Market Research
Project: DNSS
Prepared by: JTM ABDULLAH KHALID
Phase 1: Research and Conceptualization - Conduct extensive market research to
identify emerging trends and user needs. Define a set of artificial features, such as
image recognition, augmented reality, and intelligent scene analysis, that align with
consumer demands.
Phase 2: Design and Prototyping - Develop a detailed design incorporating the
chosen artificial features. Create a functional prototype to test the integration of
these features, ensuring seamless performance and user-friendly interfaces.
Phase 3: Testing and Optimization - Rigorous testing to evaluate the prototype's
reliability, accuracy, and overall performance. Collect user feedback to identify areas
for improvement, and optimize the camera's algorithms and software for enhanced
functionality and responsiveness.
Phase 4: Manufacturing and Assembly - Scale up production based on successful
prototype testing. Collaborate with manufacturing partners to ensure mass
production meets quality standards while maintaining cost-effectiveness.
PHASE 1 A.I features on pc
PHASE 2 Camera + platform
PHASE 3 Gimbal addition
PHASE 4 Multicamera addition
Presented to: Dr. Aamir Irshad
Available resources.
Recommendations for new processors will be issued after comprehensive study.
Features
ROCK ROCK ROCK ROCK
ROCK ROCK 4 ROCK (PI)
Model (PI) (PI) (PI) 4A (PI) 4B
(PI) 4C SE 4C Plus
4A 4B Plus Plus
64bits hexa core
64bits hexa core
64bits hexa core processor
processor
processor Rockchip OP1
Rockchip RK3399-T
Rockchip RK3399 Dual Cortex-72,
Dual Cortex-72,
Dual Cortex-72, frequency 2.0GHz
frequency 1.5GHz
frequency 1.8GHz wit with qual Cortex-
with qual Cortex-
Process h qual Cortex-A53, A53,
A53,
or frequency 1.4GHz frequency 1.5GHz
frequency 1.0GHz
Mali T860MP4 gpu, Mali T860MP4
Mali T860MP4 gpu,
support OpenGL ES gpu, support
support OpenGL ES
1.1/2.0/3.0/3.1/3.2, OpenGL ES
1.1/2.0/3.0/3.1/3.2,
Vulkan 1.0, Open CL 1.1/2.0/3.0/3.1/3.2,
Vulkan 1.0, Open CL
1.1 1.2, DX11. Vulkan 1.0, Open
1.1 1.2, DX11.
CL 1.1 1.2, DX11.
LPDDR4
Memory
64bit dual channel LPDDR4@3200Mb/s, 1GB/2GB/4GB optioal
eMMC
connec
tor
μSD
card
(μSD
on board eMMC slot
with up to 128GB support
eMMC connector eMMC
variant available s up to
μSD card (μSD slot connector
μSD card (μSD slot 256 GB
supports up to 256 GB μSD card
supports up to μSD
Storage μSD card) (μSD slot
256 GB μSD card) card)
M.2 SSD (M.2 supports up
M.2 SSD (M.2 M.2
connector supports up to 256 GB
connector SSD
to 2T M2 NVME SSD) μSD card)
supports up to 2T (M.2
M2 NVME SSD) connec
tor
support
s up to
2T M2
NVME
SSD)
Mini DP One Micro
up to HDMI 2K up
Standard 1440P@6 to
HDMI 2.0 up 0 1440P@60
to 4k@60 Micro One Micro
MIPI DSI 2 HDMI 2.0 HDMI 4K
Standard HDMI 2.0 up to
lanes via up to 2.0 up to
4k@60
FPC 4k@60 4k@60
MIPI DSI 2 lanes via FPC
connector MIPI DSI MIPI DSI 4
connector
Display HDMI and 2 lanes lanes via
HDMI and MIPI DSI can
MIPI DSI can via FPC FPC
work at the same time,
work at the connect connector
support mirror mode or
same time, or Only two of
extend mode.
support HDMI HDMI 2k,
mirror mode and DP HDMI 4K
or extend can work and MIPI
mode. at the DSI can
same work at the
time. same time.
3.5mm jack
HD codec
that
3.5mm jack with mic
Audio supports up
HD codec that supports up to 24-bit/96KHz audio.
to
24-bit/96KH
z audio.
MIPI CSI 2
lanes via
FPC
connector,
MIPI CSI 2 lanes via FPC connector, support up to
Camera support up
800 MP camera(1mm pitch connector).
to 800 MP
camera(0.3
mm pitch
connector).
Wireless None 802.11 ac wifi None 802.11 ac wifi 802.11 ac
BT 5.0 BT 5.0 wifi
BT 5.0
with on board with on board with
antenna antenna external
antenna
USB 3.0 OTG X1, hardware switch for host/device switch, upper
one
USB
USB 3.0 HOST X1, dedicated USB 3.0 channel, lower one
USB 2.0 HOST X2
GbE LAN with
Power over
Ethernet (PoE) GbE LAN with Power over
GbE support GbE Ethernet (PoE) support
Ethernet
LAN additional HAT LAN additional HAT is required for
is required for powering from PoE
powering from
PoE
40-pin expansion header
2 x UART
2 x SPI bus
3 x I2C bus
1 x PCM/I2S
IO 1 x SPDIF
2 x PWM
1 x ADC
6 x GPIO
2 x 5V DC power in
2 x 3.3V DC power in
RTC RTC
Others
RTC battery connector for time backup(optional) None
USB PD, support USB Type C PD 2.0, 9V/2A, 12V/2A.
USB C
Power Qualcomm® Quick ChargeTM: Supports QC 3.0/2.0
5V/3A
adapter, 9V/2A, 12V/1.5A
Size 85mm x 54mm
