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SSD DC s3700 Spec

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SSD DC s3700 Spec

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© © All Rights Reserved
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Intel® Solid-State Drive DC S3700 Series

Product Specification
 Capacity: 2.5-inch: 100GB, 200GB, 400GB, 800GB  Power Management
1.8-inch: 200GB, 400GB − 2.5-inch: 5V or 12V SATA Supply Rail10
 Components: − 1.8-inch: 3.3V SATA Supply Rail
− Intel® 25nm NAND Flash Memory − SATA Interface Power Management
− High Endurance Technology (HET) Multi-Level Cell − OS-aware hot plug/removal
(MLC) − Enhanced power-loss data protection
 Form Factors: 2.5-inch and 1.8-inch  Power11
 Read and Write IOPS1,2 (Full LBA Range, IOMeter* Queue − Active: Up to 6 W (TYP)
Depth 32) − Idle: 650 mW
− Random 4KB3 Reads: Up to 75,000 IOPS  Weight:
− Random 4KB Writes: Up to 36,000 IOPS − 2.5” 200, 400, 800GB: 73.6 grams ± 2 grams
− Random 8KB3 Reads: Up to 47,500 IOPS − 2.5” 100GB: 70 grams ± 2 grams
− Random 8KB Writes: Up to 20,000 IOPS − 1.8” 200, 400GB: 38 grams ± 2 grams
 Bandwidth Performance1  Temperature
− Sustained Sequential Read: Up to 500 MB/s4 − Operating: 0o C to 70o C
− Sustained Sequential Write: Up to 460 MB/s − Non-Operating12: -55o C to 95o C
 Endurance: 10 drive writes per day5 for 5 years − Temperature monitoring and logging
 Latency (average sequential) − Thermal throttling
− Read: 50 µs (TYP)  Shock (operating and non-operating):
− Write: 65 µs (TYP) − 1,000 G/0.5 msec
 Quality of Service6,8  Vibration
− Read/Write: 500 µs (99.9%) − Operating: 2.17 GRMS (5-700 Hz)
 Performance Consistency7,8 − Non-operating: 3.13 GRMS (5-800 Hz)
Read/Write: Up to 90%/90% (99.9%)  Reliability
 AES 256-bit Encryption − Uncorrectable Bit Error Rate (UBER):
 Altitude (simulated) 1 sector per 10^17 bits read
– Operating: -1,000 to 10,000 ft − Mean Time Between Failures (MTBF):
– Operating9: 10,000 to 15,000 ft 2 million hours
– Non-operating: -1,000 to 40,000 ft − End-to-End data-path protection
 Product Ecological Compliance  Certifications and Declarations
− RoHS* − UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft* WHCK*,
 Compliance VCCI*, SATA-IO*
− SATA Revision 3.0; compatible with SATA 6Gb/s, 3Gb/s  Compatibility
and 1.5Gb/s interface rates − Windows* 7 and Windows* 8
− ATA/ATAPI command Set – 2 (ACS-2); includes SCT − Windows* Server 2012
(Smart Command Transport) and device statistics log − Windows* Server 2008 Enterprise 32/64bit SP2
support − Windows* Server 2008 R2 SP1
− Enhanced SMART ATA feature set − Windows* Server 2003 Enterprise R2 64bit SP2
− Native Command Queuing (NCQ) command set − Red Hat* Enterprise Linux* 5.5, 5.6, 6.1, 6.3
− Data set management Trim command − SUSE* Linux* Enterprise Server 10, 11 SP1
− CentOS* 64bit 5.7, 6.3
− Intel® SSD Toolbox with Intel® SSD Optimizer
1. Performance values vary by capacityandformfactor
2. Performance specifications apply to both compressible and incompressible data
3. 4KB = 4,096 bytes; 8KB = 8,192 bytes.
4. MB/s = 1,000,000 bytes/second
5. Based on JESD218 standard. For 200GB 1.8 inches drive, it is 9.8 drives write per day.
6. Based on Random 4KB QD=1 workload, measured as the time taken for 99.9 percentile of commands to finish the round-trip from host to drive and back to host
7. Based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test)
8. Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability
9. Extended operation at a higher altitude might impact reliability.
10. Defaults to 12V, if both 12V and 5V are present
11. Based on 5V supply; refer to Table 7 for more details
12. Please contact your Intel representative for details on the non-operating temperature range

Order Number: 328171-010US


Ordering Information

Contact your local Intel sales representative for ordering information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS
INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU
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MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or
instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities
arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and
MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to
vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that prod-
uct when combined with other products.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications.
Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to:
http://www.intel.com/design/literature.htm
Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components
on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants
and/or PVC may not be better for the environment.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2015 Intel Corporation. All rights reserved.

Product Specification January 2015


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Intel® Solid-State Drive DC S3700 Series

Contents
Revision History ........................................................................................................................................................................ 4
Terms and Acronyms................................................................................................................................................................ 5
1.0 Overview....................................................................................................................................................................... 6
2.0 Product Specifications............................................................................................................................................... 7
2.1 Capacity ......................................................................................................................................................................................... 7
2.2 Performance ................................................................................................................................................................................ 7
2.3 Electrical Characteristics........................................................................................................................................................ 9
2.4 Environmental Conditions ................................................................................................................................................. 11
2.5 Product Regulatory Compliance ..................................................................................................................................... 12
2.6 Reliability ................................................................................................................................................................................... 12
2.7 Temperature Sensor............................................................................................................................................................. 13
2.8 Power Loss Capacitor Test ................................................................................................................................................ 13
2.9 Hot Plug Support ................................................................................................................................................................... 13
3.0 Mechanical Information ......................................................................................................................................... 14
4.0 Pin and Signal Descriptions .................................................................................................................................. 16
4.1 2.5-inch Form Factor Pin Locations .............................................................................................................................. 16
4.2 1.8-inch Form Factor Pin Locations .............................................................................................................................. 16
4.3 Connector Pin Signal Definitions .................................................................................................................................... 17
4.4 Power Pin Signal Definitions............................................................................................................................................. 17
5.0 Supported Command Sets..................................................................................................................................... 19
5.1 ATA General Feature Command Set ............................................................................................................................. 19
5.2 Power Management Command Set............................................................................................................................... 19
5.3 Security Mode Feature Set ................................................................................................................................................ 20
5.4 SMART Command Set ......................................................................................................................................................... 20
5.5 Device Statistics ...................................................................................................................................................................... 27
5.6 SMART Command Transport (SCT) ............................................................................................................................... 28
5.7 Data Set Management Command Set .......................................................................................................................... 28
5.8 Host Protected Area Command Set .............................................................................................................................. 28
5.9 48-Bit Address Command Set ......................................................................................................................................... 29
5.10 General Purpose Log Command Set............................................................................................................................. 29
5.11 Native Command Queuing ................................................................................................................................................ 29
5.12 Software Settings Preservation ....................................................................................................................................... 29
6.0 Certifications and Declarations ............................................................................................................................ 30
7.0 References................................................................................................................................................................. 31
Appendix A: IDENTIFY DEVICE Command Data ............................................................................................................... 32

January 2015 Product Specification


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Intel® Solid-State Drive DC S3700 Series

Revision History
Date Revision Description

October 2012 001 Initial release

November 2012 002 Updated Power On to Ready specification for 800 GB capacity

Updated: OS Compatibility; Certifications and Declarations; Power Pin Signal Definitions;


February 2013 003
SMART Attributes descriptions

March 2013 004 Edited for clarity

Updated Device Identify Table; SMART Attribute Definition. Endurance spec for 1.8-inch
April 2013 005
200 GB drive, voltage spec

June 2013 006 Added X,Y, Z dimension in section 3.0

Page 1: Compliance, Changed from ATA8-ACS2 to ATA9-ACS2


Table 14: Changed Endurance Rating Value
March 2014 007 Table 18: Changed SMART Attribute E9h, PW and Threshold values to 1.
Section 5.4.1.1: Added User Notes and changed step 6 in Use Case 2.
Appendix A: Changes to Words 59-62, 80, 81, 89, 90, 129-159, 176-205 and 255.

