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LCD TV
SERVICE MANUAL
CHASSIS : LP91D

MODEL : 32LH70YR 32LH70YR-LA/TA

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
 CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION .................................................................9

TROUBLE SHOOTING ............................................................................14

BLOCK DIAGRAM...................................................................................17

EXPLODED VIEW .................................................................................. 18

SVC. SHEET ...............................................................................................

Copyright © 2009 LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
 SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC Do not use a line Isolation Transformer during this check.
power line. Use a transformer of adequate power rating as this Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
protects the technician from accidents resulting in personal injury between a known good earth ground (Water Pipe, Conduit, etc.)
from electrical shocks. and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
It will also protect the receiver and it's components from being with 1000 ohms/volt or more sensitivity.
damaged by accidental shorts of the circuitry that may be Reverse plug the AC cord into the AC outlet and repeat AC voltage
inadvertently introduced during the service operation. measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
If any fuse (or Fusible Resistor) in this TV receiver is blown, 0.5mA.
replace it with the specified. In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
When replacing a high wattage resistor (Oxide Metal Film Resistor, repaired before it is returned to the customer.
over 1W), keep the resistor 10mm away from PCB.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.
AC Volt-meter
Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical Good Earth Ground
such as WATER PIPE,
shock. CONDUIT etc.
To Instrument's
0.15uF
exposed
Leakage Current Cold Check(Antenna Cold Check) METALLIC PARTS
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC 1.5 Kohm/10W
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc. When 25A is impressed between Earth and 2nd Ground
If the exposed metallic part has a return path to the chassis, the for 1 second, Resistance must be less than 0.1 Ω
measured resistance should be between 1MΩ and 5.2MΩ. *Base on Adjustment standard
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright © 2009 LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
 SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it.
other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500°F to 600°F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500°F to 600°F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500°F to 600°F)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the

Copyright © 2009 LG Electronics. Inc. All right reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.

Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on IC
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Copyright © 2009 LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
 SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range 3. Test method

This spec sheet is applied to LCD TV used LP91D chassis. 1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
2. Specification - EMC : CE, IEC
Each part is tested as below without special appointment.

1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC

2) Relative Humidity : 65±10%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.

4. Electrical specification
4.1. General Specification
No Item Specification Measurement Remark
1 Screen Size 32” wide Color Display Module Resolution : 1920*1080
2 Aspect Ratio 16:9
3 LCD Module 32” TFT WUXGA LCD FHD
4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 80 %
5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6 Input Voltage AC100-240V~, 50/60Hz
≤ 180 W 32” FHD, 100Hz
7 LDC Module FHD 760 x 450 x 48
(Maker : LGD) 0.36375 x 0.36375

Coating 3H

Copyright © 2009 LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. Chroma& Brightness (Optical)
5.1. LCD Module
the Color Coordinates check condition
- 50cm from the surface, Full White Pattern
- Picture mode Vivid
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 400 500 cd/m2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178/ 178 degree LGD CR > 10
3. Color Coordinates White Wx Typ 0.279 Typ LGD 32”(FHD)
Wy -0.03 0.292 +0.03 LC320WUD-SBA1
RED Xr 0.638 (100Hz/Slim)
Yr 0.334
Green Xg 0.291
Yg 0.607
Blue Xb 0.145
Yb 0.062
4. Contrast ratio 900:1 1300:1 LGD 32”(100Hz)
5. Luminance Variation 1.3

6. Component Video Input (Y, PB, PR)

Specification
No Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P

Copyright © 2009 LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
7. RGB
7.1. Analog PC, RGB- DTV –NOT SUPPORT

Specification
No Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model

8. HDMI Input
8.1. PC –Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA

8.2. DTV Mode

Specification
No Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P

Copyright © 2009 LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
 ADJUSTMENT INSTRUCTION
1. Application Range (2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
This specification sheet is applied to all of the LCD TV, utility Vx.x.x) will be opened
LP91A/B/C/D chassis. 2) Click the “Connect” button and confirm “Dialog Box”

2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 ±5 °C of temperature and 65±10% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.

3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.
(3) Download the EDID
- EDID datas are automatically download when adjusting
the Tool Option2
(4) ADC Calibration – RGB / Component
(4) Check SW Version. 3) Click the “Config.” button and Change speed I2C Speed
setting : 350Khz~400Khz
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input

4. PCB assembly adjustment method

4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps 4) Read and write bin file.
1) Connect the download jig to D-sub(RGB) jack Click “(1)Read” tab, and then load download
file(XXXX.bin) by clicking “Read”.
- LH70

1

Filexxx.bin
1

Fil

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 1

Filexxx.bin

5) Click “(2)Auto” tab and set as below (3). Adjustment method

6) Click “(3)Run”. - The input methods are same as other chassis.(Use IN-
7) After downloading, you can see the “(4)Pass” message. START Key on the Adjust Remocon.)
(If not changed the option, the input menu can differ the
model spec.)

Refer to Job Expression of each main chassis ass’y

(EBTxxxxxxxx) for Option value
Caution : Don’t Press “IN-STOP” key after completing the
function inspection.

4.3. EDID D/L method

Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data
4.1.2. Using the Memory Stick
* USB download : Service Mode 4.3.1. 1st Method
1) Insert the USB memory stick to the ISB port. EDID datas are automatically downloaded when adjusting the
2) Automatically detect the SW Version. Tool Option2.
-> S/W download process is executed automatically. Automatically downloaded when pushing the enter key after
3) Show the message “Copy the file from the Memory” adjusting the tool option2.
It takes about 2seconds.

4) After Finished the Download, Automatically DC Off -> On

4.3.2. 2nd Method
* Caution :
Must be checked that the tool option is right or not.
If tool option is wrong, hdmi edid data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear “OK”, then compele.

5) Check The update SW Version.

4.2. Input tool option.

Adjust tool option refer to the BOM.
- Tool Option Input : PCBA Check Process 4.3.3. RS-232C command Method
- Area Option Input : Set Assembly Process (1) Command : AE 00 10

After Input Tool Option and AC off * Caution

Before PCBA check, you have to change the Tool option and Don’t connect HDMI and RGB(D-SUB) cable when
have to AC off/on (Plug out and in) downloading the EDID.
(If missing this process, set can operate abnormally) If the cables are connected, Downloading of edid could be
failed.
(1) Profile : Must be changed the option value because being
different with some setting value depend on
module maker, inch and market
(2) Equipment : adjustment remote control.

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Only for training and service purposes
4.3.4. EDID data 4.4. ADC Calibration
(1) Analog(RGB): 128bytes> 4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
(2) HDMI 1 : 256Bytes

3) Press ADJ key on R/C for adjustment.

4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : Component” by using D/E
(CH +/-) and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
(3) HDMI 2 : 256Bytes
OK

4.4.2. ADC Calibration - RGB (Using External pattern)

(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 )

(4) HDMI 3 : 256Bytes

3) Press ADJ key on R/C for adjustment.

4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : RGB” by using D/E(CH +/-)
and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear

OK

Copyright © 2009 LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
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4.5. Check SW Version 5.2. Adjustment of White Balance
(1) Method : (For automatic adjustment)
1) Push In-star key on Adjust remote-controller.
2) SW Version check
Check “SW VER : V3.xx” – LH70

* LP91A~D Support RS-232C & I2C DDC Communication-

White Balance Mode.

(1) Enter the adjustment mode of DDC

- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-
run pattern display)

(2) Release the DDC adjustment mode

- Release the adjust mode after AC off/on or std-by off/on
5. PCB assembly adjustment method in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
5.1. Input Area-Option command(F3 00 00) from adjustment equipment.
(1) Profile : Must be changed the Area option value because - Need to transmit the aging off command to TV set after
being different of each Country’s Language and finishing the adjustment.
signal Condition. - Check DDC adjust mode release by exit key and release
(2) Equipment : adjustment remote control. DDC adjust mode)
(3) Adjustment method
- The input methods are same as other chassis.(Use IN- (3) Enter the adjust mode of white balance)
START Key on the Adjust Remocon.) - Enter the white balance adjustment mode with aging
command (F3, 00, FF)
Refer to Job Expression of each main chassis ass’y * Luminance min value is 150cd in the Cool/Medium/Warm
(EBTxxxxxxxx) for Option value. mode(For LCD)

* White Balance Adjustment 5.3. Adjustment of White Balance

- Purpose : Adjust the color temperature to reduce the (for Manual adjustment)
deviation of the module color temperature. (1) Color analyzer(CA100+, CA210) should be used in the
- Principle : To adjust the white balance without the saturation, calibrated ch by CS-1000
Fix the one of R/G/B gain to 192 (default data) (2) Operate the zero-calibration of the CA100+ or CA-210,
and decrease the others. then stick sensor to the module when adjusting.
- Adjustment mode : Three modes – Cool / Medium / Warm (3) For manual adjustment, it is also possible by the following
- Required Equipment sequence.
1) Remote controller for adjustment 1) Select white pattern of heat-run by pressing “POWER
2) Color Analyzer : CA100+ or CA-210 or same product - ON” key on remote control for adjustment then operate
LCD TV( ch : 9 ), heat run longer than 15 minutes. (If not executed this
(should be used in the calibrated ch by CS-1000) step, the condition for W/B may be different.)
3) Auto W/B adjustment instrument(only for Auto adjustment) 2) Push “Exit” key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter “0000” (Password)
6) Select “3. W/B ADJUST”
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.
10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others
11) When adjustment is completed, Enter “COPY ALL”.
12) Exit adjustment mode using EXIT key on R/C.

Copyright © 2009 LG Electronics. Inc. All right reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
 * CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G

(4) Standard color coordinate and temperature when using the

CA100+ or CA210 equipment
Coordinate
Mode Temp uv∆
x y
Cool 0.276±0.002 0.283±0.002 11000K 0.000
Medium 0.285±0.002 0.293±0.002 9300K 0.000
Warm 0.313±0.002 0.329±0.002 6500K 0.003

To check the Coordinates of White Balance, you have to

measure at the below conditions.
Picture Mode : User 1
Dynamic Contrast : Off
Dynamic Colour : Off
(If you miss the upper condition, the coordinates of W/B
can be lower than the spec.)

