Datasheet

Voltage Detectors

Voltage Detector ICs with Watchdog Timer

BD37Axx Series BD87Axx Series BD99A41F
General Description Key Specifications
The BD37A19FVM, BD37A41FVM, BD87A28FVM,  RESET Power Supply Voltage Range: 1.0V to 10V
BD87A29FVM, BD87A34FVM, BD87A41FVM and  WDT Power Supply Voltage Range: 2.5V to 10V
BD99A41F are watchdog timer reset ICs. It delivers a  High Precision Detection Voltage:
high precision detection voltage of 1.5% and a (Ta = 25°C) 1.5%
super-low current consumption of 5 µA (Typ). It can be (Ta = −40°C to 105°C) 2.5%
used in a wide range of electronic devices to monitor  Super-Low Current Consumption: 5μA(Typ)
power supply voltages and in system operation to  Operating Temperature Range: -40°C to +105°C
prevent runaway operation.
Packages W (Typ) x D (Typ) x H (Max)
Features  MSOP8 2.90mm x 4.00mm x 0.90mm
 Built-in Watchdog Timer
 Reset delay time can be set with the CT pin's
external capacitance
 Watchdog timer monitor time and reset time can be
set with the CTW pin's external capacitance.
 Output Circuit Type: N-Channel Open Drain

Applications  SOP8 5.00mm x 6.20mm x 1.71mm

All devices using microcontrollers or DSP, including
vehicle equipment, displays, servers, DVD players,
and telephone systems

Ordering Information

B D 3 7 A 1 9 F V M - TR

Part Number Detection Voltage Package Packaging and forming specification

37A：WDT H Active 19：1.9V FVM : MSOP8 TR: Embossed tape and reel
87A：WDT L Active 28：2.8V F : SOP8 E2: Embossed tape and reel
99A：WDT H Active 29：2.9V
34：3.4V
41：4.1V

Lineup
Detection voltage (Typ) INH logic Package Orderable Part Number

1.9V H: Active MSOP8 Reel of 3000 BD37A19FVM-TR

4.1V H: Active MSOP8 Reel of 3000 BD37A41FVM-TR
2.8V L: Active MSOP8 Reel of 3000 BD87A28FVM-TR
2.9V L: Active MSOP8 Reel of 3000 BD87A29FVM-TR
3.4V L: Active MSOP8 Reel of 3000 BD87A34FVM-TR
4.1V L: Active MSOP8 Reel of 3000 BD87A41FVM-TR
4.1V H: Active SOP8 Reel of 2500 BD99A41F-E2

○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
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Pin Configurations
MSOP8 SOP8
(TOP VIEW) (TOP VIEW)
8 7 6 5 8 7 6 5

1 2 3 4 1 2 3 4

Figure 1. Pin Configurations

Pin Descriptions
BD37AxxFVM BD87AxxFVM / BD99A41F
Pin Pin
No. Function No. Function
name name
1 CLK Clock input from microcontroller 1 CTW WDT time setting capacitor connection pin
Reset delay time setting capacitor Reset delay time setting capacitor
2 CT 2 CT
connection pin connection pin
3 CTW WDT time setting capacitor connection pin 3 CLK Clock input from microcontroller

4 VDD Power supply pin 4 GND GND pin

5 N.C. NC pin 5 VDD Power supply pin

WDT ON/OFF setting pin
6 GND GND pin 6 INH INH=H/L:WDT=OFF/ON(BD87AxxFVM)
INH=H/L:WDT=ON/OFF(BD99A41F)
WDT ON/OFF setting pin
7 INH 7 N.C. NC pin
INH=H/L:WDT=ON/OFF
8 RESET Reset output pin 8 RESET Reset output pin

Block Diagrams
BD37AxxFVM BD87AxxFVM / BD99A41F

VDD VDD
RESET RESET

CLK 8 CTW 8
1 1

R R

S Q S Q
+ +
Vref Vref
N.C.
CT INH CT
2 7 2 7

VDD VDD
Pulse
Generation + +
R R INH
CTW Circuit Q GND CLK Q
3 6 3 6
S S
+ Pulse +
Generation
VthH VthL Circuit VthH VthL

