VN820 / VN820SO

® / VN820SP / VN820-B5 / VN820PT

HIGH SIDE DRIVER

TYPE RDS(on) IOUT VCC
VN820
10
VN820SP
1
VN820-B5 40 mΩ 9A 36 V
VN820SO
PowerSO-10™ P2PAK PPAK
VN820PT

■ CMOS COMPATIBLE INPUT

■ ON STATE OPEN LOAD DETECTION
■ OFF STATE OPEN LOAD DETECTION PENTAWATT SO-16L
■ SHORTED LOAD PROTECTION
ORDER CODES
■ UNDERVOLTAGE AND OVERVOLTAGE
PACKAGE TUBE T&R
SHUTDOWN
PENTAWATT VN820 -
■ PROTECTION AGAINST LOSS OF GROUND
PowerSO-10™ VN820SP VN820SP13TR
■ VERY LOW STAND-BY CURRENT
P2PAK VN820-B5 VN820-B513TR
■ REVERSE BATTERY PROTECTION (*) SO-16L VN820SO VN820SO13TR
PPAK VN820PT VN820PT13TR
DESCRIPTION
The VN820, VN820SP, VN820-B5, VN820SO, compatibility table). Active current limitation
VN820PT are monolithic devices made by using combined with thermal shutdown and automatic
STMicroelectronics VIPower M0-3 Technology, restart protect the device against overload.
intended for driving any kind of load with one side The device detects open load condition both is on
connected to ground. and off state. Output shorted to VCC is detected in
Active V CC pin voltage clamp protects the device the off state. Device automatically turns off in case
against low energy spikes (see ISO7637 transient of ground pin disconnection.
BLOCK DIAGRAM
VCC

VCC OVERVOLTAGE
CLAMP DETECTION

UNDERVOLTAGE
DETECTION
GND

Power CLAMP

INPUT DRIVER
OUTPUT
LOGIC
CURRENT LIMITER

STATUS ON STATE OPENLOAD

DETECTION

OVERTEMPERATURE
DETECTION OFF STATE OPENLOAD
AND OUTPUT SHORTED TO V CC
DETECTION

(*) See application schematic at page 9 Rev. 1

July 2004 1/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

ABSOLUTE MAXIMUM RATING

Value
Symbol Parameter Unit
PowerSO-10™ PENTAWATT P2PAK SO-16L PPAK
VCC DC Supply Voltage 41 V
- VCC Reverse DC Supply Voltage - 0.3 V
- IGND DC Reverse Ground Pin Current - 200 mA
IOUT DC Output Current Internally Limited A
- IOUT Reverse DC Output Current -9 A
IIN DC Input Current +/- 10 mA
ISTAT DC Status Current +/- 10 mA
Electrostatic Discharge
(Human Body Model: R=1.5KΩ; C=100pF)
- INPUT 4000 V
VESD
- STATUS 4000 V
- OUTPUT 5000 V
- VCC 5000 V
Maximum Switching Energy (L=4mH; RL=0Ω;
EMAX 481 481 mJ
Vbat=13.5V; Tjstart=150ºC; IL=13A)
Maximum Switching Energy (L=3.7mH;
EMAX 438 mJ
RL=0Ω; Vbat=13.5V; Tjstart=150ºC; IL=13A)
Maximum Switching Energy (L=4.48mH;
EMAX 526 mJ
RL=0Ω; Vbat=13.5V; Tjstart=150ºC; IL=13A)
Ptot Power Dissipation TC=25°C 65.8 65.8 65.8 8.3 65.8 W
Tj Junction Operating Temperature Internally Limited °C
Tc Case Operating Temperature - 40 to 150 °C
Tstg Storage Temperature - 55 to 150 °C

CONFIGURATION DIAGRAM (TOP VIEW) & SUGGESTED CONNECTIONS FOR UNUSED AND N.C.
PINS

GROUND 6 5 OUTPUT VCC 1 16 VCC

7
INPUT 4 OUTPUT N.C. OUTPUT
STATUS 8 3 N.C.
N.C. 9 2 OUTPUT
GND OUTPUT
N.C. 10 OUTPUT
1 OUTPUT INPUT
11 STATUS OUTPUT

PPAK / P2PAK / PENTAWATT

VCC
N.C. OUTPUT
PowerSO-10™ N.C. OUTPUT
VCC 8 9 VCC
Connection / Pin Status N.C. Output Input
Floating X X X X SO-16L
To Ground X Through 10KΩ resistor

