ThinkSystem SR630 V2

Maintenance Manual

Machine Types: 7Z70 and 7Z71

Note

Before using this information and the product it supports, be sure to read and understand the safety
information and the safety instructions, which are available at:
https://pubs.lenovo.com/safety_documentation/

In addition, ensure that you are familiar with the terms and conditions of the Lenovo warranty for your server,
which can be found at:
http://datacentersupport.lenovo.com/warrantylookup

Eighteenth Edition (November 2024)

© Copyright Lenovo 2021, 2024.

LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services
Administration (GSA) contract, use, reproduction, or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.
Contents

Contents . . . . . . . . . . . . . . . . . i Working inside the server with the power on . . 87

Handling static-sensitive devices . . . . . . 88
Safety . . . . . . . . . . . . . . . . . . v Memory module installation rules and order . . . . 88
Safety inspection checklist . . . . . . . . . . . vi DRAM DIMM installation order . . . . . . . 90
PMEM and DRAM DIMM installation order . . 94
Chapter 1. Introduction . . . . . . . . . 1
Technical rules . . . . . . . . . . . . . . . 102
Specifications . . . . . . . . . . . . . . . . 2
Technical rules for drives . . . . . . . . . 102
Particulate contamination . . . . . . . . . 11
Technical rules for RAID configuration . . . . 103
Firmware updates . . . . . . . . . . . . . . 12
Technical rules for PCIe adapters . . . . . . 103
Tech Tips . . . . . . . . . . . . . . . . . 16
Technical rules for thermal limitation . . . . . 107
Security advisories . . . . . . . . . . . . . 16
Air baffle replacement . . . . . . . . . . . . 111
Power on the server . . . . . . . . . . . . . 17
Remove the air baffle . . . . . . . . . . . 111
Power off the server . . . . . . . . . . . . . 17
Install the air baffle . . . . . . . . . . . . 112
Chapter 2. Server components . . . . 19 Backplane replacement. . . . . . . . . . . . 114
Front view . . . . . . . . . . . . . . . . . 19 Remove the front 2.5-inch drive backplane . . 114
Diagnostics panel . . . . . . . . . . . . 26 Install the front 2.5-inch drive backplane . . . 116
LCD diagnostics panel . . . . . . . . . . 28 Remove the front 3.5-inch drive backplane . . 117
External LCD diagnostics handset . . . . . . 33 Install the front 3.5-inch drive backplane . . . 118
Rear view . . . . . . . . . . . . . . . . . 39 Remove the front 16-EDSFF drive
backplane . . . . . . . . . . . . . . . 120
Rear view LEDs . . . . . . . . . . . . . 43
Install the front 16-EDSFF drive backplane . . 121
System board components . . . . . . . . . . 44
Remove the 2.5-inch rear drive backplane. . . 122
System board LEDs . . . . . . . . . . . 46
Install the 2.5-inch rear drive backplane . . . 123
Switch block . . . . . . . . . . . . . . 47
Remove the 7mm drive backplanes . . . . . 124
Parts list. . . . . . . . . . . . . . . . . . 49
Install the 7mm drive backplanes . . . . . . 126
Power cords . . . . . . . . . . . . . . 52
CMOS battery replacement . . . . . . . . . . 128
Chapter 3. Internal cable routing . . . 53 Remove the CMOS battery . . . . . . . . 128
CFF HBA/RAID adapter. . . . . . . . . . . . 54 Install the CMOS battery . . . . . . . . . 130
Front I/O . . . . . . . . . . . . . . . . . 57 EDSFF cage replacement . . . . . . . . . . . 131
Intrusion switch . . . . . . . . . . . . . . . 58 Remove an EDSFF cage . . . . . . . . . 132
RAID flash power modules . . . . . . . . . . 59 Install an EDSFF cage . . . . . . . . . . 133
M.2 drive backplane . . . . . . . . . . . . . 61 Front I/O assembly replacement . . . . . . . . 134
16-EDSFF drive backplane . . . . . . . . . . 62 Remove the front I/O assembly . . . . . . . 135
7mm drive backplane . . . . . . . . . . . . 63 Install the front I/O assembly . . . . . . . . 137
2.5-inch/3.5-inch drive backplane (power) . . . . 64 Remove the LCD diagnostics panel
assembly . . . . . . . . . . . . . . . 138
2.5-inch/3.5-inch drive backplane (signal). . . . . 65
Install the LCD diagnostics panel
4 x 3.5-inch front drive bays . . . . . . . . 65 assembly . . . . . . . . . . . . . . . 140
4 x 2.5-inch front drive bays . . . . . . . . 69 Heat sink Torx T30 nut replacement . . . . . . . 142
8 x 2.5-inch front drive bays . . . . . . . . 72 Remove a heat sink Torx T30 nut . . . . . . 142
10 x 2.5-inch front drive bays. . . . . . . . 78 Install a heat sink Torx T30 nut . . . . . . . 143
Hot-swap drive replacement . . . . . . . . . . 144
Chapter 4. Hardware replacement
Remove a 2.5/3.5-inch hot-swap drive . . . . 145
procedures . . . . . . . . . . . . . . . 85
Install a 2.5/3.5-inch hot-swap drive . . . . . 146
Installation guidelines . . . . . . . . . . . . 85
Remove an EDSFF drive . . . . . . . . . 148
Safety inspection checklist. . . . . . . . . 86
Install an EDSFF drive . . . . . . . . . . 150
System reliability guidelines . . . . . . . . 87

© Copyright Lenovo 2021, 2024 i

Hot-swap power supply unit replacement . . . . 151 Install the security bezel . . . . . . . . . . 214
Remove a hot-swap power supply unit . . . . 151 Serial port module replacement . . . . . . . . 217
Install a hot-swap power supply . . . . . . 156 Remove a serial port module . . . . . . . . 217
Internal CFF HBA/RAID adapter replacement . . . 161 Install a serial port module . . . . . . . . . 219
Remove the internal CFF HBA/RAID System fan replacement . . . . . . . . . . . 220
adapter . . . . . . . . . . . . . . . . 161 Remove a system fan . . . . . . . . . . . 220
Install the internal CFF HBA/RAID adapter. . . 162 Install a system fan. . . . . . . . . . . . 222
Intrusion switch replacement . . . . . . . . . 163 System board replacement . . . . . . . . . . 223
Remove an intrusion switch . . . . . . . . 163 Remove the system board . . . . . . . . . 224
Install an intrusion switch . . . . . . . . . 164 Install the system board . . . . . . . . . . 225
Memory module replacement . . . . . . . . . 165 Update the machine type and serial
Remove a memory module . . . . . . . . 165 number . . . . . . . . . . . . . . . . 227
Install a memory module . . . . . . . . . 167 Enable TPM . . . . . . . . . . . . . . 229
M.2 backplane and M.2 drive replacement . . . . 168 Enable UEFI Secure Boot . . . . . . . . . 231
Remove the M.2 backplane and M.2 drive. . . 169 Top cover replacement . . . . . . . . . . . . 232
Adjust the retainer on the M.2 backplane . . . 171 Remove the top cover . . . . . . . . . . 232
Install the M.2 backplane and M.2 drive. . . . 172 Install the top cover . . . . . . . . . . . 233
OCP 3.0 Ethernet adapter replacement . . . . . 175 Complete the parts replacement . . . . . . . . 235
Remove the OCP 3.0 Ethernet adapter . . . . 175
Install the OCP 3.0 Ethernet adapter . . . . . 176 Chapter 5. Problem
PCIe adapter replacement. . . . . . . . . . . 178 determination . . . . . . . . . . . . . 237
Remove a PCIe adapter . . . . . . . . . . 178 Event logs . . . . . . . . . . . . . . . . . 237
Install a PCIe adapter . . . . . . . . . . . 179 Light path diagnostics . . . . . . . . . . . . 239
Processor and heat sink replacement . . . . . . 180 General problem determination procedures . . . . 239
Remove a processor and heat sink . . . . . 181 Resolving suspected power problems . . . . 239
Separate the processor from carrier and heat Resolving suspected Ethernet controller
sink . . . . . . . . . . . . . . . . . . 184 problems . . . . . . . . . . . . . . . 240
Install a processor and heat sink . . . . . . 186 Troubleshooting by symptom . . . . . . . . . 241
Rack latches replacement . . . . . . . . . . . 191 Power on and power off problems . . . . . . 242
Remove the rack latches . . . . . . . . . 191 Memory problems . . . . . . . . . . . . 243
Install the rack latches . . . . . . . . . . 192 Hard disk drive problems . . . . . . . . . 247
RAID flash power module replacement . . . . . . 194 Monitor and video problems . . . . . . . . 251
Remove the RAID flash power module on the Keyboard, mouse, KVM switch or USB-device
chassis . . . . . . . . . . . . . . . . 195 problems . . . . . . . . . . . . . . . 252
Install the RAID flash power module on the Optional-device problems . . . . . . . . . 253
chassis . . . . . . . . . . . . . . . . 197 Serial-device problems . . . . . . . . . . 255
Remove the RAID flash power module on the Intermittent problems . . . . . . . . . . . 255
air baffle . . . . . . . . . . . . . . . . 199 Power problems . . . . . . . . . . . . . 258
Install the RAID flash power module on the air Network problems . . . . . . . . . . . . 258
baffle . . . . . . . . . . . . . . . . . 200
Observable problems . . . . . . . . . . . 258
Remove the RAID flash power module on the
riser . . . . . . . . . . . . . . . . . 201 Software problems . . . . . . . . . . . . 261
Install the RAID flash power module on the
riser . . . . . . . . . . . . . . . . . 203 Appendix A. Hardware
Rear drive assembly replacement . . . . . . . . 204
disassembling for recycle . . . . . . . 263
Disassembling the system board for recycle. . . . 263
Remove the rear drive assembly . . . . . . 204
Install the rear drive assembly . . . . . . . 206
Appendix B. Getting help and
Riser card replacement . . . . . . . . . . . . 209
technical assistance . . . . . . . . . . 265
Remove a riser card . . . . . . . . . . . 209
Before you call . . . . . . . . . . . . . . . 265
Install a riser card . . . . . . . . . . . . 211
Collecting service data . . . . . . . . . . . . 266
Security bezel replacement . . . . . . . . . . 213
Contacting Support . . . . . . . . . . . . . 267
Remove the security bezel . . . . . . . . . 213

ii ThinkSystem SR630 V2 Maintenance Manual

Appendix C. Notices. . . . . . . . . . 269 Taiwan Region BSMI RoHS declaration. . . . 271
Trademarks . . . . . . . . . . . . . . . . 270 Taiwan Region import and export contact
Important notes . . . . . . . . . . . . . . . 270 information . . . . . . . . . . . . . . . . 271
Telecommunication regulatory statement . . . . . 270
Index . . . . . . . . . . . . . . . . . . 273
Electronic emission notices . . . . . . . . . . 271

© Copyright Lenovo 2021, 2024 iii

iv ThinkSystem SR630 V2 Maintenance Manual
Safety
Before installing this product, read the Safety Information.

Antes de instalar este produto, leia as Informações de Segurança.

在安装本产品之前，请仔细阅读 Safety Information （安全信息）。

Læs sikkerhedsforskrifterne, før du installerer dette produkt.

Lees voordat u dit product installeert eerst de veiligheidsvoorschriften.

Ennen kuin asennat tämän tuotteen, lue turvaohjeet kohdasta Safety Information.

Avant d'installer ce produit, lisez les consignes de sécurité.

Vor der Installation dieses Produkts die Sicherheitshinweise lesen.

Prima di installare questo prodotto, leggere le Informazioni sulla Sicurezza.

Les sikkerhetsinformasjonen (Safety Information) før du installerer dette produktet.

Antes de instalar este produto, leia as Informações sobre Segurança.

© Copyright Lenovo 2021, 2024 v

Antes de instalar este producto, lea la información de seguridad.

Läs säkerhetsinformationen innan du installerar den här produkten.

Safety inspection checklist

Use the information in this section to identify potentially unsafe conditions with your server. As each machine
was designed and built, required safety items were installed to protect users and service technicians from
injury.

Notes:
• The product is not suitable for use at visual display workplaces according to §2 of the Workplace
Regulations.
• The set-up of the server is made in the server room only.

CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. Lenovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products. Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location.

Important: Electrical grounding of the server is required for operator safety and correct system function.
Proper grounding of the electrical outlet can be verified by a certified electrician.

Use the following checklist to verify that there are no potentially unsafe conditions:
1. Make sure that the power is off and the power cord is disconnected.
2. Check the power cord.
• Make sure that the third-wire ground connector is in good condition. Use a meter to measure third-
wire ground continuity for 0.1 ohm or less between the external ground pin and the frame ground.
• Make sure that the power cord is the correct type.
To view the power cords that are available for the server:
a. Go to: http://dcsc.lenovo.com/#/

vi ThinkSystem SR630 V2 Maintenance Manual

 b. Click Preconfigured Model or Configure to order.
c. Enter the machine type and model for your server to display the configurator page.
d. Click Power ➙ Power Cables to see all line cords.
• Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use good judgment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions, such as metal filings, contamination, water or
other liquid, or signs of fire or smoke damage.
5. Check for worn, frayed, or pinched cables.
6. Make sure that the power-supply cover fasteners (screws or rivets) have not been removed or tampered
with.

© Copyright Lenovo 2021, 2024 vii

viii ThinkSystem SR630 V2 Maintenance Manual
Chapter 1. Introduction
The ThinkSystem™ SR630 V2 server is a 1U rack server designed to be highly flexible to support many kinds
of Information Technology (IT) workloads. This high-performance, multi-core server is ideally suited for IT
environments that require superior processor performance, input/output (I/O) flexibility, and flexible
manageability.

Performance, ease of use, reliability, and expansion capabilities were key considerations in the design of the
server. These design features make it possible for you to customize the system hardware to meet your needs
today and provide flexible expansion capabilities for the future.

The server comes with a limited warranty. For details about the warranty, see:
https://support.lenovo.com/us/en/solutions/ht503310

For details about your specific warranty, see:

http://datacentersupport.lenovo.com/warrantylookup

Identifying your server

When you contact Lenovo for help, the machine type and serial number information helps support
technicians to identify your server and provide faster service.

The machine type and serial number are on the ID label on the right rack latch in the front of the server.

Figure 1. Location of the ID label

XClarity Controller network access label

The XClarity® Controller network access label is attached on the top side of the pull-out information tab as
shown. After you get the server, peel the XClarity Controller network access label away and store it in a safe
place for future use.

Note: The pull-out information tab is located on the right bottom of the front side of your server. For detailed
information, see “Front view” on page 19.

© Copyright Lenovo 2021, 2024 1

Figure 2. Location of the XClarity Controller network access label

Quick response code

The system service label, which is on the top cover, provides a quick response (QR) code for mobile access
to service information. Scan the QR code with a mobile device and a QR code reader application to get quick
access to the Lenovo Service Web site for this server. The Lenovo Service Information Web site provides
additional information for parts installation and replacement videos, and error codes for server support.

The following illustration shows the QR code: https://datacentersupport.lenovo.com/products/servers/

thinksystem/sr630v2/7z70

Figure 3. QR code

Specifications
The following information is a summary of the features and specifications of the server. Depending on the
model, some features might not be available, or some specifications might not apply.

2 ThinkSystem SR630 V2 Maintenance Manual

Table 1. Server specifications

Specification Description

• 1U
• Height: 43.00 mm (1.69 inches)
Dimension • Width: 439.20 mm (17.29 inches)
• Depth: 772.60 mm (30.42 inches)

Note: The depth is measured without PSU handles or security bezel installed.

• Net weight: up to 20.80 kg (45.86 lb)

• Gross weight: up to 28.41 kg (62.66 lb)
Weight
Note: The gross weight includes the weights of the server, power cable,
packaging, rail kit and cable management arm.

Supports multi-core Intel Xeon processors, with integrated memory controller and
Intel Mesh Ultra Path Interconnect (UPI) topology.
• Up to two Intel® Xeon® processors
• Designed for Land Grid Array (LGA) 4189 socket
• Scalable up to 40 cores per socket, 80 cores in total
• Thermal Design Power (TDP): up to 270 watts
Processor • Supports 3 UPI links up to 11.2 GT/s

For a list of supported processors, see https://serverproven.lenovo.com/.

Only one processor is supported if you use the 8351N processor or processor with
the suffix of “U”.

For technical rules for processors and heat sinks, see “Technical rules for thermal
limitation” on page 107.

• Standard heat sink

• High-performance heat sink (T-shape)
Heat sink
For technical rules for processors and heat sinks, see “Technical rules for thermal
limitation” on page 107.

Chapter 1. Introduction 3
Table 1. Server specifications (continued)

Specification Description

See “Memory module installation order” in Setup Guide for detailed information
about memory configuration and setup.

• Slots: 32 memory module slots

• Supported memory module type:
– TruDDR4 3200, dual-rank, 16 GB/32 GB/64 GB RDIMM
– TruDDR4 3200, quad-rank, 128 GB 3DS RDIMM
– TruDDR4 2933, octal-rank, 256 GB 3DS RDIMM
– TruDDR4 3200, 128 GB, 256 GB and 512 GB Intel® OptaneTM Persistent
Memory (PMEM)
• Minimum memory: 16 GB
• Maximum memory:
– Without PMEMs:
– 2 TB using 32 x 64 GB RDIMMs
– 8 TB using 32 x 256 GB RDIMMs
– With PMEMs:

Memory – 10 TB: 16 x 128 GB 3DS RDIMMs + 16 x 512 GB PMEMs (Memory Mode)

Total 10 TB installed memory capacity, of which 8 TB (PMEMs) is used as
system memory and 2 TB (3DS RDIMMs) is used as cache.
– 12 TB: 16 x 256 GB 3DS RDIMMs + 16 x 512 GB PMEMs (App Direct Mode)
Total 12 TB installed memory capacity, of which 4 TB (3DS RDIMMs) is used
as system memory and 8 TB (PMEMs) is used as persistent memory for
storage.

Notes:
• The operating speed and total memory capacity depend on the processor model
and UEFI settings.
• All Icelake Platinum and Gold CPUs support PMEM. For Icelake Silver CPUs, only
processor 4314 supports PMEM.
• When 256 GB 3DS RDIMM/512 GB PMEM is installed, the ambient temperature
must be limited to 30°C or lower.

For a list of supported memory options, see https://serverproven.lenovo.com/.

For technical rules for memory modules, see “Memory module installation rules and
order” on page 88.

Supported and certified operating systems:

• Microsoft Windows Server
• VMware ESXi
• Red Hat Enterprise Linux
Operating systems • SUSE Linux Enterprise Server
• Canonical Ubuntu

References:
• Complete list of available operating systems: https://lenovopress.com/osig.

4 ThinkSystem SR630 V2 Maintenance Manual

Table 1. Server specifications (continued)

Specification Description

• OS deployment instructions: Follow the adopted combination to install all the

PMEMs and DRAM DIMMs (see “Install the operating system” in Setup Guide).

Note: VMware ESXi does not support ThinkSystem 2.5 U.3 6500 ION 30.72TB Read
Intensive NVMe PCIe 4.0 x4 HS SSD.
Front:
• Up to four 3.5-inch hot-swap SAS/SATA drives
• Up to four 3.5-inch hot-swap AnyBay (SAS/SATA/NVMe) drives
• Up to four 2.5-inch hot-swap SAS/SATA drives
• Up to eight 2.5-inch hot-swap SAS/SATA/U.3 NVMe drives
• Up to six 2.5-inch hot-swap SAS/SATA and four 2.5-inch hot-swap AnyBay (SAS/
SATA/NVMe) drives
• Up to six 2.5-inch hot-swap SAS/SATA and four 2.5-inch hot-swap NVMe drives
• Up to six 2.5-inch hot-swap SAS/SATA and two 2.5-inch hot-swap AnyBay (SAS/
SATA/NVMe) drives and two 2.5-inch hot-swap NVMe drives
• Up to ten 2.5-inch hot-swap NVMe drives
• Up to ten 2.5-inch hot-swap AnyBay (SAS/SATA/NVMe) drives
Internal drives • Up to 16 hot-swap EDSFF drives

Inside:
• Up to two internal SATA or NVMe M.2 drives

Rear:
• Up to two 2.5-inch hot-swap SAS/SATA or NVMe drives
• Up to two 7mm hot-swap SATA or NVMe drives

Notes:
• M.2 and 7mm drives are not supported at the same time.
• If PMEM or 256 GB DIMM is used, rear 2.5-inch drives are not supported.
• For the server model with 16 front EDSFF drives, M.2 drives are not supported.
• For technical rules for drives, see “Technical rules for drives” on page 102.

Depending on the model, your server supports up to three PCIe slots in the rear.

• PCIe x16, low-profile

• PCIe x16/x16, low-profile + low profile
Expansion slots
• PCIe x16/x16, low profile + full-height

For locations and technical rules for PCIe slots, see “Rear view” on page 39 and
“Technical rules for PCIe adapters” on page 103.

Chapter 1. Introduction 5
Table 1. Server specifications (continued)

Specification Description

Your server supports the following GPUs:

• Low-profile, half-length, single-wide:
– NVIDIA® Quadro® P620
– NVIDIA® Tesla® T4
– NVIDIA® A2
– NVIDIA® Tesla® T4 16GB Base Card (for China only)
– NVIDIA® L4
• Full-height, 3/4 length, single-wide:
Graphics processing unit
(GPU) – NVIDIA® Quadro® P2200

For technical rules for GPU, see “Technical rules for GPU adapters” on page 110.

Notes:
To prevent potential thermal issues, change the Misc setting in the BIOS from
Option3 (default value) to Option1 if the following two conditions are met:
• The server is equipped with a GPU adapter.
• The UEFI firmware version is AFE128B or later.
For the method of changing the Misc setting, see https://support.lenovo.com/us/en/
solutions/TT1832.

• Front:
– One VGA connector (optional)
– One USB 2.0 connector
– One USB 3.2 Gen 1 (5Gbps) connector
– One external diagnostics connector
– One diagnostics panel (optional)
– One LCD diagnostics panel (optional)
Input/Output (I/O) features • Rear:
– One VGA connector
– Three USB 3.2 Gen 1 (5Gbps) connectors
– Ethernet connectors on OCP 3.0 Ethernet adapter (optional)
– One RJ45 BMC management network connector
– One serial port (optional)

For detailed information about each component, see “Front view” on page 19 and
“Rear view” on page 39.

6 ThinkSystem SR630 V2 Maintenance Manual

Table 1. Server specifications (continued)

Specification Description

Support the following RAID adapters:

• ThinkSystem RAID 530-8i PCIe 12Gb Adapter
• ThinkSystem RAID 5350-8i PCIe 12Gb Adapter
• ThinkSystem RAID 530-16i PCIe 12Gb Adapter
• ThinkSystem RAID 540-8i PCIe Gen 4 12Gb Adapter
• ThinkSystem RAID 540-16i PCIe Gen 4 12Gb Adapter
• ThinkSystem RAID 930-8i 2GB Flash PCIe 12Gb Adapter
• ThinkSystem RAID 9350-8i 2GB Flash PCIe 12Gb Adapter
• ThinkSystem RAID 9350-16i 4GB Flash PCIe 12Gb Adapter
• ThinkSystem RAID 930-8e 4GB Flash PCIe 12Gb Adapter
• ThinkSystem RAID 930-16i 4GB Flash PCIe 12Gb Adapter
• ThinkSystem RAID 930-16i 8GB Flash PCIe 12Gb Adapter
• ThinkSystem RAID 940-8i 4GB Flash PCIe Gen 4 12Gb Adapter
• ThinkSystem RAID 940-8i 8GB Flash PCIe Gen 4 12Gb Adapter
• ThinkSystem RAID 940-16i 4GB Flash PCIe Gen 4 12Gb Adapter
• ThinkSystem RAID 940-8e 4GB Flash PCIe 12Gb Adapter
• ThinkSystem RAID 940-16i 8GB Flash PCIe Gen 4 12Gb Adapter
• ThinkSystem RAID 940-16i 8GB Flash PCIe Gen 4 12Gb Internal Adapter
• ThinkSystem RAID 9350-8i 2GB Flash PCIe 12Gb Internal Adapter
HBA/RAID adapters • ThinkSystem RAID 9350-16i 4GB Flash PCIe 12Gb Internal Adapter
(depending on the model) • ThinkSystem RAID 5350-8i PCIe 12Gb Internal Adapter

Support the following HBAs:

• ThinkSystem 430-8i SAS/SATA 12Gb HBA
• ThinkSystem 4350-8i SAS/SATA 12Gb HBA
• ThinkSystem 4350-16i SAS/SATA 12Gb HBA
• ThinkSystem 430-8e SAS/SATA 12Gb HBA
• ThinkSystem 430-16i SAS/SATA 12Gb HBA
• ThinkSystem 430-16e SAS/SATA 12Gb HBA
• ThinkSystem 440-8i SAS/SATA Gen 4 12Gb HBA
• ThinkSystem 440-8e SAS/SATA PCIe Gen4 12Gb HBA
• ThinkSystem 440-16i SAS/SATA Gen 4 12Gb HBA
• ThinkSystem 440-16e SAS/SATA Gen 4 12Gb HBA
• ThinkSystem 440-16i SAS/SATA PCIe Gen 4 12Gb Internal HBA

For technical rules for storage controller adapters, see “Technical rules for PCIe
adapters” on page 103.

For technical rules for RAID configuration, see “Technical rules for RAID
configuration” on page 103.

For more information about the RAID/HBA adapters, see https://lenovopress.com/

lp1288-thinksystem-raid-adapter-and-hba-reference.

System fans • Supported fan types:

Chapter 1. Introduction 7
Table 1. Server specifications (continued)

Specification Description

– Standard fan 4056 (21000 RPM)

– Performance fan 4056 (28000 RPM)
• Fan redundancy: N+1 redundancy, one redundant fan rotor
– One processor: six hot-swap dual rotor system fans (one redundant fan rotor)
– Two processors: eight hot-swap dual rotor system fans (one redundant fan
rotor)
Note:
The redundant cooling by the fans in the server enables continued operation if one
rotor of a fan fails.

When the system is powered off but still plugged in to AC power, fans 1 and 2 may
continue to spin at a much lower speed. This is the system design to provide proper
cooling.
For technical rules for system fans, see “Technical rules for system fans” on page
109.

• One processor in processor socket 1

• One memory module in slot 3
Minimal configuration for • One power supply
debugging
• One HDD/SSD drive, one M.2 drive, or one 7mm drive (if OS is needed for
debugging)
• Six system fans (with one processor)

8 ThinkSystem SR630 V2 Maintenance Manual

Table 1. Server specifications (continued)

Specification Description

The server has the following acoustic noise emissions declaration:

Table 2. Acoustic noise emissions declaration

Scenario Sound power Sound
level (LWAd) pressure level
(LpAm): Used configuration
Idlin- Oper- Idlin- Oper-
g ating g ating

Typical 6.0 7.1 45 56 dBA

• Two 165 W processors
Bel Bel dBA
• Eight 64 GB DIMMs
• Eight SAS hard disk drives
• RAID 440-16i adapter
• Intel X710-T2L 10GBASE-T 2-
port OCP adapter
• Two 750-watt power supply
units
Storage 7.5 7.7 61 62 dBA
• Two 165 W processors
rich Bel Bel dBA
• Sixteen 64 GB DIMMs
• Twelve SAS hard disk drives
• RAID 940-16i adapter
• Intel X710-T2L 10GBASE-T 2-
Acoustical noise emissions port OCP adapter
• Two 750-watt power supply
units
GPU rich 7.6 8.3 62 69 dBA
• Two 205 W processors
Bel Bel dBA
• Sixteen 64 GB DIMMs
• Ten SAS hard disk drives
• RAID 940-16i adapter
• Intel X710-T2L 10GBASE-T 2-
port OCP adapter
• Two NVIDIA Tesla T4 GPUs
• Two 1100-watt power supply
units

Notes:
• These sound power levels are measured in controlled acoustical environments
according to procedures specified by ISO 7779 and are reported in accordance
with ISO 9296.
• The declared sound levels may change depending on configuration/conditions, for
example, with high-power NICs, high-power processors and GPUs, such as
ThinkSystem Mellanox ConnectX-6 HDR/200GbE QSFP56 1-port/2-port PCIe
Adapter, ThinkSystem Broadcom 57454 10GBASE-T 4-port OCP Ethernet
Adapter.
• Government regulations (such as those prescribed by OSHA or European
Community Directives) may govern noise level exposure in the workplace and may

Chapter 1. Introduction 9
Table 1. Server specifications (continued)

Specification Description

apply to you and your server installation. The actual sound pressure levels in your
installation depend upon a variety of factors, including the number of racks in the
installation; the size, materials, and configuration of the room; the noise levels
from other equipment; the room ambient temperature, and employee's location in
relation to the equipment. Further, compliance with such government regulations
depends on a variety of additional factors, including the duration of employees'
exposure and whether employees wear hearing protection. Lenovo recommends
that you consult with qualified experts in this field to determine whether you are in
compliance with the applicable regulations.

One or two hot-swap power supplies for redundancy support:

Table 3. Electrical input for power supplies

Power supply 100–127 V 200–240 V ac 240 V dc -48 V dc

ac
500-watt 80 PLUS √ √ √
Platinum
750-watt 80 PLUS √ √ √
Platinum
750-watt 80 PLUS √ √
Titanium

Electrical input 1100-watt 80 √ √ √

PLUS Platinum
1800-watt 80 √ √
PLUS Platinum
1100-watt √

CAUTION:
• 240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland
ONLY.
• Power supply with 240 V dc input cannot support hot plugging power cord
function. Before removing the power supply with dc input, please turn off
server or disconnect dc power sources at the breaker panel or by turning off
the power source. Then, remove the power cord.

The server is supported in the following environment:

• Air temperature:
– Operating:
– ASHRAE class A2: 10–35°C (50–95°F); when the altitude exceeds 900 m
(2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F)
with every 300 m (984 ft) of altitude increase.
Environment – ASHRAE class A3: 5–40°C (41–104°F); when the altitude exceeds 900 m
(2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F)
with every 175 m (574 ft) of altitude increase.
– ASHRAE class A4: 5–45°C (41–113°F); when the altitude exceeds 900 m
(2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F)
with every 125 m (410 ft) of altitude increase.
– Server off: 5–45°C (41–113°F)
– Shipping or storage: -40–60°C (-40–140°F)

10 ThinkSystem SR630 V2 Maintenance Manual

Table 1. Server specifications (continued)

Specification Description

• Maximum altitude: 3050 m (10 000 ft)

• Relative humidity (non-condensing):
– Operating:
– ASHRAE Class A2: 8%–80%, maximum dew point: 21°C (70°F)
– ASHRAE Class A3: 8%–85%, maximum dew point: 24°C (75°F)
– ASHRAE Class A4: 8%–90%, maximum dew point: 24°C (75°F)
– Shipment or storage: 8%–90%
• Particulate contamination

Attention: Airborne particulates and reactive gases acting alone or in

combination with other environmental factors such as humidity or temperature
might pose a risk to the server. For information about the limits for particulates and
gases, see “Particulate contamination” on page 11.

The server is designed for standard data center environment and is recommended to
be placed in industrial data center. Depending on hardware configurations, the server
complies with ASHRAE Class A2, A3, or A4 specifications with certain thermal
restrictions. System performance may be impacted when operating temperature is
out of permitted conditions.

The restrictions to ASHRAE support are as follows:

• The ambient temperature must be no more than 30°C if your server meets any of
the following conditions:
– 205 W < TDP ≤ 270 W
– Installed with any rear 2.5-inch NVMe drive
– Installed with any 256 GB DIMM or PMEM
– Installed with any passive GPU
• The ambient temperature must be no more than 35°C if your server meets any of
the following conditions:
– 165 W < TDP ≤ 205 W
– Installed with any front NVMe drive or rear NVMe AIC SSD
– Installed with any 7mm boot drive
– Installed with any M.2 NVMe drive
– Installed with any rear 2.5-inch SAS/SATA drive
• The ambient temperature must be no more than 45°C if the CPU TDP is equal to
or smaller than 165 W.

Particulate contamination
Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in
combination with other environmental factors such as humidity or temperature might pose a risk to the
device that is described in this document.

Risks that are posed by the presence of excessive particulate levels or concentrations of harmful gases
include damage that might cause the device to malfunction or cease functioning altogether. This
specification sets forth limits for particulates and gases that are intended to avoid such damage. The limits
must not be viewed or used as definitive limits, because numerous other factors, such as temperature or
moisture content of the air, can influence the impact of particulates or environmental corrosives and gaseous

Chapter 1. Introduction 11
contaminant transfer. In the absence of specific limits that are set forth in this document, you must
implement practices that maintain particulate and gas levels that are consistent with the protection of human
health and safety. If Lenovo determines that the levels of particulates or gases in your environment have
caused damage to the device, Lenovo may condition provision of repair or replacement of devices or parts
on implementation of appropriate remedial measures to mitigate such environmental contamination.
Implementation of such remedial measures is a customer responsibility.

Table 4. Limits for particulates and gases

Contaminant Limits
Reactive gases Severity level G1 as per ANSI/ISA 71.04-19851:
• The copper reactivity level shall be less than 200 Angstroms per month (Å/month ≈ 0.0035 μg/
cm2-hour weight gain).2
• The silver reactivity level shall be less than 200 Angstroms per month (Å/month ≈ 0.0035 μg/
cm2-hour weight gain).3
• The reactive monitoring of gaseous corrosivity must be conducted approximately 5 cm (2 in.) in
front of the rack on the air inlet side at one-quarter and three-quarter frame height off the floor
or where the air velocity is much higher.

Airborne Data centers must meet the cleanliness level of ISO 14644-1 class 8.
particulates
For data centers without airside economizer, the ISO 14644-1 class 8 cleanliness might be met by
choosing one of the following filtration methods:
• The room air might be continuously filtered with MERV 8 filters.
• Air entering a data center might be filtered with MERV 11 or preferably MERV 13 filters.

For data centers with airside economizers, the choice of filters to achieve ISO class 8 cleanliness
depends on the specific conditions present at that data center.
• The deliquescent relative humidity of the particulate contamination should be more than 60%
RH.4
• Data centers must be free of zinc whiskers.5

1ANSI/ISA-71.04-1985. Environmental conditions for process measurement and control systems: Airborne
contaminants. Instrument Society of America, Research Triangle Park, North Carolina, U.S.A.
2The derivation of the equivalence between the rate of copper corrosion growth in the thickness of the corrosion
product in Å/month and the rate of weight gain assumes that Cu2S and Cu2O grow in equal proportions.
3The derivation of the equivalence between the rate of silver corrosion growth in the thickness of the corrosion
product in Å/month and the rate of weight gain assumes that Ag2S is the only corrosion product.
4The deliquescent relative humidity of particulate contamination is the relative humidity at which the dust absorbs
enough water to become wet and promote ionic conduction.
5 Surface debris is randomly collected from 10 areas of the data center on a 1.5 cm diameter disk of sticky
electrically conductive tape on a metal stub. If examination of the sticky tape in a scanning electron microscope
reveals no zinc whiskers, the data center is considered free of zinc whiskers.

Firmware updates
Several options are available to update the firmware for the server.

You can use the tools listed here to update the most current firmware for your server and the devices that are
installed in the server.

• Best practices related to updating firmware is available at the following site:

– http://lenovopress.com/LP0656

12 ThinkSystem SR630 V2 Maintenance Manual

• The latest firmware can be found at the following site:
– https://datacentersupport.lenovo.com/products/servers/thinksystem/sr630v2/7z70/downloads/driver-list/
• You can subscribe to product notification to stay up to date on firmware updates:
– https://datacentersupport.lenovo.com/tw/en/solutions/ht509500

Important terminology
• In-band update. The installation or update is performed using a tool or application within an operating
system that is executing on the server’s core CPU.
• Out-of-band update. The installation or update is performed by the Lenovo XClarity Controller collecting
the update and then directing the update to the target subsystem or device. Out-of-band updates have no
dependency on an operating system executing on the core CPU. However, most out-of-band operations
do require the server to be in the S0 (Working) power state.
• On-Target update. The installation or update is initiated from an installed operating system executing on
the target server itself.
• Off-Target update. The installation or update is initiated from a computing device interacting directly with
the server’s Lenovo XClarity Controller.
• UpdateXpress System Packs (UXSPs). UXSPs are bundled updates designed and tested to provide the
interdependent level of functionality, performance, and compatibility. UXSPs are server machine-type
specific and are built (with firmware and device driver updates) to support specific Windows Server, Red
Hat Enterprise Linux (RHEL) and SUSE Linux Enterprise Server (SLES) operating system distributions.
Machine-type-specific firmware-only UXSPs are also available.

Firmware updating tools

See the following table to determine the best Lenovo tool to use for installing and setting up the firmware:

I/O
Update Core Devices Com-
Methods System Firm- Graphi- mand
Suppor- Firmware ware cal user line Supports
Tool ted Updates Updates interface interface UXSPs
Lenovo XClarity Provisioning Manager In-band2 √ √
(LXPM)
On-
Target

Lenovo XClarity Controller Out-of- √ Selected √

(XCC) band I/O
devices
Off-
Target

Lenovo XClarity Essentials OneCLI In-band √ All I/O √ √

(OneCLI) devices
Out-of-
band

On-
Target

Off-
Target

Chapter 1. Introduction 13
 I/O
Update Core Devices Com-
Methods System Firm- Graphi- mand
Suppor- Firmware ware cal user line Supports
Tool ted Updates Updates interface interface UXSPs
Lenovo XClarity Essentials In-band √ All I/O √ √
UpdateXpress devices
(LXCE) Out-of-
band

On-
Target

Off-
Target

Lenovo XClarity Essentials Bootable In-band √ All I/O √ √ √

Media Creator devices (BoMC (BoMC
(BoMC) Out-of- applica- applica-
band tion) tion)

Off-
Target

Lenovo XClarity Administrator In-band1 √ All I/O √ √

(LXCA) devices
Out-of-
band2

Off-
Target

Lenovo XClarity Integrator (LXCI) for Out-of- √ Selected √

VMware vCenter band I/O
devices
Off-
Target

Lenovo XClarity Integrator (LXCI) for In-band √ All I/O √ √

Microsoft Windows Admin Center devices
Out-of-
band

On-
Target

Off-
Target

Lenovo XClarity Integrator (LXCI) for In-band √ All I/O √ √

Microsoft System Center Configuration devices
Manager On-
Target

Notes:
1. For I/O firmware updates.
2. For BMC and UEFI firmware updates.

• Lenovo XClarity Provisioning Manager

14 ThinkSystem SR630 V2 Maintenance Manual

 From Lenovo XClarity Provisioning Manager, you can update the Lenovo XClarity Controller firmware, the
UEFI firmware, and the Lenovo XClarity Provisioning Manager software.

Note: By default, the Lenovo XClarity Provisioning Manager Graphical User Interface is displayed when
you start the server and press the key specified in the on-screen instructions. If you have changed that
default to be the text-based system setup, you can bring up the Graphical User Interface from the text-
based system setup interface.
For additional information about using Lenovo XClarity Provisioning Manager to update firmware, see:
“Firmware Update” section in the LXPM documentation compatible with your server at https://
pubs.lenovo.com/lxpm-overview/

Important: Lenovo XClarity Provisioning Manager (LXPM) supported version varies by product. All
versions of Lenovo XClarity Provisioning Manager are referred to as Lenovo XClarity Provisioning Manager
and LXPM in this document, unless specified otherwise. To see the LXPM version supported by your
server, go to https://pubs.lenovo.com/lxpm-overview/.
• Lenovo XClarity Controller
If you need to install a specific update, you can use the Lenovo XClarity Controller interface for a specific
server.

Notes:
– To perform an in-band update through Windows or Linux, the operating system driver must be installed
and the Ethernet-over-USB (sometimes called LAN over USB) interface must be enabled.
For additional information about configuring Ethernet over USB, see:
“Configuring Ethernet over USB” section in the XCC documentation version compatible with your
server at https://pubs.lenovo.com/lxcc-overview/
– If you update firmware through the Lenovo XClarity Controller, make sure that you have downloaded
and installed the latest device drivers for the operating system that is running on the server.
For specific details about updating firmware using Lenovo XClarity Controller, see:
“Updating Server Firmware” section in the XCC documentation compatible with your server at https://
pubs.lenovo.com/lxcc-overview/

Important: Lenovo XClarity Controller (XCC) supported version varies by product. All versions of Lenovo
XClarity Controller are referred to as Lenovo XClarity Controller and XCC in this document, unless
specified otherwise. To see the XCC version supported by your server, go to https://pubs.lenovo.com/lxcc-
overview/.
• Lenovo XClarity Essentials OneCLI
Lenovo XClarity Essentials OneCLI is a collection of command line applications that can be used to
manage Lenovo servers. Its update application can be used to update firmware and device drivers for
your servers. The update can be performed within the host operating system of the server (in-band) or
remotely through the BMC of the server (out-of-band).
For specific details about updating firmware using Lenovo XClarity Essentials OneCLI is available at:
https://pubs.lenovo.com/lxce-onecli/onecli_c_update
• Lenovo XClarity Essentials UpdateXpress
Lenovo XClarity Essentials UpdateXpress provides most of OneCLI update functions through a graphical
user interface (GUI). It can be used to acquire and deploy UpdateXpress System Pack (UXSP) update
packages and individual updates. UpdateXpress System Packs contain firmware and device driver
updates for Microsoft Windows and for Linux.

Chapter 1. Introduction 15
 You can obtain Lenovo XClarity Essentials UpdateXpress from the following location:
https://datacentersupport.lenovo.com/solutions/lnvo-xpress
• Lenovo XClarity Essentials Bootable Media Creator
You can use Lenovo XClarity Essentials Bootable Media Creator to create bootable media that is suitable
for firmware updates, VPD updates, inventory and FFDC collection, advanced system configuration, FoD
Keys management, secure erase, RAID configuration, and diagnostics on supported servers.
You can obtain Lenovo XClarity Essentials BoMC from the following location:
https://datacentersupport.lenovo.com/solutions/lnvo-bomc
• Lenovo XClarity Administrator
If you are managing multiple servers using the Lenovo XClarity Administrator, you can update firmware for
all managed servers through that interface. Firmware management is simplified by assigning firmware-
compliance policies to managed endpoints. When you create and assign a compliance policy to managed
endpoints, Lenovo XClarity Administrator monitors changes to the inventory for those endpoints and flags
any endpoints that are out of compliance.
For additional information about using Lenovo XClarity Administrator to update firmware, see:
http://sysmgt.lenovofiles.com/help/topic/com.lenovo.lxca.doc/update_fw.html
• Lenovo XClarity Integrator offerings
Lenovo XClarity Integrator offerings can integrate management features of Lenovo XClarity Administrator
and your server with software used in a certain deployment infrastructure, such as VMware vCenter,
Microsoft Admin Center, or Microsoft System Center.
For additional information about using Lenovo XClarity Integrator to update firmware, see:
https://pubs.lenovo.com/lxci-overview/

Tech Tips
Lenovo continually updates the support website with the latest tips and techniques that you can use to solve
issues that your server might encounter. These Tech Tips (also called retain tips or service bulletins) provide
procedures to work around issues or solve problems related to the operation of your server.

