Presentation on Mini project
Go, and Move the World
STUDIES ON MICROSTRUCTURAL, MECHANICAL
PROPERTIES OF AA2014 BY SOLID- STATE DIFFUSION
BONDING PROCESS
Manoj S Patil 1VE19ME019
Vignesh N G 1VE19ME037
Vinayaka R Murari 1VE19ME039
Vishwesh G Anandashetti 1VE19ME040
Under the supervision
Dr. Bharath V
Assistant Professor
Department of Mechanical Engineering
Sri Venkateshwara college of Engineering,Bengaluru-562157
1 16/07/2022
OVERVIEW
Go, and Move the World
Motivation
Introduction
Literature Survey
Objectives
Methodology
Experimental Details
Expected outcomes
References
2
Motivations
Go, and Move the World
AA2014
Nose cap dome
Front Spar of Wing
Rivets used to join Spar AA2014
and Bottom Cap
Nose cap shell
Submarine Launched Ballistic Missile-K4
Reference-
DRDO (Technology, Focus)
3
Introduction
Go, and Move the World
2) Transient Liquid Phase (TLP)
1) Solid-state diffusion bonding process
bonding process
4
Literature Survey
Go, and Move the World
❖ Y Liu et. al (2022)
➢ Title : “Air atmosphere diffusion bonding of Al–Mg–Li alloy using Cu nano-coating interlayer: Microstructural
characterization and formation mechanisms ”
➢ Base Materials: 5A90 (Al-Mg-Li) alloy (with electrodeposition of Cu)
➢ Bonding Parameters: P-4MPa, T- 500, 515, 530, 545 0C, t- 90 min
➢ Results : Diffusion bonding achieved at 530 0C, Shear strength-187.9 MPa, nano indention- 2.38 GPa
❖ Q. Jia et.al (2020)
➢ Title : “Mechanism of ultrasonic-assisted transient liquid phase bonding of 6061 Al alloy with cladded Zn-Al alloy in
air”
➢ Base Materials: AA6061 (Ultrasonic assisted Zn-5 to 30 Al cladded)
➢ Bonding Parameters: P-0.15 MPa(ultrasonic), T- 420–510 0C, t- 5-60 s
➢ Results : TLP joint achieved at 450 0C and 60 s, shear strength-95% of the base metal (164 MPa) *173 MPa
❖ Lee C S et. al (1999)
➢ Title : “Vacuum-free diffusion bonding of aluminium metal matrix composite”
➢ Base Materials: AA6061 (20% volume Al2O3)
➢ Bonding Parameters: P-1-3 MPa, T- 515-530 0C, t- 2-12 hrs.
➢ Results : Joint efficiency of 90.5% with 77.7% bonded area is achieved
❖ J Pilling & Ridley (1987)
➢ Title : “Solid state bonding of superplastic AA 7475”
➢ Base Materials: AA 7475
➢ Bonding Parameters: P-5-20 MPa, T- 450 0C, t- 6-20 min (with interface treatment)
➢ Results : Studied probability of failure against applied stress. Lesser probability of failure observed for (5MPa, 515 0C,
5 5hrs)
Summery of the Literature survey
Go, and Move the World
Similar aluminium alloys are joined using either coating or cladding
technique
Solid state diffusion bonded joints are achieved at higher temperature,
pressure and bonding time.
Microstructural evidences for oxides at bonding line, voids and bonded
areas are rarely signified
6
Novelty Aspects of the present work
Go, and Move the World
Vacuum diffusion bonding of Aluminium alloys is carried out
without any coating or cladding
Solid state diffusion bonded joints are achieved at lower pressure
and lower bonding time
A novel chemical solution consists of sodium salts + NaOH---
HNO3 is used as redoxing solution
Diffusion bonding on a Novel aluminium alloy is been investigated
Microstructural evidences for oxides at bonding line, voids and
bonded areas are signified
7
Objectives of the Proposed Research Work Go, and Move the World
Vacuum solid state diffusion bonding of AA 2014 with
constant pressure of 10 MPa, bonding duration of 30 min with
the bonding temperatures of 450, 475 and 500 0C
Microstructural evaluation- SEM, EDS and XRD Study of
diffusion bonded sections to know the presence of major elements
and oxide behaviour.
Microhardness properties evaluation and comparison on bonded
joints, base metals of the bonded sections
8
Methodology
Go, and Move the World
Preparing Base Metals according to the
dimensions required
Preparing and cleaning of surfaces to
be diffusion bonded
Chemical cleaning (with novel solution)
Base metals (stacked) are kept in customized diffusion
bonding furnace on a UTM
Fig 1
Bonding Pressure, Temperature is set for the bonding
duration of 30 min
After Diffusion bonding process, Bonded samples are
cooled to room temperature in the furnace without
releasing the pressure
Bonding Temperature- 450, 475, 500 0C Polishing and etching for microstructure evaluation
Bonding Pressure- 10 MPa
Microstructure and Hardness characterization
9 Bonding Duration- 30 min
EXPERIMENTAL DETAILS
Go, and Move the World
1. Microstructural Studies
Grit papers :200, 400, 600, 800, 1000 and 1200
Diamond paste :3 m
Etchant- Keller’s reagent :(2.5%HNO3+1.5%HCl+1%HF+95% H2O by volume)
Light Optical Microscope : Zeiss LOM
Scanning Electron Microscope : Tescan Vega3
2. EDX & XRD Studies
EDAX Ametek
100 kv Philips twin tube X-ray diffractometer
3. Microhardness
Vickers Microhardness (Hv) test. SEM
10 XRD
EXPECTED OUT COMES
Go, and Move the World
In the current study the AA2014/AA2219 bonded joints are formed successfully using a
vacuum solid state diffusion bonding process performed without incorporating the cladding or
electrodepositing other metals. The significant possible outcomes drawn from the study are as
listed below
Grain boundary expulsion and grain growth across the interface are going to be observed on
all the bonded sections. However, this condition is found only at some random areas of the
bonded sections at 450 and 475 0C.
Relatively a quality bond with homogeneous microstructure and without showcasing any
metallographic evidence of bond line has been achieved under the bonding temperature of
500 0C.
Incomplete bonded sections exhibit the interfacial voids with a higher mass percentage of
oxide compared to the perfectly bonded sections.
As the bonding temperature increased, the hardness at the bond interfaces might be increased
due to the elimination of voids and oxides.
The bonded interface might be obtained at 500 degC yielded a maximum microhardness
11
Go, and Move the World
12
