DVB 2 Service Manual
DVB 2 Service Manual
SERVICE MANUAL
       SATELLITE STB
          MODEL
           DVB 530
           DVB 630
           DVB 710
          DVB 710 CI
  Schematic Version PCB 16 MB04E3
        Artwork Version 1.0
SERVICE MANUAL
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 28                                                                                                     LDER (128K01)
40005188
R3
RES SMD 1/16W 220R J (0603)
30012868
IC6
IC TS87C52X2-MCB tape&reel
300143429R30
RES SMD 1/16W 10K J
                   29                                                                                                     29
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                                                          31
                                                     31
                                   31                                ü                                           ÷
 551002 \H 31
 UPLOAD DEFAULT SAT_XPDRS : ............................................................................................................................................... 31
 DOWNLOAD DEFAULT SAT_XPDRS : ......................................................................................................................................... 31
 RS232 TEST :............................................................................................................................................................................. 32
 SOFTWARE UPGRADE THROUGH RS232 ......................................................................................................................... 33
 SCHEMATICS .............................................................................................................................................................................. 33
 16PW04-5 POWER BOARD SCHEMATIC ........................................................................................................................... 34
 16MB04-E3 MAINBOARD SCHEMATIC I........................................................................................................................... 34
 16MB04-E3 MAINBOARD SCHEMATIC II ......................................................................................................................... 34
 16MB04-E3 MAINBOARD SCHEMATIC III ........................................................................................................................ 34
 16MB04-E3 MAINBOARD SCHEMATIC IV........................................................................................................................ 34
 16MB04-E3 MAINBOARD SCHEMATIC V ...................................................................ERROR! BOOKMARK NOT DEFINED.
 16MB04-E3 MAINBOARD SCHEMATIC VI........................................................................................................................ 34
 16FP0X-X FRONT BOARD SCHEMATIC ............................................................................................................................ 34
 16SC04-4 SCART SCHEMATIC ...................................................................................... ERROR! BOOKMARK NOT DEFINED.
 16UK04-1 REMOTE BOARD SCHEMATIC ......................................................................................................................... 34
 BILL OF MATERIALS .................................................................................................................................................................. 35
 BOARD LAYOUT ........................................................................................................................................................................ 72
 16PW04-5 COMPONENT LAYER:............................................................................................................................................... 72
 16PW04-5 BOTTOM LAYER: ..................................................................................................................................................... 72
 16MB04-E3 TOP LAYER: .......................................................................................................................................................... 72
 16MB04-E3 COMPONENT LAYER: ............................................................................................................................................ 72
 16MB04-E3 GND LAYER:........................................................................................................................................................ 72
 16MB04-E3 VCC LAYER: ........................................................................................................................................................ 73
 16MB04-E3 BOTTOM LAYER:................................................................................................................................................... 73
 16FP05-2 COMPONENT LAYER: ................................................................................................................................................ 73
 16FP05-2 BOTTOM LAYER:....................................................................................................................................................... 73
 16FP06-2 COMPONENT LAYER: ................................................................................................................................................ 73
 16FP06-2 BOTTOM LAYER:....................................................................................................................................................... 73
 16FP07-4 COMPONENT LAYER: ................................................................................................................................................ 73
 16FP07-4 BOTTOM LAYER:....................................................................................................................................................... 73
 16SC04-4 COMPONENT LAYER:................................................................................................................................................ 73
 16SC04-4 BOTTOM LAYER: ...................................................................................................................................................... 73
 16FP04-4 BOTTOM LAYER:.................................................................................................ERROR! BOOKMARK NOT DEFINED.
 16UV04-1 TOP LAYER:............................................................................................................................................................. 73
 16UV04-1 BOTTOM LAYER: ..................................................................................................................................................... 74
 16UV04-1 SOLDER LAYER:....................................................................................................................................................... 74
REVISION HISTORY
Rev 1.0          02/08/02                 Cumhur AKIN              Initial Revision
                                                                   Schematics
GENERAL DESCRIPTION
Major functional blocks are discussed briefly in this section. A more detailed description is contained later in the
document.
STi5512 (IC2)
1. Introduction
        The STi5512 is the latest in the OMEGA family of integrated multimedia decoder engines for DVB set top
box systems. Compared to the STi5510, it has an enhanced External Memory Interface which supports SDRAM,
without the need for glue logic. The device has increased performance with a 60MHz CPU clock, a digital YCrCb
output, support for Genlock, and new display modes. The STi5512 can also be used as a replacement part for the
STi5510 as it has the same architecture and is pin-compatible, however, some software modifications are required.
STi5512 mode is selected by setting pin YC0 low, and STi5510 mode is selected by setting pin YC0 high.
        The STi5512 is available with any combination of ICAM and Macrovision options, and different part
numbers are used to identify the options as described in the section below. Throughout this manual, where the
information is generic to all Macrovision and ICAM options, the device is referred to as the STi5512 only.