N.C. GND VDD

VDD
4 5 4 5

CT pin capacitor: 470pF to 3.3µF

CTW pin capacitor: 0.001µF to 10µF

Figure 2.Block Diagrams

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Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Ratings Unit
Power Supply Voltage *1 VDD −0.3 to 10 V
CT Pin Voltage VCT −0.3 to VDD + 0.3 V
CTW Pin Voltage VCTW −0.3 to VDD + 0.3 V
RESET Pin Voltage VRESET −0.3 to VDD + 0.3 V
INH Pin Voltage VINH −0.3 to VDD + 0.3 V
CLK Pin Voltage VCLK −0.3 to VDD + 0.3 V
*2
0.47
Power Dissipation Pd W
0.55*3
Operating Ambient Temperature Topr −40 to + 105 °C
Storage Temperature Tstg −55 to + 125 °C
Maximum Junction Temperature Tjmax 125 °C
*1 Do not exceed Pd.
*2 MSOP8 : Reduced by 4.70 mW/℃ over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
*3 SOP8 : Reduced by 5.50 mW/℃ over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.

Recommended Operating Ratings(Ta = −40°C to 105°C)

Parameter Symbol Min Max Unit
RESET Power Supply Voltage VDD RESET 1.0 10 V
WDT Power Supply Voltage VDD WDT 2.5 10 V

Electrical Characteristics
(Unless otherwise specified, Ta = −40°C to 105°C, VDD = 5V)
Limits
Parameter Symbol Unit Conditions
Min Typ Max
[Overall]
Total Supply Current 1 INH : WDT ON Logic Input
IDD1 — 5 14 µA
(during WDT operation) CTW = 0.1µF
Total Supply Current 2
IDD2 — 5 14 µA INH : WDT OFF Logic Input
(when WDT stopped)
Output Leak Current Ileak — — 1 µA VDD = VDS = 10V
Output Current Capacity IOL 0.7 — — mA VDD = 1.2V, VDS = 0.5V
[RESET]
1.9V Detect VDET1 1.871 1.900 1.929 V Ta = 25°C
2.8V Detect VDET1 2.758 2.800 2.842 V Ta = 25°C
Detection
2.9V Detect VDET1 2.886 2.930 2.974 V Ta = 25°C
Voltage 1
3.4V Detect VDET1 3.349 3.400 3.451 V Ta = 25°C
4.1V Detect VDET1 4.039 4.100 4.162 V Ta = 25°C
1.9V Detect VDET2 1.852 1.900 1.948 V Ta = −40°C to 105°C
2.8V Detect VDET2 2.730 2.800 2.870 V Ta = −40°C to 105°C
Detection
2.9V Detect VDET2 2.857 2.930 3.003 V Ta = −40°C to 105°C
Voltage 2
3.4V Detect VDET2 3.315 3.400 3.485 V Ta = −40°C to 105°C
4.1V Detect VDET2 4.007 4.100 4.202 V Ta = −40°C to 105°C
1.9V Detect Vrhys VDET×0.03 VDET×0.13 VDET×0.19 V Ta=−40°C to 105°C
2.8V Detect Vrhys VDET×0.018 VDET×0.045 VDET×0.060 V Ta=−40°C to 105°C
Hysteresis
2.9V Detect Vrhys VDET×0.02 VDET×0.05 VDET×0.06 V Ta=−40°C to 105°C
Width
3.4V Detect Vrhys VDET×0.02 VDET×0.05 VDET×0.07 V Ta=−40°C to 105°C
4.1V Detect Vrhys VDET×0.018 VDET×0.035 VDET×0.050 V Ta=−40°C to 105°C

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●Electrical Characteristics - continued