CURRENT AND VOLTAGE CONVENTIONS

IS

VF
IIN
VCC
INPUT
ISTAT IOUT
STATUS OUTPUT VCC
GND

VIN
VSTAT VOUT
IGND

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

THERMAL DATA
Value
Symbol Parameter Unit
PowerSO-10 PENTAWATT P2PAK SO-16L PPAK
Rthj-case Thermal Resistance Junction-case Max 1.9 1.9 1.9 - 1.9 °C/W
Rthj-lead Thermal Resistance Junction-lead Max - - - 15 - °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 51.9 (1) 61.9 (1) 51.9 (1) 65 (2) 76.9 (1) °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 37 (3) - 37 (3) 48 (4) 45 (3) °C/W
(1) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick).
(2)
When mounted on FR4 printed circuit board with 0.5cm2 of Cu (at least 35µ thick) connected to all VCC pins.
(3) When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35µm thick).
(4) When mounted on FR4 printed circuit board with 6cm2 of Cu (at least 35µ thick) connected to all V
CC pins.

ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40°C<Tj<150°C unless otherwise specified)

POWER
Symbol Parameter Test Conditions Min Typ Max Unit
VCC Operating Supply Voltage 5.5 13 36 V
VUSD Undervoltage Shut-down 3 4 5.5 V
Undervoltage Shut-down
VUSDhyst 0.5 V
hysteresis
VOV Overvoltage Shut-down 36 V
IOUT=3A; Tj=25°C; VCC>8V 40 mΩ
RON On State Resistance
IOUT=3A; VCC>8V 80 mΩ
Off State; VCC=13V; VIN=VOUT=0V 10 25 µA
Off State; VCC=13V; VIN=VOUT=0V;
IS Supply Current
Tj=25°C 10 20 µA
On State; VCC=13V; VIN=5V; IOUT=0A 2 3.5 mA
IL(off1) Off State Output Current VIN=VOUT=0V 0 50 µA
IL(off2) Off State Output Current VIN=0V; VOUT =3.5V -75 0 µA
IL(off3) Off State Output Current VIN=VOUT=0V; Vcc=13V; Tj =125°C 5 µA
IL(off4) Off State Output Current VIN=VOUT=0V; Vcc=13V; Tj =25°C 3 µA

SWITCHING (V CC=13V)
Symbol Parameter Test Conditions Min Typ Max Unit
RL=4.3Ω from VIN rising edge to
td(on) Turn-on Delay Time 30 µs
VOUT =1.3V
RL=4.3Ω from VIN falling edge to
td(off) Turn-off Delay Time 30 µs
VOUT =11.7V
See
RL=4.3Ω from VOUT =1.3 to
dVOUT/dt(on) Turn-on Voltage Slope relative V/µs
VOUT =10.4V
diagram
See
RL=4.3Ω from VOUT =11.7 to
dVOUT/dt(off) Turn-off Voltage Slope relative V/µs
VOUT =1.3V
diagram

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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

ELECTRICAL CHARACTERISTICS (continued)

INPUT PIN
Symbol Parameter Test Conditions Min Typ Max Unit
VIL Input Low Level 1.25 V
IIL Low Level Input Current VIN=1.25V 1 µA
VIH Input High Level 3.25 V
IIH High Level Input Current VIN=3.25V 10 µA
VI(hyst) Input Hysteresis Voltage 0.5 V
IIN=1mA 6 6.8 8 V
VICL Input Clamp Voltage
IIN=-1mA -0.7 V

VCC - OUTPUT DIODE

Symbol Parameter Test Conditions Min Typ Max Unit
VF Forward on Voltage -IOUT=2A; Tj=150°C 0.6 V

STATUS PIN
Symbol Parameter Test Conditions Min Typ Max Unit
VSTAT Status Low Output Voltage ISTAT =1.6mA 0.5 V
ILSTAT Status Leakage Current Normal Operation VSTAT=5V 10 µA
Status Pin Input
CSTAT Normal Operation VSTAT=5V 100 pF
Capacitance
ISTAT =1mA 6 6.8 8 V
VSCL Status Clamp Voltage
ISTAT =-1mA -0.7 V

