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(Magnetron Oscillator)
Microwave Tubes
{-!
ne
Linear Beam Tubes (Ordinary type)
0-Type
Cross-Field Tubes (Magnetic Type)
(M- Type)
yh
Magnetron ¥ CFA
Y y Y j
Klystron TWT Twystrons Carcinotrong
(Cross field Amplifier)
| ss
' '
Helix Backwardwave Couple Ring bar
Oscillator (BWO) Cavity Ring loop
Two cavity Klystron Multicavity Klystron Reflex Klystron
Amplifier Amplifier Oscillator
Mechanism _of_ oscillations in Magnetron- The magnetron
requires an external magnetic field with flux lines parallel to the
axis of cathode. This field is provided by a permanent magnet or
electromagnet. The dc magnetic field is normal to the dc electric
field between the cathode and anode. Because of the cross-field
between the cathode and anode, the electrons emitted from
the cathode are affected by the cross-field to move in curved
paths. If the dc magnetic field is strong enough, the electrons
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Microwave Engineering - Magnetrons
Unlike the tubes discussed so far, Magnetrons are the cross-field tubes in which the electric and
magnetic fields cross, i.e. run perpendicular to each other. In TWT, it was observed that electrons
when made to interact with RF, for a longer time, than in Klystron, resulted in higher efficiency. The
same technique is followed in Magnetrons.
wee ih a dnie a
Types of Magnetrons
There are three main types of Magnetrons fede nike ope of ok ver
Tegnche , cited A
Negative Resistance Type Covbilibed ob tA ee pane
* The negative resistance between two anade segments, is used a cyoted ~feeld
+ They have low efficiency.
+ They are used at low frequencies < 500M Hz
Cyclotron Frequency Magnetrons
+ The synchronism between the electric component and oscillating electrons is considered
+ Useful for frequencies higher than 100MHz.
Travelling Wave or Cavity Type
+ The interaction between electrons and rotating EM ficid is taken into account
+ High peak power oscillations are provided.
+ Useful in radar applications
Cavity Magnetron
The Magnetron is called as Cavity Magnetron because the anode is made into resonant cavities
and a permanent magnet is used to produce a strong magnetic field, where the action of both of
these make the device work.
Construction of Cavity Magnetron
A thick cylindrical cathode is present at the center and a cylindrical block of copper, is fixed axially,
which acts as an anode. This anode block is made of a number of slots that acts as resonant
anode cavities.
https wu tutorialspoint conmicrowave_engineering/microwave_engineering_magnetrons him 1610722721, 425 PM Microwave Engineering - Magnetrons
The space present between the anode and cathode is called as Interaction space. The electric
field is present radially while the magnetic field is present axially in the cavity magnetron. This
magnetic field is produced by a permanent magnet, which is placed such that the magnetic lines
are parallel to cathode and perpendicular to the electric field present between the anode and the
cathode.
The following figures show the constructional details of a cavity magnetron and the magnetic lines
of flux present, axially
Q
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Ir “Ss 5
Construction details of » Cavity Magnetron Magnetic flux lines in Magnetron (axial)
pP
BB
NY
A
This Cavity Magnetron has 8 cavities tightly coupled to each other. An N-cavity magnetron has
NN modes of operations. These operations depend upon the frequency and the phase of
oscillations. The total phase shift around the ring of this cavity resonators should be 2nm where
n_ is an integer.
If dy represents the relative phase change of the AC electric field across adjacent cavities, then
2m
N
Ss
Where n=0, +1, +2, + (4-1), +
wz
Which means that mode of resonance can exist if N is an even number.
lz
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This mode of resonance is called as 7 — mode
and
Calle of Ma woods
This is called as the Zero mode, because there will be no RF electric field between the anode and
the cathode. This is also called as Fringing Field and this mode is not used in magnetrons.
Operation of Cavity Magnetron
When the Cavity Klystron is under operation, we have different cases to consider. Let us go
through them in detail.
Case 1
If the magnetic field is absent, i.e. B = 0, then the behavior of electrons can be observed in the
following figure. Considering an example, where electron a directly goes to anode under radial
electric force
‘Anode block
Interaction
space
Cathode
no magne!
field is present
Case 2
If there is an increase in the magnetic field, a lateral force acts on the electrons. This can be
observed in the following figure, considering electron b which takes a curved path, while both
forces are acting on it
hitps:/immwtutoralspoint.com/microwave_ongineering/microwave_engineering_magnetrons htm 36sate
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an
Movement of electron b when small magnetic field is present
Radius of this path is calculated as
mv
R-B
It varies proportionally with the velocity of the electron and it is inversely proportional to the
magnetic field strength.