Page 1: Compliance, Changed from ATA9-ACS2 to ATA/ATAPI Command Set - 2 (ACS-2)


Table 9: Added footnotes
April 2014 008 Table 10: Footnote corrections
Table 11: Title correction
Appendix A: Changed Default Value of Word 105 from 0004h to 0006h

Page 1: Altitude spec change with added footnote (note 9).


September 2014 009 Table 14: Updated footnote for Reliability table
Table 18: Updated SMART attribute B8h description and changed threshold values

In Section 5.6, added clarification to word 106 of Identify Device Command and SCT
January 2015 010
command process to change the reported value.

Product Specification January 2015


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Intel® Solid-State Drive DC S3700 Series

Terms and Acronyms

Term Definition

ATA Advanced Technology Attachment


CRC Cyclic Redundancy Check
DAS Device Activity Signal
DMA Direct Memory Access
ECC Error Correction Code
EXT Extended
FPDMA First Party Direct Memory Access
Gigabyte
GB Note: The total usable capacity of the SSD may be less than the total physical capacity because a
small portion of the capacity is used for NAND flash management and maintenance purposes.
Gb Gigabit
HDD Hard Disk Drive
HET High Endurance Technology
KB Kilobyte
I/O Input/Output
IOPS Input/Output Operations Per Second
ISO International Standards Organization
LBA Logical Block Address
MB Megabyte (1,000,000 bytes)
MLC Multi-level Cell
MTBF Mean Time Between Failures
NCQ Native Command Queuing
NOP No Operation
PB Petabyte
PBW Peta Bytes Written
PCB Printed Circuit Board
PIO Programmed Input/Output
RDT Reliability Demonstration Test
RMS Root Mean Square
SATA Serial Advanced Technology Attachment
SCT SMART Command Transport
Self-Monitoring, Analysis and Reporting Technology
SMART An open standard for developing hard drives and software systems that automatically monitors the
health of a drive and reports potential problems.
SSD Solid-State Drive
TB Terabyte
TB Tera Bytes Written
TYP Typical
UBER Uncorrectable Bit Error Rate

January 2015 Product Specification


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Intel® Solid-State Drive DC S3700 Series

1.0 Overview
This document describes the specifications and capabilities of the Intel® SSD DC S3700 Series.

The Intel SSD DC S3700 Series delivers leading performance and Quality of Service combined with
world-class reliability and endurance for Serial Advanced Technology Attachment (SATA)-based
computers in four capacities: 100GB, 200GB, 400GB and 800GB.

By combining 25nm Intel® NAND Flash Memory technology with SATA 6Gb/s interface support, the
Intel SSD DC S3700 Series delivers sequential read speeds of up to
500 MB/s and sequential write speeds of up to 460 MB/s. Intel SSD DC S3700 Series delivers
Quality of Service of 500 µs for random 4KB reads and writes measured at a queue depth of 1
(see Table 6).

The Intel SSD DC S3700 Series also includes High Endurance Technology (HET), which combines
NAND silicon enhancements and SSD NAND management techniques to extend the write endurance
of an SSD, leading to lifetime endurance levels of 10 drive writes per day for 5 years.

The industry-standard 2.5-inch form factor enables interchangeability with existing hard disk drives
(HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability,
ruggedness, and power savings offered by an SSD.

Intel SSD DC S3700 Series offers these key features:

• High Endurance Technology (HET)


• High I/O and throughput performance
• Consistent I/O latency
• Enhanced power-loss data protection
• End-to-End data-path protection
• Thermal throttling
• Temperature Sensor
• Inrush current management
• Low power
• High reliability
• Enhanced ruggedness
• Temperature monitor and logging
• Power loss protection capacitor self-test

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Intel® Solid-State Drive DC S3700 Series

2.0 Product Specifications


2.1 Capacity

Table 1: User Addressable Sectors

Unformatted Capacity
Intel® SSD DC S3700 Series
(Total User Addressable Sectors in LBA Mode)

100GB 195,371,568

200GB 390,721,968

400GB 781,422,768

800GB 1,562,824,368

Notes:
1GB = 1,000,000,000 bytes; 1 sector = 512 bytes.
LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive.
The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash
management and maintenance purposes.

2.2 Performance

Table 2: Random Read/Write Input/Output Operations Per Second (IOPS)

Intel SSD DC S3700 Series


Specification1 Unit
100 GB 200 GB (2.5”/1.8”) 400 GB (2.5”/1.8”) 800 GB

Random 4KB Read (up to)2 IOPS 75,000 75,000 / 75,000 75,000 / 75,000 75,000

Random 4KB Write (up to) IOPS 19,000 32,000 / 29,000 36,000 / 36,000 36,000

Random 8KB Read (up to)3 IOPS 47,500 47,500 / 47,500 47,500 / 47,500 47,500

Random 8KB Write (up to) IOPS 9,500 16,500 / 14,500 19,500 / 19,500 20,000

Notes:
1. Performance measured using IOMeter* with Queue Depth 32. Measurements are performed on a full Logical Block Address (LBA) span of the
drive.
2. 4KB = 4,096 bytes
3. 8KB = 8,192 bytes

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Intel® Solid-State Drive DC S3700 Series

Table 3: Random Read/Write IOPS Consistency

Intel SSD DC S3700 Series


Specification1 Unit
100 GB 200 GB (2.5”/1.8”) 400 GB (2.5”/1.8”) 800 GB

Random 4KB Read (up to)2 % 90 90 90 90

Random 4KB Write (up to) % 85 90 90 90

Random 8KB Read (up to)3 % 90 90 90 90

Random 8KB Write (up to) % 85 90 90 90

Notes:
1. Performance consistency measured using IOMeter* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th
percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span
of the drive once the workload has reached steady state but including all background activities required for normal operation and
data reliability.
2. 4KB = 4,096 bytes
3. 8KB = 8,192 bytes

Table 4: Sequential Read and Write Bandwidth

Intel® SSD DC S3700 Series


Specification Unit
100GB 200GB 400GB 800GB

Sequential Read (SATA 6Gb/s)1 MB/s 500 500 500 500

Sequential Write (SATA 6Gb/s)1 MB/s 200 365 460 460

Notes:
1. Performance measured using IOMeter* with 128KB (131,072 bytes) of transfer size with Queue Depth 32.