Macrovision/ICAM option Package type ( W=BGA) Functional revision
2. Technical Specification
High performance graphics system
       • High resolution chroma mode (4:4:4) for RGB output
       • 2 to 8 bits per pixel OSD options
       • Link list control
       • 4-bit mixing factor by region or 6-bit mixing for each CLUT entry (anti-aliasing)
       • 8-bit Y, U and V resolution palette
       • Extra YUV plane for background images or graphics
       • 2D, paced BLT engine with “fill” function
       • Anti-flicker and anti-flutter filters
Enhanced 32-bit VL-RISC CPU - 60 MHz clock
       • Fast integer/bit operation and very high code density
High-performance memory/cache subsystem
       • 2 Kbytes instruction cache, 2 Kbytes data cache or SRAM, 4 Kbytes SRAM
       • 200 Mbytes/s maximum bandwidth
Combined video and audio decoder core
       • Video decoder fully supports MPEG-2 MP@ML. Letter box (16:9 and 14:9), 2:1, 3:1 and 4:1 downsizing
       • Memory reduction - PAL MP@ML in 12 Mbits
       • Audio decoder supports layers 1 and 2 of MPEG 1,and an AC-3 interface to an external decoder
       • Digital YCrCb output in 4:2:2 format
PAL/NTSC/SECAM encoder
       • MacrovisionTM 7.01, teletext and closed caption
       • Outputs RGB with 10-bit DACs and CVBS, Y, C and component output (YUV) with 10-bit DACS
       • Separate OSD control for RGB and CVBS outputs
       • Genlock support
High performance SDRAM memory interface
       • Supports two 16- or one 64-Mbit 100 MHz SDRAMs
       • Accessible by MPEG decoder, PTI, DMAs and CPU
        • High bandwidth access from CPU allows high performance OSD operations
Programmable external memory interface (EMI)
        • Glueless interface to SDRAM
Programmable transport interface
        • Parallel or serial input
        • Supports DVB bit-streams
        • More than 32 PIDs supported
        • DVB descrambler
        • 32 SI/PSI filters of 8 bytes
Vectored interrupts - 8 prioritized levels
Interfaces and DMA engines
        • 2 SmartCard interfaces, 2 UARTs, 2 I2C/SPI controllers, 3 PWM outputs, 4 timers, 3 capture timers
        • Block move DMA
        • Teletext interface, input from external source
        • IEEE1284 port, or IEEE1394 A/V link layer interface
Low power controller/real time clock/watchdog
JTAG test access port
Professional toolset support
        • ANSI C compiler and libraries
        • Advanced debugging tools
Non-intrusive debug controller
        • Hardware breakpoints
        • Real-time trace
3. Architecture overview
The STi5512 includes the following hardware modules:
         • Transport demultiplexor
         • System microcontroller
         • MPEG video decoder
         • MPEG audio decoder
         • PAL/NTSC/SECAM encoder
The STi5512 directly interfaces to external memory and peripherals with no extra glue logic, keeping the system
cost to a minimum. The STi5512 architectural block diagram is shown below.
a. Processor
The Central Processing Unit (CPU) on the STi5512 is the ST20-C2 32-bit processor core running at the CPU clock
rate. It contains instruction processing logic, instruction and data pointers and an operand register. It directly
accesses the high speed on-chip caches and SRAM, which can store data or programs. The processor can also
access memory via the External Memory Interface (EMI) and SDRAM interface.
The SDRAM interface includes all the signals necessary for control of the memory. Refresh is handled automatically
by the decoder. The SDRAM interface supports two 16-Mbit or one 64-Mbit 100 MHz SDRAMs. The memory is
used to hold the bit buffer, store decoded pictures and provide the display buffer. It also holds the user-defined on-
screen display (OSD) bitmaps and can be used by the CPU for private storage of data. For the decoding of PAL
MP@ML sequences, 12 Mbits of SDRAM are required.
d. PAL/NTSC/SECAM encoder
Integrated into this subsystem is all the digital processing and the digital to analog convertors required to process
the digital video output from the MPEG video decoder and produce RGB, YUV, YC and CVBS analog outputs. The
output of the teletext interface is filtered and re-inserted into the blanking interval in this subsystem.
