4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler

April 2007

4N29, 4N30, 4N31, 4N32, 4N33 tm

General Purpose 6-Pin Photodarlington Optocoupler

Features Description
■ High sensitivity to low input drive current The 4N29, 4N30, 4N31, 4N32, 4N33 have a gallium
■ Meets or exceeds all JEDEC Registered arsenide infrared emitter optically coupled to a silicon
Specifications planar photodarlington.
■ VDE 0884 approval available as a test option
– add option .300. (e.g., 4N29.300)

Applications
■ Low power logic circuits
■ Telecommunications equipment
■ Portable electronics
■ Solid state relays
■ Interfacing coupling systems of different potentials
and impedances

Packages Schematic

White Package (-M Suffix)

6 ANODE 1 6 BASE
6
1

1
CATHODE 2 5 COLLECTOR

1
N/C 3 4 EMITTER

Black Package (No -M Suffix)

6
6
1
1

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1
 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler
Absolute Maximum Ratings (TA = 25°C Unless otherwise specified.)
Symbol Parameter Device Value Units
TOTAL DEVICE
TSTG Storage Temperature Non M -55 to +150 °C
M -40 to +150
TOPR Operating Temperature Non M -55 to +100 °C
M -40 to +100
TSOL Lead Solder Temperature All 260 for 10 sec °C
PD Total Device Power Dissipation @ TA = 25°C All 250 mW
Derate above 25°C 3.3 mW/°C
EMITTER
IF Continuous Forward Current All 80 mA
VR Reverse Voltage All 3 V
IF(pk) Forward Current – Peak (300µs, 2% Duty Cycle) All 3.0 A
PD LED Power Dissipation @ TA = 25°C All 150 mW
Derate above 25°C 2.0 mW/°C
DETECTOR
BVCEO Collector-Emitter Breakdown Voltage All 30 V
BVCBO Collector-Base Breakdown Voltage All 30 V
BVECO Emitter-Collector Breakdown Voltage All 5 V
PD Detector Power Dissipation @ TA = 25°C All 150 mW
Derate above 25°C 2.0 mW/°C
IC Continuous Collector Current All 150 mA

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 2
 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler
Electrical Characteristics (TA = 25°C Unless otherwise specified.)
Individual Component Characteristics
Symbol Parameter Test Conditions Min. Typ. Max. Unit
EMITTER
VF Input Forward Voltage* IF = 10mA – 1.2 1.5 V
IR Reverse Leakage Current* VR = 3.0V – 0.001 100 µA
C Capacitance* VF = 0V, f = 1.0MHz – 150 – pF
DETECTOR
BVCEO Collector-Emitter Breakdown Voltage* IC = 1.0mA, IB = 0 30 60 – V
BVCBO Collector-Base Breakdown Voltage* IC = 100µA, IE = 0 30 100 – V
BVECO Emitter-Collector Breakdown Voltage* IE = 100µA, IB = 0 5.0 8 – V
ICEO Collector-Emitter Dark Current* VCE = 10V, Base Open – 1 100 nA
hFE DC Current Gain VCE = 5.0V, IC = 500µA – 5000 –

Transfer Characteristics
Symbol Parameter Test Conditions Min. Typ. Max. Unit
DC CHARACTERISTICS
IC(CTR) Collector Output Current*(1, 2) IF = 10mA, VCE = 10V, IB = 0
4N32, 4N33 50 (500) – – mA (%)
4N29, 4N30 10 (100) – –
4N31 5 (50) – –
VCE(SAT) Saturation Voltage*(2) IF = 8mA, IC = 2.0mA
4N29, 4N30, 4N32, 4N33 – – 1.0 V
4N31 – – 1.2
AC CHARACTERISTICS
ton Turn-on Time IF = 200mA, IC = 50mA, – – 5.0 µS
VCC = 10V
toff Turn-off Time
4N32, 4N33 IF = 200mA, IC = 50mA, – – 100 µS
4N29, 4N30, 4N31 VCC = 10V – – 40
BW Bandwidth(3, 4) – 30 – kHz