Table 5: Latency

Intel SSD DC S3700 Series


Specification
100, 200 and 400GB 800 GB

Latency1 (TYP)
Read 50 µs 50 µs
Write 65 µs 65 µs
Power On to Ready 2 2.0 s 3.0 s

Notes:
1. Device measured using IOMeter. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential
workload.
2. Power On To Ready time assumes proper shutdown. Time varies if shutdown is not preceded by STANDBY IMMEDIATE command.

Product Specification January 2015


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Intel® Solid-State Drive DC S3700 Series

Table 6: Quality of Service

Intel SSD DC S3700 Series

Queue Depth=1 Queue Depth=32


Specification Unit
200/400/800 200/400/800
100GB 100GB
GB GB

Quality of Service1,2 (99.9%)

Reads ms 0.5 0.5 1 1

Writes ms 0.5 0.5 15 10

Quality of Service 1,2 (99.9999%)

Reads ms 10 5 10 5

Writes ms 10 5 20 20

Notes:
1. Device measured using IOMeter. Quality of Service measured using 4 KB (4,096 bytes) transfer size on a random workload on a full Logical
Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal
operation and data reliability.
2. Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the
round-trip from host to drive and back to host.

2.3 Electrical Characteristics

Table 7: Operating Voltage for 2.5-inch Form Factor

Intel® SSDDC S3700 Series


Electrical Characteristics
100, 200, 400 and 800GB

5 V Operating Characteristics:

Operating Voltage range 5 V (±5%)


Rise time (Max/Min) 1 s / 1 ms
Fall time (Min)2 1 ms
Noise level 500 mV pp 10 Hz – 100 KHz
50 mV pp 100 KHz – 20 MHz
Min Off time3 500 ms
Inrush Current (Typical Peak) 1 1.0 A, < 1 s

12 V Operating Characteristics:

Operating Voltage range 12 V (±10%)


Rise time (Max/Min) 1 s / 1 ms
Fall time (Min)2 1 ms
Noise level 1000 mV pp 10 Hz – 100 KHz
100 mV pp 100 KHz – 20 MHz
Min Off time3 500 ms
Inrush Current (Typical Peak) 1 1.0 A, < 1 s

Notes:
1. Measured from initial device power supply application
2. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management
3. The drive needs to be powered off for at least 500msec before powering on

January 2015 Product Specification


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Intel® Solid-State Drive DC S3700 Series

Table 8: Power Consumption for 2.5-inch Form Factor (5V Supply)

Intel SSD DC S3700 Series


Specification Unit
100GB 200GB 400GB 800GB

Active Write - RMS Average 1 W 2.8 4.2 5.2 5.8

Active Write - RMS Burst 2 W 3.1 4.6 7.7 8.2

Idle W 0.6 0.6 0.6 0.6

Notes:
1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is
measured using scope trigger over a 100 ms sample period
2. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured
using scope trigger over a 500 µs sample period

Table 9: Power Consumption for 2.5-inch Form Factor (12V Supply)

Intel SSD DC S3700 Series


Specification Unit
100GB 200GB 400GB 800GB

Active Write - RMS Average1 W 2.9 4.4 5.4 6.0

Active Write - RMS Burst2 W 3.3 4.8 7.6 8.2

Idle W 0.8 0.8 0.8 0.8

Notes:
1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is
measured using scope trigger over a 100 ms sample period
2. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured
using scope trigger over a 500 µs sample period

Table 10: Operating Voltage for 1.8-inch Form Factor

Intel® SSD DC S3700 Series


Electrical Characteristics
200 and 400GB

Operating Voltage for 3.3 V (±5%)


Min 3.13 V
Max 3.47 V
Rise time (Max/Min) 1 s / 1 ms
Fall time (Min)2 1 ms
Noise level 300 mV pp 10 Hz – 100 KHz
500 mV pp 100 KHz – 20 MHz
Min Off time3 500 ms

Inrush Current (Typical Peak) 1 1.2 A, < 1 s

Notes:
1. Measured from initial device power supply application
2. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management
3. The drive needs to be powered off for at least 500msec before powering on

Product Specification January 2015


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Intel® Solid-State Drive DC S3700 Series

Table 11: Power Consumption for 1.8-inch Form Factor

Intel SSD DC S3700 Series


Specification1 Unit
200GB 400GB

Active Write - RMS Average @ 3.3V W 4.3 5.3

Active Write - RMS Burst @ 3.3V W 4.7 7.9

Idle @ 3.3V W 0.6 0.6

Notes:
1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) power is measured
using scope trigger over a 100 ms sample period.

2.4 Environmental Conditions

Table 12: Temperature, Shock, Vibration

Temperature Range

Case Temperature
Operating 0 – 70 oC
1
Non-operating -55 – 95 oC

Temperature Gradient2
Operating 30 oC/hr (Typical)
Non-operating 30 oC/hr (Typical)

Humidity
Operating 5 – 95 %
Non-operating 5 – 95 %

Shock and Vibration Range

Shock3
Operating 1,000 G (Max) at 0.5 msec
Non-operating 1,000 G (Max) at 0.5 msec

Vibration4
Operating 2.17 GRMS (5-700 Hz) Max
Non-operating 3.13 GRMS (5-800 Hz) Max

Notes:
1. Please contact your Intel representative for details on the non-operating temperature range.
2. Temperature gradient measured without condensation.
3. Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be
applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.
4. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be
applied in the X, Y or Z axis. Vibration specification is measured using RMS value.

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Intel® Solid-State Drive DC S3700 Series

2.5 Product Regulatory Compliance


Intel® SSD DC S3700 Series meets or exceeds the regulatory or certification requirements in the following table:

Table 13: Product Regulatory Compliance Specifications

Region For Which


Title Description
Conformity Declared

TITLE 47-Telecommunications CHAPTER 1—


FCC Part 15B Class B
FEDERAL COMMUNMICATIONS COMMISSION PART USA
15 — RADIO FREQUENCY DEVICES
CA/CSA-CEI/IEC CISPR 22:02. This is CISPR
ICES-003, Issue 4 Interference-Causing Equipment Canada
22:1997 with Canadian Modifications
Standard Digital Apparatus

IEC 55024 Information Technology Equipment —


Immunity characteristics— Limits and methods of EN-55024: 1998 and its amendments European Union
measurement CISPR24:2010

IEC 55022 Information Technology Equipment —


Radio disturbance Characteristics— Limits and EN-55022: 2006 and its amendments European Union
methods of measurement CISPR24:2008 (Modified)

Information Technology Equipment —


EN-60950-1 2nd Edition USA/Canada
Safety — Part 1: General Requirements

Information Technology Equipment —


UL/CSA EN-60950-1 2nd Edition USA/Canada
Safety — Part 1: General Requirements

2.6 Reliability
Intel SSD DC S3700 Series meets or exceeds SSD endurance and data retention requirements as specified in the
JESD218 standard. Reliability specifications are listed in the following table:

Table 14: Reliability Specifications

Parameter Value

Uncorrectable Bit Error Rate (UBER)

Uncorrectable bit error rate will not exceed one sector in the
specified number of bits read. In the unlikely event of a < 1 sector per 1017 bits read
non-recoverable read error, the SSD will report it as a read failure
to the host; the sector in error is considered corrupt and is not
returned to the host.

Mean Time Between Failures (MTBF)

Mean Time Between Failures is estimated based on Telcordia* 2 million hours


methodology and demonstrated through Reliability
Demonstration Test (RDT).