f. Memory subsystem
The STi5512 on-chip memory system provides 200 Mbytes/s internal data bandwidth, supporting pipelined 2-cycle
internal memory access at 20 ns cycle times at 60 MHz. The STi5512 memory subsystem consists of instruction
and data caches, SRAM and an external memory interface (EMI). The STi5512 product has 4 Kbytes of on-chip
SRAM. The advantage of this is the ability to store on-chip any timecritical code, such as interrupt routines, software
kernels or device drivers, and even frequently used data. The instruction and data caches are direct mapped with a
write-back system for the data cache. The caches support burst accesses to the external memories for refill and
write-back which are effective for increasing performance with page-mode DRAM memories. The data cache may
also be configured as an additional 2 Kbytes of internal SRAM. The STi5512 EMI controls access to the external
memory and peripherals including the DMA data ports. It can access a 16 Mbyte physical address space in each of
the three memory banks, or greater if DRAM is used. It provides sustained transfer rates of up to 80 Mbytes/s for
SRAM, and up to 40 Mbytes/s using page-mode DRAM. The 32-bit programmable EMI supports ROM, SRAM and
DRAM/SDRAM for the ST20. SDRAM is supported at the CPU clock rate. The STi5512 supports boot bank width
ROM/Flash population options using the address shift mechanism. The SDRAM interface supports the use of two
16 Mbits or one 64 Mbits of external 100 MHz SDRAM. This memory is used to store the display data generated by
the MPEG decoder and the CPU and read by the display unit.
g. Interrupt subsystem
The STi5512 interrupt subsystem supports eight prioritized interrupt levels. Four external interrupt pins are
provided. Level assignment logic allows any of the internal or external interrupts to be assigned to any interrupt
level. Interrupt level sharing is supported for level-sensitive interrupts.
h. Serial communications
To facilitate the connection of this system to a modem for a pay-per-view type system and other peripherals, two
UARTs (ASC2s) are included in the device. The UARTs provide an asynchronous serial interface and can be
programmed to support a range of baud rates and data formats, for example, data size, stop bits and parity. The
UARTs are buffered with 16 byte FIFOs for transmit and receive data. Two synchronous serial communications
(SSC2) interfaces are provided on the device. These can be used to control, via an I2C or SPI bus, the tuner, Link-
IC, E2PROM (if used) and the remote control devices in the application.
l. Parallel IO module
Forty bits of parallel IO are provided. Each bit is programmable as an output or an input. The output can be
configured as a totem pole or open drain driver. Input compare logic is provided which can generate an interrupt on
any change of any input bit. Many pins of the STi5512 device are multi-functional, and can either be configured as
PIO or connected to an internal peripheral signal such as a UART or SSC.
m. Teletext
The teletext connects to the internal digital encoder using a request and data protocol. It translates teletext data to
and from memory. It has two modes of operation; teletext data in and teletext data out. In teletext data out mode,
the teletext interface uses DMA to retrieve teletext data from memory, and serializes the data for transmission to the
composite video encoder. In teletext data in mode, teletext data is extracted from the composite video signal and is
fed into the teletext interface as a serial stream. The teletext interface assembles the data and uses DMA to pass
this data to memory.
n. Diagnostic controller
The Diagnostic Controller Unit (DCU) is accessed via the JTAG test access port. It is the main access for
communication with a host for development, including loading code and debugging. It provides:
• Bootstrapping and debugging during development
• Hardware breakpoint and watchpoint facilities
• Real-time tracing
• External LSA triggering support
5. Pin list
Signal names are prefixed by not if they are active low; otherwise they are active high.
1 This pin is tri-stated during reset and then sampled at the end of the reset to determine whether the OS-Link is active and
to determine the function of the shared CPUAnalyse / TrigIn and the ErrorOut / TrigOut, as described in the System
Services chapter. If the ErrorOut pin is sampled high (i.e at VDD) then the DCU signals (TrigIn and TrigOut) are
selected and a low value indicates OS-Link signals (i.e. CPUAnalyse, ErrorOut) are to be used. External 10KΩ pull-up
or pull-down resistors should be fitted to the ErrorOut according to the functionality desired.
notMemRAS2 out RAS strobe for SDRAM/DRAM in bank 1, chip select for Bank1 or RAS strobe for lowest DRAM sub-bank in
Bank1. notMemRAS3 out RAS strobe for highest DRAM sub-bank in Bank1 or SDRAM Chip select signal for Bank1
notSDRAMCS0 out SDRAM Chip select signal for Bank0 or lowest sub-bank of Bank0
The teletext clock and data inputs are shared PIO pins, as shown in Table 17 High speed data port pins have a dual
function, and can be used either to interface to an external IEEE 1394 link layer controller or provide an IEEE 1284
parallel port interface.
GENERAL DESCRIPTION
          The 64Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 67,108,864 bits. It is
internally configured as a quad-bank DRAM with a synchronous interface (all signals are registered on the positive
edge of the clock signal, CLK). Each of the x4’s 16,777,216 -bit banks is organized as 4,096 rows by 1,024 columns by 4
bits. Each of the x8’s 16,777,216-bit banks is organized as 4,096 rows by 512 columns by 8 bits. Each of the x16’s
16,777,216-bit banks is organized as 4,096 rows by 256 columns by 16 bits. Read and write accesses to the
SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of
locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then
followed by a READ or WRITE
command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be
accessed (BA0, BA1 select the bank; A0-A11 select the row). The address bits registered coincident with the READ or
WRITE command are used to select the starting column location for the burst access.