PROTECTIONS (see note 1)

Symbol Parameter Test Conditions Min Typ Max Unit
TTSD Shut-down Temperature 150 175 200 °C
TR Reset Temperature 135 °C
Thyst Thermal Hysteresis 7 15 °C
Status delay in overload
tSDL Tj>TTSD 20 µs
condition
9 13 20 A
Ilim Current limitation
5.5V<VCC<36V 20 A
Turn-off Output Clamp
Vdemag IOUT=3A; VIN=0V; L=6mH VCC-41 VCC-48 VCC-55 V
Voltage

Note 1: To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used
together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number
of activation cycles
OPENLOAD DETECTION
Symbol Parameter Test Conditions Min Typ Max Unit
Openload ON State
IOL VIN=5V 70 150 300 mA
Detection Threshold
Openload ON State
tDOL(on) IOUT =0A 200 µs
Detection Delay
Openload OFF State
VOL Voltage Detection VIN=0V 1.5 2.5 3.5 V
Threshold
Openload Detection Delay
tDOL(off) 1000 µs
at Turn Off

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

OPEN LOAD STATUS TIMING (with external pull-up) OVERTEMP STATUS TIMING

VOUT > VOL IOUT< I OL

Tj > TTSD
VIN VIN

VSTAT VSTAT

tDOL(off) tSDL tSDL

tDOL(on)

SWITCHING TIME WAVEFORMS

VOUT

90%
80%

dVOUT/dt(on) dVOUT/dt(off)

10%
t

VIN
td(on) td(off)

t
TRUTH TABLE
CONDITIONS INPUT OUTPUT STATUS
L L H
Normal Operation
H H H
L L H
Current Limitation H X (Tj < TTSD) H
H X (Tj > TTSD) L
L L H
Overtemperature
H L L
L L X
Undervoltage
H L X
L L H
Overvoltage
H L H
L H L
Output Voltage > VOL
H H H
L L H
Output Current < IOL
H H L

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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

OPEN LOAD DETECTION IN OFF STATE

Off state open load detection requires an external pull-up 2) no misdetection when load is disconnected: in this
resistor (RPU) connected between OUTPUT pin and a case the VOUT has to be higher than VOLmax; this
positive supply voltage (VPU) like the +5V line used to results in the following condition RPU<(VPU–VOLmax)/
supply the microprocessor. IL(off2).
The external resistor has to be selected according to the Because Is(OFF) may significantly increase if Vout is pulled
following requirements: high (up to several mA), the pull-up resistor RPU should
1) no false open load indication when load is connected: be connected to a supply that is switched OFF when the
in this case we have to avoid VOUT to be higher than module is in standby.
VOlmin; this results in the following condition The values of VOLmin, VOLmax and IL(off2) are available in
VOUT=(VPU/(RL+RPU))RL<VOlmin. the Electrical Characteristics section.

Open Load detection in off state

V batt. VPU

VCC

RPU

DRIVER
INPUT + IL(off2)
LOGIC

OUT
+
R
-
STATUS
VOL
RL

GROUND

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

ELECTRICAL TRANSIENT REQUIREMENTS ON VCC PIN

ISO T/R 7637/1 TEST LEVELS

Test Pulse I II III IV Delays and
Impedance
1 -25 V -50 V -75 V -100 V 2 ms 10 Ω
2 +25 V +50 V +75 V +100 V 0.2 ms 10 Ω
3a -25 V -50 V -100 V -150 V 0.1 µs 50 Ω
3b +25 V +50 V +75 V +100 V 0.1 µs 50 Ω
4 -4 V -5 V -6 V -7 V 100 ms, 0.01 Ω
5 +26.5 V +46.5 V +66.5 V +86.5 V 400 ms, 2 Ω

ISO T/R 7637/1 TEST LEVELS RESULTS

Test Pulse I II III IV
1 C C C C
2 C C C C
3a C C C C
3b C C C C
4 C C C C
5 C E E E

CLASS CONTENTS
C All functions of the device are performed as designed after exposure to disturbance.
E One or more functions of the device is not performed as designed after exposure to disturbance
and cannot be returned to proper operation without replacing the device.