Case 3
If the magnetic field B is further increased, the electron follows a path such as the electron c, just
grazing the anode surface and making the anode current zero. This is called as "Critical magnetic
ich is the cut-off magnetic field. Refer the following figure for better
field” (B.) , wi
understanding.
‘Anode block
space
Cathode
Movement of electron ¢ when the magnetic field is critical
magnetic fieldie. B= Be
Case 4
tps: tutorialspoint com/microwave_engineering/microwave_engineering_magnetrons.htm10122/21, 425 PM ‘Microwave Engineering - Magnetions
If the magnetic field is made greater than the critical field,
B>B,
Then the electrons follow a path as electron d, where the electron jumps back to the cathode,
without going to the anode. This causes "back heating" of the cathode. Refer the following figure.
Anode block
Interaction
space
Cathode
Movement of electron d when excessive magnetic field is present
This is achieved by cutting off the electric supply once the oscillation begins. If this is continued, the
‘emitting efficiency of the cathode gets affected
Operation of Cavity Magnetron with Active RF Field
We have discussed so far the operation of cavity magnetron where the RF field is absent in the
cavities of the magnetron staticcase . Let us now discuss its operation when we have an active
RF field,
As in TWT, let us assume that initial RF oscillations are present, due to some noise transient. The
oscillations are sustained by the operation of the device. There are three kinds of electrons emitted
in this process, whose actions are understood as electrons a, b and ¢, in three different cases.
Case 1
Wren oscillations are present, an electron a, slows down transferring energy to oscillate. Such
electrons that transfer their energy to the oscillations are called as favored electrons. These
electrons are responsible for bunching effect.
Case 2
In this case, another electron, say b, takes energy from the Oscillations and increases its velocity.
As and when this is done,
tps / ww tutorilepoint com/microwave_engineeringimicrowave_engineering_magnetrons hmL4
1072221, 425 PM Microwave Engineering - Magnetrons
+ Itbends more sharply.
+ It spends little time in interaction space
+ Itreturns to the cathode.
These electrons are called as unfavored electrons. They don't participate in the bunching effect.
Also, these electrons are harmful as they cause "back heating"
Case 3
In this case, electron ¢, which is emitted a little later, moves faster. It tries to catch up with electron
a. The next emitted electron d, tries to step with a. As a result, the favored electrons a, ¢ and d
form electron bunches or electron clouds. It called as "Phase focusing effect”
This whole process is understood better by taking a look at the following figure.
Figure A shows the electron movements in different cases while figure B shows the electron clouds.
formed. These electron clouds occur while the device is in operation. The charges present on the
internal surface of these anode segments, follow the oscillations in the cavities. This creates an
electric field rotating clockwise, which can be actually seen while performing a practical experiment.
While the electric field is rotating, the magnetic flux lines are formed in parallel to the cathode,
under whose combined effect, the electron bunches are formed with four spokes, directed in
regular intervals, to the nearest positive anode segment, in spiral trajectories.
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Let the cavity magnetron has 8 cavities, by which it
supports varieties of modes depending upon the phase
difference between fields in two adjacent cavities. Boundary
conditions are satisfied when total phase shift around the eight
cavities is multiplied by 27 radians. However, the most
important mode for magnetron operation is one where in the
phase shift between the fields of adjacent cavities is m radians.
This is known as 2-Mode.
Hull cut- off voltage &
Hartee condition
In a cylindrical magnetron, several re-entrant cavities are
connected to the gaps. Thus it is also called as Cavity
Magnetron. Assume the radius of cathode is ‘a’ and anode is ‘b’.
The dc voltage V)is applied between the cathode and anode.
When the dc voltage and the magnetic flux (i.e. which is in the
+ve z-direction) are adjusted properly, the electrons will follow
parabolic path in the presence of cross field. These parabolic
paths are formed in the cathode-anode space under the
combined force of both electric and magnetic fields which are
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r=aand angular velocity at emission V,,,= d/dt = 0
.. equation (iii)=> C = -(eBa?/2)
Put the value of C in equation (iii)=>
(d/dt)x(mr2) = (eBr2/2) - (eBa2/2)
=> (dib/dt)x(mr2) = (eB/2)[r?-a2]
=> (d/dt) = (eB/2m)[1- a2/r?] «eee (iv)
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(eB/2m)
At B = B= cut-off magnetic flux density
(dib/dt) max = (CBo/2M) = W/Z vserseeeenee(V)
Where, w,= eB,/m e
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Potential Energy = Kinetic Energy
eVo= % mv?
