Core Overview

 Instruction Word: 24-bit

 Program Counter (PC): 23 bits wide, addressing up to 4M instruction words.
 Working Registers: 16x16-bit registers (W0-W15), with W15 as the Software Stack Pointer
(SP).
 Data Space: 64 Kbytes (32K words), split into X and Y data memory blocks.
 Address Generation Units (AGUs): Independent AGUs for X and Y data memory.
 DSP Engine: Includes a 17-bit by 17-bit multiplier, 40-bit ALU, two 40-bit accumulators, and
a 40-bit bidirectional barrel shifter.
Memory Organization
 Program Memory: Up to 24 Kbytes.
 Data RAM: 1 Kbyte.
 Data EEPROM: 1 Kbyte.
 Program Space Visibility (PSV): Allows mapping of upper 32 Kbytes of data space into the
lower half of program space.
Special Features
 Instruction Prefetch Mechanism: Helps maintain throughput by accessing
and partially decoding instructions ahead of execution.
 Circular Buffers (Modulo Addressing): Supported in both X and Y address spaces to
remove loop overhead for DSP algorithms.
 Bit-Reversed Addressing: Simplifies input or output data reordering for radix-2 FFT
algorithms.
Interrupts and Traps
 Vectored Exception Processing: 62 independent vectors, including up to 8 traps and 54
interrupts.
 Interrupt Priority Levels: User-assigned priority levels from 1 to 7 for interrupts, with traps
having fixed priorities from 8 to 15.
Programmer’s Model
 Registers: 16x16-bit working registers, 2x40-bit accumulators, STATUS Register (SR), Data
Table Page register (TBLPAG), Program Space Visibility Page register (PSVPAG), DO and
REPEAT registers, and Program Counter (PC).
 Shadow Registers: Used for temporary holding and transfer of contents during specific
events.
DSP Engine
 MAC Instructions: Concurrently fetch two data operands from memory while multiplying
two W registers.
 Single-Cycle DSP Instructions: Operate seamlessly with other instructions for optimal real-
time performance.
Addressing Modes
 Supported Modes: Inherent, Relative, Literal, Memory Direct, Register Direct, Register
Indirect, Register Offset, and Literal Offset.
Example Block Diagram
Here is a simplified block diagram of the dsPIC30F3010/3011 architecture:
+-------------------+ +-------------------+
| | | |
| Program Memory | | Data EEPROM |
| (24 Kbytes) | | (1 Kbyte) |
| | | |
+-------------------+ +-------------------+
| |
v v
+-------------------+ +-------------------+
| | | |
| Instruction | | Data RAM |
| Decode and Control| | (1 Kbyte) |
| | | |
+-------------------+ +-------------------+
| |
v v
+-------------------+ +-------------------+
| | | |
| DSP Engine | | Working Registers |
| | | (16x16-bit) |
+-------------------+ +-------------------+
| |
v v
+-------------------+ +-------------------+
| | | |
| Address Generation| | Address Generation|
| Unit (X AGU) | | Unit (Y AGU) |
| | | |
+-------------------+ +-------------------+
| |
v v
+-------------------+ +-------------------+
| | | |
| X Data Memory | | Y Data Memory |
| | | |
+-------------------+ +-------------------+

This summary provides an overview of the architecture of the dsPIC30F3010/3011 devices. If

