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CH 1 Introduction

This document provides an introduction to ceramics, including: 1) It defines five main categories of materials including metals, polymers, ceramics, semiconductors, and composites. 2) It describes the general properties of ceramics such as brittleness, poor electrical/thermal conduction, compressive strength, and chemical insensitivity. 3) It discusses different types of ceramics and their applications as well as critical issues and the relationship between microstructure, processing, and applications. 4) It emphasizes the importance of safety when working with ceramics.

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Sezin AYHAN
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0% found this document useful (0 votes)
43 views10 pages

CH 1 Introduction

This document provides an introduction to ceramics, including: 1) It defines five main categories of materials including metals, polymers, ceramics, semiconductors, and composites. 2) It describes the general properties of ceramics such as brittleness, poor electrical/thermal conduction, compressive strength, and chemical insensitivity. 3) It discusses different types of ceramics and their applications as well as critical issues and the relationship between microstructure, processing, and applications. 4) It emphasizes the importance of safety when working with ceramics.

Uploaded by

Sezin AYHAN
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Ch 1 Introduction

•What is Ceramic?
Five categories of materials : Metals, polymers, ceramics,
semiconductors, and composites

 Metals:
−Delocalized electrons overcome the mutual repulsion between the metal ion cores.
−Both pure and alloy
−Mainly transitional elements
−Some metals(alloys) contain nonmetallic elements (C in Fe).
−Some metals contain ceramics (carbides such as Fe3C and W6C).
−Good electrical and thermal conductivity

 Polymers:
−Macromolecules formed by covalent bonding of many mers
−Organic compounds based on carbon, hydrogen, sulfur, chlorine, etc.
−Plastics
 Ceramics:
−Mixed bonding of covalent, ionic, and sometimes metallic
−Arrays of interconnected atoms, not discrete molecules -I2 (discrete molecules),
paraffin wax (long chain alkane molecules), ice (discrete H2O)
−Mainly oxides, nitrides, carbides
−“ Most solid materials that aren’t metal, plastic, or derived from plants or
animals are ceramics”

 Semiconductors:
−Electrically between conductor and insulator
−Wide band gap (3 eV )
−SiC, GaN, etc.

 Composites:
−Combinations of more than one materials or phase
−Ceramics can be reinforcement or matrix.
•General Properties of Ceramics? misunderstanding?
1) Brittleness
Because of mixed ionic-covalent bonding
But, at higher temperatures (above Tg), glass no longer brittle
Brittle only at room T, not at elevated temperature

2) Poor electrical and thermal conduction


Valence electrons are not free.
But, diamond has the highest thermal conductivity (by phonons)
ReO3 has and electrical conductivity, similar to Cu.
YBa2Cu3O7 is superconductor, zero resistivity below 92 K.
3) Compressive strength
Stronger in compression than in tension (in metal, both are similar).
if compressive condition, load-bearing application is possible.

4) Chemical insensitivity
Generally chemically and thermally durable
Pyrex glass in lab or in bakeware

5) Transparent
Sapphire watch covers, precious stones, optical fibers.
Metal can be thin only with very thin (< 0.1 µm)
•Types of Ceramic and their applications
 Traditional ceramics: Based on clay and silica, low technology, low cost
 Advanced ceramics: special, technical, engineering, recently developed
•Market

General distribution of industry sales Overall glass market distribution in US

Market distribution of advanced Ceramics


•Critical issues for the future
1. Structural ceramics
Si3N4, SiC, ZrO2, B4C, and Al2O3 are used in applications such as cutting
tools, wear components, heat exchangers, and engine parts.
Key issues
• Reducing cost of the final product
• Improving reliability
• Improving reproducibility
2. Electronic ceramics
BaTiO3, ZnO, Pb(Zr,Ti)O3, AlN, superconductors are used in applications as
capacitor dielectrics, varistors, MEMS, substrate, and IC packages.
Key issues
• Integrating with existing semiconductor technology
• Improving processing
• Enhancing compatibility with other materials
3. Bioceramics
Inert(Al2O3, ZrO2, bioactive(hydroxyapatite, glass-ceramic), and resorbable
(tricalcium phosphate).
Key issues
• Matching mechanical properties to human tissues
• Increasing reliability
• Improving processing methods
4. Coating and Films
To modify the surface properties  bioactive coating on bioinert implant
Economic reason  diamond coating on a cheap cutting tool
Better performance  HTSCs coating and better electrical transport
Key issues
• Understanding film deposition and growth
• Improving film/substrate adhesion
• Increasing reproducibility
5. Composites
Main purpose of CMCs is to increase fracture toughness through reinforcement.
The roles of ceramics in MMCs is to increase strength, enhance creep resistance,
and greater wear resistance.
Key issues
• Reducing processing costs
• Developing compatible combination of materials
• Understanding interfaces
6. Nanoceramics
Mainly in cosmetic products, catalysis, fuel cells, coatings, and other devices
Key issues
• Making them
• Integrating them into devices
• Ensuring that they do not have a negative impact on society
•Relation between microstructure, processing, and applications

1. The strength of polycrystalline ceramics depends on the grain size (Hall-


Petch effects)
2. Transparent or translucent ceramics depends on the pores or second-
phases.
3. Thermal conductivity of commercially available polycrystalline AlN is
usually lower than that predicted by theory because of the presence of
impurities, mainly oxygen, which scatter phonons.
4. The permeability of soft ferrites is a function of grain size and large
defect-free grains are preferred because we need to have very mobile
domain walls.
5. For the electrical insulators(high electrical resistivity) pure alumina is not
used. Silicates are added to reduce the sintering temperature. But
silicates make glassy phase and it increases conductivity.
•You should be careful !!

• Toxicity : the manufacturer supplied information on the hazards. Please


read this information and keep it.
• Small particle : not be inhaled (< 1µm)
• High temperature : even 400 °C of ceramic will not show a change in
color.
• Organics : used as solvents or binders in ceramic processing. Materials
Safety Data Sheets (MSDS) should be readily accessible for all the materials
you are using.

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