Residual Stress Measurement by X-Ray Diffraction For Bearing Steels
Residual Stress Measurement by X-Ray Diffraction For Bearing Steels
for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Designation: E2860 − 20
INTRODUCTION
The measurement of residual stress using X-ray diffraction (XRD) techniques has gained much
popularity in the materials testing field over the past half century and has become a mandatory test for
many production and prototype bearing components. However, measurement practices have evolved
over this time period. With each evolutionary step, it was discovered that previous assumptions were
sometimes erroneous, and as such, results obtained were less reliable than those obtained using
state-of-the-art XRD techniques. Equipment and procedures used today often reflect different periods
in this evolution; for example, systems that still use the single- and double-exposure techniques as well
as others that use more advanced multiple exposure techniques can all currently be found in
widespread use. Moreover, many assumptions made, such as negligible shear components and
non-oscillatory sin2ψ distributions, cannot safely be made for bearing materials in which the demand
for measurement accuracy is high. The use of the most current techniques is, therefore, mandatory to
achieve not only the most reliable measurement results but also to enable identification and evaluation
of potential measurement errors, thus paving the way for future developments.
3.2.2 macrostress, n—average stress acting over a region of τij = Shear stress component i, j
the test specimen containing many gains/crystals/coherent θ = Bragg angle
domains. ν = Poisson’s ratio
xMode = Mode dependent depth of penetration
3.3 Abbreviations: ψ = Angle between the specimen surface normal and the
3.3.1 ALARA—As low as reasonably achievable scattering vector, that is, normal to the diffracting plane, see
3.3.2 FWHM—Full width half maximum Fig. 1
3.3.3 LPA—Lorentz-polarization-absorption
3.3.4 MSDS—Material safety data sheet 4. Summary of Test Method
3.3.5 XEC—X-ray elastic constant 4.1 A test specimen is placed in a XRD goniometer aligned
as per Test Method E915.
3.3.6 XRD—X-ray diffraction
{hkl} 4.2 The diffraction profile is collected over three or more
3.4 Symbols: 1⁄2 S2 = X-ray elastic constant of quasi-
11ν
angles within the required angular range for a given {hkl}
isotropic material equal to E $ hkl% plane, although at least seven or more are recommended.
eff
4.3 The XRD profile data are then corrected for LPA,
3
Available from American National Standards Institute (ANSI), 25 W. 43rd St., background, and instrument-specific corrections.
4th Floor, New York, NY 10036, http://www.ansi.org.
4
Available from SAE International (SAE), 400 Commonwealth Dr., Warrendale,
4.4 The peak position/Bragg angle is determined for each
PA 15096, http://www.sae.org. XRD peak profile.
NOTE 1—Stress matrix is rotated 90° about the surface normal compared to Fig. 2 and Fig. 14.
FIG. 3 Chi Mode Diagram for Measurement in σ11 Direction
4. Post-measurement corrections may be applied to account for slope of the data, while τ13 is related to the direction and degree
possible σ33 influences (12.12). Since the σij values will remain of elliptical opening. Fig. 4 shows a simulated d versus sin2ψ
constant for a given azimuth, the s1{hkl} term is renamed C. profile for the tensor shown. Here the positive 20-MPa τ13
1 $ hkl% 1 stress results in an elliptical opening in which the positive psi
$ hkl% 5
ε φψ s
2 2
@ σ 11 sin2 ψ1σ 33 cos2 ψ # 1 2 s $2hkl% @ τ 13sin~ 2ψ ! # 1s $1hkl% @ σ 11 range opens upward and the negative psi range opens down-
ward. A higher τ13 value will cause a larger elliptical opening.
1σ 221σ 33# (3)
A negative 20-MPa τ13 stress would result in the same elliptical
$ hkl% 5
1 $ hkl% opening only the direction would be reversed with the positive
ε φψ s
2 2
@ σ 11 sin2 ψ1τ 13sin~ 2ψ ! # 1C (4)
psi range opening downwards and the negative psi range
5.3.1 The measured interplanar spacing values are con- opening upwards as shown in Fig. 5.
verted to strain using Eq 24, Eq 25, or Eq 26. Eq 4 is used to 5.4 Modified Chi Mode—Interplanar strain measurements
fit the strain versus sin2ψ data yielding the values σ11, τ13, and are performed at multiple β angles with a fixed χ offset,
C. The measurement can then be repeated for multiple phi χm (Fig. 6). Measurements at various β angles do not provide a
angles (for example 0, 45, and 90°) to determine the full constant φ angle (Fig. 7), therefore, Eq 2 cannot be simplified
stress/strain tensor. The value, σ11, will influence the overall in the same manner as for omega and chi mode.
