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Eye Pleasing White SMD LED Specs

This document provides specifications for approval of a white SMD LED. It includes features, applications, dimensions, maximum ratings, electro-optical characteristics, bin structures, typical curves, packaging, cautions, and disclaimers. Key specifications include a luminous flux range of 26.6-40 lm depending on bin, a forward voltage of 2.6-2.9V, a color temperature range of 2700-6500K, and a viewing angle of 120 degrees. The LED will be taped and reeled in packs of 4,000 units.

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Arturo mendoza
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0% found this document useful (0 votes)
227 views22 pages

Eye Pleasing White SMD LED Specs

This document provides specifications for approval of a white SMD LED. It includes features, applications, dimensions, maximum ratings, electro-optical characteristics, bin structures, typical curves, packaging, cautions, and disclaimers. Key specifications include a luminous flux range of 26.6-40 lm depending on bin, a forward voltage of 2.6-2.9V, a color temperature range of 2700-6500K, and a viewing angle of 120 degrees. The LED will be taped and reeled in packs of 4,000 units.

Uploaded by

Arturo mendoza
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 22

CUSTOMER : .

DATE : .
REV : .

SPECIFICATIONS FOR APPROVAL

Eye Pleasing White SMD LED


MODEL NAME : LEMWS36W80****EP

APPROVAL REMARK APPENDIX DESIGNED CHECKED APPROVED


LGIT Confidential and Proprietary

TABLE OF CONTENTS

1. Features --------------------- 3

2. Applications --------------------- 3

3. Outline Dimensions --------------------- 3

4. Absolute Maximum Ratings --------------------- 4

5. Electro-Optical Characteristics --------------------- 4

6. Bin Structures and Order Code --------------------- 5~10

7. Typical Characteristic Curves --------------------- 11~12

8. Packing and Labeling of Products --------------------- 13~17

9. Cautions on Use --------------------- 18~21

10. Disclaimers --------------------- 21

Appendix. Nomenclature of Package --------------------- 22

2 / 23
LGIT Confidential and Proprietary

1. Features
- Lighting Color : White
- Lead Frame Type LED Package : 3.00 x 3.00 x 0.75 (L x W x H) [Unit : mm]
- Viewing Angle : 120˚
- Chip Material : InGaN
- Soldering Methods : Reflow soldering
- Taping : 8 mm antistatic clear carrier tape and antistatic clear cover tape.
4,000 pcs/reel, ∅178 mm reel

2. Applications
- Interior and Exterior Illumination
- Even if the same color temperature is used with EP LED and general LED, color difference may
occur in the state of the finished product.

3. Outline Dimensions ( Unit : mm )

3.00 Cathode Mark 0.75 0.97 0.56 0.97

2.50
3.00

① ② ② ①

Recommendable soldering pattern


0.75

(For reflow soldering)


0.88 0.56 1.27
0.33

Internal circuit
1.18 0.43

Anode Cathode
① ②
2.70

① ②

Pad Configuration
① Anode Pad
② Cathode Pad 1.07 1.07

Tolerances unless otherwise mentioned are ± 0.10 mm

3 / 23
LGIT Confidential and Proprietary

4. Absolute Maximum Ratings (Ta=25℃)

Item Symbol Rating Unit


Forward Current If 350 mA
Pulse Forward Current*1) Ifp 400 mA
Operating Temperature Topr -40 ~ +85 ℃
Storage Temperature Tstg -40 ~ +100 ℃
Junction Temperature Tj 125 ℃
Soldering Temperature JEDEC-J-STD-020D
ESD Classification Class 2 (ANSI/ESDA/JEDEC JS-001)
*1) Pulse width ≤10ms and duty cycle ≤10%
※ Operating the LED beyond the listed maximum ratings may affect device reliability and cause permanent damage.
These or any other conditions beyond those indicated under recommended operating conditions are not implied.
The exposure to the absolute maximum rated conditions may affect device reliability.
※ The LEDs are not designed to be driven in reverse bias.
※ These values are provided less than Tj 125℃

