ATmega809/1609/3209/4809 –

48-pin
48-pin Data Sheet – megaAVR® 0-series

Introduction
® ®
The ATmega809/1609/3209/4809 microcontrollers of the megaAVR 0-series are using the AVR
processor with hardware multiplier, running at up to 20 MHz, with a wide range of Flash sizes up to 48
KB, up to 6 KB of SRAM, and 256 bytes of EEPROM in 28-, 32-, 40-, or 48-pin package. The series uses
the latest technologies from Microchip with a flexible and low-power architecture including Event System
and SleepWalking, accurate analog features and advanced peripherals.
The devices described here offer Flash sizes from 8 KB to 48 KB in a 48-pin package.

Features
®
• AVR CPU
– Single-cycle I/O access
– Two-level interrupt controller
– Two-cycle hardware multiplier
• Memories
– Up to 48 KB In-system self-programmable Flash memory
– 256B EEPROM
– Up to 6 KB SRAM
– Write/Erase endurance:
• Flash 10,000 cycles
• EEPROM 100,000 cycles
– Data retention: 40 Years at 55°C
• System
– Power-on Reset (POR) circuit
– Brown-out Detector (BOD)
– Clock options:
• 16/20 MHz low-power internal oscillator
• 32.768 kHz Ultra Low-Power (ULP) internal oscillator
• 32.768 kHz external crystal oscillator
• External clock input
– Single pin Unified Program Debug Interface (UPDI)
– Three sleep modes:
• Idle with all peripherals running for immediate wake-up
• Standby
– Configurable operation of selected peripherals

© 2019 Microchip Technology Inc. Preliminary Datasheet DS40002016B-page 1

 ATmega809/1609/3209/4809 – 48-pin

– SleepWalking peripherals
• Power-Down with limited wake-up functionality
• Peripherals
– One 16-bit Timer/Counter type A (TCA) with a dedicated period register and three compare
channels
– Four 16-bit Timer/Counter type B with input capture (TCB)
– One 16-bit Real-Time Counter (RTC) running from an external crystal or an internal RC oscillator
– Four USART with fractional baud rate generator, auto-baud, and start-of-frame detection
– Master/slave Serial Peripheral Interface (SPI)
– Dual mode Master/Slave TWI with dual address match
• Standard mode (Sm, 100 kHz)
• Fast mode (Fm, 400 kHz)
• Fast mode plus (Fm+, 1 MHz)
– Event System for CPU independent and predictable inter-peripheral signaling
– Configurable Custom Logic (CCL) with up to four programmable Look-up Tables (LUT)
– One Analog Comparator (AC) with a scalable reference input
– One 10-bit 150 ksps Analog to Digital Converter (ADC)
– Five selectable internal voltage references: 0.55V, 1.1V, 1.5V, 2.5V, and 4.3V
– CRC code memory scan hardware
• Optional automatic scan before code execution is allowed
– Watchdog Timer (WDT) with Window mode, with separate on-chip oscillator
– External interrupt on all general purpose pins
• I/O and Packages:
– 41 programmable I/O lines
– 48-pin UQFN 6x6 and TQFP 7x7
• Temperature Range: -40°C to 125°C
• Speed Grades -40°C to 105°C:
– 0-5 MHz @ 1.8V – 5.5V
– 0-10 MHz @ 2.7V – 5.5V
– 0-20 MHz @ 4.5V – 5.5V
• Speed Grades -40°C to 125°C:
– 0-8 MHz @ 2.7V - 5.5V
– 0-16 MHz @ 4.5V - 5.5V

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 2

 ATmega809/1609/3209/4809 – 48-pin

Table of Contents

Introduction......................................................................................................................1

Features.......................................................................................................................... 1

1. Block Diagram........................................................................................................... 5

2. Pinout........................................................................................................................ 6
2.1. 48-pin UQFN/TQFP......................................................................................................................6

3. I/O Multiplexing and Considerations..........................................................................7

3.1. Multiplexed Signals...................................................................................................................... 7

4. Electrical Characteristics........................................................................................... 9
4.1. Disclaimer.....................................................................................................................................9
4.2. Absolute Maximum Ratings .........................................................................................................9
4.3. General Operating Ratings ..........................................................................................................9
4.4. Power Considerations................................................................................................................ 11
4.5. Power Consumption................................................................................................................... 11
4.6. Peripherals Power Consumption................................................................................................13
4.7. BOD and POR Characteristics................................................................................................... 14
4.8. External Reset Characteristics................................................................................................... 15
4.9. Oscillators and Clocks................................................................................................................15
4.10. I/O Pin Characteristics................................................................................................................17
4.11. USART....................................................................................................................................... 19
4.12. SPI..............................................................................................................................................20
4.13. TWI.............................................................................................................................................21
4.14. VREF..........................................................................................................................................23
4.15. ADC............................................................................................................................................25
4.16. AC.............................................................................................................................................. 28
4.17. UPDI Timing............................................................................................................................... 29
4.18. Programming Time..................................................................................................................... 30

5. Typical Characteristics.............................................................................................31
5.1. Power Consumption................................................................................................................... 31
5.2. GPIO.......................................................................................................................................... 39
5.3. VREF Characteristics................................................................................................................. 46
5.4. BOD Characteristics...................................................................................................................48
5.5. ADC Characteristics................................................................................................................... 51
5.6. AC Characteristics......................................................................................................................61
5.7. OSC20M Characteristics............................................................................................................63
5.8. OSCULP32K Characteristics..................................................................................................... 65

6. Ordering Information................................................................................................67

7. Online Package Drawings....................................................................................... 68

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 ATmega809/1609/3209/4809 – 48-pin

8. Package Drawings...................................................................................................69
8.1. 48-Pin TQFP.............................................................................................................................. 69
8.2. 48-Pin UQFN..............................................................................................................................73

9. Conventions.............................................................................................................77
9.1. Memory Size and Type...............................................................................................................77
9.2. Frequency and Time...................................................................................................................77

10. Data Sheet Revision History....................................................................................78

10.1. Rev.B - 03/2019..........................................................................................................................78
10.2. Rev. A - 02/2018.........................................................................................................................78

The Microchip Web Site................................................................................................ 79

Customer Change Notification Service..........................................................................79

Customer Support......................................................................................................... 79

Product Identification System........................................................................................ 80

Microchip Devices Code Protection Feature................................................................. 80

Legal Notice...................................................................................................................80

Trademarks................................................................................................................... 81

Quality Management System Certified by DNV.............................................................81

Worldwide Sales and Service........................................................................................82

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 4

 ATmega809/1609/3209/4809 – 48-pin
Block Diagram

1. Block Diagram

UPDI UPDI
CRC CPU
OCD

Flash
M M M
S
SRAM S BUS Matrix
EEPROM
S
S
NVMCTRL
I
N PAn
/ PBn
AINPn PORTS O
U
PCn
PDn
AINNn ACn T PEn
OUT
PFn
GPIOR D
AINn A
ADCn E D T
VREFA A
V A
E T B
A
N
B CPUINT U
Detectors/
T S
EVOUTx EVSYS U References
R S
RESET
O
U
System RST POR
LUTn-INn
LUTn-OUT CCL T Management
I BOD/
Bandgap
N RSTCTRL VLM
G
WOn TCAn CLKCTRL
N
E
T SLPCTRL
WO TCBn W
O Clock Generation
R
RXD K CLKOUT
TXD
XCK USARTn WDT
OSC20M
EXTCLK
XDIR
OSC32K
MISO
MOSI TOSC1
SCK SPIn RTC XOSC32K
SS

TOSC2
SDA (master)
SCL (master)
SDA (slave) TWIn
SCL (slave)

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 ATmega809/1609/3209/4809 – 48-pin
Pinout

2. Pinout

2.1 48-pin UQFN/TQFP

PA0 (EXTCLK)

UPDI
GND
VDD
PA3
PA2
PA4

PA1

PF6
PF5
PF4
PF3
44
43
42
41
40
39
38
37
48
47
46
45

PA5 1 36 PF2
PA6 2 35 PF1 (TOSC2)
PA7 3 34 PF0 (TOSC1)
PB0 4 33 PE3
PB1 5 32 PE2
PB2 6 31 PE1
PB3 7 30 PE0
PB4 8 29 GND
PB5 9 28 AVDD
PC0 10 27 PD7
PC1 11 26 PD6
PC2 12 25 PD5
13
14
15
16
17
18
19
20
21
22
23
24
PC3

PC4
PC5
PC6
PC7
PD0
PD1
PD2
PD3
PD4
GND
VDD

Power Functionality
Input supply Programming, debug

Ground Clock, crystal

GPIO on VDD power domain TWI

GPIO on AVDD power domain Digital functions only

Analog functions

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 ATmega809/1609/3209/4809 – 48-pin
I/O Multiplexing and Considerations

3. I/O Multiplexing and Considerations

3.1 Multiplexed Signals

UQFN48/ Pin name (1,2) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn
TQFP48

