Color Monitor: Service Manual
Color Monitor: Service Manual
com
COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : LM62B
MODEL: L226WTQ(L226WTQ-BFQ.A**MQF,A**GQF)
( ) **Same model for Service
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
SPECIFICATIONS ................................................... 2 ADJUSTMENT ...................................................... 13
PRECAUTIONS ....................................................... 4 TROUBLESHOOTING GUIDE .............................. 15
TIMING CHART ....................................................... 8 WIRING DIAGRAM ............................................... 19
DISASSEMBLY ........................................................ 9 EXPLODED VIEW...................................................20
BLOCK DIAGRAM ................................................. 10 REPLACEMENT PARTS LIST ...............................22
DESCRIPTION OF BLOCK DIAGRAM...................11 SCHEMATIC DIAGRAM ......................................... 25
SPECIFICATIONS
1. LCD CHARACTERISTICS 4. MAX. RESOLUTION
Type : TFT Color LCD Module Analog : 1680 x 1050@60Hz
Active Display Area : 22 inch diagonal Digital : 1680 x 1050@60Hz
Pixel Pitch : 0.282 (H) x 0.282 (V)
Size : 493.7(H) x 320.1(V) x 16.5(D) 5. POWER SUPPLY
Color Depth : 16.7M (8bit) colors 5-1. Power Adaptor(Built-in Power)
Electrical Interface : LVDS Input : AC 100-240V~, 50/60Hz, 1.2A
Surface Treatment : AG(Haze 25%), Hard Coating(3H)
Operating Mode : Normally White 5-2. Power Consumption
Backlight Unit : 4 CCFL
MODE H/V SYNC VIDEO POWER CONSUMPTION LED COLOR
2. OPTICAL CHARACTERISTICS less than 50 W(max)
2-1. Viewing Angle by Contrast Ratio ≥ 10 POWER ON (NORMAL) ON/ON ACTIVE BLUE
less than 45 W(typ)
Left : +75° min., +85°(Typ) Right : -75° min., -85°(Typ) STAND BY OFF/ON OFF less than 1 W AMBER
Top :+70° min., +80°(Typ) Bottom : -70° min., -80°(Typ) SUSPEND ON/OFF OFF less than 1 W AMBER
2-2. Luminance : 180(Typ) (Typ. 30)-sRGB DPMS OFF OFF/OFF OFF less than 1 W AMBER
: 220(min), 300(Typ)-6500K POWER S/W OFF - - less than 1 W OFF
: 150(min)-9300K
-2-
Signal Connector Pin Assignment
-3-
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT. WARNING
• There are some special components used in LCD BE CAREFUL ELECTRIC SHOCK !
monitor that are important for safety. These parts are
• If you want to replace with the new backlight (CCFL) or
marked on the schematic diagram and the
inverter circuit, must disconnect the AC adapter
replacement parts list. It is essential that these critical
because high voltage appears at inverter circuit about
parts should be replaced with the manufacturer’s
650Vrms.
specified parts to prevent electric shock, fire or other
hazard.
• Handle with care wires or connectors of the inverter
• Do not modify original design without obtaining written circuit. If the wires are pressed cause short and may
permission from manufacturer or you will void the burn or take fire.
original parts and labor guarantee.
Leakage Current Hot Check Circuit
AC Volt-meter
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners. Good Earth Ground
such as WATER PIPE,
• Do not press on the panel, edge of the frame strongly CONDUIT etc.
To Instrument's
or electric shock as this will result in damage to the exposed
screen. METALLIC PARTS
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
-4-
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this 9. Use with this receiver only the test fixtures specified in
service manual and its supplements and addenda, read this service manual.
and follow the SAFETY PRECAUTIONS on page 3 of this CAUTION: Do not connect the test fixture ground strap
publication. to any heat sink in this receiver.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the Electrostatically Sensitive (ES) Devices
safety precautions on page 3 of this publication, always Some semiconductor (solid-state) devices can be
follow the safety precautions. Remember: Safety First. damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
General Servicing Precautions Devices. Examples of typical ES devices are integrated
1. Always unplug the receiver AC power cord from the AC circuits and some field-effect transistors and
power source before; semiconductor "chip" components. The following
a. Removing or reinstalling any component, circuit techniques should be used to help reduce the incidence of
board module or any other receiver assembly. component damage caused by static by static electricity.