5. Electro - Optical Characteristics (Ta=25℃)

Item Symbol Condition CCT Min. Typ. Max. Unit


6500 (F) 30.0 - 36.0
5700 (G) 32.0 - 38.0
5000 (H) 32.0 - 38.0
Luminous Flux*1) Φv If =65mA 4000 (J) 32.0 - 38.0 lm
3500 (K) 30.0 - 36.0
3000 (L) 30.0 - 36.0
2700 (M) 30.0 - 36.0
6500 (F) 28.5 - 34.2
5700 (G) 30.4 - 36.1
5000 (H) 30.4 - 36.1
Luminous Flux*2) Φv If =65mA 4000 (J) 30.4 - 36.1 lm
3500 (K) 28.5 - 34.2
3000 (L) 28.5 - 34.2
2700 (M) 28.5 - 34.2
Forward Voltage Vf If =65mA All 2.60 - 2.90 V
Refer to
Color Coordinate Cx / Cy If =65mA All -
‘Chromaticity Bins’
Color Rendering Index (CRI) Ra If =65mA All 80.0 - - -
Viewing Angle 2Θ1/2 If =65mA All - 120 - deg
Typical Temperature Coefficient of ΔVf / ΔTj If =65mA All -2.0 - -6.0 mV/℃
Forward Voltage*3)
Thermal Resistance,
Rth j-s If =65mA All - 7 - ℃/W
Junction to Solder Point
*1) These values are measured by a standard of LED component level
*2) These values are measured by a standard of assembly level
*3) Measured at Ta between 25℃ and 85℃
※ These values are measured by the LG Innotek optical spectrum analyzer within the following tolerances.
Luminous Flux (Φv) : ±7%, Forward Voltage (Vf) : ±0.1V, Color Value : ±0.005, CRI Value : ±2,
※ Although all LEDs are tested by LG Innotek equipment, some values may vary slightly depending on the
conditions of the test equipment.

4 / 23
LGIT Confidential and Proprietary

6. Bins Structure and Order Code


Luminous Flux Bins

CCT W0 W1 W2 W3 W4 W5
CRI Model Name
[K] *1)
28.0~30.0 30.0~32.0 32.0~34.0 34.0~36.0 36.0~38.0 38.0~40.0
*2)
26.6~28.5 28.5~30.4 30.4~32.3 32.3~34.2 34.2~36.1 36.1~38.0

6500 (F) LEMWS36W80F***EP


5700 (G) LEMWS36W80G***EP
5000 (H) LEMWS36W80H***EP
80 4000 (J) LEMWS36W80J***EP
3500 (K) LEMWS36W80K***EP
3000 (L) LEMWS36W80L***EP
2700 (M) LEMWS36W80M***EP
*1) These values are measured by a standard of LED component level
*2) These values are measured by a standard of assembly level

 Luminous Flux Bins (@65mA)


Luminous Flux*1) [lm] Luminous Flux*2) [lm]
Bin
Min. Max. Min. Max.
W0 28.0 30.0 26.6 28.5
W1 30.0 32.0 28.5 30.4
W2 32.0 34.0 30.4 32.3
W3 34.0 36.0 32.3 34.2
W4 36.0 38.0 34.2 36.1
W5 38.0 40.0 36.1 38.0
*1) These values are measured by a standard of LED component level
*2) These values are measured by a standard of assembly level

 Forward Voltage Bins (@65mA)


Vf [V]
Bin
Min. Max.
7A 2.60 2.65 ※ Bin structure : Please refer to the following example.
7B 2.65 2.70 Bin Code : W4–H4–8A
(Φv Bin = W4, Color Bin = H4, Vf Bin = 8A)
8A 2.70 2.75
8B 2.75 2.80
9A 2.80 2.85
9B 2.85 2.90

 CRI Bins (@65mA)


CRI [K]
Bin
Min. Max.
80 80 -

5 / 23
LGIT Confidential and Proprietary

6. Bins Structure and Order Code


 Color Bins (@65mA)

5000K
HB7
HB4

HB1 HB8 Blackbody


5700K
GB7 H Locus
Cy

GB4 HB2 HB9


GB8 HB6
GB1
6500K ANSI
FB7 G HB3
GB9 C78.377A
GB2
FB4 FB8 GB6

FB1 GB3
F FB9
FB2
FB6

FB3

Cx

※ MacAdam Ellipse Bin


MacAdam
CCT Bin Cx Cy a b θ
Step
6500K F 3 0.3131 0.3290 0.00223 0.00095 58.57
5700K G 3 0.3293 0.3423 0.00249 0.00107 59.09
5000K H 3 0.3452 0.3559 0.00274 0.00118 59.60