(Unless otherwise specified, Ta = −40°C to 105°C, VDD = 5V)
Limits
Parameter Symbol Unit Conditions
Min Typ Max
RESET Transmission CCT = 0.001µF *1
tPLH 3.9 6.9 10.1 ms
Delay Time: Low  High When VDD = VDET 0.5V
Delay Circuit Resistance Rrst 5.8 10.0 14.5 MΩ VCT = GND
Delay Pin Threshold
VCTH VDD×0.3 VDD×0.45 VDD×0.6 V RL = 470KΩ
Voltage
Delay Pin Output Current ICT 150 — — µA VDD = 1.50V, VCT = 0.5V
Min Operating Voltage VOPL 1.0 — — V VOL ≤ 0.4V, RL = 470KΩ
[WDT]
WDT Monitor Time twH 7.0 10.0 20.0 ms CCTW = 0.01µF *2
WDT Reset Time twL 2.4 3.3 7.0 ms CCTW = 0.01µF *3
Clock Input Pulse Width tWCLK 500 — — ns
CLK High Threshold
VCLKH VDD × 0.8 — VDD V
Voltage
CLK Low Threshold Voltage VCLKL 0 — VDD × 0.3 V
INH High Threshold Voltage VINHH VDD × 0.8 — VDD V
INH Low Threshold Voltage VINHL 0 — VDD × 0.3 V
CTW Charge Current ICTWC 0.25 0.50 0.75 µA VCTW = 0.2V
CTW Discharge Current ICTWO 0.75 1.50 2.00 µA VCTW = 0.8V
*1 tPLH can be varied by changing the CT capacitance value.
tPLH (s)  0.69 × Rrst (MΩ) × CCT (µF) Rrst = 10 MΩ (Typ)
*2 twH can be varied by changing the CTW capacitance value.
twH (s)  (0.5 × CCTW (µF))/ICTWC (µA) ICTWC = 0.5 µA(Typ)
*3 twL can be varied by changing the CTW capacitance value.
twL (s)  (0.5 × CCTW (µF))/ICTWO (µA) ICTWO = 1.5 µA(Typ)

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Typical Performance Curves

(Unless otherwise specified, Ta = 25°C) : 4.1V Detection

12 10
RESET VOLTAGE: VRESET [V] .

10

CIRCUIT CURRENT: IDD [μA]

8
Ta=105°C

8
6

6 Ta=25°C

4
4 Ta=-40°C

2
2

0 0
0 2 4 6 8 10 0 2 4 6 8 10
SUPPLY VOLTAGE: VDD [V] SUPPLY VOLTAGE: VDD [V]

Figure 3. Detection Voltage Figure 4. Total Supply Current

400 2

350
1.5
CTW PIN CURRENT: ICTW [μA]
CT PIN CURRENT: ICT [μA] .

300
1
250

200 0.5

150
0

100
-0.5
50

0 -1
0 1 2 3 4 5 0 1 2 3 4 5
CTW PIN VOLTAGE: VCTW [V]
SUPPLY VOLTAGE: VDD [V]
Figure 5. Delay Pin Current vs Power Supply Voltage Figure 6. CTW Charge Discharge Current

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Typical Performance Curves – continued

(Unless otherwise specified, Ta = 25°C) : 4.1V Detection

2 10000

OUTPUT DELAY TIME: TPLH [ms] .

RESET CURRENT: IRESET [mA]

Ta=105°C
1.5 1000

1 100
Ta=25°C

Ta=-40°C
0.5 10

0 1
0 2 4 6 8 10 0.0001 0.001 0.01 0.1

RESET VOLTAGE: VRESET [V] CT PIN CAPACITY: CT [μF]

Figure 7. Output Current Figure 8. T RESET Transmission

Delay Time vs Capacitance

10000 5
DETECTION VOLTAGE: VDET [V]

4.75
WDT RESET TIME: Tw [ms]

1000

4.5
100 Moniter Time L→H

4.25

10
Reset Time
4
H→L
1
3.75

0.1 3.5
0.001 0.01 0.1 1 10 -40 0 40 80
CTW PIN CAPACITY: CTW [μF] AMBIENT TEMPERATURE: Ta [℃]

Figure 9. WDT Time vs Capacitance Figure 10. Detection Voltage vs Temperature

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Typical Performance Curves – continued

(Unless otherwise specified, Ta = 25°C) : 4.1V Detection

1 13

OUTPUT DELAY RESISTANCE: Rrst [MΩ]

OPERATING VOLTAGE: VOPL [V]

12
0.75

11

0.5

10

0.25
9

0 8
-40 0 40 80 -40 0 40 80
AMBIENT TEMPERATURE: Ta [℃] AMBIENT TEMPERATURE: Ta [℃]

Figure 11. Operating Marginal Voltage Figure 12. CT Pin Circuit Resistance
vs Temperature vs Temperature

10 15
OUTPUT DELAY TIME: TPLH [ms]