To find the Tech Tips available for your server:

1. Go to http://datacentersupport.lenovo.com and navigate to the support page for your server.
2. Click on How To’s from the navigation pane.
3. Click Article Type ➙ Solution from the drop-down menu.
Follow the on-screen instructions to choose the category for the problem that you are having.

Security advisories
Lenovo is committed to developing products and services that adhere to the highest security standards in
order to protect our customers and their data. When potential vulnerabilities are reported, it is the
responsibility of the Lenovo Product Security Incident Response Team (PSIRT) to investigate and provide
information to our customers so they may put mitigation plans in place as we work toward providing
solutions.

The list of current advisories is available at the following location:

https://datacentersupport.lenovo.com/product_security/home

16 ThinkSystem SR630 V2 Maintenance Manual

Power on the server
After the server performs a short self-test (power status LED flashes quickly) when connected to input power,
it enters a standby state (power status LED flashes once per second).

The server can be turned on (power LED on) in any of the following ways:
• You can press the power button.
• The server can respond to remote power-on requests sent to Lenovo XClarity Controller via Lenovo
XClarity Essentials OneCLI, IPMItool, or SSH CLI.
For example, run the following command on Lenovo XClarity Essentials OneCLI to power on your server:
OneCli.exe ospower turnon --bmc USERID:PASSW0RD@host

For more information about running the ospower command, see https://sysmgt.lenovofiles.com/help/topic/
toolsctr_cli_lenovo/onecli_r_ospower_command.html.

If the system UEFI power policy is set to “always on”, the system will be powered on automatically when an
AC source is plugged in.

For information about powering off the server, see “Power off the server” on page 17.

System boot/startup time

The system boot/startup time varies by hardware configurations and may change depending on your server
configuration and conditions.
• For typical configurations without PMEM memory modules, it takes about 3 minutes for the system to
start up.
Configuration example: 2 x processors, 16 x RDIMMs, 1 x RAID adapter, 1 x NIC adapter
• For configurations with PMEM memory modules installed, it may take up to 15 minutes for the system to
start up.
Configuration example: 2 x processors, 16 x RDIMMs, 16 x PMEMs, 1 x RAID adapter, 1 x NIC adapter
• For configurations with PMEM memory modules installed and Intel Volume Management Device (VMD)
enabled, it may take about 20 minutes or longer for the system to start up.
Configuration example: 2 x processors, 16 x RDIMMs, 16 x PMEMs, 1 x RAID adapter, 1 x NIC adapter

Power off the server

The server remains in a standby state when it is connected to a power source, allowing the BMC to respond
to remote power-on requests. To remove all power from the server (power status LED off), you must
disconnect all power cables.

To place the server in a standby state (power status LED flashes once per second):

Note: The Lenovo XClarity Controller can place the server in a standby state as an automatic response to a
critical system failure.
• Start an orderly shutdown using the operating system (if supported by your operating system).
• Press the power button to start an orderly shutdown (if supported by your operating system).
• Press and hold the power button for more than 4 seconds to force a shutdown.
• Send remote power-off commands to Lenovo XClarity Controller via Lenovo XClarity Essentials OneCLI,
IPMItool, or SSH CLI.

Chapter 1. Introduction 17
When in a standby state, the server can respond to remote power-on requests sent to the Lenovo XClarity
Controller. For information about powering on the server, see “Power on the server” on page 17.

18 ThinkSystem SR630 V2 Maintenance Manual

Chapter 2. Server components
Use the information in this section to learn about each of the components associated with your server.

Front view
The front view of the server varies by model. Depending on the model, your server might look slightly
different from the illustrations in this topic.

Refer to the following front view for different server models:

• “Server models with four 2.5-inch front drive bays” on page 19
• “Server models with eight 2.5-inch front drive bays” on page 20
• “Server models with ten 2.5-inch front drive bays” on page 21
• “Server models with 16 EDSFF front drives” on page 21
• “Server models with four 3.5-inch front drive bays” on page 22
• “Server models with 2.5-inch front drive bays (backplane-less)” on page 23
• “Server models with 3.5-inch front drive bays (backplane-less)” on page 23
• “Server models with eight 2.5-inch front drive bays (with LCD diagnostics panel)” on page 24
• “Server models with 16 EDSFF front drives (with LCD diagnostics panel)” on page 24

Server model with four 2.5-inch drive bays

Table 5. Components on the front of the server

Callout Callout
1 Drive status LED 2 Drive activity LED

3 Diagnostics panel 4 USB 3.2 Gen 1 (5Gbps) connector

5 External diagnostics connector 6 XClarity Controller USB connector

7 VGA connector (optional) 8 Rack latch (right)

© Copyright Lenovo 2021, 2024 19

Table 5. Components on the front of the server (continued)

Callout Callout
9 Pull-out information tab 10 Drive filler (1)

11 Drive bays (4) 12 Rack latch (left)

Note: For more information about each component, see “Front components overview” on page 25.

Server model with eight 2.5-inch drive bays

Table 6. Components on the front of the server

Callout Callout
1 Drive status LED 2 Drive activity LED

3 Drive filler (1) 4 Diagnostics panel

5 USB 3.2 Gen 1 (5Gbps) connector 6 External diagnostics connector

7 XClarity Controller USB connector 8 VGA connector (optional)

9 Rack latch (right) 10 Pull-out information tab

11 Drive bays (8) 12 Rack latch (left)

Note: For more information about each component, see “Front components overview” on page 25.

20 ThinkSystem SR630 V2 Maintenance Manual

Server model with ten 2.5-inch drive bays

Table 7. Components on the front of the server

Callout Callout
1 Drive status LED 2 Drive activity LED

3 Diagnostics panel 4 USB 3.2 Gen 1 (5Gbps) connector

5 External diagnostics connector 6 XClarity Controller USB connector

7 VGA connector (optional) 8 Rack latch (right)

9 Pull-out information tab 10 Drive bays (10)

11 Rack latch (left)

Note: For more information about each component, see “Front components overview” on page 25.

Server model with 16 EDSFF drives

Chapter 2. Server components 21

Table 8. Components on the front of the server

Callout Callout
1 Diagnostics panel 2 USB 3.2 Gen 1 (5Gbps) connector

3 External diagnostics connector 4 XClarity Controller USB connector

5 VGA connector (optional) 6 Rack latch (right)

7 Pull-out information tab 8 Drive filler (1)

9 Drive bays (16) 10 Rack latch (left)

Note: For more information about each component, see “Front components overview” on page 25.

Server model with four 3.5-inch drive bays

Table 9. Components on the front of the server

Callout Callout
1 Rack latch (left) 2 VGA connector (optional)

3 External diagnostics connector 4 XClarity Controller USB connector and USB 3.2 Gen 1
(5Gbps) connector

5 Diagnostics panel 6 Rack latch (right)

7 Pull-out information tab 8 Drive bays (4)

9 Drive status LED 10 Drive activity LED

Note: For more information about each component, see “Front components overview” on page 25.

22 ThinkSystem SR630 V2 Maintenance Manual

Server model with 2.5-inch drive bays (backplane-less)

Table 10. Components on the front of the server

Callout Callout
1 Diagnostics panel 2 USB 3.2 Gen 1 (5Gbps) connector

3 External diagnostics connector (reserved) 4 XClarity Controller USB connector

5 VGA connector (optional) 6 Rack latch (right)

7 Pull-out information tab 8 Drive fillers (4)

9 Rack latch (left)

Note: For more information about each component, see “Front components overview” on page 25.

Server model with 3.5-inch drive bays (backplane-less)

Table 11. Components on the front of the server

Callout Callout
1 Rack latch (left) 2 VGA connector (optional)

3 External diagnostics connector 4 XClarity Controller USB connector and USB 3.2 Gen 1
(5Gbps) connector

5 Diagnostics panel 6 Rack latch (right)

7 Pull-out information tab 8 Drive fillers (4)

Note: For more information about each component, see “Front components overview” on page 25.

Chapter 2. Server components 23

Server model with eight 2.5-inch drive bays (with LCD diagnostics panel assembly)

Table 12. Components on the front of the server

Callout Callout
1 Drive status LED 2 Drive activity LED

3 LCD diagnostics panel assembly 4 LCD diagnostics panel

5 USB 3.2 Gen 1 (5Gbps) connector 6 External diagnostics connector

7 XClarity Controller USB connector 8 VGA connector (optional)

9 Rack latch (right) 10 Pull-out information tab

11 Drive bays (8) 12 Rack latch (left)

Note: For more information about each component, see “Front components overview” on page 25.

Server model with 16 EDSFF drives (with LCD diagnostics panel assembly)

24 ThinkSystem SR630 V2 Maintenance Manual

Table 13. Components on the front of the server

Callout Callout
1 LCD diagnostics panel assembly 2 LCD diagnostics panel

3 USB 3.2 Gen 1 (5Gbps) connector 4 External diagnostics connector

5 XClarity Controller USB connector 6 VGA connector (optional)

7 Rack latch (right) 8 Pull-out information tab

9 Drive bays (16) 10 Rack latch (left)

Note: For more information about each component, see “Front components overview” on page 25.

Front components overview

Diagnostics panel
The diagnostics panel is integrated in front I/O assembly on some models. For information about the controls
and status LEDs on the diagnostics panel, see “Diagnostics panel” on page 26.

Drive LEDs
Each drive comes with an activity LED and status LED and the signals are controlled by the backplanes.
Different colors and speeds indicate different activities or status of the drive. The following illustrations and
tables describe the problems that are indicated by drive activity LED and drive status LED.

Figure 4. LEDs on hard disk drives or solid-state drives

Drive LED Status Description

1 Drive status LED Solid yellow The drive has an error.

Blinking yellow (blinking slowly, about one The drive is being rebuilt.
flash per second)

Blinking yellow (blinking rapidly, about four The RAID adapter is locating the drive.
flashes per second)

2 Drive activity LED Solid green The drive is powered but not active.

Blinking green The drive is active.

Chapter 2. Server components 25

External diagnostics port
The connector is for connecting an external diagnostics handset. For more about its functions, see “External
LCD diagnostics handset” on page 33.

Hot-swap drives and drive bays

The drive bays on the front and rear of your server are designed for hot-swap drives. The number of the
installed drives in your server varies by model. When you install drives, follow the order of the drive bay
numbers.

The EMI integrity and cooling of the server are protected by having all drive bays occupied. Vacant drive
bays must be occupied by drive fillers.

LCD diagnostics panel assembly

The assembly comes with an integrated LCD diagnostics panel that can be used to quickly obtain system
status, firmware levels, network information, and health information about the system. For more about the
panel functions, see “LCD diagnostics panel” on page 28.

Pull-out information tab

The Lenovo XClarity Controller network access label is attached on the pull-out information tab. The default
Lenovo XClarity Controller hostname and the IPv6 Link Local Address (LLA) are provided on the tab.

Rack latches
If your server is installed in a rack, you can use the rack latches to help you slide the server out of the rack.
You also can use the rack latches and screws to secure the server in the rack so that the server cannot slide
out, especially in vibration-prone areas. For more information, refer to the Rack Installation Guide that comes
with your rail kit.

USB 3.2 Gen 1 (5Gbps) connectors

The USB 3.2 Gen 1 (5Gbps) connectors can be used to attach a USB-compatible device, such as a USB
keyboard, USB mouse, or USB storage device.

VGA connector
The VGA connectors on the front and rear of the server can be used to attach a high-performance monitor, a
direct-drive monitor, or other devices that use a VGA connector.

XClarity Controller USB connector

The XClarity Controller USB connector can function as a regular USB 2.0 connector to the host OS. In
addition, it can also be used to connect the server to an android or iOS device, where you can then install
and launch the Lenovo XClarity Mobile app to manage the system using XClarity Controller.

For details about using the Lenovo XClarity Mobile app, refer to http://sysmgt.lenovofiles.com/help/topic/
com.lenovo.lxca.doc/lxca_usemobileapp.html.

Diagnostics panel
The diagnostics panel provides controls, connectors, and LEDs.

Note: Diagnostics panel with an LCD display is available for some models. For details, see “LCD diagnostics
panel” on page 28 and “External LCD diagnostics handset” on page 33.

26 ThinkSystem SR630 V2 Maintenance Manual

Figure 5. Diagnostics panel

1 Power button with power status LED

You can press the power button to power on the server when you finish setting up the server. You also can
hold the power button for several seconds to power off the server if you cannot shut down the server from
the operating system. The power status LED helps you to determine the current power status.

Status Color Description

Solid on Green The server is on and running.

Slow blinking Green The server is off and is ready to be powered on (standby state).
(about one flash
per second)

Fast blinking Green The server is off, but the XClarity Controller is initializing, and the server is not
(about four ready to be powered on.
flashes per
second)

Off None There is no ac power applied to the server.

2 Network activity LED

Compatibility of the NIC adapter and the network activity LED

NIC adapter Network activity LED

OCP 3.0 Ethernet adapter Support

PCIe NIC adapter Not support

When an OCP 3.0 Ethernet adapter is installed, the network activity LED on the front I/O assembly helps you
identify the network connectivity and activity. If no OCP 3.0 Ethernet adapter is installed, this LED is off.

Status Color Description

On Green The server is connected to a network.

Blinking Green The network is connected and active.

Off None The server is disconnected from the network.

Note: If the network activity LED is off when an OCP 3.0 Ethernet adapter
is installed, check the network ports in the rear of your server to determine
which port is disconnected.

3 System ID button with system ID LED

Use this system ID button and the blue system ID LED to visually locate the server. A system ID LED is also
located on the rear of the server. Each time you press the system ID button, the state of both the system ID
LEDs changes. The LEDs can be changed to on, blinking, or off. You can also use the Lenovo XClarity

Chapter 2. Server components 27

Controller or a remote management program to change the state of the system ID LEDs to assist in visually
locating the server among other servers.

If the XClarity Controller USB connector is set to have both the USB 2.0 function and XClarity Controller
management function, you can press the system ID button for three seconds to switch between the two
functions.

4 System error LED

The system error LED helps you to determine if there are any system errors.

Status Color Description Action

On Yellow An error has been detected on the server. Check the event log to determine the exact
Causes might include but are not limited to cause of the error.
the following errors: Alternatively, follow the light path
diagnostics to determine if additional LEDs
• The temperature of the server reached
are lit that will direct you to identify the
the non-critical temperature threshold.
cause of the error.
• The voltage of the server reached the
non-critical voltage threshold.
• A fan has been detected to be running at
low speed.
• A hot-swap fan has been removed.
• The power supply has a critical error.
• The power supply is not connected to
the power.

Off None The server is off or the server is on and is None.

working correctly.

LCD diagnostics panel

The LCD diagnostics panel is attached to the front of the server, while it allows quick access to system
information such as errors, system status, firmware, network, and health information.

28 ThinkSystem SR630 V2 Maintenance Manual

Location of the LCD diagnostics panel
The LCD diagnostics panel is attached to the front of the server.

Location

1 The handle with which the panel can be pulled out from the server.
Notes:
Callout
• The panel can be pushed in or pulled out regardless of the system power status.
• When pulling it out, do it gently to avoid damage.

Display panel overview

The diagnostics device consists of an LCD display and 5 navigation buttons.

1 LCD display

2 Scroll buttons (up/down/left/right)

Press the scroll buttons to locate and select system
information.
3 Select button
Press the select button to select from the options in the
menu.

Chapter 2. Server components 29

Option flow diagram
The LCD diagnostics panel displays various system information. Navigate through the options with the scroll
buttons.

The external LCD diagnostics handset displays various system information. Navigate through the options
with the scroll buttons.

Depending on the model, the options and entries on the LCD display might be different.

30 ThinkSystem SR630 V2 Maintenance Manual

Full menu list
Following is the list of available options. Switch between an option and the subordinate information entries
with the select button, and switch among options or information entries with the scroll buttons.

Depending on the model, the options and entries on the LCD display might be different.

Home Menu (System Status Dashboard)

Home Menu Example

1 System name

2 System status

3 Active alert quantity

4 Temperature

5 Power consumption

6 Checkpoint code

Active Alerts

Sub Menu Example

Home screen:
Active error quantity
Note: The “Active Alerts” menu displays only the quantity 1 Active Alerts
of active errors. If no errors occur, the “Active Alerts”
menu will not be available during navigation.

Active Alerts: 1
Press ▼ to view alert details
Details screen:
• Error message ID (Type: Error/Warning/Information) FQXSPPU009N(Error)
• Occurrence time
04/07/2020 02:37:39 PM
• Possible sources of the error
CPU 1 Status:
Configuration Error

System VPD Information

Sub Menu Example

Machine Type: xxxx

• Machine type and serial number Serial Num: xxxxxx
• Universal Unique ID (UUID)
Universal Unique ID:
xxxxxxxxxxxxxxxxxxxxxxxxxxxx

Chapter 2. Server components 31

System Firmware

Sub Menu Example

UEFI
UEFI (Inactive)
• Firmware level (status)
Build: D0E101P
• Build ID
Version: 1.00
• Version number
Date: 2019-12-26
• Release date
XCC Primary
XCC Primary (Active)
• Firmware level (status)
Build: DVI399T
• Build ID
Version: 4.07
• Version number
Date: 2020-04-07
• Release date
XCC Backup
XCC Backup (Active)
• Firmware level (status)
Build: D8BT05I
• Build ID
Version: 1.00
• Version number
Date: 2019-12-30
• Release date

XCC Network Information

Sub Menu Example

• XCC hostname
XCC Network Information
• MAC address
XCC Hostname: XCC-xxxx-SN
• IPv4 Network Mask
MAC Address:
• IPv4 DNS
xx:xx:xx:xx:xx:xx
• IPv6 Link Local IP
IPv4 IP:
• Stateless IPv6 IP
xx.xx.xx.xx
• Static IPv6 IP
IPv4 Network Mask:
• Current IPv6 Gateway
x.x.x.x
• IPv6 DNS
IPv4 Default Gateway:
Note: Only the MAC address that is currently in use is
displayed (extension or shared). x.x.x.x

32 ThinkSystem SR630 V2 Maintenance Manual

System Environmental Information

Sub Menu Example

Ambient Temp: 24 C
Exhaust Temp: 30 C
• Ambient temperature PSU1: Vin= 213 w
• Exhaust temperature Inlet= 26 C
• PSU status FAN1 Front: 21000 RPM
• Spinning speed of fans by RPM FAN2 Front: 21000 RPM
FAN3 Front: 21000 RPM
FAN4 Front: 21000 RPM

Active Sessions

Sub Menu Example

Quantity of active sessions Active User Sessions: 1

Actions

Sub Menu Example

Several quick actions are available:

• Restore XCC to Defaults
• Force XCC Reset
• Request XCC Reset
Request XCC Reset?
• Set UEFI Memory Test
This will request the BMC to reboot itself.
• System reset
Hold √ for 3 seconds
• Request Virtual Reseat
• Modify XCC Static IPv4 Address/Net mask/Gateway
• Modify System Name
• Generate/Download FFDC Service Data

External LCD diagnostics handset

The external LCD diagnostics handset is an external device that is connected to the server with a cable, and
it allows quick access to system information such as errors, system status, firmware, network, and health
information.

Note: The external LCD diagnostics handset is an optional part that needs to be purchased separately.

Chapter 2. Server components 33

Location of the external LCD diagnostics handset
Location Callouts
The external LCD diagnostics handset is connected to the 1 External LCD diagnostics handset
server with an external cable.
2 Magnetic bottom
With this component, the diagnostic handset can be
attached to the top or side of the rack with hands spared
for service tasks.

3 External diagnostics connector

This connector is located on the front of the server, and is
used to connect an external LCD diagnostics handset.

Note: When unplugging the external handset, see the following instructions:

Press the plastic clip on the plug forward.

Hold the clip and remove the cable from the connector.

Display panel overview

The diagnostics device consists of an LCD display and 5 navigation buttons.

34 ThinkSystem SR630 V2 Maintenance Manual

 1 LCD display

2 Scroll buttons (up/down/left/right)

Press the scroll buttons to locate and select system
information.
3 Select button
Press the select button to select from the options in the
menu.

Option flow diagram

The LCD diagnostics panel displays various system information. Navigate through the options with the scroll
buttons.

The external LCD diagnostics handset displays various system information. Navigate through the options
with the scroll buttons.

Depending on the model, the options and entries on the LCD display might be different.

Chapter 2. Server components 35

Full menu list
Following is the list of available options. Switch between an option and the subordinate information entries
with the select button, and switch among options or information entries with the scroll buttons.

Depending on the model, the options and entries on the LCD display might be different.

Home Menu (System Status Dashboard)

36 ThinkSystem SR630 V2 Maintenance Manual

 Home Menu Example

1 System name

2 System status

3 Active alert quantity

4 Temperature

5 Power consumption

6 Checkpoint code

Active Alerts

Sub Menu Example

Home screen:
Active error quantity
Note: The “Active Alerts” menu displays only the quantity 1 Active Alerts
of active errors. If no errors occur, the “Active Alerts”
menu will not be available during navigation.

Active Alerts: 1
Press ▼ to view alert details
Details screen:
• Error message ID (Type: Error/Warning/Information) FQXSPPU009N(Error)
• Occurrence time
04/07/2020 02:37:39 PM
• Possible sources of the error
CPU 1 Status:
Configuration Error

System VPD Information

Sub Menu Example

Machine Type: xxxx

• Machine type and serial number Serial Num: xxxxxx
• Universal Unique ID (UUID)
Universal Unique ID:
xxxxxxxxxxxxxxxxxxxxxxxxxxxx

Chapter 2. Server components 37

System Firmware

Sub Menu Example

UEFI
UEFI (Inactive)
• Firmware level (status)
Build: D0E101P
• Build ID
Version: 1.00
• Version number
Date: 2019-12-26
• Release date
XCC Primary
XCC Primary (Active)
• Firmware level (status)
Build: DVI399T
• Build ID
Version: 4.07
• Version number
Date: 2020-04-07
• Release date
XCC Backup
XCC Backup (Active)
• Firmware level (status)
Build: D8BT05I
• Build ID
Version: 1.00
• Version number
Date: 2019-12-30
• Release date

XCC Network Information

Sub Menu Example

• XCC hostname
XCC Network Information
• MAC address
XCC Hostname: XCC-xxxx-SN
• IPv4 Network Mask
MAC Address:
• IPv4 DNS
xx:xx:xx:xx:xx:xx
• IPv6 Link Local IP
IPv4 IP:
• Stateless IPv6 IP
xx.xx.xx.xx
• Static IPv6 IP
IPv4 Network Mask:
• Current IPv6 Gateway
x.x.x.x
• IPv6 DNS
IPv4 Default Gateway:
Note: Only the MAC address that is currently in use is
displayed (extension or shared). x.x.x.x

38 ThinkSystem SR630 V2 Maintenance Manual

System Environmental Information

Sub Menu Example

Ambient Temp: 24 C
Exhaust Temp: 30 C
• Ambient temperature PSU1: Vin= 213 w
• Exhaust temperature Inlet= 26 C
• PSU status FAN1 Front: 21000 RPM
• Spinning speed of fans by RPM FAN2 Front: 21000 RPM
FAN3 Front: 21000 RPM
FAN4 Front: 21000 RPM

Active Sessions

Sub Menu Example

Quantity of active sessions Active User Sessions: 1

Actions

Sub Menu Example

Several quick actions are available:

• Restore XCC to Defaults
• Force XCC Reset
• Request XCC Reset
Request XCC Reset?
• Set UEFI Memory Test
This will request the BMC to reboot itself.
• System reset
Hold √ for 3 seconds
• Request Virtual Reseat
• Modify XCC Static IPv4 Address/Net mask/Gateway
• Modify System Name
• Generate/Download FFDC Service Data

Rear view
The rear view of the server varies by model. Depending on the model, your server might look slightly different
from the illustrations in this topic.

Refer to the following rear view for different server models:

• “Server model with three PCIe slots” on page 39
• “Server model with two PCIe slots” on page 40
• “Server model with two hot-swap 2.5-inch rear drive bays and one PCIe slot” on page 40
• “Server model with two hot-swap 7mm rear drive bays and two PCIe slots” on page 41

Server model with three PCIe slots

The following illustration shows the rear view of server model with three PCIe slots. Depending on the model,
your server might look slightly different from the illustration below.

Chapter 2. Server components 39

Table 14. Components on the rear of the server

Callout Callout
1 PCIe slot 1 on riser 1 assembly 2 PCIe slot 2 on riser 1 assembly

3 PCIe slot 3 on riser 2 assembly 4 Power supply 2 (optional)

5 Power supply 1 6 NMI button

7 USB 3.2 Gen 1 (5Gbps) connectors (3 DCIs) 8 VGA connector

9 XClarity Controller network connector 10 Ethernet connectors on OCP 3.0 Ethernet adapter
(optional)

Note: For more information about each component, see “Rear components overview” on page 41.

Server model with two PCIe slots

The following illustration shows the rear view of the server model with two PCIe slots. Depending on the
model, your server might look slightly different from the illustration below.

Table 15. Components on the rear of the server

Callout Callout
1 PCIe slot 1 on riser 1 assembly 2 PCIe slot 2 on riser 1 assembly

3 Power supply 2 (optional) 4 Power supply 1

5 NMI button 6 USB 3.2 Gen 1 (5Gbps) connectors (3 DCIs)

7 VGA connector 8 XClarity Controller network connector

9 Ethernet connectors on OCP 3.0 Ethernet adapter

(optional, two or four connectors may be available)

Note: For more information about each component, see “Rear components overview” on page 41.

Server model with two 2.5-inch hot-swap rear drive bays and one PCIe slot
The following illustration shows the rear view of the server model with two hot-swap drive bays and one PCIe
slot. Depending on the model, your server might look slightly different from the illustration below.

40 ThinkSystem SR630 V2 Maintenance Manual

Table 16. Components on the rear of the server

Callout Callout
1 PCIe slot 1 on riser 1 assembly 2 Rear 2.5-inch drive bays (2)

3 Power supply 2 (optional) 4 Power supply 1

5 NMI button 6 USB 3.2 Gen 1 (5Gbps) connectors (3 DCIs)

7 VGA connector 8 XClarity Controller network connector

9 Ethernet connectors on OCP 3.0 Ethernet adapter

(optional, two or four connectors may be available)

Note: For more information about each component, see “Rear components overview” on page 41.

Server model with two 7mm hot-swap rear drive bays and two PCIe slots
The following illustration shows the rear view of the server model with two 7mm hot-swap rear drive bays and
two PCIe slots. Depending on the model, your server might look slightly different from the illustration below.

Table 17. Components on the rear of the server

Callout Callout
1 PCIe slot 1 on riser 1 assembly 2 PCIe slot 2 on riser 1 assembly

3 Rear 7mm drive bays (2) 4 Power supply 2 (optional)

5 Power supply 1 6 NMI button

7 USB 3.2 Gen 1 (5Gbps) connectors (3 DCIs) 8 VGA connector

9 XClarity Controller network connector 10 Ethernet connectors on OCP 3.0 Ethernet adapter
(optional, two or four connectors may be available)

Note: For more information about each component, see “Rear components overview” on page 41.

Rear components overview

Drive LEDs
Each hot-swap drive comes with an activity LED and status LED and the signals are controlled by the
backplanes. Different colors and speeds indicate different activities or status of the drive. The following
illustration shows the LEDs on a Hard disk drive or solid–state drive.

Chapter 2. Server components 41

Figure 6. Drive LEDs

Drive LED Status Description

1 Drive status LED (right) Solid yellow The drive has an error.

Blinking yellow (blinking slowly, about one The drive is being rebuilt.
flash per second)

Blinking yellow (blinking rapidly, about four The RAID adapter is locating the drive.
flashes per second)

2 Drive activity LED (left) Solid green The drive is powered but not active.

Blinking green The drive is active.

Ethernet connectors

Figure 7. OCP 3.0 Ethernet adapter (two connectors, seen Figure 8. OCP 3.0 Ethernet adapter (four connectors, seen
from the rear) from the rear)

• The OCP 3.0 Ethernet adapter provides two or four extra Ethernet connectors for network connections.
• By default, Ethernet connector 1 (the first port starting from the left in the rear server view) on the OCP 3.0
Ethernet adapter can also function as a management connector using the shared management capacity. If
the shared management connector fails, traffic can automatically switch over to another connector on the
adapter.

Hot-swap drives and drive bays

The drive bays on the front and rear of your server are designed for hot-swap drives. The number of the
installed drives in your server varies by model. When you install drives, follow the order of the drive bay
numbers.

The EMI integrity and cooling of the server are protected by having all drive bays occupied. Vacant drive
bays must be occupied by drive fillers.

NMI button
Press this button to force a nonmaskable interrupt (NMI) to the processor. By this way, you can make the
operating system halt (such as Windows Blue Screen of Death) and take a memory dump. You might have to
use a pen or the end of a straightened paper clip to press the button.

42 ThinkSystem SR630 V2 Maintenance Manual

PCIe slots
The PCIe slots are on the rear of the server and your server supports up to three PCIe slots on riser 1 and 2
assemblies.

Power supply units

The hot-swap redundant power supply helps you avoid significant interruption to the operation of the system
when a power supply fails. You can purchase a power supply option from Lenovo and install the power
supply to provide power redundancy without turning off the server.

On each power supply, there are three status LEDs near the power cord connector. For information about the
LEDs, see “Rear view LEDs” on page 43.

USB 3.2 Gen 1 (5Gbps) connectors

The USB 3.2 Gen 1 (5Gbps) connectors are direct connect interfaces (DCIs) for debugging, which can be
used to attach a USB-compatible device, such as a USB keyboard, USB mouse, or USB storage device.

VGA connector
The VGA connectors on the front and rear of the server can be used to attach a high-performance monitor, a
direct-drive monitor, or other devices that use a VGA connector.

XClarity Controller network connector

The XClarity Controller network connector can be used to attach an Ethernet cable to manage the baseboard
management controller (BMC).

Rear view LEDs

The rear of the server provides system ID LED, system error LED, Ethernet LEDs, and power supply LEDs.

Server rear view LEDs

The following illustration shows the LEDs on the rear view of server model with two PCIe slots. The LEDs on
the rear view of other server models are the same.

Figure 9. Rear view LEDs

Table 18. LEDs on the rear view of the server

Callout Callout
1 Ethernet link LED 2 Ethernet activity LED

3 Power input LED 4 Power output LED

5 Power supply error LED 6 System error LED

7 System ID LED

1 Ethernet link LED

2 Ethernet activity LED
The BMC network connector has two status LEDs.

Chapter 2. Server components 43

 Ethernet status LED Color Status Description

1 Ethernet link LED Green On Network link is established.

None Off Network link is disconnected.
2 Ethernet activity LED Green Blinking Network link is connected and active.

None Off The server is disconnected from a LAN.

3 4 5 Power supply LEDs

Each hot-swap power supply has three status LEDs.

LED Description

3 Power input
• Green: The power supply is connected to the ac power source.
LED
• Off: The power supply is disconnected from the ac power source or a power problem occurs.

4 Power output
• Green: The server is on and the power supply is working normally.
LED
• Blinking green: The power supply is in the zero-output mode (standby). When the server
power load is low, one of the installed power supplies enters into the standby state while the
other one delivers the entire load. When the power load increases, the standby power supply
will switch to active state to provide sufficient power to the system.
To disable zero-output mode, log in to the Lenovo XClarity Controller web interface, choose
Server Configuration ➙ Power Policy, disable Zero Output Mode, and then click Apply. If
you disable the zero-out mode, both power supplies will be in the active state.
• Off: The server is powered off, or the power supply is not working properly. If the server is
powered on but the LED is off, replace the power supply.

5 Power supply
• Yellow: The power supply has failed. To resolve the issue, replace the power supply.
error LED
• Off: The power supply is working normally.

6 System error LED

The system error LED helps you to determine if there are any system errors. For details, see “Diagnostics
panel” on page 26.

7 System ID LED
The blue system ID LED helps you to visually locate the server. A system ID LED is also located on the front
of the server. Each time you press the system ID button, the state of both the system ID LEDs changes. The
LEDs can be changed to on, blinking, or off. You can also use the Lenovo XClarity Controller or a remote
management program to change the state of the system ID LEDs to assist in visually locating the server
among other servers.

System board components

The illustration in this section shows the component locations on the system board.

44 ThinkSystem SR630 V2 Maintenance Manual

Figure 10. System board components

Callout Callout
1 NMI Button 2 SATA Connector 0

3 System Board Release Pin 4 Serial Port Module Connector

5 Internal USB Connector 6 Riser 1 Slot

7 SATA Connector 1 8 7mm/M.2 Signal Connector

9 OCP 3.0 Network Card Connector 10 TPM Module Connector

11 SATA 2/Rear Backplane Signal Connector 12 Front USB Connector

13 PCIe Connector 1 14 PCIe Connector 2

15 Front VGA Connector 16 M.2 Power Connector

17 External LCD Connector 18 Front Panel Connector

19 Intrusion Switch Connector 20 Internal RAID Power Connector

21 Fan 1-8 Connectors 22 PCIe Connector 3

23 PCIe Connector 4 24 System Board Lift Handle

25 Power Supply 1 Connector 26 PCIe Connector 5

Chapter 2. Server components 45

 Callout Callout
27 PCIe Connector 6 28 Front Backplane Power Connector

29 Power Supply 2 Connector 30 3V Battery (CR2032)

31 Riser 2 slot

System board LEDs

The illustration in this section shows the LEDs on the system board.

Figure 11. System board LEDs

Table 19. LEDs on the system board

Callout Callout
1 System error LED 2 System ID LED

3 BMC heart beat LED 4 Memory module error LEDs

1 System error LED

When this yellow LED is lit, one or more LEDs elsewhere in the server might also be lit to direct you to the
source of the error. For more information, see “Rear view LEDs” on page 43.

46 ThinkSystem SR630 V2 Maintenance Manual

2 System ID LED

The blue system ID LED helps you to visually locate the server. A system ID LED is also located on the front
of the server. Each time you press the system ID button, the state of both the system ID LEDs changes. The
LEDs can be changed to on, blinking, or off.

3 BMC heart beat LED

The BMC heart beat LED helps you identify the BMC status.

Status Color Description

On Green The BMC is not alive.

Blinking Green The BMC is alive.

Off None The BMC is not alive.

4 Memory module error LEDs

When a memory module error LED is lit, it indicates that the corresponding memory module has failed.

Switch block
The following illustrates the location and functions of the switch block on the system board.

Important:
• Before you move any switch, turn off the server; then, disconnect all power cords and external cables. Do
not open your server or attempt any repair before reading and understanding the following information:
– https://pubs.lenovo.com/safety_documentation/
– “Handling static-sensitive devices” on page 88
• If there is a clear protective sticker on the top of the switch block, you must remove and discard it to
access the switches.
• Any system-board switch or jumper block that is not shown in the illustrations in this document is
reserved.

Chapter 2. Server components 47

Figure 12. Switch block location on the system board

Table 20. Switch description

Switch number Switch name Description

1 SW8-1 ME firmware security • OFF: The switch is in default setting.

override switch • ON: Enable Flash security override.

2 SW8-2 Clear CMOS switch • OFF: The switch is in default setting.

• ON: Clear the real-time clock (RTC) registry.

3 SW8-3 Force XCC reset switch • OFF: The switch is in default setting.
• ON: Reset the Lenovo XClarity Controller.

4 SW8-4 Force XCC update • OFF: The switch is in default setting.

switch • ON: Force XClarity Controller firmware to enter the booting
mode (for development purpose only).

5 SW8-5 XCC SPI0 half ROM • OFF: The switch is in default setting.
switch • ON: Force XClarity Controller to boot from a backup image.

6 SW8-6 Low security switch • OFF: The switch is in default setting.

• ON: Enable low security mode for XClarity Controller
firmware (For development purpose only).

7 SW8-7 Reserved Reserved

8 SW8-8 Override power-on • OFF: The switch is in default setting.
password switch • ON: Override the power-on password.

48 ThinkSystem SR630 V2 Maintenance Manual

Parts list
Use the parts list to identify each of the components that are available for your server.

For more information about ordering the parts shown in Figure 13 “Server components” on page 49:

https://datacentersupport.lenovo.com/products/servers/thinksystem/sr630v2/7z70/parts

It is highly recommended that you check the power summary data for your server using Lenovo Capacity
Planner before purchasing any new parts.

Note: Depending on the model, your server might look slightly different from the illustration.

Figure 13. Server components

The parts listed in the following table are identified as one of the following:

Chapter 2. Server components 49

• Tier 1 customer replaceable unit (CRU): Replacement of Tier 1 CRUs is your responsibility. If Lenovo
installs a Tier 1 CRU at your request with no service agreement, you will be charged for the installation.
• Tier 2 customer replaceable unit (CRU): You may install a Tier 2 CRU yourself or request Lenovo to
install it, at no additional charge, under the type of warranty service that is designated for your server.
• Field replaceable unit (FRU): FRUs must be installed only by trained service technicians.
• Consumable and Structural parts: Purchase and replacement of consumable and structural parts is
your responsibility. If Lenovo acquires or installs a structural component at your request, you will be
charged for the service.

Note: Unless otherwise specified in other agreements or contract terms, parts beyond their warranty terms
and/or parts that have reached their maximum usage limitations do not qualify for warranty service.

Table 21. Parts list

Consumable
and
Index Description Tier 1 CRU Tier 2 CRU FRU
Structural
parts

For more information about ordering the parts shown in Figure 13 “Server components” on page 49:

https://datacentersupport.lenovo.com/products/servers/thinksystem/sr630v2/7z70/parts

1 Top cover √
2 Standard air baffle √
3 Riser assembly (LP) √
4 Riser assembly (LP+LP) √
5 Riser assembly (LP+FH) √
6 Rear wall bracket √
7 PCIe adapter √
8 System board √
RAID flash power module holder (on
9
chassis) √

RAID flash power module holder (in

10
riser cage) √

11 RAID flash power module √

12 OCP 3.0 Ethernet adapter √
13 Power supply unit √
14 Power supply unit filler √
Front I/O assembly with diagnostics
15
panel (right) √

16 Front I/O assembly √

17 External LCD diagnostics handset √
18 LCD diagnostics panel assembly √
19 EIA (right) √
20 LCD diagnostics panel √

50 ThinkSystem SR630 V2 Maintenance Manual

Table 21. Parts list (continued)

Consumable
and
Index Description Tier 1 CRU Tier 2 CRU FRU
Structural
parts

Front I/O assembly with diagnostics

21
panel (top) √

22 2.5-inch drive bay filler √

23 2.5-inch drive √
24 3.5-inch drive √
25 7mm drive cage √
26 7mm drive backplane (bottom) √
27 7mm drive backplane (top) √
28 4-EDSFF cage √
29 7mm drive √
30 7mm drive bay filler √
31 EDSFF drive √
32 Security bezel √
33 4 x 2.5-inch front drive backplane √
34 16-EDSFF front drive backplane √
35 8 x 2.5-inch front drive backplane √
36 10 x 2.5-inch front drive backplane √
37 4 x 3.5-inch front drive backplane √
38 2 x 2.5-inch rear drive cage √
39 2 x 2.5-inch rear drive backplane √
40 Internal RAID module √
41 Intrusion switch cable √
42 Fan module √
43 Memory module √
44 Chassis √
45 Heat sink PEEK nut √
46 Standard heat sink √
47 Performance heat sink (T-shape) √
48 Processor √
49 M.2 drive √
50 M.2 backplane √
TPM adapter (for Chinese Mainland
51
only) √

Chapter 2. Server components 51

Table 21. Parts list (continued)

Consumable
and
Index Description Tier 1 CRU Tier 2 CRU FRU
Structural
parts

52 M.2 retainer clip √

53 CMOS battery (CR2032) √

Power cords
Several power cords are available, depending on the country and region where the server is installed.

To view the power cords that are available for the server:
1. Go to: http://dcsc.lenovo.com/#/
2. Click Preconfigured Model or Configure to order.
3. Enter the machine type and model for your server to display the configurator page.
4. Click Power ➙ Power Cables to see all line cords.

Notes:
• For your safety, a power cord with a grounded attachment plug is provided to use with this product. To
avoid electrical shock, always use the power cord and plug with a properly grounded outlet.
• Power cords for this product that are used in the United States and Canada are listed by Underwriter's
Laboratories (UL) and certified by the Canadian Standards Association (CSA).
• For units intended to be operated at 115 volts: Use a UL-listed and CSA-certified cord set consisting of a
minimum of 18 AWG, Type SVT or SJT, three-conductor cord, a maximum of 15 feet in length and a
parallel blade, grounding-type attachment plug rated 15 amperes, 125 volts.
• For units intended to be operated at 230 volts (U.S. use): Use a UL-listed and CSA-certified cord set
consisting of a minimum of 18 AWG, Type SVT or SJT, three-conductor cord, a maximum of 15 feet in
length and a tandem blade, grounding-type attachment plug rated 15 amperes, 250 volts.
• For units intended to be operated at 230 volts (outside the U.S.): Use a cord set with a grounding-type
attachment plug. The cord set should have the appropriate safety approvals for the country in which the
equipment will be installed.
• Power cords for a specific country or region are usually available only in that country or region.

52 ThinkSystem SR630 V2 Maintenance Manual

Chapter 3. Internal cable routing
See this section to do cable routing for specific components.

Some of the components in the server have internal cables and cable connectors. For details, see the
following cable routing sections:
• “CFF HBA/RAID adapter” on page 54
• “Front I/O” on page 57
• “Intrusion switch” on page 58
• “RAID flash power modules” on page 59
• “M.2 drive backplane” on page 61
• “16-EDSFF drive backplane” on page 62
• “7mm drive backplane” on page 63
• “2.5-inch/3.5-inch drive backplane (power)” on page 64
• “2.5-inch/3.5-inch drive backplane (signal)” on page 65

Read the following guidelines carefully before you connect any cables:
• Power off the server before you connect or disconnect any internal cables.
• See the documentation that comes with any external devices for additional cabling instructions. It might
be easier for you to route cables before you connect the devices to the server.
• Cable identifiers of some cables are printed on the cables that come with the server and optional devices.
Use these identifiers to connect the cables to the correct connectors.
• Ensure that the relevant cables pass through the cable clips.