※ MacAdam Ellipse

a
b θ
Cx, Cy

6 / 23
LGIT Confidential and Proprietary

6. Bins Structure and Order Code


 Color Bins (@65mA)
※ Ansi Bin
6500K 5700K 5000K
Bin Cx Cy Bin Cx Cy Bin Cx Cy
0.3028 0.3304 0.3207 0.3462 0.3376 0.3616
0.3087 0.3363 0.3263 0.3513 0.3434 0.3664
FB1 GB1 HB1
0.3098 0.3296 0.3266 0.3437 0.3428 0.3579
0.3041 0.3240 0.3212 0.3389 0.3373 0.3534
0.3041 0.3240 0.3212 0.3389 0.3373 0.3534
0.3098 0.3296 0.3266 0.3437 0.3428 0.3579
FB2 GB2 HB2
0.3108 0.3229 0.3268 0.3361 0.3422 0.3494
0.3055 0.3177 0.3217 0.3316 0.3369 0.3451
0.3055 0.3177 0.3217 0.3316 0.3369 0.3451
0.3108 0.3229 0.3268 0.3361 0.3422 0.3494
FB3 GB3 HB3
0.3119 0.3162 0.3270 0.3285 0.3416 0.3408
0.3068 0.3113 0.3222 0.3243 0.3366 0.3369
0.3087 0.3363 0.3263 0.3513 0.3434 0.3664
0.3146 0.3422 0.3320 0.3565 0.3493 0.3712
FB4 GB4 HB4
0.3154 0.3352 0.3319 0.3485 0.3484 0.3624
0.3098 0.3296 0.3266 0.3437 0.3428 0.3579
0.3108 0.3229 0.3268 0.3361 0.3422 0.3494
0.3162 0.3282 0.3319 0.3406 0.3474 0.3536
FB6 GB6 HB6
0.3170 0.3212 0.3318 0.3327 0.3465 0.3448
0.3119 0.3162 0.3270 0.3285 0.3416 0.3408
0.3146 0.3422 0.3320 0.3565 0.3493 0.3712
0.3205 0.3481 0.3376 0.3616 0.3551 0.3760
FB7 GB7 HB7
0.3210 0.3408 0.3373 0.3534 0.3539 0.3669
0.3154 0.3352 0.3319 0.3485 0.3484 0.3624
0.3154 0.3352 0.3319 0.3485 0.3484 0.3624
0.3210 0.3408 0.3373 0.3534 0.3539 0.3669
FB8 GB8 HB8
0.3216 0.3334 0.3369 0.3451 0.3527 0.3578
0.3162 0.3282 0.3319 0.3406 0.3474 0.3536
0.3162 0.3282 0.3319 0.3406 0.3474 0.3536
0.3216 0.3334 0.3369 0.3451 0.3527 0.3578
FB9 GB9 HB9
0.3221 0.3261 0.3366 0.3369 0.3515 0.3487
0.3170 0.3212 0.3318 0.3327 0.3465 0.3448

7 / 23
LGIT Confidential and Proprietary

6. Bins Structure and Order Code


 Color Bins (@65mA)

2700K
3000K
M31 M33
M13
M11
L33
L31 M14 M32M34
3500K L11
L13
M12
K33 L14
L32 L34 M Blackbody
K31 M43
L12 Locus
L M21 M23 M41
Cy

4000K K13
K32 K34 L43
K11
J33 L41 M42 M44
K14 L21 L23 M22 M24
J31
J13
K12 K K43
L42
L44
J32 J34 K41
L24
ANSI
L22
J11
K23 K44
J14 J43 K21 C78.377A
K42
J12 J J41 K24
K22
J44
J21 J23 J42
J24
J22

Cx
※ MacAdam Ellipse Bin
MacAdam
CCT Bin Cx Cy a b θ
Step
4000K J 3 0.3828 0.3803 0.00313 0.00134 53.70
3500K K 3 0.4082 0.3922 0.00309 0.00138 54.00
3000K L 3 0.4344 0.4032 0.00278 0.00136 53.20
2700K M 3 0.4586 0.4103 0.00270 0.00140 53.70

