AMC1117

1A LOW DROPOUT
www.addmtek.com POSITIVE REGULATOR

DESCRIPTION FEATURES

The AMC1117 series of positive adjustable and fixed „ Output current of 1A typical
regulators is designed to provide 1A for applications „ Three-terminal adjustable or fixed 1.5V, 1.8V,
requiring high efficiency. All internal circuitry is designed 2.5V, 3.3V, 5.0V outputs
to operated down to 800mV input to output differential and „ Low dropout of typical 800mV
the dropout voltage is fully specified as a function of load „ Thermal protection built in
current. „ Typical 0.015% line regulation
The AMC1117 offers current limiting and thermal „ Typical 0.01% load regulation
protection. The on chip trimming adjusts the reference „ Fast transient response
voltage accuracy to 1%. „ Available in SOT-223 and TO-252 packages
„ Pin assignment identical to earlier LT1117 series.

APPLICATIONS PACKAGE PIN OUT

„ 2.85V Model for SCSI-2 Active Termination 3. VIN

„ Battery Charger
2. VOUT
„ High Efficiency Linear Regulators
1. ADJ/GND
„ Battery Powered Instrumentation
„ Post Regulator for Switching DC/DC Converter 3-Pin Plastic SOT-223
Surface Mount
(Top View)
VOLTAGE OPTIONS
AMC1117-1.5 – 1.5V Fixed
3. VIN
AMC1117-1.8 – 1.8V Fixed
AMC1117-2.5 – 2.5V Fixed 2. V out

AMC1117-3.3 – 3.3V Fixed 1. ADJ/GND

AMC1117-5.0 – 5.0V Fixed
3-Pin Plastic TO-252
AMC1117 – Adjustable Output Surface Mount
(Top View)

ORDER INFORMATION
SOT-223 TO-252
TA (OC) SK SJ
3-pin 3-pin
AMC1117-X.XSKF (Lead Free) AMC1117-X.XSJF (Lead Free)
0 to 70
AMC1117SKF (Lead Free) AMC1117SJF (Lead Free)
Note: 1.All surface-mount packages are available in Tape & Reel. Append the letter “T” to part number (i.e. AMC1117-X.XSJT).
2.The letter “F” is marked for Lead Free process.

Copyright © 2006 ADDtek Corp. 1 DD004_K -- JULY 2006

 AMC1117
BLOCK DIAGRAM

VIN

VOUT

For
ADJ Fixed
Output
Options

GND

Copyright © 2006 ADDtek Corp. 2 DD004_K -- JULY 2006

 AMC1117
ABSOLUTE MAXIMUM RATINGS (Note1)
Input Voltage 7V
Operating Junction Temperature Range, TJ 0 OC to 150 OC
Storage Temperature Range -65 OC to 150 OC
Lead Temperature (soldiering, 10 seconds) 260 OC
Note 1: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative
out of the specified terminal.

POWER DISSIPATION TABLE

Package θJA Derating factor ( mW/ OC) TA≤ 25 OC TA=70 OC TA= 85 OC
(OC /W ) TA≥ 25 OC Power rating(mW) Power rating(mW) Power rating (mW)
SKF 136 7.35 919 588 478
SJF 80 12.5 1562 1000 812
Note :
1. θJA: Thermal Resistance-Junction to Ambient, DF : Derating factor, Po: Power consumption.
Junction Temperature Calculation: TJ = TA + (PD × θJA), Po = DF × (TJ- TA)
The θJA numbers are guidelines for the thermal performance of the device/PC-board system.
All of the above assume no ambient airflow.

2. θJT: Thermal Resistance-Junction to Tab, TC: case(Tab) temperature, TJ = TC + (PD × θJT)

For SK package, θJT = 15.0 OC /W.
For SJ package, θJT = 7.0 OC /W.

RECOMMENDED OPERATING CONDITIONS

Recommended Operating Conditions
Parameter Symbol Units
Min. Typ. Max.
Input Voltage VIN 2.7 7 V
Load Current (with adequate heat sinking) IO 5 mA
Input Capacitor (VIN to GND) 10 µF
Output Capacitor with ESR of 10Ω max., (VOUT to GND) 10 µF
Junction temperature TJ 125 O
C

