GBNA-000032

Ed. 00

SMT-i5210
Service Manual
 SMT-i5210 Service Manual

COPYRIGHT
This manual is proprietary to SAMSUNG Electronics Co., Ltd. and is protected by copyright.
No information contained herein may be copied, translated, transcribed or duplicated for any commercial
purposes or disclosed to the third party in any form without the prior written consent of SAMSUNG Electronics
Co., Ltd.

TRADEMARKS
Product names mentioned in this manual may be trademarks and/or registered trademarks of their respective
companies.

This document has been reproduced by TelephoneSystemsDirect with the kind permission of Samsung.

This manual should be read and used as a guideline for properly installing and operating the product.

This manual may be changed for the system improvement, standardization and other technical reasons without prior
notice.

If you need updated manuals or have any questions concerning the contents of the manuals, contact our Document
Center at the following address or Web site:

Address: Document Center 3rd Floor Jeong-bo-tong-sin-dong. Dong-Suwon P.O. Box 105, 416, Maetan-3dong
Yeongtong-gu, Suwon-si, Gyeonggi-do, Korea 442-600
Homepage: http://www.samsungdocs.com

©2010 SAMSUNG Electronics Co., Ltd. All rights reserved.

 SMT-i5210 Service Manual

INTRODUCTION

Purpose
This manual provides information on the configuration and specifications of the SMT-
i5210, an Internet Protocol (IP) phone and describes how to assemble and disassemble the
product. It also describes the problems encountered when using the product,
troubleshooting methods, hardware block, circuits, etc.

Content and Organization

This manual consists of 5 chapters, 2 annexes, and abbreviations used. The contents of
each chapter are as follow.

CHAPTER 1. Product Description

Describes the configuration, names and functions of parts, and specifications of the SMT-
i5210 IP phone.

CHAPTER 2. Assembly and Disassembly

Illustrates the disassembly diagram and board structure of the SMT-i5210 IP phone, and
describes how to disassemble and assemble the body and handset.

CHAPTER 3. Description of Circuits

Describes the structure and features of each circuit of the SMT-i5210 IP phone.

CHAPTER 4. Check and Diagnosis

Describes what to check to see if the SMT-i5210 IP phone is working normally, and how to
use the diagnosis program.

CHAPTER 5. Troubleshooting
Describes the types of problems which may arise while using the SMT-i5210 IP phone, and
the methods of troubleshooting.

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ANNEX A. Parts List

Provides a list of all the parts of the SMT-i5210 IP phone.

ANNEX B. Parts Layout

Provides the parts layout of the SMT-i5210 IP phone.

ABBREVIATION
Provides explanations on the abbreviations used throughout this manual.

Conventions
The following types of paragraphs contain special information that must be carefully read
and thoroughly understood. Such information may or may not be enclosed in a rectangular
box, separating it from the main text, but is always preceded by an icon and/or a bold title.

WARNING
Provides information or instructions that the reader should follow in order to avoid
personal injury or fatality.

CAUTION
Provides information or instructions that the reader should follow in order to avoid
a service failure or damage to the system.

CHECKPOINT
Provides the operator with checkpoints for stable system operation.

NOTE
Indicates additional information as a reference.

References
SMT-i5210 User Manual
Describes how to use the SMT-i5210 IP phone.

SMT-i5210 Quick Guide

Describes how to use the basic functions of the SMT-i5210 IP phone.

II © SAMSUNG Electronics Co., Ltd.

 SMT-i5210 Service Manual

Revision History
EDITION DATE OF ISSUE REMARKS

00 01. 2010. First Edition

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IV © SAMSUNG Electronics Co., Ltd.

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SAFETY CONCERNS

The purpose of the Safety Concerns section is to ensure the safety of users and prevent
property damage. Please read this document carefully for proper use.

Symbols

Caution
Indication of a general caution

Restriction
Indication for prohibiting an action for a product

Instruction
Indication for commanding a specifically required action

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Warning

WARNING

Disconnect the power cord

When repairing the product, be sure to disconnect the power cord.
If left connected, it may cause fire or electric shock.

Take care after repair

After repairing the product, make sure that there are no foreign metal substances
remaining within the phone. This may cause fire or damage parts.

Take care when applying power

Do not use a damaged power plug, cord, or a loose outlet as this may cause fire
or electric shock.

VI © SAMSUNG Electronics Co., Ltd.

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Caution

CAUTION

Damage to ESD (Electrostatic Sensitive Devices)

When handling boards or parts, take care not to damage them with static
electricity. To prevent this, put on wrist-straps before handling them.

Conductive material
When applying power after separating a board, do not place the board in a
location which contains moisture, metal or any conductive material.

Use of a power adaptor

Be sure to use the adaptor provided with the product to connect the power port of
the phone. Using any other power adaptor may cause critical damage to the
product.

Product assembly
After repairing the product, all connectors and screws should be replaced into
their original locations. In addition, after completing assembly, there not be a gap
between the top and bottom case.

Detachment of the hang-up part of the handset

If you detachment the hang-up part of the handset-where the plunger is
connected-from the front case, the bonded front case will become loose. As a
result of this, do not detach it except in unavoidable circumstances.

Use of standard parts

When repairing the product, be sure to use standard parts. If standard parts are
not used, the product may not work properly.

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TABLE OF CONTENTS

INTRODUCTION I

Purpose ...................................................................................................................................................... I
Content and Organization .......................................................................................................................... I
Conventions............................................................................................................................................... II
References ................................................................................................................................................ II
Revision History ....................................................................................................................................... III

SAFETY CONCERNS V

Symbols .....................................................................................................................................................V
Warning ....................................................................................................................................................VI
Caution.....................................................................................................................................................VII

CHAPTER 1. Product Description 1-1

1.1 The Configuration .................................................................................................................. 1-1

1.1.1 Front of the SMT-i5210 Phone ................................................................................................ 1-1
1.1.2 Back of the SMT-i5210 Phone ................................................................................................ 1-3

1.2 The Specifications ................................................................................................................. 1-4

CHAPTER 2. Assembly and Disassembly 2-1

2.1 The Disassembly Diagram .................................................................................................... 2-1

2.1.1 The Disassembly Diagram of the Body ..................................................................................2-2
2.1.2 The Disassembly Diagram of the Handset .............................................................................2-5

2.2 The Disassembly ................................................................................................................... 2-6

2.2.1 The Disassembly of the Body .................................................................................................2-6
2.2.2 The Disassembly of Handset ................................................................................................2-13

2.3 The Assembly....................................................................................................................... 2-17

CHAPTER 3. Description of Circuits 3-1

3.1 H/W Block Diagram ................................................................................................................ 3-1

3.2 CPU ......................................................................................................................................... 3-2

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3.2.1 Block Diagram of the CPU .......................................................................................................3-2

3.2.2 Mode Selection.........................................................................................................................3-3
3.2.3 Register MAP ...........................................................................................................................3-4
3.2.4 GPIO Allocation ........................................................................................................................3-5

3.3 External Memory..................................................................................................................... 3-6

3.3.1 Serial Flash ...............................................................................................................................3-6
3.3.2 SDRAM .....................................................................................................................................3-7

3.4 Network ................................................................................................................................... 3-8

3.4.1 Main Functions ...................................................................................................................... 3-10

3.5 LCD ........................................................................................................................................ 3-12

3.5.1 Interface with the CPU .......................................................................................................... 3-12
3.5.2 Operation Principles .............................................................................................................. 3-13
3.5.3 Key Functions ........................................................................................................................ 3-13

3.6 LED ........................................................................................................................................ 3-14

3.6.1 LED Operation Method ......................................................................................................... 3-14
3.6.2 LED Color Change ................................................................................................................ 3-14

3.7 Audio ..................................................................................................................................... 3-16

3.7.1 Main Functions ...................................................................................................................... 3-17

3.8 User Interface ....................................................................................................................... 3-18

3.8.1 Keys of the SMT-i5210.......................................................................................................... 3-18
3.8.2 Hook ....................................................................................................................................... 3-19

3.9 The Power ............................................................................................................................. 3-20

3.9.1 Main Functions of PoE .......................................................................................................... 3-20
3.9.2 Ground Related Cautions ..................................................................................................... 3-21

CHAPTER 4. Check and Diagnosis 4-1

4.1 SMT-i5210 Check and Diagnosis ........................................................................................... 4-1

4.1.1 What To Check .........................................................................................................................4-1
4.1.2 Using a Diagnosis Program .....................................................................................................4-2

CHAPTER 5. Troubleshooting 5-1

5.1 When power is not on or reset is not available ................................................................... 5-2

5.2 When the product does not boot .......................................................................................... 5-3

5.3 When the LED is not lit or nothing is displayed on the LCD .............................................. 5-4

5.4 When LAN connection fails ................................................................................................... 5-5

5.5 When dial tone is not heard normally ................................................................................... 5-6

X © SAMSUNG Electronics Co., Ltd.