※ MacAdam Ellipse

a
b θ
Cx, Cy

8 / 23
LGIT Confidential and Proprietary

6. Bins Structure and Order Code


 Color Bins (@65mA)
※ Ansi Bin
4000K 3500K 3000K 2700K
Bin Cx Cy Bin Cx Cy Bin Cx Cy Bin Cx Cy
0.3736 0.3874 0.3996 0.4015 0.4299 0.4165 0.4562 0.4260
0.3804 0.3917 0.4071 0.4052 0.4364 0.4189 0.4625 0.4275
J11 K11 L11 M11
0.3785 0.3841 0.4041 0.3969 0.4323 0.4098 0.4575 0.4181
0.3720 0.3800 0.3969 0.3932 0.4260 0.4075 0.4513 0.4166
0.3720 0.3800 0.3969 0.3932 0.4260 0.4075 0.4513 0.4166
0.3785 0.3841 0.4041 0.3969 0.4323 0.4098 0.4575 0.4181
J12 K12 L12 M12
0.3766 0.3765 0.4012 0.3885 0.4282 0.4008 0.4525 0.4087
0.3703 0.3726 0.3941 0.3848 0.4221 0.3984 0.4465 0.4071
0.3804 0.3917 0.4071 0.4052 0.4364 0.4189 0.4625 0.4275
0.3871 0.3959 0.4146 0.4089 0.4430 0.4212 0.4687 0.4289
J13 K13 L13 M13
0.3849 0.3881 0.4114 0.4005 0.4387 0.4122 0.4637 0.4196
0.3785 0.3841 0.4041 0.3969 0.4323 0.4098 0.4575 0.4181
0.3785 0.3841 0.4041 0.3969 0.4323 0.4098 0.4575 0.4181
0.3849 0.3881 0.4114 0.4005 0.4387 0.4122 0.4637 0.4196
J14 K14 L14 M14
0.3828 0.3803 0.4082 0.3922 0.4344 0.4032 0.4586 0.4103
0.3766 0.3765 0.4012 0.3885 0.4282 0.4008 0.4525 0.4087
0.3703 0.3726 0.3941 0.3848 0.4221 0.3984 0.4465 0.4071
0.3766 0.3765 0.4012 0.3885 0.4282 0.4008 0.4525 0.4087
J21 K21 L21 M21
0.3746 0.3689 0.3982 0.3803 0.4243 0.3921 0.4477 0.3996
0.3687 0.3652 0.3915 0.3769 0.4184 0.3899 0.4419 0.3982
0.3687 0.3652 0.3915 0.3769 0.4184 0.3899 0.4419 0.3982
0.3746 0.3689 0.3982 0.3803 0.4243 0.3921 0.4477 0.3996
J22 K22 L22 M22
0.3727 0.3613 0.3953 0.3721 0.4203 0.3834 0.4428 0.3906
0.3670 0.3578 0.3889 0.369 0.4147 0.3814 0.4373 0.3893
0.3766 0.3765 0.4012 0.3885 0.4282 0.4008 0.4525 0.4087
0.3828 0.3803 0.4082 0.3922 0.4344 0.4032 0.4586 0.4103
J23 K23 L23 M23
0.3806 0.3725 0.405 0.3837 0.4302 0.3943 0.4535 0.4011
0.3746 0.3689 0.3982 0.3803 0.4243 0.3921 0.4477 0.3996
0.3746 0.3689 0.3982 0.3803 0.4243 0.3921 0.4477 0.3996
0.3806 0.3725 0.405 0.3837 0.4302 0.3943 0.4535 0.4011
J24 K24 L24 M24
0.3784 0.3647 0.4017 0.3752 0.4260 0.3853 0.4483 0.3918
0.3727 0.3613 0.3953 0.3721 0.4203 0.3834 0.4428 0.3906
0.3871 0.3959 0.4146 0.4089 0.4430 0.4212 0.4687 0.4289
0.3939 0.4002 0.4223 0.4127 0.4496 0.4236 0.4750 0.4304
J31 K31 L31 M31
0.3915 0.3922 0.4187 0.404 0.4450 0.4144 0.4697 0.4209
0.3849 0.3881 0.4114 0.4005 0.4387 0.4122 0.4637 0.4196
0.3849 0.3881 0.4114 0.4005 0.4387 0.4122 0.4637 0.4196
0.3915 0.3922 0.4187 0.404 0.4450 0.4144 0.4697 0.4209
J32 K32 L32 M32
0.3890 0.3842 0.4151 0.3953 0.4404 0.4052 0.4643 0.4115
0.3828 0.3803 0.4082 0.3922 0.4344 0.4032 0.4586 0.4103
0.3939 0.4002 0.4223 0.4127 0.4496 0.4236 0.475 0.4304
0.4006 0.4044 0.4299 0.4165 0.4562 0.4260 0.4813 0.4319
J33 K33 L33 M33
0.3979 0.3962 0.426 0.4075 0.4513 0.4166 0.4756 0.4223
0.3915 0.3922 0.4187 0.404 0.4450 0.4144 0.4697 0.4209
0.3915 0.3922 0.4187 0.404 0.4450 0.4144 0.4697 0.4209
0.3979 0.3962 0.426 0.4075 0.4513 0.4166 0.4756 0.4223
J34 K34 L34 M34
0.3952 0.388 0.4221 0.3984 0.4465 0.4071 0.4700 0.4126
0.3890 0.3842 0.4151 0.3953 0.4404 0.4052 0.4643 0.4115