© Copyright Lenovo 2021, 2024 53

 Cable Route
holder
1 3 4 Route to BP Pwr connector, RAID Pwr connector, and PCIe connectors (3, 4, 5, 6)
2 Route to intrusion switch cable
5 6 Route to FIO connector, LCD external connector, M.2 Pwr connector, VGA connector, Front USB
connector, PCIe connectors (1, 2, 7, 8), 7mm/M.2 connector, SATA connectors (0, 1, 2), and RAID/
HBA connectors

Note: Disengage all latches, release tabs, or locks on cable connectors when you disconnect cables from
the system board. Failing to release them before removing the cables will damage the cable sockets on the
system board, which are fragile. Any damage to the cable sockets might require replacing the system board.

CFF HBA/RAID adapter

Use the section to understand the power cable and input cable routing for CFF HBA/RAID adapter.

Power and MB input cable routing for CFF HBA/RAID adapters

Note: The illustration only involves power cable and MB input cable routing. For signal cable routing of CFF
HBA/RAID adapters, see “2.5-inch/3.5-inch drive backplane (signal)” on page 65.
• “Cable routing for Gen 4 CFF RAID adapters” on page 54
• “Cable routing for Gen 3 CFF RAID adapters” on page 55

Cable routing for Gen 4 CFF RAID adapters

Gen 4 CFF RAID adapter supported:
• ThinkSystem RAID 940-16i 8GB Flash PCIe Gen 4 12Gb Internal Adapter

54 ThinkSystem SR630 V2 Maintenance Manual

Figure 14. Cable routing for Gen 4 CFF RAID adapters

From To
1 Power connector on the CFF HBA/RAID adapter Internal RAID connector on the system board

2 Input connector on the CFF HBA/RAID adapter PCIe 1 (for server model with the 8 x 2.5-inch SAS/SATA
backplane with both one and two processors installed)

PCIe 3 (for server model with the 6 x 2.5-inch SAS/SATA

and 4 x 2.5-inch AnyBay backplane with two processors
installed)

Note: With one processor installed, the server does not

support the 6 x 2.5-inch SAS/SATA and 4 x 2.5-inch
AnyBay backplane.

Cable routing for Gen 3 CFF RAID adapters

Gen 3 CFF RAID adapters supported:
• ThinkSystem RAID 5350-8i PCIe 12Gb Internal Adapter
• ThinkSystem RAID 9350-8i 2GB Flash PCIe 12Gb Internal Adapter
• ThinkSystem RAID 9350-16i 4GB Flash PCIe 12Gb Internal Adapter

Chapter 3. Internal cable routing 55

Figure 15. Cable routing for Gen 3 CFF RAID adapters

From To
1 Power connector on the CFF HBA/RAID adapter Internal RAID connector on the system board

2 Input connector on the CFF HBA/RAID adapter PCIe 1 (for server model with the 8 x 2.5-inch SAS/SATA
backplane with both one and two processors installed)

PCIe 3 (for server model with the 6 x 2.5-inch SAS/SATA

and 4 x 2.5-inch AnyBay backplane with two processors
installed)

Note: With one processor installed, the server does not

support the 6 x 2.5-inch SAS/SATA and 4 x 2.5-inch
AnyBay backplane.

56 ThinkSystem SR630 V2 Maintenance Manual

Front I/O
Use the section to understand the cable routing for Front I/O.

Cable routing for Front I/O

Note: The illustration shows the cabling scenario for server models with four 3.5-inch front drive bays.
Location of each connector on the front of the server varies by models. For detailed location of front I/O
components for different models, see “Front view” on page 19.

Figure 16. Cable routing for Front I/O

From To
1 VGA cable VGA connector on the system board

2 LCD external diagnostics handset cable LCD EXT connector on the system board

3 USB cable Front USB connector on the system board

4 Front diagnostic panel cable FIO connector on the system board

Chapter 3. Internal cable routing 57

Intrusion switch
Use the section to understand the cable routing for the intrusion switch.

Figure 17. Intrusion switch cable routing

From To
1 Intrusion switch cable on the fan cage Intrusion switch connector on the system board

58 ThinkSystem SR630 V2 Maintenance Manual

RAID flash power modules
Use the section to understand the cable routing for RAID flash power modules.

RAID flash power module locations

Callout Location Scenario

1 Super capacitor on the chassis 2.5'' chassis installed with a standard or
performance heat sink
2 Super capacitors in the air baffle 2.5'' or 3.5'' chassis installed with a standard heat
sink
3 Super capacitors in the riser 1 slot 3.5'' chassis installed with a performance heat
sink

An extension cable is provided for each RAID flash power module for connection. Connect the super
capacitor cable to the super capacitor connector on the corresponding RAID adapter as shown.

Chapter 3. Internal cable routing 59

Figure 18. Power cable routing for super capacitor

From To
RAID flash power module Super capacitor connector on the RAID adapter

60 ThinkSystem SR630 V2 Maintenance Manual

M.2 drive backplane
This section provides cable routing information for the M.2 drives.

Figure 19. Cable routing for M.2 drives

From To
1 Power cable M.2 power connector on the system board

2 M.2 signal cable 7mm/M.2 signal connector on the system board

Chapter 3. Internal cable routing 61

16-EDSFF drive backplane
This section provides cable routing information for the EDSFF drives.

Figure 20. Cable routing for EDSFF drives

From To
1 EDSFF 0/1 PCIe 6
1 EDSFF 2/3 PCIe 5
1 EDSFF 4/5 PCIe 4
1 EDSFF 6/7 PCIe 3
2 Power connector on the drive backplane Front backplane power connector on the system board

3 EDSFF 8/9 C1 on the retimer card

3 EDSFF 10/11 C0 on the retimer card
3 EDSFF 12/13 PCIe 2
3 EDSFF 14/15 PCIe 1

62 ThinkSystem SR630 V2 Maintenance Manual

7mm drive backplane
This section provides cable routing information for the 7mm drives.

Figure 21. Cable routing for 7mm drives

From To
1 7mm signal cable 7mm/M.2 signal connector on the system board

2 Power cable Power connectors on the rise card on the riser 1 assembly

Chapter 3. Internal cable routing 63

2.5-inch/3.5-inch drive backplane (power)
Use the section to understand the power cable routing for 2.5-inch or 3.5-inch drive backplanes.

Figure 22. Backplane power cable connection

From To
1 Power connector on the front drive backplane Front backplane power connector on the system board

2 Power connector on the rear drive backplane Power connectors on the rise card on the riser 1
assembly

64 ThinkSystem SR630 V2 Maintenance Manual

2.5-inch/3.5-inch drive backplane (signal)
Use the section to understand the cable routing for signal cable connections for 2.5-inch/3.5-inch drive
backplanes.

Your server supports the following server models with:

• “4 x 3.5-inch front drive bays” on page 65
• “4 x 2.5-inch front drive bays” on page 69
• “8 x 2.5-inch front drive bays” on page 72
• “10 x 2.5-inch front drive bays” on page 78

4 x 3.5-inch front drive bays

Use this section to understand the backplane cable routing for server model with four 3.5-inch front drives.

To connect cables for a 7mm drive backplane, refer to “7mm drive backplane” on page 63.

To connect power cables for a backplane for standard 2.5-inch or 3.5-inch drives, refer to “2.5-inch/3.5-inch
drive backplane (power)” on page 64.

To connect signal cables for a backplane for standard 4 x 3.5-inch front drives, refer to the following cable
routing scenarios depending on your server configuration:
• “Cable routing for onboard configuration” on page 66
• “Cable routing with an SFF HBA/RAID adapter” on page 67
• “Cable routing with an SFF RAID adapter (tri-mode)” on page 68

Chapter 3. Internal cable routing 65

Cable routing for onboard configuration
The following table shows the mapping relationship between backplane connectors and system board
connectors for onboard configuration.

Table 22. Mapping between backplane connectors and system board connectors for onboard configuration

Backplanes From To

Front BP (NVMe) NVMe 0-1*, 2-3* PCIe 1, PCIe 2

Front BP (SAS) SAS SATA 0

SAS SATA 2
Rear BP (if any)
NVMe 0, NVMe 1 PCIe 6

Note: *NVMe 0-1 and NVMe 2-3 connectors are available only when the 4 x 3.5'' AnyBay front backplane is
used.

The following figure illustrates the cable routing for the onboard configuration of 4 x 3.5-inch front AnyBay
drive bays with a rear 2 x 2.5-inch NVMe drive cage. Connections between connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔
3 , ... n ↔ n

Figure 23. Cable routing for onboard configuration of 4 x 3.5-inch front AnyBay drive bays with a rear 2 x 2.5-inch NVMe
drive cage

66 ThinkSystem SR630 V2 Maintenance Manual

Cable routing with an SFF HBA/RAID adapter
The following table shows the mapping relationship between backplane connectors and system board/
adapter connectors when an 8i SFF HBA/RAID adapter (Gen 3 or Gen 4) is installed.

Table 23. Mapping between backplane connectors and system board/adapter connectors when an SFF HBA/RAID
adapter is installed

Backplanes From To

Front BP (NVMe) NVMe 0-1*, 2-3* PCIe 1, PCIe 2

Front BP (SAS) SAS C0

SAS Gen 3: C1; Gen 4: C0

Rear BP (if any)
NVMe 0, NVMe 1 PCIe 6

Notes:
• *NVMe 0-1 and NVMe 2-3 connectors are available only when the 4 x 3.5'' AnyBay front backplane is
used.
• Gen 3 and Gen 4 SFF HBA/RAID adapters are slightly different in their connectors, but the cable routing
method is similar.

The following figure illustrates the cable routing for the configuration of 4 x 3.5-inch front AnyBay drive bays
with an 8i SFF RAID adapter (Gen 4) and a rear 2 x 2.5-inch SAS/SATA drive cage. Connections between
connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔ 3 , ... n ↔ n

Figure 24. Cable routing for 4 x 3.5-inch front AnyBay drive bays with an 8i SFF RAID adapter (Gen 4) and a rear 2 x 2.5-
inch SAS/SATA drive cage

Chapter 3. Internal cable routing 67

Cable routing with an SFF RAID adapter (tri-mode)
The following table shows the mapping relationship between backplane connectors and adapter connectors
when a Gen 4 8i SFF RAID adapter (tri-mode) is installed.

Table 24. Mapping between backplane connectors and adapter connectors when a Gen 4 8i SFF RAID adapter (tri-mode)
is installed
Backplane From To

Front BP (SAS) SAS 0 C0

Note: If a tri-mode RAID adapter is used, only U.3 front drives are supported, and U.2 front drives are not
supported.

The following figure illustrates the cable routing for the configuration of 4 x 3.5-inch front U.3 drive bays with
a 16i SFF RAID adapter (tri-mode). Connections between connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔ 3 , ... n ↔ n

Figure 25. Cable routing for 4 x 3.5-inch front U.3 drive bays with a Gen 4 8i SFF RAID adapter (tri-mode)

68 ThinkSystem SR630 V2 Maintenance Manual

4 x 2.5-inch front drive bays
Use this section to understand the backplane cable routing for server model with four 2.5-inch front drives.

To connect cables for a 7mm drive backplane, refer to “7mm drive backplane” on page 63.

To connect power cables for a backplane for standard 2.5-inch or 3.5-inch drives, refer to “2.5-inch/3.5-inch
drive backplane (power)” on page 64.

To connect signal cables for a backplane for standard 4 x 2.5-inch front drives, refer to the following cable
routing scenarios depending on your server configuration:
• “Cable routing for onboard configuration” on page 70
• “Cable routing with an SFF HBA/RAID adapter” on page 71

Chapter 3. Internal cable routing 69

Cable routing for onboard configuration
The following table shows the mapping relationship between backplane connectors and system board
connectors for onboard configuration.

Table 25. Mapping between backplane connectors and system board connectors for onboard configuration

Backplanes From To

Front BP (SAS) SAS SATA 0

The following figure illustrates the cable routing for the onboard configuration of 4 x 2.5-inch front SAS/SATA
drive bays. Connections between connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔ 3 , ... n ↔ n

Figure 26. Cable routing for onboard configuration of 4 x 2.5-inch front SAS/SATA drive bays

70 ThinkSystem SR630 V2 Maintenance Manual

Cable routing with an SFF HBA/RAID adapter
The following table shows the mapping relationship between backplane connectors and adapter connectors
when an 8i SFF HBA/RAID adapter (Gen 3 or Gen 4) is installed.

Table 26. Mapping between backplane connectors and adapter connectors when an SFF HBA/RAID adapter is installed

Backplanes From To

Front BP (SAS) SAS C0

Note: Gen 3 and Gen 4 SFF HBA/RAID adapters are slightly different in their connectors, but the cable
routing method is similar.

The following figure illustrates the cable routing for the configuration of 4 x 2.5-inch front SAS/SATA drive
bays with an 8i SFF RAID adapter (Gen 4). Connections between connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔ 3 , ... n ↔
n

Figure 27. Cable routing for 4 x 2.5-inch front SAS/SATA drive bays with an 8i SFF RAID adapter (Gen 4)

Chapter 3. Internal cable routing 71

8 x 2.5-inch front drive bays
Use this section to understand the backplane cable routing for server model with eight 2.5-inch front drives.

To connect cables for a 7mm drive backplane, refer to “7mm drive backplane” on page 63.

To connect power cables for a backplane for standard 2.5-inch or 3.5-inch drives, refer to “2.5-inch/3.5-inch
drive backplane (power)” on page 64.

To connect signal cables for a backplane for standard 8 x 2.5-inch front drives, refer to the following cable
routing scenarios depending on your server configuration:
• “Cable routing for onboard configuration” on page 73
• “Cable routing with an SFF HBA/RAID adapter” on page 74
• “Cable routing with an SFF RAID adapter (tri-mode)” on page 75
• “Cable routing with a re-timer card for one processor” on page 76
• “Cable routing with a CFF HBA/RAID adapter” on page 77

72 ThinkSystem SR630 V2 Maintenance Manual

Cable routing for onboard configuration
The following table shows the mapping relationship between backplane connectors and system board
connectors for onboard configuration.

Table 27. Mapping between backplane connectors and system board connectors for onboard configuration

Backplanes From To

SAS 0 SATA 0
Front BP (SAS)
SAS 1 SATA 1
Rear BP (if any) SAS SATA 2

The following figure illustrates the cable routing for the onboard configuration of 8 x 2.5-inch front SAS/SATA
drive bays with a rear 2 x 2.5-inch SAS/SATA drive cage. Connections between connectors: 1 ↔ 1 , 2 ↔ 2 ,
3 ↔ 3 , ... n ↔ n .

Figure 28. Cable routing for onboard configuration of 8 x 2.5-inch front SAS/SATA drive bays with a rear 2 x 2.5-inch
SAS/SATA drive cage

Chapter 3. Internal cable routing 73

Cable routing with an SFF HBA/RAID adapter
The following table shows the mapping relationship between backplane connectors and system board/
adapter connectors when an 8i SFF HBA/RAID adapter (Gen 3 or Gen 4) is installed.

Table 28. Mapping between backplane connectors and system board/adapter connectors when an SFF HBA/RAID
adapter is installed

Backplanes From To

Front BP (SAS) SAS 0 C0

SAS 1 Gen 3: C1; Gen 4: C0
Rear BP (if any) SAS SATA 2

Note: Gen 3 and Gen 4 SFF HBA/RAID adapters are slightly different in their connectors, but the cable
routing method is similar.

The following figure illustrates the cable routing for the configuration of 8 x 2.5-inch front SAS/SATA drive
bays with a 8i SFF RAID adapter (Gen 4) and a rear 2 x 2.5-inch SAS/SATA drive cage. Connections between
connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔ 3 , ... n ↔ n .

Figure 29. Cable routing for 8 x 2.5-inch front SAS/SATA drive bays with an 8i SFF RAID adapter (Gen 4) and a rear 2 x
2.5-inch SAS/SATA drive cage

74 ThinkSystem SR630 V2 Maintenance Manual

Cable routing with an SFF RAID adapter (tri-mode)
The following table shows the mapping relationship between backplane connectors and adapter connectors
when a Gen 4 8i SFF RAID adapter (tri-mode) is installed.

Table 29. Mapping between backplane connectors and adapter connectors when a Gen 4 8i SFF RAID adapter (tri-mode)
is installed
Backplane From To

Front BP (SAS) SAS 0, SAS 1 C0

Notes:
• For the server model with eight front 2.5-inch drives, the 10 x 2.5'' AnyBay backplane is used to support
the tri-mode configuration.
• If a tri-mode RAID adapter is used, only U.3 front drives are supported, and U.2 front drives are not
supported.

The following figure illustrates the cable routing for the configuration of 8 x 2.5-inch front U.3 drive bays with
a Gen 4 8i SFF RAID adapter (tri-mode). Connections between connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔ 3 , ... n ↔ n .

Figure 30. Cable routing for 8 x 2.5-inch front U.3 drive bays with a Gen 4 8i SFF RAID adapter (tri-mode)

Chapter 3. Internal cable routing 75

Cable routing with a re-timer card for one processor
The following table shows the mapping relationship between backplane connectors and a re-timer card for
one processor.

Table 30. Mapping between backplane connectors and a re-timer card for one processor

Backplane From To

SAS 0 SATA 0
Front BP (SAS)
SAS 1 SATA 1
NVMe 0–1, NVMe 2–3 PCIe 1, PCIe 2
Front BP (NVMe)
NVMe 4–5, NVMe 6–7 C0, C1

Notes:
• For the server model with eight front 2.5-inch NVMe drives, the 10 x 2.5'' AnyBay backplane is used.
• If you take the front view of the chassis, when the re-timer card is installed in PCIe slot 1, the cable is
routed on the right side as figure 4 illustrates; when PCIe slot 1 is occupied, install the re-timer card to
PCIe slot 2, note that the cable should be routed on the left side.

The following figure illustrates the cable routing for the configuration of 8 x 2.5-inch front NVMe drive bays
with a re-timer card. Connections between connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔ 3 , ... n ↔ n .

Figure 31. Cable routing for 8 x 2.5-inch front drive bays with a re-timer card for one processor

76 ThinkSystem SR630 V2 Maintenance Manual

Cable routing with a CFF HBA/RAID adapter
The following table shows the mapping relationship between backplane connectors and adapter connectors
when a 16i CFF HBA/RAID adapter is installed.

Table 31. Mapping between backplane connectors and adapter connectors when a 16i CFF HBA/RAID adapter is
installed
Backplanes From To

Front BP (SAS) SAS 0 C0

SAS 1 C1
Rear BP (if any) SAS C3

Note: For power and input cable connection of the CFF HBA/RAID adapter, refer to “CFF HBA/RAID
adapter” on page 54.

The following figure illustrates the cable routing for the configuration of 8 x 2.5-inch front SAS/SATA drive
bays with a 16i CFF RAID adapter and a rear 2 x 2.5-inch SAS/SATA drive cage. Connections between
connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔ 3 , ... n ↔ n .

Figure 32. Cable routing for 8 x 2.5-inch front SAS/SATA drive bays with a 16i CFF RAID adapter and a rear 2 x 2.5-inch
SAS/SATA drive cage

Chapter 3. Internal cable routing 77

10 x 2.5-inch front drive bays
Use this section to understand the backplane cable routing for server model with ten 2.5-inch front drives.

To connect cables for a 7mm drive backplane, refer to “7mm drive backplane” on page 63.

To connect power cables for a backplane for standard 2.5-inch or 3.5-inch drives, refer to “2.5-inch/3.5-inch
drive backplane (power)” on page 64.

To connect signal cables for a backplane for standard 10 x 2.5-inch front drives, refer to the following cable
routing scenarios depending on your server configuration:
• “Cable routing for onboard configuration” on page 79
• “Cable routing with an SFF HBA/RAID adapter” on page 80
• “Cable routing with an SFF RAID adapter (tri-mode)” on page 81
• “Cable routing with a CFF HBA/RAID adapter” on page 83

78 ThinkSystem SR630 V2 Maintenance Manual

Cable routing for onboard configuration
The following table shows the mapping relationship between backplane connectors and system board
connectors for onboard configuration.

Table 32. Mapping between backplane connectors and system board connectors for onboard configuration

Backplanes From To

NVMe 0-1, 2-3 PCIe 1, PCIe 2

Front BP (NVMe)
NVMe 4-5*, 6-7*, 8-9* PCIe 3, PCIe 4, PCIe 5
SAS 0 SATA 0
Front BP (SAS) SAS 1 SATA 1
SAS 2* SATA 2
SAS SATA 2
Rear BP (if any)
NVMe 0, NVMe 1 PCIe 6

Notes:
• *NVMe 4-5, NVMe 6-7, and NVMe 8-9 connectors are available only when the 10 x 2.5'' AnyBay front
backplane is used.
• *The SAS 2 connector only needs to be connected in the front drive scenario of 10 x 2.5'' AnyBay or 6 x
2.5'' SAS/SATA + 4 x 2.5'' AnyBay.
• In case of front 10 x 2.5'' NVMe drive bay scenario, SAS connectors on the front backplane do not need to
be connected.

The following figure illustrates the cable routing for the onboard configuration of 10 x 2.5-inch front drive
bays (6 x SAS/SATA + 4 x NVMe) with a rear 2 x 2.5-inch SAS/SATA drive cage. Connections between
connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔ 3 , ... n ↔ n

Chapter 3. Internal cable routing 79

Figure 33. Cable routing for onboard configuration of 10 x 2.5-inch front drive bays (6 x SAS/SATA + 4 x NVMe) with a
rear 2 x 2.5-inch SAS/SATA drive cage

Cable routing with an SFF HBA/RAID adapter

The following table shows the mapping relationship between backplane connectors and system board/
adapter connectors when an 8i or 16i SFF HBA/RAID adapter (Gen 3 or Gen 4) is installed.

Table 33. Mapping between backplane connectors and system board/adapter connectors when an SFF HBA/RAID
adapter is installed

Backplanes From To

Front BP (NVMe) NVMe 0-1, 2-3 PCIe 1, PCIe 2

NVMe 4-5*, 6-7*, 8-9* PCIe 3, PCIe 4, PCIe 5
Front BP (SAS) SAS 0 C0
SAS 1 Gen 3: C1; Gen 4: C0
SAS 2* Gen 3: C2; Gen 4: C1
SAS Gen 3: C3; Gen 4: C1
Rear BP (if any)
NVMe 0, NVMe 1 PCIe 6

Notes:
• *NVMe 4-5, NVMe 6-7, and NVMe 8-9 connectors are available only when the 10 x 2.5'' AnyBay front
backplane is used.
• *The SAS 2 connector only needs to be connected in the front drive scenario of 10 x 2.5'' AnyBay or 6 x
2.5'' SAS/SATA + 4 x 2.5'' AnyBay.
• Gen 3 and Gen 4 SFF HBA/RAID adapters are slightly different in their connectors, but the cable routing
method is similar.

80 ThinkSystem SR630 V2 Maintenance Manual

The following figure illustrates the cable routing for the configuration of 10 x 2.5-inch front AnyBay drive bays
with a 16i SFF RAID adapter (Gen 4) and a rear 2 x 2.5-inch SAS/SATA drive cage. Connections between
connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔ 3 , ... n ↔ n

Figure 34. Cable routing for 10 x 2.5-inch front AnyBay drive bays with a 16i SFF RAID adapter (Gen 4) and a rear 2 x 2.5-
inch SAS/SATA drive cage

Cable routing with an SFF RAID adapter (tri-mode)

The following table shows the mapping relationship between backplane connectors and adapter connectors
when a Gen 4 16i SFF RAID adapter (tri-mode) is installed.

Table 34. Mapping between backplane connectors and adapter connectors when a Gen 4 16i SFF RAID adapter (tri-
mode) is installed

Backplane From To

Front BP (SAS) SAS 0, SAS 1 C0

SAS 2 C1

Note: If a tri-mode RAID adapter is used, only U.3 front drives are supported, and U.2 front drives are not
supported.

The following figure illustrates the cable routing for the configuration of 10 x 2.5-inch front U.3 drive bays with
a 16i SFF RAID adapter (tri-mode). Connections between connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔ 3 , ... n ↔ n

Chapter 3. Internal cable routing 81

Figure 35. Cable routing for 10 x 2.5-inch front U.3 drive bays with a Gen 4 16i SFF RAID adapter (tri-mode)

82 ThinkSystem SR630 V2 Maintenance Manual

Cable routing with a CFF HBA/RAID adapter
The following table shows the mapping relationship between backplane connectors and system board/
adapter connectors when a 16i CFF HBA/RAID adapter is installed.

Table 35. Mapping between backplane connectors and system board/adapter connectors when a 16i CFF HBA/RAID
adapter is installed

Backplanes From To

Front BP (NVMe) NVMe 0-1, 2-3 PCIe 1, PCIe 2

Front BP (SAS) SAS 0 C0

SAS 1 C1
SAS 2 C2
SAS C3
Rear BP (if any)
NVMe 0, NVMe 1 PCIe 6

Note: For power and input cable connection of the CFF HBA/RAID adapter, refer to “CFF HBA/RAID
adapter” on page 54.

The following figure illustrates the cable routing for the configuration of 10 x 2.5-inch front drive bays (6 x
SAS/SATA + 4 x AnyBay) with a 16i CFF RAID adapter and a rear 2 x 2.5-inch SAS/SATA drive cage.
Connections between connectors: 1 ↔ 1 , 2 ↔ 2 , 3 ↔ 3 , ... n ↔ n

Figure 36. Cable routing for 10 x 2.5-inch front drive bays (6 x SAS/SATA + 4 x AnyBay) with a 16i CFF RAID adapter and
a rear 2 x 2.5-inch SAS/SATA drive cage

Chapter 3. Internal cable routing 83

84 ThinkSystem SR630 V2 Maintenance Manual
Chapter 4. Hardware replacement procedures
This section provides installation and removal procedures for all serviceable system components. Each
component replacement procedure references any tasks that need to be performed to gain access to the
component being replaced.

For more information about ordering parts:

https://datacentersupport.lenovo.com/products/servers/thinksystem/sr630v2/7z70/parts

Note: If you replace a part, such as an adapter, that contains firmware, you might also need to update the
firmware for that part. For more information about updating firmware, see “Firmware updates” on page 12.

Installation guidelines
Before installing components in your server, read the installation guidelines.

Before installing optional devices, read the following notices carefully:

Attention: Prevent exposure to static electricity, which might lead to system halt and loss of data, by
keeping static-sensitive components in their static-protective packages until installation, and handling these
devices with an electrostatic-discharge wrist strap or other grounding system.
• Read the safety information and guidelines to ensure your safety at work:
https://pubs.lenovo.com/safety_documentation/
• When you install a new server, download and apply the latest firmware. This will help ensure that any
known issues are addressed, and that your server is ready to work with optimal performance. Go to
ThinkSystem SR630 V2 Drivers and Software to download firmware updates for your server.

Important: Some cluster solutions require specific code levels or coordinated code updates. If the
component is part of a cluster solution, verify the latest Best Recipe code level menu for cluster supported
firmware and driver before you update the code.
• It is good practice to make sure that the server is working correctly before you install an optional
component.
• Keep the working area clean, and place removed components on a flat and smooth surface that does not
shake or tilt.
• Do not attempt to lift an object that might be too heavy for you. If you have to lift a heavy object, read the
following precautions carefully:
– Make sure that you can stand steadily without slipping.
– Distribute the weight of the object equally between your feet.
– Use a slow lifting force. Never move suddenly or twist when you lift a heavy object.
– To avoid straining the muscles in your back, lift by standing or by pushing up with your leg muscles.
• Back up all important data before you make changes related to the disk drives.
• Have a small flat-blade screwdriver, a small Phillips screwdriver, and a T8 Torx screwdriver available.
• To view the error LEDs on the system board and internal components, leave the power on.
• You do not have to turn off the server to remove or install hot-swap power supplies, hot-swap fans, or hot-
plug USB devices. However, you must turn off the server before you perform any steps that involve
removing or installing adapter cables, and you must disconnect the power source from the server before
you perform any steps that involve removing or installing a riser card, memory, or processor.

© Copyright Lenovo 2021, 2024 85

• Blue color on a component indicates touch points, where you can grip to remove a component from or
install it in the server, open or close a latch, and so on.
• Terra-cotta on a component or a terra-cotta label on or near a component indicates that the component
can be hot-swapped if the server and operating system support hot-swap capability, which means that
you can remove or install the component while the server is still running. (Terra-cotta can also indicate
touch points on hot-swap components.) See the instructions for removing or installing a specific hot-swap
component for any additional procedures that you might have to perform before you remove or install the
component.
• The Red strip on the drives, adjacent to the release latch, indicates that the drive can be hot-swapped if
the server and operating system support hot-swap capability. This means that you can remove or install
the drive while the server is still running.

Note: See the system specific instructions for removing or installing a hot-swap drive for any additional
procedures that you might need to perform before you remove or install the drive.
• After finishing working on the server, make sure you reinstall all safety shields, guards, labels, and ground
wires.

Safety inspection checklist

Use the information in this section to identify potentially unsafe conditions with your server. As each machine
was designed and built, required safety items were installed to protect users and service technicians from
injury.

Notes:
• The product is not suitable for use at visual display workplaces according to §2 of the Workplace
Regulations.
• The set-up of the server is made in the server room only.

CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. Lenovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products. Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location.

Important: Electrical grounding of the server is required for operator safety and correct system function.
Proper grounding of the electrical outlet can be verified by a certified electrician.

Use the following checklist to verify that there are no potentially unsafe conditions:
1. Make sure that the power is off and the power cord is disconnected.
2. Check the power cord.
• Make sure that the third-wire ground connector is in good condition. Use a meter to measure third-
wire ground continuity for 0.1 ohm or less between the external ground pin and the frame ground.
• Make sure that the power cord is the correct type.
To view the power cords that are available for the server:
a. Go to: http://dcsc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the machine type and model for your server to display the configurator page.
d. Click Power ➙ Power Cables to see all line cords.

86 ThinkSystem SR630 V2 Maintenance Manual

 • Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use good judgment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions, such as metal filings, contamination, water or
other liquid, or signs of fire or smoke damage.
5. Check for worn, frayed, or pinched cables.
6. Make sure that the power-supply cover fasteners (screws or rivets) have not been removed or tampered
with.

System reliability guidelines

Review the system reliability guidelines to ensure proper system cooling and reliability.

Make sure the following requirements are met:

• When the server comes with redundant power, a power supply must be installed in each power-supply
bay.
• Adequate space around the server must be spared to allow server cooling system to work properly. Leave
approximately 50 mm (2.0 in.) of open space around the front and rear of the server. Do not place any
object in front of the fans.
• For proper cooling and airflow, refit the server cover before you turn the power on. Do not operate the
server for more than 30 minutes with the server cover removed, for it might damage server components.
• Cabling instructions that come with optional components must be followed.
• A failed fan must be replaced within 48 hours after malfunction.
• A removed hot-swap fan must be replaced within 30 seconds after removal.
• A removed hot-swap drive must be replaced within two minutes after removal.
• A removed hot-swap power supply must be replaced within two minutes after removal.
• Every air baffle that comes with the server must be installed when the server starts (some servers might
come with more than one air baffle). Operating the server with a missing air baffle might damage the
processor.
• All processor sockets must contain either a socket cover or a processor with heat sink.
• When more than one processor is installed, fan population rules for each server must be strictly followed.

Working inside the server with the power on

You might need to keep the power on with the server cover removed to look at system information on the
display panel or to replace hot-swap components. Review these guidelines before doing so.

Attention: The server might stop and data loss might occur when internal server components are exposed
to static electricity. To avoid this potential problem, always use an electrostatic-discharge wrist strap or other
grounding systems when working inside the server with the power on.
• Avoid loose-fitting clothing, particularly around your forearms. Button or roll up long sleeves before
working inside the server.
• Prevent your necktie, scarf, badge rope, or hair from dangling into the server.
• Remove jewelry, such as bracelets, necklaces, rings, cuff links, and wrist watches.
• Remove items from your shirt pocket, such as pens and pencils, in case they fall into the server as you
lean over it.
• Avoid dropping any metallic objects, such as paper clips, hairpins, and screws, into the server.

Chapter 4. Hardware replacement procedures 87

Handling static-sensitive devices
Review these guidelines before you handle static-sensitive devices to reduce the possibility of damage from
electrostatic discharge.

Attention: Prevent exposure to static electricity, which might lead to system halt and loss of data, by
keeping static-sensitive components in their static-protective packages until installation, and handling these
devices with an electrostatic-discharge wrist strap or other grounding system.

• Limit your movement to prevent building up static electricity around you.

• Take additional care when handling devices during cold weather, for heating would reduce indoor
humidity and increase static electricity.
• Always use an electrostatic-discharge wrist strap or other grounding system, particularly when working
inside the server with the power on.
• While the device is still in its static-protective package, touch it to an unpainted metal surface on the
outside of the server for at least two seconds. This drains static electricity from the package and from your
body.
• Remove the device from the package and install it directly into the server without putting it down. If it is
necessary to put the device down, put it back into the static-protective package. Never place the device
on the server or on any metal surface.
• When handling a device, carefully hold it by the edges or the frame.
• Do not touch solder joints, pins, or exposed circuitry.
• Keep the device from others’ reach to prevent possible damages.

Memory module installation rules and order

Memory modules must be installed in a specific order based on the memory configuration that you
implement on your server.

Your server has 16 channels, 32 memory slots, and supports:

• Minimum memory:
– 16 GB
• Maximum memory:
– Without PMEMs:
– 2 TB using 32 x 64 GB RDIMMs
– 8 TB using 32 x 256 GB RDIMMs
– With PMEMs:
– 10 TB: 16 x 128 GB 3DS RDIMMs + 16 x 512 GB PMEMs (Memory Mode)
Total 10 TB installed memory capacity, of which 8 TB (PMEMs) is used as system memory and 2 TB
(3DS RDIMMs) is used as cache.
– 12 TB: 16 x 256 GB 3DS RDIMMs + 16 x 512 GB PMEMs (App Direct Mode)
Total 12 TB installed memory capacity, of which 4 TB (3DS RDIMMs) is used as system memory and
8 TB (PMEMs) is used as persistent memory for storage.
• Type (depending on the model):
– TruDDR4 3200, dual-rank, 16 GB/32 GB/64 GB RDIMM
– TruDDR4 3200, quad-rank, 128 GB 3DS RDIMM

88 ThinkSystem SR630 V2 Maintenance Manual

 – TruDDR4 2933, octal-rank, 256 GB 3DS RDIMM
– TruDDR4 3200 128 GB, 256 GB and 512 GB PMEM

For a list of supported memory options, see https://serverproven.lenovo.com/.

Notes:
• The operating speed and total memory capacity depend on the processor model and UEFI settings.
• All Icelake Platinum and Gold CPUs support PMEM. For Icelake Silver CPUs, only processor 4314
supports PMEM.
• When 256 GB 3DS RDIMM/512 GB PMEM is installed, the ambient temperature must be limited to 30°C
or lower.
• Mixing 128 GB and 256 GB 3DS RDIMMs is not supported.

The following illustration helps you to locate the memory module slots on the system board.

Note: It is recommended to install memory modules with the same rank in each channel.

Figure 37. Memory module slots on the system board

Table 36. Memory slot and channel identification

Channel F0 F1 E0 E1 H0 H1 G0 G1 C1 C0 D1 D0 A1 A0 B1 B0
Slot number 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

Memory module installation guideline

• Two types of configurations are supported. Consider corresponding rules and population sequence
accordingly:
– “DRAM DIMM installation order” on page 90 (RDIMMs or 3DS RDIMMs)
– “PMEM and DRAM DIMM installation order” on page 94
• A label on each DIMM identifies the DIMM type. This information is in the format xxxxx nRxxx PC4-
xxxxx-xx-xx-xxx. Where n indicates if the DIMM is single-rank (n=1) or dual-rank (n=2).
• At least one DIMM is required for each processor. Install at least eight DIMMs per processor for good
performance.
• When you replace a DIMM, the server provides automatic DIMM enablement capability without requiring
you to use the Setup Utility to enable the new DIMM manually.

Attention:

Chapter 4. Hardware replacement procedures 89

• Mixing x4 and x8 DIMMs in the same channel is allowed.
• Always populate DIMMs with the maximum number of ranks in the farthest DIMM slot, followed by the
nearest DIMM slot.
• Do not mix RDIMMs and 3DS RDIMMs in the same server.
• Mixing 128 GB and 256 GB 3DS RDIMMs is not supported.

DRAM DIMM installation order

For RDIMMs or 3DS RDIMMs, the following memory modes are available:
• “Independent mode” on page 90
• “Mirroring mode” on page 93

Independent mode
In independent memory mode, memory channels can be populated with DIMMs in any order and you can
populate all channels for each processor in any order with no matching requirements. Independent memory
mode provides the highest level of memory performance, but lacks failover protection. The DIMM installation
order for independent memory mode varies based on the number of processors and memory modules
installed in the server.

Follow the rules below when installing memory modules in independent mode:
• All memory modules to be installed must be of the same type. x4 and x8 DIMMs can be mixed in the same
channel.
• Memory modules from different vendors are supported.
• There must be at least one DDR4 DIMM per socket.
• In each memory channel, populate slot 0 first.
• If a memory channel has two DIMMs, populate the DIMM with a higher number of ranks in slot 0; if the two
DIMMs have the same number of ranks, populate the DIMM with a higher capacity in slot 0.
• A maximum of 8 logical ranks (ranks seen by the host) per channel is allowed.
• A maximum of two different DIMM capacities are supported per system.
– For channels A, C, E, and G, populated DIMMs must have the same total capacity for each channel.
– For channels B, D, F, and H, populated DIMMs must have the same total capacity for each channel,
which can be different from that of the other set (channels A, C, E, and G).
• If there are more than two DIMMs, populate them in a right-and-left symmetrical manner across a CPU
socket.

90 ThinkSystem SR630 V2 Maintenance Manual

With one processor
The following table shows the sequence of populating memory modules (with the same capacity) for
independent mode when only one processor is installed.

Table 37. Independent mode with one processor (DIMMs with same capacity)

Total DIMMs CPU 1

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
1 DIMM 3
2 DIMMs 3 7
4 DIMMs1 3 7 10 14
6 DIMMs 1 3 7 10 14 16
8 DIMMs1, 2 1 3 5 7 10 12 14 16
12 DIMMs 1 2 3 4 7 8 9 10 13 14 15 16
16 DIMMs1, 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Notes:
1. DIMM configurations that support the Sub NUMA Clustering (SNC) feature, which can be enabled via
UEFI. SNC is not supported if DIMM population does not follow the sequence indicated by the table
above.
2. DIMM configurations that support Software Guard Extensions (SGX). See “Enable Software Guard
Extensions (SGX)” in Setup Guide to enable this feature.

The following table shows the sequence of populating memory modules (with different capacities) for
independent mode when only one processor is installed.

Table 38. Independent mode with one processor (DIMMs with different capacities)

Total DIMMs CPU 1

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
2 DIMM 3 5
4 DIMMs 3 5 12 14
8 DIMMs1, 2 1 3 5 7 10 12 14 16
12 DIMMs1, 2 1 3 4 5 7 8 9 10 12 13 14 16
16 DIMMs1, 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Notes:
1. DIMM configurations that support the Sub NUMA Clustering (SNC) feature, which can be enabled via
UEFI. SNC is not supported if DIMM population does not follow the sequence indicated by the table
above.
2. DIMM configurations that support Software Guard Extensions (SGX). See “Enable Software Guard
Extensions (SGX)” in Setup Guide to enable this feature.

Chapter 4. Hardware replacement procedures 91

With two processors
The following table shows the sequence of populating memory modules (with the same capacity) for
independent mode when two processors are installed.

Table 39. Independent mode with two processors (DIMMs with same capacity)

Total DIMMs CPU 1

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
2 DIMMs 3
4 DIMMs 3 7
8 DIMMs1 3 7 10 14
12 DIMMs 1 3 7 10 14 16
16 DIMMs1, 2 1 3 5 7 10 12 14 16
24 DIMMs 1 2 3 4 7 8 9 10 13 14 15 16
32 DIMMs1, 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Total DIMMs CPU 2
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
2 DIMMs 19
4 DIMMs 19 23
8 DIMMs1 19 23 26 30
12 DIMMs 17 19 23 26 30 32
16 DIMMs1, 2 17 19 21 23 26 28 30 32
24 DIMMs 17 18 19 20 23 24 25 26 29 30 31 32
32 DIMMs1, 2 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

Notes:
1. DIMM configurations that support the Sub NUMA Clustering (SNC) feature, which can be enabled via
UEFI. SNC is not supported if DIMM population does not follow the sequence indicated by the table
above.
2. DIMM configurations that support Software Guard Extensions (SGX). See “Enable Software Guard
Extensions (SGX)” in Setup Guide to enable this feature.

The following table shows the sequence of populating memory modules (with the different capacities) for
independent mode when two processors are installed.

Table 40. Independent mode with two processors (DIMMs with different capacities)

Total DIMMs CPU 1

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
4 DIMMs 3 5
8 DIMMs 3 5 12 14
16 DIMMs1, 2 1 3 5 7 10 12 14 16
24 DIMMs1, 2 1 3 4 5 7 8 9 10 12 13 14 16
32 DIMMs1, 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

92 ThinkSystem SR630 V2 Maintenance Manual

Table 40. Independent mode with two processors (DIMMs with different capacities) (continued)

Total DIMMs CPU 2

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
4 DIMMs 19 21
8 DIMMs 19 21 28 30
16 DIMMs1, 2 17 19 21 23 26 28 30 32
24 DIMMs1, 2 17 19 20 21 23 24 25 26 28 29 30 32
32 DIMMs1, 2 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

Notes:
1. DIMM configurations that support the Sub NUMA Clustering (SNC) feature, which can be enabled via
UEFI. SNC is not supported if DIMM population does not follow the sequence indicated by the table
above.
2. DIMM configurations that support Software Guard Extensions (SGX). See “Enable Software Guard
Extensions (SGX)” in Setup Guide to enable this feature.

Mirroring mode
Memory-mirroring mode provides full memory redundancy while reducing the total system memory capacity
in half. Memory channels are grouped in pairs with each channel receiving the same data. If a failure occurs,
the memory controller switches from the DIMMs on the primary channel to the DIMMs on the backup
channel. The DIMM installation order for memory mirroring varies based on the number of processors and
DIMMs installed in the server.

In mirroring mode, each memory module in a pair must be identical in size and architecture. The channels are
grouped in pairs with each channel receiving the same data. One channel is used as a backup of the other,
which provides redundancy.

Follow the rules below when installing memory modules in mirroring mode:
• All memory modules to be installed must be of the same type with the same capacity, frequency, voltage,
and ranks.
• Mirroring can be configured across channels, and the total DDR4 memory size of the primary and
secondary channels must be the same.
• Partial Memory Mirroring is a sub-function of memory mirroring. It requires to follow the memory
population for memory mirroring.

The following table shows the memory module population sequence for mirroring mode when only one
processor (CPU 1) is installed.

