SSD DC s3700 Spec
SSD DC s3700 Spec
Product Specification
Capacity: 2.5-inch: 100GB, 200GB, 400GB, 800GB Power Management
1.8-inch: 200GB, 400GB − 2.5-inch: 5V or 12V SATA Supply Rail10
Components: − 1.8-inch: 3.3V SATA Supply Rail
− Intel® 25nm NAND Flash Memory − SATA Interface Power Management
− High Endurance Technology (HET) Multi-Level Cell − OS-aware hot plug/removal
(MLC) − Enhanced power-loss data protection
Form Factors: 2.5-inch and 1.8-inch Power11
Read and Write IOPS1,2 (Full LBA Range, IOMeter* Queue − Active: Up to 6 W (TYP)
Depth 32) − Idle: 650 mW
− Random 4KB3 Reads: Up to 75,000 IOPS Weight:
− Random 4KB Writes: Up to 36,000 IOPS − 2.5” 200, 400, 800GB: 73.6 grams ± 2 grams
− Random 8KB3 Reads: Up to 47,500 IOPS − 2.5” 100GB: 70 grams ± 2 grams
− Random 8KB Writes: Up to 20,000 IOPS − 1.8” 200, 400GB: 38 grams ± 2 grams
Bandwidth Performance1 Temperature
− Sustained Sequential Read: Up to 500 MB/s4 − Operating: 0o C to 70o C
− Sustained Sequential Write: Up to 460 MB/s − Non-Operating12: -55o C to 95o C
Endurance: 10 drive writes per day5 for 5 years − Temperature monitoring and logging
Latency (average sequential) − Thermal throttling
− Read: 50 µs (TYP) Shock (operating and non-operating):
− Write: 65 µs (TYP) − 1,000 G/0.5 msec
Quality of Service6,8 Vibration
− Read/Write: 500 µs (99.9%) − Operating: 2.17 GRMS (5-700 Hz)
Performance Consistency7,8 − Non-operating: 3.13 GRMS (5-800 Hz)
Read/Write: Up to 90%/90% (99.9%) Reliability
AES 256-bit Encryption − Uncorrectable Bit Error Rate (UBER):
Altitude (simulated) 1 sector per 10^17 bits read
– Operating: -1,000 to 10,000 ft − Mean Time Between Failures (MTBF):
– Operating9: 10,000 to 15,000 ft 2 million hours
– Non-operating: -1,000 to 40,000 ft − End-to-End data-path protection
Product Ecological Compliance Certifications and Declarations
− RoHS* − UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft* WHCK*,
Compliance VCCI*, SATA-IO*
− SATA Revision 3.0; compatible with SATA 6Gb/s, 3Gb/s Compatibility
and 1.5Gb/s interface rates − Windows* 7 and Windows* 8
− ATA/ATAPI command Set – 2 (ACS-2); includes SCT − Windows* Server 2012
(Smart Command Transport) and device statistics log − Windows* Server 2008 Enterprise 32/64bit SP2
support − Windows* Server 2008 R2 SP1
− Enhanced SMART ATA feature set − Windows* Server 2003 Enterprise R2 64bit SP2
− Native Command Queuing (NCQ) command set − Red Hat* Enterprise Linux* 5.5, 5.6, 6.1, 6.3
− Data set management Trim command − SUSE* Linux* Enterprise Server 10, 11 SP1
− CentOS* 64bit 5.7, 6.3
− Intel® SSD Toolbox with Intel® SSD Optimizer
1. Performance values vary by capacityandformfactor
2. Performance specifications apply to both compressible and incompressible data
3. 4KB = 4,096 bytes; 8KB = 8,192 bytes.