Product Specification January 2015


12 328171-010US
Intel® Solid-State Drive DC S3700 Series

Parameter Value

Power On/Off Cycles

Power On/Off Cycles is defined as power being removed from the 24 per day
SSD, and then restored. Most host systems remove power from
the SSD when entering suspend and hibernate as well as on a
system shutdown.

Insertion Cycles
50 on SATA cable
500 on backplane
SATA/power cable insertion/removal cycles.

Data Retention
3 months power-off retention once SSD
The time period for retaining data in the NAND at maximum rated reaches rated write endurance at 40 °C
endurance.

Endurance Rating 100GB: 1.83 PBW


200GB: 3.65 PBW
400GB: 7.30 PBW
While running JESD218 standard1 and based on JESD219 workload.
800GB: 14.60 PBW

Note:
1 Refer to JESD218 standard table 1 for UBER, FFR and other Enterprise SSD endurance verification requirements. UBER design and majority of
life target is 1E-17. Endurance verification acceptance criterion based on establishing <1E-16 at 60 confidence.

2.7 Temperature Sensor


The Intel® SSD DC S3700 Series has an internal temperature sensor with an accuracy of +/-2C over a
range of -20C to +80C which can be monitored using two SMART attributes: Airflow Temperature
(BEh) and Device Internal Temperature (C2h).

For more information on supported SMART attributes, see Table 19 “SMART Attributes” on page 20.

2.8 Power Loss Capacitor Test


The Intel SSD DC S3700 Series supports testing of the power loss capacitor, which can be
monitored using the following SMART attribute: (175, AFh).

2.9 Hot Plug Support


Hot Plug insertion and removal is supported in the presence of a proper connector and appropriate
operating system (OS), as described in the SATA 3.0 specification.

This product supports asynchronous signal recovery and issues an unsolicited COMINIT when first
mated with a powered connector to guarantee reliable detection by a host system without hardware
device detection.

January 2015 Product Specification


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Intel® Solid-State Drive DC S3700 Series

3.0 Mechanical Information


Figures 1 and 2 show the physical package information for the Intel® SSD DC S3700 Series in the 2.5- and
1.8-inch form factors. All dimensions are in millimeters.

Figure 1. Intel SSD DC S3700 Series, 2.5-inch Form Factor Dimensions

X – Length -- * Y - Width Z - Height

100.45 Max 69.85 +/- 0.25 7.0 +0/-0.5

* - does not include 0.3 connector protrusion

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Figure 2: Intel® SSD DC S3700 Series, 1.8-inch Form Factor Dimensions

X - Length Y - Width Z - Height

78.50 +/- 0.60 54.0 +/- 0.25 5.0 +/- 0.35

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4.0 Pin and Signal Descriptions


4.1 2.5-inch Form Factor Pin Locations

Figure 3: Layout of 2.5-inch Form Factor Signal and Power Segment Pins

Note: 2.5-inch connector supports built in latching capability.

4.2 1.8-inch Form Factor Pin Locations

Figure 4: Layout of 1.8-inch Form Factor Signal and Power Segment Pins

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4.3 Connector Pin Signal Definitions

Table 15: Serial ATA Connector Pin Signal Definitions—2.5- and 1.8-inch Form Factors

Pin Function Definition

S1 Ground 1st mate


S2 A+
Differential signal pair A
S3 A-
S4 Ground 1st mate
S5 B-
Differential signal pair B
S6 B+
S7 Ground 1st mate

Note: Key and spacing separate signal and power segments.

4.4 Power Pin Signal Definitions

Table 16: Serial ATA Power Pin Definitions—2.5-inch Form Factors

Pin1 Function Definition Mating Order

P12 Not connected (3.3 V Power) --


P22 Not connected (3.3 V Power) --
2 nd
P3 Not connected (3.3 V Power; pre-charge) 2 Mate
3,4
P4 Ground Ground 1st Mate
P53 Ground Ground 1st Mate
P63 Ground Ground 1st Mate
P73,5 V5 5 V Power 1st Mate
3,5
P8 V5 5 V Power 2nd Mate
P93,5 V5 5 V Power 2nd Mate
P103 Ground Ground 1st Mate
Device Activity Signal/Disable Staggered
P116 DAS/DSS 2nd Mate
Spin-up
P123,4 Ground Ground 1st Mate
P137 V12 12 V Power 1st Mate
P147 V12 12 V Power 2nd Mate
P157 V12 12 V Power 2nd Mate

Notes:
1. All pins are in a single row, with a 1.27 mm (0.050-inch) pitch.
2. Pins P1, P2 and P3 are connected together, although they are not connected internally to the device. The host may put 3.3 V on these pins.
3. The mating sequence is:
• ground pins P4-P6, P10, P12 and the 5V power pin P7
• signal pins and the rest of the 5V power pins P8-P9
4. Ground connectors P4 and P12 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in
a suitably configured backplane connector.
5. Power pins P7, P8, and P9 are internally connected to one another within the device.
6. The host may ground P11 if it is not used for Device Activity Signal (DAS).
7. Pins P13, P14 and P15 are internally connected to one another within the device. The host may put 12 V on these pins.

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Table 17: Serial ATA Power Pin Definitions—1.8-inch Form Factors

Pin Function Definition Mating Order1

P12 V33 3.3 V Power 2nd Mate

P22 V33 3.3 V Power, per-charge 2nd Mate

P33 Ground -- 1st Mate

P43 Ground -- 1st Mate

P54 V5 5 V Power; not connected. 1st Mate

P64 V5 5 V Power; not connected. 2nd Mate

Device Activity Signal/Disable Staggered


P75 DAS/DSS 2nd Mate
Spin-up

Key Key NC NC

P86 Optional Manufacturing Test Pin 2nd Mate

P96 Optional Manufacturing Test Pin 2nd Mate

Notes:
1. All mate sequences assume zero angular offset between connectors.
2. P1 and P2 are internally connected to one another within the device.
3. Ground connectors P3 and P4 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in
a suitably configure backplane connector.
4. Pins P5 and P6 are not connected internally to the device but there is an option to connect through a zero ohm stuffing resistor. The host may
put 5V on these pins.
5. The host may ground P7 if it is not used for Device Activity Signal (DAS).
6. P8 and P9 should not be connected by the host.

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5.0 Supported Command Sets


Intel® SSD DC S3700 Series supports all mandatory ATA (Advanced Technology Attachment)
commands defined in the ATA8-ACS specification described in this section.

5.1 ATA General Feature Command Set


The Intel SSD DC S3700 Series supports the ATA General Feature command set (non- PACKET),
which consists of:
− EXECUTE DEVICE DIAGNOSTIC
− SET FEATURES
− IDENTIFY DEVICE

Note: See Appendix A, “IDENTIFY DEVICE Command Data” on page 30 for details on the sector data
returned after issuing an IDENTIFY DEVICE command.