Copyright © 2009 LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
 TROUBLESHOOTING

No power : [A] PROCESS

(LED indicator off)

Fail
Check 24V, 12V, 5,2V Check short of Main B/D
of Power B/D or Change Power B/D

Pass

Fail Fail
Check Output of Check short of IC1001, Re-soldering or Change defect
IC1001, IC1003, IC1007 IC1003, IC1007 part of IC1001, IC1003, IC1007

Pass
Pass
Change IC1002,, Q1003

Fail
Check LEDAssy Change LEDAssy

Pass

Check P307 Connector

No Raster [B]: Process

Pass

Check LED status

Repeat A PROCESS
On Display Unit Fail

Pass

Check Panel Link Cable Change Panel Link Cable

Or Module Fail Or Module

Pass

Check Inverter Connector Change Inverter Connector

Or Inverter Fail Or Inverter

Pass

Check Output of IC802 Change IC802

Fail

Pass

Check LVDS Cable Change Module

Fail

Copyright © 2009 LG Electronics. Inc. All right reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
 No Raster on PC Signal

Pass

Check Input source Cable

And Jack

Pass

Check the Input/Output Re-soldering or

Of J104 Fail Change the defect part

Pass

Re-soldering or
Check the Input/Output Change the defect part,
Of P401 Fail Check FFC cable

Pass

Re-soldering or
Check the Input/Output
Of IC100 Fail Change the defect part,
Check RGB EDID Data

Pass

Check the Input/Output Re-soldering or

Of IC800 Fail Change the defect part

Pass

Repeat [A], & [B] Process

No Raster on COMMPONENT Signal No Raster on HDMI Signal

Pass
Pass
Check Input source
Cable And Jack
Check Input source
Cable And Jack
Pass

Pass Check the Input/Output Re-soldering or

Of JK301, JK302, JK303 Fail Change the defect part
Check The Input/Output Re-soldering or
Of JK101 Fail Change the defect part
Pass
Re-soldering or
Check the Input/Output Change the defect part
Pass
Of IC300, IC301, JK302 Fail Check HDMI EDID Data
Re-soldering or Re-download HDCP
Check The input/Output Change the defect part
Of P401 Fail Check FFC Cable Pass

Pass Check the Input/Output Re-soldering or

Of IC800 Fail Change the defect part

Check the Input/Output Re-soldering or Pass

Of IC800 Fail Change the defect part
Repeat [A], & [B] Process

Repeat [A], & [B] Process

Copyright © 2009 LG Electronics. Inc. All right reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
 No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal

Pass Pass

Check Input source

Cable And Jack Check Input source
Cable And Jack

Pass
Pass

Check The Input/Output Re-soldering or

Change the defect part Check The Input/Output Re-soldering or
Of JK101, JK201 Fail
Of TU500 Fail Change the defect part

Pass
Pass
Re-soldering or
Check the Input/Output Re-soldering or
Change the defect part Check the Input/Output
Of P401 Fail Change the defect part
Check FFC Cable Of P401 Fail
Check FFC Cable
Pass
Pass

Check the Input/Output Re-soldering or

Check the Input/Output Re-soldering or
Of IC800 Fail Change the defect part
Of IC800 Fail Change the defect part

Pass
Pass

Repeat [A], & [B] Process Repeat [A], & [B] Process

No Sound

Check The Input Sourse Change The Source Input

Fail

Pass

Check The Input/Output Re-soldering or

Of IC600 Fail Change the defect part

Pass

Check The Speaker Change Speaker

Fail

Pass

Check The Speaker Wire

Copyright © 2009 LG Electronics. Inc. All right reserved. - 16 - LGE Internal Use Only
Only for training and service purposes
 EEPROM DDC_SCL1/SDA1
IR TX
HDMI1 TMDS 24C02
HDMI_DATA_1 Serial Flash
HDMI2 TMDS
HDMI3 EEPROM HDMI_DATA_2 ( 8MByt e)
24C02 DDC_SCL1/SDA2
TMDS EEP_SCL/ SDAEEPROM
EEPROM
DDC_SCL1/SDA3 HDMI_DATA_3 f o r HDCP
24C02
( 8K)

Only for training and service purposes

USB USB_DP/ DN EEP_SCL/ SDA
EEPROM
( 256K)
Bluet o o t h
BLT_DP/ DN
Circ uit
DDR2 SDRAM
( 512MB)
OPC_EN

Copyright © 2009 LG Electronics. Inc. All right reserved.

E-DIM
PC_Aud io PC_Aud io _L/ R :700m Vrm s
PC_Aud io _L/ R
MAIN SCALER DDR2 SDRAM
EEPROM DSUB_SCL /SDA ( 2* 256MB) URSA_[ A: B]
RGB_PC 24C02 LGE376xA
PC_R/ G/ B/ HS/ VS MEMC_RXE0±
PC_R/ G/ B/ HS/ VS MEMC_RXE1±
MEMC_RXE2±

- 17 -
COMP1_Y/ Pb / Pr:1/ 0. 7Vp p MEMC_RXC±
COMP1_Y/ Pb / Pr: 1/ 0. 7Vp p MEMC_RXC3±
COMP2_Y/ Pb / Pr:1/ 0. 7Vp p MEMC_RXE4± FRC IC
FULL HD LVDS co nnec tor

COMP1 COMP2_Y/ Pb / Pr: 1/ 0. 7Vp p

COMP2 MNT_OUT MEMC_RXO0± LGE7329A
MEMC_RXO1±
Co m p 1_L/ R :500m Vrm s MEMC_RXO2±
COMP1_LIN/ RIN
Co m p 2_L/ R :500m Vrm s MEMC_RXOC±
COMP2_LIN/ RIN MEMC_RXO3±
AV1_LIN/ RIN :500m Vrm s
BLOCK DIAGRAM

AV1_LIN/ RIN
MEMC_RXO4±
AV1_VIN : 1Vp p
AV1_VIN
MNT_OUT AV2_LIN/ RIN :500mVrm s Serial Flash
AV2_LIN/ RIN URSA_[C~D]
AV1 AV2_VIN : 1Vp p
AV2_VIN
AV 2 MNT_VOUT: 1Vp p
MNT_VOUT M_SCL/ SDA
FRC LVDS c onnect or

MNT_LOUT/ ROUT: 500mVrm s PWM R_SPK_OUT

AUDIO
MNT_L/ R OUT NTP3100L
AMP IIS_OUT R_CH
L_CH
TV TU_MAIN TU_MAIN
TUNER M_SCL/ SDA L_SPK_OUT
( RF)
SIF SIF
PANEL_STATUS
Tx/ Rx : ± 15Vp p 232C Driver OPC_OUT
TXD / RXD :5V Dig it al PSU
RS232 ST3232C
RL_ON/ I-DIMMING/ DISP_EN

LGE Internal Use Only

 EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
400

A2
820

540

570
805

530

830

806
804

A10
801

900
550
803

802

910
A5
200T

122
200

123
200N

120
560

301
510

580

310
500
300

Copyright LG Electronics. Inc. All right reserved. - 18 - LGE Internal Use Only
Only for training and service purposes
 EAX58298501
Mstar LCD LH70 R202 0
+5V_USB

USB Non_OCP
OCP_READY

JK200 Pin to Pin with AC A

C

KJA-UB-0-0037 EAN43439401

PC EDID
KDS226
D213 R238
IC201 OCP_READY 510
close to JK200 MIC2009YM6-TR OCP_READY
+5VST_MST
IC100
CAT24C02WI-GT3 11 **1A Design C200
6 VOUT VIN 1 L202 120-ohm
OCP_READY
C201 100uF
C202
100uF
C205 500 R205 C203 C204
R129 C113 10uF 100uF
L200 0.1uF 10uF
R154 R128 16V 16V 5 ILIMIT GND 2 4.7K
READY

A0 VCC 4.7K 4.7K 4.7K 0.01uF 6.3V 16V

OCP_READY OCP_READY OCP_READY
1 8 OCP_READY

2
160
0 R200 R203 4 FAULT/ ENABLE 3
A1 WP USB_DN
2 7 R110 100
DDC_WP It s possibel D207 30V R204
A2 SCL READY 1KOCP_READY
3 6 R119 100
DSUB_SCL to 27~47ohm
VSS SDA 3 USB_DP
4 5 R120 100
DSUB_SDA 0 R201
D208 30V
READY

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 LH70 2008/09/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. INPUT-USB 1 9

+5V_HDMI_2
EAX58298501
HDMI2 +5V_MULTI Mstar LCD LH70
+5V_HDMI_2
A2

A1

D301
KDS184S
R303 1K
C

HDMI3
IC301 +5V_HDMI_3
R301 10K C CAT24C02WI-GT3
HPD_MST_2 B E
Q301 +5V_MULTI
2SC3875S R309 R311 C301
A0 1 8 VCC 10K 10K 0.01uF

A2

A1
+5V_HDMI_3
D302
A1 2 7 WP R327 100 KDS184S
DDC_WP R314 1K

C
C IC302
20 A2 3 6 SCL R304 100 R312 10K B CAT24C02WI-GT3
20
HPD_MST_3 Q302
VSS 4 5 SDA R305 100 E2SC3875S A0 VCC R319 R320 C300
HPD 19 1 8 10K 10K 0.01uF
+5V_POWER 18 A1 WP
2 7 R329 100 DDC_WP
DDC/CEC_GND 17
SDA 16 DDC_SDA2 20
A2
3 6
SCL
R317 100
SCL 15 DDC_SCL2 20
VSS SDA
NC 14 4 5 R318 100
HPD 19
CEC 13 CEC
JP304

+5V_POWER 18
CLK- 12 TMDS2_RXC-
JP305

DDC/CEC_GND 17
CLK_SHIELD 11 16
10
SDA
DDC_SDA3
CLK+
TMDS2_RXC+ SCL 15 DDC_SCL3
9
DATA0-
TMDS2_RX0- NC 14
DATA0_SHIELD 8 13
7
CEC
CEC
DATA0+
TMDS2_RX0+ CLK- 12 TMDS3_RXC-
DATA1- 6 TMDS2_RX1- CLK_SHIELD 11
DATA1_SHIELD 5 10
4
CLK+
TMDS3_RXC+
DATA1+
TMDS2_RX1+ DATA0- 9
TMDS3_RX0-
DATA2- 3 TMDS2_RX2- DATA0_SHIELD 8
DATA2_SHIELD 2 7
1
DATA0+
TMDS3_RX0+
DATA2+
TMDS2_RX2+ DATA1- 6 TMDS3_RX1-
DATA1_SHIELD 5
JK302 DATA1+ 4 TMDS3_RX1+
YKF45-7058V
DATA2- 3 TMDS3_RX2-
EAG59023302
DATA2_SHIELD 2
DATA2+ 1 TMDS3_RX2+
JK303
YKF45-7058V

HDMI1
+5V_HDMI_1
EAG59023302
+5V_MULTI

+5V_HDMI_1
A2

A1

D300 +3.3V_MST
R302 1K KDS184S
C

IC300
CAT24C02WI-GT3
HPD_MST_1 R300 10K B C
E
Q300 R315 R316
2SC3875S A0 VCC R308 R310 C302
1 8 10K 10K 0.01uF 68K 56000
CEC_READY READY

A1 WP
R331 100 DDC_WP
Q303
2 7
BSS83 D303
20
A2
3 6
SCL
R306 100 CEC_READY MMBD301LT1G
30V CEC_READY
20
VSS SDA
D CEC_C
HPD 19
4 5 R307 100
B R313
G S 0
JP302

18
+5V_POWER
CEC
JP303

DDC/CEC_GND 17
D304
16 CDS3C30GTH
SDA
DDC_SDA1 30V CEC_READY
15
SCL
DDC_SCL1
NC 14
13
CEC
CEC
12
CLK-
TMDS1_RXC- THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
CLK_SHIELD 11
10
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
CLK+
TMDS1_RXC+ FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
9
DATA0-
TMDS1_RX0- ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
DATA0_SHIELD 8
7 THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DATA0+
TMDS1_RX0+
6
DATA1-
TMDS1_RX1-
DATA1_SHIELD 5
4
DATA1+
TMDS1_RX1+
DATA2- 3 TMDS1_RX2-
DATA2_SHIELD 2
DATA2+ 1 TMDS1_RX2+
JK301
YKF45-7054V
EAG59023301 H6 LH70 2008/09/20
INPUT-HDMI 2 9

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 EAX58298501
Mstar LCD LH70 CONTROL KEY

1 L411 500-ohm
ZD401
SUB_SCL
ESD_READY

2 L410 500-ohm
ZD402
SUB_SDA
ESD_READY

3 +3.3V_MST

R420 R421
4.7K 4.7K
4 L403 120ohm
C404
KEY1
C408
470pF 0.1uF

5 L406 120ohm
KEY2

Only for training and service purposes

C412 C411
470pF 0.1uF
+5VST_MST
6 L404 120-ohm +5VST_MST
C406
47uF16V
+5VST_MST R429
10K IR-OUT
7 R427 R430 22
IR 10K IR-OUT IR-OUT IR_OUT
R428 10K C Q404
IR-OUT B 2SC3052
E IR-OUT
8 L402 120ohm C
R426 47K B
ZD400 C403 C407 IR-OUT E Q405
ESD_READY 47pF 0.1uF 2SC3052
READY IR-OUT

Copyright © 2009 LG Electronics. Inc. All right reserved.