44 PA0 EXTCLK 0,TxD 0-WO0 0-IN0

45 PA1 0,RxD 0-WO1 0-IN1

46 PA2 TWI 0,XCK SDA(MS) 0-WO2 0-WO EVOUTA 0-IN2

47 PA3 TWI 0,XDIR SCL(MS) 0-WO3 1-WO 0-OUT

48 PA4 0,TxD(3) MOSI 0-WO4

1 PA5 0,RxD(3) MISO 0-WO5

2 PA6 0,XCK(3) SCK 0-OUT(3)

3 PA7 CLKOUT OUT 0,XDIR(3) SS EVOUTA(3)

4 PB0 3,TxD 0-WO0(3)

5 PB1 3,RxD 0-WO1(3)

6 PB2 3,XCK 0-WO2(3) EVOUTB

7 PB3 3,XDIR 0-WO3(3)

8 PB4 3,TxD(3) 0-WO4(3) 2-WO(3)

9 PB5 3,RxD(3) 0-WO5(3) 3-WO

10 PC0 1,TxD MOSI(3) 0-WO0(3) 2-WO 1-IN0

11 PC1 1,RxD MISO(3) 0-WO1(3) 3-WO(3) 1-IN1

12 PC2 TWI 1,XCK SCK(3) SDA(MS)(3) 0-WO2(3) EVOUTC 1-IN2

13 PC3 TWI 1,XDIR SS(3) SCL(MS)(3) 0-WO3(3) 1-OUT

14 VDD

15 GND

16 PC4 1,TxD(3) 0-WO4(3)

17 PC5 1,RxD(3) 0-WO5(3)

18 PC6 1,XCK(3) 1-OUT(3)

19 PC7 1,XDIR(3) EVOUTC(3)

20 PD0 AIN0 0-WO0(3) 2-IN0

21 PD1 AIN1 P3 0-WO1(3) 2-IN1

22 PD2 AIN2 P0 0-WO2(3) EVOUTD 2-IN2

23 PD3 AIN3 N0 0-WO3(3) 2-OUT

24 PD4 AIN4 P1 0-WO4(3)

25 PD5 AIN5 N1 0-WO5(3)

26 PD6 AIN6 P2 2-OUT(3)

27 PD7 VREFA AIN7 N2 EVOUTD(3)

28 AVDD

29 GND

30 PE0 AIN8 MOSI(3) 0-WO0(3)

31 PE1 AIN9 MISO(3) 0-WO1(3)

32 PE2 AIN10 SCK(3) 0-WO2(3) EVOUTE

33 PE3 AIN11 SS(3) 0-WO3(3)

34 PF0 TOSC1 2,TxD 0-WO0(3) 3-IN0

35 PF1 TOSC2 2,RxD 0-WO1(3) 3-IN1

36 PF2 TWI AIN12 2,XCK SDA(S)(3) 0-WO2(3) EVOUTF 3-IN2

37 PF3 TWI AIN13 2,XDIR SCL(S)(3) 0-WO3(3) 3-OUT

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I/O Multiplexing and Considerations

...........continued

UQFN48/ Pin name (1,2) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn
TQFP48

38 PF4 AIN14 2,TxD(3) 0-WO4(3) 0-WO(3)

39 PF5 AIN15 2,RxD(3) 0-WO5(3) 1-WO(3)

40 PF6 RESET 2,XCK(3) 3-OUT(3)

41 UPDI

42 VDD

43 GND

Note: 
1. Pin names are of type Pxn, with x being the PORT instance (A,B,C, ...) and n the pin number.
Notation for signals is PORTx_PINn. All pins can be used as event input.
2. All pins can be used for external interrupt, where pins Px2 and Px6 of each port have full
asynchronous detection.
3. Alternate pin positions. For selecting the alternate positions, refer to the PORTMUX documentation.

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 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

4. Electrical Characteristics

4.1 Disclaimer
All typical values are measured at T = 25°C and VDD = 3V unless otherwise specified. All minimum and
maximum values are valid across operating temperature and voltage unless otherwise specified.
Typical values given should be considered for design guidance only, and actual part variation around
these values is expected.

4.2 Absolute Maximum Ratings

Stresses beyond those listed in this section may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or other conditions beyond those indicated in
the operational sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Table 4-1. Absolute Maximum Ratings
Symbol Description Conditions Min. Max. Unit
VDD Power Supply Voltage -0.5 6 V
IVDD Current into a VDD pin TA=[-40, 85]°C - 200 mA
TA=[85, 125]°C - 100 mA
IGND Current out of a GND pin TA=[-40, 85]°C - 200 mA
TA=[85, 125]°C - 100 mA
VPIN Pin voltage with respect to GND -0.5 VDD+0.5 V
IPIN I/O pin sink/source current -40 40 mA
Ic1 (1) I/O pin injection current except for the RESET pin Vpin<GND-0.6V or -1 1 mA
5.5V<Vpin≤6.1V
4.9V<VDD≤5.5V
Ic2(1) I/O pin injection current except for the RESET pin Vpin<GND-0.6V or -15 15 mA
Vpin≤5.5V
VDD≤4.9V
Tstorage Storage temperature -65 150 °C

Note: 
1. – If VPIN is lower than GND-0.6V, then a current limiting resistor is required. The negative DC
injection current limiting resistor is calculated as R = (GND-0.6V – Vpin)/ICn.
– If VPIN is greater than VDD+0.6V, then a current limiting resistor is required. The positive DC
injection current limiting resistor is calculated as R = (Vpin-(VDD+0.6))/ICn.

4.3 General Operating Ratings

The device must operate within the ratings listed in this section in order for all other electrical
characteristics and typical characteristics of the device to be valid.

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 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

Table 4-2. General Operating Conditions

Symbol Description Condition Min. Max. Unit

VDD Operating Supply Voltage 1.8(1) 5.5 V
TA Operating temperature range -40 125 °C

Note: 
1. Operation is guaranteed down to 1.8V or VBOD with BODLEVEL0, whichever is lower.
Table 4-3. Operating Voltage and Frequency

Symbol Description Condition Min. Max. Unit

fCLK_CPU Nominal operating system clock frequency VDD=[1.8, 5.5]V 0 5 MHz
TA=[-40, 105]°C(1)(4)
VDD=[2.7, 5.5]V 0 10
TA=[-40, 105]°C(2)(4)
VDD=[4.5, 5.5]V 0 20
TA=[-40, 105]°C(3)(4)
VDD=[2.7, 5.5]V 0 8
TA=[-40, 125]°C(2)
VDD=[4.5, 5.5]V 0 16
TA=[-40, 125]°C(2)

Note: 
1. Operation is guaranteed down to BOD triggering level, VBOD with BODLEVEL0.
2. Operation is guaranteed down to BOD triggering level, VBOD with BODLEVEL2.
3. Operation is guaranteed down to BOD triggering level, VBOD with BODLEVEL7.
4. These specifications do not apply to automotive range parts (-VAO).
The maximum CPU clock frequency depends on VDD. As shown in the figure below, the Maximum
Frequency vs. VDD is linear between 1.8V < VDD < 2.7V and 2.7V < VDD < 4.5V.

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 10

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

Figure 4-1. Maximum Frequency vs. VDD for [-40, 105]°C

20MHz

10MHz
Safe Operating Area

5MHz

1.8V 2.7V 4.5V 5.5V

4.4 Power Considerations

The average die junction temperature, TJ (in °C) is given from the formula
TJ = TA+PD * RθJA
where PD is the total power dissipation.
The total thermal resistance of a package (RθJA) can be separated into two components, RθJC and RθCA,
representing the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)
and from the case to the outside ambient air (RθCA). These terms are related by the equation:
RθJA = RθJC + RθCA.
RθJC is device related and cannot be influenced by the user. However, RθCA is user dependent and can
be minimized by thermal management techniques such as heat sinks, ambient air cooling, and thermal
convection. Thus, good thermal management on the part of the user can significantly reduce RθCA so that
RθJA approximately equals RθJC.
The power dissipation curve is negatively sloped as ambient temperature increase. The maximum power
dissipation is therefore at minimum ambient temperature while the highest junction temperature occurs at
the maximum ambient temperature.
Table 4-4. Power Dissipation and Junction Temperature vs Temperature

Package TA Range RθJA (°C/W) PD (W) Typical TJ - TA(°C) Typical

UQFN48 -40°C to 125°C 1.0
TQFP48 -40°C to 125°C 1.0

4.5 Power Consumption

The values are measured power consumption under the following conditions, except where noted:
• VDD=3V
• TA=25°C
• OSC20M used as system clock source, except where otherwise specified

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 11

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

• System power consumption measured with peripherals disabled and I/O ports driven low with inputs
disabled
Table 4-5. Power Consumption in Active and Idle Mode

Mode Description Condition Typ. Max. Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 8.5 - mA
fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 4.3 - mA
VDD=3V 2.3 - mA
fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 2.2 - mA
VDD=3V 1.2 - mA
VDD=2V 0.75 - mA
fCLK_CPU=32.768 kHz (OSCULP32K) VDD=5V 16.4 - µA
VDD=3V 9.0 - µA
VDD=2V 6.0 - µA
Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 2.8 - mA
fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 1.4 - mA
VDD=3V 0.8 - mA
fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 0.7 - mA
VDD=3V 0.4 - mA
VDD=2V 0.25 - mA
fCLK_CPU=32.768 kHz (OSCULP32K) VDD=5V 5.6 - µA
VDD=3V 2.8 - µA
VDD=2V 1.8 - µA

Table 4-6. Power Consumption in Power-Down, Standby and Reset Mode

Mode Description Condition Typ. Max. Max. Unit

25°C 85°C(1) 125°C
Standby Standby power RTC running at 1.024 VDD=3V 0.7 - - µA
consumption kHz from external
XOSC32K (CL=7.5
pF)
RTC running at 1.024 VDD=3V 0.7 6.0 16.0 µA
kHz from internal
OSCULP32K

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 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

...........continued
Mode Description Condition Typ. Max. Max. Unit
25°C 85°C(1) 125°C
Power Power down/ All peripherals VDD=3V 0.1 5.0 15.0 µA
Down/ Standby power stopped
Standby consumption are the
same when all
peripherals are
stopped
Reset Reset power RESET line pulled low VDD=3V 100 - - µA
consumption

Note: 
1. These parameters are for design guidance only and are not tested.