Copyright © 2006 ADDtek Corp. 3 DD004_K -- JULY 2006

 AMC1117
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, IO =10mA, and TJ = 25 OC.
AMC1117
Parameter Symbol Test Conditions Units
Min Typ Max
Reference IO = 10mA, VIN = 5V 1.238 1.250 1.262
AMC1117 VREF V
Voltage 10mA ≤ IO ≤ 1A, 2.65V ≤ VIN ≤ 7V 1.225 1.250 1.275
IO = 10mA, VIN = 3.0V 1.485 1.500 1.515
AMC1117-1.5
10mA ≤ IO ≤ 1A, 3.0V ≤ VIN ≤ 7V 1.470 1.500 1.530
IO = 10mA, VIN = 3.3V 1.782 1.8 1.818
AMC1117-1.8
10mA ≤ IO ≤ 1A, 3.3V ≤ VIN ≤ 7V 1.764 1.8 1.836
Output IO = 10mA, VIN = 4.0V 2.475 2.500 2.525
AMC1117-2.5 VOUT V
Voltage 10mA ≤ IO ≤ 1A, 4.0V ≤ VIN ≤ 7V 2.450 2.500 2.550
IO = 10mA, VIN = 4.8V 3.267 3.300 3.333
AMC1117-3.3
10mA ≤ IO ≤ 1A, 4.8V ≤ VIN ≤ 7V 3.235 3.300 3.365
IO = 10mA, VIN = 6.5V 4.950 5.000 5.050
AMC1117-5.0
10mA ≤ IO ≤ 1A, 6.5V ≤ VIN ≤ 7V 4.900 5.000 5.100
Line AMC1117 IO = 10mA, VOUT +1.5V ≤ VIN ≤ 7V 0.04 0.20 %
∆VOI
Regulation AMC1117-X.X IO = 10mA, VOUT +1.5V ≤ VIN ≤ 7V 1.0 6.0 mV
Load AMC1117 10mA ≤ IO ≤ 1A, VIN = VOUT +1.5V 0.10 0.40 %
∆VOL
Regulation AMC1117-X.X 10mA ≤ IO ≤ 1A, VIN = VOUT +1.5V 1.0 10.0 mV
IO = 10mA, VIN≧2.65V 0.8 1.15
Dropout Voltage ∆V IO = 500mA, VIN≧2.65V 0.8 1.25 V
IO = 1A, VIN≧2.65V 0.8 1.30
(Note 1)
Minimum Load Current VIN ≤ 7V 2 7 mA
Quiescent
AMC1117-X.X IQ VIN ≤ 7V 6 13 mA
Current
Current Limit ICL VIN – VOUT = 3V 1 1.2 A
Adjust Pin Current IO = 10mA, VIN – VOUT = 2V 50 120 µA
(Note 2)
Thermal Regulation O
TA = 25 C, 30 ms pulse 0.01 0.1 %/W
fO = 120HZ, 1V RMS, I O = 400mA,
Ripple rejection (Note 2) RR 60 75 dB
VIN – VOUT = 3V
Note 1: For the adjustable device, the minimum load current is the minimum current required to maintain regulation. Normally the current in
the resistor divider used to set the output voltage is selected to meet the minimum load current requirement.
Note 2: These parameters, although guaranteed, are not tested in production.

Copyright © 2006 ADDtek Corp. 4 DD004_K -- JULY 2006

 AMC1117
CHARACTERIZATION CURVES

Unless otherwise specified, VIN= VOUT+2V，CIN=1µF，COUT=4.7µF，TA=25 OC

Load Regulation Load Regulation

2.53 2.88
AMC1117-2.5 AMC1117-2.85
2.52 2.87
2.51
2.86

VO (V)
2.5
VO (V)

2.85
2.49
2.84
2.48
2.83
2.47
2.46 2.82
0 200 400 600 800 1000 0 200 400 600 800 1000
IO (mA) IO (mA)

Load Regulation Load Regulation

3.34 5.02
AMC1117-3.3 AMC1117-5.0
3.33 5.01
3.32 5
3.31 4.99
VO (V)
VO (V)

3.3 4.98
3.29 4.97
3.28 4.96
3.27 4.95
3.26 4.94
0 200 400 600 800 1000 0 200 400 600 800 1000
IO (mA)
IO (mA)

Quiescent Current vs.