9 +3.3V_MULTI_MST +3.3V_MST

R401 R400
0 READY 0
10 L407 120-ohm
C414
0.1uF

11 R402 0

12 R403 0

13

14 R404 10K SPK_N

15

P400 6630V90141J
INTERFACE
71

P401
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70

502500-7011
TXD
RXD

PC_G
PC_B
PC_R

PC_VS
PC_HS
SIDE_V
M_SCL

SIDE_C
M_SDA

+3.3V_MST

SIDE_Y
IR_OUT
+5V_MULTI
+5V_TUNER

COMP1_L
COMP1_R
COMP2_L
COMP2_R

SIDE_RIN

CVBS_VIN
MNT_VOUT
SIDE_LIN
MNT_LOUT
MNT_ROUT
CVBS_LIN
CVBS_RIN
PC_AUD_L
PC_AUD_R

TV_MAIN

COMP1_Y
COMP2_Y
MAIN_SIF
MUTE_LINE
DSUB_SCL

COMP1_PB
COMP1_PR
COMP2_PB
COMP2_PR
DSUB_SDA
S_VIDEO_DET

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 LH70 2008/09/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. CONTROL & INTERFACE 3 9

LGE Internal Use Only

 EAX58298501
Mstar LCD LH70
+16V_NTP AMP :GAIN X 4
+12V_AUDIO
C615 C617 R604 C612 C620 C622 C627
0.1uF 0.1uF 3.3 68uF35V 68uF35V 68uF35V 68uF35V IC701
C613
0.01uF C707
+1.8V 0.1uF
C R702 1K
L606 120-ohm B 1 OUT1 LM324DOUT4 14
+1.8V_AVDD E
Q700
RT1C3904-T112 C700 R704 10K
L605 120-ohm +1.8V_DVDD SPK_L+ MNT_LOUT 6800pF
R608 R605 C672 R700
12 12 L603 0.01uF 4.7K C702 33pF 2 INPUT1- INPUT4- 13
AD-8770 C637 R663
+3.3V_MULTI_MST 2S 2F 0.1uF 4.7K R708
C619 R626 6.8K
L601 120-ohm 390pF C632 3.3
+3.3V_MULTI_AUD 0.47uF
C621 1S 1F R625
390pF 3.3 R705 5.6K 3 INPUT1+ INPUT4+ 12
EAP60684501 C669 R623 MNT_L_AMP
0.1uF 4.7K C671
R610 R606

Only for training and service purposes

12 12 0.01uF SPK_L- +12V_AUDIO
SPK_L-
C616
4 VCC GND 11
22000pF C704
0.01uF
C611 22000pF
C618
1uF MNT_R_AMP R706 5.6K 5 INPUT2+ INPUT3+ 10
+3.3V_MST
C703 33pF
R611 READY +12V_AUDIO
10K
R707 10K 6 INPUT2- INPUT3- 9
C R709
R607 10KB C709 6.8K
READY 0.1uF
Q601 READY
RT1C3904-T112 E C R703 1K
B 7 OUT2 OUT3 8

BST1B 44

Copyright © 2009 LG Electronics. Inc. All right reserved.

VDR1B 43
R609 0 E

OUT1A_2 54
OUT1A_1 53
Q701

OUT1B_2 48
OUT1B_1 47
SW_RESET

PGND1A_2 56
PGND1A_1 55
PVDD1A_2 52
PVDD1A_1 51
PVDD1B_2 50
PVDD1B_1 49
PGND1B_2 46
PGND1B_1 45
RT1C3904-T112 C701
READY
R612 1 BST1A NC 42 MNT_ROUT 6800pF
22K
R701
2 VDR1A VDR2A 41 4.7K
C608 C624
R601 100 1uF 1uF
MULTI_PW_SW R682 0 3 RESET BST2A 40
READY C606
1000pF 4 AD PGND2A_2 39
C625
5 DVSS_1 PGND2A_1 38
AUDIO MAIN AMP 22000pF
6 VSS_IO IC600 OUT2A_2 37 SPK_R+
R658 R622 C648
7 CLK_I OUT2A_1 36 12 12 0.01uF
I2S_MCLK NTP-3100L C644 R628
+3.3V_MULTI_AUD +16V_NTP L607 0.1uF 4.7K
8 VDD_IO PVDD2A_2 35 C630 AD-8770 R671
+1.8V_AVDD EAN60664001 390pF 2S 2F 3.3
C605
C603 0.1uF 9 DGND_PLL PVDD2A_1 34 C634 C673
1000pF 390pF 0.47uF
C601 C626 C629 1S 1F
100pF 10 AGND_PLL PVDD2B_2 33 0.1uF 0.1uF R635
R600 EAP60684501 3.3
3.3K R621 R624 R667
11 LFM PVDD2B_1 32 C643
12 12 0.1uF 4.7K C647
+1.8V_AVDD 12 AVDD_PLL OUT2B_2 31 0.01uF
C600 C602 SPK_R-
10uF16V 0.1uF 13 DVDD_PLL OUT2B_1 30

14 TEST0 PGND2B_2 29
+1.8V_DVDD
C604 C607
10uF16V 0.1uF
Chinese Hotel & BLUETOOTH Option(LH70)

15 DVSS_2
16 DVDD
17 SDATA
18 WCK
19 BCK
20 SDA
21 SCL
22 MONITOR_0
23 MONITOR_1
24 MONITOR_2
25 FAULT
26 VDR2B
27 BST2B
28 PGND2B_1
+1.8V_DVDD C623 22000pF +3.3V_MULTI_MST P700
12507WR-06L
C609 C610
10uF 16V 0.1uF R744
0
1

R733 0 3
BLT_DP

C651 1000pF C614 1uF

P600

0
0
0
100
100
0
4
SMAW250-04Q

R734 0 5

R676
R677
R678
R602
R603
R656 0
READY
R673
1
BLT_DN
SPK_R-
6
2
SPK_R+ 7

3
SPK_L-

M_SCL
M_SDA

I2S_WS
4

I2S_SCK

I2S_SDO
SPK_L+
5

MULTI_PW_SW
C639
C638
33pF 33pF
50V 50V
READY READY

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 LH70 2008/09/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. AUDIO 4 9

LGE Internal Use Only

 EAX58298501 **H/W OPTION
R896 R898 R8010 R8011
Small HD(19/22) 4.7K X 4.7K X
Mstar LCD LH70 Small FHD (27) 4.7K X 4.7K 4.7K DDR2_A[0-12]
Non Small HD 4.7K X X 4.7K
Non Small FHD X 4.7K 4.7K X
IC802 Apollo X 4.7K 4.7K 4.7K +1.8V_DDR

DDR2_A[3]
DDR2_A[7]
DDR2_A[9]
DDR2_A[5]
DDR2_A[1]
DDR2_A[8]
DDR2_A[6]
DDR2_A[4]
DDR2_A[2]
DDR2_A[0]

DDR2_A[12]
DDR2_A[10]
DDR2_A[11]
SERIAL FLASH 8M MX25L6405DMI-12G

POWER_SW
100HZ X 4.7K X 4.7K I2S_OUT
+3.3V_MULTI_MST

R867 1K

DDR2_CKE
DDR2_BA0
DDR2_BA1
DDR2_WEZ
DDR2_CASZ
DDR2_RASZ
DDR2_ODT
1 HOLD SCLK 16 +3.3V_MULTI_MST +3.3V_MULTI_MST +3.3V_MST R8020 10K

R8016:DSP_BSY
R8017:DSP_IRQ
SPI_CLK C811
C807 0.1uF

+3.3V_MST
+5VST_MST
0.01uF 2 VCC SI.SIO015 R8011 R898

AR812
56
AR813
56
AR814
56
AR815
56
AR800
56
SPI_DI 4.7K 4.7K

0.1uF
0.01uF
1K

SYS_RESET
CEC_C
PC_VS
PC_HS
IR
DSUB_SDA
RXD
TXD
KEY2
KEY1
MODEL_OPT1
MODEL_OPT2
BLT_DP
BLT_DN
TXD
RXD
EEP_SCL
EEP_SDA
RL_ON
I2S_SDO
I2S_SCK
I2S_WS
I2S_MCLK
PANEL_STATUS
3 NC_1 NC_8 14

10K
MODEL_OPT1 MODEL_OPT2 +3.3V_LPLL_VDDP

C844
C863
R868
R8010 R896
4.7K 4.7K

C817 15pF
C816 15pF
4 NC_2 NC_7 13 READY READY

R8003
+3.3V_MULTI_MST +1.8V
5 NC_3 +1.2V_VDDC_MST
NC_6 12

X801
12MHz
+3.3V_MULTI_MST

0
0
100
100
100
100
100
100
0
100
100
100
100
0.1uF
100
100
100
100
100
R878

56
4.7K
6 NC_4 NC_5 11
R877

R839
1M

R8035
R8034
R824
R825
R894
R8022
R8021
R826
R827
R828
R829
R8012
R8016
R8017
4.7K
7 CS GND 10 C R8031
SPI_CZ B DDC_WP
E 10K +3.3V_AVDD_33_DM

HWRESET
CEC
VSYNC1
HSYNC1
VSYNC0
HSYNC0
IRIN
GPIO140 R895
GPIO139 R849
GPIO138
GPIO135 R850
GPIO134 R893
XIN
XOUT
AVDD_MPLL
SAR3
SAR2
SAR1
SAR0
USB0_DP
USB0_DM
GND_18
GND_17
UART1_TX/GPIO87
UART1_RX/GPIO86
UART2_TX/I2CM_SCK
UART2_RX/I2CM_SDA
SPDIFO
I2S_OUT_SD
I2S_OUT_BCK
VDDC_7
GND_16
VDDP_5 C883
I2S_OUT_WS
I2S_OUT_MCK
I2S_IN_SD
I2S_IN_BCK/GPIO68
I2S_IN_WS/GPIO67
VDDC_6
A_MCLKE R852
A_MADR[3]
A_MADR[7]
A_MADR[12]
A_MADR[9]
A_MADR[5]
AVDD_DDR_6
A_MADR[10]
A_MADR[1]
A_BADR[0]
A_BADR[1]
A_WEZ
A_MADR[11]
A_MADR[8]
A_MADR[6]
GND_15
A_MADR[4]
A_MADR[2]
A_MADR[0]
A_CASZ
A_RASZ
A_ODT
MVREF
AVDD_MEMPLL
GND_14
SPI_DO 8 SO/SIO1 WP/ACC 9 Q805
RT1C3904-T112

256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
R851 10RXBCKN 1 192 B_MCLKZ R843 33
TMDS2_RXC- DDR2_MCLKZ DDR2_D[0-15]

Only for training and service purposes

R854 10RXBCKP 2 191 B_MCLK R844 33
TMDS2_RXC+ DDR2_MCLK
R856 10 RXB0N 3 190 B_MDATA[5] AR805 DDR2_D[5]
TMDS2_RX0-
R858 10 RXB0P 4 189 B_MDATA[2] 56 DDR2_D[2]
TMDS2_RX0+
HOTPLUGB 5 188 B_MDATA[0] DDR2_D[0]
HPD_MST_2
EEPROM Close to IC Pin R859 10 RXB1N 6 187 B_MDATA[7] DDR2_D[7]
TMDS2_RX1-
R862 10 RXB1P 7 186 AVDD_DDR_5 C853 0.1uF

HDMI_2
IC801 L800 TMDS2_RX1+
MLB-201209-0120P-N2 AVDD_33_1 8 185 B_MDATA[13] AR806 DDR2_D[13]
24LC256-I/SM +3.3V_MULTI_MST
+3.3V_MULTI_MST +3.3V_AVDD_33_DM C833 0.1uF R869 10 RXB2N 9 184 B_MDATA[10] 56 DDR2_D[10]
C866 C867
TMDS2_RX2- GND_13
L801 TMDS2_RX2+ R871 10 RXB2P 10 183 DDR2_D[8]
A0 VCC 16V 10uF 0.1uF MLB-201209-0120P-N2 RXACKN B_MDATA[8]
1 24C64_Normal 8 +3.3V_AVDD_AU TMDS1_RXC- R872 10 11 182 DDR2_D[15]
R873 10RXACKP 12 181 B_MDATA[15]
C803 TMDS1_RXC+ AVDD_DDR_4
A1 WP 0.01uF L802 TMDS1_RX0- R874 10 RXA0N 13 180
2 7 R8027 R8028 +3.3V_LPLL_VDDP B_DDR2_DQSB[1]
TMDS1_RX0+ R879 10 RXA0P 14 179 DDR2_DQS1M
4.7K 4.7K MLB-201209-0120P-N2 AVDD_33_2 B_DDR2_DQS[1]
15 178 DDR2_DQS1P
A2 SCL GND_12
3 6 R812 0 C815 0.1uF TMDS1_RX1- R880 10 RXA1N 16 177

HDMI_1
EEP_SCL TMDS1_RX1+ R890 10 RXA1P 17 176 VDDP_4 C849 0.1uF
VSS SDA GND_1 18 175 AVDD_DDR_3
4 5 R813 0 B_DDR2_DQSB[0]
EEP_SDA TMDS1_RX2- R891 10 RXA2N 19 174 DDR2_DQS0M
R892 10 RXA2P 20 173 B_DDR2_DQS[0]
TMDS1_RX2+ DDR2_DQS0P
HOTPLUGA 21 172 GND_11
HPD_MST_1

Copyright © 2009 LG Electronics. Inc. All right reserved.

