Tecnoflon® PFR 06HC
Perfluoroelastomer
TECNOFLON® PFR 06HC
TECNOFLON® PFR 06HC is a new chemical resistant perfluoroelastomer (FFKM). Tecnoflon® PFR
06HC offers the widest range of aggressive media sealing capabilities along with excellent
compression set values.
It is suitable for most applications in temperature ranging from –10°C to 230°C, offering
outstanding resistance to aggressive media such as hot organic and inorganic acids, caustics,
amines (especially hot amines, i.e. at temperature higher than 70°C), ketones, aldehydes, esters,
ethers, alcohols, fuels, solvents, sour gases, hydrocarbons, steam, hot water, ethylene and
propylene oxide and mixed process streams. Moreover it can cope with a wide range of potent
active pharmaceutical ingredients (API's) and aggressive cleaning agents, being especially suited
to withstand steaminplace (SIP) and cleaninplace (CIP) procedures.
Moreover its structure was specifically designed to deliver enhanced extrusion resistance and
rapid gas decompression (RGD or explosive decompression ED) resistance requested for many
high pressure gas applications in the oil & gas industry.
Its extreme cleanliness along with its broad chemical resistance make PFR 06HC the suitable
sealing material for most wet semiconductor processes (wafer cleaning, polymer removal, wet
etching, polishing), for photolithography developing and stripping and for general purpose fab
equipments (pumps, scrubbers, filters, chemicals delivery systems).
PFR 06HC can be combined with the cure system and other typical fluoroelastomer
compounding ingredients; its mixing can be accomplished with tworoll mills or internal mixers.
Finished goods may be produced by a variety of rubber processing methods.
The primary use for PFR 06HC is the manufacturing of any kind of elastomeric sealing element
such as Orings, gaskets, valve bodies, butterfly valves, pump housings and stators, metal
bonded parts, diaphragms, profiles, etc. These sealing elements can be used in mechanical seals,
pumps, compressors, valves, reactors, mixers, sprayers, dispensers, quick connect couplings,
controls, instrumentation, etc. in a wide range of industrial sectors.
Tecnoflon® PFR 06HC is marketed in the form of raw polymer (1 kg box) in order to give the
transformer the freedom and the opportunity to develop and finetune compounds and items best
suited to the final application.
2
Basic characteristics of the raw polymer are as follows:
PROPERTIES TYPICAL VALUES
ML (1+10’) @ 121°C (MU) 75
Specific gravity (g/cm3) 2.05
Colour Translucent
Packaging / Form 1 kg / Slabs
HANDLING AND SAFETY
Normal care and precautions should be taken to avoid skin contact, eye contact and breathing of
fumes. Smoking is prohibited in working areas. Wash hands before eating or smoking. For
complete health and safety information, please refer to the material safety data sheet.