           The SDRAM provides for programmable READ or WRITE burst lengths of 1, 2, 4 or 8 locations, or the full page,
with a burst terminate option. An AUTO PRECHARGE function may be enabled to provide a self-timed row precharge that
is initiated at the end of the burst sequence. The 64Mb SDRAM uses an internal pipelined architecture to achieve high-
speed operation. This architecture is compatible with the 2n rule of prefetch architectures, but it also allows the column
address to be changed on every clock cycle to achieve a high-speed, fully random access. Precharging one bank while
accessing one of the other three banks will hide the precharge cycles and provide seamless, high-speed, random-access
operation. The 64Mb SDRAM is designed to operate in 3.3V, lowpower memory systems. An auto refresh mode is
provided, along with a power-saving, power-down mode. All inputs and outputs are LVTTL-compatible. SDRAM’s offer
substantial advances in DRAM operating performance, including the ability to synchronously burst data at a high data rate
with automatic column-address generation, the ability to interleave between internal banks in order to hide precharge time
and the capability to randomly change column addresses on each clock cycle during a burst access.
DESCRIPTION
The M29W800 is a non-volatile memory that may be erased electrically at the block or chip level and programmed
in-system ona Byte-by-Byteor Wordby-Word basis using only a single 2.7V to 3.6V VCC supply. For Program and
Erase operations the necessary high voltages are generated internally. The device can also be programmed in
standard programmers. The array matrix organisation allows each block to be erased and reprogrammed without
affecting other blocks. Blocks can be protected against programing and erase on programming equipment, and
temporarily unprotected to make changes in the application. Each block can be programmed and erased over
100,000 cycles. Instructions for Read/Reset, Auto Select for reading the Electronic Signature or Block Protection
status, Programming, Blockand Chip Erase, Erase Suspend and Resume are written to the device in cycles of
commands to a Command Interface using standard microprocessor write timings. The device is offered in
TSOP48(12 x 20mm) and SO44 packages. Both normal and reverse pinouts are available for the TSOP48package.
Organisation
TheM29W800 is organised as 1 Mx8 or 512K x16 bits selectable by the BYTE signal. When BYTEis Low the Byte-
wide x8 organisation is selected and the address lines are DQ15A–1 and A0-A18. The Data Input/Output signal
DQ15A–1 acts as address line A–1 which selects the lower or upper Byte of the memory word for output on DQ0-
DQ7,DQ8-DQ14 remain at High impedance. When BYTEis High the memory uses the address inputs A0-A18 and
the Data Input/Outputs DQ0-DQ15. Memory control is provided by Chip Enable E, Output Enable G and Write
EnableW inputs. AReset/Block Temporary Unprotection RPtri-level input provides a hardware reset when pulled
Low,and when held High (atVID) temporarily unprotects blocks previously protected allowing them to be programed
and erased. Erase and Program operations are controlled by an internal Program/Erase Controller (P/E.C.). Status
Register data output on DQ7 provides a Data Polling signal, and DQ6 and DQ2 provide Toggle signals to indicate
the state of the P/E.C operations. A Ready/Busy RB output indicates the completion of the internal algorithms.
Memory Blocks
The devices feature asymmetrically blocked architecture providing system memory integration. Both M29W800Tand
M29W800Bdeviceshavean array of 19 blocks, one Boot Block of 16 KBytes or 8KWords, two Parameter Blocks of 8
KBytes or 4KWords, one Main Block of 32 KBytes or 16KWordsand fifteen Main Blocks of 64 KBytes or 32KWords.
The M29W800Thas the Boot Block at the top of the memory address space and the M29W800B locates the Boot
Block starting at the bottom. The memory maps are showed in Figure3. Each block can be erased separately, any
combination of blocks can be specified for multi-block erase or the entire chip may be erased. The Erase operations
are managed automatically by the P/E.C. The block erase operation can be suspended in order to read from or
program to any block not being ersased, and then resumed. Block protection provides additional data security. Each
block can be separately protected or unprotected against Program or Erase on programming equipment. All
previously protected blocks can be temporarily unprotected in the application.
Bus Operations
The following operations can be performed using the appropriate bus cycles: Read(Array, Electronic Signature,
Block Protection Status), Write command, Output Disable, Standby, Reset, Block Protection, Unprotection,
Protection Verify, Unprotection Verify and Block Temporary Unprotection.
Command Interface
Instructions, made up of commands written in cycles, can be given to the Program/Erase Controller through a
Command Interface (C.I.). For added data protection, program or erase execution starts after4 or 6 cycles. The first,
second, fourth and fifth cycles are used to input Coded cycles to the C.I. This Coded sequence is the same for all
Program/Erase Controller instructions. The ’Command’ itself and its confirmation, when applicable, are given on the
third, fourth or sixth cycles. Any incorrect command or any improper command sequence will reset the device to
Read Array mode.