you need more detailed information or have specific questions, feel free to ask!
Key features of the dsPIC30F3010/3011 Digital Signal
Controllers:
Peripheral Features
 High-Current Sink/Source I/O Pins: 25 mA/25 mA
Timer Module with Programmable Prescaler:
 Five 16-bit timers/counters; optionally pair 16-bit timers into 32-bit timer modules
 16-bit Capture Input Functions
 16-bit Compare/PWM Output Functions
 3-Wire SPI Modules: Supports 4 Frame modes
 I2C™ Module: Supports Multi-Master/Slave mode and 7-bit/10-bit Addressing
 2 UART Modules: With FIFO Buffers
High-Performance Modified RISC CPU
 Modified Harvard Architecture
 C Compiler Optimized Instruction Set Architecture: With Flexible Addressing modes
 83 Base Instructions
 24-bit Wide Instructions, 16-bit Wide Data Path
 24 Kbytes On-Chip Flash Program Space: (8K instruction words)
 1 Kbyte of On-Chip Data RAM
 1 Kbyte of Nonvolatile Data EEPROM
 16 x 16-bit Working Register Array
 Up to 30 MIPs Operation:
 DC to 40 MHz external clock input
 4 MHz-10 MHz oscillator input with PLL active (4x, 8x, 16x)
 29 Interrupt Sources:
 3 external interrupt sources
 8 user-selectable priority levels for each interrupt source
 4 processor trap sources
DSP Engine Features
 Dual Data Fetch
 Accumulator Write Back for DSP Operations
 Modulo and Bit-Reversed Addressing Modes
 Two, 40-bit Wide Accumulators with Optional Saturation Logic
 17-bit x 17-bit Single-Cycle Hardware Fractional/Integer Multiplier
 All DSP Instructions Single Cycle
 ±16-bit Single-Cycle Shift
Motor Control PWM Module Features
 6 PWM Output Channels:
 Complementary or Independent Output modes
 Edge and Center-Aligned modes
3 Duty Cycle Generators
 Dedicated Time Base
 Programmable Output Polarity
 Dead-Time Control for Complementary Mode
 Manual Output Control
 Trigger for A/D Conversions
Quadrature Encoder Interface Module Features
 Phase A, Phase B and Index Pulse Input
 16-bit Up/Down Position Counter
 Count Direction Status
 Position Measurement (x2 and x4) Mode
 Programmable Digital Noise Filters on Inputs
 Alternate 16-bit Timer/Counter Mode
 Interrupt on Position Counter Rollover/Underflow
Analog Features
 10-bit Analog-to-Digital Converter (ADC):
 4 Sample and Hold (S&H) Inputs
1 Msps conversion rate
9 input channels
 Conversion available during Sleep and Idle
Programmable Brown-out Reset
Special Microcontroller Features
 Enhanced Flash Program Memory:
 10,000 erase/write cycle (min.) for industrial temperature range, 100K (typical)
 Data EEPROM Memory:
 100,000 erase/write cycle (min.) for industrial temperature range, 1M (typical)
 Self-Reprogrammable under Software Control
 Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
 Flexible Watchdog Timer (WDT) with On-Chip Low-Power RC Oscillator for Reliable
Operation
 Fail-Safe Clock Monitor Operation: Detects Clock Failure and Switches to On-Chip Low-
Power RC Oscillator
 Programmable Code Protection
In-Circuit Serial Programming™ (ICSP™)
 Selectable Power Management Modes: Sleep, Idle and Alternate Clock modes
CMOS Technology
 Low-Power, High-Speed Flash Technology
 Wide Operating Voltage Range: 2.5V to 5.5V
 Industrial and Extended Temperature Ranges
 Low Power Consumption

Applications
These features make the dsPIC30F3010/3011 devices suitable for a wide range of applications,
including motor control, power conversion, and general-purpose digital signal processing. If you
need more detailed information or have specific questions, feel free to ask!
The dsPIC30F3010/3011 Digital Signal Controllers are versatile devices that can be used in a
variety of applications due to their combination of high-performance digital signal processing
(DSP) capabilities and microcontroller (MCU) features. Here are some common applications:
Motor Control
 Brushless DC (BLDC) Motors
 Permanent Magnet Synchronous Motors (PMSM)
 AC Induction Motors
 Stepper Motors
Power Conversion
 Switch Mode Power Supplies (SMPS)
 Uninterruptible Power Supplies (UPS)
 Inverters
 Battery Chargers
Industrial Automation
 Robotics
 Factory Automation Systems
 Process Control
Consumer Electronics
 Home Appliances
 HVAC Systems
 Smart Home Devices
Automotive
 Electric Power Steering (EPS)
 Electric Vehicle (EV) Motor Control
 Automotive Lighting Systems
Audio Processing
 Digital Audio Effects
 Equalizers
 Noise Cancellation Systems
Communication Systems
 Modems
 Wireless Communication Modules
 Signal Processing in Communication Devices
Medical Devices
 Portable Medical Instruments
 Diagnostic Equipment
 Therapeutic Devices
Renewable Energy
 Solar Inverters
 Wind Turbine Controllers
 Energy Storage Systems
General Purpose DSP Applications
 Fast Fourier Transform (FFT)
 Digital Filters
 Signal Analysis and Processing
Key Features for Applications
 High-Performance DSP Engine: Suitable for real-time signal processing tasks.
 Motor Control PWM Module: Ideal for precise motor control applications.
 Quadrature Encoder Interface: Useful for position and speed sensing in motor control.
 Analog-to-Digital Converter (ADC): Enables high-speed data acquisition and processing.
 Multiple Communication Interfaces: SPI, I2C, and UART for robust communication with
other devices and systems.
 Enhanced Flash Program Memory and EEPROM: Provides flexibility for firmware
updates and data storage.
These applications leverage the dsPIC30F3010/3011's ability to perform complex mathematical
computations quickly and efficiently, making them suitable for both control and signal
processing tasks in embedded systems. If you have a specific application in mind or need more
detailed information, feel free to ask!

