Materials and Manufacturing Processes
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                Synthesis of Polishing Fluid and Novel Approach
                for Nanofinishing of Copper using Ball End
                Magnetorheological Finishing Process
                Dilshad Ahmad Khan PhD & Sunil Jha PhD
                To cite this article: Dilshad Ahmad Khan PhD & Sunil Jha PhD (2017): Synthesis of Polishing
                Fluid and Novel Approach for Nanofinishing of Copper using Ball End Magnetorheological Finishing
                Process, Materials and Manufacturing Processes, DOI: 10.1080/10426914.2017.1328112
                To link to this article: http://dx.doi.org/10.1080/10426914.2017.1328112
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Download by: [The UC San Diego Library]                                                                   Date: 13 May 2017, At: 01:02
Synthesis of Polishing Fluid and Novel Approach for Nanofinishing of Copper using
                   Ball End Magnetorheological Finishing Process
                        Dilshad Ahmad Khan PhD1, Sunil Jha PhD2
1
    Indian Institute of Technology Delhi, Mechanical Engineering , Hauz Khas, New Delhi ,
      India, 2I.I.T. Delhi, Mechanical Engineering, Department of Mechanical Engg, New
                                          Delhi, India
       Address correspondence to Dr Sunil Jha PhD, Email: suniljha@mech.iitd.ac.in
                                          Abstract
Ball end magnetorheological (MR) finishing process utilizes the magnetically control
stiffened ball of magnetorheological fluid for finishing purpose. Copper is mechanically
soft and chemically reactive material so it is difficult to finish up to nanometer order level
by traditional and most of the advanced finishing processes. In this research work the
problems associated with ball end MR finishing of copper has been explored and a fluid
composition suitable for finishing of copper has been developed. A novel approach using
two opposite magnetic pole has been used to enhance the magnetic flux density
distribution between tool tip and copper workpiece surface. The same has been
magnetically simulated and verified experimentally. The effect of fluid composition
parameters have been analyzed by the statistical model developed by response surface.
After 30 minute of finishing time nano finished surface with very few shallow scratches
has been achieved.
KEYWORDS: Ball-end, Magnetorheological, Finishing, Copper, Nanofinishing,
Simulation, Roughness, Abrasive, Benzotriazole
                                              1
Received 08 Dec 2016, Accepted 22 Apr 2017
                                    INTRODUCTION
Due to the advancement of nanotechnology in manufacturing field, the demand of ultra-
finished components is very high in electronics and metal optics industries. In electronics
industries, copper is used as the interconnect material which require very high level of
planarization [1-3]. In metal optics industries, copper is considered as best material for
industrial ultra-finished mirrors due to its high natural reflectivity, good thermal
conductivity, high heat capacity and durability [4, 5]. Ultra-finished copper mirrors are
used in high power laser applications like laser cutting, laser engraving and laser welding
systems for guiding the laser beam. Copper mirrors are made in flat, concave, convex or
in freeform shapes. Copper, being a soft material, is very difficult to finish by traditional
and some advanced finishing processes. This is because these processes involve high
normal finishing force which is not suitable for ultra-finishing. In loose abrasive finishing
processes like lapping, honing, polishing, etc. the high normal force leads to abrasive
getting embedded in the soft surface and a considerable polished area is covered by
abrasives [6-9].
Advanced finishing processes also have their own limitations, in chemo mechanical
polishing (CMP) the chemicals attack the finished copper surface. Moreover there are
environmental issues associated with disposal of the chemical slurry [10]. CMP is most
suitable for flat surfaces configured in two-dimensional space and finishing of three
dimensional and freeform surfaces increases the cost of the finishing. In CMP process the
                                              2
slurry plays a crucial role in its successful completion. Sometimes the chemical slurry
needs extra care as it causes the possible corrosion of the polishing setup [11]. CMP
process become complex in nature due to the involvement of considerable number of
parameters. The performance of CMP process mainly depends on pressure applied on
polishing pad, relative velocity of the workpiece, material to be polished, slurry
composition, chemistry of polishing slurry, abrasive type, abrasive particle size, hardness
and roughness of the polishing pad [12]. In CMP process the pressure is applied on the
polishing slurry which is in between the workpiece and the polishing pad. Usually the
abrasive particles are harder than the workpiece due to which the abrasives get embedded
in the workpiece surface up to some extent. This results in particulate contamination after
CMP. In CMP process, polishing pad needs periodic conditioning as the asperities on the
pad collapses due to pressure and gets sheared by polishing slurry. Frequent or aggressive
conditioning leads to early end of life of polishing pad [13].
