Introduction
In the realm of electronic manufacturing, soldering processes serve as the cornerstone
for creating reliable connections between electronic components. The efficiency and
integrity of these connections are paramount to the functionality and longevity of
electronic devices. Among the myriad factors influencing solder joint quality, the
soldering process temperature and surface roughness play pivotal roles in determining
the microstructure and mechanical properties of solder joints.
The solder alloy 40% tin (Sn) and 60% lead (Pb), commonly denoted as Sn40Pb60,
has been a staple in electronic assembly due to its favorable combination of melting
point, wetting characteristics, and mechanical properties. Understanding the intricate
interplay between process parameters and solder joint properties is indispensable for
optimizing manufacturing processes and ensuring product reliability.
Temperature during the soldering process profoundly influences the microstructure of
solder joints. Variations in temperature can affect the nucleation and growth kinetics
of intermetallic compounds (IMCs) at the interface between the solder and substrate,
thus altering the joint's mechanical and electrical properties. Moreover, excessive
temperatures can lead to thermal degradation of components or substrate materials,
compromising the integrity of the assembly.
Surface roughness of soldering substrates also exerts a significant influence on solder
joint formation. The topography of substrate surfaces impacts wetting behavior,
interfacial contact area, and the distribution of mechanical stresses within the joint.
Consequently, surface roughness variations can result in disparities in solder wetting,
formation of voids or cracks, and ultimately, variations in mechanical strength and
reliability of solder joints.
This research endeavors to investigate the effects of soldering process temperature
and surface roughness on the microstructure and mechanical properties of Sn40Pb60
solder joints. By systematically varying these parameters and characterizing the
resulting solder joints through microstructural analysis and mechanical testing,
insights will be gained into the fundamental mechanisms governing solder joint
formation and performance. Such knowledge will not only contribute to enhancing the
understanding of soldering processes but also facilitate the optimization of
manufacturing processes for improved reliability and performance of electronic
assemblies.
In the subsequent sections, the experimental methodology, results, and discussions
will be presented, followed by conclusions and recommendations for future research
directions.