FIG. 4 Sample d (2θ) Versus sin2ψ Dataset with σ11 = -500 MPa and τ13 = +20 MPa
FIG. 5 Sample d (2θ) Versus sin2ψ Dataset with σ11 = -500 MPa and τ13 = -20 MPa
5.4.1 Eq 2 shall be rewritten in terms of β and χm. Eq 5 and 5.4.2 Substituting φ and ψ in Eq 2 with Eq 5 and 6 (see
6 are obtained from the solution for a right-angled spherical X1.1), we get:
triangle (3).
ψ 5 arccos~ cos βcosχ m ! (5)
FIG. 7 ψ and φ Angles Versus β Angle for Modified Chi Mode with χm = 12°
$ hkl% 5
1 $ hkl% 5.4.5 The τij influences on the d versus sin2β plot are more
ε βχ s @ σ 11 sin2 β cos2 χ m 1σ 22 sin2 χ m 1σ 33 cos2 β cos2 χ m #
m 2 2 complex and are often assumed to be zero (3). However, this
1 may not be true and significant errors in the calculated stress
1 s $2hkl% @ τ 12sinβsin~ 2χ m ! 1τ 13sin~ 2β ! cos2 χ m 1τ 23cosβsin~ 2χ m ! # may result. Figs. 9-13 show the d versus sin2β influences of
2
1s $1hkl% @ σ 111σ 221σ 33# (7) individual shear components for modified chi mode consider-
ing two detector positions (χm = +12° and χm = -12°). Compo-
5.4.3 Stress normal to the surface (σ33) is assumed to be nents τ12 and τ13 cause a symmetrical opening about the σ11
insignificant because of the shallow depth of penetration of slope influence for either detector position (Figs. 9-11);
X-rays at the free surface reducing Eq 7 to Eq 8. Post-
therefore, σ11 can still be determined by simply averaging the
measurement corrections may be applied to account for pos-
positive and negative β data. Fitting the opening to the τ12 and
sible σ33 influences (see 12.12). Since the σij values and χm will
τ13 terms may be possible, although distinguishing between the
remain constant for a given azimuth, the s1{hkl} term is
renamed C, and the σ22 term is renamed D. two influences through regression is not normally possible.
5.4.6 The τ23 value affects the d versus sin2β slope in a
1 $ hkl% 1
$ hkl% 5
ε βχ s @ σ 11 sin2 β cos2 χ m 1D # 1 2 s $2hkl% @ τ 12sinβsin~ 2χ m ! similar fashion to σ11 for each detector position (Figs. 12 and
m 2 2
13). This is an unwanted effect since the σ11 and τ23 influence
1τ 13sin~ 2β ! cos2 χ m 1τ 23cosβsin~ 2χ m ! # 1C (8) cannot be resolved for one χm position. In this instance, the τ23
2 shear stress of -100 MPa results in a calculated σ11 value of
5.4.4 The σ11 influence on the d versus sin β plot is similar
to omega and chi mode (Fig. 8) with the exception that the -472.5 MPa for χm = +12° or -527.5 MPa for χm = -12°, while
slope shall be divided by cos2χm. This increases the effective 1⁄2 the actual value is -500 MPa. The value, σ11 can still be
s2{hkl} by a factor of 1/cos2χm for σ11. determined by averaging the β data for both χm positions.
FIG. 8 Sample d (2θ) Versus sin2β Dataset with σ11 = -500 MPa
FIG. 9 Sample d (2θ) versus sin2β Dataset with χm = +12°, σ11 = -500 MPa, and τ12 = -100 MPa
FIG. 10 Sample d (2θ) Versus sin2β Dataset with χm = -12°, σ11 = -500 MPa, and τ12 = -100 MPa
FIG. 11 Sample d (2θ) Versus sin2β Dataset with χm = +12 or -12°, σ11 = -500 MPa, and τ13 = -100 MPa
5.4.7 The use of the modified chi mode may be used to 6.1.2 X-Ray Source—There are generally three X-ray
determine σ11 but shall be approached with caution using one sources used for XRD.