4.6 Peripherals Power Consumption

The table below can be used to calculate the additional current consumption for the different I/O
peripherals in the various operating modes.
Some peripherals will request the clock to be enabled when operating in STANDBY. See the peripheral
chapter for further information.
Operating conditions:
• VDD=3V
• T=25°C
• OSC20M at 1 MHz used as system clock source, except where otherwise specified
• In Idle Sleep mode, except where otherwise specified
Table 4-7. Peripherals Power Consumption

Peripheral Conditions Typ.(1) Unit

BOD Continuous 19 µA
Sampling @ 1 kHz 1.2
TCA 16-bit count @ 1 MHz 13.0 µA
TCB 16-bit count @ 1 MHz 7.4 µA
RTC 16-bit count @ OSCULP32K 1.2 µA
WDT (including OSCULP32K) 0.7 µA
OSC20M 130 µA
AC Fast Mode(2) 92 µA
Low-Power Mode(2) 45 µA
ADC(3) 50 ksps 330 µA
100 ksps 340 µA

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 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

...........continued
Peripheral Conditions Typ.(1) Unit
XOSC32K CL=7.5 pF 0.5 µA
OSCULP32K 0.4 µA
USART Enable @ 9600 Baud 13.0 µA
SPI (Master) Enable @ 100 kHz 2.1 µA
TWI (Master) Enable @ 100 kHz 24.0 µA
TWI (Slave) Enable @ 100 kHz 17.0 µA
Flash programming Erase Operation 1.5 mA
Write Operation 3.0

Note: 
1. Current consumption of the module only. To calculate the total internal power consumption of the
microcontroller, add this value to the base power consumption given in “Power Consumption”
section in electrical characteristics.
2. CPU in Standby mode.
3. Average power consumption with ADC active in Free-Running mode.

4.7 BOD and POR Characteristics

Table 4-8. Power Supply Characteristics

Symbol Description Condition Min. Typ. Max. Unit

SRON(1) Power-on Slope - - 100(2) V/ms

Note: 
1. For design guidance only and not tested in production.
2. A slope faster than the maximum rating can trigger a reset of the device if changing the voltage
level after an initial power-up.
Table 4-9. Power-on Reset (POR) Characteristics

Symbol Description Condition Min. Typ. Max. Unit

VPOR POR threshold voltage on VDD VDD falls/rises at 0.5V/ms or slower 0.8(1) - 1.6(1) V
falling
POR threshold voltage on VDD 1.4(1) - 1.8
rising

Note: 
1. For design guidance only and not tested in production.

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 14

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

Table 4-10. Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min. Typ. Max. Unit

VBOD BOD detection level (falling/ BODLEVEL0 1.7 1.8 2.0 V
rising)
BODLEVEL2 2.4 2.6 2.9
BODLEVEL7 3.9 4.3 4.5
VHYS Hysteresis BODLEVEL0 - 25 - mV
BODLEVEL2 - 40 -
BODLEVEL7 - 80 -
tBOD Detection time Continuous - 7 - µs
Sampled, 1 kHz - 1 - ms
Sampled, 125 Hz - 8 -
tstartup Start-up time Time from enable to ready - 40 - µs
VINT Interrupt level 0 Percentage above the selected - 4 - %
BOD level
Interrupt level 1 - 13 -
Interrupt level 2 - 25 -

4.8 External Reset Characteristics

Table 4-11. External Reset Characteristics

Mode Description Condition Min. Typ. Max. Unit

VVIH_RST Input Voltage for RESET 0.7×VDD - VDD+0.2 V
VVIL_RST Input Low Voltage for RESET -0.2 - 0.3×VDD
tMIN_RST Minimum pulse width on RESET pin(1) - - 2.5 µs
Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note: 
1. These parameters are for design guidance only and are not production tested.

4.9 Oscillators and Clocks

Operating conditions:
• VDD=3V, except where specified otherwise
Table 4-12. 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min. Typ. Max. Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25°C, 3.0V 16 MHz
FREQSEL=1 20

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 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

...........continued
Symbol Description Condition Min. Typ. Max. Unit
fCAL Frequency calibration range OSC16M(2) 14.5 17.5 MHz
OSC20M(2) 18.5 21.5 MHz
ETOTAL Total error with 16 MHz and 20 From target TA=25°C, 3.0V -1.5 1.5 %
MHz frequency selection frequency
TA=[0, 70]°C, -2.0 2.0 %
VDD=[1.8, 3.6]V
Full operation -4.0 4.0
range
EDRIFT Accuracy with 16 MHz and 20 Factory calibrated TA=[0, 70]°C, -1.8 1.8 %
MHz frequency selection VDD=3V(1) VDD=[1.8, 5.5]V
relative to the factory-stored
frequency value
ΔfOSC20M Calibration step size - 0.75 - %
DOSC20M Duty cycle - 50 - %
tstartup Start-up time Within 2% - 12 - µs
accuracy

Note: 
1. See also the description of OSC20M on calibration.
2. Oscillator Frequencies above speed specification must be divided so the CPU clock is always
within specification.
Table 4-13. 32.768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min. Typ. Max. Unit

fOSCULP32K Factory calibration frequency 32.768 kHz
Factory calibration accuracy TA=25°C, 3.0V -3 3 %
ETOTAL Total error from target frequency TA=[0, 70]°C, VDD=[1.8, 3.6]V -10 +10 %
Full operation range -20 +20
DOSCULP32K Duty cycle 50 %
tstartup Start-up time - 250 - µs

Table 4-14. 32.768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min. Typ. Max. Unit

fout Frequency - 32.768 - kHz
tstartup Start-up time CL=7.5 pF - 300 - ms
CL Crystal load capacitance(1) 7.5 - 12.5 pF
CTOSC1/TOSC2 Parasitic pin capacitance - 5.5 - pF

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 16

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

...........continued
Symbol Description Condition Min. Typ. Max. Unit
ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=7.5 pF - - 80 kΩ

CL=12.5 pF - - 40
 

Note: 
1. This parameter is for design guidance only and not production tested.
Figure 4-2. External Clock Waveform Characteristics

V IH1

V IL1

Table 4-15. External Clock Characteristics

Symbol Description Condition VDD=[1.8, 5.5]V VDD=[2.7, 5.5]V VDD=[4.5, 5.5]V Unit
Min. Max. Min. Max. Min. Max.
fCLCL Frequency 0 5.0 0.0 10.0 0.0 20.0 MHz
tCLCL Clock Period 200 - 100 - 50 - ns
tCHCX(1) High Time 80 - 40 - 20 - ns
tCLCX(1) Low Time 80 - 40 - 20 - ns
tCLCH(1) Rise Time (for - 40 - 20 - 10 ns

maximum frequency)
tCHCL(1) Fall Time (for maximum - 40 - 20 - 10 ns

frequency)
ΔtCLCL(1) Change in period from - 20 - 20 - 20 %
one clock cycle to the
next

Note: 
1. This parameter is for design guidance only and not production tested.

4.10 I/O Pin Characteristics

Table 4-16. I/O Pin Characteristics (TA=[-40, 85]°C, VDD=[1.8, 5.5]V unless otherwise noted)

Symbol Description Condition Min. Typ. Max. Unit

VIL Input Low Voltage -0.2 - 0.3×VDD V
VIH Input High Voltage 0.7×VDD - VDD+0.2V V

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 17

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

...........continued
Symbol Description Condition Min. Typ. Max. Unit
IIH / IIL I/O pin Input Leakage Current VDD=5.5V, pin high - < 0.05 - µA
VDD=5.5V, pin low - < 0.05 -
VOL I/O pin drive strength VDD=1.8V, IOL=1.5 mA - - 0.36 V
VDD=3.0V, IOL=7.5 mA - - 0.6
VDD=5.0V, IOL=15 mA - - 1
VOH I/O pin drive strength VDD=1.8V, IOH=1.5 mA 1.44 - - V
VDD=3.0V, IOH=7.5 mA 2.4 - -
VDD=5.0V, IOH=15 mA 4 - -
Itotal Maximum combined I/O sink/ TA=125°C - - 100 mA
source current per pin group(1,2)
Maximum combined I/O sink/ TA=25°C - - 200
source current per pin group(1,2)
tRISE Rise time VDD=3.0V, load=20 pF - 2.5 - ns
VDD=5.0V, load=20 pF - 1.5 -
VDD=3.0V, load=20 pF, - 19 -
slew rate enabled
VDD=5.0V, load=20 pF, - 9 -
slew rate enabled
tFALL Fall time VDD=3.0V, load=20 pF - 2.0 - ns
VDD=5.0V, load=20 pF - 1.3 -
VDD=3.0V, load=20 pF, - 21 -
slew rate enabled
VDD=5.0V, load=20 pF, - 11 -
slew rate enabled
Cpin I/O pin capacitance except for - 3.5 - pF
TOSC, VREFA, and TWI pins
Cpin I/O pin capacitance on TOSC pins - 4 - pF
Cpin I/O pin capacitance on TWI pins - 10 - pF
Cpin I/O pin capacitance on VREFA pin - 14 - pF
Rp Pull-up resistor 20 35 50 kΩ

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 18

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

Note: 
1. Pin group A (PA[7:0]), PF[6:2]), pin group B (PB[7:0], PC[7:0]), pin group C (PD:7:0, PE[3:0],
PF[1:0]). For 28-pin and 32-pin devices pin group A and B should be seen as a single group. The
combined continuous sink/source current for each individual group should not exceed the limits.
2. These parameters are for design guidance only and are not production tested.