Intel SSD DC S3700 Series also supports the following optional commands:
− READ DMA
− WRITE DMA
− READ SECTOR(S)
− READ VERIFY SECTOR(S)
− READ MULTIPLE
− SEEK
− SET FEATURES
− WRITE SECTOR(S)
− SET MULTIPLE MODE1
− WRITE MULTIPLE
− FLUSH CACHE
− READ BUFFFER
− WRITE BUFFER
− NOP
− DOWNLOAD MICROCODE
− WRITE UNCORRECTABLE EXT
1. The only multiple supported will be multiple 1

5.2 Power Management Command Set


Intel SSD DC S3700 Series supports the Power Management command set, which consists of:
− CHECK POWER MODE
− IDLE
− IDLE IMMEDIATE
− SLEEP
− STANDBY
− STANDBY IMMEDIATE

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5.3 Security Mode Feature Set


Intel SSD DC S3700 Series supports the Security Mode command set, which
consists of:
− SECURITY SET PASSWORD
− SECURITY UNLOCK
− SECURITY ERASE PREPARE
− SECURITY ERASE UNIT
− SECURITY FREEZE LOCK
− SECURITY DISABLE PASSWORD
5.4 SMART Command Set
Intel® SSD DC S3700 Series supports the SMART command set, which consists of:
− SMART READ DATA
− SMART READ ATTRIBUTE THRESHOLDS
− SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE
− SMART SAVE ATTRIBUTE VALUES
− SMART EXECUTE OFF-LINE IMMEDIATE
− SMART READ LOG SECTOR
− SMART WRITE LOG SECTOR
− SMART ENABLE OPERATIONS
− SMART DISABLE OPERATIONS
− SMART RETURN STATUS
− SMART ENABLE/DISABLE AUTOMATIC OFFLINE

5.4.1 SMART Attributes


The following table lists the SMART attributes supported by the Intel SSD DC S3700 Series and the
corresponding status flags and threshold settings.

Table 18: SMART Attributes

Status Flags
ID Attribute Threshold
SP EC ER PE OC PW

Re-allocated Sector Count


Raw value: shows the number of retired blocks since
05h leaving the factory (grown defect count). 1 1 0 0 1 0 0 (none)
Normalized value: beginning at 100, shows the percent
remaining of allowable grown defect count.

Power-On Hours Count


Raw value: reports power-on time, cumulative over the
09h 1 1 0 0 1 0 0 (none)
life of the SSD, integer number in hour time units.
Normalized value: always 100.

Power Cycle Count


Raw value: reports the cumulative number of power
0Ch 1 1 0 0 1 0 0 (none)
cycle events over the life of the device.
Normalized value: always 100.

AAh Available Reserved Space (See Attribute E8) 1 1 0 0 1 1 10

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Status Flags
ID Attribute Threshold
SP EC ER PE OC PW

Program Fail Count


Raw value: shows total count of program fails.
ABh 1 1 0 0 1 0 0 (none)
Normalized value: beginning at 100, shows the percent
remaining of allowable program fails.
Erase Fail Count
Raw value: shows total count of erase fails.
ACh 1 1 0 0 1 0 0 (none)
Normalized value: beginning at 100, shows the percent
remaining of allowable erase fails.
Unexpected Power Loss
Also known as “Power-off Retract Count” per magnet-
ic-drive terminology.
Raw value: reports number of unclean shutdowns, cu-
AEh mulative over the life of the SSD. 1 1 0 0 1 0 0 (none)
An “unclean shutdown” is the removal of power without
STANDBY IMMEDIATE as the last command (regardless
of PLI activity using capacitor power).
Normalized value: always 100.
Power Loss Protection Failure
Last test result as microseconds to discharge cap, satu-
rates at max value. Also logs minutes since last test and
lifetime number of tests.
Raw value:
Bytes 0-1: Last test result as microseconds to dis-
charge cap, saturates at max value. Test result
expected in range 25 <= result <= 5000000, lower indi-
AFh 1 1 0 0 1 1 10
cates specific error code.
Bytes 2-3: Minutes since last test, saturates at max
value.
Bytes 4-5: Lifetime number of tests, not increment-
ed on power cycle, saturates at max value.
Normalized value: set to 1 on test failure or 11 if the
capacitor has been tested in an excessive temperature
condition, otherwise 100.
SATA Downshift Count
Raw value: reports number of times SATA interface
B7h selected lower signaling rate due to error. 1 1 0 0 1 0 0 (none)
Normalized value: always 100.
End-to-End Error Detection Count
Raw value: reports number of LBA tag mismatches in
B8h end-to-end data protection path. 1 1 0 0 1 1 90
Normalized value: always 100.
Uncorrectable Error Count
Raw value: shows the number of errors that could
BBh not be recovered using Error 1 1 0 0 1 0 0 (none)
Correction Code (ECC).
Normalized value: always 100.

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Status Flags
ID Attribute Threshold
SP EC ER PE OC PW

Temperature - Airflow Temperature (Case)


Raw value: reports SSD case temperature statis-
tics.
Bytes 0-1: Current case temperature, Celsius
BEh Byte 2: Recent min case temperature, Celsius 1 0 0 0 1 0 0 (none)
Byte 3: Recent max case temperature, Celsius
Bytes 4-5: Over temperature counter. Number of times
sampled temperature exceeds drive max operating
temperature specification.
Normalized value: 100 – case temperature in C degrees
Power-Off Retract Count (Unsafe Shutdown Count)
Raw value: reports the cumulative number of unsafe
(unclean) shutdown events over the life of the device. An
C0h unsafe shutdown occurs whenever the device is 1 1 0 0 1 0 0 (none)
powered off without STANDBYIMMEDIATE being the
last command.
Normalized value: always 100.

Temperature - Device Internal Temperature


Raw value: Reports internal temperature of the SSD in
degrees Celsius. Temperature reading is the value direct
C2h from the printed circuit board (PCB) sensor without 1 0 0 0 1 0 0 (none)
offset.
Normalized value: 150 – device temperature in C
degrees, 100 if device temperature less than 50.

Pending Sector Count


Raw value: number of current unrecoverable read
C5h 0 1 0 0 1 0 0 (none)
errors that will be re-allocated on next write.
Normalized value: always 100.

CRC Error Count


Raw value: shows total number of encountered SATA
C7h 1 1 0 0 1 0 0 (none)
interface cyclic redundancy check (CRC) errors.
Normalized value: always 100.

Host Writes
Raw value: reports total number of sectors written by the
E1h host system. The raw value is increased by 1 for every 1 1 0 0 1 0 0 (none)
65,536 sectors (32MB) written by the host.
Normalized value: always 100.

Timed Workload Media Wear


Raw value: measures the wear seen by the SSD (since
reset of the workload timer, attribute E4h), as a
E2h percentage of the maximum rated cycles. Divide the raw 1 1 0 0 1 0 0 (none)
value by 1024 to derive the percentage with 3 decimal
points.
Normalized value: always 100.

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Status Flags
ID Attribute Threshold
SP EC ER PE OC PW

Timed Workload Host Read/Write Ratio


Raw value: shows the percentage of I/O operations that
are read operations (since reset of the workload timer,
E3h 1 1 0 0 1 0 0 (none)
attribute E4h). Reported as integer percentage from 0 to
100.
Normalized value: always 100.

Timed Workload Timer


Raw value: measures the elapsed time (number of
E4h 1 1 0 0 1 0 0 (none)
minutes since starting this workload timer).
Normalized value: always 100.

Available Reserved Space


Raw value: reports number of reserve blocks remaining.
E8h Normalized value: begins at 100 , which corresponds 1 1 0 0 1 1 10
to 100 percent availability of the reserved space. The
threshold value for this attribute is 10 percent
availability.