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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

Figure 1: Waveforms

NORMAL OPERATION
INPUT
LOAD VOLTAGE
STATUS

UNDERVOLTAGE
VCC VUSDhyst
VUSD
INPUT
LOAD VOLTAGE
STATUS undefined

OVERVOLTAGE
VCC<VOV VCC>VOV
VCC
INPUT
LOAD VOLTAGE
STATUS

OPEN LOAD with external pull-up

INPUT
VOUT >VOL
LOAD VOLTAGE
VOL
STATUS

OPEN LOAD without external pull-up

INPUT

LOAD VOLTAGE
STATUS

OVERTEMPERATURE
Tj TTSD
TR

INPUT
LOAD CURRENT
STATUS

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

APPLICATION SCHEMATIC

+5V +5V

Rprot VCC

STATUS

Dld

µC Rprot INPUT
OUTPUT

GND

RGND
VGND DGND

GND PROTECTION NETWORK AGAINST This small signal diode can be safely shared amongst
REVERSE BATTERY several different HSD. Also in this case, the presence of
the ground network will produce a shift (j600mV) in the
Solution 1: Resistor in the ground line (RGND only). This input threshold and the status output values if the
can be used with any type of load. microprocessor ground is not common with the device
The following is an indication on how to dimension the ground. This shift will not vary if more than one HSD
RGND resistor. shares the same diode/resistor network.
1) RGND ≤ 600mV / (IS(on)max). Series resistor in INPUT and STATUS lines are also
2) RGND ≥ (−VCC) / (-IGND) required to prevent that, during battery voltage transient,
the current exceeds the Absolute Maximum Rating.
where -IGND is the DC reverse ground pin current and can
be found in the absolute maximum rating section of the Safest configuration for unused INPUT and STATUS pin
device’s datasheet. is to leave them unconnected.
Power Dissipation in RGND (when VCC<0: during reverse LOAD DUMP PROTECTION
battery situations) is: Dld is necessary (Voltage Transient Suppressor) if the
PD= (-VCC)2/RGND load dump peak voltage exceeds VCC max DC rating. The
This resistor can be shared amongst several different same applies if the device will be subject to transients on
HSD. Please note that the value of this resistor should be the VCC line that are greater than the ones shown in the
calculated with formula (1) where IS(on)max becomes the ISO T/R 7637/1 table.
sum of the maximum on-state currents of the different µC I/Os PROTECTION:
devices.
If a ground protection network is used and negative
Please note that if the microprocessor ground is not transient are present on the VCC line, the control pins will
common with the device ground then the RGND will be pulled negative. ST suggests to insert a resistor (Rprot)
produce a shift (IS(on)max * RGND) in the input thresholds in line to prevent the µC I/Os pins to latch-up.
and the status output values. This shift will vary
depending on many devices are ON in the case of several The value of these resistors is a compromise between the
high side drivers sharing the same RGND. leakage current of µC and the current required by the
HSD I/Os (Input levels compatibility) with the latch-up limit
If the calculated power dissipation leads to a large resistor of µC I/Os.
or several devices have to share the same resistor then
the ST suggests to utilize Solution 2 (see below). -VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND) / IIHmax
Solution 2: A diode (DGND) in the ground line. Calculation example:
A resistor (RGND=1kΩ) should be inserted in parallel to For VCCpeak= - 100V and Ilatchup ≥ 20mA; VOHµC ≥ 4.5V
DGND if the device will be driving an inductive load. 5kΩ ≤ Rprot ≤ 65kΩ.
Recommended Rprot value is 10kΩ.

