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Dioda Marking D4

1) The EC10DS4 is a miniature surface mount diode with high surge capability, low forward voltage drop, and low reverse leakage current. 2) It has a maximum repetitive peak reverse voltage of 400V, non-repetitive peak reverse voltage of 600V, and average rectified output current of 1A at 25°C. 3) The diode has a small size of 12mm tape and reel packaging, making it suitable for automated assembly on circuit boards.

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415 views5 pages

Dioda Marking D4

1) The EC10DS4 is a miniature surface mount diode with high surge capability, low forward voltage drop, and low reverse leakage current. 2) It has a maximum repetitive peak reverse voltage of 400V, non-repetitive peak reverse voltage of 600V, and average rectified output current of 1A at 25°C. 3) The diode has a small size of 12mm tape and reel packaging, making it suitable for automated assembly on circuit boards.

Uploaded by

Hosting Ind
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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DIODE Type : EC10DS4

FEATURES OUTLINE DRAWING

* Miniature Size,Surface Mount Device


* High Surge Capability
* Low Forward Voltage Drop
* Low Reverse Leakage Current
* Packaged in 12mm Tape and Reel
* Not Rolling During Assembly

Maximum Ratings Approx Net Weight:0.06g

Rating Symbol EC10DS4 Unit


Repetitive Peak Reverse Voltage VRRM 400 V
Non-repetitive Peak Reverse Voltage VRSM 600 V
0.74 Ta=25 °C *1 50Hz Half Sine
Average Rectified Output Current IO A
1.0 Ta=25 °C *2 Wave Resistive Load
RMS Forward Current IF(RMS) 1.57 A
50Hz Half Sine Wave,1cycle
Surge Forward Current IFSM 25 A
Non-repetitive
Operating JunctionTemperature Range Tjw -40 to +150 °C
Storage Temperature Range Tstg -40 to +150 °C

Electrical • Thermal Characteristics


Characteristics Symbol Conditions Min. Typ. Max. Unit
Peak Reverse Current IRM Tj= 25°C, VRM= VRRM - - 10 µA
Peak Forward Voltage VFM Tj= 25°C, IFM= 1.0A - - 1.1 V
*1 - - 157
Thermal Resistance Rth(j-a) Junction to Ambient °C /W
*2 - - 108
*1 Glass Epoxy Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
*2 Alumina Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
EC10D*_ OUTLINE DRAWING (Dimensions in mm)
FORWARD CURRENT VS. VOLTAGE

EC10DS1/EC10DS2/EC10DS4
INSTANTANEOUS FORWARD CURRENT (A) 10

2
Tj=25°C
Tj=150°C
1

0.5

0.2

0.1
0 0.4 0.8 1.2 1.6 2.0
INSTANTANEOUS FORWARD VOLTAGE (V)

AVERAGE FORWARD POWER DISSIPATION

EC10DS1/EC10DS2/EC10DS4
AVERAGE FORWARD POWER DISSIPATION (W)

D.C.
1.6

1.2
HALF SINE WAVE

0.8

0.4

0
0 0.4 0.8 1.2 1.6
AVERAGE FORWARD CURRENT (A)
AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE
Glass-Epoxy Substrate Mounted(Soldering Land=2×2mm)
EC10DS1/EC10DS2/EC10DS4
AVERAGE FORWARD CURRENT (A) 1.2

1.0 D.C.

HALF SINE WAVE


0.8

0.6

0.4

0.2

0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE (°C)

AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE


Alumina Substrate Mounted(Soldering Land=2×2mm)
EC10DS1/EC10DS2/EC10DS4
1.6

1.4
D.C.
AVERAGE FORWARD CURRENT (A)

1.2

HALF SINE WAVE


1.0

0.8

0.6

0.4

0.2

0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE (°C)
SURGE CURRENT RATINGS
f=50Hz,Half Sine Wave,Non-Repetitive,No Load
EC10DS1/EC10DS2/EC10DS4
30

25
SURGE FORWARD CURRENT (A)

20

15

10

5 I FSM

0.02s
0
0.02 0.05 0.1 0.2 0.5 1 2
TIME (s)

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