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=> eVo = %ml[(dr/dt)2+ r2(ddp/dt)?] ........0.(Vi)
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directions in cylindrical co-ordinates.
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roa, 10:52 AM Avalanche Transit Tane Devices
Due to this effect, the current pulse takes a phase shift of 90°. However, instead of being there, it
moves towards cathode due to the reverse bias applied. The time taken for the pulse to reach
cathode depends upon the thickness of n+ layer, which is adjusted to make it 90° phase shift. Now,
a dynamic RF negative resistance is proved to exist. Hence, IMPATT diode acts both as an
oscillator and an amplifier.
The following figure shows the constructional details of an IMPATT diode.
Cu cathode
z Je seal
Gold
wire
Ne
0
Gold wire Pe
23mm hi erer ic Gold alloy
=e contact
< Cuanode
Constructional details of IMPATT
The efficiency of IMPATT diode is represented as
Where,
+ Pye = AC power
+ Pye =DC power
. V, & I, = AC voltage & current
. Va & Ig = DC voltage & current
Disadvantages
Following are the disadvantages of IMPATT diode.
https Aww tutorialspoint com/microwave_engineering/microwave_engineering_avalanche_transit_time_devices.htm
aa
10/29/21, 10:52 AM ‘Avalanche Transit Time Devices
It is noisy as avalanche is a noisy process
Tuning range is not as good as in Gunn diodes
Applications
Following are the applications of IMPATT diode.
. Microwave oscillator
. Microwave generators
+ Modulated output oscillator
. Receiver local oscillator
8
+ Negative resistance amplifications
+ Intrusion alarm networks highQIM PATT
+ Police radar highQIM PATT
+ Low power microwave transmitter highQIM PATT
+ FMtelecom transmitter lowQIM PATT
* CWDoppler radar transmitter lowQIM PATT
TRAPATT Diode
The full form of TRAPATT diode is TRApped Plasma Avalanche Triggered Transit diode. A
microwave generator which operates between hundreds of MHz to GHz. These are high peak
power diodes usually n+- p-p+ or p+-n-n+ structures with n-type depletion region, width varying
from 2.5 to 1.25 Aum. The following figure depicts this.
:ngineeting/microwave_engineering_avalanche_tansittime_devices. htm 3910123,21, 10:52 AM Avalanche Transit Time Devices:
Square wave
current drive
F 50m for cw & 750
um for low frequency
¥_ high peak power
. 25t012.5 um
depletion layer
Arrangement in TRAPATT diode
The electrons and holes trapped in low field region behind the zone, are made to fill the depletion
region in the diode. This is done by a high field avalanche region which propagates through the
diode.
The following figure shows a graph in which AB shows charging, BC shows plasma formation, DE
shows plasma extraction, EF shows residual extraction, and FG shows charging
Let us see what happens at each of the points.
A: The voltage at point A is not sufficient for the avalanche breakdown to occur. At A, charge
carriers due to thermal generation results in charging of the diode like a linear capacitance.
A-B: At this point, the magnitude of the electric field increases. When a sufficient number of
carriers are generated, the electric field is depressed throughout the depletion region causing
the voltage to decrease from B to C.
C: This charge helps the avalanche to continue and a dense plasma of electrons and holes is
created. The field is further depressed so as not to let the electrons or holes out of the
depletion layer, and traps the remaining plasma
tps: ww tutorialspoint com/microwave_engineering/microwave_engineering_avalanche_transit_time_devices.htm\ EE
1072921, 1052 AM ‘valonche Transit Tine Devices
D: The voltage decreases at point D. A long time is required to clear the plasma as the total
plasma charge is large compared to the charge per unit time in the external current
E: At point E, the plasma is removed. Residual charges of holes and electrons remain each at
‘one end of the deflection layer.
E to F: The voltage increases as the residual charge is removed.
F: At point F, all the charge generated internally is removed.
F to G: The diode charges like a capacitor.
G: At point G, the diode current comes to zero for half a period. The voltage remains constant
as shown in the graph above. This state continues until the current comes back on and the
cycle repeats.