4. MB/s = 1,000,000 bytes/second
5. Based on JESD218 standard. For 200GB 1.8 inches drive, it is 9.8 drives write per day.
6. Based on Random 4KB QD=1 workload, measured as the time taken for 99.9 percentile of commands to finish the round-trip from host to drive and back to host
7. Based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test)
8. Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability
9. Extended operation at a higher altitude might impact reliability.
10. Defaults to 12V, if both 12V and 5V are present
11. Based on 5V supply; refer to Table 7 for more details
12. Please contact your Intel representative for details on the non-operating temperature range
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Contents
Revision History ........................................................................................................................................................................ 4
Terms and Acronyms................................................................................................................................................................ 5
1.0 Overview....................................................................................................................................................................... 6
2.0 Product Specifications............................................................................................................................................... 7
2.1 Capacity ......................................................................................................................................................................................... 7
2.2 Performance ................................................................................................................................................................................ 7
2.3 Electrical Characteristics........................................................................................................................................................ 9
2.4 Environmental Conditions ................................................................................................................................................. 11
2.5 Product Regulatory Compliance ..................................................................................................................................... 12
2.6 Reliability ................................................................................................................................................................................... 12
2.7 Temperature Sensor............................................................................................................................................................. 13
2.8 Power Loss Capacitor Test ................................................................................................................................................ 13
2.9 Hot Plug Support ................................................................................................................................................................... 13
3.0 Mechanical Information ......................................................................................................................................... 14
4.0 Pin and Signal Descriptions .................................................................................................................................. 16
4.1 2.5-inch Form Factor Pin Locations .............................................................................................................................. 16
4.2 1.8-inch Form Factor Pin Locations .............................................................................................................................. 16
4.3 Connector Pin Signal Definitions .................................................................................................................................... 17
4.4 Power Pin Signal Definitions............................................................................................................................................. 17
5.0 Supported Command Sets..................................................................................................................................... 19
5.1 ATA General Feature Command Set ............................................................................................................................. 19
5.2 Power Management Command Set............................................................................................................................... 19
5.3 Security Mode Feature Set ................................................................................................................................................ 20
5.4 SMART Command Set ......................................................................................................................................................... 20
5.5 Device Statistics ...................................................................................................................................................................... 27
5.6 SMART Command Transport (SCT) ............................................................................................................................... 28
5.7 Data Set Management Command Set .......................................................................................................................... 28
5.8 Host Protected Area Command Set .............................................................................................................................. 28
5.9 48-Bit Address Command Set ......................................................................................................................................... 29
5.10 General Purpose Log Command Set............................................................................................................................. 29
5.11 Native Command Queuing ................................................................................................................................................ 29
5.12 Software Settings Preservation ....................................................................................................................................... 29
6.0 Certifications and Declarations ............................................................................................................................ 30
7.0 References................................................................................................................................................................. 31
Appendix A: IDENTIFY DEVICE Command Data ............................................................................................................... 32
Revision History
Date Revision Description
November 2012 002 Updated Power On to Ready specification for 800 GB capacity
Updated Device Identify Table; SMART Attribute Definition. Endurance spec for 1.8-inch
April 2013 005
200 GB drive, voltage spec
In Section 5.6, added clarification to word 106 of Identify Device Command and SCT
January 2015 010
command process to change the reported value.
Term Definition
1.0 Overview
This document describes the specifications and capabilities of the Intel® SSD DC S3700 Series.
The Intel SSD DC S3700 Series delivers leading performance and Quality of Service combined with
world-class reliability and endurance for Serial Advanced Technology Attachment (SATA)-based
computers in four capacities: 100GB, 200GB, 400GB and 800GB.
By combining 25nm Intel® NAND Flash Memory technology with SATA 6Gb/s interface support, the
Intel SSD DC S3700 Series delivers sequential read speeds of up to
500 MB/s and sequential write speeds of up to 460 MB/s. Intel SSD DC S3700 Series delivers
Quality of Service of 500 µs for random 4KB reads and writes measured at a queue depth of 1
(see Table 6).
The Intel SSD DC S3700 Series also includes High Endurance Technology (HET), which combines
NAND silicon enhancements and SSD NAND management techniques to extend the write endurance
of an SSD, leading to lifetime endurance levels of 10 drive writes per day for 5 years.