b. Disconnecting or reconnecting any receiver electrical 1. Immediately before handling any semiconductor
plug or other electrical connection. component or semiconductor-equipped assembly, drain
c. Connecting a test substitute in parallel with an off any electrostatic charge on your body by touching a
electrolytic capacitor in the receiver. known earth ground. Alternatively, obtain and wear a
CAUTION: A wrong part substitution or incorrect commercially available discharging wrist strap device,
polarity installation of electrolytic capacitors may which should be removed to prevent potential shock
result in an explosion hazard. reasons prior to applying power to the unit under test.
d. Discharging the picture tube anode. 2. After removing an electrical assembly equipped with
2. Test high voltage only by measuring it with an ES devices, place the assembly on a conductive
appropriate high voltage meter or other voltage surface such as aluminum foil, to prevent electrostatic
measuring device (DVM, FETVOM, etc) equipped with charge buildup or exposure of the assembly.
a suitable high voltage probe. 3. Use only a grounded-tip soldering iron to solder or
Do not test high voltage by "drawing an arc". unsolder ES devices.
3. Discharge the picture tube anode only by (a) first 4. Use only an anti-static type solder removal device.
connecting one end of an insulated clip lead to the Some solder removal devices not classified as "anti-
degaussing or kine aquadag grounding system shield static" can generate electrical charges sufficient to
at the point where the picture tube socket ground lead damage ES devices.
is connected, and then (b) touch the other end of the 5. Do not use freon-propelled chemicals. These can
insulated clip lead to the picture tube anode button, generate electrical charges sufficient to damage ES
using an insulating handle to avoid personal contact devices.
with high voltage. 6. Do not remove a replacement ES device from its
4. Do not spray chemicals on or near this receiver or any protective package until immediately before you are
of its assemblies. ready to install it. (Most replacement ES devices are
5. Unless specified otherwise in this service manual, packaged with leads electrically shorted together by
clean electrical contacts only by applying the following conductive foam, aluminum foil or comparable
mixture to the contacts with a pipe cleaner, cotton- conductive material).
tipped stick or comparable non-abrasive applicator; 7. Immediately before removing the protective material
10% (by volume) Acetone and 90% (by volume) from the leads of a replacement ES device, touch the
isopropyl alcohol (90%-99% strength) protective material to the chassis or circuit assembly
CAUTION: This is a flammable mixture. into which the device will be installed.
Unless specified otherwise in this service manual, CAUTION: Be sure no power is applied to the chassis
lubrication of contacts in not required. or circuit, and observe all other safety precautions.
6. Do not defeat any plug/socket B+ voltage interlocks 8. Minimize bodily motions when handling unpackaged
with which receivers covered by this service manual replacement ES devices. (Otherwise harmless motion
might be equipped. such as the brushing together of your clothes fabric or
7. Do not apply AC power to this instrument and/or any of the lifting of your foot from a carpeted floor can
its electrical assemblies unless all solid-state device generate static electricity sufficient to damage an ES
heat sinks are correctly installed. device.)
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
-5-
General Soldering Guidelines Replacement
1. Use a grounded-tip, low-wattage soldering iron and 1. Carefully insert the replacement IC in the circuit board.
appropriate tip size and shape that will maintain tip 2. Carefully bend each IC lead against the circuit foil pad
temperature within the range or 500 F to 600 F. and solder it.
2. Use an appropriate gauge of RMA resin-core solder 3. Clean the soldered areas with a small wire-bristle
composed of 60 parts tin/40 parts lead. brush. (It is not necessary to reapply acrylic coating to
3. Keep the soldering iron tip clean and well tinned. the areas).
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a "Small-Signal" Discrete Transistor
metal handle. Removal/Replacement
Do not use freon-propelled spray-on cleaners. 1. Remove the defective transistor by clipping its leads as
5. Use the following unsoldering technique close as possible to the component body.
a. Allow the soldering iron tip to reach normal 2. Bend into a "U" shape the end of each of three leads
temperature. remaining on the circuit board.