Table 41. Mirroring mode with one processor (CPU 1)

Configura- DIMM slots

tion
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
8 DIMMs 1 3 5 7 10 12 14 16
16 DIMMs 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Note: DIMM configurations listed in the table support the Sub NUMA Clustering (SNC) feature, which can be
enabled via UEFI. SNC is not supported if DIMM population does not follow the sequence indicated by the
table above.

Chapter 4. Hardware replacement procedures 93

The following table shows the memory module population sequence for mirroring mode when two
processors (CPU 1 and CPU 2) are installed.

Table 42. Mirroring mode with two processors (CPU 1 and CPU 2)

Configura- DIMM slots

tion
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
16 DIMMs 1 3 5 7 10 12 14 16
32 DIMMs 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Configura- DIMM slots
tion
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
16 DIMMs 17 19 21 23 26 28 30 32
32 DIMMs 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

Note: DIMM configurations listed in the table support the Sub NUMA Clustering (SNC) feature, which can be
enabled via UEFI. SNC is not supported if DIMM population does not follow the sequence indicated by the
table above.

PMEM and DRAM DIMM installation order

This section contains information of how to install PMEMs and DRAM DIMMs properly.

When PMEMs and DRAM DIMMs are mixed in the system, the following modes are supported:
• “App Direct Mode” on page 99
• “Memory Mode” on page 101

See the following topics to learn how to set up and configure PMEMs.
• “PMEM rules” on page 94
• “Setting up the system for PMEM for the first time” on page 94
• “PMEM Management options” on page 95
• “Adding or replacing PMEMs in App Direct Mode” on page 99

PMEM rules
Make sure to meet the following requirements when applying PMEMs in the system.
• All the PMEMs that are installed must be of the same part number.
• All the DRAM DIMMs that are installed must be of the same type, rank, and capacity with minimum
capacity of 16 GB. It is recommended to use Lenovo DRAM DIMMs with the same part number.

Setting up the system for PMEM for the first time

Complete the following steps when installing PMEMs to the system for the first time.
1. Determine the mode and combination (see “App Direct Mode” on page 99 or “Memory Mode” on page
101).
2. Consider “PMEM rules” on page 94 and acquire the PMEMs and DRAM DIMMs that meet the
requirements.
3. Remove all the memory modules that are presently installed (see “Remove a memory module” on page
165).

94 ThinkSystem SR630 V2 Maintenance Manual

 4. Follow the adopted combination to install all the PMEMs and DRAM DIMMs (see “Install a memory
module” on page 167).
5. Disable security on all the installed PMEMs (see “PMEM Management options” on page 95).
6. Make sure the PMEM firmware is the latest version. If not, update it to the latest version (see https://
sysmgt.lenovofiles.com/help/topic/com.lenovo.lxca.doc/update_fw.html).
7. Configure the PMEMs so that the capacity is available for use (see “PMEM Management options” on
page 95).

PMEM Management options

PMEMs can be managed with the following tools:
• Lenovo XClarity Provisioning Manager (LXPM)
To open LXPM, power on the system and press the key specified on screen instructions as soon as the
logo screen appears. If a password has been set, enter the password to unlock LXPM.
Go to UEFI Setup ➙ System Settings ➙ Intel Optane PMEMs to configure and manage PMEMs.
For more details, see the “UEFI setup” section in the LXPM documentation compatible with your server at
https://pubs.lenovo.com/lxpm-overview/.

Note: If the text-based interface of Setup Utility opens instead of LXPM, go to System Settings ➙ <F1>
Start Control and select Tool Suite. Then, reboot the system, and as soon as the logo screen appears,
press the key specified in the on-screen instructions to open LXPM. (For more information, see the
“Startup” section in the LXPM documentation compatible with your server at https://pubs.lenovo.com/
lxpm-overview/.)
• Setup Utility
To enter Setup Utility:
1. Power on the system and press the key specified in the on-screen instructions to open LXPM.
(For more information, see the “Startup” section in the LXPM documentation compatible with your
server at https://pubs.lenovo.com/lxpm-overview/.)
2. Go to UEFI Settings ➙ System Settings, click on the pull-down menu on the upper right corner of
the screen, and select Text Setup.
3. Reboot the system, and as soon as the logo screen appears, press the key specified in the on-screen
instructions.
Go to System Configuration and Boot Management ➙ System Settings ➙ Intel Optane PMEMs to
configure and manage PMEMs.
• Lenovo XClarity Essentials OneCLI
Some management options are available in commands that are executed in the path of Lenovo XClarity
Essentials OneCLI in the operating system. See https://pubs.lenovo.com/lxce-onecli/download_use_onecli
to learn how to download and use Lenovo XClarity Essentials OneCLI.

Following are the available management options:

• Intel Optane PMEMs details
Select this option to view the following details concerning each of the installed PMEMs:
– Number of Intel Optane PMEMs detected
– Total raw capacity
– Total memory capacity
– Total App Direct capacity

Chapter 4. Hardware replacement procedures 95

 – Total unconfigured capacity
– Total inaccessible capacity
– Total reserved capacity
Alternatively, view PMEM details with the following command in OneCLI:

OneCli.exe config show IntelOptanePMEM --bmc XCC_Account:XCC_Password@XCC_IP

Notes:
– XCC_Account stands for XCC user ID.
– XCC_Password stands for XCC user password.
– XCC_IP stands for XCC IP address.
• Goals
– Memory Mode [%]
Select this option to define the percentage of PMEM capacity that is invested in system memory, and
hence decide the PMEM mode:
– 0%: App Direct Mode
– 100%: Memory Mode
Go to Goals ➙ Memory Mode [%], input the memory percentage, and reboot the system.

Notes:
– Before changing from one mode to another:
1. Back up all the data and delete all the created namespaces. Go to Namespaces ➙ View/
Modify/Delete Namespaces to delete the created namespaces.
2. Perform secure erase on all the installed PMEMs. Go to Security ➙ Press to Secure Erase to
perform secure erase.
– Make sure the capacity of installed PMEM and DRAM DIMMs meets system requirements for the
new mode (see “PMEM rules” on page 94).
– After the system is rebooted and the input goal value is applied, the displayed value in System
Configuration and Boot Management ➙ Intel Optane PMEMs ➙ Goals will go back to the
following default selectable options:
• Scope: [Platform]
• Memory Mode [%]: 0
• Persistent Memory Type: [App Direct]
These values are selectable options for PMEM settings, and do not represent the current PMEM
status.
In addition, you can take advantage of a memory configurator, which is available at the following site:
http://1config.lenovo.com/#/memory_configuration

Alternatively, set PMEM Goals with the following commands in OneCLI:

– For Memory Mode:
1. Set create goal status.
OneCli.exe config set IntelOptanePMEM.CreateGoal Yes --bmc XCC_Account:XCC_Password@XCC_IP
2. Define the PMEM capacity that is invested in system volatile memory.
OneCli.exe config set IntelOptanePMEM.MemoryModePercentage 100 --bmc XCC_Account:XCC_Password@XCC_
IP

Where 100 stands for the percentage of capacity that is invested in system volatile memory.
– For App Direct Mode:

96 ThinkSystem SR630 V2 Maintenance Manual

 1. Set create goal status.
OneCli.exe config set IntelOptanePMEM.CreateGoal Yes --bmc XCC_Account:XCC_Password@XCC_IP
2. Define the PMEM capacity that is invested in system volatile memory.
OneCli.exe config set IntelOptanePMEM.MemoryModePercentage 0 --bmc XCC_Account:XCC_Password@XCC_IP

Where 0 stands for the percentage of capacity that is invested in system volatile memory.
3. Set the PMEM mode.
OneCli.exe config set IntelOptanePMEM.PersistentMemoryType "App Direct" --bmc XCC_Account:XCC_
Password@XCC_IP

Where App Direct stands for the PMEM mode. You can input App Direct for App Direct
interleaved or App Direct Not Interleaved for App Direct not interleaved.
– Persistent Memory Type
In App Direct Mode, the PMEMs that are connected to the same processor are by default interleaved
(displayed as App Direct), while memory banks are used in turns. To set them as not interleaved in the
Setup Utility, go to Intel Optane PMEMs ➙ Goals ➙ Persistent Memory Type [(PMEM mode)],
select App Direct Not Interleaved and reboot the system.

Note: Setting PMEM App Direct capacity to not interleaved will turn the displayed App Direct regions
from one region per processor to one region per PMEM.
• Regions
After the memory percentage is set and the system is rebooted, regions for the App Direct capacity will be
generated automatically. Select this option to view the App Direct regions per processor.
• Namespaces
App Direct capacity of PMEMs requires the following steps before it is truly available for applications.
1. Namespaces must be created for region capacity allocation.
2. Filesystem must be created and formatted for the namespaces in the operating system.
Each App Direct region can be allocated into one namespace. Create namespaces in the following
operating systems:
– Windows: Use powershell command. To create a namespace, use Windows Server 2019 or later
versions.
– Linux: Use ndctl command.
– VMware: Reboot the system, and VMware will create namespaces automatically.
After creating namespaces for App Direct capacity allocation, make sure to create and format filesystem
in the operating system so that the App Direct capacity is accessible for applications.
• Security
– Enable Security

Attention: By default, PMEM security is disabled. Before enabling security, make sure all the country
or local legal requirements regarding data encryption and trade compliance are met. Violation could
cause legal issues.
PMEMs can be secured with passphrases. Two types of passphrase protection scope are available for
PMEM:
– Platform: Choose this option to run security operation on all the installed PMEM units at once. A
platform passphrase is stored and automatically applied to unlock PMEMs before operating system
starts running, but the passphrase still has to be disabled manually for secure erase.
Alternatively, enable/disable platform level security with the following commands in OneCLI:

Chapter 4. Hardware replacement procedures 97

 • Enable security:
1. Enable security.
onecli.exe config set IntelOptanePMEM.SecurityOperation "Enable Security" --imm
USERID:PASSW0RD@10.104.195.86
2. Set the security passphrase.
onecli.exe config set IntelOptanePMEM.SecurityPassphrase "123456" --imm
USERID:PASSW0RD@10.104.195.86 --imm USERID:PASSW0RD@10.104.195.86

Where 123456 stands for the passphrase.

3. Reboot the system.
• Disable security:
1. Disable security.
onecli.exe config set IntelOptanePMEM.SecurityOperation "Disable Security" --imm
USERID:PASSW0RD@10.104.195.86
2. Enter passphrase.
onecli.exe config set IntelOptanePMEM.SecurityPassphrase "123456" --imm
USERID:PASSW0RD@10.104.195.86
3. Reboot the system.
– Single PMEM: Choose this option to run security operation on one or more selected PMEM units.

Notes:
• Single PMEM passphrases are not stored in the system, and security of the locked units needs to
be disabled before the units are available for access or secure erase.
• Always make sure to keep records of the slot number of locked PMEMs and corresponding
passphrases. In the case the passphrases are lost or forgotten, the stored data cannot be backed
up or restored, but you can contact Lenovo service for administrative secure erase.
• After three failed unlocking attempts, the corresponding PMEMs enter “exceeded” state with a
system warning message, and the PMEM unit can only be unlocked after the system is rebooted.
To enable passphrase, go to Security ➙ Press to Enable Security.
– Secure Erase

Notes:
– Password is required to perform Secure Erase when security enabled.
– Before executing secure erase, make sure ARS (Address Range Scrub) is done on all PMEMs or on
the specific PMEMs selected. Otherwise, secure erase cannot be started on all PMEMs or the
specific PMEM selected, and the following text message will pop out:
The passphrase is incorrect for single or multiple or all Intel Optane PMEMs selected, or maybe there is
namespace on the selected PMEMs. Secure erase operation is not done on all Intel Optane PMEMs selected.

Secure erase cleanses all the data that is stored in the PMEM unit, including encrypted data. This data
deletion method is recommended before returning or disposing a malfunctioning unit, or changing
PMEM mode. To perform secure erase, go to Security ➙ Press to Secure Erase.
Alternatively, perform platform level secure erase with the following command in OneCLI:

OneCli.exe config set IntelOptanePMEM.SecurityOperation "Secure Erase Without Passphrase" --bmc

USERID:PASSW0RD@10.104.195.86
• PMEM Configuration

98 ThinkSystem SR630 V2 Maintenance Manual

 PMEM contains spared internal cells to stand in for the failed ones. When the spared cells are exhausted
to 0%, there will be an error message, and it is advised to back up data, collect service log, and contact
Lenovo support.
There will also be a warning message when the percentage reaches 1% and a selectable percentage
(10% by default). When this message appears, it is advised to back up data and run PMEM diagnostics
(see the “Diagnostics” section in the LXPM documentation compatible with your server at https://
pubs.lenovo.com/lxpm-overview/). To adjust the selectable percentage that the warning message requires,
go to Intel Optane PMEMs ➙ PMEM Configuration, and input the percentage.
Alternatively, change the selectable percentage with the following command in OneCLI:

onecli.exe config set IntelOptanePMEM.PercentageRemainingThresholds 20 --imm USERID:PASSW0RD@10.104.195.86

Where 20 is the selectable percentage.

Adding or replacing PMEMs in App Direct Mode

Complete the following steps before adding or replacing PMEMs in App Direct Mode.

1. Back up stored data in PMEM namespaces.

2. Disable PMEM security with one of the following options:
• LXPM
Go to UEFI Setup ➙ System Settings ➙ Intel Optane PMEMs ➙ Security ➙ Press to Disable
Security, and input passphrase to disable security.
• Setup Utility
Go to System Configuration and Boot Management ➙ System Settings ➙ Intel Optane PMEMs
➙ Security ➙ Press to Disable Security, and input passphrase to disable security.
3. Delete namespaces with command corresponding to the operating system that is installed:
• Linux command:
ndctl destroy-namespace all -f
• Windows Powershell command
Get-PmemDisk | Remove-PmemDisk
4. Clear Platform Configuration Data (PCD) and Namespace Label Storage Area (LSA) with the following
ipmctl command (for both Linux and Windows).
ipmctl delete -pcd

Notes: See the following links to learn how to download and use impctl in different operating systems:
• Windows: https://datacentersupport.lenovo.com/us/en/videos/YTV101407
• Linux: https://datacentersupport.lenovo.com/us/en/solutions/HT508642
5. Reboot the system.

App Direct Mode

In this mode, PMEMs act as independent and persistent memory resources directly accessible by specific
applications, and DRAM DIMMs act as system memory. Ensure that the ratio of total DRAM DIMM capacity
to total PMEM capacity within a processor is between 1:1 and 1:8.

Chapter 4. Hardware replacement procedures 99

With one processor
Table 43. Memory population in App Direct Mode with one processor (CPU 1)

• D: DRAM DIMM
• P: Persistent Memory Module (PMEM)

DIMM slots
Configuration
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
1 PMEM and 6 D D P D D D D
DIMMs*
1 PMEM and 8 D D P D D D D D D
DIMMs*
2 PMEMs and 12 D D D D P D D D D P D D D D
DIMMs
4 PMEMs and 4 P D P D D P D P
DIMMs
4 PMEMs and 8 D D P D D P P D D P D D
DIMMs
8 PMEMs and 8 D P D P D P D P P D P D P D P D
DIMMs

Note: Configurations with an asterisk (*) support the not-interleaved mode only. 100% interleaved mode is
not supported.

Two processors
Table 44. Memory population in App Direct Mode with two processors (CPU 1 and CPU 2)

• D: DRAM DIMM
• P: Persistent Memory Module (PMEM)

Configura- DIMM slots

tion
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
2 PMEM D D P D D D D
and 12
DIMMs*
2 PMEM D D P D D D D D D
and 16
DIMMs*
4 PMEMs D D D D P D D D D P D D D D
and 24
DIMMs
8 PMEMs P D P D D P D P
and 8
DIMMs
8 PMEMs D D P D D P P D D P D D
and 16
DIMMs
16 PMEMs D P D P D P D P P D P D P D P D
and 16
DIMMs

100 ThinkSystem SR630 V2 Maintenance Manual

Table 44. Memory population in App Direct Mode with two processors (CPU 1 and CPU 2) (continued)

Configura- DIMM slots

tion
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
2 PMEM D D P D D D D
and 12
DIMMs*
2 PMEM D D P D D D D D D
and 16
DIMMs*
4 PMEMs D D D D P D D D D P D D D D
and 24
DIMMs
8 PMEMs P D P D D P D P
and 8
DIMMs
8 PMEMs D D P D D P P D D P D D
and 16
DIMMs
16 PMEMs D P D P D P D P P D P D P D P D
and 16
DIMMs

Note: Configurations with an asterisk (*) support the not-interleaved mode only. 100% interleaved mode is
not supported.

Memory Mode
In this mode, PMEMs act as volatile system memory, while DRAM DIMMs act as cache. Ensure that the ratio
of total DRAM DIMM capacity to total PMEM capacity within a processor is between 1:4 and 1:16.

With one processor

Table 45. Memory Mode with one processor (CPU 1)

• D: DRAM DIMM
• P: Persistent Memory Module (PMEM)

DIMM slots
Configuration
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
4 PMEMs and 4 P D P D D P D P
DIMMs
4 PMEMs and 8 D D P D D P P D D P D D
DIMMs
8 PMEMs and 8 D P D P D P D P P D P D P D P D
DIMMs

Chapter 4. Hardware replacement procedures 101

With two processors
Table 46. Memory Mode with two processors (CPU 1 and CPU 2)

• D: DRAM DIMM
• P: Persistent Memory Module (PMEM)

Configura- DIMM slots

tion
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
8 PMEMs P D P D D P D P
and 8
DIMMs
8 PMEMs D D P D D P P D D P D D
and 16
DIMMs
16 PMEMs D P D P D P D P P D P D P D P D
and 16
DIMMs
Configura- DIMM slots
tion
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
8 PMEMs P D P D D P D P
and 8
DIMMs
8 PMEMs D D P D D P P D D P D D
and 16
DIMMs
16 PMEMs D P D P D P D P P D P D P D P D
and 16
DIMMs

Technical rules
Refer to the below technical rules and limitations when you install the related server components.

Technical rules for drives

Understanding the technical rules for drives helps you correctly install and configure drives in the system.

Drive installation rules

The following notes describe information that you must consider when you install a drive.
• The drive bays are numbered to indicate the installation order (starting from number “0”). Follow the
installation order when you install a drive. See “Front view” on page 19.
• You can use drives from different vendors.
• The drives in a single RAID array must be of the same type, same size, and same capacity.
• You can mix drives of different types and different capacities in one system, but not in one RAID array.
You can also use a 2.5-inch drive in a 3.5-inch drive bay.

For technical rules for RAID configuration, see “Technical rules for RAID configuration” on page 103.

102 ThinkSystem SR630 V2 Maintenance Manual

Technical rules for RAID configuration
The following notes describe information that you must consider when you configure RAID.
• For software RAID, JBOD and RAID levels 0, 1, 5, and 10 are supported.
• Onboard NVMe configuration supports JBOD and RAID levels 0, 1, 5, and 10 when Intel NVMe SSDs are
used.
• Both VROC Intel-SSD-Only and VROC Premium support JBOD and RAID levels 0, 1, 5, and 10, with the
former using Intel NVMe drives while the latter using non-Intel NVMe drives.
– Bootable volumes must be in the same volume management device (VMD) domain.
– Data volumes can be deployed across VMD domains.
– RAID volumes across CPUs are not supported.
– VROC must be configured by referring to the following VMD domain matrix.

Table 47. VMD domain matrix

CPU 0 CPU 1
VMD domain VMD domain VMD domain VMD domain
Server model
PCIe 1 PCIe 2 1 1 1 1 PCIe 3 PCIe 4 PCIe 5 PCIe 6
A B C D
6 7 8 9
– 6 SATA/SAS + 2
AnyBay + 2 NVMe
– 6 SATA/SAS + 4
NVMe
6 SATA/SAS + 4 6 7 8 9
AnyBay

0 1 2 3 4 5 6 7 8 9
– 10 AnyBay
– 10 NVMe
16 EDSFF 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

Technical rules for PCIe adapters

Understanding the technical rules for PCIe adapters helps you correctly install and configure PCIe adapters
in the system.

Chapter 4. Hardware replacement procedures 103

PCIe adapters supported for different models
Table 48. PCIe adapters supported and their locations

Server rear view Supported types and slot location

Riser 1 assembly
• Slot 1: PCIe x16 (x8, x4, x1), low-profile
• Slot 2: PCIe x16 (x8, x4, x1), low-profile

Riser 2 assembly
• Slot 3: PCIe x16 (x8, x4, x1), low-profile

Riser 1 assembly
• Slot 1: PCIe x16 (x8, x4, x1), low-profile
• Slot 2: PCIe x16 (x8, x4, x1), full-height

Note: One rear wall bracket must be installed next to the two PCIe
slots.
Riser 1 assembly
• Slot 1: PCIe x16 (x8, x4, x1), low-profile
• Slot 2: PCIe x16 (x8, x4, x1), low-profile

Riser 1 assembly
• Slot 1: PCIe x16 (x8, x4, x1), low-profile

To locate the PCIe slots, see “Rear view” on page 39.

PCIe adapter installation rules and order

When installing different types of PCIe adapters, refer to the following suggested installation priority:

Table 49. Recommended installation priority for different types of PCIe adapters

Installation priority

1. OCP Ethernet adapter 7. InfiniBand adapter

2. Custom form factor (CFF) internal HBA/RAID adapter 8. Fiber channel adapter

3. Standard form factor (SFF) RAID adapter/Re-timer 9. Network adapter

adapter

4. SFF internal HBA adapter 10. NVMe PCIe flash adapter

5. Re-timer adapter 11. External storage controller

6. GPU adapter 12. COM port bracket

When installing a specific PCIe adapter, refer to the following suggested slot installation priority:

104 ThinkSystem SR630 V2 Maintenance Manual

Table 50. Recommended slot installation priority for PCIe adapters

Recommended slot PCIe adapters

installation priority

Must be installed in slot 1

• SFF HBA/RAID adapter
• ThinkSystem x16 Gen 4.0 Re-timer adapter (for 4 x NVMe)

Must be installed in slot 2

• ThinkSystem NVIDIA Quadro P2200 5GB PCIe Active GPU
(configured as a full-height
slot) • ThinkSystem Broadcom 57454 10/25GbE SFP28 4-port PCIe Ethernet Adapter
• ThinkSystem Intel E810-DA4 10/25GbE SFP28 4-port PCIe Ethernet Adapter
• ThinkSystem Broadcom 57504 10/25GbE SFP28 4-port PCIe Ethernet Adapter

Must be installed in slot 3 ThinkSystem Mellanox HDR/200GbE 2x PCIe Aux Kit

Note: ThinkSystem Mellanox HDR/200GbE 2x PCIe Aux Kit must be used together
with Mellanox ConnectX-6 HDR IB/200GbE Single Port x16 PCIe Adapter and
functions as the auxiliary adapter. Two CPUs are required if both adapters are used,
with the primary adapter installed in slot 1 or slot 2 while the auxiliary adapter installed
in slot 3.
Slot 1 > Slot 3 > Slot 2
• ThinkSystem NVIDIA Tesla T4 16GB PCIe Passive GPU
• ThinkSystem NVIDIA A2 16GB PCIe Gen4 Passive GPU
• ThinkSystem NVIDIA Tesla T4 16GB Base Card (for China only)
• ThinkSystem NVIDIA Quadro P620 GPU
• Mellanox ConnectX-5 EDR IB/100GbE VPI 2-port x16 PCIe 3.0 HCA
• Mellanox ConnectX-6 HDR100 IB/100GbE VPI 1-port x16 PCIe 3.0 HCA
• Mellanox ConnectX-6 HDR100 IB/100GbE VPI 2-port x16 PCIe 3.0 HCA
• Mellanox ConnectX-6 Dx 10/25GbE SFP28 2-port PCIe Ethernet Adapter
• Mellanox ConnectX-6 Dx 100GbE QSFP56 2-port PCIe Ethernet Adapter
• ThinkSystem NVIDIA ConnectX-7 NDR400 OSFP 1-Port PCIe Gen5 Adapter
• ThinkSystem NVIDIA ConnectX-7 NDR200/HDR QSFP112 2-Port PCIe Gen5 x16
InfiniBand Adapter

Chapter 4. Hardware replacement procedures 105

Table 50. Recommended slot installation priority for PCIe adapters (continued)

Recommended slot PCIe adapters

installation priority

Slot 2 > Slot 3 A COM port upgrade kit needs to be installed in slot 2 or 3 as a normal PCIe adapter.
In this case, a riser and bracket are needed.
Slot 1 > Slot 2 > Slot 3 Other PCIe adapters not mentioned above.
Notes:
• For Mellanox ConnectX-6 HDR IB/200GbE Single Port x16 PCIe Adapter, refer to
the following slot priority depending on the quantity of adapters to be installed:
– Two adapters: slot 1, slot 3 or slot 2, slot 3
– Three adapters: slot 1, slot 2, slot 3
• For Xilinx Alveo U50 100GbE 1-Port PCIe Gen4 Adapter, refer to following rules:
– The ambient temperature must be limited to 30°C or lower.
– Use performance fans and no fan fails.
– Only one operating system, Red Hat Enterprise Linux, is supported.
– Do not support Vmware and Windows preload.
• The RAID 940-8i or RAID 940-16i adapter supports Tri-mode. When Tri-mode is
enabled, the server supports SAS, SATA and U.3 NVMe drives at the same time.
NVMe drives are connected via a PCIe x1 link to the controller.

Note: To support Tri-mode with U.3 NVMe drives, U.3 x1 mode must be enabled
for the selected drive slots on the backplane through the XCC Web GUI. Otherwise,
the U.3 NVMe drives cannot be detected. For more information, see “U.3 NVMe
drive can be detected in NVMe connection, but cannot be detected in Tri-mode” on
page 250.

106 ThinkSystem SR630 V2 Maintenance Manual

Technical rules for thermal limitation
This topic provides thermal rules for processors, system fans, heat sinks and other parts.

• “Server models with front drive bays only” on page 107

• “Server models with front and rear drive bays” on page 107
• “Server models with GPUs” on page 108

Server models with front drive bays only

This section provides thermal information for server models with front drive bays only.

Front bays Max. CPU TDP1 Heat sink Air baffle Fan type Max. DIMM Qty.
Ambient (watts)
Temp. (at DRAM2 PMEM3
sea level)

45°C TDP ≤ 125 Standard √ Standard 32 16

45°C 125 < TDP ≤ Standard √ Standard 32 16

165
• 4 x 3.5"
35°C 165 < TDP ≤ Standard √ Perform- 32 16
• 4 x 2.5"
205 ance
• 8 x 2.5"
30°C 205 < TDP ≤ T-shape x Perform- 32 16
• 10 x 2.5" 250 ance
30°C 250 < TDP ≤ T-shape x Perform- 32 16
270 ance
35°C TDP ≤ 125 Standard √ Perform- 32 16
ance
35°C 125 < TDP ≤ Standard √ Perform- 32 16
• 10 x 2.5" U.2 165 ance

• 16 x EDSFF 35°C 165 < TDP ≤ Standard √ Perform- 32 16

205 ance
30°C 205 < TDP ≤ T-shape x Perform- 32 16
250 ance

Notes:
1. For 6334, 4310T, 6338T, and 5320T processors, performance heat sinks must be used.
2. When a 256 GB 3DS RDIMM or 256 GB PMEM is installed, the ambient temperature must be limited to
30°C or lower.
3. The capacity of 3DS RDIMM and PMEM supported is not greater than 256 GB.

Server models with front and rear drive bays

This section provides thermal information for server models with middle or rear drive bays.

Chapter 4. Hardware replacement procedures 107

 Front bays Rear bays Max. CPU Heat sink Air Fan type Max. DIMM Qty.
Ambient TDP1 baffle
Temp. (watts) DRAM2 PMEM
(at sea
level)

TDP ≤ Perform-
Standard √ 32 x
• Rear 125 ance
• 4 x 3.5" SAS/
• 2 x 2.5" 125 <
SATA: Perform-
• 4 x 2.5" SAS/ TDP ≤ Standard √ 32 x
35°C ance
SATA/ 165
• 8 x 2.5"
U.2 • Rear
• 10 x 2.5" U.2: 165 <
Perform-
TDP ≤ Standard √ 32 x
30°C ance
205

Notes:
1. For 6334, 4310T, 6338T, and 5320T processors, performance heat sinks must be used.
2. When a 256 GB 3DS RDIMM, the ambient temperature must be limited to 30°C or lower, and the
capacity of 3DS RDIMM supported is not greater than 256 GB.

Server models with GPUs

This section provides thermal information for server models with GPUs.

• Active GPUs:
– NVIDIA® Quadro® P620
– NVIDIA® Quadro® P2200
• Passive GPUs:
– NVIDIA® Tesla® T4
– NVIDIA® A2
– NVIDIA® L4

Notes:
1. Up to one P2200 GPU adapter is supported, while a maximum of three T4, L4, P620 or A2 GPU adapters
are supported.
2. All GPUs installed must be identical.

108 ThinkSystem SR630 V2 Maintenance Manual

 Front bays Max. Ambient CPU TDP1 (watts) Heat sink Air Fan type Max. DIMM Qty.
Temp. (at sea baffle
level) DRA- PMEM3
M2
Perform-
TDP ≤ 125 Standard √ 32 16
ance
• Active GPUs:
• 4 x 3.5" 35°C Perform-
125 < TDP ≤ 165 Standard √ 32 16
• 4 x 2.5" ance
• Passive
• 8 x 2.5" GPUs: 30°C Perform- 32 16
165 < TDP ≤ 205 Standard √
ance
• 10 x 2.5"
30°C4 Perform-
205 < TDP ≤ 220 T-shape x 32 16
ance

• 4 x 2.5"5 • Active GPUs:

35°C T-shape Perform-
220 < TDP ≤ 270 x 32 16
ance
• Passive
GPUs: 30°C

Notes:
1. For 6334, 4310T, 6338T, and 5320T processors, performance heat sinks must be used.
2. When a 256 GB 3DS RDIMM or 256 GB PMEM is installed, the ambient temperature must be limited to
30°C or lower.
3. The capacity of 3DS RDIMM and PMEM supported is not greater than 256 GB.
4. When the processor TDP is within the range between 205 W (not included) to 220 W, the ambient
temperature must be limited to 30°C or lower, regardless of which GPU is installed.
5. When the processor TDP is within the range between 220 W (not included) to 270 W, only 4 x 2.5-inch
SAS/SATA front backplane is supported.

Use following topics to learn about the technical rules for system fans and GPUs:

Technical rules for system fans

Understanding the technical rules for system fans helps you install the correct type and number of fans
based on what is configured for your server.

Fan redundancy rules

• Supported fan types:
– Standard fan 4056 (21000 RPM)
– Performance fan 4056 (28000 RPM)
• Fan redundancy: N+1 redundancy, one redundant fan rotor
– One processor: six hot-swap dual rotor system fans (one redundant fan rotor)
– Two processors: eight hot-swap dual rotor system fans (one redundant fan rotor)

Note: The redundant cooling by the fans in the server enables continued operation if one rotor of a fan fails.

Fan selection rules

The following lists the rules for selecting standard or performance fan.

Chapter 4. Hardware replacement procedures 109

Table 51. Fan selection rules for different conditions

Use If your server meets any of the following conditions:

Standard or performance
TDP <= 165 W
fan

• TDP > 165 W

• Installed with the front 10 x 2.5'' AnyBay drive backplane or 16-EDSFF drive
backplane
• Installed with the 2 x 2.5'' rear backplane
• Installed with any passive GPU
• Installed with any of the following PCIe adapters:
Performance fan – ThinkSystem Broadcom 57454 10GBASE-T 4-port OCP Ethernet Adapter
– ThinkSystem Broadcom 57508 100GbE QSFP56 2-port PCIe 4 Ethernet Adapter
– Mellanox ConnectX-6 HDR100 IB/100GbE VPI 1-port x16 PCIe 3.0 HCA
– Mellanox ConnectX-6 HDR IB/200GbE Single Port x16 PCIe Adapter
– Mellanox ConnectX-6 HDR100 IB/100GbE VPI 2-port x16 PCIe 3.0 HCA
– Mellanox ConnectX-6 Dx 100GbE QSFP56 2-port PCIe Ethernet Adapter
– ThinkSystem Xilinx Alveo U50 100GbE 1-Port PCIe Gen4 Adapter

Notes:
• Standard fans are enough for low-wattage processors while you can still use performance fans for better
cooling.
• If there is an OCP 3.0 Ethernet adapter installed, when the system is powered off but still plugged in to AC
power, fans 1 and 2 will continue to spin at a much lower speed. This is the system design to provide
proper cooling for the OCP 3.0 Ethernet adapter.

Technical rules for GPU adapters

Understanding the technical rules helps you choose the correct GPUs and install them in the supported slots
based on what is configured for your server.

The following are rules for installing GPUs for your server:
• For GPU configuration, the CPU TDP must not be greater than 200 W. However, if the 4 x 2.5'' SAS/SATA
drive backplane is used or no backplane is used, the CPU TDP can support up to 270 W.
• If a passive GPU adapter is used, the performance fan must be used.
• Refer to the following slot priority when installing a GPU adapter:
– T4, P620, A2, L4: slot 1, slot 3, slot 2
– P2200: slot 2 (full-height)
• When T4, L4 or A2 is installed, the ambient temperature must be limited to 30°C or lower.
• Up to one P2200 GPU adapter is supported, while a maximum of three T4, L4, P620 or A2 GPU adapters
are supported.
• All GPUs installed must be identical.

To prevent potential thermal issues, change the Misc setting in the BIOS from Option3 (default value) to
Option1 if the following two conditions are met:
• The server is equipped with a GPU adapter.
• The UEFI firmware version is AFE128B or later.

110 ThinkSystem SR630 V2 Maintenance Manual

For the method of changing the Misc setting, see https://support.lenovo.com/us/en/solutions/TT1832.

Air baffle replacement

Use this information to remove and install the air baffle.

Note: Air baffle is unavailable when performance heat sink is installed.

Remove the air baffle

Use this information to remove the air baffle.

About this task

Depending on the model, your server might not have an air baffle installed. The air baffle you want to remove
might be different from the following illustrations, but the removal method is the same.

S033

CAUTION:
Hazardous energy present. Voltages with hazardous energy might cause heating when shorted with
metal, which might result in spattered metal, burns, or both.

S017

CAUTION:
Hazardous moving fan blades nearby. Keep fingers and other body parts away.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. If there is a RAID flash power module installed on the bottom of the air baffle, disconnect the RAID
flash power module cable first.
a. Press the release tab to release the connector.
b. Disengage the connector from the cable socket.

Note: Failing to release the tab before removing the cables will damage the cable sockets on
the system board. Any damage to the cable sockets might require replacing the system board.

Chapter 4. Hardware replacement procedures 111

 Figure 38. Disconnecting RAID flash power module cables

Step 3. Grasp the air baffle and carefully lift it out of the server.

Figure 39. Air baffle removal

Attention: Operating the server with the air baffle removed might damage server components. For
proper cooling and airflow, install the air baffle before you power on the server.

After you finish

If you would like to reuse the RAID flash power module installed on the bottom of the air baffle, remove it
from the air baffle. See “Remove the RAID flash power module on the air baffle” on page 199.

Demo video

Watch the procedure on YouTube

Install the air baffle

Use this information to install the air baffle.

About this task

112 ThinkSystem SR630 V2 Maintenance Manual

Depending on the model, your server might not have an air baffle installed. The air baffle you want to install
might be different from the following illustrations, but the removal method is the same.

S033

CAUTION:
Hazardous energy present. Voltages with hazardous energy might cause heating when shorted with
metal, which might result in spattered metal, burns, or both.

S017

CAUTION:
Hazardous moving fan blades nearby. Keep fingers and other body parts away.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.

Procedure
Step 1. If you need to install a RAID flash power module on the bottom of the air baffle, install it first. See
“Install the RAID flash power module on the air baffle” on page 200.

Chapter 4. Hardware replacement procedures 113

Step 2. Align the direction of the air baffle according to indications on it.

Figure 40. Air baffle installation

Step 3. Lower the air baffle into the chassis and press the air baffle down until it is securely seated.

After you finish

1. If there is a RAID flash power module installed on the bottom of the air baffle, connect it to the RAID
adapter with the extension cable that comes with the RAID flash power module.
2. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

Backplane replacement
Use this information to remove and install a backplane.

Remove the front 2.5-inch drive backplane

Use this information to remove the backplane for four, eight, or ten 2.5 inch hot-swap drives.

About this task

The following describes how to remove the backplane for ten and four 2.5-inch hot-swap drives. You can
remove the backplane for eight 2.5-inch hot-swap drives in the same way.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.

114 ThinkSystem SR630 V2 Maintenance Manual

• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Remove all the installed drives and drive fillers from the drive bays. See “Remove a 2.5/3.5-inch
hot-swap drive” on page 145.
Step 3. Disconnect the cables from the backplane. See “2.5-inch/3.5-inch drive backplane (power)” on
page 64 and “2.5-inch/3.5-inch drive backplane (signal)” on page 65.
Step 4. Grasp the backplane and carefully lift it out of the chassis.

Figure 41. Removal of backplane for ten 2.5-inch hot-swap drives

Step 5. Remove the backplane from its bracket.

Figure 42. Removing a backplane

a. Loosen two screws that lock the bracket.

b. Slide the backplane down and remove it as illustrated above.

After you finish

Chapter 4. Hardware replacement procedures 115

If you are instructed to return the old backplane, follow all packaging instructions and use any packaging
materials that are provided.

Install the front 2.5-inch drive backplane

Use this information to install the backplane for four, eight, or ten 2.5 inch hot-swap drives.

About this task

The following describes how to install the backplane for ten and four 2.5-inch hot-swap drives. You can
install the backplane for eight 2.5-inch hot-swap drives in the same way.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the backplane to any unpainted surface on the
outside of the server. Then, take the backplane out of the package and place it on a static-
protective surface.
Step 2. Connect the cables to the backplane. See “2.5-inch/3.5-inch drive backplane (power)” on page 64
and “2.5-inch/3.5-inch drive backplane (signal)” on page 65.
Step 3. Install the backplane to the bracket.

Figure 43. Installing a backplane

a. Install the backplane as illustrated above and align the screw holes on the backplane and
bracket.
b. Tighten two screws to secure the backplane to the bracket.
Step 4. Align the two pins on the backplane with the corresponding holes in the chassis.

116 ThinkSystem SR630 V2 Maintenance Manual

 Figure 44. Installation of backplane for ten 2.5-inch hot-swap drives

Step 5. Lower the backplane into the chassis. Ensure that the pins pass through the holes and the
backplane is fully seated in place.
Step 6. Connect the cables to the system board or expansion slots. See “2.5-inch/3.5-inch drive backplane
(power)” on page 64 and “2.5-inch/3.5-inch drive backplane (signal)” on page 65.

After you finish

1. Reinstall all the drives and drive fillers into the drive bays. See “Install a 2.5/3.5-inch hot-swap drive” on
page 146.
2. Complete the parts replacement. See “Complete the parts replacement” on page 235.
3. If you have installed an Anybay backplane with U.3 NVMe drives for Trimode, enable U.3 x1 mode for
the selected drive slots on the backplane through the XCC Web GUI. See “U.3 NVMe drive can be
detected in NVMe connection, but cannot be detected in Tri-mode” on page 250.

Remove the front 3.5-inch drive backplane

Use this information to remove the front 3.5-inch drive backplane.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Note: Depending on the specific type, your backplane might look different from the illustration in this topic.
Step 1. Prepare your server.
a. Remove the top cover. See “Remove the top cover” on page 232.

Chapter 4. Hardware replacement procedures 117

 b. Remove the system fan cage for easier operation. See “Remove a system fan” on page 220.
c. Remove all the installed drives and fillers (if any) from the drive bays. See “Remove a 2.5/3.5-
inch hot-swap drive” on page 145.
Step 2. Remove the backplane from the chassis.

Figure 45. 3.5-inch-drive backplane removal

a. Open the release latches that secure the backplane.

b. Pivot the backplane backward slightly to release it from the three pins 1 on the chassis.

c. Carefully remove the backplane out of the chassis.

Step 3. Record the cable connections on the backplane and then disconnect all cables from the
backplane. See “2.5-inch/3.5-inch drive backplane (power)” on page 64 and “2.5-inch/3.5-inch
drive backplane (signal)” on page 65.

After you finish

If you are instructed to return the old backplane, follow all packaging instructions and use any packaging
materials that are provided.

Demo video

Watch the procedure on YouTube

Install the front 3.5-inch drive backplane

Use this information to install the front 3.5-inch drive backplane.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.

118 ThinkSystem SR630 V2 Maintenance Manual

• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the backplane to any unpainted surface on the
outside of the server. Then, take the backplane out of the package and place it on a static-
protective surface.
Step 2. Connect the cables to the backplane. See “2.5-inch/3.5-inch drive backplane (power)” on page 64
and “2.5-inch/3.5-inch drive backplane (signal)” on page 65.
Step 3. Put the backplane down into place.

Figure 46. Installation of backplane for four 3.5-inch hot-swap drives

a. Put the backplane under the front I/O assembly cables, align it with the chassis, and lower
it into the chassis. Put the backplane into place with it leaning backward slightly so that the
three pins 1 on the chassis pass through the three holes 2 in the backplane.

b. Close the release latches to secure the backplane in place.

Step 4. Connect the cables to the system board or expansion slots. See “2.5-inch/3.5-inch drive backplane
(power)” on page 64 and “2.5-inch/3.5-inch drive backplane (signal)” on page 65.

After you finish

Chapter 4. Hardware replacement procedures 119

 1. Reinstall all the drives and drive fillers into the drive bays. See “Install a 2.5/3.5-inch hot-swap drive” on
page 146.
2. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

Remove the front 16-EDSFF drive backplane

Use this information to remove the backplane for front 16 EDSFF drives.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Remove all the installed drives and drive cages from the drive bays. See “Remove an EDSFF drive”
on page 148.
Step 3. Remove the backplane from the chassis.

Figure 47. Removal of backplane for 16 EDSFF drives

a. Loosen the screw.

b. Slightly slide the backplane as shown and then lift it up.
Step 4. Disconnect the cables from the backplane. See “16-EDSFF drive backplane” on page 62.

120 ThinkSystem SR630 V2 Maintenance Manual

After you finish
If you are instructed to return the old backplane, follow all packaging instructions and use any packaging
materials that are provided.

Install the front 16-EDSFF drive backplane

Use this information to install the backplane for front 16 EDSFF drives.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the backplane to any unpainted surface on the
outside of the server. Then, take the backplane out of the package and place it on a static-
protective surface.
Step 2. Connect the cables to the backplane. See “16-EDSFF drive backplane” on page 62.
Step 3. Put the backplane down into place.

