INVENTEC

500 Main Street, Suite 18

PO Box 989
Deep River, CT 06417 USA

Toll Free: 800.435.0317

Phone: 860.526.8300

RMA-223, Rosin Mildly Active Solder Paste

Fax: 860.526.8243
www.amtechsolder.com

Product Data Sheet

Product Highlights Available Alloys
n ROL0 flux classification Alloy Temp °C Temp °F
n Exceptional print definition 63Sn/37Pb 183 361
n Excellent wetting on most board finishes 62Sn/36Pb/2Ag 179 354
n Low voiding 62.8Sn/36.8Pb/0.4Ag 179-183 354-361
n Long stencil life 60Sn/40Pb 183-191 361-376
n Wide process window 43Sn/43Pb/14Bi 144-163 291-325
n REACH compliant 42Sn/58Bi 138 280
n Compatible with enclosed print heads 10Sn/88Pb/2Ag 268-290 514-554
n Print & dispense grade solder paste available
Packaging
500 gram jars
700 gram cartridges
35 or 100 gram syringes
ProFlow cassettes

Test Results
Test J-STD-004 or Test Requirement Result
other requirements (as stated)
Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough
Corrosion IPC-TM-650: 2.6.15 L: No Corrosion
Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.05%
Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop
(No-cleaned)
Surface Insulation Resistance 85 oC, IPC-TM-650: 2.6.3.7 L: ≥100 MΩ (No Clean)
85% RH @ 168 Hours
Tack Value IPC-TM-650: 2.4.44 48g
Viscosity - Malcom @ 10 RPM/25 Co
IPC-TM-650: 2.4.34.4 Print: 200-275
(x103mPa/s)- Sn63/Pb37 T3/T4 Dispensing: 110-150
Visual IPC-TM-650: 3.4.2.5 Clear and free
from precipitation
Conflict Minerals Compliance
Electronic Industry Citizenship Coalition (EICC) Compliant
REACH Compliance
Articles 33 and 67 of Regulation Contains no substance
(EC) No 1907/2006 >0.1% w/w that is listed
as a SVHC or restricted
for use in solder materials
RMA-223, Rosin Mildly Active Solder Paste
Printer Operation Amtech Low Oxide Powder Distribution
The following are general guidelines for stencil Micron Size Type Pitch Requirements
printer optimization with RMA-223. Some 45-75µ Type-2 24 mil and above
adjustments may be necessary based on your 25-45µ Type-3 16-24 mil
process requirements. 20-38µ Type-4 12-16 mil
15-25µ Type-5 8-12 mil
Print Speed: 25-100 mm/sec 5-15µ Type-6 5-8 mil
Squeegee Pressure: 70-250g/cm of blade 2-11µ Type-7 < 5 mil
Under Stencil Wipe: Once every 10-25 prints, Note: Type-6 and Type-7 may not be available in certain alloys.
Other powder distributions are available on request.
or as necessary

Stencil Life Storage

> 8 hours @ 30-45% RH and 20-25 oC Solder paste should be stored between 3-8 oC
~ 4 hours @ 45-75% RH and 20-25 oC (37-46 oF) to obtain the maximum refrigerated shelf
life of six months. Unopened solder paste stored
Cleaning at room temperature, 25 oC (77 oF) will have a one
RMA-223 is a Rosin Mildly Active solder paste that month shelf life. Syringes and cartridges should
can be left on the board for many SMT assemblies. be stored vertically in the refrigerator with the
For applications requiring cleaning, RMA-223 can dispensing tip down. Allow 4-8 hours for solder
be cleaned using flux residue removers such as paste to reach an operating temperature of 20-25 oC
Inventec Disper 607 and Disper 610. (68-77 oF). Keep the solder paste container sealed
while warming the solder paste to operating
temperature. NEVER FREEZE SOLDER PASTE.

Recommended Profile Profile for Sn63 and Sn62 Alloys

This profile is designed to serve
250° Topside Temperature of board
as a starting point for process to be @ 212 – 230°C maximum

optimization using RMA-223. To 200° Liquidus temperature for Sn63 and Sn62 alloys

achieve better results with voiding

179-183°
Topside Temperature of board
to be @ 170°C at finest
mil pitch in zone prior
or to reduce tombstoning, consider 150° Flux Activation Temperature
to reflow
140°
Temp. (ºC)

using a longer soaking zone, Time above liquidus should be

45 – 90 seconds depending on
board density, size & population
(140-180 oC) for 60-90 seconds, 100°
Temperature Ramp
@ < 3.0°C/Second
with a rapid pre-heat stage.
Quick Ramp
If there is evidence of solder 50° to 100°C

Pre-Heat Soak Reflow Cool

de-wetting, consider lowering the
0°
peak reflow temperature, or
reduce the time above liquidus to
<60 seconds.

Revised December 9, 2015