12
WDT RESET TIME: Tw [ms]

8 9

7 6

6 3

5 0
-40 0 40 80 -40 0 40 80
AMBIENT TEMPERATURE: Ta [℃] AMBIENT TEMPERATURE: Ta [℃]
Figure 13. RESET Transmission Delay Time Figure 14. WDT Time vs Temperature
vs Temperature

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Timing Chart
VDETH
VDD
VDET VDETH=VDET+Vrhys
WDT circuit turns off when INH is low
0
INH
(BD37AxxFVM／BD99A41F)
0
WDT circuit turns off when INH is high
INH
(BD87AxxFVM)
0
CLK

0
*4 tWCLK tWCLK

VCT VCTH

0
VthH
VCTW
VthL
0
*2
*1 *3
TWH TWL
TPLH
RESET

0 ④⑤ ⑥
①② ③ ④ ⑤ ⑦ ⑦ ④ ⑤⑧ ⑨ ④ ⑤⑩ ②③ ④ ⑤ ⑩ ②③ ④ ⑤⑩ ⑪

Figure 15. Timing Chart

Explanation
① The RESET pin voltage (RESET) switches to low when the power supply voltage (VDD) falls to 0.8 V.

② The external capacitor connected to the CT pin begins to charge when VDD rises above the reset detection voltage
(VDETH). The RESET signal stays low until VDD reaches the VDETH voltage and switches to high when VDD reaches or
exceeds the VDETH voltage. The RESET transmission delay time tPLH allowed to elapse before RESET switches from
low to high is given by the following equation:
tPLH (s)  0.69 × Rrst(MΩ) × CCT (µF)   [1]
Rrst denotes the IC's built-in resistance and is designed to be 10 MΩ (Typ). CCT denotes the external capacitor
connected to the CT pin.

③ The external capacitor connected to the CTW pin begins to charge when RESET rises, triggering the watchdog timer.

④ The CTW pin state switches from charge to discharge when the CTW pin voltage (VCTW ) reaches VthH, and RESET
switches from high to low. The watchdog timer monitor time tWH is given by the following equation:
tWH (s)  (0.5 × CCTW (µF))/(ICTWC(µA))   [2]
ICTWC denotes the CTW charge current and is designed to be 0.50 µA (Typ). CCTW denotes the external capacitor
connected to the CTW pin.

⑤ The CTW pin state switches from charge to discharge when VCTW reaches VthL, and RESET switches from low to
high. The watchdog timer reset time tWL is given by the following equation:
tWL (s)  (0.5 × CCTW (µF))/(ICTWO(µA))   [3]
ICTWO denotes the CTW discharge current and is designed to be 1.50 µA (Typ).

⑥ The CTW pin state may not switch from charge to discharge when the CLK input pulse width tWCLK is short. Use a
tWCLK input pulse width of at least 500 ns.
tWCLK ≥ 500 ns (Min)   [4]

⑦ When a pulse (positive edge trigger) of at least 500 ns is input to the CLK pin while the CTW pin is charging, the CTW
state switches from charge to discharge. Once it discharges to VthL, it will charge again.

⑧ Watchdog timer operation is forced off when the INH pin switches to low (L: BD37Axx Series. BD99A41F, H:
BD87AxxSeries). At that time, only the watchdog timer is turned off. Reset detection is performed normally.

⑨ The watchdog timer function turns on when the INH pin switches to high(H: BD37Axx Series. BD99A41F, L:
BD87AxxSeries). The external capacitor connected to the CTW pin begins to charge at that time.

⑩ RESET switches from high to low when VDD falls to the RESET detection voltage (VDET) or lower.

⑪ When VDD falls to 0 V, the RESET signal stays low until VDD reaches 0.8 V.