Single point diamond turning (SPDT) is also an option to finish soft materials like
copper, aluminum etc. but it leaves concentric tool marks at the surface which are not
desirable in high precision optics. Also by this process only axi-symmetric surfaces can
be finished [14, 15]. Magnetic assisted finishing processes such as magnetic abrasive
finishing (MAF) [6, 16], magnetorheological finishing (MRF) [17], magnetorheological
abrasive flow finishing (MRAFF) [18] also have shape limitations and are suitable either
for flat or less complex surfaces. These magnetic field assisted finishing processes are not
preferred for more complex surfaces.
                                              3
In magnetorheological finishing, a smart fluid known as magnetorheological polishing
(MRP) fluid is used. MRP fluid is a composition of micron sized carbonyl iron particles
(CIPs), abrasives and a carrier medium like mineral oil, silicon oil or water. In the
absence of magnetic field, CIPs are dispersed randomly in MRP fluid but under the
influence of magnetic field the CIPs get magnetically polarized and align themselves
along the magnetic flux lines to form CIPs chains [17-20]. The abrasive particles are
gripped in between these CIPs chains. The gripping strength of the CIPs come from the
applied magnetic field strength. After removal of magnetic field the CIPs depolarize and
return to their random state.
Ball end magnetorheological (MR) finishing is a recently developed nanofinishing
process which is a variant of magnetorheological finishing process [21-24]. This process
utilizes a flexible ball shaped finishing tool made of magnetorheological polishing fluid
[25]. The flexible ball adjusts its compliance according to the shape in contact. This
makes the process capable of finishing complex surfaces like concave, convex, aspheric
or freeform overcoming the shape limitations of magnetic assisted processes [26, 27]. For
gentle finishing the stiffness of the MRP fluid ball can be controlled externally. Ball end
MR finishing is a deterministic process and the final surface finish depends on the
process parameters.
                            MATERIALS AND METHODS
Even though MRP fluid is a mixture of abrasives and CIPs in a viscoelastic medium but
when MRP fluid comes under the influence of magnetic field the CIPs move toward the
                                              4
higher magnetic flux density region i.e. the tool tip and the non-magnetic abrasive
particles are pushed toward the lower magnetic flux region i.e. workpiece surface. This is
due to magnetic field gradient in the working gap between tool tip and workpiece. This
phenomenon ensures that at the workpiece surface there is abrasive rich MRP fluid. The
abrasive particles those are in direct contact with the workpiece surface and perform
actual cutting action are called active abrasives. During finishing, active abrasives shear
off the roughness peaks gradually (Fig.1) and impart the desired surface finish in
multiples passes.
Experimental Conditions for Trial Experiments
MRP Fluid
Due to the scarcity of literature available on MR finishing of copper a set of trial
experiments were carried out using water and oil based MRP fluid samples. The MRP
fluid samples were prepared using silicon carbide (SiC) and alumina abrasives (Al2O3) of
1000 mesh size. In all MRP fluid samples, the composition was kept as vol 20 % CIP, vol
20% abrasive and vol 60% carrier medium. In water based MRP fluid, deionized water
was used as the carrier medium whereas in oil based MRP fluid a viscous substance
containing wt 80% heavy paraffin oil and wt 20% grease was used as the carrier medium.