χm position because of the possible presence of a τ23 stress. The 6.1.2.1 Conventional Sealed Tube—This is by far the most
combination of multiple shear stresses including τ23 results in common found in XRD equipment. It is identified by its anode
increasingly complex shear influences. Chi and omega mode target element such as chromium (Cr), manganese (Mn), or
are preferred over modified chi for these reasons. copper (Cu). The anode is bombarded by electrons to produce
specific X-ray wavelengths unique to the target element.
6. Apparatus 6.1.2.2 Rotating Anode Tube—This style of tube offers a
6.1 A typical X-ray diffractometer is composed of the higher intensity than a conventional sealed tube.
following main components: 6.1.2.3 Synchrotron—Particle accelerator that is capable of
6.1.1 Goniometer—An angle-measuring device responsible producing a high-intensity X-ray beam.
for the positioning of the source, detectors, and sample relative 6.1.2.4 Sealed Radioactive Sources—Although not com-
to each other. monly used, they may be utilized.
FIG. 12 Sample d (2θ) Versus sin2β Dataset with χm = +12°, σ11 = -500 MPa, τ23 = -100 MPa, and Measured σ11 = -472.5 MPa
FIG. 13 Sample d (2θ) Versus sin2β Dataset with χm = -12°, σ11 = -500 MPa, τ23 = -100 MPa, and Measured σ11 = -527.5 MPa
6.1.3 Detector—Detectors may be of single channel, multi- 7.4 Refer to material safety data sheets (MSDS) sheets for
channel linear, or area design. handling of dangerous materials potentially found in XRD
6.1.4 Software—Software is grouped into the following equipment (that is, beryllium and lead).
main categories: 7.5 The high voltage used to generate X-rays is very
6.1.4.1 Goniometer control—Responsible for positioning of dangerous. Follow the manufacturer’s and local guidelines
the sample relative to the incident beam and detector(s) in when dealing with high-voltage equipment.
automated goniometers.
6.1.4.2 Data acquisition—Responsible for the collection of 8. Test Specimens
diffraction profile data from the detector(s).
6.1.4.3 Data processing—Responsible for all data fitting 8.1 This guide is intended for materials with the following
and calculations. characteristics:
6.1.4.4 Data management—Responsible for data file man- 8.1.1 Fine grain size and
agement as well as overall record keeping. Individual measure- 8.1.2 Near random coherent domain orientation distribution.
ment data is typically stored in a file format that can later be 8.2 Test specimens shall be clean at the measured location
reopened for reevaluation. It is often beneficial to keep a and should be free of visible signs of oxidation, material debris,
database of key measurement values and file names. and coatings such as oil and paint.
7. Hazards 8.3 Sample surfaces shall be free of any significant rough-
ness. Grooves produced by machining perpendicular to the
7.1 Regarding the use of analytical X-ray equipment, local measurement direction may affect measurement results (4, p.
government regulations or guidelines shall always be followed. 21).
Examples include ANSI N43.2-2001 and ANSI N43.3.
8.4 Sample surfaces may be prepared using electropolishing
7.2 The as low as reasonably achievable (ALARA) philoso- as this method does not impart stress within the sample;
phy should always be used when dealing with radiation however, removal of stressed layers may influence the subsur-
exposure. face residual stress state. Corrections are available to estimate
7.3 Always follow the safety guidelines of the equipment the true stress that existed when the specimen was intact (see
manufacturer. 12.13).
(2) Capable of accessing deep grooves parallel to axis of 10.2 Additionally, a nonzero known residual stress profi-
rotation. ciency reference sample should be measured to verify that
9.5.2.2 Disadvantages: hardware and software are working correctly.
(1) Beam spot on sample is pseudo elliptical and spreads NOTE 1—No national reference sample exists other than a stress-free
appreciably and sample. It is recommended that round robin methodologies be used to
(2) Usually requires spot focus and collimators that reduce determine the residual stress values of such reference samples. Specifica-
tion DIN EN 15305 provides a methodology for creating a stress-reference
particle statistics. specimen.