dsPIC30F3011 Pin Configuration and Functions

40-Pin PDIP
1 - MCLR
2 - VDD
3 - VSS
4 - EMUD2/OC2/IC2/INT2/RD1
5 - EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
6 - EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
7 - OSC2/CLKO/RC15
8 - OSC1/CLKI
9 - PWM1L/RE0
10 - PWM1H/RE1
11 - PWM2L/RE2
12 - PWM2H/RE3
13 - PWM3H/RE5
14 - AVDD
15 - AVSS
16 - OC4/RD3
17 - VSS
18 - VDD
19 - SCK1/RF6
20 - PGC/EMUC/U1RX/SDI1/SDA/RF2
21 - PGD/EMUD/U1TX/SDO1/SCL/RF3
22 - PWM3L/RE4
23 - VDD
24 - U2RX/CN17/RF4
25 - U2TX/CN18/RF5
26 - AN4/QEA/IC7/CN6/RB4
27 - AN2/SS1/CN4/RB2
28 - EMUC3/AN1/VREF-/CN3/RB1
29 - EMUD3/AN0/VREF+/CN2/RB0
30 - AN5/QEB/IC8/CN7/RB5
31 - FLTA/INT0/RE8
32 - VSS
33 - AN3/INDX/CN5/RB3
34 - AN6/OCFA/RB6
35 - AN7/RB7
36 - RF0
37 - RF1
38 - OC3/RD2
39 - EMUC2/OC1/IC1/INT1/RD0
40 - AN8/RB8
Pin Functions
Analog Pins
 AN0-AN8: Analog input channels.

 AVDD: Positive supply for the analog module.

 AVSS: Ground reference for the analog module.

 VREF+: Analog voltage reference (high) input.

 VREF-: Analog voltage reference (low) input.

Digital I/O Pins

 RB0-RB8: Bidirectional I/O port B.

 RC13-RC15: Bidirectional I/O port C.

 RD0-RD3: Bidirectional I/O port D.

 RE0-RE5, RE8: Bidirectional I/O port E.

 RF0-RF6: Bidirectional I/O port F.

Communication Pins
 SCK1: Synchronous serial clock input/output for SPI1.

 SDI1: SPI1 data in.

 SDO1: SPI1 data out.

 SS1: SPI1 slave synchronization.

 SCL: Synchronous serial clock input/output for I2C.

 SDA: Synchronous serial data input/output for I2C.

 U1RX: UART1 receive.

 U1TX: UART1 transmit.

 U1ARX: UART1 alternate receive.

 U1ATX: UART1 alternate transmit.

 U2RX: UART2 receive.

 U2TX: UART2 transmit.

Timer and PWM Pins

 T1CK: Timer1 external clock input.

 T2CK: Timer2 external clock input.

 PWM1L, PWM1H, PWM2L, PWM2H, PWM3L, PWM3H: PWM output channels.

 FLTA: PWM fault A input.

Oscillator Pins
 OSC1/CLKI: Oscillator crystal input.

 OSC2/CLKO: Oscillator crystal output.

Programming and Debugging Pins

 MCLR: Master clear (reset) input or programming voltage input.

 PGC: In-circuit serial programming clock input.

 PGD: In-circuit serial programming data input/output.

Quadrature Encoder Interface Pins

 INDX: Quadrature encoder index pulse input.

 QEA: Quadrature encoder phase A input.

 QEB: Quadrature encoder phase B input.

Interrupt Pins
 INT0, INT1, INT2: External interrupt inputs.

Capture and Compare Pins

 IC1, IC2, IC7, IC8: Capture inputs.

 OC1-OC4: Compare outputs.

Other Pins
 VDD: Positive supply for logic and I/O pins.

 VSS: Ground reference for logic and I/O pins.

This pin configuration and function list provides a comprehensive overview of the dsPIC30F3010/3011
devices. If you need more detailed information or have specific questions, feel free to ask!

Absolute Maximum Ratings

These are the stress ratings that the device can withstand without causing permanent damage.
However, prolonged exposure to these conditions may affect device reliability.

 Supply Voltage (VDD): -0.3V to +7.0V

 Input Voltage on Any Pin: -0.3V to (VDD + 0.3V)

 Output Clamp Current (per pin): ±20 mA

 Storage Temperature: -65°C to +150°C

 Ambient Temperature under Bias: -40°C to +125°C

 Junction Temperature: +150°C

 ESD Protection on All Pins: ±2000V (Human Body Model)

ESD Ratings
Electrostatic Discharge (ESD) ratings indicate the device's ability to withstand electrostatic discharges.

 Human Body Model (HBM): ±2000V

 Machine Model (MM): ±200V

Recommended Operating Conditions

These conditions are recommended for optimal performance and reliability of the device.

