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kvr16ln11 4

This document summarizes the specifications of a 4GB DDR3L-1600 CL11 memory module from ValueRAM. The module uses eight 512M x 8-bit DRAM chips operating at 1.35V or 1.5V with a clock frequency of 800MHz. It has a CL latency of 11 cycles, a minimum row cycle time of 48.125ns, and operates between 0°C and 85°C. The module has a height of either 0.740" or 1.180" and uses a 240-pin DIMM connector.

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36 views2 pages

kvr16ln11 4

This document summarizes the specifications of a 4GB DDR3L-1600 CL11 memory module from ValueRAM. The module uses eight 512M x 8-bit DRAM chips operating at 1.35V or 1.5V with a clock frequency of 800MHz. It has a CL latency of 11 cycles, a minimum row cycle time of 48.125ns, and operates between 0°C and 85°C. The module has a height of either 0.740" or 1.180" and uses a 240-pin DIMM connector.

Uploaded by

xmangakax
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Memory Module Specifications

KVR16LN11/4
4GB 1Rx8 512M x 64-Bit PC3L-12800
CL11 240-Pin DIMM

DESCRIPTION SPECIFICATIONS
This document describes ValueRAM's 512M x 64-bit (4GB) CL(IDD) 11 cycles
DDR3L-1600 CL11 SDRAM (Synchronous DRAM), 1Rx8, low Row Cycle Time (tRCmin) 48.125ns (min.)
voltage, memory module, based on eight 512M x 8-bit FBGA Refresh to Active/Refresh 260ns (min.)
components. The SPD is programmed to JEDEC standard Command Time (tRFCmin)
latency DDR3-1600 timing of 11-11-11 at 1.35V or 1.5V. This Row Active Time (tRASmin) 35ns (min.)
240-pin DIMM uses gold contact fingers. The electrical and UL Rating 94 V - 0
mechanical specifications are as follows: Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C
FEATURES
• JEDEC standard 1.35V and 1.5V Power Supply

• VDDQ = 1.35V and 1.5V

• 800MHz fCK for 1600Mb/sec/pin

• 8 independent internal bank

• Programmable CAS Latency: 11, 10, 9, 8, 7, 6

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with


starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]

• Bi-directional Differential Data Strobe

• Internal(self) calibration : Internal self calibration through ZQ


pin (RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C,


3.9us at 85°C < TCASE < 95°C

• Asynchronous Reset
• PCB Height: 0.740” (18.75mm) or 1.180” (30.00mm)

Important Information: The module defined in this data sheet is one of several configurations available under
this part number. While all configurations are compatible, the DRAM combination and/or the module height
may vary from what is described here.

Continued >>

Document No. VALUERAM1365-001.C00 05/10/21 Page 1


MODULE DIMENSIONS:

kingston.com Document No. VALUERAM1365-001.C00 Page 2


©2021 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA.
All rights reserved. All trademarks and registered trademarks are the property of their respective owners.

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