Instructions
Seven instructions are defined to perform Read Array, Auto Select (to read the Electronic Signature or Block
Protection Status), Program, Block Erase, Chip Erase, Erase Suspend and Erase Resume. The internal P/E.C.
automatically handles all timing and verification of the Program and Erase operations. The Status Register Data
Polling, Toggle, Error bits and the RB output may be read at any time, during programming or erase, to monitor
the progress of the operation. Instructions are composed of up to six cycles. The first two cycles input a Coded
sequence to the Command Interface which is common to all instructions The third cycle inputs the instruction set-
up command. Subsequent cycles output the addressed data, Electronic Signature or Block Protection Status for
Read operations. In order to give additional data protection, the instructions for Program and Block or Chip Erase
require further command inputs. For a Program instruction, the fourth command cycle inputs the address and data
to be programmed. For an Erase instruction (Block or Chip), the fourth and fifth cycles input a further Coded
sequence before the Erase confirm command on the sixth cycle. Erasure of a memory block may be suspended, in
order to read data from another block or to program data in another block, and then resumed. When power is first
applied or if VCC falls below VLKO, the command interface is reset to Read Array.
Description
The AT24C128/256 provides 131,072/262,144 bits of serial electrically erasable and programmable read only
memory (EEPROM) organized as 16,384/32,768 words of 8 bits each. The device’s cascadable feature allows up to
four devices to share a common 2-wire bus. The device is optimized for use in many industrial and commercial
applications where low-power and low-voltage operation are essential. The devices are available in space-saving 8-
pin JEDEC PDIP, 8-lead EIAJ, 8-lead JEDEC SOIC, 14-lead TSSOP, and 8-pad LAP packages. In addition, the
entire family is available in 5.0V (4.5V to 5.5V), 2.7V (2.7V to 5.5V) and 1.8V (1.8V to 3.6V) versions.
Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative
edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may
be wire-O Red with any number of other open-drain or open collector devices.
DEVICE/PAGE ADDRESSES (A1, A0): The A1 and A0 pins are device address inputs that are hardwired or left not
connected for hardware compatibility with AT24C32/64. When the pins are hardwired, as many as four 128K/256K
devices may be addressed on a single bus system (device addressing is discussed in detail under the Device
Addressing section). When the pins are not hardwired, the default A1 and A0 are zero.
WRITE PROTECT (WP): The write protect input, when tied to GND, allows normal write operations. When WP is
tied high to VCC, all write operations to the memory are inhibited. If left unconnected, WP is internally pulled down to
GND. Switching WP to VCC prior to a write operation creates a software write protect function.
Memory Organization
AT24C128/256, 128K/256K SERIAL EEPROM: The128K/256K is internally organized as 256/512 pages of 64-
bytes each. Random word addressing requires a 14/15-bit data word address.
I2C Bus Compatible Audio Video (AV) Switch & Electronic Volume Control
(IC301)
Description
The Sony CXA2161R is an Audio/Video switch designed primarily for application in Digital Set Top Boxes. It
provides video and audio routing from the digital encoder source to the TV and VCR scart (peritelevision)
connectors. In addition, the TV audio output has a programmable volume control. The chip is programmed by
means of an I2C interface and can operate from a single or dual power supply. Target specifications: Canal+,
BSkyB, TPS, NorDig, and ECCA Euro-Box
Features
Supply
• Single: 0V, +5V, +12V
• Dual: 0V, –5V, +5V and +12V
(Low number of external parts required)
Video
• 2 scart switching (VCR, TV)
• VCR input supports RGB mode
• Integrated 75 drivers for direct video connection
• Y/C mixer with trap for RF modulators
• Switchable clamps on inputs
• Adjustable gain on RGB outputs
• Video output shutdown for low power modes
• Fast blanking switch
• Slow blanking switch for TV and VCR output
• SVHS switch on VCR output
• Y/C auxiliary input
Audio
• Four stereo audio inputs
• Volume control (–56dB to +6dB in 2dB steps)
• Additional switchable gain on audio DAC inputs
• Audio overlay facility
• Volume bypass for TV and Phono outputs
• Mono switching on TV, VCR outputs
• High drive capability (600 loads possible)
• Switchable audio limiter function
• Switchable Mono output for RF modulators
USED IC LISTS
Sti5512AWE (IC2) Set Top Box Backend Decoder With Integrated Host Processor
CXA2161R (IC301) I2C Bus Compatible Audio Video (AV) Switch & Electronic Volume Control
CONNECTORS
Power Connector
3. Scart Connector
SCART CONNECTION
20 18 16 14 12 10 8 6 4 2
21 19 17 15 13 11 9 7 5 3 1
TV Scart Socket
POWER REQUIREMENTS
         Power measurements are for a board configured according to the included Bill of Materials while playing a
typical DVB channel.