Media Wearout Indicator


Raw value: always 0.
Normalized value: reports the number of cycles the
NAND media has undergone. Declines linearly from 100
E9h to 1 as the average erase cycle count increases from 0 to 1 1 0 0 1 1 1
the maximum rated cycles.
Once the normalized value reaches 1, the number will
not decrease, although it is likely that significant
additional wear can be put on the device.

Thermal Throttle Status


Raw value: reports Percent Throttle Status and Count
of
events
EAh Byte 0: Throttle status reported as integer percentage. 1 1 0 0 1 0 0 (none)
Bytes 1-4: Throttling event count. Number of times
thermal throttle has activated. Preserved over power cy-
cles.
Byte 5: Reserved.
Normalized value: always 100.

Total LBAs Written


Raw value: reports the total number of sectors written
F1h by the host system. The raw value is increased by 1 for 1 1 0 0 1 0 0 (none)
every 65,536 sectors (32MB) written by the host.
Normalized value: always 100.

Total LBAs Read


Raw value: reports the total number of sectors read by
F2h the host system. The raw value is increased by 1 for 1 1 0 0 1 0 0 (none)
every 65,536 sectors (32MB) read by the host.
Normalized value: always 100.

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Table 19: SMART Attribute Status Flags

Status Flag Description Value = 0 Value = 1

SP Self-preserving attribute Not a self-preserving attribute Self-preserving attribute


EC Event count attribute Not an event count attribute Event count attribute
ER Error rate attribute Not an error rate attribute Error rate attribute
PE Performance attribute Not a performance attribute Performance attribute
Collected during both offline and
OC Online collection attribute Collected only during offline
activity online activity

PW Pre-fail warranty attribute Advisory Pre-fail

5.4.1.1 Timed Workload Endurance Indicators

Timed Workload Media Wear Indicator — ID E2h

This attribute tracks the drive wear seen by the device during the last wear timer loop, as a
percentage of the maximum rated cycles. The raw value tracks the percentage up to 3 decimal
points. This value should be divided by 1024 to get the percentage.
For example: if the raw value is 4450, the percentage is 4450/1024 = 4.345%. The raw value is held
at FFFFh until the wear timer (attribute E4h) reaches 60 (minutes) after a SMART EXECUTE OFFLINE
IMMEDIATE (B0h/D4h) subcommand 40h to the SSD. The normalized value is always set to 100 and
should be ignored.

Timed Workload Host Reads Percentage — ID E3h

This attribute shows the percentage of I/O operations that are read operations during the last
workload timer loop. The raw value tracks this percentage and is held at FFFFh until the workload
timer (attribute E4h) reaches 60 (minutes). The normalized value is always set to 100 and should be
ignored.

Workload Timer — ID E4h

This attribute is used to measure the time elapsed during the current workload. The attribute is
reset when a SMART EXECUTE OFFLINE IMMEDIATE (D4h) subcommand 40h is issued to the drive.
The raw value tracks the time in minutes and has a maximum value of 2^32 = 4,294,967,296 minutes
(8,171 years). The normalized value is always set to 100 and should be ignored.

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User Notes

• Sending a SMART EXECUTE OFFLINE IMMEDIATE (B0h/D4h) subcommand 40h to the SSD
resets and starts all three attributes (Media Wear Indicator, Attribute E2h, Host Reads
Percentage, Attribute E3h, and the Workload timer, Attribute E4h) to FFFFh.

• The Attribute raw values are held at FFFFh until the Workload timer (Attribute E4h) reaches a
total of 60 (minutes) of power on time. After 60 minutes, the Timed Workload data is made
available.

• After the Workload timer (E4h) reaches 60 (minutes), the Timed Workload data is saved every
minute so only 59 seconds of data is lost if power is removed without receiving ATA STANDBY
IMMEDIATE. Accumulated data is not reset due to power loss.

• Upon power up, the attributes hold a snapshot of their last saved values for 59 seconds and
live data is available after 60 seconds, once the initial one hour interval is completed.

Example Use Cases

The Timed Workload Endurance attributes described in this section are intended to be used to
measure the amount of media wear that the drive is subjected to during a timed workload.

Ideally, the system that the drive is being used in should be capable of issuing SMART commands.
Otherwise, provisions have been provided to allow the media wear attributes to be persistent so
the drive can be moved to a SMART capable system to read out the drive wear attribute values.

Use Case 1 – With a System Capable of SMART Commands

1. On a SMART capable system issue the SMART EXECUTE OFF-LINE IMMEDIATE (D4h)
sub-command 40h to reset the drive wear attributes.
2. Run the workload to be evaluated for at least 60 minutes. Otherwise the drive wear attributes
will not be available.
3. Read out the drive wear attributes with the SMART READ DATA (D0h) command.

Use Case 2 – With a System Not Capable of SMART Commands

1. On a SMART capable system, issue the SMART EXECUTE OFF-LINE IMMEDIATE (D4h)
sub-command 40h to reset the drive wear attributes.
2. Move the drive to the system where the workload will be measured (and not capable of
SMART commands).
3. Run the workload to be evaluated for at least 60 minutes. Otherwise the drive wear attributes
will not be available.
4. Do a clean system power down by issuing the ATA STANDBY IMMEDIATE command prior to
shutting down the system. This will store all the drive wear SMART attributes to persistent
memory within the drive.
5. Move the drive to a SMART capable system.
6. Read out the drive wear attributes with the SMART READ DATA (D0h) command within 59
seconds after power-up.

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Example Calculation of Drive Wear

The following is an example of how the drive wear attributes can be used to evaluate the impact of a
given workload. The Host Writes SMART attribute (E1h) can also be used to calculate the amount of
data written by the host during the workload by reading this attribute before and after running the
workload. This example assumes that the steps shown in “Example Use Cases” on page 18 were
followed to obtain the following attribute values:
• Timed Workload Media Wear (E2h) has a raw value of 16. Therefore, the percentage wear =
16/1024 = 0.016%.
• Timed Workload Host Read/Write Ratio (E3h) has a normalized value of 80, indicating that
80% of operations were reads.
• Workload Timer (E4h) has a raw value of 500. Therefore the workload ran for 500 minutes.
• Host Writes Count (E1h) had a raw value of 100,000 prior to running the workload and a value
of 130,000 at the end of the workload. Therefore, the number of sectors written by the host
during the workload was 30,000 * 65,535 = 1,966,050,000 sectors or 1,966,050,000 *
512/1,000,000,000 = 1,007 GB.

The following conclusions can be made for this example case:

The workload took 500 minutes to complete with 80% reads and 20% writes. A total of 1,007 GB
of data was written to the device, which increased the media wear in the drive by 0.016%. At this
point in time, this workload is causing a wear rate of 0.016% for every 500 minutes, or
0.00192%/hour.

5.4.2 SMART Logs

Intel® SSD DC S3700 Series implements the following Log Addresses: 00h, 02h, 03h, 06h, and 07h.

Intel DC S3700 Series implements host vendor specific logs (addresses 80h-9Fh) as read and write
scratchpads, where the default value is zero (0). Intel SSD DC S3700 Series does not write any
specific values to these logs unless directed by the host through the appropriate commands.

