0% found this document useful (0 votes)
93 views5 pages

SOP-8 Plastic-Encapsulate MOSFETS: N-Channel Enhancement Mode Power MOSFET

The document provides information about a N-Channel Enhancement Mode Power MOSFET. It details the product features, maximum ratings, thermal characteristics, electrical characteristics, and switching parameters of the MOSFET. Key specifications include a drain-source breakdown voltage of 30V, on-state resistances of 13.5-18mOhm, and total gate charges of 6.2-8nC.

Uploaded by

muzaffarfarhan79
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
93 views5 pages

SOP-8 Plastic-Encapsulate MOSFETS: N-Channel Enhancement Mode Power MOSFET

The document provides information about a N-Channel Enhancement Mode Power MOSFET. It details the product features, maximum ratings, thermal characteristics, electrical characteristics, and switching parameters of the MOSFET. Key specifications include a drain-source breakdown voltage of 30V, on-state resistances of 13.5-18mOhm, and total gate charges of 6.2-8nC.

Uploaded by

muzaffarfarhan79
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 5

SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.

,LTD

SOP-8 Plastic-Encapsulate MOSFETS


4410
N-Channel Enhancement Mode Power MOSFET
SO-8L D
D
Description D
D
The 4410 uses advanced trench technology to provide
G
excellent RDS(ON) and low gate charge . The complementary S G
S S
MOSFETs may be used to form a level shifted high side S S
Pin 1 SO-8 S
switch, and for a host of other applications.
Equiva len t Cir cu it
D
General Features

PRODUCT SUMMARY

VDSS ID RDS(on) (mΩ) Max G


S

10 A 13.5 @ VGS = 10V P

MARKING
30V
5A 18.0 @ VGS = 4.5V

4410
● High power and current handing capability
TFCYWP
● Lead free product is acquired o
● Surface mount package
Y :year code W :week code

Absolute Maximum Ratings TA=25°C unless otherwise noted


Parameter Symbol Maximum Units
Drain-Source Voltage VDS 30 V
Gate-Source Voltage VGS ±20 V
Continuous Drain
TA=25°C ID 10
Current A A
Pulsed Drain Current B IDM 45
TA=25°C 2.3
PD W
Power Dissipation A TA=70°C 1.6
Junction and Storage Temperature Range TJ, TSTG -55 to 150 °C

Thermal Characteristics
Parameter Symbol Typ Max Units
Maximum Junction-to-Ambient A t ≤ 10s 48 62.5 °C/W
RθJA
Maximum Junction-to-Ambient A Steady-State 74 110 °C/W
Maximum Junction-to-Lead C Steady-State RθJL 35 40 °C/W

www.sztuofeng.com Page 1 v1.0


SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD

SOP-8 Plastic-Encapsulate MOSFETS


4410
Electrical Characteristics (TJ=25°C unless otherwise noted)

Symbol Parameter Conditions Min Typ Max Units


STATIC PARAMETERS
BVDSS Drain-Source Breakdown Voltage ID= 250µA, VGS=0V 30 V

IDSS Zero Gate Voltage Drain Current VDS= 24V, V GS=0V 500 nA

IGSS Gate-Body leakage current VDS=0V, VGS=±20V ±100 nA


VGS(th) Gate Threshold Voltage VDS=VGS ID= 250µA 1.0 1.6 2.5 V
ID(ON) On state drain current VGS= 10V , V DS = 5V 45 A

VGS= 10V, ID= 10A 11 13.5 mΩ


RDS(ON) Static Drain-Source On-Resistance
VGS= 4.5V, ID= 5A 16 18.0 mΩ
gFS Forward Transconductance VDS= 15V, I D = 10A 9 S
VSD Diode Forward Voltage IS= 3A , VGS=0V 0.8 1.2 V
IS Maximum Body-Diode Continuous Current 3 A

DYNAMIC PARAMETERS
Ciss Input Capacitance 710 pF
Coss Output Capacitance VGS=0V, VDS=25V, f=1MHz 155 pF
Crss Reverse Transfer Capacitance 145 pF
Rg Gate resistance VGS=0V, VDS=0V, f=1MHz 3.0 Ω

SWITCHING PARAMETERS
Qg (10V) Total Gate Charge (10V) 8 nC
Qg (4.5V) Total Gate Charge (4.5V) 6.2 nC
VDD= 20V, V GEN = 10V, ID= 9A
Qgs Gate Source Charge 3.3 nC
Qgd Gate Drain Charge 2.7 nC
tD(on) Turn-On DelayTime 7.0 ns
tr Turn-On Rise Time VDD= 15V, V GEN = 10V,R L = 15Ω
, 7.0 ns
tD(off) Turn-Off DelayTime RGEN=3Ω I D= 9A 22 ns
tf Turn-Off Fall Time 7.0 ns
trr Body Diode Reverse Recovery Time IF= 10A, dI/dt=100A/µs 24 ns
Qrr Body Diode Reverse Recovery Charge IF= 10A, dI/dt=100A/µs 14 nC

2
A: The value of R θJA is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
2
E. These tests are performed with the device mounted on 1 in FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
SOA curve provides a single pulse rating.

www.sztuofeng.com Page 2 v1.0


SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD

SOP-8 Plastic-Encapsulate MOSFETS


4410
Characteristics Curve

www.sztuofeng.com Page 3 v1.0


SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD

SOP-8 Plastic-Encapsulate MOSFETS


4410
Characteristics Curve

www.sztuofeng.com Page 4 v1.0


SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD

SOP-8 Plastic-Encapsulate MOSFETS


4410

SOP-8 Package Information

Dimensions In Millimeters Dimensions In Inches


Symbol
Min. Max. Min. Max.
A 1.350 1.750 0.053 0.069
A1 0.100 0.250 0.004 0.010
A2 1.350 1.550 0.053 0.061
b 0.330 0.510 0.013 0.020
c 0.170 0.250 0.006 0.010
D 4.700 5.100 0.185 0.200
E 3.800 4.000 0.150 0.157
E1 5.800 6.200 0.228 0.244
e 1.270(BSC) 0.050(BSC)
L 0.400 1.270 0.016 0.050

θ 0° 8° 0° 8°

www.sztuofeng.com Page 5 v1.0

You might also like