20EC401 Analog Integrated Circuits
Module 1 – Basic Information of op-amp,
Differential Amplifier
Lecture –1 Introduction to Operational Amplifier
Class: II ECE A
Academic Year:2021-2022 (Even Semester)
Course Outcomes:
Upon completion of the course, students shall have ability to
Course Outcomes:
Upon completion of the course, students shall have ability to
CO1 Understand the functional blocks of Linear IC and conceive the Linear [U]
application based on Operation amplifier
CO2 Understand the operations and characteristics and application areas [U]
of operational amplifiers
CO3 Enumerate the concept of Analog Multiplier and PLL [AP]
CO4 Apply the properties of operational amplifier in designing ADC’s, [AP]
DAC’s for real time signal analysis.
CO5 Apply the concept of Integrated circuits to design Voltage Regulator [AP]
CO6 [AN]
Perform simulation based analysis of AC and DC circuits to verify the
results and functionality
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ASSESSMENT COMPONENTS
• TECHNICAL QUIZ (5 Marks)
Date:21.03.22
• Assignment (5 Marks)
Individual Assignment
Date of submission: 25.03.22
• Mini project (10 Marks)
A batch can have 3 members
Date of presentation: 25.04.2022 onwards
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Overview
– Basics & Characteristics of Operational Amplifiers
– Applications of operational amplifiers
– Analog multiplier and PLL
– Analog to digital and digital to analog converters
– Special Function ICs
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TEXT BOOKS
1) D.Roy Choudhury, Shail Jain, “Linear Integrated
Circuits”, New Age International Pvt. Ltd. Fourth
Edition, 2010
2) Sergio Franco, “Design with operational amplifiers
and analog integrated circuits”,McGraw-
Hill,4thedition,2016. (Reprint)
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Module 1 Introduction
Lecture 1 – Introduction to Integrated
Circuits
Session Learning Objective
• To understand the need of Analog and Digital Integrated
circuits
• To Differentiate Analog and Digital ICs
• To understand different IC packages
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Introduction
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Introduction - Questions
• What is an Integrated Circuit?
• Where do you use an Integrated Circuit?
• Why do you prefer an Integrated Circuit to the
circuits made by interconnecting discrete
components?
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INTEGRATED CIRCUIT
Def: The “Integrated Circuit “ or IC is a miniature, low
cost electronic circuit consisting of active and passive
components that are irreparably joined together on a
single crystal chip of silicon.
In 1958 Jack Kilby of Texas Instruments invented first IC
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Applications of an IC
• Communication
• Control
• Instrumentation
• Computer
• Electronics- Amplifiers
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Advantages:
• Small size
• Low cost
• Less weight
• Low supply voltages
• Low power consumption
• Highly reliable
• Fast speed
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Classification
• Digital ICs
• Linear ICs
Integrated
circuits
Monolithic Thick Hybrid circuits
circuits &Thin film
Bipolar Uni polar
Pn junction Dielectric JFET
MOSFET
isolation isolation
Classification of ICs
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Chip size and Complexity
• Invention of Transistor (Ge) - 1947
• Development of Silicon - 1955-1959
• Silicon Planar Technology - 1959
• First ICs, SSI (3- 30gates/chip) - 1960
• MSI ( 30-300 gates/chip) - 1965-1970
• LSI ( 300-3000 gates/chip) -1970-1975
• VLSI (More than 3k gates/chip) - 1975
• ULSI (more than one million active devices are integrated on
single chip)
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SSI MSI LSI VLSI ULSI
< 100 100-1000 1000- >100000 Over 1
active active 100000 active million
devices devices active devices active
devices devices
Integrated BJT’s and MOSFETS 8bit, 16bit Pentium
resistors, Enhanced Microproc Microproc
diodes & MOSFETS essors essors
BJT’s
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IC Advantages
1. Increased system reliability due to the elimination
of soldered joints.
2. Increased operating speeds
3. Small in Size
4. Reduction in power consumption
5. Improved performance
6. Cost reduction due to batch processing
Limitations
As small is size- it is unable to dissipate large
amount of Power
At present coils inductors and transformers cannot
be produced in IC form
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Integrated Circuits
ANALOG IC DIGITAL IC
• Linear integrated circuits • Digitals ICs contain circuits
inputs and outputs can take whose inputs and outputs
on a continuous range of voltage are limited to two
values and the outputs are
generally proportional to possible levels low or high.
the inputs.
• It is used in microprocessor,
• It is used in aircraft, space, computers, clocks, digital
vehicles, radars, PLL, watches, calculator etc.
Oscilloscopes etc.
• Its consist of more number of
• It consist of very less number transistor as compared to
of transistor as compared to
linear ICs.
digital ICs.
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IC Package types
• Metal can Package
• Dual-in-line
• Flat Pack
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Metal can Packages
• The metal sealing plane is at the bottom
over which the chip is bounded
• It is also called transistor pack
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Dual-in-line Package
• The chip is mounted inside a plastic or
ceramic case
• The 8 pin Dip is called MiniDIP and also
available with 12, 14, 16, 20pins
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Flat pack
• The chip is enclosed in a rectangular
ceramic case
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Packages
The metal can (TO) The Flat Package
Package
The Dual-in-Line (DIP)
Package
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Selection of IC Package
Type Criteria
Metal can 1. Heat dissipation is important
package 2. For high power applications like
power amplifiers, voltage
regulators etc.
DIP 1. For experimental or bread
boarding purposes as easy to
mount
2. If bending or soldering of the leads
is not required
3. Suitable for printed circuit boards
as lead spacing is more
Flat pack 1. More reliability is required
2. Light in weight
3. Suited for airborne applications
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Review Questions
1. What is the need of Integrated Circuits?
2. Mention How Analog IC is called as Linear IC?
3. What are the applications of IC ?
4. Why IC is preferred than a BJT?
5. Where DIP IC is preferred?
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Session Learning Outcomes
• Ability to explain different IC packages
• Ablity to differentiate the Analog and Digital ICs.
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Next Topic
• Operational Amplifier Symbol, PIN
diagram and Ideal Characteristics
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