Figure 48. Installation of backplane for 16 EDSFF drives

a. Align the hole on the backplane with the pin on the chassis, place it down, and slightly slide
it as shown.
b. Tighten the screw to secure the backplane.
Step 4. Connect the cables to the system board or expansion slots. See “16-EDSFF drive backplane” on
page 62.

Chapter 4. Hardware replacement procedures 121

After you finish
1. Reinstall all the drives and drive cages into the drive bays. See “Install an EDSFF drive” on page 150.
2. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Remove the 2.5-inch rear drive backplane

Use this information to remove the 2.5-inch rear drive backplane.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Prepare your server.
a. Remove the top cover. See “Remove the top cover” on page 232.
b. Remove all the installed drives and fillers (if any) from the drive bays. See “Remove a 2.5/3.5-
inch hot-swap drive” on page 145.
c. Record the cable connections for 7mm drives and then disconnect all cables from the
backplanes. For information about the backplane cable routing, see “2.5-inch/3.5-inch drive
backplane (power)” on page 64 and “2.5-inch/3.5-inch drive backplane (signal)” on page 65.
Step 2. Gently press and hold the tab on the rear hot-swap drive cage as shown and remove the air baffle
from the rear hot-swap drive cage.

Figure 49. Air baffle removal

Step 3. Disconnect the cables from the 2.5-inch rear drive backplane.

122 ThinkSystem SR630 V2 Maintenance Manual

Step 4. Carefully lift the 2.5-inch rear drive backplane out of the rear hot-swap drive cage.

Figure 50. 2.5-inch rear drive backplane removal

After you finish

If you are instructed to return the old backplane, follow all packaging instructions and use any packaging
materials that are provided.

Install the 2.5-inch rear drive backplane

Use this information to install the 2.5-inch rear drive backplane.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the rear backplane to any unpainted surface on
the outside of the server. Then, take the rear backplane out of the package and place it on a static-
protective surface.

Chapter 4. Hardware replacement procedures 123

Step 2. Align the rear backplane with the rear hot-swap drive cage and lower it into the rear hot-swap drive
cage.

Figure 51. Rear backplane installation

Step 3. Connect the cables to the backplane. See “2.5-inch/3.5-inch drive backplane (power)” on page 64
and “2.5-inch/3.5-inch drive backplane (signal)” on page 65.
Step 4. Install the air baffle into the rear hot-swap drive cage as shown.

Figure 52. Air baffle installation

Step 5. Connect the cables to the system board or expansion slots. See “2.5-inch/3.5-inch drive backplane
(power)” on page 64 and “2.5-inch/3.5-inch drive backplane (signal)” on page 65.

After you finish

1. Reinstall the drives or drive fillers into the rear hot-swap drive cage. See “Install a 2.5/3.5-inch hot-swap
drive” on page 146.
2. Reinstall the drive assembly to the server. See “Install the rear drive assembly” on page 206.
3. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Remove the 7mm drive backplanes

Use this information to remove the 7mm drive backplanes.

124 ThinkSystem SR630 V2 Maintenance Manual

About this task
Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Note: Depending on the specific type, your backplanes might look different from the illustration in this topic.
Step 1. Prepare your server.
a. Remove the top cover. See “Remove the top cover” on page 232.
b. Remove all the installed drives and fillers (if any) from the drive bays. See “Remove a 2.5/3.5-
inch hot-swap drive” on page 145.
c. Record the cable connections for 7mm drives and then disconnect all cables from the
backplanes. For information about the backplane cable routing, see “7mm drive backplane” on
page 63.
d. Remove the 7mm drive assembly (if any) from the rear chassis. See “Remove the rear drive
assembly” on page 204.
Step 2. Remove the 7mm drive backplane on the top.

Figure 53. 7mm drive backplane removal (top)

a. Remove the two screws as shown.

b. Vertically lift the backplane up and put it aside.

Chapter 4. Hardware replacement procedures 125

Step 3. Remove the 7mm drive backplane at the bottom.

Figure 54. 7mm drive backplane removal (bottom)

a. Remove the screw as shown.

b. Remove the backplane horizontally from the cage as shown.

After you finish

If you are instructed to return the old backplanes, follow all packaging instructions and use any packaging
materials that are provided.

Install the 7mm drive backplanes

Use this information to install the 7mm drive backplanes.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the new backplanes to any unpainted surface on
the outside of the server. Then, take the new backplanes out of the package and place them on a
static-protective surface.
Step 2. Install the 7mm drive backplane at the bottom.

126 ThinkSystem SR630 V2 Maintenance Manual

 Figure 55. 7mm drive backplane installation (bottom)

a. Align the pin on the cage and slightly slide the backplane into the cage until it is fully
seated.
b. Install the screw as shown.
Step 3. Install the 7mm drive backplane on the top.

Figure 56. 7mm drive backplane installation (top)

a. Put the backplane down on the cage as shown.

b. Install the two screws to secure the backplane in place.

Step 4. Connect the cables from the backplanes to the system board and riser slot. See “7mm drive
backplane” on page 63.

After you finish

1. Install the 7mm drive cage assembly on the rear chassis. See “Install the rear drive assembly” on page
206.
2. Reinstall all the drives and fillers (if any) into the drive bays. See “Install a 2.5/3.5-inch hot-swap drive” on
page 146.
3. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Chapter 4. Hardware replacement procedures 127

CMOS battery replacement
Use this information to remove and install the CMOS battery.

Remove the CMOS battery

Use this information to remove the CMOS battery.

About this task

The following tips describe information that you must consider when removing the CMOS battery.
• Lenovo has designed this product with your safety in mind. The lithium CMOS battery must be handled
correctly to avoid possible danger. If you replace the CMOS battery, you must adhere to local ordinances
or regulations for battery disposal.
• If you replace the original lithium battery with a heavy-metal battery or a battery with heavy-metal
components, be aware of the following environmental consideration. Batteries and accumulators that
contain heavy metals must not be disposed of with normal domestic waste. They will be taken back free
of charge by the manufacturer, distributor, or representative, to be recycled or disposed of in a proper
manner.
• To order replacement batteries, call your support center or business partner. For Lenovo support
telephone numbers, see https://datacentersupport.lenovo.com/supportphonelist for your region support
details.

Note: After you replace the CMOS battery, you must reconfigure the server and reset the system date and
time.

S004

CAUTION:
When replacing the lithium battery, use only Lenovo specified part number or an equivalent type
battery recommended by the manufacturer. If your system has a module containing a lithium battery,
replace it only with the same module type made by the same manufacturer. The battery contains
lithium and can explode if not properly used, handled, or disposed of.

Do not:
• Throw or immerse into water
• Heat to more than 100°C (212°F)
• Repair or disassemble

Dispose of the battery as required by local ordinances or regulations.

128 ThinkSystem SR630 V2 Maintenance Manual

S002

CAUTION:
The power-control button on the device and the power switch on the power supply do not turn off the
electrical current supplied to the device. The device also might have more than one power cord. To
remove all electrical current from the device, ensure that all power cords are disconnected from the
power source.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Remove any parts and disconnect any cables that might impede your access to the CMOS battery.
Step 3. Locate the CMOS battery. See “System board components” on page 44.
Step 4. Open the battery clip as shown and carefully take the CMOS battery out of the socket.

Attention:
• Failing to remove the CMOS battery properly might damage the socket on the system board.
Any damage to the socket might require replacing the system board.
• Do not tilt or push the CMOS battery by using excessive force.

Figure 57. CMOS battery removal

After you finish

1. Install a new one. See “Install the CMOS battery” on page 130.
2. Dispose of the CMOS battery as required by local ordinances or regulations.

Demo video

Chapter 4. Hardware replacement procedures 129

Watch the procedure on YouTube

Install the CMOS battery

Use this information to install the CMOS battery.

About this task

The following tips describe information that you must consider when installing the CMOS battery.
• Lenovo has designed this product with your safety in mind. The lithium CMOS battery must be handled
correctly to avoid possible danger. If you replace the CMOS battery, you must adhere to local ordinances
or regulations for battery disposal.
• If you replace the original lithium battery with a heavy-metal battery or a battery with heavy-metal
components, be aware of the following environmental consideration. Batteries and accumulators that
contain heavy metals must not be disposed of with normal domestic waste. They will be taken back free
of charge by the manufacturer, distributor, or representative, to be recycled or disposed of in a proper
manner.
• To order replacement batteries, call your support center or business partner. For Lenovo support
telephone numbers, see https://datacentersupport.lenovo.com/supportphonelist for your region support
details.

Note: After you replace the CMOS battery, you must reconfigure the server and reset the system date and
time.

S004

CAUTION:
When replacing the lithium battery, use only Lenovo specified part number or an equivalent type
battery recommended by the manufacturer. If your system has a module containing a lithium battery,
replace it only with the same module type made by the same manufacturer. The battery contains
lithium and can explode if not properly used, handled, or disposed of.

Do not:
• Throw or immerse into water
• Heat to more than 100°C (212°F)
• Repair or disassemble

Dispose of the battery as required by local ordinances or regulations.

130 ThinkSystem SR630 V2 Maintenance Manual

S002

CAUTION:
The power-control button on the device and the power switch on the power supply do not turn off the
electrical current supplied to the device. The device also might have more than one power cord. To
remove all electrical current from the device, ensure that all power cords are disconnected from the
power source.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the CMOS battery to any unpainted surface on
the outside of the server. Then, take the CMOS battery out of the package.
Step 2. Install the CMOS battery. Ensure that the CMOS battery is seated in place.

Figure 58. CMOS battery installation

After you finish

1. Complete the parts replacement. See “Complete the parts replacement” on page 235.
2. Use the Setup utility to set the date, time, and any passwords.

Demo video

Watch the procedure on YouTube

EDSFF cage replacement

Use this information to remove and install an EDSFF cage

Chapter 4. Hardware replacement procedures 131

Remove an EDSFF cage
Use this information to remove an EDSFF cage.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. If the security bezel is installed, remove it first. See “Remove the security bezel” on page 213.
Step 2. Locate the EDSFF cage you need to remove, and then remove all the EDSFF drives installed in it.
See “Remove an EDSFF drive” on page 148.
Step 3. Remove the EDSFF cage from the chassis.

Figure 59. EDSFF cage removal

a. Press down the extended tab on the other side of the front chassis.
b. Slide the EDSFF cage out of the front chassis.

After you finish

1. Install a new EDSFF cage. See “Install an EDSFF cage” on page 133.
2. If you are instructed to return the old EDSFF cage, follow all packaging instructions and use any
packaging materials that are provided.

132 ThinkSystem SR630 V2 Maintenance Manual

Install an EDSFF cage
Use this information to install an EDSFF cage.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the EDSFF cage to any unpainted surface on the
outside of the server. Then, take the EDSFF cage out of the package and place it on a static-
protective surface.
Step 2. Slide the diagnostics panel assembly into the front chassis as shown. Ensure that it is seated in
place.

Figure 60. EDSFF cage installation

Chapter 4. Hardware replacement procedures 133

Step 3. Remove the EDSFF drive cage cover.

Figure 61. EDSFF drive cage cover removal

a. Open the handle as shown.

b. Grasp the handle and remove the drive cage cover.

Step 4. Install EDSFF drives into the EDSFF cage. See “Install an EDSFF drive” on page 150.

After you finish

Complete the parts replacement. See “Complete the parts replacement” on page 235.

Front I/O assembly replacement

Use this information to remove and install the front I/O assembly.

Depending on server models, your server supports the following front I/O assemblies.

134 ThinkSystem SR630 V2 Maintenance Manual

 Type Front I/O assembly

Front I/O assembly with diagnostics panel (right)

For server models with

• four 2.5-inch front drive bays
• ten 2.5-inch front drive bays
• eight 2.5-inch front drive bays (1)
• 16 EDSFF drives (1)

For server models with four 3.5-inch front drive Front I/O assembly with diagnostics panel (top)
bays.

For server models with Front I/O assembly+ LCD diagnostics panel assembly
• eight 2.5-inch front drive bays (2)
• 16 EDSFF drives (2)

Remove the front I/O assembly

Use this information to remove the front I/O assembly.

About this task

The following illustrates how to remove the front I/O assembly with diagnostics panel. You can remove other
front I/O assemblies in the same way.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.

Chapter 4. Hardware replacement procedures 135

• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. If the security bezel is installed, remove it. See “Remove the security bezel” on page 213.
Step 3. Disconnect the front I/O cables from the system board.
a. Press the release tab to release the connector.
b. Disengage the connector from the cable socket.

Notes:
• Failing to release the tab before removing the cables will damage the cable sockets on the
system board. Any damage to the cable sockets might require replacing the system board.
• The connector on your server may look slightly different from the following illustration.

Figure 62. Disconnecting front I/O cable

136 ThinkSystem SR630 V2 Maintenance Manual

Step 4. Remove the front I/O assembly.

Figure 63. Removal of the front I/O assembly

a. Remove the screws that secure the front I/O assembly.

b. Slide the front I/O assembly out of the front chassis.

After you finish

If you are instructed to return the old front I/O assembly, follow all packaging instructions and use any
packaging materials that are provided.

Demo video

Watch the procedure on YouTube

Install the front I/O assembly

Use this information to install the front I/O assembly.

About this task

The following illustrates how to install the front I/O assembly with diagnostics panel. You can install other
front I/O assemblies in the same way.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Chapter 4. Hardware replacement procedures 137

Procedure
Step 1. Touch the static-protective package that contains the front I/O assembly to any unpainted surface
on the outside of the server. Then, take the front I/O assembly out of the package and place it on a
static-protective surface.
Step 2. Install the front I/O assembly.

Figure 64. Installation of the front I/O assembly

a. Insert the front I/O assembly into the front chassis.

b. Install the screws to secure the front I/O assembly in place.

After you finish

1. Connect the front I/O cables to the system board. See “Front I/O” on page 57.
2. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

Remove the LCD diagnostics panel assembly

Use this information to remove the LCD diagnostics panel assembly.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. If the security bezel is installed, remove it. See “Remove the security bezel” on page 213.

138 ThinkSystem SR630 V2 Maintenance Manual

Step 3. Disconnect the LCD diagnostics panel cables from the system board.
a. Press the release tab to release the connector.
b. Disengage the connector from the cable socket.

Note: Failing to release the tab before removing the cables will damage the cable sockets on
the system board. Any damage to the cable sockets might require replacing the system board.

Figure 65. Disconnecting LCD diagnostics panel cable

Step 4. Remove the LCD diagnostics panel assembly from the chassis.

Figure 66. LCD diagnostics panel assembly removal

a. Press down the extended tab on the other side of the front chassis.
b. Slide the assembly out of the front chassis.

Chapter 4. Hardware replacement procedures 139

Step 5. Remove the LCD diagnostics panel from its assembly.

Figure 67. LCD diagnostics panel removal

a. Press down the clips as shown.

b. Pull the LCD diagnostics panel by its handle to get it out of its assembly.

After you finish

1. Install a new LCD diagnostics panel assembly or filler. See “Install the LCD diagnostics panel assembly”
on page 140.
2. If you are instructed to return the old LCD diagnostics panel assembly, follow all packaging instructions
and use any packaging materials that are provided.

Install the LCD diagnostics panel assembly

Use this information to install the diagnostics panel assembly.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the diagnostics panel assembly to any unpainted
surface on the outside of the server. Then, take the assembly out of the package and place it on a
static-protective surface.

140 ThinkSystem SR630 V2 Maintenance Manual

Step 2. If there is a filler installed on the front chassis, remove it as shown.

Figure 68. Filler removal

Step 3. Insert the LCD diagnostics panel into its assembly. Ensure that the panel is fully seated into its
assembly.

Figure 69. LCD diagnostics panel installation into its assembly

Chapter 4. Hardware replacement procedures 141

Step 4. Slide the diagnostics panel assembly into the front chassis as shown. Ensure that it is seated in
place.

Figure 70. Diagnostics panel assembly installation

After you finish

Complete the parts replacement. See “Complete the parts replacement” on page 235.

Heat sink Torx T30 nut replacement

Use this information to remove and install a heat sink Torx T30 nut.

Remove a heat sink Torx T30 nut

This task has instructions for removing a PEEK (Polyether ether ketone) Torx T30 nut on the heat sink.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.
• If the server is in a rack, remove it from the rack.
• Do not touch the processor contacts. Contaminants on the processor contacts, such as oil from your skin,
can cause connection failures.

Note: The heat sink, processor, and processor carrier for your system might be different from those shown
in the illustrations.

Procedure
Step 1. Make preparations for this task.

142 ThinkSystem SR630 V2 Maintenance Manual

 a. Remove the top cover. See “Remove the top cover” on page 232.
b. Remove the PHM. See “Remove a processor and heat sink” on page 181.
Step 2. Remove the Torx T30 nut.

Figure 71. Removing a Torx T30 nut from the heat sink

Note: Do not touch the gold contacts on the bottom of the processor.

a. Rotate the anti-tilt wire bail inwards.

b. Push the upper edge of the Torx T30 nut towards the center of the heat sink until it
disengages.

c. Remove the Torx T30 nut.

Attention: Visually inspect the removed Torx T30 nut, if the nut is cracked or damaged, make
sure no debris or broken pieces are left inside your server.

After you finish

1. Install a new Torx T30 nut. See “Install a heat sink Torx T30 nut” on page 143.
2. If you are instructed to return the defective component, please package the part to prevent any shipping
damage. Reuse the packaging the new part arrived in and follow all packaging instructions.

Demo video

Watch the procedure on YouTube

Install a heat sink Torx T30 nut

This task has instructions for installing a PEEK (Polyether ether ketone) Torx T30 nut on the heat sink.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.
• Do not touch the processor contacts. Contaminants on the processor contacts, such as oil from your skin,
can cause connection failures.

Chapter 4. Hardware replacement procedures 143

Note: The heat sink, processor, and processor carrier for your system might be different from those shown
in the illustrations.

Procedure
Step 1. Install the Torx T30 nut.

Figure 72. Installing a Torx T30 nut into the heat sink

Note: Do not touch the gold contacts on the bottom of the processor.

a. Rotate the anti-tilt wire bail inwards.

b. Orient the Torx T30 nut under the anti-tilt wire bail; then, align the Torx T30 nut with the
socket at an angle as shown.

c. Push the lower edge of the Torx T30 nut into the socket until it clicks into place. Make sure
the Torx T30 nut is secured under the four clips in the socket.

After you finish

1. Reinstall the PHM. See “Install a processor and heat sink” on page 186.
2. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

Hot-swap drive replacement

Use this information to remove and install a hot-swap drive. You can remove or install a hot-swap drive
without turning off the server, which helps you avoid significant interruption to the operation of the system.

Notes:

144 ThinkSystem SR630 V2 Maintenance Manual

• The term “hot-swap drive” refers to all the supported types of hot-swap hard disk drives, hot-swap solid-
state drives, and hot-swap NVMe drives.
• Use any documentation that comes with the drive and follow those instructions in addition to the
instructions in this topic.
• The electromagnetic interference (EMI) integrity and cooling of the server are protected by having all drive
bays covered or occupied. The vacant bays are either covered by an EMI-protective panel or occupied by
drive fillers. When installing a drive, save the removed drive filler in case that you later remove the drive
and need the drive filler to cover the place.
• To avoid damage to the drive connectors, ensure that the top cover is in place and fully closed whenever
you install or remove a drive.

Remove a 2.5/3.5-inch hot-swap drive

Use this information to remove a 2.5/3.5-inch hot-swap drive.

About this task

The following describes the information that you must consider for this task:
• Ensure that you have backed up data on your drive, especially if it is part of a RAID array.
– Before you make changes to drives, RAID adapters, or drive backplanes, back up all important data
that is stored on the drives.
– Before you remove any component of a RAID array, back up all RAID configuration information.
• If one or more NVMe drives are to be removed, it is recommended to disable them first in Safely Remove
Hardware and Eject Media (Windows) or filesystem (Linux). Log in to XClarity Controller and go to the
Storage menu to identify and locate the drive type and corresponding drive bay number. If the drive bay
numbers come with the term “NVMe”, it indicates the installed drives are NVMe drives.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.
• To ensure that there is adequate system cooling, do not operate the server for more than two minutes
without either a drive or a drive filler installed in each bay.

Procedure
Step 1. If the security bezel is installed, remove it first. See “Remove the security bezel” on page 213.
Step 2. Slide the release latch to the left to open the drive tray handle.

Figure 73. Opening the drive tray handle

Chapter 4. Hardware replacement procedures 145

Step 3. Grasp the handle and slide the drive out of the drive bay.

Figure 74. Hot-swap drive removal

After you finish

1. Install the drive filler or a new drive to cover the drive bay. See “Install a 2.5/3.5-inch hot-swap drive” on
page 146.
2. If you are instructed to return the old hot-swap drive, follow all packaging instructions and use any
packaging materials that are provided.

Demo video

Watch the procedure on YouTube

Install a 2.5/3.5-inch hot-swap drive

Use this information to install a 2.5/3.5-inch hot-swap drive.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the drive to any unpainted surface on the outside
of the server. Then, take the drive out of the package and place it on a static-protective surface.

Note: Ensure that drive installation meets “Technical rules for drives” on page 102.

146 ThinkSystem SR630 V2 Maintenance Manual

Step 2. Remove the drive filler from the drive bay and keep the drive filler in a safe place.

Figure 75. Drive filler removal

Step 3. Install the drive in the drive bay.

Figure 76. Hot-swap drive installation

a. Ensure that the drive tray handle is in the open position. Slide the drive into the drive bay
until it snaps into position.

b. Close the drive tray handle to lock the drive in place.

Step 4. Check the drive LEDs to verify that the drive is operating correctly. For details, see “Drive LEDs” on
page 25.
Step 5. Continue to install additional hot-swap drives if necessary.

After you finish

1. Reinstall the security bezel if you have removed it. See “Install the security bezel” on page 214.
2. Use the Lenovo XClarity Provisioning Manager to configure the RAID if necessary. For more information,
see:
https://pubs.lenovo.com/lxpm-overview/
3. If you have installed an Anybay backplane with U.3 NVMe drives for Trimode, enable U.3 x1 mode for
the selected drive slots on the backplane through the XCC Web GUI. See “U.3 NVMe drive can be
detected in NVMe connection, but cannot be detected in Tri-mode” on page 250.

Chapter 4. Hardware replacement procedures 147

Demo video

Watch the procedure on YouTube

Remove an EDSFF drive

Use this information to remove an EDSFF drive.

About this task

The following describes the information that you must consider for this task:
• Ensure that you have backed up data on your drive, especially if it is part of a RAID array.
– Before you make changes to drives, RAID adapters, or drive backplanes, back up all important data
that is stored on the drives.
– Before you remove any component of a RAID array, back up all RAID configuration information.
• If one or more NVMe drives are to be removed, it is recommended to disable them first in Safely Remove
Hardware and Eject Media (Windows) or filesystem (Linux). Log in to XClarity Controller and go to the
Storage menu to identify and locate the drive type and corresponding drive bay number. If the drive bay
numbers come with the term “NVMe”, it indicates the installed drives are NVMe drives.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.
• To ensure that there is adequate system cooling, do not operate the server for more than two minutes
without either a drive or a drive filler installed in each bay.

Procedure
Step 1. If the security bezel is installed, remove it first. See “Remove the security bezel” on page 213.

148 ThinkSystem SR630 V2 Maintenance Manual

Step 2. Remove the EDSFF drive cage cover.

Figure 77. EDSFF drive cage cover removal

a. Open the handle as shown.

b. Grasp the handle and remove the drive cage cover.

Step 3. Remove the EDSFF drive.

Figure 78. EDSFF drive removal

a. Slide the release latch as shown to open the drive tray handle.

b. Grasp the handle and slide the drive out of the drive bay.

Chapter 4. Hardware replacement procedures 149

After you finish
1. Install a new drive or install the drive cage cover to cover the drive bay. See “Install an EDSFF drive” on
page 150.
2. If you are instructed to return the old EDSFF drive, follow all packaging instructions and use any
packaging materials that are provided.

Install an EDSFF drive

Use this information to install an EDSFF drive.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the drive to any unpainted surface on the outside
of the server. Then, take the drive out of the package and place it on a static-protective surface.

Note: Ensure that drive installation meets “Technical rules for drives” on page 102.
Step 2. Install the EDSFF drive.

Figure 79. EDSFF drive installation

a. Ensure that the drive tray handle is in the open position. Slide the drive into the drive bay
until it snaps into position.

b. Close the drive tray handle to lock the drive in place.

Step 3. Continue to install additional EDSFF drives if necessary.

150 ThinkSystem SR630 V2 Maintenance Manual

Step 4. Install the EDSFF drive cage cover.

Figure 80. EDSFF drive cage cover installation

a. Install the drive cage cover in place.

b. Close the drive cage handle.

After you finish

1. Reinstall the security bezel if you have removed it. See “Install the security bezel” on page 214.
2. Use the Lenovo XClarity Provisioning Manager to configure the RAID if necessary. For more information,
see:
https://pubs.lenovo.com/lxpm-overview/

Hot-swap power supply unit replacement

Use this information to remove and install a hot-swap power supply unit.

Remove a hot-swap power supply unit

Use this information to remove a power supply unit.

About this task

Note: If the power supply unit to be removed is the only one installed, the power supply is non-hot-swap
and before removing it, you must turn off the server first. To support redundancy mode or hot-swap, install
an additional hot-swap power supply.

Chapter 4. Hardware replacement procedures 151

Safety information for AC power supplies

S035

CAUTION:
Never remove the cover on a power supply or any part that has this label attached. Hazardous voltage,
current, and energy levels are present inside any component that has this label attached. There are no
serviceable parts inside these components. If you suspect a problem with one of these parts, contact
a service technician.

S002

CAUTION:
The power-control button on the device and the power switch on the power supply do not turn off the
electrical current supplied to the device. The device also might have more than one power cord. To
remove all electrical current from the device, ensure that all power cords are disconnected from the
power source.

S001

DANGER

Electrical current from power, telephone, and communication cables is hazardous.

To avoid a shock hazard:
• Connect all power cords to a properly wired and grounded electrical outlet/source.
• Connect any equipment that will be attached to this product to properly wired outlets/sources.
• When possible, use one hand only to connect or disconnect signal cables.
• Never turn on any equipment when there is evidence of fire, water, or structural damage.
• The device might have more than one power cord, to remove all electrical current from the
device, ensure that all power cords are disconnected from the power source.

Safety information for DC power supplies

CAUTION:
240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland ONLY. Power supply with
240 V dc input cannot support hot plugging power cord function. Before removing the power supply

152 ThinkSystem SR630 V2 Maintenance Manual

with dc input, please turn off server or disconnect dc power sources at the breaker panel or by turning
off the power source. Then, remove the power cord.

在直流输入状态下，若电源供应器插座不支持热插拔功能，请务必不要对设备电源线进行热插拔，此操作可能
导致设备损坏及数据丢失。因错误执行热插拔导致的设备故障或损坏，不属于保修范围。

NEVER CONNECT AND DISCONNECT THE POWER SUPPLY CABLE AND EQUIPMENT WHILE YOUR
EQUIPMENT IS POWERED ON WITH DC SUPPLY (hot-plugging). Otherwise you may damage the
equipment and result in data loss, the damages and losses result from incorrect operation of the equipment
will not be covered by the manufacturers’ warranty.

S035

CAUTION:
Never remove the cover on a power supply or any part that has this label attached. Hazardous voltage,
current, and energy levels are present inside any component that has this label attached. There are no
serviceable parts inside these components. If you suspect a problem with one of these parts, contact
a service technician.

S019

CAUTION:
The power-control button on the device does not turn off the electrical current supplied to the device.
The device also might have more than one connection to dc power. To remove all electrical current
from the device, ensure that all connections to dc power are disconnected at the dc power input
terminals.

Chapter 4. Hardware replacement procedures 153

S029

DANGER

For -48V dc power supply, electrical current from power cables is hazardous.
To avoid a shock hazard:
• To connect or disconnect -48V dc power cables when you need to remove/install redundancy
power supply unit(s).

To Connect: To Disconnect:

1. Turn OFF subject dc power source(s) and equipment 1. Disconnect or turn off the subject dc power source(s)
(s) that are attached to this product. (at the breaker panel) before removing the power
2. Install the power supply unit(s) into the system supply unit(s).
housing. 2. Remove the subject dc cord(s) and make sure the
3. Attach dc power cord(s) to the product. wire terminal of power cord(s) is insulated.
3. Unplug the subject power supply unit(s) from the
• Ensure correct polarity of -48 V dc connections:
system housing.
RTN is + and -Vin (typical -48 V) dc is -. Earth
ground should be connected very well.
4. Connect dc power cord(s) to subject power source
(s).
5. Turn ON all the power source(s).

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure

154 ThinkSystem SR630 V2 Maintenance Manual

Step 1. If the server is in a rack, adjust the cable management arm (CMA) to gain access to the power
supply bay.

Figure 81. CMA adjustment

1. Press down the stop bracket 1 and rotate it to the open position.
2. Rotate the CMA out of the way to gain access to the power supply.
Step 2. Disconnect the power cord from the hot-swap power supply.
• For 240 V DC power supply units, turn off the server, then, disconnect both ends of the power
cord and keep it in an ESD-safe place.
• For AC power supply units, disconnect both ends of the power cord and keep it in an ESD-safe
place.
• For –48V DC power supply units:
1. Disconnect the power cords from the electrical outlet.
2. Use a slotted screwdriver to loosen the captive screws on the power supply terminal block.
3. Disconnect the power cords from the power supply unit, make the wire terminal insulated,
and keep them in an ESD-safe place.

Note: If you are replacing two power supplies, replace them one by one to ensure that the power
supply to the server is not interrupted. Do not disconnect the power cord from the secondly
replaced power supply until the power output LED for the firstly replaced power supply is lit. For the
location of the power output LED, refer to “Rear view LEDs” on page 43.

Chapter 4. Hardware replacement procedures 155

Step 3. Press the release tab toward the handle and carefully pull the handle at the same time to slide the
hot-swap power supply out of the chassis.

Figure 82. Hot-swap power supply removal

After you finish

1. Install a new power supply or install the power-supply filler to cover the power supply bay. See “Install a
hot-swap power supply” on page 156.

Important: To ensure proper cooling during normal server operation, both of the power supply bays
must be occupied. This means that each bay must have a power supply installed; or one has a power
supply installed and the other has a power supply filler installed.
2. If you are instructed to return the old hot-swap power supply, follow all packaging instructions and use
any packaging materials that are provided.

Demo video

Watch the procedure on YouTube

Install a hot-swap power supply

Use this information to install a hot-swap power supply.

About this task

The following describes the information that you must consider when installing a power supply:
• The server is shipped with only one power supply by default. In this case, the power supply is non-hot-
swap and before removing it, you must turn off the server first. To support redundancy mode or hot-swap,
install an additional hot-swap power supply.
• If you are replacing the existing power supply with a new power supply:
– Use Lenovo Capacity Planner to calculate the required power capacity for what is configured for your
server. More information about Lenovo Capacity Planner is available at:
https://datacentersupport.lenovo.com/solutions/lnvo-lcp
– Ensure that the devices that you are installing are supported. For a list of supported optional devices for
the server, go to:
https://serverproven.lenovo.com/

156 ThinkSystem SR630 V2 Maintenance Manual

 – Attach the power information label that comes with this option onto the existing label near the power
supply.

Figure 83. Example power supply unit label on the top cover

Safety information for AC power supplies

S035

CAUTION:
Never remove the cover on a power supply or any part that has this label attached. Hazardous voltage,
current, and energy levels are present inside any component that has this label attached. There are no
serviceable parts inside these components. If you suspect a problem with one of these parts, contact
a service technician.

S002

CAUTION:
The power-control button on the device and the power switch on the power supply do not turn off the
electrical current supplied to the device. The device also might have more than one power cord. To
remove all electrical current from the device, ensure that all power cords are disconnected from the
power source.

S001

Chapter 4. Hardware replacement procedures 157

 DANGER

Electrical current from power, telephone, and communication cables is hazardous.

To avoid a shock hazard:
• Connect all power cords to a properly wired and grounded electrical outlet/source.
• Connect any equipment that will be attached to this product to properly wired outlets/sources.
• When possible, use one hand only to connect or disconnect signal cables.
• Never turn on any equipment when there is evidence of fire, water, or structural damage.
• The device might have more than one power cord, to remove all electrical current from the
device, ensure that all power cords are disconnected from the power source.

Safety information for DC power supplies

CAUTION:
240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland ONLY. Power supply with
240 V dc input cannot support hot plugging power cord function. Before removing the power supply
with dc input, please turn off server or disconnect dc power sources at the breaker panel or by turning
off the power source. Then, remove the power cord.

在直流输入状态下，若电源供应器插座不支持热插拔功能，请务必不要对设备电源线进行热插拔，此操作可能
导致设备损坏及数据丢失。因错误执行热插拔导致的设备故障或损坏，不属于保修范围。

NEVER CONNECT AND DISCONNECT THE POWER SUPPLY CABLE AND EQUIPMENT WHILE YOUR
EQUIPMENT IS POWERED ON WITH DC SUPPLY (hot-plugging). Otherwise you may damage the
equipment and result in data loss, the damages and losses result from incorrect operation of the equipment
will not be covered by the manufacturers’ warranty.

S035

CAUTION:
Never remove the cover on a power supply or any part that has this label attached. Hazardous voltage,
current, and energy levels are present inside any component that has this label attached. There are no
serviceable parts inside these components. If you suspect a problem with one of these parts, contact
a service technician.

158 ThinkSystem SR630 V2 Maintenance Manual

S019

CAUTION:
The power-control button on the device does not turn off the electrical current supplied to the device.
The device also might have more than one connection to dc power. To remove all electrical current
from the device, ensure that all connections to dc power are disconnected at the dc power input
terminals.

S029

DANGER

For -48V dc power supply, electrical current from power cables is hazardous.
To avoid a shock hazard:
• To connect or disconnect -48V dc power cables when you need to remove/install redundancy
power supply unit(s).

To Connect: To Disconnect:

1. Turn OFF subject dc power source(s) and equipment 1. Disconnect or turn off the subject dc power source(s)
(s) that are attached to this product. (at the breaker panel) before removing the power
2. Install the power supply unit(s) into the system supply unit(s).
housing. 2. Remove the subject dc cord(s) and make sure the
3. Attach dc power cord(s) to the product. wire terminal of power cord(s) is insulated.
3. Unplug the subject power supply unit(s) from the
• Ensure correct polarity of -48 V dc connections:
system housing.
RTN is + and -Vin (typical -48 V) dc is -. Earth
ground should be connected very well.
4. Connect dc power cord(s) to subject power source
(s).
5. Turn ON all the power source(s).

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the hot-swap power supply to any unpainted
surface on the outside of the server. Then, take the hot-swap power supply out of the package and
place it on a static-protective surface.

Chapter 4. Hardware replacement procedures 159

Step 2. If there is a power-supply filler installed, remove it.

Figure 84. Hot-swap power supply filler removal

Step 3. Slide the new hot-swap power supply into the bay until it snaps into position.

Figure 85. Hot-swap power supply installation

Step 4. Connect the power supply unit to a properly grounded electrical outlet.
• For 240 V DC power supply units:
1. Turn off the server.
2. Connect one end of the power cord to the power connector on the power supply unit.
3. Connect the other end of the power cord to a properly grounded electrical outlet.
• For AC power supply units:
1. Connect one end of the power cord to the power connector on the power supply unit.
2. Connect the other end of the power cord to a properly grounded electrical outlet.
• For –48V DC power supply units:
1. Use a slotted screwdriver to loosen the 3 captive screws on the power supply terminal
block.
2. Check the type label on the power supply block and each power cord.

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 Type PSU terminal block Power cord

Input
-Vin

Ground
GND

Input
RTN

3. Face the groove side of each power cord pin upwards, and then plug the pins into
corresponding holes on the power block. Use the table above for guidance to ensure that
the pins find correct slots.
4. Tighten the captive screws on the power block. Ensure that the screws and cord pins are
secured in place and no bare metal parts are shown.
5. Connect the other end of the cables to a properly grounded electrical outlet. Ensure that the
cable ends find correct outlets.

After you finish

1. If you have adjusted the CMA to gain access to the power supply bay, properly readjust the CMA back
in place.
2. If the server is turned off, turn on the server. Ensure that both the power input LED and the power output
LED on the power supply are lit, indicating that the power supply is operating properly.

Demo video

Watch the procedure on YouTube

Internal CFF HBA/RAID adapter replacement

Use this information to remove and install the internal CFF HBA/RAID adapter.

Remove the internal CFF HBA/RAID adapter

Use this information to remove the internal CFF HBA/RAID adapter.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Remove any components that may impede access to the internal CFF HBA/RAID adapter.
Step 3. Disconnect all cables from the internal CFF HBA/RAID adapter.
a. Press the release tab to release the connector.

Chapter 4. Hardware replacement procedures 161

 b. Disengage the connector from the cable socket.

Note: Failing to release the tab before removing the cables will damage the cable sockets on
the system board. Any damage to the cable sockets might require replacing the system board.

Figure 86. Disconnecting cables

Step 4. Lift the release pin, slightly slide the internal CFF HBA/RAID adapter as shown, and carefully lift it
out of the chassis.

Figure 87. Internal CFF HBA/RAID adapter removal

After you finish

If you are instructed to return the old internal CFF HBA/RAID adapter, follow all packaging instructions and
use any packaging materials that are provided.

Install the internal CFF HBA/RAID adapter

Use this information to install the internal CFF HBA/RAID adapter.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.

162 ThinkSystem SR630 V2 Maintenance Manual

• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the internal CFF HBA/RAID adapter to any
unpainted surface on the outside of the server. Then, take the internal CFF HBA/RAID adapter out
of the package and place it on a static-protective surface.
Step 2. Align the notches on the tray with the pins on the chassis, place down the internal CFF HBA/RAID
adapter, and slightly slide it as shown to secure it on the chassis.

Figure 88. Internal CFF HBA/RAID adapter installation

Step 3. Connect cables to the internal RAID adapter. See “CFF HBA/RAID adapter” on page 54.

After you finish

1. Update the adapter and system firmware to the latest version to better support current configuration.
For more details, see “Firmware updates” on page 12.
2. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Intrusion switch replacement

Use this information to remove and install an intrusion switch.

The intrusion switch informs you that the server cover is not properly installed or closed by creating an event
in the system event log (SEL).

Remove an intrusion switch

Use this information to remove an intrusion switch.

About this task

Chapter 4. Hardware replacement procedures 163

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Disconnect the cable of the intrusion switch from the system board. For the location of the intrusion
switch connector and cable routing information, refer to “System board components” on page 44
and “Intrusion switch” on page 58.
Step 3. Slide the intrusion switch as shown to remove it.

Figure 89. Intrusion switch removal

After you finish

If you are instructed to return the old intrusion switch, follow all packaging instructions and use any
packaging materials that are provided.

Install an intrusion switch

Use this information to install an intrusion switch.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure

164 ThinkSystem SR630 V2 Maintenance Manual

Step 1. Touch the static-protective package that contains the intrusion switch to any unpainted surface on
the outside of the server. Then, take the intrusion switch out of the package and place them on a
static-protective surface.
Step 2. Insert the intrusion switch and push it in the direction as shown until it is fully seated.

Figure 90. Intrusion switch installation

Step 3. Connect the cable of the intrusion switch to the intrusion switch connector on the system board.
See “Intrusion switch” on page 58.

After you finish

Complete the parts replacement. See “Complete the parts replacement” on page 235.

Memory module replacement

Use this information to remove and install a memory module.

Remove a memory module

Use this information to remove a memory module.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Memory modules are sensitive to static discharge and require special handling. Refer to the standard
guidelines for “Handling static-sensitive devices” on page 88.
– Always wear an electrostatic-discharge strap when removing or installing memory modules.
Electrostatic-discharge gloves can also be used.
– Never hold two or more memory modules together so that they touch. Do not stack memory modules
directly on top of each other during storage.
– Never touch the gold memory module connector contacts or allow these contacts to touch the outside
of the memory module connector housing.
– Handle memory modules with care: never bend, twist, or drop a memory module.

Chapter 4. Hardware replacement procedures 165

 – Do not use any metal tools (such as jigs or clamps) to handle the memory modules, because the rigid
metals may damage the memory modules.
– Do not insert memory modules while holding packages or passive components, which can cause
package cracks or detachment of passive components by the high insertion force.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. If your server comes with an air baffle, remove it. See “Remove the air baffle” on page 111.
Step 3. Remove the memory module from the slot.

mm

Figure 91. Memory module removal

a. Open the retaining clip on each end of the memory module slot.

Attention: To avoid breaking the retaining clips or damaging the memory module slots, handle
the clips gently.

b. Grasp the memory module at both ends and carefully lift it out of the slot.

After you finish

1. Install a memory module filler or a new memory module to cover the slot. See “Install a memory module”
on page 167.
2. If you are instructed to return the old memory module, follow all packaging instructions and use any
packaging materials that are provided.

Demo video

Watch the procedure on YouTube

166 ThinkSystem SR630 V2 Maintenance Manual

Install a memory module
Use this information to install a memory module.

About this task

See “Memory module installation order” in Setup Guide for detailed information about memory configuration
and setup.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Memory modules are sensitive to static discharge and require special handling. Refer to the standard
guidelines for “Handling static-sensitive devices” on page 88:
– Always wear an electrostatic-discharge strap when removing or installing memory modules.
Electrostatic-discharge gloves can also be used.
– Never hold two or more memory modules together so that they do not touch each other. Do not stack
memory modules directly on top of each other during storage.
– Never touch the gold memory module connector contacts or allow these contacts to touch the outside
of the memory module connector housing.
– Handle memory modules with care: never bend, twist, or drop a memory module.
– Do not use any metal tools (such as jigs or clamps) to handle the memory modules, because the rigid
metals may damage the memory modules.
– Do not insert memory modules while holding packages or passive components, which can cause
package cracks or detachment of passive components by the high insertion force.

Procedure
Step 1. Touch the static-protective package that contains the memory module to any unpainted surface on
the outside of the server. Then, take the memory module out of the package and place it on a
static-protective surface.
Step 2. Locate the required memory module slot on the system board.

Note: Ensure that you observe the installation rules and sequence in “Memory module installation
rules and order” on page 88.

Chapter 4. Hardware replacement procedures 167

Step 3. Install the memory module into the slot.

Figure 92. Memory module installation

a. Open the retaining clip on each end of the memory module slot.

Attention: To avoid breaking the retaining clips or damaging the memory module slots, open
and close the clips gently.

b. Align the memory module with the slot, and gently place the memory module on the slot
with both hands.
c. Firmly press both ends of the memory module straight down into the slot until the retaining
clips snap into the locked position.

Note: If there is a gap between the memory module and the retaining clips, the memory
module has not been correctly inserted. In this case, open the retaining clips, remove the
memory module, and then reinsert it.