R840 390 REXT 22
IC800 171 B_DDR2_DQM[0]
DDR2_DQM0
C819 0.1uF C804 VCLAMP
0.1uF 23 170 B_DDR2_DQM[1]
DDR2_DQM1
C804/C805/C806:Close to IC C805 0.1uF REFP 24 169 AVDD_DDR_2
LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ] B_MDATA[14]
a s c l o s e a s p o s s i b l e C806 0.1uFREFM 25 168 AR809 DDR2_D[14]
HDCP EEPROM READY R814 47 C843 BIN1P
0.047uF 26 167 B_MDATA[9] 56 DDR2_D[9]
+3.3V_MULTI_MST PC_B
R803 470 C846 SOGIN1
1000pF 27 166 GND_10 DDR2_D[12]
PC_G
R816 47 C845 GIN1P
0.047uF 28 EAN60658901 165 B_MDATA[12] DDR2_D[11]
R818 47 C847 RIN1P
0.047uF 29 164 B_MDATA[11]
PC_R
HDCP_READY IC803 R838 47 C825 BINM
0.047uF 30 163 AVDD_DDR_1
R8004 CAT24WC08W-T R815 47 C851 BIN0P
0.047uF 31 162 B_MDATA[6] AR810 DDR2_D[6]
4.7K COMP1_PB
R833 47 C827 GINM
0.047uF 32 161 B_MDATA[1] 56 DDR2_D[1]
A0 VCC R817 47 C852 GIN0P
0.047uF 33 160 GND_9 DDR2_D[3]
1 8 COMP1_Y
R819 470 C854 SOGIN0
1000pF 34 159 B_MDATA[3] DDR2_D[4]
R836 47 C829 RINM
0.047uF 35 158 B_MDATA[4]
A1 WP RIN0P VDDC_5
2 7 COMP1_PR R804 47 C855 0.047uF 36 157
DDC_WP AVDD_33_3 37 156 VDDP_3 C848 0.1uF
GND_2 GPIO58 R8018 1K +3.3V_MULTI_MST
A2 SCL C838 0.1uF 38 155 R8038 1K MUTE_LINE
3 6 R8005 22 BIN2P GPIO57 R865 4.7K
EEP_SCL COMP2_PB R832 47 C826 0.047uF 39 154 SUB_SCL
HDCP_READY GIN2P GPIO56 R866 4.7K
COMP2_Y R834 47 C828 0.047uF 40 153 SUB_SDA
VSS SDA SOGIN2 GPIO55
4 5 R8006 22 R835 470 C835 1000pF 41 152 S_VIDEO_DET
HDCP_READY EEP_SDA COMP2_PR R837 47 C830 RIN2P
0.047uF 42 151 GPIO54
PANEL_ON R8029
CVBS6 GPIO53 3.3K
SIDE_C R8042 47 C8001 0.047uF 43 150 DISP_EN/VAVS_ON
R8019 47 C8002 CVBS5
0.047uF 44 149 GPIO52
SIDE_Y SW_RESET
R897 10 C831 CVBS4
0.047uF 45 148 GPIO51
CVBS_VIN DDC_WP
R802 10 C832 CVBS3
0.047uF 46 147 GND_8
SIDE_V R8032 4.7K
CVBS2 47 146 GPIO152/I2C_OUT_SD3
R8014 100 READY
CVBS1 48 145 GPIO151/I2C_OUT_SD2 R8015 100 READY MEMC_RESET
+12V_AUDIO R831 10 C834 VCOM1
0.047uF 49 144 GPIO150/I2C_OUT_MUTE
OPC_EN
GAIN X 4 R857 10 C836 CVBS0
0.047uF 50 143 VDDC_4
TV_MAIN
C810 0.01uF R830 10 C837 VCOM0
0.047uF 51 142 GND_7
AVDD_33_4 52 141 AVDD_LPLL C850 0.01uF
R809
470 CVBSOUT 53 140 LVB0M
MNT_VOUT_T MEMC_RXO4-
E B GND_3 54 139 LVB0P
C MEMC_RXO4+
R875 47 C868 0.1uF SIF0P 55 138 LVB1M
Q801 MAIN_SIF MEMC_RXO3-
R8041 47 R876 47 C869 0.1uFSIF0M 56 137 LVB1P
ISA1530AC1
C B
MNT_VOUT_T MEMC_RXO3+
E VDDC_1 57 136 LVB2M
MEMC_RXOC-
Q802 C856 2.2uF AUL5 58 135 LVB2P
R808 220 SIDE_LIN MEMC_RXOC+
MNT_VOUT RT1C3904-T112 C861 2.2uF AUR5 59 134 LVBCKM
SIDE_RIN MEMC_RXO2-
AUVRM 60 133 LVBCKP
MEMC_RXO2+
R807 402 R882 AUOUTL2
100 61 132 LVB3M
R810 MNT_L_AMP MEMC_RXO1-
READY 68 R881 AUOUTR2
100 62 131 LVB3P
MNT_R_AMP MEMC_RXO1+
R846 AUOUTL1
100 63 130 LVB4M
READY
MEMC_RXO0-
R847 AUOUTR1
100 64 129 LVB4P
READY
MEMC_RXO0+
R842 22K

65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128

C839 0.01uF
RESET R845 22K
SDI
SCZ

SCK
SDO

AUL0
AUL1
AUL2
AUL3
AUL4

AUR0
AUR1
AUR2
AUR3
AUR4

C841 0.01uF
PWM0
PWM1
PWM2
PWM3

RXC0P
RXC1P
RXC2P
LVA4P
LVA3P
LVA2P
LVA1P
LVA0P

GND_4
GND_5
GND_6

RXC0N
RXC1N
RXC2N

GPIO20

AUVRP

P_12V P_16V Q804

LVA4M
LVA3M
LVA2M
LVA1M
LVA0M

AUVAG

AUCOM
VDDP_1
VDDP_2

VDDC_2
VDDC_3
RXCCKP
LVACKP

RXCCKN
USB1_DP

R8002 22K
LVACKM

RT1C3904-T112
USB1_DM

R8037
DDCA_CK
DDCA_DA

AVDD_AU
AVDD_DM

UART2_TX
UART2_RX
HOTPLUGC

0
DDCDB_CK
DDCDC_CK

DDCDA_CK
DDCDB_DA
DDCDC_DA

DDCDA_DA

C B R8007 33K C877 0.01uF +3.3V_AVDD_AU

R800 R8001 E
C871
RL_ON R8009 22K
0 0 4.7uF READY +3.3V_AVDD_33_DM
READY 10V C878 0.01uF C842 0.1uF
0.1uF
10
10
0.01uF
10
10
0
0
1K READY

100
100
100
100
0 READY
0
0
100
10
10
100
10
10

2.2uF
2.2uF
2.2uF
2.2uF
2.2uF
2.2uF
2.2uF
2.2uF
0.1uF
2.2uF
2.2uF
0.01uF

D801
POWER_DET
KDS181 +5VST_MST
R885 150 D802
C823
C824
C801
C872
C802
C873
C874
C875
C808
C821
C822
C840

KDS181
C882
R822
R823
C876
R841
R848
R899
R8013
R8030

R8023
R8024
R8025
R8026
R8033
R806
R870
R8039
R801
R805
R8040
R820
R821

R860 1K
AR818
33

R855
R8036 10K
10K C870
READY 47uF 25V MULTI_PW_SW
C
R853 Close to IC as close as possible
I-DIM

1K
E-DIM

SPI_DI

B Q803
SPI_CZ
SPI_DO

+1.2V_VDDC_MST
USB_DP

RT1C3904-T112
SPI_CLK

Q800
COMP1_L
COMP2_L
COMP1_R
COMP2_R

+5VST_MST
CVBS_LIN
CVBS_RIN
DDC_SCL1
DDC_SCL2
DDC_SCL3

PC_AUD_L
DSUB_SCL
POWER_DET

PC_AUD_R
DDC_SDA1
DDC_SDA2
DDC_SDA3

DSUB_SDA

R861 ISA1530AC1 2.2uF

HPD_MST_3

1K C8000 E
TMDS3_RX0-
TMDS3_RX1-
TMDS3_RX2-

TMDS3_RXC-
TMDS3_RX0+
TMDS3_RX1+
TMDS3_RX2+

16V
MEMC_RXE0-
MEMC_RXE1-
MEMC_RXE2-
MEMC_RXE3-
MEMC_RXE4-

TMDS3_RXC+

E
MEMC_RXEC-

MEMC_RXE0+
MEMC_RXE1+
MEMC_RXE2+
MEMC_RXE3+
MEMC_RXE4+

READY
MEMC_RXEC+

B +1.2V_VDDC_MST
C HDMI_3
SW800 SYS_RESET C857 C859 C879 C880 C881
R886
USB PART USB_DN

JTP-1127WEM +5VST_MST 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF

2
0 R8043
2K
R8000 SPK_N +3.3V_MULTI_MST

3 1
4
10K 0 MEMC_RESET R8008 0 +1.8V
10uF 16V
0.1uF
1000pF
4.7uF

C812 R8045
READY R863 4.7K R811 R883
4.7uF 1K 1K
R888 100 R864 4.7K READY
C809
C813
C818
C820

SPK_N +3.3V_MULTI_MST
0 R8044 0
R8046 R889 R884
C864 C858 C860 C862 C865
Close to IC
with width trace

C814 R887 D803 READY 1K 1K 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF

KDS181 READY
0.1uF 33K
M_SCL
M_SDA

[MODE SELECTION]

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 LH70 2008/09/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MAIN Mstar 5 9

LGE Internal Use Only

 EAX58298501
Mstar LCD LH70 #9.DDR2
IC900 IC900-*1
+1.8V_DDR
HYB18TC512160B2F-2.5 DDR2_D[0-15] H5PS5162FFR-S6C

Close to DDR2 IC
1K

VREF DQ0
R907

J2 G8
DQ1

C904 C905 C918

J2 VREF DQ0 G8 DDR2_D[0] G2
H7 DQ2
A0
1K

M8 DQ3
R908

0.01uF 1000pF 0.1uF

50V DQ1 G2 DDR2_D[1] A1
A2
M3
H3
H1 DQ4
M7 DQ5
DDR2_A[0] DQ2 H7 DDR2_D[2] A3 N2
H9
DQ6
M8 A0 A4 N8
F1
DQ7
DDR2_A[1] DQ3 H3 DDR2_D[3] A5 N3
F9
DQ8
M3 A1 A6 N7
C8
DQ9
DDR2_A[2] DQ4 H1 DDR2_D[4] A7 P2
C2
DQ10
M7 A2 A8 P8
D7
DQ11
DDR2_A[3] DQ5 H9 DDR2_D[5] A9 P3
D3
DQ12
N2 A3 A10/AP M2
D1
DQ13
DDR2_A[4] DQ6 F1 DDR2_D[6] A11 P7
D9
DQ14
N8 A4 A12 R2
B1
DQ15
DDR2_A[5] DQ7 F9 DDR2_D[7] B9

