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Final Datasheet V1.0: TPM Sensor SP30T

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0% found this document useful (0 votes)
47 views13 pages

Final Datasheet V1.0: TPM Sensor SP30T

Uploaded by

marcos
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Final Datasheet V1.

0 TS
Rev.
1378
2
Page 1
SensoNor TPM Sensor SP30T of 13

Final Datasheet V1.0


Tire Pressure Monitoring Sensor SP30T

Revisions dates:
00 2007-06-11
1 2007-12-20
2 2008-05-29

Document history: See end of document


Stamp
Date Sign Rev Reference Date Dok
Prepared 070611 ML 0 Archive 11843 070813 HKW
Checked 070613 NPH 1 EM 11866 080616 HKW
Approved 070716 RH 2 EM 12044 080616
Final Datasheet V1.0 TS
Rev.
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SensoNor TPM Sensor SP30T of 13

Table of Contents
1 PRODUCT DESCRIPTION.......................................................................................................................................4
1.1 Overview...........................................................................................................................................................4
1.2 Features ...........................................................................................................................................................4
1.3 Ordering Information ........................................................................................................................................4
2 PRODUCT CHARACTERISTICS.............................................................................................................................5
2.1 Measurement Performance..............................................................................................................................5
2.1.1 Pressure Measurement................................................................................................................................5
2.1.2 Acceleration Measurement ..........................................................................................................................6
2.1.3 Temperature Measurement .........................................................................................................................6
2.1.4 Supply Voltage Measurement......................................................................................................................6
2.2 Current Consumption .......................................................................................................................................7
2.3 Tmax.................................................................................................................................................................7
2.4 Vmin .................................................................................................................................................................7
2.5 Clock Sources ..................................................................................................................................................8
2.5.1 System Clock (MCLK)..................................................................................................................................8
2.5.2 Low Power (LP) Oscillator ...........................................................................................................................8
2.5.3 External Clock ..............................................................................................................................................8
2.6 LF Input ............................................................................................................................................................8
2.7 Power-on Reset................................................................................................................................................9
2.8 Digital I/O..........................................................................................................................................................9
3 OPERATING RANGE...............................................................................................................................................9
4 ABSOLUTE MAXIMUM RATINGS ........................................................................................................................10
5 PHYSICAL DIMENSIONS ......................................................................................................................................11
6 PIN CONFIGURATION...........................................................................................................................................12
7 DOCUMENT HISTORY ..........................................................................................................................................13
Final Datasheet V1.0 TS
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Edition 2008-05-29
Published by Infineon Technologies AG,
Am Campeon 1-12
85579 Neubiberg, Germany
© Infineon Technologies AG 2006-03-20.
All Rights Reserved.
Attention please!

The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.

Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or the Infineon Technologies Companies and our Infineon Technologies
Representatives worldwide (www.infineon.com).

Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
Final Datasheet V1.0 TS
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1 Product Description

1.1 Overview
The SP30T Tire Pressure Monitoring (TPM) Sensor represents Infineon’s high pressure range TPM sensor for SUV
and Truck application. The SP30T combines a high pressure range with a high level of integration by including a
microcontroller and LF-input stage to meet market demands for flexible, customer specific solutions and overall
system cost reduction.

The sensor design is based upon Infineon’s proprietary and patented solutions for high reliability measurements in
harsh automotive environments, with a predictable and stable quality in high volume applications.

The SP30T measures pressures up to 1600kPa, temperature, supply voltage and acceleration (optional), and by
integrating these functions with an ASIC in one package, Infineon has developed the ideal product for high pressure
TPM applications.

1.2 Features
• Integrated Sensors
o High pressure range
o Acceleration
o Temperature
o Voltage
• Integrated Peripherals
o Microcontroller
o On board EEPROM
o GPIOs
o ADC for signal conditioning
o 2x LF Receiver for triggering
• Measurement Ranges
o Pressure Sensor 100 to 1600 kPa
o Temperature Sensor -40 to +125°C
o Supply Voltage Sensor 2.1 to 3.6 V
o Acceleration Sensor -12 to 115 g

1.3 Ordering Information

Product Name Product Type Ordering Code Package


SP30T-00E00-06B Tire Pressure Monitoring Sensor SP000411794 P-DSOSP-14-6
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2 Product Characteristics
The max and min numbers are to be understood as + and – 5σ values (Cpk = 1.67) unless otherwise specified.