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1
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

Off State Output Current High Level Input Current

IL(off1) (µA) Iih (uA)

5 5

4.5 4.5
Off state Vin=3.25V
4 Vcc=36V 4
Vin=Vout=0V
3.5 3.5

3 3

2.5 2.5

2 2

1.5 1.5

1 1

0.5 0.5

0 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (ºC) Tc (°C)

Input Clamp Voltage Input High Level

Vicl (V) Vih (V)

8 3.6

7.8
3.4
Iin=1mA
7.6
3.2
7.4
3
7.2

7 2.8

6.8
2.6
6.6
2.4
6.4
2.2
6.2

6 2
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175

Tc (°C) Tc (°C)

Input Low Level Input Hysteresis Voltage

Vil (V) Vhyst (V)

2.6 1.5

1.4
2.4
1.3
2.2
1.2
2
1.1

1.8 1

0.9
1.6
0.8
1.4
0.7
1.2
0.6

1 0.5
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (°C)

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

Overvoltage Shutdown ILIM Vs Tcase

Vov (V) Ilim (A)

50 25

48 22.5
Vcc=13V
46 20

44 17.5

42 15

40 12.5

38 10

36 7.5

34 5

32 2.5

30 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (ºC)

Turn-on Voltage Slope Turn-off Voltage Slope

dVout/dt(on) (V/ms) dVout/dt(off) (V/ms)

1000 1000

900 900
Vcc=13V Vcc=13V
800 800
Rl=4.3Ohm Rl=4.3Ohm
700 700

600 600

500 500

400 400

300 300

200 200

100 100

0 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (ºC) Tc (ºC)

On State Resistance Vs Tcase On State Resistance Vs V CC

Ron (mOhm) Ron (mOhm)

100 100

90 90
Iout=3A
80 80
Vcc=8V; 13V; 36V Tc= 150ºC
70 70

60 60

50 50
Tc= 25ºC
40 40

30 30
Tc= - 40ºC
20 20

10 10

0 0
-50 -25 0 25 50 75 100 125 150 175 5 10 15 20 25 30 35 40
Tc (ºC) Vcc (V)

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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

Status Clamp Voltage Status Leakage Current

Vscl (V) Ilstat (uA)

8 0.05

7.8
Istat=1mA
7.6 0.04

7.4 Vstat=5V

7.2 0.03

6.8 0.02

6.6

6.4 0.01

6.2

6 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (°C)

Status Low Output Voltage Open Load Off State Voltage Detection Threshold

Vstat (V) Vol (V)

0.8 5

4.5
0.7
Vin=0V
Istat=1.6mA 4
0.6
3.5
0.5
3

0.4 2.5

2
0.3
1.5
0.2
1
0.1
0.5

0 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175

Tc (°C) Tc (°C)

Open Load On State Detection Threshold

Iol (mA)
200

190
Vcc=13V
180
Vin=5V
170

160

150

140

130

120

110

100

90

80
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

PowerSO-10, P 2PAK, PENTAWATT Maximum turn off current versus load inductance

ILMAX (A)
100

10 A

B
C

1
0.1 1 10 100
L(mH )

A = Single Pulse at TJstart=150ºC

B= Repetitive pulse at T Jstart=100ºC
C= Repetitive Pulse at T Jstart=125ºC

Conditions:
VCC=13.5V
Values are generated with R L=0Ω
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves B and C.

VIN, IL
Demagnetization Demagnetization Demagnetization

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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

PPAK Maximum turn off current versus load inductance

ILMAX (A)
100

B
10
C

1
0.1 1 10 100
L(mH)

A = Single Pulse at TJstart=150ºC

B= Repetitive pulse at T Jstart=100ºC
C= Repetitive Pulse at T Jstart=125ºC

Conditions:
VCC=13.5V
Values are generated with R L=0Ω
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves B and C.

VIN, IL
Demagnetization Demagnetization Demagnetization

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

SO-16L Maximum turn off current versus load inductance

ILM AX (A)
100

B
10 C

1
0.1 1 10 100
L(mH)

A = Single Pulse at TJstart=150ºC

B= Repetitive pulse at T Jstart=100ºC
C= Repetitive Pulse at T Jstart=125ºC

Conditions:
VCC=13.5V
Values are generated with R L=0Ω
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves B and C.

VIN, IL
Demagnetization Demagnetization Demagnetization

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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

SO-16L THERMAL DATA

SO-16L PC Board

Layout condition of Rth and Zth measurements (PCB FR4 area= 41mm x 48mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: 0.5cm2, 6cm2).

