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Device Names and Package Designators for Logic Integrated Circuits
Given below is the standard naming of logic devices:
1. Standard Prefix – Vendor Name
AD Analog Devices MC Motorola
AM Advanced Micro Devices MN Micro Networks
AT Atmel MT Micron Technology
bq Benchmarq NDS National Semiconductor
CA RCA (analog) NE Signetics
CD RCA (digital) NEC NEC
CLC Comlinear Corp. OKI Oki Data
CS Crystal Semiconductor MC ON Semiconductor [Motorola]
CS Cherry Semiconductor PI Pericom
CY Cypress Semiconductor PM PMI "Analog Devices"
DG Siliconix PWM Siliconix
DS Dallas Semiconductor QL Quick Logic
DM National Semiconductor (digital) QSI Quality Semiconductor
EDI Electronic Designs Inc, EDI SA Signetics
EL Elantec SD SGS Thomson
EP Altera (Classic series) SE Signetics
EPC Altera (EPROM) SEC Samsung Electronics
EPF Altera (Flex series) SG Silicon General
EPM Altera (MAX series) SI Siliconix
GM Goldstar SN Texas Instruments, TI (Standard)
HA Hitachi (analog) SNJ Texas Instruments, TI (MIL/QML
HAT Hitachi Qualified)
HD Hitachi (digital) SPT Signal Processing Technologies,
HI Harris SPT
HM Harris Microwave SSD Samsung Electronics
HM Hitachi SU Signetics
HY Hyundai SY Synergy Semiconductor
HYB Siemens TA Toshiba
IDT Integrated Devices Technology, IDT TC Toshiba
IRF International Rectifier TD Pro-Electronics
IP Integrated Power TL Texas Instruments (analog, Linear)
IT Micron TMS Texas Instruments
HI Intersil [Harris] X Xicor
LGS Goldstar XC Xilinx
LM National XR Exar Corp.
M Mitsubishi UA Fairchild
MACH Vantis (MACH, PLD) UC Unitrode integrated circuits
MAX Maxim Z Zilog
MB Fujitsu ZD Zeltex
2. Temperature Range
54 − Military
74 − Commercial
3. Family
Blank – Transistor-Transistor Logic (TTL)
ABT − Advanced BiCMOS Technology
ABTE/ETL − Advanced BiCMOS Technology/Enhanced Transceiver Logic
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AC/ACT − Advanced CMOS Logic
AHC/AHCT − Advanced High-Speed CMOS Logic
ALB − Advanced Low-Voltage BiCMOS
ALS − Advanced Low-Power Schottky Logic
ALVC − Advanced Low-Voltage CMOS Technology
ALVT − Advanced Low-Voltage BiCMOS Technology
AS − Advanced Schottky Logic
AUC − Advanced Ultra-Low-Voltage CMOS Logic
AUP − Advanced Ultra-Low-Power CMOS Logic
AVC − Advanced Very Low-Voltage CMOS Logic
BCT − BiCMOS Bus-Interface Technology
CB3Q − 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus-Switch Crossbar Technology Logic
CB3T − 2.5-V/3.3-V Low-Voltage Translator Bus-Switch Crossbar Technology Logic
CBT − Crossbar Technology
CBT-C − 5-V Bus-Switch Crossbar Technology Logic With −2-V Undershoot Protection
CBTLV − Low-Voltage Crossbar Technology Logic F − F Logic
FB − Backplane Transceiver Logic/Futurebus+
GTL − Gunning Transceiver Logic
GTLP − Gunning Transceiver Logic Plus
HC/HCT − High-Speed CMOS Logic
HSTL − High-Speed Transceiver Logic
LS − Low-Power Schottky Logic
LV-A − Low-Voltage CMOS Technology
LV-AT − Low-Voltage CMOS Technology – TTL Compatible
LVC − Low-Voltage CMOS Technology
LVT − Low-Voltage BiCMOS Technology
PCA/PCF − I2C Inter-Integrated Circuit Applications
S − Schottky Logic
SSTL − Stub Series-Terminated Logic
SSTU − Stub Series-Terminated Ultra-Low-Voltage Logic
SSTV/SSTVF − Stub Series-Terminate Low-Voltage Logic
TVC − Translation Voltage Clamp Logic
VME − VERSAmodule Eurocard Bus Technology
4. Special Features
Blank = No Special Features
C − Configurable VCC (LVCC)
D − Level-Shifting Diode (CBTD)
H − Bus Hold (ALVCH) Circuitry (CBTK)
