ASUSTeK COMPUTER INC.
ASUS L8400L Notebook
SERVICE GUIDE
ASUS L8400 L NOTEBOOK
Service Guide
ASUSTeK Computer Inc.
No. 150, Li-Te Rd., Peitou, Taipei, Taiwan, R.O.C.
Phone +886-2-2894-3447 • Fax +886-2-2895-9254
No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a
retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup
purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”).
ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED,
INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE
LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR
LOSS OF PROFITS, LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSINESS AND THE LIKE), EVEN
IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY DEFECT OR ERROR IN
THIS MANUAL OR PRODUCT.
Products and corporate names appearing in this manual may or may not be registered trademarks or copyrights of their respective
companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe.
• Intel and Pentium are registered trademarks of Intel Corporation.
SPECIFICATIONS AND INFORMATION CONTAINED IN THIS MANUAL ARE FURNISHED FOR INFORMATIONAL USE
ONLY, AND ARE SUBJECT TO CHANGE AT ANY TIME WITHOUT NOTICE, AND SHOULD NOT BE CONSTRUED AS A
COMMITMENT BY ASUS. ASUS ASSUMES NO RESPONSIBLITY OR LIABILITY FOR ANY ERRORS OR INACCURACIES
THAT MAY APPEAR IN THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARES DESCRIBED IN IT.
Copyright © 2001 ASUSTeK COMPUTER INC. All Rights Reserved.
Manual revision 0.9, October 9, 2001
Table of Contents
CHAPTER 1: ASUS SERVICE POLICY
ASUS Service Policy Overview 1-2
ASUS Branch Service Repair Centers 1-3
Worldwide Service Channels – GSM program 1-4
Map of Service Locations 1-8
Source of Support 1-9
CHAPTER 2: SERVICE OVERVIEW
L8400 L series Overview and Components 2-2
L8400 L series Overview 2-2
Components 2-4
Service Overview 2 - 16
Precautions 2 - 16
Appropriate Tools 2 - 18
CHAPTER 3: DISASSEMBLY PROCEDURE
Keyboard, Memory and Function Cap 3–3
CPU Thermal Module 3–6
LCD module 3–7
Palm Rest Module 3 – 10
HDD module 3 – 12
Top Case Module 3 – 13
Bottom Case Module 3 – 17
Motherboard Module 3 – 20
FDD module 3 – 23
CPU 3 – 24
CHAPTER 4: ASSEMBLY PROCEDURE
CPU 4–2
FDD module 4–4
Motherboard Module 4–6
Bottom Case Module 4–9
Top Case Module 4 – 12
HDD module 4 – 16
Palm Rest Module 4 – 17
LCD module 4 – 19
CPU Thermal Module 4 – 22
Keyboard, Memory and Function Cap 4 – 24
CHAPTER 5: UPGRADE & REPLACEMENT
Memory Upgrade 5-2
HDD Upgrade 5-2
LCD Module Replacement 5-3
Lan or Modem Board Replacement 5-3
CHAPTER 6: HARDWARE SPECIFICATIONS
System Specifications 6–2
Chipset Specifications 6–8
Key Parts Specifications 6 – 13
System Resource 6 – 18
CHAPTER 7: SOFTWARE SPECIFICATIONS
BIOS Specification 7-2
System Software Specification 7–3
LED Indicator Definition 7–8
Hot Key Definition 7–9
Resource Allocation 7 – 10
CHAPTER 8: COMPONENT PARTS LIST
System Assembly 8–2
CPUs 8–3
Keyboards 8–4
Bottom System Assembly 8–5
Bottom Case Modules 8 – 10
Top Case Modules 8 – 12
Palm Rest Modules 8 – 14
Palm Rest Sub Ass’y 8 – 16
Function Cap Modules 8 – 18
PCMCIA Bezel Modules 8 – 20
Thermal Module 8 – 22
LCD Module 8 – 24
FDD Module 8 – 27
CD-ROM Module 8 – 29
DVD-ROM Module 8 – 31
HDD Module 8 – 33
HDD Housing 8 – 35
Main Board Module 8 – 37
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