The industry-standard 2.5-inch form factor enables interchangeability with existing hard disk drives
(HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability,
ruggedness, and power savings offered by an SSD.
Unformatted Capacity
Intel® SSD DC S3700 Series
(Total User Addressable Sectors in LBA Mode)
100GB 195,371,568
200GB 390,721,968
400GB 781,422,768
800GB 1,562,824,368
Notes:
1GB = 1,000,000,000 bytes; 1 sector = 512 bytes.
LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive.
The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash
management and maintenance purposes.
2.2 Performance
Random 4KB Read (up to)2 IOPS 75,000 75,000 / 75,000 75,000 / 75,000 75,000
Random 4KB Write (up to) IOPS 19,000 32,000 / 29,000 36,000 / 36,000 36,000
Random 8KB Read (up to)3 IOPS 47,500 47,500 / 47,500 47,500 / 47,500 47,500
Random 8KB Write (up to) IOPS 9,500 16,500 / 14,500 19,500 / 19,500 20,000
Notes:
1. Performance measured using IOMeter* with Queue Depth 32. Measurements are performed on a full Logical Block Address (LBA) span of the
drive.
2. 4KB = 4,096 bytes
3. 8KB = 8,192 bytes
Notes:
1. Performance consistency measured using IOMeter* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th
percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span
of the drive once the workload has reached steady state but including all background activities required for normal operation and
data reliability.
2. 4KB = 4,096 bytes
3. 8KB = 8,192 bytes
Notes:
1. Performance measured using IOMeter* with 128KB (131,072 bytes) of transfer size with Queue Depth 32.
Table 5: Latency
Latency1 (TYP)
Read 50 µs 50 µs
Write 65 µs 65 µs
Power On to Ready 2 2.0 s 3.0 s
Notes:
1. Device measured using IOMeter. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential
workload.
2. Power On To Ready time assumes proper shutdown. Time varies if shutdown is not preceded by STANDBY IMMEDIATE command.
Reads ms 10 5 10 5
Writes ms 10 5 20 20
Notes:
1. Device measured using IOMeter. Quality of Service measured using 4 KB (4,096 bytes) transfer size on a random workload on a full Logical
Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal
operation and data reliability.
2. Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the
round-trip from host to drive and back to host.
5 V Operating Characteristics:
12 V Operating Characteristics:
Notes:
1. Measured from initial device power supply application
2. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management
3. The drive needs to be powered off for at least 500msec before powering on
Notes:
1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is
measured using scope trigger over a 100 ms sample period
2. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured
using scope trigger over a 500 µs sample period
Notes:
1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is
measured using scope trigger over a 100 ms sample period
2. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured
using scope trigger over a 500 µs sample period
Notes:
1. Measured from initial device power supply application
2. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management
3. The drive needs to be powered off for at least 500msec before powering on
Notes:
1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) power is measured
using scope trigger over a 100 ms sample period.
Temperature Range
Case Temperature
Operating 0 – 70 oC
1
Non-operating -55 – 95 oC
Temperature Gradient2
Operating 30 oC/hr (Typical)
Non-operating 30 oC/hr (Typical)
Humidity
Operating 5 – 95 %
Non-operating 5 – 95 %
Shock3
Operating 1,000 G (Max) at 0.5 msec
Non-operating 1,000 G (Max) at 0.5 msec
Vibration4
Operating 2.17 GRMS (5-700 Hz) Max
Non-operating 3.13 GRMS (5-800 Hz) Max
Notes:
1. Please contact your Intel representative for details on the non-operating temperature range.
2. Temperature gradient measured without condensation.
3. Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be
applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.
4. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be
applied in the X, Y or Z axis. Vibration specification is measured using RMS value.