The avalanche zone velocity V, is represented as
de J
4-2 -—
dt @Na
Where
+ J = Current density
. q = Electron charge 1.6 x 10°'9
+ N4_ = Doping concentration
The avalanche zone will quickly sweep across most of the diode and the transit time of the carriers
is represented as
Where
V,_ = Saturated carrier drift velocity
. L = Length of the specimen
‘tips wv tutorialspoint com/microwave_engineeringimicrowave_engineering_avalanche_transittime_devices.him1012921, 10:52AM ‘Avalanche Transit Time Devices
The transit time calculated here is the time between the injection and the collection. The repeated
action increases the output to make it an amplifier, whereas a microwave low pass filter connected
in shunt with the circuit can make it work as an oscillator.
Applications
There are many applications of this diode.
* Low power Doppler radars
+ Local oscillator for radars
+ Microwave beacon landing system
+ Radio altimeter
* Phased array radar, etc.
BARITT Diode
The full form of BARITT Diode is BARrier Injection Transit Time diode. These are the latest
invention in this family. Though these diodes have long drift regions like IMPATT diodes, the carrier
injection in BARITT diodes is caused by forward biased junctions, but not from the plasma of an
avalanche region as in them
In IMPATT diodes, the carrier injection is quite noisy due to the impact ionization. In BARITT
diodes, to avoid the noise, carrier injection is provided by punch through of the depletion region
The negative resistance in a BARITT diode is obtained on account of the drift of the injected holes
to the collector end of the diode, made of p-type material
The following figure shows the constructional details of a BARITT diode.
ites! wiv tutorialspoint commicrowave_engineering/microwave_engineeting_avalanche_transittime_devices.htm
a910729721, 10:52 AM Avalanche Transit Time Devices (3 *
ntype c
(Si wafer) ,
Drift region e }
Electric
— + Distance
Construction of BARITT diode
For a2 m-n-m BARITT diode, Ps-Si Schottky barrier contacts metals with n-type Si wafer in
between. A rapid increase in current with applied voltage above30v_ is due to the thermionic
hole injection into the semiconductor.
The critical voltage (Vc) depends on the doping constant (N) , length of the semiconductor
(L) and the semiconductor dielectric permittivity (€S) represented as
qNL?
2eS
Monolithic Microwave Integrated Circuit MMIC
Microwave ICs are the best alternative to conventional waveguide or coaxial circuits, as they are
low in weight, small in size, highly reliable and reproducible. The basic materials used for
monolithic microwave integrated circuits are ~
+ Substrate material
+ Conductor material
https tutorialepoint.com/microwave_engineering/mictowave_engineering_avalanche. transit time_devices.htm 719102321, 1052 AM
* Dielectric films
+ Resistive films
These are so chosen to have ideal characteristics and high efficiency. The substrate on which
circuit elements are fabricated is important as the dielectric constant of the material should be high
with low dissipation factor, along with other ideal characteristics. The substrate materials used are
GaAs, Ferrite/gamet, Aluminum, beryllium, glass and rutile.
The conductor material is so chosen to have high conductivity, low temperature coefficient of
resistance, good adhesion to substrate and etching, etc. Aluminum, copper, gold, and silver are
mainly used as conductor materials. The dielectric materials and resistive materials are so chosen
to have low loss and good stability.
Fabrication Technology
In hybrid integrated circuits, the semiconductor devices and passive circuit elements are formed on
a dielectric substrate. The passive circuits are either distributed or lumped elements, or a
combination of both.
Hybrid integrated circuits are of two types
+ Hybrid Ic
+ Miniature Hybrid IC
In both the above processes, Hybrid IC uses the distributed circuit elements that are fabricated on
IC using a single layer metaliization technique, whereas Miniature hybrid IC uses multi-level
elements.
Most analog circuits use meso-isolation technology to isolate active n-type areas used for FETs and
diodes. Planar circuits are fabricated by implanting ions into semi-insulating substrate, and to
provide isolation the areas are masked off.
“Via hole” technology is used to connect the source with source electrodes connected to the
ground, in a GaAs FET, which is shown in the following figure.
https wm tuterialspoint com/microwave_engineering/microwave_engineering_avalanche_transittime_devices.htmn10/29/21, 10:52 AM Avalanche Transit Time Devices
contact layer
Drain Source Drain
—n channel layer
~ Buffer layer
Semi insulating
substrate
Plated gold via hole
connection
Via-hole technology in monolithic IC’s
There are many applications of MMICs
+ Military communication
+ Radar
ECM
Phased array antenna systems
Spread spectrum and TDMA systems
They are cost-effective and also used in many domestic consumer applications such as DTH,
telecom and instrumentation, etc.
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