N3 A5 BA0
DDR2_A[6] DQ8 C8 DDR2_D[8] BA1
L2

N7 A6 L3
A1 VDD5

DDR2_A[7] DQ9 C2 DDR2_D[9] E1 VDD4

P2 A7 CK J8 J9 VDD3

DDR2_A[8] DQ10 D7 DDR2_D[10] CK K8 M9 VDD2

P8 A8 CKE K2 R1 VDD1

DDR2_A[9] DQ11 D3 DDR2_D[11]

P3 A9 ODT
DDR2_A[10] DQ12 D1 DDR2_D[12] CS
K9
VDDQ10
M2 A10/AP RAS
L8 A9
VDDQ9
DDR2_A[11] DQ13 D9 DDR2_D[13] CAS
K7 C1
VDDQ8
P7 A11 WE
L7 C3
VDDQ7
DDR2_A[12] DQ14 B1 DDR2_D[14] K3 C7
VDDQ6
R2 A12 C9
VDDQ5
DQ15 B9 DDR2_D[15] LDQS
UDQS
F7
E9
G1 VDDQ4
B7 VDDQ3
G3
VDDQ2
DDR2_A[0-12] +1.8V_DDR LDM
G7
VDDQ1
DDR2_BA0 L2 BA0 UDM
F3
B3
G9

DDR2_BA1 L3 BA1
VDD5 A1 C901 0.01uF LDQS E8 A3 VSS5

Close to DDR2 IC
UDQS A8 E3 VSS4
VDD4 E1 C902 0.01uF J3 VSS3
VSS2
NC4 N1

DDR2_MCLK J8 CK VDD3 J9 C903 0.01uF NC5

L1
R3
P9 VSS1
R906 150 NC6
DDR2_MCLKZ READY K8 CK VDD2 M9 C906 0.01uF
R7

VSSQ10
DDR2_CKE K2 CKE VDD1 R1 C907 0.01uF NC1
NC2
A2
B2
B8 VSSQ9
E2 VSSQ8
NC3 A7
R8 VSSQ7
D2
D8 VSSQ6
VSSQ5
DDR2_ODT K9 ODT VSSDL J7 E7
F2 VSSQ4
VSSQ3
L8 CS VDDQ10 A9 C908 0.01uF
F8
H2 VSSQ2
VDDL VSSQ1
DDR2_RASZ K7 RAS VDDQ9 C1 C909 0.01uF
J1 H8

DDR2_CASZ L7 CAS VDDQ8 C3 C910 0.01uF

DDR2_WEZ K3 WE VDDQ7 C7 C911 0.01uF

VDDQ6 C9 C912 0.01uF

VDDQ5 E9 C913 0.01uF

DDR2_DQS0P R900 56 F7 LDQS
VDDQ4 G1 C914 0.01uF
DDR2_DQS1P R901 56 B7 UDQS
VDDQ3 G3 C915 0.01uF

VDDQ2 G7 C916 0.01uF

DDR2_DQM0 R902 56 F3 LDM VDDQ1 G9 C917 0.01uF

DDR2_DQM1 R903 56 B3 UDM

DDR2_DQS0M R904 56 E8 LDQS VSS5 A3

DDR2_DQS1M R905 56 A8 UDQS VSS4 E3
VSS3 J3
VSS2 N1
L1 NC4
VSS1 P9
R3 NC5
R7 NC6

VSSQ10 B2
A2 NC1
VSSQ9 B8
E2 NC2
VSSQ8 A7
R8 NC3
VSSQ7 D2
VSSQ6 D8
J7 VSSDL VSSQ5 E7
VSSQ4 F2
VSSQ3 F8
+1.8V_DDR VSSQ2 H2
J1 VDDL VSSQ1 H8
C900
0.01uF
C919
10uF 10V DDR2 MEMORY

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 LH70 2008/09/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MAIN DDR 6 9

Copyright © 2009 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 EAX58298501 **5V_MULTI-->1.2V
Mstar LCD LH70
IC1001
P1000 BD9130EFJ-E2
FM20020-24
ADJ EN
P_5V 1 8 R1006 10K

VCC PVCC
+5V_MULTI 2 7

R1000
2.2K
OUT:1.27V
1 NC Power_On 2 C1004 C1018 ITH SW
R1008 12K 3 6 L1002 2.2uH +1.2V_VDDC_MST
10uF 16V 10uF 16V C1012 R1009
3 GND GND 4 3 560pF GND PGND 2K
2 R1003 10K RL_ON 4 5 C1013 C1025 R2 C1014 C1041
1 10uF 16V 10uF 16V 0.1uF 1uF 25V
5 GND GND 6 R1010 READY
Q1000 MAX 2A 3.3K R1
7 5.2V 5.2V 8 2SC3875S
P_5V
9 5.2V 5.2V 10 P_5V V0 = 0.8*(1+(R2/R1))
11 GND GND 12
P_12V 13 12V 12V 14 P_12V
15 GND GND 16 +5V_MULTI
P_16V 17 24V 24V 18 P_16V R1046
**5V_MULTI->3.3V->1.8V

Only for training and service purposes

3K IC1003
R1066 0 19 NC INV_ON 20 AZ1085S-3.3TR/E1
READY OUT:3.3V
R1001 10K L1005 120-ohm 21 A.DIM Err_Out22 3 R1047 10K
I-DIM PANEL_STATUS 1 2 Q1002 DISP_EN/VAVS_ON +5V_MULTI R1073 0 INPUT 3 MAX 3A 2 OUTPUT L1003 500 +3.3V_MULTI_MST
1K
R1012
C1044 C1024 23 NC PWM_DIM 24 2SC3875S C1054 1 C1028 C1036
2.2uF 0.1uF R1053 0.1uF ADJ/GND 100uF 16V IC1002 0.1uF
READY 0 NON_LGD AP1117EG-13
OPC_OUT2 R1067 0
SBL C1020 IN 3 MAX 1A 2 OUT L1013 120-ohm
L1004 120-ohm +1.8V_DDR
READY DDR2, Vref
25 OPC_OUT1 1 C1022 C1039 C1023 C1032
C1045 R1011 10uF 1uF 25V 0.1uF
2.2uF 16V 1K C1040 C1016 C1015 ADJ/GND READY 0.1uF +1.8V
READY 1uF 25V 10uF 0.1uF R1 R1004 NTP,AUDIO DSP
READY 300

LED Block R2 R1007

150 V0 = 1.25*(1+(R2/R1))
+5VST_MST +5V_MULTI

Copyright © 2009 LG Electronics. Inc. All right reserved.

R1002 R1005
10K 1.2K

LD1002 P_5V L1001 120-ohm +5VST_MST

**Switch 12V:P12V
SAM2333 C1003 C1008 C1011
10uF16V 0.01uF 0.01uF
**Switch 5V:5V_MULTI -> 1.8V
P_12V L1012 120-ohm +12V_AUDIO
C1002 C1007 C1034 P_12V
47uF 25V 0.01uF 0.1uF
L1006
L1000 500 120-ohm
P_16V +16V_NTP
C1006 C1046 C1001
68uF35V 0.01uF 0.1uF
C1027
68uF Q1003
35V R1049 C1047
READY 33K 1uF 25V SI4925BDY
Close to Q1003 EBK32753101
R1065
33K S1
1 8
D1_2
L1007 120-ohm +12V_LCD
C C1005 R1050 R1051 R1052 C1009 C1010
B Q1001 G1 0.1uF 2.2K 2.2K 2.2K 100uF16V 0.01uF
R1048 10K 2 7 D1_1
PANEL_ON RT1C3904-T112
R1045 E S2 D2_2
*ST 5V->3.3V 10K 3 6

G2
P_5V 4 5 D2_1 +5V_MULTI
IC1007 C1019 C1021
AP2121N-3.3TRE1 10uF 16V 0.01uF
R1070 C1048
22K 1uF
+5VST_MST 3 VIN VOUT 2 +3.3V_MST
GND C1052 C1053 C1037
10uF 16V 0.01uF 1uF 25V R1069
1 READY 1.6K
C
R1068 10K B Q1004
POWER_SW RT1C3904-T112
E

+5V_MULTI
**DC-DC CONVERTER_READY
12V->5V_TUNER/USB OUT:5V L1010 120-ohm +5V_TUNER
R1059 R1019 C1017
10
100uF 16V
IC1006 10K
MP2212DN +5V_USB
R1057 C1026
30K R1056 0.1uF
0
1 FB EN/SYNC 8 L1014 120-ohm +5V_MEMC
R1018 READY
MEMC
R1058 700mA + 415mA
5.6K MAX 3A 2K
2 GND SW_2 7

P_12V L1008 500 3 IN SW_1 6 L1009 3.6uH

C1030 C1031 C1000 C1029 C1038
10uF 25V 10uF 25V 10uF 16V 10uF 16V 1uF 25V
4 BS VCC 5 READY
C1033
C1035 0.1uF
1uF 25V

R1055
0

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 LH70 2008/09/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. POWER 7 9

LGE Internal Use Only

 +12V_LCD
P1103 P1101
EAX58298501 SMAW250-04Q
TF05-51S
L1107
CB3216PA501E
XTAL R1124 1M
Mstar LCD LH70 1 1

MEMC_RXE0+
MEMC_RXE0-
MEMC_RXE1+
MEMC_RXE1-
MEMC_RXE2+
MEMC_RXE2-
MEMC_RXEC+
MEMC_RXEC-
MEMC_RXE3+
MEMC_RXE3-
MEMC_RXE4+
MEMC_RXE4-
MEMC_RXO0+
MEMC_RXO0-
MEMC_RXO1+
MEMC_RXO1-
MEMC_RXO2+
MEMC_RXO2-
MEMC_RXOC+
MEMC_RXOC-
MEMC_RXO3+
MEMC_RXO3-
MEMC_RXO4+
MEMC_RXO4-
2
X1101 12MHz 2
M_XTALO M_XTALI 3

R1146 R1152 4

C1150 10uF 16V

C1151 1000pF
C1152 0.1uF
Closed to IC1100 C1147 C1148 3
100 100 15pF 15pF ISP_RXD_TR 5
R1147 R1153 4 6
100 100 ISP_TXD_TR
7
R1148 R1154 5
8
100 100
R1149 R1155 9

100 100 +3.3V_MEMC 10

R1150 R1156 11
URSA_B4M
100 100 L1105
120-ohm URSA_B4P 12
R1151 R1157
+3.3V_MEMC 13
100 100 URSA_B3M
URSA_B3P 14
+3.3V_MEMC L1104 120-ohm
15
L1106

10uF 10V
10uF
0.1uF
0.1uF
0.1uF
0.01uF
0.1uF
1uF

M_XTALO
M_XTALI
URSA_A0P
URSA_A0M
URSA_A1P
URSA_A1M
URSA_A2P
URSA_A2M
URSA_ACKP
URSA_ACKM
URSA_A3P
URSA_A3M
URSA_A4P
URSA_A4M
URSA_B0P
URSA_B0M
URSA_B1P
URSA_B1M
BLM18PG121SN1D URSA_BCKM 16
R1110 820 C1139 22uF 17
URSA_BCKP

C1126
C1127
C1101
C1129
C1131
C1133
C1134
C1135
+1.26V_MEMC L1102 120-ohm C1115 22uF 16V C1140 10uF
18
C1117 10uF C1146 0.1uF
URSA_B2M 19
C1118 0.1uF C1141 0.1uF