After you finish

Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

M.2 backplane and M.2 drive replacement

Use this information to remove and install the M.2 backplane and M.2 drive (an assembled M.2 backplane
and M.2 drive is also known as M.2 module).

168 ThinkSystem SR630 V2 Maintenance Manual

Remove the M.2 backplane and M.2 drive
Use this information to remove the M.2 backplane and M.2 drive.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Disconnect the M.2 cables from the M.2 backplane.

Figure 93. Disconnecting M.2 cables

a. Loosen the screw on the signal cable.

b. Tilt the connector and remove it.
c. Remove the power cable.
Step 3. Remove the M.2 drive from the M.2 backplane.

Note: The M.2 backplane you want to remove might be different from the following illustrations,
but the removal method is the same.

Chapter 4. Hardware replacement procedures 169

 Figure 94. M.2 drive removal

a. Press both sides of the retainer 2 .

b. Slide the retainer backward to loosen the M.2 drive from the M.2 backplane.

c. Rotate the M.2 drive away from the M.2 backplane.

d. Pull the M.2 drive away from the connector 1 at an angle of approximately 30 degrees.
Step 4. Remove the M.2 module from the chassis.

Figure 95. M.2 module removal

a. Loosen the screw.

b. Release the M.2 backplane from the pin and carefully lift the M.2 backplane out from the
chassis.

170 ThinkSystem SR630 V2 Maintenance Manual

Step 5. Disconnect all M.2 cables from the system board.
a. Press the release tab to release the connector.
b. Disengage the connector from the cable socket.

Note: Failing to release the tab before removing the cables will damage the cable sockets on
the system board. Any damage to the cable sockets might require replacing the system board.

Figure 96. Disconnecting M.2 cables

After you finish

If you are instructed to return the old M.2 backplane or M.2 drive, follow all packaging instructions and use
any packaging materials that are provided.

Demo video

Watch the procedure on YouTube

Adjust the retainer on the M.2 backplane

Use this information to adjust the retainer on the M.2 backplane.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Note: The M.2 backplane you want to adjust might be different from the following illustrations, but the
adjustment method is the same.

Chapter 4. Hardware replacement procedures 171

Figure 97. M.2 retainer adjustment

Step 1. Press both sides of the retainers.

Step 2. Move the retainer forward until it is in the large opening of the keyhole.

Step 3. Take the retainer out of the keyhole.

Step 4. Insert the retainer into the correct keyhole into which the retainer should be installed to
accommodate the particular size of the M.2 drive you wish to install.

Step 5. Press both sides of the retainer.

Step 6. Slide the retainer backwards until it is seated in place.

Install the M.2 backplane and M.2 drive

Use this information to install the M.2 backplane and M.2 drive.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the M.2 backplane and M.2 drive to any
unpainted surface on the outside of the server. Then, take the M.2 backplane and M.2 drive out of
the package and place them on a static-protective surface.

Notes:
• The M.2 backplane module is shipped with a loose screw, but the screw is not necessarily used
for the installation.
• The M.2 backplane you want to install might be different from the following illustrations, but the
installation method is the same.
Step 2. Adjust the retainer on the M.2 backplane to accommodate the particular size of the M.2 drive you
wish to install. See “Adjust the retainer on the M.2 backplane” on page 171.

172 ThinkSystem SR630 V2 Maintenance Manual

Step 3. Locate the M.2 drive slot on the M.2 backplane.

Note: For some M.2 backplanes that support two identical M.2 drives, install the M.2 drive in slot 0
first.

1 Slot 0
2 Slot 1

Figure 98. M.2 drive slot

Step 4. Install the M.2 backplane onto the chassis.

Figure 99. M.2 backplane installation

a. Align the notch of the M.2 backplane with the pin on the chassis, and then place down the
M.2 backplane.

b. Tighten the screw to secure the M.2 backplane.

Step 5. Connect the cables to the M.2 backplane and system board. See “M.2 drive backplane” on page
61.
Step 6. Install the M.2 drive on the M.2 backplane.

Chapter 4. Hardware replacement procedures 173

 Figure 100. M.2 drive installation

a. Insert the M.2 drive at an angle of approximately 30 degrees into the connector.

b. Rotate the M.2 drive down until the notch 1 catches on the lip of the retainer 2 .

c. Slide the retainer forward (toward the connector) to secure the M.2 drive into place.
Step 7. Connect the cables to the M.2 backplane and system board. For more information about cable
routing, see “M.2 drive backplane” on page 61.

Figure 101. Connecting M.2 cables

a. Tilt the connector at an angle of 20 degrees or lower, and insert it until its bottom surface
reaches the ramp.
b. Press the connector down flat.
c. Tighten the screw on the signal cable.
d. Connect the power cable.

After you finish

1. Complete the parts replacement. See “Complete the parts replacement” on page 235.
2. Use the Lenovo XClarity Provisioning Manager to configure the RAID. For more information, see:
https://pubs.lenovo.com/lxpm-overview/

174 ThinkSystem SR630 V2 Maintenance Manual

Demo video

Watch the procedure on YouTube

OCP 3.0 Ethernet adapter replacement

Use this information to remove and install the OCP 3.0 Ethernet adapter.

Note: The OCP 3.0 Ethernet adapter is available only on some models.

Remove the OCP 3.0 Ethernet adapter

Use this information to remove the OCP 3.0 Ethernet adapter.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure

Figure 102. OCP 3.0 Ethernet adapter removal

Step 1. Loosen the thumbscrew that secures the adapter.

Step 2. Pull out the OCP 3.0 Ethernet adapter by its handle on the left as shown.

After you finish

Install a new OCP 3.0 Ethernet adapter or a card filler. See “Install the OCP 3.0 Ethernet adapter” on page
176.

Demo video

Chapter 4. Hardware replacement procedures 175

Watch the procedure on YouTube

Install the OCP 3.0 Ethernet adapter

Use this information to install the OCP 3.0 Ethernet adapter.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the OCP 3.0 Ethernet adapter to any unpainted
surface on the outside of the server. Then, take the OCP 3.0 Ethernet adapter out of the package
and place it on a static-protective surface.

176 ThinkSystem SR630 V2 Maintenance Manual

Step 2. Install the OCP 3.0 Ethernet adapter.

Note: Ensure that the Ethernet adapter is fully seated and the thumbscrew is securely tightened.
Otherwise, the OCP 3.0 Ethernet adapter will not get full connection and may not function.

Figure 103. OCP 3.0 Ethernet adapter installation

a. Push the OCP 3.0 Ethernet adapter by its handle on the left until it is fully inserted into the
connector on the system board.

b. Fully tighten the thumbscrew to secure the adapter.

Notes:

Figure 104. OCP 3.0 Ethernet adapter (two Figure 105. OCP 3.0 Ethernet adapter (four
connectors, seen from the rear) connectors, seen from the rear)

• The OCP 3.0 Ethernet adapter provides two or four extra Ethernet connectors for network
connections.
• By default, Ethernet connector 1 (the first port starting from the left in the rear server view) on the
OCP 3.0 Ethernet adapter can also function as a management connector using the shared
management capacity. If the shared management connector fails, traffic can automatically
switch over to another connector on the adapter.

After you finish

Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

Chapter 4. Hardware replacement procedures 177

PCIe adapter replacement
Use this information to remove and install a PCIe adapter.

The PCIe adapter can be an Ethernet adapter, a host bus adapter (HBA), a PCIe RAID adapter, a PCIe
interposer adapter, a PCIe solid-state drive, a PCIe GPU, and any other supported PCIe adapter.

Notes:
• Depending on the specific type, the PCIe adapter might look different from the illustrations in this topic.
• Use any documentation that comes with the PCIe adapter and follow those instructions in addition to the
instructions in this topic.
• To prevent potential thermal issues, change the Misc setting in the BIOS from Option3 (default value) to
Option1 if the following two conditions are met:
– The server is equipped with a GPU adapter.
– The UEFI firmware version is AFE128B or later.
For the method of changing the Misc setting, see https://support.lenovo.com/us/en/solutions/TT1832.

Remove a PCIe adapter

Use this information to remove a PCIe adapter.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Remove the riser assembly. See “Remove a riser card” on page 209.
Step 3. Remove the PCIe adapter from the riser assembly.

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 Figure 106. PCIe adapter removal from the LP-FH riser assembly

a. Rotate the latch on the riser bracket to the open position.

b. Grasp the PCIe adapter by its edges and carefully pull it out of the PCIe adapter slot on the
riser card.

Note: The procedure for removing a PCIe adapter is similar for different types of riser assembly. In
this topic, the LP-FH riser assembly is used as an example.

After you finish

1. Install a PCIe adapter or PCIe adapter filler. See “Install a PCIe adapter” on page 179.
2. If you are instructed to return the old PCIe adapter, follow all packaging instructions and use any
packaging materials that are provided.

Demo video

Watch the procedure on YouTube

Install a PCIe adapter

Use this information to install a PCIe adapter.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure

Chapter 4. Hardware replacement procedures 179

Step 1. Touch the static-protective package that contains the PCIe adapter to any unpainted surface on
the outside of the server. Then, take the PCIe adapter out of the package and place it on a static-
protective surface.
Step 2. Locate the correct PCIe slot for the PCIe adapter. For information about the PCIe slots and
supported PCIe adapters, see “Rear view” on page 39.
Step 3. Install the PCIe adapter and secure it to the riser assembly.

Figure 107. PCIe adapter installation into the LP-FH riser assembly

a. Align the PCIe adapter with the PCIe slot on the riser card. Then, carefully press the PCIe
adapter straight into the slot until it is securely seated and its bracket also is secured.

b. Rotate the latch on the riser bracket to the closed position.

Notes:
1. Ensure that PCIe adapter installation meets “Technical rules for PCIe adapters” on page 103.
2. The procedure for installing a PCIe adapter is similar for different types of riser assembly. In
this topic, the LP-FH riser assembly is used as an example.
Step 4. Connect cables to the PCIe adapter in the riser assembly. See Chapter 3 “Internal cable routing” on
page 53.

After you finish

1. Reinstall the riser assembly. See “Install a riser card” on page 211.
2. Update the adapter and system firmware to the latest version to better support current configuration.
For more details, see “Firmware updates” on page 12.
3. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

Processor and heat sink replacement

Use this information to remove and install a processor and heat sink.

180 ThinkSystem SR630 V2 Maintenance Manual

Attention: Before reusing a processor or heat sink, make sure you use Lenovo proven alcohol cleaning pad
and thermal grease.

Remove a processor and heat sink

This task has instructions for removing an assembled processor and heat sink, known as a processor-heat-
sink module (PHM). This task requires a Torx T30 driver. This procedure must be executed by a trained
technician.

About this task

S002

CAUTION:
The power-control button on the device and the power switch on the power supply do not turn off the
electrical current supplied to the device. The device also might have more than one power cord. To
remove all electrical current from the device, ensure that all power cords are disconnected from the
power source.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.
• If the server is in a rack, remove it from the rack.
• Each processor socket must always contain a cover or a PHM. When removing or installing a PHM,
protect empty processor sockets with a cover.
• Do not touch the processor socket or processor contacts. Processor-socket contacts are very fragile and
easily damaged. Contaminants on the processor contacts, such as oil from your skin, can cause
connection failures.
• Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact
with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage
components, such as the electrical connectors in the processor socket.
• Remove and install only one PHM at a time. If the system board supports multiple processors, install the
PHMs starting with the first processor socket.

Note: The heat sink, processor, and processor carrier for your system might be different from those shown
in the illustrations.

The following illustration shows the components of the PHM.

Chapter 4. Hardware replacement procedures 181

Figure 108. PHM components

Callout Callout
1 Heat sink 9 Clips to secure processor in carrier

2 Heat sink triangular mark 10 Carrier triangular mark

3 Processor identification label 11 Processor ejector handle

4 Nut and wire bail retainer 12 Processor heat spreader

5 Torx T30 nut 13 Thermal grease

6 Anti-tilt wire bail 14 Processor contacts

7 Processor carrier 15 Processor triangular mark

8 Clips to secure carrier to heat sink

Procedure
Step 1. Make preparations for this task.
a. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. If the processor comes with a T-shaped heat sink, fully loosen the two heat sink screws as shown.

182 ThinkSystem SR630 V2 Maintenance Manual

 Figure 109. Loosening T-shaped heat sink screws

Step 3. Remove the PHM from the system board.

Figure 110. Removing a PHM

a. Fully loosen the Torx T30 nuts on the PHM in the removal sequence shown on the heat-sink
label.
b. Rotate the anti-tilt wire bails inward.
c. Carefully lift the PHM from the processor socket. If the PHM cannot be fully lifted out of the
socket, further loosen the Torx T30 nuts and try lifting the PHM again.

Notes:
• Do not touch the contacts on the bottom of the processor.
• Keep the processor socket clean from any object to prevent possible damages.

Chapter 4. Hardware replacement procedures 183

After you finish
• Each processor socket must always contain a cover or a PHM. Protect empty processor sockets with a
cover or install a new PHM.
• If you are not going to install a PHM back, cover the processor socket with the socket cover and install a
PHM filler.

• If you are removing the PHM as part of a system board replacement, set the PHM aside.
• If you are reusing the processor or heat sink, separate the processor from its retainer. See “Separate the
processor from carrier and heat sink” on page 184
• If you are instructed to return the defective component, please package the part to prevent any shipping
damage. Reuse the packaging the new part arrived in and follow all packaging instructions.

Demo video

Watch the procedure on YouTube

Separate the processor from carrier and heat sink

This task has instructions for separating a processor and its carrier from an assembled processor and heat
sink, known as a processor-heat-sink module (PHM). This procedure must be executed by a trained
technician.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.
• Do not touch the processor contacts. Contaminants on the processor contacts, such as oil from your skin,
can cause connection failures.
• Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact
with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage
components, such as the electrical connectors in the processor socket.

Note: The heat sink, processor, and processor carrier for your system might be different than those shown
in the illustrations.

184 ThinkSystem SR630 V2 Maintenance Manual

Procedure
Step 1. Separate the processor from the heat sink and carrier.

Figure 111. Separating a processor from the heat sink and carrier

Note: Do not touch the contacts on the processor.

a. Lift the handle to release the processor from the carrier.

b. Hold the processor by its edges; then, lift the processor from the heat sink and carrier.

c. Without putting the processor down, wipe the thermal grease from the top of the processor
with an alcohol cleaning pad; then, place the processor on a static protective surface with the
processor-contact side up.
Step 2. Separate the processor carrier from the heat sink.

Figure 112. Separating a processor carrier the from heat sink

Note: The processor carrier will be discarded and replaced with a new one.

a. Release the retaining clips from the heat sink.

b. Lift the carrier from the heat sink.

c. Wipe the thermal grease from the bottom of the heat sink with an alcohol cleaning pad.

After you finish

Chapter 4. Hardware replacement procedures 185

If you are instructed to return the defective component, please package the part to prevent any shipping
damage. Reuse the packaging the new part arrived in and follow all packaging instructions.

Install a processor and heat sink

This task has instructions for installing an assembled processor and heat sink, known as a processor-heat-
sink module (PHM). This task requires a Torx T30 driver. This procedure must be executed by a trained
technician.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.
• Each processor socket must always contain a cover or a PHM. When removing or installing a PHM,
protect empty processor sockets with a cover.
• Do not touch the processor socket or processor contacts. Processor-socket contacts are very fragile and
easily damaged. Contaminants on the processor contacts, such as oil from your skin, can cause
connection failures.
• Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact
with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage
components, such as the electrical connectors in the processor socket.
• Remove and install only one PHM at a time. If the system board supports multiple processors, install the
PHMs starting with the first processor socket.
• To ensure the best performance, check the manufacturing date on the new heat sink and make sure it
does not exceed 2 years. Otherwise, wipe off the existing thermal grease and apply the new grease onto it
for optimal thermal performance.

Notes:
• The heat sink, processor, and processor carrier for the system might be different from those shown in the
illustrations.
• PHMs are keyed for the socket where they can be installed and for their orientation in the socket.
• See https://serverproven.lenovo.com/ for a list of processors supported for your server. All processors on
the system board must have the same speed, number of cores, and frequency.
• Before you install a new PHM or replacement processor, update your system firmware to the latest level.
See “Update the firmware” in the ThinkSystem SR630 V2 Setup Guide.

The following illustration shows the components of the PHM.

186 ThinkSystem SR630 V2 Maintenance Manual

Figure 113. PHM components

Callout Callout
1 Heat sink 9 Clips to secure processor in carrier

2 Heat sink triangular mark 10 Carrier triangular mark

3 Processor identification label 11 Processor ejector handle

4 Nut and wire bail retainer 12 Processor heat spreader

5 Torx T30 nut 13 Thermal grease

6 Anti-tilt wire bail 14 Processor contacts

7 Processor carrier 15 Processor triangular mark

8 Clips to secure carrier to heat sink

Procedure
Step 1. If you are replacing a processor and reusing the heat sink.
a. Remove the processor identification label from the heat sink and replace it with the new label
that comes with the replacement processor.
b. If there is any old thermal grease on the heat sink, wipe the thermal grease from the bottom of
the heat sink with an alcohol cleaning pad.
Step 2. If you are replacing a heat sink and reusing the processor.
a. Remove the processor identification label from the old heat sink and place it on the new heat
sink in the same location. The label is on the side of the heat sink closest to the triangular
alignment mark.

Chapter 4. Hardware replacement procedures 187

 Note: If you are unable to remove the label and place it on the new heat sink, or if the label is
damaged during transfer, write the processor serial number from the processor identification
label on the new heat sink in the same location as the label would be placed using a permanent
marker.
b. Install processor in new carrier.

Note: Replacement heat sinks come with both gray and black processor carriers. Make sure
to use the carrier with the same color as the one you discarded earlier.

Figure 114. Installing a processor carrier

1. Make sure the handle on the carrier is in the closed position.

2. Align the processor on the new carrier so that the triangular marks align; then, insert
the marked end of the processor into the carrier.

3. Hold the inserted end of the processor in place; then, pivot the unmarked end of the
carrier down and away from the processor.

4. Press the processor and secure the unmarked end under the clip on the carrier.

5. Carefully pivot the sides of the carrier down and away from the processor.

6. Press the processor and secure the sides under the clips on the carrier.

Note: To prevent the processor from falling out of the carrier, keep the processor-contact
side up and hold the processor-carrier assembly by the sides of the carrier.
Step 3. Apply thermal grease.
a. Carefully place the processor and carrier in the shipping tray with the processor-contact side
down. Make sure the triangular mark on the carrier is aligned with the triangular mark in the
shipping tray.
b. If there is any old thermal grease on the processor, gently wipe the top of the processor with
an alcohol cleaning pad.

Note: Make sure the alcohol has fully evaporated before applying new thermal grease.

188 ThinkSystem SR630 V2 Maintenance Manual

 c. Apply the thermal grease on the top of the processor with syringe by forming four uniformly
spaced dots, while each dot consists of about 0.1 ml of thermal grease.

Figure 115. Thermal grease application with processor in shipping tray

Step 4. Assemble the processor and heat sink.

Figure 116. Assembling the PHM with processor in shipping tray

a. Align the triangular mark on the heat sink label with the triangular mark on the processor carrier
and processor.
b. Install the heat sink onto the processor-carrier.
c. Press the carrier into place until the clips at all four corners engage.
Step 5. Install the processor-heat-sink module into the system board socket.

Chapter 4. Hardware replacement procedures 189

 Figure 117. Installing a PHM

a. Rotate the anti-tilt wire bails inward.

b. Align the triangular mark and four Torx T30 nuts on the PHM with the triangular mark and
threaded posts of the processor socket; then, insert the PHM into the processor socket.

c. Rotate the anti-tilt wire bails outward until they engage with the hooks in the socket.

d. Fully tighten the Torx T30 nuts in the installation sequence shown on the heat-sink label.
Tighten the screws until they stop; then, visually inspect to make sure that there is no gap
between the screw shoulder beneath the heat sink and the processor socket. (For reference,
the torque required for the fasteners to fully tighten is 1.1 newton-meters, 10 inch-pounds).
Step 6. If the processor comes with a T-shaped heat sink, fully tighten the two heat sink screws as shown.
(For reference, the torque required for the fasteners to fully tighten is 1.1 newton-meters, 10 inch-
pounds).

Figure 118. Tightening T-shaped heat sink screws

190 ThinkSystem SR630 V2 Maintenance Manual

After you finish
Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

Rack latches replacement

Use this information to remove and install the rack latches.

Remove the rack latches

Use this information to remove the rack latches.

About this task

Attention: Read “Installation guidelines” on page 85 to ensure that you work safely.

Procedure
Step 1. If the server is installed with the security bezel, remove it first. See “Remove the security bezel” on
page 213.
Step 2. Use a flat-blade screwdriver to remove the ID label plate on the right rack latch and place it in a
safe place.

Figure 119. ID label plate removal

Chapter 4. Hardware replacement procedures 191

Step 3. On each side of the server, remove the two screws that secure the rack latch.

Figure 120. Rack latch screws removal

Step 4. On each side of the server, remove the rack latch from the chassis as shown.

Figure 121. Rack latch removal

After you finish

If you are instructed to return the old rack latches, follow all packaging instructions and use any packaging
materials that are provided.

Demo video

Watch the procedure on YouTube

Install the rack latches

Use this information to install the rack latches.

192 ThinkSystem SR630 V2 Maintenance Manual

About this task
Attention: Read “Installation guidelines” on page 85 to ensure that you work safely.

Procedure
Step 1. Touch the static-protective package that contains the rack latches to any unpainted surface on the
outside of the server. Then, take the rack latches out of the package and place them on a static-
protective surface.
Step 2. On each side of the server, align the rack latch with the pin on the chassis. Then, press the rack
latch onto the chassis and slightly slide it forward as shown.

Figure 122. Rack latch installation

Step 3. Install the two screws to secure the rack latch on each side of the server.

Figure 123. Rack latch screws installation

After you finish

1. Install the ID label plate to the right rack latch as shown.

Chapter 4. Hardware replacement procedures 193

 Figure 124. ID label plate installation

2. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

RAID flash power module replacement

The RAID flash power module protects the cache memory on the installed RAID adapter. You can purchase a
RAID flash power module from Lenovo. Use this information to remove and install a RAID flash power
module.

For a list of supported options, see:

https://serverproven.lenovo.com/

RAID super capacitors can be installed on the chassis, in the air baffle, or to one riser slot.

194 ThinkSystem SR630 V2 Maintenance Manual

RAID flash power module locations

Callout Location Scenario

1 Super capacitor on the chassis 2.5'' chassis installed with a standard or
performance heat sink
2 Super capacitors in the air baffle 2.5'' or 3.5'' chassis installed with a standard heat
sink
3 Super capacitors in the riser 1 slot 3.5'' chassis installed with a performance heat
sink

Remove the RAID flash power module on the chassis

Use this information to remove the RAID flash power module on the chassis.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Disconnect the cable of the RAID flash power module.
a. Press the release tab to release the connector.

Chapter 4. Hardware replacement procedures 195

 b. Disengage the connector from the cable socket.

Note: Failing to release the tab before removing the cables will damage the cable sockets on
the system board. Any damage to the cable sockets might require replacing the system board.

Figure 125. Disconnecting RAID flash power module cables

Step 3. Remove the RAID flash power module on the chassis.

Figure 126. Removal of the RAID flash power module on the chassis

a. Open the retention clip on the holder of the RAID flash power module.

b. Take the RAID flash power module out of the holder.

196 ThinkSystem SR630 V2 Maintenance Manual

Step 4. Remove the RAID flash power module holder as shown if necessary.

a. Press the blue touch point to release the latch.

b. Slide the holder as depicted below and lift the holder out of the chassis.

Figure 127. RAID flash power module holder removal

After you finish

If you are instructed to return the old RAID flash power module, follow all packaging instructions and use any
packaging materials that are provided.

Install the RAID flash power module on the chassis

Use this information to install the RAID flash power module on the chassis.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the RAID flash power module to any unpainted
surface on the outside of the server. Then, take the RAID flash power module out of the package
and place it on a static-protective surface.

Chapter 4. Hardware replacement procedures 197

Step 2. If the server comes with a tray that covers the place of the RAID flash power module on the chassis,
remove it first.
a. Press the blue touch point to release the latch.

b. Slide the tray as depicted below and lift the tray out of the chassis.

Figure 128. Tray removal

Step 3. If the server does not have a RAID flash power module holder on the chassis, install one first.

Figure 129. RAID flash power module holder installation

198 ThinkSystem SR630 V2 Maintenance Manual

Step 4. Install the RAID flash power module on the chassis.

Figure 130. Installation of the RAID flash power module on the chassis

a. Open the retention clip on the holder.

b. Put the RAID flash power module into the holder and press it down to secure it into the
holder.

After you finish

1. Connect the super capacitor module to an adapter with the extension cable that comes with the flash
power module. See “RAID flash power modules” on page 59.
2. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Remove the RAID flash power module on the air baffle

Use this information to remove the RAID flash power module on the air baffle.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Disconnect the cable of the RAID flash power module.
a. Press the release tab to release the connector.
b. Disengage the connector from the cable socket.

Chapter 4. Hardware replacement procedures 199

 Note: Failing to release the tab before removing the cables will damage the cable sockets on
the system board. Any damage to the cable sockets might require replacing the system board.

Figure 131. Disconnecting RAID flash power module cables

Step 3. Remove the air baffle from the chassis. See “Remove the air baffle” on page 111.
Step 4. Remove the RAID flash power module on the air baffle.

Figure 132. Removal of the RAID flash power module on the air baffle

a. Open the retention clip on the holder of the RAID flash power module.

b. Take the RAID flash power module out of the holder.

After you finish

If you are instructed to return the old RAID flash power module, follow all packaging instructions and use any
packaging materials that are provided.

Demo video

Watch the procedure on YouTube

Install the RAID flash power module on the air baffle

Use this information to install the RAID flash power module on the air baffle.

200 ThinkSystem SR630 V2 Maintenance Manual

About this task
Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the RAID flash power module to any unpainted
surface on the outside of the server. Then, take the RAID flash power module out of the package
and place it on a static-protective surface.
Step 2. Install the RAID flash power module on the air baffle.

Figure 133. Installation of the RAID flash power module on the air baffle

a. Open the retention clip on the holder.

b. Put the RAID flash power module into the air baffle and press it down to secure it into the
air baffle.

After you finish

1. Install the air baffle on the chassis. See “Install the air baffle” on page 112.
2. Connect the flash power module to an adapter with the extension cable that comes with the flash power
module. See “RAID flash power modules” on page 59.
3. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

Remove the RAID flash power module on the riser

Use this information to remove the RAID flash power module on the riser.

Chapter 4. Hardware replacement procedures 201

About this task
Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Disconnect the cable of the RAID flash power module.
a. Press the release tab to release the connector.
b. Disengage the connector from the cable socket.

Note: Failing to release the tab before removing the cables will damage the cable sockets on
the system board. Any damage to the cable sockets might require replacing the system board.

Figure 134. Disconnecting RAID flash power module cables

Step 3. Remove the riser assembly. See “Remove a riser card” on page 209.

202 ThinkSystem SR630 V2 Maintenance Manual

Step 4. Remove the RAID flash power module from the riser.

Figure 135. Removal of the RAID super capacitor assembly from the riser

a. Rotate the latch on the riser bracket to the open position.

b. Remove the RAID flash power assembly from the riser.

c. Open the retention clip on the holder of the RAID flash power module.

d. Take the RAID flash power module out of the holder.

After you finish

If you are instructed to return the old RAID flash power module, follow all packaging instructions and use any
packaging materials that are provided.

Install the RAID flash power module on the riser

Use this information to install the RAID flash power module on the riser.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the RAID flash power module to any unpainted
surface on the outside of the server. Then, take the RAID flash power module out of the package
and place it on a static-protective surface.

Chapter 4. Hardware replacement procedures 203

Step 2. Install the RAID flash power module on the riser.

Figure 136. Installation of the RAID flash power module on the riser

a. Open the retention clip on the holder.

b. Put the RAID flash power module into the holder and press it down to secure it into the
holder.
c. Rotate the latch on the riser bracket to the open position.

d. Align the RAID flash power assembly with the slot on the riser card. Then, carefully press
the RAID flash power assembly straight into the slot until it is securely seated and its bracket
also is secured.

After you finish

1. Install the riser assembly on the chassis. See “Install a riser card” on page 211.
2. Connect the flash power module to an adapter with the extension cable that comes with the flash power
module. See “RAID flash power modules” on page 59.
3. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Rear drive assembly replacement

Use this information to remove and install the rear drive assembly.

Note: The term “hot-swap drive” refers to all the supported types of 2.5-inch hot-swap hard disk drives and
hot-swap solid-state drives.

Remove the rear drive assembly

Use this information to remove the rear drive assembly.

About this task

204 ThinkSystem SR630 V2 Maintenance Manual

The following illustrates how to remove the 2.5-inch rear drive assembly. You can remove the 7mm rear drive
assembly in the same way.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Remove the drives or drive fillers installed in the rear drive cage. See “Remove a 2.5/3.5-inch hot-
swap drive” on page 145.
Step 3. Disconnect the rear drive cage cables from the system board or the PCIe adapter.
a. Press the release tab to release the connector.
b. Disengage the connector from the cable socket.

Note: Failing to release the tab before removing the cables will damage the cable sockets on
the system board. Any damage to the cable sockets might require replacing the system board.

Figure 137. Disconnecting cables

Chapter 4. Hardware replacement procedures 205

Step 4. Hold the two blue touch points and directly lift the rear drive cage out of the chassis.

Figure 138. Rear drive cage removal

Step 5. If the rear backplane is reused, remove the rear backplane. See “Remove the 2.5-inch rear drive
backplane” on page 122.

After you finish

If you are instructed to return the old rear drive cage, follow all packaging instructions and use any packaging
materials that are provided.

Demo video

Watch the procedure on YouTube

Install the rear drive assembly

Use this information to install the rear drive assembly.

About this task

The following illustrates how to install the 2.5-inch rear drive assembly. You can install the 7mm rear drive
assembly in the same way.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure

206 ThinkSystem SR630 V2 Maintenance Manual

Step 1. Touch the static-protective package that contains the rear drive cage to any unpainted surface on
the outside of the server. Then, take the rear drive cage out of the package and place it on a static-
protective surface.
Step 2. Gently press and hold the tab on the rear drive cage as shown and remove the air baffle from the
rear drive cage.

Figure 139. Air baffle removal

Step 3. Align the rear backplane with the rear drive cage and lower it into the rear drive cage.

Figure 140. Rear backplane installation

Step 4. Connect the cables to the backplane. See “2.5-inch/3.5-inch drive backplane (power)” on page 64
and “2.5-inch/3.5-inch drive backplane (signal)” on page 65.

Chapter 4. Hardware replacement procedures 207

Step 5. Install the air baffle into the rear drive cage as shown.

Figure 141. Air baffle installation

Step 6. Align the pins on the rear drive cage with the corresponding hole and slot in the chassis. Then,
lower the rear drive cage into the chassis until it is fully seated.

Figure 142. Rear drive cage installation

Step 7. Connect the cables to the system board or expansion slots. See “2.5-inch/3.5-inch drive backplane
(power)” on page 64 and “2.5-inch/3.5-inch drive backplane (signal)” on page 65.

After you finish

1. Reinstall the drives or drive fillers into the rear drive cage. See “Install a 2.5/3.5-inch hot-swap drive” on
page 146.

208 ThinkSystem SR630 V2 Maintenance Manual

 2. Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

Riser card replacement

Use this information to remove and install a riser card.

There are different types of riser assembly configurations. The removal or installation procedure of the riser
card is similar for all types of riser assembly. The following takes the LP-FH riser assembly as an example.

Remove a riser card

Use this information to remove a riser card.

About this task

The riser assembly you want to remove might be different from the following illustrations, but the removal
method is the same. The following takes the LP-FH riser assembly as an example.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. If there is any PCIe adapter installed on the riser card, record the cable connections first. Then,
disconnect all cables from the PCIe adapter.

Chapter 4. Hardware replacement procedures 209

Step 3. Grasp the riser assembly by its edges and carefully lift it out of the chassis.

Figure 143. Riser assembly removal

Step 4. If necessary, remove the PCIe adapters that are installed on the riser card. See “Remove a PCIe
adapter” on page 178.
Step 5. Remove the riser card from the bracket.

Figure 144. Riser card removal

a. Remove the two screws that secure the riser card to the bracket.
b. Remove the riser card.

210 ThinkSystem SR630 V2 Maintenance Manual

After you finish
1. If you are instructed to return the old riser card, follow all packaging instructions and use any packaging
materials that are provided.
2. Remove the rear wall bracket if you would like to install a non-LP-FH riser assembly.

Figure 145. Rear wall bracket removal

Demo video

Watch the procedure on YouTube

Install a riser card

Use this information to install a riser card.

About this task

The riser assembly you want to install might be different from the following illustrations, but the installation
method is the same. The following takes the LPFH riser assembly as an example.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the riser card to any unpainted surface on the
outside of the server. Then, take the riser card out of the package and place it on a static-protective
surface.

Chapter 4. Hardware replacement procedures 211

Step 2. Install the riser card and secure it to the bracket.

Figure 146. Riser card installation

1. Align the screw holes in the riser card with the corresponding ones in the bracket.

2. Install the two screws to secure the riser card to the bracket
Step 3. If necessary, reinstall the PCIe adapters on the riser card. See “Install a PCIe adapter” on page 179.
Then, refer to your note to reconnect any cables of the PCIe adapters on the riser card. Or you can
refer to the Chapter 3 “Internal cable routing” on page 53 and locate the cable routing information
for your configuration options.

212 ThinkSystem SR630 V2 Maintenance Manual

Step 4. Position the riser assembly on the chassis. Align the plastic clip and two pins on the bracket with
the guide pin and two holes on the chassis and align the riser card with the riser slot on the system
board. Then, carefully press the riser assembly straight down into the slot until it is fully seated.

Figure 147. Riser assembly installation

After you finish

Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

Security bezel replacement

Use this information to remove and install the security bezel.

Note: The security bezel is available on some models.

Remove the security bezel

Use this information to remove the security bezel.

About this task

Attention: Read “Installation guidelines” on page 85 to ensure that you work safely.

Procedure

Chapter 4. Hardware replacement procedures 213

Step 1. Use the key to unlock the security bezel.

Figure 148. Unlocking the security bezel

Step 2. Press the release latch 1 and rotate the security bezel outward to remove it from the chassis.

Figure 149. Security bezel removal

Attention: Before you ship the rack with the server installed, reinstall and lock the security bezel
into place.

Install the security bezel

Use this information to install the security bezel.

About this task

Attention: Read “Installation guidelines” on page 85 to ensure that you work safely.

Procedure
Step 1. If you have removed the rack latches, reinstall them. See “Install the rack latches” on page 192.
Step 2. If the key is held inside the security bezel, remove it out of the security bezel.

214 ThinkSystem SR630 V2 Maintenance Manual

 Figure 150. Key removal

a. Press the latch to release the key.

b. Remove the key from the retaining clip in the shown direction.
Step 3. Carefully insert the tab on the security bezel into the slot on the right rack latch. Then, press and
hold the blue release latch and rotate the security bezel inward until the other side clicks into place.

Figure 151. Security bezel installation

Chapter 4. Hardware replacement procedures 215

Step 4. Use the key to lock the security bezel to the closed position.

Figure 152. Locking the security bezel

216 ThinkSystem SR630 V2 Maintenance Manual

Serial port module replacement
Use this information to remove and install a serial port module.

Remove a serial port module

Use this information to remove a serial port module.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Disconnect the cable of the serial port module from the system board.
a. Pinch two side clips to release the connector.
b. Disengage the connector from the cable socket.

Note: Failing to release clips before removing the cables will damage the cable sockets on the
system board. Any damage to the cable sockets might require replacing the system board.

Figure 153. Disconnecting serial port module cable

Step 3. Remove the riser bracket from the server.

Chapter 4. Hardware replacement procedures 217

 Figure 154. Removing the riser bracket

Step 4. Open the retention latch and remove the serial port module from the riser bracket.

Figure 155. Removing the riser bracket

Step 5. (Optional) If you need to replace the serial port bracket, use a 5 mm wrench to disassemble the
serial port cable from the bracket.

a. Loosen two screws to release the connector from the bracket.

b. Disengage the cable from the bracket.

Figure 156. Disassembling the serial port module

After you finish

1. Install a new serial port module, a PCIe adapter, or a PCIe slot bracket to cover the place. See “Install a
serial port module” on page 219 and “Install a PCIe adapter” on page 179.
2. If you are instructed to return the old serial port module, follow all packaging instructions and use any
packaging materials that are provided.

218 ThinkSystem SR630 V2 Maintenance Manual

Install a serial port module
Use this information to install a serial port module.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.
• Read the “Technical rules for PCIe adapters” on page 103 to ensure that you install the serial port module
to a correct PCIe slot.

Procedure
Step 1. Touch the static-protective package that contains the component to any unpainted surface on the
outside of the server. Then, take the component out of the package and place it on a static-
protective surface.
Step 2. Use a 5 mm wrench to install the serial port cable into the bracket.

a. Engage the connector to the bracket.

b. Tighten two screws to ensure that the connector is securely installed to the bracket.

Figure 157. Assembling the serial port module

Step 3. Install the serial port module to the riser bracket.

Figure 158. Installing the serial port module

Step 4. Install the riser assembly to the server.

Chapter 4. Hardware replacement procedures 219

 Figure 159. Installing the riser assembly

Step 5. Connect the cable of the serial port module to the serial-port-module connector on the system
board. For the location of the serial-port-module connector, refer to “System board components”
on page 44.

After you finish

1. Complete the parts replacement. See “Complete the parts replacement” on page 235.
2. To enable the serial port module, do one of the following according to the installed operating system:
• For Linux operating system:
Open the ipmitool and enter the following command to disable the Serial over LAN (SOL) feature:
-I lanplus -H IP -U USERID -P PASSW0RD sol deactivate
• For Microsoft Windows operating system:
a. Open the ipmitool and enter the following command to disable the SOL feature:
-I lanplus -H IP -U USERID -P PASSW0RD sol deactivate
b. Open Windows PowerShell and enter the following command to disable the Emergency
Management Services (EMS) feature:
Bcdedit /ems no
c. Restart the server to ensure that the EMS setting takes effect.

System fan replacement

Use this information to remove and install a system fan.

Remove a system fan

Use this information to remove a system fan. You can remove a hot-swap fan without powering off the
server, which helps you avoid significant interruption to the operation of the system.

About this task

220 ThinkSystem SR630 V2 Maintenance Manual

S033

CAUTION:
Hazardous energy present. Voltages with hazardous energy might cause heating when shorted with
metal, which might result in spattered metal, burns, or both.

S017

CAUTION:
Hazardous moving fan blades nearby. Keep fingers and other body parts away.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Remove the top cover. See “Remove the top cover” on page 232.
Step 2. Grasp the fan tabs on both ends of the system fan and carefully lift the system fan out of the server.

Figure 160. System fan removal

After you finish

Chapter 4. Hardware replacement procedures 221

 1. Install a new system fan or install a fan filler to cover the place. See “Install a system fan” on page 222.
2. If you are instructed to return the old system fan, follow all packaging instructions and use any
packaging materials that are provided.

Demo video

Watch the procedure on YouTube

Install a system fan

Use this information to install a system fan. You can install a hot-swap fan without powering off the server,
which helps you avoid significant interruption to the operation of the system.

About this task

S033

CAUTION:
Hazardous energy present. Voltages with hazardous energy might cause heating when shorted with
metal, which might result in spattered metal, burns, or both.

S017

CAUTION:
Hazardous moving fan blades nearby. Keep fingers and other body parts away.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the system fan to any unpainted surface on the
outside of the server. Then, take the system fan out of the package and place it on a static-
protective surface.

Note: Ensure that fan installation meets “Technical rules for system fans” on page 109.

222 ThinkSystem SR630 V2 Maintenance Manual

Step 2. Place the system fan down in the slot and then press the point on its edge to secure it in place.
Ensure that the fan connector is installed correctly to the connector on the system board.

Figure 161. System fan installation

After you finish

Complete the parts replacement. See “Complete the parts replacement” on page 235.

Demo video

Watch the procedure on YouTube

System board replacement

Use this information to remove and install the system board.

S017

CAUTION:
Hazardous moving fan blades nearby. Keep fingers and other body parts away.

S012

CAUTION:

Chapter 4. Hardware replacement procedures 223

Hot surface nearby.

Remove the system board

Use this information to remove the system board.

About this task

A system board, also known as the motherboard, provides different connectors or slots to connect different
components or peripherals of the system for communication. If the system board fails, it must be replaced.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Prepare your server.
a. Remove the top cover. See “Remove the top cover” on page 232.
b. If your server comes with an air baffle, remove it first. See “Remove the air baffle” on page 111.
c. If your server comes with a rear drive assembly, remove it first. See “Remove the rear drive
assembly” on page 204.
d. Record where the cables are connected to the system board; then, disconnect all the cables.

Attention: Disengage all latches, cable clips, release tabs, or locks on cable connectors
beforehand. Failing to release them before removing the cables will damage the cable
connectors on the system board. Any damage to the cable connectors may require replacing
the system board.
e. Remove any of the following components that are installed on the system board and put them
in a safe, static-protective place.
• “Processor and heat sink” on page 180
• “Memory modules” on page 165
• “System fans” on page 220
• “RAID flash power modules” on page 194
• “Riser assemblies” on page 209
• “CMOS battery” on page 128
• “OCP 3.0 Ethernet adapter” on page 175
f. Pull out the power supplies slightly. Ensure that they are disconnected from the system board.

224 ThinkSystem SR630 V2 Maintenance Manual

Step 2. Remove the system board.

Figure 162. System board removal

a. Hold the lift handle 1 and lift the release pin 2 at the same time and slide the system board
toward the front of the server.
b. Lift the system board out of the chassis.

After you finish

If you are instructed to return the old system board, follow all packaging instructions and use any packaging
materials that are provided.

Important: Before you return the system board, make sure that the CPU socket is covered. There is a CPU
external cap covering the CPU socket on the new system board. Slide the CPU external cap out from the
CPU socket on the new system board, and install the external cap on the CPU socket on the removed
system board.

If you are planning to recycle the system board, follow the instructions in Appendix A “Hardware
disassembling for recycle” on page 263 for compliance with local regulations.

Demo video

Watch the procedure on YouTube

Install the system board

Use this information to install the system board.

About this task

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.

Chapter 4. Hardware replacement procedures 225

• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. Touch the static-protective package that contains the system board to any unpainted surface on
the outside of the server. Then, take the system board out of the package and place it on a static-
protective surface.
Step 2. Install the system board to the server.