Rthj-amb Vs PCB copper area in open box free air condition

RTH j-amb (°C/W)

70

65

60

55

50

45

40
0 1 2 3 4 5 6 7
PCB Cu heatsink area (cm^2)

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

P2PAK THERMAL DATA

P2PAK PC Board

Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: 0.97cm2, 8cm2).

Rthj-amb Vs PCB copper area in open box free air condition

RTHj_amb (°C/W)
55
Tj-Tamb=50°C
50

45

40

35

30
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)

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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

PPAK THERMAL DATA

PPAK PC Board

Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: 0.44cm2, 8cm2).

Rthj-amb Vs PCB copper area in open box free air condition

RTHj_amb (ºC/W)

90
80
70
60
50
40
30
20
10
0
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

PowerSO-10™ THERMAL DATA

PowerSO-10™ PC Board

Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8cm2).

Rthj-amb Vs PCB copper area in open box free air condition

RTHj_amb (°C/W)

55
Tj-Tamb=50°C
50

45

40

35

30
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)

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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

PowerSO-10 Thermal Impedance Junction Ambient Single Pulse

ZTH (°C/W)

100
0.5 cm2

6 cm2

10

0.1

0.01
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)

Thermal fitting model of a single channel HSD Pulse calculation formula

in PowerSO-10
Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ )
where δ = tp ⁄ T
Thermal Parameter
Area/island (cm2) 0.5 6
R1 (°C/W) 0.04
Tj C1 C2 C3 C4 C5 C6 R2 (°C/W) 0.25
R3( °C/W) 0.25
R1 R2 R3 R4 R5 R6
R4 (°C/W) 0.8
Pd R5 (°C/W) 12
R6 (°C/W) 37 22
T_amb
C1 (W.s/°C) 0.0008
C2 (W.s/°C) 7.00E-03
C3 (W.s/°C) 0.015
C4 (W.s/°C) 0.3
C5 (W.s/°C) 0.75
C6 (W.s/°C) 3 5

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

P2PAK Thermal Impedance Junction Ambient Single Pulse

ZTH (°C/W)
1000

100
0.97 cm2

6 cm2

10

0.1

0.01
0.0001 0.001 0.01 0.1 1 10 100 1000
T ime (s)

Thermal fitting model of a single channel HSD Pulse calculation formula

in P 2PAK
Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ )
where δ = tp ⁄ T
Thermal Parameter
Area/island (cm2) 0.97 6
R1 (°C/W) 0.04
Tj C1 C2 C3 C4 C5 C6 R2 (°C/W) 0.25
R3( °C/W) 0.3
R1 R2 R3 R4 R5 R6
R4 (°C/W) 4
Pd R5 (°C/W) 9
R6 (°C/W) 37 22
T_amb
C1 (W.s/°C) 0.0008
C2 (W.s/°C) 0.007
C3 (W.s/°C) 0.015
C4 (W.s/°C) 0.4
C5 (W.s/°C) 2
C6 (W.s/°C) 3 5

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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

PPAK Thermal Impedance Junction Ambient Single Pulse

ZT H (°C/W)
1000

100 0.44 cm2

6 cm2

10

0.1

0.01
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)

Thermal fitting model of a single channel HSD Pulse calculation formula

in PPAK
Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ )
where δ = tp ⁄ T
Thermal Parameter
Area/island (cm2) 0.44 6
R1 (°C/W) 0.04
Tj C1 C2 C3 C4 C5 C6 R2 (°C/W) 0.25
R3( °C/W) 0.3
R1 R2 R3 R4 R5 R6
R4 (°C/W) 2
Pd R5 (°C/W) 15
R6 (°C/W) 61 24
T_amb
C1 (W.s/°C) 0.0008
C2 (W.s/°C) 0.007
C3 (W.s/°C) 0.02
C4 (W.s/°C) 0.3
C5 (W.s/°C) 0.45
C6 (W.s/°C) 0.8 5

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

SO-16L Thermal Impedance Junction Ambient Single Pulse

ZT H (°C/W)
1000

100 0.5 cm2

6 cm2

10

0.1

0.01
0.0001 0.001 0.01 0.1 1 10 100 1000
T ime (s)

