0% found this document useful (0 votes)
880 views8 pages

Si-Tech Semiconductor Co.,Ltd: S80N10R/S

This document summarizes the specifications and characteristics of an N-channel MOSFET produced by SI-TECH SEMICONDUCTOR CO. The MOSFET has a maximum drain-source voltage of 80V, continuous drain current of 100A, and on-state resistance of 5.8mΩ. It uses trench MOS technology to minimize resistance and features high avalanche ruggedness and fast switching. The MOSFET is well-suited for applications such as automotive, DC/DC converters, and power management.

Uploaded by

Stefan Iusco
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
880 views8 pages

Si-Tech Semiconductor Co.,Ltd: S80N10R/S

This document summarizes the specifications and characteristics of an N-channel MOSFET produced by SI-TECH SEMICONDUCTOR CO. The MOSFET has a maximum drain-source voltage of 80V, continuous drain current of 100A, and on-state resistance of 5.8mΩ. It uses trench MOS technology to minimize resistance and features high avalanche ruggedness and fast switching. The MOSFET is well-suited for applications such as automotive, DC/DC converters, and power management.

Uploaded by

Stefan Iusco
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 8

SI-TECH SEMICONDUCTOR CO.

,LTD
S80N10R/S

N-Channel MOSFET
Features
█ 80V,100A,Rds(on)(typ)=5.8mΩ @Vgs=10V
█ High Ruggedness
█ Fast Switching
█ 100% Avalanche Tested
█ Improved dv/dt Capability

General Description
This Power MOSFET is produced using Si-Tech’s advanced
Trench MOS Technology. This latest technology has been
especially designed to minimize on-state resistance, have a
high rugged avalanche characteristics.These devices are well
suited for low voltage application such as automotive,DC/DC
converters,and high efficiency switch for power management
in portable and battery products.

Absolute Maximum Ratings


Symbol Parameter Value Units
VDSS Drain-Source Voltage 80 V
Continuous Drain Current (TC=25℃) 100 A
ID
Continuous Drain Current (TC=100℃) 70 A
IDM Pulsed Drain Current (Note 1) 320 A
VGS Gate-Source Voltage ± 30 V
EAS Single Pulsed Avalanche Energy (Note 2) 784 mJ
Maximum Power Dissipation (TC=25℃) 208 W
PD
Derating Factor above 25℃ 1.39 W/℃
TJ Operating Junction Temperature Range -55 to +175 ℃
TSTG Storage Temperature Range -55 to +175 ℃

Thermal Characteristics
Symbol Parameter Max. Units

Rth j-c Thermal Resistance, Junction to case 0.72 ℃/ W


Rth c-s Thermal Resistance, Case to Sink 0.5 ℃/ W
Rth j-a Thermal Resistance, Junction to Ambient 62.5 ℃/ W

-1- Mar.2016
SI-TECH SEMICONDUCTOR CO.,LTD
S80N10R/S

Electrical Characteristics (TC=25℃ unless otherwise noted)

Symbol Parameter Test Conditions Min. Typ. Max. Units


BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 80 - - V
IDSS Drain-Source Leakage Current VDS=78V, VGS=0V - - 1 uA
IGSS Gate Leakage Current, Forward VGS=30V, VDS=0V - - 100 nA
Gate Leakage Current, Reverse VGS=-30V, VDS=0V - - -100 nA
VGS(th) Gate Threshold Voltage VGS=VDS, ID=250uA 2 - 4 V
RDS(on) Drain-Source On-State Resistance VGS=10V, ID=40A - 5.8 7 mΩ
Qg Total Gate Charge VDD=60V - 107 - nC
Qgs Gate-Source Charge VGS=10V - 26 - nC
Qgd Gate-Drain Charge ID=80A (Note 3) - 46 - nC
t d(on) Turn-on Delay Time VDD=37.5V,VGS=10V - 25 - ns
tr Turn-on Rise Time ID=45A,RG=4.7Ω - 66 - ns
t d(off) Turn-off Delay Time TC=25℃ - 36 - ns
tf Turn-off Fall Time (Note 3) - 24 - ns
Ciss Input Capacitance - VDS=25V - 4020 - pF
Coss Output Capacitance VGS=0V - 489 - pF
Crss Reverse Transfer Capacitance f = 1MHz - 208 - pF

Source-Drain Diode Characteristics (TC=25℃ unless otherwise noted)

Symbol Parameter Test Conditions Min. Typ. Max. Units


IS Continuous Source Diode Forward Current - - 100 A
ISM Pulsed Source Diode Forward Current (Note 1) - - 320 A
VSD Forward On Voltage VGS=0V, IS=45A - - 1.2 V
tr r Reverse Recovery Time VGS=0V, IS=45A - 100 150 ns
Qr r Reverse Recovery Charge dIF/dt = 100A/us - 410 650 nC

Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L=0.5mH, VDD=50V, RG=25 Ω, Starting TJ=25℃
3. Pulse Width ≤ 300 us; Duty Cycle≤2%

-2- Mar.2016
SI-TECH SEMICONDUCTOR CO.,LTD
S80N10R/S

Typical Characteristics

Output Characteristics Drain Current

ID - Drain Current (A)


ID- Drain Current (A)

VDS - Drain-Source Voltage (V)


T j- Junction Temperature (°C)
Safe Operation Area
Thermal Transient Impedance
Normalized Effective Transient
ID - Drain Current (A)

V DS- Drain-Source Voltage (V) Square Wave Pulse Duration (sec)

-3- Mar.2016
SI-TECH SEMICONDUCTOR CO.,LTD
S80N10R/S

Typical Characteristics

Power Dissipation Drain-Source On Resistance

RDS(ON) - On Resistance (mΩ)


Ptot - Power (W)

Tj - Junction Temperature (°C) ID- Drain Current (A)

Drain-Source On Resistance Gate Threshold Voltage


Normalized Threshold Volt age
RDS(ON) - On- Resistance (mΩ )

VGS - Gate-Source Voltage (V) T j- Junction Temperature (°C)

-4- Mar.2016
SI-TECH SEMICONDUCTOR CO.,LTD
S80N10R/S

Typical Characteristics

Drain-Source On Resistance Source-Drain Diode Forward


Normalized On Resista nce

I S - Source Current (A)

Tj- Junction Temperature (°C)


VSD- Source-Drain Voltage (V)

Capacitance Gate Charge


V GS- Gate-Source Volt age (V)
C - Capacit ance (pF)

VDS- Drain-Source Voltage (V)


QG - Gate Charge (nC)

-5- Mar.2016
SI-TECH SEMICONDUCTOR CO.,LTD
S80N10R/S

Avalanche Test Circuit and Waveforms

Switching Time Test Circuit and Waveforms

-6- Mar.2016
SI-TECH SEMICONDUCTOR CO.,LTD
S80N10R/S
Package Outline

Dimensions are shown in millimeters

R:TO220

-7- Mar.2016
SI-TECH SEMICONDUCTOR CO.,LTD
S80N10R/S
2
S:TO263(D PAK)

-8- Mar.2016

You might also like