(500 F to 600 F) 3. Bend into a "U" shape the replacement transistor leads.
b. Heat the component lead until the solder melts. 4. Connect the replacement transistor leads to the
c. Quickly draw the melted solder with an anti-static, corresponding leads extending from the circuit board
suction-type solder removal device or with solder and crimp the "U" with long nose pliers to insure metal
braid. to metal contact then solder each connection.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil. Power Output, Transistor Device
6. Use the following soldering technique. Removal/Replacement
a. Allow the soldering iron tip to reach a normal 1. Heat and remove all solder from around the transistor
temperature (500 F to 600 F) leads.
b. First, hold the soldering iron tip and solder the strand 2. Remove the heat sink mounting screw (if so equipped).
against the component lead until the solder melts. 3. Carefully remove the transistor from the heat sink of the
circuit board.
c. Quickly move the soldering iron tip to the junction of 4. Insert new transistor in the circuit board.
the component lead and the printed circuit foil, and 5. Solder each transistor lead, and clip off excess lead.
hold it there only until the solder flows onto and 6. Replace heat sink.
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the Diode Removal/Replacement
circuit board printed foil. 1. Remove defective diode by clipping its leads as close
d. Closely inspect the solder area and remove any as possible to diode body.
excess or splashed solder with a small wire-bristle 2. Bend the two remaining leads perpendicular y to the
brush. circuit board.
3. Observing diode polarity, wrap each lead of the new
IC Remove/Replacement diode around the corresponding lead on the circuit
Some chassis circuit boards have slotted holes (oblong) board.
through which the IC leads are inserted and then bent flat 4. Securely crimp each connection and solder it.
against the circuit foil. When holes are the slotted type, 5. Inspect (on the circuit board copper side) the solder
the following technique should be used to remove and joints of the two "original" leads. If they are not shiny,
replace the IC. When working with boards using the reheat them and if necessary, apply additional solder.
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above. Fuse and Conventional Resistor
Removal/Replacement
Removal 1. Clip each fuse or resistor lead at top of the circuit board
1. Desolder and straighten each IC lead in one operation hollow stake.
by gently prying up on the lead with the soldering iron 2. Securely crimp the leads of replacement component
tip as the solder melts. around notch at stake top.
2. Draw away the melted solder with an anti-static 3. Solder the connections.
suction-type solder removal device (or with solder CAUTION: Maintain original spacing between the
braid) before removing the IC. replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
-6-
Circuit Board Foil Repair At Other Connections
Excessive heat applied to the copper foil of any printed Use the following technique to repair the defective copper
circuit board will weaken the adhesive that bonds the foil pattern at connections other than IC Pins. This technique
to the circuit board causing the foil to separate from or involves the installation of a jumper wire on the
"lift-off" the board. The following guidelines and component side of the circuit board.
procedures should be followed whenever this condition is 1. Remove the defective copper pattern with a sharp
encountered. knife.
Remove at least 1/4 inch of copper, to ensure that a
At IC Connections hazardous condition will not exist if the jumper wire
To repair a defective copper pattern at IC connections use opens.
the following procedure to install a jumper wire on the 2. Trace along the copper pattern from both sides of the
copper pattern side of the circuit board. (Use this pattern break and locate the nearest component that is
technique only on IC connections). directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
1. Carefully remove the damaged copper pattern with a of the nearest component on one side of the pattern
sharp knife. (Remove only as much copper as break to the lead of the nearest component on the
absolutely necessary). other side.
2. carefully scratch away the solder resist and acrylic Carefully crimp and solder the connections.
coating (if used) from the end of the remaining copper CAUTION: Be sure the insulated jumper wire is
pattern. dressed so the it does not touch components or sharp
3. Bend a small "U" in one end of a small gauge jumper edges.
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
-7-
TIMING CHART
VIDEO
B
SYNC
D E F
-8-
DISASSEMBLY
#1 #2
#3 #4
#7
-9-
GM5726H
3.3V
Line Buffer GenesisACE LV D S
Analog I(R/ G/B) ADC
Vcc
LVDS 5V
D-Sub
Module
EEPROM Scaler
Tx
(EDID) TMDS Rx
DVI(TMDS) OSD
DVI-D
EEPROM 1.8V
MCU
SSC
KEY
(EDID)
SDA
- 10 -
/SCL
LIPS
EEPROM
Flash ROM
(System)
BLOCK DIAGRAM
5V 3.3V 3.3V
3.3V
Filter 12V 5V Regulator 1.8V
15V
Inverter(4Lamps)
DESCRIPTION OF BLOCK DIAGRAM
2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
15V is provided for inverter in L226WT/WTM.
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC 15V to AC 820Vrms and operates back-light lamps of module in L226WT/WTM.
3. MICOM Part.
This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset IC and
the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in EEPROM.