Thermal fitting model of a single channel HSD Pulse calculation formula

in SO-16L
Z TH δ = R TH ⋅ δ + Z THtp ( 1 – δ )
where δ = tp ⁄ T
Thermal Parameter
Area/island (cm2) 0.5 6
R1 (°C/W) 0.04
Tj C1 C2 C3 C4 C5 C6 R2 (°C/W) 0.25
R3( °C/W) 2.2
R1 R2 R3 R4 R5 R6
R4 (°C/W) 12
Pd R5 (°C/W) 15
R6 (°C/W) 37 22
T_amb
C1 (W.s/°C) 0.0008
C2 (W.s/°C) 7.00E-03
C3 (W.s/°C) 1.50E-02
C4 (W.s/°C) 0.14
C5 (W.s/°C) 1
C6 (W.s/°C) 3 5

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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

PowerSO-10™ MECHANICAL DATA

mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 3.35 3.65 0.132 0.144
A (*) 3.4 3.6 0.134 0.142
A1 0.00 0.10 0.000 0.004
B 0.40 0.60 0.016 0.024
B (*) 0.37 0.53 0.014 0.021
C 0.35 0.55 0.013 0.022
C (*) 0.23 0.32 0.009 0.0126
D 9.40 9.60 0.370 0.378
D1 7.40 7.60 0.291 0.300
E 9.30 9.50 0.366 0.374
E2 7.20 7.60 0.283 300
E2 (*) 7.30 7.50 0.287 0.295
E4 5.90 6.10 0.232 0.240
E4 (*) 5.90 6.30 0.232 0.248
e 1.27 0.050
F 1.25 1.35 0.049 0.053
F (*) 1.20 1.40 0.047 0.055
H 13.80 14.40 0.543 0.567
H (*) 13.85 14.35 0.545 0.565
h 0.50 0.002
L 1.20 1.80 0.047 0.070
L (*) 0.80 1.10 0.031 0.043
α 0º 8º 0º 8º
α (*) 2º 8º 2º 8º
(*) Muar only POA P013P

0.10 A B
10

H E E2 E E4

1
SEATING
PLANE

e B DETAIL "A"
A

0.25
C

D
h = D1 =
= =
SEATING
PLANE
A
F
A1
A1

L
DETAIL "A"

α
P095A

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1
 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

PENTAWATT (VERTICAL) MECHANICAL DATA

mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 4.8 0.189
C 1.37 0.054
D 2.4 2.8 0.094 0.110
D1 1.2 1.35 0.047 0.053
E 0.35 0.55 0.014 0.022
F 0.8 1.05 0.031 0.041
F1 1 1.4 0.039 0.055
G 3.2 3.4 3.6 0.126 0.134 0.142
G1 6.6 6.8 7 0.260 0.268 0.276
H2 10.4 0.409
H3 10.05 10.4 0.396 0.409
L 17.85 0.703
L1 15.75 0.620
L2 21.4 0.843
L3 22.5 0.886
L5 2.6 3 0.102 0.118
L6 15.1 15.8 0.594 0.622
L7 6 6.6 0.236 0.260
M 4.5 0.177
M1 4 0.157
Diam. 3.65 3.85 0.144 0.152

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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

P2PAK MECHANICAL DATA

mm.
DIM.
MIN. TYP MAX.
A 4.30 4.80
A1 2.40 2.80
A2 0.03 0.23
b 0.80 1.05
c 0.45 0.60
c2 1.17 1.37
D 8.95 9.35
D2 8.00
E 10.00 10.40
E1 8.50
e 3.20 3.60
e1 6.60 7.00
L 13.70 14.50
L2 1.25 1.40
L3 0.90 1.70
L5 1.55 2.40
R 0.40
V2 0º 8º
Package Weight 1.40 Gr (typ)

P010R

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

SO-16L MECHANICAL DATA

mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 2.65 0.104
a1 0.1 0.2 0.004 0.008
a2 2.45 0.096
b 0.35 0.49 0.014 0.019
b1 0.23 0.32 0.009 0.012
C 0.5 0.020
c1 45° (typ.)
D 10.1 10.5 0.397 0.413
E 10.0 10.65 0.393 0.419
e 1.27 0.050
e3 8.89 0.350
F 7.4 7.6 0.291 0.300
L 0.5 1.27 0.020 0.050
M 0.75 0.029
S 8° (max.)