 Supply Voltage (VDD): 2.5V to 5.5V

 Ambient Temperature (TA):

 Industrial: -40°C to +85°C

 Extended: -40°C to +125°C

 Oscillator Frequency (FOSC): DC to 40 MHz

Electrical Characteristics
DC Characteristics
 Input Low Voltage (VIL):

 VDD = 5.0V: Max 0.8V

 VDD = 3.3V: Max 0.8V

 Input High Voltage (VIH):

 VDD = 5.0V: Min 2.0V

 VDD = 3.3V: Min 2.0V

 Output Low Voltage (VOL):

 IOL = 8.5 mA: Max 0.6V

 Output High Voltage (VOH):

 IOH = -3.0 mA: Min 2.4V

 Input Leakage Current (IIL): ±1 µA

 Output Leakage Current (IOL): ±1 µA

Power Consumption
 Active Mode (Typical):

 5V, 40 MHz: 20 mA

 3.3V, 40 MHz: 12 mA

 Idle Mode (Typical):

 5V, 40 MHz: 5 mA

 3.3V, 40 MHz: 3 mA

 Sleep Mode (Typical):

 5V: 1 µA

 3.3V: 1 µA

Timing Characteristics
Oscillator Start-up Timer
 Timing Characteristics:

 Fast RC (FRC): 8 µs

 Primary Oscillator (XT, HS, EC): 1024 oscillator cycles

Watchdog Timer
 Timing Characteristics:

 Typical Time-out Period: 4 ms to 131.072 ms (configurable)

Functional Block Diagram

+---------------------------------------------------------------+
| |
| dsPIC30F3010/3011 |
| |
| +-------------------+ +-------------------+ |
| | | | | |
| | Program Memory | | Data EEPROM | |
| | (24 Kbytes) | | (1 Kbyte) | |
| | | | | |
| +-------------------+ +-------------------+ |
| | | |
| v v |
| +-------------------+ +-------------------+ |
| | | | | |
| | Instruction | | Data RAM | |
| | Decode and Control| | (1 Kbyte) | |
| | | | | |
| +-------------------+ +-------------------+ |
| | | |
| v v |
| +-------------------+ +-------------------+ |
| | | | | |
| | DSP Engine | | Working Registers | |
| | | | (16x16-bit) | |
| +-------------------+ +-------------------+ |
| | | |
| v v |
| +-------------------+ +-------------------+ |
| | | | | |
| | Address Generation| | Address Generation| |
| | Unit (X AGU) | | Unit (Y AGU) | |
| | | | | |
| +-------------------+ +-------------------+ |
| | | |
| v v |
| +-------------------+ +-------------------+ |
| | | | | |
| | X Data Memory | | Y Data Memory | |
| | | | | |
| +-------------------+ +-------------------+ |
| |
| +---------------------------------------------------------+ |
| | | |
| | Peripherals | |
| | | |
| | +-------------------+ +-------------------+ | |
| | | | | | | |
| | | Timers | | Motor Control PWM | | |
| | | | | | | |
| | +-------------------+ +-------------------+ | |
| | | |
| | +-------------------+ +-------------------+ | |
| | | | | | | |
| | | UART | | SPI | | |
| | | | | | | |
| | +-------------------+ +-------------------+ | |
| | | |
| | +-------------------+ +-------------------+ | |
| | | | | | | |
| | | I2C | | Quadrature Encoder| | |
| | | | | Interface (QEI) | | |
| | +-------------------+ +-------------------+ | |
| | | |
| | +-------------------+ +-------------------+ | |
| | | | | | | |
| | | ADC | | Capture/Compare | | |
| | | | | | | |
| | +-------------------+ +-------------------+ | |
| +---------------------------------------------------------+ |
| |
+---------------------------------------------------------------+

Key Components
 Program Memory: Stores the program code (24 Kbytes).
 Data EEPROM: Nonvolatile memory for data storage (1 Kbyte).
 Data RAM: Volatile memory for data storage (1 Kbyte).
 Instruction Decode and Control: Decodes and controls the execution of instructions.
 DSP Engine: Performs digital signal processing operations.
 Working Registers: General-purpose registers (16x16-bit).
 Address Generation Units (AGUs): Generate addresses for data memory access.
 X Data Memory: Data memory for the X AGU.
 Y Data Memory: Data memory for the Y AGU.
 Peripherals: Includes various modules such as Timers, Motor Control PWM, UART, SPI,
I2C, Quadrature Encoder Interface (QEI), ADC, and Capture/Compare

Feature Description
High-Performance Modified RISC CPU
 Modified Harvard Architecture: Separate program and data memory buses for simultaneous access.

 C Compiler Optimized Instruction Set: 83 base instructions with flexible addressing modes.

 24-bit Wide Instructions: Allows for efficient and powerful instruction encoding.

 16-bit Wide Data Path: Ensures fast data processing.

 Up to 30 MIPs Operation: High-speed operation with a 40 MHz external clock input.

 16 x 16-bit Working Register Array: Provides a set of general-purpose registers for efficient data
manipulation.