K − Undershoot-Protection Ports (LVCR)
R − Damping Resistor on Both Output
S − Schottky Clamping Diode (CBTS)
Z − Power-Up 3-State (LVCZ)
5. Bit Width
Blank = Gates, MSI, and Octals
1G − Single Gate
2G − Dual Gate
3G − Triple Gate
8 − Octal IEEE 1149.1 (JTAG)
16 − Widebus (16-, 18- and 20-bit)
18 − Widebus IEEE 1149.1 (JTAG)
32 − Widebus+ (32- and 36-bit)
6. Options
Blank = No Options Output Port
2 − Series Damping Resistor on One
4 − Level Shifter
25 − 25-Ω Line Driver
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7. Function
244 − Noninverting Buffer/Driver
374 − D-Type Flip-Flop
573 − D-Type Transparent Latch
640 − Inverting Transceiver
8. Device Revision
Blank = No Revision
Letter Designator A−Z
9. Packages
Commercial: D, DW − Small-Outline Integrated Circuit (SOIC)
DB, DBQ, DCT, DL − Shrink Small-Outline Package (SSOP)
DBB, DGV − Thin Very Small-Outline Package (TVSOP)
DBQ − Quarter-Size Small-Outline Package (QSOP)
DBV, DCK, DCY, PK − Small-Outline Transistor (SOT)
DCU − Very Thin Shrink Small-Outline Package (VSSOP)
DGG, PW − Thin Shrink Small-Outline Package (TSSOP)
FN − Plastic Leaded Chip Carrier (PLCC)
GGM, GKE, GKF, ZKE, ZKF − MicroStar BGATM Low-Profile Fine-
Pitch Ball Grid Array (LFBGA)
GQL, GQN, ZQL, ZQN, ZXU, ZXY − MicroStar JunioTM Very-Thin-
Profile Fine-Pitch Ball Grid Array (VFBGA)
N, NT, P − Plastic Dual-In-Line Package (PDIP)
NS, PS − Small-Outline Package (SOP)
PAG, PAH, PCA, PCB, PM, PN, PZ − Thin Quad Flatpack (TQFP)
PH, PQ, RC − Quad Flatpack (QFP)
PZA Low-Profile Quad Flatpack (LQFP)
RGQ, RGY, DRY, RSE, RSW, DRJ, DRC, RGE − Quad Flatpack No
Lead (QFN)
YZP − NanoStarTM and NanoFreeTM Die-Size Ball Grid Array (DSBGA†)
Military: FK − Leadless Ceramic Chip Carrier (LCCC)
GB − Ceramic Pin Grid Array (CPGA)
HFP, HS, HT, HV − Ceramic Quad Flatpack (CQFP)
J, JT − Ceramic Dual-In-Line Package (CDIP)
W, WA, WD − Ceramic Flatpack (CFP)
10. Tape and Reel
R − Tape and reel packing (standard reel quantities)
T − Tape and reel packing (short reel, 250 units)
11. RoHS and Green Status
E_ – Conforms to JEDEC JESD97 E-Category specification for Pb - free and reduced environmentally
unfriendly substances
G_ – Additional reductions in environmentally unfriendly substances (Sb and Br) in addition to E_
reductions
Logic Family Details
1. 74AC: A high-speed CMOS logic family with CMOS input switching levels and buffered CMOS outputs
that can drive +/- 24mA of IOH and IOL.
2. 74ACT: A high-speed CMOS logic family with the same buffered CMOS outputs that can drive +/-
24mA of IOH and IOL. This family has a TTL-to-CMOS input buffer stage. The inputs will interface with
TTL outputs operating at 5 volts with VOH = 2.4 volts and VOL = 0.4 volts. The devices have the same
output buffered structures as the AC family.
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3. 74LCX: These devices have a mixed 3volt-to-5 volt capability for use with applications that have both 3
volt and 5-volt devices which interface with one another.
4. 74LVX: This family consists of low-cost devices with 5-volt tolerant inputs. The devices can receive
and output 3 volts or 5 volts.
5. 74LVQ: This family consists of low-cost devices designed for 3.3 volt only applications.
6. 74LVT: This family has both high speed and a high output drive. These devices have a +64mA / -
32mA output drive currents. The chips are 5-volt tolerant and are designed to be used with
applications that have both 3v and 5v devices that interface with one another.