Copper Samples
The experiments were performed on oxygen free high conducting (OFHC) copper
samples. The workpiece samples were prepared in the form of disc of 35 mm diameter
and 6 mm thickness. These samples were prepared by lathe operations followed by
                                              5
conventional lapping. Conventional lapping was used to remove cutting tool marks and
unevenness on the surface. The surface roughness of the prepared samples varied from 60
nm to 70 nm. Finally the prepared workpiece samples were cleaned by distilled water and
dried by high air flow. Before ball end MR finishing, the workpiece surface was cleaned
by acetone and extreme care was taken to keep the surface uncontaminated.
Machining Conditions
The machining parameters were taken as: magnetizing current = 7A, working gap
between tool tip and copper samples = 0.8 mm, tool rotational speed = 250 rpm and table
feed rate = 10mm/min. A length of 20 mm is finished along the diameter of the disc. The
finishing time was kept as 30 minutes.
Problems Overcome in Ball End MR Finishing of Copper
In ball end MR finishing of copper, two major problems have been encountered. The
observed problems and their individual solutions are discussed in the following sub-
sections.
Chemical Reaction at the Finishing Site
Trial finishing experiments were performed using water and oil based MRP fluids
containing SiC and alumina as the abrasives. A total of four combinations of base fluid
and abrasives were tested for ball end MR finishing of copper samples. After 30 minutes
of finishing it was observed that in all samples, irrespective of base fluid medium and
abrasives, the finished surface had undergone some chemical reaction and turned black
                                             6
and brownish in color (Fig. 2). To investigate the chemical composition of these reacted
surfaces, energy-dispersive x-ray (EDX) analysis were done (Fig. 3) for all the finished
samples.
From the EDX analysis it was found that the surface had an appreciable amount of
oxygen present on it which is an indication of oxidation of nascent surface. It was
supposed that during finishing the nascent surface comes in contact with the atmospheric
air and reacted with the oxygen present in it. Black and brownish appearance on surface
might be because of the copper oxides as copper oxides exhibit the same color. It was
also observed that the surface roughness of the copper samples increased after the
finishing operation which also might be due to the formation of oxides.
In EDX spectra, the oxygen peaks are clearly visible and the analysis shows that the
oxygen varies from 2.6 to 11% by weight. So, prevention of copper from being oxidized
is the prime requirement in ball end MR finishing and for this purpose benzotriazole
(BTA) was used with MRP fluid.
BTA is a strong corrosion inhibitor that is widely used in chemical engineering to protect
the copper from corrosion. This is also used to control the pH of the polishing slurry in
CMP of copper. BTA was mixed in water as well as in oil based MRP fluids and it was
found that there is no chemical reaction on the copper surface for both types of fluids.
The images of copper samples after finishing with BTA mixed fluids are shown in Fig. 4.
                                             7
Even though BTA mixed water-based MRP fluid is capable of finishing copper sample
but due to fast evaporation of water during finishing operations, the MRP fluid becomes
dry. This requires frequent replenishment of the water-based MRP fluid thus making the
process uneconomical and labor intensive.
So from this study it is concluded that BTA mixed oil-based MRP fluid is suitable for
copper finishing. Alumina being a soft abrasive is suitable for finishing of soft materials
such as copper and so that in next part of the research BTA mixed oil-based MRP fluid is
used with alumina as abrasive.
It was also observed that by using BTA in oil-based MRP fluid, finishing effect (reducing
Ra value) was very low and the process was not able to remove deep scratches from the
copper surface. Thus there was a need to enhance the finishing effect to make the process
fast and economical. In the next section the problem of low magnetic flux density has
been explored due to which low finishing effect was achieved.
Low and Uneven Magnetic Flux Density on Copper Sample
Due to diamagnetic nature of copper when it is exposed to a magnetic field it repels the
magnetic flux lines. In ball end MR finishing process the tool tip works as a magnetic
pole and the magnetic flux lines emerge from it. When copper sample is placed under the
tool tip the magnetic flux lines are repelled and get diverted from centre to outward in
working gap.