4.11 USART
Figure 4-3. USART in SPI Mode - Timing Requirements in Master Mode
SS

tMOS tSCKR tSCKF

SCK
(CPOL = 0)

tSCKW
SCK
(CPOL = 1)
tSCKW
tMIS tMIH tSCK

MISO
MSb LSb
(Data Input)

tMOH tMOH

MOSI
(Data Output) MSb LSb

Table 4-17. USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min. Typ. Max. Unit

fSCK SCK clock frequency Master - - 10 MHz
tSCK SCK period Master 100 - - ns
tSCKW SCK high/low width Master - 0.5×tSCK - ns
tSCKR SCK rise time Master - 2.7 - ns
tSCKF SCK fall time Master - 2.7 - ns
tMIS MISO setup to SCK Master - 10 - ns
tMIH MISO hold after SCK Master - 10 - ns
tMOS MOSI setup to SCK Master - 0.5×tSCK - ns
tMOH MOSI hold after SCK Master - 1.0 - ns

Note: 
1. These parameters are for design guidance only and are not production tested.

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 19

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

4.12 SPI
Figure 4-4. SPI - Timing Requirements in Master Mode
SS

tMOS tSCKR tSCKF

SCK
(CPOL = 0)

tSCKW
SCK
(CPOL = 1)
tSCKW
tMIS tMIH tSCK

MISO
MSb LSb
(Data Input)

tMOH tMOH

MOSI
(Data Output) MSb LSb

Figure 4-5. SPI - Timing Requirements in Slave Mode

SS

tSSS tSSCKR tSSCKF

tSSH

SCK
(CPOL = 0)

tSSCKW
SCK
(CPOL = 1)
tSSCKW
tSIS tSIH tSSCK

MOSI
MSb LSb
(Data Input)

tSOSS tSOS tSOSH

MISO
(Data Output) MSb LSb

Table 4-18. SPI - Timing Characteristics

Symbol(1) Description Condition Min. Typ. Max. Unit

fSCK SCK clock frequency Master - - 10 MHz
tSCK SCK period Master 100 - - ns
tSCKW SCK high/low width Master - 0.5*SCK - ns
tSCKR SCK rise time Master - 2.7 - ns
tSCKF SCK fall time Master - 2.7 - ns
tMIS MISO setup to SCK Master - 10 - ns
tMIH MISO hold after SCK Master - 10 - ns
tMOS MOSI setup to SCK Master - 0.5*SCK - ns
tMOH MOSI hold after SCK Master - 1.0 - ns

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 20

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

...........continued
Symbol(1) Description Condition Min. Typ. Max. Unit
fSSCK Slave SCK clock frequency Slave - - 5 MHz
tSSCK Slave SCK period Slave 4*t Clkper - - ns
tSSCKW SCK high/low width Slave 2*t Clkper - - ns
tSSCKR SCK rise time Slave - - 1600 ns
tSSCKF SCK fall time Slave - - 1600 ns
tSIS MOSI setup to SCK Slave 3.0 - - ns
tSIH MOSI hold after SCK Slave t Clkper - - ns
tSSS SS setup to SCK Slave 21 - - ns
tSSH SS hold after SCK Slave 20 - - ns
tSOS MISO setup to SCK Slave - 8.0 - ns
tSOH MISO hold after SCK Slave - 13 - ns
tSOSS MISO setup after SS low Slave - 11 - ns
tSOSH MISO hold after SS low Slave - 8.0 - ns

Note: 
1. These parameters are for design guidance only and are not production tested.

4.13 TWI
Figure 4-6. TWI - Timing Requirements
t of t HIGH tr

t LOW t LOW

SCL
t SU;STA t HD;STA t HD;DAT t SU;DAT
t SU;STO
SDA

t BUF

Table 4-19. TWI - Timing Characteristics

Symbol(1) Description Condition Min. Typ. Max. Unit

fSCL SCL clock Max. frequency requires 0 - 1000 kHz
frequency system clock at 10 MHz,
which, in turn, requires
VDD=[2.7, 5.5]V and T=[-40,
105]°C
VIH Input high voltage 0.7×VDD - - V
VIL Input low voltage - - 0.3×VDD V

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 21

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

...........continued
Symbol(1) Description Condition Min. Typ. Max. Unit
VHYS Hysteresis of 0.1×VDD 0.4×VDD V
Schmitt trigger
inputs
VOL Output low voltage Iload=20 mA, Fast mode+ - - 0.2xVDD V
Iload=3 mA, Normal mode, - - 0.4V
VDD>2V
Iload=3 mA, Normal mode, - - 0.2×VDD
VDD≤2V
IOL Low-level output fSCL≤400 kHz, VOL=0.4V 3 - - mA
current
fSCL≤1 MHz, VOL=0.4V 20 - -
CB Capacitive load for fSCL≤100 kHz - - 400 pF
each bus line
fSCL≤400 kHz - - 400
fSCL≤1 MHz - - 550
tR Rise time for both fSCL≤100 kHz - - 1000 ns
SDA and SCL
fSCL≤400 kHz 20 - 300
fSCL≤1 MHz - - 120
tOF Output fall time 10 pF < fSCL≤400 20+0.1×CB - 300 ns
from VIHmin to capacitance of kHz
VILmax bus line < 400
fSCL≤1 MHz 20+0.1×CB - 120
pF
tSP Spikes suppressed 0 - 50 ns
by the input filter
IL Input current for 0.1×VDD<VI<0.9×VDD - - 1 µA
each I/O pin
CI Capacitance for - - 10 pF
each I/O pin
RP Value of pull-up fSCL≤100 kHz (VDD- - 1000 ns/ Ω
resistor VOL(max)) /I (0.8473×CB)
OL

fSCL≤400 kHz - - 300 ns/

(0.8473×CB)
fSCL≤1 MHz - - 120 ns/
(0.8473×CB)
tHD;STA Hold time fSCL≤100 kHz 4.0 - - µs
(repeated) Start
fSCL≤400 kHz 0.6 - -
condition
fSCL≤1 MHz 0.26 - -

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 22

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

...........continued
Symbol(1) Description Condition Min. Typ. Max. Unit
tLOW Low period of SCL fSCL≤100 kHz 4.7 - - µs
Clock
fSCL≤400 kHz 1.3 - -
fSCL≤1 MHz 0.5 - -
tHIGH High period of SCL fSCL≤100 kHz 4.0 - - µs
Clock
fSCL≤400 kHz 0.6 - -
fSCL≤1 MHz 0.26 - -
tSU;STA Setup time for a fSCL≤100 kHz 4.7 - - µs
repeated Start
fSCL≤400 kHz 0.6 - -
condition
fSCL≤1 MHz 0.26 - -
tHD;DAT Data hold time fSCL≤100 kHz 0 - 3.45 µs
fSCL≤400 kHz 0 - 0.9
fSCL≤1 MHz 0 - 0.45
tSU;DAT Data setup time fSCL≤100 kHz 250 - - ns
fSCL≤400 kHz 100 - -
fSCL≤1 MHz 50 - -
tSU;STO Setup time for fSCL≤100 kHz 4 - - µs
Stop condition
fSCL≤400 kHz 0.6 - -
fSCL≤1 MHz 0.26 - -
tBUF Bus free time fSCL≤100 kHz 4.7 - - µs
between a Stop
f ≤400 kHz 1.3 - -
and Start condition SCL
fSCL≤1 MHz 0.5 - -

Note: 
1. These parameters are for design guidance only and are not production tested.

4.14 VREF
Table 4-20. Internal Voltage Reference Characteristics

Symbol(1) Description Min. Typ. Max. Unit

tstart Start-up time - 25 - µs

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 23

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

...........continued
Symbol(1) Description Min. Typ. Max. Unit
VDD Power supply voltage range for 0V55 1.8 - 5.5 V
Power supply voltage range for 1V1 1.8 - 5.5
Power supply voltage range for 1V5 1.8 - 5.5
Power supply voltage range for 2V5 3.0 - 5.5
Power supply voltage range for 4V3 4.8 - 5.5

Note: 
1. These parameters are for design guidance only and are not production tested.
Table 4-21. ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min. Typ. Max. Unit

1V1 Internal reference voltage VDD=[1.8V, 5.5V] -2.0 2.0 %
T=[0 - 105]°C
0V55 Internal reference voltage VDD=[1.8V, 5.5V] -3.0 3.0
1V5 T=[0 - 105]°C
2V5
4V3
0V55 Internal reference voltage VDD=[1.8V, 5.5V] -5.0 5.0
1V1 T=[-40 - 125]°C
1V5
2V5
4V3

Note: 
1. These values are based on characterization and not covered by production test limits.
2. The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREF.CTRLA
register.
Table 4-22. AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min. Typ. Max. Unit

0V55 Internal reference voltage VDD=[1.8V, 5.5V] -3.0 3.0 %
1V1 T=[0 - 105]°C
1V5
2V5
0V55 Internal reference voltage VDD=[1.8V, 5.5V] -5.0 5.0
1V1 T=[-40 - 125]°C
1V5
2V5
4V3

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 24

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

Note: 
1. These values are based on characterization and not covered by production test limits.
2. The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREF.CTRLA
register.