- 11 -
LIPS Board Block Diagram
15V
50 ~ 60Hz
HVDC 100KHz 5V
EMI INPUT RECTIFIER ENERGY OUTPUT RECTIFIER
COMPONENTS AND FILTER TRANSFER AND FILTER
LINE GND
100 ~ 240V
SIGNAL
PWM PHOTO- Collection
CONTROL COUPLER and
CIRCUIT ISOLATION Feedback
PRIMARY SECONDARY
Operation description_Power
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
achieve the stabilized DC output voltage.
6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo
transistor.
- 12 -
ADJUSTMENT
Windows EDID V1.0 User Manual 2. EDID Read & Write
1) Run WinEDID.exe
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Doesn’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available for LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folder
b) Run Userport.exe
- 13 -
SERVICE OSD
1) Turn off the power switch at the right side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch for 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
IBM 9 6
Video Signal 5 1
Compatible PC 15 11
Generator 10 6
5 1
C
PARALLEL PORT
d
13
se
1
tu
2C
25
No
14
23
RS
OFF ON
5V
EL
Control Line
F
LL
C
RA
PA
VG ON
WE
S 5V
(110V/220V)
PO
E 74LS06
A
T
MO Power LED
CS
NI OFF 4.7K
YN
TO
V-S
R
74LS06
E ST Switch
B
B
F V-Sync On/Off Switch
(Switch must be ON.)
- 14 -
TROUBLESHOOTING GUIDE
1. NO POWER
NO POWER
(POWER INDICATOR OFF)
YES
YES
NO
4
1 CHECK IC501 PIN108 CHECK CRYSTAL(X501)
PULSE
YES
CHECK IC501
Waveforms
1 P702-#5,6 2 IC601-#2 3 IC602-#2 4 IC501-#108
- 15 -
2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS
NO RASTER
(OSD IS NOT DISPLAYED)
CHECK P702 NO
CHECK POWER BOARD
1 VOLTAGE PIN5,6 (LIPS)
(5V)?
YES
YES
1. CONFIRM BRIGHTNESS
NO
OSD CONTRL STATUS
2 CHECK P702
2. CHECK MICOM DIM-ADJ
PIN10
PORT
YES
CHECK
PULSE AS
CONTACTING PROBE NO
3 POWER BOARD (LIPS)
TO THE LAMP
WIRE OF THE
LCD MODULE
YES
Waveforms
1 P702-#5,6 2 P702-#10 3 LAMP CURRENT
- 16 -
3. NO RASTER (OSD IS NOT DISPLAYED) - MAIN
NO RASTER
(OSD IS NOT DISPLAYED)
YES
YES
CHECK IC501
PIN89(H-SYNC) AND NO CHECK CONNECTION LINE
PIN90(V-SYNC).
FROM D-SUB TO IC501
IS PULSE APPEARED AT
SIGNAL PINS?
YES
TROUBLE IN CABLE
OR LCD MODULE
Waveforms
4 IC501-#108
- 17 -
4. TROUBLE IN DPM
TROUBLE IN DPM
YES
1 CHECK NO
IC501 PIN89,90 CHECK H/V SYNC LINE
2 SYNC PULSE
YES
TROUBLE IN IC501
Waveforms
1 H-SYNC 2 V-SYNC
- 18 -
WIRING DIAGRAM
28P
11P
6631900109A
6631T20020Q
6P
EAD36549101
4P
6631V12031F
- 19 -
300
174
200
500
510
520
310 410
- 20 -
320
330
EXPLODED VIEW
430 900
910
920
EXPLODED VIEW PARTS LIST
or 6410TCW007A Power Cord, CCC,LSG-31&RVA18N<F10A&LS-70_1.87M_BLK LSG-31 LS-70 1.87M - 250V 10A RVV 3X0.75MM2 BLACK CCC N LONGWELL ELECTRONICS (SUZHOU)COMPANY-For China
6410TBW004A Power Cord, LP-61L+GFC18N+<B90A+LS-60_1.87M_BLK LP-61L LS-60 1.87M NONE 250V 10A H05VV-F 3X0.75MM2 BLACK BSI N LONGWELL ELECTRONICS (SUZHOU)COMPANY-For H.K
6410TPW003A Power Cord, LP-33 & GFC18N<B90A+LS-60_1.87M_BLK LP-33 LS-60 1.87M - 250V 16A H05VV-F 3X0.75MM2 BLACK PCT N LONGWELL COMPANY-For Russia
64109UP002A Power Cord, DTII-3P-11+DTII-3P-04 HONGCHANG UL/CSA 1870MM PLUG BLACK-For U.S.A
6410TEW011A Power Cord, IMO LP-22 & H05VV-F 0.75_3C & LS-60_1.87M_BLK LP-22 LS-60 1.87M NONE 250V 10A H05VV-F 3X0.75MM2 BLACK IMQ N LONGWELL COMPANY-For Chile
200 EAJ33945801 LCD,Module-TFT, LM220WE1-TLA1 DRIVER 22.0INCH 1680X1050 300CD COLOR 72% 16/10 800:1 160/160 5ms 4LAMPS LG PHILIPS LCD
EAJ33527501 LCD,Module-TFT, M220Z1-L01 ZBD DRIVER 22.0INCH 1680X1050 300CD COLOR 72% 16/10 700:1 4CCFL, 2CH-LVDS, 5MS, 170/160 CHI MEI OPTOELECTRONICS CORP
210 MCK33950601 Cover, MOLD ABS L225W ABS L225W Vesa Plate-OPTION
300 ABJ31701224 Cabinet Assembly, L226WTQ LM62A 23" Black,3000:1+2ms+EPA, China Market,
310 MEY33947503 Knob, MOLD ABS MAIN 5 L225W Control Knob(5Key) Black