Intel DC S3700 Series also implements a device vendor specific log at address A9h as a read-only
log area with a default value of zero (0).

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5.5 Device Statistics


In addition to the SMART attribute structure, statistics pertaining to the operation and health of the
Intel SSD DC S3700 Series can be reported to the host on request through the Device Statistics log
as defined in the ATA specification.

The Device Statistics log is a read-only GPL/SMART log located at read log address 0x04 and is
accessible using READ LOG EXT, READ LOG DMA EXT or SMART READ LOG commands.

The following table lists the Device Statistics supported by the Intel SSD DC S3700 Series.

Table 20: Device Statistics Log

Equivalent SMART attribute


Page Offset Description
(if applicable)

0x00 -- List of Supported Pages --


0x08 Power Cycle Count 0Ch
0x10 Power-On Hours 09h
0x18 Logical Sectors Written E1h
Num Write Commands – incremented by one for
0x01 – General Statistics 0x20 --
every host write
0x28 Logical Sectors Read F2h
Num Read Commands – incremented by one for
0x30 --
every host read
0x08 Num Reported Uncorrectable Errors BBh
0x04 – General Error Statistics Num Resets Between Command Acceptance and
0x10 --
Completion
0x00 Device Statistics Information Header --

0x08 Current Temperature --

0x10 Average Short Term Temperature --

0x18 Average Long Term Temperature --

0x20 Highest Temperature --

0x28 Lowest Temperature --

0x30 Highest Average Short Term Temperature --


0x05 – Temperature Statistics
0x38 Lowest Average Short Term Temperature --

0x40 Highest Average Long Term Temperature --

0x48 Lowest Average Long Term Temperature --

0x50 Time in Over-Temperature --

0x58 Specified Maximum Operating Temperature --

0x60 Time in Under-Temperature --

0x68 Specified Minimum Operating Temperature --

0x08 Number of Hardware Resets --

0x06 – Transport Statistics 0x10 Number of ASR Events --

0x18 Number of Interface CRC Errors --


E9h
0x07 – Solid State Device Statistics 0x08 Percentage Used Endurance Indicator Note: This device statistic
counts from 1 to 150

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5.6 SMART Command Transport (SCT)


With SMART Command Transport (SCT), a host can send commands and data to an SSD and receive
status and data from an SSD using standard write/read commands to manipulate two SMART Logs:
− Log Address E0h ("SCT Command/Status") — used to send commands and retrieve status
− Log Address E1h ("SCT Data Transfer") — used to transport data
Intel® SSD DC S3700 Series supports the following standard SCT actions:
− Write Same — Intel DC S3700 Series implements this action code as described in the ATA
specification.
− Error Recovery Control — Intel DC S3700 Series accepts this action code, and will store and
return error-recovery time limit values.
− Feature Control – Intel DC S3700 Series supports feature code 0001h (write cache) feature
code 0002h (write cache reordering), and feature code 0003h (time interval for temperature
logging). It also supports D000h(Power Safe Write Cache capacitor test interval),
(D001h(read/write power governor mode), D002h(read/write thermal governor mode),
D003h(read power governor burst power), D004h(read power governor average power).
− Data table command – Intel DC S3700 Series supports data table command as specified in
ATA8-ACS2. This will read out temperature logging information in
table ID 0002h.
− Read Status Support – Intel DC S3700 Series supports read status log.
− SCT command 0xD801with State=0, Option=1, ID Word 106 can be used to change from
0x6003 to 0x4000 (4KB physical sector size to 512B physical sector size support change).

5.7 Data Set Management Command Set


Intel SSD DC S3700 Series supports the Data Set Management command set Trim attribute, which
consists of:
− DATA SET MANAGEMENT

5.8 Host Protected Area Command Set


Intel SSD DC S3700 Series supports the Host Protected Area command set, which consists of:
− READ NATIVE MAX ADDRESS
− SET MAX ADDRESS
− READ NATIVE MAX ADDRESS EXT
− SET MAX ADDRESS EXT
Intel SSD DC S3700 Series also supports the following optional commands:
− SET MAX SET PASSWORD
− SET MAX LOCK
− SET MAX FREEZE LOCK
− SET MAX UNLOCK

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5.9 48-Bit Address Command Set


Intel SSD DC S3700 Series supports the 48-bit Address command set, which
consists of:
− FLUSH CACHE EXT
− READ DMA EXT
− READ NATIVE MAX ADDRESS EXT
− READ SECTOR(S) EXT
− READ VERIFY SECTOR(S) EXT
− SET MAX ADDRESS EXT
− WRITE DMA EXT
− WRITE MULTIPLE EXT
− WRITE SECTOR(S) EXT
− WRITE MULTIPLE FUA EXT
− WRITE DMA FUA EXT

5.10 General Purpose Log Command Set


Intel® SSD DC S3700 Series supports the General Purpose Log command set, which consists of:
− READ LOG EXT
− WRITE LOG EXT

5.11 Native Command Queuing


Intel SSD DC S3700 Series supports the Native Command Queuing (NCQ) command set, which
includes:
− READ FPDMA QUEUED
− WRITE FPDMA QUEUED

Note: With a maximum Queue Depth set to 32.

5.12 Software Settings Preservation


Intel SSD DC S3700 Series supports the SET FEATURES parameter to enable/disable the
preservation of software settings.

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6.0 Certifications and Declarations


The following table describes the Device Certifications supported by the Intel SSD DC S3700 Series.

Table 21: Device Certifications and Declarations

Certification Description

Low Voltage DIRECTIVE 2006/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL
CE Compliant of 12 December 2006, and EMC Directive 2004/108/EC OF THE EUROPEAN PARLIAMENT AND
OF THE COUNCIL of 15 December 2004.

Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd Edition,


2007-03-27 (Information Technology Equipment - Safety - Part 1: General Requirements)
UL Recognized
CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Information Technology Equipment - Safety -
Part 1: General Requirements)

Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic


C-Tick Compliant
Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA).

Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment - Radio
BSMI Compliant disturbance Characteristics - limits and methods of measurement, as amended on June 1, 2006,
is harmonized with CISPR 22: 2005.04.

Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control


KCC Regulation and meets the Electromagnetic Compatibility (EMC) Framework requirements of the
Radio Research Laboratory (RRL) Ministry of Information and Communication Republic of Korea.

Voluntary Control Council for Interface to cope with disturbance problems caused by personal
VCCI
computers or facsimile.

RoHS Compliant Restriction of Hazardous Substance Directive

WEEE Directive on Waste Electrical and Electronic Equipment

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7.0 References
The following table identifies the standards information referenced in this document.