2.1 Measurement Performance

2.1.1 Pressure Measurement


The presented performance reflects the use of 11-bit measurement of pressure signal and 10-bit measurement of
temperature.

Table 1 Pressure measurement specifications


SPECIFICATION AMBIENT CONDITIONS
PARAMETER COMMENTS
Min Typ Max Unit Temp [°C] VDD [V] Pressure [kPa]
Input pressure range* 100 1600 kPa -40 to 125 2.1 to 3.6
Measurement error -25 25 kPa 0 to 50 2.1 to 3.6 100 to1000 Linear behavior
between 1000
-30 30 kPa -40 to 125 2.1 to 3.6 kPa and 1600
-45 45 kPa 0 to 50 2.1 to 3.6 1000 to1600 kPa according to
-50 50 kPa -40 to 125 2.1 to 3.6 Figure 1

Table 2 Pressures 100, 375, 657, 1000, 1300, 1600 kPa verified in qualification

LSL @ -40 --> 125°C


USL @ -40 --> 125°C SP30T Pressure Specification
LSL @ 0 --> 50°C
USL @ 55
0 --> 50°C
45

35
25
Measurement error [kPa]

15

-5100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600
-15
-25
-35

-45
-55
Input Pressure [kPa]

Figure 1: Pressure measurement error


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2.1.2 Acceleration Measurement


The presented performance reflects the use of 12-bit measurement of acceleration signal and 10-bit measurement for
temperature.

Table 2 Acceleration measurement specifications


SPECIFICATION AMBIENT CONDITIONS
PARAMETER COMMENTS
Min Typ Max Unit Temp [°C] VDD [V]
Input acceleration range -12 115 g -40 to 125 2.1 to 3.6
Sensitivity error -18.75 18.75 % -40 to 90 2.1 to 3.6
-24 24 90 to 125
Offset error@9g -6 6 g -20 to 70 2.1 to 3.6
-8.5 8.5 -40 to 90
-12 12 90 to 125

2.1.3 Temperature Measurement


The presented performance reflects the use of 10-bit measurement of temperature.

Table 3 Temperature measurement specifications


SPECIFICATION AMBIENT CONDITIONS
PARAMETER COMMENTS
Min Typ Max Unit Temp [°C] VDD [V]
Measurement error -3 3 °C -20 to 70 2.1 to 3.6
-5 5 °C -40 to 90 2.1 to 3.6
-3 7 °C 90 to 125 2.1 to 3.6

2.1.4 Supply Voltage Measurement


The presented performance reflects the use of 9-bit measurement of supply voltage.

Table 4 Supply voltage measurement specifications


SPECIFICATION AMBIENT CONDITIONS
PARAMETER COMMENTS
Min Typ Max Unit TEMP [°C] VDD [V]
Measurement error -100 +100 mV -40 to 125 VTHR to 3.6
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2.2 Current Consumption

Table 5 Current consumption


SPECIFICATION AMBIENT CONDITIONS
PARAMETER COMMENTS
Min Typ Max Unit Temp [°C] VDD [V]
Power down current 0.4 0.6 µA 25 3.0
Power down current 13 20 µA 125 3.0
IDLE current 30 50 µA 25 3.0
IDLE current 50 75 µA 125 3.0
RUN current 0.53 0.8 mA 25 3.0
RUN current 0.65 1.0 mA 125 3.0
Pressure measurement 4 12 µAs -40 to 125 2.1 to 3.6 11 bit A/D conversion,
excl. temperature meas
Acceleration measurement 6 16 µAs -40 to 125 2.1 to 3.6 12 bit A/D conversion,
excl. temperature meas
Temperature measurement 0.9 2.5 µAs -40 to 125 2.1 to 3.6 10 bit A/D conversion
Supply voltage measurement 0.3 2.5 µAs -40 to 125 2.1 to 3.6 9 bit A/D conversion
Peak current 1.6 2.5 mA 25 3.0 Pressure measurement
and 1 LF channel on,
duration is 1280µs for
11 bit measurement for
the peak current only.
1 channel LF current 2.6 4.6 µA 25 3.0
1 channel LF current 3.0 6.7 µA 125 3.0
nd
2 channel LF current 4.5 5.5 µA 25 3.0 2 LF channel is
optional
nd
2 channel LF current 6.5 11 µA 125 3.0 2 LF channel is
optional
Thermal shutdown current 18 25 µA 125 3.0
Thermal shutdown current 30 50 µA 150 3.0

2.3 Tmax
ϑSHTD represents the temperature at which the Thermal Shut-down function can be enabled and ϑREL represents the
temperature at which the Master Reset state is released. The ϑSHTD is always higher than ϑREL.