330 MFB33947801 Lens, MOLD PMMA BenQ LENS L225W Eagel Eye
400 ACQ31701704 Cover Assembly,Rear, L225W LM62A 23" Backcover LPL DVI,D-SUB
ACQ31701720 Cover Assembly,Rear, L225W LM62A 23" Backcover LPL DVI,D-SUB,mercury-Only U.S.A
410 MGJ33948901 Plate,Metal, PRESS SECC 0.8 SUPPORTER SECC L225W Stand Bracket Metal
420 ADV31702015 Frame Assembly, L226W LM62A 23" Rear Shield Assy(DVI-D,D-SUB) for LPL
430 ADV32121501 Frame Assembly, L226W LM62A 23" Lamp shield assy
510 6871TPT318E PCB Assembly,Power, PLLM-M602A POWER T.T CMO L225W 22"Wide Scaler Dimming LG INNOTEK CO., LTD
520 EBR33771801 PCB Assembly,Sub, CONTROL NT CKD T.T LM62B L225WT KRDGQFN L226WT NT CKD CONTROL
900 AAN31689301 Base Assembly, STAND L225WT LM62A STAND HINGE BODY ASSY
910 AAN31689201 Base Assembly, STAND L225WT LM62A STAND BODY ASSY
920 AAN31688001 Base Assembly, ASSY L225WT LM62A STAND BASE ASSY
- 21 -
REPLACEMENT PARTS LIST
CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,
READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.
* NOTE : S SAFETY Mark
AL ALTERNATIVE PARTS
- 22 -
DATE: 2007. 02. 22. DATE: 2007. 02. 22.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
D605 0DS226009AA KDS226 1.2V 85V 300MA 2A 4NS R547 0RJ0562D677 MCR03EZPJ560 56OHM 5% 1/10W
D606 0DS226009AA KDS226 1.2V 85V 300MA 2A 4NS R548 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W
D607 0DS226009AA KDS226 1.2V 85V 300MA 2A 4NS R549 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W
D608 0DS226009AA KDS226 1.2V 85V 300MA 2A 4NS R550 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W
D609 0DS226009AA KDS226 1.2V 85V 300MA 2A 4NS R553 0RJ2400D677 MCR03EZPJ241 240OHM 5% 1/10W
D610 0DS226009AA KDS226 1.2V 85V 300MA 2A 4NS R554 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W
D611 0DS226009AA KDS226 1.2V 85V 300MA 2A 4NS R566 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1
D612 0DSON00138A MMBD301LT1G 600MV 30V - - 1. R567 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1
D613 0DSON00138A MMBD301LT1G 600MV 30V - - 1. R568 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1
D614 0DD184009AA KDS184 KDS184 TP KEC - 85V - R569 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1
D615 0DD184009AA KDS184 KDS184 TP KEC - 85V - R577 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W
ZD601 0DZ560009GB BZT52C5V6S-(F) 5.6V 5.2TO6V R578 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W
ZD603 0DZ560009GB BZT52C5V6S-(F) 5.6V 5.2TO6V R583 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W
ZD605 0DZ560009GB BZT52C5V6S-(F) 5.6V 5.2TO6V R584 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W
ZD606 0DZ560009GB BZT52C5V6S-(F) 5.6V 5.2TO6V R588 0RJ0222D677 MCR03EZPJ220 22OHM 5% 1/10W
ZD607 0DZ560009GB BZT52C5V6S-(F) 5.6V 5.2TO6V R589 0RJ0222D677 MCR03EZPJ220 22OHM 5% 1/10W
ZD608 0DZ560009GB BZT52C5V6S-(F) 5.6V 5.2TO6V R590 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W
ZD610 0DZ560009GB BZT52C5V6S-(F) 5.6V 5.2TO6V R591 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W
R592 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1
ICs R593 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1
R594 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
IC501 EAN36489801 L226WTQ GUMI FRESH MEMORY R595 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
IC502 EAN31470701 GM5822H-LF-AA 1.8VTO3.3V 14. R596 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1
IC503 EAN31557001 HY57V161610FTP-6 16MBIT 1MX1 R597 0RJ2001D677 MCR03EZPJ202 2KOHM 5% 1/10W
IC504 EAN31557001 HY57V161610FTP-6 16MBIT 1MX1 R598 0RJ2001D677 MCR03EZPJ202 2KOHM 5% 1/10W
IC505 0IMMRSG036B M24C16-WMN6TP 16KBIT 2KX8BIT R599 0RJ2702D677 MCR03EZPJ273 27KOHM 5% 1/10W