9 / 23
LGIT Confidential and Proprietary

6. Bins Structure and Order Code


 Color Bins (@65mA)
※ Ansi Bin
4000K 3500K 3000K 2700K
Bin Cx Cy Bin Cx Cy Bin Cx Cy Bin Cx Cy
0.3828 0.3803 0.4082 0.3922 0.4344 0.4032 0.4586 0.4103
0.3890 0.3842 0.4151 0.3953 0.4404 0.4052 0.4643 0.4115
J41 K41 L41 M41
0.3866 0.3762 0.4117 0.3868 0.4360 0.3962 0.4590 0.4023
0.3806 0.3725 0.4050 0.3837 0.4302 0.3943 0.4535 0.4011
0.3806 0.3725 0.4050 0.3837 0.4302 0.3943 0.4535 0.4011
0.3866 0.3762 0.4117 0.3868 0.4360 0.3962 0.4590 0.4023
J42 K42 L42 M42
0.3841 0.3682 0.4082 0.3783 0.4316 0.3873 0.4538 0.3931
0.3784 0.3647 0.4017 0.3752 0.4260 0.3853 0.4483 0.3918
0.3890 0.3842 0.4151 0.3953 0.4404 0.4052 0.4643 0.4115
0.3952 0.388 0.4221 0.3984 0.4465 0.4071 0.4700 0.4126
J43 K43 L43 M43
0.3925 0.3798 0.4184 0.3899 0.4419 0.3982 0.4646 0.4035
0.3866 0.3762 0.4117 0.3868 0.4360 0.3962 0.4590 0.4023
0.3866 0.3762 0.4117 0.3868 0.4360 0.3962 0.4590 0.4023
0.3925 0.3798 0.4184 0.3899 0.4419 0.3982 0.4646 0.4035
J44 K44 L44 M44
0.3898 0.3716 0.4147 0.3814 0.4373 0.3893 0.4593 0.3944
0.3841 0.3682 0.4082 0.3783 0.4316 0.3873 0.4538 0.3931

10 / 23
LGIT Confidential and Proprietary

7. Typical Characteristic Curves


 Forward Current vs. Forward Voltage  Relative Luminous Flux vs. Forward Current
Ta=25℃ Ta=25℃
200 300
180

Relative Luminous Flux [%]


250
160
Forward Current [mA]

140 200
120
100 150
80
60 100
40
50
20
0 0
2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 0 20 40 60 80 100 120 140 160 180 200

Forward Voltage [V] Forward Current [mA]

 Chromaticity Coordinate vs. Forward Current  Luminous Flux vs. Temperature


Ta=25℃ If=65mA
0.004 105
Cx
ΔChromaticity Coordinate

Relative Luminous Flux [%]

0.003 100
Cy
0.002 95
0.001
90
0.000
0 20 40 60 80 100 120 140 160 180 200 85
-0.001
80
-0.002
-0.003 75

-0.004 70
25 40 55 70 85 100
Forward Current [mA] Ambient Temperature [℃]

 Forward Voltage vs. Temperature Chromaticity Coordinate vs. Temperature


If=65mA
If=65mA
0.3 0.01
[ΔChromaticity Coordinate

Cx
0.2 Cy
ΔForward Voltage [V]

0.00

0.1
-0.01
0.0
-0.02
-0.1
-0.03
-0.2

-0.3 -0.04
25 40 55 70 85 100 25 40 55 70 85 100

Ambient Temperature [℃] Ambient Temperature [℃]

※ The ambient temperature values for each graph are obtained with LG Innotek equipment.

11 / 23
LGIT Confidential and Proprietary

7. Typical Characteristic Curves


 Spectrum (5700K (G))  Spectrum (4000K (J))
Ta=25℃, If=65mA
Ta=25℃, If=65mA
100

Relative Spectral Power Distribution [%]


100
Relative Spectral Power Distribution [%]

90
90
80
80
70
70

60 60

50 50

40 40

30 30

20 20

10 10

0 0
380 430 480 530 580 630 680 730 780 380 430 480 530 580 630 680 730 780

Wavelength [nm]
Wavelength [nm]

 Spectrum (3000K (L))


Ta=25℃, If=65mA
100
Relative Spectral Power Distribution [%]

90

80

70

60

50

40

30

20

10

0
380 430 480 530 580 630 680 730 780
Wavelength [nm]

 Radiation Characteristics
Ta 25℃, If = 65mA Ta 25℃, If = 65mA
X-X Y-Y
0 0
-30 30 -30 30

-60 60 -60 60

-90 90 -90 90
100 50 0 50 100 100 50 0 50 100

※ The ambient temperature values for each graph are obtained with LG Innotek equipment.