Table 6 Trigger temperatures for thermal shutdown


SPECIFICATION AMBIENT CONDITIONS
PARAMETER COMMENTS
Min Typ Max Unit TEMP [°C] VDD [V]
ϑSHTD 102 123 °C -40 to 175 2.1 to 3.6 Thermal shutdown enable
ϑREL 100 121 °C -40 to 175 2.1 to 3.6 Master Reset release

2.4 Vmin
The voltage at which the Vmin-circuit will return a low battery voltage status is specified in Table :

Table 7 Vmin specifications


SPECIFICATION AMBIENT CONDITIONS
PARAMETER COMMENTS
Min Typ Max Unit TEMP [°C] VDD [V]
Vmin 2.0 2.1 2.2 V -40 to 125 VTHR to 3.6
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2.5 Clock Sources

2.5.1 System Clock (MCLK)

Table 8 System clock (MCLK) specifications


SPECIFICATION AMBIENT CONDITIONS
PARAMETER COMMENTS
Min Typ Max Unit TEMP [°C] VDD [V]
MCLK frequency 1.8 2.0 2.2 MHz -40 to 125 2.1 3.6

2.5.2 Low Power (LP) Oscillator

Table 9 LP oscillator specifications


SPECIFICATION AMBIENT CONDITIONS
PARAMETER COMMENTS
Min Typ Max Unit TEMP [°C] VDD [V]
Tit 0.5, 1.0, 2.0 or 4.0 s -40 to 125 2.1 to 3.6 Interval timer main tick
del2t 25, 50, 75 or 100 ms -40 to 125 2.1 to 3.6 Delay to extra tick
LP oscillator accuracy -20 20 % -40 to 125 2.1 to 3.6

2.5.3 External Clock

Table 10 External clock specifications


SPECIFICATION AMBIENT CONDITIONS
PARAMETER COMMENTS
Min Typ Max Unit TEMP [°C] VDD [V]
External clock 3.5 MHz -40 to 125 2.1 to 3.6

2.6 LF Input

Table 11 LF telegram
SPECIFICATION AMBIENT CONDITIONS
PARAMETER COMMENTS
Min Typ Max Unit TEMP [°C] VDD [V]
Modulation ASK -40 to 125 2.1 to 3.6
Carrier frequency 121.25 125 128.75 kHz -40 to 125 2.1 to 3.6
Preamble period 4 ms -40 to 125 2.1 to 3.6
Data rate 3.84 3.9 3.96 kHz -40 to 125 2.1 to 3.6
Settling time 2 ms -40 to 125 2.1 to 3.6 Time from LF interface
is turned on by RISC to
the LF interface is
active
Detection threshold 5 mVp-p -40 to 125 2.1 to 3.6
Input capacitance 10 12 pF -40 to 125 2.1 to 3.6
Input resistance 500 kΩ -40 to 125 2.1 to 3.6
Other The input signals from the enabled LF channels are rectified and real time summed
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Table 12 LF Carrier Detection


SPECIFICATION AMBIENT CONDITIONS
PARAMETER COMMENTS
Min Typ Max Unit TEMP [°C] VDD [V]
Carrier frequency 121.25 125 128.75 kHz -40 to 125 2.1 to 3.6
Maximum sensitivity not to 4 mVp-p 0 to 90 2.1 to 3.6
detect, 2 amplifiers 3.5 mVp-p 90 to 125 2.1 to 3.6
enabled 3.5 mVp-p -40 to 0 2.1 to 3.0
2.9 mVp-p -40 to 0 3.0 to 3.6
Minimum sensitivity to 10 mVp-p 0 to 90 2.1 to 3.6
detect, 2 amplifiers 12.2 mVp-p 90 to 125 2.1 to 3.6
enabled 12.2 mVp-p -40 to 0 2.1 to 3.6
Maximum sensitivity not to 0.8 mVp-p -40 3.6
detect, 3 amplifiers 0.25 mVp-p -40 2.1 to 3.0
enabled 0.25 mVp-p 0 to 125 2.1 to 3.6
Minimum sensitivity to 2.5 mVp-p -40 to 125 2.1 to 3.6
detect, 3 amplifiers
enabled