3
TYPICAL BLACK COMPOUNDS
FORMULATION 70 Shore A 80 Shore A
Tecnoflon® PFR 06HC 100 100
Luperox 101XL45 phr 1.5 1.5
Drimix TAIC (75 %) phr 2 2
N990 MT Carbon Black phr 15 25
COMPOUND MOONEY VISCOSITY
ML (1+10’) @ 121°C MU 80 85
COMPOUND DENSITY
Density g/cm3 2.00 2.01
MDR 12 min @ 160°C ARC 0.5°
Minimum Torque lb*in 1.6 1.7
Maximum Torque lb*in 22.9 28.7
ts2 s 40 38
t’50 s 60 67
t’90 s 158 200
MDR 12 min @ 150°C ARC 0.5°
Minimum Torque lb*in 2.0 2.3
Maximum Torque lb*in 23.0 28.3
ts2 s 71 77
t’50 s 137 150
t’90 s 315 380
TYPICAL PHYSICAL PROPERTIES
Post Cure: 4 h @ 230°C
100 % Modulus MPa 6.5 11.0
Tensile Strength MPa 19.0 19.5
Elongation at Break % 185 160
Hardness ShoreA 70 79
COMPRESSION SET
(25 % Deformation, ASTM D395 Method B, #214 ORing)
70 h @ 200°C % 20 23
4
TYPICAL OIL & GAS COMPOUND
FORMULATION
Tecnoflon® PFR 06HC 100
Luperox 101XL45 phr 0.9
Drimix TAIC (75 %) phr 1.2
N990 MT Carbon Black phr 60
PAT 777 phr 1
Struktol WS280 phr 0.5
COMPOUND DENSITY
3
Density g/cm 1.96
MDR 12 min @ 160°C ARC 0.5°
Minimum Torque lb*in 3.0
Maximum Torque lb*in 40.3
ts2 s 35
t’50 s 81
t’90 s 281
TYPICAL PHYSICAL PROPERTIES
Post Cure: 4 h @ 230°C
50% Modulus MPa 9.0
100 % Modulus MPa 18.4
Tensile Strength MPa 20.1
Elongation at Break % 118
Hardness Shore A 90
COMPRESSION SET
(25 % Deformation, ASTM D395 Method B, #214 ORing)
70 h @ 200°C % 26
5
RAPID GAS DECOMPRESSION TESTS
The compound showed in the previous page was successfully tested in the following conditions
referring to NORSOK standard M710 rev.2. #312 Orings (13.64 mm internal diameter 5.33 mm
crosssection) were submitted to testing.
Test Temperature Pressure Media Decompression rate cycle # squeeze rate oring # NORSOK rating
°C Bar bar/min %
1 100 150 CH4/CO2 90/10 20 10 12 4 0000000010000000
2 100 300 CH4/CO2 90/10 20 1 12 2 00000000
Whereby the NORSOK rating numbers are as follows:
• 0: no internal cracks, holes or blisters of any size.
• 1: less than 4 internal cracks, each shorter than 50% of cross section with a total crack
length less than the cross section.
6
COLD FLEXIBILITY
DSC
Tg onset °C 8
Tg midpoint °C 1
Retraction curve (ASTM D1329)
TR10 °C 2
TR30 °C 2
TR50 °C 4
TR70 °C 7
7
FLUID RESISTANCE OVERVIEW
Inorganic acids A
Organic acids A
Alkalis A
Amines (RT) A
Hot amines (> 70°C) A
Water / Steam A
Ketones A
Esters A
Ethers A
Aldehydes A
Alcohols A
Hydrocarbons A
Sour gas A
Lubricants A
Fluorinated fluids C
Symbol Volume Swelling (%)
A < 10%
B 10 30%
C 30 50%
D > 50 %
8
FLUID RESISTANCE
CHEMICAL AND PROCESS INDUSTRY (CPI)
Ethylenediamine 100°C 72 h
Δ Tensile Strength % 35
Δ Elongation at Break % +13
Δ Hardness Shore A 4
Δ Volume % +6.5
Ethylenediamine 100°C 168 h
Δ Tensile Strength % 40
Δ Elongation at Break % +9
Δ Hardness Shore A 7
Δ Volume % +9
2aminoethanol (MEA – ethanolamine) 150°C 72 h
Δ Tensile Strength % 30
Δ Elongation at Break % +9
Δ Hardness Shore A 9
Δ Volume % +17
NH3 28% 100°C 336 h
Δ Tensile Strength % 19
Δ Elongation at Break % 16
Δ Hardness Shore A 3
Δ Volume % +3.7
2(2aminoethoxy) ethanol (diglycolamine) 150°C 168 h
Δ Tensile Strength % 35
Δ Elongation at Break % +11
Δ Hardness Shore A 10
Δ Volume % +20
2(2aminoethoxy) ethanol (diglycolamine) 200°C 168 h
Δ Tensile Strength % 62
Δ Elongation at Break % +3
Δ Hardness Shore A 22
Δ Volume % +39
9
FLUID RESISTANCE
CHEMICAL AND PROCESS INDUSTRY (CPI) (CONT.)