Isolation Characteristics
Symbol Characteristic Test Conditions Min. Typ. Max. Units
VISO Input-Output Isolation Voltage(5)
4N29, 4N30, 4N31, 4N32, 4N33 II-O ≤ 1µA, Vrms, t = 1min. 5300 – – Vac(rms)
4N32* VDC 2500 – – V
4N33* VDC 1500 – –
RISO Isolation Resistance(5) VI-O = 500VDC – 1011 – Ω
CISO Isolation Capacitance(5) VI-O = Ø, f = 1MHz – 0.8 – pF

Notes:
* Indicates JEDEC registered data.
1. The current transfer ratio(IC/IF) is the ratio of the detector collector current to the LED input current with VCE @ 10V.
2. Pulse test: pulse width = 300µs, duty cycle ≤ 2.0% .
4. IF adjusted to IC = 2.0mA and IC = 0.7mA rms.
5. The frequency at which IC is 3dB down from the 1kHz value.
6. For this test, LED pins 1 and 2 are common, and phototransistor pins 4, 5 and 6 are common.

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 3
 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler
Typical Performance Curves
Fig. 1 LED Forward Voltage vs. Forward Current Fig. 2 LED Forward Voltage vs. Forward Current
(Black Package) (White Package)
1.8 1.8

1.7 1.7
VF - FORWARD VOLTAGE (V)

VF - FORWARD VOLTAGE (V)

1.6 1.6

1.5 1.5

1.4 1.4
TA = -55°C
TA = -55°C
1.3 1.3
TA = 25°C
TA = 25°C
1.2 1.2

TA = 100°C
1.1 TA = 100°C 1.1

1.0 1.0

1 10 100 1 10 100

IF - LED FORWARD CURRENT (mA) IF - LED FORWARD CURRENT (mA)

Fig.3 Normalized CTR vs. Forward Current Fig.4 Normalized CTR vs. Forward Current
(Black Package) (White Package)
1.4 1.6
VCE = 5.0V Normalized to VCE = 5.0V Normalized to
TA = 25°C IF = 10 mA TA = 25°C IF = 10 mA
1.2 1.4

1.2
1.0
NORMALIZED CTR
NORMALIZED CTR

1.0
0.8

0.8
0.6
0.6

0.4
0.4

0.2
0.2

0.0 0.0
0 5 10 15 20 0 2 4 6 8 10 12 14 16 18 20

IF - FORWARD CURRENT (mA) IF - FORWARD CURRENT (mA)

Fig. 5 Normalized CTR vs. Ambient Temperature Fig. 6 Normalized CTR vs. Ambient Temperature
(Black Package) (White Package)
1.6 1.4

1.4 IF = 5 mA 1.2
IF = 5 mA
NORMALIZED CTR
NORMALIZED CTR

1.2 1.0

IF = 10 mA IF = 10 mA

1.0 0.8

0.8 0.6 IF = 20 mA

0.6 0.4 Normalized to

Normalized to
IF = 20 mA IF = 10 mA
IF = 10 mA TA = 25°C
TA = 25°C
0.4 0.2

-75 -50 -25 0 25 50 75 100 125 -60 -40 -20 0 20 40 60 80 100

TA - AMBIENT TEMPERATURE (°C) TA - AMBIENT TEMPERATURE (°C)

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 4
 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler
Typical Performance Curves (Continued)
Fig. 7 CTR vs. RBE (Unsaturated) Fig. 8 CTR vs. RBE (Unsaturated)
(Black Package) (White Package)
1.0 1.0

NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))

NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))

0.9 0.9
IF = 20 mA

0.8 VCE= 5.0 V 0.8

IF = 20 mA IF = 10 mA
0.7 0.7
IF = 5 mA
0.6
0.6 IF = 10 mA
0.5
0.5
0.4
0.4 IF = 5 mA
0.3
0.3
0.2
0.2 VCE= 5.0 V
0.1
0.1
0.0

0.0
10 100 1000 10 100 1000

RBE- BASE RESISTANCE (kΩ) RBE- BASE RESISTANCE (kΩ)

Fig. 9 CTR vs. RBE (Saturated) Fig. 10 CTR vs. RBE (Saturated)
(Black Package) (White Package)
1.0 1.0
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))

NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))

0.9 0.9
VCE= 0.3 V VCE= 0.3 V
0.8 0.8
IF = 20 mA
0.7 0.7 IF = 20 mA

0.6 0.6
IF = 10 mA

0.5 0.5 IF = 10 mA

0.4 0.4

0.3 IF = 5 mA 0.3 IF = 5 mA

0.2 0.2

0.1 0.1

0.0 0.0

10 100 1000 10 100 1000

RBE- BASE RESISTANCE (k Ω) RBE- BASE RESISTANCE (k Ω)