                                             8
Without considering MRP fluid in the working gap, magneto-static simulation of the
magnetic flux density over copper sample was done and magnetic field lines are shown in
Fig. 5. All the simulations were carried out at 7 A magnetizing current and at 1mm
working gap. It is shown in Fig. 5 that magnetic field lines flare out in the working gap
and concentrate along the periphery of the tool tip in the form of a ring of comparatively
higher magnetic flux density. This may be due to the combined effect of repulsion of
magnetic flux lines by copper workpiece as well as magnetic edge effect experienced by
the tool tip.
Fig. 6 shows the simulation results of magnetic flux density distribution in tool tip, MRP
fluid in the gap and over the top surface of the copper workpiece. From the simulation
results it is clear that the MRP fluid has the low magnetic flux density below the tool tip
and comparatively higher magnetic flux density along the periphery of the tool tip in the
form of a ring (Fig. 6b). In ball end MR finishing of copper, only one magnetic pole
develops at the tool tip because copper is non-magnetic in nature. This is contrary to the
two opposite poles developed while finishing ferromagnetic material with ball end MR
process. In ball end MR finishing of ferromagnetic materials one pole develops at the tool
tip and it induces the other pole (opposite) at the workpiece. Due to single magnetic pole
in ball end MR finishing of copper the overall magnetic field achieved over the copper
surface is very low and insignificant for effective finishing (Fig. 6b).
It is observed that if a permanent magnet (PM) is used below the copper workpiece, it
enhances the magnetic flux density in MRP fluid as well as on the copper surface. This
                                              9
gives uniform magnetic flux density by avoiding the formation of high flux density ring
along the periphery of the tool tip. The results of magnetic simulations for copper placed
over a permanent magnet are shown in Fig. 7. For magnetic simulation, a permanent
magnet having the same pole strength as that of the tool tip is used. Fig. 7a shows that
magnetic flux density is uniform under the tool tip without any ring of higher magnetic
flux. Fig. 7b shows that using permanent magnet below the copper sample enhances the
magnetic flux density at the copper surface too which is significant for the finishing
action.
To validate the simulation results, the magnetic flux densities at different currents (0 to
10 ampere) were measured over a copper sample without and with permanent magnet
(PM) as base (Fig. 8). The magnetic flux densities were measured with the help of a
Gauss meter, keeping a fixed gap of 1.2 mm between tool tip and workpiece. The results
show that placing a PM below the copper sample increases the magnetic flux densities
significantly at all current levels. Since the magnetic flux density depends on the
magnetizing current, so increase in magnetizing current increases the magnetic flux
density in the working gap. The increase in magnetic flux density was observed only up
to a certain level of magnetizing current. Beyond this there was not much increment in
magnetic flux density due to the magnetic saturation of the tool material as shown in Fig.
8.
The copper samples finished without and with permanent magnet base are shown in Fig.
9. The experimental conditions were kept same as that in magnetic simulations (current
7A, gap 1 mm). The experiments were performed at 300 rpm of tool speed.
                                             10
Fig. 9a shows two finishing regions; a central region denoted by “A” has no finishing
effect whereas another region “B” with a ring shaped area of insignificant finish. Fig. 9b
shows that when copper is placed over a permanent magnet it is finished uniformly.
Difference in finishing effect on both the samples can be seen easily by the light patterns
available at the samples surfaces.
Experimentation
With the above solutions it is now possible to finish copper by ball end MR finishing
process. Strength of the ferromagnetic particles chains (yield stress) depends on the
induced dipole moment which is directly proportional to the diameter of the
ferromagnetic particle.
         d 3 µp µ f
md                  H0        …         …………………………………...(1)
         2 µ p 2µ f
Where:
md= induced dipole moment
d= Particle diameter
µp= particle permeability
µf= fluid permeability
So, to increase the fluid strength further, electrolytic iron powder (EIP) of bigger mesh
size (#300) was used in place of CIP.
                                            11
The experiments were conducted on copper disc of 35 mm in diameter and 6 mm
thickness. For experiments, the copper sample was placed over a permanent magnet of
0.5 Tesla to enhance the magnetic flux in the working gap. Other fixed process
parameters are summarized in table 1.