Nmethyldiethanolamine (MDEA) 150°C 168 h
Δ Tensile Strength % 22
Δ Elongation at Break % 2
Δ Hardness Shore A 2
Δ Volume % +2
Nmethyldiethanolamine (MDEA) 200°C 168 h
Δ Tensile Strength % 38
Δ Elongation at Break % 6
Δ Hardness Shore A 5
Δ Volume % +8
Dipropylamine 150°C 168 h
Δ Tensile Strength % 27
Δ Elongation at Break % 14
Δ Hardness Shore A 4
Δ Volume % +6.5
Dipropylamine 200°C 168 h
Δ Tensile Strength % 29
Δ Elongation at Break % 10
Δ Hardness Shore A 5
Δ Volume % +6.9
10
FLUID RESISTANCE
CHEMICAL AND PROCESS INDUSTRY (CPI) (CONT.)
Nitric acid 65 % 80°C 72 h
Δ Tensile Strength % 30
Δ Elongation at Break % +6
Δ Hardness Shore A 5
Δ Volume % +5
Glacial acetic acid 100°C 336 h
Δ Tensile Strength % 13
Δ Elongation at Break % 15
Δ Hardness Shore A 5
Δ Volume % +5
Formic acid 85% 100°C 168 h
Δ Tensile Strength % 14
Δ Elongation at Break % 5
Δ Hardness Shore A 5
Δ Volume % +7
Water 220°C 168 h
Δ Tensile Strength % 17
Δ Elongation at Break % +23
Δ Hardness Shore A +1
Δ Volume % +2.0
Steam 220°C 168 h
Δ Tensile Strength % 29
Δ Elongation at Break % +24
Δ Hardness Shore A +1
Δ Volume % 0
For optimal acid resistance, zinc oxide and Wollastonite fillers are not recommended
11
FLUID RESISTANCE
WET SEMICONDUCTOR
KOH 50 % 125°C 168 h
Δ Tensile Strength % 6
Δ Elongation at Break % 18
Δ Hardness Shore A 2
Δ Volume % +0.7
HNO3 65% / HF 49% / water 41/13/46 50 °C 720 h
Δ Tensile Strength % 12
Δ Elongation at Break % 29
Δ Hardness Shore A 0
Δ Volume % +1.6
HF 49% 23 °C 720 h
Δ Tensile Strength % 5
Δ Elongation at Break % 21
Δ Hardness Shore A 0
Δ Volume % +1.2
APM – SC1 (NH4OH 29% / H2O2 30% / water 1:1:5) 23 °C 720 h
Δ Tensile Strength % 8
Δ Elongation at Break % 14
Δ Hardness Shore A 0
Δ Volume % +0.1
HPM – SC2 (HCl 37% / H2O2 30% / water 1:1:6) 23 °C 720 h
Δ Tensile Strength % 9
Δ Elongation at Break % 19
Δ Hardness Shore A 1
Δ Volume % 0
SPM – Piranha fluid (H2SO4 96%/ H2O2 30% 5:1) 23 °C 720 h
Δ Tensile Strength % +0.3
Δ Elongation at Break % 19
Δ Hardness Shore A 0
Δ Volume % 0
12
FLUID RESISTANCE
SEMICONDUCTOR DEVELOPING, STRIPPING, POLYMER REMOVAL
In semiconductor manufacturing processes, many different specialty chemicals are used for the
removal of photoresist and of postdry etch process residue, for postCMP cleaning as well as for
edge bead removers.
They are usually either aqueous or semiaqueous or fully organic mixtures formulated to
effectively remove residues or positive and negative photoresist from substrate surfaces.
The most commonly used fluids are:
• ACT® specialty chemicals by Air Products and Chemicals, Inc.
• EKC™ fluids by EKC Technology, Inc.