4.15 ADC

4.15.1 Internal Reference Characteristics

Operating conditions:
• VDD = 1.8 to 5.5V
• Temperature = -40°C to 125°C
• DUTYCYC = 25%
• CLKADC = 13 * fADC
• SAMPCAP is 10 pF for 0.55V reference, while it is set to 5 pF for VREF≥1.1V
• Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted
Table 4-23. Power Supply, Reference, and Input Range

Symbol Description Conditions Min. Typ. Max. Unit

VDD Supply voltage CLKADC ≤1.5 MHz 1.8 - 5.5 V
CLKADC >1.5 MHz 2.7 - 5.5
VREF Reference voltage REFSEL = Internal reference 0.55 - VDD-0.5 V
REFSEL = External reference 1.1 VDD
REFSEL = VDD 1.8 - 5.5
CIN Input capacitance SAMPCAP=5 pF - 5 - pF
SAMPCAP=10 pF - 10 -
VIN Input voltage range 0 - VREF V
IBAND Input bandwidth 1.1V≤VREF - - 57.5 kHz

Table 4-24. Clock and Timing Characteristics(1)

Symbol Description Conditions Min. Typ. Max. Unit

fADC Sample rate 1.1V≤VREF 15 - 115 ksps
1.1V≤VREF (8-bit resolution) 15 - 150
VREF=0.55V (10 bits) 7.5 - 20
CLKADC Clock frequency VREF=0.55V (10 bits) 100 - 260 kHz
1.1V≤VREF (10 bits) 200 - 1500
1.1V≤VREF (8-bit resolution) 200 - 2000
Ts Sampling time 2 2 33 CLKADC cycles
TCONV Conversion time (latency) Sampling time = 2 CLKADC 8.7 - 50 µs

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 25

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

...........continued
Symbol Description Conditions Min. Typ. Max. Unit
TSTART Start-up time Internal VREF - 22 - µs

Note: 
1. These parameters are for design guidance only and are not production tested.
Table 4-25. Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min. Typ. Max. Unit

Res Resolution - 10 - bit
INL Integral Non- REFSEL = fADC=7.7 ksps - 1.0 - LSB
linearity INTERNAL
VREF=0.55V
REFSEL = fADC=15 ksps - 1.0 -
INTERNAL or VDD
REFSEL = fADC=77 ksps - 1.0 -
INTERNAL or VDD
fADC=115 ksps - 1.2 -
1.1V≤VREF
DNL(1) Differential REFSEL = fADC=7.7 ksps - 0.6 - LSB
Non-linearity INTERNAL
VREF = 0.55V
REFSEL = fADC=15 ksps - 0.4 -
INTERNAL
VREF = 1.1V
REFSEL = fADC=15 ksps - 0.4 -
INTERNAL or VDD
1.5V≤VREF
REFSEL = fADC=77 ksps - 0.4 -
INTERNAL or VDD
1.1V≤VREF
REFSEL = fADC=115 ksps - 0.5 -
INTERNAL
1.1V≤VREF
REFSEL = VDD fADC=115 ksps - 0.9 -
1.8V≤VREF

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 26

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

...........continued
Symbol Description Conditions Min. Typ. Max. Unit
EABS Absolute REFSEL = T=[0-105]°C - <10 - LSB
accuracy INTERNAL
VDD = [1.8V-3.6V]
VREF = 1.1V
VDD = [1.8V-3.6V] - <15 -
REFSEL = VDD - 2.5 -
REFSEL = - <35 -
INTERNAL
EGAIN Gain error REFSEL = T=[0-105]°C - ±15 - LSB
INTERNAL
VDD = [1.8V-3.6V]
VREF = 1.1V
VDD = [1.8V-3.6V] - ±20 -
REFSEL = VDD - 2 -
REFSEL = - ±35 -
INTERNAL
EOFF Offset error REFSEL = - -1 - LSB
INTERNAL
VREF = 0.55V
REFSEL = - -0.5 - LSB
INTERNAL
1.1V ≤ VREF

Note: 
1. A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing
codes.
2. These parameters are for design guidance only and are not production tested.
3. Reference setting and fADC must fulfill the specification in “Clock and Timing Characteristics” and
“Power supply, Reference, and Input Range” tables.

4.15.2 External Reference Characteristics

Operating conditions:
• VDD = 1.8 to 5.5V
• Temperature = -40°C to 125°C
• DUTYCYC = 25%
• CLKADC = 13 * fADC
• SAMPCAP is 5 pF
The accuracy characteristics numbers are based on the characterization of the following input reference
levels and VDD ranges:
• Vref = 1.8V, VDD = 1.8 to 5.5V
• Vref = 2.6V, VDD = 2.7 to 5.5V
• Vref = 4.096V, VDD = 4.5 to 5.5V

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 27

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

• Vref = 4.3V, VDD = 4.5 to 5.5V

Table 4-26. ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min. Typ. Max. Unit

Res Resolution - 10 - bit
INL Integral Non- fADC=15 ksps - 0.9 - LSB
linearity
fADC=77 ksps - 0.9 -
fADC=115 ksps - 1.2 -
DNL(1) Differential fADC=15 ksps - 0.2 - LSB
Non-linearity
fADC=77 ksps - 0.4 -
fADC=115 ksps - 0.8 -
EABS Absolute fADC=15 ksps - 2 - LSB
accuracy
fADC=77 ksps - 2 -
fADC=115 ksps - 2 -
EGAIN Gain error fADC=15 ksps - 2 - LSB
fADC=77 ksps - 2 -
fADC=115 ksps - 2 -
EOFF Offset error - -0.5 - LSB

Note: 
1. A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing
codes.
2. These parameters are for design guidance only and are not production tested.

4.16 AC
Table 4-27. Analog Comparator Characteristics, Low-Power Mode Disabled

Symbol Description Condition Min. Typ. Max. Unit

VIN Input voltage -0.2 - VDD V
CIN Input pin capacitance PD1 to PD6 - 3.5 - pF
PD7 - 14 -
VOFF Input offset voltage 0.7V<VIN<(VDD-0.7V) -20 ±5 +20 mV
VIN=[-0.2V, VDD] -40 ±20 +40
IL Input leakage current - 5 - nA
TSTART Start-up time - 1.3 - µs

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 28

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

...........continued
Symbol Description Condition Min. Typ. Max. Unit
VHYS Hysteresis HYSMODE=0x0 - 0 - mV
HYSMODE=0x1 - 10 -
HYSMODE=0x2 - 25 -
HYSMODE=0x3 - 50 -
tPD Propagation delay 25 mV Overdrive, VDD≥2.7V - 50 - ns

Table 4-28. Analog Comparator Characteristics, Low-Power Mode Enabled

Symbol Description Condition Min. Typ. Max. Unit

VIN Input voltage -0.2 - VDD V
CIN Input pin capacitance PD1 to PD6 - 3.5 - pF
PD7 - 14 -
VOFF Input offset voltage 0.7V<VIN<(VDD-0.7V) -30 ±10 +30 mV
VIN=[0V, VDD] -50 ±30 +50
IL Input leakage current - 5 - nA
TSTART Start-up time - 1.3 - µs
VHYS Hysteresis HYSMODE=0x0 - 0 - mV
HYSMODE=0x1 - 10 -
HYSMODE=0x2 - 25 -
HYSMODE=0x3 - 50 -
tPD Propagation delay 25 mV overdrive, VDD≥2.7V - 150 - ns

4.17 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min. Max. Unit

TRES Duration of Handshake/Break on RESET 10 200 µs
TUPDI Duration of UPDI.txd=0 10 200 µs
TDeb0 Duration of Debugger.txd=0 0.2 1 µs
TDebZ Duration of Debugger.txd=z 200 14000 µs

Note: 
1. These parameters are for design guidance only and are not production tested.

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 29

 ATmega809/1609/3209/4809 – 48-pin
Electrical Characteristics

4.18 Programming Time

See the table below for typical programming times for Flash and EEPROM.
Table 4-29. Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles
Page Write 2 ms
Page Erase 2 ms
Page Erase-Write 4 ms
Chip Erase 4 ms
EEPROM Erase 4 ms

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 30

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

5. Typical Characteristics

5.1 Power Consumption

5.1.1 Supply Currents in Active Mode

Figure 5-1.  Active Supply Current vs. Frequency (1-20 MHz) at T=25°C
12.0 VDD [V]
1.8
11.0 2.2
10.0 2.7
3
9.0 3.6
4.2
8.0 5
7.0 5.5

6.0

5.0

4.0

3.0

2.0

1.0

0.0
0 2 4 6 8 10 12 14 16 18 20
Frequency [MHz]

Figure 5-2.  Active Supply Current vs. Frequency [0.1, 1.0] MHz at T=25°C
600 VDD [V]
1.8
550 2.2
500 2.7
3
450 3.6
4.2
400 5
350 5.5

300

250

200

150

100

50

0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Frequency [MHz]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 31

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-3.  Active Supply Current vs. Temperature (f=20 MHz OSC20M)
12.0 VDD [V]
4.5
11.0 5
10.0 5.5

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0
-40 -20 0 20 40 60 80 100 120
Temperature [°C]

Figure 5-4.  Active Supply Current vs. VDD (f=[1.25, 20] MHz OSC20M) at T=25°C
12.0 Frequency [MHz]
1.25
11.0 2.5
10.0 5
10
9.0 20

8.0

7.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 32

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-5. Active Supply Current vs. VDD (f=32.768 kHz OSCULP32K)

32 Temperature [°C]
-40
-20
28
0
25
24 70
85
105
20
125

16

12

0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

5.1.2 Supply Currents in Idle Mode

Figure 5-6.  Idle Supply Current vs. Frequency (1-20 MHz) at T=25°C
5.0 VDD [V]
1.8
4.5 2.2
2.7
4.0 3
3.6
3.5 4.2
5
3.0 5.5

2.5

2.0

1.5

1.0

0.5

0.0
0 2 4 6 8 10 12 14 16 18 20
Frequency [MHz]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 33

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-7.  Idle Supply Current vs. Low Frequency (0.1-1.0 MHz) at T=25°C
250 VDD [V]
1.8
225 2.2
2.7
200 3
3.6
175 4.2
5
150 5.5

125

100

75

50

25

0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Frequency [MHz]