Table 22: Standards References

Date Title Location

Solid-State Drive (SSD) Requirements and Endurance Test http://www.jedec.org/standards-documents/


July 2012
Method (JESD219) results/jesd219

Solid-State Drive (SSD) Requirements and Endurance Test http://www.jedec.org/standards-documents/


Sept 2010
Method (JESD218) docs/jesd218/

Dec 2008 VCCI http://www.vcci.jp/vcci_e/

http://qdms.intel.com/
June 2009 RoHS Click Search MDDS Database and search
for material description datasheet

August 2009 ACS-2-ATA/ATAPI Command Set 2 Specification http://www.t13.org/

June 2009 Serial ATA Revision 3.0 http://www.sata-io.org/

May 2006 SFF-8223, 2.5-inch Drive w/Serial Attachment Connector http://www.sffcommittee.org/

May 2005 SFF-8201, 2.5-inch drive form factor http://www.sffcommittee.org/

International Electrotechnical Commission EN 61000


4-2 (Electrostatic discharge immunity test)
1995 4-3 (Radiated, radio-frequency, electromagnetic field
1996 immunity test)
1995 4-4 (Electrical fast transient/burst immunity test)
http://www.iec.ch/
1995 4-5 (Surge immunity test)
1997 4-6 (Immunity to conducted disturbances, induced by radio-
1994 frequency fields)
4-11 (Voltage Variations, voltage dips, short interruptions
and voltage variations immunity tests)

1995 ENV 50204 http://www.dbicorporation.com/radimmun.h


(Radiated electromagnetic field from digital radio tm/
telephones)

January 2015 Product Specification


328171-010US 31
Intel® Solid-State Drive DC S3700 Series

Appendix A: IDENTIFY DEVICE Command Data


Table 23: Returned Sector Data

F = Fixed
Word V = Variable Default Value Description
X = Both

0 X 0040h General configuration bit-significant information


1 X 3FFFh Obsolete - Number of logical cylinders (16,383)
2 V C837h Specific configuration
3 X 0010h Obsolete - Number of logical heads (16)
4-5 X 0h Retired
6 X 003Fh Obsolete - Number of logical sectors per logical track (63)
7-8 V 0h Reserved for assignment by the CompactFlash* Association (CFA)
9 X 0h Retired
10-19 F varies Serial number (20 ASCII characters)
20-21 X 0h Retired
22 X 0h Obsolete
23-26 F varies Firmware revision (8 ASCII characters)
27-46 F varies Model number (Intel® Solid-State Drive)
7:0—Maximum number of sectors transferred per interrupt on multiple
47 F 8001h
commands
48 F 4000h Trusted Computing Feature Set
49 F 2F00h Capabilities
50 F 4000h Capabilities
51-52 X 0h Obsolete
53 F 0007h Words 88 and 70:64 valid
54 X 3FFFh Obsolete - Number of logical cylinders (16,383)
55 X 0010h Obsolete - Number of logical heads (16)
56 X 003Fh Obsolete - Number of logical sectors per logical track (63)
57-58 X FC1000FBh Obsolete
59 F BF01 Number of sectors transferred per interrupt on multiple commands
100GB: 0BA52230h
200GB: 0FFFFFFFh
60-61 V Total number of user-addressable sector
400GB: 0FFFFFFFh
800GB: 0FFFFFFFh
62 X 0h Obsolete
63 X 0007h Multi-word DMA modes supported/selected
64 F 0003h PIO modes supported
65 F 0078h Minimum multiword DMA transfer cycle time per word
66 F 0078h Manufacturer’s recommended multiword DMA transfer cycle time
67 F 0078h Minimum PIO transfer cycle time without flow control
68 F 0078h Minimum PIO transfer cycle time with IORDY flow control
69 F 4030h Additional Supported
70 F 0000h Reserved
71-74 F 0h Reserved for IDENTIFY PACKET DEVICE command
75 F 001Fh Queue depth
76 F 850Eh Serial ATA capabilities
Product Specification January 2015
32 328171-010US
Intel® Solid-State Drive DC S3700 Series

F = Fixed
Word V = Variable Default Value Description
X = Both

77 F 0006h Reserved for future Serial ATA definition


78 F 0040h Serial ATA features supported
79 V 0040h Serial ATA features enabled
80 F 03FCh Major version number
81 F 0110h Minor version number
82 F 746Bh Command set supported
83 F 7501h Command sets supported
84 F 6163h Command set/feature supported extension
85 V 7469h Command set/feature enabled
86 V B401h Command set/feature enabled
87 V 6163h Command set/feature default
88 V 407Fh Ultra DMA Modes
89 F 0002h Time required for security erase unit completion
90 F 0002h Time required for enhanced security erase completion
91 V 0h Current advanced power management value
92 V 0FFFEh Master Password Revision Code
Hardware reset result: the contents of bits (12:0) of this word shall
93 X 0h
change only during the execution of a hardware reset
94 V 0h Vendor’s recommended and actual acoustic management value
95 F 0h Stream minimum request size
96 V 0h Streaming transfer time - DMA
97 V 0h Streaming access latency - DMA and PIO
98-99 F 0h Streaming performance granularity
100GB: 0BA52230h
200GB: 1749F1B0h
100-103 V Maximum user LBA for 48-bit address feature set
400GB: 2E9390B0h
800GB: 5D26CEB0h
104 V 0h Streaming transfer time - PIO
Maximum number of 512-byte blocks of LBA Range Entries per DATA
105 V 0006h
SET MANAGEMENT command
Default Physical sector size / logical sector size. Can be changed to
106 F 6003h
0004h to reflect 512Bytes/Sector.
107 F 0h Inter-seek delay for ISO-7779 acoustic testing in microseconds
108-111 F varies Unique ID
112-115 F 0h Reserved for world wide name extension to 128 bits
116 V 0h Reserved for technical report
117-118 F 0h Words per logical sector
119 F 405Ch Supported settings
120 F 401Ch Command set/feature enabled/supported
121-126 F 0h Reserved
127 X 0h Removable Media Status Notification feature set support
128 V 0021h Security status
129 V 1Ch Vendor-specific
130-139 X 0h Vendor-specific
140-149 X 0h Disable Logical Error Field

January 2015 Product Specification


328171-010US 33
Intel® Solid-State Drive DC S3700 Series

F = Fixed
Word V = Variable Default Value Description
X = Both

150-159 X 0h Vendor-specific
160 X 0h CompactFlash Association (CFA) power mode 1
161-167 X 0h Reserved for assignment by the CFA
168 X 3h Reserved for assignment by the CFA
169 X 0001h Data set management Trim attribute support
170-175 F 0h Reserved for assignment by the CFA
176-205 X Varies Current media serial number
206 X 003Dh SCT Command Transport
207-208 F 0000h Reserved
209 X 4000h Alignment of logical blocks within a physical block
210-211 V 0000h Write-Read-Verify Sector Count Mode 3 (DWord)
212-213 F 0000h Write-Read-Verify Sector Count Mode 2 (DWord)
214 X 0000h NV Cache Capabilities
215-216 V 0000h NV Cache Size in Logical Blocks (DWord)
217 F 0001h Nominal media rotation rate
218 V 0000h Reserved
219 F 0000h NV Cache Options
220 V 0000h Write-Read-Verify feature set
221 X 0000h Reserved
222 F 101Fh Transport major version number
223 F 0000h Transport minor version number
224-229 F 0000h Reserved
230-233 X 0000h Extended Number of User Addressable Sectors (QWord)
Minimum number of 512-byte data blocks per DOWNLOAD MICROCODE
234 F 0001h
command for mode 03h
Maximum number of 512-byte data blocks per DOWNLOAD
235 F FFFFh
MICROCODE command for mode 03h
236-254 X 0000h Reserved
255 V Varies Integrity word

Notes:
F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when media is removed
or changed.
V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the commands executed
by the device.
X = F or V. The content of the word may be fixed or variable.

Product Specification January 2015


34 328171-010US

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