2.6 Reliability
Intel SSD DC S3700 Series meets or exceeds SSD endurance and data retention requirements as specified in the
JESD218 standard. Reliability specifications are listed in the following table:
Parameter Value
Uncorrectable bit error rate will not exceed one sector in the
specified number of bits read. In the unlikely event of a < 1 sector per 1017 bits read
non-recoverable read error, the SSD will report it as a read failure
to the host; the sector in error is considered corrupt and is not
returned to the host.
Parameter Value
Power On/Off Cycles is defined as power being removed from the 24 per day
SSD, and then restored. Most host systems remove power from
the SSD when entering suspend and hibernate as well as on a
system shutdown.
Insertion Cycles
50 on SATA cable
500 on backplane
SATA/power cable insertion/removal cycles.
Data Retention
3 months power-off retention once SSD
The time period for retaining data in the NAND at maximum rated reaches rated write endurance at 40 °C
endurance.
Note:
1 Refer to JESD218 standard table 1 for UBER, FFR and other Enterprise SSD endurance verification requirements. UBER design and majority of
life target is 1E-17. Endurance verification acceptance criterion based on establishing <1E-16 at 60 confidence.
For more information on supported SMART attributes, see Table 19 “SMART Attributes” on page 20.
This product supports asynchronous signal recovery and issues an unsolicited COMINIT when first
mated with a powered connector to guarantee reliable detection by a host system without hardware
device detection.
Figure 3: Layout of 2.5-inch Form Factor Signal and Power Segment Pins
Figure 4: Layout of 1.8-inch Form Factor Signal and Power Segment Pins
Table 15: Serial ATA Connector Pin Signal Definitions—2.5- and 1.8-inch Form Factors
Notes:
1. All pins are in a single row, with a 1.27 mm (0.050-inch) pitch.
2. Pins P1, P2 and P3 are connected together, although they are not connected internally to the device. The host may put 3.3 V on these pins.
3. The mating sequence is:
• ground pins P4-P6, P10, P12 and the 5V power pin P7
• signal pins and the rest of the 5V power pins P8-P9
4. Ground connectors P4 and P12 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in
a suitably configured backplane connector.
5. Power pins P7, P8, and P9 are internally connected to one another within the device.
6. The host may ground P11 if it is not used for Device Activity Signal (DAS).
7. Pins P13, P14 and P15 are internally connected to one another within the device. The host may put 12 V on these pins.
Key Key NC NC
Notes:
1. All mate sequences assume zero angular offset between connectors.
2. P1 and P2 are internally connected to one another within the device.
3. Ground connectors P3 and P4 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in
a suitably configure backplane connector.
4. Pins P5 and P6 are not connected internally to the device but there is an option to connect through a zero ohm stuffing resistor. The host may
put 5V on these pins.
5. The host may ground P7 if it is not used for Device Activity Signal (DAS).
6. P8 and P9 should not be connected by the host.
Note: See Appendix A, “IDENTIFY DEVICE Command Data” on page 30 for details on the sector data
returned after issuing an IDENTIFY DEVICE command.
Intel SSD DC S3700 Series also supports the following optional commands:
− READ DMA
− WRITE DMA
− READ SECTOR(S)
− READ VERIFY SECTOR(S)
− READ MULTIPLE
− SEEK
− SET FEATURES
− WRITE SECTOR(S)
− SET MULTIPLE MODE1
− WRITE MULTIPLE
− FLUSH CACHE
− READ BUFFFER
− WRITE BUFFER
− NOP
− DOWNLOAD MICROCODE
− WRITE UNCORRECTABLE EXT
1. The only multiple supported will be multiple 1
Status Flags
ID Attribute Threshold
SP EC ER PE OC PW
Status Flags
ID Attribute Threshold
SP EC ER PE OC PW
Status Flags
ID Attribute Threshold
SP EC ER PE OC PW
Host Writes
Raw value: reports total number of sectors written by the
E1h host system. The raw value is increased by 1 for every 1 1 0 0 1 0 0 (none)
65,536 sectors (32MB) written by the host.
Normalized value: always 100.