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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

PPAK MECHANICAL DATA

DIM. MIN. TYP MAX.

A 2.20 2.40
A1 0.90 1.10
A2 0.03 0.23
B 0.40 0.60
B2 5.20 5.40
C 0.45 0.60
C2 0.48 0.60
D1 5.1
D 6.00 6.20
E 6.40 6.60
E1 4.7
e 1.27
G 4.90 5.25
G1 2.38 2.70
H 9.35 10.10
L2 0.8 1.00
L4 0.60 1.00
R 0.2
V2 0º 8º
Package Weight Gr. 0.3

P032T1

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 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

PowerSO-10™ SUGGESTED PAD LAYOUT TUBE SHIPMENT (no suffix)

14.6 - 14.9
B CASABLANCA MUAR
10.8 - 11
C
6.30

A C
A

0.67 - 0.73
B
1 10 0.54 - 0.6
2 9

9.5 3 8 All dimensions are in mm.

4 7 1.27
5 6 Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1)
Casablanca 50 1000 532 10.4 16.4 0.8
Muar 50 1000 532 4.9 17.2 0.8

TAPE AND REEL SHIPMENT (suffix “13TR”)

REEL DIMENSIONS
Base Q.ty 600
Bulk Q.ty 600
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max) 30.4

All dimensions are in mm.

TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 24
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 11.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2

All dimensions are in mm.

End

Start

Top No components Components No components

cover
tape 500mm min
Empty components pockets 500mm min
saled with cover tape.

User direction of feed

29/35

1
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

PENTAWATT TUBE SHIPMENT (no suffix)

Base Q.ty 50
Bulk Q.ty 1000
B Tube length (± 0.5) 532
A 18
B 33.1
C (± 0.1) 1
C
All dimensions are in mm.

30/35
 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
P2PAK TUBE SHIPMENT (no suffix)

Base Q.ty 50
Bulk Q.ty 1000
B Tube length (± 0.5) 532
A 18
C
B 33.1
C (± 0.1) 1

All dimensions are in mm.

A

TAPE AND REEL SHIPMENT (suffix “13TR”)

REEL DIMENSIONS
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max) 30.4

All dimensions are in mm.

TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 16
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 11.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2

All dimensions are in mm. End

Start

Top No components Components No components

cover
tape 500mm min
Empty components pockets 500mm min
saled with cover tape.

User direction of feed

31/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
SO-16L TUBE SHIPMENT (no suffix)

Base Q.ty 50
Bulk Q.ty 1000
Tube length (± 0.5) 532
C
B A 3.5
B 13.8
C (± 0.1) 0.6

All dimensions are in mm.

A

TAPE AND REEL SHIPMENT (suffix “13TR”)

REEL DIMENSIONS
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max) 22.4

TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 16
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 12
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 7.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2

All dimensions are in mm. End

Start

Top No components Components No components

cover
tape 500mm min
Empty components pockets 500mm min
saled with cover tape.

User direction of feed

32/35

1
 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PPAK TUBE SHIPMENT (no suffix)

A
C
Base Q.ty 75
Bulk Q.ty 3000
Tube length (± 0.5) 532
A 6
B B 21.3
C (± 0.1) 0.6

All dimensions are in mm.

TAPE AND REEL SHIPMENT (suffix “13TR”)

REEL DIMENSIONS
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max) 22.4

All dimensions are in mm.

TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 16
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 7.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2

All dimensions are in mm. End

Start

Top No components Components No components

cover
tape 500mm min
Empty components pockets 500mm min
saled with cover tape.

User direction of feed

33/35

1
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

REVISION HISTORY
Date Revision Description of Changes
- Minor changes
- Current and voltage convention update (page 2).
- “Configuration diagram (top view) & suggested connections for unused and n.c.
pins” insertion (page 2).
Jul 2004 1 - 6 cm2 Cu condition insertion in Thermal Data table (page 3).
- VCC - OUTPUT DIODE section update (page 4).
- PROTECTIONS note insertion (page 3)
- Revision History table insertion (page 34).
- Disclaimers update (page 35).

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1
 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a trademark of STMicroelectronics.

All other names are the property of their respective owners

 2004 STMicroelectronics - Printed in ITALY- All Rights Reserved.

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