9.5.3 Modified Chi Mode—With modified chi mode, the
source positioning, sample positioning, and axis of rotation are 11. Procedure
the same as omega mode. The detector positions, however, are
rotated 90° about the incident beam creating a fixed χ offset 11.1 Position test specimen for measurement in the goniom-
(χm). Conflicting nomenclature may be found in literature with eter. Ensure that specimen-positioning devices such as clamps
regard to axis names. For example, the χ and ω names may be do not create an applied load because the XRD method does
reversed such that multiple angles are observed by rotation not differentiate between applied and residual stress but rather
about the χ axis. Since modified chi mode is typically used by measures the summation of the two.
omega mode diffractometers with detector positioning rotated 11.2 The angular range over which measurements are car-
90° about the incident beam, omega axis labeling is used for ried out is limited by the mode used. Measurements should
consistency. always be performed over the maximum permissible ψ range.
9.5.3.1 Advantage—Capable of accessing deep grooves par- If the range is further limited by specimen geometry, the largest
allel to axis of rotation. possible range should be used where no shadowing effects
9.5.3.2 Disadvantages: occur.
(1) Values τ12 and τ13 cannot be resolved (see 5.4) and 11.2.1 Iso Inclination—ψ max = 645° (sin2ψ = 0.5). (9, p.
(2) Values τ23 and σ11 cannot be resolved (see 5.4). 121)
11.2.2 Side Inclination—ψ max = 677° (sin2ψ = 0.95). (9,
10. Calibration and Standardization p. 121)
10.1 Instrument alignment can be verified with Test Method 11.2.3 Modified Chi—β max = 678° (sin2β = 0.96). (1, p.
E915 by the measurement of a stress-free powder. 179)
12.5.1.2 If texture effects are present, the use of cross 12.7.1.1 In the case of single-detector omega mode in which
correlation may cause larger errors than other methods. software does not support overlapping of separate positive and
12.5.2 Absolute Method—Diffraction angles are determined negative ψ range collections, and such oscillations or devia-
relative to each detector. tions are present, a linear regression may be performed
separately for the positive and negative range to determine
12.6 The 2θ values are converted to d spacing using Bragg’s each d' value, respectively.
law. $ hkl% 5 A sin2 ψ1d
d φψ ' (22)
$ hkl% sinθ $ hkl%
nλ Kα1 5 2d φψ (20)
φψKα1
where:
12.7 The measurement do value shall be determined for the
calculation of strain. A = regression variable.
12.7.1 do Omega and Chi Mode—When using the plane 12.7.2 do Modified Chi Mode—When using the plane stress
stress model, there is a negligible error for the substitution of model, there is a negligible error for the substitution of do with
do with d'ψ = 0 (HS-784). When d versus sin2ψ plots exhibit d'β = 0 (HS-784). When d versus sin2β plots exhibit large
14.4.1 Uncertainty in Peak Fitting—The collected peak (b) Maximize ψ tilt—It has been suggested that lineariza-
profile is a summation of multiple overlapping peaks. tion of the d versus sin2ψ distribution may be achieved by
Therefore, not properly accounting for all contributions will maximizing the ψ tilt range (1, p. 189).
affect the accuracy of deconvoluting individual contributions 14.4.2.2 Large Grain Size—For a given homogeneous
using profile regression. Possible deviations include the fol- volume, a larger grain size will reduce the number of grains
lowing: available for diffraction at a given orientation. This is often
14.4.1.1 Peak Asymmetry—This is commonly observed in associated with random deviations in the sin2ψ or sin2β plot.
bearing steel materials. Possible sources of asymmetry include Intensity ratios above 1.6 may require corrective actions that
dislocation effects, separation of peaks as a result of slight include the following:
tetragonalities in cubic materials, and incomplete heat treat- (1) Different hkl plane—It has been shown that some hkl
ment causing a mixture of ferrite and martensite. planes are more susceptible to nonelliptical sin2ψ distributions
14.4.1.2 Interfering Peak(s)—Diffraction peaks free of in- than others for cubic materials (13, pp. 899-906). The selection
terfering peaks from the measured phase are typically used. of a high-multiplicity hkl plane may also reduce the effects of
The presence of other phases such as carbides may create large grain size.