Abrasive and iron powder concentration in MRP fluid affect the finishing performance of
ball end MR finishing process. To analyze the effect of these two parameters, a two
factors central composite design (CCD) technique was used for the experiments. The
abrasive concentration, denoted by A, was varied from 10 to 20 volume % and EIP
concentration, denoted by B, was varied from 15 to 25 volume %. These limits were
chosen to maintain the viscosity of the MRP fluid, in which the total solid concentration
(volume of abrasive and Iron powder) should not exceed beyond 45 volume %. The
coded levels of the parameters and their actual values are shown in table 2 and 3
respectively. Percentage reduction in surface roughness (%ΔRa) is considered as the
performance measure of the process.
Table 4 shows sum of squares and % contribution of input parameters on response, which
are derived by analysis of variance (ANOVA). On the basis of sequential sum of squares
and lack of fit test it was observed that quadratic model gives good conformation with the
experimental results. Thus, to incorporate nonlinearity of the response parameter, the
following quadratic equation is derived from the experimental results:
In coded form:
% Ra      43.65    0.84*A     6.45*B     8.62*A 2 3.53*B2      2.58*A *B            (2)
In actual form:
                                            12
% Ra        319.22 24.57*A 16.20*B           0.68 A 2 0.28*B2 0.20*A *B             (3)
The percentage change in surface roughness (%ΔRa) calculated on the basis of measured
values of surface roughness have reasonably good coefficient of correlation (R2 = 94.39
%). The results in terms of effect of volume % of abrasive and volume % of EIP on the
response have been computed using quadratic model (Eq 2 or 3) derived from the
analysis of variance.
                             RESULTS AND DISCUSSION
The effect of volume % of Abrasive and volume % of EIP on the response (%ΔRa) are
discussed in the following sub-sections:
Effect of Abrasive Concentration
The effect of abrasive concentration on the response %ΔRa has been studied at
differentEIP concentrations. From the experimental results it is observed that initially by
increasing the abrasive concentration in MRP fluid, the percentage reduction in surface
roughness (%ΔRa) increases. However beyond a certain limit of abrasive concentration,
%ΔRa decreases (Fig. 10). The reason behind this may be that increased level of abrasive
concentration in MRP fluid contains more number of abrasive particles, these increased
number of abrasive particles remove more material during finishing and thus %ΔRa
increases. But when the abrasive concentration is increased beyond a certain limit, it
decreases the magnetic permeability of the MRP fluid due to increase of non magnetic
particles. The EIP chains in the fluid of low magnetic permeability are thin, weak and
discontinuous in nature. The discontinuous chains grip the abrasive particles loosely.
                                             13
These loosely gripped abrasive particles remove less material in finishing due to which
the percentage reduction in surface roughness (%ΔRa) decreases.
Effect of Electrolytic Iron Powder Concentration
The effect of Electrolytic iron powder concentration on %ΔRa at different abrasive
concentrations has been shown in Fig. 11. The figure shows that for abrasive
concentrations from vol. 10 to 15% as the EIP concentration is increased, %ΔRa
increases. The increase of %ΔRa with increasing EIP concentration may be due to the fact
that increasing the EIP concentration increases the magnetic permeability of the MRP
fluid. At higher EIP concentration, due to higher magnetic permeability, the EIP chains
become continuous and grow in width. These strong EIP chains aggregate in the form of
a thick and strong MRP column and result in firmly gripping of abrasive particles in
between EIP chains. The firmly gripped abrasives perform more cutting during finishing
and increase the %ΔRa. Beyond vol. 23% EIP concentration the %ΔRa stabilizes and
not much change was observed. This is due to the fact that up to 23 vol % of EIP
concentration all the available abrasives are gripped sufficiently and adding more EIP
only aggregates outside the EIP chains already gripping the abrasive.
Optimization Study
In this optimization study the goal is to maximize the percentage reduction in surface
roughness (%ΔRa). Previously developed quadratic model of %ΔRa is optimized
subjected to lower and higher values of abrasive and EIP concentrations in the design
space.
