Features

• Low-voltage and Standard-voltage Operation

– 2.7 (VCC = 2.7V to 5.5V)
• User Selectable Internal Organization
– 16K: 2048 x 8 or 1024 x 16
• 3-wire Serial Interface
• Sequential Read Operation
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• 2 MHz Clock Rate (5V) Compatibility
• Self-timed Write Cycle (10 ms max)
• High Reliability
– Endurance: 1 Million Write Cycles
3-wire Serial
– Data Retention: 100 Years
• Automotive Grade, Extended Temperature and Lead-Free Devices Available
EEPROM
• 8-lead PDIP, 8-lead JEDEC SOIC, and 8-lead TSSOP Packages
16K (2048 x 8 or 1024 x 16)
Description
The AT93C86 provides 16384 bits of serial electrically erasable programmable read AT93C86
only memory (EEPROM) organized as 1024 words of 16 bits each when the ORG Pin
is connected to V CC and 2048 words of 8 bits each when it is tied to ground. The
device is optimized for use in many industrial and commercial applications where low
power and low voltage operations are essential. The AT93C86 is available in space
saving 8-lead PDIP, 8-lead JEDEC SOIC and 8-lead TSSOP packages.
The AT93C86 is enabled through the Chip Select pin (CS), and accessed via a 3-wire
serial interface consisting of Data Input (DI), Data Output (DO), and Shift Clock (SK).

Pin Configurations
8-lead PDIP
Pin Name Function
CS Chip Select
CS 1 8 VCC
SK Serial Data Clock SK 2 7 DC
DI Serial Data Input DI 3 6 ORG
DO 4 5 GND
DO Serial Data Output
GND Ground
VCC Power Supply 8-lead SOIC
ORG Internal Organization
CS 1 8 VCC
DC Don’t Connect
SK 2 7 DC
DI 3 6 ORG
DO 4 5 GND

8-lead TSSOP

CS 1 8 VCC
SK 2 7 DC
DI 3 6 ORG
DO 4 5 GND Rev. 1237E–SEEPR–01/03

1
Upon receiving a READ instruction at DI, the address is decoded and the data is clocked out serially on the data output pin
DO. The WRITE cycle is completely self-timed and no separate ERASE cycle is required before WRITE. The WRITE cycle
is only enabled when the part is in the ERASE/WRITE ENABLE state. When CS is brought “high” following the initiation of
a WRITE cycle, the DO pin outputs the READY/BUSY status of the part. The AT93C86 is available in a 2.7V to 5.5V
version.

Absolute Maximum Ratings*

Operating Temperature.................................. -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
Storage Temperature ..................................... -65°C to +150°C age to the device. This is a stress rating only and
functional operation of the device at these or any
Voltage on any Pin other conditions beyond those indicated in the
with Respect to Ground .....................................-1.0V to +7.0V operational sections of this specification is not
implied. Exposure to absolute maximum rating
Maximum Operating Voltage .......................................... 6.25V conditions for extended periods may affect
device reliability
DC Output Current........................................................ 5.0 mA

Block Diagram
Vcc GND

MEMORY ARRAY
ADDRESS
ORG 2048 x 8 DECODER
OR
1024 x 16

DATA
REGISTER

DI OUTPUT
BUFFER
MODE
DECODE
CS LOGIC

CLOCK DO
SK GENERATOR

Note: 1. When the ORG pin is connected to Vcc, the x 16 organization is selected. When it is connected to ground, the x 8 organiza-
tion is selected. If the ORG pin is left unconnected and the application does not load the input beyond the capability of the
internal 1 Meg ohm pullup, then the x 16 organization is selected. This feature is not available on the 1.8V devices.

2 AT93C86
1237E–SEEPR–01/03
 AT93C86

Pin Capacitance(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted).
Symbol Test Conditions Max Units Conditions
COUT Output Capacitance (DO) 5 pF VOUT = 0V
CIN Input Capacitance (CS, SK, DI) 5 pF VIN = 0V
Note: 1. This parameter is characterized and is not 100% tested.