 SMT-i5210 Service Manual

ANNEX A. Parts List A-1

ANNEX B. Parts Layout B-1

B.1 SMT-i5210 PBA-Front ............................................................................................................ B-1

B.2 SMT-i5210 PBA-Rear.............................................................................................................. B-2

ABBREVIATION I

C ~ P ........................................................................................................................................................... I
S ................................................................................................................................................................. II

LIST OF FIGURES

Figure 1.1 Front of the SMT-i5210 IP phone .......................................................................... 1-1

Figure 1.2 Back of the SMT-i5210 Phone ............................................................................... 1-3

Figure 2.1 Disassembly Diagram of the Body ........................................................................ 2-2

Figure 2.2 Disassembly Diagram of the Handset ................................................................... 2-5
Figure 2.3 Detachment of the cradle ...................................................................................... 2-6
Figure 2.4 Detachment of the Base Plate (1) ......................................................................... 2-7
Figure 2.5 Detachment of front and back sides (2)................................................................. 2-7
Figure 2.6 Detachment of the main PBA (1) ........................................................................... 2-8
Figure 2.7 Detachment of cables............................................................................................ 2-9
Figure 2.8 Detachment of the main PBA (2) ........................................................................... 2-9
Figure 2.9 Detachment of LCD ............................................................................................. 2-10
Figure 2.10 Detachment the PBA ......................................................................................... 2-10
Figure 2.11 Detachment the UC ............................................................................................2-11
Figure 2.12 Detachment of the handset hook........................................................................2-11
Figure 2.13 Detachment of the Front Panel and Buttons ..................................................... 2-12
Figure 2.14 Detachment of the Curl Cord (1) ....................................................................... 2-13
Figure 2.15 Detachment of the Curl Cord (2) ....................................................................... 2-13
Figure 2.16 Detachment of the Upper Cover (1) .................................................................. 2-14
Figure 2.17 Detachment of the Upper Cover (2) .................................................................. 2-14
Figure 2.18 Detachment of the Upper Cover (3) .................................................................. 2-14
Figure 2.19 Detachment of the Upper Cover (4) .................................................................. 2-15
Figure 2.20 Detachment the Weight Bar .............................................................................. 2-15
Figure 2.21 Detachment of the Modular Jack, Mike and Rx-unit (1)..................................... 2-16
Figure 2.22 All Disassembled Components of the Handset ................................................. 2-16

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Figure 3.1 H/W Block Diagram of the SMT-i5210 ................................................................... 3-1

Figure 3.2 Block Diagram of the CPU ..................................................................................... 3-2
Figure 3.3 Serial Flash Memory Block Diagram ...................................................................... 3-6
Figure 3.4 SDRAM Block Diagram .......................................................................................... 3-7
Figure 3.5 Network Block Diagram ......................................................................................... 3-8
Figure 3.6 LCD Interface Block Diagram .............................................................................. 3-12
Figure 3.7 Audio Block Diagram ........................................................................................... 3-16
Figure 3.8 Audio Block Diagram in the CPU ......................................................................... 3-17
Figure 3.9 The SMT-i5210 Front Panel Key Layout .............................................................. 3-18
Figure 3.10 Power Block Diagram .................................................................................................... 3-20
Figure 3.11 Power Configuration during OfficeServ PoE Switch Interface ..................................... 3-21

LIST OF TABLES

Table 1.1 Description of Buttons ............................................................................................. 1-2

Table 1.2 Description of Connection Ports .............................................................................. 1-3
Table 1.3 SMT-i5210 Specifications ........................................................................................ 1-4

Table 2.1 List of Components of the Body............................................................................... 2-3

Table 2.2 List of Components of the Handset ......................................................................... 2-5

Table 3.1 CPU Power On Strap Pin Configuration .................................................................. 3-3

Table 3.2 Register Map ........................................................................................................... 3-4
Table 3.3 GPIO Pin MAP ........................................................................................................ 3-5
Table 3.4 RTL8306G Power-on Strap Pin ............................................................................... 3-9
Table 3.5 Change of LED Color by Port ................................................................................ 3-14
Table 3.6. BCM1190 6 x 6 Key Matrix ............................................................................................... 3-19
Table 3.7 CPLD 3 x 3 Key Matrix .......................................................................................... 3-19
Table 3.8 Hook Switch Control Value .................................................................................... 3-19

XII © SAMSUNG Electronics Co., Ltd.

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CHAPTER 1. Product Description

This chapter describes the configuration, names and functions of parts, and specifications
of the SMT-i5210 IP phone.

1.1 The Configuration

This section shows the configuration of the SMT-i5210 IP phone, and describes the names
and functions of the components.

1.1.1 Front of the SMT-i5210 Phone

Figure 1.1 Front of the SMT-i5210 IP phone

© SAMSUNG Electronics Co., Ltd. 1-1

CHAPTER 1.

The table below describes the function of each component.

Table 1.1 Description of Buttons

Item Specification

LED Displays the call status.

Soft Button Used by the user to select their desired function from the soft
menus displayed on the LCD screen.
Conference Button Used for a conference call.
Transfer Button Used to enable the call transfer function when busy.
Hold Button Used to enable the call hold function.
UC dial Sets the phone to a call forward or a 'do not disturb' status.
Navigation Button Used to manipulate the menu functions.
(up/down/left/right/ok)
AOM Button Used to allocate system functions or phone numbers to each
button, to allow the buttons to function as hotkeys.
Dial Button Used to enter numbers and characters.
Speaker Button Used to converse via a speaker phone instead of a handset.
Headset Button Used to converse via a headset.
Volume Button Used to control the volume of the handset, speaker, key tone,
etc.
Mute Button Silences the voice of the user to the called party.
Service Button Displays the Service menu.
Message Button Displays detailed menus where the user can create a message
or select a message box, etc.
Phonebook button Displays an addressbook so that a user can search or enter a
phone number via a soft menu.
LCD Screen LCD screen of the phone.
Handset Transfers the caller's voice.

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1.1.2 Back of the SMT-i5210 Phone

Figure 1.2 Back of the SMT-i5210 Phone

Table 1.2 Description of Connection Ports

Port Description

Headset connection port A port where a headset is connected.

Handset connection port A handset is connected to it.
PC connection port PC is connected to it via the LAN cable provided with the
phone.
LAN connection port LAN cable connected to a network is connected to it.
Power connection port Port to connect the power adapter which is provided with the
phone when PoE support is not available.

© SAMSUNG Electronics Co., Ltd. 1-3

CHAPTER 1.

1.2 The Specifications

The specifications of the SMT-i5210 phone are as follows:

Table 1.3 SMT-i5210 Specifications

Item Specification

Model SMT-i5210
Weight (g) 994
Dimensions (mm) 223 (L) × 223 (W) × 131.5 (H)
Power consumption when DC 36~59 V (Standard 48 V); 200 mA
using PoE
Power consumption when DC 5 V; 1.2 A (Max.)
using an adaptor
PoE Interface Supports 802.3 a/f standard.
Network Interface Ethernet 10/100 BASE-T
Operating temperature (°C) 0~45
Operating humidity (%) 10~90
Call via speaker phone Available
LCD Black & white graphic LCD (128 × 64 pixels)

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CHAPTER 2. Assembly and

Disassembly

This chapter illustrates the disassembly diagram of the SMT-i5210 IP phone, and describes
how to disassemble and assemble the phone.

2.1 The Disassembly Diagram

This section illustrates the disassembly diagram of the SMT-i5210.

© SAMSUNG Electronics Co., Ltd. 2-1

CHAPTER 2.