2.7 Power-on Reset

Table 13 Power-on reset level


SPECIFICATION
PARAMETER COMMENTS
Min Typ Max Unit
Power-on reset level, VTHR 1.8 1.85 1.9 V

2.8 Digital I/O

Table 14 Digital I/O specifications


SPECIFICATION
PARAMETER COMMENTS
Min Typ Max Unit
Digital output high VDD-0.3 V At 1 mA load current
Digital output low 0.3 V At 1 mA load current
Digital input high 0.8⋅VDD V
Digital input low 0.2⋅VDD V
Input current ±1 µA

3 Operating Range
Table 15 Operating range
SPECIFICATION
PARAMETER COMMENTS
Min Typ Max Unit
Supply voltage VTHR 3.6 V Unless otherwise specified
Ambient temperature -40 125 °C
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4 Absolute Maximum Ratings


Table 16 Absolute maximum ratings
SPECIFICATION
PARAMETER COMMENTS
Min Typ Max Unit
Ambient temperature, operating -40 150 °C Max 24 h accumulated over life time
Ambient temperature, storage -40 150 °C Max 1000 h
1
Transient temperature 175 °C Max 3 min
Supply Voltage -0.3 4.0 V
Input voltage -0.3 Vdd+0.3 V
Input current, any pin (DC) -10 10 mA
Input current, any pin (transient) -100 100 mA
Input current, LF pins -1 1 mA
Maximum input pressure 50 2000 kPa
2500 kPa Max 2 s, 5 times over lifetime
Static acceleration 3000 g
Mechanical shock 4000 g Half sine, 0.3ms
ESD HBM 2 kV Human body model JESD22-A114
ESD CDM 750 V Charge Device Model ESD-STM5.3.1,
Corner pins
500 Charge Device Model ESD-STM5.3.1,
All other pins
Latch Up 100 mA AEC-Q100
1
Will withstand standard SnPb Eutectic reflow soldering process (JEDEC J-STD-020, J-STD-A113)

Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the device.
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5 Physical dimensions

Figure 2: Physical Dimensions – Drawing P-DSOSP-14-6 1) Dimension does not include mold flash, protrusions or
gate burrs. Mold flash, protrusions and gate burrs do not exceed 0.15mm (0.006 inch) per side. 2) Dimension does
not include inter-lead flash or protrusions. Inter-lead flash and protrusions do not exceed
0.25mm (0.010 inch) per side.
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6 Pin Configuration

Figure 3: Pin Configuration. Top view, not to scale

Table 17 Pin Description


PIN NAME FUNCTION
1 IN4 LF receiver channel 2, negative input
2 P10 General purpose I/O with external wakeup, internal pull-up/pull-down
3 P11 General purpose I/O with external wakeup, internal pull-up/pull-down
4 MSDA Monitor Serial Data I/O, internal pull-up
5 MSCL Monitor Serial Clock input
6 VDD Supply pad VDD (battery, positive terminal)
7 VSS Common ground (battery, negative terminal)
8 VSS Common ground (battery, negative terminal)
9 P17 General purpose I/O (or digital modulator output)
10 P15 General purpose I/O or external clock
11 P14 General purpose I/O (or digital modulator output)
12 IN1 LF receiver channel 1, positive input
13 IN2 LF receiver channel 1, negative input
14 IN3 LF receiver channel 2, positive input
Final Datasheet V1.0 TS
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7 Document history
Rev Paragraphs Description
00 First issue of TS1378
1 1 Disclaimer included
1 2.1.1 Pressure range extended from max 1500kPa to max 1600kPa. Measurement error
adjusted accordingly.
1 2.1.1 Footnote included displaying the Pressure values verified in qualification
1 5 Physical Drawing updated
2 1 Added section “Product Description “
2 5 Physical Drawing updated
2 5 Added wording to Figure title of figure 2
2 6 Added section “Pin Configuration”
2 Removed “Confidential” marking
2 2 Updated fig. 1

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