Figure 163. System board installation

a. Hold the lift handle 1 and the release pin 2 at the same time to lower the system board into
the chassis.
b. Slide the system board to the rear of the server until the system board snaps into position.
Ensure that:
• The new system board is engaged by the locating pin 3 on the chassis.
• The rear connectors on the new system board are inserted into the corresponding holes in
the rear panel.
• The release pin 2 secures the system board in place.

After you finish

1. Install any components that you have removed from the failing system board.
• “Processor and heat sink” on page 180
• “Memory modules” on page 165
• “System fans” on page 220
• “RAID flash power modules” on page 194

226 ThinkSystem SR630 V2 Maintenance Manual

 • “Riser assemblies” on page 209
• “CMOS battery” on page 128
• “OCP 3.0 Ethernet adapter” on page 175
2. Properly route and secure the cables in the server. Refer to detailed cable routing information for each
component in Chapter 3 “Internal cable routing” on page 53.
3. Install the rear drive cage if you have removed it. See “Install the rear drive assembly” on page 206.
4. Install the air baffle if you have removed it. See “Install the air baffle” on page 112.
5. Install the top cover. See “Install the top cover” on page 233.
6. Push the power supplies into the bays until they click into place.
7. Connect power cords to the server and turn on the server.
8. Update the machine type and serial number of the system board. See “Update the machine type and
serial number” on page 227.
9. Enable TPM. See “Enable TPM” on page 229.
10. Optionally, enable Secure Boot. See “Enable UEFI Secure Boot” on page 231.

Demo video

Watch the procedure on YouTube

Update the machine type and serial number

After the system board is replaced by trained service technicians, the machine type and serial number must
be updated.

There are two methods available to update the machine type and serial number:
• From Lenovo XClarity Provisioning Manager
To update the machine type and serial number from Lenovo XClarity Provisioning Manager:
1. Start the server and press the key according to the on-screen instructions to display the Lenovo
XClarity Provisioning Manager interface.
2. If the power-on Administrator password is required, enter the password.
3. From the System Summary page, click Update VPD.
4. Update the machine type and serial number.
• From Lenovo XClarity Essentials OneCLI
Lenovo XClarity Essentials OneCLI sets the machine type and serial number in the Lenovo XClarity
Controller. Select one of the following methods to access the Lenovo XClarity Controller and set the
machine type and serial number:
– Operate from the target system, such as LAN or keyboard console style (KCS) access
– Remote access to the target system (TCP/IP based)
To update the machine type and serial number from Lenovo XClarity Essentials OneCLI:
1. Download and install Lenovo XClarity Essentials OneCLI.
To download Lenovo XClarity Essentials OneCLI, go to the following site:
https://datacentersupport.lenovo.com/solutions/HT116433
2. Copy and unpack the OneCLI package, which also includes other required files, to the server. Make
sure that you unpack the OneCLI and the required files to the same directory.

Chapter 4. Hardware replacement procedures 227

 3. After you have Lenovo XClarity Essentials OneCLI in place, type the following commands to set the
machine type and serial number:
onecli config set SYSTEM_PROD_DATA.SysInfoProdName <m/t_model> [access_method]
onecli config set SYSTEM_PROD_DATA.SysInfoSerialNum <s/n> [access_method]
onecli config set SYSTEM_PROD_DATA.SysInfoProdIdentifier <system model> [access_method]
onecli config set SYSTEM_PROD_DATA.SysInfoProdIdentifierEx <system model> --override [access_method]

Where:

<m/t_model>
The server machine type and model number. Type mtm xxxxyyy, where xxxx is the machine type
and yyy is the server model number.
<s/n>
The serial number on the server. Type sn zzzzzzz, where zzzzzzz is the serial number.
[access_method]
The access method that you select to use from the following methods:

– Online authenticated LAN access, type the command:

[--bmc-username <xcc_user_id> --bmc-password <xcc_password>]

Where:

xcc_user_id
The BMC/IMM/XCC account name (1 of 12 accounts). The default value is USERID.
xcc_password
The BMC/IMM/XCC account password (1 of 12 accounts).
Example commands are as follows:
onecli config set SYSTEM_PROD_DATA.SysInfoProdName <m/t_model> --bmc-username <xcc_user_id>
--bmc-password <xcc_password>
onecli config set SYSTEM_PROD_DATA.SysInfoSerialNum <s/n> --bmc-username <xcc_user_id> --bmc-
password <xcc_password>
onecli config set SYSTEM_PROD_DATA.SysInfoProdIdentifier <system model> --bmc-username xcc_user_
id --bmc-password xcc_password
onecli config set SYSTEM_PROD_DATA.SysInfoProdIdentifierEx <system model> --override --bmc-
username xcc_user_id --bmc-password xcc_password
– Online KCS access (unauthenticated and user restricted):
You do not need to specify a value for access_method when you use this access method.
Example commands are as follows:
onecli config set SYSTEM_PROD_DATA.SysInfoProdName <m/t_model>
onecli config set SYSTEM_PROD_DATA.SysInfoSerialNum <s/n>
onecli config set SYSTEM_PROD_DATA.SysInfoProdIdentifier <system model>
onecli config set SYSTEM_PROD_DATA.SysInfoProdIdentifierEx <system model> --override

Note: The KCS access method uses the IPMI/KCS interface, which requires that the IPMI
driver be installed.
– Remote LAN access, type the command:
[−−bmc <xcc_user_id>:<xcc_password>@<xcc_external_ip>]

Where:

xcc_external_ip
The BMC/IMM/XCC IP address. There is no default value. This parameter is required.
xcc_user_id
The BMC/IMM/XCC account (1 of 12 accounts). The default value is USERID.

228 ThinkSystem SR630 V2 Maintenance Manual

 xcc_password
The BMC/IMM/XCC account password (1 of 12 accounts).

Note: BMC, IMM, or XCC internal LAN/USB IP address, account name, and password are all
valid for this command.
Example commands are as follows: Example commands are as follows:
onecli config set SYSTEM_PROD_DATA.SysInfoProdName <m/t_model> −−bmc <xcc_user_id>:<xcc_
password>@<xcc_external_ip>
onecli config set SYSTEM_PROD_DATA.SysInfoSerialNum <s/n> −−bmc <xcc_user_id>:<xcc_
password>@<xcc_external_ip>
onecli config set SYSTEM_PROD_DATA.SysInfoProdIdentifier <system model> −−bmc xcc_user_id:xcc_
password@xcc_external_ip
onecli config set SYSTEM_PROD_DATA.SysInfoProdIdentifierEx <system model> --override −−bmc xcc_
user_id:xcc_password@xcc_external_ip
4. Reset the Lenovo XClarity Controller to the factory defaults. See “Resetting the BMC to Factory
Default” section in the XCC documentation compatible with your server at https://pubs.lenovo.com/
lxcc-overview/.

Enable TPM
The server supports Trusted Platform Module (TPM) of version 2.0.

Note: For customers in the Chinese Mainland, integrated TPM is not supported. However, customers in the
Chinese Mainland can install a TPM adapter (sometimes called a daughter card), only version 2.0 is available.

When a system board is replaced, you must make sure that the TPM policy is set correctly.

CAUTION:
Take special care when setting the TPM policy. If it is not set correctly, the system board can become
unusable.

Set the TPM policy

By default, a replacement system board is shipped with the TPM policy set to undefined. You must modify
this setting to match the setting that was in place for the system board that is being replaced.

There are two methods available to set the TPM policy:

• From Lenovo XClarity Provisioning Manager
To set the TPM policy from Lenovo XClarity Provisioning Manager:
1. Start the server and press the key according to the on-screen instructions to display the Lenovo
XClarity Provisioning Manager interface.
2. If the power-on Administrator password is required, enter the password.
3. From the System Summary page, click Update VPD.
4. Set the policy to one of the following settings.
– NationZ TPM 2.0 enabled - China only. Customers in the Chinese Mainland should choose this
setting if a NationZ TPM 2.0 adapter is installed.
– TPM enabled - ROW. Customers outside of the Chinese Mainland should choose this setting.
– Permanently disabled. Customers in the Chinese Mainland should use this setting if no TPM
adapter is installed.

Note: Although the setting undefined is available as a policy setting, it should not be used.
• From Lenovo XClarity Essentials OneCLI

Chapter 4. Hardware replacement procedures 229

 Note: Please note that a Local IPMI user and password must be setup in Lenovo XClarity Controller for
remote accessing to the target system.
To set the TPM policy from Lenovo XClarity Essentials OneCLI:
1. Read TpmTcmPolicyLock to check whether the TPM_TCM_POLICY has been locked:
OneCli.exe config show imm.TpmTcmPolicyLock --override --imm <userid>:<password>@<ip_address>

Note: The imm.TpmTcmPolicyLock value must be 'Disabled', which means TPM_TCM_POLICY is

NOT locked and changes to the TPM_TCM_POLICY are permitted. If the return code is ‘Enabled’
then no changes to the policy are permitted. The planar may still be used if the desired setting is
correct for the system being replaced.
2. Configure the TPM_TCM_POLICY into XCC:
– For customers in Chinese Mainland with no TPM, or customers that require to disable TPM:
OneCli.exe config set imm.TpmTcmPolicy "NeitherTpmNorTcm" --override --imm <userid>:<password>@<ip_
address>
– For customers in Chinese Mainland that require to enable TPM:
OneCli.exe config set imm.TpmTcmPolicy "NationZTPM20Only" --override --imm <userid>:<password>@<ip_
address>
– For customers outside Chinese Mainland that require to enable TPM:
OneCli.exe config set imm.TpmTcmPolicy "TpmOnly" --override --imm <userid>:<password>@<ip_address>
3. Issue reset command to reset system:
OneCli.exe misc ospower reboot --imm <userid>:<password>@<ip_address>
4. Read back the value to check whether the change has been accepted:
OneCli.exe config show imm.TpmTcmPolicy --override --imm <userid>:<password>@<ip_address>

Notes:
– If the read back value is matched it means the TPM_TCM_POLICY has been set correctly.
imm.TpmTcmPolicy is defined as below:
– Value 0 use string “Undefined” , which means UNDEFINED policy.
– Value 1 use string “NeitherTpmNorTcm”, which means TPM_PERM_DISABLED.
– Value 2 use string “TpmOnly”, which means TPM_ALLOWED.
– Value 4 use string “NationZTPM20Only”, which means NationZ_TPM20_ALLOWED.
– Below 4 steps must also be used to ‘lock’ the TPM_TCM_POLICY when using OneCli/ASU
commands:
5. Read TpmTcmPolicyLock to check whether the TPM_TCM_POLICY has been locked , command as
below:
OneCli.exe config show imm.TpmTcmPolicyLock --override --imm <userid>:<password>@<ip_address>

The value must be 'Disabled', it means TPM_TCM_POLICY is NOT locked and must be set.
6. Lock the TPM_TCM_POLICY:
OneCli.exe config set imm.TpmTcmPolicyLock "Enabled" --override --imm <userid>:<password>@<ip_address>
7. Issue reset command to reset system, command as below:
OneCli.exe misc ospower reboot --imm <userid>:<password>@<ip_address>

During the reset, UEFI will read the value from imm.TpmTcmPolicyLock, if the value is 'Enabled' and
the imm.TpmTcmPolicy value is valid, UEFI will lock the TPM_TCM_POLICY setting.

Note: The valid values for imm.TpmTcmPolicy include 'NeitherTpmNorTcm', 'TpmOnly', and
'NationZTPM20Only'.

230 ThinkSystem SR630 V2 Maintenance Manual

 If the imm.TpmTcmPolicyLock is set as 'Enabled' but imm.TpmTcmPolicy value is invalid, UEFI will
reject the 'lock' request and change imm.TpmTcmPolicyLock back to 'Disabled'.
8. Read back the value to check whether the ‘Lock’ is accepted or rejected. Command as below:
OneCli.exe config show imm.TpmTcmPolicy --override --imm <userid>:<password>@<ip_address>

Note: If the read back value is changed from 'Disabled' to 'Enabled' that means the TPM_TCM_
POLICY has been locked successfully. There is no method to unlock a policy once it has been set
other than replacing system board.
imm.TpmTcmPolicyLock is defined as below:
Value 1 uses string “Enabled" , which means lock the policy. Other values are not accepted.

Enable UEFI Secure Boot

Optionally, you can enable UEFI Secure Boot.

There are two methods available to enable UEFI Secure Boot:

• From Lenovo XClarity Provisioning Manager
To enable UEFI Secure Boot from Lenovo XClarity Provisioning Manager:
1. Start the server and press the key specified in the on-screen instructions to display the Lenovo
XClarity Provisioning Manager interface. (For more information, see the “Startup” section in the LXPM
documentation compatible with your server at https://pubs.lenovo.com/lxpm-overview/.)
2. If the power-on Administrator password is required, enter the password.
3. From the UEFI Setup page, click System Settings ➙ Security ➙ Secure Boot.
4. Enable Secure Boot and save the settings.
• From Lenovo XClarity Essentials OneCLI
To enable UEFI Secure Boot from Lenovo XClarity Essentials OneCLI:
1. Download and install Lenovo XClarity Essentials OneCLI.
To download Lenovo XClarity Essentials OneCLI, go to the following site:
https://datacentersupport.lenovo.com/solutions/HT116433
2. Run the following command to enable Secure Boot:
OneCli.exe config set SecureBootConfiguration.SecureBootSetting Enabled --bmc <userid>:<password>@<ip_
address>

where:
– <userid>:<password> are the credentials used to access the BMC (Lenovo XClarity Controller
interface) of your server. The default user ID is USERID, and the default password is PASSW0RD
(zero, not an uppercase o).
– <ip_address> is the IP address of the BMC.
For more information about the Lenovo XClarity Essentials OneCLI set command, see:
https://pubs.lenovo.com/lxce-onecli/onecli_r_set_command

Note: If disabling UEFI secure boot is needed, run the following command:
OneCli.exe config set SecureBootConfiguration.SecureBootSetting Disabled --bmc <userid>:<password>@<ip_
address>

Chapter 4. Hardware replacement procedures 231

Top cover replacement
Use this information to remove and install the top cover.

Remove the top cover

Use this information to remove the top cover.

About this task

S033

CAUTION:
Hazardous energy present. Voltages with hazardous energy might cause heating when shorted with
metal, which might result in spattered metal, burns, or both.

S014

CAUTION:
Hazardous voltage, current, and energy levels might be present. Only a qualified service technician is
authorized to remove the covers where the label is attached.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Procedure
Step 1. If the server is installed in a rack, remove the server from the rack. See the Rack Installation Guide
that comes with the rail kit for your server.

232 ThinkSystem SR630 V2 Maintenance Manual

Step 2. Remove the top cover.

Attention: Handle the top cover carefully. Dropping the top cover with the cover latch open might
damage the cover latch.

Figure 164. Top cover removal

a. Use a screwdriver to turn the cover lock to the unlocked position as shown.

b. Press the release button on the cover latch. The cover latch then gets released to some
extent.
c. Fully open the cover latch as shown.

d. Slide the top cover to the rear until it is disengaged from the chassis. Then, lift the top cover
off the chassis and place the top cover on a flat clean surface.

After you finish

Replace any options as required or install a new top cover. See “Install the top cover” on page 233.

Demo video

Watch the procedure on YouTube

Install the top cover

Use this information to install the top cover.

About this task

S033

Chapter 4. Hardware replacement procedures 233

CAUTION:
Hazardous energy present. Voltages with hazardous energy might cause heating when shorted with
metal, which might result in spattered metal, burns, or both.

S014

CAUTION:
Hazardous voltage, current, and energy levels might be present. Only a qualified service technician is
authorized to remove the covers where the label is attached.

Attention:
• Read “Installation guidelines” on page 85 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.

Operating the server with the top cover removed might damage server components. For proper cooling and
airflow, install the top cover before you turn on the server.

Note: A new top cover comes without a service label attached. If you need a service label, order it together
with the new top cover and attach the service label to the new top cover first.

Procedure
Step 1. Check your server and ensure that:
• All cables, adapters, and other components are installed and seated correctly and that you have
not left loose tools or parts inside the server.
• All internal cables are connected and routed correctly. See Chapter 3 “Internal cable routing” on
page 53.

234 ThinkSystem SR630 V2 Maintenance Manual

Step 2. Install the top cover to your server.

Attention: Handle the top cover carefully. Dropping the top cover with the cover latch open might
damage the cover latch.

Figure 165. Top cover installation

a. Ensure that the cover latch is in the open position. Lower the top cover onto the chassis
until both sides of the top cover engage the guides on both sides of the chassis. Then, slide
the top cover to the front of the chassis.

Note: Before you slide the top cover forward, ensure that all the tabs on the top cover engage
the chassis correctly.

b. Press down the cover latch and ensure that the cover latch is completely closed.

c. Use a screwdriver to turn the cover lock to the locked position.

After you finish

After installing the top cover, complete the parts replacement. See “Complete the parts replacement” on
page 235.

Demo video

Watch the procedure on YouTube

Complete the parts replacement

Use this information to complete the parts replacement.

To complete the parts replacement, do the following:

1. Ensure that all components have been reassembled correctly and that no tools or loose screws are left
inside your server.

Chapter 4. Hardware replacement procedures 235

 2. Properly route and secure the cables in the server. Refer to detailed cable routing information for each
component inChapter 3 “Internal cable routing” on page 53.
3. If you have removed the top cover, reinstall it. See “Install the top cover” on page 233.
4. Reconnect external cables and power cords to the server.

Attention: To avoid component damage, connect the power cords last.

5. Update the server configuration if necessary.
• Download and install the latest device drivers: http://datacentersupport.lenovo.com
• Update the system firmware. See “Firmware updates” on page 12.
• Reconfigure the disk arrays if you have installed or removed a hot-swap drive or a RAID adapter. See
the Lenovo XClarity Provisioning Manager User Guide, which is available for download at: http://
datacentersupport.lenovo.com

236 ThinkSystem SR630 V2 Maintenance Manual

Chapter 5. Problem determination
Use the information in this section to isolate and resolve issues that you might encounter while using your
server.

Lenovo servers can be configured to automatically notify Lenovo Support if certain events are generated.
You can configure automatic notification, also known as Call Home, from management applications, such as
the Lenovo XClarity Administrator. You may also configure Call Home from Lenovo XClarity Controller. Using
the Call Home function, you can create a service forwarder that automatically sends service data for any
managed device to Lenovo Support.

To isolate a problem, you should typically begin with the event log of the application that is managing the
server:
• If you are managing the server from the Lenovo XClarity Administrator, begin with the Lenovo XClarity
Administrator event log.
• If you are using some other management application, begin with the Lenovo XClarity Controller event log.

Event logs
An alert is a message or other indication that signals an event or an impending event. Alerts are generated by
the Lenovo XClarity Controller or by UEFI in the servers. These alerts are stored in the Lenovo XClarity
Controller Event Log.

Note: For a listing of events, including user actions that might need to be performed to recover from an
event, see the Messages and Codes Reference, which is available at:
https://thinksystem.lenovofiles.com/help/topic/SR630V2/pdf_files.html

Lenovo XClarity Administrator event log

If you are using Lenovo XClarity Administrator to manage server, network, and storage hardware, you can
view the events from all managed devices through the XClarity Administrator.

© Copyright Lenovo 2021, 2024 237

Figure 166. Lenovo XClarity Administrator event log

For more information about working with events from XClarity Administrator, see:

http://sysmgt.lenovofiles.com/help/topic/com.lenovo.lxca.doc/events_vieweventlog.html

Lenovo XClarity Controller event log

The Lenovo XClarity Controller monitors the physical state of the server and its components using sensors
that measure internal physical variables such as temperature, power-supply voltages, fan speeds, and
component status. The Lenovo XClarity Controller provides various interfaces to systems management
software and to system administrators and users to enable remote management and control of a server.

The Lenovo XClarity Controller monitors all components of the server and posts events in the Lenovo
XClarity Controller event log.

Figure 167. Lenovo XClarity Controller event log

For more information about accessing the Lenovo XClarity Controller event log, see:

238 ThinkSystem SR630 V2 Maintenance Manual

“Viewing Event Logs” section in the XCC documentation compatible with your server at https://
pubs.lenovo.com/lxcc-overview/

Light path diagnostics

Light path diagnostics is a system of LEDs on various external and internal components of the server that
leads you to the failed component. When an error occurs, LEDs are lit on the front I/O assembly, the rear
panel, the system board, and the failed component. By viewing the following LEDs, you can often identify the
system and device status and diagnose problems.

• “Front view” on page 19

• “Diagnostics panel” on page 26
• “Diagnostics panel” on page 26
• “Rear view LEDs” on page 43
• “System board LEDs” on page 46

General problem determination procedures

Use the information in this section to resolve problems if the event log does not contain specific errors or the
server is inoperative.

If you are not sure about the cause of a problem and the power supplies are working correctly, complete the
following steps to attempt to resolve the problem:
1. Power off the server.
2. Make sure that the server is cabled correctly.
3. Remove or disconnect the following devices if applicable, one at a time, until you find the failure. Power
on and configure the server each time you remove or disconnect a device.
• Any external devices.
• Surge-suppressor device (on the server).
• Printer, mouse, and non-Lenovo devices.
• Each adapter.
• Hard disk drives.
• Memory modules until you reach the minimum configuration that is supported for the server.
See “Specifications” on page 2 to determine the minimum configuration for your server.

Note: The minimum configuration required for the server to start is one processor and one 2 GB DIMM.
4. Power on the server.

If the problem is solved when you remove an adapter from the server, but the problem recurs when you
install the same adapter again, suspect the adapter. If the problem recurs when you replace the adapter with
a different one, try a different PCIe slot.

If the problem appears to be a networking problem and the server passes all system tests, suspect a network
cabling problem that is external to the server.

Resolving suspected power problems

Power problems can be difficult to solve. For example, a short circuit can exist anywhere on any of the power
distribution buses. Usually, a short circuit will cause the power subsystem to shut down because of an
overcurrent condition.

Complete the following steps to diagnose and resolve a suspected power problem.

Chapter 5. Problem determination 239

Step 1. Check the event log and resolve any errors related to the power.

Note: Start with the event log of the application that is managing the server. For more information
about event logs, see “Event logs” on page 237.
Step 2. Check for short circuits, for example, if a loose screw is causing a short circuit on a circuit board.
Step 3. Remove the adapters and disconnect the cables and power cords to all internal and external
devices until the server is at the minimum configuration that is required for the server to start. See
“Specifications” on page 2 to determine the minimum configuration for your server.
Step 4. Reconnect all ac power cords and turn on the server. If the server starts successfully, reseat the
adapters and devices one at a time until the problem is isolated.

If the server does not start from the minimum configuration, replace the components in the minimum
configuration one at a time until the problem is isolated.

Resolving suspected Ethernet controller problems

The method that you use to test the Ethernet controller depends on which operating system you are using.
See the operating-system documentation for information about Ethernet controllers, and see the Ethernet
controller device-driver readme file.

Complete the following steps to attempt to resolve suspected problems with the Ethernet controller.
Step 1. Make sure that the correct device drivers, which come with the server are installed and that they
are at the latest level.
Step 2. Make sure that the Ethernet cable is installed correctly.
• The cable must be securely attached at all connections. If the cable is attached but the problem
remains, try a different cable.
• If you set the Ethernet controller to operate at 100 Mbps or 1000 Mbps, you must use Category
5 cabling.
Step 3. Determine whether a hub is installed in the network environment. If yes, use direct connection from
a server adapter port to a laptop to clarify the network issue. If the network environment is for
unique fiber channel connectors (such as SFP+ and QSFP), use another known good server for
direct connection to clarify the issue first.
Step 4. Check the Ethernet controller LEDs on the rear panel of the server. These LEDs indicate whether
there is a problem with the connector, cable, or hub.
• The Ethernet link status LED is lit when the Ethernet controller receives a link pulse from the hub.
If the LED is off, there might be a defective connector or cable or a problem with the hub.
• The Ethernet transmit/receive activity LED is lit when the Ethernet controller sends or receives
data over the Ethernet network. If the Ethernet transmit/receive activity is off, make sure that the
hub and network are operating and that the correct device drivers are installed.
Step 5. Check the Network activity LED on the rear of the server. The Network activity LED is lit when data
is active on the Ethernet network. If the Network activity LED is off, make sure that the hub and
network are operating and that the correct device drivers are installed.
Step 6. Check for operating-system-specific causes of the problem, and also make sure that the operating
system drivers are installed correctly.
Step 7. Make sure that the device drivers on the client and server are using the same protocol.

If the Ethernet controller still cannot connect to the network but the hardware appears to be working, the
network administrator must investigate other possible causes of the error.

240 ThinkSystem SR630 V2 Maintenance Manual

Troubleshooting by symptom
Use this information to find solutions to problems that have identifiable symptoms.

To use the symptom-based troubleshooting information in this section, complete the following steps:
1. Check the event log of Lenovo XClarity Controller and follow the suggested actions to resolve any event
codes.
For more information about event logs, see “Event logs” on page 237)
2. Review this section to find the symptoms that you are experiencing and follow the suggested actions to
resolve the issue.
3. If the problem persists, contact support (see “Contacting Support” on page 267).

Chapter 5. Problem determination 241

Power on and power off problems
Use this information to resolve issues when powering on or powering off the server.

• “Embedded hypervisor is not in the boot list” on page 242

• “Server does not power on (no indication that input power is connected to the server)” on page 242
• “The power button does not work (server does not start)” on page 243
• “Server does not power off” on page 243

Embedded hypervisor is not in the boot list

Complete the following steps until the problem is solved.
1. If the server has been installed, moved, or serviced recently, or if this is the first time the embedded
hypervisor is being used, make sure that the device is connected properly and that there is no physical
damage to the connectors.
2. See the documentation that comes with the optional embedded hypervisor flash device for setup and
configuration information.
3. Check https://serverproven.lenovo.com/ to validate that the embedded hypervisor device is supported for
the server.
4. Make sure that the embedded hypervisor device is listed in the list of available boot options. From the
management controller user interface, click Server Configuration ➙ Boot Options.
For information about accessing the management controller user interface, see “Opening and Using the
XClarity Controller Web Interface” section in the XCC documentation compatible with your server at:
https://pubs.lenovo.com/lxcc-overview/
5. Check http://datacentersupport.lenovo.com for any tech tips (service bulletins) related to the embedded
hypervisor and the server.
6. Make sure that other software works on the server to ensure that it is working properly.

Server does not power on (no indication that input power is connected to the server)
Complete the following steps until the problem is resolved:
1. Check the event log for any events related to the server not powering on.
2. Check for any LEDs that are flashing amber.
3. Check the power LED on the front operator panel.
4. Check the front operator panel LCD display for error indications.
5. Check the power supply LEDs and ensure that the power supplies are functioning:
a. Make sure that both power supplies installed in the server are of the same type. Mixing different
power supplies in the server will cause a system error.
b. Make sure that the power cords are correctly connected to a working electrical outlet. The power
source meets the input power requirements for the installed power supplies (see the power supply
labels).
c. Disconnect and reconnect the input power cords.
d. Reseat the power supplies.
e. Replace the power supplies one by one, and check the power button function after installing each
one.
6. If the problem still cannot be resolved, collect the failure information with system logs captured to
Lenovo support.

242 ThinkSystem SR630 V2 Maintenance Manual

The power button does not work (server does not start)
Note: The power button will not function until approximately 1 to 3 minutes after the server has been
connected to ac power to allow time for BMC to initialize.

Complete the following steps until the problem is resolved:

1. Verify that input power is applied to the server and that the power supplies are functioning. See “Server
does not power on (no indication that input power is connected to the server)” on page 242.
2. If you just installed an optional device, remove it, and restart the server. If the server starts, you might
have installed more devices than the power supply supports.
3. Make sure that:
• The type of memory that is installed is correct.
• The processors are installed in the correct sequence.
• The minimum number of DIMMs are installed and functional for your processor configuration.
4. Make sure that the power button on the server is working correctly:
Reseat the operator information panel cable. If the problem remains, replace the operator information
panel.
5. If the problem still cannot be resolved, collect the failure information with system logs captured to
Lenovo support.

Server does not power off

Complete the following steps until the problem is resolved:
1. Determine whether you are using an Advanced Configuration and Power Interface (ACPI) or a non-ACPI
operating system. If you are using a non-ACPI operating system, complete the following steps:
a. Press Ctrl+Alt+Delete.
b. Turn off the server by pressing the power button and holding it down for 5 seconds.
c. Restart the server.
d. If the server fails POST and the power button does not work, disconnect the power cord for 20
seconds; then, reconnect the power cord and restart the server.
2. If the problem remains or if you are using an ACPI-aware operating system, suspect the system board.

Memory problems
See this section to resolve issues related to memory.

• “Displayed system memory is less than installed physical memory” on page 244
• “Multiple memory modules in a channel identified as failing” on page 245
• “Attempt to change to another PMEM mode fails” on page 245
• “Extra namespace appears in an interleaved region” on page 245
• “Migrated PMEMs are not supported” on page 245
• “Invalid memory population detected” on page 246
• “PMEMs installed in wrong slots after system board replacement” on page 246
• “After PMEMs are reconfigured, error messages and LEDs persist to indicate PMEMs are installed in
wrong slots” on page 247
• “Cannot create goal successfully when installing PMEMs to the system for the first time” on page 247

Chapter 5. Problem determination 243

Displayed system memory is less than installed physical memory
Complete the following procedure to solve the problem.

Note: Each time you install or remove a memory module, you must disconnect the server from the power
source; then, wait 10 seconds before restarting the server.
1. Make sure that:
• No error LEDs are lit on the operator information panel.
• No memory module error LEDs are lit on the system board.
• Memory mirrored channel does not account for the discrepancy.
• The memory modules are seated correctly.
• You have installed the correct type of memory module (see “PMEM rules” in Setup Guide for
requirements).
• After changing or replacing a memory module, memory configuration is updated accordingly in the
Setup Utility.
• All banks of memory are enabled. The server might have automatically disabled a memory bank when
it detected a problem, or a memory bank might have been manually disabled.
• There is no memory mismatch when the server is at the minimum memory configuration.
• When PMEMs are installed:
a. Refer to “PMEM rules” in Setup Guide and see if the displayed memory fits the mode description.
b. If the memory is set in App Direct Mode, all the saved data have been backed up, and created
namespaces are deleted before any PMEM is replaced or added.
c. If PMEMs are recently set in Memory Mode, turn it back to App Direct Mode and examine if there
is namespace that has not been deleted.
d. Go to the Setup Utility, select System Configuration and Boot Management ➙ Intel Optane
PMEMs ➙ Security, and make sure security of all the PMEM units is disabled.
2. Reseat the memory modules, and then restart the server.
3. Check the POST error log:
• If a memory module was disabled by a systems-management interrupt (SMI), replace the memory
module.
• If a memory module was disabled by the user or by POST, reseat the memory module; then, run the
Setup Utility and enable the memory module.
4. Run memory diagnostics. When you start a solution and press F1, the LXPM interface is displayed by
default. (For more information, see the “Startup” section in the LXPM documentation compatible with
your server at https://pubs.lenovo.com/lxpm-overview/.) You can perform memory diagnostics with this
interface. From the Diagnostic page, go to Run Diagnostic ➙ Memory test or PMEM test.

Notes: When PMEMs are installed, run diagnostics based on the mode that is set presently:
• App Direct Mode:
– Run Memory Test for DRAM memory modules.
– Run PMEM Test for PMEMs.
• Memory Mode:
Run both Memory Test and PMEM Test for PMEMs.
5. Reverse the modules between the channels (of the same processor), and then restart the server. If the
problem is related to a memory module, replace the failing memory module.

244 ThinkSystem SR630 V2 Maintenance Manual

 Note: When PMEMs are installed, only adopt this method in Memory Mode.
6. Re-enable all memory modules using the Setup Utility, and then restart the server.
7. (Trained technician only) Install the failing memory module into a memory module connector for
processor 2 (if installed) to verify that the problem is not the processor or the memory module connector.
8. (Trained technician only) Replace the system board.

Multiple memory modules in a channel identified as failing

Note: Each time you install or remove a memory module, you must disconnect the server from the power
source; then, wait 10 seconds before restarting the server.

Complete the following procedure to solve the problem.

1. Reseat the memory modules; then, restart the server.
2. Remove the highest-numbered memory module of those that are identified and replace it with an
identical known good memory module; then, restart the server. Repeat as necessary. If the failures
continue after all identified memory modules are replaced, go to step 4.
3. Return the removed memory modules, one at a time, to their original connectors, restarting the server
after each memory module, until a memory module fails. Replace each failing memory module with an
identical known good memory module, restarting the server after each memory module replacement.
Repeat step 3 until you have tested all removed memory modules.
4. Replace the highest-numbered memory module of those identified; then, restart the server. Repeat as
necessary.
5. Reverse the memory modules between the channels (of the same processor), and then restart the
server. If the problem is related to a memory module, replace the failing memory module.
6. (Trained technician only) Install the failing memory module into a memory module connector for
processor 2 (if installed) to verify that the problem is not the processor or the memory module connector.
7. (Trained technician only) Replace the system board.

Attempt to change to another PMEM mode fails

After the PMEM mode is changed and the system is successfully restarted, if the PMEM mode stays the
same instead of being changed, check the DRAM DIMMs and PMEM capacity to see if it meets the
requirement of the new mode (see “PMEM rules” in Setup Guide).

Extra namespace appears in an interleaved region

If there are two created namespaces in one interleaved region, VMware ESXi ignores the created
namespaces and creates an extra new namespace during system booting. Delete the created namespaces
in either the Setup Utility or the operating system before the first booting with ESXi.

Migrated PMEMs are not supported

If this warning message appears, complete the following steps:
Intel Optane PMEM interleave set (DIMM X) is migrated from another system (Platform ID: 0x00), these migrated PMEMs
are not supported nor warranted in this system.
1. Move the modules back to the original system with the exact same configuration as the previous one.
2. Back up stored data in PMEM namespaces.
3. Disable PMEM security with one of the following options:
• LXPM
Go to UEFI Setup ➙ System Settings ➙ Intel Optane PMEMs ➙ Security ➙ Press to Disable
Security, and input passphrase to disable security.

Chapter 5. Problem determination 245

 • Setup Utility
Go to System Configuration and Boot Management ➙ System Settings ➙ Intel Optane PMEMs
➙ Security ➙ Press to Disable Security, and input passphrase to disable security.
4. Delete namespaces with command corresponding to the operating system that is installed:
• Linux command:
ndctl destroy-namespace all -f
• Windows Powershell command
Get-PmemDisk | Remove-PmemDisk
5. Clear Platform Configuration Data (PCD) and Namespace Label Storage Area (LSA) with the following
ipmctl command (for both Linux and Windows).
ipmctl delete -pcd

Notes: See the following links to learn how to download and use impctl in different operating systems:
• Windows: https://datacentersupport.lenovo.com/us/en/videos/YTV101407
• Linux: https://datacentersupport.lenovo.com/us/en/solutions/HT508642
6. Start the server and press the key specified in the on-screen instructions. (For more information, see the
“Startup” section in the LXPM documentation compatible with your server at https://pubs.lenovo.com/
lxpm-overview/.) The Lenovo XClarity Provisioning Manager interface is displayed by default.
7. Power off the system.
8. Remove the modules to be reused for a new system or configuration.

Invalid memory population detected

If this warning message appears, complete the following steps:
Invalid memory population (unsupported DIMM population) detected. Please verify memory configuration is valid.
1. See “Memory module installation rules and order” in Setup Guide to make sure the present memory
module population sequence is supported.
2. If the present sequence is indeed supported, see if any of the modules is displayed as “disabled” in
Setup Utility.
3. Reseat the module that is displayed as “disabled,” and reboot the system.
4. If the problem persists, replace the memory module.

PMEMs installed in wrong slots after system board replacement

If this warning message appears, complete the following steps:
DIMM X of Intel Optane PMEM persistent interleave set should be moved to DIMM Y.
1. Record each of the instructions of changing PMEM slot from XCC events.
2. Power off the system, and remove the PMEMs that are mentioned in the warning messages. It is
suggested to label these PMEMs to avoid confusion.
3. Install the PMEMs in the correct slot number indicated in the warning messages. Remove the labels to
avoid blocking airflow and cooling.
4. Complete replacement and power on the system. Make sure there is no similar warning messages in
XCC.

Note: Do not perform any provisioning on PMEM to avoid data lost when the messages are still present in
XCC events.

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After PMEMs are reconfigured, error messages and LEDs persist to indicate PMEMs are installed in
wrong slots
AC the system or restart XCC to solve this problem.

Cannot create goal successfully when installing PMEMs to the system for the first time
When seeing ones of the following messages:
• ERROR: Cannot retrieve memory resources info
• ERROR: One or more PMEM modules do not have PCD data. A platform reboot is recommended to
restore valid PCD data.
Complete the following steps to solve the problem.

1. If the PMEMs have been installed in another system with stored data, perform the following steps to
erase the data.
a. Based on the original population order, install the PMEMs to the original system where they were
installed previously, and back up the data from the PMEMs to other storage devices.
b. Disable PMEM security with one of the following options:
• LXPM
Go to UEFI Setup ➙ System Settings ➙ Intel Optane PMEMs ➙ Security ➙ Press to Disable
Security, and input passphrase to disable security.
• Setup Utility
Go to System Configuration and Boot Management ➙ System Settings ➙ Intel Optane
PMEMs ➙ Security ➙ Press to Disable Security, and input passphrase to disable security.
c. Delete namespaces with command corresponding to the operating system that is installed:
• Linux command:
ndctl destroy-namespace all -f
• Windows Powershell command
Get-PmemDisk | Remove-PmemDisk
d. Clear Platform Configuration Data (PCD) and Namespace Label Storage Area (LSA) with the following
ipmctl command (for both Linux and Windows).
ipmctl delete -pcd

Notes: See the following links to learn how to download and use impctl in different operating
systems:
• Windows: https://datacentersupport.lenovo.com/us/en/videos/YTV101407
• Linux: https://datacentersupport.lenovo.com/us/en/solutions/HT508642
2. Install the PMEMs back to the target system, and upgrade system firmware to the latest version without
entering Setup Utility.
3. If the problem persists, overwrite PMEMs with the following ndctl command.
ndctl sanitize-dimm --overwrite all
4. Monitor the overwrite status with the following command.
watch -n 1 “ipmctl show -d OverwriteStatus -dimm”
5. When seeing all PMEM OverwriteStatus=Completed, reboot the system and see if the problem persists.

Hard disk drive problems

Use this information to resolve issues related to the hard disk drives.

Chapter 5. Problem determination 247

• “Server cannot recognize a hard drive” on page 248
• “Multiple hard drives fail” on page 249
• “Multiple hard drives are offline” on page 249
• “A replacement hard disk drive does not rebuild” on page 249
• “Green drive activity LED does not represent actual state of associated drive” on page 249
• “Yellow drive activity LED does not represent actual state of associated drive” on page 249
• “U.3 NVMe drive can be detected in NVMe connection, but cannot be detected in Tri-mode” on page 250

Server cannot recognize a hard drive

Complete the following steps until the problem is solved.
1. Observe the associated yellow hard disk drive status LED. If the LED is lit, it indicates a drive fault.
2. If the status LED is lit, remove the drive from the bay, wait 45 seconds, and reinsert the drive, making
sure that the drive assembly connects to the hard disk drive backplane.
3. Observe the associated green hard disk drive activity LED and the yellow status LED and perform
corresponding operations in different situations:
• If the green activity LED is flashing and the yellow status LED is not lit, the drive is recognized by the
controller and is working correctly. Run the diagnostics tests for the hard disk drives. When you start
a server and press the key according to the on-screen instructions, the LXPM is displayed by default.
(For more information, see the “Startup” section in the LXPM documentation compatible with your
server at https://pubs.lenovo.com/lxpm-overview/.) You can perform hard drive diagnostics from this
interface. From the Diagnostic page, click Run Diagnostic ➙ HDD test/Disk Drive Test.*
• If the green activity LED is flashing and the yellow status LED is flashing slowly, the drive is
recognized by the controller and is rebuilding.
• If neither LED is lit or flashing, check whether the hard disk drive backplane is correctly seated. For
details, go to step 4.
• If the green activity LED is flashing and the yellow status LED is lit, replace the drive. If the activity of
the LEDs remains the same, go to step Hard disk drive problems. If the activity of the LEDs changes,
return to step 1.
4. Make sure that the hard disk drive backplane is correctly seated. When it is correctly seated, the drive
assemblies correctly connect to the backplane without bowing or causing movement of the backplane.
5. Reseat the backplane power cable and repeat steps 1 through 3.
6. Reseat the backplane signal cable and repeat steps 1 through 3.
7. Suspect the backplane signal cable or the backplane:
• Replace the affected backplane signal cable.
• Replace the affected backplane.
8. Run the diagnostics tests for the hard disk drives. When you start a server and press the key according
to the on-screen instructions, the LXPM is displayed by default. (For more information, see the “Startup”
section in the LXPM documentation compatible with your server at https://pubs.lenovo.com/lxpm-
overview/.) You can perform hard drive diagnostics from this interface. From the Diagnostic page, click
Run Diagnostic ➙ HDD test/Disk Drive Test.*
Based on those tests:
• If the backplane passes the test but the drives are not recognized, replace the backplane signal cable
and run the tests again.
• Replace the backplane.

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 • If the adapter fails the test, disconnect the backplane signal cable from the adapter and run the tests
again.
• If the adapter fails the test, replace the adapter.

Multiple hard drives fail

Complete the following steps until the problem is solved:
• View the Lenovo XClarity Controller event log for events related to power supplies or vibration issues and
resolve those events.
• Make sure that the device drivers and firmware for the hard disk drive and server are at the latest level

Important: Some cluster solutions require specific code levels or coordinated code updates. If the device is
part of a cluster solution, verify that the latest level of code is supported for the cluster solution before you
update the code.

Multiple hard drives are offline

Complete the following steps until the problem is solved:
• View the Lenovo XClarity Controller event log for events related to power supplies or vibration issues and
resolve those events.
• View the storage subsystem log for events related to the storage subsystem and resolve those events.

One or two 7mm drives identified as failing

Complete the following steps until the problem is solved:
1. Remove and reinstall the reported drive(s) in the same drive bay or another drive bay.
2. If the problem persists, consider replacing the current drives with new ones.
3. If the problem still persists, consider replacing the bottom backplane.
4. If the problem still persists, consider replacing the top backplane.

A replacement hard disk drive does not rebuild

Complete the following steps until the problem is solved:
1. Make sure that the hard disk drive is recognized by the adapter (the green hard disk drive activity LED is
flashing).
2. Review the SAS/SATA RAID adapter documentation to determine the correct configuration parameters
and settings.