Status Flags
ID Attribute Threshold
SP EC ER PE OC PW
This attribute tracks the drive wear seen by the device during the last wear timer loop, as a
percentage of the maximum rated cycles. The raw value tracks the percentage up to 3 decimal
points. This value should be divided by 1024 to get the percentage.
For example: if the raw value is 4450, the percentage is 4450/1024 = 4.345%. The raw value is held
at FFFFh until the wear timer (attribute E4h) reaches 60 (minutes) after a SMART EXECUTE OFFLINE
IMMEDIATE (B0h/D4h) subcommand 40h to the SSD. The normalized value is always set to 100 and
should be ignored.
This attribute shows the percentage of I/O operations that are read operations during the last
workload timer loop. The raw value tracks this percentage and is held at FFFFh until the workload
timer (attribute E4h) reaches 60 (minutes). The normalized value is always set to 100 and should be
ignored.
This attribute is used to measure the time elapsed during the current workload. The attribute is
reset when a SMART EXECUTE OFFLINE IMMEDIATE (D4h) subcommand 40h is issued to the drive.
The raw value tracks the time in minutes and has a maximum value of 2^32 = 4,294,967,296 minutes
(8,171 years). The normalized value is always set to 100 and should be ignored.
User Notes
• Sending a SMART EXECUTE OFFLINE IMMEDIATE (B0h/D4h) subcommand 40h to the SSD
resets and starts all three attributes (Media Wear Indicator, Attribute E2h, Host Reads
Percentage, Attribute E3h, and the Workload timer, Attribute E4h) to FFFFh.
• The Attribute raw values are held at FFFFh until the Workload timer (Attribute E4h) reaches a
total of 60 (minutes) of power on time. After 60 minutes, the Timed Workload data is made
available.
• After the Workload timer (E4h) reaches 60 (minutes), the Timed Workload data is saved every
minute so only 59 seconds of data is lost if power is removed without receiving ATA STANDBY
IMMEDIATE. Accumulated data is not reset due to power loss.
• Upon power up, the attributes hold a snapshot of their last saved values for 59 seconds and
live data is available after 60 seconds, once the initial one hour interval is completed.
The Timed Workload Endurance attributes described in this section are intended to be used to
measure the amount of media wear that the drive is subjected to during a timed workload.
Ideally, the system that the drive is being used in should be capable of issuing SMART commands.
Otherwise, provisions have been provided to allow the media wear attributes to be persistent so
the drive can be moved to a SMART capable system to read out the drive wear attribute values.
1. On a SMART capable system issue the SMART EXECUTE OFF-LINE IMMEDIATE (D4h)
sub-command 40h to reset the drive wear attributes.
2. Run the workload to be evaluated for at least 60 minutes. Otherwise the drive wear attributes
will not be available.
3. Read out the drive wear attributes with the SMART READ DATA (D0h) command.
1. On a SMART capable system, issue the SMART EXECUTE OFF-LINE IMMEDIATE (D4h)
sub-command 40h to reset the drive wear attributes.
2. Move the drive to the system where the workload will be measured (and not capable of
SMART commands).
3. Run the workload to be evaluated for at least 60 minutes. Otherwise the drive wear attributes
will not be available.
4. Do a clean system power down by issuing the ATA STANDBY IMMEDIATE command prior to
shutting down the system. This will store all the drive wear SMART attributes to persistent
memory within the drive.
5. Move the drive to a SMART capable system.
6. Read out the drive wear attributes with the SMART READ DATA (D0h) command within 59
seconds after power-up.
The following is an example of how the drive wear attributes can be used to evaluate the impact of a
given workload. The Host Writes SMART attribute (E1h) can also be used to calculate the amount of
data written by the host during the workload by reading this attribute before and after running the
workload. This example assumes that the steps shown in “Example Use Cases” on page 18 were
followed to obtain the following attribute values:
• Timed Workload Media Wear (E2h) has a raw value of 16. Therefore, the percentage wear =
16/1024 = 0.016%.
• Timed Workload Host Read/Write Ratio (E3h) has a normalized value of 80, indicating that
80% of operations were reads.