2.1.1 The Disassembly Diagram of the Body

34

33/33-1

32
31/31-1 to 5
1
30

2 29
28
3
27

4
26

5/5-1 25
6 24
7
10 8 23
9
11
12

13 22
16
14
17
15
18 21
19

20

Figure 2.1 Disassembly Diagram of the Body

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Table 2.1 List of Components of the Body

No SEC CODE Name Quantity

1 GB07-00021A LCD, CMF2P0490-E 1

2 GB72-00390A LCD Bracket 1
3 6002-000154 Screw (M3 x L8) 2
4 GB72-00391A Plunger 1
5 GA97-01996A Wheel Key Inner Assembly 1
5-1 GB72-00399A Wheel Key 1
6 GB72-00401A Wheel Key Holder 1
7 6003-001166 Screw (M1.4 x L4) 2
8 GA72-00495A Navi. Key 1
9 GA72-00496A OK Key 1
10 GB72-00389A Key Soft 1
11 GA72-00482A Function Key_L 1
12 GA72-00523A Function Key_R 1
13 GA72-00487A Hot Key 1
14 GA72-00481A 3X4 Key 1
15 GA72-00480A DSS-7 Key 2
16 3001-002463 SPEAKER 1
17 6002-000154 Screw (M3 x L8) 2
18 GA73-00069A MIC Holder 1
19 GB30-00005A MICROPHONE-ASSY 1
20 GA97-01992B Pedestal Assembly 1
21 6002-000154 Screw (M3 x L8) 6
22 GB97-00863A Bottom Case Assembly 1
23 6002-000154 Screw (M3 x L8) 11
24 GB73-00083A Key Bottom Cover 1
25 GB92-01007A SMT-i5210 PBA 1
26 GB73-00082A Key Top Cover 1
27 GA68-00427A Name Sheet STA 1
28 6002-000154 Screw (M3 x L8) 1
29 GA39-00038A CBF HARNESS 1
30 GB92-01008A PBA (SMT-i5230 ) 1
31 GB97-00864A Housing Assembly 1
31-1 GB72-00393A LCD Window 1
31-2 GB73-00088A LCD Pad 1
31-3 GA72-00521A DSS Window 1
31-4 GA72-00494A Name Sheet Holder 1
31-5 GA73-00099A Speaker Pad 1

© SAMSUNG Electronics Co., Ltd. 2-3

CHAPTER 2.

(Continued)

No SEC CODE Name Quantity

32 GB72-00387A Face Plate 1

33 GA72-00502A Wheel Mode Deco. 1
33-1 GA70-00106A Mode Key Spring 1
34 GA72-00485A Handset Rack 1

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2.1.2 The Disassembly Diagram of the Handset

1
11

10/10-1

2
3

6
4/4-1/4-2
5
9
8

Figure 2.2 Disassembly Diagram of the Handset

Table 2.2 List of Components of the Handset

No SEC CODE Name Quantity

1 GA72-00484A HANDSET UPPER 1

2 GA72-00483A HANDSET CAP 1
3 GC70-00105A WEIGHT BALANCE 1
4 2203-000444 CAPACITOR 1
4-1 3003-000117 MIC 1
4-2 GA73-00011A MIC HOLDER 1
5 JF39-40021A MODULAR JACK 1
6 GA39-00030A CURL CORD 1
7 GA72-00486A HANDSET LOWER 1
8 GA73-40559A HOLE DUMMY 1
9 6002-000147 SCREW M3 L10 1
10 HDT-36CF1 RX UNIT 1
GA73-00096A Cushion Receiver 1
11 6003-000214 Screw (M3xL8 Washer) 1

© SAMSUNG Electronics Co., Ltd. 2-5

CHAPTER 2.

2.2 The Disassembly

This section describes how to disassemble the SMT-i5210.

Damage to Electrostatic Sensitive Device (ESD)

When handling boards or parts, take care not to damage them with static
electricity. Therefore, make sure to wear a pair of anti-static gloves before
handling the board or parts.

2.2.1 The Disassembly of the Body

1) Detachment of the cradle
Pull the cradle out following the arrow direction, holding the body.

Figure 2.3 Detachment of the cradle

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2) Detachment of the base plate

Unscrew the 6 fixing screws from the base plate of the phone, and detach it.

Figure 2.4 Detachment of the Base Plate (1)

The figure below shows the detached front and back sides.

Figure 2.5 Detachment of front and back sides (2)

© SAMSUNG Electronics Co., Ltd. 2-7

CHAPTER 2.

3) Unscrew all fixing screws (16) that secure the parts including the main PCB, LED
PCB speaker, and LCD cover.

Figure 2.6 Detachment of the main PBA (1)

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Detachment the cables connected to the main PBA of the front- speaker cable, mike
cable, LCD cable, LED and key cable from the PBA connector.

LED connector LCD connector

Mike connector

Speaker connector

Figure 2.7 Detachment of cables

Detach the main PBA, speaker, LED PBA, and mike from the Front panel.

Figure 2.8 Detachment of the main PBA (2)

© SAMSUNG Electronics Co., Ltd. 2-9

CHAPTER 2.

Detach the LCD screen from the LCD screen cover.

Figure 2.9 Detachment of LCD

The figure below shows the front case and Conductive Rubber (key pad) when
detached.

Figure 2.10 Detachment the PBA

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Unscrew the two UC wheel fixing screws.

Figure 2.11 Detachment the UC

Detach the handset rack on the front of the Front panel by pulling it upward.

Figure 2.12 Detachment of the handset hook

© SAMSUNG Electronics Co., Ltd. 2-11

CHAPTER 2.

The figure below shows the detached front parts such as buttons.

Figure 2.13 Detachment of the Front Panel and Buttons

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2.2.2 The Disassembly of Handset

1) Detachment of the curl cord
Detach the cap at the bottom of the handset using a pin, and detach the curl cord from
the modular jack.

Figure 2.14 Detachment of the Curl Cord (1)

Figure 2.15 Detachment of the Curl Cord (2)

© SAMSUNG Electronics Co., Ltd. 2-13

CHAPTER 2.

2) Detachment of the upper cover

Detach the hole dummy inside the handset, unscrew the fixing screw, and then detach
the upper cover.

Figure 2.16 Detachment of the Upper Cover (1)

Figure 2.17 Detachment of the Upper Cover (2)

Figure 2.18 Detachment of the Upper Cover (3)

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Figure 2.19 Detachment of the Upper Cover (4)

3) First, detach the Weight Bar.

Figure 2.20 Detachment the Weight Bar

© SAMSUNG Electronics Co., Ltd. 2-15

CHAPTER 2.

Detachment of the modular jack, mike and Rx-unit

Figure 2.21 Detachment of the Modular Jack, Mike and Rx-unit (1)

4) All the disassembled components of the handset are as follows.

Figure 2.22 All Disassembled Components of the Handset

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2.3 The Assembly

You can assemble the SMT-i5210 in the reverse of disassembly.

© SAMSUNG Electronics Co., Ltd. 2-17

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CHAPTER 3. Description of Circuits

This chapter describes the structure and features of each circuit of the SMT-i5210 IP phone.

3.1 H/W Block Diagram

The figure below is the hardware block diagram of the SMT-i5210 IP phone which adopts
the BCM1190 CPU.

LCD S-FLASH SDRAM

3.2’’ 128x64 Graphic 8MB 16MB
CMF2P0490-E MX25L6405 K4S281632

SPI1_CLK SPI0 XTAL XTAL

SPI1_CS 25MHz 25MHz
SPI[1:3]
OSC
20MHz SPI SDRAM E1 Transformer RJ-45
CPLD
LC4128-75T128C GPIO SMI/LED H1102 PC

Ethernet Switch
3x3 PHY RTL8306 Transformer RJ-45
LED VoIP Processor Ethernet 0 E0 E2
6x6 H2019NL LAN
KEY PAD KEY_SCAN 257MHz MIPS32
DSS/LAMP BCM1190 3.3V 1.8V

1.2V
HOOK
GPIO 2.5V 1.8V
IRQ
FUNC_LED CODEC 1 CODEC 0 3.3V
RESET
3.3V 48V

Switch Regulator PoE PD

AOZ1021H, 3A AS1135
SEL 4CH Switch x2
Audio AMP FSA2268
5V
TPA6204A
Optional
Power Adaptor
Speaker MIC RJ-22 RJ-22 5V/1.5A
M50R5A OBE-15L46 Handset Headset

Figure 3.1 H/W Block Diagram of the SMT-i5210

© SAMSUNG Electronics Co., Ltd. 3-1

CHAPTER 3.

3.2 CPU
The figure below is the block diagram of the CPU.

Figure 3.2 Block Diagram of the CPU

3.2.1 Block Diagram of the CPU

The main functions of the CPU are as follows:
 DSP control
 User interface
 Network interface (10/100BASE-T)
 Call processing
 Data saving

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3.2.2 Mode Selection

In BCM1190 - the CPU of the SMT-i5210, you can set the system clock, SPI clock, SPI
addressing mode, etc. by hardware.
The hardware of the SMT-i5210 is fixed to the bold-lettered modes in the table below.