                                            14
Maximize:
% Ra        319.22 24.57 *A 16.20*B           0.68 A 2 0.28*B2 0.20*A *B
Subjected to:
10≤A≤20
15≤B≤25
For optimization of these two fluid parameters Design Expert software was used to
calculate the optimum level of the independent parameters for the response.
The optimum values of abrasive and EIP concentrations were found at 14 vol% and 23
vol% respectively. For the validation of opmization result, one experiment was conducted
at the optimized values of abrasive and EIP concentration. The experimental value of
percentage reduction in surface roughness (%ΔRa) was found 42.34 in place of 46.59
obtained theoretically. Hence there seems to be approx 10% error. The predicted and
experimental values of the %ΔRa at optimum parametric conditions are given in table 5.
The surface roughness profile of initial copper surface and after finishing with optimum
fluid conditions are shown in Fig. 12. It is observed that the larger rouhness peaks seen
on the initial roughness profile (Fig. 12a) are sheared off significantly for 30 min of
finishing time (Fig. 12b).
The scanning electron micrographs and atomic force microscopy images of the initial and
finished surfaces finished with optimum polishing fluid composition are shown in Fig. 13
                                             15
and 14 respectively. The SEM images show complete removal of shallow scratches while
the deep scratches present on the initial surface have turned into shallow scratches after
the finishing operation. The AFM images show the correction in the unevenness of the
initial profile to result in a better surface profile after finishing.
                                        CONCLUSION
On the basis of experimental and theoretical work presented, the following conclusions
may be drawn:
        In ball end MR finishing copper reacts with the oxygen and the surface turns
black and brownish in color due to oxide formation irrespective of type of base fluid. To
overcome this problem, BTA mixed MRP fluid has been synthesized for MR finishing of
copper. This synthesized fluid contains bigger particle sized EIP (instead of CIP) to
enhance the finishing effect on copper. Bigger size magnetizable particle (EIP) perform
better in terms of scratches removed as compared to CIP.
        While finishing copper using BEMRF process a ring of comparatively higher
magnetic flux density was observed only along the periphery of the tool tip and the
overall magnetic flux density was lower at the copper surface. Two opposite magnetic
pole approach has been proposed to enhance the magnetic flux density in the working
gap. Using this novel approach a uniform and significantly higher magnetic flux density
was obtained when copper was placed over a permanent magnet with the opposite pole
facing the tool tip. With this arrangement the magnetic flux density was enhanced from
0.35 to 0.85 Tesla at 10 A current for a gap of 1.2 mm.
                                                16
       The parametric analysis of the MRP fluid shows that increasing the abrasive
concentration upto a certain limit increase the percent change in surface roughness
(%ΔRa) but further adding more amout of abrasive decreases the magnetic permeability
of the MRP fluid due to which %ΔRa decreases. As the EIP concnetration was increased
the %ΔRa increases but beyond a certain limit (around 23 vol%) the results stabilizes due
to magnetic saturation of the fluid.
       Optimization study shows that the optimum values of abrasive and EIP
concentrations for the copper finishing are 14 vol % and 23 vol % respectively. Using
optimum polishing fluid composition, in 30 min of finishing, the surface roughness was
reduced from 65.90 nm to 38 nm with 42.34% improvement.