Fig. 11 Collector-Emitter Saturation Voltage vs Collector Current Fig. 12 Collector-Emitter Saturation Voltage vs Collector Current
(Black Package) (White Package)
VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)

100 100

TA = 25˚C
10 10

1 1

IF = 2.5 mA IF = 2.5 mA

0.1 0.1

IF = 20 mA
IF = 10 mA IF = 20 mA
0.01 0.01
IF = 5 mA
IF = 5 mA IF = 10 mA
TA = 25˚C
0.001 0.001
0.01 0.1 1 10
0.01 0.1 1 10

IC - COLLECTOR CURRENT (mA) IC - COLLECTOR CURRENT (mA)

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 5
 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler
Typical Performance Curves (Continued)

Fig. 13 Switching Speed vs. Load Resistor Fig. 14 Switching Speed vs. Load Resistor
(Black Package) (White Package)
1000 1000

IF = 10 mA IF = 10 mA
VCC = 10 V VCC = 10 V
TA = 25°C TA = 25°C
SWITCHING SPEED - (µs)

100 100

SWITCHING SPEED - (µs)

Toff Toff
10 Tf 10 Tf

Ton Ton

1 Tr 1
Tr

0.1 0.1

0.1 1 10 100 0.1 1 10 100

R-LOAD RESISTOR (kΩ) R-LOAD RESISTOR (kΩ)

Fig. 15 Normalized ton vs. RBE Fig. 16 Normalized ton vs. RBE
(Black Package) (White Package)
5.0 5.0

4.5 VCC = 10 V 4.5 VCC = 10 V

NORMALIZED ton - (ton(RBE) / ton(open))

NORMALIZED ton - (ton(RBE) / ton(open))

IC = 2 mA IC = 2 mA
RL = 100 Ω RL = 100 Ω
4.0
4.0

3.5
3.5

3.0
3.0
2.5
2.5
2.0
2.0
1.5

1.5
1.0

1.0
0.5
10 100 1000 10000 100000 10 100 1000 10000 100000

RBE- BASE RESISTANCE (k Ω) RBE- BASE RESISTANCE (k Ω)

Fig. 17 Normalized toff vs. RBE Fig. 18 Normalized toff vs. RBE
(Black Package) (White Package)
1.4 1.4

1.3 1.3
NORMALIZED toff - (toff(RBE) / toff(open))

NORMALIZED toff - (toff(RBE) / toff(open))

1.2 1.2

1.1 1.1

1.0 1.0

0.9 0.9

0.8 0.8

0.7 0.7

0.6 0.6
VCC = 10 V VCC = 10 V
0.5 IC = 2 mA 0.5 IC = 2 mA
RL = 100 Ω RL = 100 Ω
0.4 0.4

0.3 0.3

0.2 0.2

0.1 0.1
10 100 1000 10000 100000 10 100 1000 10000 100000

RBE- BASE RESISTANCE (k Ω) RBE- BASE RESISTANCE (k Ω)

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 6
 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler
Typical Performance Curves (Continued)

Fig. 19 Dark Current vs. Ambient Temperature

10000
VCE = 10 V

ICEO - COLLECTOR -EMITTER DARK CURRENT (nA)

TA = 25°C
1000

100

10

0.1

0.01

0.001
0 20 40 60 80 100

TA - AMBIENT TEMPERATURE (°C)

TEST CIRCUIT WAVE FORMS

VCC = 10V
INPUT PULSE
IF IC RL

10%
INPUT OUTPUT OUTPUT PULSE
90%
RBE
tr tf

ton toff
Adjust IF to produce IC = 2 mA

Figure 20. Switching Time Test Circuit and Waveforms

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 7
 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler
Black Package (No -M Suffix)

Package Dimensions (Through Hole) Package Dimensions (Surface Mount)

PIN 1
ID. 0.350 (8.89)
0.320 (8.13)

0.270 (6.86) Pin 1 ID

0.240 (6.10)

0.390 (9.90)
0.332 (8.43)
0.260 (6.60)
0.240 (6.10)
SEATING PLANE

0.350 (8.89)
0.330 (8.38)