                                                                           Watts
              LNB_SUPPLY_IN (13V, 18V)              -----                    -----
                      +30V                          -----                    -----
                      +12V                         30mA                   360mW
                       +5V                        145mA                   725mW
                      +3V3                          -----                    ----
                     Voltage                     Current mA                Power
 POWER_ON
                                                                           Watts
              LNB_SUPPLY_IN (13V, 18V)          500mA (max)              6.5W, 9W
                      +30V                           1mA                   30mW
                      +12V                          30mA                  360mW
                       +5V                         340mA                    1.7W
                      +3V3                         780mA                  2.574W
PCB EXPLANATIONS
INTRODUCTION
       DVB-S (digital satellite receiver) is designed with ST chipset. The technical information of
the receiver will be explained as three parts in the following pages: Power Board, Main Board
and Front Panel Board.
        The TOPSwitch concept is used for power supply. TOP 233Y (IC1) is designed to work
until 50 Watts in family of TOPSwitch_FX with 5 pins. The receiver works between 85 and 265
VAC mains voltage by using TOP 233Y in SMPS (Switch Mode Power Supply). The secondary
voltage regulation is adjusted by changing the duty cycle of drain signal according to the
feedback voltage, which is got from the secondary side of transformer. The feedback voltages
are 3.3V and 5V. This is connected to the comparator pin of TOP 233Y (IC1-pin1) via IC12
(Optocoupler). The comparator pin also protects the box against short circuits and overload. The
Vcc voltage of IC1 is between 2V –3V at pin2. The TOP 233Y works at a fixed frequency. This
frequency is fixed by RC oscillator at pin1. The pin3 and pin 4 are ground and the pin5 is drain
of MOSFET, which is inside the TOP 233Y.
       The switching of LNB supply voltage is done here. 18V and 22V outputs of transformer
switched by Q1, Q2 and H/V output of STV299 (TU501 or TU502). By this way overheating and
unnecessary power consumption of Q5 (BD235) that regulates the LNB supply is prevented.
22kHz tone which is needed for DiSEqC signals, is generated at pin18 (TU501) or pin10
(TU502) of STV0299 in tuner 22KHz is added to LNB supply here via LM358N (IC4)
                                                                  Watts
              LNB_SUPPLY_IN (13V, 18V)               -----
                      +30V                       31V – 34V
                      +12V                     11.8V – 12.20V
                       +5V                      4.2 V – 4.5V
                      +3V3                      3.7 V – 3.9V
                                                                  Power
                        Voltage                Range of Voltage
                                                                  Watts
 POWER_ON
             LNB_SUPPLY_IN ( 13V…VER. )          13 V – 14 V
              LNB_SUPPLY_IN ( 18V HOR.)          17V – 19V
                       +30V                      31 V – 34 V
                       +12V                    11.8 V – 12.2 V
                       +5V                      4.9 V – 5.3 V
                         +3V3                    3.7 V – 3.9V
       The main board contains two parts: Front-end and Back-end. The digital signal is
demodulated in Front-end and then decoded in Back-end. Analog signals are processed in
different part.
       The tuner (TU501 Alps or TU502 Sharp) is capable of getting both digital broadcasts.
After the modulated signals (I, Q outputs) receive from tuner, they go to STV0299 for
demodulation process in tuner. (TU501 or TU502) In this IC, QPSK (Quadrated Phase Shift
Keying) demodulation and Forward Error Correction (FEC) are done which is necessary to
demodulate DVB-S transmission. TS (transport stream): The multiplexed digital stream which
includes video, audio and data information related to more than one channel (can be only one
channel for SCPC signals) and DVB tables. TS signals which are generated after demodulation,
reach to Sti5512 (IC2) via 8 bits data bus. However, Byte Clock (FE_BCLK), Packet Clock
(FE_PCLK) and Error (FE_ERROR) signals are also sent to ST20 (ICS1) for demultiplexing
process of TS. STV0299 is controlled by I2C. In addition, 22kHz tone which is needed for
DiSEqC signals, is generated at pin18 (TU501) or pin10 (TU502) of STV0299 in tuner.
       LNB supply voltage (13/18V) is regulated via power board. Switching of supply voltage
between LOOP_IN and LNB_SUPPLY is done by Q501 transistors. The voltage on RL507 is
proportional with the current of LNB supply. Overload on LNB supply increases the voltage on
R507, which results switching of Q503, Q504. By this way input LNB_OVERLOAD signal port of
Sti 5512 (IC2) has the knowledge of LNB overload and then LNB supply is cut off for protection
of box via Sti 5512 interrupt port (P45_INT2).