12 / 23
LGIT Confidential and Proprietary

8. Packing and Labeling of Products


8-1. Taping Outline Dimension

( Unit : mm )

 Packing Materials :
- Reel : Conductive PS (Black)
- Embossed Carrier Tape : Antistatic PET (Clear)
- Cover Tape : Conductive PET Base

Polarity
Direction

Cathode

Anode

Taping Arrangement
Embossed Carrier Tape Feed Direction

( End ) Cover Tape ( Start )

Trailer Loaded Pocket Leader with


(Empty Pockets) (4,000 pcs) Cover Tape
(Min. 400mm) (1,600mm) (Min.500mm)

13 / 23
LGIT Confidential and Proprietary

8. Packing and Labeling of Products

8-2. Packing Structures


Reeled products are packed in a sealed-off and moisture-proof aluminum bag with desiccants (silica
gel). A maximum of four aluminum bags are packed in an inner box and six inner boxes are packed
in an outer box.

Label A
Vacuum Packing
Label A
Label B

Silica gel

Label A(SRM)
Label B(MRM)

Sizes (mm)
Types
ⓐ ⓑ ⓒ
ⓒ Inner Box 227 82 258
Outer Box 530 240 280
Tolerance : ±10mm

Label C

ⓐ ⓑ

14 / 23
LGIT Confidential and Proprietary

8. Packing and Labeling of Products


8-3. MES Label Structure

※ Label A
Specifying Lot ID, ‘Model Name’, ‘MES ID’, ‘RANK’, ‘Q’ty’, ‘Run No.’, ‘Rack No.’
Lot ID : ***************** 2C11001-A003
Ver : 1.00

Model : LEMWS36W80***EP Q’ty : 4000[pcs]


MES ID : ***** Run No : F00401-4517
40mm RANK : U2-H32-1 Rack No : C-107
***** =U2-H32-1=4000=F00401-4517=C-107

U2-H32-1
P-J21-2 LG Innotek Co., Ltd.

 Run No. indication


80mm

1 2 3 4 5 6 7 8 9 10
Code Manufactured Manufactured Manufactured Manufactured TH # Serial No
Site Year Month Date

Paju :1 2013 : 3 1~9 : 1~9 ( 01~31) ( 00 ~ 99 ) ( 00 ~ ZZ )


Huizhou : 9 2014 : 4 10 : A
··· 11 : B
2020 : 0 12 : C
2021 : 1

※ Label C
Specifying ‘Customer’, ‘Date’, ‘Model Name’, ‘Quantity’, ‘Customer Part no.’, ‘Outbox ID’,
‘LGIT internal Model name’

OutBox Customer 2018.3.16

LEMWS36W80****EP/4000
40mm PSO2221003

U2-H32-1=4000

 Box ID. indication 80mm

1 2 3 4 5 6 7 8 9 10
Manufactured PKG Box Year Month Date Serial No
Site Site 2013 : 3 1~9 : 1~9 ( 01 ~ 31) ( 001 ~ 999 )
2014 : 4 10 : A
Paju :P PKG : S, P Inner Box : I ···
Huizhou : H 2020 : 0 11 : B
Outer Box : O
2021 : 1 12 : C

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LGIT Confidential and Proprietary

8. Packing and Labeling of Products


8-4. NEDA Label Structure

※ Label A
Specifying ‘Manufacturing Part Number’, ‘Quantity’, ‘Bin Code’, ‘Lot’, ‘Date Code’
and ‘Country of Origin’

Manuf Part Number (1P): LEMWS36W80****EP Date Code(9D): 1531

Country of CN
Qty(Q): 4000 Bin Code: U2-H32-1 Origin (4L)
40mm

Lot#(1T): DPMWY5K25VP003900

LG Innotek

80mm

 Date Code(9D)  Lot#(1T)

LG Innotek Trace Code


1 2 3 4

Year Week
01~99 01~52

 Bin Code

1 2 1 2 3 1

Flux Color Coordinates Forward Voltage

※ Label B
Specifying ‘Manufacturing Part Number’, ‘Quantity’, ‘Bin Code’, ‘Trans ID’, ‘Date Code’,
‘Country of Origin’ and ‘Inner Box ID’