IC601 0IMMR00014A M24C02-RMN6TP 2KBIT 256X8BIT R601 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
IC602 0IMMR00014A M24C02-RMN6TP 2KBIT 256X8BIT R602 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
IC702 0IPMGSG016A LD1086D2T18TR 3.4TO30V 1.8V R603 0RJ0752D677 MCR03EZPJ750 75OHM 5% 1/10W
IC703 0IPMGA0010A AZ1117H-3.3 4.75TO10V 3.3V 0 R604 0RJ0752D677 MCR03EZPJ750 75OHM 5% 1/10W
R605 0RJ0752D677 MCR03EZPJ750 75OHM 5% 1/10W
FILTERs R606 0RJ0682D677 MCR03EZPJ680 68OHM 5% 1/10W
R607 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1
L501 6210TCE0013 HB-1M1608-121JT 120OHM 1.6X0 R608 0RJ0682D677 MCR03EZPJ680 68OHM 5% 1/10W
L502 6210TCE0013 HB-1M1608-121JT 120OHM 1.6X0 R609 0RJ4700D677 MCR03EZPJ471 470OHM 5% 1/10W
R610 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
TRANSISTORs R611 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
R612 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
Q502 0TRDI80002A MMBT3904-(F) NPN 6V 60V 40V R613 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
Q601 0TR390609FA KST3906-MTF PNP -5V -40V -40 R614 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
Q602 0TR390609FA KST3906-MTF PNP -5V -40V -40 R615 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
R616 0RJ4700D677 MCR03EZPJ471 470OHM 5% 1/10W
RESISTORs R617 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
R618 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
R503 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W R619 0RJ1001D677 MCR03EZPJ102 1KOHM 5% 1/10W
R511 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10 R620 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R514 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1 R621 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R519 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10 R622 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R524 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1 R623 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R525 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W R624 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R526 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W R625 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R527 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W R626 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R528 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W R627 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R529 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1 R628 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W
R530 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1 R629 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W
R538 0RJ5601D677 MCR03EZPJ562 5.6KOHM 5% 1/10 R630 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W
R540 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W R631 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W
R541 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W R632 0RJ2200D677 MCR03EZPJ221 220OHM 5% 1/10W
R542 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W R633 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W
R544 0RJ0562D677 MCR03EZPJ560 56OHM 5% 1/10W R635 0RJ4700D677 MCR03EZPJ471 470OHM 5% 1/10W
R545 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1 R636 0RJ0392D677 MCR03EZPJ390 39OHM 5% 1/10W
R546 0RJ0562D677 MCR03EZPJ560 56OHM 5% 1/10W R637 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W
- 23 -
DATE: 2007. 02. 22.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
OTHERs
CONTROL BOARD
- 24 -
SCHEMATIC DIAGRAM
1. SCALER
- 25 -
2. POWER
- 26 -
3. WAFER
- 27 -
4. CONTROL
- 28 -
Feb. 2007
P/NO : MFL36713646 Printed in Korea