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                                           19
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                                          20
Table1. Fixed experimental parameters and conditions
Parameters                              Conditions
Abrasive and size                       Alumina, mesh size 1000
Electrolytic Iron powder (EIP) size     300 mesh size
Base fluid                              A composition of wt80% heavy paraffin and wt
                                        20% grease
Corrosion inhibitor                     Benzotriazole
Magnetizing current                     6A
Working gap                             1.2 mm
Rotational speed                        300 rpm
Table feed rate                         10 mm/ min
Finishing time                          30 min
Finishing length                        20 mm along the diameter
                                         21
Table 2. Coded levels and actual values of parameters
Parameters                         Levels
                                   -1.414        -1      0    +1      +1.414
Abrasive concentration (vol%)-A    10            11.50   15   18.50   20
EIP Concentration (vol%)-B         15            16.50   20   23.50   25
                                            22
Table 3. Plan of experiments and response
Std.   Run     Input parameters                         Initial Ra   Final Ra   %Δ
order order Coded levels            Actual values       value        value      Ra
                                                        (nm)         (nm)
               Abrasive EIP         Abrasive EIP
               (A)         (B)      (A)          (B)
1      5       -1          -1       11.5         16.5   79.70        59.60      25.22
2      9       +1          -1       18.5         16.5   65.50        47.40      27.63
3      10      -1          +1       11.5         23.5   66.50        39.30      40.90
4      11      +1          +1       18.5         23.5   68.50        45.90      32.99
5      2       -1.414      0        10           20     71.60        52.50      26.67
6      3       +1.414      0        20           20     74.80        55.50      25.80
7      12      0           -1.414   15           15     61.70        45.90      25.607
8      13      0           +1.414 15             25     72.00        38.00      47.22
9      7       0           0        15           20     72.40        41.60      42.54
10     6       0           0        15           20     76.00        43.40      42.89
11     1       0           0        15           20     79.10        43.80      44.63
12     8       0           0        15           20     72.30        40.90      43.43
13     4       0           0        15           20     70.60        39.00      44.76
                                            23
Table 4. Sum of squares (SS) and percentage contribution of process parameters on
%ΔRa
Source                     Sum of Squares                 % Contribution
A                          5.66                           0.60
B                          332.94                         35.40
A2                         470.71                         50.05
B2                         86.57                          9.21
A×B                        26.64                          2.83
Pure error                 17.9                           1.90
                                          24
Table 5. Validation of optimization results
Parameters              Predicted %Δ Ra by         Experimental % Error in
                        quadretic model            %Δ Ra        predicted value
A            B
14 vol%      23 vol%    46.59                      42.34        -10.05
                                              25
Figure 1. Material removal by active abrasive in BEMRF (a) active abrasive gripped in
CIP approaching the roughness peak (b) active abrasive shearing off the roughness peaks
in a single pass (c) active abrasive gradually sheared off the roughness peaks in multiple
passes
                                            26
Figure 2. Copper samples finished by (a) SiC-water based MRP fluid (b) Al2O3-water
based MRP fluid (c) SiC-oil based MRP fluid (d) Al2O3-oil based MRP fluid
                                         27
Figure 3. EDX spectra of copper samples finished with (a) SiC-water based MRP fluid
(b) Al2O3-water based MRP fluid (c) SiC-oil based MRP fluid (d) Al2O3-oil based MRP
fluid
                                         28
Figure 4. Copper samples finished by BTA mixed (a) SiC-water based MRP fluid (b)
Al2O3-water based MRP fluid (c) SiC-oil based MRP fluid (d) Al2O3-oil based MRP fluid
                                         29
Figure 5. Magneto-static simulation over copper samples showing magnetic field lines
                                          30
Figure 6. Magnetic flux density distribution for copper (a) in MRP fluid (b) on top
surface of copper workpiece
                                           31
Figure 7. Magnetic flux density distribution for copper workpiece on a permanent
magnet (a) in MRP fluid (b) on top surface of workpiece
                                          32
Figure 8. Magnetic flux densities at copper worpiece at different currents without and
with a permanent magnet base
                                           33
Figure 9. Copper samples (a) uneven and low finishing without permanent magnet base
(b) uniform finishing using permanent magnet as the base
                                          34
Figure 10. Effect of abrasive concentration on percentage reduction in surface roughness
(%ΔRa).
                                           35
Figure 11. Effect EIP concentration on percentage reduction in surface roughness (%Δ
Ra)
                                          36
Figure 12. Surface roughness profile of (a) Initial surface (b) finished surface with
optimal fluid composition
                                             37
Figure 13. Scanning electron micrograph of (a) initial surface (b) finished surface of the
copper sample
                                            38
Figure 14. Atomic force microscopy image of (a) initial surface (b) finished surface of
the copper sample
                                           39