interfering peaks. (2) Oscillation(s)—The φ and β oscillations as well as
14.4.1.3 Counting Statistics—Random error as a result of sample translation may be introduced to minimize the effects of
counting statistics may result from failure to take sufficient large grains (14).
time during the measurement to obtain accurate intensity (3) Increase aperture size—Where possible, the use of a
information and, thus, to determine accurately the diffraction larger aperture will increase the number of grains sampled and
peak positions. Methods are available (HS-784) for estimating minimize the effects of large grain size.
the standard deviation of the measured stress as a result of the (4) Increase number of tilts and range—Increasing the
errors involved in counting and curve fitting to determine peak number of ψ tilts and the ψ tilt range can also reduce errors
positions. caused by large grain size.
14.4.2 Uncertainty in d Versus sin2ψ or sin2β Fitting—There (5) Deeper penetrating radiation—A deeper penetration
are many possible sources of error in the d versus sin2ψ or may increase the number of grains sampled and reduce the
sin2β plot. Some of these errors may create an elliptical offset effects of large grain size.
causing an apparent shear influence, while others create oscil-
latory or seemingly random patterns. Deviations often become 14.4.2.3 Temperature Gradient—Changes in sample tem-
more apparent at lower σ11 values because of the lower perature will cause a change in strain according to the material
d-spacing axis scaling. Distinguishing between sources of error coefficient of thermal expansion. If the sample material is
can be difficult and multiple influences may overlap. Some gradually heated or cooled during measurement, a change in
possible sources are listed in the following. strain will occur. For example, the air in a goniometer
14.4.2.1 Texture—A nonrandom coherent domain orienta- enclosure may be warmer than the outside ambient air causing
tion distribution is found in all bearing materials in varying the sample to warm up gradually when placed in the enclosure
degrees. Texture may be manifested by a significant change in for measurement. Fig. 15 shows d-spacing deviations caused
peak intensity versus orientation as well as oscillatory sin2ψ by a 5 °C increase in temperature during measurement. The
distributions. The degree of texture observed in a measurement rate of sample temperature change will depend on its thermal
is indicated by the peak integrated intensity ratio (Eq 30). conductivity.
14.4.2.4 Stability of Residual Stress/Strain—Residual
I max
I.R. $ hkl% 5 (29) stresses may cause the strain to change over time through creep
I min
mechanisms. The strain rate of change is largest in the primary
(1) Intensity ratios above 1.6 may require corrective ac-
stage after the stresses are created or altered and will slow over
tions that include the following:
time with increasing strain. Larger strain rates may cause a
(a) Different hkl plane—It has been shown that some hkl significant change in strain over the course of the measure-
planes are more susceptible to nonelliptical sin2ψ distributions ment. The effects of aging may also contribute to the stability
than others for cubic materials (12, pp. 899-906) and of residual stress over time.
FIG. 15 Simulated Two Detector Omega Mode sin2ψ Offset for 5°C Increase during Measurement where σ11 = -100 MPa, τ13 = +20 MPa,
and αL = 11 × 10-6 mm/mm/°C (αL Applied to do{hkl} Value)
14.4.2.5 Plastic Deformation—Oscillatory sin2ψ or sin2β 14.4.4.2 Sample Alignment—The sample measurement lo-
plots may occur as a result of plastic deformation (1, p. 400). cation shall remain aligned with the goniometer center of
14.4.3 Maximum Acceptable Errors: rotation. This is especially true for curved surfaces where
14.4.3.1 Intensity ratio shall not exceed 3.0. Corrective measurement of misaligned samples can result in d-spacing
actions may be required if the intensity ratio exceeds 1.6. offsets that appear to be stress component influences.
14.4.3.2 Stress Values—Alternatively, strain values may be 14.4.4.3 Sample Curvature—Sample curvature should not
used. This avoids error as a result of the selection of inappro- exceed limits specified in 9.1.2.
priate elastic constants. 14.4.4.4 Surface Condition—Sample surface should be pre-
(1) Normal stress error not to exceed 10 % of the normal pared in accordance with 8.2.
stress value or 35 MPa, whichever is larger. Corrective actions 14.4.4.5 X-Ray Optics—X-ray optics should be used accord-
may be required if error exceeds 20 MPa. ing to the manufacturer’s specifications.
