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LMH0324
SNLS516A – JANUARY 2016 – REVISED MARCH 2016

LMH0324 3G/HD/SD SDI Dual Output Adaptive Cable Equalizer

1 Features 3 Description
1• Supports ST 424(3G), ST 292(HD), and ST The LMH0324 is a low power, dual output, extended
259(SD) reach adaptive cable equalizer. It is designed to
equalize SDI data transmitted over 75 Ω coax cable.
• Compatible with DVB-ASI and AES10 (MADI) The equalizer operates over a wide range of data
• Adaptive Cable Equalizer rates from 125 Mbps to 2.97 Gbps. The equalizer
• Cable Reach (Belden 1694A): includes an active sensing circuitry that ensures
robust performance and enhanced immunity to
– 200 m at 2.97 Gbps variations in the input signal launch amplitude.
– 280 m at 1.485 Gbps
The LMH0324 provides extended cable reach with
– 600 m at 270 Mbps low power consumption. It offers power management
• Low Power: 78 mW (typical) to reduce power consumption further when no input
• Power Save Mode: 15 mW signal is present.
• On-chip input Termination (75 Ω single-ended) The LMH0324 has two differential serial data outputs,
• Integrated Input Return Loss Network which provide flexibility for fan-out buffering. The
output drivers offer programmable de-emphasis to
• Dual 100 Ω Output Drivers with De-Emphasis compensate for board trace losses at the LMH0324
• Independent Output Power Down Control outputs. The operating state of the LMH0324 can be
• Supports Signal Splitter Mode (-6 dB Launch set via pin control. Additional settings of the device
Amplitude) can be programmed via SPI or SMBus interface.
• Cable Length Indicator The LMH0324 is pin-compatible to the LMH1219 (12
• Digital MUTEREF Threshold Gbps adaptive cable equalizer with integrated
reclocker). The pin compatibility allows ease of
• Powers from 2.5 V or 1.8 V Supply upgrade from a 3 Gbps equalizer to a 12 Gbps
• Configurable by Control Pins, SPI or SMBus equalizer with integrated reclocker.
Interface
• 4 mm x 4 mm 24-pin QFN Package Device Information(1)
• Operating Temperature Range: -40°C to 85°C PART NUMBER PACKAGE BODY SIZE (NOM)
LMH0324 QFN (24) 4 mm x 4 mm
2 Applications (1) For all available packages, see the orderable addendum at
the end of the data sheet.
• SMPTE Compatible Serial Digital Interface (SDI)
• Broadcast Video Routers, Switchers, and Monitors
• DVB-ASI and Distribution Amplifiers
• Digital Video Processing and Editing
Simplified Block Diagram
Low Power
VOD_DE
Adaptive Cable Equalizer
EQ 2
100 Ÿ
Bypass OUT0±
Driver
2 SE 75 Ÿ Cable
IN0± Term and VOD_DE
EQ
RL Network
100 Ÿ 2
Carrier OUT1±
Detector OUT_MUX Driver

CD_N
Power Serial
LDO Control Logic
Management Interface

VDD_LDO Single 2.5 V Control Carrier SPI

or Pins Detect or
1.8 V SMBus

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
This datasheet has been downloaded from http://www.digchip.com at this page
LMH0324
SNLS516A – JANUARY 2016 – REVISED MARCH 2016 www.ti.com

Table of Contents
1 Features .................................................................. 1 5.1 Community Resources.............................................. 3
2 Applications ........................................................... 1 5.2 Trademarks ............................................................... 3
3 Description ............................................................. 1 5.3 Electrostatic Discharge Caution ................................ 3
5.4 Glossary .................................................................... 3
4 Revision History..................................................... 2
5 Device and Documentation Support.................... 3 6 Mechanical, Packaging, and Orderable
Information ............................................................. 3

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (January 2016) to Revision A Page

• Product Preview to Production Data Release ....................................................................................................................... 1

2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated

Product Folder Links: LMH0324

 LMH0324
www.ti.com SNLS516A – JANUARY 2016 – REVISED MARCH 2016

5 Device and Documentation Support

5.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

5.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
5.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

5.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

6 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: LMH0324
 PACKAGE OPTION ADDENDUM

www.ti.com 29-Mar-2016

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

LMH0324RTWR ACTIVE WQFN RTW 24 3000 Green (RoHS CU SN Level-3-260C-168 HR -40 to 85 L0324A2
& no Sb/Br)
LMH0324RTWT ACTIVE WQFN RTW 24 250 Green (RoHS CU SN Level-3-260C-168 HR -40 to 85 L0324A2
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 29-Mar-2016

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 28-Mar-2016

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMH0324RTWR WQFN RTW 24 3000 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LMH0324RTWT WQFN RTW 24 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 28-Mar-2016

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMH0324RTWR WQFN RTW 24 3000 367.0 367.0 35.0
LMH0324RTWT WQFN RTW 24 250 213.0 191.0 55.0

Pack Materials-Page 2
 MECHANICAL DATA
RTW0024A

SQA24A (Rev B)

www.ti.com
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