High Thermal Reliability
Data Sheet
Tg 180°C
Td 340°C
370HR Dk 4.04
Df 0.0210
High Performance Laminate and
Prepreg IPC-4101 - / 98 / 99 / 101 / 126
UL - File Number E41625
370HR is the industry’s “best in class” Last Updated September 30, 2020
Revision No: D
lead-free compatible product for high-
reliability applications across a wide Product Features
range of markets. · Industry Recognition
- UL File Number: E41625
370HR laminates and prepregs are made using a patented high - Qualified to UL’s MCIL Program
performance 180°C Tg FR-4 multi-functional epoxy resin system - RoHS Compliant
that is designed for multi-layer Printed Wiring Board (PWB) · Performance Attributes
applications where maximum thermal performance, reliability - CAF resistant
superior CAF resistance are required. This system provides - Lead-free assembly compatible
superior thermal performance with low Coefficient of Thermal
· Processing Advantages
Expansion (CTE) and the mechanical, chemical and moisture
- FR-4 process compatible
resistance properties that equal or exceed the performance of
traditional FR-4 materials. - UV blocking and AOI fluorescence
370HR is used in thousands of PWB designs and has proven to be Product Availability
best in class for thermal reliability, CAF performance, ease of · Standard Material Offering: Laminate
processing and proven performance on sequential lamination
- 2 to 125 mil (0.05 to 3.2 mm)
designs.
- Available in full size sheet or panel form
· Copper Foil Type
Product Attributes - HTE Grade 3
High Thermal Reliability , High Density Interconnect - RTF (Reverse Treat Foil)
· Copper Weight
Typical Market Applications - ½ to 2 oz (18 to 70 µm) available
Computing, Storage & Peripherals , Consumer Electronics ,
- Heavier copper available
Networking & Communication Systems , Aerospace & Defense ,
- Thinner copper foil available
Medical, Industrial & Instrumentation , Automotive &
Transportation · Standard Material Offering: Prepreg
- Roll or panel form
ORDERING INFORMATION: - Tooling of prepreg panels
Contact your local sales representative or contact info@isola-group.com for · Glass Fabric Availability
further information. - E-glass
Isola Group Isola Asia Pacific Isola GmbH - Square weave glass
6565 West Frye Road (Hong Kong) Ltd. Isola Strasse 2 - Mechanically spread glass
Chandler, AZ 85226 12/F, Kin Sang D-52348 Düren,
Phone: 480-893- Commercial Centre, Germany
6527 49 King Yip Street, Kwun Tong, Phone: 49-2421-8080
Fax: 480-893-1409 Kowloon, Hong Kong Fax: 49-2421-808164
Phone: 852-2418-1318
Fax: 852-2418-1533
370HR Typical Values
Last Updated Sep 30, 2020
Units Test Method
Property Typical Value IPC-TM-650 (or
Metric (English)
as noted)
Glass Transition Temperature (Tg) by DSC 180 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 340 °C 2.4.24.6
Time to Delaminate by TMA (Copper A. T260 60
Minutes 2.4.24.1
removed) B. T288 30
A. Pre-Tg 45 ppm/°C
Z-Axis CTE B. Post-Tg 230 ppm/°C 2.4.24C
C. 50 to 260°C, (Total Expansion) 2.8 %
X/Y-Axis CTE Pre-Tg 13/14 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/mK ASTM E1952
Thermal Stress 10 sec @ 288ºC A. Unetched
Pass Pass Visual 2.4.13.1
(550.4ºF) B. Etched
A. @ 100 MHz 4.24 2.5.5.3
B. @ 1 GHz 4.17 2.5.5.9
Dk, Permittivity C. @ 2 GHz 4.04 — Bereskin Stripline
D. @ 5 GHz 3.92 Bereskin Stripline
E. @ 10 GHz 3.92 Bereskin Stripline
A. @ 100 MHz 0.0150 2.5.5.3
B. @ 1 GHz 0.0161 — 2.5.5.9
Df, Loss Tangent C. @ 2 GHz 0.0210 — Bereskin Stripline
D. @ 5 GHz 0.0250 — 2.5.5.5
E. @ 10 GHz 0.0250 2.5.5.5
A. After moisture resistance 3.0 x 108
Volume Resistivity MΩ-cm 2.5.17.1
B. At elevated temperature 7.0 x 108
A. After moisture resistance 3.0 x 106
Surface Resistivity MΩ 2.5.17.1
B. At elevated temperature 2.0 x 108
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 115 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 54 (1350) kV/mm (V/mil) 2.5.6.2A
UL 746A
Comparative Tracking Index (CTI) 3 (175-249) Class (Volts)
ASTM D3638
A. Low profile copper foil and very
low profile copper foil all copper foil 2.4.8C
1.14 (6.5)
>17 μm [0.669 mil]
Peel Strength B. Standard profile copper N/mm (lb/inch) 2.4.8.2A
1.25 (7.0)
1. After thermal stress 2.4.8.3
1.25 (7.0)
2. At 125ºC (257ºF) 2.4.8.3
1.14 (6.5)
3. After process solutions
A. Length direction 90.0
Flexural Strength ksi 2.4.4B
B. Cross direction 77.0
A. Length direction 55.9
Tensile Strength ksi ASTM D3039
B. Cross direction 35.6
A. Length direction 3744
Young's Modulus ksi ASTM D790-15e2
B. Cross direction 3178
A. Length direction 0.177
Poisson's Ratio — ASTM D3039
B. Cross direction 0.171
Moisture Absorption 0.15 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these
products will be governed by the terms and conditions of the agreement under which they are sold.
https://www.isola-group.com/products/all-printed-circuit-materials/370hr/
The Isola name and logo are registered trademarks of Isola Corp. USA in the USA and other countries. 370HR is a registered trademark of Isola
USA Corp. in the USA. All other trademarks mentioned herein are property of their respective owners.
© 2020, Isola Group, All rights reserved.
NOTE
Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Added Thermal Conductivity value 3/20