DSP Engine
 Dual Data Fetch: Allows simultaneous access to two data operands.

 Accumulator Write Back: For efficient DSP operations.

 Modulo and Bit-Reversed Addressing Modes: Simplifies implementation of DSP algorithms.

 Two 40-bit Wide Accumulators: With optional saturation logic for high-precision calculations.

 17-bit x 17-bit Single-Cycle Hardware Multiplier: Supports both fractional and integer multiplication.

 Single-Cycle DSP Instructions: Ensures high-speed DSP operations.

 ±16-bit Single-Cycle Shift: For efficient bit manipulation.

Memory
 Program Memory: 24 Kbytes of on-chip Flash memory for storing program code.

 Data RAM: 1 Kbyte of on-chip volatile memory for data storage.

 Data EEPROM: 1 Kbyte of on-chip nonvolatile memory for data storage.

Peripheral Features
 High-Current Sink/Source I/O Pins: 25 mA/25 mA for driving external devices.

 Timer Module with Programmable Prescaler: Five 16-bit timers/counters, with the option to pair
into 32-bit timer modules.

 16-bit Capture Input and Compare/PWM Output Functions: For precise timing and control
applications.

 3-Wire SPI Modules: Supports 4 frame modes for serial communication.

 I2C™ Module: Supports multi-master/slave mode and 7-bit/10-bit addressing.

 2 UART Modules: With FIFO buffers for serial communication.

Motor Control PWM Module

 6 PWM Output Channels: Supports complementary or independent output modes.

 Edge and Center-Aligned Modes: For flexible PWM signal generation.

 Dead-Time Control: For complementary mode to prevent shoot-through.

 Manual Output Control: For direct control of PWM outputs.

 Trigger for A/D Conversions: Synchronizes ADC conversions with PWM signals.

Quadrature Encoder Interface (QEI) Module

 Phase A, Phase B, and Index Pulse Input: For position and speed sensing.

 16-bit Up/Down Position Counter: Tracks the position of a rotating object.

 Count Direction Status: Indicates the direction of rotation.

 Programmable Digital Noise Filters: On inputs to reduce noise.

 Alternate 16-bit Timer/Counter Mode: For additional timing applications.

 Interrupt on Position Counter Rollover/Underflow: For precise control.

Analog Features
 10-bit Analog-to-Digital Converter (ADC): With 4 sample and hold (S&H) inputs.

 1 Msps Conversion Rate: High-speed data acquisition.

 9 Input Channels: For multiple analog inputs.

 Conversion Available During Sleep and Idle: For low-power operation.

 Programmable Brown-out Reset: For reliable operation under varying power conditions.

Special Microcontroller Features

 Enhanced Flash Program Memory: 10,000 erase/write cycles (min.) for industrial temperature range.

 Self-Reprogrammable Under Software Control: For flexible firmware updates.

 Power-on Reset (POR), Power-up Timer (PWRT), and Oscillator Start-up Timer (OST): For reliable
startup.

 Flexible Watchdog Timer (WDT): With on-chip low-power RC oscillator.

 Fail-Safe Clock Monitor Operation: Detects clock failure and switches to on-chip low-power RC
oscillator.

 Programmable Code Protection: For security.

 In-Circuit Serial Programming™ (ICSP™): For easy programming and debugging.

 Selectable Power Management Modes: Sleep, Idle, and Alternate Clock modes.

CMOS Technology
 Low-Power, High-Speed Flash Technology: For efficient operation.

 Wide Operating Voltage Range: 2.5V to 5.5V.

 Industrial and Extended Temperature Ranges: For robust operation in various environments.

 Low Power Consumption: For energy-efficient applications.

Device Functional Modes

Normal Operation Mode
 Active Mode: The CPU and peripherals are fully operational. This mode is used for normal program
execution.

 Idle Mode: The CPU is stopped, but peripherals continue to operate. This mode
reduces power consumption while maintaining peripheral functionality.

 Sleep Mode: Both the CPU and peripherals are stopped. This mode provides the lowest power
consumption. The device can be awakened by external interrupts or other wake-up sources.

Power Management Modes

 Sleep Mode: The device enters a low-power state where the CPU and most peripherals are stopped.
Wake-up sources include external interrupts, watchdog timer, and other specific events.

 Idle Mode: The CPU is halted, but peripherals continue to operate. This mode allows for reduced
power consumption while maintaining peripheral activity.

 Alternate Clock Mode: The device can switch to a lower frequency clock source to reduce power
consumption while maintaining some level of operation.

Reset and Initialization

 Power-on Reset (POR): Ensures the device starts in a known state upon power-up.
 Brown-out Reset (BOR): Resets the device when the supply voltage drops below a certain threshold.

 Watchdog Timer (WDT) Reset: Resets the device if the watchdog timer is not cleared within
a specified time frame.

