Load Current (A)
1
Load
Dropout Voltage (mV)
300 0.5
TJ= 25°C
0
200
Output Voltage
Deviation(mV)
20
TJ= -40°C
100 0
-20
RT9183H-18CS
0
0 0.3 0.6 0.9 1.2 1.5
Time (100us/Div)
Load Current (A)
2 20
Current (A)
Load
1 0
50
Load Current (mA)
Output Voltage
Deviation(mV)
0 500
-50 0
Input Voltage
Deviation(V)
ILOAD = 100mA COUT = 47uF/Low ESR COUT = 47uF/Low ESR, ILOAD = 100mA
Input Voltage
Deviation(V)
5 4
Output Voltage
Deviation(mV)
10
Output Voltage
Deviation(mV)
10 0
0 -10
RT9183-12CGF RT9183H-18CS
1 5
VOUT Off to On 0
0.9
Voltage (V)
2
VOUT On to Off
Output
0.8 1
0
RT9183L-33CM5 RT9183H-18CS
0.7
-50 -25 0 25 50 75 100 125
Time (500us/Div)
Temperature (°C)
0.83
Reference Voltage (V)
0.81
0.79
0.77
RT9183H-CS
0.75
-50 -25 0 25 50 75 100 125
Temperature (°C)
Where T J(MAX) is the maximum operation junction The best way to do this is to layout CIN and COUT near the
temperature 125°C, TA is the ambient temperature and device with short traces to the VIN, VOUT, and ground pins.
the θJA is the junction to ambient thermal resistance. The regulator ground pin should be connected to the
For recommended operating conditions specification of external circuit ground so that the regulator and its
RT9183, where T J(MAX) is the maximum junction capacitors have a“ single point ground” .
temperature of the die (125°C) and TA is the maximum It should be noted that stability problems have been seen
ambient temperature. The junction to ambient thermal in applications where “ vias ” to an internal ground plane
resistance (θJA is layout dependent) for SOT-223 package were used at the ground points of the device and the input
is 115°C/W, SOT-223 package (F-Type) is 135°C/W, and output capacitors. This was caused by varying ground
SOP-8 package is 125°C/W, and TO-263 package is potentials at these nodes resulting from current flowing
45°C/W on standard JEDEC 51-3 thermal test board. through the ground plane. Using a single point ground
The maximum power dissipation depends on operating technique for the regulator and it's capacitors fixed the
ambient temperature for fixed TJ(MAX) and thermal resistance problem. Since high current flows through the traces going
θJA. For RT9183 packages, the Figure 4 of derating curves into VIN and coming from VOUT, Kelvin connect the capacitor
allows the designer to see the effect of rising ambient leads to these pins so there is no voltage drop in series
temperature on the maximum power allowed. with the input and output capacitors.
Optimum performance can only be achieved when the
PCB Layout device is mounted on a PC board according to the diagram
2400 below:
TO-263
Maximum power dissipation (mW)
2000 GND
1600
1200
SOT-223
SOP-8
800
+ ADJ
EN
SOT-223
400
(F-Type)
0 VOUT
0 25 50 75 100 125
(°C)
Ambient temperature (℃)
+
Figure 4
GND VIN
GND
R1
Enable EN ADJ COUT
GND
C CIN 10uF
0.1uF R2
10uF RT
D
D1 H
C B
L
L1
e e
A
A1
b
H
A
J B
C
I
D
C
D U
B
V
E
L1
b1
L2
e b b2
C
D U
B
V
E
L1
L2
e b
b2