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Power Dissipation

MSOP8 SOP8
800 800

When mounted on a glass epoxy board When mounted on a glass epoxy board
(70 mm  70 mm  1.6mm) ja = 212.8 (°C /W) (70 mm  70 mm  1.6mm) ja = 181.8 (°C /W)
POWER DISSIPATION: Pd [mW]

POWER DISSIPATION: Pd [mW]

600 600

550mW
470mW

400 400

200 200

105°C 105°C

0 0
0 25 50 75 100 125 0 25 50 75 100 125

AMBIENT TEMPERATURE: Ta [°C] AMBIENT TEMPERATURE: Ta [°C]

Figure 16. Power Dissipation

I/O Equivalence Circuit

CLK INH CT

VDD VDD VDD

VDD

10MΩ(Typ)

INH CT
CLK

CTW RESET

VDD VDD

RESET

CTW

Figure 17. I/O equivalence circuit

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External Settings for Pins and Precautions

1. Connect a capacitor (0.001 µF to 1,000 µF) between the VDD and GND pins when the power line impedance is high.
Use of the IC when the power line impedance is high may result in oscillation.

2. External capacitance
A capacitor must be connected to the CTW pin. When using a large capacitor such as 1 µF, the INH pin must allow a
CTW discharge time of at least 2 ms. The power-on reset (RESET Transmission Delay) time is given by equation [1]
on page 8. The WDT time is given by equations [2] and [3] on page 8. The setting times are proportional to the
capacitance value from the equations, so the maximum and minimum setting times can be calculated from the
electrical characteristics according to the capacitance. Note however that the electrical characteristics do not include
the external capacitor's temperature characteristics.

Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor Transistor (NPN)
Pin A Pin B B Pin B
C
Pin A E

P B C
P+ P+ P+ N P P+
N N N N Parasitic N N N
E
Elements
Parasitic
P Substrate P Substrate
Elements
GND GND GND GND
Parasitic Parasitic N Region
Elements Elements close-by
Figure 18. Example of monolithic IC structure

12. Applications or inspection processes with modes where the potentials of the VDD pin and other pins may be reversed
from their normal states may cause damage to the IC’s internal circuitry or elements. Use an output pin capacitance
of 1000 µF or lower in case VDD is shorted with the GND pin while the external capacitor is charged. It is
recommended to insert a diode for preventing back current flow in series with VDD or bypass diodes between VDD
and each pin.

Back current prevention diode

Bypass diode

VDD Pin

Figure 19.

13. When VDD falls below the operating marginal voltage, output will be open. When output is being pulled up to input,
output will be equivalent to VDD.

14. Regarding the CLK and INH pins

The CLK and INH pins comprise inverter gates and should not be left open. (These pins should be either pulled up or
down.) Input to the CLK pin is detected using a positive edge trigger and does not affect the CLK signal duty. Input
the trigger to the CLK pin within the tWH time.

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Physical Dimension, Tape and Reel Information

Package Name MSOP8

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Physical Dimension, Tape and Reel Information – continued

Package Name SOP8

(Max 5.35 (include.BURR))

(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1

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Marking Diagrams

MSOP8(TOP VIEW) SOP8(TOP VIEW)

Part Number Marking Part Number Marking

LOT Number LOT Number

1PIN MARK 1PIN MARK

Part Number Marking Package Part Number

D3719 MSOP8 Reel of 3000 BD37A19FVM-TR
D3741 MSOP8 Reel of 3000 BD37A41FVM-TR
D8728 MSOP8 Reel of 3000 BD87A28FVM-TR
D8729 MSOP8 Reel of 3000 BD87A29FVM-TR
D8734 MSOP8 Reel of 3000 BD87A34FVM-TR
D8741 MSOP8 Reel of 3000 BD87A41FVM-TR
99A41 SOP8 Reel of 2500 BD99A41F-E2

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© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0G1G0AN00130-1-2
14/15
TSZ22111・15・001 05.Jul.2018 Rev.004
BD37Axx Series BD87Axx Series BD99A41F Datasheet

Revision History
Date Revision Changes
12.Apr.2013 001 New Release
P.8 Explanation ⑨ modified.
25.Apr.2013 002
P.9 Figure 17. I/O equivalence circuit the error in writing of the part of CLK was corrected.
05.Sep.2014 003 Applied the ROHM Standard Style
P.6 Unit of Figure 9. modified.
P.8 Explanation ②, ④ and ⑤ added unit.
05.Jul.2018 004 Explanation ⑥ added number of the expression.
P.9 I/O Equivalence Circuit modified.
P.10 External Settings for Pins and Precautions 2. modified.

www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0G1G0AN00130-1-2
15/15
TSZ22111・15・001 05.Jul.2018 Rev.004
 Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
 Datasheet

General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.

Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.