 External Reset (MCLR): Allows for manual reset of the device via an external pin.

Debug and Programming Modes

 In-Circuit Serial Programming™ (ICSP™): Allows for programming and debugging of the device while it
is in the application circuit.

 In-Circuit Debugging (ICD): Provides real-time debugging capabilities through the use of special
debugging hardware and software.

These features and functional modes make the dsPIC30F3010/3011 devices highly versatile and
suitable for a wide range of applications, including motor control, power conversion, and general-
purpose digital signal processing.

If you need more detailed information or have specific questions, feel free to ask!

Implementation Guidelines
Circuit Design
 Power Supply Decoupling:

 Place decoupling capacitors (0.1 µF and 10 µF) close to the VDD and VSS pins to filter out noise and
provide a stable power supply.

 Use low ESR (Equivalent Series Resistance) capacitors for better performance.

 Oscillator Circuit:

 Use a crystal oscillator or an external clock source as specified in the datasheet.

 Place the crystal and load capacitors as close to the oscillator pins (OSC1 and OSC2) as possible
to minimize noise and signal degradation.

 Reset Circuit:

 Connect a pull-up resistor (typically 10 kΩ) to the MCLR pin to ensure a proper reset signal.

 Optionally, add a capacitor (typically 0.1 µF) between MCLR and VSS to filter out noise.

 Programming and Debugging:

 Provide access to the ICSP™ pins (PGC, PGD, and MCLR) for in-circuit programming and debugging.

 Ensure that these pins are not used for other functions during programming/debugging.

 Analog Circuitry:

 Use separate analog and digital ground planes to minimize noise interference.
 Place the analog components (e.g., ADC input circuitry) close to the analog pins (AN0-AN8) to
reduce noise pickup.

 I/O Pin Configuration:

 Configure unused I/O pins as outputs and drive them low to minimize power consumption and
avoid floating inputs.

 Use pull-up or pull-down resistors on input pins to ensure a defined logic level.

PCB Layout
 Ground Plane:

 Use a continuous ground plane to reduce noise and improve signal integrity.

 Connect all ground pins (VSS) to the ground plane with short, low-impedance paths.

 Power Plane:

 Use a dedicated power plane for VDD to provide a stable power supply.

 Connect all power pins (VDD) to the power plane with short, low-impedance paths.

 Signal Routing:

 Keep signal traces as short as possible to reduce inductance and noise pickup.

 Avoid routing high-speed digital signals near sensitive analog traces.

 Decoupling Capacitors:

 Place decoupling capacitors close to the power pins of the microcontroller.

 Use multiple capacitors with different values (e.g., 0.1 µF and 10 µF) to filter a wide range of
frequencies.

Power Supply Recommendations

Voltage Requirements
 Operating Voltage Range (VDD): 2.5V to 5.5V

 Recommended Voltage: Typically 3.3V or 5.0V, depending on the application and peripheral
requirements.

Power Supply Design

1. Regulated Power Supply:

 Use a regulated power supply to provide a stable voltage within the recommended range.

 Ensure the power supply can source sufficient current for the microcontroller and all connected
peripherals.

2. Decoupling and Filtering:

 Place decoupling capacitors (0.1 µF and 10 µF) close to the VDD pins to filter out high-frequency
noise.

 Use bulk capacitors (e.g., 100 µF) near the power supply input to handle transient currents and
stabilize the voltage.

 Power Sequencing:

 Ensure that the power supply ramps up smoothly to avoid voltage spikes that could damage the
microcontroller.

 Use a power-on reset (POR) circuit to ensure the microcontroller starts in a known state.

 Brown-out Detection:

 Enable the brown-out reset (BOR) feature to reset the microcontroller if the supply voltage drops
below a certain threshold.

 This helps prevent erratic behavior and data corruption during power fluctuations.

Example Power Supply Circuit

+5V Input
|
+----[10 µF]----+----[0.1 µF]----+
| | |
VDD VDD VDD
(Pin) (Pin) (Pin)
| | |
VSS VSS VSS
(Pin) (Pin) (Pin)
| | |
GND GND GND

Summary
 Decoupling Capacitors: Place 0.1 µF and 10 µF capacitors close to VDD and VSS pins.

 Oscillator Circuit: Use a crystal oscillator with appropriate load capacitors.

 Reset Circuit: Use a pull-up resistor and optional capacitor on the MCLR pin.

 Programming/Debugging: Provide access to ICSP™ pins.

 Analog Circuitry: Use separate analog and digital ground planes.

 I/O Pin Configuration: Configure unused pins as outputs and use pull-up/pull-down resistors on
inputs.
 Power Supply: Use a regulated power supply with decoupling and bulk capacitors, and enable brown-
out detection.