(2) Normal strain error not to exceed 10 % of the normal 14.4.4.6 Errors in Peak Fitting—See 14.4.1.
strain value or 250 ppm, whichever is larger. Corrective actions 14.4.4.7 Errors in sin2ψ or sin2 β Fitting—See 14.4.2.
may be required if the error exceeds 150 ppm.
(3) Shear stress errors not to exceed 10 % of the shear 14.5 “As measured” residual stress values not corrected for
stress value or 35 MPa, whichever is larger. Corrective actions gradient (12.12), material removal (12.13) or relaxation as a
may be required if the error exceeds 20 MPa. result of sectioning (12.14) are potentially subject to high
(4) Shear strain errors not to exceed 10 % of the shear inaccuracies.
strain value or 125 ppm, whichever is larger. Corrective actions 14.5.1 Gradient Effect—A significant stress gradient within
may be required if the error exceeds 75 ppm. the diffracted volume will affect the dependence of measured
14.4.4 Uncertainty in Stress Values—Sources of experimen- strain with incident beam orientation because of a difference in
tal error in the residual stress measurement result may include volume penetration. In chi and omega mode, large gradients
the following: may be indicated by a curved d versus sin2ψ distribution.
14.4.4.1 X-Ray Elastic Constant(s)—Factors affecting Unlike curvatures caused by shear stress, the curvatures caused
Young’s modulus will also affect the X-ray elastic constants. by a stress gradient bend in the same direction for the positive
X-ray elastic constants may be determined with Test Method and negative ψ range (see Fig. 16) (1, p. 181). Corrections are
E1426. Some examples of X-ray elastic constant influences available for the stress gradient effect (HS-784, p. 75)
include the following: Surface and near surface residual stress values for ground
(1) Stability of residual stress/strain—Material instabilities surfaces may be over 200 % greater in magnitude than “as
such as creep and aging may influence the stress-strain measured” values due to a residual stress gradient versus depth.
relationship over time. Factors that effect the depth of penetration such as diffracto-
(2) Chemistry—Material chemistry can have a large influ- meter mode and target radiation may influence the “as mea-
ence on X-ray elastic constants. For example, in case-hardened sured” value. If initial measurement depths of a ground surface
steels, a carbon gradient versus depth can cause a significant are significantly larger than the depth of penetration the near
material properties gradient with depth. surface residual stress gradient versus depth may be
(3) Grain structure—In martensitic steels, two structures underestimated, causing the gradient correction (12.12) to
are commonly observed: “lath” and “plate” martensite (15). under-correct. Depths should be chosen that capture turning
The percentage of each structure is largely dependent on the points and inflections of the residual stress versus depth curve.
carbon content and where the carbon is concentrated, that is, in 14.5.2 Material Removal—The redistribution of residual
solution/in carbides. stress’ as a result of material removal may cause the freshly
exposed surface to have a different residual stress than existed 15. Keywords
before electropolishing. See 12.13 for correction. 15.1 bearing; residual stress; X-ray diffraction; XRD
14.5.3 Relaxation as a Result of Sectioning—Sample sec-
tioning may partially release and redistribute the residual stress
in a sample. See 12.14 for correction methods.
APPENDIX
(Nonmandatory Information)
X1.1 The values, ψ and φ, are converted to β and χ reference { sin2 s arccoss x dd 512x 2
using Eq 5 and 6.
5σ 22s 12cos2 βcosχ m 2sin2 βcos2 χ m d
ψ 5 arccos~ cos βcosχ m ! ~5!
5σ 22s 12cos2 x s cos2 β1sin2 β dd
φ 5 arccos S sin βcosχ m
sin ψ D ~6!