      At the backend part, there is a 32-bit CPU ST20 (in Sti 5512 embeded ) that controls all
processes. Demultiplexer of the CPU provides the transmission of the desired channel’s
information from TS (Transport Stream) to MPEG Decoder section. The program that runs on
Sti5512 is in Flash memories (IC203, IC204). 8Mbits SDRAMs (IC201, IC202) are used for data
memory of this program.
       ST20 uses 32- bit data and 22- bit address buses for access to flash, DRAM and MPEG
decoder. It uses RAS, CAS etc. (read, write, enable) signals to activate related IC while
accessing them.
       The clock which is needed by Sti 5512 (IC2), is generated at power on mode by 27MHz
crystal (X2) and IC4 (74HCU04). The output of PWM outputs of Sti 5512 (IC2), is filtered to have
a DC level via R96 and C22. At the output of ICS3, the 27MHz clock can be adjusted according
to capacity of pins of 27MHz crystal to ground. This capacity is related with DC value on D1 and
D2 (BB133) at pins of crystal. This operation maintains synchronization between audio-video
that are coming from MPEG transport stream and PCR clock.
     Sti 5512 (IC2) can communicate any micro controller via RS232 by using IC1 (MAX232-
RS232 level converter). The RS232 output of receiver is used for debug any problem using
Windows Hyper Terminal program.
       MPEG decoder in Sti 5512 (IC2), is responsible for decoding of MPEG video and audio
signals. The video, which is compressed using MPEG2 and audio, which is compressed using
MPEG1 Layer 1-2, are processed here. After decoding, CCIR 601 formatted 8-bit video and
PCM formatted audio, are generated by mpeg decoder.
        If digital broadcast has a teletext information, Sti 5512 (IC2) inserts teletext info into VBI
(vertical blanking interval) which can be watched on TV. Digital audio that is PCM formatted on
Sti 5512’ s output, is processed by CS4335 (IC401) and amplified by LM833 (IC402) and then
switched through IC301 (CXA2161R).
       In digital mode, RGB signals are only delivered to TV scart. CVBS output is distributed
through IC301 (CXA2161R) to TV, AUX/VCR and VCR scarts. When VCR becomes active,
audio and video signals are driven to TV and VCR scarts, which is activated by pin8 of VCR
scart.
The program information is stored in 128Kbits EEPROM (24C128 – IC205) via I2C.
       To show program number, 4 digit 7 segment displays (MD1, MD2) are used on front
panel board. They are driven by 97C52 ( IC6 ) which is controlled by MC. The functional keys
are Standby, TV/Radio, Menu, OK, Vol+, Vol-, Prog+, Prog-. IR module ( MD3 ) is used for
remote control. Standby/power on led ( D2 ) is used to indicate whether the box is in Standby or
Power on mode with Red (Standby) and Green (Power on). Radio led ( D3 ) is used to show
radio channel.
RF Modulator System :
       You can control RF modulator system at this line. RF modulator system option can be
selected as Pal G or Pal I or Pal K type in software side by pressing left or right cursor key on
the remote control.
RF Modulator Type :
       You can control RF modulator type at this line. RF modulator option can be selected as
Sharp or Samsung or LG type in software side by pressing left or right cursor key on the remote
control.
Tuner Type :
Scarts :
Reboot :
        You press OK button on the front panel or on the remote commander. Apparatus is
restart.
Clear Database :
        You press OK button on the front panel or on the remote commander. These settings
reinitialize whole EEPROM and store all programs erase.
    The object of this manual is to give necessary information and details to the user to
UPLOAD the program table to the receiver through RS232.
9.    Go to “L/R: DBCopy – OK: Upload PGM” line on the service menu and press “LEFT” or
      “RIGHT” keys of remote control (for copying database to the receiver). Please wait until the
      print statements on the Hyper Terminal screen end.
10.    From “Transfer” menu, choose “Receive File”.
11.   Choose 1K Xmodem as protocol type.
12.   “L/R: DBCopy – OK: Upload PGM” line on the service menu and press “OK” key of remote
      control. Then Receive on of Hyper Terminal window and enter a file name like
      (Program_table) and press “OK” button. then You will see the progress on the PC screen.
      Besides, on TV screen the receiver will count the downloaded packets.
13.   Wait for the transfer to be completed. Then, disconnect and exit from Hyper Terminal
      window.
Download PGM :
       The object of this manual is to give necessary information and details to the user to
upgrade the program table of the receiver through RS232.
12. Press Send button of Hyper Terminal window and then Go to “Download PGM” line on the
    service menu and press “OK” key of remote control. You will see the progress on the PC
    screen. Besides, on TV screen the receiver will count the downloaded packets.
13. Wait for the transfer to be completed. Then, disconnect and exit from Hyper Terminal
    window.
Reset receiver by pressing power on/off button. Receiver will tune to new program table.
Remote/Front Test :
       You press “OK” button on the front panel or remote commander to enter Remote/Front
panel test then you can see name of the button on the front panel or remote commander you
pressed. By pressing Menu button on the front panel two times, you can exit.