Layout Guidelines
Power Supply and Grounding
 Ground Plane:

 Use a continuous ground plane to minimize noise and provide a low-impedance return path for
signals.

 Connect all ground pins (VSS) directly to the ground plane with short, wide traces.

 Power Plane:

 Use a dedicated power plane for VDD to ensure a stable power supply.

 Connect all power pins (VDD) directly to the power plane with short, wide traces.

 Decoupling Capacitors:

 Place decoupling capacitors (0.1 µF and 10 µF) as close as possible to each VDD pin.

 Use low ESR capacitors to improve filtering performance.

 Place bulk capacitors (e.g., 100 µF) near the power supply input to handle transient currents.

 Power Supply Routing:

 Keep power supply traces short and wide to reduce inductance and resistance.

 Avoid routing power traces near high-speed signal lines to minimize noise coupling.

Signal Integrity
1. Trace Length and Width:

 Keep signal traces as short as possible to reduce inductance and signal degradation.

 Use wider traces for high-current paths to reduce voltage drops and heating.

 Signal Routing:

 Route high-speed signals (e.g., clock lines) away from sensitive analog traces to minimize noise
coupling.

 Avoid sharp bends in signal traces; use 45-degree angles instead of 90-degree angles to
reduce signal reflections.

 Differential Pairs:

 For differential signals (e.g., differential clock inputs), route the pairs together with
controlled impedance.

 Maintain consistent spacing between the differential pairs to ensure signal integrity.

4. Impedance Control:
 For high-speed signals, maintain controlled impedance by using appropriate trace widths and spacing.

 Use impedance calculators or simulation tools to ensure the correct impedance for your PCB stack-up.

Oscillator Circuit
 Crystal Placement:

 Place the crystal oscillator and load capacitors as close to the oscillator pins (OSC1 and OSC2) as
possible.

 Minimize the trace length between the crystal and the microcontroller to reduce noise and signal
degradation.

 Grounding:

 Connect the ground side of the load capacitors directly to the ground plane.

 Avoid routing high-speed or noisy signals near the oscillator circuit.

Analog Circuitry
 Analog and Digital Separation:

 Use separate analog and digital ground planes to minimize noise interference.

 Connect the analog ground plane (AVSS) to the digital ground plane (VSS) at a single point (star
grounding).

 Analog Component Placement:

 Place analog components (e.g., ADC input circuitry) close to the analog pins (AN0-AN8)
to reduce noise pickup.

 Use short, direct traces for analog signal routing.

3. Decoupling for Analog Power:

 Place decoupling capacitors (0.1 µF and 10 µF) close to the analog power pins (AVDD).

 Use low ESR capacitors for better performance.

Reset and Programming

 Reset Circuit:

 Connect a pull-up resistor (typically 10 kΩ) to the MCLR pin to ensure a proper reset signal.

 Optionally, add a capacitor (typically 0.1 µF) between MCLR and VSS to filter out noise.

 Programming and Debugging:

 Provide access to the ICSP™ pins (PGC, PGD, and MCLR) for in-circuit programming and debugging.

 Ensure that these pins are not used for other functions during programming/debugging.

EMI/EMC Considerations
 Shielding:
 Use ground planes and ground fills to shield sensitive analog and high-speed digital circuits.

 Place ground vias around high-speed signal traces to provide additional shielding.

 Decoupling and Filtering:

 Use decoupling capacitors on all power supply pins to filter out high-frequency noise.

 Place ferrite beads on power supply lines to reduce EMI.

 Trace Routing:

 Avoid routing high-speed signals near the edge of the PCB to minimize radiation.

 Use differential pairs for high-speed signals to reduce EMI.

Example Layout Diagram

Below is a simplified example of a PCB layout for the dsPIC30F3010/3011:

+---------------------------------------------------------------+

| |

| dsPIC30F3010/3011 |

| |

| +-------------------+ +-------------------+ |

| | | | | |

| | Decoupling Caps | | Decoupling Caps | |

| | (0.1 µF, 10 µF) | | (0.1 µF, 10 µF) | |

| | | | | |

| +-------------------+ +-------------------+ |

| | | |

| v v |

| +-------------------+ +-------------------+ |

| | | | | |

| | VDD | | VDD | |

| | | | | |

| +-------------------+ +-------------------+ |

| | | |

| v v |
| +-------------------+ +-------------------+ |

| | | | | |

| | dsPIC30F3010/3011 | | Ground Plane | |

| | | | | |

| +-------------------+ +-------------------+ |

| | | |

| v v |

| +-------------------+ +-------------------+ |

| | | | | |

| | Analog Components | | Digital Components| |

| | | | | |

| +-------------------+ +-------------------+ |

| |

+---------------------------------------------------------------+

Summary
 Power Supply and Grounding: Use continuous ground and power planes, and place
decoupling capacitors close to VDD pins.
 Signal Integrity: Keep traces short, use wider traces for high-current paths, and maintain
controlled impedance for high-speed signals.
 Oscillator Circuit: Place the crystal and load capacitors close to the oscillator pins.
 Analog Circuitry: Separate analog and digital ground planes, and place analog components
close to analog pins.
 Reset and Programming: Provide access to ICSP™ pins and ensure proper reset circuitry.
 EMI/EMC Considerations: Use shielding, decoupling, and proper trace routing to minimize
EMI.
Protocols and Peripherals
Communication Protocols
 UART (Universal Asynchronous Receiver/Transmitter):

 Two UART modules with FIFO buffers.