Manuf Part Number (1P): LEMWS36W80****EP Date Code(9D): 1531

Country of CN
Qty(Q): 16000 Trans ID (K): IAP5X8
Origin (4L)
40mm

Bin Code: U1–H11–1 INNER BOX ID: HSI2531198

LG Innotek

80mm

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LGIT Confidential and Proprietary

8. Packing and Labeling of Products


8-4. NEDA Label Structure

※ Label C
Specifying ‘Manufacturing Site’, ‘Customer Address’, ‘Manufacturing Part Number’, ‘Bin Code’,
‘Box ID’, ‘Trans ID’ and ‘Quantity’

FROM: LG Innotek(HuiZhou)Co., Ltd TO:


District 18,ZhongKai Hi-Tech Industry
Development Zone, Huizhou ,Guangdong, China
Manuf Part Number (1P): LEMWS36W80****EP
Trans ID (K): IAP5X8

40mm
Bin Code: U1–U11–1
Qty(Q): 96000

BOX ID: HSO2531048

80mm

 Box ID indication

1 2 3 4 5 6 7 8 9 10

Site Code Outbox Year Month Date Serial No


13 : 3 1~9 : 1~9 ( 01 ~ 31) ( 001 ~ 999 )
Paju: P S, P Outbox: O
14 : 4 10 : A
Huizhou: H Inbox: I
15 : 5 11 : B
12 : C

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LGIT Confidential and Proprietary

9. Cautions on Use
9-1. Moisture-Proof Package
-. The moisture in the SMD package may vaporize and expand during soldering.
-. The moisture can damage the optical characteristics of the LEDs due to the encapsulation.

9-2. During Storage

Conditions Temperature Humidity Time

Within 1 Year from


Before Opening Aluminum Bag 5℃ ~ 30℃ < 50%RH
the Delivery Date
Storage
After Opening Aluminum Bag 5℃ ~ 30℃ < 60%RH ≤ 672 hours

Baking 65 ± 5℃ < 10%RH 10 ~ 24 hours

9-3. During Usage


-. The LED should avoid direct contact with hazardous materials such as sulfur, chlorine, phthalate,
etc.
-. The metal parts on the LED can rust when exposed to corrosive gases. Therefore, exposure to
corrosive gases must be avoided during operation and storage.
-. The silver-plated metal parts also can be affected not only by the corrosive gases emitted inside of
the end-products but by the gases penetrated from outside environment.
-. Extreme environments such as sudden ambient temperature changes or high humidity that can
cause condensation must be avoided.

9-4. Cleaning
-. Do not use brushes for cleaning or organic solvents (i.e. Acetone, TCE, etc..) for washing as
they may damage the resin of the LEDs.
-. Isopropyl Alcohol(IPA) is the recommended solvent for cleaning the LEDs under the following
conditions. (Cleaning Condition : IPA, 25℃ max. × 60sec max.)
-. Ultrasonic cleaning is not recommended.
-. Pretests should be conducted with the actual cleaning process to validate that the process will not
damage the LEDs.

9-5. Thermal Management


-. The thermal design of the end product must be seriously considered, particularly at the beginning of
the system design process.
-. The generation of heat is greatly impacted by the input power, the thermal resistance of the circuit
boards and the density of the LED array combined with other components.

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LGIT Confidential and Proprietary

9. Cautions on Use
9-6. Testing & Measurement (Compliance)
-. When the individual LED is tested, LG Innotek recommends that the compliance of the source
meter should be controlled like as; the input voltage should be set below 75V and the current
also should be set below 30mA.
Otherwise, the LED chip might be affected by certain surge or electrical overstress in a moment.
And that means it can lead to serious failure for that LED.

9-7. Static Electricity


-. Wristbands and anti-electrostatic gloves are strongly recommended and all devices, equipment and
machinery must be properly grounded when handling the LEDs, which are sensitive against static
electricity and surge.
-. Precautions are to be taken against surge voltage to the equipment that mounts the LEDs.
-. Unusual characteristics such as significant increase of current leakage, decrease of turn-on voltage,
or non-operation at a low current can occur when the LED is damaged.

9-8. Recommended Circuit


-. The current through each LED must not exceed the absolute maximum rating when designing the
circuits.
-. In general, there can be various forward voltages for LEDs. Different forward voltages in parallel via
a single resistor can result in different forward currents to each LED, which also can output different
luminous flux values. In the worst case, the currents can exceed the absolute maximum ratings
which can stress the LEDs. Matrix circuit with a single resistor for each LED is recommended to
avoid the luminous flux fluctuations.