Only for training and service purposes

C1142 0.1uF 20

B1
A1
C1
C2
A2
B2
B3
A3
C3
C4
A4
B4
F11
H8
B5
A5
C5
C6
A6
B6
B7
A7
C7
C8
A8
B8
G11
H7
K15
K16
D4
D3
B14
A14
D5
D6
N7
E11
D13
D11
G8
F10
B9
A9
C9
C10
A10
B10
B11
A11
C11
C12
A12
B12
D9
D7
B13
A13
C13
C14
R1105 0
URSA_B2P
ISP_RXD_TR 21
R1106 0 URSA_B1M

XIN
ISP_TXD_TR

RE4P
RE3P
RE2P
RE1P
RE0P
RO4P
RO3P
RO2P
RO1P
RO0P

RE4N
RE3N
RE2N
RE1N
RE0N
RO4N
RO3N
RO2N
RO1N
RO0N
REXT D12

SCLM

XOUT
D8

SDAM
LVB0P
LVB1P

LVA0P
LVA1P
LVA2P
LVA3P
LVA4P

GND_6
GND_5
GND_2

RECKP
R1107 100 E1 SDAS GPIO_5

ROCKP
GPIO_2
GPIO_1
GPIO_9
GPIO_8
GPIO_6
GPIO_4

RECKN
LVB0M
LVB1M

LVA0M
LVA1M
LVA2M
LVA3M
LVA4M

ROCKN
M_SDA 22

GPIO_13
GPIO_14
GPIO_12
GPIO[25]
LVACKP
URSA_B1P

LVACKM
R1108 100 D1 SCLS GPIO_7 D10

AVDD_PLL
M_SCL E10 23
R1101 1K F1 GPIO[8] GPIO_11 URSA_B0M

AVDD_LVDS_1
AVDD_LVDS_2
+3.3V_MEMC E3
R1102 G1 GPIO[9] GPIO_10 24
1K C1119 0.1uF K8 GND_14 D2 URSA_B0P
[E1] GPIO_3
READY E5 VDDC_1 LVB2P C15 R1129 4.7K 25
[D1] URSA_B2P +3.3V_MEMC READY
E2 GPIO[10] LVB2M B15
LED_DEMO URSA_B2M LED_DEMO R1132 0 R1130 0 26
A15 READY READY

+3.3V_MEMC
LVDS_SEL F2 GPIO[11] LVBCKP URSA_BCKP
F3 GPIO[12] LVBCKM A16 URSA_A4M 27
B16
URSA_BCKM
AFLC_EN G2 GPIO[13] LVB3P URSA_B3P 28
M4 GPIO[22] LVB3M C16 URSA_A4P
D15
URSA_B3M 29
M5 GPIO[23] LVB4P URSA_B4P URSA_A3M
R1100 R1159 D16
1K 1K G3 GPIO[14] LVB4M URSA_B4M 30
F9 URSA_A3P
READY READY E4 GPIO[15] AVDD_33_2
F4 GPIO[16] GND_4 G10 C1143 0.1uF 31
R1158 R1160 G4 GPIO[17] LVC0P E15
1K 1K URSA_C0P URSA_ACKM 32
H4 GPIO[18] LVC0M E16
URSA_C0M 33

Copyright © 2009 LG Electronics. Inc. All right reserved.

J4 GPIO[19] LVC1P E14 URSA_ACKP
L1103 120-ohm C1120 10uF 10V F14
URSA_C1P
+3.3V_MEMC K4 GPIO[20] LVC1M URSA_C1M 34
C1121 10uF L4 GPIO[21] LVC2P F16
F15
URSA_C2P 35
J6 VDDP_2 LVC2M URSA_C2M URSA_A2M
C1122 0.1uF H9 GND_7 LVCCKP G15
URSA_CCKP URSA_A2P 36
MEMC_DQ[16-31] C1123 0.1uF K9 GND_15 LVCCKM G16
G14
URSA_CCKM 37
LVC3P URSA_C3P URSA_A1M
F6 VDDC_2 LVC3M H14
URSA_C3M URSA_A1P 38
MEMC_DQ[20] H1 MDATA[20] LVC4P H16
H15
URSA_C4P +3.3V_MULTI_MST 39
MEMC_DQ[19] H2 MDATA[19] LVC4M URSA_C4M URSA_A0M
LVD0P J15
URSA_D0P URSA_A0P 40
MEMC_DQ[17] H3 MDATA[17] LVD0M J16 R1127
J14
URSA_D0M 470 R1123 22 41
MEMC_DQ[22] J1 MDATA[22] LVD1P OPC_OUT2
IC1100 LVD1M K14
URSA_D1P
URSA_D1M
SBL R1136
NOT_SBL
0
42
P1102
TF05-41S
MEMC_DQ[27] J2 MDATA[27]
MEMC_DQ[28] J3 MDATA[28] R1137 OPC_OUT1 R1138 22 R1145 0 43
C 0 READY R1144 0 OPC_EN
C1105 0.1uF GND_3 G9 C1144 0.1uF OPC_DIS
B E-DIM R1139 22 44
K1 MDATA[25] L14 R1128 1K OPC_EN 1
MEMC_DQ[25]
MEMC_DQ[30] K2 MDATA[30]
LGE7329A LVD2P
LVD2M L15
URSA_D2P OPC_EN Q1101
E RT1C3904-T112 LVDS_SEL R1161
READY
0 45
URSA_D2M R1112 4.7K R1113 0 VESA 2
K6 AVDD_DDR_2 LVDCKP L16 +3.3V_MEMC JEIDA
EAN60659201 URSA_DCKP 46
K3 DQM[3] LVDCKM M16 R1131 4.7K R1140 0 READY URSA_D4M 3
MEMC_DQM3 F8
URSA_DCKM READY 47
MEMC_DQM2 L1 DQM[2] AVDD_33_1 AFLC_EN 4
M15 R1118 4.7K R1119 0 URSA_D4P
C1106 0.1uF J8 GND_10 LVD3P URSA_D3P READY READY 48
L2 DQS[2] LVD3M M14 R1133 4.7K R1141 0 READY URSA_D3M 5
MEMC_DQS2 N16
URSA_D3M READY 49
MEMC_DQSB2 L3 DQSB[2] LVD4P URSA_D4P 6
N15 R1134 4.7K R1142 0 READY URSA_D3P
L6 AVDD_DDR_4 LVD4M URSA_D4M READY 50
L8 VDDP_3 C1145 0.1uF R1135 4.7K R1143 0 READY 7
H6 READY 51
C1124 0.1uF H10 GND_8 VDDC_5 8
M1 DQS[3] GPIO[24] N6 URSA_DCKM
MEMC_DQS3 E12 52 9
MEMC_DQSB3 M2 DQSB[3] GPIO[7] URSA_DCKP
L7 AVDD_DDR_5 GPIO[6] D14
10
MEMC_DQ[31] M3 MDATA[31] GPIO[5] F12 +3.3V_MEMC
MEMC_DQ[24] N1 MDATA[24] GPIO[4] E13 URSA_D2M 11
C1107 0.1uF J9 GND_11 GPIO[3] F13
URSA_D2P 12
MEMC_DQ[26] N2 MDATA[26] GPIO[2] G13
MEMC_DQ[29] N3 MDATA[29] GPIO[1] H13 URSA_D1M 13
L10 AVDD_DDR_6 GPIO[0] J13 R1114 R1116
1K 1K URSA_D1P 14
MEMC_DQ[23] P1 MDATA[23] PWM0 K12
MEMC_DQ[16] R1 MDATA[16] [N13] PWM1 L12 URSA_D0M 15
MEMC_DQ[18] T1 MDATA[18] [L9] CSZ K13
[N12] M_SPI_CZ URSA_D0P 16
MEMC_DQ[21] T2 MDATA[21] [N5] SDO M12 R1115 R1117
M_SPI_DO 1K 1K 17
R2 MCLK[0] [N4] SDI M13
MEMC_MCLK M_SPI_DI READY READY
P2 MCLKZ[0] SCK L13
MEMC_MCLKZ M_SPI_CK 18
C1125 0.1uF G7 GND_1 GPIO[30] N14
R1103 L9 AVDD_MEMPLL GPIO[29] N13 URSA_C4M 19
10K MVREF N5 MVREF GPIO[28] N12 GPIO8 PWM1 PWM0 URSA_C4P 20
MEMC_ODT N4 ODT
R1104 C1102 C1103 I2C HIGH LOW HIGH URSA_C3M 21
10K 0.1uF 1uF +3.3V_MEMC

RASZ
CASZ
MADR[0]
MADR[2]
MADR[4]
GND_12
MADR[6]
MADR[8]
MADR[11]
WEZ
BADR[1]
BADR[0]
MADR[1]
MADR[10]
AVDD_DDR_7
MADR[5]
MADR[9]
MADR[12]
MADR[7]
MADR[3]
MCLKE
GND_16
VDDC_3
MDATA[4]
MDATA[3]
GND_13
MDATA[1]
MDATA[6]
AVDD_DDR_3
MDATA[11]
MDATA[12]
MDATA[9]
MDATA[14]
AVDD_DDR_1
DQM[1]
DQM[0]
MDATA[7]
MDATA[0]
MDATA[2]
MDATA[5]
MCLK[1]
MCLKZ[1]
GPIO[26]
GPIO[27]
GND_17
RESET
C1108 0.1uF EEPROM HIGH HIGH LOW 22
URSA_C3P

J7

P3
P4
P5
P6
P7
P8
F7
P9

T3
T4
T5
T6
T7
T8
T9

R3
R4
R5
R6
R7
R8
R9

N8
K7
N9
G6 VDDC_4

GND_9

J10
J11

P10
P11
P12 DQSB[0]
P13 MDATA[15]
P14 MDATA[13]
P15
P16

L11
T10
T11
T12
T13 DQS[1]
T14 MDATA[8]
T15
T16

R10
R11
R12 DQS[0]
R13 DQSB[1]
R14 MDATA[10]
R15
R16
SPI HIGH HIGH HIGH

K10
K11
H11 VDDP_1
N10
N11
M11
C1109 0.1uF
R1111 23
C1110 0.1uF 10K
24

0
C1111 0.1uF URSA_CCKM
MEMC_RESET
C1112 0.1uF URSA_CCKP 25

C1116 10uF 26

R1109
+1.8V_MEMC L1101 120-ohm C1104 22uF 16V 27

0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
URSA_C2M
URSA_C2P 28

29

C1113
C1114
C1132
C1128
C1130
C1136
C1137
C1138

URSA_C1M
URSA_C1P 30

SPI FLASH +3.3V_MEMC URSA_C0M 31

URSA_C0P 32

33
IC1101 C1149
0.1uF 34
W25X20AVSNIG
35

MEMC_BA1
MEMC_BA0

MEMC_WEZ
MEMC_DQS0
MEMC_DQS1

MEMC_RASZ
MEMC_CASZ
MEMC_DQM1
MEMC_DQM0
R1120 56 CS 1 8 VCC 36

MEMC_DQSB0
MEMC_DQSB1
MEMC_MCLK1

MEMC_MCLKE
M_SPI_CZ
MEMC_MCLKZ1

37

MEMC_A[0]
MEMC_A[2]
MEMC_A[4]
MEMC_A[6]
MEMC_A[8]
MEMC_A[11]
MEMC_A[1]
MEMC_A[10]
MEMC_A[5]
MEMC_A[9]
MEMC_A[12]
MEMC_A[7]
MEMC_A[3]
MEMC_DQ[4]
MEMC_DQ[3]
MEMC_DQ[1]
MEMC_DQ[6]
MEMC_DQ[11]
MEMC_DQ[12]
MEMC_DQ[9]
MEMC_DQ[14]
MEMC_DQ[15]
MEMC_DQ[8]
MEMC_DQ[10]
MEMC_DQ[13]
MEMC_DQ[7]
MEMC_DQ[0]
MEMC_DQ[2]
MEMC_DQ[5]