DC Characteristics
Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = +2.7V to +5.5V,
TAE = -40°C to +125°C, VCC = +2.7V to +5.5V (unless otherwise noted).
Symbol Parameter Test Condition Min Typ Max Unit
VCC1 Supply Voltage 2.7 5.5 V
VCC2 Supply Voltage 4.5 5.5 V
READ at 1.0 MHz 0.5 2.0 mA
ICC Supply Current VCC = 5.0V
WRITE at 1.0 MHz 0.5 2.0 mA
ISB1 Standby Current VCC = 2.7V CS = 0V 6.0 10.0 µA
ISB2 Standby Current VCC = 5.0V CS = 0V 17 30 µA
IIL Input Leakage VIN = 0V to VCC 0.1 1.0 µA
IOL Output Leakage VIN = 0V to VCC 0.1 1.0 µA
(1)
VIL1 Input Low Voltage -0.6 VCC x 0.3
4.5V ≤ VCC ≤ 5.5V V
VIH1(1) Input High Voltage VCC x 0.7 VCC + 1
VIL2 (1) Input Low Voltage -0.6 VCC x 0.3
VCC ≤ 2.7V V
VIH2(1) Input High Voltage VCC x 0.7 VCC + 1

VOL1 Output Low Voltage IOL = 2.1 mA 0.4 V

4.5V ≤ VCC ≤ 5.5V
VOH1 Output High Voltage IOH = -0.4 mA 2.4 V

VOL2 Output Low Voltage IOL = 0.15 mA 0.2 V

VCC ≤ 2.7V
VOH2 Output High Voltage IOH = -100 µA VCC - 0.2 V
Note: 1. VIL min and VIH max are reference only and are not tested.

3
1237E–SEEPR–01/03
AC Characteristics
Applicable over recommended operating range from TAI = -40°C to + 85°C, TAE = -40°C to + 125°C,VCC = As Specified,
CL = 1 TTL Gate and 100 pF (unless otherwise noted).
Symbol Parameter Test Condition Min Typ Max Units

SK Clock 4.5V ≤ VCC ≤ 5.5V 0 2

fSK MHz
Frequency 2.7V ≤ VCC ≤ 5.5V 0 1

4.5V ≤ VCC ≤ 5.5V 250

tSKH SK High Time ns
2.7V ≤ VCC ≤ 5.5V 250

4.5V ≤ VCC ≤ 5.5V 250

tSKL SK Low Time ns
2.7V ≤ VCC ≤ 5.5V 250

Minimum CS 4.5V ≤ VCC ≤ 5.5V 250

tCS ns
Low Time 2.7V ≤ VCC ≤ 5.5V 250

4.5V ≤ VCC ≤ 5.5V 50

tCSS CS Setup Time Relative to SK ns
2.7V ≤ VCC ≤ 5.5V 50

4.5V ≤ VCC ≤ 5.5V 100

tDIS DI Setup Time Relative to SK ns
2.7V ≤ VCC ≤ 5.5V 100

tCSH CS Hold Time Relative to SK 0 ns

4.5V ≤ VCC ≤ 5.5V 100

tDIH DI Hold Time Relative to SK ns
2.7V ≤ VCC ≤ 5.5V 100

4.5V ≤ VCC ≤ 5.5V 250

tPD1 Output Delay to ‘1’ AC Test ns
2.7V ≤ VCC ≤ 5.5V 250

4.5V ≤ VCC ≤ 5.5V 250

tPD0 Output Delay to ‘0’ AC Test ns
2.7V ≤ VCC ≤ 5.5V 250

4.5V ≤ VCC ≤ 5.5V 250

tSV CS to Status Valid AC Test ns
2.7V ≤ VCC ≤ 5.5V 250

CS to DO in High AC Test 4.5V ≤ VCC ≤ 5.5V 100

tDF ns
Impedance CS = VIL 2.7V ≤ VCC ≤ 5.5V 100

10 ms
tWP Write Cycle Time
4.5V ≤ VCC ≤ 5.5V 4 ms
(1)
Endurance 5.0V, 25°C, Page Mode 1M Write Cycles
Note: 1. This parameter is characterized and is not 100% tested.