Temperature Stability
Temperature
2 10
Output Voltage Change (%)

Quiescent Current (mA)

1.5
8
1
0.5 6
0
-0.5 4
-1 2
-1.5
-2 0
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
TA (OC) TA (OC)

Copyright © 2006 ADDtek Corp. 5 DD004_K -- JULY 2006

 AMC1117
APPLICATION INFORMATION

VOUT
VIN
VIN VOUT AMC1117
AMC1117
R1 121Ω
121Ω 1%
10µF
C1 C2 1k
10µF 100µF 100µF
R2 TTL
1k 365
1k 1%

Adjustable Regulator 5V Regulator with Shutdown

R2
VOUT = 1.25V ( 1+ )
R1

VIN VOUT
AMC1117-X.X

C1 C2
10µF 100µF

Fixed Voltage Regulator

Copyright © 2006 ADDtek Corp. 6 DD004_K -- JULY 2006

 AMC1117
Application Note:

Maximum Power Calculation:

TJ(MAX) – TA(MAX)
PD(MAX)=
θJA
TJ(OC): Maximum recommended junction temperature
TA(OC): Ambient temperature of the application
θJA(OC/W): Junction-to-junction temperature thermal resistance of the package, and other heat dissipating
materials.
The maximum power dissipation of a single-output regulator :
PD(MAX) = [(VIN(MAX) - VOUT(NOM))] × IOUT(NOM) + VIN(MAX) × IQ
Where: VOUT(NOM) = the nominal output voltage
IOUT(NOM) = the nominal output current, and
IQ = the quiescent current the regulator consumes at IOUT(MAX)
VIN(MAX) = the maximum input voltage
Then θJA = (150 OC – TA)/ PD

Thermal consideration:

When power consumption is over about 404 mW (for SOT-223 package, 687mW for TO-252 package, at TA=70 OC),
additional heat sink is required to control the junction temperature below 125 OC.

The junction temperature is: TJ = P D (θJT + θCS + θSA) + TA

P D: Dissipated power.
θJT: Thermal resistance from the junction to the mounting tab of the package.
θCS: Thermal resistance through the interface between the IC and the surface on which it is mounted. (Typically,
θCS < 1.0°C/W)
θSA: Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).

If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of
copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through hole vias.

PCB θSA (OC /W) 59 45 38 33 27 24 21

2
PCB heat sink size (mm ) 500 1000 1500 2000 3000 4000 5000

Recommended figure of PCB area used as a heat sink.

through hole vias

(Bottom View)
(Top View)

Copyright © 2006 ADDtek Corp. 7 DD004_K -- JULY 2006

 AMC1117
PACKAGE
3-Pin Surface Mount SOT-223 (SK)
MILLIMETERS
D A
MIN TYP MAX
c
B1 A 1.50 1.65 1.80

A1 0.02 0.05 0.08

B 0.60 0.70 0.80

H B1 2.90 - 3.15
E

c 0.28 0.30 0.32

D 6.30 6.50 6.70

K
L
E 3.30 3.50 3.70
e A1 e 2.3 BSC
e1
e1 4.6 BSC

H 6.70 7.00 7.30

L 0.91 1.00 1.10

K 1.50 1.75 2.00

B
α 0° 5° 10°

β 3°

3-Pin Surface Mount TO-252 (SJ)

INCHES MILLIMETERS
MIN TYP MAX MIN TYP MAX
E A
b2 A1 A 0.086 - 0.094 2.18 - 2.39
c1
L2 A1 0.040 - 0.050 1.02 - 1.27

SEATING PLAN
b - 0.024 - - 0.61 -
b2 0.205 - 0.215 5.21 - 5.46

D c 0.018 - 0.023 0.46 - 0.58

H
c1 0.018 - 0.023 0.46 - 0.58
D 0.210 - 0.220 5.33 - 5.59
L1 L
E 0.250 - 0.265 6.35 - 6.73

e b c e 0.090 BSC 2.29 BSC

e1
e1 0.180 BSC 4.58 BSC

H 0.370 - 0.410 9.40 - 10.41

L 0.020 - - 0.51 - -
L1 0.025 - 0.040 0.64 - 1.02

L2 0.060 - 0.080 1.52 - 2.03

Copyright © 2006 ADDtek Corp. 8 DD004_K -- JULY 2006

 AMC1117

IMPORTANT NOTICE

ADDtek reserves the right to make changes to its products or to discontinue any integrated circuit product or service
without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing
orders, that the information being relied on is current.

A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe
property or environmental damage. ADDtek integrated circuit products are not designed, intended, authorized, or
warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of
ADDtek products in such applications is understood to be fully at the risk of the customer. In order to minimize risks
associated with the customer’s applications, the customer should provide adequate design and operating safeguards.

ADDtek assumes to no liability to customer product design or application support. ADDtek warrants the performance of
its products to the specifications applicable at the time of sale.

ADDtek Corp.
9F, No. 20, Sec. 3, Bade Rd., Taipei, Taiwan, 105
TEL: 2-25700299
FAX: 2-25700196

Copyright © 2006 ADDtek Corp. 9 DD004_K -- JULY 2006