Figure 5-8.  Idle Supply Current vs. Temperature (f=20 MHz OSC20M)
5.0 VDD [V]
4.5
4.5 5
5.5
4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0
-40 -20 0 20 40 60 80 100 120
Temperature [°C]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 34

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-9.  Idle Supply Current vs. VDD (f=32.768 kHz OSCULP32K)
20 Temperature [°C]
-40
18 -20
0
16 25
70
14 85
105
12 125

10

0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

5.1.3 Supply Currents in Power-Down Mode

Figure 5-10.  Power-Down Mode Supply Current vs. Temperature (all functions disabled)
8.0 VDD [V]
1.8
2.2
7.0
2.7
3
6.0 3.6
4.2
5
5.0
5.5

4.0

3.0

2.0

1.0

0.0
-40 -20 0 20 40 60 80 100 120
Temperature [°C]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 35

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-11.  Power-Down Mode Supply Current vs. VDD (all functions disabled)
8.0 Temperature [°C]
-40
-20
7.0
0
25
6.0 70
85
105
5.0
125

4.0

3.0

2.0

1.0

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

Figure 5-12.  Power-Down Mode Supply Current vs. VDD (all functions disabled)
8.0 Temperature [°C]
-40
-20
7.0
0
25
6.0 70
85
105
5.0
125

4.0

3.0

2.0

1.0

0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 36

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

5.1.4 Supply Currents in Standby Mode

Figure 5-13.  Standby Mode Supply Current vs. VDD (RTC running with internal OSCULP32K)
10.0 Temperature [°C]
-40
9.0 -20
0
8.0 25
70
7.0 85
105
6.0 125

5.0

4.0

3.0

2.0

1.0

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

Figure 5-14.  Standby Mode Supply Current vs. VDD (Sampled BOD running at 125 Hz)
10.0 Temperature [°C]
-40
9.0 -20
0
8.0 25
70
7.0 85
105
6.0 125

5.0

4.0

3.0

2.0

1.0

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 37

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-15.  Standby Mode Supply Current vs. VDD (Sampled BOD running at 1 kHz)
10.0 Temperature [°C]
-40
9.0 -20
0
8.0 25
70
7.0 85
105
6.0 125

5.0

4.0

3.0

2.0

1.0

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

5.1.5 Power-on Supply Currents

Figure 5-16. Power-on Supply Current vs. VDD (BOD enabled at 4.3V level)
400 Temperature [°C]
-40
360 -20
0
320 25
70
280 85
105
240 125

200

160

120

80

40

0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 38

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

5.2 GPIO

GPIO Input Characteristics

Figure 5-17. I/O Pin Input Hysteresis vs. VDD
2.0 Temperature[°C]
-40
1.8 0
25
1.6 70
85
1.4
105
1.2 125
Threshold [V]

1.0

0.8

0.6

0.4

0.2

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

Figure 5-18. I/O Pin Input Threshold Voltage vs. VDD (T=25°C)

75 Treshold
Vih
70 Vil

65

60

55
Threshold [%]

50

45

40

35

30

25
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 39

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-19. I/O Pin Input Threshold Voltage vs. VDD (VIH)

75 Temperature[°C]
-40
70 0
25
65 70
85
60
105
55 125
Threshold [%]

50

45

40

35

30

25
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

Figure 5-20. I/O Pin Input Threshold Voltage vs. VDD (VIL)

75 Temperature[°C]
-40
70 0
25
65 70
85
60
105
55 125
Threshold [%]

50

45

40

35

30

25
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 40

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

GPIO Output Characteristics

Figure 5-21. I/O Pin Output Voltage vs. Sink Current (VDD=1.8V)
0.50 Temperature[°C]
-40
0.45 -20
0
0.40 25
70
0.35
85
0.30 105
Voutput[V]

125
0.25

0.20

0.15

0.10

0.05

0.00
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Sink current [mA]

Figure 5-22. I/O Pin Output Voltage vs. Sink Current (VDD=3.0V)

0.50 Temperature [°C]
-40
0.45 -20
0
0.40 25
70
0.35 85
105
0.30 125

0.25

0.20

0.15

0.10

0.05

0.00
0 1 2 3 4 5 6 7 8 9 10
Sink current [mA]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 41

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-23. I/O Pin Output Voltage vs. Sink Current (VDD=5.0V)

1.0 Temperature [°C]
-40
0.9 -20
0
0.8 25
70
0.7 85
105
0.6 125

0.5

0.4

0.3

0.2

0.1

0.0
0 2 4 6 8 10 12 14 16 18 20
Sink current [mA]

Figure 5-24. I/O Pin Output Voltage vs. Sink Current (T=25°C)

1.0 Vdd [V]
1.8
0.9 2
2.2
0.8 3
4
0.7
5
0.6
Voutput[V]

0.5

0.4

0.3

0.2

0.1

0.0
0 2 4 6 8 10 12 14 16 18 20
Sink current [mA]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 42

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-25. I/O Pin Output Voltage vs. Source Current (VDD=1.8V)

1.80 Temperature [°C]
-40
1.75 -20
0
1.70 25
70
1.65 85
105
1.60 125

1.55

1.50

1.45

1.40

1.35

1.30
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Source current [mA]

Figure 5-26. I/O Pin Output Voltage vs. Source Current (VDD=3.0V)

3.0 Temperature [°C]
-40
2.9 -20
0
2.8 25
70
2.7 85
105
2.6 125

2.5

2.4

2.3

2.2

2.1

2.0
0 1 2 3 4 5 6 7 8 9 10
Source current [mA]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 43

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-27. I/O Pin Output Voltage vs. Source Current (VDD=5.0V)

5.0 Temperature [°C]
-40
4.9 -20
0
4.8 25
70
4.7 85
105
4.6 125

4.5

4.4

4.3

4.2

4.1

4.0
0 2 4 6 8 10 12 14 16 18 20
Source current [mA]

Figure 5-28. I/O Pin Output Voltage vs. Source Current (T=25°C)

5.0 Vdd [V]
1.8
4.5 2
2.2
4.0 3
4
3.5
5
3.0
Voutput[V]

2.5

2.0

1.5

1.0

0.5

0.0
0 2 4 6 8 10 12 14 16 18 20
Source current [mA]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 44

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

GPIO Pull-Up Characteristics

Figure 5-29. I/O Pin Pull-Up Resistor Current vs. Input Voltage (VDD=1.8V)
2.0 Temperature [°C]
-40
-20
1.8
0
25
1.5 70
85
105
1.3
125

1.0

0.8

0.5

0.3

0.0
0 5 10 15 20 25 30 35 40 45 50
Pull-up resistor current [µA]

Figure 5-30. I/O Pin Pull-Up Resistor Current vs. Input Voltage (VDD=3.0V)
3.0 Temperature [°C]
-40
-20
2.8
0
25
2.5 70
85
105
2.3
125

2.0

1.8

1.5

1.3

1.0
0 5 10 15 20 25 30 35 40 45 50
Pull-up resistor current [µA]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 45

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-31. I/O Pin Pull-Up Resistor Current vs. Input Voltage (VDD=5.0V)
5.0 Temperature [°C]
-40
-20
4.8
0
25
4.5 70
85
105
4.3
125

4.0

3.8

3.5

3.3

3.0
0 5 10 15 20 25 30 35 40 45 50
Pull-up resistor current [µA]

5.3 VREF Characteristics

Figure 5-32. Internal 0.55V Reference vs. Temperature
1.0 Vdd [V]
2
0.8 3
5
0.6

0.4

0.2
Vref error [%]

0.0

-0.2

-0.4

-0.6

-0.8

-1.0
-40 -20 0 20 40 60 80 100 120
Temperature [°C]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 46

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-33. Internal 1.1V Reference vs. Temperature

1.0 Vdd [V]
2
0.8 3
5
0.6

0.4

0.2
Vref error [%]

0.0

-0.2

-0.4

-0.6

-0.8

-1.0
-40 -20 0 20 40 60 80 100 120
Temperature [°C]

Figure 5-34. Internal 2.5V Reference vs. Temperature

1.0 Vdd [V]
3
0.8 5

0.6

0.4

0.2
Vref error [%]

0.0

-0.2

-0.4

-0.6

-0.8

-1.0
-40 -20 0 20 40 60 80 100 120
Temperature [°C]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 47

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-35. Internal 4.3V Reference vs. Temperature

1.0 Vdd [V]
5
0.8

0.6

0.4

0.2
Vref error [%]

0.0

-0.2

-0.4

-0.6

-0.8

-1.0
-40 -20 0 20 40 60 80 100 120
Temperature [°C]

5.4 BOD Characteristics

BOD Current vs. VDD

Figure 5-36. BOD Current vs. VDD (Continuous Mode Enabled)
50 Temperature [°C]
-40
45 0
25
40 70
85
35
105
30 125
Idd [µA]

25

20

15

10

0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 48

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-37. BOD Current vs. VDD (Sampled BOD at 125 Hz)

5.0 Temperature [°C]
-40
4.5 0
25
4.0 70
85
3.5
105
3.0 125
Idd [µA]

2.5

2.0

1.5

1.0

0.5

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

Figure 5-38. BOD Current vs. VDD (Sampled BOD at 1 kHz)

5.0 Temperature [°C]
-40
4.5 0
25
4.0 70
85
3.5
105
3.0 125
Idd [µA]

2.5

2.0

1.5

1.0

0.5

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 49

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

BOD Threshold vs. Temperature

Figure 5-39. BOD Threshold vs. Temperature (Level 1.8V)
1.90
Falling VDD
1.88 Rising VDD

1.86

1.84

1.82
BOD level [V]

1.80

1.78

1.76

1.74

1.72

1.70
-40 -20 0 20 40 60 80 100 120
Temperature [°C]

Figure 5-40. BOD Threshold vs. Temperature (Level 2.6V)

2.74 Falling VDD

Rising VDD
2.72

2.70

2.68
BOD level [V]

2.66

2.64

2.62

2.60

2.58

2.56

-40 -20 0 20 40 60 80 100 120

Temperature [°C]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 50

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-41. BOD Threshold vs. Temperature (Level 4.3V)

4.34 Falling VDD

Rising VDD
4.32

4.30

4.28
BOD level [V]

4.26

4.24

4.22

4.20

4.18

4.16

-40 -20 0 20 40 60 80 100 120

Temperature [°C]

5.5 ADC Characteristics

Figure 5-42. Absolute Accuracy vs. VDD (fADC=115 ksps) at T=25°C, REFSEL = Internal Reference
10.0 Vref [V]
1.1
9.0 1.5
2.5
8.0 4.3
VDD
7.0
Absolute Accuracy [LSb]

6.0

5.0

4.0

3.0

2.0

1.0

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 51

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-43. Absolute Accuracy vs. Vref (VDD=5.0V, fADC=115 ksps), REFSEL = Internal Reference
10.0 Temperature [°C]
-40
9.0 25
85
8.0 105

7.0
Absolute Accuracy [LSb]

6.0

5.0

4.0

3.0

2.0

1.0

0.0
1.1 1.5 2.5 4.3 VDD
Vref [V]

Figure 5-44. DNL Error vs. VDD (fADC=115 ksps) at T=25°C, REFSEL = Internal Reference
2.0 Vref [V]
1.1
1.8 1.5
2.5
1.6 4.3
VDD
1.4

1.2
DNL [LSb]

1.0

0.8

0.6

0.4

0.2

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 52

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-45. DNL vs. Vref (VDD=5.0V, fADC=115 ksps), REFSEL = Internal Reference
2.0 Temperature [°C]
-40
1.8 25
85
1.6 105

1.4

1.2
DNL [LSb]

1.0

0.8

0.6

0.4

0.2

0.0
1.1 1.5 2.5 4.3 VDD
Vref [V]

Figure 5-46. Gain Error vs. VDD (fADC=115 ksps) at T=25°C, REFSEL = Internal Reference
8.0 Vref [V]
1.1
7.0 1.5
2.5
6.0 4.3
VDD
5.0

4.0
Gain [LSb]

3.0

2.0

1.0

0.0

-1.0

-2.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 53

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-47. Gain Error vs. Vref (VDD=5.0V, fADC=115 ksps), REFSEL = Internal Reference
8.0 Temperature [°C]
-40
7.0
25
85
105
6.0

5.0
Gain [LSb]

4.0

3.0

2.0

1.0

0.0
1.1 1.5 2.5 4.3 VDD
Vref [V]

Figure 5-48. INL vs. VDD (fADC=115 ksps) at T=25°C, REFSEL = Internal Reference
2.0 Vref [V]
1.1
1.8 1.5
2.5
1.6 4.3
VDD
1.4

1.2
INL [LSb]

1.0

0.8

0.6

0.4

0.2

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 54

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-49. INL vs. Vref (VDD=5.0V, fADC=115 ksps), REFSEL = Internal Reference
2.0 Temperature [°C]
-40
1.8 25
85
1.6 105

1.4

1.2
INL [LSb]

1.0

0.8

0.6

0.4

0.2

0.0
1.1 1.5 2.5 4.3 VDD
Vref [V]

Figure 5-50. Offset Error vs. VDD (fADC=115 ksps) at T=25°C, REFSEL = Internal Reference
2.0 Vref [V]
1.1
1.6 1.5
2.5
1.2 4.3
VDD
0.8

0.4
Offset [LSb]

0.0

-0.4

-0.8

-1.2

-1.6

-2.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 55

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-51. Offset Error vs. Vref (VDD=5.0V, fADC=115 ksps), REFSEL = Internal Reference
2.0 Temperature [°C]
-40
1.6 25
85
1.2 105

0.8

0.4
Offset[LSb]

0.0

-0.4

-0.8

-1.2

-1.6

-2.0
1.1 1.5 2.5 4.3 VDD
Vref [V]

Figure 5-52. Absolute Accuracy vs. VDD (fADC=115 ksps, T=25°C), REFSEL = External Reference

10.0 Vref [V]

1.8
9.0 2.6
4.096
8.0 4.3

7.0
Absolute Accuracy [LSb]

6.0

5.0

4.0

3.0

2.0

1.0

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 56

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-53. Absolute Accuracy vs. VREF (VDD=5.0V, fADC=115 ksps, REFSEL = External Reference)

10.0 Temperature [°C]

-40
9.0 25
85
8.0 105

7.0
Absolute Accuracy [LSb]

6.0

5.0

4.0

3.0

2.0

1.0

0.0
1.8 2.6 4.096 4.3
Vref [V]

Figure 5-54. DNL vs. VDD (fADC=115 ksps, T=25°C, REFSEL = External Reference)

2.0 Vref [V]

1.8
1.8 2.6
4.096
1.6 4.3

1.4

1.2
DNL [LSb]

1.0

0.8

0.6

0.4

0.2

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 57

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-55. DNL vs. VREF (VDD=5.0V, fADC=115 ksps, REFSEL = External Reference)

2.0 Temperature [°C]

-40
1.8 25
85
1.6 105

1.4

1.2
DNL [LSb]

1.0

0.8

0.6

0.4

0.2

0.0
1.8 2.6 4.096 4.3
Vref [V]

Figure 5-56. Gain vs. VDD (fADC=115 ksps, T=25°C, REFSEL = External Reference)

8.0 Vref [V]

1.8
7.0 2.6
4.096
6.0 4.3

5.0

4.0
Gain [LSb]

3.0

2.0

1.0

0.0

-1.0

-2.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 58

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-57. Gain vs. VREF (VDD=5.0V, fADC=115 ksps, REFSEL = External Reference)

8.0 Temperature [°C]

-40
25
7.0
85
105
6.0

5.0
Gain [LSb]

4.0

3.0

2.0

1.0

0.0
1.8 2.6 4.096 4.3
Vref [V]

Figure 5-58. INL vs. VDD (fADC=115 ksps, T=25°C, REFSEL = External Reference)

2.0 Vref [V]

1.8
1.8 2.6
4.096
1.6 4.3

1.4

1.2
INL [LSb]

1.0

0.8

0.6

0.4

0.2

0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 59

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-59. INL vs. VREF (VDD=5.0V, fADC=115 ksps, REFSEL = External Reference)

2.0 Temperature [°C]

-40
1.8 25
85
1.6 105

1.4

1.2
INL [LSb]

1.0

0.8

0.6

0.4

0.2

0.0
1.8 2.6 4.096 4.3
Vref [V]

Figure 5-60. Offset vs. VDD (fADC=115 ksps, T=25°C, REFSEL = External Reference)

2.0 Vref [V]

1.8
1.6 2.6
4.096
1.2 4.3

0.8

0.4
Offset [LSb]

0.0

-0.4

-0.8

-1.2

-1.6

-2.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 60

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-61. Offset vs. VREF (VDD=5.0V, fADC=115 ksps, REFSEL = External Reference)

2.0 Temperature [°C]

-40
1.6 25
85
1.2 105

0.8

0.4
Offset [LSb]

0.0

-0.4

-0.8

-1.2

-1.6

-2.0
1.8 2.6 4.096 4.3
Vref [V]

5.6 AC Characteristics
Figure 5-62. Hysteresis vs. VCM - 10 mV (VDD=5V)
20 Temperature [°C]
-40
18 -20
0
16 25
55
14
85
105
Hysteresis [mV]

12
125
10

0
-0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vcommon mode [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 61

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-63. Hysteresis vs. VCM - 10 mV to 50 mV (VDD=5V, T=25°C)

80 HYSMODE
10mV
72 25mV
50mV
64

56
Hysteresis [mV]

48

40

32

24

16

0
-0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vcommon mode [V]

Figure 5-64. Offset vs. VCM - 10 mV (VDD=5V)

10.0 Temperature [°C]
-40
9.0 -20
0
8.0 25
55
7.0
85
6.0 105
Offset [mV]

125
5.0

4.0

3.0

2.0

1.0

0.0
-0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vcommon mode [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 62

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-65. Offset vs. VCM - 10 mV to 50 mV (VDD=5V, T=25°C)

10 HYSMODE
10mV
9 25mV
50mV
8

6
Offset [mV]

0
-0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vcommon mode [V]

5.7 OSC20M Characteristics

Figure 5-66. OSC20M Internal Oscillator: Calibration Stepsize vs. Calibration Value (VDD=3V)
1.4 Temperature [°C]
-40
-20
1.2 0
25
70
1.0 85
105
125
0.8

0.6

0.4

0.2

0.0
0 16 32 48 64 80 96 112 128
OSCCAL [x1]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 63

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-67. OSC20M Internal Oscillator: Frequency vs. Calibration Value (VDD=3V)

32 Temperature [°C]
-40
30 -20
0
28 25
70
26
85
24 105
125
22

20

18

16

14

12

10
0 16 32 48 64 80 96 112 128
OSCCAL [x1]

Figure 5-68. OSC20M Internal Oscillator: Frequency vs. Temperature

20.5 Vdd [V]
1.8
20.4 2.2
2.7
20.3 3
3.6
20.2 5
5.5
20.1

20.0

19.9

19.8

19.7

19.6

19.5
-40 -20 0 20 40 60 80 100 120
Temperature [°C]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 64

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-69. OSC20M Internal Oscillator: Frequency vs. VDD

20.5 Temperature [°C]
-40
20.4 -20
0
20.3 25
70
20.2 85
105
20.1 125

20.0

19.9

19.8

19.7

19.6

19.5
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

5.8 OSCULP32K Characteristics

Figure 5-70. OSCULP32K Internal Oscillator Frequency vs. Temperature
40.0 Vdd [V]
1.8
39.0 2.2
2.7
38.0 3
3.6
37.0
5
Frequency [kHz]

36.0 5.5

35.0

34.0

33.0

32.0

31.0

30.0
-40 -20 0 20 40 60 80 100 120
Temperature [°C]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 65

 ATmega809/1609/3209/4809 – 48-pin
Typical Characteristics

Figure 5-71. OSCULP32K Internal Oscillator Frequency vs. VDD

40.0 Temperature [°C]
-40
39.0 -20
0
38.0 25
70
37.0
85
105
Frequency [kHz]

36.0
125
35.0

34.0

33.0

32.0

31.0

30.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Vdd [V]

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 66

 ATmega809/1609/3209/4809 – 48-pin
Ordering Information

6. Ordering Information
• Available ordering options can be found by:
– Clicking on one of the following product page links:
• ATmega809 Product Page
• ATmega1609 Product Page
• ATmega3209 Product Page
• ATmega4809 Product Page
– Searching by product name at microchipdirect.com
– Contacting your local sales representative

Figure 6-1. Product Identification System

To order or obtain information, for example on pricing or delivery, refer to the factory or the listed sales
office.