4 AT93C86
1237E–SEEPR–01/03
 AT93C86

Instruction Set for the AT93C86

Address Data
Instruction SB Op Code x8 x 16 x8 x 16 Comments
READ 1 10 A10 - A0 A9 - A0 Reads data stored in memory,
at specified address.
EWEN 1 00 11XXXXXXXX 11XXXXXXXX Write enable must precede all
programming modes.
ERASE 1 11 A10 - A0 A9 - A0 Erases memory location An - A0.
WRITE 1 01 A10 - A0 A9 - A0 D7 - D0 D15 - D0 Writes memory location An - A0.
ERAL 1 00 10XXXXXXXX 10XXXXXXXX Erases all memory locations.
Valid only at VCC = 4.5V to 5.5V.
WRAL 1 00 01XXXXXXXX 01XXXXXXXX D7 - D0 D15 - D0 Writes all memory locations.
Valid when VCC = 4.5V to 5.5V and
Disable Register cleared.
EWDS 1 00 00XXXXXXXX 00XXXXXXXX Disables all programming instructions.

Functional The AT93C86 is accessed via a simple and versatile 3-wire serial communication inter-
Description face. Device operation is controlled by seven instructions issued by the host processor.
A valid instruction starts with a rising edge of CS and consists of a Start Bit (logic
“1”) followed by the appropriate Op Code and the desired memory Address location.
READ (READ): The Read (READ) instruction contains the Address code for the mem-
ory location to be read. After the instruction and address are decoded, data from the
selected memory location is available at the serial output pin DO. Output data changes
are synchronized with the rising edges of serial clock SK. It should be noted that a
dummy bit (logic “0”) precedes the 8- or 16-bit data output string.
ERASE/WRITE (EWEN): To assure data integrity, the part automatically goes into the
Erase/Write Disable (EWDS) state when power is first applied. An Erase/Write Enable
(EWEN) instruction must be executed first before any programming instructions can be
carried out. Please note that once in the Erase/Write Enable state, programming
remains enabled until an Erase/Write Disable (EWDS) instruction is executed or VCC
power is removed from the part.
ERASE (ERASE): The Erase (ERASE) instruction programs all bits in the specified
memory location to the logical “1” state. The self-timed erase cycle starts once the
ERASE instruction and address are decoded. The DO pin outputs the READY/BUSY
status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS).
A logic “1” at pin DO indicates that the selected memory location has been erased, and
the part is ready for another instruction.
WRITE (WRITE): The Write (WRITE) instruction contains the 8 or 16 bits of data to be
written into the specified memory location. The self-timed programming cycle, tWP, starts
after the last bit of data is received at serial data input pin DI. The DO pin outputs the
READY/BUSY status of the part if CS is brought high after being kept low for a minimum
of 250 ns (tCS). A logic “0” at DO indicates that programming is still in progress. A logic
“1” indicates that the memory location at the specified address has been written with the
data pattern contained in the instruction and the part is ready for further instructions. A
READY/BUSY status cannot be obtained if the CS is brought high after the end of
the self-timed programming cycle, tWP.

5
1237E–SEEPR–01/03
 ERASE ALL (ERAL): The Erase All (ERAL) instruction programs every bit in the mem-
ory array to the logic “1” state and is primarily used for testing purposes. The DO pin
outputs the READY/BUSY status of the part if CS is brought high after being kept low for
a minimum of 250 ns (tCS). The ERAL instruction is valid only at VCC = 5.0V ± 10%.
WRITE ALL (WRAL): The Write All (WRAL) instruction programs all memory locations
with the data patterns specified in the instruction. The DO pin outputs the READY/BUSY
status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS).
The WRAL instruction is valid only at VCC = 5.0V ± 10%.
ERASE/WRITE DISABLE (EWDS): To protect against accidental data disturb, the
Erase/Write Disable (EWDS) instruction disables all programming modes and should be
executed after all programming operations. The operation of the READ instruction is
independent of both the EWEN and EWDS instructions and can be executed at any
time.

6 AT93C86
1237E–SEEPR–01/03
 AT93C86

Timing Diagrams

Synchronous Data Timing

Note: 1. This is the minimum SK period.

Organization Key for Timing Diagrams

AT93C86 (16K)
I/O x8 x 16
AN A10 A9
DN D7 D15

7
1237E–SEEPR–01/03
READ Timing

tCS

High Impedance

EWEN Timing

tCS
CS

SK

DI 1 0 0 1 1 ...