• PRS™, ALEG™, REZI™ product lines by Mallinckrodt Baker, Inc.
They normally contain organic solvents (like NMP, DMSO, DMAc) and organic amines (like
ethanolamine, diethanolamine, hydroxylamine, diglycolamine).
PFR 06HC was tested in some of the chemical species listed above:
Nmethyl2pyrrolidone (NMP) 80 °C 168 h
Δ Tensile Strength % 17
Δ Elongation at Break % 18
Δ Hardness Shore A 4
Δ Volume % +1
Dimethylacetamide (DMAc) 80 °C 168 h
Δ Tensile Strength % 16
Δ Elongation at Break % 12
Δ Hardness Shore A 4
Δ Volume % +0.4
2aminoethanol (MEA – ethanolamine) 80°C 168 h
Δ Tensile Strength % 15
Δ Elongation at Break % 14
Δ Hardness Shore A 3
Δ Volume % +0.9
Dimethyl sulfoxide (DMSO)/MEA 30/70 80°C 336 h
Δ Tensile Strength % 7
Δ Elongation at Break % +2
Δ Hardness Shore A 2
Δ Volume % +2.2
13
Hydroxylamine 50% 80°C 168 h
Δ Tensile Strength % 8
Δ Elongation at Break % 14
Δ Hardness Shore A 2
Δ Volume % +0.1
2(2aminoethoxy) ethanol (diglycolamine) 80°C 168 h
Δ Tensile Strength % 11
Δ Elongation at Break % 17
Δ Hardness Shore A 2
Δ Volume % +1.2
Tetramethylammonium hydroxide (TMAH) 25 % 90°C 168 h
Δ Tensile Strength % 2
Δ Elongation at Break % 12
Δ Hardness Shore A 2
Δ Volume % +0.5
14
MISCELLANEOUS PFR PROPERTIES
In general, the following properties can be considered as typical or average values for
perfluoroelastomers.
THERMAL EXPANSION
Following the definition of linear coefficient of thermal expansion: L = L0 · (1+α · ΔT), the average
value between 80 and 250°C is as follows:
α = 3.5 · 104 1/K
SPECIFIC HEAT
Specific heat (J/g)
Black compounds White compounds
50°C 0.98 0.83
100°C 1.05 0.86
150°C 1.12 0.91
GAS PERMEATION RATE
Permeability (T = 30°C)
(cm3(STP)·mm/m²·atm·d)
Nitrogen 250
Oxygen 450
Helium 5400
ELECTRICAL PROPERTIES
Dielectric constant and loss factor at 50 Hz frequency.
Volume and surface resistivity were measured applying 100 V direct tension.
Dielectric constant ε' 3.50
Loss Factor tan(δ) 0.030
16
Surface resistivity RS (Ω) 5.0·10
Volume resistivity RV (Ω·cm) 6.1·1016
15
Revision date 10/2009
To our actual knowledge, the information contained herein is accurate as of the date of this document. However neither Solvay Solexis S.p.A., nor any of its affiliates makes any
warranty, express or implied, or accepts any liability in connection with this information or its use. This information is for use by technically skilled persons at their own discretion and
risk and does not relate to the use of this product in combination with any other substance or any other process. This is not a license under any patent or other proprietary right. The
user alone must finally determine suitability of any information or material for any contemplated use in compliance with applicable law, the manner of use and whether any patents
are infringed. This information gives typical properties only and is not to be used for specification purposes. Solvay Solexis S.p.A., reserves the right to make additions, deletions or
modifications to the information at any time without prior notification.
Trademarks and/or other Solvay Solexis S.p.A. products referenced herein are either trademarks or registered trademarks of Solvay Solexis S.p.A. or its affiliates, unless otherwise
indicated.
Copyright 2009, Solvay Solexis S.p.A. All Rights Reserved.
Contact Solvay Solexis at:
solexis.marketing@solvay.com
www.solvaysolexis.com
www.solvay.com
16