Table 3.1 CPU Power On Strap Pin Configuration

Pin Name Strap Name Function

GPIO[17] OSC_bypass 0 Put Internal oscillator in bypass mode

1 Normal Mode
GPIO[18] MIPS Endian Mode 0 Little Endian
1 Big Endian
GPIO[22:19] Clock Select 0000 MIPS: 250 MHz, Bus Clock: 100 MHz
0001 MIPS: 250 MHz, Bus Clock: 125 MHz
0010 MIPS: 250 MHz, Bus Clock: 139 MHz
0011 MIPS: 250 MHz, Bus Clock: 166 MHz
1100 MIPS: 275 MHz, Bus Clock: 100 MHz
1101 MIPS: 275 MHz, Bus Clock: 125 MHz
1110 MIPS: 275 MHz, Bus Clock: 138 MHz
1111 MIPS: 275 MHz, Bus Clock: 165 MHz
GPIO[25:23] SPI Clock Select 000 50 MHz
001 25 MHz
010 12.5 MHz
011 3.125 MHz
100 1.56 MHz
101 781 KHz
110 391 KHz
111 20 MHz
GPIO[26] SPI Flash 0 16-bit
Addressing Mode 1 24-bit
GPIO[27] Serial Flash Fast 0 Fast Read Mode
Read Mode 1 Do not support Fast Read Mode

© SAMSUNG Electronics Co., Ltd. 3-3

CHAPTER 3.

3.2.3 Register MAP

All registers of the CPU exist between 0xBAFE0000 and 0xBAFFFFF.
The table below shows the types of register groups and the base address of each register.

Table 3.2 Register Map

Address Range Register Group

0xBAFE0000-0xBAFE00FF Peripheral Control

0xBAFE0200-0xBAFE02FF Timer
0xBAFE0300-0xBAFE03FF UART
0xBAFE0400-0xBAFE04FF GPIO
0xBAFE0500-0xBAFE05FF Keyscan
0xBAFE0C00-0xBAFE0CFF SPI
0xBAFE2300-0xBAFE23FF SDRAM Controller
0xBAFE2C00-0xBAFE2EFF EMAC DMA Control (IUDMA)
0xBAFE3000-0xBAFE3FFF EMACs
0xBAFE4000-0xBAFE4FFF APM
0xBAFE4400-0xBAFE46FF APM DMA Control (IUDMA)

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3.2.4 GPIO Allocation

This section describes the configuration and functions of the General Purpose Input/Output
(GPIO). Basically, the CPU has a total of 32 GPIOs. GPIO[0]–GPIO[3] can be used for an
external interrupt; GPIO[4]–GPIO[7] for PCM; GPIO[8]–GPIO[13] for UART and PHY
LED; and GPIO[14]–GPIO[16] for SPI Chip Select Signal as required, and GPIO[17]–
GPIO[27] can be used as a Power on Strap.
Functions are allocated to the GPIO port of the SMT-i5210 as shown in the table below.

Table 3.3 GPIO Pin MAP

GPIO IN/OUT Signal Value

GPIO[0] IN Hook Switch 0: Hook ON

GPIO[1] IN CPLD Interrupt 0: CPLD Register Changed
GPIO[2:3] IN UC_DIAL_SCAN[1:2] 0: UC Dial Switch Key Detected
GPIO[4:7] Not used - -
GPIO[8] OUT LCD Reset 0: LCD Module Reset (H/W Default)
GPIO[9] OUT LCD_A0 0: Command
1: Data
GPIO[10] OUT LCD_BL_ON 0: LCD Back-light Disable (H/W Default)
GPIO[11] OUT CPLD Reset 0: CPLD Reset (H/W Default)
GPIO[12:13] Not used - -
GPIO[14] OUT CS1_LCD 0: Chip Select 1 for LCD
GPIO[15] OUT CS2_KEY 0: Chip Select 2 for KEY Scan of CPLD
GPIO[16] OUT CS3_LED 0: Chip Select 3 for DSS LED of CPLD
GPIO[17] Not used - -
GPIO[18] OUT FUNC_LED0 0: LED ON for Transfer
GPIO[19] OUT FUNC_LED1 0: LED ON for Hold
GPIO[20] OUT FUNC_LED2 0: LED ON for Mute
GPIO[21] OUT FUNC_LED3 0: LED ON for Headset
GPIO[22] OUT FUNC_LED4 0: LED ON for Speaker
GPIO[23] Not Used - -
GPIO[24] IN PC_LINK_ON 0: PC Port Link ON from RTL8306G
GPIO[25] IN LAN_LINK_ON 0: LAN Port Link ON from RTL8306G
GPIO[26:27] Not Used - -
GPIO[28] IN/OUT MDIO MDIO for Ethernet Management
Interface
GPIO[29] OUT MDC MDC for Ethernet Management Interface
GPIO[30] OUT HEADSET_SEL 0: Handset Select (H/W Default)
1: Headset Select
GPIO[31] OUT AMP_SD 0: AMP Chip Reset (H/W Default)

© SAMSUNG Electronics Co., Ltd. 3-5

CHAPTER 3.

3.3 External Memory

3.3.1 Serial Flash
In the SMT-i5210, an 8 MB Serial Flash Memory (MX25L6405 from Macronix) is used to
save the files necessary for booting, O.S., applications, system parameters, etc.
For connection with BCM1190, a Two-Wire SPI (MISO, MOSI) is used at a speed of 20
MHz for communication. Although the clock can be set at a maximum of 86 MHz for the
MX25L6405, it has been set at 20 MHz for reliability of the SMT-i5210 operation. Data is
transmitted via the data line connected through SPI, following 1-byte command instruction
and 3-byte memory address. Data is transmitted through the 64-byte SPI TX Message FIFO
(0xBAFE0C40–0xBAFE0C7F) and 64-byte SPI RX Data FIFO (0xBAFE0C80–
0xBAFE0CBF) register.

- Capacity: 8 MBytes × 1 ea
CPU SFlash - Part: MX25L6405D
- Access time: 86 MHz Serial Clock
BCM1190 64 Mbit - Package: 16 Pin SOP
- Power supply: 3.3 V
SPI_CLK SCLK

SPI_MISO SO

SPI_MOSI SI

SPI_SBB CS#

Figure 3.3 Serial Flash Memory Block Diagram

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3.3.2 SDRAM
16 MByte SDRAM is used for software operation and data saving.
With the CUP, it is connected to the GBUS at a speed of 166 MHZ.

- Capacity: 2 M × 16 bit × 4 banks

CPU SDRAM - Total capacity: 16 MBytes 16 bit port
- Part: K4S281632K-UC60
BCM1190 16 MB
- Max. frequency: 166 mhz (Access time-6.0ns)
- CAS latency: 2 & 3
SD_CS_B _CS - Refresh period: 64ms (4K cycle)
- Package: TSOP 54pin
SD_WE_B _WE
- Power supply: 3.3 V
SD_RAS _RAS
SD_CAS _CAS
SDQM_0 LDQM
SDQM_1 UDQM
SD_BSA_0 BA0
SD_BSA_1 BA1

SD_CLK CLK
SD_CKE CKE

SD_A(11:0) A(11:0)
SD_DQ(15:0) DQ(15:0)

Figure 3.4 SDRAM Block Diagram

© SAMSUNG Electronics Co., Ltd. 3-7

CHAPTER 3.

3.4 Network
Although the PHY/MAC of 2port is installed within the BCM1190 main chipset, it uses the
S/W Switching method to handle Ethernet Frame thus resulting in limited performance
without providing the wired speed. Therefore, L2 Switching is performed by connecting
each of LAN, PC port, and one port of BCM1190 by using a separate external switch chip.
For the L2 Switch chip, RTL8306G is used. Also, RTL8306G has the PHY and MAC
installed inside, and it is connected to BCM1190 in a PHY-to-PHY type interface.
Furthermore, to handle the Ethernet Protocols such as VLAN of BCM1190, it provides the
SMI (Serial Management Interface) connection to BCM1190. And to recognize the Link
connection status of the PC/LAN port, the function is implemented by connecting the Link
LED Signal of RTL8306G to GPIO of BCM1190.

It is a network block diagram.

Part: RTL8306G
Ethernet I/F: 10/100BASE-TX
Package: 128Pin PQFP
VCC: 3.3 V, 1.8 V

Figure 3.5 Network Block Diagram

The H/W Reset Configuration of RTL8306G can be set by using Power on Strap Pin.
This decides the operation mode according to the inputted value when the reset is applied
to the RTL8306G chip. After the Reset, it operates in the mode that has been allocated to
the pin.

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Table 3.4 RTL8306G Power-on Strap Pin

Pin Name Pin No. Value Function

ENEEPROM 73 0 Disable EEPROM Loading

SETGROUP 95 1 Group X: Port0
Group Y: Port1, 2, 3
DISPORTPRI[0:4] [83:86], 88 11111 Disable Port[0:4] Priority
ENBKPRS 78 1 Enable Half Duplex Back Pressure
ENDEFER 90 1 Enable Carrier Sense Deferring for Half Duplex
Back Pressure
GXENFC 76 1 Enable Flow Control in Group X
GYENFC 77 1 Enable Flow Control in Group Y
GXANEG 104 1 Enable Auto-negotiation in Group X
GYANEG 105 1 Enable Auto-negotiation in Group Y
GXSPD100 107 1 Set 100Mbps in Group X
GYSPD100 108 1 Set 100Mbps in Group Y
GXFULL 109 1 Set Full-Duplex in Group X
GYFULL 110 1 Set Full-Duplex in Group Y
LED_MODE[1:0] [55:54] 01 LED_ADD[4:0]: Link ON LED
EN_AUTOXOVER 69 1 Enable Auto Crossover Detection
DISBRDCTRL 80 1 Disable Broadcast Storm Control
DISTAGPRI 91 1 Disable 802.1p VLAN tag priority
DISVLAN 93 1 Disable VLAN
DISARP 98 1 Disable ARP Broadcast to all VLANs
DISLEAKY 101 1 Disable forwarding of unicast frames to other
VLANs
EN48PASS1 97 1 Enable 48 Pass 1
ENFORWARD 111 1 Enable to forward 802.1D specified multicast
address frames
BCINDROP 113 1 Broadcast Input Drop mechanism
MAX1536 114 1 Maximum Frame Length 1536 Byte

© SAMSUNG Electronics Co., Ltd. 3-9

CHAPTER 3.

3.4.1 Main Functions

Below are the major features of the RTL8306G.
 6-port switch controller with memory and transceiver for 10Base-T and 100Base-TX
 Supports Dual MII/RMII for router applications, HomePNA, HomePlug, or VDSL
solutions
 Non-blocking wire-speed reception and transmission and non-head-of-line-blocking
forwarding
 Complies with IEEE 802.3/802.3u auto negotiation
 Built-in high efficiency SRAM for packet buffer, with 2K-entry lookup table, 16-entry
CAM, and 4-way associative hash algorithm
 Supports high performance QoS function on each port:
 Supports 4-level priority queues
 Weighted round robin service
 Input/Oitput port bandwidth control
 Supports IEEE 802.1p Traffic Re-marking
 Lookup Table is accessible via SMI
 Supports 32-bit smart counter for per port RX/TX byte/packet count, collision counter,
and error counter
 Supports reserved control frame filtering (DID= 01-80-C2-00-00-04~01-80-C2-00-00-
0F)
 Supports advanced storm filtering
 Supports Port Mirroring
 Supports interrupt for CPU application
 Supports SMI (Serial Management Interface) for programming and diagnostics
 Optional EEPROM interface for configuration
 Supports MAC and PHY loopback function for diagnosis
 Supports up to 16 VLAN groups
 Flexible 802.1Q port/tag-based VLAN
 Supports special VLAN tag insert or remove function on per-port basis (egress) to
separate WAN traffic from LAN traffic
 VLAN priority tag Insert/Remove function
 ARP VLAN for broadcast packets
 Leaky VLAN for unicast packets
 Supports external processor to maintain greater than 16 VLAN groups
 Flexible LED indicators for link, activity, speed, full/half duplex, and collision, as well
as user defined LED output
 LEDs blink upon reset for LED diagnostics
 Supports loop detection function with one LED to indicate the existence of a loop

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 Optional 1552 byte maximum packet length

 Flow control fully supported
 Half duplex: Back pressure flow control
 Full duplex: IEEE 802.3x flow control
 Optional MDI/MDIX auto crossover for plug-and-play
 Physical layer port Polarity Detection and Correction function
 GreenEthernet Features
 Link-On and Cable Length Power Saving
 Link-Down Power Saving
 Robust baseline wander correction for improved 100Base-TX performance
 25 MHz crystal or 3.3 V/1.8 V OSC input
 Single 3.3 V power input can be transformed to 1.8 V via a low-cost external BJT
transistor
 Low power, 1.8/3.3 V, 0.18 um CMOS technology
 128-pin PQFP package

© SAMSUNG Electronics Co., Ltd. 3-11

CHAPTER 3.

3.5 LCD
This section describes the LCD of the SMT-i5210 IP phone.

3.5.1 Interface with the CPU

The 3.2" 128 X 64 dot-matrix mono LCD is used, and this is connected to the main board
via the Flexible Printed Circuit (FPC) connector. It is the Serial Interface that is connected
with the CPU through the SPI and implemented as Multi-SPI with Serial Flash Memory.
For reference, four external devices (Flash, LCD, KEY, and LED) can be connected by
using SPI in BCM1190. LCD CS signal uses the allocated GPIO[14], and the maximum
usable clock of the LCD Module is 20 MHz. In SMT-i5210, it has been set to 12.5 MHz.
To use at 12.5 MHz, CPLD adjusts the LCD CS signal.

It is an LCD-CPU interface block diagram.

Capacity: 3.2” 128 x 64 Pixel MONO

Part: 2K15654-2D
Access time: Max. 20 MHz Serial Clock
VCC: 3.3 V
Back-light Power: 6.4 V

Figure 3.6 LCD Interface Block Diagram

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3.5.2 Operation Principles

The LCD module is One-Wire SPI, so data is transmitted via the single SPI_MISO line,
and only Write is allowed. If the A0 signal value is Low, it is recognized as Command; and
if High, as Data. The address has eight pages; one line per page. A total of eight lines can
be displayed and the column address of each page consists of 0–132 (2 bytes), and eight
dots (1 byte data) are displayed for each address.
To supply power to the LCD Back-light, a Booster is used, and with the GPIO[10] of
BCM1190, the voltage output can be controlled.

3.5.3 Key Functions

The LCD used in SMT-i5210 supports below functions.
 Support of 128 dots × 64 dots graphic type LCD
 Support of Korean language
 SPI interface

© SAMSUNG Electronics Co., Ltd. 3-13

CHAPTER 3.

3.6 LED
This section describes the LED of the SMT-i5210 IP phone.

3.6.1 LED Operation Method

The LED is operated by using the GPIO of the CPU and the I/O pin of the CPLD.
Through the GPIO of the CPU, five LEDs (Red) of the function keys are controlled while
one Lamp LED (Y-Green, Red) and 14 DSS/BLF LEDs (Y-Green & Red) are controlled
through the I/O pin of the CPLD. At this point, the CPU interface with the CPLD via the
SPI to control the LED of the CPLD’s I/O pin.

3.6.2 LED Color Change

The SMT-i5210 uses LEDs that are made of 15 dual LEDs and five mono LEDs.
Depending on the signal from the GPIO port of the CPU and the I/O port of the CPLD, the
color of the LED changes as follows:

Table 3.5 Change of LED Color by Port

LED Color
LED Port
Red Green Orange

Transfer GPIO 18 LOW - -

HOLD GPIO 19 LOW - -
MUTE GPIO 20 LOW - -
HEADSET GPIO 21 LOW - -

SPEAKER GPIO 22 LOW - -

DSS0 IO 63 HIGH LOW LOW

IO 62 LOW HIGH LOW

DSS1 IO 61 HIGH LOW LOW

IO 60 LOW HIGH LOW

DSS2 IO 59 HIGH LOW LOW

IO 58 LOW HIGH LOW
DSS3 IO 57 HIGH LOW LOW

IO 56 LOW HIGH LOW

DSS4 IO 55 HIGH LOW LOW

IO 54 LOW HIGH LOW

DSS5 IO 53 HIGH LOW LOW

IO 52 LOW HIGH LOW

DSS6 IO 51 HIGH LOW LOW

IO 50 LOW HIGH LOW

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(Continued)

LED Color
LED Port
Red Green Orange

DSS7 IO 73 LOW HIGH LOW

IO 74 HIGH LOW LOW

DSS8 IO 75 LOW HIGH LOW

IO 76 HIGH LOW LOW

DSS9 IO 77 LOW HIGH LOW

IO 78 HIGH LOW LOW

DSS10 IO 79 LOW HIGH LOW

IO 80 HIGH LOW LOW

DSS11 IO 81 LOW HIGH LOW

IO 82 HIGH LOW LOW

DSS12 IO 83 LOW HIGH LOW

IO 84 HIGH LOW LOW

DSS13 IO 85 LOW HIGH LOW

IO 86 HIGH LOW LOW

LAMP IO 70 LOW HIGH LOW

IO 69 HIGH LOW LOW

© SAMSUNG Electronics Co., Ltd. 3-15

CHAPTER 3.

3.7 Audio
Basically BCM1190 provides two channel audio input/output ports. One channel connects
the Mike and speaker of the main body for the Speaker phone function, and the other
channel is connected to the Handset/Headset. To the main body speaker, the signals from
BCM1190 are inputted through the Audio Amp (1.7 W TPA6204 from TI) while being
amplified by it. To minimize Pop-up Noise, Fully Differential Audio Amp is used, and
BCM1190 uses the GPIO[31] for the On/Off of the Amp. When the GPIO[31] value is ‘1’,
the Amp is On. To selectively connect the Audio port of BCM1190 to RJ-22 Handset and
the RJ-22 Headset, Analog Switch (FSA2268 from Fairchild) is connected. The Analog
Switch is controlled with the GPIO[30] of BCM1190. As default, the Handset is selected
for the Analog Switch, and its selections are as follow: ‘0’  Handset and ‘1’  Headset.
The figure below displays the Audio Part Block Diagram.

Figure 3.7 Audio Block Diagram

This is the block diagram of the audio part in the CPU.

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This is the diagram of the entire audio block.

Figure 3.8 Audio Block Diagram in the CPU

3.7.1 Main Functions

The key functions of Audio are described below.
 16-bit sigma-delta ADC (Analog Digital Converter) and DAC (Digital Analog
Converter) 12.5 MHz Sampling
 G.712 G.722
 Interface with a handset
 Programmable Gain Control
 Side tone control

© SAMSUNG Electronics Co., Ltd. 3-17

CHAPTER 3.

3.8 User Interface

This section describes the user interface of the SMT-i5210 IP phone.

3.8.1 Keys of the SMT-i5210

Basically BCM1190 supports the 6 x 6 Key matrix. Other than that, additional key
allocation is implemented by using the 3x3 Key Matrix of CPLD.

3.8.1.1 Key Types

 3x4 Key: 12
 Fixed Function: 10(SPK/LED, Mute/LED, Headset/LED, Volume, PB, MSG, UC,
Trnas/LED, Hold/LED, Conf.)
 Navi. & Ok Key: 5(up/down/left/right, OK)
 Soft Key: 3(buttons below the LCD)
 DSS Key: 14
※ UC Dial: 2 (for setting the status such as absent, present, etc.)  Implemented with the
GPIO[3:2]

3.8.1.2 The Key Map

The SMT-i5210 is configured with one PCB and uses its bottom side for the Key pad.
The SMT-i5210's front panel Key layout and Key Matrix structure are as below.

Figure 3.9 The SMT-i5210 Front Panel Key Layout

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Table 3.6. BCM1190 6 x 6 Key Matrix

OUT
0 1 2 3 4 5
IN
0 F4 F6 F10A F11 F12 F14A
F10B F14B

1 F1 F5 K1 K4 K7 F13A
F13B

2 FD1 FD2 K2 K5 K8 K10

3 F2 FD3 FD5 K6 K9 K11

4 F3 FD4 K3 DSS1 DSS4 K12

5 F7 F8A F9A DSS2 DSS3 DSS5

F8B F9B

Table 3.7 CPLD 3 x 3 Key Matrix

OUT
0 1 2
IN
0 DSS12 DSS9 DSS6
1 DSS13 DSS10 DSS7
2 DSS14 DSS11 DSS8

3.8.2 Hook
GPIO 0 is used to control the hook switch.

Table 3.8 Hook Switch Control Value

Hook Activation Remark

High On-hook (a handset is hanged up) -

Low Off-hook (a handset is picked up)

© SAMSUNG Electronics Co., Ltd. 3-19

CHAPTER 3.

3.9 The Power

It is the block diagram of the power.
Power is supplied via PoE or 5 V AC/DC adaptor.

Transformer RJ-45
RTL8306 H2019NL LAN
3.3V 1.8V
BCM1190
1.2V
2.5V
3.3V
3.3V 48V

Switch Regulator PoE PD

AOZ1021H, 3A AS1135

5V
Optional
Power Adaptor
5V/1.5A or 5V/3A

Figure 3.10 Power Block Diagram

3.9.1 Main Functions of PoE

It satisfies the IEEE 802.3af Draft 3.3 Support DTE technology requirements.
 A voltage of 48 V is used. (30 V Cut-off)
 Power over Ethernet (PoE) is still available when the power polarity is changed.
 Supports not only the 4, 5 & 7, 8-pair power supply of the RJ-45 jack but also the 1, 2
& 3, 6-pair power supply of RJ-45 jack.
 Can be changed to a resistor signature method.
 Supports the voltage polarity protection function.
 Supplies 5 V DC.

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3.9.2 Ground Related Cautions

The SMT-i5210 uses an AS1135 PD chip to control DC-DC with the ‘Non-Isolated BUCK’
method. The method has a lower power efficiency than the ‘Isolated Flyback’ method, but
its part configuration is simpler thus decreasing the part’s mounting area on the PCB while
having another strength of allowing implementation at a lower cost.

On the other hand, a circuit that is implemented with the 'Non-Isolated' method requires
extra caution when grounding. In other words, a failure may occur when performing
debugging if system (OfficeServ products) that is connected to the Frame Ground, Scope,
PC, and other devices are connected together. Thus extra cautions is required.
It is the structure that is outputting 5 V power by having 48 V inputted through the PSE/PD
as the reference electric potential and generating the ground within the board according to
the voltage level. As a result, the difference in power level occurs from the Frame Ground.

As shown in the figure below, the difference in the Ground Level itself does not cause a
problem during the actual site operation.
However, when probing inside of the SMT-i5210 for board debugging or SIO
communication through UART by using a PC, a failure occurs due to the Ground Level
difference between Scope equipment and the PC.
As a result, FGND connection parts need to be removed from the AC Connector of the
OfficeServ or Debugging equipment when the failure occurs. If the PoE Switch is
interfacing with the products that have separated FGND and GND instead of the
OfficeServ products, the FGND connection of the Debugging equipment should have no
limitation.

Figure 3.11 Power Configuration during OfficeServ PoE Switch Interface

© SAMSUNG Electronics Co., Ltd. 3-21

CHAPTER 3.

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CHAPTER 4. Check and Diagnosis

This chapter describes what to check to see if the SMT-i5210 IP phone is working normally,
and how to use the diagnosis program.

4.1 SMT-i5210 Check and Diagnosis

This section describes what to check to see if the SMT-i5210 IP phone is working normally,
and how to use the diagnosis program.

4.1.1 What To Check

Before starting checking on SMT-i5210, read ‘3.9.2 Ground Related Cautions’. If the PoE
48 V power provided by a PoE supplying device is not floating ground, the specimen does
not operate when probing with the scope that is grounded or being connected with the
debugging console cable of the PC. Also, an electrical damage may occur to the specimen
if it is connected for a long period of time.

Checking Power
 Checking for a short: Check # 1, 2, and 3 pin of the U7 in turn using the Digital
Voltage Meter (DVM).
 Checking 5 V (adaptor), or 48 V Power over Ethernet (PoE): Check whether the
voltage is supplied to the ‘+’ and ‘-’ of the bridge diode BD1 or BD2 after connecting
the product to local power source or a system.
 Check the +3.3 V power: Check that the output from VCC and GND the C4 is +3.3 V.
 To prevent reverse voltage, the 5 V power is supplied after passing through the diode
that results in about 0.2 V of voltage drop. And the 5 V power supply mentioned in
this manual may slightly differ from an actual use.

Checking the X-TAL oscillation and clock

 Check the 25 MHz output from # 1 pin of the Y1 and Y2.
 Check the 20 MHz output from # 4 pin of the CPU U14.
 Check the 166 MHz output from # 38 pin of the SDRAM U9.

© SAMSUNG Electronics Co., Ltd. 4-1

CHAPTER 4.

Checking the operation of the LCD display

#5 Pin of the LCD module connector (J21): 3.3 V

Hook Switch
 When the contact point between the R106 and C305 is hook-on: High Level (3.3 V)
 When the contact point between the R106 and C305 is hook-off: Low Level (0 V)

Key Scan
Check if low input is detected in KEYPAD0–5 of CPU when the key is pressed.
(Output from High to Low)

4.1.2 Using a Diagnosis Program

The SMT-i3100 IP phone has a built-in self-test program. This self-test function includes
the test items as follows:
 LCD module test
 Key test
 LED test
 Tone test
 Ring test
 LAN Link test
 Headset call test
 Handset call test
 Initialization

Entering a diagnosis program mode

In an online state, apply power while pressing the ‘#’ key button.
 A diagnosis program mode initial screen is displayed on the LCD saying ‘[SMT-i5210]
MAC : ○○○○○○○○○○○○ SW Ver: ○○○○ Start Main AFT Press # for next’.

LCD module test

If you press the ‘#’ key once on the diagnosis program initial screen, ‘[SMT-i5210] Must
Push * LCD TEST *:Start LCD test #:for next’ is displayed, and it enters a LCD module
test mode.
 Pressing the ‘*’ key once displays the entire pixels of LCD.
 Pressing the ‘*’ key once more displays the LCD Test initial screen.

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Key test
In an LCD module test mode, pressing ‘#’ key once displays ‘[SMT-i5210] KEY TEST
Press Key #:for next’, and it enters the key test mode.
 If you press a number, navigation, volume key, etc., the key value is displayed on the
LCD.
 Whenever you press the ‘#’ key, you can move to the next test mode.

LED test
In a key test mode, pressing the ‘#’ key once displays ‘[SMT-i5210] Must Push * LED
TEST *: Chg LED Status #:for next’, and it enters the LED test mode.
 Whenever the ‘*’ key is pressed, the LED status is changed in the order of 'RED LED
 GREEN LED Off LED Full LED'.
 Whenever you press the ‘#’ key, you can move to the next test mode.

Tone test
In an LED module test mode, pressing ‘#’ key once displays ‘[SMT-i5210] TONE TEST
*:Chg Tone #:for next’, and it enters the tone test mode.
 Using the volume key in the tone test mode, you can adjust the volume of the tone.
 In the tone test mode, you can select a tone using the ‘*’ key.
 Basically, two types of tone appear in turn.

Ring test
In a tone test mode, pressing the ‘#’ key once displays ‘[SMT-i5210] RING TEST *: Test
other #:for next’, and it enters the ring test mode.Diagnosis program: Ring test.
 Using the volume key in a ring test mode, you can adjust the volume of the ring.
 In a ring test mode, you can select a ring melody using the ‘*’ key.
 Basically, two types of ring melody appear in turn.

LAN Link test

When the ‘#’ key is pressed once during the Ring test mode, ‘[SMT-i5210] Must Push *
LINK TEST *: start test #: for next’ is displayed and enters the LAN Link test mode.
 Pressing the ‘*’ key displays ‘LAN: Connect, PC: Disconnect’ is displayed on the
LCD.
 Connect is displayed if linked; if not, Disconnect.

Headset call test

When the ‘#’ key is pressed once during the LAN Link test mode, ‘[SMT-i5210] Must Push
* Headset CALL *: start #: for next’ is displayed and enters the Headset call test mode.
 Pressing the ‘*’ key places a call to the phone which is set in a zig mode via a handset
device.

© SAMSUNG Electronics Co., Ltd. 4-3

CHAPTER 4.

 If you apply power while pressing 7 (handsfree) or 9 (handset) on the phone,

‘SAMSUNG Zig Phone HF/HS Mode’ is displayed and booting is done in a zig mode.

Handset call test

When the ‘#’ key is pressed once during the Headset call test mode, ‘[SMT-i5210] Must
Push * Handset CALL *: start #: for next’ is displayed and enters the Handset call test
mode.

Pressing the ‘*’ key places a call to the phone which is set in a zig mode via a
handset device.

Speaker call test

When the ‘#’ key is pressed once during the Speaker call test mode, ‘[SMT-i5210] Must
Push * Speaker CALL *: start #: for next’ is displayed and enters the Speaker call test
mode.
Pressing the ‘*’ key places a call to the phone which is set in a zig mode via a handset
device.

Initialization
When the ‘#’ key is pressed once during the Speaker call test mode, ‘[SMT-i5210] Must
Push * Factory Reset? *: reset #: for next’ is displayed and enters the initialization mode.
 Pressing the ‘*’ key starts the initialization to factory settings.
 When the ‘#’ key is pressed, ‘[SMT-i5210] Complete !! Press # for next’ is displayed.
When the ‘#’ key is pressed again, ‘TEST IS FINISHED *:test again #:reboot’ is
displayed.
 If the ‘*’ key is pressed, the diagnosis is restarted from the initial step of the diagnosis
program. And if the ‘#’ key is pressed, the diagnosis ends, and the phone is rebooted.

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 SMT-i5210 Service Manual

CHAPTER 5. Troubleshooting

Describes the types of problems which may arise while using the SMT-i5210 IP phone, and
the methods of troubleshooting.

© SAMSUNG Electronics Co., Ltd. 5-1

CHAPTER 5.

5.1 When power is not on or reset is not available

Connect the power adapter

1
to the power connection
port.

Is the power NO Check the soldering state of

adapter output at 5 V DC or J10, D4, etc. then replace the
above? power adapter.

YES

Is 3.3 V outputted? NO
(Both ends of C4)

YES

Is U7 output (VOUT) NO
shorted?

YES
Check the soldering state of
U7 then replace.

Check each power element for 1

short-circuit, and replace it.

Does the Reset NO

signal operate normally from
Low to High?

Check soldering state of R121.

YES

Exit

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 SMT-i5210 Service Manual

5.2 When the product does not boot

Power is applied normally. 1

NO
Does X-TAL (25 M) oscillate Replace X-TAL (25 M)
normally?

YES

NO
Is 20 MHz outputted from
SPI_CLK?

YES

When Reset,
are signals transmitted to NO
the data line with SPI-CS0-L
signal?
Check for U5 short, and
YES replace it.

1
1

Are ADD and DATA of NO

DRAM normal?

YES Check for DRAM short,

and replace it.

1
Is 3.3 V outputted NO Check for U7 short,
from the LCD power line? and replace it.

YES

Check the LCD connector

insertion, and replace it.

Exit

© SAMSUNG Electronics Co., Ltd. 5-3

CHAPTER 5.

5.3 When the LED is not lit or nothing is displayed

on the LCD

Booting is done normally. 1

Is there no signal on YES Check the LCD module

LED/LCD? and replace it.

NO

Is there an
NO
abnormal screen displayed
on the LCD?

YES Check the LCD elements and

connector then replace them.

Is 3.3 V
supplied to # 5 Pin of J21 NO
normally?

YES
Check L44 then replace it.

NO
Is the Reset signal displayed
on the LCD?

YES Check the LCD reset

signal of the CPU.

Check the LCD control signal,

and replace it.

Exit

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 SMT-i5210 Service Manual

5.4 When LAN connection fails

Booting is done normally. 1

Is Link signal NO Check the cable and port status

detected when LAN cable is
connected? then replace.

YES

NO
Is the signal displayed
on Tx/Rx?

YES
Check the CPU and transformer
interface part for short or open,
and replace the CPU.

Check the Tx/Rx path.

Exit

© SAMSUNG Electronics Co., Ltd. 5-5

CHAPTER 5.

5.5 When dial tone is not heard normally

Booting is done normally. 1

NO Check the Network

Is dial tone heard?
connection status.

YES

Is HANDSET_ NO
SPK_P/M signal outputted
normally?

YES
Check the CPU, and replace it.

Is HANDSET
NO
_SPK_P/M outputted normally
after passing the
resistor?
YES Replace 0 Ω resistor of
R150 and R151.

1
Replace the HANDSET

Exit

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 SMT-i5210 Service Manual

ANNEX A. Parts List

This chapter provides the parts layout of the SMT-i5210 IP phone.

Sec Code Name Location Quantity

0202-001459 SOLDER-CREAM XX 1
0202-001524 SOLDER-BAR XX 1
0402-001047 DIODE-BRIDGE BD1, BD2 2
0402-001211 DIODE-RECTIFIER D9 1
0402-001405 DIODE-SCHOTTKY D12, D3, D4, D7 4
0403-001164 DIODE-ZENER ZD2 1
0406-001083 DIODE-TVS D10, D11 2
0406-001227 DIODE-TVS ZD3 1
0501-000467 TR-SMALL SIGNAL Q6, Q7 2
0502-001226 TR-POWER Q3, Q4, Q5 3
0505-001165 FET-SILICON Q2 1
0505-001845 FET-SILICON Q1 1
0505-002531 FET-SILICON Q8 1
0601-001064 LED LED10, LED11, LED12, LED13, 14
LED14, LED15, LED16, LED17,
LED18, LED19, LED20, LED21,
LED8, LED9
0601-001094 LED LED22, LED23 2
0601-001226 LED LED1, LED2, LED3, LED4, LED5, 7
LED6, LED7
0903-001595 IC-MICROCONTROLLER U14 1
1001-001593 IC-ANALOG SWITCH U12, U13 2
1105-001573 IC-DRAM U9 1
1107-001777 IC-FLASH MEMORY U10 1
1201-002222 IC-AUDIO AMP U3 1
1203-005538 IC-DC/DC CONVERTER U7 1

© SAMSUNG Electronics Co., Ltd. A-1

ANNEX A.

