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M24.173B Datasheet (HTML) 1 Page - Intersil Corporation: Zoom in Zoom Out

The document is a 1 page datasheet for the M24.173B thin shrink small outline exposed pad plastic package from Intersil. It provides dimensions and notes for the package in both inches and millimeters. There are 11 notes that provide additional details about package specifications and manufacturing tolerances.

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0% found this document useful (0 votes)
14 views4 pages

M24.173B Datasheet (HTML) 1 Page - Intersil Corporation: Zoom in Zoom Out

The document is a 1 page datasheet for the M24.173B thin shrink small outline exposed pad plastic package from Intersil. It provides dimensions and notes for the package in both inches and millimeters. There are 11 notes that provide additional details about package specifications and manufacturing tolerances.

Uploaded by

Brix Matacsil
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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5/9/24, 9:43 PM M24.

173B datasheet(1/1 Pages) INTERSIL | Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP)

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Part # M24.173B X

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M24.173B Datasheet(HTML) 1 Page - Intersil Corporation

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Plastic Packages for Integrated Circuits
X

Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)

N
M24.173B
2 4 L E A D T H I N S H R I N K S M A L L O U T L I N E E X P O S E D PA D
INDEX 0.25(0.010) M B M
E P L A S T I C PA C K A G E
A R E A
E1
GAUGE INCHES MILLIMETERS
- B - PLANE
SYMBOL MIN M A X MIN M A X NOTES

A - 0.047 - 1.20 -
12 3
A1 0.000 0.006 0.00 0.15 -
TOP VIEW L
0.25 A2 0.031 0.051 0.80 1.05 -
0.010
0.05(0.002) S E AT I N G P L A N E b 0.0075 0.0118 0.19 0.30 9

-A-
c 0.0035 0.0079 0.09 0.20 -
D A
D 0.303 0.311 7.70 7.90 3

α E1 0.169 0.177 4.30 4.50 4


-C-
A2
e 0.026 BSC 0.65 BSC -
c
e A1 E 0.246 0.256 6.25 6.50 -
b L 0.0177 0.0295 0.45 0.75 6
0.10(0.004)

0.10(0.004) M C AM BS N 2 4 24 7
α 0o 8o 0o 8o -

12 3 P - 0.197 - 5.00 11

P1 - 0 . 1 2 6 - 3 . 2 0 11

NOTES: R e v. 1 1 1 / 0 3
P1
1. These package dimensions are within allowable dimensions of
J E D E C M O - 1 5 3 - A D T, I s s u e F.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
N
3. Dimension “D” does not include mold flash, protrusions or gate
P burrs. Mold flash, protrusion and gate burrs shall not exceed
BOTTOM VIEW 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.


8 . Te r m i n a l n u m b e r s a r e s h o w n f o r r e f e r e n c e o n l y.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact. (Angles in degrees)

11 . D i m e n s i o n s “ P ” a n d “ P 1 ” a r e t h e r m a l a n d / o r e l e c t r i c a l e n h a n c e d
v a r i a t i o n s . Va l u e s s h o w n a r e m a x i m u m s i z e o f e x p o s e d p a d
within lead count and body size.

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