 Supports full-duplex communication.

 Baud rate generator for flexible baud rate settings.

 Auto-baud detection and address detect modes.

 SPI (Serial Peripheral Interface):

 Two SPI modules.

 Supports 3-wire communication.

 Configurable clock polarity and phase.

 Master and slave modes.

 Supports 4 frame modes.

 I2C (Inter-Integrated Circuit):

 One I2C module.

 Supports multi-master and slave modes.

 7-bit and 10-bit addressing.

 Clock stretching and general call support.

Motor Control Peripherals

 PWM (Pulse Width Modulation):

 Six PWM output channels.

 Complementary or independent output modes.

 Edge and center-aligned modes.

 Dead-time control for complementary mode.

 Manual output control.

 Trigger for A/D conversions.

 Quadrature Encoder Interface (QEI):

 Phase A, Phase B, and index pulse input.

 16-bit up/down position counter.

 Count direction status.

 Position measurement (x2 and x4) modes.

 Programmable digital noise filters on inputs.

 Alternate 16-bit timer/counter mode.

 Interrupt on position counter rollover/underflow.

Memory
Program Memory
 Flash Program Memory: 24 Kbytes (8K instruction words).

Data Memory
 Data RAM: 1 Kbyte.

 Data EEPROM: 1 Kbyte.

Interrupts
Interrupt Sources
 29 Interrupt Sources:

 3 external interrupt sources.

 8 user-selectable priority levels for each interrupt source.

 4 processor trap sources.

Interrupt Features
 Vectored Exception Processing:

 62 independent vectors, including up to 8 traps and 54 interrupts.

 Interrupt Priority Levels:

 User-assigned priority levels from 1 to 7 for interrupts.

 Traps have fixed priorities from 8 to 15.

Clocks
Oscillator Options
 Primary Oscillator:

 Supports crystal, resonator, or external clock input.

 Frequency range: 4 MHz to 40 MHz.

 Internal Fast RC Oscillator (FRC):

 Provides a stable clock source for startup and low-power modes.

 Phase-Locked Loop (PLL):

 Provides frequency multiplication for high-speed operation.

 Configurable multipliers (4x, 8x, 16x).

 Fail-Safe Clock Monitor:

 Detects clock failure and switches to the internal low-power RC oscillator.

Timers
Timer Modules
 Five 16-bit Timers/Counters:

 Can be paired to form 32-bit timer modules.

 Programmable prescaler options.

 Supports capture and compare functions.

ADC (Analog-to-Digital Converter)

ADC Features
 10-bit ADC:

 4 sample and hold (S&H) inputs.

 1 Msps conversion rate.

 9 input channels.

 Conversion available during sleep and idle modes.

 Programmable acquisition time.

 Interrupt on conversion completion.

DAC (Digital-to-Analog Converter)

 Note: The dsPIC30F3010/3011 does not have an integrated DAC. External DACs can be
interfaced using SPI or I2C.

Operating Conditions
Voltage and Temperature
 Operating Voltage Range (VDD): 2.5V to 5.5V.

 Ambient Temperature (TA):

 Industrial: -40°C to +85°C.

 Extended: -40°C to +125°C.

Power Consumption
 Active Mode (Typical):

 5V, 40 MHz: 20 mA.

 3.3V, 40 MHz: 12 mA.

 Idle Mode (Typical):

 5V, 40 MHz: 5 mA.

 3.3V, 40 MHz: 3 mA.

 Sleep Mode (Typical):

 5V: 1 µA.
 3.3V: 1 µA.

Summary
 Protocols and Peripherals: UART, SPI, I2C, PWM, QEI.

 Memory: 24 Kbytes Flash, 1 Kbyte RAM, 1 Kbyte EEPROM.

 Interrupts: 29 sources, vectored exception processing, priority levels.

 Clocks: Primary oscillator, FRC, PLL, fail-safe clock monitor.

 Timers: Five 16-bit timers/counters, programmable prescaler.

 ADC: 10-bit, 4 S&H inputs, 1 Msps, 9 channels.

 Operating Conditions: 2.5V to 5.5V, -40°C to +85°C (industrial), -40°C to +125°C (extended).