R1121 56 DO 2 7 HOLD 38
M_SPI_DO
MEMC_A[0-12] MEMC_DQ[0-15] 39
R1122 10K WP 3 6 CLK R1125 56
M_SPI_CK 40

GND 4 5 DIO R1126 56 41

M_SPI_DI
42

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 LH70 2008/09/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MEMC & LVDS Out 8 9

LGE Internal Use Only

 EAX58298501
Mstar LCD LH70

+3.3V_MEMC +1.8V_MEMC for DDR +1.26V Core for MEMC

1300 mA @85% efficiency 1000 mA @85% efficiency

IC1205
+5V_MEMC IC1204
MP2212DN +3.3V_MEMC IC1203 APE8953MP
BD9130EFJ-E2
R1236 R1234
+5V_MEMC
R1 C1246
39K 10 0.1uF ADJ EN
P_12V 1 FB EN/SYNC 8 R1235 10K 233 mA+400mA+600mA 1 8 R1227 10K 8 EN GND 1
L1206
R1237 500 C1264 R2
L1205 12K R2 2 GNDMAX 3ASW_2 7 L1204 3.6uH +3.3V_MEMC VCC 400mA + 600mA 1uF
2 7 PVCC R1233 0 7 POK 2A FB 2 R1232 17.4K 1%

Only for training and service purposes

500
C1257 C1258 2.2uH C1259
3 IN SW_1 6 10uF 16V 10uF 16V C1243 C1244 C1267 R1225 18K ITH 3 6 SW +1.8V_MEMC +1.8V_MEMC 6 VCNTL VOUT_1 3 10K 1%
R1 R1231 18nF 16V 600 mA
100uF 22uF 0.1uF L1203
C1253 C1254 R1228
10uF 25V 10uF 25V 4 BS VCC 5 C1245 GND R1 39K 1% +1.26V_MEMC
4 5 PGND C1247 C1248 5 VIN VOUT_2 4
C1255 C1256 330pF 22uF R1229 0.1uF
1uF 25V 10nF R2 30K 1% C1250 C1249
MAX 2A 0.1uF 10uF 10V C1251 C1252 C1260
Close to IC1204 100uF16V 0.1uF 10uF 16V
R1226 47 V0 = 0.8(1+R1/R2) R1230 1K

Vo=0.8(1+R1/R2) V0 = 0.8(1+R1/R2)

Copyright © 2009 LG Electronics. Inc. All right reserved.

+1.8V_MEMC_DDR +1.8V_MEMC_DDR

R1221 R1223
1K 1% 1K 1%

C1239 C1240 R1222 R1224 C1241 C1242

1000pF 0.1uF 1K 1% 1K 1% 0.1uF 1000pF

MEMC_DQ[16-31] DDR_DQ[16-31] DDR_DQ[16-31] IC1201 DDRB_A[0-12]

DDRB_A[0-12] MEMC_A[0-12] DDRA_A[0-12]
DDRA_A[0-12] IC1202 DDR_DQ[0-15]
DDR_DQ[0-15] MEMC_DQ[0-15]
HYB18TC256160BF-2.5 HYB18TC256160BF-2.5

AR1201 56 AR1205 22 AR1209 22 AR1213 56

MEMC_DQ[27] DDR_DQ[27] DDR_DQ[16] DQ0 G8 J2 VREF VREF J2 G8 DQ0 DDR_DQ[0] DDR_DQ[15] MEMC_DQ[15]
MEMC_DQ[28] DDR_DQ[28] DDR_DQ[17] DQ1 G2 DDRB_A[10] MEMC_A[10] MEMC_A[10] DDRA_A[10] G2 DQ1 DDR_DQ[1] DDR_DQ[8] MEMC_DQ[8]
MEMC_DQ[25] DDR_DQ[25] DDR_DQ[18] DQ2 H7 DDRB_A[1] MEMC_A[1] MEMC_A[1] DDRA_A[1] H7 DQ2 DDR_DQ[2] DDR_DQ[10] MEMC_DQ[10]
M8 A0 DDRB_A[0] DDRA_A[0] A0 M8
MEMC_DQ[30] DDR_DQ[30] DDR_DQ[19] DQ3 H3 DDRB_A[3] MEMC_A[3] MEMC_A[3] DDRA_A[3] H3 DQ3 DDR_DQ[3] DDR_DQ[13] MEMC_DQ[13]
M3 A1 DDRB_A[1] DDRA_A[1] A1 M3
DDR_DQ[20] DQ4 H1 H1 DQ4 DDR_DQ[4]
AR1202 56 M7 A2 DDRB_A[2] AR1206 22 AR1210 22 DDRA_A[2] A2 M7 AR1214 56
MEMC_DQ[22] DDR_DQ[22] DDR_DQ[21] DQ5 H9 DDRB_A[9] MEMC_A[9] MEMC_A[9] DDRA_A[9] H9 DQ5 DDR_DQ[5] DDR_DQ[7] MEMC_DQ[7]
N2 A3 DDRB_A[3] DDRA_A[3] A3 N2
MEMC_DQ[17] DDR_DQ[17] DDR_DQ[22] DQ6 F1 DDRB_A[12] MEMC_A[12] MEMC_A[12] DDRA_A[12] F1 DQ6 DDR_DQ[6] DDR_DQ[0] MEMC_DQ[0]
N8 A4 DDRB_A[4] DDRA_A[4] A4 N8
MEMC_DQ[19] DDR_DQ[19] DDR_DQ[23] DQ7 F9 DDRB_A[7] MEMC_A[7] MEMC_A[7] DDRA_A[7] F9 DQ7 DDR_DQ[7] DDR_DQ[2] MEMC_DQ[2]
N3 A5 DDRB_A[5] DDRA_A[5] A5 N3
MEMC_DQ[20] DDR_DQ[20] DDR_DQ[24] DQ8 C8 DDRB_A[5] MEMC_A[5] MEMC_A[5] DDRA_A[5] C8 DQ8 DDR_DQ[8] DDR_DQ[5] MEMC_DQ[5]
N7 A6 DDRB_A[6] DDRA_A[6] A6 N7
AR1203 56 DDR_DQ[25] DQ9 C2 AR1207 22 AR1211 22 C2 DQ9 DDR_DQ[9] AR1215 56
P2 A7 DDRB_A[7] DDRA_A[7] A7 P2
MEMC_DQ[31] DDR_DQ[31] DDR_DQ[26] DQ10 D7 DDRB_A[0] MEMC_A[0] MEMC_A[2] DDRA_A[2] D7 DQ10 DDR_DQ[10] DDR_DQ[11] MEMC_DQ[11]
P8 A8 DDRB_A[8] DDRA_A[8] A8 P8
MEMC_DQ[24] DDR_DQ[24] DDR_DQ[27] DQ11 D3 DDRB_A[2] MEMC_A[2] MEMC_A[0] DDRA_A[0] D3 DQ11 DDR_DQ[11] DDR_DQ[12] MEMC_DQ[12]
P3 A9 DDRB_A[9] DDRA_A[9] A9 P3
MEMC_DQ[26] DDR_DQ[26] DDR_DQ[28] DQ12 D1 DDRB_A[4] MEMC_A[4] MEMC_A[6] DDRA_A[6] D1 DQ12 DDR_DQ[12] DDR_DQ[9] MEMC_DQ[9]
M2 A10/AP DDRB_A[10] DDRA_A[10] A10/AP M2
MEMC_DQ[29] DDR_DQ[29] DDR_DQ[29] DQ13 D9 DDRB_A[6] MEMC_A[6] MEMC_A[4] DDRA_A[4] D9 DQ13 DDR_DQ[13] DDR_DQ[14] MEMC_DQ[14]
P7 A11 DDRB_A[11] DDRA_A[11] A11 P7
DDR_DQ[30] DQ14 B1 B1 DQ14 DDR_DQ[14]
AR1204 56 R2 A12 DDRB_A[12] AR1208 22 AR1212 22 DDRA_A[12] A12 R2 AR1216 56
MEMC_DQ[23] DDR_DQ[23] DDR_DQ[31] DQ15 B9 B_URSA_RASZ MEMC_RASZ MEMC_RASZ A_URSA_RASZ B9 DQ15 DDR_DQ[15] DDR_DQ[6] MEMC_DQ[6]
MEMC_DQ[16] DDR_DQ[16] +1.8V_MEMC_DDR B_URSA_CASZ MEMC_CASZ MEMC_CASZ A_URSA_CASZ DDR_DQ[1] MEMC_DQ[1]
MEMC_DQ[18] DDR_DQ[18] L2 BA0 B_URSA_BA0 DDRB_A[11] MEMC_A[11] MEMC_A[8] DDRA_A[8] A_URSA_BA0 BA0 L2 +1.8V_MEMC_DDR DDR_DQ[3] MEMC_DQ[3]
MEMC_DQ[21] DDR_DQ[21] C1203 10uF L3 BA1 B_URSA_BA1 DDRB_A[8] MEMC_A[8] MEMC_A[11] DDRA_A[11] A_URSA_BA1 BA1 L3 C1222 10uF DDR_DQ[4] MEMC_DQ[4]
C1204 0.1uF VDD_5 A1 R1202 22 R1211 22 A1 VDD_5 C1223 0.1uF
VDD_4 E1 MEMC_MCLK MEMC_MCLK1 E1 VDD_4
C1205 0.1uF R1201 R1220 C1224 0.1uF
C1206 0.1uF VDD_3 J9 J8 CK 150 150READY CK J8 J9 VDD_3 C1225 0.1uF
VDD_2 M9 K8 CK READY R1203 22 MEMC_MCLKZ MEMC_MCLKZ1
R1212 22 CK K8 M9 VDD_2 +1.8V_MEMC +1.8V_MEMC_DDR
C1207 0.1uF C1226 0.1uF
C1208 0.1uF VDD_1 R1 K2 CKE B_URSA_MCLKE A_URSA_MCLKE CKE K2 R1 VDD_1 C1228 0.1uF
BLM18PG121SN1D
+1.8V_MEMC +1.8V_MEMC_DDR L1202
K9 ODT R1204 22 R1213 22 ODT K9
C1212 10uF MEMC_ODT MEMC_ODT C1227 10uF
BLM18PG121SN1D VDDQ_10 A9 L8 CS CS L8 A9 VDDQ_10
16V

L1201 C1209 0.1uF VDDQ_9 C1 K7 RAS RAS K7 C1 VDDQ_9 C1229 0.1uF

C1210 0.1uF B_URSA_RASZ A_URSA_RASZ C1230 0.1uF
VDDQ_8 C3 L7 CAS CAS L7 C3 VDDQ_8
C1220

B_URSA_CASZ A_URSA_CASZ
0.1uF
C1221

C1211 0.1uF C1231 0.1uF

10V
VDDQ_7 C7 K3 WE B_URSA_WEZ A_URSA_WEZ WE K3 C7 VDDQ_7
C1213 0.1uF C1232 0.1uF
0.1uF

VDDQ_6 C9 C9 VDDQ_6

0.1uF
C1214 0.1uF C1233 0.1uF

C1201
C1202
VDDQ_5 E9 R1205 56 R1214 56 E9 VDDQ_5
C1215 0.1uF VDDQ_4 G1
F7 LDQS MEMC_DQS2 MEMC_DQS0 LDQS F7
G1 VDDQ_4 C1234 0.1uF

10uF
C1216 0.1uF B7 UDQS R1206 56 R1215 56 UDQS B7 C1235 0.1uF
VDDQ_3 G3 MEMC_DQS3 MEMC_DQS1 G3 VDDQ_3
C1217 0.1uF VDDQ_2 G7 G7 VDDQ_2 C1236 0.1uF
C1218 0.1uF R1207 56 R1216 56 C1237 0.1uF
VDDQ_1 G9 F3 LDM MEMC_DQM2 MEMC_DQM0 LDM F3 G9 VDDQ_1
C1219 0.1uF R1208 56 R1217 56 C1238 0.1uF
B3 UDM MEMC_DQM3 MEMC_DQM1 UDM B3