0.070 (1.78)
0.045 (1.14)
0.070 (1.77)
0.040 (1.02)

Seating Plane
0.320 (8.13)
0.014 (0.36)
0.200 (5.08)
0.010 (0.25)
0.115 (2.92)

0.020 (0.51) 0.200 (5.08) 0.012 (0.30)

0.154 (3.90)
0.100 (2.54) MIN 0.115 (2.93) 0.008 (0.20)

0.016 (0.40)
0.008 (0.20)
0.022 (0.56) 0.300 (7.62) 0.025 (0.63)
0° to 15° TYP
0.016 (0.41) 0.020 (0.51)
0.100 [2.54]
0.100 (2.54) 0.035 (0.88)
0.020 (0.50)
TYP 0.012 (0.30)
0.016 (0.41)

Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for

Surface Mount Leadform
PIN 1 ID

0.070 (1.78)
0.270 (6.86)
0.240 (6.10)

0.060 (1.52)

0.350 (8.89)
0.330 (8.38)
0.415 (10.54) 0.100 (2.54)
0.070 (1.78)
0.045 (1.14)
SEATING PLANE

0.295 (7.49) 0.030 (0.76)

0.200 (5.08)
0.135 (3.43)

0.154 (3.90) 0.016 (0.40)

0.004 (0.10)
0.100 (2.54) 0.008 (0.20)
MIN

0° to 15°
0.022 (0.56)
0.016 (0.41)
0.400 (10.16)
0.100 (2.54) TYP TYP

Note:
All dimensions are in inches (millimeters).

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 8
 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler
White Package (-M Suffix)

Package Dimensions (Through Hole) Package Dimensions (Surface Mount)

0.350 (8.89) 0.350 (8.89)

0.320 (8.13) 0.320 (8.13)

PIN 1 ID
Pin 1 ID

0.390 (9.90)
0.332 (8.43)
0.260 (6.60) 0.260 (6.60)
0.240 (6.10) 0.240 (6.10)
SEATING PLANE

0.070 (1.77)
0.070 (1.77) 0.040 (1.02) 0.320 (8.13)
0.040 (1.02)

SEATING PLANE
0.320 (8.13) 0.014 (0.36)
0.014 (0.36)
0.010 (0.25) 0.010 (0.25)

0.200 (5.08) 0.200 (5.08) 0.012 (0.30)

0.115 (2.93) 0.115 (2.93) 0.008 (0.20)

0.100 (2.54) 0.025 (0.63)

0.015 (0.38) 0.020 (0.51)
0.100 [2.54]
0.035 (0.88)
0.020 (0.50) 15° 0.020 (0.50)
0.100 (2.54) 0.006 (0.16)
0.016 (0.41) 0.016 (0.41)
0.012 (0.30)

Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for

Surface Mount Leadform
0.350 (8.89)
0.320 (8.13)
PIN 1 ID

0.070 (1.78)
0.260 (6.60)
0.240 (6.10)

0.060 (1.52)

0.070 (1.77)
0.040 (1.02) 0.415 (10.54) 0.100 (2.54)
0.014 (0.36)
SEATING PLANE

0.010 (0.25)
0.295 (7.49) 0.030 (0.76)
0.200 (5.08)
0.115 (2.93)

0.100 (2.54)
0.015 (0.38)

0.100 [2.54] 0.012 (0.30)

0.020 (0.50) 0.008 (0.21)
0.016 (0.41)
0.425 (10.80)
0.400 (10.16)

Note:
All dimensions are in inches (millimeters).

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 9
 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler
Ordering Information
Black Package White Package
(No Suffix) Example (-M Suffix) Example Option
No Suffix 4N32 No Suffix 4N32M Standard Through Hole Device
.S 4N32S S 4N32SM Surface Mount Lead Bend
.SD 4N32SD SR2 4N32SR2M Surface Mount; Tape and reel
.W 4N32W T 4N32TM 0.4" Lead Spacing
.300 4N32300 V 4N32VM VDE 0884
.300W 4N32300W TV 4N32TVM VDE 0884, 0.4" Lead Spacing
.3S 4N323S SV 4N32SVM VDE 0884, Surface Mount
.3SD 4N323SD SR2V 4N32SR2VM VDE 0884, Surface Mount, Tape & Reel

Marking Information

1 1

4N29 2 4N29 2

6 6
V XX YY K V X YY Q

3 4 5 3 4 5

Black Package, No Suffix White Package, -M Suffix

Definitions
1 Fairchild logo
2 Device number
VDE mark (Note: Only appears on parts ordered with VDE
3
option – See order entry table)
One or two digit year code
4 • Two digits for black package parts, e.g., ‘07’
• One digit for white package parts, e.g., ‘7’
5 Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
*Note – Parts built in the white package (M suffix) that do not have the ‘V’ option (see
definition 3 above) that are marked with date code ‘325’ or earlier are marked in the
portrait format.