{ cos2 x1sin2 x51
$ hkl% 5
1 $ hkl% { 12cos2 x5sin2 x
ε φψ s
2 2
@ σ 11 cos2 φ sin2 ψ1σ 22 sin2 φ sin2 ψ1σ 33 cos2 ψ #
5σ 22sin2 χ m
1
1 s $2hkl% @ τ 12sin~ 2φ ! sin2 ψ1τ 13cosφsin~ 2ψ ! 1τ 23sinφsin~ 2ψ ! # σ 33cos2 ψ
2
1s $1hkl% @ σ 111σ 221σ 33# ~2! 5σ 33cos2 s arccoss cosβcosχ m dd
2 2
σ 11cos φsin ψ
{ cos2 s arccosx d 5x 2
2 2
sin βcos χ m
5σ 11 sin2 ψ 5σ 33cos2 βcos2 χ m
sin2 ψ
τ 12sins 2φ d sin2 ψ
5σ 11sin2 βcos2 χ m
σ 22sin2 φsin2 ψ
S
5τ 12sin 2arccos S sinβcosχ m
sinψ DD sin2 ψ
5σ 22sin2 F arccos S
sinβcosχ m
sin2 ψ DG sin2 ψ {sins 2arccosx d 52x œ12x 2
S
5σ 22 12
sin2 βcos2 χ m
sin2 ψ D sin2 ψ
5τ 122sinβcosχ m sinψ Œ 12
sin2 βcos2 χ m
sin2 ψ
5σ 22s sin2 ψ2sin2 βcos2 χ m d
5τ 122sinβcosχ m œ12cos
2
βcos2 χ m Œ 12
sin2 βcos2 χ m
12cos2 βcos2 χ m 5τ 23Œ 12
sin2 βcos2 χ m
sin2 s arccoss cosβcosχ m dd
sins 2arccoss cosβcosχ m dd
5τ 122sinβcosχ m œ12cos
2
βcos2 χ m 2sin2 βcos2 χ m
5τ 23Œ 12
sin2 βcos2 χ m
12cos2 βcos2 χ m
2cosβcosχ m œ12cos
2
βcos2 χ m
5τ 122sinβcosχ m œ12cos
2
χ m s cos β1sin β d
2 2
5τ 232cosβsins 2χ m d
sinβcosχ m
5τ 13 sins 2ψ d
sinψ
{
sins 2x d
52cosx
X1.3 Bringing the terms together we obtain:
sinx
1 $ hkl%
5τ 132sinβcosχ m cosψ $ hkl% 5
ε βχ s @ σ 11 sin2 β cos2 χ m 1σ 22 sin2 χ m 1σ 33 cos2 β cos2 χ m #
m 2 2
5τ 132sinβcosχ m coss arccoss cosβcosχ m dd 1
1 s $2hkl% @ τ 12sinβsin~ 2χ m ! 1τ 13sin~ 2β ! cos2 χ m 1τ 23cosβsin~ 2χ m ! #
5τ 132sinβcosβcos χ m 2 2
1s $1hkl% @ σ 111σ 221σ 33# ~7!
1
{cosxsinx5 sins 2x d
2
X1.4 Modified χ d' Calculation:
5τ 13sins 2β d cos2 χ m
τ 23sinφsins 2ψ d X1.4.1 For β = 0, Eq 23 becomes:
$ hkl%
d β50χ 5 A sin2 01Bsin01Csin~ 2·0 ! 1Dcos01E 5 D1E
S
5τ 23sin arccos S sinβcosχ m
sinψ DD sins 2ψ d
m
Substituting d β50χ
$ hkl% with d':
m
{sins arccosx d 5 œ12x 2
d ' 5 D1E
REFERENCES
(1) Hauk, V., Structural and Residual Stress Analysis by Nondestructive (6) Dionnet, B., Francois, M., Lebrun, J. L., and Nardou, F., “Influence of
Methods, Elsevier, Amsterdam, The Netherlands, 1997. Tore Geometry on X-Ray Stress Analysis,” in Proceedings of the
(2) Noyan, I. C. and Cohen, J. B., Residual Stress Measurement by Fourth European Conference on Residual Stresses, Vol 1, France,
Diffraction and Interpretation, Springer-Verlag, 1987. 1996.
(3) Londsdale, D. and Doig, P., “The Development of a Transportable (7) Residual Stress Measurement by X-Ray Diffraction, Schaeffler Group
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SUMMARY OF CHANGES
Committee E28 has identified the location of selected changes to this standard since the last issue (E2860–12)
that may impact the use of this standard.
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