VSS_5 A3 E8 LDQS R1209 56 MEMC_DQSB2 MEMC_DQSB0

R1218 56 LDQS E8 A3 VSS_5
R1210 56 R1219 56
DDR2 1.8V By CAP - Place these Caps near Memory

VSS_4 E3 A8 UDQS MEMC_DQSB3 MEMC_DQSB1 UDQS A8 E3 VSS_4

VSS_3 J3 J3 VSS_3
VSS_2 N1 L1 NC_4 AR1217 22 NC_4 L1 N1 VSS_2

DDR2 1.8V By CAP - Place these Caps near Memory

VSS_1 P9 R3 NC_5 B_URSA_BA0 MEMC_BA0 NC_5 R3 P9 VSS_1
B_URSA_BA1 MEMC_BA1
R7 NC_6 NC_6 R7
B_URSA_MCLKE MEMC_MCLKE
B_URSA_WEZ MEMC_WEZ
VSSQ_10 B2 B2 VSSQ_10
A2 NC_1 NC_1 A2
VSSQ_9 B8 E2 NC_2 AR1218 22 NC_2 E2 B8 VSSQ_9
VSSQ_8 A7 R8 NC_3 MEMC_BA0 A_URSA_BA0 NC_3 R8 A7 VSSQ_8
VSSQ_7 D2 +1.8V_MEMC_DDR MEMC_BA1 A_URSA_BA1 +1.8V_MEMC_DDR D2 VSSQ_7
VSSQ_6 D8 MEMC_MCLKE A_URSA_MCLKE D8 VSSQ_6
VSSQ_5 E7 J7 VSSDL MEMC_WEZ A_URSA_WEZ VSSDL J7 E7 VSSQ_5
VSSQ_4 F2 F2 VSSQ_4
VSSQ_3 F8 F8 VSSQ_3
VSSQ_2 H2 H2 VSSQ_2
VSSQ_1 H8 J1 VDDL VDDL J1 H8 VSSQ_1
C1261 C1262
0.1uF 0.1uF

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 LH70 2008/09/20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MEMC_DDR & POWER 9 9

LGE Internal Use Only

 P401
501951-7019

TU500 TU500-*1
TAFT-Z203D TAFT-H203F PC_HS 2 1 PC_VS
PC_G 4 3
PC_R 6 5 PC_B
NC_1 8 7
1 NC_1 1 COMP1_PB
INTERFACE
+5V_TUNER GND_1 COMP1_PR 10 9 COMP1_Y
2 GND_1 2 12 11
COMP2_PB
Near the pin +B[5V] 14 13
3 +B[5V] 3 COMP2_PR COMP2_Y
C501 C508 C509 C510 C511 16 15
0.01uF 10uF 16V 100uF 16V 100uF 16V 100uF 16V NC_2 SIDE_C
4 NC_2 4 18 17
SIDE_Y
RF_AGC 20 19
5 RF_AGC 5 SIDE_V CVBS_VIN
TP[3.3V_OPT] 22 21 TV_MAIN

Only for training and service purposes

6 TP[3.3V_OPT] L500 6
120OHM 24 23
READY NTSC_TUNER MNT_VOUT
NC_3 26 25
7 NC_3 7 MAIN_SIF
GND_2 SIDE_RIN 28 27 SIDE_LIN
8 GND_2 8 30 29
MNT_LOUT
+5V_TUNER SDA 32 31
9 SDA R504 47 9 MNT_ROUT
C502 M_SDA
27pF L501 SCL +3.3V_MST 34 33 +3.3V_MST
R505 47 120OHM
10 M_SCL 10 36 35
PAL_TUNER SCL C500
C503
MUTE_LINE
27pF R506 MOPLL_AS
0.01uF 220 38 37
11 MOPLL_AS 50V 11 CVBS_LIN

Copyright © 2009 LG Electronics. Inc. All right reserved.

C504 TV_MAIN 40 39
R507 READY NC_4 CVBS_RIN
12 NC_4 220 12 42 41
E
COMP1_R COMP1_L
V-OUT 44 43
13 V-OUT ISA1530AC1 13 COMP2_L
B Q502
L502 R502 46 45
4.7K C NC_5 COMP2_R
10uH
14 NC_5 READY 14 48 47
PC_AUD_R PC_AUD_L
C507 A-OUT
15 A-OUT 82pF 15 IR_OUT 50 49
READY
SIF-OUT TXD 52 51
16 SIF-OUT MAIN_SIF 16 54 53 RXD
NC_6 56 55
17 NC_6 17 M_SCL M_SDA
NC_7 DSUB_SDA 58 57
18 NC_7 18 60 59 DSUB_SCL
NC_8 62 61
19 NC_8 19 +5V_MULTI S_VIDEO_DET
NC_9 64 63 +5V_MULTI
20 NC_9 20 66 65
+5V_TUNER
21 21 68 67 +5V_TUNER
70 69
SHIELD SHIELD
71

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS MStar 2008. 5. 20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. TUNER 1 2
UNER

LGE Internal Use Only

 COMPONENT1/2, AV1, MNT_OUT[JACK PACK TYPE C PC +5V_MULTI
JK101
PPJ225-01
JK104 C117 C118 C119
9J[GN]E-LUG 0.1uF 0.1uF 0.1uF

KCN-DS-1-0089 **MULTI ITEM

[GN]O-SPRING-L 5J 4A [GN]O-SPRING-S 6630TGA004K
COMP2_Y ZD108 ZD102
COMP1_Y 1.24C02-SUB:0IMMRAL014D
R127 SD05 ESD_READY SD05 ESD_READY R109
75 75

C
C
C

A
A
A
[GN]CONTACT-L 6J 3A [GN]CONTACT-S ZD103
2.ENKMC2837-SUB:0DS226009AA
ZD109 SD05 ESD_READY

D126
D127
D128
SD05 ESD_READY 6 RED_GND [KDS226]

AC
AC
AC
9K [BL]E-LUG GND_2

ENKMC2837-T112
ENKMC2837-T112
ENKMC2837-T112
1 11 RED
COMP2_PB [BL]C-LUG-L 7K 8B [BL]C-LUG-S COMP1_PB R101
PC_R
R126 ZD107 ZD101 R108 GREEN_GND 75
75 SD05 ESD_READY SD05 75 7
9L [RD]E-LUG_1 ESD_READY DDC_DATA
2 12 ESD_READY
DSUB_SDA

COMPONENT2
GREEN D107
COMP2_PR [RD]C-LUG_L 7L 8C [RD]C-LUG-S COMP1_PR PC_G CDS3C30GTH
30V
R102
R125 ZD106 ZD100 R107 8 BLUE_GND 75
75

Only for training and service purposes

SD05 ESD_READY SD05 75 R110
9M [WH]E-LUG_1 ESD_READY 68
H_SYNC
3 13 C100
PC_HS

COMPONENT1
ZD104 R111
4.7K 68pF
R133 R114 BLUE SD05
COMP2_L [WH]C-LUG-L_1 7M 8D [WH]C-LUG-S_1 COMP1_L R103
PC_B ESD_READY
R137 10K R122 D115 D101 R104 10K R118 9 NC 75
12K 220K 30V ESD_READY 30V 220K 12K R116
9N [RD]E-LUG_2 ESD_READY 68
V_SYNC
4 14 R112 C102
PC_VS
ZD105 68pF
R132 GND_1 4.7K
COMP2_R [RD]O-SPRING-L_1 5N 4E [RD]O-SPRING-S_1 SD05
R136 10K ESD_READY
R121 D114 10 SYNC_GND
12K 220K 30V ESD_READY R113
[RD]CONTACT-L_1 6N 3E [RD]CONTACT-S_1 COMP1_R DDC_CLOCK
D100 10K R117 5 15 DSUB_SCL
R100 ESD_READY
30V 12K DDC_GND CDS3C30GTH D110
9P [YL]E-LUG ESD_READY 220K 30V
CDS3C30GTH

C204 100uF 16V R212

MNT_VOUT [YL]O-SPRING-L 5P 4F [YL]O-SPRING-S
75

Copyright © 2009 LG Electronics. Inc. All right reserved.

16 SHILED

[YL]CONTACT-L 6P 3F [YL]CONTACT-S CVBS_VIN

ZD200 R210
SD05 ESD_READY 75
9Q [WH]E-LUG_2 ZD201
SD05 ESD_READY
C201 10uF 16V R215
[WH]C-LUG-L_2 7Q 8G [WH]C-LUG-S_2

AV1
MNT_LOUT D204 R214 10K R218
CVBS_LIN
C200 D200
Q201 100pF 30V 30V 220K 12K
RT1C3904-T112 C READY NON_HOTEL_OPT 9R [RD]E-LUG_3 ESD_READY
MUTE_LINE B E
POP NOISE

[RD]O-SPRING-L_2 5R 4H [RD]O-SPRING-S_2 R217

CVBS_RIN

MNT_OUT
10K
D203 R211 R219
PC SOUND
30V 220K 12K JK102
C202 10uF 16V R206 0 [RD]CONTACT-L_2 6R 3H [RD]CONTACT-S_2 ESD_READY
MNT_ROUT NON_HOTEL_OPT PEJ024-01
D201
30V 3 E_SPRING
NON_HOTEL_OPT
C PC_AUD_R
B
MUTE_LINE 6A T_TERMINAL1 R138
POP NOISE Q200
RT1C3904-T112 E 10K
D119 R130 R140
30V 220K 12K
7A B_TERMINAL1 CDS3C30GTH
ESD_READY

4 R_SPRING
PC_AUD_L
RS-232C (CI ITEM) JK103 AV2 5 T_SPRING R139
KCN-DS-1-0088 10K
1 [YL]GND D120
R131 R141
30V 12K
7B B_TERMINAL2 220K
CDS3C30GTH
+3.3V_MST ESD_READY
2 [YL]O-SPRING SIDE_V
5.6B

TP131
1 ZD202 R227 6B T_TERMINAL2
ESD_READY 75
5.6B
IC101 3 [YL]CONTACT ZD203
6 ESD_READY
ST3232CDR
C109 8 SHIELD_PLATE
0.1uF
C1+ 1 R144 100 2 4 [WH]GND
16 VCC
D121
C107 V+ CDS3C30GTH
2 15 GND 30V ESD_READY
0.1uF 7 5 [WH]C-LUG-L R224 10K
C1- 3 D206
SIDE_LIN
14 T1OUT 30V
R223 R226
3 220K 12K
ESD_READY READY
C2+ R1IN R145 100 JK105
4 13 6 [RD]GND S-VIDEO(LH30(China)) PSJ014-01
C106 D122 8
CDS3C30GTH C-LUG1
0.1uF C2- 5
12 R1OUT IR_OUT READY
30V ESD_READY
1
IR_OUT 4 7 [RD]O-SPRING R225 10K C-LUG2
V- 6
11 T1IN D205
SIDE_RIN 2 SIDE_C
R222 R228 R105
C108 30V 220K 12K GND 0-SPRING D102
READY
ESD_ESD_READY 6 3 30V 75 +3.3V_MST
0.1uF T2OUT 9
7 10 T2IN +3.3V_MST 8 [RD]CONTACT C-LUG3
READY
R115
4 10K
C-LUG4
R2IN 8 9 R2OUT R123 R124 5 5 S_VIDEO_DET
4.7K 4.7K
D103 C101
10 7 SHIELD
30V
READY
OPT
READY
RXD PPJ148-07
JK201 ZD110
SIDE_Y
TXD SD05 R106
READY 75
ZD111
SD05
READY

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS MStar 2008. 5. 20
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. A-TUNER/AV IN / OUT 2 2

LGE Internal Use Only

 Feb., 2009
P/NO : MFL60021524 Printed in Korea