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 10
 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler
Tape Dimensions
Black Package, No Suffix

12.0 ± 0.1
4.85 ± 0.20
4.0 ± 0.1 Ø1.55 ± 0.05
0.30 ± 0.05 4.0 ± 0.1
1.75 ± 0.10

7.5 ± 0.1
13.2 ± 0.2 16.0 ± 0.3
9.55 ± 0.20

0.1 MAX 10.30 ± 0.20 Ø1.6 ± 0.1

User Direction of Feed

White Package, -M Suffix

12.0 ± 0.1
4.5 ± 0.20
2.0 ± 0.05 Ø1.5 MIN
0.30 ± 0.05 4.0 ± 0.1
1.75 ± 0.10

11.5 ± 1.0
21.0 ± 0.1 24.0 ± 0.3
9.1 ± 0.20

0.1 MAX 10.1 ± 0.20 Ø1.5 ± 0.1/-0

User Direction of Feed

Note:
All dimensions are in millimeters.

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 11
 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler
Reflow Soldering Profile
Black Package, No Suffix
300
215°C, 10–30 s
250
Temperature (°C)

225 C peak
200

150

100 Time above 183°C, 60–150 sec • Peak reflow temperature: 225°C (package surface temperature)
• Time of temperature higher than 183°C for 60–150 seconds
50 Ramp up = 3C/sec • One time soldering reflow is recommended
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Time (Minute)

White Package, -M Suffix

300
280 260°C
260
240 >245°C = 42 Sec
220
200
180
160 Time above
°C 140 183°C = 90 Sec
120
100 1.822°C/Sec Ramp up rate
80
60
40
20 33 Sec
0
0 60 120 180 270 360
Time (s)

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 12
 4N29, 4N30, 4N31, 4N32, 4N33 General Purpose 6-Pin Photodarlington Optocoupler
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an
exhaustive list of all such trademarks.
®
ACEx i-Lo™ Power-SPM™ TinyBoost™
®
Across the board. Around the world.™ ImpliedDisconnect™ PowerTrench TinyBuck™
®
ActiveArray™ IntelliMAX™ Programmable Active Droop™ TinyLogic
®
Bottomless™ ISOPLANAR™ QFET TINYOPTO™
Build it Now™ MICROCOUPLER™ QS™ TinyPower™
CoolFET™ MicroPak™ QT Optoelectronics™ TinyWire™
CROSSVOLT™ MICROWIRE™ Quiet Series™ TruTranslation™
CTL™ Motion-SPM™ RapidConfigure™ µSerDes™
®
Current Transfer Logic™ MSX™ RapidConnect™ UHC
DOME™ MSXPro™ ScalarPump™ UniFET™
2
E CMOS™ OCX™ SMART START™ VCX™
® ®
EcoSPARK OCXPro™ SPM Wire™
®
EnSigna™ OPTOLOGIC STEALTH™
®
FACT Quiet Series™ OPTOPLANAR SuperFET™
®
FACT PACMAN™ SuperSOT™-3
®
FAST PDP-SPM™ SuperSOT™-6
FASTr™ POP™ SuperSOT™-8
®
FPS™ Power220 SyncFET™
® ®
FRFET Power247 TCM™
®
GlobalOptoisolator™ PowerEdge™ The Power Franchise
GTO™ PowerSaver™ ™
HiSeC™

DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER
ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support,
which, (a) are intended for surgical implant into the body or device, or system whose failure to perform can be
(b) support or sustain life, and (c) whose failure to perform reasonably expected to cause the failure of the life support
when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.

PRODUCT STATUS DEFINITIONS

Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In Design This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Preliminary First Production This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
design.
Obsolete Not In Production This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I26

©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com

4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1 13