        You press the OK key on the front panel or remote commander to start 7-segment
display test. You can see the test pattern on the display.
System Diagnostic :
      You press the OK key on the front panel or remote commander and show your IC
information in apparatus main hardware
Development Team :
      You press the OK key on the front panel or remote commander and Show your
development team list
      The object of this manual is to give necessary information and details to the user to
transmission the program table and preset table to the receiver through RS232.
3.    Open the “main menu” and press “929526” keys sequentially for both of the receivers, you
      will see service menu on the TV screens.
4.    Go to “L/R: DBCopy – OK: Upload PGM” line on the service menu for master receiver and
      press “LEFT” or “RIGHT” keys of remote control (for copying database to the receiver).
5.    Go to “Download PGM” line on the service menu for slave receiver
6.    “L/R: DBCopy – OK: Upload PGM” line on the service menu and press “OK” key of remote
      control or front panel for master device. “Download PGM” line on the service menu and
      press “OK” key of remote control or front panel for slave device. Besides, on TV screen the
      receiver will count the downloaded packets.
7.    Wait for the transfer to be completed the program table for both receivers.
8.    Power off both receivers then power on them.
9.    Open the “main menu” and press “929526” keys sequentially for both of the receivers, you
      will see service menu on the TV screens.
10.   Go to “Upload default Sat_Xpdrs” line on the service menu for master receiver.
11.   Go to “Download default Sat_Xpdrs” line on the service menu for slave receiver
12.   “Upload default Sat_Xpdrs” line on the service menu and press “OK” key of remote control
      or front panel for master device. “Download default Sat_Xpdrs” line on the service menu
      and press “OK” key of remote control or front panel for slave device. Besides, on TV screen
      the receiver will count the downloaded packets.
13.   Wait for the transfer to be completed the preset table for both receivers.
Rs232 Test :
      You connect the jumper to Rx output and Tx output. You press the “OK” key on the front
panel or remote commander then you can see “tESt” at the front display. You release the “OK”
key on the front panel or remote commander then you can see “Err” at the front display.
You can return to main menu by pressing “Menu” keys on the remote control
SCHEMATICS
BILL OF MATERIALS
20062060 REMOTE CONTROL DVB2 UKV B.ASSY                  20087128 3. SCART ASSY DVB-2 (SMD)
POS.NO     DESCRIPTION                        VES.CODE   POS.NO   DESCRIPTION                  VES.CODE
 C100      CAP EL 47UF 6.3V M (4*7MM)         30000395   C7       CAP SMD 470PF 50V J (0805)   30000256
 D100      LED INFRARED IR333                 30002733   C8       CAP SMD 470PF 50V J (0805)   30000256
  IC1      IC SAA3010T                        30002735   C9       CAP SMD 1NF 50V K R (0805)   30000284
 Q101      TR BC548B                          30001454   C10      CAP SMD 1NF 50V K R (0805)   30000284
 Q102      TR BC327                           30001452   C11      CAP SMD 1NF 50V K R (0805)   30000284
 R100      RES SMD 1/10W 6.8K J 0805          30000778   C12      CAP SMD 1NF 50V K R (0805)   30000284
 R101      RES SMD 1/10W 100R J               30000464   R6       RES SMD 1/10W 1K J 0805      30000469
 R102      RES SMD 1/10W 1.2K J (0805)        30000499   R7       RES SMD 1/10W 15K J (0805)   30000534
 R103      RES SMD 1/10W 68R J                30002731   R8       RES SMD 1/10W 15K J (0805)   30000534
 R104      RES SMD 1/10W 10K J 0805           30000475   R5       RES SMD 1/10W 75R J (0805)   30000797
 R105      RES SMD 1/10W 47K J (0805)         30000727            PCB 16SC04-4                 30017517
 R106      RES SMD 1/10W 1.5R J (0805)        30000546   PL1      SOCKET SCART (SATELLITE)     30011596
 X100      XTAL REZ 429KHZ (0.9MM)            30011443            CONN ASSY 10P 8CM            30015171
           R/C DVB2 (SILVER)                  20085209            VİDA C ZN YSMB M3*6          35000180
           PCB 16UV04-1                       30015100
           SINGLE BATT.CONTACT (-) RC2000     35000006
           SINGLE BATT.CONTACT (+) RC2000     35000007
           DOUBLE BATTERY CONTACT UKV-        35000003
           900
           VİDA S C ZNSY YSMB 2.9*6.5         35000210
           LENS RCDVB (I)                     40006044
           RUBBER PAD TRP38 (RCDVB) R01       40008432
           BOTTOM COVER RCDVB (I) (SILVER)    40009550
           BATTERY COVER RCDVB (I) (SILVER    40009561
           TOP COVER RCDVB (I) UK750 DVB-2    40009562
BOARD LAYOUT
16PW04-5 Component Layer: