Camxs 6 MDR
Camxs 6 MDR
CA-MXS6MDR
SP-MXS6MD
SP-MXS6MD
SERVICE MANUAL
COMPACT COMPONENT MD SYSTEM
CA-MXS6MDR
SP-MXS6MD
STANDBY
/ON
LEVEL
METER
MENU DISC
SP/LP2/LP4
LONG REC
MODE MODE
REC PAUSE
LINE
/DEMO
PHONES LINE 2
DIGITAL AUDIO
Contents
1. This design of this product contains special hardware and many circuits and components specially
for safety purposes. For continued protection, no changes should be made to the original design
unless authorized in writing by the manufacturer. Replacement parts must be identical to those
used in the original circuits. Services should be performed by qualified personnel only.
2. Alterations of the design or circuitry of the product should not be made. Any design alterations of
the product should not be made. Any design alterations or additions will void the manufacturer`s
warranty and will further relieve the manufacture of responsibility for personal injury or property
damage resulting therefrom.
3. Many electrical and mechanical parts in the products have special safety-related characteristics.
These characteristics are often not evident from visual inspection nor can the protection afforded
by them necessarily be obtained by using replacement components rated for higher voltage,
wattage, etc. Replacement parts which have these special safety characteristics are identified in
the Parts List of Service Manual. Electrical components having such features are identified by
shading on the schematics and by ( ) on the Parts List in the Service Manual. The use of a
substitute replacement which does not have the same safety characteristics as the recommended
replacement parts shown in the Parts List of Service Manual may create shock, fire, or other
hazards.
4. The leads in the products are routed and dressed with ties, clamps, tubings, barriers and the
like to be separated from live parts, high temperature parts, moving parts and/or sharp edges
for the prevention of electric shock and fire hazard. When service is required, the original lead
routing and dress should be observed, and it should be confirmed that they have been returned
to normal, after re-assembling.
5. Leakage currnet check (Electrical shock hazard testing)
After re-assembling the product, always perform an isolation check on the exposed metal parts
of the product (antenna terminals, knobs, metal cabinet, screw heads, headphone jack, control
shafts, etc.) to be sure the product is safe to operate without danger of electrical shock.
Do not use a line isolation transformer during this check.
Plug the AC line cord directly into the AC outlet. Using a "Leakage Current Tester", measure
the leakage current from each exposed metal parts of the cabinet , particularly any exposed
metal part having a return path to the chassis, to a known good earth ground. Any leakage
current must not exceed 0.5mA AC (r.m.s.)
Alternate check method
Plug the AC line cord directly into the AC outlet. Use an AC voltmeter having, 1,000 ohms
per volt or more sensitivity in the following manner. Connect a 1,500 10W resistor paralleled by
a 0.15 F AC-type capacitor between an exposed
AC VOLTMETER
metal part and a known good earth ground. (Having 1000
Measure the AC voltage across the resistor with the ohms/volts,
AC voltmeter. or more sensitivity)
Move the resistor connection to eachexposed metal
part, particularly any exposed metal part having a 0.15 F AC TYPE
return path to the chassis, and meausre the AC
Place this
voltage across the resistor. Now, reverse the plug in probe on
the AC outlet and repeat each measurement. voltage each exposed
measured Any must not exceed 0.75 V AC (r.m.s.). 1500 10W metal part.
This corresponds to 0.5 mA AC (r.m.s.).
Good earth ground
1. This equipment has been designed and manufactured to meet international safety standards.
2. It is the legal responsibility of the repairer to ensure that these safety standards are maintained.
3. Repairs must be made in accordance with the relevant safety standards.
4. It is essential that safety critical components are replaced by approved parts.
5. If mains voltage selector is provided, check setting for local voltage.
! Burrs formed during molding may be left over on some parts of the chassis. Therefore,
pay attention to such burrs in the case of preforming repair of this system.
1-2
CA-MXS6MDR
SP-MXS6MD
(U.K only)
1. This design of this product contains special hardware and many circuits and components specially
for safety purposes. For continued protection, no changes should be made to the original
design unless authorized in writing by the manufacturer. Replacement parts must be identical to
those used in the original circuits.
2. Any unauthorised design alterations or additions will void the manufacturer's guarantee ; furthermore the
manufacturer cannot accept responsibility for personal injury or property damage resulting therefrom.
3. Essential safety critical components are identified by ( ) on the Parts List and by shading on the
schematics, and must never be replaced by parts other than those listed in the manual. Please note
however that many electrical and mechanical parts in the product have special safety related
characteristics. These characteristics are often not evident from visual inspection. Parts other than
specified by the manufacturer may not have the same safety characteristics as the recommended
replacement parts shown in the Parts List of the Service Manual and may create shock, fire, or
other hazards.
4. The leads in the products are routed and dressed with ties, clamps, tubings, barriers and the
like to be separated from live parts, high temperature parts, moving parts and/or sharp edges
for the prevention of electric shock and fire hazard. When service is required, the original lead
routing and dress should be observed, and it should be confirmed that they have been returned
to normal, after re-assembling.
! Burrs formed during molding may be left over on some parts of the chassis. Therefore,
pay attention to such burrs in the case of preforming repair of this system.
1-3
CA-MXS6MDR
SP-MXS6MD
(caption)
Anti-static wrist strap
Conductive material
(conductive sheet) or iron plate
1.1.3. Handling the optical pickup
1. In order to maintain quality during transport and before installation, both sides of the laser diode on the
replacement optical pickup are shorted. After replacement, return the shorted parts to their original condition.
(Refer to the text.)
2. Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power
source can easily destroy the laser diode.
CN451
CN321
Soldering part
CD pickup
MD pickup Pickup Soldering part
1-4
CA-MXS6MDR
SP-MXS6MD
VARNING : Osynlig laserstrålning är denna del är öppnad ADVARSEL : Usynlig laserstråling ved åbning , når
och spårren är urkopplad. Betrakta ej strålen. sikkerhedsafbrydere er ude af funktion. Undgå
VARO : Avattaessa ja suojalukitus ohitettaessa olet udsættelse for stråling.
alttiina näkymättömälle lasersäteilylle.Älä katso ADVARSEL : Usynlig laserstråling ved åpning,når
säteeseen. sikkerhetsbryteren er avslott. unngå utsettelse
for stråling.
WARNING LABEL
DANGER : Invisibie laser radiation VARO : Avattaessa ja suojalukitus
when open and interlock or ohitettaessa olet alttiina
defeated. näkymättömälle lasersäteilylle.Älä
AVOID DIRECT EXPOSURE TO
CLASS 1 BEAM (e)
katso säteeseen. (d)
1-5
CA-MXS6MDR
SP-MXS6MD
Top cover
Disassembly method A A
<Main body>
Removing the top cover
(See Fig. 1 and 2)
1. Remove the four screws A on the back of the body.
Input board
C C
Fig.3
D
Front panel assembly
Fig.5 Fig.4
1-6
CA-MXS6MDR
SP-MXS6MD
Removing the font panel assembly Front panel assembly Joint a
(See Fig.6 to 8)
Prior to performing the following procedure, remove
the top cover. E E
1. Disconnect the wire from connector CN603 on the
input board and the card wire from CN801 on the
microcomputer board.
Input board
Joint b
Fig.7
F F
Removing the display board (See Fig.9)
Prior to performing the following procedure, remove
the top cover and the front panel assembly.
CN791
1. Remove the nine screws F attaching the display
board to the front panel assembly.
Microcomputer board
CN801
CN393
CN392
CN391
Fig.14
1-8
CA-MXS6MDR
SP-MXS6MD
CN112 CN111 L
Removing the tuner board Rear cover
(See Fig.15 and 16)
Prior to performing the following procedure, remove
the top cover.
J
1. Disconnect the wire from connector CN111 and
CN112 on the tuner board.
N P
Removing the Input board (See Fig.18) Fig.17
CN661
Prior to performing the procedure, remove the top CN603
cover, the rear cover, the rear panel and the tuner
board.
Input board
1. Disconnect the card wire from connector CN661 and
the wire from CN603 on the input board.
CN691
2. Remove the two screws R attaching the bracket and
remove the bracket in the direction of the arrow.
CN602
3. Disconnect the lower connector CN602, CN913 and
CN922 from the main board. Disconnect the wire CN913
CN922
from CN691 on the input board. R
Fig.18
1-9
CA-MXS6MDR
SP-MXS6MD
Removing the heat sink assembly Heat sink assembly
(See Fig.19 and 20)
Prior to performing the procedure, remove the top Bracket
cover, the CD changer mechanism assembly, the
rear cover, the rear panel, the tuner board and the
input board.
Fig.19
CN924 CN394
Fig.20
Heat sink
T U
Amplifier board
Regulator board
Fig.21
1-10
CA-MXS6MDR
SP-MXS6MD
Removing the Main board (See Fig.22) CN911
Main board
Prior to performing the procedure, remove the top
CN991
cover, the CD changer mechanism assembly, the
rear cover, the rear panel, the tuner board, the input
board and the heat sink assembly.
V
V
1. Disconnect the wire from connector CN911 on the
main board and CN991 on the power transformer
assembly.
<MD section>
Removing the main board Main board
(See Fig.1 and 2)
1. Turn over the body and disconnect the card wire
from connector CN408 and the flexible wire from CN408
CN407 on the main board.
Main board
CN451
CN321
Fig.2
Joint c
Mechanism cover
B
Removing the mechanism cover
(See Fig.3)
Fook
1. Remove the four screws B on both sides of the
body.
Fig.4
Spring
Head lifter
Fig.5
Head lifter
Spring
Fig.6
Head assembly
C
Fig.7
1-13
CA-MXS6MDR
SP-MXS6MD
Removing the Loading assembly
(See Fig.8 and 9)
D D
Ref: The loading assembly, the traverse mechanism
assembly and the single flame will be
removable after removing the loading assembly
from the body.
Loading assembly
Prior to performing the following procedure, remove
the main board, the mechanism cover, the head lifter
and the head assembly.
Loading assembly
Traverse mechanism
assembly
Single flame
Fig.9
1-14
CA-MXS6MDR
SP-MXS6MD
<Loading assembly> Slide base (R) E'
Removing the slide base (L) / (R) E
(See Fig.10)
1. Remove the two screws E on the upper side of the
loading assembly.
E
E'
Fig.10
I Eject bar
Eject bar
Part g
UD base
Fig.15
1-16
CA-MXS6MDR
SP-MXS6MD
<Traverse mechanism assembly>
Removing the Insulators (See Fig.16) Insulators
Pickup unit
1. Disengage the four insulators from the notches of the
traverse mechanism chassis.
Insulators
Traverse machanism chassis
Fig.16
2. Move the shaft inward and remove it from the shaft Pickup unit
holder (R).
K
Removing the pickup (See Fig.18)
1. Draw out the shaft from the pickup. Pickup
Shaft
Fig.18
1-17
CA-MXS6MDR
SP-MXS6MD
Removing the feed motor assembly
(See Fig.19-1, 19-2)
Traberse mechanism board Soldering j
It is not necessary to remove the pickup unit.
Fig.19-1
1-18
CA-MXS6MDR
SP-MXS6MD
<Reattaching the loading assembly>
1. Reattach the eject bar to the UD base.
(Fig.15 and 20)
3. Slide the slide bar and the eject bar in the direction
of the arrow in Fig.20 and reattach the cartridge
holder assembly using the two screws I.
(Fig.20 and 21)
I
Cam switch boss
I
Ditch
UD base
Eject bar
Fig.20
UD base (Bottom)
Ditch m
Loading slider
Eject lever
l
Fig.21
1-19
CA-MXS6MDR
SP-MXS6MD
4. Reattach the wire holder to the UD base while
engaging the UD base hook marked u to the wire
holder slot marked t (At the same time, the boss on
the reverse side of the wire holder is fitted to the UD
base round hole).
Boss
Cam switch
Loading motor assembly
F
Cam gear
Cam gear
Eject lever
(Triangle mark)
n Eject lever
Fig.22
1-20
CA-MXS6MDR
SP-MXS6MD
8. Reattach the UD base while engaging the four pins Pin
on both sides of the UD base to the notches of the
loading mechanism base and placing the edge
(marked e’) of the cartridge holder assembly under
the hook e of the loading mechanism base. (Fig.23) Hook e'
9. Reattach the slide base (R) while fitting the two pins
on another side of the UD base to the slots of the
slide base (R). (Fig.24) Pin
Ref: To expedite the work, bring up the UD base Slide base (R)
slightly when fitting each pin to the appropriate Part v E
notch.
Pin
Pin
Part w
Fig.24
Slide base (R) E' Slide base (L)
Slide base (R)
Cam gear
Part w
Part v
E'
Fig.26 Fig.25
1-21
CA-MXS6MDR
SP-MXS6MD
<CD mechanism section>
Removing the servo control board
(See Fig.1 to 4)
ATTENTION: Make sure the sub chassis unit is
locating at the lowest position. If
not,perform the following procedure
from 1 to 3.
3. From the right side of the body, slide the slide cam
(L) backward until it stops. The sub chassis unit will
move to the lowest position.
Slot p
Gear base unit Main board
Fig.3-2 Fig.4
1-22
CA-MXS6MDR
SP-MXS6MD
Top cover
Removing the tray unit (See Fig.5 to 8)
The tray unit can be removed despite the position of
the sub chassis unit, but the lowest position is
recommended to expedite the work.
B B
1. Remove the four screws B attaching the top cover
on the top of the body.
4. From the top of the body, release the tray from the
joint hook marked d (Push the tray toward the front). Rod
5. Release the stoppers on both sides in the direction Clamper base unit
of the arrow and pull out the tray unit from the body. Fig.5
ATTENTION: Pull out the tray unit from the top tray 3
in sequence. Top cover
Tray
Both
Tray
Clamper base unit
Fig.6
Both
Tray unit
Joint d
Tray 3
Return spring
1. Remove the two screws C attaching the side unit (L). Side unit (L)
2. Slide and remove the side unit (L) toward the front C Joint f
while releasing the two joints e and the joint f with Hook gear
the chassis unit. Joint g
3. Slide the slide cam (L) toward the front until it stops
to place the sub chassis unit at the top position. slide hook
Slide cam(L)
Joints e
ATTENTION: When reassembling, make sure the boss Fig.9-2
is fitted to the select arm marked h.
Side unit (L)
D Joint f
Fig.9-3
Boss
Side unit (R) Joint g
Select arm
Joint h
D
Fig.9-4 Fig.9-5
1-24
CA-MXS6MDR
SP-MXS6MD
Removing the sub chassis unit
(See Fig.10 to 12)
Prior to performing the following procedures, remove
the servo control board, the top cover, the tray unit,
the side unit (L) and the side unit (R).
2. Slide the slide cam (L) and the slide cam (R) in the Slide cam (R)
direction of the arrow until they stop.
Pin Pin
Slider (R)
Hook gear
slide hook
Fig.12
1-25
CA-MXS6MDR
SP-MXS6MD
Removing the flap base unit and the gear Flap base unit
Joint tab j
base unit (See Fig.13 and 14) Joint tab i
Fig.13
F
Belt
Fig.14
Motor
Motor
Fig.15
1-26
CA-MXS6MDR
SP-MXS6MD
Removing the pickup (See Fig.16 to 20) Top cover
Flexible board
k Joint m
Rack arm
J
Shaft holder
I
Screw shaft
Pickup Joint l
Fig.20 Fig.18
1-27
CA-MXS6MDR
SP-MXS6MD
Removing the traverse mechanism
K Joint o
assembly (See Fig.21)
Prior to performing the following procedure, remove
the servo control board and the clamper base unit.
Rod
Top cover
Clamper base unit
Fig.5
Rod
1-28
CA-MXS6MDR
SP-MXS6MD
Ornament grille Tweeter
<Speaker section>
Information
This is a method of dis assembly.
As parts of the repair of this speaker Woofer
system, it is only the speaker box assemblies. Boss
It is not possible to supply with each part unit.
Prior to performing the following procedure, remove
the front grille.
Woofer
Stick Driver
Fig.2
Boss 4
Fig.3
1-29
CA-MXS6MDR
SP-MXS6MD
Removing the speaker (tweeter) (See Fig.4 and 5) Ornament grille
1. Insert a screwdriver under the ornament grille and
remove it from the body. Driver
Tweeter
Fig.4
Tweeter
B
A A
Woofer
Fig.5
1-30
CA-MXS6MDR
SP-MXS6MD
3.Laser power adjustment
Adjustment method
Insert the sensor
This model is auto adjust system. of laser power meter
Press [ 2 key ] of
MD TEST MODE 1 Remote controller
LCD indication
MD TEST MODE 1 LCD indication LCD indication
L.POWER UP L.POWER DOWN
Press [ 4 key] of
Setting OK Remote controller
LCD indication
2.Initialize the EEPROM L.POWER REC
6.23mW Adjustment
Initialize OK
Adjustment complete
1-31
CA-MXS6MDR
SP-MXS6MD
4.Disc adjustment
This adjustment should done after laser power adjustment.
Insert
Pre-master disc
LCD indication
ON TUNING
LCD indication
Adjustment
NG_ERR _!
OK?
<Refer the NG code list>
LCD indication
OK_TUNING
1-32
CA-MXS6MDR
SP-MXS6MD
5.Independent operation mode Operation key MODE
In case the checking mode or adjustment Remote controller [SLEEP] Focus search [FOCUS_SEARCH]
when occur the error at disc adjustment,
Remote controller [6 key] Pit rough servo [P.R.SERVO]
Independent mode into by select the key
Remote controller [7 key] Groove rough servo [GR.R.SERVO]
before release the TERST MODE.
Remote controller [8 key] Tracking ON [TRACKING_ON]
Remote controller [9 key] Tracking OFF [TRACKING_OFF]
Remote controller [STOP] STOP [STOP]
Main body [EJECT] EJECT [EJECT]
MD TEST MODE 2
1.Setting the TEST MODE 2 2.Indication the drift level of
(CAUTION) MD mode should NO the pickup adjustment value
DISC condition, when POWER
ON to not read TOC. TEST MODE 2
LCD indication
[HELLO] then Adjustment value
[MD TEST MODE 1] IVR IVR (Pre-master, Recordable groove)
TAGC TRK AGC ( )
Setting the MD TEST MODE2 TBAL TRK BALANCE ( )=0
by press [STOP key] and LPOW Laser power (Play power=0 Rec power)
[TITLE/EDIT key] together FBIA Focus bias ( )=0
FAGC Focus AGC ( )
Setting OK TEOF TE offset ( )=0
SAGC Sled AGC ( )
1-33
CA-MXS6MDR
SP-MXS6MD
LCD indication
CD TEST MODE
LCD indication
[HELLO] then
CD TEST MODE
Complete setting
TEST MODE
Read TOC
TEST MODE
Power to OFF
1-34
CA-MXS6MDR
SP-MXS6MD
POWER ON
Caution:Full color LED is keep white condition, when loop out by any key at test mode.
1-35
CA-MXS6MDR
SP-MXS6MD
RUNNING MODE
This running mode is a mode by which the recording is compulsorily deleted with ALL-ERASE after
U-TOC is written when the recording of MD ends, and the recording is repeated again.
This TEST MODE is continue recording (loop recording), it is for recording stop when MD end.
This TEST MODE is only can use manual operation recording [MD REC PAUSE]. CD synchro recording
(CD MD REC,BEST HIT REC,1CD MD REC) is not operate correctly.
1-36
CA-MXS6MDR
SP-MXS6MD
MD play Key
Check point
Slider turns REST Confirm that the voltage
switch ON at the pin 9 of CN408 are
0V.
Mechanism operation ON
Confirm that the voltage
Laser ON
at the pin 50 of IC500 are 4V.
Disc detection
Automatic tuning of
Focus error gain
TOC reading
Play a disc
1-37
CA-MXS6MDR
SP-MXS6MD
(2) For cleaning the lens, use the following cotton swab after
mearsing it in alcohol.
Product No : JCB-B4 Manufacturer : Nippon Cotton Swab Set the pickup to [TEST] mode according
to the procedures described in the
2. Confirmation of the service life of laser adjustment method.
diode when the service life of the laser
diode has been exhausted, the following
symptoms will appear. Adjust the laser power.
(1) Recording will become impossible.
Is the
recording power NO
(6.23mW) output with
Change CAUTION
the laser power under
test mode?
Since this system is designed to perform magnetic
recording, the laser power ten times or over of the
YES
conventional MD player will be output. Therefore, be
sure to perform not only adjustment and operation
The drive current NO of this system so carefully as not to directly look at
of laser diode 120mA Change the laser beam or touch on the body.
or less?
YES
O.K.
4.Semi-solid state resistors on the
APC board.
3. Method of measuring the drive current
The semi-solid state resistor on the APC board
of laser diode attached to the pickup is used for adjusting the laser
When the voltage measured at each side of R337, power. Since these resistor should be adjusted in
it become 120mV or over, the service life of laser pair according to the characteristics of the optical
diode is judged to have been exhausted. block, be sure not touch on the resistors.
Since the service life of the laser diode will be
exhausted when the laser power is low, it is
necessary to change the pickup.
Meanwhile, do not pickup.
Otherwise, the pickup will be damaged due to over
current.
1-38
CA-MXS6MDR
SP-MXS6MD
Disc detection
Play
1-39
CA-MXS6MDR
SP-MXS6MD
Play disc
YES
O.K.
1-40
CA-MXS6MDR
SP-MXS6MD
Description of major ICs
AK4519VF-X (IC480) : A / D D / A converter
1.Pin layout
1 24
2 23
3 22
4 21
5 20
6 19
7 18
8 17
9 16
10 15
11 14
12 13
8x
AOUTL LPF Modulator Interpolator
8x
AOUTR LPF Modulator Interpolator
PWAD PWDA
3.Pin Function
Pin
NO. Symbol I/O Function
1 VRDA I Voltage Reference Input Pin for DAC, VA
2 VRAD I Voltage Reference Input Pin for ADC, VA
3 AINR I RCH Analog Input Pin
4 VCMR O Rch Common Voltage Output Pin, 0.45xVA
5 VCML O Lch Common Voltage Output Pin, 0.45xVA
6 AINL I Lch Analog Input Pin
7 PWAD I ADC Power-Down Mode Pin "L":Power Down
8 PWDA I DAC Power-Down Mode Pin "L":Power Down
9 MCLK I Master Clock Input Pin
10 LRCK I Input/Output Channel Clock Pin
11 SCLK I Audio Serial Data Clock Pin
12 SDTO O Audio Serial Data Output Pin
13 DGND - Digital Ground Pin
14 VD - Digital Power Supply Pin
15 SDTI I Audio Serial Data Input Pin
16 CMODE I Master Clock Select Pin
17 DEM1 I De-emphasis Frequency Select Pin
18 DEM0 I De-emphasis Frequensy Select Pin
19 AOUTL O Lch Analog Output Pin
20 AOUTR O Rch Analog Output Pin
21 VCOM O Common Voltage Output Pin, 0.45xVA
22 AGND - Analog Ground Pin
23 VB - Substrate Pin
24 VA - Analog Power Supply Pin
1-41
CA-MXS6MDR
SP-MXS6MD
AN8849SB-W (IC601) : Head amp
1.Pin layout
2.Block diagram
3 5 6 8 9 10 17 11 12
DET
EQ AGC
13
BDO
DET 14
15
OFTR
16
36
Substraction
35
FBAL 29
34
33
GCTRL 28
32
Substraction
TBAL 30
31
1-42
CA-MXS6MDR
SP-MXS6MD
3.Pin Function
Pin
NO. Symbol Function
1 PD Photo detector signal input.
2 LD Laser diode drive terminal.
3 RFN RF amp negative input terminal.
4 Vcc1 Power supply terminal.
5 RFOUT Equaruzer connect terminal.
6 EQSW Power supply terminal.
7 Vcc2 RF AGC input terminal.
8 RFC RF AGC filter connect terminal.
9 CAGC ARF output terminal.
10 ARF 3T envelope detect filter terminal.
11 CEA Envelope detect output circuit.
12 ENV Low level DO detect connect terminal.
13 CBDO DO detect signal output terminal.
14 BDO OFF TRACK detect signal connect terminal.
15 COFTR OFF TRACK detect signal output terminal.
16 OFTR RF signal amp. detection output.
17 NRFDET Ground.
18 GND LD APC ON / OFF select.
19 LDON Reference voltage output terminal.
20 VREF1 CROSS detect signal output terminal.
21 CROSS Reference voltage output terminal.
22 VREF2 CROSS detect filter connect terminal.
23 CCRS Tracking error output terminal.
24 TEN TE amp.negative input terminal.
25 TEOUT FE amp.negative input terminal.
26 FEN Focus error output terminal.
27 FEOUT Focus gain, tracking gain adjust control signal inout terminal.
28 GCTRL Focus barance adjust control input terminal.
29 FBAL Tracking barance adjust control input terminal.
30 TBAL Connect PDIC.
31 E Connect PDIC.
32 F Connect PDIC.
33 D Connect PDIC.
34 B Connect PDIC.
35 C Connect PDIC.
36 A Connect PDIC.
1-43
CA-MXS6MDR
SP-MXS6MD
CXA2523AR (IC310) : MD servo
1.Block diagram
WBLADJ
ADAGC
CSLED
BOTM
ADFM
ABCD
ADFG
ADIN
AUX
SE
FE
TE
36 35 34 33 32 31 30 29 28 27 26 25
RF 38 23 3TADJ
MUX FE Amp
AGC, EQ
RFAGC 39 22 EQADJ
AGCI 40 21 VREF
COMPO 41 20 F0CNT
USER
Comp
COMPP 42 19 XSTBY
ADDC 43 18 XLAT
CPU
OPO 44 17 SCLK
OP Amp
USER
Command I/F
3T Detector
ABCD Amp
OPN 45 16 SWDT
RFO 46 15 TEMP R
RF Amp
TEMP Amp
MORFI 47 14 TEMP I
MORFO 48 13 GND
I-V Amp APC
1 2 3 4 5 6 7 8 9 10 11 12
I
VC
PD
APC
APCREF
2.Pin function
1-44
CA-MXS6MDR
SP-MXS6MD
1-45
CA-MXS6MDR
SP-MXS6MD
CXD2662R (IC350) : DSP
1.Pin layout
75 ~ 51
76 50
~ ~
100 26
1 ~ 25
MDDT1
OSCO
FS256
XBCK
LRCK
XTSL
OSCI
FS4
2.Block diagram
16 17 18 29 27 28 90 52
PCO 59
FILI 60 CLOCK
PLL GENERATOR 46 XRAS
FILO 61
44 XCAS
CLTV 62
47 XWE
EFM ACIRC 4
Each block 43 XOE
EFM 100 ENCODER DECODER 12 A00 A11
COMP 4 D0 D3
RFI 57
ASYO 53
26 DADT
ATRAC/ATRAC3
ENCODER/DECODER 25 ADDT
ADFG 78 ADIP DECODER 24 XBCKI
4
23 LRCKI
FGIN 95 22 DATAI
DIGITAL 2
SPFD 94 SAMPLING DIN DIN1
SPINDLE RATE AUDIO
SPRD 93 SERVO CONVERTER I/F 21 DOUT
F0CNT 79
APC 77 12 DQSY
SUBCODE
FE 66 PROCESSOR 11 SQSY
MUX
TE 75
SE 74 A/D SERVO
ANALOG
10 7 5 6 8 9 1 2 3 4 13
XRST
XLAT
SWDT
SCLK
SRDT
SENS
MNT0
MNT1
MNT2
MNT3
RECP
1-46
CA-MXS6MDR
SP-MXS6MD
3.Pin function
Pin No. Symbol I/O Function
1 MNT0 I/O Monitor output.
2 MNT1 O Monitor output.
3 MNT2 O Monitor output.
4 MNT3 O Monitor output.
5 SWDT I Data input for microcomputer serial interface.
6 SCLK I Shift clook input for microcomputer serial interface.
7 XLAT I Latch input for microcomputer serial interface.Latched at the falling edge.
8 SRDT O Data output for microcomputer serial interface.
Outputs the internal status corresponding to the microcomputer serial
9 SENS O
interface address.
10 XRST I Reset input. Low : reset
11 SQSY O Disc subcode Q sync / ADIP sync output.
Subcode Q sync output in U-bit CD or MD format when the Digital In
12 DQSY O
source is CD or MD.
Laser power switching input.
13 RECP I High : recording power ; low ; playback power
14 XINT O Interruption request output. Low when the interruption status occurs.
15 TX I Enable signal input for recoding data output. High : enabled
16 OSCI I Crystal oscillation circuit input.
17 OSCO O Crystal oscillation circuit output. (inverted output ofthe OSCI pin)
OSCI input frequency switching.
XTSL1(command) = low and XTSL = high : 512Fs (22.5792MHz)
18 XTSL I XTSL1(command) = low and XTSL = low : 1024Fs (45.1584MHz)
XTSL1(command) = high : 2048Fs (90.3168MHz)
19 DIN0 I Digital audio interface signal input 1.
20 DIN1 I Digital audio interface signal input 2.
21 DOUT O Digital audio interface signal output.
22 DATAI I Test pin. Connect to GND.
23 LRCKI I Test pin. Connect to GND.
24 XBCKI I Test pin. Connect to GND.
25 ADDT I Data input from A / D converter.
26 DADT O REC monitor output / decoded audio data output.
27 LRCK O LA clock (44.1kHz) output to the external audio block.
28 XBCK O Bit clock (2.8224kHz) output to the external audio block.
29 FS256 O 256Fs output.
30 DVDD - Digital power supply.
31 A03 O External DRAM address output.
32 A02 O External DRAM address output.
33 A01 O External DRAM address output.
34 A00 O External DRAM address output.
35 A10 O External DRAM address output.
36 A04 O External DRAM address output.
37 A05 O External DRAM address output.
38 A06 O External DRAM address output.
39 A07 O External DRAM address output.
40 A08 O External DRAM address output.
41 A11 O External DRAM address output.
42 DVSS - Digital ground.
43 XOE O External DRAM output enable.
1-47
CA-MXS6MDR
SP-MXS6MD
62 Internal VCO control voltage input for master PLL of playback digital EFM PLL and
CLTV I
recording EFM PLL.
63 PEAK I Peak hold signal input for quantity of light.
64 BOTM I Bottom hold signal input for quantity of light.
65 ABCD I Signal input for quantity of light.
66 FE I Focus error signal input.
67 AUXI I Auxillary input 1.
68 VC I Center voltage input.
69 ADIO I Monitor output for A / D converter input signal.
70 AVDD - Analog power supply.
71 ADRT I Voltage input for the upper limit of the A / D converter operating range.
72 ADRB I Voltage input for the lower limit of the A / D converter operating range.
73 AVSS - Analog ground.
74 SE I Sled error signal input.
75 TE I Tracking error signal input.
76 DCHG I Connect to he low-inpedance power supply.
77 APC I Error signal input for laser digital APC.
78 ADFG I ADIP binary FM signal (22.05 1kHz) input.
79 F0CNT O CXA2523 current source setting output.
80 XLRF O CXA2523 control latch output. Latched at the falling edge.
81 CKRF O CXA2523 control shift clook output.
82 DTRF O CXA2523 control data output.
83 APCREF O Referevce PWM output for laser APC.
84 LDDR O PWM output for laser digital APC.
85 TRDR O Tracking servo drive PWM output. ( )
86 TFDR O Tracking servo drive PWM output. (+)
87 DVDD - Digital power supply.
88 FFDR O Focus servo drive PWM output. (+)
89 FRDR O Focus servo drive PWM output. ( )
90 FS4 O 4Fs output. (176.4kHz)
1-48
CA-MXS6MDR
SP-MXS6MD
IN/OUT1 1 14 VDD
OUT/IN1 2 13 CONT1 I/O O/I
OUT/IN2 3 12 CONT4
IN/OUT2 4 11 IN/OUT4
CONT
CONT2 5 10 OUT/IN4
CONT3 6 9 OUT/IN3
VSS 7 8 IN/OUT3
1Y 1 14 VCC A B Y
1A 2 13 4Y L L H
1B 3 12 4B L H L
2Y 4 11 4A H L L
2A 5 10 3Y H H L
2B 6 9 3B
GND 7 8 3A
1-49
CA-MXS6MDR
SP-MXS6MD
HD6432345A15FA (IC500) : MD servo control
1.Pin layout
100 ~ 76
1 75
~ ~
25 51
26 ~ 50
2.Pin function (1 / 2)
PIN No. I/O Symbol Function
1 I DO Data input for EEPROM.
2 O DI Data input for EEPROM.
3 O SCL Clock output for EEPROM.
4 O CS Chip select for EEPROM 1.
5 - STSRDY Non connected.
6 - NC Non connected.
7 - VSS Ground
8 O STATUS Status output for host.
9 O SWDT Data output to CXD2662R.
10 I COMMAND Command input from host.
11 I SRDT Data input from CXD2662R.
12 I COMCLK Clock input from host.
13 O SCLK Serial clock output to CDX2662R.
14~16 - NC Non connected.
17 - POWER Power supply.
18 - VSS Ground
19 O PWAD AD power control output.
20 O PWDA DA power control output.
21 O EMPHA Emphasis control output.
22,23 - NC Non connected.
24 O MODON High frequency ON / OFF output.
25 O MODCHG High frequency power select output.
26 - NC Non connected.
27 O MONIDATA Data output for debag / test mode.
28 O MONICLK Clock output for debag / test mode.
29 O MONILAT Latch output for debag / test mode.
30 O XTSL Input frequency select output to CXD2662R.
31 - VSS Ground
32 O TX Write data output permission to CXD2662R.
33 - NC Non connected.
34 O RECP Recording power output to CXD2662R.
35,36 - NC Non connected.
37 O XRST LSI reset output to CXD2662R.
38 I SENS Monitor input from CXD2662R.
39 I XLAT Write protect switch input.
40 - VCC Power supply.
41~44 I MNT3~0 LSI monitor signal from CXD2662R.
45~48 I CAM4^1 Mechanism position detect input.
49 - VSS Ground
50 O DRVON 4ch CLV drive power save.
1-50
CA-MXS6MDR
SP-MXS6MD
Pin function (HD6432345A15FA 2 / 2)
PIN No. I/O Symbol Function
51 I MPROT Write protect switch input.
52 I SSTOP SLED rest position detect input.
53 I HREF Refrect level select switch input.
54~56 O MMONI0~2 Test terminal.
57 I MD0 Oparation setting for CPU.
58 I MD1 Oparation setting for CPU.
59 - MMONO3 Test terminal.
60 I WDT0VF Operation setting for CPU.
61 I MD2 Operation setting for CPU.
62 I RESET Reset input of CPU.
63 I NMI Oparation setting for CPU.
64 I STBY Oparation setting for CPU.
65 - VCC Power supply terminal.
66 O XTAL X'tal OSC terminal (10MHz)
67 I EXTL X'tal OSC terminal (10MHz)
68 - VSS Ground
69 - NC Non connect.
70 O MHON Magnetic head driver ON / OFF.
71 I CDEMP CD emphasis input.
72 I CDCOPY CD Cbit input.
73 I CDTND CD TNO input.
74 I SQSY Sub code Q / A dip syne.
75 I DQSY Connect to CXD2662R DQSY.
76 I XINT Interrupter requier.
77 - AVCC Power supply.
78 - VREF Power supply.
79 I MODESE Mode select input.
80 I SET1 UART select input.
81 I SET2 DOUT ON / OFF select input.
82 I SET3 DOUT output select input.
83~86 I MT0~3 Monitor output select.
87 - AVSS Ground
88 - VSS Ground
89~92 I ID0~3 Operation setting for CPU.
93 O SVIB Sled slectrical viblation signal.
94 O EJECT Loading motor control output.
95 O LOAD Loading motor control output.
96 O 4REC MH driver voltage down output at low temp.
97 - NC Non connected.
98 - VCC Power supply.
99 O DIUNL Digital in u nlock.
100 O NC Non connected.
1-51
CA-MXS6MDR
SP-MXS6MD
MN662748RPM (IC651) : Digital servo & digital signal processer
1. Pin layout
20 ~ 1
21 80
~
40 61
41 ~ 60
2.Block diagram
V V D D / / F T R T V B / O
D S V V R T E E F R D D R F
D S D S S E E C E O F T
D S T S N R T D
1 1 T V S E
1-52
CA-MXS6MDR
SP-MXS6MD
3. Pin function
Pin Pin
No. Dymbol I/O Function No. Symbol I/O Function
1 BCLK O Not used 41 TES O Tracking error shunt signal output (H:shunt)
2 LRCK O Not used 42 PLAY Not used
I
3 SRDATA O Not used 43 WVEL Not used
I
4 DVDD1 Power supply (Digital) 44 ARF I RF signal input
I
5 DVSS1 Connected to GND 45 IREF I Reference current input pin
I
6 TX O Digital audio interface output 46 DRF I Bias pin for DSL
CPU command clock signal input
7 MCLK I 47 DSLF I/O Loop filter pin for DSL
(Data is latched at signal's rising point)
8 MDATA I CPU command data input 48 PLLF I/O Loop filter pin for PLL
9 MLD I CPU command load signal input 49 VCOF Not used
I
10 SENSE O Sense signal output 50 AVDD2 Power supply (Analog)
I
11 FLOCK O Focus lock signal output Active :Low 51 AVSS2 Connected to GND (Analog)
I
12 TLOCK O Tracking lock signal output Active :Low 52 EFM Not used
I
13 BLKCK O sub-code/block/clock signal output 53 PCK Not used
I
14 SQCK I Outside clock for sub-code Q resister input 54 PDO Not used
I
15 SUBQ O Sub-code Q -code output 55 SUBC Not used
I
16 DMUTE Connected to GND 56 SBCK Not used
I
I
Status signal Connected to GND (for X'tal oscillation
17 STATUS O 57 VSS
I
(CRC,CUE,CLVS,TTSTOP,ECLV,SQOK) circuit)
18 RST I Reset signal input (L:Reset) 58 XI I Input of 16.9344MHz X'tal oscillation circuit
19 SMCK Not used 59 X2 O Output of X'tal oscillation circuit
I
20 PMCK Not used 60 VDD Power supply (for X'tal oscillation circuit)
I
I
21 TRV O Traverse enforced output 61 BYTCK Not used
22 TVD O Traverse drive output 62 CLDCK I
I Not used
23 PC Not used 63 FLAG Not used
I
signal output)
26 KICK O Kick pulse output 66 CLVS Not used
I
32 FE I Focus error signal input (Analog input) 72 AVDD1 Power supply (Digital)
I
33 TE I Tracking error signal input (Analog input) 73 OUT L O Lch audio output
34 RF ENV I RF envelope signal input (Analog input) 74 AVSS1 Connected to GND
I
35 VDET I Vibration detect signal input (H:detect) 75 OUT R O Rch audio output
36 OFT I Off track signal input (H:off track) 76 RSEL pull up
I
1-53
CA-MXS6MDR
SP-MXS6MD
UPD780024AGKB08 (IC251) : Unit micon
1. Pin layout
64 ~ 49
1 48
~ ~
16 33
17 ~ 32
1-54
CA-MXS6MDR
SP-MXS6MD
2. Pin function (2/2)
Pin Symbol I/O Function
No.
33 TRY1CLOSE I Tray 1 close signal input
34 AVREF I Reference power supply voltage
35 AVDD I Reference power supply voltage
36 /RESET I CD reset signal input
37 XT2 O Non connect
38 XT1 I Reference power supply voltage
39 IC I No use ( for Flash micon)
40 X2 O X'tal osc output
41 X1 I X'tal osc input
42 VSS1 I Ground
43 FLAG O FLAG for C1 error
44 BLKCK O Sub Q block clock signal output
45 CAM_CW O Cam motor rotation clockwise
46 CAM_CCW O Cam motor rotation counter clockwise
47 ACT_CCW O Actuator motor rotation counter clockwise
48 ACT_CW O Actuator motor rotation clockwise
49 GCTRL I Gain select 2/4 speed
50 EQSW I Equalizer select 2/4 speed
51 ICAMP3 I Cam position 3
52 ICAMP4 I Cam position 4
53 /RESET O Reset signal output
54 STAT I Status signal input
55 /DMUTE I Digital mute signal input
56 /P.ON I Power on signal input
57 MLD I Command load signal input
58 MDATA I Command data input
59 MCLK I Command clock input
60 SELECT I Communication select signal input
61 RUNDATA I Running data input from running jig
62 RUNLOAD2 I Running load 2 signal input from running jig
63 RUNLOAD1 I Running load 1 signal input from running jig
64 RUNCLOCK I Running clock signal input from running jig
1-55
CA-MXS6MDR
SP-MXS6MD
AK93C65AF-X (IC590) : EEPROM
1.Pin layout
PE 1 8 NC
VCC 2 7 GND
CS 3 6 DO
SK 4 5 DI
8 PIN SOP
2.Block diagram
DO
DATA
REGISTER 16 16
R/W AMPS
AND
AUTO ERASE
DI INSTRUCTION EEPROM
REGISTER INSTRUCTION
DECODE,
CONTROL
AND
4096bit
CLOCK ADD. DECODER 256 x 16
GENERATION BUFFERS
CS
VPP SW
SK
PE VPP
VREF GENERATOR
3.Pin function
1-56
CA-MXS6MDR
SP-MXS6MD
BD7910FV-X (IC450) : Pre driver
1.Block diagram
20 19 18 17 16 15 14 13 12 11
- + + -
VG Mute
SVcc Pre driver
EFM
Vregin
1 2 3 4 5 6 7 8 9 10
2.Pin function
Pin Symbol I/O Function Pin
No. No. Symbol I/O Function
1 Vreg IN I Regulator input and regulator 11 NC - Non connect
1-57
CA-MXS6MDR
SP-MXS6MD
BR24C01AFV-W-X (IC201) : EEPROM
1.Pin layout Vcc WP SCL SDA
A0 A1 A2 GND
2.Block diagram
7bit 8bit
START STOP
A2 3 6 SCL
CONTROL LOGIC
ACK
3.Pin function
1-58
CA-MXS6MDR
SP-MXS6MD
HY51V17400CT-60 (IC390) : DRAM
1.Pin layout 2.Pin function
Pin Name Parameter
Vcc Vss /RAS Row Address Strobe
DQ0 DQ3
DQ1 DQ2 /CAS Column Address Strobe
WE CAS /WE Write Enable
RAS OE
A11 A9 /OE Output Enable
A0~A11 Address Input (4K Refresh Product)
A10 A8
A0 A7 A0~A10 Address Input (2K Refresh Product)
A1 A6 DQ0~DQ3 Data In/Out
A2 A5
Vcc Power (3.3V)
A3 A4
Vcc Vss Vss Ground
NC No Connection
4
4
WE
CAS 4 4
CAS Clock
Generator
(11/10)*
Cloumn Predecoder
A0 (11/12)* Column Decoder
A1
A2
A3 Sense Amp
Address Buffer
RAS Clock
RAS Generator Substrate Bias Vcc
Generator Vss
X16 Parallel
Test
1-59
CA-MXS6MDR
SP-MXS6MD
LA6541-X (IC801) : Servo driver
1. Pin Layout & block diagram
Vcc Vref Vin4 Vg4 Vo8 Vo7 Gnd Vo6 Vo5 Vg3 Vin3 Cd Res
24 23 22 21 20 19 18 17 16 15 14 13
- +
- + Level BTL BTL Level RESET
shift driver driver shift
11k 11k
ohm ohm
1 2 3 4 5 6 7 8 9 10 11 12
Vcc Mute Vin1 Vg1 Vo1 Vo2 Gnd Vo3 Vo4 Vg2 Vin2 Reg Reg
out In
2. Pin function
Pin
No.
Symbol Function
1 Vcc Power supply (Shorted to pin 24)
2 Mute All BTL amplifier outputs ON/OFF
3 Vin1 BTL AMP 1 input pin
4 Vg1 BTL AMP 1 input pin (For gain adjustment)
5 Vo1 BTL AMP 1 input pin (Non inverting side)
6 Vo2 BTL AMP 1 input pin (Inverting side)
7 Vo3 BTL AMP 2 input pin (Inverting side)
8 Vo4 BTL AMP 2 input pin (Non inverting side)
9 Vg2 BTL AMP 2 input pin (For gain adjustment)
10 Vin2 BTL AMP 2 input pin
11 Reg Out External transistor collector (PNP) connection. 5V power supply output
12 Reg In External transistor (PNP) base connection
13 Res Reset output
14 Cd Reset output delay time setting (Capacitor connected externally)
15 Vin3 BTL AMP 3 input pin
16 Vg3 BTL AMP 3 input pin (For gain adjustment)
17 Vo5 BTL AMP 3 output pin (Non inverting side)
18 Vo6 BTL AMP 3 output pin (Inverting side)
19 Vo7 BTL AMP 4 output pin (Inverting side)
20 Vo8 BTL AMP 4 output pin (Non inverting side)
21 Vg4 BTL AMP 4 output pin (For gain adjustment)
22 Vin4 BTL AMP 4 output pin
23 Vref Level shift circuit's reference voltage application
24 Vcc Power supply (Shorted to pin 1)
1-60
CA-MXS6MDR
SP-MXS6MD
M63008FP-X (IC410) : 5ch Actuator driver
1.Pin layout
REG+ CH3IN
REGB OUT3
IN1+ IN3-
VBS1 VBS2
Vm1 Vm2
IN1- IN3+
OUT1 N.C
VM1- VM3-
VM1+ VM3+
GND GND
VM2+ VM4+
VM2- VM4-
OUT2 VM5+
IN2- VM5-
IN2+ OUT5
MUTE1 IN5-
MUTE2 IN5+
SS,GND IN4+
VREF IN4-
VREFO OUT4
2.Block diagram
VBS2 IN3-
40
VBS1
IN1+ 3 R R
E3 37 IN3+
IN1- 6 41 OUT3
E1 R Vm1 Vm2 R
OUT1 7
VBS1 VBS2
42 CH3 IN
VM1(+) 9
CH1 Vrefm1 Vrefm2 CH3 34 VM3(+)
VM1(-) 8 X5 X8 35 VM3(-)
VBS1 VBS2
VM2(+) 12
CH2 CH4 31 VM4(+)
VM2(-) 13 X5 VREFO X8 30 VM4(-)
OUT2 14
BIAS HI :Sleep
VBS1 VBS1 23 IN4-
IN2-I 15
E4 24 IN4+
IN2+ 16
E2 22 OUT4
SLEEP VBS2
VREFO 21 Low,Open
VBS1
MUTE ON CH5 29 VM5(+)
VREF 20 VREF 1~4 X8 28 vm5(-)
CH 5CH
TSD
VBS2 1.25V VBS2
REGB 2 26 IN5-
VREG 25 IN5+
REG+ 1 E5
27 OUT5
19 17 18 10 11 32 33
MUTE1 MUTE2
SS,GND GND (4PIN)
1-61
CA-MXS6MDR
SP-MXS6MD
MN101C12GDW (IC851): Panel micon
1.Pin layout
75 ~ 51
76 50
~ ~
100 26
1 ~ 25
2. Pin function
Pin No. Symbol I/O Function
1 - - Connect to ground.
2 LEVEL Lch I Input terminal.
3 LEVEL Rch I Input terminal.
4~9 - - Connect to ground.
10 A / D Power - A / D Ref. voltage.
11 Vdd - Ref. voltage.
12 8.38MHz I OSC frequency input terminal.
13 8.38MHz O OSC frequency output terminal.
14 GND - Connect to ground.
15 - - Connect to ground.
16 - - Non use.
17~19 - - Connect to ground.
20 - - Connect to ground.
21 comm sysreq O System CPU require signal output terminal.
22 LED STBY red O Stand by LED (RED) output terminal.
23 LED POWER green O Power LED (GREEN) output terminal.
24 - - Connect to ground.
25 - - Connect to ground.
26 comm panereq I Panel CPU require signal input terminal.
27~32 - - Connect to ground.
33 comm reset I Reset signal input terminal.
34 - - Connect to ground.
35 - - Connect to ground.
36 LED MD REC O MD (RED) output terminal.
37~41 - - Connect to ground.
42 comm out O Commor signal output terminal.
43 comm in I Commor signal input terminal.
44 comm clock I Commor clock signal input terminal.
45~57 - - Connect to ground.
58 LCD WE O Write enable output terminal.
59 LCD RE O Read enable output terminal.
60 LCD CS1 O Chip select output terminal.
61 - - Connect to ground.
62 - - Connect to ground.
63 LCD AO O Data select signal output terminal.
64 LCD RESET O LCD reset signal output terminal.
65~72 - - Connect to ground.
73 LCD LEDdimmer O Dimmer control terminal.
74~78 - - Connect to ground.
79~86 LCD D7~D0 O Pata bus signal output terminal.
87~94 - - Connect to ground.
95 DVASS - Connect to ground.
96 - - Non use.
97 LED RED O Red LED control terminal.
98 LED GREEN O Green LED control terminar.
99 LED BLUE O Blue LED control terminal.
100 DAVdd - Ref. voltage.
1-62
CA-MXS6MDR
SP-MXS6MD
NJM4580D (IC672) : LPF, Mic and H.phone Amp.
1.Terminal layout
A OUT 1 8 V+
A -IN 2 7 B OUT
A B
A +IN 3 6 B -IN
V- 4 5 B +IN
(TOP VIEW)
2.Block diagram
+
V
INPUT
+
OUTPUT
V-
1-63
CA-MXS6MDR
SP-MXS6MD
STK402-030 (IC301) : Power amp.
1.Pin layout
1 15
2.Block diagram
8
TR7 TR9
R1 R13
TR4 TR11
R6 R8
C1 C2
TR14 TR15
1
TR5 TR12
TR1 TR2 R3 R11
TR8 TR10
2
R4 R12
TR6 TR13
R5 R10
TR3 TR16
D1
R2 R7 R9
R14
SUB
5 13 12 7 6 10 11 14 15
1-64
CA-MXS6MDR
SP-MXS6MD
TC7S08F-W (IC340) : Buffer
IN B 1 5 VDD A
Y
IN A 2
Vss 3 4 OUT X B
GND
Vcc
IN B 1 5 VDD A
Y
IN A 2
A
Vss 3 4 OUT X
GND
A OUT 1 8 V+
A -IN 2 7 B OUT
1 2 3 4 5 6 7 8 9 10
A +IN 3 6 B -IN
2. Pin function
1-65
CA-MXS6MDR
SP-MXS6MD
TDA7439 (IC671) : Control volume
1.Pin layout
SDA 1 30 CSL
CRE 2 29 DIG GND
Vs 3 28 TREBLE(R)
AGND 4 27 TREBLE(L)
ROUT 5 26 MIN(L)
LOUT 6 25 MOUT(L)
R-IN4 7 24 BOUT(L)
R-IN3 8 23 BIN(L)
R-IN2 9 22 BOUT(R)
R-IN1 10 21 BIN(R)
L-IN1 11 20 MOUT(R)
L-IN2 12 19 MIN(R)
L-IN3 13 18 INR
L-IN4 14 17 MUXOUTR
MUXOUTL 15
TDA7439 16 INL
2.Block diagram
TREBLE(L)
MUXOUT
BOUT(L)
MOT(L)
MIN(L)
BIN(L)
INL
15 16 27 26 25 23 24
L-IN1 11
SPEAKER
G VOLUME TREBLE MIDLE BASS ATT 6 LOUT
LEFT
L-IN2 12
L-IN3 13 30 SCL
0/30dB 2
I C BUS DECODER LATCHES
L-IN4 14 2dB STEP 1 SDA
R-IN1 10 29 DIG-GND
R-IN2 9
SPEAKER
G VOLUME TREBLE MIDLE BASS ATT 5 ROUT
R-IN3 8 RIGHT
R-IN4 7 INPUT
MULTIPLEXER 3 Vs
GAIN SUPPLY
4 AGND
17 18 28 19 20 21 22 2
MIN(R)
TREBLE(R)
BIN(R)
BOUT(R)
MOUT(R)
CREF
INR
MUXOUT
1-66
CA-MXS6MDR
SP-MXS6MD
TK11140SC-W (IC485) : Regulator
1.Pin layout
2.Block diagram
VOUT
VIN
Thermal Sensor
Rin=550k
on / off Ccont.
Bandgap Reference
Cnp
GND
100 A 100 A
OUT1 1 8 V+
Q2 Q3
Ii1 2 7 OUT2 IN Q1 Q4
1 2
OUT
IN1 3 6 Ii2 Q8
Ii
Q7
V- 4 5 IN2
Q5 Q6
V-
1-67
CA-MXS6MDR
SP-MXS6MD
XC62ER3602M-X (IC400) : Regulator
1.Pin layout
5 4
1 2 3
2.Block diagram
VDD VOUT
EXT
Current
+
Limit
-
Voltage
CE Reference
V SS
3.Pin function
1-68
CA-MXS6MDR CA-MXS6MDR
SP-MXS6MD SP-MXS6MD
Printed in Japan
1-69
No.20876 200009(O)