L1 L2 L3 L1 L2 L3 L1 L2 L3
RL1 RL2 RL3
RL

Fig.1 Recommended Circuit in Parallel Mode Fig.2 Abnormal Circuit


: Separate resistors must be used for each LED. Circuits to Avoid : The current through the LEDs may vary
due to the variation in LED forward voltage.

-. The driving circuits must be designed to operate the LEDs by forward bias only.
-. Reverse voltages can damage the zener diode, which can cause the LED to fail.
-. A constant current LED driver is recommended to power the LEDs.

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LGIT Confidential and Proprietary

9. Cautions on Use
9-9. Soldering Conditions
-. Reflow soldering is the recommended method for assembling LEDs on a circuit board.
-. LG Innotek does not guarantee the performance of the LEDs assembled by the dip soldering
method.
-. Recommended Soldering Profile (according to JEDEC J-STD-020D)

Profile Feature Pb-Free Assembly


Preheat / Soak
Temperature Min (Tsmin) 150℃
Temperature Max (Tsmax) 200℃
Maximum time(ts) from Tsmin to Tsmax 60~120 seconds
Ramp-up rate (TL to Tp) 3℃/ second max.

Liquidous temperature (T L) 217℃

Time (tL) maintained above T L Max. 60 seconds

Maximum peak package body temperature (Tp) 260℃

Time(tp) within 5℃ of the specified temperature (T c) Max. 10 seconds

Ramp-down rate (T p to TL) 6℃/second max.

Maximum Time 25℃ to peak temperature 8 minutes max.

-. Reflow or hand soldering at the lowest possible temperature is desirable for the LEDs although
the recommended soldering conditions are specified in the above diagrams.
-. A rapid cooling process is not recommended for the LEDs from the peak temperature.
-. The silicone encapsulant at the top of the LED package is a soft surface, which can easily be
damaged by pressure. Precautions should be taken to avoid strong pressure on the silicone resin
when leveraging the pick and place machines.
-. Reflow soldering should not be done more than two times.

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LGIT Confidential and Proprietary

9. Cautions on Use
9-10. Soldering Iron
-. The recommended condition is less than 5 seconds at 260℃.
-. The time must be shorter for higher temperatures. (+10℃ → -1sec).
-. The power dissipation of the soldering iron should be lower than 15W and the surface temperature
of the device should be controlled at or under 230℃.

9-11. Eye Safety Guidelines


-. Do not directly look at the light when the LEDs are on.
-. Proceed with caution to avoid the risk of damage to the eyes when examining the LEDs with optical
instruments.

9-12. Manual Handling


-. Use Teflon-type tweezers to grab the base of the LED and do not apply mechanical pressure on the
surface of the encapsulant.

10. Disclaimers
-. LG Innotek is not responsible for any damages or accidents caused if the operating or storage
conditions exceed the absolute maximum ratings recommended in this document.
-. The LEDs described in this document are intended to be operated by ordinary electronic equipment.
-. It is recommended to consult with LG Innotek when the environment or the LED operation is non-
standard in order to avoid any possible malfunctions or damage to product or risk of life or health.
-. Disassembly of the LED products for the purpose of reverse engineering is prohibited without prior
written consent from LG Innotek. All defected LEDs must be reported to LG Innotek and are not to
be disassembled or analyzed.
-. The product information can be modified and upgraded without prior notice.

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LGIT Confidential and Proprietary

Appendix. Nomenclature of Package

All LEDs are tested and sorted by color, luminous flux and forward voltage where every LED in
a tube has only a single color bin, luminous flux bin and forward voltage bin.
However, the forward voltage bin information is not captured in the part number nomenclature.
A 16-digit part number is required when orders are placed. LG Innotek leverages the following
part number nomenclature.

Type
LE = Light Emitting Diode
Color
RR = Red
BB = Blue
MW = Multi Mixing White
MC = Multi Color

PKG Type
S = SMD Type
M = Module Type Label Code
A = Ceramic Type
0 = MES
H = High Power SMD Type
A = NEDA

PKG Dimension Revision

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Flux Bin Code


0 = Full Bins
1 = 15% Micro-Bins
2 = 7.5% Micro-Bins

CIE Bin Code


1 = 4 Bins
2 = 9 Bins
3 = 16 Bins
Special Code

CIE Bin

Optical Bin (CRI)

Optical Bin (Flux)

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