• Workload Timer (E4h) has a raw value of 500. Therefore the workload ran for 500 minutes.
• Host Writes Count (E1h) had a raw value of 100,000 prior to running the workload and a value
of 130,000 at the end of the workload. Therefore, the number of sectors written by the host
during the workload was 30,000 * 65,535 = 1,966,050,000 sectors or 1,966,050,000 *
512/1,000,000,000 = 1,007 GB.
The workload took 500 minutes to complete with 80% reads and 20% writes. A total of 1,007 GB
of data was written to the device, which increased the media wear in the drive by 0.016%. At this
point in time, this workload is causing a wear rate of 0.016% for every 500 minutes, or
0.00192%/hour.
Intel® SSD DC S3700 Series implements the following Log Addresses: 00h, 02h, 03h, 06h, and 07h.
Intel DC S3700 Series implements host vendor specific logs (addresses 80h-9Fh) as read and write
scratchpads, where the default value is zero (0). Intel SSD DC S3700 Series does not write any
specific values to these logs unless directed by the host through the appropriate commands.
Intel DC S3700 Series also implements a device vendor specific log at address A9h as a read-only
log area with a default value of zero (0).
The Device Statistics log is a read-only GPL/SMART log located at read log address 0x04 and is
accessible using READ LOG EXT, READ LOG DMA EXT or SMART READ LOG commands.
The following table lists the Device Statistics supported by the Intel SSD DC S3700 Series.
Certification Description
Low Voltage DIRECTIVE 2006/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL
CE Compliant of 12 December 2006, and EMC Directive 2004/108/EC OF THE EUROPEAN PARLIAMENT AND
OF THE COUNCIL of 15 December 2004.
Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment - Radio
BSMI Compliant disturbance Characteristics - limits and methods of measurement, as amended on June 1, 2006,
is harmonized with CISPR 22: 2005.04.
Voluntary Control Council for Interface to cope with disturbance problems caused by personal
VCCI
computers or facsimile.
7.0 References
The following table identifies the standards information referenced in this document.
http://qdms.intel.com/
June 2009 RoHS Click Search MDDS Database and search
for material description datasheet
F = Fixed
Word V = Variable Default Value Description
X = Both
F = Fixed
Word V = Variable Default Value Description
X = Both
F = Fixed
Word V = Variable Default Value Description
X = Both
150-159 X 0h Vendor-specific
160 X 0h CompactFlash Association (CFA) power mode 1
161-167 X 0h Reserved for assignment by the CFA
168 X 3h Reserved for assignment by the CFA
169 X 0001h Data set management Trim attribute support
170-175 F 0h Reserved for assignment by the CFA
176-205 X Varies Current media serial number
206 X 003Dh SCT Command Transport
207-208 F 0000h Reserved
209 X 4000h Alignment of logical blocks within a physical block
210-211 V 0000h Write-Read-Verify Sector Count Mode 3 (DWord)
212-213 F 0000h Write-Read-Verify Sector Count Mode 2 (DWord)
214 X 0000h NV Cache Capabilities
215-216 V 0000h NV Cache Size in Logical Blocks (DWord)
217 F 0001h Nominal media rotation rate
218 V 0000h Reserved
219 F 0000h NV Cache Options
220 V 0000h Write-Read-Verify feature set
221 X 0000h Reserved
222 F 101Fh Transport major version number
223 F 0000h Transport minor version number
224-229 F 0000h Reserved
230-233 X 0000h Extended Number of User Addressable Sectors (QWord)
Minimum number of 512-byte data blocks per DOWNLOAD MICROCODE
234 F 0001h
command for mode 03h
Maximum number of 512-byte data blocks per DOWNLOAD
235 F FFFFh
MICROCODE command for mode 03h
236-254 X 0000h Reserved
255 V Varies Integrity word
Notes:
F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when media is removed
or changed.
V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the commands executed
by the device.
X = F or V. The content of the word may be fixed or variable.