SRM Institute of Science & Technology (SRM IST)
Center of Excellence for Electronic Cooling and CFD Sim Lab,
BEL 407, Third Floor, Basic Engineering Lab,
College of Engineering and Technology,
Kattankulathur, Chennai - 603203, Tamil Nadu, India.
Capstone Program IN ELECTRONIC COOLING
(A practical and industry-oriented course taught by an expert from Intel Corporation, USA, with a hands-on approach.)
Even Semester 2023 - 2024
All Lectures will be delivered by Dr. Prabhakar Subrahmanyam
Dr. Prabhakar Subrahmanyam is a Staff Scientist at Intel Corporation, where he specializes in Thermal Research and Cooling
techniques for a range of Microprocessors & GPUs, including Client, Desktop, Xeon servers, HPC, and Graphics ecosystems. He is a
graduate of Stanford University in Aerospace Engineering specializing in re-entry heat transfer of planetary entry probes/vehicles. At
Intel, he works on latest processors and devices. With over 60 publications and 50 patents to his name, Dr. Prabhakar is an experienced
and a pioneering technologist who is particularly renowned for his expertise in Jet Impingement techniques for Electronic Cooling
applications, having invented, developed, and deployed numerous innovative designs at Intel labs. He is also active in various
conference committees, serving as a sessions chair and reviewer for IEEE Transactions of Components Packaging and Manufacturing
Technology and ASME Transactions of Journal of Electronic Packaging. Currently, he is the Chief Thermal Architect for the latest
graphical processing units (GPU) at Intel. In this role, he leads the pathfinding research and drives innovation in cooling methods and
improves the packaging photolithography process at the node level for all processors in the ecosystem. His contributions have been
instrumental in advancing the field of thermal management for microprocessors/GPUs, and he continues to be a key player in this
space.
Capstone Program comprises Capstone Curriculum 8. Manufacturing methods for semiconductors
and Photolithography Process
• 26 Lectures of 2 hours each 1. Introduction to Electronic Cooling 9. Power-maps and their effects on Silicon
• 15 Lab Sessions of 8 hours each 2. Heat sink, Heat Pipes and Air cooling Packages
3. Cold Plates and Liquid Cooling 10. Datacenter cooling and energy efficiency
Target Audience
4. Heat Exchangers and their applications in Electronic 11. Jet Impingement for electronic Cooling
• Undergraduate students Cooling Applications
at the 2nd, 3rd and 4th year 5. TECs and their use in Electronic Cooling 12. Reliability of Electronic Components
from all Engineering 6. Immersion Cooling for High Power applications 13. Two Phase Flows in Electronic Cooling
Disciplines
7. Electronic Packaging Materials, TIMs, PCM and their limits Application
For more details Contact the Coordinators
Dr. B. K. Gnanavel Dr. S. Manikandan Dr. S. Senthil kumar Mr. G. Naresh Dr. Rajesh Agarwal Dr. C. Naveen
Professor and Head of Center of Excellence Coordinator Coordinator Coordinator Coordinator Coordinator
for Electronic Cooling and CFD Sim Lab, Mechanical Engineering Aerospace Engineering Automobile Engineering Electronics & Electrical & Electronics
College of Engineering and Technology, Ph: 9015532238 Communication Engineering
SRM Institute of Science and Technology, Engineering
Kattankulathur, Chennai - 603203,
Tamil Nadu, India Dr. D. Premnath Dr. C. Arun Kumar Dr. K. Vibha Dr. S. Senthil Raja Dr. R. Brindha
Mobile: 9677059138 Coordinator Coordinator Coordinator Coordinator Coordinator
email: gnanaveb@srmist.edu.in Mechanical Engineering Civil Engineering Electronics & Instrumentation Engineering Mechatronics Engineering Computing Technologies
Course Registration: Interested Students Can Select the Pre / Co Requisite & Capstone Program by course Polling from Academia
2018 and 2021 Regula�on for Capstone
Course Code
2018 2021
Regula�on Regula�on Course Title Remark/Prerequisite
Credits Credits
2018 2021
Electronic Thermal
18MEO122J 21MEO113J Pre-requisite/Co-requisite.
Management
3 3 It is sufficient to do one
Microelectronic Thermal
18MEE451J 21MEE217J prerequisite
Management
Capstone Program in 18MEO122J or 18MEE451J
18IPE401J 21IPE401J 6 6
Electronic Cooling 21MEO113J or 21MEE217J
Capstone Program
18IPP401L 21IPP401L 10 15 18IPE401J or 21IPE401J
Project
Total Credits for Capstone Program 19 24