(Continued)

Sec Code Name Location Quantity

1203-005559 IC-BACKLIGHT U15 1

DRIVER
1203-006129 IC-POWER U8 1
SUPERVISOR
1205-003724 IC-ETHERNET U6 1
SWITCH
1209-001869 IC-ETC, LINEAR U4, U5 2
1301-001663 IC-CPLD U1 1
1405-001082 VARISTOR V13, V14, V15, V16, V17, V18, V19, 8
V20
2007-000060 R-CHIP R241 1
2007-000066 R-CHIP R154, R155, R156 3
2007-000143 R-CHIP R106, R107, R109, R110, R111, 18
R112, R113, R114, R115, R116,
R120, R129, R131, R263, R264,
R267, R268, R269
2007-000171 R-CHIP R148, R149, R150, R151, R152, 6
R153
2007-000173 R-CHIP R196, R197 2
2007-000239 R-CHIP R242, R251, R252, R253, R255, 7
R277, R278
2007-000414 R-CHIP R291 1
2007-001164 R-CHIP R159, R160, R161, R162, R284, 6
R285
2007-001290 R-CHIP R238 1
2007-001292 R-CHIP R100, R101, R102, R103, R104, 36
R18, R19, R20, R21, R22, R23,
R257, R258, R259, R260, R261,
R262, R274, R275, R276, R280,
R281, R85, R86, R87, R88, R89,
R90, R91, R92, R93, R94, R95, R96,
R97, R98
2007-001325 R-CHIP R289 1
2007-002797 R-CHIP R211, R213, R215, R217, R219, 7
R221, R223
2007-007142 R-CHIP R179, R180, R181, R182, R183, 23
R184, R185, R186, R187, R188,
R189, R191, R192, R193, R194,
R195, R282, R283, R55, R56, R57,
R58, R60
2007-007287 R-CHIP R240 1

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 SMT-i5210 Service Manual

(Continued)

Sec Code Name Location Quantity

2007-007306 R-CHIP R239 1

2007-007318 R-CHIP R121, R123, R126, R249 4
2007-007443 R-CHIP R254, R256, R279 3
2007-007528 R-CHIP R202, R203 2
2007-007549 R-CHIP R245 1
2007-007766 R-CHIP R244 1
2007-007767 R-CHIP R205, R206, R207, R208, R209, 26
R210, R212, R214, R216, R218,
R220, R222, R224, R225, R226,
R227, R228, R229, R230, R231,
R232, R233, R234, R235, R236,
R237
2007-008006 R-CHIP R157, R158 2
2007-008298 R-CHIP R163, R164, R165, R166, R167, 16
R168, R169, R170, R171, R172,
R173, R174, R175, R176, R177,
R178
2007-008364 R-CHIP R201 1
2007-008567 R-CHIP R290 1
2007-008596 R-CHIP R250 1
2007-008807 R-CHIP R246 1
2007-009777 R-CHIP R292 1
2007-009933 R-CHIP R204 1
2007-010285 R-CHIP R243 1
2203-000041 C-CER, CHIP C170, C370 2
2203-000233 C-CER, CHIP C184, C185, C186, C187, C192, 17
C193, C194, C195, C196, C197,
C203, C204, C205, C374, C375,
C376, C377
2203-000254 C-CER, CHIP C302, C303, C304, C305, C310, 7
C311, C312
2203-000257 C-CER, CHIP C395, C396 2
2203-000359 C-CER, CHIP C353, C354, C355, C356, C357, 9
C358, C359, C360, C361
2203-000425 C-CER, CHIP C351, C352 2
2203-000438 C-CER, CHIP C350 1
2203-000679 C-CER, CHIP C320, C321, C393 3
2203-000714 C-CER, CHIP C402 1
2203-001386 C-CER, CHIP C365, C366, C389 3

© SAMSUNG Electronics Co., Ltd. A-3

ANNEX A.

(Continued)

Sec Code Name Location Quantity

2203-001414 C-CER, CHIP C368 1

2203-005171 C-CER, CHIP C178, C179, C180, C181, C182, 6
C378
2203-005249 C-CER, CHIP C397 1
2203-005457 C-CER, CHIP C322, C323, C388, C394 4
2203-006158 C-CER, CHIP C207, C208, C209, C210, C211, 98
C212, C213, C214, C215, C216,
C217, C218, C219, C220, C221,
C222, C223, C224, C225, C226,
C227, C228, C229, C230, C231,
C232, C233, C234, C235, C236,
C237, C238, C239, C242, C243,
C244, C245, C246, C247, C248,
C249, C250, C251, C252, C253,
C254, C255, C256, C257, C258,
C259, C260, C261, C262, C263,
C264, C265, C266, C267, C268,
C269, C270, C271, C272, C273,
C274, C275, C276, C277, C278,
C279, C280, C281, C282, C283,
C284, C285, C286, C287, C289,
C290, C291, C292, C293, C294,
C295, C297, C298, C299, C300,
C379, C380, C381, C382, C384,
C385, C391, C68
2203-006170 C-CER, CHIP C317, C318, C319 3
2203-006328 C-CER, CHIP C364 1
2203-006460 C-CER, CHIP C339, C340, C341, C342, C343, 11
C344, C345, C346, C347, C348,
C349
2203-006562 C-CER, CHIP C334, C335, C336, C337, C338 5
2203-006834 C-CER, CHIP C398 1
2203-007133 C-CER, CHIP C155, C156, C157, C158, C159, 23
C160, C161, C162, C324, C325,
C326, C327, C328, C329, C330,
C331, C332, C333, C371, C372,
C387, C390, C392
2401-001374 C-AL C4 1
2401-003034 C-AL C154 1
2401-004399 C-AL C164 1
2401-004469 C-AL C139 1
2409-001114 C-POLYMER, CHIP C167 1

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 SMT-i5210 Service Manual

(Continued)

Sec Code Name Location Quantity

2601-001056 TRANS-SMD, PULSE T2 1

2601-001141 TRANS-SMD, PULSE T1 1
2703-000350 INDUCTOR-SMD L23, L48 2
2703-001116 INDUCTOR-SMD L57 1
2703-002642 INDUCTOR-SMD L47, L49 2
2801-004058 CRYSTAL-SMD Y1, Y2 2
2804-001499 OSCILLATOR- Y3 1
CLOCK
3301-001208 BEAD-SMD L24, L25, L26, L27, L28, L29, L30, 16
L31, L32, L34, L44, L45, L46, L50,
L52, L54
3301-001574 BEAD-SMD L35, L36, L37, L38, L39, L40, L41, 8
L42
3409-000121 SWITCH-HOOK S1 1
3409-001176 SWITCH-DETECTOR S2, S3 2
3708-002288 CONNECTOR- J21 1
FPC/FFC/PIC
3711-000015 HEADER-BOARD TO J15 1
CABLE
3711-000024 HEADER-BOARD TO J20 1
CABLE
3711-000541 HEADER-BOARD TO J12 1
CABLE
3711-001512 HEADER-BOARD TO J11 1
CABLE
3711-003801 HEADER-BOARD TO J19 1
CABLE
3722-001322 JACK-MODULAR J13, J14 2
3722-001514 JACK-DC POWER J10 1
3722-002875 JACK-MODULAR J16, J17 2
GA39-00038A CBF HARNESS XX 1
GA68-00289A LABEL (P)-BAR XX 1
CODE
GB29-00005A FILTER LINE M1 1
GB41-00080A PCB PCS01C 1
GB94-00541A PHANTOM SM - 1

© SAMSUNG Electronics Co., Ltd. A-5

ANNEX A.

This page is intentionally left blank.

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 SMT-i5210 Service Manual

ANNEX B. Parts Layout

This chapter provides the parts layout of the SMT-i5210 IP phone.

B.1 SMT-i5210 PBA-Front

© SAMSUNG Electronics Co., Ltd. B-1

ANNEX B.

B.2 SMT-i5210 PBA-Rear

B-2 www.telephonesystemsdirect.co.uk.
 SMT-i5210 Service Manual

ABBREVIATION

A
AOM Add On Module

C
CPU Central Processing Unit

D
DSS Direct Station Select

E
ESD Electrostatic Sensitive Devices

F
FIFO First In First Out
FPC Flexible Printed Circuit

G
GPIO General Purpose Input/Output

I
IP Internet Protocol

L
LAN Local Area Network
LCD Liquid Crystal Display
LED Light Emitting Diode

N
NOR Not OR

© SAMSUNG Electronics Co., Ltd. I

 SMT-i5210 Service Manual

M
MIB Management Information Base

P
PoE Power Over Ethernet

S
SDRAM Synchronous Dynamic Random Access Memory

II © SAMSUNG Electronics Co., Ltd.

This document has been reproduced by TelephoneSystemsDirect with the kind permission of
Samsung.
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For more information on this, or any other Samsung phone system product, please feel free
to contact our team of Samsung Platinum Partner professionals at:

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0800 652 8052
www.telephonesystemsdirect.co.uk

SMT-i5210
Service Manual

©2010 Samsung Electronics Co., Ltd.

All rights reserved.

Information in this manual is proprietary to SAMSUNG

Electronics Co., Ltd.
No information contained here may be copied, translated,
transcribed or duplicated by any form without the prior written
consent of SAMSUNG.
Information in this manual is subject to change without notice.