AT mega 4809 - MFR

Carrier Type
AVR product family R=Tape & Reel
Blank=Tube or Tray
Flash size in KB
Temperature Range
Series name F=-40°C to +125°C
Pin count Package Type
9=48 pins (PDIP: 40 pins) A=TQFP
8=32 pins (SSOP: 28 pins) M=QFN (UQFN/VQFN)
P=PDIP
X=SSOP

Note:  Tape and Reel identifier only appears in the catalog part number description. This identifier is
used for ordering purposes. Check with your Microchip Sales Office for package availability with the Tape
and Reel option.

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 67

 ATmega809/1609/3209/4809 – 48-pin
Online Package Drawings

7. Online Package Drawings

For the most recent package drawings:
1. Go to http://www.microchip.com/packaging.
2. Go to the package type specific page, for example VQFN.
3. Search for either Drawing Number or Style to find the most recent package drawings.
Table 7-1. Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV
TQFP48 C04-300 PT

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 68

 ATmega809/1609/3209/4809 – 48-pin
Package Drawings

8. Package Drawings

8.1 48-Pin TQFP

48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

48X TIPS
0.20 C A-B D
D
D1
D1
2

A B

E1 E

E1
A A 2

E1
4 N

NOTE 1 1 2 4X
D1 0.20 H A-B D
4

48x b
e 0.08 C A-B D

TOP VIEW

0.10 C H
C A2
A
SEATING
PLANE 0.08 C

A1 SIDE VIEW

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 69

 ATmega809/1609/3209/4809 – 48-pin
Package Drawings

48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

 
L
(L1)

SECTION A-A

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Leads N 48
Lead Pitch e 0.50 BSC
Overall Height A - - 1.20
Standoff A1 0.05 - 0.15
Molded Package Thickness A2 0.95 1.00 1.05
Foot Length L 0.45 0.60 0.75
Footprint L1 1.00 REF
Foot Angle  0° 3.5° 7°
Overall Width E 9.00 BSC
Overall Length D 9.00 BSC
Molded Package Width E1 7.00 BSC
Molded Package Length D1 7.00 BSC
Lead Thickness c 0.09 - 0.16
Lead Width b 0.17 0.22 0.27
Mold Draft Angle Top  11° 12° 13°
Mold Draft Angle Bottom  11° 12° 13°

Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A-B and D to be determined at center line between leads where leads exit
plastic body at datum plane H
Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 70

 ATmega809/1609/3209/4809 – 48-pin
Package Drawings

48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

C1

C2 G

SILK SCREEN
48

Y1

1 2
X1
E

RECOMMENDED LAND PATTERN

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 0.50 BSC
Contact Pad Spacing C1 8.40
Contact Pad Spacing C2 8.40
Contact Pad Width (X48) X1 0.30
Contact Pad Length (X48) Y1 1.50
Distance Between Pads G 0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process

Microchip Technology Drawing C04-2300-PT Rev A

Table 8-1. Device and Package Maximum Weight

140 mg

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 71

 ATmega809/1609/3209/4809 – 48-pin
Package Drawings

Table 8-2. Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3. Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4. Package Code

Y8X

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 72

 ATmega809/1609/3209/4809 – 48-pin
M
Package Drawings

Packaging Diagrams and Parameters

8.2 48-Pin UQFN

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

 2009 Microchip Technology Inc. DS00049BC-page 95

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 73

 M ATmega809/1609/3209/4809 – 48-pin
Packaging Diagrams and ParametersPackage Drawings

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

DS00049BC-page 94  2009 Microchip Technology Inc.

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 74

 ATmega809/1609/3209/4809 – 48-pin
Package Drawings

Table 8-5. Device and Package Maximum Weight

TBD mg

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 75

 ATmega809/1609/3209/4809 – 48-pin
Package Drawings

Table 8-6. Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7. Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8. Package Code

R7X

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 76

 ATmega809/1609/3209/4809 – 48-pin
Conventions

9. Conventions

9.1 Memory Size and Type

Table 9-1. Memory Size and Bit Rate

Symbol Description
KB kilobyte (210 = 1024)
MB megabyte (220 = 1024*1024)
GB gigabyte (230 = 1024*1024*1024)
b bit (binary ‘0’ or ‘1’)

B byte (8 bits)
1 kbit/s 1,000 bit/s rate (not 1,024 bit/s)
1 Mbit/s 1,000,000 bit/s rate
1 Gbit/s 1,000,000,000 bit/s rate
word 16-bit

9.2 Frequency and Time

Table 9-2. Frequency and Time

Symbol Description
kHz 1 kHz = 103 Hz = 1,000 Hz
KHz 1 KHz = 1,024 Hz, 32 KHz = 32,768 Hz
MHz 1 MHz = 106 Hz = 1,000,000 Hz
GHz 1 GHz = 109 Hz = 1,000,000,000 Hz
ms 1 ms = 10-3s = 0.001s
µs 1 µs = 10-6s = 0.000001s
ns 1 ns = 10-9s = 0.000000001s

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 77

 ATmega809/1609/3209/4809 – 48-pin
Data Sheet Revision History

10. Data Sheet Revision History

Note:  The data sheet revision is independent of the die revision and the device variant (last letter of the
ordering number).

10.1 Rev.B - 03/2019

Chapter Changes
Entire Document • Added ATmega809/ATmega1609
• Updated Electrical Characteristics section and
Typical Characteristics section
• Added package drawing for UQFN
• Updated package drawing for TQFP

10.2 Rev. A - 02/2018

Initial release.

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 78

 ATmega809/1609/3209/4809 – 48-pin

The Microchip Web Site

Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as
a means to make files and information easily available to customers. Accessible by using your favorite
Internet browser, the web site contains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design
resources, user’s guides and hardware support documents, latest software releases and archived
software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online
discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases,
listing of seminars and events, listings of Microchip sales offices, distributors and factory
representatives

Customer Change Notification Service

Microchip’s customer notification service helps keep customers current on Microchip products.
Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata
related to a specified product family or development tool of interest.
To register, access the Microchip web site at http://www.microchip.com/. Under “Support”, click on
“Customer Change Notification” and follow the registration instructions.

Customer Support
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.
Local sales offices are also available to help customers. A listing of sales offices and locations is included
in the back of this document.
Technical support is available through the web site at: http://www.microchip.com/support

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 79

 ATmega809/1609/3209/4809 – 48-pin

Product Identification System

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

AT mega 4809 - MFR

Carrier Type
AVR product family R=Tape & Reel
Blank=Tube or Tray
Flash size in KB
Temperature Range
Series name F=-40°C to +125°C
Pin count Package Type
9=48 pins (PDIP: 40 pins) A=TQFP
8=32 pins (SSOP: 28 pins) M=QFN (UQFN/VQFN)
P=PDIP
X=SSOP

Note:  Tape and Reel identifier only appears in the catalog part number description. This identifier is
used for ordering purposes. Check with your Microchip Sales Office for package availability with the Tape
and Reel option.

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the
market today, when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of
these methods, to our knowledge, require using the Microchip products in a manner outside the
operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is
engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their
code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the
code protection features of our products. Attempts to break Microchip’s code protection feature may be a
violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software
or other copyrighted work, you may have a right to sue for relief under that Act.

Legal Notice
Information contained in this publication regarding device applications and the like is provided only for
your convenience and may be superseded by updates. It is your responsibility to ensure that your
application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY
OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS
CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life
support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend,
indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 80

 ATmega809/1609/3209/4809 – 48-pin

from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual
property rights unless otherwise stated.

Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud,
chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST,
SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight
Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom,
CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming,
ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient
Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE,
Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2019, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-4321-6

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ISO/TS 16949
Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer
fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California
® ®
and India. The Company’s quality system processes and procedures are for its PIC MCUs and dsPIC
®
DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design and manufacture of development
systems is ISO 9001:2000 certified.

© 2019 Microchip Technology Inc. Datasheet Preliminary DS40002016B-page 81

 Worldwide Sales and Service

AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE

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Tel: 631-435-6000 Tel: 46-8-5090-4654
San Jose, CA UK - Wokingham
Tel: 408-735-9110 Tel: 44-118-921-5800
Tel: 408-436-4270 Fax: 44-118-921-5820
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078

© 2019 Microchip Technology Inc. Preliminary Datasheet DS40002016B-page 82