7. 74ALCX: These devices are about the same as the LVT family without the high drive currents.
8. 74xx: The first TTL family developed. The 74xx family offers a wide variety of logic functions. There
are a number of other TTL logic families that offer either higher speed or lower power.
9. 74Lxx: This is the Low power version of the TTL family above. The value of the internal device
resistors have been increased by a factor of 10x. The family offers 1/10 the power consumption as the
previous family but operates at 1/3 the speed.
10. 74LSxx: Devices add a Schottky diode between the Base and Collector of the transistor. The Schottky
diode prevents the transistor from going into full saturation. So the 74LS family operates at the same
speed as the 74 family [10nS] with only 2mW of power dissipation compared to 10mW for 74xx or
1mW for the 74L family [at 33nS].
11. 74Sxx: Gains its speed using the same Schottky diode as the 74LS family, but the value of the internal
device resistors have been decreased by half the original values of the 74xx family. So the speed
increases [3nS], and the power consumption also increases [20mW].
12. 74ALSxx: The advanced LS family offers near the same high speed as the 74Sxx family at 4nS at a
power dissipation of the only 1mW. Except for the 74Sxx family, the 74ALS family outperforms the
other three TTL families listed. If the design calls for a TTL family which needs to operate at 3nS, this
is the family to use.
13. 74ASxx: If the design needs to operate faster than 3nS then the 74AS family should be used. This
family is twice as fast as the 74ALS family, with a propagation delay of only 1.5nS. The price is a 7mW
power dissipation.
Datasheets
A datasheet is a technical literature that contains important information regarding a certain electrical or
electronic component. During its early stages, datasheets provide the specifications the designer works
from or wants the device to achieve. Datasheets focus on electrical properties and the pin functions of the
device; usually, the inner workings of the device are not discussed. Alongside the datasheet, these
components normally come with “Application Notes” that deal with how to use the device on certain
applications. However, datasheets are invariably covered with legal disclaimers regarding the accuracy,
permanency, and utility of the document.
It is good to read the datasheet of a certain device before starting to use it in a certain design. The
important parts of most general datasheets are given and described below.
Parts of a Datasheet
1. The official name of the part or series, part numbers, part number variations, and manufacturer release
date of the datasheet. From the example shown in Figure 1, the device name is LM555 Timer,
released in February 2000, manufactured by National Semiconductor.
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2. General Description, Features, and Applications, pertain to the device's characteristics, summary of its
summarized features and applications. The ordering information, types of available packages, or the
schematic or wiring diagram sometimes follow these sections. (See Figures 1, 2a, and 2b.)
Figure 1
Figure 2a
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Figure 2b
3. The absolute maximum ratings section indicates the maximum voltage, current, power, and
temperature parameters for the device. Maximum ratings are values beyond which damage
can occur, and reliability may be affected. (See Figure 3)
Figure 3
4. The electrical characteristics section details the important device parameters by providing the
minimum and maximum values under certain test conditions and provides device tolerance.
The DC electrical characteristics discuss large-signal boundaries (voltage, current, etc.) while
the AC electrical characteristics concern the different time-dependent parameters (e.g.,
capacitance, propagation delay, etc.). (See Figure 4)
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Figure 4
5. Pin diagram details the device's package outline from a certain point of view, normally from the
top or bottom. The pin assignments and names are also seen in this part, and its functions are
also described. Also, the block diagram, for complex devices, may be given. (See Figure 5)
Figure 5
6. Waveforms of typical performance characteristics of the device are also part of the datasheet.
Normally, timing diagrams are given here. The frequency, voltage, current, and power
characteristics are also given, especially for devices of the same family differing only on the
range of operation. (See Figure 6)
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Figure 6
7. Sample circuits for certain devices are sometimes given. These put emphasis on the “special
behavior” that the device exhibits when accompanied by certain passive components. Each
sample circuit may also contain formulas and explanation on why a certain component must
be chosen. (See Figure 7)
Figure 7
8. Mechanical drawing and footprints are the last piece of essential information a datasheet
includes. This will be a drawing of the physical form of the device, with measurements
specified in metric and American units.
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Figure 8
References:
http://www.ti.com/lit/sg/sdyu001z/sdyu001z.pdf
http://www.interfacebus.com/Design_Logic_Family_Selection.html
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