EWDS Timing

tCS
CS

SK

DI 1 0 0 0 0 ...

8 AT93C86
1237E–SEEPR–01/03
 AT93C86

WRITE Timing
tCS
CS

SK

DI 1 0 1 AN ... A0 DN ... D0

HIGH IMPEDANCE
DO BUSY READY

tWP

WRAL Timing(1)
tCS
CS

SK

DI 1 0 0 0 1 ... DN ... D0

BUSY
HIGH IMPEDANCE
DO READY

tWP

Note: 1. Valid only at VCC = 4.5V to 5.5V.

9
1237E–SEEPR–01/03
ERASE Timing
tCS

CS CHECK STANDBY
STATUS

SK

DI 1 1 1 AN AN-1 AN-2 ... A0

tSV tDF

HIGH IMPEDANCE BUSY HIGH IMPEDANCE

DO
READY

tWP

ERAL Timing(1)
tCS

CS CHECK STANDBY
STATUS

SK

DI 1 0 0 1 0

tSV tDF
HIGH IMPEDANCE BUSY HIGH IMPEDANCE
DO
READY
tWP

Note: 1. Valid only at VCC = 4.5V to 5.5V.

10 AT93C86
1237E–SEEPR–01/03
 AT93C86

AT93C86 Ordering Information

Ordering Code Package Operation Range
AT93C86-10PI-2.7 8P3 Industrial
AT93C86-10SI-2.7 8S1 (-40°C to 85°C)
AT93C86-10TI-2.7 8A2
AT93C86-10SJ-2.7 8S1 Lead-Free/Industrial Temperature
(-40°C to 85°C)
AT93C86-10SE-2.7 8S1 High Grade/Extended Temperature
(-40°C to 125°C)
Note: For 2.7V devices used in a 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables.

Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
-2.7 Low Voltage (2.7V to 5.5V)

11
1237E–SEEPR–01/03
Packaging Information

8P3 – PDIP

1
E

E1

Top View c
eA

End View

COMMON DIMENSIONS
D (Unit of Measure = inches)
e
D1 SYMBOL MIN NOM MAX NOTE
A2 A
A 0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
b2 L D1 0.005 3
b3 E 0.300 0.310 0.325 4
4 PLCS b E1 0.240 0.250 0.280 3
e 0.100 BSC
Side View
eA 0.300 BSC 4
L 0.115 0.130 0.150 2

Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
TITLE DRAWING NO. REV.
2325 Orchard Parkway 8P3, 8-lead, 0.300" Wide Body, Plastic Dual
8P3 B
R San Jose, CA 95131 In-line Package (PDIP)

12 AT93C86
1237E–SEEPR–01/03
 AT93C86

8S1 – JEDEC SOIC

3 2 1

Top View

e B
A

D COMMON DIMENSIONS
(Unit of Measure = mm)
Side View
SYMBOL MIN NOM MAX NOTE
A – – 1.75
A2 B – – 0.51

C C – – 0.25
D – – 5.00
E – – 4.00
L e 1.27 BSC
E H – – 6.20

End View L – – 1.27

Note: This drawing is for general information only. Refer to JEDEC Drawing MS-012 for proper dimensions, tolerances, datums, etc.

10/10/01
TITLE DRAWING NO. REV.
2325 Orchard Parkway 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
8S1 A
R San Jose, CA 95131 Small Outline (JEDEC SOIC)

13
1237E–SEEPR–01/03
8A2 – TSSOP

3 2 1

Pin 1 indicator
this corner

E1 E

L1

N
L
Top View End View
COMMON DIMENSIONS
(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A D 2.90 3.00 3.10 2, 5

b E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
A – – 1.20

e A2 A2 0.80 1.00 1.05

b 0.19 – 0.30 4
D
e 0.65 BSC
Side View L 0.45 0.60 0.75
L1 1.00 REF

Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H. 5/30/02
TITLE DRAWING NO. REV.
2325 Orchard Parkway 8A2, 8-lead, 4.4 mm Body, Plastic
8A2 B
R San Jose, CA 95131 Thin Shrink Small Outline Package (TSSOP)

14 AT93C86
1237E–SEEPR–01/03
 Atmel Headquarters Atmel Operations
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1237E–SEEPR–01/03 xM