Green drive activity LED does not represent actual state of associated drive
Complete the following steps until the problem is solved:
1. If the green hard disk drive activity LED does not flash when the drive is in use, run the diagnostics tests
for the hard disk drives. When you start a server and press the key according to the on-screen
instructions, the LXPM is displayed by default. (For more information, see the “Startup” section in the
LXPM documentation compatible with your server at https://pubs.lenovo.com/lxpm-overview/.) You can
perform hard drive diagnostics from this interface. From the Diagnostic page, click Run Diagnostic ➙
HDD test/Disk Drive Test.*
2. If the drive passes the test, replace the backplane.
3. If the drive fails the test, replace the drive.

Yellow drive activity LED does not represent actual state of associated drive
Complete the following steps until the problem is solved:

Chapter 5. Problem determination 249

 1. Turn off the server.
2. Reseat the SATA/SAS adapter.
3. Reseat the backplane signal cable and backplane power cable.
4. Reseat the drive.
5. Power on the server and observe the activity of the drive LEDs.

Note: * Depending on the LXPM version, you may see HDD test or Disk Drive Test.

U.3 NVMe drive can be detected in NVMe connection, but cannot be detected in Tri-mode
In Tri-mode, NVMe drives are connected via a PCIe x1 link to the controller. To support Tri-mode with U.3
NVMe drives, U.3 x1 mode must be enabled for the selected drive slots on the backplane through the XCC
Web GUI. By default, the backplane setting is U.2 x4 mode.

Complete the following steps to enable U.3 x1 mode:

1. Log into the XCC Web GUI, and choose Storage ➙ Detail from the navigation tree on the left.
2. In the window that is displayed, click the icon next to Backplane.
3. In the dialog box that is displayed, select the target drive slots and click Apply.
4. Do a DC power cycle to make the setting take effect.

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Monitor and video problems
Use this information to solve problems related to a monitor or video.

• “Incorrect characters are displayed” on page 251

• “Screen is blank” on page 251
• “Management controller remote presence cannot work” on page 251
• “Screen goes blank when you start some application programs” on page 251
• “The monitor has screen jitter, or the screen image is wavy, unreadable, rolling, or distorted” on page 251
• “The wrong characters appear on the screen” on page 252

Incorrect characters are displayed

Complete the following steps:
1. Verify that the language and locality settings are correct for the keyboard and operating system.
2. If the wrong language is displayed, update the server firmware to the latest level. See “Firmware
updates” on page 12.

Screen is blank
Note: Make sure that the expected boot mode has not been changed from the UEFI to Legacy or vice versa.
1. If the server is attached to a KVM switch, bypass the KVM switch to eliminate it as a possible cause of
the problem: connect the monitor cable directly to the correct connector on the rear of the server.
2. If the server is installed with the graphical adapters while turning on the server, the Lenovo logo is
displayed on the screen after approximately 3 minutes. This is normal operation while the system loads.
3. Make sure that:
• The server is turned on and there is power supplied to the server.
• The monitor cables are connected correctly.
• The monitor is turned on and the brightness and contrast controls are adjusted correctly.
4. Make sure that the correct server is controlling the monitor, if applicable.
5. Make sure that the video output is not affected by corrupted server firmware; see “Firmware updates”
on page 12.
6. If the problem remains, contact Lenovo Support.

Management controller remote presence cannot work

The management controller remote presence function is unable to display the system screen when an
optional video adapter is present. To use the management controller remote presence function, remove the
optional video adapter or use the onboard VGA as the display device. The management controller remote
presence function is disabled if you install an optional video adapter.

Screen goes blank when you start some application programs

1. Make sure that:
• The application program is not setting a display mode that is higher than the capability of the monitor.
• You installed the necessary device drivers for the application.

The monitor has screen jitter, or the screen image is wavy, unreadable, rolling, or distorted
1. If the monitor self-tests show that the monitor is working correctly, consider the location of the monitor.
Magnetic fields around other devices (such as transformers, appliances, fluorescents, and other
monitors) can cause screen jitter or wavy, unreadable, rolling, or distorted screen images. If this
happens, turn off the monitor.

Chapter 5. Problem determination 251

 Attention: Moving a color monitor while it is turned on might cause screen discoloration.

Move the device and the monitor at least 305 mm (12 in.) apart, and turn on the monitor.

Notes:
a. To prevent diskette drive read/write errors, make sure that the distance between the monitor and any
external diskette drive is at least 76 mm (3 in.).
b. Non-Lenovo monitor cables might cause unpredictable problems.
2. Reseat the monitor cable.
3. Replace the components listed in step 2 one at a time, in the order shown, restarting the server each
time:
a. Monitor cable
b. Video adapter (if one is installed)
c. Monitor
d. (Trained technician only) System board.

The wrong characters appear on the screen

Complete the following steps until the problem is solved:
1. Verify that the language and locality settings are correct for the keyboard and operating system.
2. If the wrong language is displayed, update the server firmware to the latest level. See “Firmware
updates” on page 12.

Keyboard, mouse, KVM switch or USB-device problems

Use this information to solve problems related to a keyboard, mouse, KVM switch or USB-device problems.

• “All or some keys on the keyboard do not work” on page 252

• “Mouse does not work” on page 252
• “KVM switch problems” on page 253
• “USB-device does not work” on page 253

All or some keys on the keyboard do not work

1. Make sure that:
• The keyboard cable is securely connected.
• The server and the monitor are turned on.
2. If you are using a USB keyboard, run the Setup utility and enable keyboardless operation.
3. If you are using a USB keyboard and it is connected to a USB hub, disconnect the keyboard from the
hub and connect it directly to the server.
4. Replace the keyboard.

Mouse does not work

1. Make sure that:
• The mouse cable is securely connected to the server.
• The mouse device drivers are installed correctly.
• The server and the monitor are turned on.
• The mouse option is enabled in the Setup utility.

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 2. If you are using a USB mouse and it is connected to a USB hub, disconnect the mouse from the hub and
connect it directly to the server.
3. Replace the mouse.

KVM switch problems

1. Make sure that the KVM switch is supported by your server.
2. Make sure that the KVM switch is powered on correctly.
3. If the keyboard, mouse or monitor can be operated normally with direct connection to the server, then
replace the KVM switch.

USB-device does not work

1. Make sure that:
• The correct USB device driver is installed.
• The operating system supports USB devices.
2. Make sure that the USB configuration options are set correctly in system setup.
Restart the server and press the key according to the on-screen instructions to display the LXPM system
setup interface. (For more information, see the “Startup” section in the LXPM documentation compatible
with your server at https://pubs.lenovo.com/lxpm-overview/.) Then, click System Settings ➙ Devices
and I/O Ports ➙ USB Configuration.
3. If you are using a USB hub, disconnect the USB device from the hub and connect it directly to the
server.

Optional-device problems
Use this information to solve problems related to optional devices.

• “External USB device is not recognized” on page 253

• “PCIe adapter is not recognized or is not functioning” on page 253
• “Insufficient PCIe resources are detected.” on page 254
• “A Lenovo optional device that was just installed does not work.” on page 254
• “A Lenovo optional device that worked previously does not work now” on page 255

External USB device is not recognized

Complete the following steps until the problem is resolved:
1. Update the UEFI firmware to the latest version.
2. Make sure that the proper drivers are installed on the compute node. See the product documentation for
the USB device for information about device drivers.
3. Use the Setup utility to make sure that the device is configured correctly.
4. If the USB device is plugged into a hub or the console breakout cable, unplug the device and plug it
directly into the USB port on the front of the compute node.

PCIe adapter is not recognized or is not functioning

Complete the following steps until the problem is resolved:
1. Update the UEFI firmware to the latest version.
2. Check the event log and resolve any issues related to the device.
3. Validate that the device is supported for the server (see https://serverproven.lenovo.com/). Make sure that
the firmware level on the device is at the latest supported level and update the firmware if applicable.

Chapter 5. Problem determination 253

 4. Make sure that the adapter is installed in a correct slot.
5. Make sure that the proper device drivers are installed for the device.
6. Resolve any resource conflicts if running legacy mode (UEFI). Check legacy ROM boot orders and
modify the UEFI setting for MM config base.

Note: Ensure that you modify the ROM boot order associated with the PCIe adapter to the first
execution order.
7. Check http://datacentersupport.lenovo.com for any tech tips (also known as retain tips or service
bulletins) that might be related to the adapter.
8. Ensure any adapter external connections are correct and that the connectors are not physically
damaged.
9. Make sure that the PCIe adapter is installed with the supported operating system.

Insufficient PCIe resources are detected.

If you see an error message stating “Insufficient PCI Resources Detected,” complete the following steps until
the problem is resolved:
1. Press Enter to access System Setup Utility.
2. Select System Settings ➙ Devices and I/O Ports ➙ MM Config Base; then, modify the setting to
increase the device resources. For example, modify 3 GB to 2 GB or modify 2 GB to 1 GB.
3. Save the settings and restart the system.
4. If the error recurs with the highest device resource setting (1GB), shutdown the system and remove
some PCIe devices; then, power on the system.
5. If the reboot failed, repeat step 1 to step 4.
6. If the error recurs, press Enter to access System Setup Utility.
7. Select System Settings ➙ Devices and I/O Ports ➙ PCI 64–Bit Resource Allocation, then; modify
the setting from Auto to Enable.
8. If the Boot Device does not support MMIO above 4GB for Legacy Boot, use UEFI Boot Mode or remove/
disable some PCIe devices.
9. DC cycle the system and ensure the system is enter UEFI boot menu or the operating system; then,
capture the FFDC log.
10. Contact Lenovo technical support.

A Lenovo optional device that was just installed does not work.
1. Check the XCC event log for any events associated with the device.
2. Make sure that:
• The device is supported for the server (see https://serverproven.lenovo.com/).
• You followed the installation instructions that came with the device and the device is installed
correctly.
• You have not loosened any other installed devices or cables.
• You updated the configuration information in system setup. Start the server and press the key
specified in the on-screen instructions. (For more information, see the “Startup” section in the LXPM
documentation compatible with your server at https://pubs.lenovo.com/lxpm-overview/.)
3. Reseat the cable connection and ensure that there is no physical damage to the cable.
4. Reseat the device that you have just installed.
5. Replace the device that you have just installed.

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A Lenovo optional device that worked previously does not work now
1. Check the XCC event log for any events associated with the device.
2. Make sure that all of the cable connections for the device are secure.
3. If the device comes with test instructions, use those instructions to test the device.
4. Reseat the cable connection and check if any physical parts have been damaged, .
5. Replace the cable.
6. Reseat the failing device.
7. Replace the failing device.

Serial-device problems
Use this information to solve problems with serial ports or devices.

• “Number of displayed serial ports is less than the number of installed serial ports” on page 255
• “Serial device does not work” on page 255

Number of displayed serial ports is less than the number of installed serial ports
Complete the following steps until the problem is solved.
1. Make sure that:
• Each port is assigned a unique address in the Setup utility and none of the serial ports is disabled.
• The serial-port adapter (if one is present) is seated correctly.
2. Reseat the serial port adapter.
3. Replace the serial port adapter.

Serial device does not work

1. Make sure that:
• The device is compatible with the server.
• The serial port is enabled and is assigned a unique address.
• The device is connected to the correct connector.
2. Reseat the following components:
a. Failing serial device.
b. Serial cable.
3. Replace the following components:
a. Failing serial device.
b. Serial cable.
4. (Trained technician only) Replace the system board.

Intermittent problems
Use this information to solve intermittent problems.

• “Intermittent external device problems” on page 256

• “Intermittent KVM problems” on page 256
• “Intermittent unexpected reboots” on page 256

Chapter 5. Problem determination 255

Intermittent external device problems
Complete the following steps until the problem is solved.
1. Update the UEFI and XCC firmware to the latest versions.
2. Make sure that the correct device drivers are installed. See the manufacturer's website for
documentation.
3. For a USB device:
a. Make sure that the device is configured correctly.
Restart the server and press the key according to the on-screen instructions to display the LXPM
system setup interface. (For more information, see the “Startup” section in the LXPM documentation
compatible with your server at https://pubs.lenovo.com/lxpm-overview/.) Then, click System Settings
➙ Devices and I/O Ports ➙ USB Configuration.
b. Connect the device to another port. If using a USB hub, remove the hub and connect the device
directly to the server. Make sure that the device is configured correctly for the port.

Intermittent KVM problems

Complete the following steps until the problem is solved.

Video problems:
1. Make sure that all cables and the console breakout cable are properly connected and secure.
2. Make sure that the monitor is working properly by testing it on another server.
3. Test the console breakout cable on a working server to ensure that it is operating properly. Replace the
console breakout cable if it is defective.

Keyboard problems:

Make sure that all cables and the console breakout cable are properly connected and secure.

Mouse problems:

Make sure that all cables and the console breakout cable are properly connected and secure.

Intermittent unexpected reboots

Note: Some uncorrectable errors require that the server reboot so that it can disable a device, such as a
memory DIMM or a processor to allow the machine to boot up properly.
1. If the reset occurs during POST and the POST watchdog timer is enabled, make sure that sufficient time
is allowed in the watchdog timeout value (POST Watchdog Timer).
To check the POST watchdog time, restart the server and press the key according to the on-screen
instructions to display the LXPM system setup interface. (For more information, see the “Startup”
section in the LXPM documentation compatible with your server at https://pubs.lenovo.com/lxpm-
overview/.) Then, click BMC Settings ➙ POST Watchdog Timer.
2. If the reset occurs after the operating system starts, do one of the followings:
• Enter the operating system when the system operates normally and set up operating system kernel
dump process (Windows and Linux base operating systems will be using different method). Enter the
UEFI setup menus and disable the feature, or disable it with the following OneCli command.
OneCli.exe config set SystemRecovery.RebootSystemOnNMI Disable --bmc XCC_USER:XCC_PASSWORD@XCC_IPAddress
• Disable any automatic server restart (ASR) utilities, such as the Automatic Server Restart IPMI
Application for Windows, or any ASR devices that are installed.

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3. See the management controller event log to check for an event code that indicates a reboot. See “Event
logs” on page 237 for information about viewing the event log. If you are using Linux base operating
system, then capture all logs back to Lenovo support for further investigation.

Chapter 5. Problem determination 257

Power problems
Use this information to resolve issues related to power.

System error LED is on and event log "Power supply has lost input" is displayed
To resolve the problem, ensure that:
1. The power supply is properly connected to a power cord.
2. The power cord is connected to a properly grounded electrical outlet for the server.
3. Make sure that the power supply AC source is stable within the supported range.
4. Swap the power supply to see if the issue follows the power supply, if it follows the power supply, then
replace the failing one.
5. Review the event log and see how the problem it is to follow the event log actions to resolved the
problems.

Network problems
Use this information to resolve issues related to networking.

• “Cannot wake server using Wake on LAN” on page 258

• “Could not log in using LDAP account with SSL enabled” on page 258

Cannot wake server using Wake on LAN

Complete the following steps until the problem is resolved:
1. If you are using the dual-port network adapter and the server is connected to the network using Ethernet
5 connector, check the system-error log or IMM2 system event log (see “Event logs” on page 237),
make sure:
a. Fan 3 is running in standby mode, if Emulex dual port 10GBase-T embedded adapter is installed.
b. The room temperature is not too high (see “Specifications” on page 2).
c. The air vents are not blocked.
d. The air baffle is installed securely.
2. Reseat the dual-port network adapter.
3. Turn off the server and disconnect it from the power source; then, wait 10 seconds before restarting the
server.
4. If the problem still remains, replace the dual-port network adapter.

Could not log in using LDAP account with SSL enabled

Complete the following steps until the problem is resolved:
1. Make sure that the license key is valid.
2. Generate a new license key and log in again.

Observable problems
Use this information to solve observable problems.

• “Server hangs during the UEFI boot process” on page 259

• “The server immediately displays the POST Event Viewer when it is turned on” on page 259
• “Server is unresponsive (POST is complete and operating system is running)” on page 259
• “Server is unresponsive (POST failed and cannot start System Setup)” on page 260

258 ThinkSystem SR630 V2 Maintenance Manual

• “Voltage planar fault is displayed in the event log” on page 260
• “Unusual smell” on page 260
• “Server seems to be running hot” on page 261
• “Cannot enter legacy mode after installing a new adapter” on page 261
• “Cracked parts or cracked chassis” on page 261

Server hangs during the UEFI boot process

If the system hangs during the UEFI boot process with the message UEFI: DXE INIT on the display, make sure
that Option ROMs were not configured with a setting of Legacy. You can remotely view the current settings
for Option ROMs by running the following command using the Lenovo XClarity Essentials OneCLI:

onecli config show EnableDisableAdapterOptionROMSupport --bmc xcc_userid:xcc_password@xcc_ipaddress

To recover a system that hangs during the boot process with Legacy Option ROM settings, see the following
Tech Tip:

https://datacentersupport.lenovo.com/us/en/solutions/ht506118

If legacy Option ROMs must be used, do not set slot Option ROMs to Legacy on the Devices and I/O Ports
menu. Instead, set slot Option ROMs to Auto (the default setting), and set the System Boot Mode to Legacy
Mode. Legacy option ROMs will be invoked shortly before the system boots.

The server immediately displays the POST Event Viewer when it is turned on
Complete the following steps until the problem is solved.
1. Correct any errors that are indicated by the light path diagnostics LEDs.
2. Make sure that the server supports all the processors and that the processors match in speed and
cache size.
You can view processor details from system setup.
To determine if the processor is supported for the server, see https://serverproven.lenovo.com/.
3. (Trained technician only) Make sure that processor 1 is seated correctly
4. (Trained technician only) Remove processor 2 and restart the server.
5. Replace the following components one at a time, in the order shown, restarting the server each time:
a. (Trained technician only) Processor
b. (Trained technician only) System board

Server is unresponsive (POST is complete and operating system is running)

Complete the following steps until the problem is solved.
• If you are in the same location as the compute node, complete the following steps:
1. If you are using a KVM connection, make sure that the connection is operating correctly. Otherwise,
make sure that the keyboard and mouse are operating correctly.
2. If possible, log in to the compute node and verify that all applications are running (no applications are
hung).
3. Restart the compute node.
4. If the problem remains, make sure that any new software has been installed and configured correctly.
5. Contact your place of purchase of the software or your software provider.

Chapter 5. Problem determination 259

• If you are accessing the compute node from a remote location, complete the following steps:
1. Make sure that all applications are running (no applications are hung).
2. Attempt to log out of the system and log back in.
3. Validate the network access by pinging or running a trace route to the compute node from a
command line.
a. If you are unable to get a response during a ping test, attempt to ping another compute node in
the enclosure to determine whether it is a connection problem or compute node problem.
b. Run a trace route to determine where the connection breaks down. Attempt to resolve a
connection issue with either the VPN or the point at which the connection breaks down.
4. Restart the compute node remotely through the management interface.
5. If the problem remains, verify that any new software has been installed and configured correctly.
6. Contact your place of purchase of the software or your software provider.

Server is unresponsive (POST failed and cannot start System Setup)

Configuration changes, such as added devices or adapter firmware updates, and firmware or application
code problems can cause the server to fail POST (the power-on self-test).

If this occurs, the server responds in either of the following ways:

• The server restarts automatically and attempts POST again.
• The server hangs, and you must manually restart the server for the server to attempt POST again.

After a specified number of consecutive attempts (automatic or manual), the server reverts to the default
UEFI configuration and starts System Setup so that you can make the necessary corrections to the
configuration and restart the server. If the server is unable to successfully complete POST with the default
configuration, there might be a problem with the system board.

You can specify the number of consecutive restart attempts in System Setup. Start the server and press the
key specified in the on-screen instructions. (For more information, see the “Startup” section in the LXPM
documentation compatible with your server at https://pubs.lenovo.com/lxpm-overview/.) Then, click System
Settings ➙ Recovery and RAS ➙ POST Attempts ➙ POST Attempts Limit. Available options are 3, 6, 9,
and disable.

If the issue cannot be resolved by the actions mentioned above, call the service team to review the issue
symptom and confirm whether the system board replacement is necessary.

Voltage planar fault is displayed in the event log

Complete the following steps until the problem is solved.
1. Revert the system to the minimum configuration. See “Specifications” on page 2 for the minimally
required number of processors and DIMMs.
2. Restart the system.
• If the system restarts, add each of the removed items one at a time and restart the system each time
until the error occurs. Replace the item for which the error occurs.
• If the system does not restart, suspect the system board.

Unusual smell
Complete the following steps until the problem is solved.
1. An unusual smell might be coming from newly installed equipment.
2. If the problem remains, contact Lenovo Support.

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Server seems to be running hot
Complete the following steps until the problem is solved.

Multiple compute nodes or chassis:

1. Make sure that the room temperature is within the specified range (see “Specifications” on page 2).
2. Make sure that the fans are installed correctly.
3. Update the UEFI and XCC to the latest versions.
4. Make sure that the fillers in the server are installed correctly (see Maintenance Manual for detailed
installation procedures).
5. Use the IPMI command to ramp up the fan speed to the full fan speed to see whether the issue can be
resolved.

Note: The IPMI raw command should only be used by trained technician and the each system has its
own specific PMI raw command.
6. Check the management processor event log for rising temperature events. If there are no events, the
compute node is running within normal operating temperatures. Note that you can expect some
variation in temperature.

Cannot enter legacy mode after installing a new adapter

Complete the following steps until the problem is solved.
1. Go to UEFI Setup ➙ Devices and I/O Ports ➙ Set Option ROM Execution Order.
2. Move the RAID adapter with operation system installed to the top of the list.
3. Select Save.
4. Reboot the system and auto boot to operation system.

Cracked parts or cracked chassis

Contact Lenovo Support.

Software problems
Use this information to solve software problems.

1. To determine whether the problem is caused by the software, make sure that:
• The server has the minimum memory that is needed to use the software. For memory requirements,
see the information that comes with the software.

Note: If you have just installed an adapter or memory, the server might have a memory-address
conflict.
• The software is designed to operate on the server.
• Other software works on the server.
• The software works on another server.
2. If you receive any error messages while you use the software, see the information that comes with the
software for a description of the messages and suggested solutions to the problem.
3. Contact your place of purchase of the software.

Chapter 5. Problem determination 261

262 ThinkSystem SR630 V2 Maintenance Manual
Appendix A. Hardware disassembling for recycle
Follow the instructions in this section to recycle components with compliance with local laws or regulations.

Disassembling the system board for recycle

Follow the instructions in this section to disassemble the system board before recycling.

Before disassembling the system board:

1. Remove the system board from the server (see “Remove the system board” on page 224).
2. Refer to local environmental, waste or disposal regulations to ensure compliance.

Complete the following steps to disassemble the system board:

Figure 168. Disassembling the system board

© Copyright Lenovo 2021, 2024 263

Step 1. Remove the following screws as illustrated:
• 11 slotted screws (with PH2 screwdriver)
• Five slotted screws (with PH1 screwdriver)
• Two guiding pin standoffs (with 7 mm wrench)
• One plunger (with 11 mm and 16 mm wrench)
• Two hexagon bolts on the VGA connector (with 5 mm wrench)
Step 2. Separate the components 1 2 3 4 5 from the system board.

Note: Component 2 (PSU airduct) is available only when the CPU TDP is greater than 125 W.

After disassembling the system board, comply with local regulations when recycling.

264 ThinkSystem SR630 V2 Maintenance Manual

Appendix B. Getting help and technical assistance
If you need help, service, or technical assistance or just want more information about Lenovo products, you
will find a wide variety of sources available from Lenovo to assist you.

On the World Wide Web, up-to-date information about Lenovo systems, optional devices, services, and
support are available at:

http://datacentersupport.lenovo.com

Note: This section includes references to IBM Web sites and information about obtaining service. IBM is
Lenovo's preferred service provider for ThinkSystem.

Before you call

Before you call, there are several steps that you can take to try and solve the problem yourself. If you decide
that you do need to call for assistance, gather the information that will be needed by the service technician to
more quickly resolve your problem.

Attempt to resolve the problem yourself

You can solve many problems without outside assistance by following the troubleshooting procedures that
Lenovo provides in the online help or in the Lenovo product documentation. The Lenovo product
documentation also describes the diagnostic tests that you can perform. The documentation for most
systems, operating systems, and programs contains troubleshooting procedures and explanations of error
messages and error codes. If you suspect a software problem, see the documentation for the operating
system or program.

You can find the product documentation for your ThinkSystem products at https://pubs.lenovo.com/

You can take these steps to try to solve the problem yourself:
• Check all cables to make sure that they are connected.
• Check the power switches to make sure that the system and any optional devices are turned on.
• Check for updated software, firmware, and operating-system device drivers for your Lenovo product. The
Lenovo Warranty terms and conditions state that you, the owner of the Lenovo product, are responsible
for maintaining and updating all software and firmware for the product (unless it is covered by an
additional maintenance contract). Your service technician will request that you upgrade your software and
firmware if the problem has a documented solution within a software upgrade.
• If you have installed new hardware or software in your environment, check https://
serverproven.lenovo.com/ to make sure that the hardware and software are supported by your product.
• Go to http://datacentersupport.lenovo.com and check for information to help you solve the problem.
– Check the Lenovo forums at https://forums.lenovo.com/t5/Datacenter-Systems/ct-p/sv_eg to see if
someone else has encountered a similar problem.

Gathering information needed to call Support

If you require warranty service for your Lenovo product, the service technicians will be able to assist you
more efficiently if you prepare the appropriate information before you call. You can also go to http://
datacentersupport.lenovo.com/warrantylookup for more information about the product warranty.

© Copyright Lenovo 2021, 2024 265

Gather the following information to provide to the service technician. This data will help the service
technician quickly provide a solution to your problem and ensure that you receive the level of service for
which you might have contracted.
• Hardware and Software Maintenance agreement contract numbers, if applicable
• Machine type number (Lenovo 4-digit machine identifier)
• Model number
• Serial number
• Current system UEFI and firmware levels
• Other pertinent information such as error messages and logs

As an alternative to calling Lenovo Support, you can go to https://support.lenovo.com/servicerequest to

submit an Electronic Service Request. Submitting an Electronic Service Request will start the process of
determining a solution to your problem by making the pertinent information available to the service
technicians. The Lenovo service technicians can start working on your solution as soon as you have
completed and submitted an Electronic Service Request.

Collecting service data

To clearly identify the root cause of a server issue or at the request of Lenovo Support, you might need
collect service data that can be used for further analysis. Service data includes information such as event
logs and hardware inventory.

Service data can be collected through the following tools:

• Lenovo XClarity Provisioning Manager
Use the Collect Service Data function of Lenovo XClarity Provisioning Manager to collect system service
data. You can collect existing system log data or run a new diagnostic to collect new data.
• Lenovo XClarity Controller
You can use the Lenovo XClarity Controller web interface or the CLI to collect service data for the server.
The file can be saved and sent to Lenovo Support.
– For more information about using the web interface to collect service data, see the “Downloading
service data” section in the XCC documentation version compatible with your server at https://
pubs.lenovo.com/lxcc-overview/.
– For more information about using the CLI to collect service data, see the “ffdc command” section in the
XCC documentation version compatible with your server at https://pubs.lenovo.com/lxcc-overview/.
• Lenovo XClarity Administrator
Lenovo XClarity Administrator can be set up to collect and send diagnostic files automatically to Lenovo
Support when certain serviceable events occur in Lenovo XClarity Administrator and the managed
endpoints. You can choose to send diagnostic files to Lenovo Support using Call Home or to another
service provider using SFTP. You can also manually collect diagnostic files, open a problem record, and
send diagnostic files to the Lenovo Support Center.
You can find more information about setting up automatic problem notification within the Lenovo XClarity
Administrator at http://sysmgt.lenovofiles.com/help/topic/com.lenovo.lxca.doc/admin_setupcallhome.html.
• Lenovo XClarity Essentials OneCLI
Lenovo XClarity Essentials OneCLI has inventory application to collect service data. It can run both in-
band and out-of-band. When running in-band within the host operating system on the server, OneCLI can
collect information about the operating system, such as the operating system event log, in addition to the
hardware service data.

266 ThinkSystem SR630 V2 Maintenance Manual

 To obtain service data, you can run the getinfor command. For more information about running the
getinfor, see https://pubs.lenovo.com/lxce-onecli/onecli_r_getinfor_command.

Contacting Support
You can contact Support to obtain help for your issue.

You can receive hardware service through a Lenovo Authorized Service Provider. To locate a service
provider authorized by Lenovo to provide warranty service, go to https://datacentersupport.lenovo.com/
serviceprovider and use filter searching for different countries. For Lenovo support telephone numbers, see
https://datacentersupport.lenovo.com/supportphonelist for your region support details.

Appendix B. Getting help and technical assistance 267

268 ThinkSystem SR630 V2 Maintenance Manual
Appendix C. Notices
Lenovo may not offer the products, services, or features discussed in this document in all countries. Consult
your local Lenovo representative for information on the products and services currently available in your
area.

Any reference to a Lenovo product, program, or service is not intended to state or imply that only that
Lenovo product, program, or service may be used. Any functionally equivalent product, program, or service
that does not infringe any Lenovo intellectual property right may be used instead. However, it is the user's
responsibility to evaluate and verify the operation of any other product, program, or service.

Lenovo may have patents or pending patent applications covering subject matter described in this
document. The furnishing of this document is not an offer and does not provide a license under any patents
or patent applications. You can send inquiries in writing to the following:
Lenovo (United States), Inc.
8001 Development Drive
Morrisville, NC 27560
U.S.A.
Attention: Lenovo Director of Licensing

LENOVO PROVIDES THIS PUBLICATION “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS
OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT,
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allow
disclaimer of express or implied warranties in certain transactions, therefore, this statement may not apply to
you.

This information could include technical inaccuracies or typographical errors. Changes are periodically made
to the information herein; these changes will be incorporated in new editions of the publication. Lenovo may
make improvements and/or changes in the product(s) and/or the program(s) described in this publication at
any time without notice.

The products described in this document are not intended for use in implantation or other life support
applications where malfunction may result in injury or death to persons. The information contained in this
document does not affect or change Lenovo product specifications or warranties. Nothing in this document
shall operate as an express or implied license or indemnity under the intellectual property rights of Lenovo or
third parties. All information contained in this document was obtained in specific environments and is
presented as an illustration. The result obtained in other operating environments may vary.

Lenovo may use or distribute any of the information you supply in any way it believes appropriate without
incurring any obligation to you.

Any references in this publication to non-Lenovo Web sites are provided for convenience only and do not in
any manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the
materials for this Lenovo product, and use of those Web sites is at your own risk.

Any performance data contained herein was determined in a controlled environment. Therefore, the result
obtained in other operating environments may vary significantly. Some measurements may have been made
on development-level systems and there is no guarantee that these measurements will be the same on
generally available systems. Furthermore, some measurements may have been estimated through
extrapolation. Actual results may vary. Users of this document should verify the applicable data for their
specific environment.

© Copyright Lenovo 2021, 2024 269

Trademarks
LENOVO, THINKSYSTEM, and XCLARITY are trademarks of Lenovo.

Intel, Optane and Xeon are trademarks of Intel Corporation in the United States, other countries, or both.
NVIDIA is a trademark and/or registered trademarks of NVIDIA Corporation in the U.S. and/or other
countries. Microsoft and Windows are trademarks of the Microsoft group of companies. Linux is a registered
trademark of Linus Torvalds. All other trademarks are the property of their respective owners. © 2023
Lenovo.

Important notes
Processor speed indicates the internal clock speed of the microprocessor; other factors also affect
application performance.

CD or DVD drive speed is the variable read rate. Actual speeds vary and are often less than the possible
maximum.

When referring to processor storage, real and virtual storage, or channel volume, KB stands for 1 024 bytes,
MB stands for 1 048 576 bytes, and GB stands for 1 073 741 824 bytes.

When referring to hard disk drive capacity or communications volume, MB stands for 1 000 000 bytes, and
GB stands for 1 000 000 000 bytes. Total user-accessible capacity can vary depending on operating
environments.

Maximum internal hard disk drive capacities assume the replacement of any standard hard disk drives and
population of all hard-disk-drive bays with the largest currently supported drives that are available from
Lenovo.

Maximum memory might require replacement of the standard memory with an optional memory module.

Each solid-state memory cell has an intrinsic, finite number of write cycles that the cell can incur. Therefore, a
solid-state device has a maximum number of write cycles that it can be subjected to, expressed as total
bytes written (TBW). A device that has exceeded this limit might fail to respond to system-generated
commands or might be incapable of being written to. Lenovo is not responsible for replacement of a device
that has exceeded its maximum guaranteed number of program/erase cycles, as documented in the Official
Published Specifications for the device.

Lenovo makes no representations or warranties with respect to non-Lenovo products. Support (if any) for the
non-Lenovo products is provided by the third party, not Lenovo.

Some software might differ from its retail version (if available) and might not include user manuals or all
program functionality.

Telecommunication regulatory statement

This product may not be certified in your country for connection by any means whatsoever to interfaces of
public telecommunications networks. Further certification may be required by law prior to making any such
connection. Contact a Lenovo representative or reseller for any questions.

270 ThinkSystem SR630 V2 Maintenance Manual

Electronic emission notices
When you attach a monitor to the equipment, you must use the designated monitor cable and any
interference suppression devices that are supplied with the monitor.

Additional electronic emissions notices are available at:

https://pubs.lenovo.com/important_notices/

Taiwan Region BSMI RoHS declaration

Taiwan Region import and export contact information

Contacts are available for Taiwan Region import and export information.

Appendix C. Notices 271

272 ThinkSystem SR630 V2 Maintenance Manual
Index
2.5-inch rear drive backplane D
removing 122
2.5-inch/3.5-inch drive devices, static-sensitive
power cable routing 64 handling 88
7mm drive backplane diagnostics panel
installing 126 LCD 28, 33
removing 124 diagnostics panel assembly
installing 140
DIMM
replacing 165
A DIMM installation order 94
disassembling 263
a serial port module Dynamic random access memory (DRAM) 90
install 219
removing 217
air baffle
installing 112 E
removing 111
replacing 111 EDSFF
App Direct Mode 99 removing 148
EDSFF cage
installing 133
removing 132
B replacing 131
EDSFF drive
backplane installing 150
installing 126 enable
removing 117, 124 TPM 229
replacing 114 Ethernet
bezel controller
installing 214 troubleshooting 240
removing 213 Ethernet controller problems
replacing 213 solving 240
External
LCD diagnostics handset 28, 33
C
cable routing
backplane 57, 65, 69, 72, 78
F
FIO 57 fan
intrusion switch 58 installing 222
RAID super capacitor 59 removing 220
super capacitor 59 replacing 220
Cable routing for the 7mm drives. 63 fan error LED 46
Cable routing for the EDSFF drives. 62 firmware updates 12
Cable routing for the M.2 drives. 61 front 16-EDSFF drive backplane
carrier 184 installing 121
CFF HBA/RAID adapter front 16-EDSFF-drive backplane
power cable routing 54 removing 120
CMOS battery front 2.5-inch-drive backplane
install 130 installing 116
remove 128 removing 114
replacing 128 front 3.5-inch-drive backplane
collecting service data 266 installing 118
completing removing 117
parts replacement 235 front I/O assembly
contamination, particulate and gaseous 11 installing 137
cover removing 135
installing 233 replacing 134
removing 232
replacing 232
CPU
installing 186 G
removing 181
separating 184 gaseous contamination 11
creating a personalized support web page 265 Getting help 265
custom support web page 265 GPU 110
guidelines
options installation 85
system reliability 87

© Copyright Lenovo 2021, 2024 273

H security bezel 214
system board 225
handling static-sensitive devices 88 system fan 222
hard disk drive T30 nut 143
installing 146 top cover 233
replacing 144 insufficient PCIe resource
hard disk drive problems 247 solving 253
hard disk drives intermittent problems 255
removing 145 internal cable routing 53
hardware service and support telephone numbers 267 internal CFF HBA/RAID adapter
heat sink 180 installing 162
installing 186 removing 161
removing 181 replacing 161
separating 184 introduction 1
heat sink nut 142–143 intrusion switch
installing 143 installing 164
removing 142 removing 163
help 265 replacing 163
hot-swap drive
installing 146
replacing 144
hot-swap drives K
removing 145
hot-swap power supply keyboard problems 252
installing 156
hot-swap rear drive assembly
installing 206
replacing 204 L
LCD
diagnostics panel 28, 33
LCD diagnostics handset
I External 28, 33
ID label 1 LCD diagnostics panel assembly
important notices 270 removing 138
Independent mode 90 light path diagnostics 239
install
a serial port module 219
CMOS battery 130
installation M
guidelines 85 M.2 backplane and M.2 drive
installation guidelines 85 replacing 168
installing Memory Mode 101
air baffle 112 memory module
backplane 126 removing 165
CPU 186 memory module error LED 46
diagnostics panel assembly 140 memory module installation order 94, 99, 101
EDSFF cage 133 memory module, install 167
EDSFF drive 150 memory modules
front 16-EDSFF drive backplane 121 removal 165
front 2.5-inch drive backplane 116 memory modules installation rules 88
front 3.5-inch drive backplane 118 microprocessor
front I/O assembly 137 installing 186
hard disk drive 146 removing 181
heat sink 186 separating 184
heat sink nut 143 microprocessor heat sink module
hot-swap drive 146 installing 186
hot-swap power supply 156 removing 181
hot-swap rear drive assembly 206 separating 184
internal CFF HBA/RAID adapter 162 Mirroring mode 93
intrusion switch 164 monitor problems 251
memory module 167 mouse problems 252
microprocessor 186
microprocessor heat sink module 186
OCP 3.0 Ethernet adapter 176
PCIe adapter 179 N
PEEK T30 nut 143
PHM 186 network
processor 186 problems 258
processor-heat-sink module 186 network access label 1
rack latches 192 notes, important 270
RAID flash power module on the air baffle 200 notices 269
RAID flash power module on the chassis 197
RAID flash power module on the riser 203
rear backplane 123
riser card 211

274 ThinkSystem SR630 V2 Maintenance Manual

O RAID flash power module on the air baffle
installing 200
observable problems 258 removing 199
OCP 3.0 Ethernet adapter RAID flash power module on the chassis
replacing 175 installing 197
optional-device problems 253 removing 195
RAID flash power module on the riser
installing 203
removing 201
P rear backplane
particulate contamination 11 installing 123
parts list 49 rear drive assembly
parts replacement, completing 235 removing 204
PCIe Rear view 39
troubleshooting 253 recycle 263
PCIe adapter recycling 263
installing 179 remove
removing 178 CMOS battery 128
replacing 178 OCP 3.0 Ethernet adapter 175
PEEK T30 nut 142–143 removing
installing 143 2.5-inch rear drive backplane 122
removing 142 7mm drive backplane 124
PHM a serial port module 217
installing 186 air baffle 111
removing 181 backplane 117, 124
separating 184 CPU 181
PMem 101 EDSFF 148
PMEM 94, 99 EDSFF cage 132
power front 16-EDSFF drive backplane 120
problems 258 front 2.5-inch drive backplane 114
power cable routing front I/O assembly 135
2.5-inch/3.5-inch drive backplanes 64 hard disk drive 145
CFF HBA/RAID adapter 54 heat sink 181
power cords 52 heat sink nut 142
power off the server 17 hot-swap drive 145
power on the server 17 internal CFF HBA/RAID adapter 161
power problems 239 intrusion switch 163
power supply unit LCD diagnostics panel assembly 138
removing 151 memory modules 165
replacing 151 microprocessor 181
problems microprocessor heat sink module 181
Ethernet controller 240 PCIe adapter 178
hard disk drive 247 PEEK T30 nut 142
intermittent 255 PHM 181
keyboard 252 power supply unit 151
monitor 251 processor 181
mouse 252 processor-heat-sink module 181
network 258 rack latches 191
observable 258 RAID flash power module on the air baffle 199
optional devices 253 RAID flash power module on the chassis 195
PCIe 253 RAID flash power module on the riser 201
power 239, 258 rear drive assembly 204
power on and power off 242 riser card 209
serial-device 255 security bezel 213
software 261 system board 224
USB device 252 system fan 220
video 251 T30 nut 142
processor 180 top cover 232
installing 186 removing, memory module 165
removing 181 replacing
processor and memory expansion tray 263 air baffle 111
processor-heat-sink module backplane 114
installing 186 CMOS battery 128
removing 181 DIMM 165
EDSFF cage 131
front I/O assembly 134
hard disk drive 144
R hot-swap drive 144
hot-swap rear drive assembly 204
rack latches internal CFF HBA/RAID adapter 161
installing 192 intrusion switch 163
removing 191 M.2 backplane and M.2 drive 168
replacing 191 OCP 3.0 Ethernet adapter 175
RAID flash power module PCIe adapter 178
replacing 194 power supply unit 151

© Copyright Lenovo 2021, 2024 275

 rack latches 191 installing 222
RAID flash power module 194 removing 220
riser card 209 replacing 220
security bezel 213 system ID LED 46
serial port module 217 system power LED 46
system board 223 system reliability guidelines 87
system fan 220
top cover 232
replacing heat sink 180
replacing heat sink nut 142 T
replacing processor 180
T30 nut 142–143
retainer on M.2 backplane
installing 143
adjusting 171
removing 142
riser card
Taiwan Region BSMI RoHS declaration 271
installing 211
Taiwan Region import and export contact information 271
removing 209
tech tips 16
replacing 209
technical rules 110
Technical rules for PCIe adapter 103
Technical rules for RAID configuration 103
S technical rules for system fans 109
telecommunication regulatory statement 270
safety v telephone numbers 267
safety inspection checklist vi, 86 top cover
Secure Boot 231 installing 233
security advisories 16 removing 232
security bezel replacing 232
installing 214 Torx T30 nut 142
removing 213 TPM 229
replacing 213 TPM policy 229
separating trademarks 270
carrier 184 troubleshooting 251, 253, 261
CPU 184 by symptom 241
heat sink 184 hard disk drive problems 247
microprocessor 184 intermittent problems 255
microprocessor heat sink module 184 keyboard problems 252
PHM 184 mouse problems 252
serial number 227 network problems 258
serial port module observable problems 258
replacing 217 power on and power off problems 242
serial-device problems 255 power problems 258
server power on or power off problems 242 serial-device problems 255
service and support symptoms-based troubleshooting 241
before you call 265 USB-device problems 252
hardware 267 video 251
software 267 Trusted Platform Module 229
service data 266
signal cable routing
2.5-inch/3.5-inch drive backplanes 65
software 19 U
software problems 261
UEFI Secure Boot 231
software service and support telephone numbers 267
update firmware 12
solving
updating,
Ethernet controller problems 240
machine type 227
insufficient PCIe resource 253
USB-device problems 252
solving power problems 239
static-sensitive devices
handling 88
support web page, custom 265
supported drive bay combinations 102
V
switch block 47 video problems 251
system board 263
installing 225
removing 224
replacing 223 W
system board components 44 warranty 1
system board LED 46 working inside the server
system error LED 46 power on 87
system fan

276 ThinkSystem SR630 V2 Maintenance Manual